JP5313640B2 - Headphone unit and headphones - Google Patents

Description

  The present invention relates to a headphone unit, and particularly has a feature in the structure of a headphone unit for preventing deformation of the diaphragm when the diaphragm is attached to a unit frame using an adhesive.

  As shown in FIG. 7, a general headphone 1 includes an ear pad 2, a baffle plate 3, a headphone housing 4, and a headphone unit 5. When such a headphone 1 covers the user's pinna E and is worn on the side of the user's face, the side of the user's face, the earpad 2, a part of the baffle plate 3, and a headphone unit. A sealed space is formed by 5.

  The headphone unit 5 has a structure similar to that of a dynamic speaker. As shown in FIG. 8C, the headphone unit 5 is based on a unit frame 52, and in addition to this, a magnetic circuit constituent member, a diaphragm 54, and a voice coil 56 are provided. It has as a main component. Such a headphone unit 5 is attached to the baffle plate 3 by the unit frame 52 being fitted into the center hole of the baffle plate 3.

  The unit frame 52 is a disk-shaped part, and has a cylindrical portion 52a at the center, and the inner peripheral side of the cylindrical portion 52a is a through hole.

  The magnetic circuit component includes a yoke 57 formed in a circular dish shape, a disk-shaped magnet 58 fixed to the inner bottom surface of the yoke 57, and a disk fixed to the front end surface of the magnet 58. A pole piece 59 is provided. A cylindrical gap is formed over the entire circumference between the inner peripheral surface of the front end (the left end in FIG. 7 and the upper end in FIG. 8) of the yoke 57 and the pole piece 59. It becomes a magnetic gap through which the magnetic flux to be passed. The outer periphery of the yoke 57 is fitted into the cylindrical portion 52 a of the unit frame 52 and is integrated with the unit frame 52.

  The diaphragm 54 has a main dome at the center and a sub dome surrounding the periphery of the main dome (hereinafter, the main dome and the sub dome are collectively referred to as “vibration portion 54b”), and the outer peripheral edge ( Hereinafter, the “attached portion 54 a” is fixed to the outer peripheral edge of the unit frame 52. The diaphragm 54 is a thin plate part made of, for example, a resin, and the diaphragm 54 itself has an electromagnetic force generated in a voice coil 56 described later with an outer peripheral edge fixed to the unit frame 52 as a fulcrum. It can vibrate in the front-rear direction against elasticity. The front end of the voice coil 56 is fixed to the back side of the diaphragm 54 along the boundary between the main dome and the sub dome.

  The voice coil 56 is a part formed by winding a thin conductive wire in a cylindrical shape, and is disposed in the magnetic gap, and can move in the front-rear direction together with the diaphragm 54 without touching the yoke 57 and the pole piece 59. ing.

  As apparent from the configuration described above, since the voice coil 56 is disposed in the magnetic gap, when an audio signal is input to the voice coil 56, the current according to the audio signal and the magnetic flux in the magnetic gap are reduced. The voice coil 56 moves in the front-rear direction due to the electromagnetic force. Since the diaphragm 54 vibrates back and forth together with the voice coil 56, sound waves according to the audio signal are emitted from the diaphragm 54.

  When the headphone unit 5 is an ear covering type headphone, the unit frame 52 is fitted and fixed in the hole 31 of the baffle plate 3, and the housing 4 is fixed to the back side of the baffle plate 3. A protector for protecting the diaphragm 54 is disposed in front of the diaphragm 54, but the protector is not shown.

  In the headphone 1 having such a configuration, when a closed space is formed by the unit frame 52 and the diaphragm 54, the air acts as a spring, and the diaphragm 54 vibrates faithfully to the audio signal. I can't do that. Therefore, the communication hole 52b is formed in the unit frame 52, so that a closed space is not formed by the unit frame 52 and the diaphragm 54, and the diaphragm 54 is likely to vibrate. In addition, in order to give an appropriate damping characteristic to the diaphragm 54 and improve the frequency response, an acoustic resistance material 52c is attached to the unit frame 52 and covers the communication hole 52b. As the acoustic resistance material 52c, a material that has an appropriate resistance to air flow, such as a nonwoven fabric, open-cell sponge, glass wool, mesh, or the like is selected. Furthermore, a jetty 52f is provided on the outer peripheral edge of the unit frame 52 on the diaphragm fixing side.

  Here, the fixing of the diaphragm 54 to the unit frame 52 is generally performed through steps shown in FIGS. 8A to 8C using a rubber-based adhesive.

  First, as shown in FIG. 8A, the adhesive A is applied to the adhesive application part 52 g inside the jetty 52 f provided along the circumferential part of the unit frame 52.

  Next, as shown in FIG. 8B, the vibration plate 54 is placed on the unit frame 52 so that the attachment portion 54a is brought into contact with the adhesive application portion 52g. At this time, the adhesive also adheres to the pasting portion 54a. Further, the voice coil 56 fixed to the diaphragm 54 is inserted into the magnetic gap described above.

  Then, as shown in FIG. 8C, the adhesive A is cured, whereby the adhesive application portion 52g and the pasted portion 54a are bonded, and the vibration plate 54 is fixed to the unit frame 52.

  By the way, when the diaphragm 54 is placed on the unit frame 52, the adhesive A is sandwiched between the adhesive application part 52g and the pasting part 54a, so that the excess adhesive A is placed on the adhesive application part 52g. Are extruded evenly in each direction. However, since the adhesive A pushed out in the direction of the jetty 52f is blocked by the jetty 52f, the adhesive A is applied on the unit frame 52 as shown in FIG. 8B. It flows out concentratedly inward in the radial direction from the portion 52g. Most of the adhesive A that has flowed out adheres to the vibration part 54 b of the vibration plate 54.

  Here, the rubber-based adhesive is cured and bonded by volatilization of the volatile solvent contained as a component thereof, but at that time, the rubber-based adhesive shrinks by the amount of the volatile solvent that has volatilized. Therefore, as shown in FIG. 8C, when the adhesive A is cured, the vibration portion 54b to which the adhesive A is attached is deformed as the adhesive A contracts, so that the ease of vibration changes. End up. Such deformation of the vibration part or change in the ease of vibration adversely affects the sound quality of the headphones, and in particular causes a problem that the frequency response in the low sound range becomes non-uniform.

  As one of the countermeasures against this problem, there is an invention described in Patent Document 1. The headphones shown in FIGS. 9A to 9C are substantially the same as the headphones described in Patent Document 1. 9A to 9C, an adhesive reservoir 52h having a rectangular cross section is provided in a groove shape along the outer peripheral edge of the adhesive application portion 52g. As will be described below, when the vibration plate 54 is attached, the extra adhesive A flows into the adhesive reservoir 52h, thereby preventing the adhesive A from adhering to the vibration part 54b.

  When attaching the diaphragm 54, first, as shown in FIG. 9A, the adhesive A is applied to the adhesive application part 52g. Next, as shown in FIG. 9B, the vibration plate 54 is placed on the unit frame 52 such that the vibration plate 54 is overlapped with the adhesive application portion 52 g of the unit frame 52. At that time, the excess adhesive A is evenly pushed out in each direction on the adhesive application part 52g, and the adhesive A pushed out in the direction of the jetty 52f flows into the adhesive reservoir 52h.

JP 2001-333498 A

  However, since the adhesive A is evenly extruded in each direction of the adhesive application part 52g, as shown in FIG. 9B, only about half of the surplus adhesive A enters the adhesive reservoir 52h. The remaining adhesive A does not flow in and flows in the direction of the vibration part 54b of the vibration plate 54, and adhesion to the vibration plate 54 cannot be sufficiently suppressed. For this reason, as shown in FIG. 9C, the deformation / curing of the vibration part 54b due to the hardening / shrinkage of the adhesive A attached to the vibration plate 54 cannot be sufficiently suppressed, and as a result, the influence on the sound quality of the headphones is sufficient. There is a problem that it cannot be suppressed.

  The present invention has been made in view of the above problems, and effectively prevents adhesion of the adhesive to the vibration part of the diaphragm when the diaphragm is attached to the unit frame using an adhesive. An object of the present invention is to provide a headphone unit that can prevent deformation of the diaphragm and a headphone equipped with the headphone unit.

(1) The present invention relates to a magnetic circuit component member, a voice coil disposed in a magnetic gap formed by the magnetic circuit component member, a diaphragm to which the voice coil is fixed, and a peripheral portion of the diaphragm. A headphone unit including the unit frame, wherein the diaphragm is fixed to a fixing portion of the unit frame, and the fixing portion is formed of a horizontal portion and an inclined portion extending radially outward from the horizontal portion ; It is most important that the inclined portion is formed as a tapered inclined surface, and the inclined portion is intermittently formed in a groove shape at a plurality of locations in the circumferential direction of the fixing portion over the entire circumference of the fixing portion. Features.

Although not particularly limited in the present invention, in the above invention, the inclined portion preferably has a wedge shape in plan view .

  The present invention is also a headphone comprising: a baffle plate to which a headphone unit is attached; an earpad attached to the front side of the baffle plate; and a housing attached to the back side of the baffle plate, wherein the headphone unit Is the above headphone unit.

  According to the present invention, it is possible to effectively prevent the adhesive from adhering to the vibration portion of the diaphragm, and thereby, the deformation of the diaphragm in the structure in which the diaphragm is attached to the unit frame using the adhesive. Can be prevented and the influence on the sound quality of the headphones can be suppressed.

  Embodiments of the present invention will be described below with reference to the drawings. Since the headphone unit according to the embodiment of the present invention has the same structure as the conventional headphone unit described above except for the adhesive reservoir, the embodiment of the present invention will be described focusing on the shape of the adhesive reservoir. .

[Example 1]
As shown in FIGS. 1 and 2, the headphone unit 5 according to the present embodiment has a cross-sectional shape that is tapered in a lower portion on the inner peripheral side of the jetty 52 f provided on the circumferential portion of the unit frame 52. By forming the inclined portion 52j, an adhesive reservoir 52h ′ is provided over the entire circumference of the unit frame 52. A horizontal adhesive application portion 52g is provided along the radially inner side of the adhesive reservoir 52h ′. Accordingly, the adhesive reservoir 52h ′ is formed between the jetty 52f and the adhesive application portion 52g, and is continuous with the upper surface in FIG. 1 of the adhesive application portion 52g and gradually falls outward in the radial direction. -It is formed in a plate shape.

  In assembling such a headphone unit 5, first, as shown in FIG. 1A, the adhesive A is applied to the adhesive application part 52g.

  Next, as shown in FIG. 1B, the vibration plate 54 is placed on the unit frame 52 so that the attaching portion 54a is brought into contact with the adhesive application portion 52g. The voice coil 56 fixed to the diaphragm 54 is inserted into the magnetic gap described above.

  Then, as shown in FIG. 1C, the adhesive A is cured, so that the adhesive application portion 52g and the affixed portion 54a are bonded, and the vibration plate 54 is fixed to the unit frame 52.

  Thus, when the diaphragm 54 is mounted on the unit frame 52, the adhesive A is sandwiched between the adhesive application part 52g and the pasting part 54a, so that the excess adhesive A is removed from the adhesive application part. Extruded in each direction on 52g. The amount of the adhesive A pushed out in the direction of the adhesive reservoir 52h 'flows into the adhesive reservoir 52h'.

  Since the adhesive reservoir 52h ′ has the inclined portion 52j formed in a tapered shape as described above, the space formed by being sandwiched between the adhesive reservoir 52h ′ and the attaching portion 54a is The structure gradually becomes wider toward the outside in the radial direction.

  Here, the difference in the inflow of the adhesive A between the adhesive pool 52h of the conventional unit frame and the adhesive pool 52h 'of the unit frame of the present embodiment will be described.

  As shown in FIG. 10 (a), in the conventional unit frame 52, a corner portion 52i having a right cross-sectional shape is formed at the end of the adhesive application portion 52g on the adhesive reservoir 52h side. When the vibration plate 54 is attached to the unit frame 52, the adhesive A is sandwiched between the attachment portion 54a of the vibration plate 54 and the adhesive application portion 52g of the unit frame and pushed out in each direction.

  However, in the portion ahead of the corner portion 52i, the adhesive A is difficult to contact the inner wall portion of the adhesive reservoir 52h. Therefore, the adhesive A tends to be rounded evenly at the end of the adhesive reservoir 52h due to the surface tension, stays in the vicinity of the corner 52i, and cannot flow smoothly before that. As a result, adhesion of the adhesive A to the vibration part 54b cannot be sufficiently suppressed.

  On the other hand, as shown in FIG. 10B, in the unit frame 52 in the present embodiment, the adhesive reservoir 52h ′ formed on the outer circumferential side of the adhesive application portion 52g has an outer side from the inner side in the radial direction. An inclined portion 52j that is gently inclined toward the top and continues to the adhesive application portion 52g is formed. Therefore, the inclined portion 52j has a structure in which an attractive force due to so-called “wetting” easily acts on the adhesive applied to the adhesive application portion 52g. When the vibration plate 54 is attached to the unit frame 52, the adhesive A is sandwiched between the attachment portion 54a of the vibration plate 54 and the adhesive application portion 52g of the unit frame and pushed out in each direction. On the inner side in the radial direction of the adhesive application portion 52g, as in the conventional unit frame 52, corner portions 52i are formed, and the adhesive A does not flow easily.

  On the other hand, on the outer side in the radial direction of the adhesive application part 52g, as described above, the inclined part 52j is formed continuously with the adhesive application part 52g, and the attracting force due to so-called “wetability” is easy to work. Therefore, the adhesive A is guided to the adhesive reservoir 52h ′ along the inclined portion 52j, and the inflow of the adhesive A into the adhesive reservoir 52h ′ is promoted. Since the space formed by the inclined portion 52j and the attaching portion 54a of the diaphragm 54, that is, the adhesive reservoir 52h ′ gradually spreads outward in the radial direction, the adhesive A is applied to the inclined portion 52j and the attaching portion 54a. It can flow into the adhesive reservoir 52h ′ while maintaining contact.

  As the adhesive A used for attaching the diaphragm 54 and the unit frame 52, those having high affinity for the respective materials constituting the diaphragm 54 and the unit frame 52 are used. When a liquid with a high affinity for a material flows into a narrow space formed by the material, the liquid is in a narrow space due to the affinity between the material and the liquid, that is, the wettability, as in capillary action. Receives force in the direction of being pulled.

  Therefore, an adhesive A having a high affinity for the respective materials constituting the diaphragm 54 and the unit frame 52 is formed by the attaching portion 54a of the diaphragm 54 and the adhesive application portion 52g of the unit frame. When flowing into the adhesive reservoir 52h ′, which is a narrow space, the adhesive A is pulled to the adhesive reservoir 52h ′ by the wettability of the respective materials constituting the diaphragm 54 and the unit frame 52 and the adhesive A. Receive force in the direction

  Since the pulling force is not generated in the direction of the corner portion 52i, the direction of the corner portion 52i and the direction of the adhesive reservoir 52h ′ are different from each other in the ease of flow of the adhesive A. Upon receiving a force pulled in the direction of the agent reservoir 52h ′, it is easier to flow in the direction of the adhesive reservoir 52h ′ than in the direction of the corner portion 52i.

  Therefore, surplus adhesive A can flow into the adhesive reservoir 52h ′ in a concentrated manner, effectively preventing the adhesive A from protruding in the direction of the corner 52i, and vibration of the diaphragm 54 of the adhesive A. Adhesion to the part 54b can be effectively prevented.

  In the present invention, the adhesive reservoir 52h 'is not limited to the embodiment 1 described above, and may take other forms as described below.

[Example 2]
In the first embodiment, as shown in FIG. 2, the adhesive reservoir 52h ′ is formed continuously over the entire circumferential direction of the unit frame 52. However, in the present invention, the adhesive reservoir 52h ′ may be formed intermittently over the entire circumferential direction of the unit frame 52 as in the second embodiment shown in FIG. In the present embodiment, the adhesive reservoir 52 h ′ has a uniform width from the inner side to the outer side in the circumferential direction of the unit frame 52. Further, the cross-sectional shape is inclined in a tapered shape from the inner side to the outer side of the unit frame 52 in the same manner as the adhesive reservoir according to the first embodiment. Such an adhesive reservoir 52h ′ also has the same effect as that of the first embodiment.

[Example 3]
Further, in the present invention, as in the third embodiment shown in FIG. 4, the adhesive reservoir 52 h ′ is formed intermittently over the entire circumferential direction of the unit frame 52, and the planar shape thereof is the unit frame 52. It may have a so-called wedge shape that gradually narrows from the inside in the radial direction to the outside. Also in this case, the cross-sectional shape is inclined in a tapered shape from the inner side to the outer side in the radial direction of the unit frame 52 as in the case of the adhesive reservoir according to the first embodiment. Such an adhesive reservoir 52h ′ also has the same effect as that of the first embodiment.

[Example 4]
In the above-described first to third embodiments, the cross-sectional shape of the adhesive reservoir 52h ′ is configured to be inclined in a tapered shape from the inner side to the outer side in the radial direction of the unit frame 52. A configuration such as that of the fourth embodiment may be employed.

  In Example 4, the cross-sectional shape of the adhesive reservoir 52h 'is formed as a curved inclined surface, which is shown in FIG. However, in order to facilitate the tensile force due to the wettability of the adhesive to the inclined surface, the adhesive application part 52g and the adhesive reservoir 52h ′ are smoothly continuous in an arc so that no sharp corners are generated. It is desirable to make it. The planar shape of the adhesive reservoir 52h 'is arbitrary, and may be the same planar shape as the adhesive reservoir in the first to third embodiments. Also in this case, since the space formed by the bottom surface of the adhesive reservoir 52h ′ and the pasting portion 54a gradually expands outward in the radial direction, the adhesive A is applied to the adhesive reservoir 52h ′ and the pasting portion 54a. It can flow into the adhesive reservoir 52h ′ while maintaining contact, and has the same effects as those of the first to third embodiments.

[Example 5]
In Example 5, the cross-sectional shape of the adhesive reservoir 52h ′ is formed in a step shape having a plurality of step portions, which is shown in FIG. The planar shape of the adhesive reservoir 52h ′ is arbitrary, and may be the same planar shape as the adhesive reservoir in Examples 1 to 3. Also in the fifth embodiment, since the step of each step portion is small, the adhesive A flows into the adhesive reservoir 52h ′ while maintaining contact with the adhesive reservoir 52h ′ and the attachment site 54a. The same effects as those of the first to third embodiments can be obtained.

It is a longitudinal cross-sectional view which shows one Example of the headphone unit which concerns on this invention in order of an assembly process. It is a top view which shows the unit frame in the said Example. It is a top view which shows the modification of the unit frame applicable to the headphone unit which concerns on this invention. It is a top view which shows another modification of the unit frame applicable to the headphone unit which concerns on this invention. It is a longitudinal cross-sectional view which shows another Example of the headphone unit which concerns on this invention. It is a longitudinal cross-sectional view which shows another Example of the headphone unit which concerns on this invention. It is a longitudinal cross-sectional view which shows the example of the general headphone carrying the conventional headphone unit. It is a longitudinal cross-sectional view which shows the example of the conventional headphone unit in order of an assembly process. It is a longitudinal cross-sectional view which shows another example of the conventional headphone unit in order of an assembly process. FIGS. 2A and 2B are enlarged views showing how a diaphragm is fixed to a unit frame with an adhesive, wherein FIG. 1A is a longitudinal sectional view showing a conventional example, and FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Headphone 2 Ear pad 3 Baffle board 4 Headphone housing 5 Headphone unit 52 Unit frame 52f Jetty 52g Adhesive application part 52h, 52h 'Adhesive reservoir 52i Corner part 52j Inclination part 54 Diaphragm 54a Pasting part 54b Vibration part 56 Voice coil
A Adhesive

Claims (3)

A magnetic circuit component member, a voice coil disposed in a magnetic gap formed by the magnetic circuit component member, a diaphragm to which the voice coil is fixed, and a unit frame to which a peripheral portion of the diaphragm is fixed A headphone unit,
The diaphragm is fixed to the fixing portion of the unit frame,
The fixing part is formed of a horizontal part and an inclined part that extends radially outward from the horizontal part ,
The headphone unit in which the inclined portion is intermittently formed as a tapered inclined surface at a plurality of locations over the entire circumference of the fixed portion . The inclined part, the headphone unit of claim 1, wherein the planar shape is a wedge shape. A headphone comprising a baffle plate to which a headphone unit is attached, an ear pad attached to the front side of the baffle plate, and a housing attached to the back side of the baffle plate, wherein the headphone unit is claimed in claim 1 or A headphone which is the headphone unit according to 2 .

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