JP5328869B2 - 転写用の型の製造方法 - Google Patents
転写用の型の製造方法 Download PDFInfo
- Publication number
- JP5328869B2 JP5328869B2 JP2011231312A JP2011231312A JP5328869B2 JP 5328869 B2 JP5328869 B2 JP 5328869B2 JP 2011231312 A JP2011231312 A JP 2011231312A JP 2011231312 A JP2011231312 A JP 2011231312A JP 5328869 B2 JP5328869 B2 JP 5328869B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- transfer
- base member
- gimbal
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012546 transfer Methods 0.000 title claims description 83
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000465 moulding Methods 0.000 claims description 35
- 238000003825 pressing Methods 0.000 claims description 31
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 238000002360 preparation method Methods 0.000 claims 1
- 239000000047 product Substances 0.000 description 26
- 239000000758 substrate Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 230000000452 restraining effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000012778 molding material Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
13 被成形対象
41 転写用の型
43 型保持体
101 拘束部材
103 ベース部材
104 型部材
109 接着剤
Claims (1)
- 被成形対象に押し当てることによって前記被成形対象に微細なパターンを転写する転写用の型の製造方法において、
所定の厚さを有する錐台状のベース部材の面積の小さいほうの上底面に、微細な転写パターンが形成され前記ベース部材よりも薄く形成された板状の型部材を紫外線硬化式の接着剤を用いて貼り付ける貼り付け工程を有し、
前記ベース部材、前記型部材および前記接着剤が透明であり、
前記貼り付け工程は、前記型を用いて前記被成形対象に微細なパターンを、紫外線を用いて転写するときに使用する転写装置に、前記ベース部材と前記型部材とを設置して、前記ベース部材で前記型部材を押圧してなされる工程であることを特徴とする転写用の型の製造方法。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011231312A JP5328869B2 (ja) | 2011-10-21 | 2011-10-21 | 転写用の型の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011231312A JP5328869B2 (ja) | 2011-10-21 | 2011-10-21 | 転写用の型の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006171237A Division JP2008000945A (ja) | 2006-06-21 | 2006-06-21 | 転写用の型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012060141A JP2012060141A (ja) | 2012-03-22 |
| JP5328869B2 true JP5328869B2 (ja) | 2013-10-30 |
Family
ID=46056782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011231312A Active JP5328869B2 (ja) | 2011-10-21 | 2011-10-21 | 転写用の型の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5328869B2 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110874012A (zh) * | 2012-09-06 | 2020-03-10 | Ev 集团 E·索尔纳有限责任公司 | 用于压印的结构印模、装置以及方法 |
| JP2017130678A (ja) * | 2017-03-09 | 2017-07-27 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 型押し加工のための構造体スタンプ、装置および方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1072954A3 (en) * | 1999-07-28 | 2002-05-22 | Lucent Technologies Inc. | Lithographic process for device fabrication |
| CN1729428A (zh) * | 2001-05-16 | 2006-02-01 | 德克萨斯州大学系统董事会 | 通过施加电场在光固化组合物中加工纳米级图形的方法和系统 |
| US6849558B2 (en) * | 2002-05-22 | 2005-02-01 | The Board Of Trustees Of The Leland Stanford Junior University | Replication and transfer of microstructures and nanostructures |
| JP2004025647A (ja) * | 2002-06-26 | 2004-01-29 | Seiko Epson Corp | 入れ子、金型及びこれらの製造方法 |
| KR100568581B1 (ko) * | 2003-04-14 | 2006-04-07 | 주식회사 미뉴타텍 | 미세패턴 형성 몰드용 조성물 및 이로부터 제작된 몰드 |
| JP3819397B2 (ja) * | 2004-03-30 | 2006-09-06 | 株式会社東芝 | インプリント方法 |
| US7140861B2 (en) * | 2004-04-27 | 2006-11-28 | Molecular Imprints, Inc. | Compliant hard template for UV imprinting |
| AU2005282060A1 (en) * | 2004-09-08 | 2006-03-16 | Nil Technology Aps | A flexible nano-imprint stamp |
-
2011
- 2011-10-21 JP JP2011231312A patent/JP5328869B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012060141A (ja) | 2012-03-22 |
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