JP5323601B2 - Wafer processing tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer-processing tape capable of allowing an operator or an automatic label attaching machine to accurately and making it simply recognize the attaching position of an identifying label. <P>SOLUTION: The wafer processing tape 10 includes a long release film 11, an adhesive layer 12 and an adhesive film 13. The adhesive layer 12 is formed on the release film 11, and includes a circular section 12a, having a substantially circular shape corresponding to a semiconductor wafer shape and a shape with a size equal to or larger than that of the semiconductor wafer; and an indicator section 12b, having a substantially rectangular shape wherein the indicator section is an attaching position indicator provided at an attaching position of an identifying label (such as, a bar code label and a QR code label) placed outside the circular section 12a. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a wafer processing tape. In particular, the present invention relates to a wafer processing tape formed from an adhesive film and an adhesive layer provided on the adhesive film.

  In recent years, in order to fix a semiconductor wafer when the semiconductor wafer is cut and separated (diced) into individual chips, a wafer processing tape provided with an adhesive layer on a base film or a cut semiconductor chip as a lead frame is used. Wafer processing tape (dicing) having a structure in which an adhesive layer is further laminated on an adhesive layer in order to adhere to semiconductor packages and package substrates, etc. Die bonding film) has been developed.

  As such a wafer processing tape (dicing die bonding film), a tape that has been pre-cut processed in consideration of workability such as attachment to a semiconductor wafer and attachment to a ring frame during dicing. is there.

  An example of a pre-cut wafer processing tape (dicing die bonding film) is shown in FIG. FIG. 28A, FIG. 28B, and FIG. 28C are a perspective view, a plan view, and a cross-sectional view of the wafer processing tape 50, respectively. The wafer processing tape 50 includes a release film 51, an adhesive layer 52, and an adhesive film 53. The adhesive layer 52 is processed into a circular shape corresponding to the shape of the wafer or a substantially circular shape having a wedge-shaped outer peripheral portion (see Patent Document 1). The adhesive film 53 is obtained by removing the peripheral area of the circular portion corresponding to the shape of the ring frame for dicing. As shown in the drawing, the adhesive film 53 includes a circular label portion 53a and a peripheral portion 53b surrounding the outside. Have. The adhesive layer 52 and the circular label portion 53a of the pressure-sensitive adhesive film 53 are laminated with their centers aligned, and the circular label portion 53a of the pressure-sensitive adhesive film 53 covers the adhesive layer 52 and is released from the periphery thereof. It is in contact with the film 51.

  When dicing the semiconductor wafer, the release film 51 is peeled off from the laminated adhesive layer 52 and the adhesive film 53, and the back surface of the semiconductor wafer W is pasted on the adhesive layer 52 as shown in FIG. The dicing ring frame R is adhesively fixed to the outer peripheral portion of the circular label portion 53a of the adhesive film 53. In this state, the semiconductor wafer W is diced, and then the adhesive film 53 is subjected to a curing process such as ultraviolet irradiation to pick up a semiconductor chip. At this time, since the adhesive film 53 has a reduced adhesive force due to the curing process, the adhesive film 53 is easily peeled off from the adhesive layer 52, and the semiconductor chip is picked up with the adhesive layer 52 attached to the back surface. The adhesive layer 52 attached to the back surface of the semiconductor chip then functions as a die bonding film when the semiconductor chip is bonded to a lead frame, a package substrate, or another semiconductor chip.

  By the way, after the semiconductor wafer W and the dicing ring frame R are attached to the wafer processing tape 50, an identification label (for example, a bar code label) is placed on the wafer processing tape 50 in order to identify and manage them. Is pasted.

JP 2008-277778 A

  The above-described identification label affixing operation has been performed by an automatic affixing machine or manually by an operator. Further, since the reading of the identification label affixed on the wafer processing tape 50, which is performed in a later process, is performed by a reader, the identification label is accurately affixed to the affixing position on the wafer processing tape 50. There was a need to be.

  However, in the identification label affixing operation by the automatic affixing machine, the position of the identification label affixed on the wafer processing tape 50 is affixed out of the affixing position, and the operator reapplies the identification label. There were many cases that had to be done.

  When the identification label is reapplied by an operator caused by the above-described automatic sticking machine sticking error or when the identification label sticking work itself is performed manually, there is no label at the sticking position of the identification label on the wafer processing tape 50. There is a problem that it takes work time for the operator to accurately recognize the application position of the identification label on the wafer processing tape 50 and apply the identification label.

  Accordingly, the present invention has been made to solve the above-described problems, and allows a worker or an automatic sticking machine to easily and accurately recognize the sticking position of an identification label. The object is to provide a processing tape.

  As a result of earnestly examining the above problems, the present inventors provide a sticking position mark that serves as a mark at the sticking position of the identification label on the wafer processing tape in which the adhesive layer and the adhesive film are laminated, Alternatively, the position of the identification label on the wafer processing tape can be indicated to the identification label application operator or the automatic application machine by providing an application position indicator of the identification label application position on the outer periphery of the adhesive layer. It has been found that recognition can be performed accurately and easily, and as a result, the operation time for attaching the identification label can be shortened. Furthermore, the present invention was completed by finding that the sticking position marker is formed of the same material as that of the adhesive layer to prevent deterioration of quality such as mixing of foreign substances.

  That is, the tape for wafer processing according to the first aspect of the present invention includes a long release film, one or more adhesive layers having a predetermined planar shape provided on the release film, An adhesive film that covers each of the adhesive layers and has one or more circular label portions provided so as to be in contact with the release film around the adhesive layer. The adhesive layer is provided with an identification position label on the periphery of the adhesive layer, and the label is formed by deformation of the adhesive layer. Here, the shape deformation includes not only the deformation of the shape and size but also the case of deformation by stamping or the like.

  A wafer processing tape according to a second aspect of the present invention is characterized in that in the wafer processing tape according to the first aspect of the present invention, the sticking position mark is formed in a planar shape.

  The wafer processing tape according to a third aspect of the present invention is the wafer processing tape according to the first or second aspect of the present invention, wherein the sticking position indicator is a straight line portion indicating a sticking reference position of the identification label. And a part or all of the identification label is a label to be bonded onto the adhesive layer. Here, the sticking reference position is a portion (straight line, point, etc.) that is used as a mark when an operator or an automatic sticking machine attaches an identification label to a wafer processing tape.

  A wafer processing tape according to a fourth aspect of the present invention is the wafer processing tape according to the third aspect of the present invention, wherein the sticking position indicator is used in a wafer dicing apparatus. It is located inside the ring frame for use.

  The wafer processing tape according to a fifth aspect of the present invention is the wafer processing tape according to the third or fourth aspect of the present invention, wherein the adhesive layer has a substantially circular shape, and the sticking position indicator Is formed by a convex portion protruding outward from the circumference of the substantially circular adhesive layer.

  The wafer processing tape according to a sixth aspect of the present invention is the wafer processing tape according to the third or fourth aspect of the present invention, wherein the adhesive layer has a substantially circular shape, and the sticking position indicator Is formed by a concave portion recessed inward from the circumference of the substantially circular adhesive layer.

  The wafer processing tape according to a seventh aspect of the present invention is the wafer processing tape according to the fifth or sixth aspect of the present invention, wherein the adhesive layer has a substantially circular shape, and the convex portion or A symmetrical convex portion or a symmetrical concave portion having the same shape as the convex portion or the concave portion constituting the identification label portion is provided at a position substantially symmetrical with respect to the concave portion with respect to the concave portion. To do.

  The wafer processing tape according to an eighth aspect of the present invention is the wafer processing tape according to the third or fourth aspect of the present invention, wherein the adhesive layer has a circular portion having a substantially circular shape and an outer edge of the portion. And a sign portion that forms the sticking position sign at a position away from the mark.

  A wafer processing tape according to a ninth aspect of the present invention is the wafer processing tape according to the eighth aspect of the present invention, wherein the marker is positioned substantially symmetrical with respect to the circular mark portion with respect to the marker portion. The second marker part having the same shape as the part is provided.

  The wafer processing tape according to a tenth aspect of the present invention is the wafer processing tape according to any one of the fifth to ninth aspects of the present invention, wherein the convex portion, the concave portion, or the marker portion is: It is substantially rectangular.

  The wafer processing tape according to an eleventh aspect of the present invention is the wafer processing tape according to the third or fourth aspect of the present invention, wherein the adhesive layer has a substantially circular shape, and the sticking position indicator Is formed on the substantially circular adhesive by a marking process having a shape with the straight portion.

  A wafer processing tape according to a twelfth aspect of the present invention is the wafer processing tape according to any one of the fifth to eleventh aspects of the present invention, wherein the length of the straight portion is the length of the identification label. It is characterized by having approximately the same length.

  A wafer processing tape according to a thirteenth aspect of the present invention is the wafer processing tape according to any one of the fifth to tenth aspects of the present invention, wherein the convex portion, the concave portion, or the marker portion is the tape. The linear portion is provided with a notch portion for positioning in the linear direction.

  Affixing an identification position on the identification label on the wafer processing tape on which the adhesive layer and the adhesive film are laminated, or providing an identification position label on the outer periphery of the adhesive layer By using the wafer processing tape of the present invention, which is provided in the section, the identification label application operator or the automatic application machine can easily recognize the identification label application position on the wafer processing tape. , Can be attached with high accuracy. Thereby, the work time of the sticking work of an identification label can be shortened. Furthermore, by forming the sticking position mark with the same material as the adhesive layer, it is possible to prevent quality deterioration such as contamination with foreign matter. Further, it is possible to prevent the productivity of the wafer processing tape from being lowered due to the addition of the operation for forming the sticking position mark.

(A) is a perspective view of the tape for wafer processing which concerns on the 1st Embodiment of this invention, (b) is the top view, (c) is the cross-sectional view. It is sectional drawing which shows the state by which the semiconductor wafer, the ring frame for dicing, and the identification label were affixed on the tape for wafer processing. It is a figure for demonstrating the sticking position of an identification label. (A) And (b) is a figure for demonstrating the shape of a label | marker part. It is a figure for demonstrating the shape of a label | marker part. (A) And (b) is a figure for demonstrating the notch part provided in the label | marker part. It is a top view of the tape for wafer processing 10a of the modification of the tape for wafer processing 10 which concerns on the 1st Embodiment of this invention. (A) is a top view of the tape 20 for wafer processing which concerns on the 2nd Embodiment of this invention, (b) is the same sectional drawing. It is sectional drawing which shows the state by which the semiconductor wafer, the ring frame for dicing, and the identification label were affixed on the tape for wafer processing. It is a figure for demonstrating the sticking position of an identification label. (A) And (b) is a figure for demonstrating the shape of a convex part. It is a figure for demonstrating the shape of a convex part. (A) And (b) is a figure for demonstrating the notch provided in the convex part. It is a top view of the tape 20a for wafer processing of the modification of the tape 20 for wafer processing which concerns on the 2nd Embodiment of this invention. (A) is a top view of the tape 30 for wafer processing which concerns on the 3rd Embodiment of this invention, (b) is the same sectional drawing. It is sectional drawing which shows the state by which the semiconductor wafer, the ring frame for dicing, and the identification label were affixed on the tape for wafer processing. It is a figure for demonstrating the sticking position of an identification label. It is a figure for demonstrating the shape of a recessed part. It is a figure for demonstrating the shape of a recessed part. (A) And (b) is a figure for demonstrating the notch provided in the recessed part. (A) is a top view of the wafer processing tape 30a of the modification of the wafer processing tape 30 which concerns on the 3rd Embodiment of this invention, (b) and (c) are the affixing states of an identification label It is the figure which showed an example. (A) is a top view of the wafer processing tape 30b of the modification of the wafer processing tape 30 which concerns on the 3rd Embodiment of this invention, (b) shows an example of the affixing state of an identification label. It is a figure It is a top view of the tape 30b for wafer processing of the modification of the tape 30 for wafer processing which concerns on the 3rd Embodiment of this invention. (A) is a top view of the tape 40 for wafer processing which concerns on the 4th Embodiment of this invention, (b) is the same sectional drawing. It is sectional drawing which shows the state by which the semiconductor wafer, the ring frame for dicing, and the identification label were affixed on the tape for wafer processing. It is a figure for demonstrating the sticking position of an identification label. It is a figure for demonstrating the adhesive bond layer in which two stamping processes were given. (A) is a perspective view of a conventional wafer processing tape, (b) is a plan view thereof, and (c) is a sectional view thereof. It is sectional drawing which shows the state by which the semiconductor wafer and the dicing ring frame were affixed on the conventional tape for wafer processing.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1A is a perspective view of a wafer processing tape according to a first embodiment of the present invention, FIG. 1B is a plan view thereof, and FIG. 1C is a cross-sectional view thereof. FIG. 2 is a cross-sectional view showing a state in which a semiconductor wafer, a dicing ring frame, and an identification label are attached to a wafer processing tape.

  As shown in FIGS. 1A, 1 </ b> B, and 1 </ b> C, the wafer processing tape 10 includes a long release film 11, an adhesive layer 12, and an adhesive film 13. The adhesive layer 12 is provided on the release film 11, and has a circular portion 12a having a substantially circular shape corresponding to the shape of the semiconductor wafer and a size larger than the size of the semiconductor wafer, and a circular portion. A label portion 12b having a substantially rectangular shape and a size equal to or larger than the size of the identification label provided at a position where an identification label (for example, a bar code label, a QR code label, etc.) outside 12a is attached. Yes. In the present invention, the shape includes both concepts of shape and size (size).

  The labeling part 12b is provided at a sticking position of an identification label (for example, a bar code label, a QR code label, etc.) outside the circular part 12a on the release film 11. The shape of the marking part 12b is substantially rectangular. Further, as shown in FIG. 2, when the semiconductor wafer W and the dicing ring frame R are attached to the wafer processing tape 10, the material of the adhesive layer 12 adheres to the dicing ring frame R. In order to prevent the occurrence of the above, the area inside the area where the dicing ring frame R is affixed, that is, the area where the circular part 12a and the dicing ring frame R are affixed, so that the marker 12b and the dicing ring frame R do not overlap The indicator portion 12b is provided so as to be in the region A on the circular label portion 13a between the two.

  The adhesive film 13 includes a circular label portion 13a that covers the circular portion 12a and the label portion 12b and is provided so as to contact the release film 11 around the circular portion 12a and the label portion 12b. In this example, the example which has the peripheral part 13b which further surrounds the outer side of this circular label part 13a was shown. The peripheral portion 13b includes a form that completely surrounds the outer side of the circular label portion 13a and a form that is not completely surrounded as illustrated. The circular label portion 13a has a substantially circular shape corresponding to the dicing ring frame.

  In addition, as shown in FIG. 2, the labeling portion 12b is configured so that the dicing ring frame R does not overlap the dicing ring frame R when the semiconductor wafer W and the dicing ring frame R are attached to the wafer processing tape 10. It is provided so as to be in a region on the inner side of the attachment region of the frame R, that is, in the region A on the circular label portion 13a between the circular portion 12a and the attachment region of the ring frame R for dicing. In addition, the identification label L is affixed on the label | marker part 12b.

Hereafter, each component of the tape 10 for wafer processing of this embodiment is demonstrated in detail.
(Release film)
As the release film 11 used for the wafer processing tape 10 of the present invention, a polyethylene terephthalate (PET) series, a polyethylene series, or other known films such as a release-processed film can be used.

  The thickness of the release film is not particularly limited and may be appropriately set, but is preferably 25 to 50 μm.

(Adhesive layer)
As described above, the adhesive layer 12 used in the wafer processing tape 10 of the present invention is formed on the release film 11 and has a substantially circular shape corresponding to the shape of the semiconductor wafer and is larger than the size of the semiconductor wafer. A pasting position indicator provided at a pasting position of a circular portion 12a having a size shape and an identification label (for example, a bar code label, a QR code label, etc.) outside the circular portion 12a. And a label portion 12b having a size larger than the size of the identification label.

  The labeling part 12b is provided at the sticking position of the identification label outside the circular part 12a on the release film 11. The shape is substantially rectangular and larger than the size of the identification label. Further, as shown in FIG. 2, the marking portion 12b is used for dicing so as not to overlap the dicing ring frame R when the semiconductor wafer W and the dicing ring frame R are attached to the wafer processing tape 10. It is provided so as to be in a region inside the region where the ring frame R is pasted, that is, in the region A on the circular label portion 13a between the circular portion 12a and the region where the dicing ring frame R is pasted. This is for preventing the occurrence of problems such as adhesion of the material of the adhesive layer 12 to the dicing ring frame R.

  As shown in FIG. 3, the operator only needs to affix the identification label L to the labeling part 12b so that the side Lt of the identification label L is along the side 15 (straight line part) of the labeling part 12b indicating the reference reference position. Can easily perform the pasting operation with high accuracy. Thereby, the work time of the sticking work of an identification label can be shortened. Here, the sticking reference position refers to a portion (straight line, point, etc.) that is used as a marker when the worker or the automatic sticking machine sticks the identification label L.

  As described above, by providing the label portion 12b, when a human (operator) performs the operation of applying the identification label, the operator can easily recognize the application position of the identification label on the wafer processing tape 10. At the same time, the pasting operation can be executed with high accuracy.

  In the wafer processing tape 10 shown in FIGS. 1A, 1B, and 1C, the marker portion 12b has a substantially rectangular shape, but a linear portion (for example, FIG. 3 as long as it has at least one straight line portion corresponding to the side 15 for extending the side Lt of the identification label L. For example, a substantially trapezoidal shape as shown in FIG. It may be. Further, in the wafer processing tape 10 shown in FIGS. 1A, 1B, and 1C, the label portion 12b is larger than the size of the identification seal L, but the size of the identification seal L is large. The size may be smaller than that, and as shown in FIG. 4B, the identification seal L may stick out of the marker 12b.

  Further, as shown in FIG. 5, it is preferable that the length of the side 15 (straight line portion) of the label portion 12 b is the same as the length (width) of the side Lt of the identification label L. Thereby, the identification label L can be affixed with high precision to the affixing position of the identification label L in the width direction.

  Further, as shown in FIGS. 6A and 6B, it is preferable to provide a notch portion 16 for designating the reference position in the width direction of the identification label L on the side 15 (straight line portion) of the marker portion 12b. . The sticking reference position in the width direction of the identification label L may be the center position of the side Lt or the end portion. 6A shows a case where the pasting position in the width direction of the identification label L is the center position of the side Lt. FIG. 6B shows the pasting position in the width direction of the identification label L at the end of the side Lt. This is the case of the department. Thereby, the identification label L can be affixed with high precision to the reference position in the width direction of the identification label L.

  In addition, even when the identification label is affixed by an automatic affixing machine, the affixing operation can be easily and accurately performed simply by causing the automatic affixing machine to recognize the arrangement position of the label portion 12b. Thereby, the work time of the sticking work of an identification label can be shortened.

  Further, by forming the marking portion 12b and the circular portion 12a with the same material, for example, the wafer processing tape 10 due to the mixing of foreign matter such as ink as compared with the method of printing the identification label applying position by ink or the like. Can prevent quality deterioration. Further, in the pre-cut processing operation of the adhesive layer 12, the circular adhesive layer 12 and the rectangular marker portion 12b are punched together, so that it is not necessary to add a step of forming the marker portion 12b. That is, it is possible to prevent the productivity of the wafer processing tape 10 from being lowered due to the addition of the step of forming the marking portion 12b.

  The adhesive layer 12 is attached to the back surface of the semiconductor chip when the semiconductor chip is picked up after the semiconductor wafer is bonded and diced, and serves as an adhesive for fixing the semiconductor chip to the substrate or the lead frame. It is what is used. As the adhesive layer 12, an adhesive containing at least one selected from an epoxy resin, an acrylic resin, and a phenol resin can be preferably used. In addition, a polyimide resin or a silicone resin can also be used. The thickness may be appropriately set, but is preferably about 5 to 100 μm.

(Adhesive film)
As described above, the pressure-sensitive adhesive film 13 of the present invention has a circular label portion 13a corresponding to the shape of the dicing ring frame and a peripheral portion 13b surrounding the outside thereof. Such an adhesive film 13 can be formed by removing a region between the circular label portion 13a and the peripheral portion 13b from the film-like adhesive by pre-cut processing.

  The adhesive film 13 is not particularly limited, and has a sufficient adhesive force so that the semiconductor wafer does not peel when dicing the semiconductor wafer. The adhesive layer 12 can be easily picked up when the semiconductor chip is picked up after dicing. Any material may be used as long as it exhibits low adhesive strength so that it can be peeled off. For example, a laminate formed from a base film and a pressure-sensitive adhesive layer provided on the base film can be suitably used.

  The base film of the adhesive film 13 can be used without particular limitation as long as it is a conventionally known base film. However, when a radiation curable material is used as the adhesive layer described later, the radiation transparency is used. It is preferable to use one having

  For example, as the material, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic Α-olefin homopolymer or copolymer such as acid methyl copolymer, ethylene-acrylic acid copolymer, ionomer or a mixture thereof, polyurethane, styrene-ethylene-butene or pentene copolymer, polyamide-polyol Listed are thermoplastic elastomers such as copolymers, and mixtures thereof. Further, the base film may be a mixture of two or more materials selected from these groups, or may be a single layer or a multilayer.

  The thickness of the base film is not particularly limited and may be set as appropriate, but is preferably 50 to 200 μm.

  The resin used for the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film 13 is not particularly limited, and a known chlorinated polypropylene resin, acrylic resin, polyester resin, polyurethane resin, epoxy resin, or the like used for the pressure-sensitive adhesive is used. can do.

  It is preferable to prepare a pressure-sensitive adhesive by appropriately mixing an acrylic pressure-sensitive adhesive, a radiation polymerizable compound, a photopolymerization initiator, a curing agent and the like with the resin of the pressure-sensitive adhesive layer. The thickness of the pressure-sensitive adhesive layer is not particularly limited and may be appropriately set, but is preferably 5 to 30 μm.

  It can be made easy to peel from the adhesive layer 12 by blending the radiation-polymerizable compound into the pressure-sensitive adhesive layer and curing the radiation. As the radiation polymerizable compound, for example, a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in a molecule that can be three-dimensionally reticulated by light irradiation is used.

  Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6 hexanediol diacrylate Acrylate, polyethylene glycol diacrylate, oligoester acrylate, and the like are applicable.

  In addition to the above acrylate compounds, urethane acrylate oligomers can also be used. The urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type, and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diene). A terminal isocyanate urethane prepolymer obtained by reacting isocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.) with an acrylate or methacrylate having a hydroxyl group (for example, 2-hydroxyethyl) Acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc.) Obtained by the reaction.

  The pressure-sensitive adhesive layer may be a mixture of two or more selected from the above resins.

  When using a photopolymerization initiator, for example, isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, benzyldimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenyl Propane or the like can be used. The blending amount of these photopolymerization initiators is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the acrylic copolymer.

  Next, a modification of the wafer processing tape 10 according to the first embodiment of the present invention shown in FIGS. 1A, 1B, and 1C will be described with reference to FIG.

  FIG. 7 is a modified example of the wafer processing tape 10 according to the first embodiment of the present invention shown in FIGS. 1A, 1B, and 1C, and a marker portion is provided on the release film. It is a top view of two tapes 10a for wafer processing provided. Here, only differences from the wafer processing tape 10 according to the first embodiment of the present invention shown in FIGS. 1 (a), (b) and (c) will be described, and FIGS. The same components as in b) and (c) are assigned the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 7, the difference between the wafer processing tape 10a and the wafer processing tape 10 shown in FIGS. 1 (a), (b) and (c) is that the adhesive layer 12 is different from the circular portion 12a. It has two label | marker parts 12b and 12b '.

  As shown in FIG. 7, the two marker portions 12b and 12b ′ have the same shape as each other, and are provided at substantially point-symmetrical positions with respect to the center O of the circular portion 12a having a substantially circular shape. By providing the above-described two marker portions 12b and 12b ', it is possible to wind up with good balance when winding in a roll shape. Further, by providing the two marking portions 12b and 12b ′ so that the position in the short direction of the wafer processing tape 10a is the same, the wafer processing tape 10a can be moved up and down in the short direction in the subsequent work process. Can work without consideration.

  Further, as shown in FIG. 7, in the wafer processing tape 10a, the adhesive layer 12 includes a circular portion 12a and two marking portions 12b and 12b ', but the circular portion 12a and three or more marking portions are provided. You may prepare.

  Next, a wafer processing tape according to a second embodiment of the present invention will be described with reference to FIGS.

  FIG. 8A is a plan view of a wafer processing tape 20 according to the second embodiment of the present invention, and FIG. 8B is a cross-sectional view thereof. FIG. 9 is a cross-sectional view showing a state in which a semiconductor wafer, a dicing ring frame, and an identification label are attached to the wafer processing tape 20. Here, only differences from the wafer processing tape 10 according to the first embodiment of the present invention shown in FIGS. 1 (a), (b) and (c) will be described, and FIGS. The same components as in b) and (c) are assigned the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 8 (a) and 8 (b), the difference between the wafer processing tape 20 and the wafer processing tape 10 shown in FIGS. 1 (a), 1 (b) and 1 (c) is different from FIG. Instead of the adhesive layer 12 having the marking portion 12b and the circular portion 12a in the wafer processing tape 10 shown in (a), (b) and (c), the wafer processing tape 20 has a substantially circular shape. The adhesive layer 22 includes a circular portion 22a and a substantially rectangular convex portion 22b which is a sticking position mark provided on the outer peripheral portion of the circular portion 22a.

  That is, the wafer processing tape 20 includes a long release film 11, an adhesive layer 22, and an adhesive film 13. In addition, the adhesive layer 22 includes a substantially circular circular portion 22a and a convex portion 22b that is a substantially rectangular shape protruding outward on an outer peripheral portion that serves as an attachment position of an identification label of the circular portion 22a. Yes.

  Further, as shown in FIG. 9, the adhesive layer 22 is made of the material of the adhesive layer 12 on the dicing ring frame R when the semiconductor wafer W and the dicing ring frame R are attached to the wafer processing tape 20. In order to prevent the occurrence of problems such as adhesion, the protrusion 22b and the dicing ring frame R are provided in a region inside the attaching region of the dicing ring frame R so as not to overlap. The identification label L is attached so that a part or the whole of the identification label L covers the convex portion 22 b on the adhesive layer 22.

  As shown in FIG. 10, simply attaching the identification label L to the adhesive layer 22 so that the side Lt of the identification label L is along the side 25 (straight line portion) of the convex portion 22 b indicating the application reference position. The person can easily perform the pasting work with high accuracy. Thereby, the work time of the sticking work of an identification label can be shortened.

  As described above, by providing the adhesive layer 22 provided with the convex portions 22b, when a human (operator) performs an identification label application operation, the identification label application position on the wafer processing tape 20 is determined. In addition to making the operator easily recognize, the pasting operation can be executed with high accuracy.

  In the wafer processing tape 20 shown in FIGS. 8 (a) and 8 (b), the convex portion 22b has a substantially rectangular shape, but a straight line portion indicating the reference reference position (for example, as shown in FIG. 8). Any shape having at least one straight line portion corresponding to the side 25 for extending the side Lt of the identification label L may be used. For example, a substantially trapezoidal shape as shown in FIG. . Further, in the wafer processing tape 20 shown in FIGS. 8A and 8B, the convex portion 22b has such a size that the entire surface of the identification seal L is pasted, but as shown in FIG. 11B. In addition, it is sufficient that a part of the identification seal L is pasted, and a part of the identification seal L may stick out of the convex portion 22b.

  Further, as shown in FIG. 12, it is preferable that the length of the side 25 (straight line portion) of the convex portion 22b is the same as the length (width) of the side Lt of the identification label L. Thereby, the identification label L can be affixed with high precision to the affixing position of the identification label L in the width direction.

  Further, as shown in FIGS. 13A and 13B, it is preferable to provide a cutout portion 26 that specifies the reference position in the width direction of the identification label L on the side 25 (straight line portion) of the convex portion 22 b. . The sticking reference position in the width direction of the identification label L may be the center position of the side Lt or the end portion. FIG. 13A shows the case where the pasting position in the width direction of the identification label L is the center position of the side Lt, and FIG. 13B shows the pasting position in the width direction of the identification label L at the end of the side Lt. This is the case of the department. Thereby, the identification label L can be affixed with high precision to the reference position in the width direction of the identification label L.

  Further, even when the identification label sticking operation is performed by an automatic pasting machine, the pasting operation can be easily and accurately performed only by causing the automatic pasting machine to recognize the arrangement position of the convex portion 22b. Thereby, the work time of the sticking work of an identification label can be shortened.

  Next, a modified example of the wafer processing tape 20 according to the second embodiment of the present invention shown in FIGS. 8A and 8B will be described with reference to FIG.

  FIG. 14 shows a modification of the wafer processing tape 20 according to the second embodiment of the present invention shown in FIGS. 8A, 8B, and 8C, and includes a circular portion 22a and two convex portions. It is a top view of the tape 20a for wafer processing provided with the adhesive bond layer 22 which has 24a, 24b. Here, only differences from the wafer processing tape 20 according to the second embodiment of the present invention shown in FIGS. 8A and 8B will be described, and the same as FIGS. 8A and 8B. Constituent elements are given the same reference numerals and description thereof is omitted.

  As shown in FIG. 14, the difference between the wafer processing tape 20a and the wafer processing tape 20 shown in FIGS. 8A and 8B is that the circular portion 22a and the circular portion 22a have a substantially circular shape. In other words, the adhesive layer 22 includes two convex portions 24 a and 24 b provided on the outer peripheral portion.

  As shown in FIG. 14, the two convex portions 24a and 24b have the same shape as each other, and are provided at positions substantially symmetrical with respect to the center O of the circular portion 22a. By providing the above-described two convex portions 24a and 24b, it is possible to wind up with good balance when winding up into a roll shape. Further, by providing the two convex portions 24a and 24b so that the position of the wafer processing tape 20a in the short direction is the same, the up and down of the wafer processing tape 20a in the short direction is taken into consideration in the subsequent work process. Can work without.

  Further, as shown in FIG. 14, the adhesive layer 22 of the wafer processing tape 20a includes two convex portions 24a and 24b, but may include three or more convex portions.

  Next, a wafer processing tape according to a third embodiment of the present invention will be described with reference to FIGS.

  FIG. 15A is a plan view of a wafer processing tape 30 according to the third embodiment of the present invention, and FIG. 15B is a cross-sectional view thereof. FIG. 16 is a cross-sectional view showing a state in which a semiconductor wafer, a dicing ring frame, and an identification label are attached to the wafer processing tape 30. Here, only differences from the wafer processing tape 30 according to the first embodiment of the present invention shown in FIGS. 1 (a), (b) and (c) will be described, and FIGS. The same components as in b) and (c) are assigned the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 15 (a) and 15 (b), the difference between the wafer processing tape 30 and the wafer processing tape 10 shown in FIGS. 1 (a), 1 (b) and 1 (c) is different from FIG. Instead of the adhesive layer 12 having the marking portion 12b and the circular portion 12a in the wafer processing tape 10 shown in (a), (b) and (c), the wafer processing tape 30 has a substantially circular outer periphery. It is that the adhesive layer 32 provided with the substantially rectangular recessed part 32a which is a sticking position label | marker in the part is provided.

  That is, the wafer processing tape 30 includes a long release film 11, an adhesive layer 32, and an adhesive film 13. The adhesive layer 32 includes a substantially rectangular recess 32a that is recessed inwardly at a substantially circular outer periphery.

  Further, as shown in FIG. 16, the concave portion 32a of the adhesive layer 32 is formed so that the semiconductor wafer W and the semiconductor wafer W do not overlap when the semiconductor wafer W and the dicing ring frame R are attached to the wafer processing tape 30. It is provided in a region outside the pasting region of the semiconductor wafer W.

  As shown in FIG. 17, the operator can easily perform accuracy by simply attaching the identification label L so that the side Lt of the identification label L is along the side 35 a (straight line portion) of the recess 32 a indicating the attachment reference position. The pasting work can be performed well. Thereby, the work time of the sticking work of an identification label can be shortened. Note that the identification label L may stick out of the recess 32a.

  As described above, by providing the adhesive layer 32 having the recesses 32a, when the identification label is applied by a human (operator), the identification label application position on the wafer processing tape 30 is changed to This makes it possible for the user to easily recognize and perform the pasting operation with high accuracy.

  In the wafer processing tape 30 shown in FIGS. 15 (a) and 15 (b), the recess 32a has a substantially rectangular shape, but a straight line portion (for example, as shown in FIG. As long as it has a shape having at least one straight line portion corresponding to the side 35a for extending the side Lt of the identification label L, for example, a substantially trapezoidal shape as shown in FIG.

  Further, as shown in FIG. 19, it is preferable that the length of the side 35a (straight line portion) of the recess 32a is the same as the length (width) of the side Lt of the identification label L. Thereby, the identification label L can be affixed with high precision to the affixing position of the identification label L in the width direction.

  Further, as shown in FIGS. 20A and 20B, it is preferable to provide a notch 36 for designating the reference position in the width direction of the identification label L on the side 35a ((straight line)) of the recess 32a. The pasting reference position in the width direction of the identification label L may be the center position or the end of the side Lt. Fig. 20 (a) shows that the pasting position in the width direction of the identification label L is the side. 20 (b) shows the case where the labeling position in the width direction of the identification label L is the end of the side Lt, whereby the reference position in the width direction of the identification label L is obtained. The identification label L can be affixed with high accuracy.

  Even when the identification label is applied by an automatic application machine, the application operation can be easily and accurately performed only by causing the automatic application machine to recognize the position of the recess 32a. Thereby, the work time of the sticking work of an identification label can be shortened.

  Next, a modified example of the wafer processing tape 30 according to the third embodiment of the present invention shown in FIGS. 15A and 15B will be described with reference to FIGS. Here, only differences from the wafer processing tape 30 according to the third embodiment of the present invention shown in FIGS. 15A and 15B will be described, and the same as FIGS. 15A and 15B. Constituent elements are given the same reference numerals and description thereof is omitted.

  FIG. 21A is a plan view of a wafer processing tape 30a which is a modification of the wafer processing tape 30 according to the third embodiment of the present invention shown in FIGS. 15A, 15B and 15C. FIGS. 21B and 21C are diagrams showing an example of the identification label attached state.

  As shown in FIG. 21A, the difference between the wafer processing tape 30a and the wafer processing tape 30 shown in FIGS. 15A and 15B is that the recess direction of the substantially rectangular recess 32a ′ is different. It is a different point. The recess direction of the recess 32a of the wafer processing tape 30 is the direction of the center O of the adhesive layer 32, whereas the recess direction of the recess 32a ′ of the wafer processing tape 30a is the center O of the adhesive layer 32. Is a direction substantially parallel to the straight line S passing through the wafer, that is, a direction substantially parallel to the longitudinal direction of the wafer processing tape 30a.

  Further, as shown in FIGS. 21B and 21C, the side Lt of the identification label L is set along the side 35b ′ (straight line portion) of the recess 32a ′ indicating the sticking reference position, or the side 35c ′. The operator can easily perform the pasting work with high accuracy simply by sticking the identification label L to the adhesive layer 32 along the (straight line portion).

  FIG. 22A is a plan view of a wafer processing tape 30b that is a modification of the wafer processing tape 30 according to the third embodiment of the present invention shown in FIGS. 15A, 15B, and 15C. FIG. 22B is a diagram showing an example of a state where the identification label is affixed.

  As shown in FIG. 22A, the difference between the wafer processing tape 30b and the wafer processing tape 30 shown in FIGS. 15A and 15B is that the recess direction of the substantially rectangular recess 32a ′ is different. It is different and is further provided with two concave portions 32a ′ and 32b ′. The two concave portions 32a ′ and 32b ′ are in a direction substantially parallel to the straight line S passing through the center O of the adhesive layer 32, and with respect to the straight line S ′ passing through the center O and perpendicular to the straight line S. Are provided at positions that are substantially line symmetrical with each other. Further, the interval P between the bottom sides of the two recesses 32a ′ and 32b ′ is preferably the same as the length (width) of the side Lt of the identification label L. As shown in FIG. By pasting the identification label L between the bottoms of the recesses 32a ′ and 32b ′, the pasting operation of the identification label L can be easily performed with high accuracy.

  FIG. 23 is a plan view of a wafer processing tape 30c which is a modification of the wafer processing tape 30 according to the third embodiment of the present invention shown in FIGS. 15 (a), 15 (b) and 15 (c).

  As shown in FIG. 23, the difference between the wafer processing tape 30c and the wafer processing tape 30 shown in FIGS. 15 (a) and 15 (b) is that there are two substantially rectangular recesses on the outer periphery of the substantially circular shape. The adhesive layer 32 provided with 32a and 32b is provided. As shown in FIG. 23, the two concave portions 32 a and 32 b have the same shape as each other, and are provided at positions substantially symmetrical with respect to the center O of the adhesive layer 32. Thus, by providing the two recessed parts 32a and 32b, when winding up in roll shape, it can wind up with sufficient balance. Further, by providing the two recesses 32a and 32b so that the position of the wafer processing tape 30a in the short direction is the same, the up and down of the wafer processing tape 30a in the short direction can be taken into consideration in the subsequent work process. Can work without.

  Further, as shown in FIG. 23, the adhesive layer 32 of the wafer processing tape 30a includes two recesses 32a and 32b, but may include three or more recesses.

  FIG. 24A is a plan view of a wafer processing tape 40 according to the fourth embodiment of the present invention, and FIG. 24B is a cross-sectional view thereof. FIG. 25 is a cross-sectional view showing a state in which a semiconductor wafer, a dicing ring frame, and an identification label are attached to the wafer processing tape 40. Here, only differences from the wafer processing tape 40 according to the first embodiment of the present invention shown in FIGS. 1 (a), (b) and (c) will be described, and FIGS. The same components as in b) and (c) are assigned the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 24A and 24B, the difference between the wafer processing tape 40 and the wafer processing tape 10 shown in FIGS. 1A, 1B, and 1C is as shown in FIG. Instead of the adhesive layer 12 having the marking portion 12b and the circular portion 12a in the wafer processing tape 10 shown in (a), (b) and (c), the wafer processing tape 40 is a sticking position mark. In other words, the adhesive layer 42 having a substantially circular shape having a substantially rectangular mark 42a on the surface thereof is provided.

  That is, the wafer processing tape 40 includes the long release film 11, the adhesive layer 42, and the adhesive film 13, and the adhesive layer 42 has a substantially circular shape with a substantially rectangular marking 42 a on the surface. Shape. Further, the marking 42a on the adhesive layer 42 indicates that the identification label and the semiconductor wafer W adhered in the vicinity of the marking 42a when the semiconductor wafer W and the dicing ring frame R are adhered to the wafer processing tape 30 are used. It is applied to the surface of the region outside the pasting region of the semiconductor wafer W so as not to overlap.

  As shown in FIG. 26, the operator can simply attach the identification label L to the adhesive layer 42 so that the side Lt of the identification label L is along the side (straight line portion) 45 of the marking 42a indicating the reference position of attachment. Can easily perform the pasting operation with high accuracy. Thereby, the work time of the sticking work of an identification label can be shortened.

  As described above, by providing the adhesive layer 42 with the marking 42a on the surface, when the identification label is applied by a human (operator), the identification label is applied on the wafer processing tape 40. Can be easily recognized by the operator and the pasting operation can be executed with high accuracy. Although the marking 42a has a substantially rectangular shape, a straight line portion indicating the sticking reference position (for example, a straight line portion corresponding to the side 45 for the side Lt of the identification label L as shown in FIG. 15). It is sufficient that the marking has at least one.

  Further, it is preferable that the length of the side 45 (straight line portion) of the marking 42a is the same as the length (width) of the side Lt of the identification label L. Thereby, the identification label L can be affixed with high precision to the affixing position of the identification label L in the width direction.

  Further, as shown in FIG. 27, on the adhesive layer 42, the two markings 42 a and 42 b may be provided at positions that are substantially point-symmetric with respect to the center O of the adhesive layer 42.

  In addition, when the identification label is affixed by an automatic affixing machine, the affixing operation can be easily and accurately performed only by causing the automatic affixing machine to recognize the position of the marking 42a. Thereby, the work time of the sticking work of an identification label can be shortened.

1: Semiconductor wafer 2: Semiconductor chips 10, 10a, 20, 20a, 30, 30a, 30b, 30c, 40: Wafer processing tape 11: Release films 12, 22, 32, 42: Adhesive layers 12a, 22a: Circular part 12b, 12b ': Marking part 13: Adhesive film 13a: Circular label part 13b: Peripheral part 15, 25, 35a, 35b', 35c ': Side (straight line part)
16, 26: Notched portions 22b, 24a, 24b: convex portions 32a, 32b, 32a ', 32b': concave portions 42a, 42b: stamps

Claims (13)

A long release film,
One or more adhesive layers having a predetermined planar shape provided on the release film;
A pressure-sensitive adhesive film that includes one or more circular label portions each covering the adhesive layer and provided to contact the release film around the adhesive layer;
A wafer processing tape comprising:
A tape for wafer processing, wherein the adhesive layer is provided with an identification label sticking position mark in the vicinity of the outer edge thereof, and the sticking position mark is formed by deformation of the adhesive layer.   2. The wafer processing tape according to claim 1, wherein the sticking position mark is formed in a planar shape.   The sticking position mark has a straight line portion indicating a sticking reference position of the identification label, and a part or all of the identification label is a mark to be stuck on the adhesive layer. The wafer processing tape according to claim 1 or 2.   4. The wafer processing tape according to claim 3, wherein the sticking position indicator is located inside a ring frame for holding and fixing the circular label portion used in a wafer dicing apparatus.   The adhesive layer has a substantially circular shape, and the sticking position mark is formed by a convex portion protruding outward from the circumference of the substantially circular adhesive layer. Or the tape for wafer processing of 4.   The adhesive layer has a substantially circular shape, and the sticking position mark is formed by a concave portion recessed inward from the circumference of the substantially circular adhesive layer. 4. The wafer processing tape according to 4.   The adhesive layer has a substantially circular shape, and is substantially the same as the convex portion or the concave portion constituting the identification label portion at a substantially circular symmetrical position with respect to the convex portion or the concave portion. The wafer processing tape according to claim 5, wherein a symmetrical convex portion or a symmetrical concave portion is provided.   The said adhesive layer has a circular part which has a substantially circular shape, and a mark part which forms the said sticking position mark in the vicinity position away from the outer edge of the part. Wafer processing tape described in 1.   9. The wafer according to claim 8, wherein the second marker part having a shape similar to that of the marker part is provided at a position substantially symmetrical to the center of the circular part with respect to the marker part. Tape for processing.   The tape for wafer processing according to any one of claims 5 to 9, wherein the convex portion, the concave portion, or the marker portion is substantially rectangular.   The adhesive layer has a substantially circular shape, and the sticking position mark is formed on the substantially circular adhesive by a marking process having a shape with the straight line portion. Item 5. A wafer processing tape according to Item 3 or 4.   12. The wafer processing tape according to claim 5, wherein a length of the linear portion is substantially the same as a length of the identification label.   11. The cutout portion for positioning in the linear direction is provided in the straight portion of the convex portion, the concave portion, or the marker portion, according to claim 5. Wafer processing tape.

Images