JP5318792B2 - Component removal device and method of manufacturing wiring board with pins - Google Patents

Description

  The present invention relates to a component removing device and a method of manufacturing a pinned wiring board.

  Conventionally, a wiring substrate (semiconductor package) in which solder bumps are formed on pads for mounting electronic components is known. As this type of wiring board, there are various types such as a pin grid array (PGA) in which a plurality of lead pins protrude from the back surface side. As shown in FIG. 11, the lead pin 101 is connected to the back surface of the wiring substrate 104 in a state of being inserted into a pin hole 103 provided in the substrate support jig 102, for example. Thereafter, the push pin 105 is inserted into the pin hole 103 from the back side of the substrate supporting jig 102, whereby the lead pin 101 is pushed up and pulled out from the pin hole 103.

  However, in this case, high accuracy is required for alignment between the push-up pin 105 and the pin hole 103. Further, since the push-up pin 105 is made of a material having a hardness higher than that of the substrate support jig 102, when the push-up pin 105 is repeatedly used, the inner wall surface of the pin hole 103 is scraped by friction with the push-up pin 105. The inner diameter of the pin hole 103 gradually increases. As a result, the positional accuracy of the lead pin 101 inserted into the pin hole 103 is lowered. In addition, since the substrate support jig 102 is gradually deformed by the heat generated when the lead pins 101 are connected, the position of the push-up pins 105 must be changed in accordance with the deformation, which is difficult to manage.

  Therefore, a method has been proposed in which the lead pin 101 is pulled out from the pin hole 103 by storing the substrate support jig 102 supporting the wiring substrate 104 in the sealed container and then supplying compressed air into the sealed container. (For example, refer to Patent Document 1). In this way, the push-up pin 105 is not necessary, and the above problem can be solved.

JP 2006-108376 A (FIG. 5 etc.)

  However, when compressed air is supplied into the sealed container, the compressed air may enter between the back surface of the substrate support jig 102 and the main surface of a table (not shown) that supports the substrate support jig 102. In this case, the board support jig 102 is lifted from the table, and accordingly, the space above the wiring board 104 (the space in which the wiring board 104 moves) in the sealed container is reduced. As a result, the wiring substrate 104 cannot be separated from the substrate support jig 102, and the lead pin 101 cannot be pulled out from the pin hole 103. In this case, for example, after the compressed air is removed and the substrate support jig 102 is lowered, it is necessary to supply compressed air again into the sealed container and lift only the wiring substrate 104. Efficiency will decrease. Also, if the lead pin 101 is forcibly pulled out, the lead pin 101 may be bent.

  The present invention has been made in view of the above problems, and a first object of the present invention is to prevent the component support jig from being lifted from the table, thereby reliably removing the component from the component support jig. The object is to provide a component removal device. A second object is to provide a method of manufacturing a wiring board with pins that can improve the production efficiency by preventing the substrate supporting jig from lifting from the table and securely pulling out the lead pins from the pin holes. There is to do.

As means for solving the above problems (means 1), there is an apparatus for removing a pin-attached wiring board, which is a component having a plurality of lead pins projecting from the back side, from a component support jig. The component support jig is supported, and a cylinder block that can be brought into and out of contact with the table. When the cylinder block is pressed against the table, the component is supported in the state of supporting the component. A sealed container that forms a space for housing a component support jig, a component pressing unit that is inserted into a through-hole provided in the cylinder block and presses the main surface of the component, and a pressing force of the component pressing unit A compressed gas supply means for supplying a compressed gas having a high pressure into the sealed container; and a jig holding means for pressing the component support jig against the main surface of the table. There is a component removal apparatus according to.

  Therefore, according to the component removal apparatus of means 1, the jig pressing means presses the component support jig against the main surface of the table, so that when the compressed gas is supplied into the sealed container, the back surface of the component support jig and the table Even if compressed gas enters between the main surface and the main surface, the component support jig is prevented from being lifted from the table. Therefore, the space above the component supported by the component support jig is secured in the sealed container, and therefore the component can be reliably removed from the component support jig.

  Here, the type of the component is not particularly limited, and examples thereof include a wiring board with pins in which a plurality of lead pins project from the back surface side, and a semiconductor package having a lead frame on the back surface side. In addition, when the component is a wiring board with pins in which a plurality of lead pins protrudes on the back side, a plurality of pin holes for inserting the plurality of lead pins are provided in the component support jig, and the wiring board with pins is provided. When the wiring board body is moved in the direction opposite to the pressing direction of the component pressing means, the plurality of lead pins inserted into the plurality of pin holes are stored in the sealed container in a state of being connected to the back surface of the wiring board body. In addition, it is preferable that the plurality of lead pins be pulled out from the plurality of pin holes. In this way, the lead board is pulled out from the pin hole, so that the wiring board body can be reliably removed from the component support jig.

  In addition, examples of the substrate (wiring substrate body) constituting the pinned wiring substrate in the present invention include a substrate mainly composed of a resin material or a ceramic material. Specific examples of substrates mainly composed of resin materials include EP resin (epoxy resin) substrates, PI resin (polyimide resin) substrates, BT resin (bismaleimide / triazine resin) substrates, and PPE resin (polyphenylene ether resin) substrates. and so on. In addition, a substrate made of a composite material of these resins and organic fibers such as glass fibers (glass woven fabric or glass nonwoven fabric) or polyamide fibers may be used. Alternatively, a substrate made of a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin with a three-dimensional network fluorine-based resin base material such as continuous porous PTFE may be used. Specific examples of the substrate mainly composed of a ceramic material include a substrate made of a ceramic material such as alumina, aluminum nitride, boron nitride, silicon carbide, and silicon nitride.

  Further, the material of the member support jig, the table and the cylinder block is not particularly limited. For example, metal materials such as copper, aluminum, iron, titanium, and stainless steel, and ceramic materials such as alumina, silicon nitride, silicon carbide, and boron nitride. And so on.

  The component pressing means has an outer diameter smaller than the inner diameter of the through-hole, has the same cross-sectional shape as the cross-sectional shape of the through-hole, and is externally fitted to the shaft portion that slides in the through-hole and the shaft portion. A packing for closing a gap generated between the through hole and the shaft portion, an outer dimension larger than the inner diameter of the through hole and the outer diameter of the shaft portion, and a cross-sectional shape identical to the planar shape of the component, The piston is preferably provided with a pressing portion that presses and a seal member that is disposed on the outer peripheral portion of the lower surface of the pressing portion and that contacts the outer peripheral portion of the component supported by the component support jig. In this case, since the packing closes the gap formed between the through hole and the shaft portion, it is possible to prevent the compressed gas supplied into the sealed container from leaking outside the sealed container through the gap. Further, since the seal member contacts the component supported by the component support jig, it is possible to prevent the compressed air from being guided to the main surface of the component. As a result, the force acting on the back surface of the component from the compressed air supplied to the sealed container is surely greater than the force acting on the main surface of the component from the compressed air supplied to the sealed container. The parts can be removed more reliably. Furthermore, since the seal member contacts the outer peripheral portion of the component, it is avoided that the seal member interferes with a terminal or the like provided at the central portion of the component.

  Furthermore, the jig holding means may be a member that directly presses the component support jig against the main surface of the table, or the component support jig is indirectly pressed against the main surface of the table via some member. It may be allowed. Also, as jig holding means, one that presses the component support jig in the same direction as the pressing direction of the component pressing means, or one that moves in the direction orthogonal to the pressing direction of the component pressing means and sandwiches the component support jig And a tool for sucking a component support jig from the table side. However, it is preferable that the jig holding means presses the component support jig in the same direction as the pressing direction of the component pressing means. In this way, it is easy to establish a structure in which the component support jig is pressed against the main surface of the table. If the jig holding means sandwiches the component support jig, or if the jig holding means sucks the component support jig from the table side, the mechanism of the jig holding means is complicated. turn into. In addition, when the jig holding means presses the component support jig in the same direction as the pressing direction of the component pressing means, the supply of the compressed gas by the compressed gas supply means causes the component to move in the direction opposite to the pressing direction of the component pressing means. The component is moved and removed from the component support jig, and the holding of the component support jig by the jig holding means prevents the component support jig from moving in the direction opposite to the pressing direction of the component pressing means. .

  Although it does not specifically limit as a jig | tool holding means, For example, it is equipped with actuators, such as an air cylinder and a solenoid which moves a component support jig in the same direction as the pressing direction of a component press means, and surface-contacts a component support jig Examples include a contact member and a compression spring that is interposed between the cylinder block and the contact member and urges the cylinder block and the contact member in a direction to separate them from each other. The jig holding means includes a contact member that is in surface contact with the component support jig, a compression spring that is interposed between the cylinder block and the contact member, and biases the cylinder block and the contact member in a direction away from each other. It is preferable to provide. In this way, the structure of the jig holding means becomes simpler than that of an actuator, and driving control of the jig holding means becomes unnecessary, so that the jig holding means can be realized at low cost and easily. Can be made.

  The jig holding means is disposed in a space formed in the sealed container, and the cylinder block is formed with a recess that opens on the surface facing the table, and is compressed in the spring housing recess that opens on the inner surface of the recess. Preferably, the proximal end of the spring is accommodated. In this case, since the jig holding means is disposed in the space formed in the sealed container, the compressed gas supplied into the sealed container cannot leak out of the sealed container through the jig holding means. Absent. Further, since the proximal end portion of the compression spring is accommodated in the spring accommodating recess, the movement of the compression spring can be stabilized. Therefore, the reliability of the component removing device is improved.

  The component support jig includes a plurality of component support regions that support the component along the planar direction, and the contact member is a frame-shaped contact member that is in surface contact with the outer region of the plurality of component support regions. A plurality of compression springs may be arranged so as to surround a plurality of component support regions. In this case, since a plurality of parts with a plurality of terminals projecting can be obtained simultaneously, the parts can be manufactured efficiently.

  Another means (means 2) for solving the above problem is a method of manufacturing a pinned wiring board in which a plurality of lead pins project from the back side of the wiring board body, wherein the plurality of lead pins are The substrate support jig in a state in which the wiring board body is supported while being inserted into a plurality of pin holes provided in the board supporting jig for supporting the wiring board body and connected to the back surface of the wiring board body. Is housed in a sealed container including a table on which the substrate support jig is supported and a cylinder block that can be moved toward and away from the table, and the wiring is provided by a substrate pressing means that passes through the cylinder block. A pressing step of pressing the main surface of the substrate body, and after the pressing step, by supplying compressed gas having a pressure higher than the pressing force of the substrate pressing means into the sealed container, A drawing step of drawing a number of lead pins from the plurality of pin holes, the drawing step being in a direction opposite to the pressing direction of the substrate pressing means by bringing the substrate supporting jig into pressure contact with the main surface of the table There is a method of manufacturing a wiring board with pins, comprising a movement preventing step of preventing movement of the substrate support jig to the board.

  Therefore, according to the method of manufacturing the pinned wiring substrate of the means 2, in the movement preventing step, the substrate supporting jig is pressed in the direction opposite to the pressing direction of the substrate pressing means by bringing the substrate supporting jig into pressure contact with the main surface of the table. The movement of the tool is prevented. For this reason, when the compressed gas is supplied into the sealed container, the compressed gas is prevented from entering between the back surface of the substrate support jig and the main surface of the table, and the substrate support jig is prevented from floating from the table. Is done. Therefore, since the space above the wiring board body supported by the board support jig is secured in the sealed container, the lead pin can be reliably pulled out from the pin hole by performing the drawing process, and as a result, the wiring board body Can be reliably removed from the substrate support jig. Therefore, for example, after removing compressed air and lowering the board support jig, it is not necessary to supply compressed air again into the sealed container and lift only the wiring board body. Can be improved.

  In the movement preventing step, it is preferable that the substrate support jig is pressed against the main surface of the table by pressing the substrate support jig in the same direction as the pressing direction of the substrate pressing means. In this case, for example, the substrate support jig can be easily pressed against the main surface of the table as compared with the case where the substrate support jig is pressed in a direction orthogonal to the pressing direction of the substrate pressing means.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. The top view which shows the positional relationship of a board | substrate support jig | tool, a wiring board with a pin, a piston, seal rubber, and a jig | tool press means. The bottom view which shows the structure of the front-end | tip part of a piston. Explanatory drawing which shows the manufacturing method of a wiring board with a pin. Explanatory drawing which shows the manufacturing method of a wiring board with a pin. Explanatory drawing which shows the manufacturing method of a wiring board with a pin. Explanatory drawing which shows the manufacturing method of a wiring board with a pin. Explanatory drawing which shows the manufacturing method of a wiring board with a pin. Explanatory drawing which shows the manufacturing method of a wiring board with a pin. The schematic sectional drawing which shows the component removal apparatus in other embodiment. Explanatory drawing which shows the drawing method of the lead pin in a prior art.

  Hereinafter, an embodiment embodying the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the component removal apparatus 1 includes a substrate support jig 2 (component support jig) that supports a pinned wiring board (hereinafter referred to as “wiring board”) 10, and a wiring board 10. Is provided with a hermetically sealed container 3 for storing the substrate support jig 2 in a state of supporting the substrate. The component removal apparatus 1 is an apparatus that removes the wiring board 10 from the board support jig 2.

  In addition, the wiring board 10 of the present embodiment is a pin grid array (PGA) type semiconductor package that can support multi-terminal high-density flip-chip connection such as MPU. More specifically, the wiring board 10 is a multilayer wiring board in which a plurality of resin insulating layers are laminated on the upper and lower surfaces of a core substrate mainly composed of an epoxy resin or the like by a known method. This multilayer wiring board is a flat plate-like component provided with a copper wiring (not shown) between the resin insulating layers.

  A plurality of pads (not shown) for flip-chip connection of electronic components such as IC chips are almost in the central region of the main surface 13 (upper surface in FIG. 1) of the wiring board main body 11 constituting the wiring board 10. The solder bumps 14 (see FIG. 2) are formed on each pad while being arranged in a grid pattern. The solder bumps 14 are formed by reflowing after applying solder by printing solder paste on the pads on the main surface 13 and having a hemispherical shape.

  Further, as shown in FIG. 1, a plurality of pads (not shown) are formed in a substantially lattice pattern over the entire area of the back surface 15 (the lower surface in FIG. 1) of the wiring board body 11, and on each pad. A plurality of lead pins 12 (terminals) for socket mounting are connected by soldering. Each lead pin 12 is soldered with a solder having a melting point higher than that of the solder bump 14. Each lead pin 12 has a shaft portion having a circular cross section and a head portion having a diameter larger than that of the shaft portion. The head is soldered to the pad.

  As shown in FIGS. 1 and 2, the substrate support jig 2 is formed using, for example, aluminum, and has a main surface 21 that can come into contact with the back surface 15 of the wiring board body 11 and an opposite side of the main surface 21. And a rear surface 22 located. On the main surface 21 of the substrate support jig 2, substrate support regions 24 (component support regions) that support the wiring substrate 10 are arranged at a plurality of locations (four locations in the present embodiment) along the plane direction. In the substrate support jig 2, a plurality of pin holes 23 opened at the main surface 21 and the back surface 22 are arranged in a lattice pattern at the same pitch as the lead pins 12. A plurality of lead pins 12 are inserted into each pin hole 23. Each pin hole 23 gradually increases as the cross-sectional area of the opening on the main surface 21 side approaches the opening end, and can accommodate the head of the lead pin 12.

  As shown in FIG. 1, the sealed container 3 is formed of a metal material having high hardness such as SK material, and a table 32 on which the substrate support jig 2 is supported, and a cylinder that can be brought into contact with and separated from the table 32. And a block 31. The sealed container 3 forms a space for housing the substrate support jig 2 in a state of supporting the wiring substrate 10 when the cylinder block 31 is pressed against the table 32.

  The cylinder block 31 has a facing surface 33 that is a surface facing the table 32, and a non-facing surface 34 located on the opposite side of the facing surface 33. In addition, the cylinder block 31 is formed with a recess 35 that opens in the facing surface 33, and a seal rubber 36 is accommodated in the recess 35. The seal rubber 36 is in contact with the inner surface (inner surface and bottom surface) of the recess 35, and the lower end protrudes from the opening end of the recess 35 toward the table 32. The seal rubber 36 is made of urethane rubber or the like, and improves the airtightness of the sealed container 3 by being pressed against the outer peripheral portion of the table 32.

  As shown in FIG. 2, the seal rubber 36 of the present embodiment has a rectangular frame shape and is disposed so as to surround the substrate support jig 2. However, the corners of the seal rubber 36 are easily damaged because stress tends to concentrate. In this case, the hermeticity of the sealed container 3 may be reduced. Therefore, in this embodiment, the width of the seal rubber 36 is set to 20 mm or less (preferably 10 mm or less). In this way, the seal rubber 36 is easily deformed and is not easily damaged, so that the airtightness of the sealed container 3 can be reliably ensured.

  As shown in FIGS. 1 and 3, a piston housing recess 37 that opens at the bottom surface of the recess 35 is formed at the center of the bottom surface of the recess 35. Further, the cylinder block 31 is provided with four through holes 38 that open at the bottom surface and the non-facing surface 34 of the piston accommodating recess 37. Each through-hole 38 is positioned above the four substrate support regions 24 arranged on the main surface 21 of the substrate support jig 2 when the cylinder block 31 contacts and separates from the table 32. ing. A piston 4 (component pressing means, board pressing means) that presses the main surface 13 of the wiring board body 11 is inserted into each through hole 38. Each piston 4 includes a shaft portion 41, an O-ring 42 (packing), a pressing portion 43, and a seal member 44. The shaft portion 41 has an outer diameter smaller than the inner diameter of the through-hole 38, has the same cross-sectional shape as the cross-sectional shape of the through-hole 38, and slides in the through-hole 38. The O-ring 42 is externally fitted to the shaft portion 41, and the airtightness of the sealed container 3 is ensured by closing a gap generated between the through hole 38 and the shaft portion 41. The pressing portion 43 is accommodated in the piston accommodating recess 37, has an outer dimension larger than the inner diameter of the through hole 38 and the outer diameter of the shaft portion 41, and has the same cross-sectional shape as the planar shape of the wiring board 10. Yes. The pressing portion 43 presses the wiring board 10. The seal member 44 has a rectangular frame shape and is disposed on the outer peripheral portion of the lower surface of the pressing portion 43. The seal member 44 comes into contact with the outer peripheral portion of the main surface 13 of the wiring board body 11 supported by the substrate support jig 2 and surrounds the plurality of solder bumps 14 formed on the main surface 13. The seal member 44 is made of nitrile rubber and reduces contamination of the main surface 13 that comes into contact.

  As shown in FIGS. 1 and 3, the piston 4 has a suction hole 45 that opens on the lower surface of the pressing portion 43. The suction hole 45 communicates with a suction unit that sucks the gas in the hollow portion formed by the wiring board body 11, the seal member 44, and the piston 4. Therefore, the piston 4 can adsorb the wiring board body 11.

  Further, a bump protection portion 46 that is in contact with and supports the tops of the plurality of solder bumps 14 is provided in a region on the inner surface of the seal member 44 on the lower surface of the pressing portion 43. The bump protector 46 prevents damage to the solder bump 14 due to the suction of the wiring board main body 11 by the suction hole 45. Further, since the bump protection part 46 is made of ceramic (silicon nitride in the present embodiment), adhesion of solder to the bump protection part 46 is prevented. The ceramic forming the bump protection part 46 may be changed to alumina, zirconia, aluminum nitride, silicon carbide, or the like. The height of the bump protection part 46 is preferably smaller than the height of the seal member 44. Furthermore, the height difference between the seal member 44 and the bump protection part 46 can be changed as appropriate according to the type (product number) of the wiring board 10, but in this embodiment is 0.20 mm or less (preferably 0.15 mm or less). Is set to In this way, it becomes easy to ensure both airtightness in the hollow portion due to deformation of the seal member 44 and support of the solder bumps 14 by the bump protection portion 46. The height difference is set to be equal to or higher than the height from the main surface 13 of the wiring board body 11 to the top of the solder bump 14.

  As shown in FIG. 1, the component removing device 1 includes compressed gas supply means 5 that supplies compressed air (compressed gas) having a pressure higher than the pressing force of the piston 4 into the sealed container 3. The compressed gas supply means 5 supplies the compressed air accumulated in the pressure vessel by the compressor into the sealed vessel 3 through the supply port 6. Then, the component removing apparatus 1 uses the compressed air supplied into the hermetic container 3 to move the wiring board 10 in the direction opposite to the pressing direction of the piston 4 so that the wiring board 10 is removed from the board support jig 2. It is designed to be removed. Accordingly, the plurality of lead pins 12 are pulled out from the pin holes 23 of the substrate support jig 2.

  As shown in FIG. 1 and FIG. 2, in the space formed in the sealed container 3, jig pressing means 51 (jig holding) that presses the substrate support jig 2 directly against the main surface 39 of the table 32. Means) are arranged. The jig pressing means 51 is configured to mechanically press and hold the substrate support jig 2 along the same direction as the pressing direction of the piston 4. Therefore, the movement of the substrate support jig 2 in the direction opposite to the pressing direction of the piston 4 is prevented. The jig pressing means 51 includes a contact member 52 and a compression spring 53. The contact member 52 has a rectangular frame shape and is in surface contact with the outer regions of the four substrate support regions 24 on the main surface 21 of the substrate support jig 2. The contact member 52 has a contact surface 54 that is a surface that contacts the substrate support jig 2 and a non-contact surface 55 that is located on the opposite side of the contact surface 54. Further, the contact member 52 is provided with six spring accommodating recesses 56 having a circular shape in plan view. The spring accommodating recesses 56 are arranged at equal intervals in the contact member 52 and are arranged on an extension line of an imaginary line (not shown) set between the outlines of the adjacent substrate support regions 24. . Each spring accommodating recess 56 opens in the non-contact surface 55 and accommodates the tip of the compression spring 53. As a result, the plurality of compression springs 53 are arranged away from each other so as to surround each substrate support region 24. The base end portion of the compression spring 53 is accommodated in a spring accommodating recess 57 that opens at the bottom surface of the recess 35. Accordingly, each compression spring 53 is interposed between the cylinder block 31 and the contact member 52 and biases the cylinder block 31 and the contact member 52 in a direction in which they are separated from each other.

  Next, a method for manufacturing the wiring board 10 will be described.

  The wiring board body 11 is manufactured as follows. First, a resin insulating layer made of an epoxy resin is formed on a core substrate, and copper wiring is formed on the surfaces of the core substrate and the resin insulating layer by a semi-additive method using electroless copper plating and electrolytic copper plating. As a result, the wiring board body 11 is formed. Note that the copper wiring may be formed by a subtractive method or a full additive method.

  Next, a plurality of places on the main surface 13 of the wiring board body 11 are subjected to electroless Ni—P plating, and further subjected to electroless Au plating, thereby forming a pad made of a Ni—P plating layer and an Au plating layer. . Note that a solder resist (not shown) is formed using acrylic resin, epoxy resin, or the like on a portion of the main surface 13 of the wiring substrate 10 where the pad is not formed.

  Then, a solder paste is printed on the pad formed on the main surface 13 of the wiring board body 11 using a metal mask (not shown). And the wiring board main body 11 which printed the solder paste is arrange | positioned in a reflow furnace, and it heats to the temperature 10-40 degreeC higher than melting | fusing point of solder, and cools after that. As a result, a plurality of solder bumps 14 having a hemispherical shape are arranged on the main surface 13 side of the wiring board body 11.

  Next, the lead pins 12 are inserted into the pin holes 23 of the substrate support jig 2 placed on the table 32 (see FIG. 4). Further, the lead pins 12 are soldered to the back surface 15 of the wiring board body 11 (see FIG. 5). Soldering is performed by forming a solder paste on a pad (not shown) formed on the back surface 15 of the wiring board body 11 by printing or the like and then reflowing the solder paste with the head of the lead pin 12 in contact with the solder paste. Is called. Then, the cooling process which cools to about room temperature using a cooling fan etc. is performed. Although the cooling step is not essential, it is preferable to perform the cooling step because temperature management is difficult or the seal member 44 of the piston 4 used in the subsequent step is made of nitrile rubber that is weak at high temperatures.

  In the subsequent pressing step, the substrate support jig 2 supporting the wiring board body 11 is moved together with the table 32 below the cylinder block 31 retracted upward (see FIG. 6). Next, the cylinder block 31 is lowered and brought into pressure contact with the table 32 (see FIG. 7). As a result, the substrate support jig 2 supporting the wiring substrate body 11 is accommodated in the sealed container 3. The cylinder block 31 is kept in pressure contact with the table 32 until a drawing process described later is performed. Then, the piston 4 is lowered, and the main surface 13 of the wiring board body 11 is pressed by the piston 4 (see FIG. 8). The pressing by the piston 4 is intended to apply a constant pressure to the main surface 13 when performing the drawing process, so that it is not necessary to apply a very strong pressure. Therefore, the main surface 13 may be pressed only by its own weight instead of lowering the piston 4 mechanically.

  Next, by driving the suction means, the gas in the hollow portion constituted by the wiring board body 11, the seal member 44 and the piston 4 is sucked from the suction hole 45, and the main surface 13 of the wiring board body 11 is moved to the piston 4. Adsorb.

  In the subsequent drawing step, compressed air is supplied into the sealed container 3 by the compressed gas supply means 5 so that the plurality of lead pins 12 projecting from the back surface 15 side of the wiring board body 11 are connected to the pin holes of the board support jig 2. Pull out from 23 (see FIG. 1). Specifically, the pressure of the compressed air is set higher than the pressing force of the piston 4. Further, the pressure acting on the back surface 15 of the wiring board body 11 is more than the force (pressing force of the piston 4) acting on the main surface 13 of the wiring board body 11 due to the compressed air supplied into the sealed container 3. Therefore, the wiring board body 11 moves in the direction opposite to the pressing direction of the piston 4 (upward in FIG. 1), and the lead pin 12 is pulled out from the pin hole 23.

  Further, in the drawing process, a movement preventing process for preventing the movement of the substrate support jig 2 in the direction opposite to the pressing direction of the piston 4 is performed. More specifically, the compression spring 53 of the jig pressing means 51 urges the cylinder block 31 and the contact member 52 in a direction that separates them from each other. Along with this, the contact member 52 of the jig pressing means 51 mechanically presses the substrate support jig 2 in the same direction as the pressing direction of the piston 4. As a result, the substrate support jig 2 is pressed against the main surface 39 of the table 32, and the movement of the substrate support jig 2 in the direction opposite to the pressing direction of the piston 4 is prevented.

  Next, the cylinder block 31 is raised while the wiring board body 11 is still adsorbed to the piston 4 (see FIG. 9). The wiring board body 11 is moved to another jig when the adsorption by the piston 4 is released. Thereafter, the wiring board 10 is completed in which a plurality of lead pins 12 project from the back surface 15 side of the wiring board body 11.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the component removing device 1 of the present embodiment, the jig pressing means 51 presses the substrate support jig 2 against the main surface 39 of the table 32, so that the substrate support treatment in the direction opposite to the pressing direction of the piston 4 is performed. The movement of the tool 2 is prevented. For this reason, when compressed gas is supplied into the sealed container 3, the compressed gas is prevented from entering between the back surface 22 of the substrate support jig 2 and the main surface 39 of the table 32, and the substrate support from the table 32 is supported. The lifting of the jig 2 is prevented. Therefore, the space above the wiring board 10 (wiring board main body 11) supported by the board support jig 2 is secured in the sealed container 3, so that the lead pin 12 can be reliably pulled out from the pin hole 23, and thus The wiring board 10 can be reliably removed from the board support jig 2.

  (2) The jig pressing means 51 of the present embodiment is disposed in the space formed in the sealed container 3, and the compression spring 53 provided in the jig pressing means 51 has a base end formed on the cylinder block 31. It is accommodated in the spring accommodating recess 57. That is, the spring accommodating recess 57 does not penetrate the cylinder block 31, and the provision of the jig pressing means 51 does not form a through hole or a gap communicating with the inside and outside of the sealed container 3. Therefore, leakage of the compressed air to the outside of the sealed container 3 due to the provision of the jig pressing means 51 can be prevented.

  (3) In the present embodiment, the base end portion of the compression spring 53 is accommodated in the spring accommodating recess 57 on the cylinder block 31 side, and the distal end portion of the compression spring 53 is accommodated in the spring accommodating recess 56 on the contact member 52 side. Therefore, the movement of the compression spring 53 can be stabilized. Therefore, the reliability of the component removing apparatus 1 is improved.

  (4) In the jig pressing means 51 of the present embodiment, six compression springs 53 are arranged apart from each other so as to surround the four substrate support regions 24. For this reason, when the substrate support jig 2 is pressed by the jig pressing means 51, the force acts evenly on the substrate support jig 2. Therefore, even though the substrate supporting jig 2 is pressed by the jig pressing means 51, the problem that a part of the substrate supporting jig 2 is lifted because the force does not act evenly can be solved.

  (5) In the present embodiment, the wiring board body 11 is sucked by the suction means. As a result, the adhesion between the piston 4 and the wiring board main body 11 can be improved. Therefore, when the compressed gas is supplied into the sealed container 3, the wiring board main body 11 is moved in a direction opposite to the pressing direction of the piston 4. Can be moved more reliably.

  In addition, you may change this embodiment as follows.

  -Although the jig | tool pressing means 51 of the said embodiment was provided with the contact member 52 and the compression spring 53, it may be provided with another mechanism. For example, as shown in FIG. 10, a jig pressing means 61 including a contact member 62 and an electric actuator 63 may be used. The electric actuator 63 includes an actuator main body 64 installed on the non-facing surface 34 of the cylinder block 31 and a piston rod 65 that is driven by air pressure and presses the substrate support jig 2. In this way, the force for pressing the substrate support jig 2 can be electrically controlled. However, when the electric actuator 63 is provided, the through hole 66 for the piston rod 65 penetrating the sealed container 3 is formed, so that compressed air may leak out of the sealed container 3 through the through hole 66. In order to solve this problem, the O-ring 67 (see FIG. 10) is externally fitted to the piston rod 65 to close the gap generated between the through hole 66 and the piston rod 65, so that the hermeticity of the hermetic container 3 is improved. However, the fear of compressed air leakage is not completely eliminated. In addition, the jig pressing means 61 requires power (electric actuator 63), which increases the manufacturing cost of the wiring board 10. Therefore, the jig pressing means preferably includes the contact member 52 and the compression spring 53.

  -Although the jig | tool pressing means 51 of the said embodiment was provided with the compression spring 53 which is an elastic body, you may be provided with other elastic bodies, such as rubber | gum. If the elastic body is rubber, the elastic force of the rubber cannot be increased unless the deformation amount (compression amount) of the rubber during the pressing process is set large. The substrate support jig 2 cannot be pressed with a strong force, and the substrate support jig 2 is lifted. However, it is difficult to set the amount of rubber deformation. Therefore, the elastic body is preferably the compression spring 53.

  In the jig pressing means 51 of the above embodiment, if the force of the compression spring 53 is too strong, the main surface 21 of the substrate support jig 2 may be damaged. Even if it is attempted to replace the compression spring 53 with a weak one, the replacement work of the compression spring 53 must be performed while lifting the heavy cylinder block 31, so that the operation is difficult. Therefore, an adjustment mechanism for adjusting the urging force of the compression spring 53 may be provided for the compression spring 53. As an adjustment mechanism, by inserting a pin from the side of the compression spring 53 and fixing a part of the compression spring 53, the length of the portion where the compression spring 53 functions (that is, the magnitude of the spring coefficient) is set. Things to adjust.

  In the substrate support jig 2 of the above embodiment, a plurality of pin holes 23 opened at the main surface 21 and the back surface 22 are provided. However, each pin hole 23 may be opened only on the main surface 21.

  In the above embodiment, as a means for preventing damage to the solder bumps 14, the bump protection part 46 that contacts and supports the top of the solder bumps 14 is provided. However, damage to the solder bumps 14 may be prevented by means other than the bump protection unit 46. For example, the bump protection part 46 is omitted, and a state in which a gap is generated between the solder bump 14 and the lower surface of the piston 4 (pressing part 43) is maintained even when the wiring board body 11 is sucked by the suction hole 45. You may do it.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) An apparatus for removing a component provided with a plurality of terminals from a component support jig, including a table on which the component support jig is supported and a cylinder block that can be moved toward and away from the table. And when the cylinder block is pressed against the table, it is inserted into a sealed container that forms a space for storing the component support jig in a state of supporting the component, and a through hole provided in the cylinder block, Component pressing means for pressing the main surface of the component; compressed gas supply means for supplying compressed gas having a pressure higher than the pressing force of the component pressing means into the sealed container; and the component support jig for the table. A jig holding means for press-contacting to the main surface, wherein the component pressing means includes a frame-shaped seal member provided in a portion in contact with the main surface of the component, the component, the seal member, and the front And a suction means for sucking the gas in the hollow portion constituted by parts pressing means, parts removal device, characterized in that the adsorption of the component by sucking gas in the hollow portion by the suction means.

  (2) In the technical idea (1), the seal member is made of nitrile rubber.

  (3) In the technical idea (1) or (2), the component is a wiring board in which a plurality of solder bumps are formed on a main surface side, and the component pressing means is configured such that the seal member includes the plurality of solders. A component removing apparatus comprising a bump protection section that surrounds the bump and supports the solder bump in contact with the bump.

  (4) In the technical idea (3), the bump protecting portion is made of ceramic, and the component removing apparatus.

  (5) In the technical idea (3) or (4), the height difference between the seal member and the bump protection portion is 0.20 mm or less, and the component removing device.

  (6) In any one of the technical ideas (1) to (5), the cylinder block is provided with a rectangular frame-shaped seal rubber, and the width of the seal rubber is set to 20 mm or less. Parts removal device.

  (7) A method of manufacturing a pinned wiring board in which a plurality of lead pins project from a back surface side of the wiring board body, wherein the plurality of lead pins are provided on a substrate support jig that supports the wiring board body. The substrate support jig in a state of supporting the wiring board body in a state of being inserted into a plurality of pin holes and connected to the back surface of the wiring board body, and a table on which the board support jig is supported and A pressing step of storing the inside of a sealed container including a cylinder block that can be brought into and out of contact with the table, and pressing a main surface of the wiring board body by a board pressing means that passes through the cylinder block; and the pressing After the step, the plurality of lead pins are pulled out from the plurality of pin holes by supplying a compressed gas having a pressure higher than the pressing force of the substrate pressing means into the sealed container. The drawing step includes preventing the substrate supporting jig from moving in a direction opposite to the pressing direction of the substrate pressing means by pressing the substrate supporting jig against the main surface of the table. The substrate pressing means is constituted by a frame-shaped seal member provided at a portion in contact with the main surface of the wiring board body, the wiring board body, the sealing member, and the board pressing means. And a suction means for sucking the gas in the hollow part, and in the pressing step, the wiring board body is sucked by sucking the gas in the hollow part by the suction means. Manufacturing method.

  (8) In the technical idea (7), the component is a wiring board in which a plurality of solder bumps are formed on a main surface side, and the board pressing unit includes the sealing member that surrounds the plurality of solder bumps. A method of manufacturing a wiring board with pins, comprising: a bump protection part that contacts and supports the plurality of solder bumps.

  (9) An apparatus for removing a work from a work support jig, comprising a table on which the work support jig is supported, and a sealed container for storing the work support jig in a state of supporting the work; , A workpiece pressing means that is inserted into a through-hole provided in the sealed container and presses the main surface of the workpiece, and a compression that supplies compressed gas having a pressure higher than the pressing force of the workpiece pressing means into the sealed container A workpiece detaching apparatus comprising: a gas supply unit; and a jig holding unit that presses the workpiece supporting jig against the main surface of the table.

DESCRIPTION OF SYMBOLS 1 ... Component removal apparatus 2 ... Board | substrate support jig | tool 3 as a component support jig | tool ... Sealed container 4 ... Piston 5 as a component press means and a substrate press means ... Compressed gas supply means 10 ... A wiring board with a pin as a component (wiring) substrate)
DESCRIPTION OF SYMBOLS 11 ... Wiring board main body 12 ... Lead pin 13 as a terminal ... Main surface 15 of a component and a wiring board main body ... Back surface 23 of a component and a wiring board main body ... Pin hole 24 ... Substrate support area 31 as a component support area ... Cylinder block 32 ... Table 33 ... Opposite surface 35 as a surface facing the table ... Recess 38 ... Through hole 39 ... Table main surface 41 ... Shaft portion 42 ... O-ring 43 as packing ... Pressing portion 44 ... Seal members 51, 61 ... Jig Jig pressing means 52 as a holding means ... Contact member 53 ... Compression spring 57 ... Spring accommodating recess

Claims (10)

A device for removing a wiring board with pins, which is a component in which a plurality of lead pins serving as a plurality of terminals protrudes on the back side, from a component support jig,
The component support is configured to include a table on which the component support jig is supported and a cylinder block that can be brought into and out of contact with the table, and supports the component when the cylinder block is pressed against the table. A sealed container that forms a space for storing the jig;
A component pressing means that is inserted into a through-hole provided in the cylinder block and presses the main surface of the component;
Compressed gas supply means for supplying compressed gas having a pressure higher than the pressing force of the component pressing means into the sealed container;
A component removal apparatus comprising jig holding means for pressing the component support jig against the main surface of the table. With the supply of the compressed gas by the compressed gas supply means, the component is moved in the direction opposite to the pressing direction of the component pressing means, and the component is removed from the component support jig,
2. The component according to claim 1, wherein the component supporting jig is prevented from moving in a direction opposite to a pressing direction of the component pressing unit by holding the component supporting jig by the jig holding unit. Removal device.   The component removing apparatus according to claim 1, wherein the jig holding unit presses the component supporting jig in the same direction as a pressing direction of the component pressing unit. The jig holding means is
A contact member in surface contact with the component support jig;
The component removing device according to claim 3, further comprising a compression spring interposed between the cylinder block and the contact member and biasing the cylinder block and the contact member in a direction in which the cylinder block and the contact member are separated from each other. . The jig holding means is disposed in a space formed in the sealed container,
The cylinder block is formed with a recess that opens on a surface facing the table, and a base end portion of the compression spring is housed in a spring housing recess that opens on an inner surface of the recess. 4. The part removing apparatus according to 4. In the component support jig, a plurality of component support regions for supporting the component are arranged along the plane direction,
The contact member is a frame-shaped contact member that is in surface contact with an outer region of the plurality of component support regions,
6. The component removing device according to claim 4, wherein a plurality of the compression springs are arranged so as to surround the plurality of component supporting regions. The component pressing means is
Having an outer diameter smaller than the inner diameter of the through-hole, having the same cross-sectional shape as the cross-sectional shape of the through-hole, and a shaft portion that slides in the through-hole,
A packing that is externally fitted to the shaft portion and closes a gap formed between the through hole and the shaft portion;
A pressing portion that has an outer dimension larger than the inner diameter of the through hole and the outer diameter of the shaft portion, has the same cross-sectional shape as the planar shape of the component, and presses the component;
7. The piston according to claim 1, wherein the piston includes a seal member disposed on an outer peripheral portion of the lower surface of the pressing portion and contacting a peripheral portion of the component supported by the component support jig. The component removal device as described in the paragraph. Before SL component support jig, a plurality of pin holes for inserting the plurality of lead pins are provided,
The pinned wiring board is housed in the sealed container in a state where the plurality of lead pins inserted into the plurality of pin holes are connected to the back surface of the wiring board main body,
The plurality of lead pins are pulled out from the plurality of pin holes when the wiring board body moves in a direction opposite to the pressing direction of the component pressing means. The component removal device described in 1. A method of manufacturing a wiring board with pins in which a plurality of lead pins project from the back side of the wiring board body,
The plurality of lead pins are inserted into a plurality of pin holes provided in a substrate support jig that supports the wiring board body, and are connected to the back surface of the wiring board body, and support the wiring board body. The substrate support jig in a state is housed in a sealed container configured to include a table on which the substrate support jig is supported and a cylinder block that can be moved toward and away from the table, and the cylinder block is inserted into the sealed container. A pressing step of pressing the main surface of the wiring board body by the substrate pressing means to perform;
A pulling step of pulling out the plurality of lead pins from the plurality of pin holes by supplying a compressed gas having a pressure higher than the pressing force of the substrate pressing means into the sealed container after the pressing step;
The drawing step includes a movement preventing step of preventing the movement of the substrate support jig in a direction opposite to the pressing direction of the substrate pressing means by bringing the substrate support jig into pressure contact with the main surface of the table. A method of manufacturing a wiring board with pins, comprising:   The said movement prevention process presses the said board | substrate support jig in the same direction as the pressing direction of the said board | substrate press means, and press-contacts the said board | substrate support jig to the main surface of the said table | surface. The manufacturing method of the wiring board with a pin of description.

Images