JP5299364B2

JP5299364B2 - Stacked cooler

Info

Publication number: JP5299364B2
Application number: JP2010142478A
Authority: JP
Inventors: 礼斗史鳴海
Original assignee: Denso Corp
Current assignee: Denso Corp
Priority date: 2010-06-23
Filing date: 2010-06-23
Publication date: 2013-09-25
Anticipated expiration: 2030-06-23
Also published as: JP2012009532A

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacked cooler which can prevent cooling efficiency of electronic components from dropping even if air is generated in cooling medium or mixed therewith. <P>SOLUTION: The stacked cooler 1 for cooling an electronic component 5 from both sides comprises a plurality of cooling pipes 2 arranged to be stacked while incorporating a refrigerant passage 20, a connection part 3 which connects adjoining cooling pipes 2, and a refrigerant introduction pipe 22 and a refrigerant discharge pipe 23 connected to a front end cooling pipe 25. At the rear end of the stacked cooler 1 in the stacking direction, an air reservoir 4 formed at the highest position in the refrigerant passage 20 is provided so that air 40 stored in the air reservoir 4 does not touch the cooling wall 24 in the cooling pipe 2 which touches the electronic component 5. <P>COPYRIGHT: (C)2012,JPO&INPIT

Description

本発明は、自動車用インバータに用いられる半導体モジュール等の電子部品を両面から冷却するための積層型冷却器に関する。 The present invention relates to a stacked type cooler for cooling electronic parts such as a semiconductor module used in an inverter for an automobile from both sides.

例えば、従来より、自動車用インバータに用いられる半導体モジュール等の電子部品を両面から狭持するように、複数の冷却管を積層配置してなり、上記電子部品を両面から冷却する積層型冷却器が存在する。
これらの積層型冷却器には、図９に示すごとく、積層型冷却器９の冷却管９２に冷媒流路９２０が設けられ、該冷媒流路９２０内に冷却媒体９６を流通させることで、上記冷却管９２における電子部品９５と接触する冷却壁９２４を介し、上記電子部品９５を両面から冷却する（特許文献１参照）。 For example, conventionally, there is a stacked type cooler in which a plurality of cooling pipes are stacked so as to sandwich an electronic component such as a semiconductor module used in an inverter for an automobile from both sides, and the electronic component is cooled from both sides. Exists.
In these stacked coolers, as shown in FIG. 9, a coolant channel 920 is provided in a cooling pipe 92 of the stacked cooler 9, and a cooling medium 96 is circulated in the coolant channel 920, thereby The electronic component 95 is cooled from both sides via a cooling wall 924 that contacts the electronic component 95 in the cooling pipe 92 (see Patent Document 1).

特開２００６−５０１４号公報JP 2006-5014 A

しかしながら、冷却媒体９６の沸騰等により、該冷却媒体９６にエア（気泡）９４０が発生あるいは混入したとき、このエア９４０が上記冷媒流路９２０内に残留することがある。
そして、上記冷却管９２のうち、上記電子部品９５と接触する冷却壁９２４に接触した状態で、上記エア９４０が留まると、その電子部品９５の冷却効率が低下するおそれがある。 However, when air (bubbles) 940 is generated or mixed in the cooling medium 96 due to boiling of the cooling medium 96 or the like, the air 940 may remain in the refrigerant flow path 920.
If the air 940 stays in contact with the cooling wall 924 in contact with the electronic component 95 in the cooling pipe 92, the cooling efficiency of the electronic component 95 may be reduced.

特に、上記積層型冷却器９は、図１０に示すごとく、積層方向の後端側の後端冷却管９２６が最も高い位置に配するよう、傾斜した状態で設置されると、上記後端冷却管９２６にエア９４０が留まり、これに接触した電子部品９５が充分に冷却されなくなるおそれがある。
また、図９に示すごとく、上記後端冷却管９２６に流れる上記冷却媒体９６は、流速が低く、上記エア９４０が留まるとこれを冷却媒体９６によって押し出しにくい。 In particular, as shown in FIG. 10, when the stacked cooler 9 is installed in an inclined state so that the rear end cooling pipe 926 on the rear end side in the stacking direction is disposed at the highest position, the rear end cooling is performed. There is a possibility that the air 940 stays in the tube 926 and the electronic component 95 in contact therewith is not sufficiently cooled.
Further, as shown in FIG. 9, the cooling medium 96 flowing in the rear end cooling pipe 926 has a low flow rate, and when the air 940 stays, it is difficult to push it out by the cooling medium 96.

本発明は、かかる問題点に鑑みてなされたもので、冷却媒体にエアが発生あるいは混入しても、電子部品の冷却効率の低下を防ぐことができる積層型冷却器を提供しようとするものである。 The present invention has been made in view of such problems, and an object of the present invention is to provide a multilayer cooler that can prevent a decrease in cooling efficiency of electronic components even when air is generated or mixed in a cooling medium. is there.

第１の発明は、電子部品を両面から冷却するための積層型冷却器であって、
冷却媒体を流通させる冷媒流路を内部に設けてなると共に、互いに積層配置された複数の冷却管と、
隣り合う該冷却管同士を、上記冷媒流路の両端部においてそれぞれ互いに連結する連結部と、
上記複数の冷却管のうち積層方向の前端に配置された前端冷却管に接続され、上記積層型冷却器に冷却媒体を導入する冷媒導入管、及び冷却媒体を排出する冷媒排出管とを備え、
上記積層型冷却器における上記積層方向の後端には、上記冷媒流路の中で最も高い位置に形成されるエア溜まり部が設けてあり、
該エア溜まり部に溜まったエアが、上記冷却管における上記電子部品と接触する冷却壁に接触しないよう構成されており、
上記複数の冷却管のうち上記積層方向の後端に配置された後端冷却管は、内部に設けた冷媒流路が上記エア溜まり部を構成していると共に、上記電子部品と接触しておらず、
上記後端冷却管と、該後端冷却管に隣接配置された上記冷却管との間には、金属部材が挟持されており、該金属部材は、上記積層型冷却器を収容する金属ケースと接続されていることを特徴とする積層型冷却器にある。
第２の発明は、電子部品を両面から冷却するための積層型冷却器であって、
冷却媒体を流通させる冷媒流路を内部に設けてなると共に、互いに積層配置された複数の冷却管と、
隣り合う該冷却管同士を、上記冷媒流路の両端部においてそれぞれ互いに連結する連結部と、
上記複数の冷却管のうち積層方向の前端に配置された前端冷却管に接続され、上記積層型冷却器に冷却媒体を導入する冷媒導入管、及び冷却媒体を排出する冷媒排出管とを備え、
上記積層型冷却器における上記積層方向の後端には、上記冷媒流路の中で最も高い位置に形成されるエア溜まり部が設けてあり、
該エア溜まり部に溜まったエアが、上記冷却管における上記電子部品と接触する冷却壁に接触しないよう構成されており、
上記複数の冷却管のうち上記積層方向の後端に配置された後端冷却管は、内部に設けた冷媒流路が上記エア溜まり部を構成していると共に、上記電子部品と接触しておらず、
上記後端冷却管と、該後端冷却管に隣接配置された上記冷却管とは、互いに密着していることを特徴とする積層型冷却器にある。
第３の発明は、電子部品を両面から冷却するための積層型冷却器であって、
冷却媒体を流通させる冷媒流路を内部に設けてなると共に、互いに積層配置された複数の冷却管と、
隣り合う該冷却管同士を、上記冷媒流路の両端部においてそれぞれ互いに連結する連結部と、
上記複数の冷却管のうち積層方向の前端に配置された前端冷却管に接続され、上記積層型冷却器に冷却媒体を導入する冷媒導入管、及び冷却媒体を排出する冷媒排出管とを備え、
上記積層型冷却器における上記積層方向の後端には、上記冷媒流路の中で最も高い位置に形成されるエア溜まり部が設けてあり、
該エア溜まり部に溜まったエアが、上記冷却管における上記電子部品と接触する冷却壁に接触しないよう構成されており、
上記複数の冷却管のうち上記積層方向の後端に配置された後端冷却管は、内部に設けた冷媒流路が上記エア溜まり部を構成していると共に、上記電子部品と接触しておらず、
上記後端冷却管と、該後端冷却管に隣接配置された上記冷却管とを連結する一対の上記連結部のうち、少なくともいずれか一方は、他の上記連結部よりも冷却媒体の通水抵抗が高いことを特徴とする積層型冷却器にある。
第４の発明は、電子部品を両面から冷却するための積層型冷却器であって、
冷却媒体を流通させる冷媒流路を内部に設けてなると共に、互いに積層配置された複数の冷却管と、
隣り合う該冷却管同士を、上記冷媒流路の両端部においてそれぞれ互いに連結する連結部と、
上記複数の冷却管のうち積層方向の前端に配置された前端冷却管に接続され、上記積層型冷却器に冷却媒体を導入する冷媒導入管、及び冷却媒体を排出する冷媒排出管とを備え、
上記積層型冷却器における上記積層方向の後端には、上記冷媒流路の中で最も高い位置に形成されるエア溜まり部が設けてあり、
該エア溜まり部に溜まったエアが、上記冷却管における上記電子部品と接触する冷却壁に接触しないよう構成されており、
上記複数の冷却管のうち上記積層方向の後端に配置された後端冷却管は、内部に設けた冷媒流路が、他の上記冷却管の内部に設けた冷媒流路よりも上記積層方向の幅が大きい幅広部分を少なくとも一部に有し、該幅広部分における上記冷却壁と反対側の部分によって上記エア溜まり部が構成されていることを特徴とする積層型冷却器にある。 A first invention is a stacked cooler for cooling an electronic component from both sides,
A plurality of cooling pipes which are provided with a refrigerant flow path through which a cooling medium is circulated, and which are stacked on each other;
Connecting portions that connect the adjacent cooling pipes to each other at both ends of the refrigerant flow path;
A refrigerant introduction pipe that is connected to a front end cooling pipe disposed at a front end in the stacking direction among the plurality of cooling pipes, introduces a cooling medium to the stacked cooler, and a refrigerant discharge pipe that discharges the cooling medium;
At the rear end in the stacking direction of the stacked cooler, there is provided an air reservoir formed at the highest position in the refrigerant flow path,
The air accumulated in the air reservoir is configured not to contact a cooling wall that contacts the electronic component in the cooling pipe ,
Among the plurality of cooling pipes, the rear end cooling pipe disposed at the rear end in the stacking direction is configured such that the refrigerant flow path provided therein constitutes the air reservoir and is in contact with the electronic component. Without
A metal member is sandwiched between the rear end cooling pipe and the cooling pipe disposed adjacent to the rear end cooling pipe, and the metal member includes a metal case for housing the stacked cooler, Ru multilayer cooler near, characterized in that it is connected.
A second invention is a stacked cooler for cooling an electronic component from both sides,
A plurality of cooling pipes which are provided with a refrigerant flow path through which a cooling medium is circulated, and which are stacked on each other;
Connecting portions that connect the adjacent cooling pipes to each other at both ends of the refrigerant flow path;
A refrigerant introduction pipe that is connected to a front end cooling pipe disposed at a front end in the stacking direction among the plurality of cooling pipes, introduces a cooling medium to the stacked cooler, and a refrigerant discharge pipe that discharges the cooling medium;
At the rear end in the stacking direction of the stacked cooler, there is provided an air reservoir formed at the highest position in the refrigerant flow path,
The air accumulated in the air reservoir is configured not to contact a cooling wall that contacts the electronic component in the cooling pipe,
Among the plurality of cooling pipes, the rear end cooling pipe disposed at the rear end in the stacking direction is configured such that the refrigerant flow path provided therein constitutes the air reservoir and is not in contact with the electronic component. Without
The rear-end cooling pipe and the cooling pipe disposed adjacent to the rear-end cooling pipe are in close contact with each other.
A third invention is a stacked cooler for cooling an electronic component from both sides,
A plurality of cooling pipes which are provided with a refrigerant flow path through which a cooling medium is circulated, and which are stacked on each other;
Connecting portions that connect the adjacent cooling pipes to each other at both ends of the refrigerant flow path;
A refrigerant introduction pipe that is connected to a front end cooling pipe disposed at a front end in the stacking direction among the plurality of cooling pipes, introduces a cooling medium to the stacked cooler, and a refrigerant discharge pipe that discharges the cooling medium;
At the rear end in the stacking direction of the stacked cooler, there is provided an air reservoir formed at the highest position in the refrigerant flow path,
The air accumulated in the air reservoir is configured not to contact a cooling wall that contacts the electronic component in the cooling pipe,
Among the plurality of cooling pipes, the rear end cooling pipe disposed at the rear end in the stacking direction is configured such that the refrigerant flow path provided therein constitutes the air reservoir and is not in contact with the electronic component. Without
At least one of the pair of connecting parts that connect the rear end cooling pipe and the cooling pipe disposed adjacent to the rear end cooling pipe is more water-permeable to the cooling medium than the other connecting parts. A laminated cooler characterized by high resistance.
A fourth invention is a stacked cooler for cooling an electronic component from both sides,
A plurality of cooling pipes which are provided with a refrigerant flow path through which a cooling medium is circulated, and which are stacked on each other;
Connecting portions that connect the adjacent cooling pipes to each other at both ends of the refrigerant flow path;
A refrigerant introduction pipe that is connected to a front end cooling pipe disposed at a front end in the stacking direction among the plurality of cooling pipes, introduces a cooling medium to the stacked cooler, and a refrigerant discharge pipe that discharges the cooling medium;
At the rear end in the stacking direction of the stacked cooler, there is provided an air reservoir formed at the highest position in the refrigerant flow path,
The air accumulated in the air reservoir is configured not to contact a cooling wall that contacts the electronic component in the cooling pipe,
Among the plurality of cooling pipes, the rear end cooling pipe disposed at the rear end in the stacking direction is such that the refrigerant flow path provided in the inside is more in the stacking direction than the refrigerant flow paths provided in the other cooling pipes. The laminated cooler is characterized in that at least part of the wide portion has a large width, and the air pool portion is constituted by a portion of the wide portion opposite to the cooling wall.

本発明の積層型冷却器は、上記冷媒流路の中で最も高い位置に上記エア溜まり部を有する。それゆえ、上記冷却媒体に発生あるいは混入したエアを上記エア溜まり部に集めることができる。
そして、上記積層型冷却器は、上記エア溜まり部に溜まったエアが、上記冷却壁に接触しないよう構成されている。これによって、エアが上記電子部品と接触する冷却壁に接触することによる電子部品の冷却効率の低下を防ぐことができる。
このように、上記冷却媒体に発生あるいは混入したエアを上記冷媒流路内において、電子部品の冷却に影響を与えない位置に集めることができるため、上記積層型冷却器による電子部品の冷却効率の低下を防ぐことができる。 The stacked cooler of the present invention has the air reservoir at the highest position in the refrigerant flow path. Therefore, the air generated or mixed in the cooling medium can be collected in the air reservoir.
The stacked cooler is configured such that the air accumulated in the air reservoir does not contact the cooling wall. Accordingly, it is possible to prevent the cooling efficiency of the electronic component from being lowered due to the air coming into contact with the cooling wall in contact with the electronic component.
As described above, since air generated or mixed in the cooling medium can be collected in the refrigerant flow path at a position that does not affect the cooling of the electronic component, the cooling efficiency of the electronic component by the stacked cooler can be improved. Decline can be prevented.

以上のごとく、本発明によれば、冷却媒体にエアが発生あるいは混入しても、電子部品の冷却効率の低下を防ぐことができる積層型冷却器を提供することができる。 As described above, according to the present invention, it is possible to provide a stacked cooler that can prevent a decrease in cooling efficiency of electronic components even if air is generated or mixed in the cooling medium.

実施例１における、積層型冷却器の平面図。FIG. 3 is a plan view of the stacked cooler in the first embodiment. 実施例１における、積層型冷却器の側面図。1 is a side view of a stacked cooler in Embodiment 1. FIG. 実施例２における、積層型冷却器の平面図。FIG. 6 is a plan view of a stacked cooler in Embodiment 2. 実施例２における、積層型冷却器の側面図。FIG. 5 is a side view of a stacked cooler in Embodiment 2. 実施例３における、積層型冷却器の平面図。FIG. 9 is a plan view of a stacked cooler in Embodiment 3. 実施例３における、積層型冷却器の側面図。FIG. 9 is a side view of a stacked cooler in Embodiment 3. 実施例４における、積層型冷却器の平面図。FIG. 9 is a plan view of a stacked type cooler in Example 4. 実施例４における、積層型冷却器の側面図。The side view of the laminated type cooler in Example 4. FIG. 背景技術における、積層型冷却器の平面図。The top view of a laminated cooler in background art. 背景技術における、積層型冷却器の側面図。The side view of the laminated type cooler in background art.

本発明において、上記積層型冷却器は、例えば、自動車のエンジン等に使用される電子部品を両面から冷却するための積層型冷却器として用いることができる。
上記電子部品は、例えば、ＩＧＢＴ等の半導体素子とダイオードとを内蔵した半導体モジュールとすることができる。そして、該半導体モジュールは、例えば、自動車用インバータ、産業機器のモータ駆動インバータ等に用いられる。 In the present invention, the stacked cooler can be used, for example, as a stacked cooler for cooling an electronic component used in an automobile engine or the like from both sides.
The electronic component can be, for example, a semiconductor module including a semiconductor element such as an IGBT and a diode. And this semiconductor module is used for the inverter for motor vehicles, the motor drive inverter of industrial equipment, etc., for example.

上記冷却媒体としては、例えば、エチレングリコール系の不凍液が混入した水、水やアンモニア等の自然冷媒、フロリナート等のフッ化炭素系冷媒、ＨＣＦＣ１２３、ＨＦＣ１３４ａ等のフロン系冷媒、メタノール、アルコール等のアルコール系冷媒、アセトン等のケトン系冷媒などを用いることができる。
また、上記積層型冷却器において、上記冷媒導入管及び上記冷媒排出管を配設した側を積層方向の前端側、その反対方向を積層方向の後端側として説明する。 Examples of the cooling medium include water mixed with ethylene glycol antifreeze, natural refrigerants such as water and ammonia, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, and alcohols such as methanol and alcohol. A system refrigerant, a ketone refrigerant such as acetone, and the like can be used.
In the stacked cooler, the side on which the refrigerant introduction pipe and the refrigerant discharge pipe are arranged will be described as the front end side in the stacking direction, and the opposite direction as the rear end side in the stacking direction.

また、上記複数の冷却管のうち上記積層方向の後端に配置された後端冷却管は、内部に設けた冷媒流路が上記エア溜まり部を構成していると共に、上記電子部品と接触していない。
これにより、上記電子部品と接触していない上記後端冷却管自体が、上記エア溜まり部となるため、上記エアが上記冷却管における上記電子部品と接触する冷却壁に接触することを確実に防ぎ、上記積層型冷却器の電子部品の冷却効率の低下を確実に防ぐことができる。 The rear end cooling pipe disposed at the rear end in the stacking direction among the plurality of cooling pipes is configured such that the refrigerant flow path provided therein constitutes the air reservoir and is in contact with the electronic component. I have a have.
As a result , the rear end cooling pipe itself that is not in contact with the electronic component becomes the air reservoir, and thus the air is reliably prevented from coming into contact with the cooling wall in contact with the electronic component in the cooling pipe. And the fall of the cooling efficiency of the electronic component of the said multilayer cooler can be prevented reliably.

第１の発明においては、上記後端冷却管と、該後端冷却管に隣接配置された上記冷却管との間には、金属部材が挟持されており、該金属部材は、上記積層型冷却器を収容する金属ケースと接続されている。
これにより、上記冷却管における冷媒流路内に流れる冷却媒体が、上記狭持される金属部材を両面から冷却し、該金属部材を介し、金属部材と接続される金属ケースを冷却することができる。したがって、上記金属ケースに接触する発熱部品をも効果的に冷却することができる。 In the first invention, a metal member is sandwiched between the rear end cooling pipe and the cooling pipe disposed adjacent to the rear end cooling pipe. vessels that is connected to the metal case housing.
Thereby , the cooling medium flowing in the refrigerant flow path in the cooling pipe cools the sandwiched metal member from both sides, and can cool the metal case connected to the metal member via the metal member. . Therefore, it is possible to effectively cool the heat-generating component that contacts the metal case.

第２の発明においては、上記後端冷却管と、該後端冷却管に隣接配置された上記冷却管とは、互いに密着している。
この場合には、上記積層型冷却器の小型化を図ることができる。 In the second invention, and the rear cooling tube, the adjacent arranged the cooling tube rear end cooling tube, it is in close contact with each other.
In this case, the stacked cooler can be reduced in size.

第４の発明においては、上記複数の冷却管のうち上記積層方向の後端に配置された後端冷却管は、内部に設けた冷媒流路が、他の上記冷却管の内部に設けた冷媒流路よりも上記積層方向の幅が大きい幅広部分を少なくとも一部に有し、該幅広部分における上記冷却壁と反対側の部分によって上記エア溜まり部が構成されている。
この場合には、上記エア溜まり部の形成のために上記冷却管の積層段数を増やす必要がなく、材料コストの低減及び軽量化を図ることができる。 In a fourth aspect of the present invention, the rear end cooling pipe disposed at the rear end in the stacking direction among the plurality of cooling pipes has a refrigerant flow path provided therein and a refrigerant provided in the other cooling pipes. than the channel has at least in part wider portion width of the stacking direction is large, that is configured is the air reservoir by the opposite side of the part and the cooling wall in the width wide portion.
In this case, it is not necessary to increase the number of stacking stages of the cooling pipes for the formation of the air reservoir, and the material cost can be reduced and the weight can be reduced.

第３の発明においては、上記後端冷却管と、該後端冷却管に隣接配置された上記冷却管とを連結する一対の上記連結部のうち、少なくともいずれか一方は、他の上記連結部よりも冷却媒体の通水抵抗が高い。
この場合には、上記電子部品に接触しない上記後端冷却管における、冷却媒体の流量を少なくすることができる。その結果、上記電子部品に接触する他の冷却管における冷却媒体の流量を多くすることができ、全体として、上記電子部品の冷却効率を高めることができる。
また、第１の発明又は第２の発明において、上記後端冷却管と、該後端冷却管に隣接配置された上記冷却管とを連結する一対の上記連結部のうち、少なくともいずれか一方は、他の上記連結部よりも冷却媒体の通水抵抗が高いことが好ましい。 In a third aspect of the invention , at least one of the pair of connecting portions connecting the rear end cooling pipe and the cooling pipe disposed adjacent to the rear end cooling pipe is the other connecting portion. flow resistance of the cooling medium than is not high.
In this case, the flow rate of the cooling medium in the rear end cooling pipe not in contact with the electronic component can be reduced. As a result, it is possible to increase the flow rate of the cooling medium in the other cooling pipes that come into contact with the electronic component, and as a whole, the cooling efficiency of the electronic component can be increased.
Further, in the first invention or the second invention, at least one of the pair of connecting portions connecting the rear end cooling pipe and the cooling pipe arranged adjacent to the rear end cooling pipe is It is preferable that the flow resistance of the cooling medium is higher than that of the other connecting portions.

（実施例１）
本発明における積層型冷却器１について、図１及び図２を用いて説明する。
本例の積層型冷却器１は、図１に示すごとく、電子部品５を両面から冷却するためのものである。
また、同図に示すごとく、積層型冷却器１は、冷却媒体６を流通させる冷媒流路２０を内部に設けてなると共に、互いに積層配置された複数の冷却管２と、隣り合う冷却管２同士を、冷媒流路２０の両端部２１においてそれぞれ互いに連結する連結部３を有する。
さらに、同図に示すごとく、積層型冷却器１は、複数の冷却管２のうち積層方向の前端に配置された前端冷却管２５に接続され、積層型冷却器１に冷却媒体６を導入する冷媒導入管２２及び冷却媒体６を排出する冷媒排出管２３を備える。 Example 1
A stacked cooler 1 according to the present invention will be described with reference to FIGS. 1 and 2.
As shown in FIG. 1, the laminated cooler 1 of this example is for cooling the electronic component 5 from both sides.
Further, as shown in the figure, the laminated cooler 1 is provided with a refrigerant flow path 20 through which the cooling medium 6 is circulated, and a plurality of cooling pipes 2 arranged adjacent to each other and an adjacent cooling pipe 2. It has the connection part 3 which mutually connects each in the both ends 21 of the refrigerant flow path 20. FIG.
Furthermore, as shown in the figure, the stacked cooler 1 is connected to a front end cooling pipe 25 disposed at the front end in the stacking direction among the plurality of cooling pipes 2, and introduces the cooling medium 6 into the stacked cooler 1. A refrigerant discharge pipe 23 for discharging the refrigerant introduction pipe 22 and the cooling medium 6 is provided.

また、図１及び図２に示すごとく、積層型冷却器１における積層方向の後端には、冷媒流路２０の中で最も高い位置に形成されるエア溜まり部４が設けてあり、エア溜まり部４に溜まったエア４０が、冷却管２における電子部品５と接触する冷却壁２４に接触しないよう構成されている。 As shown in FIGS. 1 and 2, an air reservoir 4 formed at the highest position in the refrigerant flow path 20 is provided at the rear end in the stacking direction of the stacked cooler 1. The air 40 accumulated in the portion 4 is configured not to contact the cooling wall 24 that contacts the electronic component 5 in the cooling pipe 2.

また、図１及び図２に示すごとく、複数の冷却管２のうち積層方向の後端に配置された後端冷却管２６は、内部に設けた冷媒流路２０がエア溜まり部４を構成していると共に、電子部品５と接触していない。
さらに、図１及び図２に示すごとく、後端冷却管２６と、後端冷却管２６に隣接配置された冷却管２との間には、金属部材７が挟持されている。また、金属部材７は、積層型冷却器１を収容する金属ケース８と接続されている。 Further, as shown in FIGS. 1 and 2, the rear end cooling pipe 26 disposed at the rear end in the stacking direction among the plurality of cooling pipes 2 is configured such that the refrigerant flow path 20 provided therein constitutes the air reservoir 4. And is not in contact with the electronic component 5.
Further, as shown in FIGS. 1 and 2, the metal member 7 is sandwiched between the rear end cooling pipe 26 and the cooling pipe 2 disposed adjacent to the rear end cooling pipe 26. The metal member 7 is connected to a metal case 8 that houses the laminated cooler 1.

本例においては、上記電子部品５はインバータやコンバータ等の電力変換装置の一部を構成する半導体モジュールである。すなわち、電子部品５には、スイッチング素子が内蔵されており、電力変換装置の動作時においては、大きく発熱する。
この熱を冷却媒体６によって吸収して、電子部品５の温度上昇を抑制すべく、積層型冷却器１は、電子部品５の両面に冷却管２を接触配置している。 In this example, the electronic component 5 is a semiconductor module that constitutes a part of a power conversion device such as an inverter or a converter. That is, the electronic component 5 has a built-in switching element and generates a large amount of heat during operation of the power conversion device.
In order to absorb this heat by the cooling medium 6 and suppress the temperature rise of the electronic component 5, the laminated cooler 1 has the cooling pipes 2 in contact with both surfaces of the electronic component 5.

また、積層型冷却器１は複数の冷却管２を複数の電子部品５と交互に積層して配設されている。そして、後端冷却管２６も含めたすべての冷却管２は略同様の形状、構造を有している。それゆえ、本例においては、エア溜まり部４を設けるために、後端冷却管２６を追加する必要があるものの、後端冷却管２６は他の冷却管２と略同じ形状、構造のものであるため、特に大きな設計変更や、追加加工を要しない。 In addition, the laminated cooler 1 is provided by laminating a plurality of cooling pipes 2 and a plurality of electronic components 5 alternately. All the cooling pipes 2 including the rear end cooling pipe 26 have substantially the same shape and structure. Therefore, in this example, in order to provide the air reservoir 4, it is necessary to add the rear end cooling pipe 26. However, the rear end cooling pipe 26 has substantially the same shape and structure as the other cooling pipes 2. Therefore, no major design change or additional processing is required.

また、積層型冷却器１及び金属ケース８は、アルミニウム等の金属からなる。
金属ケース８内には、電子部品５（半導体モジュール）の他にも、電力変換装置の他の構成部品（例えばコンデンサ等）も収容されている。
また、図２に示すごとく、積層型冷却器１は、後端冷却管２６が最も高い位置に配されるように、積層方向が水平方向に対して傾斜した状態で用いられる。 The stacked cooler 1 and the metal case 8 are made of a metal such as aluminum.
In the metal case 8, in addition to the electronic component 5 (semiconductor module), other components (for example, a capacitor and the like) of the power conversion device are also accommodated.
In addition, as shown in FIG. 2, the stacked cooler 1 is used in a state where the stacking direction is inclined with respect to the horizontal direction so that the rear end cooling pipe 26 is disposed at the highest position.

ここで、積層型冷却器１は、金属ケース８と共に傾斜していてもよいし、金属ケース８に対して傾斜させた状態で収容し、金属ケース８を水平な状態で設置したとき、積層型冷却器１が傾斜した状態となるようにしてもよい。
いずれにしても、積層型冷却器１は後端冷却管２６（エア溜まり部４）が最も高い位置となるように傾斜した状態で、車両のエンジンルーム等に設置される。 Here, the multilayer cooler 1 may be inclined together with the metal case 8, or is accommodated in an inclined state with respect to the metal case 8, and when the metal case 8 is installed in a horizontal state, The cooler 1 may be inclined.
In any case, the stacked cooler 1 is installed in an engine room or the like of the vehicle in a state where the rear end cooling pipe 26 (air reservoir 4) is inclined so as to be at the highest position.

次に、本例の作用効果について、説明する。
本例においては、積層型冷却器１は、冷媒流路２０の中で最も高い位置にエア溜まり部４を有する。それゆえ、冷却媒体６に発生あるいは混入したエア４０を、エア溜まり部４に集めることができる。
そして、積層型冷却器１は、エア溜まり部４に溜まったエア４０が、冷却壁２４に接触しないよう構成されている。これによって、エア４０が電子部品５と接触する冷却壁２４に接触することによる電子部品５の冷却効率の低下を防ぐことができる。
このように、冷却媒体６に発生あるいは混入したエア４０を冷媒流路２０内において、電子部品５の冷却に影響を与えない位置に集めることができるため、積層型冷却器１による電子部品５の冷却効率の低下を防ぐことができる（図１参照）。 Next, the function and effect of this example will be described.
In the present example, the stacked cooler 1 has an air reservoir 4 at the highest position in the refrigerant flow path 20. Therefore, the air 40 generated or mixed in the cooling medium 6 can be collected in the air reservoir 4.
The stacked cooler 1 is configured such that the air 40 accumulated in the air reservoir 4 does not contact the cooling wall 24. As a result, it is possible to prevent the cooling efficiency of the electronic component 5 from being lowered due to the air 40 coming into contact with the cooling wall 24 in contact with the electronic component 5.
As described above, since the air 40 generated or mixed in the cooling medium 6 can be collected in the refrigerant flow path 20 at a position that does not affect the cooling of the electronic component 5, A decrease in cooling efficiency can be prevented (see FIG. 1).

また、後端冷却管２６の冷媒流路２０がエア溜まり部４を構成しており、後端冷却管２６は電子部品５と接触していない。すなわち、電子部品５と接触していない後端冷却管２６自体が、エア溜まり部４となるため、エア４０が冷却管２における電子部品５と接触する冷却壁２４に接触することを確実に防ぎ、積層型冷却器１の電子部品５の冷却効率の低下を確実に防ぐことができる（図１及び図２参照）。 Further, the refrigerant flow path 20 of the rear end cooling pipe 26 constitutes the air reservoir 4, and the rear end cooling pipe 26 is not in contact with the electronic component 5. That is, since the rear end cooling pipe 26 itself that is not in contact with the electronic component 5 becomes the air reservoir 4, the air 40 is reliably prevented from coming into contact with the cooling wall 24 in contact with the electronic component 5 in the cooling pipe 2. And the fall of the cooling efficiency of the electronic component 5 of the multilayer cooler 1 can be prevented reliably (refer FIG.1 and FIG.2).

また、後端冷却管２６と、後端冷却管２６に隣接配置された冷却管２との間には、金属部材７が挟持されており、金属部材７は、積層型冷却器１を収容する金属ケース８と接続されている。
これによって、冷却管２における冷媒流路２０内に流れる冷却媒体６が、狭持される金属部材７を両面から冷却し、金属部材７を介し、金属部材７と接続される金属ケース８を冷却することができる。したがって、金属ケース８に接触する上記電子部品５（半導体モジュール）以外の発熱部品（例えばコンデンサ等）をも効果的に冷却することができる（図１及び図２参照）。 Further, a metal member 7 is sandwiched between the rear end cooling pipe 26 and the cooling pipe 2 disposed adjacent to the rear end cooling pipe 26, and the metal member 7 accommodates the multilayer cooler 1. The metal case 8 is connected.
Thereby, the cooling medium 6 flowing in the refrigerant flow path 20 in the cooling pipe 2 cools the sandwiched metal member 7 from both sides, and cools the metal case 8 connected to the metal member 7 via the metal member 7. can do. Therefore, heat-generating components (for example, capacitors) other than the electronic component 5 (semiconductor module) contacting the metal case 8 can be effectively cooled (see FIGS. 1 and 2).

以上のごとく、本例によれば、冷却媒体にエアが発生あるいは混入しても、電子部品の冷却効率の低下を防ぐことができる積層型冷却器を提供することができる。 As described above, according to this example, it is possible to provide a stacked cooler that can prevent a decrease in cooling efficiency of electronic components even if air is generated or mixed in the cooling medium.

（実施例２）
本例は、図３及び図４に示すごとく、後端冷却管２６と、後端冷却管２６に隣接配置された冷却管２とが、互いに密着して配設された積層型冷却器１の例である。
すなわち、後端冷却管２６とこれに隣接配置された冷却管２とは、互いの主面を重ね合わせるように、密接配置されている。そして、後端冷却管２６と冷却管２とは、これらの長手方向の両端部２１において、互いの冷媒流路２０同士を連通させている。その他は、実施例１と同様である。
本例の場合には、積層型冷却器１の積層方向寸法を小さくすることができ、積層型冷却器１の小型化を図ることができる。
その他、実施例１と同様の作用効果を有する。 (Example 2)
In this example, as shown in FIGS. 3 and 4, the rear end cooling pipe 26 and the cooling pipe 2 arranged adjacent to the rear end cooling pipe 26 are arranged in close contact with each other. It is an example.
That is, the rear end cooling pipe 26 and the cooling pipe 2 disposed adjacent to the rear end cooling pipe 26 are closely arranged so that their main surfaces overlap each other. The rear end cooling pipe 26 and the cooling pipe 2 communicate with each other through the refrigerant flow paths 20 at both end portions 21 in the longitudinal direction. Others are the same as in the first embodiment.
In the case of this example, the stacking direction dimension of the stacked cooler 1 can be reduced, and the stacked cooler 1 can be downsized.
In addition, the same effects as those of the first embodiment are obtained.

（実施例３）
本例は、図５及び図６に示すごとく、後端冷却管２６の内部に設けた冷媒流路２０が、他の冷却管２の内部に設けた冷媒流路２０よりも積層方向の幅が大きい幅広部分２７を一部に有し、幅広部分２７における冷却壁２４と反対側の部分によってエア溜まり部４を形成した例である。
幅広部分２７は後端冷却管２６における長手方向の両端部２１を除く部分において、積層方向の外方に向かって突き出している。その他は、実施例１と同様である。 (Example 3)
In this example, as shown in FIGS. 5 and 6, the refrigerant flow path 20 provided in the rear end cooling pipe 26 is wider in the stacking direction than the refrigerant flow paths 20 provided in the other cooling pipes 2. This is an example in which a large wide portion 27 is partly formed and the air reservoir 4 is formed by a portion of the wide portion 27 opposite to the cooling wall 24.
The wide portion 27 protrudes outward in the stacking direction at a portion of the rear end cooling pipe 26 excluding both end portions 21 in the longitudinal direction. Others are the same as in the first embodiment.

本例の場合には、エア溜まり部４の形成のために冷却管２の積層段数を増やす必要がなく、材料コストの低減及び軽量化を図ることができる。
その他、実施例１と同様の作用効果を有する。
なお、上記幅広部分２７は、後端冷却管２６の全体にわたって、形成してもよい。すなわち、後端冷却管２６の幅を全体にわたって一定とすると共に、その幅を冷却管２よりも大きくしてもよい。 In the case of this example, it is not necessary to increase the number of stacks of the cooling pipes 2 for forming the air reservoir portion 4, and the material cost can be reduced and the weight can be reduced.
In addition, the same effects as those of the first embodiment are obtained.
The wide portion 27 may be formed over the entire rear end cooling pipe 26. That is, the width of the rear end cooling pipe 26 may be constant over the whole and the width may be larger than that of the cooling pipe 2.

（実施例４）
本例は、図７および図８に示すごとく、後端冷却管２６と、後端冷却管２６に隣接配置された冷却管２とを連結する連結部３を、他の連結部３よりも冷却媒体６の通水抵抗が高くなるように構成した例である。 Example 4
In this example, as shown in FIGS. 7 and 8, the connecting part 3 that connects the rear end cooling pipe 26 and the cooling pipe 2 disposed adjacent to the rear end cooling pipe 26 is cooled more than the other connecting parts 3. In this example, the water flow resistance of the medium 6 is increased.

本例では、図７に示すごとく、後端冷却管２６へ冷却媒体６を導入する側の連結部３を、他の連結部３よりも冷却媒体６の通水抵抗が高くなるようしている。
そのための構造として、連結部３の内部断面積を、他の連結部３における内部断面積よりも狭く形成している。その他は、実施例１と同様である。 In this example, as shown in FIG. 7, the connecting portion 3 on the side where the cooling medium 6 is introduced into the rear end cooling pipe 26 has a higher water flow resistance of the cooling medium 6 than the other connecting portions 3. .
As a structure for this purpose, the internal cross-sectional area of the connecting portion 3 is formed to be narrower than the internal cross-sectional areas of the other connecting portions 3. Others are the same as in the first embodiment.

これによって、電子部品５に接触しない後端冷却管２６における、冷却媒体６の流量を少なくすることができる。その結果、電子部品５に接触する他の冷却管２における冷却媒体６の流量を多くすることができ、全体として、電子部品５の冷却効率を高めることができる（図７参照）。その他、実施例１と同様の作用効果を有する。 As a result, the flow rate of the cooling medium 6 in the rear end cooling pipe 26 that does not contact the electronic component 5 can be reduced. As a result, the flow rate of the cooling medium 6 in the other cooling pipes 2 in contact with the electronic component 5 can be increased, and the cooling efficiency of the electronic component 5 can be improved as a whole (see FIG. 7). In addition, the same effects as those of the first embodiment are obtained.

なお、後端冷却管２６から冷却媒体６を排出する側の連結部３を、他の連結部３よりも冷却媒体６の通水抵抗が高くなるように形成してもよい。あるいは、後端冷却管２６と、後端冷却管２６に隣接配置された冷却管２とを連結する一対の連結部３の両方を他の連結部３よりも冷却媒体６の通水抵抗が高くなるように構成してもよい。これらの場合にも、上記の実施例４と同様の効果を得ることができる。 The connecting portion 3 on the side where the cooling medium 6 is discharged from the rear end cooling pipe 26 may be formed so that the water flow resistance of the cooling medium 6 is higher than that of the other connecting portions 3. Alternatively, both of the pair of connecting portions 3 that connect the rear end cooling pipe 26 and the cooling pipe 2 disposed adjacent to the rear end cooling pipe 26 have a higher water flow resistance of the cooling medium 6 than the other connecting portions 3. You may comprise so that it may become. In these cases, the same effect as in the fourth embodiment can be obtained.

１積層型冷却器
２冷却管
２０冷媒流路
２１端部
２２冷媒導入管
２３冷媒排出管
２４冷却壁
２５前端冷却管
３連結部
４エア溜まり部
４０エア
５電子部品
６冷却媒体 DESCRIPTION OF SYMBOLS 1 Stack type cooler 2 Cooling pipe 20 Refrigerant flow path 21 End part 22 Refrigerant introduction pipe 23 Refrigerant discharge pipe 24 Cooling wall 25 Front end cooling pipe 3 Connection part 4 Air reservoir part 40 Air 5 Electronic component 6 Cooling medium

Claims

A laminated cooler for cooling electronic components from both sides,
A plurality of cooling pipes which are provided with a refrigerant flow path through which a cooling medium is circulated, and which are stacked on each other;
Connecting portions that connect the adjacent cooling pipes to each other at both ends of the refrigerant flow path;
A refrigerant introduction pipe that is connected to a front end cooling pipe disposed at a front end in the stacking direction among the plurality of cooling pipes, introduces a cooling medium to the stacked cooler, and a refrigerant discharge pipe that discharges the cooling medium;
At the rear end in the stacking direction of the stacked cooler, there is provided an air reservoir formed at the highest position in the refrigerant flow path,
The air accumulated in the air reservoir is configured not to contact a cooling wall that contacts the electronic component in the cooling pipe ,
Among the plurality of cooling pipes, the rear end cooling pipe disposed at the rear end in the stacking direction is configured such that the refrigerant flow path provided therein constitutes the air reservoir and is not in contact with the electronic component. Without
A metal member is sandwiched between the rear end cooling pipe and the cooling pipe disposed adjacent to the rear end cooling pipe, and the metal member includes a metal case for housing the stacked cooler, A stacked cooler characterized by being connected .

A laminated cooler for cooling electronic components from both sides,
A plurality of cooling pipes which are provided with a refrigerant flow path through which a cooling medium is circulated, and which are stacked on each other;
Connecting portions that connect the adjacent cooling pipes to each other at both ends of the refrigerant flow path;
A refrigerant introduction pipe that is connected to a front end cooling pipe disposed at a front end in the stacking direction among the plurality of cooling pipes, introduces a cooling medium to the stacked cooler, and a refrigerant discharge pipe that discharges the cooling medium;
At the rear end in the stacking direction of the stacked cooler, there is provided an air reservoir formed at the highest position in the refrigerant flow path,
The air accumulated in the air reservoir is configured not to contact a cooling wall that contacts the electronic component in the cooling pipe,
Among the plurality of cooling pipes, the rear end cooling pipe disposed at the rear end in the stacking direction is configured such that the refrigerant flow path provided therein constitutes the air reservoir and is not in contact with the electronic component. Without
The rear-end cooling pipe and the cooling pipe disposed adjacent to the rear-end cooling pipe are in close contact with each other .

A laminated cooler for cooling electronic components from both sides,
A plurality of cooling pipes which are provided with a refrigerant flow path through which a cooling medium is circulated, and which are stacked on each other;
Connecting portions that connect the adjacent cooling pipes to each other at both ends of the refrigerant flow path;
A refrigerant introduction pipe that is connected to a front end cooling pipe disposed at a front end in the stacking direction among the plurality of cooling pipes, introduces a cooling medium to the stacked cooler, and a refrigerant discharge pipe that discharges the cooling medium;
At the rear end in the stacking direction of the stacked cooler, there is provided an air reservoir formed at the highest position in the refrigerant flow path,
The air accumulated in the air reservoir is configured not to contact a cooling wall that contacts the electronic component in the cooling pipe,
Among the plurality of cooling pipes, the rear end cooling pipe disposed at the rear end in the stacking direction is configured such that the refrigerant flow path provided therein constitutes the air reservoir and is not in contact with the electronic component. Without
At least one of the pair of connecting parts that connect the rear end cooling pipe and the cooling pipe disposed adjacent to the rear end cooling pipe is more water-permeable to the cooling medium than the other connecting parts. A laminated cooler characterized by high resistance .

3. The stacked cooler according to claim 1 , wherein at least one of the pair of connecting portions connecting the rear end cooling pipe and the cooling pipe disposed adjacent to the rear end cooling pipe. Is a laminated cooler characterized in that the flow resistance of the cooling medium is higher than that of the other connecting portions .

A laminated cooler for cooling electronic components from both sides,
A plurality of cooling pipes which are provided with a refrigerant flow path through which a cooling medium is circulated, and which are stacked on each other;
Connecting portions that connect the adjacent cooling pipes to each other at both ends of the refrigerant flow path;
A refrigerant introduction pipe that is connected to a front end cooling pipe disposed at a front end in the stacking direction among the plurality of cooling pipes, introduces a cooling medium to the stacked cooler, and a refrigerant discharge pipe that discharges the cooling medium;
At the rear end in the stacking direction of the stacked cooler, there is provided an air reservoir formed at the highest position in the refrigerant flow path,
The air accumulated in the air reservoir is configured not to contact a cooling wall that contacts the electronic component in the cooling pipe,
Among the plurality of cooling pipes, the rear end cooling pipe disposed at the rear end in the stacking direction is such that the refrigerant flow path provided in the inside is more in the stacking direction than the refrigerant flow paths provided in the other cooling pipes. A laminated type cooler comprising: a wide portion having a large width at least in part, and the air pool portion being constituted by a portion of the wide portion opposite to the cooling wall.