JP5353261B2 - Method for manufacturing metalized long resin film substrate and plating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a long-length metalized resin film showing little surface defects, even in continuous operation, and a plating apparatus for manufacturing the substrate. <P>SOLUTION: A joint part A is formed by contacting an end of a long-length resin film F having a metal film with an end of another long-length resin film F having a metal film and attaching a conductive tape 1 thereon. A rear tape 2 is an adhesive tape and can be used accordingly. At the joint part A, the conductive tape 1 and the rear tape 2 form a level difference d. While the joint part A is in contact with an electric supply roller of the plating apparatus, electric current supplied to the electric supply roller is controlled so that the maximum difference in electric potentials between an anode inside a plating liquid tank and the electric supply roller is in the range of 0.8-1.7 times of the difference in electric potentials during operation. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

The present invention relates to a method for producing a metallized long resin film substrate and a plating apparatus used for the production.

  Resin films have flexibility and can be easily processed. Therefore, a metal film or an oxide film is formed on the surface of the resin film, and it is widely used in the industry as electronic parts, optical parts, packaging materials, and the like. For example, flexible wiring boards having flexibility are used in small electronic devices such as mobile phones.

  By the way, a flexible wiring board is manufactured by a subtractive method or the like from a three-layer copper polyimide substrate in which an adhesive is used between a polyimide film, which is a kind of resin film, and a copper foil, and the both are laminated.

  In recent years, as electronic components have become lighter, thinner, and smaller, there has been an increasing demand for narrowing the wiring pitch. There is a demand for a metallized polyimide substrate which is a kind of metallized resin film substrate that does not use an adhesive from a conventional three-layer copper polyimide substrate. Since there is no adhesive, it is not affected by the characteristics of the adhesive, and it is possible to realize a pitch between wirings by utilizing the inherent stability of polyimide. The metallized polyimide substrate is adopted as COF (Chip on Film) in a driver circuit of a liquid crystal display.

As a method for obtaining a metallized polyimide substrate, a method is known in which a metal film is laminated on the surface of a polyimide film by sputtering or vapor deposition and then a metal layer is thickened by electroplating or electrolytic plating (for example, , See Patent Document 1 and Patent Document 2.) Moreover, the electrolytic plating method of a metallized polyimide board | substrate (plating method 2 layer circuit base material) is also known (for example, refer patent document 3). Although this patent document 3 discloses a technique for performing electrolytic plating on a plastic film substrate using an electrolytic plating apparatus, the correspondence to the plastic film substrate in the continuous operation and the subsequent plastic film substrate is disclosed. Not.
Looking at the demand for COF, the fine wiring is progressing with the high definition of the liquid crystal display. Under such circumstances, demands for the appearance quality of the metallized polyimide substrate are becoming strict. As such a requirement, as for the external appearance, it is first necessary to take measures against pinholes in the copper plating layer, and as the miniaturization of wiring further proceeds, surface defects such as irregularities on the surface of the copper plating layer of the metalized polyimide substrate On the other hand, reduction is demanded (see, for example, Patent Document 4).

JP 2002-252257 A JP 2003-334890 A JP 2007-246962 A JP-A-9-289368

  As described above, a metallized polyimide substrate is used as a COF material, and it is required to improve the appearance quality such as surface defects including irregularities.

  An object of this invention is to provide the manufacturing method of the metallization long resin film board | substrate with few surface defects also in continuous operation, and the plating apparatus for manufacturing this board | substrate in view of the said situation.

In order to solve the above-mentioned problems, the present inventors diligently studied a method for suppressing defects on the surface of a metallized polyimide film. As a result, a method for producing a metallized long resin film substrate for achieving the above object is provided on the metal film of the long resin film with a metal film in which a metal film is formed on at least one surface of the long resin film. In the manufacturing method of manufacturing a metallized long resin film substrate by forming an electroplating film in a plating solution tank while conveying the long resin film with a metal film in the longitudinal direction,
(1) A connecting portion is provided between the metallized long resin films adjacent to each other to electrically and mechanically connect a plurality of the long resin films with metal films in the longitudinal direction;
(2) While the connecting portion is in contact with the power feeder of the electroplating apparatus, the maximum potential difference between the anode (anode) inside the plating bath and the power feeder is the potential difference during operation. The current flowing through the power feeder is controlled so as to be in the range of 0.8 times or more and 1.7 times or less.

here,
(3) The metal film is a metal selected from nickel, chromium and copper, or an alloy containing any of nickel, chromium and copper,
(4) The electroplating may be copper electroplating.

Also,
(5) The metal film may be formed by a vacuum film forming method.

further,
(6) The long resin film may be a polyimide film.

Furthermore,
(7) The connecting portion may be formed by pasting a conductive pressure-sensitive adhesive tape or bonding with a conductive adhesive.

Furthermore,
(8) The height difference of each level | step difference formed with the said connection part and the said long resin film with a metal film may be 100 micrometers or less.

Furthermore,
(9) The conductive adhesive tape may have a thickness of 20 μm to 100 μm.

Furthermore,
(10) The electrical resistance between the long resin film with a metal film and the conductive adhesive tape affixed to the long resin film with a metal film may be 0.1Ω or less.

In order to achieve the above object, a plating apparatus of the present invention comprises a plating solution tank containing a plating solution, an anode (anode) installed in the plating solution tank, and at least one surface of a long resin film. Conveying means for immersing the long resin film with a metal film in the plating solution tank while keeping the width direction of the long resin film with a metal film formed in a horizontal direction and conveying in the longitudinal direction thereof, and the plating In a plating apparatus provided with a power supply body that supplies power to the metal film of the long resin film with a metal film outside the liquid tank, and a power supply that supplies power while controlling a current flowing through the power supply body,
(11) A connecting portion disposed between the metallized long resin films that electrically and mechanically connect a plurality of the long resin films with metal films adjacent to each other apart from each other,
(12) A connecting portion detecting means for detecting the connecting portion, arranged in front of the plating bath on the transport path of the long resin film with a metal film and in front of the power feeding means,
(13) While the connection detection unit receives the detection signal of the connection part and the connection part is in contact with the power supply, the maximum value of the potential difference between the power supply and the anode is during operation. And a control means for controlling the power supply so as to be within a range of 0.8 times or more and 1.7 times or less of the potential difference.

  Here, the long resin film with a metal film refers to a film in which a metal thin film is formed (attached) on the surface of the resin film, and the metal film is formed by sputtering or the like. The thing whose resin is a polyimide is also contained.

  Moreover, a metallized long resin film substrate means the film which electroplated copper etc. on the metal thin film of the long resin film with a metal film.

  Moreover, the time of operation means the time slot | zone when electroplating is performed when said connection part is not contacting the electric power feeding body.

  According to the present invention, it is possible to continuously produce a metallized long resin film substrate with few surface defects such as irregularities on a plating film, and to support a metallized length corresponding to a pitched wiring found in COF or the like. A long resin film substrate can be provided with high yield.

It is the schematic which shows an example of the plating apparatus of this invention. It is the schematic which shows the positional relationship when the connection part A of the elongate resin film F with a metal film and the electric power feeding roll which is a power feeding body contact. It is sectional drawing which shows the example which affixed the electroconductive tape 1 on the metal film Fa between the long resin films F with a metal film adjacent to each other. It is sectional drawing which shows the example which overlapped the long resin film with metal film F, and formed the connection part A with the conductive tape 1 and the back surface tape 2. FIG. It is sectional drawing which shows the example seen from the width direction of the long resin film with a metal film which formed the connection part A using the conductive adhesive 4. FIG. It is a graph showing the appearance frequency of the unevenness | corrugation to 120 m toward the terminal direction from the connection part A in Experimental example 4. FIG.

  The present invention is a long resin film with a metal film produced by forming a base metal layer of a nickel-chromium alloy on the surface of a polyimide film by a sputtering method and forming a copper layer on the surface of the base metal layer by a sputtering method. It has been realized in the plating equipment for copper plating.

  The plating apparatus of the present invention will be described with reference to FIG.

  FIG. 1 is a schematic view showing an example of a plating apparatus of the present invention.

  The plating apparatus 10 includes an unwinding roll 12 for unwinding the long resin film F with a metal film, a plating solution tank 11 filled with the plating solution L, an anode (anode) 14a disposed inside the plating solution vessel 11, 14b, 14c, 14d, and 14e, and a power supply roll 16a that is outside the plating bath 11 and supplies power to the long resin film F with a metal film (an example of a power supply according to the present invention) 16a, 16b, 16c, 16d, and 16e, and a winding roll 15 that winds up a metallized long resin film substrate S obtained by electroplating a long resin film with a metal film. The unwinding roll 12, the roll 13 inside the plating solution tank 11, the power supply roll 16, and the winding roll 15 constitute a conveying means for the long resin film F with the metal film. It is immersed in the plating solution L while being transported in the longitudinal direction while keeping its width direction horizontal.

  Between the first (first) power supply roll 16a and the unwinding roll 12 on the transport path of the long resin film F with the metal film, a photoelectric that constitutes a connection part detection means for detecting a connection part A described later. Each power supply 23a, 23b, 23c, 23d, 23e that receives the detection signal of the sensor 21 and the connection portion A emitted from the photoelectric sensor 21 and supplies power to the power supply rolls 16a, 16b, 16c, 16d, 16e. And a controller 22 (which is an example of the control means referred to in the present invention). Signal lines 24 and 25 are connected between the photoelectric sensor 21 and the controller 22 and between the controller 22 and each power source 23. Each power supply roll 16a, 16b, 16c, 16d, 16e and each power source 23a, 23b, 23c, 23d, 23e are connected by a power line 26. The power source 23a and the anode 14a, the power source 23b and the anode 14b, and the power source 23c. And the anode 14c, the power source 23d and the anode 14d, and the power source 23e and the anode 14e are also connected by a power line (not shown). Each power source 23 is a DC power source. Each of the power supply rolls 16a, 16b, 16c, 16d, 16e and the anodes 14a, 14b, 14c, 14d, 14e are paired and receive power from the independent power sources 23a, 23b, 23c, 23d, 23e, Each controls the maximum value of the potential difference by separate current control.

  In addition, since the power supply rolls 16a, 16b, 16c, 16d, and 16e and the anodes 14a, 14b, 14c, 14d, and 14e are provided with the power sources 23a, 23b, 23c, 23d, and 23e, the power supply rolls 16a, 16b, and 16c are provided. , 16d, 16e and the anodes 14a, 14b, 14c, 14d, 14e are electrically independent. Even if a plurality of anodes 14a, 14b, 14c, 14d, and 14e are provided in the same plating tank 11, a pair of each of the power supply rolls 16a, 16b, 16c, 16d, and 16e and the anodes 14a, 14b, 14c, 14d, and 14e Are electrically independent of each other.

  The control of the power source 23 performed by the controller 22 is provided with a photoelectric sensor 21 for detecting the conductive tape 1 or the conductive adhesive 4 in the connection portion A, and the power supply rolls 16a, 16b, 16c, 16d, 16e and the connection portion A. Is grasped (when grasping how many seconds later), and current control is performed immediately before the connection portion A contacts the power supply rolls 16a, 16b, 16c, 16d, and 16e. . Specifically, the controller 22 includes a programmable logic controller (PLC), that is, a sequencer. When the photoelectric sensor 21 detects the conductive tape 1 (or the conductive adhesive 4), the controller 22 calculates the time that the conductive tape 1 contacts each power supply roll 16, and the conductive tape 1 supplies each power supply. While in contact with the roll 16, the maximum potential difference between the power supply rolls 16a, 16b, 16c, 16d, and 16e and the corresponding anodes 14a, 14b, 14c, 14d, and 14e is determined during operation. The controller 22 controls the power supplies 23a, 23b, 23c, 23d, and 23e so as to be within the range of 0.8 to 1.7 times the potential difference of the power supply rolls 16a, 16b, 16c, 16d, and 16e. To control the current flowing through.

  The example which manufactured the process which manufactures the copper polyimide board | substrate which is 1 type of the metallization long resin film board | substrate S with the plating apparatus 10 is demonstrated. The connecting portion A has a structure in which a long resin film F with a metal film shown in FIG.

  A long resin film F with a metal film was manufactured by forming a base metal layer of nickel-chromium alloy on the surface of a polyimide film by a sputtering method, and forming a copper layer on the surface of the base metal layer by a sputtering method.

  The long resin film F with the metal film is wound in the direction in which the surface of the metal film Fa of the long resin film F with the metal film is in contact with the power supply roll 16 through the unwinding roll 12, the power supply roll 16, and the roll 13. Attach to reach. The plating solution tank 11 was filled with a copper plating solution. As the copper plating solution, a known copper plating solution, for example, a known copper sulfate plating bath (bright bath) can be used. This copper sulfate plating bath is composed of copper sulfate, sulfuric acid, a small amount of chlorine ions, known additives, and the like, and the composition thereof can be appropriately selected. Known phosphorous copper anodes were used as the anodes 14a, 14b, 14c, 14d, and 14e.

  The long resin film F with the metal film is transported inside the plating apparatus 10, and a potential difference is generated between the power supply roll 16 and the anodes 14 a, 14 b, 14 c, 14 d, 14 e, so that the long resin film with the metal film is covered. By controlling the current density per plating area to a value that can realize a desired film thickness, electroplating is performed by performing current plating to obtain a metallized long resin film substrate S (copper polyimide substrate). When the photoelectric sensor 21 detects the conductive tape 1 of the connection portion A, the controller 22 while the conductive tape 1 is in contact with one of the power feeding rolls 16a, 16b, 16c, 16d, and 16e. However, the power supply 23a, 23b, 23c to which the power supply roll in contact with the conductive tape 1 is connected is controlled so that the electric current difference is within the range of 0.8 times to 1.7 times the potential difference during operation. , 23d, or 23e. That is, only the power sources 23a, 23b, 23c, 23d, and 23e of any of the power supply rolls 16a, 16b, 16c, 16d, and 16e that are in contact with the conductive tape 1 are 0.8 times or more the potential difference during operation. The current is controlled so as to be within the range of 7 times or less. Therefore, the power supply rolls 16a, 16b, 16c, 16d, and 16e that are not in contact with the conductive tape 1 are controlled during normal operation, that is, the current control that determines the maximum potential difference described in this section is performed. Not done. Between the power supply roll 16 and the anode 14 where the conductive tape 1 is not in contact, there is a potential difference during normal operation, and the plating thickness of the product is not affected by the current control.

  The long resin film F with metal film electroplated when it is controlled to be within the range of 0.8 times or more and 1.7 times or less of the potential difference at the time of operation is separated from the normal product after the end of the plating process. It is. For example, if the transport length per time when the current is controlled while the connection portion A (the conductive tape 1) is in contact with the power supply roll 16 is 1 m, the end length (0 m) of the long resin film F with the metal film is 1 m. The range of ˜2 m and the range of 1 m to 2 m from the end (0 m) of the other resin film F with a metal film are not used as products because the metal film thickness is insufficient.

  As explained so far, the plating apparatus 10 continuously performs electroplating on a plurality of long resin films with metal films F without performing the above-described start-up control and turn-off control for each connection portion A. Can do.

  Furthermore, the plating apparatus 10 is multi-stage plating, and is operated so that the value of the applied current increases as the number of times of plating increases. Depending on the number of plating stages (the number of feed rolls and anode pairs) in the plating equipment, the current value is set low in the first half of the plating from the beginning to the half (middle), so there is no concern about the occurrence of sparks. Even if the connection portion A (conductive tape 1) is in contact with the power supply roll, control for determining the maximum value of the potential difference is not necessary. However, the current value is high in half (intermediate) to several steps of plating, and there is a concern of sparking. Therefore, while the connection portion A (conductive tape 1) is in contact with the power supply roll, the potential difference is maximum. Control to determine the value is necessary. As the electroplating progresses, the copper film thickness of the long resin film with metal film also increases, and the surface of the conductive tape is also electroplated, eliminating the level difference caused by the conductive tape and eliminating the risk of sparks. . As described above, in the multi-stage plating of the plating apparatus 10, even when control is performed to determine the maximum value of the potential difference while the connecting portion A (conductive tape 1) is in contact with the power supply roll, in the middle several stages. Good.

  In the plating apparatus 10, the copper plating layer was formed by moving the inside of the plating solution L while conveying the long resin film F with a metal film at several m to several tens m / min.

  The method for producing a metallized long resin film substrate of the present invention comprises a long resin with a metal film on a metal film of a long resin film with a metal film in which a metal film is formed on at least one surface of the long resin film. In a method for producing a metallized long resin film substrate in a plating apparatus that transports a film in the longitudinal direction and performs an electroplating film in a plating bath, a plurality of the long resin films with metal films are electrically charged in the longitudinal direction. A connecting part is provided between the adjacent metalized long resin films to be connected mechanically and mechanically, and while the connecting part is in contact with the power feeder of the electroplating apparatus, the anode ( The current flowing through the power feeding body is controlled so that the maximum value of the potential difference between the anode) and the power feeding body is within the range of 0.8 times to 1.7 times the potential difference during operation. Metalized long resin film It is a method for producing a beam substrate. That is, a long resin film with a metal film is immersed in a plating bath by a conveying means such as a roll, and the anode and a power feeder (power feeding rolls 16a, 16b, 16c, 16d, 16e in the plating apparatus 10 shown in FIG. 1) and Is a manufacturing method for producing a metallized long resin film substrate by electroplating on the metal film of a metallized long resin film with a potential difference of, in particular, a plurality of long resin films with metal films are continuously supplied A connecting portion that is electrically and mechanically connected in the longitudinal direction is provided between the long resin film with a metal film and a long resin film with a metal film adjacent thereto (following). While in contact with the power supply, the current flowing through the power supply is adjusted so that the maximum value of the potential difference between the anode and the power supply is within the range of 0.8 to 1.7 times the potential difference during operation. Control It is a manufacturing method comprising. In addition, the time of operation here means the time slot | zone when electroplating is performed when the connection part is not in contact with the electric power feeder.

  By providing a connecting portion so as to electrically connect the long resin films with metal films adjacent to each other in the longitudinal direction, the plurality of long resin films with metal films are always electrically connected in the longitudinal direction. Secured. By always ensuring conduction, it is possible to suppress the occurrence of surface defects such as irregularities due to electroplating in the plating film.

  Considering the electroplating process, in the electroplating process during the manufacturing process of the metallized long resin film substrate, the top part of the long resin film with metal film (tip part) and the end part of the long resin film with metal film (terminal part) ) Requires start-up control and turn-down control different from control of the plating conditions (current control) of the intermediate portion of the long resin film with a metal film. In electroplating, it is necessary to keep the current density with respect to the area of the object to be plated in the plating bath constant in order to keep the thickness of the plating film constant. Since the start-up control and the fall-down control perform current control corresponding to the increase and decrease in the area to be plated, they often become a starting point that causes surface defects due to electroplating due to a sudden increase or decrease in current. However, by providing a connecting portion that electrically and mechanically connects both of the long resin films with metal films adjacent to each other, a plurality of long resin films with metal films are electrically connected in the longitudinal direction. Therefore, it is possible to reduce the frequency of start-up control and fall-down control and suppress surface defects. In addition, when the connection part comes into contact with the power supply body, the contact with the power supply body becomes unstable due to the step formed by the long resin film with metal film and the connection part before and after the contact. There is a risk of sparks becoming stable. However, by controlling the maximum value of the potential difference between the anode and the power supply so as to be within the range of 0.8 times to 1.7 times the potential difference during operation, the occurrence of high voltage spark is suppressed. It becomes possible. In addition, when the connection portion is in contact with the power feeder, the current difference is set to 0.8 times or more of the potential difference during operation to perform current control similar to the above-described start-up control or fall-down control when reducing the potential difference. This is to avoid that. That is, if the potential difference is less than 0.8 times that during operation, the range in which the current value is increased or decreased is widened, which affects the occurrence of surface defects due to a sudden increase or decrease in current.

  With reference to FIG. 2, the positional relationship of the connection part A of the elongate resin film F with a metal film and the feed roll 16 is demonstrated. 2A and 2B are schematic views showing a positional relationship when the connection portion A of the long resin film F with a metal film comes into contact with the power supply roll 16 that is a power supply body. The spark is generated between the step generated by the connection portion A and the power supply roll 16. More specifically, when a high resistance portion such as a portion having a narrow contact area caused by the step of the connection portion A comes into contact with the power supply roll 16, a high voltage is caused to flow a constant value through the narrow portion. Sparks are generated. The spark mark is generated in the vicinity of the connection portion A of the long resin film F with the metal film. When sparking occurs, dirt is generated on the surface of the power supply roll 16, and surface defects are generated in the metallized long resin film substrate due to the dirt.

  The potential difference between the power supply roll 16 and the anode is appropriately selected. For example, in the plating apparatus 10 of FIG. 1 described above, when electroplating a long resin film with a metal film that is not a normal operation, that is, a connecting portion, the potential difference between the anode and the power supply roll is 3 V, but contact When the portion is in contact with the power supply roll, the occurrence of a spark can be prevented by suppressing the maximum potential difference to 5 V (applying current control). As a result, since no spark is generated, no surface defect is generated. Note that the spark potential when spark is generated without using the manufacturing method of the present invention is unknown, but since the voltage of the power feeder that does not generate spark is low, a considerable potential difference occurs. It seems that

  Various examples of the connection portion A will be described with reference to FIGS.

  3 to 5 are cross-sectional views schematically showing the side surface of the long resin film F with a metal film in the connection portion A viewed from the width direction.

  FIG. 3 is a cross-sectional view showing an example in which the conductive tape 1 is affixed between the metal film-attached long resin films F adjacent to each other and on the metal film Fa. In the example of FIG. 3, the end surfaces of the long resin film with a metal film are brought into contact with each other, and the conductive tape 1 is applied to form the connection portion A. The back tape 2 is an adhesive tape and can be used as appropriate. In the connection portion A of FIG. 3, a step d is formed by the conductive tape 1 and the back surface tape 2.

  FIG. 4 is a cross-sectional view showing an example in which the connection portion is formed by the conductive tape 1 and the back surface tape 2 by overlapping the long resin film F with a metal film. In the example of FIG. 4, the overlapping portion of the long resin film F with the metal film is bonded with the double-sided adhesive tape 3. The conductive tape 1 is stuck on the metal film Fa.

  FIG. 5 is a cross-sectional view illustrating an example of the long resin film with a metal film in which a connection portion is formed using the conductive adhesive 4 as seen from the width direction. In the example of FIG. 5, the conductive film 4 may be bonded to the metal film Fa so as to ensure the conductivity of the metal film Fa by overlapping the longitudinal ends of the long resin film F with the metal film. Moreover, you may adhere | attach suitably with the electrically conductive adhesive 4 to the overlapping part of the elongate resin film F with a metal film.

  As the conductive adhesive 4, a known conductive adhesive can be used in consideration of being chemically resistant to the plating solution. The conductive adhesive 4 is a mixture of a conductive powder such as silver powder or copper powder and a phenol resin or an epoxy resin, and can be applied to a long resin film with a metal film and cured by heating or the like.

  As the conductive tape 1, a commercially available metal foil tape composed of an adhesive portion and a metal foil can be used. Moreover, it is desirable to use a copper foil metal foil tape in consideration of the conductivity of the metal foil tape. The adhesive portion of the metal foil tape only needs to be chemically resistant to the plating solution. Moreover, the adhesive tape 1 needs that the adhesion part has electroconductivity.

A plurality of steps may be formed as the step d caused by the connection portion A and the long resin film F with the metal film, but it is desirable that the height difference of one step d does not exceed 100 μm. This is because, when the height difference of one step exceeds 100 μm, the contact with the power feeder becomes unstable due to the step, and sparks may occur. Here, the height difference of the level difference d means a height difference in the normal direction of the surface of the long resin film F with a metal film.
The thickness of the conductive tape 1 is desirably 20 μm to 100 μm. The reason for this is that when the tape thickness is less than 20 μm, the metal foil becomes thin, the conductivity of the conductive tape 1 becomes small (the resistivity increases), and the electrical conductivity is impaired, while the tape thickness exceeds 100 μm. This is because there is a concern about the occurrence of sparks due to the tape step.

  Furthermore, the electrical resistance value between the conductive tape 1 and the long resin film F with a metal film is preferably 0.1Ω or less. The use of the conductive tape 1 prevents the occurrence of sparks and maintains the stability of the appearance quality. If the contact resistance value is satisfied, the conductive tape 1 may use another type such as an adhesive. It does not matter and the material is not specified to be metallic.

  The long resin film will be described.

  As the long resin film, a polyimide film, a polyamide film, a polyethylene naphthalate film, a polyester film, a polytetrafluoroethylene film, a liquid crystal polymer film, a polyether sulfone film, or the like can be used. Of these resin films, a polyimide film is desirable in terms of electrical insulation, heat resistance, and flexibility. In addition, according to the structure of the connection part shown in the above-mentioned FIG. 3, it becomes a problem of a long resin film. In the case where the connection portion is configured by overlapping the long resin film with a metal film, the thickness of the long resin film is preferably 50 μm or less in consideration of the thickness of the metal film and the step of the connection portion.

  The long resin film F with a metal film will be described.

  The long resin film F with a metal film refers to a long resin film in which a metal film is formed (applied) on the surface of the above-described long resin film. Forming a metal film on the surface of a long resin film means forming a metal film without using an adhesive. That is, the long resin film F with a metal film is a long resin film in which a metal film is formed on the surface of the long resin film by a vacuum film formation method or the like. As will be described later, the long resin film with metal film F becomes a metallized long resin film substrate through an electroplating process.

  As described above, the long resin film with a metal film F is manufactured by forming a metal film of a long resin film by a vacuum film forming method. Examples of the vacuum film forming method include a physical film forming method such as a vacuum vapor deposition method and a sputtering method, and a chemical film forming method such as a chemical vapor deposition method (CVD). More specifically, the vacuum deposition method is a method of forming a thin film on a substrate by heating and evaporating a film forming material of an evaporation source by resistance heating or electron gun irradiation. A plasma-assisted vapor deposition method is also known in which plasma is formed between an evaporation source and a substrate for the purpose of adhesion and densification of a thin film during vapor deposition.

  Of the vacuum film forming methods, the sputtering method is desirable. The sputtering method uses a target obtained by forming a film forming material into a plate shape, generates plasma between the substrate and the target using the above plasma generation method using the target as an electrode for discharge, and uses the potential gradient to generate a target surface. In this method, the target material is knocked out by irradiating and colliding with ions to form a thin film of the target material on the substrate. The reason why the sputtering method is desirable is that the plasma can be controlled by a magnetic field or the like.

  As the metal film of the long resin film F with the metal film, a metal selected from nickel, chromium and copper or an alloy containing any of nickel, chromium and copper can be selected. For example, in the case of the above-mentioned metallized polyimide substrate (when the outermost metal is copper, it is referred to as a copper polyimide substrate), the metal applied to the surface of the polyimide film by a vacuum film forming method includes nickel and chromium. Alternatively, an alloy containing either nickel or chromium is desirable. As the composition of the alloy containing either nickel or chromium, a known alloy composition can be appropriately selected from the use of the copper polyimide substrate. The reason for using nickel, chromium, or an alloy thereof is to improve the adhesion between the polyimide film and the metal. In a copper polyimide substrate, a copper layer is formed on a surface of a film of nickel, chromium, or an alloy containing any of these by a vacuum film formation method. The reason for forming the copper layer is to ensure conductivity when performing electroplating. This is because electroplating is performed on the surface of the copper layer of the long resin film with a metal film, and copper has a low resistance value if it is made of nickel, chromium, or an alloy thereof.

  Here, a long resin film with a metal film for a copper polyimide substrate has been described, but a long resin film with a metal film for a copper polyimide substrate is a polyimide film, nickel or chromium, or an alloy film containing any of these, The copper layers are stacked in this order. Here, nickel, chromium, or an alloy film containing any of these is referred to as a base metal layer. A laminated film of the base metal layer and the copper layer becomes a metal film.

  In addition to the vacuum film forming method for producing a long resin film with a metal film, an electroless plating method or the like can also be performed.

  The metallized long resin film substrate will be described.

The metallized long resin film substrate is manufactured by forming a plating film on the metal film of the long resin film with metal film F described above by electroplating. For example, in the above-mentioned copper polyimide substrate, which is a kind of metallized long resin film substrate, the base comprising a nickel film, a chromium film, or an alloy layer containing any of these by sputtering, which is a kind of vacuum film forming method. It is manufactured by forming a copper plating film on the copper layer by copper electroplating on a long resin film F with a metal film in which a copper layer is laminated on a polyimide film on the metal layer and the base metal layer. The base metal layer and the copper layer of the long resin film F with the metal film have a total thickness of several to several thousand, and the thickness of the copper plating film forms a thickness of several to several hundred μm. In addition, prior to copper electroplating, an electroless plating method can be appropriately performed on the copper layer.
(Experiment 1)

  Electroplating was performed with the plating apparatus 10 of FIG.

A base metal layer of nickel 7% chromium was formed on a surface of a polyimide resin 150EN-F (thickness 38 μm, width 524 mm) made by Toray DuPont on a long resin film by a sputtering method to a thickness of 75 mm. A copper film was formed on the surface, and a metal film-attached long resin (polyimide) film in which a metal film (total film thickness 1100 mm) was laminated was obtained. As shown in FIG. 2, the connecting portion A is a conductive tape (copper tape: manufactured by Dainippon Ink & Chemicals, Inc., thin copper foil tape E-1100LC 18 μm thick copper foil). Adhesive layer 22 [mu] m wide 50 mm) and connected. A copper-plated film was formed on the long resin film F with a metal film so as to have a film thickness of 8 μm to obtain a metalized long polyimide film substrate S. The potential difference of normal plating was 3V. Current density, power 23a is 0.01 A / cm ^2, the power 23b is 0.02 A / cm ^2, the power 23c is 0.03 A / cm ^2, power 23d is 0.04 A / cm ^2, the power supply 23e 0.04 A / Cm ² was set. When the current was controlled so that the voltage while the conductive tape 1 (connection portion A) was in contact with the power supply roll 16 did not exceed 5V, the tape was continuously manufactured between 0 to 10 m (a pair of power supply roll and anode). The number of irregularities with a diameter of 20 to 50 μm per 50 mm × 50 mm in the range in which electroplating is performed, that is, the range in which the current density is maintained was 0.2 / 50 mm □. The number was 0.2 / 50 mm □ even at a location 10 m to 20 m away from the connection portion. Furthermore, it was 0.3 piece / 50mm (square) in the location 20m-30m away from the connection part. Therefore, the surface defects at the connection portion were within the practical range.

Note that the above-described evaluation results of surface defects are not evaluation results at the time of start-up control or start-up control at the start or end of plating. In the start-up control after the start of plating, the metalized polyimide film S has 1.0 μm / 50 mm □ or more of irregularities with a diameter of 20 μm to 50 μm from the tip (0 m) to 20 m, which is not practical and must be discarded. is there. Further, in the falling control, the occurrence of unevenness from the end (0 m) to 20 m was the same. By using the metallized long resin (polyimide) film substrate manufacturing method of the present invention, the metallized polyimide film substrate can be operated continuously, and the number of start-up and turn-off controls can be reduced. The amount of waste is drastically reduced.
(Experimental example 2)

When the metallized polyimide film S was produced by the same method as in Experimental Example 1, a white unevenness-like fine unevenness of 20 μm or less was produced by an area inspection with an area cost of 0%.
(Comparative Example 1)

As shown in FIG. 2, the conductive tape 1 is used instead of the conductive tape 1 in the connection portion A formed by abutting the long resin film F with the metal film and the long resin film F with the metal film. When connected with a non-conductive masking tape and continuously manufactured without current control, a spark with an instantaneous current exceeding 50 A occurred at the connecting portion with the feeding roll 16c, and the substrate surface defects near the connecting portion A increased dramatically. . There were many surface defects, and it was not practical.
(Experimental example 3)

3m with 35 μm thick copper foil, 35 μm adhesive layer and 25 mm width on the conductive tape 1 of the connecting portion A formed by abutting the long resin film F with metal film and the long resin film F with metal film shown in FIG. A metalized polyimide film was produced in the same manner as in Experimental Example 1 except that a conductive tape was used. In this case, even in the appearance inspection, a white uneven unevenness of 20 μm or less was generated with an area ratio of 23%. However, since the irregularities are minute irregularities with surface defects of 20 μm or less, it is in a practical range as a copper polyimide substrate.
(Experimental example 4)

  Electroplating was performed under the same conditions as in Experimental Example 3, except that the 3M conductive tape was pressed against the long resin film with a metal film so as to adhere more closely than in Experimental Example 3. The number was 0.3 / 50 mm □ even at a location 10 m to 20 m away from the connection portion. It was 0.4 pieces / 50mm □ in the place 0m-10m away from the connection part.

  With reference to FIG. 6, the average appearance frequency of the unevenness | corrugation of 20 micrometers-50 micrometers in diameter in the metallization long resin film board | substrate S in Experimental example 4 is demonstrated. FIG. 6 is a graph showing the appearance frequency of irregularities from the connection portion A to the end direction of 120 m.

  The horizontal axis of FIG. 6 represents the distance (m) from the front-end | tip part or connection part of the metallization long resin film board | substrate continued by the connection part A, and a vertical axis | shaft is 50 mm x unevenness | corrugation with a diameter of 20 micrometers-50 micrometers. The average appearance frequency at 50 mm is expressed. The average appearance frequency shown in FIG. 6 is determined by measuring the number of irregularities having a diameter of 20 μm to 50 μm for every 10 m in the longitudinal direction of the metallized long resin film substrate S (image processing), and how many the irregularities appear per 50 mm × 50 mm area. It is an indicator that shows.

  In the present invention, if the connection portion A is not provided, the front and end of each metallized long resin film substrate have many irregularities as in the comparative example, but the long resin film with metal film is separated from each other. Since a plurality of metallized resin film substrates are electrically and mechanically connected by providing F with a connecting portion A, the occurrence of irregularities as in the comparative example is a continuous metallized long resin film substrate It occurs only at the front end and the end of S, and there is an effect of preventing the occurrence of unevenness at the front end and end point of each metallized long resin film substrate S.

  The metallized polyimide film of the present invention is suitably used for flexible printed wiring boards.

DESCRIPTION OF SYMBOLS 10 Plating apparatus 11 Plating solution tank 12 Unwinding roll 14a, 14b, 14c, 14d, 14e Anode (anode)
15 Winding rolls 16a, 16b, 16c, 16d, 16e Feeding roll 21 Photoelectric sensor 22 Controllers 23a, 23b, 23c, 23d, 23e Power supply A Connection portion L Plating solution F Long resin film with metal film S Metalized long Resin film substrate

Claims (9)

On the metal film of the long resin film with a metal film having a metal film formed on at least one surface of the long resin film, in the plating solution tank, the long resin film with the metal film is conveyed in the longitudinal direction. In the manufacturing method of manufacturing a metallized long resin film substrate by forming an electroplated film,
Providing a connecting portion between the metallized long resin films adjacent to each other for electrically and mechanically connecting the plurality of long resin films with metal films in the longitudinal direction;
While the connecting portion is in contact with the power supply body of the electroplating apparatus, the maximum value of the potential difference between the anode (anode) inside the plating bath and the power supply body is 0. 0 of the potential difference during operation. A method for producing a metallized long resin film substrate, characterized in that the current flowing through the power feeder is controlled so as to fall within a range of 8 times to 1.7 times. The metal film is a metal selected from nickel, chromium and copper, or an alloy containing any of nickel, chromium and copper,
The said electroplating is copper electroplating, The manufacturing method of the metallization long resin film board | substrate of Claim 1 characterized by the above-mentioned.   The method for producing a metallized long resin film substrate according to claim 1 or 2, wherein the metal film is formed by a vacuum film formation method.   The said long resin film is a polyimide film, The manufacturing method of the metallized long resin film board | substrate of Claim 1, 2, or 3 characterized by the above-mentioned.   5. The metallization according to claim 1, wherein the connection portion is formed by applying a conductive adhesive tape or bonding with a conductive adhesive. 6. A method for producing a long resin film substrate.   6. The method for producing a metallized long resin film substrate according to claim 5, wherein a difference in height of each step formed by the connecting portion and the long resin film with a metal film is 100 μm or less.   The method for producing a metallized long resin film substrate according to claim 5 or 6, wherein the conductive adhesive tape has a thickness of 20 µm to 100 µm. 8. The electrical resistance between the long resin film with a metal film and the conductive adhesive tape affixed to the long resin film with a metal film is 0.1Ω or less . The manufacturing method of the metallization long resin film board | substrate as described in any one of them . A plating solution tank containing a plating solution, an anode (anode) installed in the plating solution tank, and a long resin film with a metal film in which a metal film is formed on at least one surface of the long resin film A conveying means for immersing the long resin film with a metal film in the plating solution tank while keeping the width direction horizontal and conveying in the longitudinal direction; and the long resin film with a metal film outside the plating solution tank In a plating apparatus provided with a power supply that supplies power to the metal film of the power supply and a power supply that supplies power while controlling the current flowing through the power supply,
A plurality of connecting portions disposed between the metallized long resin films that electrically and mechanically connect the long resin films with metal films adjacent to each other in the longitudinal direction;
A connecting part detecting means for detecting the connecting part, disposed in front of the plating bath on the transport path of the long resin film with metal film and in front of the power feeding means,
While the connection part detection means receives the detection signal of the connection part and the connection part is in contact with the power feeding body, the maximum value of the potential difference between the power feeding body and the anode is the potential difference during operation. A plating apparatus comprising control means for controlling the power supply so as to fall within a range of 0.8 times to 1.7 times.

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