JP5329372B2 - Rolled copper foil, and negative electrode current collector, negative electrode plate and secondary battery using the same - Google Patents
Rolled copper foil, and negative electrode current collector, negative electrode plate and secondary battery using the same Download PDFInfo
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Abstract
Description
本発明は、リチウムイオン二次電池をはじめとする二次電池の負極集電体材料として好適な圧延銅箔、並びにそれを用いた負極集電体、負極板及び電池に関する。 The present invention relates to a rolled copper foil suitable as a negative electrode current collector material for a secondary battery such as a lithium ion secondary battery, and a negative electrode current collector, a negative electrode plate and a battery using the rolled copper foil.
携帯電話、ノート型パソコン等のポータブル機器の普及に伴い、小型で高容量の二次電池の需要が伸びている。また、電気自動車やハイブリッド車等に用いられる中・大型の二次電池の需要も急増している。二次電池のなかでも、リチウムイオン二次電池は、軽量でエネルギー密度が高いことから多くの分野で使用されている。
リチウムイオン二次電池としては、アルミニウム箔にLiCoO2、LiNiO2、LiMn2O4等の化合物をコーティングしたものを正極として用い、銅箔に炭素質材料等を活物質としてコーティングしたものを負極に用いるものが知られている(図2)。
With the widespread use of portable devices such as mobile phones and notebook computers, the demand for small, high-capacity secondary batteries is growing. In addition, demand for medium- and large-sized secondary batteries used in electric vehicles, hybrid vehicles, and the like is also increasing rapidly. Among secondary batteries, lithium ion secondary batteries are used in many fields because of their light weight and high energy density.
As a lithium ion secondary battery, an aluminum foil coated with a compound such as LiCoO 2 , LiNiO 2 , LiMn 2 O 4 is used as a positive electrode, and a copper foil coated with a carbonaceous material as an active material is used as a negative electrode. What is used is known (FIG. 2).
銅箔には圧延銅箔と電解銅箔がある。圧延銅箔は、強度、疲労特性等の点で二次電池負極板の材料として優れている。二次電池負極板材料として市販されている圧延銅箔の多くは、タフピッチ銅(JIS−C1100)を素材とするものである。タフピッチ銅とは、100〜500質量ppmの酸素を含有する純銅であり、銅分は99.90質量%以上に規格化されている(以下、質量ppm及び質量%をそれぞれppm及び%と表記する)。
圧延銅箔の製造プロセスでは、タフピッチ銅のインゴットを熱間圧延した後、冷間圧延と焼鈍とを繰り返し、最後に最終冷間圧延で、例えば35〜5μmの範囲の所定の厚みに仕上げる。
Copper foil includes rolled copper foil and electrolytic copper foil. The rolled copper foil is excellent as a material for the secondary battery negative electrode plate in terms of strength, fatigue characteristics, and the like. Many of the rolled copper foils marketed as secondary battery negative electrode plate materials are made of tough pitch copper (JIS-C1100). Tough pitch copper is pure copper containing oxygen of 100 to 500 mass ppm, and the copper content is standardized to 99.90 mass% or more (hereinafter, mass ppm and mass% are expressed as ppm and%, respectively). ).
In the manufacturing process of the rolled copper foil, a tough pitch copper ingot is hot-rolled, and then cold-rolling and annealing are repeated, and finally it is finished to a predetermined thickness in the range of, for example, 35 to 5 μm by final cold-rolling.
一般的に、銅箔負極板は、電解銅箔や圧延銅箔を用いて次のプロセスで製造される。
(1)活物質と結着剤とを溶剤に混練分散したペーストを、集電体となる銅箔の片面もしくは両面に塗布して負極板材とする。
(2)150〜300℃の温度で数時間から数十時間加熱し乾燥する。
(3)必要に応じ、負極板材に加圧する。
(4)せん断加工を施し、所定形状の負極板へ成型する。
せん断加工の例としては、プレス機による打ち抜き加工、シャーリングによる切断加工、丸刃スリッターによる切断加工等がある。
Generally, a copper foil negative electrode plate is manufactured by the following process using electrolytic copper foil or rolled copper foil.
(1) A paste obtained by kneading and dispersing an active material and a binder in a solvent is applied to one side or both sides of a copper foil serving as a current collector to form a negative electrode plate material.
(2) Heat and dry at 150 to 300 ° C. for several hours to several tens of hours.
(3) Pressurize the negative electrode plate material as necessary.
(4) A shearing process is performed to form a negative electrode plate having a predetermined shape.
Examples of shearing include punching with a press, cutting with shearing, and cutting with a round blade slitter.
タフピッチ銅または無酸素銅を素材とする従来の圧延銅箔は、上記(2)乾燥工程において再結晶を起こして銅箔強度が低下(軟化)し、引張強さが200MPa近くまで低下する。このような軟らかい銅箔は、電池製造工程での負極板の巻き取り、巻回による極板群の製造時に高張力の負荷がかけられて箔切れを起こしやすくなる。
又、リチウムイオン二次電池では、充電時にはリチウムイオンが正極から負極に移動し、放電時にはリチウムイオンが負極から正極に移動する。リチウムイオンの移動に伴って負極活物質が膨張収縮するため、銅箔は充放電によって機械的な繰り返しストレスを受ける。そのため、軟化した銅箔は充放電による機械的な繰り返しストレスを受けて変形し、銅箔表面に塗布された活物質が剥離しやすいと共に、銅箔自体も損傷しやすくなる。
In the conventional rolled copper foil made of tough pitch copper or oxygen-free copper, recrystallization occurs in the above (2) drying step, the copper foil strength is reduced (softened), and the tensile strength is reduced to nearly 200 MPa. Such a soft copper foil is subject to high tension load during winding of the negative electrode plate in the battery manufacturing process and manufacturing of the electrode plate group by winding, and the foil easily breaks.
In a lithium ion secondary battery, lithium ions move from the positive electrode to the negative electrode during charging, and lithium ions move from the negative electrode to the positive electrode during discharging. Since the negative electrode active material expands and contracts as the lithium ions move, the copper foil is subjected to mechanical repeated stress due to charge and discharge. Therefore, the softened copper foil is deformed by mechanical repeated stress due to charging / discharging, and the active material applied to the surface of the copper foil is easily peeled off, and the copper foil itself is easily damaged.
また、二次電池の小型化に伴い、負極集電体である銅箔の薄肉化が進んでいる。銅箔が薄肉化すると、電池製造において活物質の塗布時に高張力の負荷がかけられて箔切れを起こしやすくなると共に、上記軟化による箔切れが更に発生しやすくなる。従って、最終圧延加工後の製品(圧延上がり)においてより高い引張強さを有すると共に、軟化による箔切れも起こさない銅箔が求められている。
このような課題に対応するため、タフピッチ銅を素材とする圧延銅箔に替わり、銅合金を素材とする圧延銅箔(以下、銅合金箔)が提案されている。
In addition, with the miniaturization of secondary batteries, the copper foil, which is a negative electrode current collector, is becoming thinner. When the copper foil is thinned, a high-tension load is applied at the time of application of the active material in battery production, and the foil breakage easily occurs, and the foil breakage due to the softening is more likely to occur. Accordingly, there is a need for a copper foil that has higher tensile strength in the product after final rolling (rolled up) and does not cause foil breakage due to softening.
In order to deal with such problems, a rolled copper foil made of a copper alloy (hereinafter referred to as copper alloy foil) has been proposed instead of a rolled copper foil made of tough pitch copper.
特開2000−303128(特許文献1)では、無酸素銅にCr、Zn、Ag、Ca、Sn、SbまたはBiを50または100ppm添加した銅合金箔が開示されている。
特開2000−133276(特許文献2)では、Znを10〜35%の範囲で含有する銅合金箔が開示されている。
特開平11−339811(特許文献3)では、Cu−0.1%Fe−0.03%P、Cu−0.3%Cr−0.25%Sn−0.2%Zn及びCu−0.1%Niを素材とする銅合金箔が開示されている。
特開2000−328159(特許文献4)では、0.002〜0.45重量%のPを含有し、これに0.006〜0.25重量%のFeまたは/及び0.005〜0.25重量%のAgを添加した銅合金箔が開示されている。これら合金は、りん脱酸銅をベースとしており、Pの特性への弊害を発現させないようにP濃度を制限している。
特開2003−286528(特許文献5)では、0.063〜0.231%のSnを含有し、水素濃度と酸素濃度を適正に調整した銅合金箔が開示されている。この銅箔はピンホールと屈曲寿命が改善されており、リチウムイオン二次電池の負極集電体にも使用できる。
Japanese Patent Application Laid-Open No. 2000-303128 (Patent Document 1) discloses a copper alloy foil obtained by adding 50 or 100 ppm of Cr, Zn, Ag, Ca, Sn, Sb or Bi to oxygen-free copper.
Japanese Unexamined Patent Application Publication No. 2000-133276 (Patent Document 2) discloses a copper alloy foil containing Zn in a range of 10 to 35%.
In JP-A-11-339811 (Patent Document 3), Cu-0.1% Fe-0.03% P, Cu-0.3% Cr-0.25% Sn-0.2% Zn and Cu-0. A copper alloy foil made of 1% Ni is disclosed.
Japanese Patent Application Laid-Open No. 2000-328159 (Patent Document 4) contains 0.002 to 0.45% by weight of P, and 0.006 to 0.25% by weight of Fe or / and 0.005 to 0.25. A copper alloy foil with added weight percent Ag is disclosed. These alloys are based on phosphorous-deoxidized copper, and the P concentration is limited so as not to cause adverse effects on the properties of P.
Japanese Patent Application Laid-Open No. 2003-286528 (Patent Document 5) discloses a copper alloy foil containing 0.063 to 0.231% of Sn and appropriately adjusting the hydrogen concentration and the oxygen concentration. This copper foil has improved pinholes and flex life, and can be used as a negative electrode current collector of a lithium ion secondary battery.
特許文献1の銅合金箔は460〜480MPaの引張強さを有しているが、その耐熱性は、200℃で30分の熱履歴後の400〜430MPaの引張強さを目標にしており、更に高温でも引張強さを維持する銅箔は目的とされていなかった。特許文献2では実施例の中で最も導電率が高い合金はCu−10%Zn(JIS−C2200)であり、その導電率は44%IACSに過ぎない(日本伸銅協会:伸銅品データブック(1997))。特許文献3のFe−P、Cr等の析出物が形成される銅合金箔では、より高い強度と耐熱性が得られるものの、箔が脆くなり極薄箔への圧延が困難であった。そして、Fe−P粒子が析出するCu−Fe−P合金、及びCr粒子が析出するCu−Cr−Sn−Zn合金では、550MPaの引張強さが得られているが、Cu−Ni合金の引張強さは、ぎりぎり500MPaに達するレベルである。特許文献4で使用されるAgは高価なために添加量が制限されることに加え、300℃で5分の熱履歴後の引張強さを目標にしており、更に長時間でも引張強さを維持する銅箔は目的とされていなかった。
本発明者らの検討結果によれば、従来の負極集電体用銅合金箔のなかでは、特許文献5の無酸素銅をベースとするCu−Sn合金が、比較的特性、製造性、コストのバランスに優れていたが、二次電池の充放電サイクル特性という点では充分なものではなかった。
Although the copper alloy foil of
According to the examination results of the present inventors, among the conventional copper alloy foils for negative electrode current collectors, the Cu—Sn alloy based on oxygen-free copper of Patent Document 5 is relatively characteristic, manufacturable, and cost-effective. However, it was not sufficient in terms of charge / discharge cycle characteristics of the secondary battery.
近年、リチウムイオン二次電池の性能に対する要求は高度化している。これに伴い、負極集電体用の圧延銅箔に対しては、高張力が付加される製造工程中や、二次電池充放電のストレスを受けた際に、箔に破れが生じず、活物質が剥離しない性能が更に強く求められている。
本発明はCu−Sn合金箔を改良することにより、リチウムイオン二次電池をはじめとする二次電池の負極集電体材料として好適な、充放電サイクル寿命に優れる圧延銅箔、並びにこれを用いた負極集電体、負極板及び二次電池を提供することを目的とする。
In recent years, the demand for the performance of lithium ion secondary batteries has been advanced. Along with this, the rolled copper foil for the negative electrode current collector is not torn during the manufacturing process where high tension is applied or when it is subjected to secondary battery charging / discharging stress. There is a strong demand for the ability of a substance not to peel off.
The present invention improves the Cu-Sn alloy foil, and is suitable as a negative electrode current collector material for secondary batteries such as lithium ion secondary batteries. An object of the present invention is to provide a negative electrode current collector, a negative electrode plate, and a secondary battery.
本発明者は、上記課題を解決すべく鋭意研究した結果、下記発明をなすに至った。
(1)0.05〜0.22質量%のSnを含有し残部Cu及び不純物からなる無酸素銅ベースの銅合金箔であり、表面酸化膜中のSn濃度が0.16〜1.5質量%であり、480MPa以上の引張り強さ及び80%IACS以上の導電率を有するとともに、300℃で30分間加熱後に400MPa以上の引張り強さを維持することを特徴とする、二次電池用負極集電体用圧延銅箔。
(2)更に0.1質量%以下のAgを含有することを特徴とする(1)記載の圧延銅箔。
(3)上記(1)又は(2)記載の圧延銅箔より構成される負極集電体。
(4)上記(3)に記載の負極集電体の少なくとも片面に、炭素質材料または黒鉛質材料を主成分とする負極活物質層を有する負極板。
(5)上記(3)に記載の負極集電体の少なくとも片面に、金属リチウム、金属すず、すず化合物、けい素単体、及びけい素化合物からなる群から選ばれた少なくとも1種以上を含有する活物質層を有する負極板。
(6)上記(4)又は(5)記載の負極板が、リチウム遷移金属複合酸化物を正極活物質の主成分とする正極板とセパレータを介して絶縁配置された極板群、非水電解液、並びに極板群及び非水電解液を収容する電池ケースとから構成される二次電池。
As a result of intensive studies to solve the above problems, the present inventor has made the following invention.
(1) An oxygen-free copper-based copper alloy foil containing 0.05 to 0.22 mass% of Sn and the balance being Cu and impurities, and the Sn concentration in the surface oxide film is 0.16 to 1.5 mass % der is, together with a more tensile strength and 80% IACS or more conductivity 480 MPa, it characterized that you keep the tensile strength of at least 400MPa after heating at 300 ° C. 30 min, the secondary battery Rolled copper foil for negative electrode current collectors.
(2) The rolled copper foil according to (1), further containing 0.1% by mass or less of Ag.
( 3 ) A negative electrode current collector composed of the rolled copper foil described in (1) or (2) above.
( 4 ) A negative electrode plate having a negative electrode active material layer mainly composed of a carbonaceous material or a graphite material on at least one surface of the negative electrode current collector described in ( 3 ) above.
( 5 ) At least one surface selected from the group consisting of metallic lithium, metallic tin, a tin compound, a silicon simple substance, and a silicon compound is contained on at least one surface of the negative electrode current collector described in ( 3 ) above. A negative electrode plate having an active material layer.
( 6 ) An electrode plate group in which the negative electrode plate described in the above ( 4 ) or ( 5 ) is insulated and disposed via a separator and a positive electrode plate having a lithium transition metal composite oxide as a main component of the positive electrode active material, non-aqueous electrolysis A secondary battery comprising a liquid and a battery case containing an electrode plate group and a non-aqueous electrolyte.
(銅箔の成分)
本発明では、銅箔の強度と耐熱性を改善するために無酸素銅にSnを添加している。Sn濃度が0.05%以上、好ましくは0.10%以上であると強度と耐熱性に優れた銅箔が得られる。一方、Sn濃度が0.22%を超えると、導電率が低下して二次電池の負極集電体用として不適当になる。より好ましくは0.15%以下であり、この場合83%IACS以上の導電率が安定して得られる。
(Copper foil components)
In the present invention, Sn is added to oxygen-free copper in order to improve the strength and heat resistance of the copper foil. When the Sn concentration is 0.05% or more, preferably 0.10% or more, a copper foil excellent in strength and heat resistance can be obtained. On the other hand, if the Sn concentration exceeds 0.22%, the electrical conductivity is lowered and it becomes unsuitable for the negative electrode current collector of the secondary battery. More preferably, it is 0.15% or less, and in this case, a conductivity of 83% IACS or more can be stably obtained.
本発明の銅合金箔は、無酸素銅の溶湯にSnを添加することにより溶製する。無酸素銅溶湯の酸素濃度は、通常10ppm以下である。タフピッチ銅溶湯のように100〜500ppmの酸素を含む溶湯にSnを添加すると、Snが酸化して酸化すずを形成し、Snの耐熱性改善効果が得られない。SnはCu中に固溶した状態でCuの耐熱性を改善するが、酸化物として析出してしまったSn成分はCuの耐熱性改善に寄与しないためである。酸素濃度の調整は、溶湯のカーボン脱酸等の当業者公知の技術により行うことができる。 The copper alloy foil of the present invention is melted by adding Sn to an oxygen-free copper melt. The oxygen concentration of the oxygen-free copper melt is usually 10 ppm or less. When Sn is added to a molten metal containing 100 to 500 ppm of oxygen such as a tough pitch copper molten metal, Sn is oxidized to form tin oxide, and the effect of improving the heat resistance of Sn cannot be obtained. This is because Sn improves the heat resistance of Cu in a state of being dissolved in Cu, but the Sn component deposited as an oxide does not contribute to the improvement of the heat resistance of Cu. The oxygen concentration can be adjusted by techniques known to those skilled in the art, such as carbon deoxidation of molten metal.
本発明の銅合金箔は、0.1%以下のAgを含有することができる。Agを添加することにより、導電率を低下させずに耐熱性を改善することができる。0.1%を超えるAgを添加すると耐熱性はさらに向上するが、製造コストが増加することに加え、延性が低下し箔への圧延加工が難しくなる。より好ましいAg濃度は0.06%以下である。なお、銅箔の溶解原料となる電気銅は、不可避的不純物として、通常Agを10ppm程度含有する。 The copper alloy foil of the present invention can contain 0.1% or less of Ag. By adding Ag, the heat resistance can be improved without lowering the electrical conductivity. When Ag exceeding 0.1% is added, the heat resistance is further improved, but in addition to an increase in production cost, ductility is lowered and rolling into a foil becomes difficult. A more preferable Ag concentration is 0.06% or less. In addition, the electrolytic copper used as the melting material of the copper foil usually contains about 10 ppm of Ag as an inevitable impurity.
(銅箔の特性)
充放電ストレスによる銅箔の変形が生じず、電池の信頼性を更に向上させるには、乾燥工程を経た後に400MPa以上の引張強さを保つことが好ましい。本発明で求められる乾燥工程での熱負荷レベルは、300℃で30分間の熱処理に相当する。これは従来の熱負荷の基準である200℃で30分(特許文献1)、300℃で5分(特許文献4)などの条件より極めて厳しい条件である。
本発明の圧延銅箔は、300℃で30分間加熱後の引張強さが、好ましくは400MPa以上、より好ましくは450MPa以上である。ここで、300℃で30分間加熱後に400MPa以上の引張強さを維持するためには、圧延上がりの状態で、480MPa以上、好ましくは520MPa以上の引張強さを有している必要がある。
Sn濃度が0.05%以上であると、上記条件加熱後の引張強さが400MPa以上、0.10%以上であると450MPa以上になる。
(Characteristics of copper foil)
In order to further improve the reliability of the battery without causing deformation of the copper foil due to charge / discharge stress, it is preferable to maintain a tensile strength of 400 MPa or more after the drying process. The heat load level in the drying process required in the present invention corresponds to a heat treatment at 300 ° C. for 30 minutes. This is a condition that is extremely stricter than the conventional heat load standard of 200 ° C. for 30 minutes (Patent Document 1) and 300 ° C. for 5 minutes (Patent Document 4).
The rolled copper foil of the present invention has a tensile strength after heating at 300 ° C. for 30 minutes, preferably 400 MPa or more, more preferably 450 MPa or more. Here, in order to maintain a tensile strength of 400 MPa or more after heating at 300 ° C. for 30 minutes, it is necessary to have a tensile strength of 480 MPa or more, preferably 520 MPa or more in the state after rolling.
When the Sn concentration is 0.05% or more, the tensile strength after heating under the above conditions is 400 MPa or more, and when it is 0.10% or more, it becomes 450 MPa or more.
タフピッチ銅を素材とする従来の圧延銅箔の導電率は約100%IACSであるが、素材を銅合金化することにより、銅箔の導電率は低下して電池性能が低下する傾向がある。本発明の圧延銅箔の導電率は、好ましくは80%IACS以上、更に好ましくは83%IACS以上であり、このレベルであると電池性能は低下しない。 The conductivity of a conventional rolled copper foil made of tough pitch copper is about 100% IACS. However, when the material is made of a copper alloy, the conductivity of the copper foil is lowered and the battery performance tends to be lowered. The electrical conductivity of the rolled copper foil of the present invention is preferably 80% IACS or higher, more preferably 83% IACS or higher, and battery performance does not deteriorate at this level.
(銅箔の酸化膜)
本発明の表面酸化膜中のSn濃度は、0.16〜1.5質量%である。
SnはCuより酸化しやすいため、酸化膜中のSn濃度は母地中のSn濃度と比較して高くなる。銅箔の表面に酸化すずが存在すると、金属化合物等の負極活物質に対する親和性が上昇するため、負極活物質を塗布して負極を製造する工程の作業効率が上昇する利点があることが予測できる。従って、従来技術では、Sn含有銅箔表面に必然的に存在する酸化すずに対する問題点は特に認識されていなかった。しかし、本発明者は、酸化膜中のSn濃度が1.5%を越えると、酸化膜が脆くなって母地から剥離しやすくなり、銅箔と活物質との結合性が阻害されることを発見した。酸化膜中のSn濃度を1.5%以下に制御することで、銅箔と活物質との密着性が向上し、電池の充放電サイクル寿命が向上した。
一方、酸化膜中のSn濃度を0.16%未満に調整しようとすると、活物質との密着性以外のところで弊害が生じる。例えば、後述するように、表面に酸化すずを局在させないために酸化雰囲気下で焼鈍を行うと、厚く不均一な酸化膜が生成し、酸洗後の最終圧延では材料破断が頻発する。
本発明の銅合金箔の酸化膜の厚さは1〜4nmであり、この範囲であれば酸化膜の厚みが銅箔と活物質との密着性に影響を及ぼすことはない。
本発明では、酸化膜のSn濃度は、XPS(X線光電子分光法)により試料表面をArスパッタリングしてSn濃度プロファイルを測定し、得られたプロファイルの、母地濃度に対応するベースラインよりも表面側に存在する最大ピーク濃度として表される。また、酸化膜の厚さは、上記XPSのO濃度のプロファイルにおいて、表面に濃化したOが母地のO濃度まで低下するときの深さとして表される。
(Oxide film of copper foil)
The Sn concentration in the surface oxide film of the present invention is 0.16 to 1.5% by mass.
Since Sn is easier to oxidize than Cu, the Sn concentration in the oxide film is higher than the Sn concentration in the matrix. When tin oxide is present on the surface of the copper foil, the affinity for the negative electrode active material such as a metal compound is increased, so it is predicted that there is an advantage that the working efficiency of the process of manufacturing the negative electrode by applying the negative electrode active material is increased. it can. Therefore, in the prior art, the problem with respect to tin oxide that inevitably exists on the surface of the Sn-containing copper foil has not been particularly recognized. However, the present inventor found that when the Sn concentration in the oxide film exceeds 1.5%, the oxide film becomes brittle and easily peels off from the base metal, and the bondability between the copper foil and the active material is inhibited. I found By controlling the Sn concentration in the oxide film to 1.5% or less, the adhesion between the copper foil and the active material was improved, and the charge / discharge cycle life of the battery was improved.
On the other hand, if an attempt is made to adjust the Sn concentration in the oxide film to less than 0.16%, adverse effects occur in areas other than the adhesion to the active material. For example, as will be described later, if annealing is performed in an oxidizing atmosphere in order not to localize tin oxide on the surface, a thick and non-uniform oxide film is generated, and material fracture frequently occurs in final rolling after pickling.
The thickness of the oxide film of the copper alloy foil of the present invention is 1 to 4 nm. Within this range, the thickness of the oxide film does not affect the adhesion between the copper foil and the active material.
In the present invention, the Sn concentration of the oxide film is determined by measuring the Sn concentration profile by Ar sputtering the sample surface by XPS (X-ray photoelectron spectroscopy), and the obtained profile is more than the baseline corresponding to the matrix concentration. Expressed as the maximum peak concentration present on the surface side. Further, the thickness of the oxide film is expressed as the depth when O concentrated on the surface decreases to the O concentration of the base metal in the XPS O concentration profile.
(銅箔の製造方法)
インゴットの溶製では、まずカーボンによる脱酸反応を利用して溶銅中の酸素濃度を10ppm以下に下げ、その後Snを添加する。溶銅中の酸素濃度が10ppmを超える状態でSnを添加すると、Snが酸化し、酸化すずの介在物が生成してしまう。次に、インゴットを熱間圧延により厚さ10mm程度の板とし、その後冷間圧延と再結晶焼鈍を繰り返し、最後に冷間圧延で所定厚み(一般的には35〜5μm)に仕上げる。厚みが5μm以下になると、単位面積当たりの引張強さが高くても破断しやすくなる。一方、35μmを超えると、負極板が厚くなるため二次電池を小型化しにくくなる。
再結晶焼鈍は、炉温が300〜800℃の範囲、焼鈍時間が数秒間〜数時間の範囲で、焼鈍後の結晶粒径が所定の大きさ(通常は3〜30μm)になる条件で行われる。焼鈍後の材料は、焼鈍中に生成した表面酸化膜を除去するため、硫酸水溶液等を用いて酸洗される。
(Manufacturing method of copper foil)
In the melting of the ingot, first, the oxygen concentration in the molten copper is lowered to 10 ppm or less by utilizing a deoxidation reaction by carbon, and then Sn is added. When Sn is added in a state where the oxygen concentration in the molten copper exceeds 10 ppm, Sn is oxidized, and inclusions of tin oxide are generated. Next, the ingot is made into a plate having a thickness of about 10 mm by hot rolling, and then cold rolling and recrystallization annealing are repeated, and finally finished to a predetermined thickness (generally 35 to 5 μm) by cold rolling. When the thickness is 5 μm or less, it tends to break even if the tensile strength per unit area is high. On the other hand, if it exceeds 35 μm, the negative electrode plate becomes thick, and it becomes difficult to reduce the size of the secondary battery.
Recrystallization annealing is performed under the conditions that the furnace temperature is in the range of 300 to 800 ° C., the annealing time is in the range of several seconds to several hours, and the crystal grain size after annealing is a predetermined size (usually 3 to 30 μm). Is called. The material after annealing is pickled using a sulfuric acid aqueous solution or the like in order to remove the surface oxide film generated during the annealing.
最終圧延後の銅箔表面酸化膜中のSn濃度を調整する方法は、本発明を限定するものではないが、例えば、最終圧延前の最終再結晶焼鈍における炉内のガス雰囲気を、下記影響を考慮して制御する。
雰囲気の還元性が強い場合、SnがCuより酸化しやすい傾向がそのまま要因となってCuが酸化せずにSnが優先的に酸化し、Snリッチな酸化膜が形成される。焼鈍後の酸洗の際、Cuの酸化物は酸に溶けやすいが、Snの酸化物は酸に溶けにくいため、酸化膜中のSn濃度はさらに高くなる。焼鈍で生成した酸化膜は、最終圧延において部分的に割れたり剥離したりする場合もあるが、そのほとんどは箔製品の表面に残留する。
一方、雰囲気の酸化性が強いと、SnとCuとの酸化傾向の差を区別できないほどSnとCuが同程度の速度で酸化され、酸化膜中のCu/Sn濃度比が母地中のCu/Sn濃度比に近付くものの、酸化膜が厚く不均一に成長する。このため酸洗後の材料表面に凹凸やピットが生じ、箔への圧延において銅箔にピンホールが生じたり銅箔が破断したりする。
The method for adjusting the Sn concentration in the copper foil surface oxide film after the final rolling does not limit the present invention. For example, the gas atmosphere in the furnace in the final recrystallization annealing before the final rolling has the following effects. Take control into consideration.
When the atmosphere is highly reducible, the tendency of Sn to be oxidized more easily than Cu is directly a factor, and Cu is not oxidized but Sn is preferentially oxidized to form a Sn-rich oxide film. At the time of pickling after annealing, Cu oxide is easily dissolved in acid, but Sn oxide is hardly dissolved in acid, so that the Sn concentration in the oxide film is further increased. Although the oxide film formed by annealing may be partially cracked or peeled off in the final rolling, most of it remains on the surface of the foil product.
On the other hand, if the atmosphere is highly oxidizable, Sn and Cu are oxidized at a similar rate so that the difference in oxidation tendency between Sn and Cu cannot be distinguished, and the Cu / Sn concentration ratio in the oxide film becomes Cu in the matrix. Although it approaches the Sn concentration ratio, the oxide film grows thick and uneven. For this reason, irregularities and pits are generated on the surface of the material after pickling, and pinholes are formed in the copper foil or the copper foil is broken during rolling to the foil.
好ましい最終圧延加工度は80〜98%であり、より好ましくは85〜95%である。ここで圧延加工度rは、r=(t0−t)/t0(t:圧延後の厚み、t0:圧延前の厚み)とする。最終冷間圧延の加工度が80%未満であると、圧延上がりの引張り強さを480MPa以上に調整することが難しくなる。また、最終冷間圧延の加工度が98%を超えると、銅箔の耐熱性が低下し、300℃で30分間加熱後に400MPa以上の引張強さを維持することが難しくなる。これは極度に蓄積される加工歪が再結晶を促進するためである。 A preferable final rolling degree is 80 to 98%, more preferably 85 to 95%. Here, the degree of rolling r is r = (t 0 -t) / t 0 (t: thickness after rolling, t 0 : thickness before rolling). If the degree of work of the final cold rolling is less than 80%, it becomes difficult to adjust the tensile strength after rolling to 480 MPa or more. Moreover, when the workability of final cold rolling exceeds 98%, the heat resistance of the copper foil is lowered, and it becomes difficult to maintain a tensile strength of 400 MPa or more after heating at 300 ° C. for 30 minutes. This is because extremely accumulated processing strain promotes recrystallization.
(電池の構成)
本発明に関わる負極板及び二次電池は、上記銅箔を負極集電体として用いることを特徴とするものであり、これ以外の構成については限定されず、一般に用いられている公知のものを用いることができる。
(Battery configuration)
The negative electrode plate and the secondary battery according to the present invention are characterized by using the above copper foil as a negative electrode current collector, and other configurations are not limited, and commonly used known ones are used. Can be used.
(負極)
負極は、本発明の負極集電体と、負極集電体の片面もしくは両面に形成される負極活物質より構成される。負極活物質としては、リチウムの吸蔵放出が可能な炭素質物、金属、金属化合物(金属酸化物、金属硫化物、金属窒化物)、リチウム合金などが挙げられる。
前記炭素質物としては、黒鉛、コークス、炭素繊維、球状炭素、熱分解気相炭素質物、樹脂焼成体などの黒鉛質材料もしくは炭素質材料;熱硬化性樹脂、等方性ピッチ、メソフェーズピッチ系炭素、メソフェーズピッチ系炭素繊維、メソフェーズ小球体などに500〜3000℃で熱処理を施すことにより得られる黒鉛質材料または炭素質材料;等が挙げられる。
前記金属としては、リチウム、アルミニウム、マグネシウム、すず、けい素等が挙げられる。
前記金属酸化物としては、すず酸化物、ケイ素酸化物、リチウムチタン酸化物、ニオブ酸化物、タングステン酸化物等が挙げられる。前記金属硫化物としては、すず硫化物、チタン硫化物等が挙げられる。前記金属窒化物としては、リチウムコバルト窒化物、リチウム鉄窒化物、リチウムマンガン窒化物等が挙げられる。
リチウム合金としては、リチウムアルミニウム合金、リチウムすず合金、リチウム鉛合金、リチウムケイ素合金等が挙げられる。
(Negative electrode)
A negative electrode is comprised from the negative electrode collector of this invention, and the negative electrode active material formed in the single side | surface or both surfaces of a negative electrode collector. Examples of the negative electrode active material include carbonaceous materials capable of occluding and releasing lithium, metals, metal compounds (metal oxides, metal sulfides, metal nitrides), lithium alloys, and the like.
Examples of the carbonaceous material include graphite materials, carbonaceous materials such as graphite, coke, carbon fiber, spherical carbon, pyrolytic vapor phase carbonaceous material, and resin fired body; thermosetting resin, isotropic pitch, and mesophase pitch carbon. And graphite materials or carbonaceous materials obtained by subjecting mesophase pitch-based carbon fibers, mesophase microspheres, etc. to heat treatment at 500 to 3000 ° C.
Examples of the metal include lithium, aluminum, magnesium, tin, and silicon.
Examples of the metal oxide include tin oxide, silicon oxide, lithium titanium oxide, niobium oxide, and tungsten oxide. Examples of the metal sulfide include tin sulfide and titanium sulfide. Examples of the metal nitride include lithium cobalt nitride, lithium iron nitride, and lithium manganese nitride.
Examples of the lithium alloy include a lithium aluminum alloy, a lithium tin alloy, a lithium lead alloy, and a lithium silicon alloy.
負極活物質含有層には結着剤を含有させることができる。結着剤としては、カルボキシメチルセルロース(CMC)及びスチレンブタジエン(SBR)を含む混合物が挙げられる。CMC及びSBRを含む結着剤を使用することによって、負極活物質と集電体との密着性をより高くすることができる。
負極活物質含有層には、導電剤を含有させることができる。導電剤としては、アセチレンブラック、粉末状膨張黒鉛などのグラファイト類、炭素繊維粉砕物、黒鉛化炭素繊維粉砕物、等が挙げられる。
The negative electrode active material-containing layer can contain a binder. Examples of the binder include a mixture containing carboxymethyl cellulose (CMC) and styrene butadiene (SBR). By using a binder containing CMC and SBR, the adhesion between the negative electrode active material and the current collector can be further increased.
The negative electrode active material-containing layer can contain a conductive agent. Examples of the conductive agent include acetylene black, graphite such as powdered expanded graphite, pulverized carbon fiber, pulverized graphitized carbon fiber, and the like.
(正極)
正極は、正極集電体と、前記正極集電体の片面もしくは両面に形成される正極活物質含有層より構成される。
正極集電体としては、アルミニウム板、アルミニウムメッシュ材等が挙げられる。
正極活物質含有層は、例えば、活物質と結着剤とを含有する。正極活物質としては、二酸化マンガン、二硫化モリブデン、LiCoO2、LiNiO2、LiMn2O4等のカルコゲン化合物が挙げられる。これらのカルコゲン化合物は、2種以上の混合物で用いても良い。結着剤としては、フッ素系樹脂、ポリオレフィン樹脂、スチレン系樹脂、アクリル系樹脂のような熱可塑性エラストマー系樹脂、またはフッ素ゴムのようなゴム系樹脂を用いることができる。
活物質含有層には、導電補助材としてアセチレンブラック、粉末状膨張黒鉛などのグラファイト類、炭素繊維粉砕物、黒鉛化炭素繊維粉砕物、等をさらに含有することができる。
(Positive electrode)
The positive electrode includes a positive electrode current collector and a positive electrode active material-containing layer formed on one or both surfaces of the positive electrode current collector.
Examples of the positive electrode current collector include an aluminum plate and an aluminum mesh material.
The positive electrode active material-containing layer contains, for example, an active material and a binder. Examples of the positive electrode active material include chalcogen compounds such as manganese dioxide, molybdenum disulfide, LiCoO 2 , LiNiO 2 , and LiMn 2 O 4 . These chalcogen compounds may be used in a mixture of two or more. As the binder, a thermoplastic elastomer resin such as a fluorine resin, a polyolefin resin, a styrene resin, or an acrylic resin, or a rubber resin such as a fluorine rubber can be used.
The active material-containing layer may further contain acetylene black, graphite such as powdered expanded graphite, carbon fiber pulverized material, graphitized carbon fiber pulverized material, and the like as a conductive auxiliary material.
(セパレータ)
正極と負極の間には、セパレータか、固体もしくはゲル状の電解質層を配置することができる。セパレータとしては、例えば20〜30μmの厚さを有するポリエチレン多孔質フィルム、ポリプロピレン多孔質フィルム等を用いることができる。
(Separator)
A separator or a solid or gel electrolyte layer can be disposed between the positive electrode and the negative electrode. As the separator, for example, a polyethylene porous film or a polypropylene porous film having a thickness of 20 to 30 μm can be used.
(非水電解質)
非水電解質には、液状、ゲル状もしくは固体状の形態を有するものを使用することができる。また、非水電解質は、非水溶媒と、この非水溶媒に溶解される電解質とを含むことが望ましい。
非水溶媒としては、エチレンカーボネート、ジメチルカーボネート、メチルエチルカーボネート、ジエチルカーボネート、γ−ブチロラクトン等が挙げられる。使用する非水溶媒の種類は、1種類もしくは2種類以上にすることが可能である。
電解質としては、過塩素酸リチウム(LiClO4)、六フッ化リン酸リチウム(LiPF6)、四フッ化硼酸リチウム(LiBF4)、六フッ化砒素リチウム(LiAsF6)等が挙げられる。電解質は、単独でも混合物の形態でも使用することができる。
(Nonaqueous electrolyte)
As the non-aqueous electrolyte, those having a liquid, gel or solid form can be used. The non-aqueous electrolyte preferably includes a non-aqueous solvent and an electrolyte that is dissolved in the non-aqueous solvent.
Examples of the non-aqueous solvent include ethylene carbonate, dimethyl carbonate, methyl ethyl carbonate, diethyl carbonate, and γ-butyrolactone. The kind of nonaqueous solvent to be used can be one kind or two or more kinds.
Examples of the electrolyte include lithium perchlorate (LiClO 4 ), lithium hexafluorophosphate (LiPF 6 ), lithium tetrafluoroborate (LiBF 4 ), lithium hexafluoroarsenide (LiAsF 6 ), and the like. The electrolyte can be used alone or in the form of a mixture.
(圧延銅箔の作製)
カーボン脱酸により酸素濃度を調整した溶銅にSnを添加した後、幅が500mm、厚みが200mmのインゴットに鋳造した。このインゴットを850℃で3時間加熱し、熱間圧延により厚み10mmの板にした。次に、表面の酸化スケールを研削除去し、冷間圧延により1.5mmの板とした。その後、再結晶焼鈍と冷間圧延を繰り返して、最終の圧延で厚みを18〜6μmに仕上げた。
再結晶焼鈍は連続焼鈍ラインを用いて行った。炉温を700℃とし、焼鈍後の結晶粒径が10μmになるように、材料の通板速度(炉内の滞留時間)を調整した。
最終圧延の加工度を変化させるために、最終焼鈍(最終冷間圧延直前の焼鈍)を施す板厚を予め調整した。
銅箔表面の酸化膜中のSn濃度を、最終再結晶焼鈍における炉内のガス雰囲気の酸化還元雰囲気を、下記手法により適宜制御することにより調整した。用いた連続焼鈍炉は、ブタンガスと空気との混合ガスを燃焼させて熱源とする炉であり、炉内の雰囲気はCO、CO2、O2、N2の混合ガスである。ブタンガスと空気との混合比を変化させることにより、CO濃度とCO2濃度との比(CO/CO2)を調整した。CO/CO2比が大きくなると還元性雰囲気となり、CO/CO2比が小さくなると酸化性雰囲気となる。炉から出た後の材料は10質量%硫酸水溶液で酸洗処理した。最終圧延後に得られた圧延銅箔について、下記評価を行った。
(Production of rolled copper foil)
After adding Sn to the molten copper whose oxygen concentration was adjusted by carbon deoxidation, it was cast into an ingot having a width of 500 mm and a thickness of 200 mm. The ingot was heated at 850 ° C. for 3 hours and formed into a plate having a thickness of 10 mm by hot rolling. Next, the oxide scale on the surface was removed by grinding, and a 1.5 mm plate was formed by cold rolling. Thereafter, recrystallization annealing and cold rolling were repeated, and the final rolling finished to a thickness of 18 to 6 μm.
Recrystallization annealing was performed using a continuous annealing line. The furnace temperature was set to 700 ° C., and the material passing speed (residence time in the furnace) was adjusted so that the crystal grain size after annealing was 10 μm.
In order to change the working degree of the final rolling, the thickness of the plate to be subjected to final annealing (annealing immediately before final cold rolling) was adjusted in advance.
The Sn concentration in the oxide film on the copper foil surface was adjusted by appropriately controlling the oxidation-reduction atmosphere of the gas atmosphere in the furnace in the final recrystallization annealing by the following method. The used continuous annealing furnace is a furnace that uses a mixed gas of butane gas and air as a heat source, and the atmosphere in the furnace is a mixed gas of CO, CO 2 , O 2 , and N 2 . The ratio of CO concentration to CO 2 concentration (CO / CO 2 ) was adjusted by changing the mixing ratio of butane gas and air. When the CO / CO 2 ratio is increased, a reducing atmosphere is formed, and when the CO / CO 2 ratio is decreased, an oxidizing atmosphere is formed. The material after leaving the furnace was pickled with a 10% by mass sulfuric acid aqueous solution. The following evaluation was performed on the rolled copper foil obtained after the final rolling.
(成分)
銅箔母地中の酸素濃度を不活性ガス溶融−赤外線吸収法で、Sn及びAg濃度をICP−質量分析法で分析した。ここで、Sn及びAg分析には銅箔試料を用いたが、O分析には1.5mmの板から採取した試料を用いた。これは、箔試料では質量に対する表面積の比率が非常に大きいため(例えば1gの試料の場合、厚さ1.5mmの板の表面積は1.5cm2に対し、厚さ10μmの箔の表面積は220cm2)、銅箔試料を用いて酸素を分析すると、表面の酸化膜及び吸着水膜中の酸素が加算され、酸素分析値が銅箔中の酸素濃度より50ppm程度増加するためである。なお、箔試料を用い、これが無酸素銅ベースの箔であることを判定するためには、試料の金属組織を観察し、酸化物粒子が存在しないこと(直径2μm以上の酸化物粒子が0.01個/mm2以下)を確認すればよい。なお、分析限界は1ppmであるが表中の表示は、質量%の小数点以下2桁までとした。
(component)
The oxygen concentration in the copper foil matrix was analyzed by an inert gas melting-infrared absorption method, and the Sn and Ag concentrations were analyzed by ICP-mass spectrometry. Here, a copper foil sample was used for Sn and Ag analysis, but a sample collected from a 1.5 mm plate was used for O analysis. This is because the ratio of the surface area to the mass of the foil sample is very large (for example, in the case of a 1 g sample, the surface area of a 1.5 mm thick plate is 1.5 cm 2 while the surface area of a 10 μm thick foil is 220 cm. 2 ) When oxygen is analyzed using a copper foil sample, oxygen in the surface oxide film and adsorbed water film is added, and the oxygen analysis value is increased by about 50 ppm from the oxygen concentration in the copper foil. In addition, in order to determine that this is an oxygen-free copper-based foil using a foil sample, the metal structure of the sample is observed, and no oxide particles are present (the oxide particles having a diameter of 2 μm or more are 0. (01 / mm 2 or less) may be confirmed. Although the analysis limit is 1 ppm, the display in the table is limited to 2 digits after the decimal point of mass%.
(引張強さ、導電率)
負極活物質の乾燥工程を模して圧延銅箔試料を300℃で30分間加熱した。加熱前及び加熱後の試料に対し、IPC(Institute for Interconnecting and Packaging Electronics Circuits)規格、IPC−TM−650;Method 2.4.19に準じて引張強さを求めた。試験片は、幅12.7mm、長さ150mmとし、試験片の長さ方向が圧延方向と平行になるように採取した。引張り速度は50mm/minとした。
圧延上がり(加熱前)の試料に対し引張り試験用の試験片を用い、四端子法により20℃での導電率を求めた。
(Tensile strength, conductivity)
The rolled copper foil sample was heated at 300 ° C. for 30 minutes to simulate the drying process of the negative electrode active material. The tensile strength was calculated | required according to IPC (Institute for Interconnecting and Packaging Electronics Circuits) specification, IPC-TM-650; Method 2.4.19 with respect to the sample before a heating and after a heating. The test piece was 12.7 mm in width and 150 mm in length, and was collected so that the length direction of the test piece was parallel to the rolling direction. The pulling speed was 50 mm / min.
Using a test piece for a tensile test on the rolled up sample (before heating), the conductivity at 20 ° C. was determined by a four-terminal method.
(酸化膜)
XPS(X線光電子分光法)を用い、試料表面をArスパッタリングしながらO及びSnを分析することにより、試料表層におけるO及びSnの濃度プロファイルを測定した。測定条件は次の通りである。
装置:アルバック・ファイ株式会社製5600MC、到達真空度:1.4×10-7Pa、励起源:単色化AlKα、出力:210W、検出面積:800μmφ、入射角:45度、取り出し角:45度、中和銃なし。
(スパッタ条件)イオン種:Ar+、加速電圧:3kV、掃引領域:3mm×3mm、レート:SiO2換算で2.0nm/min。
後述する発明例6での測定結果を図1に示す。Sn濃度プロファイルにおけるSnのピーク値は0.8%であり、この値を酸化膜中のSn濃度とした。また、O濃度のプロファイルより酸化膜の厚みを読み取ると1.8nmとなる。ここで、酸化膜の厚さは、図中に点線で示すように、O濃度曲線の裾の部分に接線を引き、この接線が母地のO濃度(この場合はゼロ質量%)と交わる深さとした。
(Oxide film)
Using XPS (X-ray photoelectron spectroscopy), the O and Sn concentration profiles in the sample surface layer were measured by analyzing O and Sn while sputtering the sample surface with Ar. The measurement conditions are as follows.
Apparatus: ULVAC-PHI Co., Ltd. 5600MC, ultimate vacuum: 1.4 × 10 −7 Pa, excitation source: monochromatic AlKα, output: 210 W, detection area: 800 μmφ, incident angle: 45 degrees, take-off angle: 45 degrees No neutralization gun.
(Sputtering conditions) Ion species: Ar +, acceleration voltage: 3 kV, sweep region: 3 mm × 3 mm, rate: 2.0 nm / min in terms of SiO 2 .
The measurement result in Invention Example 6 to be described later is shown in FIG. The Sn peak value in the Sn concentration profile was 0.8%, and this value was taken as the Sn concentration in the oxide film. Further, when the thickness of the oxide film is read from the profile of O concentration, it becomes 1.8 nm. Here, as shown by the dotted line in the figure, the thickness of the oxide film is a depth at which the tangent line is drawn at the bottom of the O concentration curve, and this tangent line intersects the O concentration of the matrix (in this case, zero mass%). Say it.
(サイクル寿命)
図2に示す円筒型のリチウムイオン二次電池を以下の手順で作製し、サイクル寿命を測定した。
(1)負極活物質として鱗片状黒鉛粉末50重量部、結着剤としてスチレンブタジエンゴム5重量部、そして増粘剤としてカルボキシルメチルセルロース1重量部に対して水99重量部に溶解した増粘剤水溶液23重量部を、混錬分散して負極用ペーストを得た。この負極用ペーストを圧延銅箔試料表面にドクターブレード方式で厚さ200μmに両面塗布し、300℃で30分間加熱し乾燥した。加圧して厚さを160μmに調整した後、せん断加工により成型し負極板6を得た。
(2)正極活物質としてLiCoO2粉末50重量部、導電剤としてアセチレンブラック1.5重量部、結着剤としてPTFE50重量%水性ディスパージョン7重量部、増粘剤としてカルボキシルメチルセルロース1重量%水溶液41.5重量部を、混練分散して正極用ペーストを得た。この正極用ペーストを、厚さ30μmのアルミニウム箔からなる集電体上にドクターブレード方式で厚さ約230μmに両面塗布して200℃で1時間加熱し乾燥した。加圧して厚さを180μmに調整した後、せん断加工により成型し正極板5を得た。
(3)正極板5と負極板6とを、厚さ20μmのポリプロピレン樹脂製の微多孔膜からなるセパレータ7を介して絶縁した状態で渦巻状に巻回した電極群を電池ケース8に収容した。
(4)負極板6から連接する負極リード9を、前記ケース8と下部絶縁板10を介して電気的に接続した。同様に正極板5から連接する正極リード3を、封口板1の内部端子に上部絶縁板4を介して電気的に接続した。これらの後、非水電解液を注液し、封口板1と電池ケース8とを絶縁ガスケット2を介してかしめ封口して、直径17mm、高さ50mmサイズで電池容量が780mAhの円筒型リチウムイオン二次電池を作製した。
(5)電解液は、エチレンカーボネート30体積%、エチルメチルカーボネート50体積%、プロピオン酸メチル20体積%の混合溶媒中に、電解質としてヘキサフルオロリン酸リチウム(LiPF6)を1.0モル溶かした電解液を所定量注液した。この電解液を正極活物質層及び負極活物質層内に含浸させた。
(Cycle life)
A cylindrical lithium ion secondary battery shown in FIG. 2 was produced by the following procedure, and the cycle life was measured.
(1) A thickener aqueous solution dissolved in 99 parts by weight of water with respect to 50 parts by weight of flaky graphite powder as a negative electrode active material, 5 parts by weight of styrene butadiene rubber as a binder, and 1 part by weight of carboxymethylcellulose as a thickener. 23 parts by weight was kneaded and dispersed to obtain a negative electrode paste. This negative electrode paste was applied on both sides of the rolled copper foil sample surface to a thickness of 200 μm by a doctor blade method, heated at 300 ° C. for 30 minutes, and dried. After pressurizing to adjust the thickness to 160 μm, the negative electrode plate 6 was obtained by molding by shearing.
(2) LiCoO 2 powder 50 parts by weight as a positive electrode active material, acetylene black 1.5 parts by weight as a conductive agent, PTFE 50% by weight aqueous dispersion 7 parts by weight, and
(3) A
(4) The
(5) The electrolytic solution was obtained by dissolving 1.0 mol of lithium hexafluorophosphate (LiPF 6 ) as an electrolyte in a mixed solvent of 30% by volume of ethylene carbonate, 50% by volume of ethyl methyl carbonate, and 20% by volume of methyl propionate. A predetermined amount of electrolyte was injected. The electrolytic solution was impregnated in the positive electrode active material layer and the negative electrode active material layer.
作製した電池を用い、充放電サイクル特性を評価した。20℃の環境下で充放電を行い、3サイクル目における放電容量を初期容量とし、初期容量に対して放電容量が80%に低下するまでサイクル数を計数し、これをサイクル寿命とした。充電条件:4.2Vで2時間の定電流−定電圧充電を行い、電池電圧が4.2Vに達するまでは550mA(0.7CmA)の定電流充電を行った後、さらに電流値が減衰して40mA(0.05CmA)になるまで充電した。放電条件:780mA(1CmA)の定電流で3.0Vの放電終止電圧まで放電した。サイクル寿命が600回以上になった場合に良好なサイクル特性が得られたと判定した。 Charge / discharge cycle characteristics were evaluated using the produced batteries. Charging / discharging was performed in an environment of 20 ° C., the discharge capacity at the third cycle was taken as the initial capacity, the number of cycles was counted until the discharge capacity was reduced to 80% of the initial capacity, and this was taken as the cycle life. Charging conditions: Constant current-constant voltage charging at 4.2V for 2 hours, and after 550mA (0.7CmA) constant current charging until the battery voltage reaches 4.2V, the current value further attenuates To 40 mA (0.05 CmA). Discharge conditions: Discharge was performed at a constant current of 780 mA (1 CmA) to a discharge end voltage of 3.0 V. It was determined that good cycle characteristics were obtained when the cycle life was 600 times or more.
評価結果を表1に示す。発明例3〜10、12〜13、15〜18、20〜22、26〜30は0.05〜0.22質量%のSnを含有し、80%IACS以上の導電率と480MPa以上の引張り強さを有し、300℃で30分間焼鈍後にも400MPa以上の引張り強さを維持している。また表面酸化膜中のSn濃度が1.5%以下である。その結果、600回以上の良好なサイクル寿命が得られている。
比較例1、2、発明例3〜10及び比較例11では、銅合金中のSn濃度の効果を検討している。
発明例3〜10は本発明の範囲内のSn濃度であり、目的とする特性が得られた。発明例3、4はSn濃度が低いため熱履歴後の引張強さにやや劣る。発明例9、10はSn濃度が高いため導電率がやや低い。
比較例1は従来の無添加無酸素銅であり、活物質乾燥工程における300℃での30分間の熱履歴により、銅箔の引張強さが200MPa近くまで低下した。また、比較例2は無酸素銅にSnを添加したものの添加量が0.05%未満であっため、300℃での30分間の熱履歴後、引張強さが400MPaを下回った。熱履歴後の引張強さが低いため、比較例1及び2の銅箔は、充放電の繰り返しストレスを受けて変形し、銅箔表面に塗布された活物質が剥離した。その結果、サイクル寿命が600回に満たなかった。一方、比較例11は0.22%を超えるSnを添加したために導電率が80%IACSを下回ってしまい、発熱や電圧損失により目的とする二次電池を製造できなくなる。
The evaluation results are shown in Table 1. Invention Examples 3 to 10, 12 to 13, 15 to 18, 20 to 22, and 26 to 30 contain 0.05 to 0.22% by mass of Sn, have a conductivity of 80% IACS or more and a tensile strength of 480 MPa or more. The tensile strength of 400 MPa or more is maintained even after annealing at 300 ° C. for 30 minutes. Further, the Sn concentration in the surface oxide film is 1.5% or less. As a result, a good cycle life of 600 times or more is obtained.
In Comparative Examples 1 and 2, Invention Examples 3 to 10, and Comparative Example 11, the effect of Sn concentration in the copper alloy is examined.
Invention Examples 3 to 10 are Sn concentrations within the range of the present invention, and the intended characteristics were obtained. Inventive Examples 3 and 4 are slightly inferior in tensile strength after thermal history because of low Sn concentration. Inventive Examples 9 and 10 have slightly low electrical conductivity because of high Sn concentration.
Comparative Example 1 is a conventional additive-free oxygen-free copper, and the tensile strength of the copper foil decreased to nearly 200 MPa due to a 30-minute thermal history at 300 ° C. in the active material drying step. In Comparative Example 2, the addition amount of Sn added to oxygen-free copper was less than 0.05%, and the tensile strength was less than 400 MPa after 30 minutes of heat history at 300 ° C. Since the tensile strength after heat history was low, the copper foils of Comparative Examples 1 and 2 were deformed by repeated charge / discharge stress, and the active material applied to the copper foil surface was peeled off. As a result, the cycle life was less than 600 times. On the other hand, in Comparative Example 11, since Sn exceeding 0.22% was added, the conductivity was lower than 80% IACS, and the intended secondary battery could not be manufactured due to heat generation and voltage loss.
発明例12及び13はAgを好ましい範囲で添加して、導電率を低下させることなく耐熱性を向上させており、300℃で30分間加熱後の引張強さが、同量のSnを添加した発明例9よりも高い。
比較例14は酸素が10ppmを超えたものであり、添加したSnの一部が酸化して酸化すずとなった。このため、300℃で30分間加熱後の引張強さが400MPaを下回った。更に、充放電の繰り返しストレスを受けた際に酸化すずを起点として銅箔にクラックが生じて銅箔が変形し活物質が剥離した結果、サイクル寿命が600回を大きく下回った。
発明例15〜18は、発明例5〜7の箔厚10μmに対して6μmと12μmの箔厚としても、酸化膜の厚さが1〜4nmの範囲内であれば箔厚に関係なく目的とする効果を得られることを示す。
Invention Examples 12 and 13 added Ag in a preferable range to improve the heat resistance without lowering the electrical conductivity, and the same amount of Sn was added as the tensile strength after heating at 300 ° C. for 30 minutes. It is higher than Invention Example 9.
In Comparative Example 14, oxygen exceeded 10 ppm, and a part of the added Sn was oxidized to be oxidized. For this reason, the tensile strength after heating at 300 ° C. for 30 minutes was less than 400 MPa. Furthermore, as a result of cracks occurring in the copper foil starting from tin oxide when subjected to repeated charge / discharge stress, the copper foil was deformed and the active material was peeled off. As a result, the cycle life was significantly less than 600 times.
Invention Examples 15 to 18 are intended to be used regardless of the foil thickness as long as the thickness of the oxide film is in the range of 1 to 4 nm even when the foil thickness is 6 μm and 12 μm with respect to the foil thickness of 10 μm of Invention Examples 5 to 7. It shows that the effect to do.
比較例19、発明例20〜22及び比較例23及び24では、表面酸化膜中のSn濃度の効果を検討している。
発明例20〜22は本発明の範囲内の表面酸化膜中Sn濃度であり、目的とする特性が得られた。
比較例19では、最終焼鈍の際のCO/CO2比を0.1未満として雰囲気の酸化性が強くしたところ、表面酸化膜中のSn濃度は低いが厚く不均一な酸化膜が生成し、酸洗で酸化膜を溶解した後の表面に顕著な凹凸が生じた。次工程の最終圧延で、この凹凸に起因して材料が破断し、特性を評価できなかった。表中「*1」は評価不能を示す。
比較例23及び24では、最終焼鈍の際のCO/CO2比が0.3を超え雰囲気の還元性が強くなりすぎ、表面酸化膜のSn濃度が1.5%を超えた。この酸化膜は脆いため銅箔と活物質との結合性が阻害され、充放電の繰り返しストレスを受けた際に活物質が銅箔から剥離し、サイクル寿命が600回に満たなかった。
In Comparative Example 19, Invention Examples 20 to 22, and Comparative Examples 23 and 24, the effect of Sn concentration in the surface oxide film is examined.
Invention Examples 20 to 22 are Sn concentrations in the surface oxide film within the range of the present invention, and the intended characteristics were obtained.
In Comparative Example 19, when the CO / CO 2 ratio in the final annealing was made less than 0.1 and the atmosphere was strongly oxidized, a thick and non-uniform oxide film was formed although the Sn concentration in the surface oxide film was low, Remarkable irregularities were formed on the surface after the oxide film was dissolved by pickling. In the final rolling of the next process, the material broke due to the unevenness, and the characteristics could not be evaluated. “* 1” in the table indicates that evaluation is impossible.
In Comparative Examples 23 and 24, the CO / CO 2 ratio at the time of final annealing exceeded 0.3, the reducibility of the atmosphere became too strong, and the Sn concentration of the surface oxide film exceeded 1.5%. Since this oxide film is brittle, the bondability between the copper foil and the active material is inhibited, and the active material peels from the copper foil when subjected to repeated charge / discharge stress, and the cycle life is less than 600 times.
比較例25、発明例26〜30及び比較例31では、最終圧延加工度の効果を検討している。
発明例26〜30は適正な最終圧延加工度を採用したため、目的とする特性が得られた。発明例26は加工度がやや低く、発明例30は加工度がやや高いため熱履歴後の引張強さにやや劣る。
比較例25は加工度が80%未満であったため、圧延上がりの引張強さが480MPa未満となり、この影響により、300℃で30分間の熱履歴を受けた後の引張強さが400MPaを下回った。比較例31は加工度が98%を超えたため、焼鈍軟化が促進され300℃で30分間の熱履歴を受けた後の引張強さが400MPaを下回った。比較例25及び31の銅箔は、充放電の繰り返しストレスを受けて変形し、銅箔表面に塗布された活物質が剥離した。その結果、サイクル寿命が600回に満たなかった。
In Comparative Example 25, Invention Examples 26 to 30, and Comparative Example 31, the effect of the final rolling work degree is examined.
Inventive Examples 26 to 30 adopted an appropriate final rolling degree of processing, and thus intended characteristics were obtained. Inventive Example 26 has a slightly low workability, and Inventive Example 30 has a slightly high workability, so it is slightly inferior in tensile strength after heat history.
Since the working degree of Comparative Example 25 was less than 80%, the tensile strength after rolling was less than 480 MPa, and due to this influence, the tensile strength after receiving a heat history at 300 ° C. for 30 minutes was less than 400 MPa. . Since the working degree of Comparative Example 31 exceeded 98%, annealing softening was promoted, and the tensile strength after receiving a thermal history at 300 ° C. for 30 minutes was less than 400 MPa. The copper foils of Comparative Examples 25 and 31 were deformed by repeated charge / discharge stress, and the active material applied to the copper foil surface was peeled off. As a result, the cycle life was less than 600 times.
1:封口板
2:絶縁ガスケット
3:正極リード
4:上部絶縁板
5:正極板
6:負極板
7:セパレータ
8:電池ケース
9:負極リード
10:下部絶縁板
1: Sealing plate 2: Insulating gasket 3: Positive electrode lead 4: Upper insulating plate 5: Positive electrode plate 6: Negative electrode plate 7: Separator 8: Battery case 9: Negative electrode lead 10: Lower insulating plate
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| JP5739044B1 (en) * | 2014-06-16 | 2015-06-24 | 株式会社Shカッパープロダクツ | Copper alloy foil for negative electrode current collector of secondary battery, method for producing copper alloy foil for negative electrode current collector of secondary battery, negative electrode for secondary battery, and secondary battery |
| JP6440656B2 (en) * | 2016-07-12 | 2018-12-19 | 古河電気工業株式会社 | Electrolytic copper foil |
| JP2018028120A (en) * | 2016-08-16 | 2018-02-22 | 古河電気工業株式会社 | Copper alloy foil |
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| KR102781999B1 (en) | 2016-10-12 | 2025-03-14 | 에스케이넥실리스 주식회사 | Easily Handleable Electrolytic Copper Foil, Electrode Comprising The Same, Secondary Battery Comprising The Same, and Method for Manufacturing The Same |
| JP6648088B2 (en) | 2017-10-19 | 2020-02-14 | Jx金属株式会社 | Rolled copper foil for negative electrode current collector of secondary battery, secondary battery negative electrode and secondary battery using the same, and method of producing rolled copper foil for negative electrode current collector of secondary battery |
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| JP3760668B2 (en) * | 1999-04-19 | 2006-03-29 | 日立電線株式会社 | Secondary battery current collector |
| JP4242997B2 (en) * | 2000-03-30 | 2009-03-25 | 三洋電機株式会社 | Non-aqueous electrolyte battery |
| JP2003007305A (en) * | 2001-04-19 | 2003-01-10 | Sanyo Electric Co Ltd | Electrode for secondary lithium battery and secondary lithium battery |
| JP3911184B2 (en) * | 2002-03-28 | 2007-05-09 | 日鉱金属株式会社 | Copper alloy rolled foil |
| JP2006049237A (en) * | 2004-08-09 | 2006-02-16 | Hitachi Cable Ltd | Anode material for lithium ion battery |
| JP4749780B2 (en) * | 2005-07-06 | 2011-08-17 | 三井住友金属鉱山伸銅株式会社 | Copper alloy rolled foil |
| JP4677381B2 (en) * | 2006-08-08 | 2011-04-27 | Jx日鉱日石金属株式会社 | Metal materials for printed wiring boards |
| JP4428715B2 (en) * | 2006-09-29 | 2010-03-10 | 日鉱金属株式会社 | Copper alloy foil |
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2009
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