JP5350658B2 - Light emitting element - Google Patents

Abstract

The purpose of the invention is to provide a light emitting device that is improved in intensity of light emitted from a light outgoing surface and has excellent heat releasing property, the light emitting device according to the present invention includes an LED chip 501 mounted on a substrate and an insulating section 509 formed on a front surface of the substrate and made of light-transmitting resin. The insulating section 509 has a multilayer structure constituted of a titanium dioxide-added resin layer 509 c to which titanium dioxide is added and a titanium dioxide-free resin layer 509 b to which no titanium dioxide is added.

Description

  The present invention relates to a light emitting element suitable for irradiating a thin display body such as a liquid crystal panel from the side surface and a method for manufacturing the light emitting element.

  Conventionally, as a backlight light source for irradiating a display panel such as a liquid crystal from the side, a light emitting element such as a side light emitting diode (hereinafter referred to as “LED”) as disclosed in Patent Document 1 or the like. Is used.

  As shown in FIG. 42, the light emitting element 101 includes a chip substrate 114 on which a die bond pattern 108 and an electrode terminal 109 are formed, an LED chip 103 mounted on the chip substrate 114, and an LED chip 103 and an electrode terminal 109. A connecting wire 116, a reflecting frame 123 that is disposed on the chip substrate 114 so as to surround the periphery of the LED chip 103, and has an opening on a part of the upper surface and the side wall, and an inner peripheral surface of the side wall of the reflecting frame 123 A reflection surface 122, a light transmission resin body 119 formed in the reflection frame 123 on the chip substrate 114, and having a side wall side opening as a light emission surface 117, and a reflection covering the upper surface of the light transmission resin body 119. A film 121. The light emitting element 101 is configured such that light emitted from the LED chip 103 is reflected by the reflecting surface 122 and the reflecting film 121 of the reflecting frame 123 and is emitted outward from the light emitting surface 117 formed on one side surface. Has been.

  In addition, if the escape of heat generated in the light emitting element is poor, the members in the element are damaged by heat, leading to a decrease in light emission efficiency and damage to the element itself, and long-term reliability cannot be ensured. Therefore, development of a light emitting element excellent in heat dissipation is demanded.

  For example, Patent Document 2 discloses a light emitting element substrate having excellent heat dissipation.

  With reference to FIG. 15 and FIG. 16, the structure of the light emitting element use substrate of patent document 2 is demonstrated.

  FIG. 15 is a cross-sectional view illustrating a configuration of a conventional light emitting device 1000 including the light emitting device substrate.

  16 is a diagram showing the shapes of the conductor pattern 1008 and the wiring layer 1009 of the light emitting element substrate shown in FIG.

  In the substrate for a light emitting element, as shown in FIG. 15, a first electrode 1004 and a second electrode 1005 are formed as a conductor pattern 1003, and one electrode of an LED chip (not shown) is a first electrode. The other electrode is connected to the second electrode 1005.

  The first electrode 1004, the interlayer connection pattern 1006, the protective metal layer 1007, and the conductor pattern 1008 are continuously formed from the lower side of the reflector 1001 to the lower side of the position where the LED chip is mounted. The conductor pattern 1008 is formed in the wiring layer 1009.

  Then, the heat transfer area for transferring heat generated by the reflector 1001 of the metal laminate laminated by the first electrode 1004, the interlayer connection pattern 1006, the protective metal layer 1007, and the conductor pattern 1008 is increased. That is, as shown in FIG. 16, the area of the conductor pattern 1008 is increased.

  Thus, heat generated by the reflector 1001 can be efficiently transferred to the protective metal layer 1012 and the lowermost metal substrate 1010 via the protective metal layer 1002 and the metal laminate.

Patent Document 3 discloses a configuration that improves the light reflectance of the surface resin by adding an inorganic filler to the surface resin of the multi-wiring board on which the LED chip is mounted and whitening the surface resin. It is disclosed.
Japanese Patent Laying-Open No. 2005-223082 (Publication date: August 18, 2005) JP 2004-282004 A (publication date October 07, 2004) Japanese Patent Laying-Open No. 2005-235778 (published on September 2, 2005)

  In general, the intensity of light emitted from the LED chip 103 is maximized in the upward direction indicated by the arrow 118 in FIG. However, in the configuration of Patent Document 1 described above, the reflective film 121 is formed so as to face the light emitting surface of the LED chip 103 in the light emitting direction from the LED chip 103. For this reason, the light emitted from the LED chip 103 is repeatedly reflected between the reflective film 121 and the chip substrate 114, and most of the light emitted from the LED chip 103 is efficiently emitted from the light emitting surface 117 to the outside. Instead, it is absorbed by the reflective film 121 and the chip substrate 114.

  Furthermore, in the configuration of the light emitting element 101 of Patent Document 1, the light emitting surface 117 is formed at a position shifted by 90 degrees from the upward direction (arrow 118) where the intensity of emitted light from the LED chip 103 is maximized. For this reason, the light emitted from the LED chip 103 cannot be efficiently guided to the light emitting surface of the light emitting element 101 and extracted outside the element. In addition, when phosphor particles are used as the material of the light transmissive resin body 119, light that is not converted into fluorescence or light that is not scattered is repeatedly reflected between the reflective film 121 and the chip substrate 114, many of which Is absorbed by the reflective film 121 and the chip substrate 114. Furthermore, since the degree of scattering varies depending on the amount of phosphor particles, the light extraction efficiency is not stable.

  In recent years, along with the thinning of electronic devices such as mobile phones equipped with a liquid crystal panel, there has been a demand for thinning of side-emitting LEDs used for liquid crystal backlights. However, in the conventional structure shown in Patent Document 1, the loss due to the light absorption / leakage increases as the distance between the upper surface of the LED chip 103 and the reflective film 121 becomes shorter. There was a problem that the efficiency further decreased.

  Therefore, there is a demand for the development of a side-emitting LED that can be thinned without causing a decrease in light extraction efficiency.

  Further, as shown in FIGS. 15 and 16, the light emitting device of Patent Document 2 is formed so that the metal reflector 1001 surrounds the entire device side surface when the mounting surface on which the LED chip is mounted is bottomed. Absent. For this reason, the light emitted from the LED chip to the periphery leaks to the outside of the element from the side surface where the metal reflector 1001 is not formed.

  An insulating layer 1011 is formed in a region other than the formation region of the first electrode 1004 and the second electrode 1005 on the mounting surface. For this reason, most of the light emitted from the LED chip toward the substrate side passes through the resin insulating layer 1011 and leaks from the back surface side to the outside of the element.

  Since the light leaked as described above is absorbed by other members outside the light emitting element, a great amount of energy is lost as a whole. For this reason, the light emitted from the LED chip cannot be taken out efficiently, and there is a problem that the intensity of the emitted light from the light emitting surface is lowered.

  Moreover, in the structure of patent document 3, the addition of an inorganic filler will promote the oxidation of the peripheral member by a photocatalytic effect, or will cause the bad effect by the hygroscopic effect of an inorganic filler. Further, Patent Document 3 does not mention anything about the limitation on the amount of inorganic filler added.

  The present invention has been made in view of the above problems, and its purpose is to suppress light leakage, improve the intensity of light emitted from the light exit surface, and improve heat dissipation for a long time. It is in providing the light emitting element excellent in reliability, and its manufacturing method.

Light-emitting device according to the reference of the present invention includes a LED chip mounted on the base plate, and an insulating portion made of a light transparent resin formed on the surface of the substrate, the insulating portion is the light incident side From the above, the light-reflective filler-free resin layer containing no light-reflective filler and the light-reflective filler-added resin layer containing the light-reflective filler are laminated, and the light-reflective filler added resin layer is covered with the light-reflective filler additive-free resin layer, it has such exposed to the atmosphere.

  According to said structure, the light radiate | emitted from the said LED chip and injecting into the said insulation part can be reflected in the said light reflective filler addition area | region. For this reason, when the light enters the insulating portion and is reflected by the peripheral member, light that is partially absorbed and attenuated can be reduced, and light utilization efficiency and heat dissipation can be improved.

In order to solve the above-described problem, a light emitting device according to the present invention is electrically insulated by a first metal portion formed on a mounting surface of a substrate as a mounting surface metal reflective film, and the first metal portion and the insulating portion. At least one second metal part formed on the mounting surface, mounted on the first metal part, and one electrode is electrically connected to the first metal part, and the other electrode is The LED chip electrically connected to the second metal part and the first metal part are integrally formed so as to surround the mounting surface, and the light emitted from the LED chip is reflected to emit light. A light-transmitting encapsulant formed so as to fill the region surrounded by the metal reflector and the metal reflector that leads to the light emission surface provided in the direction, and to seal the LED chip with the door, including the insulating portion, from the light incident side, a light reflective filler Not a light reflective filler additive-free resin layer has a stacked structure in which a light-reflective filler-added resin layer is laminated comprising the light reflective filler, in the area surrounded by the metallic reflecting plate, said first It is formed so as to surround the periphery of two metal parts, and the light reflective filler-added resin layer is covered with the light reflective filler-free resin layer and is not exposed to the atmosphere .

  According to said structure, the metal reflecting plate which reflects the emitted light from the said LED chip, and guides it to the light-projection surface provided in the said light-projection direction stands in the light-projection direction of the said LED chip, It is formed so as to surround the entire periphery of the LED chip. For this reason, the light emitted from the LED chip to the surroundings can be reflected by the metal reflector and efficiently guided to the light emitting surface. Thereby, the light leakage from the element side surface can be suppressed, and the intensity of the emitted light from the light emitting surface can be improved. Moreover, since the inner peripheral surface of the said metal reflecting plate is closely_contact | adhered to the said translucent sealing body, the problem that a metal peels from the inner peripheral surface side of this metal reflecting plate can be suppressed. Thereby, the internal peripheral surface of the said metal reflecting plate can be protected in the stable state by the said translucent sealing body.

  Further, the first metal layer has a function as a mounting surface metal reflective film, and is formed so as to surround the outer periphery of the second metal layer through an insulating portion formed on the outer periphery of the second metal layer. Has been. For this reason, the first metal layer as the mounting surface metal reflective film can be formed on the entire surface outside the insulating portion forming region on the mounting surface of the substrate while ensuring insulation from the second metal layer. it can. Thus, since the first metal layer as the mounting surface metal reflective film can be formed over a wide range on the mounting surface, most of the light traveling from the LED toward the substrate side is converted into the first metal layer. The metal part can lead to the light exit surface side more efficiently. For this reason, the amount of light absorbed by the substrate can be further reduced, and the intensity of light emitted from the light exit surface can be further improved.

  Furthermore, the insulating part is formed of a resin containing a light reflective filler. For this reason, the light emitted from the LED chip and incident on the insulating portion can be reflected by the light reflective filler. For this reason, when the light enters the insulating portion and is reflected by the peripheral member, light that is partially absorbed and attenuated can be reduced, and the intensity of light emitted from the light exit surface can be improved.

Moreover, the light-reflective filler of titanium dioxide oxidizes, for example, a conductive layer formed in the lower layer of the insulating portion by a photocatalytic reaction in the presence of oxygen. For this reason, it is desirable to keep away from the atmosphere containing oxygen, without adding the said light reflective filler to the mounting surface.

According to said structure, the said insulating part is from the light-incidence side, the light reflective filler additive-free resin layer which does not contain the said light reflective filler, and the light reflective filler addition resin layer containing the said light reflective filler, Have a laminated structure. Thereby, in the presence of oxygen, while suppressing problems such as metal reflection plate due to photocatalytic reaction of the light reflective filler, translucent sealing body, oxidation of the insulating portion, peeling of the translucent sealing body, etc. The light utilization efficiency can be improved.

  In the above configuration, it is desirable to use aluminum oxide, silicon oxide, or titanium dioxide as the light reflective filler. Among these, titanium dioxide is particularly preferable because of its high light reflectance and low cost.

  As described in Patent Document 2, titanium dioxide is added to the resin used for the reflecting member, and has a function of whitening and increasing the reflectance.

  However, when titanium dioxide is used as the light-reflective filler, there is a risk of oxidizing the metal reflector, the light-transmitting encapsulant, and the insulating part during the light-emitting operation due to the photocatalytic reaction in the presence of oxygen ( Oxygen passes through the sealing resin and is absorbed by the peripheral members and contains air and moisture as a source). On the other hand, when other reflective fillers such as aluminum oxide and silicon oxide are used, the above photocatalytic action does not occur, but aluminum oxide and silicon oxide are hygroscopic. For this reason, there is a risk that the air and moisture absorbed in the sealing step of the translucent sealing body are vaporized by heat during the light emitting operation and the translucent sealing body is peeled off. Here, the light-transmitting sealing body that seals the LED chip is preferably light-tight and air-tight. However, a resin having better light resistance generally tends to transmit gas such as the atmosphere, and the atmosphere / moisture may reach the mounting surface.

  Therefore, when adding only to the surface layer in the vicinity of the mounting surface, it is desirable to reduce the addition amount of the light-reflecting filler, so that the light reflectance can be improved while reducing the amount of active oxygen to be oxidized. Therefore it is desirable.

In the above configuration, the water, to avoid contact with air, the etc. interfacial adhesion layer between the mounting surface and the insulating portion and the other member, it is preferable to adopt a configuration without the light reflective filler. Since the interface with the adhesive layer and other members easily retains moisture and air, it is desirable not to contact the light reflective filler.

  Further, as the resin of the insulating part to which titanium dioxide is added, a resin that hardly transmits gas such as the atmosphere such as an epoxy resin is generally used. For this reason, it is particularly preferable to provide a reflective filler-added resin layer inside the resin of the insulating portion.

  In the above configuration, the light reflective filler desirably reflects light in a wavelength region of 400 nm or more and 850 nm or less, that is, visible light.

  In the above configuration, the light reflectance of the resin containing the light reflective filler in the wavelength region is desirably 50% or more.

  The titanium dioxide-containing RCC resin (resin coated copper) does not have a light reflectivity of 100%, but the remaining 50% to 70% and the remainder transmits light. For this reason, when the titanium dioxide-containing RCC resin is used, the light is scattered and spread inside the RCC resin, and the light leaks to the adhesive layer with other members. If there is a light-reflective filler-added resin layer in all layers of the RCC resin, the oxygen absorbed through the other member or the other member and the leaked light are caused, for example, by RCC resin, the other member, or the adhesive layer. Therefore, the light-reflecting filler-added resin layer (region) is preferably formed in a thin layer.

  In order to solve the above-described problem, the method for manufacturing a light-emitting element according to this embodiment includes a step (a) in which the step of forming the insulating portion forms the resin layer without addition of the light-reflecting filler, and the light-reflecting property A step (b) of forming a filler-added resin layer, wherein the light-reflective filler-free resin layer and the light-reflective filler-added resin layer are laminated on the metal foil in a desired order. It is characterized by forming.

  For example, the laminated structure may be attached to the metal plate on which the first metal portion and the second metal portion are formed by hot pressing from the back surface side (the side opposite to the light emitting surface).

  In the above configuration, it is desirable that the laminated structure including the light-reflective filler-free resin layer and the light-reflective filler-added resin layer is formed by a heating process performed in an inert gas atmosphere.

  According to said structure, since the quality change (yellowing change) of resin used for each said insulation part can be prevented, the said effect can be exhibited effectively, without the light absorption by quality change resin.

In the above configuration, the translucent sealing member for sealing the LED chip so as to fill a space surrounded by the substrate and the metallic reflecting plate is formed by a thermal curing step in an inert gas atmosphere It is desirable.

  In the current production lineup of RCC resin, the thickness of the resin layer is 3 μm at the thinnest. For this reason, it is desirable to put the titanium dioxide-added resin layer at a distance of at least 3 μm from the adhesive layer because of the limit of controllability of the resin layer coating thickness.

  In addition, since the resin absorbs light, it is desirable to form the light-reflective filler-free resin layer as thin as possible in a layer shape, and to form a light-reflective filler-added resin layer in the lower layer.

  It is desirable to use RCC resin as the resin. The RCC resin is in the form of a paste in which the liquid is slightly solidified, and a light reflective filler such as titanium dioxide is mixed with the RCC resin in a liquid state. For this reason, it is difficult to control the position of the light-reflective filler-added resin layer containing the light-reflective filler with a single-layer RCC resin. Therefore, first, the light reflecting filler-added resin layer is solidified, and then the RCC resin not containing the light reflecting filler is applied again to form a light reflecting filler-free resin layer, thereby mounting surface. It is possible to prevent the surface from containing a reflective filler.

Thus, by using the resin containing the light reflective filler in the insulating part, the light emitted from the LED chip and incident on the insulating part can be reflected by the light reflective filler. For this reason, when the light enters the insulating portion and is reflected by the peripheral member, light that is partially absorbed and attenuated can be reduced, and light utilization efficiency and heat dissipation can be improved .

The light emitting device of the present embodiment is formed on the mounting surface, formed on the mounting surface of the substrate and electrically insulated by the first metal portion as the mounting surface metal reflective film and the first metal portion and the insulating portion. At least one second metal part, mounted on the first metal part, and one electrode is electrically connected to the first metal part, and the other electrode is electrically connected to the second metal part. The LED chip to be connected and the first metal part are formed so as to surround the mounting surface, and the light emitted from the LED chip is reflected to the light emitting surface provided in the light emitting direction. And a light-transmitting sealing body that fills a region surrounded by the substrate and the metal reflecting plate and seals the LED chip, and the insulating portion includes: No light reflective filler added from the light incident side It has a laminated structure in which a fat layer and a light-reflective filler-added resin layer containing the light-reflective filler are laminated, and surrounds the second metal part in a region surrounded by the metal reflector. The light-reflecting filler-added resin layer is covered with the light-reflecting filler-free resin layer and is not exposed to the atmosphere, thereby improving the intensity of light emitted from the light exit surface. Can be achieved.

[First Embodiment]
An embodiment of the present invention will be described below with reference to FIGS. 1 to 5 and 38 to 41.

  FIG. 1 is a perspective view showing a configuration example of the light emitting element 500 of the present embodiment.

  FIG. 2 is a cross-sectional view illustrating a detailed configuration of the light emitting element 500.

  FIG. 3 shows an example of an etching pattern between the metal reflector 502 and each layer constituting the laminated substrate 506. 3, (a) shows the first layer 521, (b) shows the second layer 522, (c) shows the third layer 523, (d) shows the fourth layer 524, (e ) Shows the fifth layer 525, (f) shows the sixth layer 526, (g) shows the seventh layer 527, and (h) shows the eighth layer 528.

  As shown in FIG. 1, the light emitting device 500 according to the present embodiment includes an LED chip 501 mounted on a multilayer substrate 506 and a light emitting direction of the LED chip 501, and the entire periphery of the LED chip 501. A metal reflector 502 that is provided on the mounting surface so as to surround the LED chip 501 and reflects the light emitted from the LED chip 501 and guides it to the light emission surface provided in the light emission direction. A translucent sealing body 510 is formed so as to fill the region surrounded by the metal reflector 502 above.

  The light emitting element 500 is configured to be mounted so that a light emitting surface faces a side surface of a liquid crystal panel provided on a display screen of a mobile phone or the like. That is, the light emitting element 500 is configured to be used as a backlight that irradiates the liquid crystal panel from the side surface.

  The LED chip 501 is a semiconductor chip made of a GaN-based semiconductor material or the like, and emits blue light from the light emitting surface 501a. The LED chip 501 is mounted by die bonding on a die bond area / electrode common portion (first electrode portion, mounting surface metal reflective film) 507 described later so that the light emitting surface 501a is on the upper side. The LED chip 501 includes an electrode terminal (not shown) including an anode electrode and a cathode electrode on the light emitting surface 501a.

  The laminated substrate 506 has a laminated structure in which a surface layer 503, an intermediate layer 504, and a back layer 505 are formed from the mounting surface side. As shown in FIG. 2, the multilayer substrate 506 has a multilayer structure including a surface layer 503 having a two-layer structure, an intermediate layer 504 having a three-layer structure, and a back layer 505 having a two-layer structure. The multilayer substrate 506 having the above configuration is laminated on the metal reflector 502 and is formed integrally with the metal reflector 502.

  Here, a detailed configuration of the multilayer substrate 506 will be described with reference to FIGS. 2 and 3.

  First, the configuration of the surface layer 503 will be described.

  The surface layer 503 has a two-layer stacked structure in which a second layer 522 and a third layer 523 are stacked from the mounting surface side.

  The surface of the second layer 522, that is, the surface of the multilayer substrate 506 is used as a mounting surface on which the LED chip 501 is mounted.

  On the second layer 522 (mounting surface), as an electrode terminal for supplying a drive current to the LED chip 501, a die bond area / electrode common part (first metal part) 507 and an island electrode (first electrode) connected to the LED chip 501 respectively. 2 metal parts) 508. An insulating portion 509 for electrically insulating the island electrode 508 from the die bond area / electrode common portion 507 is formed so as to surround the outer periphery of the island electrode 508.

  The die bond area / electrode common part 507 is connected to the cathode electrode of the LED chip 501 by wire bonding (wire 511). The die bond area / electrode common part 507 and the metal reflector 502 are made of the same kind of metal (copper in this embodiment) and are integrally formed.

  The material of the die bond area / electrode common portion 507 and the metal reflector 502 is not limited to copper, and may be configured using other metals, but copper, silver, It is desirable to use gold or nickel.

  That is, in this embodiment, the metal reflector 502 can be integrally formed with the die bond area / electrode common portion 507 as the mounting surface metal reflective film by a method such as plating without using an adhesive. . For this reason, the heat at the time of light emission of LED chip 501 does not accumulate in resin etc. with low heat conductivity like the past, but the die bond area electrode formed on the surface of the substrate in which metal reflector 502 is integrally formed It is conducted to the common portion 507 and can be radiated effectively to the back side of the substrate. In addition, by integrally forming the metal reflector 502 and the die bond area / electrode common portion 507 in this way, the proportion of metal in the entire element increases, so that not only heat dissipation but also light leakage prevention is achieved. The structure is also improved.

  Note that the die bond area / electrode common portion 507 is formed with a dicing margin secured in order to prevent damage caused by burrs when the light emitting element 500 is diced, as will be described in detail later.

  On the other hand, the island electrode 508 serving as the other electrode terminal is made of copper and connected to the anode electrode of the LED chip 501 by wire bonding (wire 511). In addition, an island electrode 508 is formed in an island whose outer periphery is surrounded by an insulating portion 509 in a region surrounded by the metal reflector 502 in the second layer 522 as a mounting surface.

  In addition, the shape of the island electrode 508 is not particularly limited to a shape other than that shown in this embodiment mode, such as a triangle, a square, or a rectangle, but the corner has a roundness so that electric field concentration can be avoided. The shape is more preferable. Further, an element and a circuit for adjusting the driving condition of the LED chip may be provided on the island electrode 508. For example, a protective circuit element that limits the current that flows through the LED chip, such as a Zener diode, may be provided. These are similarly applied to embodiments other than the present embodiment.

  In the present embodiment, as described above, the cathode electrode of the LED chip 501 is connected to the die bond area / electrode common portion 507 and the anode electrode is connected to the island electrode 508. However, the present embodiment is not limited to this, and the anode electrode of the LED chip 501 may be connected to the die bond area / electrode common portion 507 and the cathode electrode may be connected to the island electrode 508.

  The die bond area / electrode common portion 507 and the island electrode 508 have different potentials, and one of the anode electrode and the cathode electrode of the LED chip 501 is connected to each other according to the design.

  The insulating part 509 is made of an RCC resin (resin coated copper) such as an epoxy resin, and is formed so as to electrically insulate the island electrode 508 from the die bond area / electrode common part 507. Furthermore, a light reflective filler that reflects visible light in a wavelength region of 400 nm to 850 nm is added to the epoxy resin. The epoxy resin desirably has a light reflectance of 50% or more in the wavelength region. As the light reflective filler, aluminum oxide, silicon oxide, titanium dioxide or the like having high light reflectance can be used. Among these, titanium dioxide is particularly preferable because of its high light reflectance and low cost.

  However, when titanium dioxide is used as the light-reflective filler, there is a risk of oxidizing the metal reflector 502, the light-transmitting encapsulant 510, and the insulating portion 509 during the light-emitting operation due to a photocatalytic reaction in the presence of oxygen. (Oxygen passes through the sealing resin and is absorbed by the peripheral members and is contained in the atmosphere and moisture). On the other hand, when other reflective fillers such as aluminum oxide and silicon oxide are used, the above photocatalytic action does not occur, but aluminum oxide and silicon oxide are hygroscopic. For this reason, there is a risk that the air and moisture absorbed in the sealing step of the translucent sealing body 510 are vaporized by heat during the light emitting operation, and the translucent sealing body 510 is peeled off. Here, the light-transmitting sealing body 510 that seals the LED chip 501 is preferably light-tight and air-tight. However, a resin having better light resistance generally tends to transmit gas such as air, and air and moisture may reach the mounting surface.

  Therefore, when adding only to the surface layer in the vicinity of the mounting surface of the LED chip 501, it is desirable to reduce the amount of the light-reflecting filler, particularly, thereby reducing the amount of active oxygen to be oxidized and reducing the light reflectance. Can be improved.

  Therefore, the insulating portion 509 has a laminated structure in which a light-reflective filler-free resin layer that does not include the light-reflective filler and a light-reflective filler-added resin layer that includes the light-reflective filler are stacked from the light incident side. It is desirable to have Here, since the epoxy resin absorbs light, the light-reflective filler-free resin layer that does not include the light-reflective filler is formed as thin as possible, and a light-reflective filler containing a light-reflective filler is added to the lower layer. It is desirable to form a resin layer.

  Here, the process of forming the insulating portion 509 will be described below with reference to FIGS. First, as shown in FIG. 38 (a), a liquid RCC resin is applied on a Cu foil 509a called RCC resin (resin coated copper) and solidified slightly. A layer (light-reflective filler-free resin layer) 509b is formed. Next, as shown in FIG. 38 (b), on the titanium dioxide-free resin layer 509b, the liquid RCC resin added with titanium dioxide is applied and solidified in the same manner. A titanium dioxide-added resin layer (light reflective filler-added resin layer) 509c is formed. After solidifying the titanium dioxide-added resin layer 509c, a titanium dioxide-free resin layer 509b is further formed on the titanium dioxide-added resin layer 509c to form a laminated structure 509d as shown in FIG.

  As shown in FIG. 39, a die bond area / electrode common portion (first metal portion) 507 and an island electrode (second metal portion) 508 are further formed in the laminated structure 509d formed in the above-described steps. The metal plate 530 is pasted on the back surface (opposite to the light incident surface) and bonded to the metal plate 530 by hot pressing.

  As shown in FIG. 40, the copper foil 509a has a laminated structure 509d in which a titanium dioxide-free resin layer 509b and a titanium dioxide-added resin layer 509c are laminated, and a part thereof is a conductive layer (Cu Post layer) 509e.

  When a light reflective filler such as titanium oxide is added to the resin, the light reflective filler is mixed with the liquid RCC resin, but the light reflective filler settles in a single layer resin due to a specific gravity difference with the RCC resin. Therefore, it is difficult to control the position of the titanium dioxide-added resin layer (reflective filler-added resin layer) 509c that sinks on the Cu foil 509a side and includes the light-reflective filler. Therefore, first, a titanium dioxide-free additive resin layer 509b is formed on the copper foil 509a connected to the conductive layer 509e, and the titanium dioxide-added titanium oxide-containing resin layer 509b is added to the titanium dioxide-free resin layer 509b. A resin layer (reflective filler-added layer) 509c is formed and solidified, and the RCC resin not containing the light-reflective filler is applied again on the titanium oxide-added resin layer 509c to add a titanium oxide-free resin layer (reflective). By forming the non-reactive filler-added resin layer) 509b, it is possible to prevent the reflective surface from being included in the mounting surface. As described above, the RCC resin formed in this manner is attached to the back surface of the metal plate 530 on which the die bond area / electrode common portion 507 and the island electrode 508 are formed, and the insulating portion 509 is formed by hot pressing. The Thereafter, although detailed description is omitted, the potential of the die bond area / electrode common portion 507 and the island electrode 508 is conducted to the back side of the substrate through the conductive layer 509e in the lower layer of the insulating portion 509, and is common to the die bond area / electrode. A layer in which a conductive layer and a resin layer are arranged in a planar shape is laminated in multiple layers so as to provide insulation between the portion 507 and the island electrode 508, and a glass epoxy substrate with a through hole is attached, and the through hole is attached. Then, a back electrode is provided so as to energize the conductive layer, and a reflector is finally formed by etching the surface side of the metal plate so that the insulating portion 509 is exposed on the mounting surface.

  41 is an enlarged cross-sectional view showing a circled region of the cross-sectional view shown in FIG.

  In this way, by using an RCC resin containing a light reflective filler for the insulating portion 509, as shown in FIG. 41, the light emitted from the LED chip 501 and incident on the insulating portion 509 and the LED chip 501 are sealed. Light emitted from the phosphor contained in the light-transmitting sealing body 510 to be stopped and incident on the insulating portion 509 can be reflected by the light reflective filler. Therefore, when the light enters the insulating portion 509 and is reflected by the peripheral member, light that is partially absorbed and attenuated can be reduced, and light utilization efficiency and heat dissipation can be improved.

  In addition, even when titanium dioxide is used as the light reflective filler, the metal reflector 502 is formed by the photocatalytic reaction of the light reflective filler in the presence of oxygen, as compared with the structure added throughout the insulating portion 509. Further, it is possible to improve the intensity of light emitted from the light emitting surface while suppressing problems such as oxidation of the light-transmitting sealing body 510 and the insulating portion 509 and peeling of the light-transmitting sealing body 510.

  That is, the amount of light absorbed by the insulating portion 509 and the amount of light that passes through the substrate and is emitted from the back surface side to the outside can be reduced, so that light use efficiency and heat dissipation can be improved.

  The RCC resin is preferably formed by a heat process in an inert gas atmosphere. Thereby, since the quality change (yellowing change) of the resin used for the insulating portion 509 can be prevented, the above effect can be effectively exhibited without light absorption by the quality change resin.

  In particular, in the step of sealing the light-transmitting sealing body 510, when the resin of the light-transmitting sealing body 510 is injected, air and moisture are likely to enter the mounting surface. When heat curing is performed in this state, the insulating portion (RCC resin) 509 on the mounting surface is oxidized by the air and moisture present inside. For this reason, it is desirable to perform the heat curing process of the translucent sealing body 510 in an inert gas atmosphere.

  In the present embodiment, as shown in FIG. 2, when viewed from the direction perpendicular to the light emitting surface 501a of the LED chip 501, the interface between the insulating portion 509 and the die bond area / electrode common portion 507 is a straight line. Yes. However, in the region surrounded by the metal reflector 502 on the mounting surface, the insulating portion 509 surrounding the island electrode 508 is formed as narrow as possible, and the proportion of the die bond area / electrode common portion 507 as the mounting surface metal reflecting film is occupied. Increasing the number is preferable in terms of light utilization efficiency.

  Therefore, in summary, the second layer 522 is laminated so as to be integrated with the metal reflector 502, and is separated from the island electrode 508 by the die bond area / electrode common part 507 formed with the insulating part 509 interposed therebetween. An island electrode 508 surrounded by a portion 509 is formed.

  The third layer 523 is provided to electrically connect the second layer 522 and a fourth layer 524 described later, and the insulating portion 509 is formed when the insulating portion 509 is formed on the second layer 522. It also has the function of increasing the degree of adhesion.

  In order to avoid contact with moisture and air in the vicinity of the interface bonded to other members via the third layer 523 as the adhesive layer, a configuration in which a light reflective filler such as titanium dioxide is not included is used. It is desirable. That is, since the interface with the adhesive layer and other members easily retains moisture and air, it is desirable not to contact the light reflective filler. In addition, as the resin of the insulating portion 509 to which titanium dioxide is added, a resin that hardly transmits gas such as the atmosphere such as an epoxy resin is generally used. For this reason, it is particularly preferable to provide the titanium dioxide-added resin layer 509c inside the resin of the insulating portion 509.

  On the patterning surface where the insulating portion 509 is not formed and the die bond area / electrode common portion 507 and the island electrode 508 are formed, the thickness (step difference) etched only at the outer edges of the die bond area / electrode common portion 507 and the island electrode 508 is formed. ). In this case, even if an insulating material having the same thickness as the above-mentioned thickness is formed and bonded to the patterning surface in order to form the insulating portion 509, the adhesive surface may be peeled off because of the flat surface.

  Therefore, the contact area with the insulating portion 509 is increased by adding the third layer 523 including the conductive portion 531 and the conductive portion 532 having the etched outer edge inside the etched outer edge of the second layer 522. The adhesiveness of the insulating part 509 is improved.

  In order to ensure separation between the anode and the cathode, the conductive portion 532 immediately below the formation region of the island electrode 508 needs to be formed smaller than the island electrode 508.

  Next, the configuration of the intermediate layer 504 will be described.

  The intermediate layer 504 has a three-layer stacked structure in which a fourth layer 524, a fifth layer 525, and a sixth layer 526 are stacked from the mounting surface side. The intermediate layer 504 electrically connects the third layer 523 and the electrode portions formed in the through holes 515 and the through holes 516 formed in the fifth layer 525 and the sixth layer 526 described later. .

  The fourth layer 524 is formed so that the conductive portion 533 electrically connected to the die bond area / electrode common portion 507 and the conductive portion 534 electrically connected to the island electrode 508 are not in contact with each other. The conductive portion 533 is formed so as to cover the entire formation region of the conductive portion 531 in the third layer 523. Similarly, the conductive portion 534 is formed so as to cover the entire formation region of the conductive portion 532 in the third layer 523. Here, the conductive portion 533 and the conductive portion 534 are formed to ensure a dicing margin in order to prevent damage due to the generation of burrs when the light emitting element 500 is diced.

  The fifth layer 525 is formed so that the conductive portion 535 electrically connected to the die bond area / electrode common portion 507 and the conductive portion 536 electrically connected to the island electrode 508 are not in contact with each other.

  The sixth layer 526 is formed so that the conductive portion 537 electrically connected to the die bond area / electrode common portion 507 and the conductive portion 538 electrically connected to the island electrode 508 are not in contact with each other.

  The conductive portion 537 and the conductive portion 538 have through-holes 515 to prevent copper from leaking from the gaps between the through-holes 515 and 516 when copper plating 517 is applied to through-holes 515 and 516 described later. Further, the through hole 515 and the through hole 516 are formed to cover the through hole 516 with a width larger than the width in the surface direction of the through hole 516.

  Next, the back surface layer 505 will be described.

  The back surface layer 505 has a two-layer stacked structure in which a seventh layer 527 and an eighth layer 528 are stacked from the mounting surface side. The seventh layer 527 and the eighth layer 528 are made of a laminated base material such as a glass epoxy substrate, and are laminated using an adhesive tape 514a.

  A through hole 515 and a through hole 516 are formed in the back layer 505 having a two-layer structure of the seventh layer 527 and the eighth layer 528. The through-hole 515 and the through-hole 516 are parts for wiring to the cathode electrode connected to the die bond area / electrode common portion 507 and the anode electrode connected to the island electrode 508, respectively. The through hole 515 and the through hole 516 are provided on the lower layer side of the die bond area / electrode common portion 507 and the island electrode 508, respectively.

  The through hole 515 and the through hole 516 are arranged so as to be equidistant (d1 = d2) from the center c1 of the mounting surface so that the heat capacities of the anode and the cathode are the same, and are formed by drilling.

  This is because, when soldering to connect the back electrode (back electrode 518 and back electrode 519 described later) and the external electrode, the area of the back electrode on the anode side and the cathode side is different, and the heat capacity is different. When this occurs, the solder melts unevenly, resulting in poor soldering.

  Further, the separated portion of the back surface of the laminated substrate 506 between the anode electrode and the cathode electrode is arranged such that the anode electrode and the cathode electrode are equidistant (d3 = d4) with respect to the center c1 of the mounting surface. . However, the diameters of the through hole 515 and the through hole 516 may be determined according to the design so as to ensure a dicing margin and not cause defective plating.

  As described above, the back surface layer 505 in which the seventh layer 527 and the eighth layer 528 are laminated is attached to the sixth layer 526 by pressing through the adhesive tape 514b. Here, the through hole 515 and the through hole 516 are formed so as to be covered with the conductive portion 537 and the conductive portion 538 of the sixth layer 526.

  In this state, the through hole 515 and the through hole 516 are provided with copper plating 517 on the inner peripheral surfaces thereof. Further, since the conductive portion 537 and the conductive portion 538 of the sixth layer 526 are pasted so as to cover the through hole 515 and the through hole 516, the sixth layer 526 exposed inside the through hole 515 and the through hole 516. The conductive portion 537 and the conductive portion 538 are also plated with copper.

  A copper plating 517 is also formed on the lower surface of the eighth layer 528. Then, the copper plating 517 between the through hole 515 and the through hole 516 is etched. As a result, a back electrode 518 electrically connected to the die bond area / electrode common portion 507 and a back electrode 519 electrically connected to the island electrode 508 are formed. Silver plating 512 is formed on the back electrode 518 and the back electrode 519 when silver plating 512 is applied to a surface 502a on the inner peripheral side of a metal reflector 502 described later.

  The metal reflector 502 is configured to reflect the light emitted from the light emitting surface 501 a of the LED chip 501 and guide it to the light emitting surface 513. The metal reflector 502 is made of copper, and is integrally formed with the laminated substrate 506 on the mounting surface of the substrate so as to surround the LED chip 501 and the island electrode 508. Specifically, the metal reflector 502 is formed integrally with the die bond area / electrode common portion 507 so that the die bond area / electrode common portion 507 is partially exposed on the inner peripheral side.

  As shown in FIG. 2, the metal reflector 502 is formed such that the inner surface 502a of the side surface has an arcuate cross section in the stacking direction.

  The shape on the inner peripheral side of the metal reflector 502 is formed by etching a substantially rectangular parallelepiped metal reflector. Alternatively, the metal foil may be pressed to form a concave shape, and the concave shape may be etched to form the inner peripheral shape of the metal reflector 502. As a result, since the etching is performed in the already formed concave shape, the shape on the inner peripheral side of the metal reflector 502 can be more easily formed.

  Since the outer peripheral side surface of the metal reflector 502 is formed by wet etching, the shape of the cross section perpendicular to the laminated substrate 506 is formed in a gentle curve. Specifically, it is formed in a gentle curved shape that moves away from the LED chip 501 from the upper end to the lower end.

  The translucent sealing body 510 is formed so as to seal the internal space surrounded by the multilayer substrate 506 and the metal reflector 502. Moreover, the translucent sealing body 510 is made of resin, and silicone is used in this embodiment. The light emitted from the light emitting surface 501 a of the LED chip 501 is emitted from the light emitting surface 513 provided in the light emitting direction of the translucent sealing body 510.

  Silver plating 512 is applied to the upper surface of the metal reflector 502 and the inner peripheral surface 502a. Since silver has a very high reflectance of blue light, the light emitted from the LED chip 501 can be efficiently reflected and guided to the light emitting surface 513 by applying the silver plating 512 in this manner.

Note that the light-transmitting sealing body 510 has a function of protecting the LED chip 501, the wire 511, and the silver plating 512.
As described above, the metal reflector 502 is silver-plated 512 having a high blue light reflectance in order to efficiently reflect the light emitted from the LED chip 501 as described above. However, since silver is highly reactive, it is easily discolored and deteriorated by corrosive gas. Therefore, in order to prevent silver from reacting or peeling off even under adverse conditions, it is protected by the light-transmitting encapsulant 510.
In the present embodiment, as described above, the upper end portion of the light emitting direction from the LED chip 501 in the region surrounded by the mounting surface and the metal reflector 502 is opened as the light emitting surface 513, and thus the light transmitting property. A sealing body 510 is formed so as to fill the region. Furthermore, the maximum width of the cross section in the surface direction is larger than the maximum width in the surface direction of the light emitting surface 513 at the middle step between the light emitting surface 513 (upper end opening) and the mounting surface serving as the bottom surface in the above region. And the aperture is narrowed from the middle step toward the light exit surface 513.

Further, the inner peripheral surface 502a of the metal reflector 502 to which the silver plating 512 is applied, the die bonding area / electrode common portion 507, and the translucent sealing body 510 in the region of the island electrode 508 where the silver plating 512 is applied. The inner peripheral surface is roughened by unevenness.
The uneven shape is preferably a shape in which sharp peaks and valleys are continuous. As a method for roughening the surface, various methods conventionally used may be used. For example, a step of forming the metal reflector 502 by etching, or after the step, the metal reflector 502 and the second layer are used. In the etching process in which a nickel layer (not shown) provided between the metal layer 522 and the mounting surface is removed, the etchant and the etching conditions are changed from those in a normal case so that the surface of the metal reflector 502 is roughened. Can be formed.

  As described above, the silver plating 512 is highly reactive and easily deteriorates and corrodes. Therefore, it is necessary to protect the silver plating 512 and prevent peeling and deterioration. Therefore, in this embodiment, with the above structure, the light-transmitting sealing body 510 is closely attached to the silver plating 512, and the function of the light-transmitting sealing body 510 as a protective film is improved.

  The translucent sealing body 510 contains a phosphor. Thereby, the blue light emitted from the LED chip 501 is converted into yellow light in the translucent sealing body 510. Therefore, white light can be emitted from the light emission surface 513 by combining the blue light emitted from the LED chip 501 and the yellow light emitted from the phosphor.

  In addition, when obtaining white light from the blue light emitted from the LED chip 501, there are a method using a yellow phosphor and a method using a green phosphor and a red phosphor as described above. When the above is combined, light can be mixed to obtain white light.

  Next, the direction in which light emission from the LED chip 501 proceeds in the light-emitting element 500 having the above configuration will be described.

  First, it is desirable that the light emitted from the light emitting surface 501a of the LED chip 501 is efficiently emitted from the light emitting surface 513 without light loss. As described above, basically, the direction in which the intensity of light emitted from the light emitting surface 501a of the LED chip 501 is maximum is the upward direction perpendicular to the light emitting surface 501a. Therefore, since the light emitting surface 513 of the translucent sealing body 510 is provided so as to face the light emitting surface 501a of the LED chip 501, the arrangement of the light emitting surface 513 is most preferable.

  However, in detail, the light emitted from the light emitting surface 501a of the LED chip 501 is emitted radially from the light emitting surface 501a. In addition, the wavelength of the light is converted by the phosphor while the light is transmitted through the transparent sealing body 510, and the converted light is scattered and emitted. Therefore, the light travels in either direction of 180 degrees.

  Since the metal reflector 502 has a shape surrounding the entire circumference without being divided, the light traveling in the direction of the metal reflector 502 does not leak from the metal reflector 502 to the outside. Reflected at the surface 502 a of 502. And the said light is radiate | emitted from the light-projection surface 513 of the translucent sealing body 510 by repeating reflection once or several times.

  Since the phosphor has a property of sinking to the bottom, the phosphor tends to sink to the substrate side inside the translucent sealing body 510. However, in the light emitting element 500 of the present embodiment, light is reflected by the metal reflector 502 and can be advanced toward the substrate. Therefore, it is possible to effectively use the phosphor.

  On the other hand, not all the light emitted from the LED chip 501 reaches the light emitting surface 513, and light traveling in the direction of the laminated substrate 506 is also generated. Here, the light path in this case will be described in detail.

  When the multilayer substrate 506 is made of resin, the resin transmits light because the resin has light transmittance. As a countermeasure, it is conceivable to form a metal in any layer of the multilayer substrate and suppress light that is transmitted and leaks from the lamination direction (that is, the lamination direction opposite to the light emitting surface 501a side).

  However, in the manufacturing process, the light emitting element 500 is finally separated by dicing. The end surface formed by this dicing is in a state where the end of each layer is exposed. Therefore, the light traveling in the layer is emitted from the end face.

  That is, when the package of the light emitting element 500 is a substantially rectangular parallelepiped, the position of the center of gravity is the LED chip 501, and one surface is the light emitting surface 513. In this case, light leaks from four surfaces forming 90 degrees with the light emitting surface 513.

  In this embodiment mode, in order to suppress light leakage, the die bond area / electrode common portion 507 and the island electrode 508 are surrounded by the insulating portion 509 in the region surrounded by the metal reflector 502 on the mounting surface. The die bond area / electrode common portion 507 is formed widely in a region outside the insulating portion 509.

  Light leaking from the light emitting element becomes stray light, and becomes unnecessary light for the display of the liquid crystal panel when the light emitting element is incorporated as a light source such as a backlight of the liquid crystal panel. Moreover, even when unnecessary light is removed by the light source unit, light loss occurs. Therefore, the light emitted from the LED chip cannot be used efficiently.

  Further, since stray light is absorbed by other members outside the light emitting element, a great amount of energy is lost as a whole, and similarly, light emitted from the LED chip cannot be used effectively.

  The metal reflects light. Therefore, even if the light travels in the direction toward the multilayer substrate 506, the region where the metal is formed on the mounting surface surrounded by the metal reflector 502 is widened so that the light does not pass through the multilayer substrate 506. In addition, it is possible to increase the light that is reflected again and proceeds in the direction of the light exit surface 513. Further, light transmitted through the multilayer substrate 506 can be further suppressed.

  In the light emitting element 500 according to the present embodiment, the metal reflecting plate 502 that reflects the emitted light from the LED chip 501 and guides it to the light emitting surface 513 provided in the light emitting direction is the light emitting direction of the LED chip 501. Are formed so as to surround the entire periphery of the LED chip 501. For this reason, the light emitted from the LED chip 501 to the surroundings can be reflected by the metal reflector 502 and efficiently guided to the light emitting surface 513. Thereby, the light leakage from the side surface side of the light emitting element 500 can be suppressed, and the intensity of the emitted light from the light emitting surface 513 can be improved.

  Further, in a region surrounded by the metal reflector 502 on the mounting surface, a mounting surface metal reflective film is formed outside the formation region of the insulating portion 509 for insulating the island electrode 508 from the die bond area / electrode common portion 507. The die bond area / electrode common portion 507 is formed. For this reason, most of the light emitted from the upper LED chip 501 toward the substrate can be reflected by the die bond area / electrode common portion 507 and guided to the light emitting surface 513 provided in the light emitting direction. . Therefore, the amount of light absorbed by the substrate and the amount of light that passes through the substrate and leaks from the back surface side can be reduced. Thereby, the intensity | strength of the emitted light from a light-projection surface can be aimed at.

  Further, in the light emitting element 500 of the present embodiment, heat is generated in the LED chip 501 when the LED chip 501 emits light. However, the LED chip 501 is mounted on a widely formed die bond area / electrode common portion 507, and the die bond area / electrode common portion 507 is integrally formed with the metal reflector 502. For this reason, the light emitting element 500 according to the present embodiment is excellent in heat dissipation, and can reduce the occurrence of problems such as damage to each member constituting the element or the element itself due to heat.

  Further, since silicone used for the light-transmitting sealing body 510 of the light-emitting element 500 has low adhesiveness, it may be peeled off only by being attached to a flat surface.

  However, in the light emitting element 500 of the present embodiment, as described above, the metal reflector 502 has an opening at the upper end in the light emitting direction as the light emitting surface 513 between the opening and the bottom surface on the mounting surface side. It is squeezed narrower than the middle stage. For this reason, the translucent sealing body 510 is prevented from peeling off from the light emitting element 500.

  Furthermore, unevenness is formed on the inner peripheral surface of the metal reflecting plate 502 that comes into contact with the translucent sealing body 510 on which silver plating 512 is applied. Thus, since the contact area between the translucent sealing body 510 and the metal reflecting plate 502 is increased, the degree of adhesion between the translucent sealing body 510 and the metal reflecting plate 502 is increased, and the translucent sealing is performed. The problem that the stop 510 is peeled off is suppressed.

  As shown in FIG. 2, at least the back electrode 519 is desirably formed so as to cover the formation region of the insulating portion 509 formed so as to surround the island electrode 508 and the entire region corresponding to the stacking direction. . Thereby, it is possible to prevent light emitted from the LED chip 501 from the mounting surface to the inside of the substrate from passing through the substrate via the insulating portion 509 and escaping from the back side to the outside of the element. Thereby, the intensity | strength of the emitted light from the light-projection surface 513 can be aimed at.

  Thereby, the light transmitted through the multilayer substrate 506 is reflected and prevented from transmitting to the outside. Therefore, light leakage can be suppressed.

  The island electrode 508 is connected to the back electrode 519 through a conductive portion 534 formed in the fourth layer 524. Here, the conductive portion 534 is desirably formed so as to cover the entire region corresponding to the formation region of the insulating portion 509 and the stacking direction.

  In this manner, the insulating portion 509 is formed so as to be covered with the conductive portion 534 formed on the substrate mounting surface side from the back surface electrode 519, so that the insulating portion 509 can be more effectively passed from the back surface side to the outside of the element. The amount of light leaking can be reduced.

  In addition, the conductive portion 534 is sized so as to cover the insulating portion 509 formed so as to surround the island electrode 508 on the inner peripheral side of the metal reflector 502, and may be disposed so as to cover the insulating portion 509. preferable. As a result, the light transmitted through the multilayer substrate 506 is reflected and prevented from passing through to the back surface layer 505. Therefore, light leakage can be further suppressed.

  Further, the eighth layer 528 of the multilayer substrate 506 is provided with notches 539 at the four corners. Further, a copper plating 517 is also formed in the notch 539.

  In the case of the above configuration, when the light emitting element 500 is finally diced, the copper plating portion formed in the notch 539 is also diced. Therefore, a burr | flash generate | occur | produces in the copper plating part of the cut | disconnected side surface. For this reason, the metal whiskers generated from the burrs may come into contact with the metal reflector 502 and a short circuit may occur.

  Therefore, by arranging the largest outer edge of the outer peripheral surface of the metal reflector 502 inside the position where the notch 539 is formed, the occurrence of the short circuit as described above can be prevented.

Specifically, since the metal beard has a length equal to the thickness of the back surface layer 505 at the maximum, the distance between the large outer edge of the metal reflector 502 and the notch 539 is A, and the metal reflector 502 and the back layer When the thickness between 505 (the thickness from the second layer 522 to the seventh layer 527) is B, and the thickness of the back layer 505 is C,
A> C-B
It is desirable to design so that

  Moreover, what is necessary is just to determine the opening part of the metal reflecting plate 502, and the side surface shape of the outer peripheral side according to the shape and design which are easy to etch. FIG. 4 shows a metal reflector 541 having another outer peripheral shape. FIG. 5 shows a metal reflector 542 having an outer peripheral shape and an opening 543.

  Furthermore, it is desirable to reduce the outer size of the light emitting element as much as possible in order to reduce the size of the light source. On the other hand, in order to secure the light emitting area of the light source, it is desirable to design the opening of the metal reflector 502 as large as possible while realizing miniaturization of the element.

[Second Embodiment]
The following will describe another embodiment of the present invention with reference to FIGS. 6 to 14 and FIGS. 23 to 26. FIG. For convenience of explanation, the same members as those shown in the drawings of the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The light-emitting element 600 of this embodiment has a configuration in which, in addition to the effects exhibited by the light-emitting element 500 of the first embodiment, the light leakage prevention effect is further improved, and the number of laminated substrates 606 is reduced. . Below, it demonstrates focusing on the structure and effect | action which show | play these effects.

  In the light emitting device 500 of the first embodiment, the insulating portion 509 has a straight line when the interface with the die bond area / electrode common portion 507 is viewed from the direction perpendicular to the light emitting surface.

  In the present embodiment, as shown in FIGS. 6, 7, and 23, the island electrode 608 is electrically insulated from the die bond area / electrode common portion 607 in the region surrounded by the metal reflector 502 on the mounting surface. Since the insulating portion 609 is formed in an annular shape so as to surround the outer periphery of the island electrode 608, the island electrode 608 can be insulated from the die bond area / electrode common portion 607 with a smaller area.

  In addition, since the die bond area / electrode common portion 607 is formed so as to surround the insulating portion 609 for electrically insulating the island electrode 608 from the die bond area / electrode common portion 607, the insulating portion 609 and the metal reflector 502 are formed. A die bond area / electrode common portion 607 is interposed between the two. For this reason, even if a positional deviation occurs in the formation process of the metal reflector 502, the shape and area of the insulating portion 609 are not affected, and the amount of light leakage from the insulating portion 609 varies. Absent. Furthermore, the separation distance for insulating the metal reflector 502 from the die bond area / electrode common portion 607 and the second island electrode 608 can be minimized without worrying about alignment errors in the process. The area can be designed to the minimum. Therefore, leakage of light from the insulating portion 609 can be more effectively prevented, and light traveling from the metal reflecting plate 502 toward the substrate side is more efficiently directed to the light emitting surface 513 side by the mounting surface metal reflecting film. Can be reflected. As a result, the light utilization efficiency and heat dissipation can be further improved.

  That is, within the region surrounded by the metal reflector 502 on the mounting surface, the die bond area / electrode common portion 607 as the mounting surface metal reflective film is spread over the entire surface so as to surround the island electrode 608 via the insulating portion 609. Since it can be formed, the amount of light absorbed by the substrate and the amount of light that passes through the substrate and leaks from the back surface side to the outside can be further reduced as compared with the configuration of the first embodiment.

  FIG. 6 is a perspective view illustrating a configuration example of the light emitting element 600 of the present embodiment.

  As shown in FIG. 6, the light-emitting element 600 according to the present embodiment includes an LED chip 501, a metal reflector 502, a laminated substrate 606 (a surface layer 603, an intermediate layer 604, and a back layer 605), and a light-transmitting seal. A stop 510 is provided.

  In the surface layer 603, a die bond area / electrode common part (first metal part) 607, an island electrode (second metal part) 608, and an insulating ring (second insulating part) 609 are formed.

  As described above, the insulating ring 609 is formed in an annular shape (doughnut shape) so as to surround the outer periphery of the island electrode 608. For this reason, the die bond area / electrode common portion (first metal portion) 607 serving as the mounting surface metal reflective film is placed on the island electrode 608 via the insulating ring 609 in the region surrounded by the metal reflector 502 on the mounting surface. Even if it is formed over the entire surface so as to surround the outer periphery, since the island electrode 608 can be insulated from other parts of the region, most of the light emitted from the LED chip 501 toward the substrate side is It can be reflected by the mounting surface metal reflecting film and guided to the light emitting surface 513 provided in the light emitting direction. Therefore, the amount of light absorbed by the substrate and the amount of light that passes through the substrate and escapes from the back surface side to the outside of the element can be reduced, and the intensity of light emitted from the light emitting surface 513 can be improved.

  The insulating ring 609 is made of RCC resin such as epoxy resin, like the insulating portion 509 of the first embodiment. Furthermore, the RCC resin contains a light reflective filler that reflects visible light in a wavelength region of 400 nm to 850 nm. The RCC resin desirably has a light reflectance of 50% or more in the above wavelength region. As the light reflective filler, aluminum oxide, silicon oxide, titanium dioxide or the like having high light reflectance can be used. Among these, titanium dioxide is particularly preferable because of its high light reflectance and low cost.

  However, when titanium dioxide is used as the light-reflective filler, there is a risk of oxidizing the metal reflector 502, the light-transmitting encapsulant 510, and the insulating ring 609 during the light-emitting operation due to a photocatalytic reaction in the presence of oxygen. (Oxygen passes through the sealing resin and is absorbed by the peripheral members and is contained in the atmosphere and moisture). On the other hand, when other reflective fillers such as aluminum oxide and silicon oxide are used, the above photocatalytic action does not occur, but aluminum oxide and silicon oxide are hygroscopic. Therefore, there is a risk that the air and moisture absorbed in the sealing step of the translucent sealing body 510 are vaporized by heat during the light emitting operation and the translucent sealing body 510 is peeled off. Here, the light-transmitting sealing body 510 that seals the LED chip 501 is preferably light-tight and air-tight. However, a resin having better light resistance generally tends to transmit gas such as air, and air and moisture may reach the mounting surface.

  Therefore, when adding only to the surface layer in the vicinity of the mounting surface of the LED chip 501, it is desirable to reduce the amount of the light-reflecting filler, particularly, thereby reducing the amount of active oxygen to be oxidized and reducing the light reflectance. Desirable to improve.

  Therefore, the insulating ring 609 has a laminated structure in which a light-reflective filler-free resin layer that does not include the light-reflective filler and a light-reflective filler-added resin layer that includes the light-reflective filler are stacked from the light incident side. It is desirable to have Here, since the epoxy resin absorbs light, the light-reflective filler-free resin layer that does not include the light-reflective filler is formed as thin as possible, and a light-reflective filler containing a light-reflective filler is added to the lower layer. It is desirable to form a resin layer.

  About the formation process of the insulating ring 609, since it can form by the method similar to the insulating part 509 of the above-mentioned 1st Embodiment, description here is abbreviate | omitted.

  As described above, by using the RCC resin containing the light-reflective filler for the insulating ring 609, the light that is emitted from the LED chip 501 and incident on the insulating ring 609 and the light-transmitting sealing that seals the LED chip 501 are used. Light emitted from the phosphor contained in the body 510 and incident on the insulating ring 609 can be reflected by the light reflective filler. For this reason, when the light enters the insulating ring 609 and is reflected by the peripheral member, light that is partially absorbed and attenuated can be reduced, and light utilization efficiency and heat dissipation can be improved.

  In addition, even when titanium dioxide is used as the light reflective filler, the metal reflector by photocatalytic reaction of the light reflective filler in the presence of oxygen as compared with the structure added to the entire region of the insulating ring 609. It is possible to improve the intensity of light emitted from the light emitting surface while suppressing problems such as oxidation of the light-transmitting sealing body 510 and the insulating ring 609 and peeling of the light-transmitting sealing body 510.

  That is, since the amount of light absorbed by the insulating ring 609 and the amount of light that passes through the substrate and is emitted from the back surface side to the outside can be reduced, light utilization efficiency and heat dissipation can be improved.

  The RCC resin is preferably formed by a heat process in an inert gas atmosphere. Thereby, since the quality change (yellowing change) of the resin used for the insulating ring 609 can be prevented, the above effect can be effectively exhibited without light absorption by the quality change resin.

  In addition, the light emitting element 600 according to the present embodiment reduces the resin formation region with low heat dissipation, and widens the die bond area / electrode common portion 607 as the mounting surface metal reflective film, thereby improving the heat dissipation. An effect can also be obtained. Further, as in the first embodiment, since the die bond area / electrode common portion 607 is formed integrally with the metal reflector 502, the heat generated in the metal reflector 502 can be efficiently released to the outside. .

  In addition, the multilayer substrate 606 of the light emitting element 600 of the present embodiment is configured to have a smaller number of layers than the multilayer substrate 506 of the light emitting element 500 of the first embodiment. This will be described with reference to FIG. 7 and FIG. Since the multilayer substrate 606 is laminated on the multilayer substrate 606 and the metal reflector 502 and formed integrally, the metal reflector 502 will be described as the first layer 621 below.

  FIG. 7 is a cross-sectional view illustrating a detailed configuration of the light emitting device 600.

  FIG. 8 shows an example of an etching pattern between the metal reflector 502 and each layer of the multilayer substrate 606. 8, (a) shows the first layer 621, (b) shows the second layer 622, (c) shows the third layer 623, (d) shows the fourth layer 624, (e ) Shows the fifth layer 625, and (f) shows the sixth layer 626.

  The surface layer 603 has a two-layer structure in which a second layer 622 and a third layer 623 are stacked from the mounting surface side.

  On the second layer 622 (mounting surface), as an electrode terminal for supplying a drive current to the LED chip 501, a die bond area / electrode common part (first metal part) 607 and an island electrode (first metal part) connected to the LED chip 501 respectively. 2 metal parts) 608. Further, an insulating ring 609 for electrically insulating the island electrode 608 from the die bond area / electrode common portion 607 is formed in an annular shape so as to surround the outer periphery of the island electrode 608.

  Unlike the first embodiment, a die bond area / electrode common portion 607 is formed on the mounting surface of the present embodiment so as to surround the outer periphery of the island electrode 608 via an insulating ring 609. That is, a die bond area / electrode common portion 607 as a mounting surface metal reflection film is also formed between the metal reflection film 602 and the insulating portion 609 formed on the mounting surface.

  The die bond area / electrode common portion 607, the island electrode 608, and the insulating ring 609 are the same as the die bond area / electrode common portion 507, the island electrode 508, and the insulating portion 509 of the first embodiment except for the shapes described above. It has a configuration.

  The third layer 623 is a layer provided to electrically connect the second layer 622 and a fourth layer 624 to be described later. When forming the insulating portion in the second layer 622, the third layer 623 It also has a function to increase the degree of adhesion.

  In order to avoid contact with moisture and air in the vicinity of the interface bonded to other members via the third layer 623 as the adhesive layer, a configuration in which a light reflective filler such as titanium dioxide is not included is used. It is desirable. That is, the interface with the adhesive layer and other members tends to collect moisture and air, so it is desirable that the light-reflective filler is not brought into contact. Further, as the resin of the insulating ring 609 to which titanium dioxide is added, generally, a resin that hardly transmits gas such as the atmosphere such as an epoxy resin is used. For this reason, it is particularly preferable to provide the titanium dioxide-added resin layer 509 c inside the resin of the insulating ring 609.

  The third layer 623 is provided with a conductive portion 631 and a conductive portion 632 for electrically connecting each electrode formed on the mounting surface and the back surface electrode. The conductive part 631 and the conductive part 632 have basically the same configuration as the conductive part 531 and the conductive part 532 of the first embodiment. The formation region of the conductive portion 631 and the conductive portion 632 is appropriately selected according to the shape of the die bond area / electrode common portion 607 and the island electrode 608.

  Next, the intermediate layer 604 will be described.

  The intermediate layer 604 in the present embodiment is different from the multilayer substrate 506 provided with the intermediate layer 504 having the three-layer stacked structure of the first embodiment in that it includes only the fourth layer 624.

  The fourth layer 624 electrically connects the third layer 623, a through hole 515 formed in a fifth layer 625 and a sixth layer 626 described later, and a back electrode 518 and a back electrode 519 formed in the through hole 516. Is provided to connect to.

  The fourth layer 624 is formed so that the conductive portion 633 electrically connected to the die bond area / electrode common portion 607 and the conductive portion 634 electrically connected to the island electrode 608 are not in contact with each other. Has been.

  The conductive portion 633 is formed so as to cover the entire through-hole 515 so that copper does not leak when the through-hole 515 is plated with copper. That is, the conductive portion 633 has a role of covering the through hole 515. Note that, when dicing the light emitting element 600, burrs may occur. However, since the conductive portion 633 has the same potential as the metal reflector 502, there is no problem of short circuit due to contact of burrs.

  The conductive portion 634 covers the entire formation region of the conductive portion 632 in the third layer 623 and is formed to have a width smaller than the through hole 516 in the surface direction. The conductive portion 634 is formed with a dicing margin secured in order to prevent damage due to the generation of burrs when the light emitting element 600 is diced.

Next, the back layer 605 will be described.
The back layer 605 has a two-layer stacked structure in which a fifth layer 625 and a sixth layer 626 are stacked from the mounting surface side. The configurations of the fifth layer 625 and the sixth layer 626 have the same configurations as the seventh layer 527 and the eighth layer 528 of the first embodiment, respectively.

  The back surface layer 605 laminated with the fifth layer 625 and the sixth layer 626 is attached to the fourth layer 624 with a press through an adhesive tape. Here, the through hole 515 is formed so as to be covered by the conductive portion 633 of the fourth layer 624.

  On the other hand, the through hole 516 is formed so that the conductive portion 634 of the fourth layer 624 is accommodated therein and is covered with the third layer 623. Thus, the through-hole 516 can be closed with the third layer 623 by making the width in the surface direction of the conductive portion 634 of the fourth layer 624 smaller than the width in the surface direction of the through-hole 516. The fifth layer 625 and the sixth layer 626 integrated with each other are geometrically brought into surface contact with the fourth layer 624 only at the conductive portion 633. It is considered that a gap is generated by tilting the stepped portion of the portion 633 as a fulcrum, but the fifth layer 625 and the sixth layer 626 that are laminated and integrated are inclined by appropriately adjusting the thickness of the conductive portion 633 and the adhesive tape. In this way, it is possible to adhere to the fourth layer 624 flatly, thereby preventing copper leakage in the step of forming a copper plating 517 described later.

  In this state, the through hole 515 and the through hole 516 are formed with copper plating 517 on the inner peripheral surfaces thereof. Since the conductive portion 633 of the fourth layer 624 is formed so as to cover the through hole 515, the copper plating 517 is also formed on the conductive portion 633 of the fourth layer 624. In addition, since the conductive portions 634 of the third layer 623 and the fourth layer 624 are formed so as to cover the through holes 516, the copper plating 517 is also applied to the conductive portions 634 of the third layer 623 and the fourth layer 624. It is formed. Thereby, a back electrode 518 and a back electrode 519 as external connection electrode terminals of the light emitting element 600 are formed.

  As described above, the multilayer substrate 606 achieves a reduction in the number of layers by making the conductive portions 634 of the fourth layer 624 smaller than the through holes 516 and appropriately adjusting the thickness of the conductive portions 633 and the adhesive tape. Yes. Thus, the light-emitting element 600 according to this embodiment can be reduced in size and manufacturing cost.

  Similar to the first embodiment, the opening of the metal reflector 502 and the side surface shape on the outer peripheral side may be determined according to the shape and design that are easy to etch. For example, FIG. 9 shows a metal reflector 641 having another outer peripheral shape, and FIG. 10 shows a metal reflector 642 and an opening 643 having still another outer peripheral shape.

  In the light emitting element 600, a back electrode 518 and a back electrode 519 are formed as external connection electrode terminals on the back side opposite to the light emitting surface. However, this embodiment is not limited thereto, and these external connection electrode terminals may be provided on the light emitting surface side.

  That is, as shown in FIGS. 11 and 12, the external bonding electrode 711 and the external bonding electrode 712 are formed by integrally molding with the metal reflector 502. Thereby, since it becomes possible to use the area | region P and the area | region Q as a solder joint surface, the wettability of solder can be improved.

  However, the package size of the light emitting element is increased by forming the external bonding electrode 711 and the external bonding electrode 712. In contrast, FIGS. 13 and 14 show a configuration in which the package size of the light emitting element is reduced.

  In the configuration shown in FIGS. 13 and 14, the package of the light emitting element is reduced in size by including the integrated external bonding electrode 751 in which the metal reflector 502 and the external bonding electrode 711 are integrated.

  Note that although a configuration including one LED chip 501 has been described, this embodiment is not limited to this, and the light-emitting element 600a illustrated in FIG. 24, the light-emitting element 600b illustrated in FIG. 25, and the light-emitting element 600c illustrated in FIG. Thus, the present invention can be applied to a configuration including two or more LED chips.

  23 to 26, the potential of the island electrode 608 is different from the potential of other regions including the die bond area / electrode common portion 607 surrounded by the metal reflector 502.

  As described above, by appropriately arranging and mounting a plurality of LED chips in one light emitting element, the light emission intensity can be improved without increasing the size of the element. It should be noted that the number of LED chips mounted is not limited to an upper limit of 4, and the number of LED chips mounted can be further increased in a configuration including a large element substrate.

[Third Embodiment]
The following will describe still another embodiment of the present invention with reference to FIGS. 17, 18 and 27 to 31. FIG. For convenience of explanation, the same members as those shown in the drawings of the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The light emitting element 700 according to the present embodiment includes a multilayer substrate similar to the multilayer substrate 506 of the light emitting element 500 of the first embodiment described above.

  As shown in FIG. 17, each electrode connected to the LED chip 701 as an electrode terminal for supplying a drive current to the LED chip 701 is an island electrode. In other words, the metal reflector 702 that reflects the light emitted from the LED chip 701 and guides it to the light emitting surface 513 provided in the light emitting direction is electrically supplied from any electrode that supplies a driving current to the LED chip 701. This is different from the first embodiment described above in that it is insulated.

  In the present embodiment, the cathode electrode of the LED chip 501 is connected to the first island electrode (first metal portion) 707, and the anode electrode is connected to the second island electrode (second metal portion) 708.

  The first island electrode 707 is electrically insulated from other portions in the region surrounded by the metal reflector 702 on the mounting surface by a first insulating portion 709a formed in an annular shape so as to surround the outer periphery thereof. .

  Similar to the island electrode 508 of the first embodiment, the second island electrode 708 is electrically insulated from other parts in the region by the second insulating portion 709b formed in an annular shape so as to surround the outer periphery thereof. Yes.

  Further, a mounting surface metal reflective film 720 is formed in the entire region outside the first insulating portion 709a and the second insulating portion 709b in the region.

  The first insulating portion 709a and the second insulating portion 709b are made of an RCC resin such as an epoxy resin, like the insulating portion 509 of the first embodiment and the insulating ring 609 of the second embodiment. The RCC resin contains a light reflective filler that reflects visible light in a wavelength region of 400 nm to 850 nm. The RCC resin desirably has a light reflectance of 50% or more in the above wavelength region. As the light reflective filler, aluminum oxide, silicon oxide, titanium dioxide or the like having high light reflectance can be used. Among these, titanium dioxide is particularly preferable because of its high light reflectance and low cost.

  However, when titanium dioxide is used as the light-reflective filler, the metal reflector 702, the light-transmitting encapsulant 510, the first insulating portion 709a, and the second member during the light-emitting operation due to the photocatalytic reaction in the presence of oxygen. There is a risk of oxidizing the insulating portion 709b (oxygen passes through the sealing resin, is absorbed by the peripheral members, and is contained in the atmosphere and moisture). On the other hand, when other reflective fillers such as aluminum oxide and silicon oxide are used, the above photocatalytic action does not occur, but aluminum oxide and silicon oxide are hygroscopic. Therefore, there is a risk that the air and moisture absorbed in the sealing step of the translucent sealing body 510 are vaporized by heat during the light emitting operation and the translucent sealing body 510 is peeled off. Here, the translucent sealing body 510 that seals the LED chip 701 is preferably light-tight and air-tight. However, a resin having better light resistance generally tends to transmit gas such as air, and air and moisture may reach the mounting surface.

Therefore, when adding only to the surface layer in the vicinity of the mounting surface of the LED chip 701, it is particularly desirable to reduce the addition amount of the light reflective filler, thereby reducing the amount of active oxygen to be oxidized and reducing the light reflectance. Desirable to improve.
In addition, in the vicinity of the interface bonded to other members through the third layer 623 as the adhesive layer, a structure not including a light reflective filler such as titanium dioxide is used to avoid contact with moisture and air. Is desirable. That is, the interface with the adhesive layer and other members tends to collect moisture and air, so it is desirable that the light-reflective filler is not brought into contact. In addition, as the resin of the first insulating portion 709a and the second insulating portion 709b to which titanium dioxide is added, generally, a resin that hardly transmits gas such as the atmosphere such as epoxy resin is used. For this reason, it is particularly preferable to provide the titanium dioxide-added resin layer 509c inside the resin of the first insulating portion 709a and the second insulating portion 709b.

  Therefore, the first insulating portion 709a and the second insulating portion 709b are respectively a light-reflective filler-free resin layer containing no light-reflective filler and a light-reflective filler containing a light-reflective filler from the light incident side. It is desirable to have a laminated structure in which the additive resin layer is laminated. Here, since the RCC resin absorbs light, a light-reflective filler-free resin layer that does not contain the light-reflective filler is formed as thin as possible into a layer, and a light-reflective filler containing a light-reflective filler is added to the lower layer. It is desirable to form a resin layer.

  About the formation process of the 1st insulation part 709a and the 2nd insulation part 709b, since it can manufacture in the process similar to the insulation part 509 of the above-mentioned 1st Embodiment, description here is abbreviate | omitted.

  Even when titanium dioxide is used as the light-reflective filler, the light-reflective filler is present in the presence of oxygen as compared with the structure added to the entire area of the first insulating portion 709a and the second insulating portion 709b. While suppressing problems such as oxidation of the metal reflector 702, the translucent sealing body 510, the first insulating portion 709a and the second insulating portion 709b due to the photocatalytic reaction, peeling of the translucent sealing body 510, etc. The intensity of outgoing light from the outgoing surface can be improved.

  That is, the amount of light absorbed by the first insulating portion 709a and the second insulating portion 709b and the amount of light that passes through the substrate and is emitted from the back side to the outside can be reduced. Improvements can be made.

  Thus, by using a resin containing a light-reflective filler for the first insulating portion 709a and the second insulating portion 709b, the resin is emitted from the LED chip 701 and enters the first insulating portion 709a and the second insulating portion 709b. Light emitted from the phosphor contained in the light-transmitting sealing body 510 that seals the LED chip 701 and incident on the first insulating portion 709a and the second insulating portion 709b is reflected by the light reflective filler. Can be made. For this reason, when the light enters the first insulating portion 709a and the second insulating portion 709b and is reflected by the peripheral members, the light that is partially absorbed and attenuated can be reduced, and the light utilization efficiency and heat dissipation can be improved. Can be planned.

  The RCC resin is preferably formed by a heat process in an inert gas atmosphere. Accordingly, the resin used for the first insulating part 709a and the second insulating part 709b can be prevented from being deteriorated (yellowing change), and the above effect can be effectively exhibited without light absorption by the deteriorated resin.

  Similarly to the first and second embodiments described above, the light emitting element 700 reflects the emitted light from the LED chip 701 and guides it to the light emitting surface 513 provided in the light emitting direction. A plate 702 is formed so as to stand in the light emitting direction of the LED chip 701 and surround the entire periphery of the LED chip 701. For this reason, the light emitted from the LED chip 701 to the surroundings can be reflected by the metal reflector 702 and efficiently guided to the light emitting surface 513. Thereby, light leakage from the side surface of the element can be suppressed, and the intensity of light emitted from the light emission surface 513 can be improved.

Further, a mounting surface metal reflective film 720 is interposed between the first insulating portion 709a and the metal reflecting plate 702 and between the second insulating portion 709b and the metal reflecting plate 702. For this reason, even if a positional deviation occurs in the formation process of the metal reflector 702, the deviation can be absorbed by the mounting surface metal reflective film 720. Therefore, the first insulating portion 709a and the first insulating layer 702a can be absorbed by the positional deviation. The first island electrode 707 is not affected by the shape and area of the second insulating part 709b, and even if the areas of the first insulating part 709a and the second insulating part 709b formed on the substrate mounting surface are reduced. In addition, the insulation state of the second island electrode 708 can be ensured. Therefore, according to the above configuration, the areas of the first insulating portion 709a and the second insulating portion 709b formed on the mounting surface can be further reduced, and the island electrode 707 and the The mounting surface metal reflective film 720 surrounding the second island electrode 708 can be formed in a wider area. For this reason, the leakage of light from the second insulating portion 709b can be more effectively prevented, and light directed from the metal reflecting plate 702 toward the substrate side can be more efficiently emitted by the mounting surface metal reflecting film. It can be reflected toward the 513 side. As a result, the light utilization efficiency and heat dissipation can be further improved.
Furthermore, the metal reflector 702 according to the present embodiment is electrically insulated from both the first island electrode 707 and the second island electrode 708 as described above. For this reason, as shown in FIG. 18, when the light emitting element 700 is mounted on a case 400 made of metal such as aluminum of an electronic device such as a mobile phone, the metal reflector 702 does not have a potential. Therefore, the metal reflector 702 can be mounted in contact with the housing 400 without using a resin having low heat dissipation. Thereby, the heat generated in the metal reflector 702 can be efficiently released to the outside of the light emitting element 700.
Further, as shown in FIG. 18, the light-emitting element 700 according to this embodiment includes a metal reflector 702 on the element outer circumference including at least a part of the outer circumference of the metal reflector 702 and the bottom surface of the multilayer substrate 506. A heat dissipating sheet 740 is formed for releasing the heat generated in step 1 to the outside.

  Thereby, the heat generated in the metal reflector 702 can be more efficiently released to the outside via the heat dissipation sheet 740.

  As the heat dissipation sheet 740, it is desirable to use a conductive material having excellent heat dissipation. As described above, the metal reflector 702 according to the present embodiment is insulated from other members and has no potential. For this reason, the heat | fever generate | occur | produced in the metal reflecting plate 702 can be more efficiently escaped outside via this heat dissipation sheet which consists of an electroconductive material excellent in heat dissipation, without producing problems, such as a short circuit. As the conductive material, it is desirable to use a graphite material that is particularly excellent in heat dissipation.

  Further, a mounting surface metal reflective film 720 is formed in a region outside the first insulating portion 709a and the second insulating portion 709b on the mounting surface. For this reason, most of the light emitted from the LED chip 701 toward the substrate side can be reflected by the mounting surface metal reflective film 720 and guided to the light emitting surface 513 provided in the light emitting direction. Therefore, the amount of light absorbed by the substrate and the amount of light that passes through the substrate and leaks from the back surface side to the outside of the light-emitting element 700 can be reduced. Thereby, the intensity | strength of the emitted light from a light-projection surface can be aimed at.

  The light emitting element 700 has a back surface electrode (first back surface electrode) 718 connected to the first island electrode 707 and the second island electrode 708 as external connection electrode terminals on the back surface opposite to the mounting surface of the multilayer substrate 506, respectively. And a back electrode (second back electrode) 719 are formed.

  As described above, by providing the back electrodes 718 and 719 as the external connection electrode terminals of the light emitting element 700 on the back surface side of the mounting substrate 506, light that passes through the mounting substrate 506 and leaks from the back surface side to the outside of the light emitting element 700. The amount of can be reduced.

  However, this embodiment is not limited thereto, and these external connection electrode terminals may be provided on the light emitting surface side.

  Also, as shown in FIG. 17, the back electrode 718 and the back electrode 719 are formed so as to cover the formation regions of the first insulating portion 709a and the second insulating portion 709b and the entire regions corresponding to the stacking direction, respectively. Yes.

  For this reason, among the light emitted from the LED chip 701, light traveling from the mounting surface to the inside of the substrate passes through the multilayer substrate 506 via the first insulating portion 709a and the second insulating portion 709b, and from the back surface side of the light emitting element. It is possible to effectively prevent leakage to the outside. Thereby, the intensity | strength of the emitted light from a light-projection surface can be aimed at.

  Similarly to the first embodiment, the back surface electrode 718 and the back surface electrode 719 are connected to the first island electrode 707 and the second island electrode 708 via the conductive portion 734 and the conductive portion 733 formed in the fourth layer 524, respectively. Electrically connected. Here, in this embodiment, the conductive portion 734 and the conductive portion 733 correspond to the entire region corresponding to the formation region of the first insulating portion 709a and the stacking direction and the formation region of the second insulating portion 709b and the stacking direction, respectively. Is formed so as to cover the entire area to be performed.

  Thus, the first insulating portion 709a and the second insulating portion 709b are formed so as to be covered with the respective conductive portions 734 and 733 formed on the substrate mounting surface side from the back surface electrode 718 and the back surface electrode 719, respectively. Thus, it is possible to more effectively reduce the amount of light leaking from the back surface side to the outside of the element through the first insulating portion 709a and the second insulating portion 709b.

  In the light emitting element 700, as in the above-described embodiment, the light emitting surface 513 has an upper end portion in the light emitting direction from the LED chip 701 in an area surrounded by the mounting surface and the metal reflector 702. Yes. Further, the light-transmitting sealing body 510 is formed so as to fill the region, and the maximum width of the cross section in the surface direction is between the light emitting surface 513 and the mounting surface serving as the bottom surface in the region. The opening at the upper end of the region is narrowed so as to have a region that is larger than the maximum width in the surface direction of the emission surface 513.

  As the sealing resin for the translucent sealing body 510, silicone or the like having a lower adhesiveness than epoxy is used. Therefore, as described above, the metal reflecting plate 702 is formed so as to narrow the opening serving as the light emitting surface 513, thereby improving the adhesion of the translucent sealing body 510 to the inner peripheral surface of the metal reflecting plate 702. And the peeling of the light-transmitting sealing body 510 can be suppressed. Thereby, the inner peripheral surface of the silver-plated metal reflecting plate 702 can be protected in a stable state by the translucent sealing member 510.

  In addition, as shown in FIG. 17, at least the inner peripheral surface of the metal reflector 702 that comes into contact with the light-transmitting sealing body 510 is formed with unevenness to increase the contact area with the light-transmitting sealing body 510. Is desirable. Thereby, the adhesiveness with respect to the internal peripheral surface of the metal reflecting plate 702 of the translucent sealing body 510 can be improved, and peeling of the translucent sealing body 510 can be suppressed. As a result, the inner peripheral surface of the metal reflector 702 that has been plated with silver can be protected in a stable state by the translucent sealing member 510.

  As a material of the first island electrode 707, the second island electrode 708, the metal reflector 702, and the mounting surface metal reflective film 720 constituting the light emitting element 700 according to the present embodiment, copper having excellent reflectivity among metals is used. It is desirable to use silver, gold, or nickel because light emitted from the LED chip 701 can be efficiently guided to the light emitting surface 513.

  In addition, although the structure including one island electrode 608 has been described, the present embodiment is not limited to this, and a plurality of island electrodes are also provided, such as the light emitting element 600d illustrated in FIG. 27 and the light emitting element 600e illustrated in FIG. It is good also as a structure provided.

  When two LED chips 501 are connected in series in the configuration of FIG. 17, when two LED chips are connected in series in the configuration of FIG. 18, two island electrodes are connected as shown in FIG. Are formed so as to be electrically connected to different backside electrodes so that one has an anode side and the other has a different potential such that the other is a cathode side. On the other hand, when two chips are connected in series in the configuration of FIG. 27 and when four LED chips 501 as shown in FIG. 28 are connected in parallel, as shown in FIG. 30 or FIG. The electrodes are at the same potential. In this case, the two island electrodes are both formed by disposing conductive portions of respective layers in the laminated substrate so as to be electrically connected to one of the back electrodes (not shown).

  29 to 31, + and − indicate how to take the anode (+) and cathode (−) on the island electrode, die bond area / electrode common portion, and F indicates a potential drop anywhere. First, it shows that the floating potential was set. This notation is the same in the following embodiments.

[Fourth Embodiment]
The following will describe still another embodiment of the present invention with reference to FIGS. 19, 20, 22, 29 and 32 to 34. FIG. For convenience of explanation, the same members as those shown in the drawings of the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The light emitting element 800 according to the present embodiment includes a multilayer substrate similar to the multilayer substrate 606 of the light emitting element 600 of the second embodiment described above.

  As shown in FIGS. 19 and 20, the light emitting element 800 according to the present embodiment is the LED chip as an electrode terminal that supplies a drive current to the LED chip 701, as in the light emitting element 700 of the third embodiment described above. Each of the electrodes connected to 701 is an island electrode. In addition, a metal reflector 802 that reflects light emitted from the LED chip 701 and guides it to a light emitting surface 513 provided in the light emitting direction is electrically connected to any electrode that supplies a driving current to the LED chip 701. This is different from the second embodiment described above in that it is insulated.

  In this embodiment, the cathode electrode of the LED chip 701 is connected to the first island electrode (first metal portion) 807, and the anode electrode is connected to the second island electrode (second metal portion) 808. ing.

  The first island electrode 807 is electrically insulated from other parts in the region surrounded by the metal reflector 802 on the mounting surface by a first insulating portion 809a formed in an annular shape so as to surround the outer periphery thereof. It has a configuration.

  Similar to the island electrode 608 of the second embodiment, the second island electrode 808 is electrically insulated from other parts in the region by the second insulating portion 809b formed in an annular shape so as to surround the outer periphery thereof. Yes.

  In addition, a mounting surface metal reflective film 820 is formed on the entire region outside the first insulating portion 809a and the second insulating portion 809b in the region.

  The first insulating portion 809a and the second insulating portion 809b are the same as the insulating portion 509 of the first embodiment, the insulating portion 609 of the second embodiment, and the first insulating portion 709a and the second insulating portion 709b of the third embodiment. And RCC resin such as epoxy resin. The RCC resin contains a light reflective filler that reflects visible light in a wavelength region of 400 nm to 850 nm. The epoxy resin desirably has a light reflectance of 50% or more in the wavelength region. As the light reflective filler, for example, aluminum oxide, silicon oxide, titanium dioxide or the like having high light reflectance can be used. Among these, titanium dioxide is particularly preferable because of its high light reflectance and low cost.

  However, when titanium dioxide is used as the light-reflective filler, the metal reflector 802, the light-transmitting sealing body 510, the first insulating portion 809a, and the second member during the light-emitting operation by the photocatalytic reaction in the presence of oxygen. There is a risk of oxidizing the insulating portion 809b (oxygen passes through the sealing resin, is absorbed by the peripheral members, and has air and moisture as its sources). On the other hand, when other reflective fillers such as aluminum oxide and silicon oxide are used, the above photocatalytic action does not occur, but aluminum oxide and silicon oxide are hygroscopic. Therefore, there is a risk that the air and moisture absorbed in the sealing step of the translucent sealing body 510 are vaporized by heat during the light emitting operation and the translucent sealing body 510 is peeled off. Here, the translucent sealing body 510 that seals the LED chip 701 is preferably light-tight and air-tight. However, a resin having better light resistance generally tends to transmit gas such as air, and air and moisture may reach the mounting surface.

  Therefore, when adding only to the surface layer in the vicinity of the mounting surface of the LED chip 701, it is particularly desirable to reduce the addition amount of the light reflective filler, thereby reducing the amount of active oxygen to be oxidized and reducing the light reflectance. Can be improved.

  In addition, in the vicinity of the interface bonded to other members through the third layer 623 as the adhesive layer, a structure not including a light reflective filler such as titanium dioxide is used to avoid contact with moisture and air. Is desirable. That is, the interface with the adhesive layer and other members tends to collect moisture and air, so it is desirable that the light-reflective filler is not brought into contact. Further, as the resin of the first insulating portion 809a and the second insulating portion 809b to which titanium dioxide is added, generally, a resin that hardly transmits gas such as the atmosphere such as epoxy resin is used. For this reason, it is particularly preferable to provide the titanium dioxide-added resin layer 509c inside the resin of the first insulating portion 809a and the second insulating portion 809b.

  Therefore, the first insulating portion 809a and the second insulating portion 809b are respectively a light-reflective filler-free resin layer that does not include the light-reflective filler and a light-reflective filler that includes the light-reflective filler from the light incident side. It is desirable to have a laminated structure in which the additive resin layer is laminated. Here, since the RCC resin absorbs light, a light-reflective filler-free resin layer that does not contain the light-reflective filler is formed as thin as possible into a layer, and a light-reflective filler containing a light-reflective filler is added to the lower layer. It is desirable to form a resin layer.

  About the formation process of the 1st insulation part 809a and the 2nd insulation part 809b, since it can manufacture in the process similar to the insulation part 509 of the above-mentioned 1st Embodiment, description here is abbreviate | omitted.

  When titanium dioxide is used as the light reflective filler, the conductive layer is oxidized by a photocatalytic reaction in the presence of oxygen. Further, in order to keep away from the atmosphere containing oxygen, it is desirable not to include a light reflective filler on the mounting surface.

  Therefore, the first insulating portion 809a and the second insulating portion 809b are respectively a light-reflective filler-free resin layer that does not include the light-reflective filler and a light-reflective filler that includes the light-reflective filler from the light incident side. It is desirable to have a laminated structure in which the additive resin layer is laminated. Here, since the epoxy resin absorbs light, the light-reflective filler-free resin layer that does not include the light-reflective filler is formed as thin as possible, and a light-reflective filler containing a light-reflective filler is added to the lower layer. It is desirable to form a resin layer.

  About the formation process of the 1st insulation part 809a and the 2nd insulation part 809b, since it can manufacture in the process similar to the insulation part 509 of the above-mentioned 1st Embodiment, description here is abbreviate | omitted.

  Further, even when titanium dioxide is used as the light reflective filler, the light reflective filler is present in the presence of oxygen as compared with the structure added to the entire area of the first insulating portion 809a and the second insulating portion 809b. While suppressing problems such as oxidation of the metal reflector 802, the light-transmitting sealing body 510, the first insulating portion 809a and the second insulating portion 809b due to the photocatalytic reaction, peeling of the light-transmitting sealing body 510, etc. The intensity of outgoing light from the outgoing surface can be improved.

  That is, the amount of light absorbed by the first insulating portion 809a and the second insulating portion 809b and the amount of light that passes through the substrate and is emitted from the back surface side to the outside can be reduced. Improvements can be made.

  As described above, by using a resin including a light-reflective filler for the first insulating portion 809a and the second insulating portion 809b, the resin is emitted from the LED chip 701 and enters the first insulating portion 809a and the second insulating portion 809b. The light and the light emitted from the phosphor contained in the light-transmitting sealing body 510 that seals the LED chip 701 and incident on the first insulating portion 809a and the second insulating portion 809b are reflected by the light reflective filler. Can be made. For this reason, when entering the first insulating portion 809a and the second insulating portion 809b and being reflected by the peripheral members, it is possible to reduce the light that is partially absorbed and attenuated, improving the light utilization efficiency and heat dissipation Can be achieved.

  The RCC resin is preferably formed by a heat process in an inert gas atmosphere. Accordingly, the resin used for the first insulating portion 809a and the second insulating portion 809b can be prevented from being deteriorated (yellowing change), so that the above effect can be effectively exhibited without light absorption by the deteriorated resin.

  Similarly to the first to third embodiments, the light emitting element 800 reflects the emitted light from the LED chip 701 and guides it to the light emitting surface 513 provided in the light emitting direction. However, the LED chip 701 is formed so as to stand in the light emitting direction and surround the entire periphery of the LED chip 701. For this reason, the light emitted from the LED chip 701 to the surroundings can be reflected by the metal reflector 802 and efficiently guided to the light emitting surface 513. Thereby, light leakage from the side surface of the element can be suppressed, and the intensity of light emitted from the light emission surface 513 can be improved.

  Further, as shown in FIG. 19, in the light emitting element 800 according to the present embodiment, the metal reflector 802 is formed integrally with the mounting surface metal reflector 820.

  For this reason, the mounting surface metal reflective film 820 can be formed over a wide range on the mounting surface. Thus, by increasing the metal formation region in the entire element, a light emitting element with excellent heat dissipation can be realized. Further, heat at the time of light emission of the LED chip 701 can be conducted to the front surface side of the multilayer substrate 606 on which the mounting surface metal reflective film 820 is integrally formed, and further effectively radiated to the back surface side. Thereby, deterioration due to heat can be suppressed, and a light-emitting element with excellent long-term reliability can be realized.

  In the present embodiment, the metal reflector 802 is electrically insulated from both the first island electrode 807 and the second island electrode 808 as described above. For this reason, as shown in FIG. 29, when the light emitting element 800 is mounted on a case 400 made of metal such as aluminum of an electronic device such as a mobile phone, the metal reflector 802 does not have a potential. Therefore, the metal reflector 802 can be mounted in contact with the housing 400 without using a resin having low heat dissipation. Thereby, the heat generated in the metal reflector 802 can be efficiently released to the outside of the light emitting element 800.

  Similar to the light emitting device 700 of the third embodiment, the light emitting device 800 according to the present embodiment has a metal on the device outer peripheral surface including at least a part of the outer peripheral surface of the metal reflector 802 and the bottom surface of the multilayer substrate 606. A heat dissipating sheet 740 for releasing heat generated in the reflecting plate 802 to the outside is formed.

  Thereby, the heat generated in the metal reflector 802 can be more efficiently released to the outside via the heat dissipation sheet 740.

  As the heat dissipation sheet 740, it is desirable to use a conductive material having excellent heat dissipation. As described above, the metal reflector 802 according to the present embodiment is insulated from other members and has no potential. For this reason, the heat | fever which generate | occur | produced in the metal reflecting plate 802 can be more efficiently escaped outside via this heat dissipation sheet which consists of an electroconductive material excellent in heat dissipation, without producing problems, such as a short circuit. As the conductive material, it is desirable to use a graphite material that is particularly excellent in heat dissipation.

  In addition, by grounding the conductive heat radiation sheet on the casing so as to be insulated from the back electrode, the metal reflector and the LED chip electrically and thermally connected to the metal reflector are mounted on the tower. The potential of the mounted mounting surface metal reflective film does not float, and it is possible to prevent an unnecessary surge from entering the LED chip and causing a failure or malfunction of the light emitting element.

  Further, in the present embodiment, unlike the third embodiment described above, the first insulating portion 809a and the second insulating portion 809b on the mounting surface are formed in an annular shape, so that each electrode can be replaced with a smaller area. It can be insulated from this part.

  Therefore, as shown in FIGS. 19 and 20, the mounting surface metal reflecting film 820 is formed in the region surrounded by the metal reflecting plate 802 on the mounting surface via the insulating portions 809a and 809b. 807 and the second island electrode 808 can be widely formed as a whole. For this reason, most of the light emitted from the LED chip 701 toward the substrate side can be reflected by the mounting surface metal reflective film 820 and guided to the light emitting surface 513 provided in the light emitting direction. Thereby, the amount of light absorbed by the multilayer substrate 606 and light that passes through the multilayer substrate 607 and leaks from the back surface side to the outside of the light emitting element 800 can be more effectively reduced, and the configuration of the third embodiment is achieved. In comparison, the intensity of light emitted from the light exit surface can be further improved.

  The light emitting element 800 has a back electrode (first back electrode) 818 connected to the first island electrode 807 and the second island electrode 808 as external connection electrode terminals on the back surface opposite to the mounting surface of the multilayer substrate 606, respectively. And a back electrode (second back electrode) 819 are formed.

  As described above, by providing the back electrodes 818 and 819 as the external connection electrode terminals of the light emitting element 800 on the back surface side of the mounting substrate 606, light that passes through the mounting substrate 606 and leaks from the back surface side to the outside of the light emitting element 800. The amount of can be reduced.

  However, this embodiment is not limited thereto, and these external connection electrode terminals may be provided on the light emitting surface side.

  Further, as shown in FIG. 19, the back electrode 818 and the back electrode 819 are formed so as to cover the formation regions of the first insulating portion 809a and the second insulating portion 809b and the entire regions corresponding to the stacking direction, respectively. Yes.

  For this reason, like each light emitting element according to the above-described embodiment, the light emitted from the LED chip 701 toward the inside of the substrate from the mounting surface passes through the first insulating portion 809a and the second insulating portion 809b. It is possible to effectively prevent leakage from the back surface side to the outside of the light emitting element 800 through the multilayer substrate 606. Thereby, the intensity | strength of the emitted light from a light-projection surface can be aimed at.

  As a material of the first island electrode 807, the second island electrode 808, the metal reflector 802, and the mounting surface metal reflective film 820 constituting the light emitting element 800 according to the present embodiment, copper having excellent reflectivity among metals is used. It is desirable to use silver, gold, or nickel because light emitted from the LED chip 701 can be efficiently guided to the light emitting surface 513.

  In addition, although the structure provided with one LED chip 701 was demonstrated, this embodiment is not restricted to this, The light emitting element 800a shown in FIG. 32, the light emitting element 800b shown in FIG. 33, and the light emitting element 800c shown in FIG. Thus, the present invention can be applied to a configuration including two or more LED chips.

  32 and 33, when two LED chips are connected in parallel / series, as shown in FIG. 34, when LED chip groups in which two LED chips are connected in parallel are connected in series, FIG. As shown in FIG. 4, the two island electrodes have different potentials such that one is the anode side and the other is the cathode side.

  As described above, by appropriately arranging and mounting a plurality of LED chips in one light emitting element, the light emission intensity can be improved without increasing the size of the element. It should be noted that the number of LED chips mounted is not limited to an upper limit of 4, and the number of LED chips mounted can be further increased in a configuration including a large element substrate.

[Fifth Embodiment]
The following will describe still another embodiment of the present invention with reference to FIG. 21 and FIGS. For convenience of explanation, the same members as those shown in the drawings of the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  In each of the above-described embodiments, the light emitting element on which a single LED chip is mounted has been described. However, the light emitting element of the present invention is not limited to this, and a configuration in which a plurality of LED chips are mounted may be employed.

  Therefore, in the configuration of the above-described fourth embodiment, a configuration including a plurality of LED chips will be described below with reference to FIG.

  As shown in FIG. 21, the light emitting element 900 according to the present embodiment includes an LED chip (second LED chip) 901 in addition to the LED chip 701.

  Similarly to the light emitting device 800, the cathode electrode of the LED chip 701 is connected to the first island electrode (first metal portion) 807, and the anode electrode is connected to the second island electrode (second metal portion) 808. It has become.

  In the present embodiment, the second island electrode 808 as an electrode terminal that supplies a drive current to the LED chip 701 also has a function as a power supply terminal that supplies a drive current to the LED chip 901. That is, the second island electrode 808 is also connected to the anode electrode of the LED chip 901. Furthermore, the light emitting element 900 includes a third island electrode 908 as a power supply terminal connected to the cathode electrode of the LED chip 901 and electrically connected to the first island electrode 807 through the conductive portion in the laminated substrate. The metal reflector 802 is electrically insulated from any of the first to third island electrodes.

  The first island electrode 807 is surrounded by the metal reflector 802 on the mounting surface by the first insulating portion 809a that is formed in an annular shape so as to surround the outer periphery thereof, similarly to the light emitting device 800 of the fourth embodiment described above. It is configured to be electrically insulated from other parts in the region. Further, like the island electrodes 608 and 808 of the second and fourth embodiments, the second island electrode 808 is formed in a ring shape so as to surround the outer periphery of the second island electrode 808. It is electrically insulated from the part.

  Further, in the present embodiment, the third island electrode (third electrode portion) 908 is also electrically connected to other portions in the region by the third insulating portion 909c formed in an annular shape so as to surround the outer periphery thereof. Insulated.

  That is, in the light emitting element 900 of the present embodiment, two LED chips (LED chips 701 and 901 are mounted in one circuit system. For this reason, the structure of the element is doubled without increasing the size. Light emission intensity can be obtained.

  In the present embodiment, the first to third insulating portions on the mounting surface are formed in an annular shape as in the fourth embodiment described above. For this reason, each electrode can be insulated from other parts with a smaller area.

  Accordingly, as shown in FIG. 21, the mounting surface metal reflective film 920 is formed in the region surrounded by the metal reflector 802 on the mounting surface via the first to third insulating portions. The island electrodes 807 to 809 can be widely formed so as to surround each. Therefore, most of the light emitted from the LED chips 701 and 901 toward the substrate can be reflected by the mounting surface metal reflective film 920 and guided to the light emitting surface 513 provided in the light emitting direction. Therefore, the amount of light absorbed by the multilayer substrate 606 and light that passes through the multilayer substrate 607 and leaks from the back surface side to the outside of the light emitting element 900 can be more effectively reduced.

  Further, the first insulating portion 809a, the second insulating portion 809b, and the third insulating portion 909c are the insulating portion 509 of the first embodiment, the insulating portion 609 of the second embodiment, the first insulating portion 709a of the third embodiment, and Similarly to the second insulating portion 709b, the second insulating portion 709b is made of an RCC resin such as an epoxy resin. The epoxy resin includes a light reflective filler that reflects visible light in a wavelength region of 400 nm to 850 nm. The RCC resin desirably has a light reflectance of 50% or more in the wavelength region. As the light reflective filler, for example, aluminum oxide, silicon oxide, titanium dioxide or the like having high light reflectance can be used. Among these, titanium dioxide is particularly preferable because of its high light reflectance and low cost.

  However, when titanium dioxide is used as the light-reflective filler, the metal reflector 702, the light-transmitting encapsulant 510, the first insulating portion 809a, the second, during the light-emitting operation by the photocatalytic reaction in the presence of oxygen. There is a risk of oxidizing the insulating portion 809b and the third insulating portion 909c (oxygen passes through the sealing resin and is absorbed by the peripheral members and contains air and moisture as sources). On the other hand, when other reflective fillers such as aluminum oxide and silicon oxide are used, the above photocatalytic action does not occur, but aluminum oxide and silicon oxide are hygroscopic. Therefore, there is a risk that the air and moisture absorbed in the sealing step of the translucent sealing body 510 are vaporized by heat during the light emitting operation and the translucent sealing body 510 is peeled off. Here, the translucent sealing body 510 that seals the LED chips 701 and 901 is preferably light-tight and air-tight. However, a resin having better light resistance generally tends to transmit gas such as air, and air and moisture may reach the mounting surface.

Therefore, when adding only to the surface layer in the vicinity of the mounting surface of the LED chips 701 and 901, it is desirable to reduce the addition amount of the light-reflective filler, in particular, thereby reducing the amount of active oxygen to be oxidized and reducing the light reflection. The rate can be improved.
In addition, in the vicinity of the interface bonded to other members through the third layer 623 as the adhesive layer, a structure not including a light reflective filler such as titanium dioxide is used to avoid contact with moisture and air. Is desirable. That is, the interface with the adhesive layer and other members tends to collect moisture and air, so it is desirable not to contact the light reflective filler. In addition, as the resin for the first insulating portion 809a, the second insulating portion 809b, and the third insulating portion 909c to which titanium dioxide is added, a resin that hardly transmits gas such as air is generally used, such as an epoxy resin. For this reason, it is particularly preferable to provide the titanium dioxide-added resin layer 509c inside the resin of the first insulating portion 809a, the second insulating portion 809b, and the third insulating portion 909c.

  Therefore, the first insulating portion 809a, the second insulating portion 809b, and the third insulating portion 909c are respectively a light-reflective filler-free resin layer that does not include the light-reflective filler and a light-reflective filler from the light incident side. It is desirable to have a laminated structure in which a light reflective filler-added resin layer containing is laminated. Here, since the RCC resin absorbs light, a light-reflective filler-free resin layer that does not contain the light-reflective filler is formed as thin as possible into a layer, and a light-reflective filler containing a light-reflective filler is added to the lower layer. It is desirable to form a resin layer.

  About the formation process of the 1st insulation part 809a, the 2nd insulation part 809b, and the 3rd insulation part 909c, since it can manufacture in the process similar to the insulation part 509 of above-mentioned Embodiment 1, explanation here Omitted.

  When titanium dioxide is used as the light reflective filler, the conductive layer is oxidized by a photocatalytic reaction in the presence of oxygen. Further, in order to keep away from the atmosphere containing oxygen, it is desirable not to include a light reflective filler on the mounting surface.

  Therefore, the first insulating portion 809a, the second insulating portion 809b, and the third insulating portion 909c are respectively a light-reflective filler-free resin layer that does not include the light-reflective filler and a light-reflective filler from the light incident side. It is desirable to have a laminated structure in which a light reflective filler-added resin layer containing is laminated. Here, since the epoxy resin absorbs light, the light-reflective filler-free resin layer that does not include the light-reflective filler is formed as thin as possible, and a light-reflective filler containing a light-reflective filler is added to the lower layer. It is desirable to form a resin layer.

  About the formation process of the 1st insulation part 809a, the 2nd insulation part 809b, and the 3rd insulation part 909c, since it can manufacture in the process similar to the insulation part 509 of the above-mentioned 1st Embodiment, description here Is omitted.

  Further, even when titanium dioxide is used as the light-reflective filler, it can be used in the presence of oxygen as compared with the structure added to the entire areas of the first insulating portion 809a, the second insulating portion 809b, and the third insulating portion 909c. The oxidation of the metal reflector 802, the translucent sealing body 510, the first insulating portion 809a, the second insulating portion 809b, and the third insulating portion 909c by the photocatalytic reaction of the light reflective filler, and the translucent sealing body While suppressing problems such as peeling of 510, it is possible to improve the intensity of light emitted from the light exit surface.

  That is, the amount of light absorbed by the first insulating portion 809a, the second insulating portion 809b, and the third insulating portion 909c and the amount of light that passes through the substrate and is emitted to the outside from the back surface side can be reduced. The utilization efficiency and heat dissipation can be improved.

  As described above, by using a resin containing a light-reflective filler for the first insulating portion 809a, the second insulating portion 809b, and the third insulating portion 909c, the first insulating portion 809a and the second insulating portion 809a are emitted from the LED chip 701. Light incident on the insulating portion 809b and the third insulating portion 909c and emitted from the phosphor contained in the translucent sealing body 510 that seals the LED chip 701 are emitted from the first insulating portion 809a, the second insulating portion 809b, and The light incident on the third insulating part 909c can be reflected by the light reflective filler. For this reason, light that is partially absorbed and attenuated when entering the first insulating portion 809a, the second insulating portion 809b, and the third insulating portion 909c and reflected by the peripheral member can be reduced, and the light utilization efficiency can be reduced. In addition, the heat dissipation can be improved.

  The RCC resin is preferably formed by a heat process in an inert gas atmosphere. As a result, the resin used for the first insulating part 809a, the second insulating part 809b, and the third insulating part 909c can be prevented from being deteriorated (yellowing change). It can be demonstrated.

  As in the above-described embodiment, the light emitting element 900 includes a metal reflector 802 that reflects the light emitted from the LED chips 701 and 901 and guides the light to the light emitting surface 513 provided in the light emitting direction. -Standing in the light emitting direction of 901, it is formed so as to surround the entire periphery of the LED chip 701 and the LED chip 901. For this reason, the light emitted to the surroundings from the LED chips 701 and 901 can be reflected by the metal reflector 802 and efficiently guided to the light emitting surface 513. Thereby, light leakage from the side surface of the element can be suppressed, and the intensity of light emitted from the light emission surface 513 can be improved.

  Further, as shown in FIG. 21, in the light emitting element 900 according to the present embodiment, the metal reflection plate 802 is formed integrally with the mounting surface metal reflection film 920.

  For this reason, the mounting surface metal reflective film 920 can be formed over a wide range on the mounting surface. Thus, by increasing the metal formation region in the entire element, a light emitting element with excellent heat dissipation can be realized. In addition, heat at the time of light emission of the LED chips 701 and 901 can be conducted to the front surface side of the laminated substrate 606 on which the mounting surface metal reflective film 920 is integrally formed, and further effectively radiated to the back surface side. Thereby, deterioration due to heat can be suppressed, and a light-emitting element with excellent long-term reliability can be realized.

  Further, the metal reflector 802 according to the present embodiment is electrically insulated from any of the first island electrode 807, the second island electrode 808, and the third island electrode 908 as described above. For this reason, as shown in FIG. 18, when the light emitting element 900 is mounted on a case 400 made of a metal such as aluminum of an electronic device such as a mobile phone, the metal reflector 802 does not have a potential. Therefore, the metal reflector 802 can be mounted in contact with the housing 400 without using a resin having low heat dissipation. Thereby, the heat generated in the metal reflector 802 can be efficiently released to the outside of the light emitting element 900.

  The light emitting element 900 according to the present embodiment includes at least a part of the outer peripheral surface of the metal reflector 802 and the bottom surface of the multilayer substrate 606, as in the light emitting elements 700 and 800 of the third and fourth embodiments. On the outer peripheral surface of the element, a heat radiating sheet 740 for releasing the heat generated in the metal reflector 802 to the outside is formed.

  Thereby, the heat generated in the metal reflector 802 can be more efficiently released to the outside via the heat dissipation sheet 740. As a result, a light-emitting element 900 with high long-term reliability can be realized.

  As the heat dissipation sheet 740, it is desirable to use a conductive material having excellent heat dissipation. As described above, the metal reflector 802 according to the present embodiment is insulated from other members and has no potential. For this reason, the heat | fever which generate | occur | produced in the metal reflecting plate 802 can be more efficiently escaped outside via this heat dissipation sheet which consists of an electroconductive material excellent in heat dissipation, without producing problems, such as a short circuit. As the conductive material, it is desirable to use a graphite material that is particularly excellent in heat dissipation.

  In addition, by grounding the conductive heat radiation sheet on the housing so as to be insulated from the back electrode, the LED chip 701 electrically and thermally connected to the metal reflector and the metal reflector can be obtained. The potential of the mounted mounting surface metal reflective film does not float, and it is possible to prevent an unnecessary surge from entering the LED chip 701 and causing a failure or malfunction of the light emitting element.

  In addition, although the structure provided with two LED chips was demonstrated, this embodiment is applicable not only to this but to the structure provided with four LED chips like the light emitting element 900b shown in FIG. it can.

  When two LED chips are connected in series in the configuration of FIG. 21, when two LED chips are connected in series in the configuration of FIG. 35, as shown in FIG. These are formed so as to be electrically connected to different backside electrodes so that one has an anode side and the other has a different potential such as a cathode side. On the other hand, when two LED chips are connected in parallel in the configuration of FIG. 21, when four LED chips are connected in parallel in the configuration of FIG. 35, the two island electrodes have the same potential as shown in FIG. . In this case, the two island electrodes are both formed by disposing conductive portions of respective layers in the laminated substrate so as to be electrically connected to one of the back electrodes (not shown).

  As described above, by appropriately arranging and mounting a plurality of LED chips in one light emitting element, the light emission intensity can be improved without increasing the size of the element. It should be noted that the number of LED chips mounted is not limited to an upper limit of 4, and the number of LED chips mounted can be further increased in a configuration including a large element substrate.

  The mounting surface metal reflective film 820 on which the LED chip is mounted is grounded through a conductive heat-dissipating sheet when mounted on the case 400 made of metal such as aluminum of the electronic device such as the mobile phone. Although it has been described that the malfunction and failure of the light emitting element caused by a surge or the like can be prevented without floating, the above technique is not taken. For example, the configuration of the multilayer substrate in FIG. As shown in FIG. 21, the mounting surface metal reflective film on which the LED chip 501 is mounted is electrically connected to another third back electrode that is insulated from the first and second back electrodes connected to the anode and cathode of the external power source. It is also possible to take measures by arranging the conductive portions of the respective layers of the multilayer substrate so that they are connected thermally and connecting the third back electrode to an external ground terminal insulated from the anode and cathode. it can. Furthermore, in this example, the heat dissipation characteristics of the LED chip 501 can be further improved through the third back electrode.

  This can be similarly applied to the examples of FIGS. 20 and 32 to 35 shown in the fourth embodiment.

  As described above, the light-emitting element of the present invention described in each of the above-described embodiments is arranged near the light emission surface because light leakage is improved, light emission efficiency is high, and heat dissipation is excellent. The present invention can be suitably used for a backlight unit having a waveguide plate.

  That is, by including the display element of the present invention, a backlight unit with high light use efficiency and excellent long-term reliability can be realized.

[Sixth Embodiment]
The following will describe still another embodiment of the present invention with reference to FIGS. 43 and 44. FIG. For convenience of explanation, the same members as those shown in the drawings of the above-described embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  In each of the above-described embodiments, the insulating portion has a laminated structure in which a light-reflective filler-free resin layer that does not include a light-reflective filler and a light-reflective filler-added resin layer that includes a light-reflective filler are stacked. It was. On the other hand, in this Embodiment, the reflective filler is added to the whole insulating part.

  FIG. 43 is a cross-sectional view of light-emitting element 1000 according to this embodiment. The light-emitting element 1000 has a structure in which the insulating portion 509 is replaced with an insulating portion 1009 in the light-emitting element 500 illustrated in FIG. Unlike the insulating portion 509, the insulating portion 1009 is added with a light reflective filler. Thereby, compared with the case where the insulation part has a laminated structure, manufacturing cost can be held down cheaply.

  As the light reflective filler, aluminum oxide, silicon oxide, titanium dioxide or the like having high light reflectance can be used. Here, as described above, when titanium dioxide is used as the light-reflective filler, the metal reflector 502, the light-transmitting encapsulant 510, and the insulating portion are formed during the light emission operation by the photocatalytic reaction in the presence of oxygen. There is a risk of oxidation of 1009 (oxygen passes through the sealing resin and is absorbed by the peripheral members and contains air and moisture as a source). On the other hand, when other reflective fillers such as aluminum oxide and silicon oxide are used, the above photocatalytic action does not occur, but aluminum oxide and silicon oxide are hygroscopic. Therefore, there is a risk that the air and moisture absorbed in the sealing step of the translucent sealing body 510 are vaporized by heat during the light emitting operation and the translucent sealing body 510 is peeled off.

  Therefore, in the present embodiment, there is a limit to the amount of light reflective filler added. Then, the addition amount of a light reflective filler is demonstrated.

  FIG. 44 is a graph showing the relationship between the visible light reflectance of the insulating portion 1009 and the addition amount of the light reflective filler. The reflectance of the insulating portion 1009 is saturated at a reflectance β% when the addition amount of the light reflective filler is α% by weight. Here, when the addition amount of the light reflective filler is small, light is transmitted through the insulating portion 1009 or absorbed by the insulating portion 1009, and thus the reflectance is lowered. When the addition amount of the light reflective filler is α% by weight or less, it becomes difficult to set the reflectance of the insulating portion 1009 due to the variation in the addition amount. Therefore, the addition amount of the light reflective filler is set to be more than α wt%.

  If the amount of the light-reflective filler added is too large, there is a risk that oxidation of the metal reflector 502 or the like and peeling of the light-transmitting encapsulant 510 may occur, so the amount of light-reflective filler added is more than α% by weight, In addition, it is set in the vicinity of α wt%.

  In addition, a temperature cycle test was performed on the light-emitting element 1000 in a high humidity environment, and the influence of thermal expansion / contraction of the light-emitting element 1000 and durability against temperature change were measured. In this temperature cycle test, a cycle in which the ambient temperature was changed from a low temperature (−40 ° C.) to a high temperature (120 ° C.) over 30 minutes was defined as one cycle, and this cycle was repeated 1000 times.

  As a result, it was found that if the amount of the light reflective filler added to the insulating portion 1009 is too large, cracks are likely to occur. Specifically, when the addition amount of the light reflective filler was 30% (resin 70%), the occurrence of cracks was not confirmed, but the addition amount of the light reflective filler was 36% (resin 64%). In the case, occurrence of cracks was confirmed. In this test, titanium dioxide is used as a light-reflective filler, and silica is added to the insulating portion 1009 to adjust the thermal expansion coefficient, and a part of the silica and titanium dioxide are replaced.

  Therefore, in the present embodiment, the upper limit of the addition amount of the light reflective filler is set to 30% by weight or less. That is, when the addition amount of the light reflective filler is A, α <A ≦ 30 is set.

  As described above, when the light reflective filler is added to the entire insulating portion 1009, by limiting the amount of the light reflective filler added, oxidation of the metal reflector 502 or the like and peeling of the translucent sealing body 510 are performed. The light utilization efficiency can be improved while avoiding the above-described adverse effects and the occurrence of cracks in the light-emitting element 1000.

[Summary of Embodiment]
The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the technical means disclosed in different embodiments can be appropriately combined. Such embodiments are also included in the technical scope of the present invention.

It is a perspective view of the light emitting element of a 1st embodiment. It is sectional drawing of the light emitting element of 1st Embodiment. (A)-(h) is a block diagram of the metal reflecting plate and laminated substrate of the light emitting element of 1st Embodiment. It is a perspective view of the light emitting element of a 1st embodiment. It is a perspective view of the light emitting element of a 1st embodiment. It is a perspective view of the light emitting element of 2nd Embodiment. It is sectional drawing of the light emitting element of 2nd Embodiment. (A)-(f) is a block diagram of the metal reflecting plate and laminated substrate of the light emitting element of 2nd Embodiment. It is a perspective view of the light emitting element of 2nd Embodiment. It is a perspective view of the light emitting element of 2nd Embodiment. It is a perspective view of the light emitting element of 2nd Embodiment. It is sectional drawing of the light emitting element of 2nd Embodiment. It is a perspective view of the light emitting element of 2nd Embodiment. It is sectional drawing of the light emitting element of 2nd Embodiment. It is sectional drawing of the conventional light emitting element. FIG. 27 is a plan view of the light emitting device shown in FIG. It is sectional drawing of the light emitting element of 3rd Embodiment. It is a schematic diagram which shows the state which mounted the light emitting element of 3rd Embodiment in the housing | casing of an electronic device. It is sectional drawing of the light emitting element of 4th Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 4th Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 5th Embodiment. (A)-(f) is a block diagram of the metal reflecting plate and laminated substrate of the light emitting element of 5th Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 2nd Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 2nd Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 2nd Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 2nd Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 3rd Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 3rd Embodiment. It is explanatory drawing which shows the example of the electric potential of the light emitting element of 3rd and 4th embodiment. It is explanatory drawing which shows the example of the electric potential of the light emitting element of 3rd Embodiment. It is explanatory drawing which shows the example of the electric potential of the light emitting element of 3rd Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 4th Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 4th Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 4th Embodiment. It is explanatory drawing which shows schematic structure of the light emitting element of 5th Embodiment. It is explanatory drawing which shows the example of the electric potential of the light emitting element of 5th Embodiment. It is explanatory drawing which shows the example of the electric potential of the light emitting element of 5th Embodiment. It is explanatory drawing which shows the formation process of the insulation part of the light emitting element of 1st Embodiment. It is explanatory drawing which shows the formation process of the insulation part of the light emitting element of 1st Embodiment. It is explanatory drawing which shows the cross section of the insulating part after grinding | polishing of the light emitting element of 1st Embodiment. It is explanatory drawing which shows the partial expanded cross section of the light emitting element shown in FIG. It is a perspective view of the conventional side light emission type LED. It is sectional drawing of the light emitting element of 6th Embodiment. It is a graph which shows the relationship between the visible light reflectance of an insulation part, and the addition amount of a light reflective filler.

500 Light-Emitting Element 501 LED Chip 501a Light-Emitting Surface 502 Metal Reflecting Plate 502a Surface 506 Multilayer Substrate 507 Die Bond Area / Electrode Common Portion (First Metal Portion / Mounting Surface Metal Reflecting Film)
508 Island electrode (second metal part)
509 Insulating part 509a Cu foil 509b Titanium dioxide additive-free resin layer (light-reflective filler-free resin layer)
509c Titanium dioxide-added resin layer (light-reflective filler-added resin layer)
509d Laminated structure 509e Conductive layer (Cu post layer)
510 Translucent sealing body 513 Light emission surface 515,516 Through-hole 518,519 Back electrode (1st, 2nd back electrode)
530 Metal plate 600 Light-emitting element 606 Multilayer substrate 607 Die bond area / electrode common part (first metal part / mounting surface metal reflective film)
608 Island electrode (second metal part)
609 Insulating ring (insulating part)
631 to 634 Conductive portions 711 and 712 External bonding electrode 751 Integrated external bonding electrode 700 Light emitting element 701 LED chip 702 Metal reflector 707 First island electrode (first metal portion)
708 Second island electrode (second metal part)
709a First insulating portion 709b Second insulating portion 720 Mounting surface metal reflective film 733, 734 Conductive portion 740 Heat dissipation sheet 800 Light emitting element 802 Metal reflector 807 First island electrode (first metal portion)
808 Second island electrode (second metal part)
809a First insulating portion 809b Second insulating portion 900 Light emitting element 901 LED chip (second LED chip)
908 Third metal portion 909c Third insulating portion 920 Mounting surface metal reflective film 1000 Light emitting element 1009 Insulating portion

Claims (1)

A first metal portion formed on the mounting surface of the substrate as a mounting surface metal reflective film;
At least one second metal part electrically insulated by the first metal part and the insulating part and formed on the mounting surface;
An LED chip mounted on the first metal part and having one electrode electrically connected to the first metal part and the other electrode electrically connected to the second metal part;
A metal reflector formed integrally with the first metal part so as to surround the mounting surface, reflects the emitted light from the LED chip, and guides it to a light emitting surface provided in the light emitting direction;
A region surrounded by the substrate and the metal reflector is filled, and a light-transmitting sealing body formed so as to seal the LED chip is provided.
The insulating portion has a laminated structure in which a light-reflective filler-free resin layer that does not contain a light-reflective filler and a light-reflective filler-added resin layer that contains the light-reflective filler are laminated from the light incident side. The light-reflecting filler-added resin layer is covered with the light-reflecting filler-free resin layer. The light-reflecting filler-added resin layer is formed so as to surround the second metal portion in a region surrounded by the metal reflecting plate. A light emitting element which is not exposed to the atmosphere .

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