JP5366906B2 - Radiography equipment - Google Patents

Description

  The present invention relates to a radiation imaging apparatus.

  In recent years, radiation sensitive layers are arranged on a TFT substrate in which TFTs (Thin Film Transistors) are arranged in a matrix, and a panel-like radiation detector (radiation) such as an FPD (Flat Panel Detector) that can directly convert radiation into digital data. Detection panel) has been put into practical use. This radiation detection panel has an advantage that an image can be confirmed immediately and a moving image can be confirmed as compared with a conventional imaging plate. The radiation detection panel uses an indirect conversion method in which radiation is converted into light with a scintillator and then converted into electric charge with a semiconductor layer such as a photodiode, or radiation is converted into amorphous selenium. There are those using a direct conversion method in which a semiconductor layer converts charges.

  An electronic cassette that is a portable radiation imaging apparatus that incorporates this radiation detection panel and stores radiation image data output from the radiation detection panel has also been put into practical use.

  Because this electronic cassette has portability, it is possible to take a picture of a patient while it is placed on a stretcher or bed, and the position of the electronic cassette can be changed to adjust the shooting location. It is possible to deal with it flexibly.

  The electronic cassette is usually configured such that the radiation detection panel and a control board that performs imaging operations in the radiation detection panel and exchanges electrical signals between the radiation detection panel and the outside are housed in a casing. In the radiation detection panel, a TFT substrate in which a TFT and a necessary wiring are usually formed is used as a TFT substrate. Therefore, a high-rigidity base is arranged in the casing, and the base It is common to prevent the TFT substrate from being damaged by impact by bonding the radiation detection panel together.

  In the radiation imaging apparatus, it is conceivable to reduce the thickness and weight by omitting the base by directly attaching and supporting the TFT substrate side of the radiation detection panel to the top plate of the housing. In such a radiographic apparatus, it is considered preferable to use a carbon fiber reinforced resin (CFRP) for the top plate because it absorbs less radiation.

  However, in portable radiography equipment such as electronic cassettes, there is a concern that the top plate may be damaged when carrying it, so it is more strongly required that only the top plate can be replaced when the top plate is damaged. Is done.

  In addition, when manufacturing a radiographic apparatus, it may be necessary to repair the TFT substrate of the radiation detection panel or redo the thermal compression bonding of the TCP part after the radiation detection panel is bonded to the top plate. Even in such a case, it is necessary to peel off the radiation detection panel and the top plate.

  However, if it is assumed that the top plate and the radiation detection panel are peeled off, if the top plate and the radiation detection panel are weakly bonded, the impact between the top plate and the radiation detection panel may be reduced due to a drop. As a result, the TFT substrate may be damaged inside the housing.

  A photoelectric conversion unit having a plurality of photoelectric conversion elements arranged one-dimensionally or two-dimensionally on a substrate, a sensor panel having an electrode extraction unit arranged on the outer periphery of the substrate, and arranged on the photoelectric conversion unit In addition, there is a radiation detection apparatus having a scintillator panel having a phosphor that converts radiation into light that can be detected by the photoelectric conversion unit, such that the scintillator panel and the sensor panel are brought into close contact with each other by pressure reduction (Patent Document 1). .

Further, there is a scintillation detector in which a scintillator is coupled to a photoelectric surface of a photodetector with a coupling material, and a peeling wire such as a nylon thread or a piano wire is sandwiched between the coupling portions (Patent Document 2).
JP 2006-337184 A Microfilm of actual application No. 01-89005 (actual opening and closing No. 03-28648)

  In a radiographic apparatus having a configuration in which a radiation detection panel and a control board are housed in a casing, if the radiation detection panel is brought into close contact with the top plate by decompression, the entire casing needs to be sealed. However, if the entire casing is a sealed structure, heat from various circuits provided on the control board can be easily transmitted to the radiation detection panel, which may cause image degradation.

  In addition, if a peeling wire is sandwiched between the radiation detection panel and the control board in advance, there is a problem that even the peeling wire is detected during normal radiation detection, which hinders radiation detection.

  The present invention has been made to solve the above-described problem. In a radiographic apparatus in which a radiation detector is bonded to a top plate, the top plate is affected by an impact at the time of dropping under normal use conditions. And the radiation detector do not peel off, but when it is necessary to peel off the top plate and the radiation detector, they can be easily peeled off, and there is no need for the casing to have a sealed structure. An object of the present invention is to provide a radiographic apparatus that can suppress the heat generated inside the casing and that the peeling wire does not hinder the detection of radiation during normal use.

  According to the first aspect of the present invention, there is provided a radiation detector that outputs an electrical signal indicating a radiation image represented by irradiated radiation, and a ceiling in which the radiation detector is attached and the radiation detector is bonded. A groove for inserting a peeling wire into an adhesive surface between the top plate and the radiation detector, from one side of the top plate to the adhesive surface of the top plate. The present invention relates to a radiation imaging apparatus in which at least one is formed toward another side adjacent to the one side or another side opposite to the one side.

  In the radiographic apparatus according to claim 1, a peeling wire such as a piano wire or a nichrome wire is inserted into a groove formed in the top plate, and the peeling wire is inserted into the interface between the top plate and the radiation detector. By moving in parallel, the radiation detector can be separated from the top plate.

  Further, during normal use, since the peeling wire is not inserted into the groove, even the peeling wire is not detected during radiation detection.

  The invention according to claim 2 relates to the radiation imaging apparatus according to claim 1, wherein the groove is formed outside an imaging region on the top plate where the radiation image is formed.

  In the radiographic apparatus according to claim 2, since the groove is formed in an area outside the imaging area on the top plate, it is preferably used for an inconvenient application when the groove is detected during radiation detection.

  According to a third aspect of the present invention, a plurality of the grooves are provided in parallel to each other on the bonding surface of the top plate, and at least one of the plurality of grooves is an image where the radiation image on the top plate is formed. The radiation imaging apparatus according to claim 2, wherein the radiation imaging apparatus is formed outside the area and the rest is formed so as to cross the imaging area.

  In the radiographic apparatus according to claim 3, a nichrome wire is inserted as a peeling wire into a groove formed so as to cross the imaging region and energized to heat and soften the adhesive, and the adhesive is heated. Once softened, a thin, high strength metal wire such as a piano wire is inserted as a peeling wire into the groove formed in the outer region of the imaging region on the top plate, and the interface between the top plate and the radiation detector By moving in parallel with the radiation detector, the radiation detector can be more easily separated from the top plate as compared with the radiation imaging apparatus according to claim 1.

  The invention according to claim 4 relates to the radiation imaging apparatus according to any one of claims 1 to 3, wherein the top plate and the radiation detector are bonded and fixed with a double-sided adhesive tape.

  In the radiographic apparatus according to claim 4, by inserting a peeling wire into the groove and moving the peeling wire along the interface between the top plate and the radiation detector, the core material of the double-sided adhesive tape becomes The radiation detector is separated from the top plate.

  According to a fifth aspect of the present invention, in any one of the first to third aspects, the top plate and the radiation detector are bonded and fixed with a dismantling adhesive whose adhesive force is reduced by heat or ultraviolet rays. It relates to the radiation imaging apparatus described.

  In the radiographic apparatus according to claim 5, when peeling the radiation detector from the top plate, the disassembling adhesive is heated or irradiated with UV to reduce the adhesive force, thereby reducing the top plate and the top plate. The radiation detector can be easily peeled from the top plate as compared with the case where a disassembly-type adhesive is not used for adhesion to the radiation detector.

  According to a sixth aspect of the present invention, the top plate and the radiation detector are bonded to each other with a heat demolition type adhesive whose adhesive force is reduced by heat among the demolition type adhesives, and the radiation from the top plate. When peeling the detector, a metal wire that is not energized as a peeling wire is inserted into a groove formed in a region outside the imaging region among a plurality of parallel grooves formed on the top plate. 6. The radiation imaging apparatus according to claim 5, wherein a heating wire is inserted as a peeling wire into a groove formed so as to cross the imaging region.

  In the radiation imaging apparatus, when the radiation detector is peeled from the top plate, a heating wire is inserted into a groove formed so as to cross the imaging region, and the heating and demolition type adhesive is heated. Then, when the heat dismantling adhesive is sufficiently heated and the adhesive force is reduced, a metal wire such as a piano wire is inserted into a groove formed in the outer region of the imaging region, and the top plate, the radiation detector, Move along the interface. As a result, the radiation detector can be peeled off the top plate more easily than in the case where no heat dismantling adhesive is used for bonding between the top plate and the radiation detector.

  According to a seventh aspect of the invention, the top plate and the radiation detector are bonded and fixed with a UV irradiation demolition adhesive whose adhesive force is reduced by UV irradiation among the demolition adhesives. The radiation imaging apparatus according to Item 5.

  In the radiographic apparatus according to claim 7, UV irradiation is performed on a portion where the UV irradiation dismantling type adhesive is attached and detached between the radiation detector and the top plate, thereby reducing the adhesive force. The radiation detector can be easily peeled from the top plate.

  According to an eighth aspect of the present invention, a plurality of the grooves are provided in parallel to each other on the bonding surface of the top plate, and at least one of the plurality of grooves is formed outside the imaging region on the top plate. The first groove and the rest are second grooves formed so as to cross the imaging region, and the region where the first groove is formed on the top plate is a UV irradiation dismantling type adhesive. Thus, the region where the second groove is formed in the top plate relates to the radiation imaging apparatus according to claim 5, which is bonded to the radiation detector with a heat dismantling adhesive.

  In the radiographic apparatus, the top plate and the radiation detector are bonded to each other with a UV irradiation dismantling adhesive in an area outside the imaging area, and are bonded with a heating dismantling adhesive in an area inside the imaging area. The problem that the central portion of the imaging region is easily bent can be solved.

  Further, when peeling the radiation detector from the top plate, it is only necessary to heat the area inside the imaging area of the top board and the radiation detector, so that thermal damage in the peripheral area of the imaging area is reduced or avoided. it can.

  The invention according to claim 9 relates to the radiation imaging apparatus according to any one of claims 1 to 8, wherein the radiation detector is of a scintillation type that converts radiation into light and detects the light.

  The radiation imaging apparatus described in claim 9 is an example in which the present invention is applied to a scintillation type radiation imaging apparatus.

  The invention according to claim 10 relates to the radiation imaging apparatus according to any one of claims 1 to 8, wherein the radiation detector is of a direct conversion type for detecting radiation by converting it into electrons.

  The radiation imaging apparatus described in claim 10 is an example in which the present invention is applied to a direct conversion type radiation imaging apparatus.

  As described above, according to the present invention, the top plate and the radiation detector are not peeled off by an impact when dropped under normal use conditions, but the top plate and the radiation detector are peeled off. It can be easily peeled off when necessary, and it is not necessary to rub the housing against the sealed structure, so that heat generated by the control board can be prevented from entering the inside of the housing. A radiation imaging apparatus that does not interfere with detection of radiation is provided.

FIG. 1 is a transparent perspective view illustrating an internal configuration of the electronic cassette according to the first embodiment. FIG. 2 is a circuit diagram illustrating the electronic cassette according to the first embodiment. FIG. 3 is a plan view illustrating the electronic cassette according to the first embodiment. FIG. 4 is a cross-sectional view illustrating a cross-sectional configuration of the electronic cassette according to the first embodiment. FIG. 5 is a partially enlarged cross-sectional view illustrating a cross-sectional configuration of the electronic cassette according to the first embodiment. FIG. 6 is a plan view showing an example in which only one groove for inserting a peeling wire is provided on the top plate in the electronic cassette according to the first embodiment. FIG. 7 is a plan view illustrating an example in which a plurality of grooves for inserting a peeling wire are provided on the top plate in the electronic cassette according to the first embodiment. FIG. 8 is a plan view illustrating another example in which a plurality of grooves for inserting a peeling wire are provided on the top plate in the electronic cassette according to the first embodiment. FIG. 9 is a plan view showing another example in which a plurality of grooves for inserting a peeling wire are provided obliquely with respect to the long side and the short side of the top plate in the electronic cassette according to the first embodiment. FIG. 10 is an explanatory diagram illustrating a positional relationship between the groove and the adhesive layer in the electronic cassette according to the first embodiment. FIG. 11 is an explanatory diagram illustrating a procedure for peeling the radiation detection panel from the top plate in the electronic cassette according to the first embodiment. FIG. 12 is an explanatory diagram illustrating a procedure for peeling the radiation detection panel from the top plate in the electronic cassette according to the first embodiment. FIG. 13 is an explanatory diagram illustrating a procedure for peeling the radiation detection panel from the top plate in the electronic cassette according to the first embodiment. FIG. 14 is an explanatory diagram illustrating a procedure for peeling the radiation detection panel from the top plate in the electronic cassette according to the first embodiment. FIG. 15 is an explanatory diagram illustrating a procedure for peeling the radiation detection panel from the top plate in the electronic cassette according to the first embodiment. FIG. 16 is an explanatory diagram illustrating a procedure for peeling the radiation detection panel from the top plate in the electronic cassette according to the first embodiment.

1. Embodiment 1
An example of an electronic cassette included in the radiation imaging apparatus of the present invention will be described with reference to FIGS.

(overall structure)
As shown in FIG. 1, the electronic cassette 10 is a radiation detector as a radiation detector that detects the radiation X transmitted through the patient from the irradiation surface 19 side of the casing 18 irradiated with the radiation X inside the casing 18. A panel 12 and a control board 13 to be described later are provided in order. The irradiation surface 19 corresponds to a range where the radiation detection panel 12 is disposed, and an area where a radiation image is captured by the radiation detection panel 12 is an imaging area 19A.

  As shown in FIG. 2, the radiation detection panel 12 includes an upper electrode, a semiconductor layer, and a lower electrode, and receives a light to accumulate a charge, and a sensor 14 for reading the charge accumulated in the sensor 14. The TFT 20 includes a TFT (Thin Film Transistor) active matrix substrate 29 (hereinafter referred to as a TFT substrate) in which a large number of pixels 20 including the TFT switch 16 are provided in two dimensions.

  Further, on the TFT substrate 29, a plurality of scanning wirings 22 for turning on / off the TFT switch 16 and a plurality of signal wirings 24 for reading out the charges accumulated in the sensor unit 14 intersect each other. Is provided.

  In the radiation detection panel 12 according to this embodiment, a scintillator layer 30 (see FIGS. 3 and 4) made of gadolinium sulfate (GOS), cesium iodide (CIS), or the like is attached to the surface of the TFT substrate 29. . The scintillator layer 30 has a light blocking body 30A (see FIG. 4) that blocks the light generated on the surface opposite to the attached radiation detection panel 12 in order to prevent the generated light from leaking to the outside. ing.

  In the radiation detection panel 12, irradiated radiation such as X-rays is converted into light by the scintillator layer 30 and irradiated to the sensor unit 14. The sensor unit 14 receives the light emitted from the scintillator layer 30 and accumulates electric charges.

  Each signal wiring 24 has an electrical signal (image signal) indicating a radiation image in accordance with the amount of charge accumulated in the sensor unit 14 when any TFT switch 16 connected to the signal wiring 24 is turned on. Is flowing.

  Further, a plurality of connectors 32 for connection are arranged side by side on one end side in the signal wiring direction of the radiation detection panel 12, and a plurality of connectors 34 are arranged on one end side in the scanning wiring direction. Each signal wiring 24 is connected to a connector 32, and each scanning wiring 22 is connected to a connector 34.

  The casing 18 is formed in a rectangular flat plate shape, and as shown in FIG. 4, a control board that performs various controls such as control of imaging operation of the radiation detection panel 12 and the radiation detection panel 12 and communication with an external device. 13 are built in so as to overlap. In the present embodiment, the radiation detection panel 12 is arranged so that the TFT substrate 29 is in contact with the inner surface of the casing 18 on the irradiation surface 19 side. Thereby, the radiation irradiated from the irradiation surface 19 side passes through the TFT substrate 29 and enters the scintillator layer 30.

  Here, when radiation is irradiated from the front side to which the scintillator layer 30 is bonded (surface irradiation), the radiation detection panel 12 emits light more strongly on the upper surface side (opposite side of the TFT substrate 29) of the scintillator layer 30, and the scintillator When radiation is irradiated from the back side that is not the front side to which the layer 30 is bonded (backside irradiation), the radiation that has passed through the TFT substrate 29 enters the scintillator layer 30 and the TFT substrate 29 side of the scintillator layer 30 emits light more strongly. . Electric charges are generated in each sensor unit 14 by the light generated in the scintillator layer 30. For this reason, the radiation detection panel 12 can be designed with higher sensitivity to radiation because radiation does not pass through the TFT substrate 29 when radiation is irradiated from the front side than when radiation is irradiated from the back side. In addition, since the light emission position of the scintillator layer 30 with respect to each sensor unit 14 is closer when the radiation is irradiated from the front side than when the radiation is irradiated from the front side, the resolution of the radiographic image obtained by imaging Is expensive. In the present embodiment, the radiation detection panel 12 is disposed so as to perform back-surface irradiation when radiation is irradiated from the irradiation surface 19 side. However, the radiation detection panel 12 may be disposed so as to perform surface irradiation.

  The control board 13 is provided with a control unit 36 that performs control of imaging operation by the radiation detection panel 12 and control of signal processing with respect to electric signals flowing through the signal wirings 24. The control unit 36 includes a signal detection circuit 42, And a scan signal control circuit 40.

  The signal detection circuit 42 is provided with a plurality of connectors 46, and one end of a flexible cable 44 is electrically connected to the connectors 46. Further, the other end of the flexible cable 44 is connected to the connector 32. The signal detection circuit 42 incorporates an amplification circuit for amplifying an input electric signal for each signal wiring 24. With this configuration, the signal detection circuit 42 amplifies and detects the electric signal input from each signal wiring 24 by the amplification circuit, and is stored in each sensor unit 14 as information of each pixel 20 constituting the image. Detect the amount of charge.

  On the other hand, the scan signal control circuit 40 is provided with a connector 48, and one end of a flexible cable 52 is electrically connected to the connector 48. Further, the other end of the flexible cable 52 is connected to the connector 34, and the scan signal control circuit 40 outputs a control signal for turning on / off the TFT switch 16 to each scan line 22. .

  When taking a radiographic image, the radiation detection panel 12 is irradiated with X-rays transmitted through the subject (patient).

  The irradiated radiation such as X-rays is converted into light by the scintillator layer 30 and irradiated to the sensor unit 14. The sensor unit 14 receives the light emitted from the scintillator layer 30 and accumulates electric charges.

  As shown in FIG. 2, at the time of image reading, an ON signal (+10 to 20 V) is sequentially applied from the scan signal control circuit 40 to the gate electrode of the TFT switch 16 of the radiation detection panel 12 via the scanning wiring 22. As a result, when the TFT switch 16 of the radiation detection panel 12 is sequentially turned on, an electrical signal corresponding to the amount of charge accumulated in the sensor unit 14 flows out to the signal wiring 24. The signal detection circuit 42 detects the amount of charge accumulated in each sensor unit 14 based on the electrical signal that has flowed out to the signal wiring 24 of the radiation detection panel 12 as information of each pixel 20 constituting the image. Thereby, image information indicating an image indicated by the radiation applied to the radiation detection panel 12 is obtained.

  In addition, in order to improve operability, the electronic cassette 10 according to the present exemplary embodiment cuts the end of each of the four side surfaces of the housing 18 so that the end is thinner than the center. ing.

  The casing 18 is provided with a front panel 60 on the subject side and a back panel 62 on the opposite subject side facing each other. The front panel 60 includes a top plate 64 and a holding portion 66 that holds the top plate 64. The radiation detection panel 12 is provided on the surface of the top panel 64 on the back panel 62 side.

  The top plate 64 is made of CFRP. Thereby, intensity | strength is ensured, suppressing absorption of a radiation. The holding part 66 and the back panel 62 are made of ABS resin.

  An area where a radiation image is captured by the radiation detection panel 12 on the top plate 64 is an imaging area 19A as shown in FIG.

  As shown in FIGS. 4 to 6, the TFT substrate 29 side of the radiation detection panel 12 is bonded and fixed to the top plate 64. A piano wire 71 or a nichrome wire as a peeling wire is inserted into the surface of the top plate 64 on the side where the radiation detection panel 12 is bonded and fixed, when the radiation detection panel 12 is separated from the top plate 64. A groove 65 is provided.

  As shown in FIGS. 4 to 6, only one groove 65 is provided outside the imaging region 19 </ b> A on the surface of the top plate 64 to which the radiation detection panel 12 is bonded, parallel to the short side of the top plate 64. It may be. Further, as shown in FIGS. 7 and 8, the groove 65 has one on the outside of the imaging region 19A on the surface of the top plate 64 to which the radiation detection panel 12 is bonded, and a plurality of grooves so as to cross the imaging region 19A. For example, two or three may be provided parallel to the short side of the top plate 64. Hereinafter, of the grooves 65, those provided outside the imaging region 19A may be referred to as grooves 65A, and those provided so as to cross the imaging region 19A may be referred to as grooves 65B. In the example shown in FIG. 7, the grooves 65 </ b> A and the grooves 65 </ b> B are provided at substantially equal intervals. In the example shown in FIG. 8, two grooves 65 </ b> B are provided in the central portion of the top plate 64.

  In the example shown in FIGS. 6 to 8, as described above, the groove 65 is provided in parallel to the short side of the top plate 64, but in other words, the groove 65 is a pair of opposed top plates 64. In other words, it is provided so as to connect one of the long sides and the other.

  As shown in FIG. 9, the groove 65 is provided obliquely with respect to the long side and the short side of the top plate 64. In other words, the groove 65 may be provided so as to cross the top plate 64 obliquely in a top view. . In the example shown in FIG. 9, it can be said that the groove 65 is provided so as to connect two adjacent sides of the top plate 64.

  In an example in which a plurality of grooves 65 are provided, all the grooves 65 can have the same height and width, and the width and height are changed between the grooves 65A and 65B. As a piano wire 71, a nichrome wire may be inserted into the groove 65B as a peeling wire.

  Adhesion between the top plate 64 and the radiation detection panel 12 includes a double-sided adhesive tape, a heat dismantling adhesive whose adhesive strength is reduced by heating, a UV irradiation dismantling adhesive whose adhesive strength is degraded by UV irradiation, and the like. used.

  Heat demolition type adhesives have a form in which the adhesive strength is reduced by thermal decomposition by heating above a predetermined thermal decomposition temperature, those that soften by heating to lower the adhesive strength, and heat to a normal adhesive. What mixed the expansible microcapsule etc. can be used. In the adhesive having a form in which the adhesive force is reduced by thermal decomposition, various functional groups are introduced into a normal adhesive and the thermal decomposition temperature is set to 70 to 120 ° C., whereby the TFT substrate of the radiation detection panel 12 is obtained. The radiation detection panel 12 can be peeled off from the top plate 64 without damaging 29. Further, if a material such as a metal powder for improving thermal conductivity is blended in the adhesive, a nichrome wire is inserted as a peeling wire into the groove 65 and an adhesive layer between the radiation detection panel 12 and the top plate 64 is inserted. Since the radiation detection panel 12 is also uniformly heated when heated, image unevenness is effectively prevented from occurring in the electronic cassette 10 regenerated using the radiation detection panel 12 peeled from the top plate 64.

  As the UV irradiation dismantling type adhesive, there can be used a normal adhesive in which a UV-decomposable functional group is introduced, or a radical that is generated by UV irradiation and the adhesive is decomposed by this radical.

  As shown in FIGS. 10A and 10B, the adhesive layer 70 can be formed on the entire surface of the top plate 64 and the radiation detection panel 12. When a plurality of grooves 65 are provided, the adhesive layer 70 is formed on the top plate 64 and a part of the radiation detection panel 12 as shown in FIG. 10C, specifically around the grooves 65 (grooves 65A and 65B). It may be formed only.

  In the case where the groove 65 is provided outside the imaging region 19A in the top plate 64, when the adhesive layer 70 is formed on a part of the top plate 64 and the radiation detection panel 12, the top plate as shown in 10 (E). The adhesive layer 70 is provided in the vicinity of one side that is the side on which the groove 65 is formed in 64 and in the vicinity of the other side that is located on the opposite side of the one side across the central portion of the top plate 64. be able to. Further, as shown in FIG. 10 (D), the top plate 64 is bonded to a total of four locations, that is, the vicinity of the one side and the vicinity of the other side, and two locations corresponding to the two grooves 65B in the central portion. A layer 70 can also be provided. When the adhesive layer 70 is provided at the four locations on the top plate 64, the adhesive layer 70 (adhesive layer 70A) in the vicinity of the one side and in the vicinity of the other side is formed of a UV irradiation disassembly type adhesive, The central adhesive layer 70 (adhesive layer 70B) is formed of a heat dismantling type adhesive so that the region to be heated for peeling is limited to the central portion of the top plate 64 and is located outside the radiation detection panel 12. The influence on the signal detection circuit 42 and the scan signal control circuit 40 can be minimized.

  In the case where the adhesive layer 70 is formed on the entire surface of the top plate 64 and the radiation detection panel 12, a double-sided adhesive tape, a heat dismantling adhesive, and a UV irradiation dismantling adhesive are used to bond the top plate 64 and the radiation detection panel 12. Agents are preferably used. On the other hand, when the adhesive layer 70 is formed on the top plate 64 and a part of the radiation detection panel 12, a heat dismantling adhesive and a UV irradiation dismantling adhesive are preferable for the adhesion between the top plate 64 and the radiation detection panel 12. .

  Here, the size of the control board 13 increases when the circuit is arranged in a plane so as to be formed thin.

  Further, the electronic cassette 10 can have an outer size defined in JIS Z4905 by changing the size of the radiation detection panel 12. On the other hand, it is preferable for manufacturing that the control board 13 is common regardless of the size of the radiation detection panel 12. In the case of the electronic cassette 10 having a small size, the control board 13 may be larger than the radiation detection panel 12. is there.

  For this reason, by allowing the control board 13 to be arranged up to the end in the housing 18, the control board 13 can be easily shared. The number of control boards 13 is not limited to one. For example, the control boards 13 are controlled for each function such as control of the radiation detection panel 12, reading of image data from the radiation detection panel 12, and exchange of data with the outside. 13 may be divided into a plurality of sheets.

  Hereinafter, a procedure for peeling the radiation detection panel 12 from the top plate 64 in the electronic cassette 10 will be described. First, the housing 18 is disassembled into the holding portion 66 and the back panel 62, and the top plate 64 with the radiation detection panel 12 bonded thereto is removed from the holding portion 66.

  When the electronic cassette 10 has a configuration in which a groove 65 is provided in an area outside the imaging area 19A of the top plate 64 as shown in FIGS. 6, 10A, and 10E, FIG. 11 and FIG. 12, the piano wire 71 as a peeling wire is inserted into the groove 65 of the top plate 64 removed from the holding portion 66, and the other side from the one side of the top plate 64 as shown by the arrow a. By moving the piano wire 71 along the interface between the top plate 64 and the radiation detection panel 12 toward the side of the plate, the adhesive layer 70 is mechanically broken and the radiation detection panel 12 is peeled off from the top plate 64. Can do.

  When the adhesive layer 70 is formed of an adhesive that is soluble in an organic solvent, an organic solvent that dissolves the adhesive is injected into the groove 65 to soften the adhesive layer 70 and then the piano wire 71 into the groove 65. Is inserted and moved in the direction of arrow a, the radiation detection panel 12 can be more easily peeled off.

  In the case where the adhesive layer 70 is formed of a heat dismantling type adhesive, the adhesive layer 70 is heated by some means to reduce the adhesive force, and then the piano wire 71 is inserted into the groove 65 and the direction of arrow a If it moves to (2), the radiation detection panel 12 can be peeled off more easily.

  Further, when the adhesive layer 70 is formed of a UV irradiation dismantling type adhesive, the adhesive force is reduced by irradiating the adhesive layer 70 with UV light, and then the piano wire 71 is inserted into the groove 65 and the arrow a If it moves to a direction, the radiation detection panel 12 can be peeled off more easily.

  As shown in FIGS. 7, 10B, and 10C, the electronic cassette 10 has a groove 65A in an area outside the imaging area 19A of the top plate 64, and has a groove 65B in the imaging area 19A. In addition, in the case where the grooves 65A and the grooves 65B are provided at substantially equal intervals, as shown in FIGS. 13 and 14, piano wires are respectively provided in the grooves 65A and 65B of the top plate 64 removed from the holding portion 66. 71 is inserted, and each piano wire 71 is moved in the direction of the arrow a along the interface between the top plate 64 and the radiation detection panel 12, thereby mechanically destroying the adhesive layer 70 and removing the radiation detection panel 12 from the top. It can be peeled from the plate 64.

  In the case where the adhesive layer 70 is formed of a heat dismantling type adhesive, a nichrome wire is inserted in advance into the groove 65B instead of the piano wire and energized, the adhesive layer 70 is heated to reduce the adhesive force, and then the groove The piano wire 71 may be inserted into 65A and moved in the direction of arrow a.

  When the adhesive layer 70 is formed of an adhesive that is softened with an organic solvent, the organic solvent is injected into the groove 65B to soften the adhesive layer 70, and then the piano wire 71 is inserted into the groove 65A and the arrow a It may be moved in the direction.

  In the case where the adhesive layer 70 is formed of a UV irradiation dismantling type adhesive, the adhesive layer 70 is irradiated with UV to reduce the adhesive force, and then the piano wire 71 is inserted into the grooves 65A and 65B, and the direction of the arrow a It may be moved to.

  As shown in FIG. 10D, a groove 65A is formed on the top plate 64 outside the imaging region 19A, and a plurality of, for example, two grooves 65B are formed in the center of the imaging region 19A. An adhesive layer 70A is provided along one side of the groove 64A on the side where the groove 65A is formed and another side located on the opposite side of the one side across the central portion of the top plate 64. Also in the electronic cassette 10 of the form in which the adhesive layer 70B is provided at the corresponding position, as shown in FIGS. 15 and 16, the piano wire 71 is inserted into each of the groove 65A and the groove 65B and moved in the direction of the arrow a. By doing so, the radiation detection panel 12 can be peeled from the top plate 64.

  However, when the adhesive layer 70A is formed of a UV irradiation dismantling adhesive and the adhesive layer 70B is formed of a heating dismantling adhesive, the adhesive layer 70A is irradiated with UV and a nichrome wire is inserted into the groove 65B. Then, the adhesive layer 70B is heated, and then the nichrome wire is moved in the direction of arrow a to peel off the adhesive layer 70B in advance, and then the piano wire 71 is inserted into the groove 65A and the direction of arrow a May be moved to peel the portion of the adhesive layer 70A.

  As described above, the example of the scintillation type electronic cassette in which the radiation detection panel 12 includes the TFT substrate 29 and the scintillator layer 30 has been described. However, the present invention converts the radiation directly into electrons instead of the scintillator layer 30. The present invention can also be applied to a direct conversion type electronic cassette having a semiconductor detection layer.

  In addition to the electronic cassette having the radiation detection panel 12 bonded to the top plate 64 on the TFT substrate 29 side, the radiation detection panel 12 is bonded to the top plate on the scintillator layer 30 or the semiconductor detection layer side. The present invention can also be applied to electronic cassettes in the form.

  Furthermore, the present invention can be applied not only to a portable radiographic apparatus such as an electronic cassette but also to a stationary radiographic apparatus.

  In addition, the present invention can be applied not only to an electronic cassette that detects X-rays but also to a radiographic apparatus that detects gamma rays.

DESCRIPTION OF SYMBOLS 10 Electronic cassette 12 Radiation detection panel 13 Control board 14 Sensor part 16 Switch 18 Case 19A Imaging area 19 Irradiation surface 20 Pixel 22 Scanning wiring 24 Signal wiring 29 Active matrix substrate 29 Substrate 30 Scintillator layer 30A Shading body 32 Connector 34 Connector 36 Control 40 Scan signal control circuit 42 Signal detection circuit 44 Flexible cable 46 Connector 48 Connector 52 Flexible cable 60 Front panel 62 Back panel 64 Top plate 65 Groove 65A Groove 65B Groove 66 Holding section 70 Adhesive layer 70A Adhesive layer 70B Adhesive layer 71 Piano wire

Claims (10)

A radiation detector that captures a radiation image represented by the irradiated radiation and outputs an electrical signal indicating the captured radiation image;
A housing having a built-in radiation detector and a top plate to which the radiation detector is bonded;
With
A groove for inserting a peeling wire into the bonding surface between the top plate and the radiation detection panel is provided on the bonding surface of the top plate from one side of the top plate to another side adjacent to the one side. At least one radiation imaging apparatus is formed toward a side or another side facing the one side.   The radiographic apparatus according to claim 1, wherein the groove is formed outside an imaging region where the radiographic image is formed on the top plate. A plurality of the grooves are provided in parallel to each other on the bonding surface of the top plate,
2. The radiography according to claim 1, wherein at least one of the plurality of grooves is formed outside an imaging region on the top plate where the radiation image is formed, and the rest is formed so as to cross the imaging region. apparatus.   The radiation imaging apparatus according to claim 1, wherein the top plate and the radiation detection panel are bonded and fixed with a double-sided adhesive tape.   The radiation imaging apparatus according to any one of claims 1 to 3, wherein the top plate and the radiation detector are bonded and fixed with a dismantling adhesive whose adhesive force is reduced by heat or ultraviolet rays. The top plate and the radiation detector are bonded with a heating demolition adhesive whose adhesive force is reduced by heat among the demolition adhesive,
When the radiation detector is peeled from the top plate, among the plurality of parallel grooves formed on the top plate, a groove formed in a region outside the imaging region is energized as a peeling wire. The radiographic apparatus according to claim 5, wherein a heating wire is inserted as a peeling wire into a groove formed so that a metal wire not to be inserted is inserted and crosses the imaging region.   The radiographic apparatus according to claim 5, wherein the top plate and the radiation detector are bonded and fixed with a UV irradiation dismantling adhesive whose adhesive force is reduced by UV irradiation among the dismantling adhesive. A plurality of the grooves are provided in parallel to each other on the bonding surface of the top plate,
At least one of the plurality of grooves is a first groove formed outside the imaging region on the top plate, and the rest is a second groove formed so as to cross the imaging region,
The region where the first groove is formed on the top plate is a UV irradiation dismantling type adhesive, and the region where the second groove is formed on the top plate is a heating dismantling type adhesive, and the radiation detection The radiation imaging apparatus according to claim 5, wherein the radiation imaging apparatus is bonded to a container.   The radiation imaging apparatus according to claim 1, wherein the radiation detector is of a scintillation type that converts radiation into light and detects the light.   The radiation imaging apparatus according to claim 1, wherein the radiation detector is a direct conversion type that detects radiation by converting it into electrons.

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