JP5370085B2 - Substrate processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To readily obtain the state of a substrate processing apparatus that is used for manufacturing a substrate of a printed wiring board or the like; and to prevent decrease in operating rate of production facility by performing maintenance of the facility in a proper timely manner. <P>SOLUTION: The substrate processing apparatus includes: a means for carrying a substrate at a predetermined speed; a spray wand to which multiple spray nozzles are attached; a pump that supplies a processing liquid to the spray wand; and a pressure indicator provided at an optional position of a flow path in the pump and spray wand, and at an end point of the spray wand. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a substrate processing apparatus used in various electronic devices and the like.

  2. Description of the Related Art In recent years, printed wiring boards that are widely used in various electronic devices and the like have been required to have high reliability along with higher wiring density as electronic devices have become smaller and more multifunctional.

  Therefore, in the following, the development apparatus and etching apparatus used for forming a conductive pattern such as a conventional printed wiring board, or the manufacturing apparatus such as a development apparatus used for a photographic development type solder resist, can cope with higher wiring density. There has been a need for a device configuration that can be used.

  Hereinafter, a conventional substrate processing apparatus, particularly a printed wiring board etching apparatus will be described.

  FIG. 2 shows an outline of an etching apparatus as a conventional printed wiring board manufacturing apparatus. In FIG. 2, 21 is a spray nozzle, 22 is a spray tube, 23 is a pressure gauge, 24 is a pump, 25 is a filter, 26 is a feed roller, 27 is a valve, 28 is an etching booth, and 29 is a substrate.

  A method for etching a printed wiring board in the etching apparatus configured as described above will be described below.

  First, a substrate 29 in which an etching resist is formed on a copper-clad laminate (not shown) cut to a predetermined size by a screen printing method, a photographic method, or the like is parallel to the traveling direction of the substrate in the etching booth 28 or Between the upper surface side and the lower surface side spray tube 22 piped at a certain angle, it is conveyed on the feed roller 26 at a predetermined speed, and an etching liquid as a processing liquid such as cupric chloride is applied from the spray nozzle 21 to the upper and lower surfaces. By spraying, the exposed copper in the portion where the etching resist is not formed is dissolved to obtain a conductor pattern.

  Thereafter, a conductor pattern is formed from the copper clad laminate through processes such as peeling of the etching resist, washing with water, and drying.

  The outline of the configuration of the developing device as a conventional printed wiring board manufacturing apparatus is the same as that of the etching apparatus.

  For example, Patent Document 1 is known as prior art document information related to the invention of this application.

JP-A-4-264793

  As described above, the general etching apparatus includes the filter 25 between the pump 24 and the spray tube 22 in order to remove foreign substances in the processing liquid such as the etching liquid in the etching booth. When the filter 25 is filled with foreign matter and exceeds a certain limit, the pressure gauge display is lowered.

  On the other hand, when the spray nozzle 21 is clogged with foreign matter, the pressure of the pressure gauge 23 increases, but the flow rate of the etching solution decreases.

  When the pressure is managed only by pressure, the valve 27 is adjusted to be closed in order to lower the display of the pressure gauge 23. At this time, the contradictory condition that the flow rate sprayed onto the substrate is gradually reduced. May be set.

  Furthermore, when the spray nozzle 21 is clogged with foreign matter and the filter 25 is also filled with foreign matter at the same time, the pressure rises due to the foreign matter clogging the spray nozzle 21, There is a possibility that the downward trend of the pressure due to the filling of foreign matter will be balanced out and canceled out, and the display of the pressure gauge 23 may show the same value as the initial accurate setting. In this case, the flow rate of the etching solution sprayed on the substrate is significantly reduced due to the decrease in the flow rate due to the clogging of the spray nozzle 21 and the decrease in the flow rate due to the clogging of the filter 25. In an extreme case, the thickness of the copper is reduced. There is a possibility that the flow rate of the etching solution for sufficient etching is not reached and a phenomenon of remaining copper occurs.

  In order to prevent the above situation, the filter 25 has been regularly inspected and replaced, and the spray nozzle 21 has been cleaned.

  However, in general, an etching solution for a printed wiring board is a substance that is used at a high temperature of 40 to 50 ° C. and is harmful to the human body, so that the operation for removing and attaching the spray nozzle 21 is extremely difficult and dangerous.

  Therefore, the etching solution has been once lowered to room temperature of 20 to 25 ° C., and the operation has been performed. However, it is difficult to check the clogging of the spray nozzle 21 during production, and for the time being, all the spray nozzles 21 are removed and attached. It was. For this reason, the work efficiency is poor and it takes a long time for equipment maintenance, leading to a reduction in the operating rate of the production equipment.

  The present invention solves the above-mentioned conventional problems, and provides a substrate processing apparatus that is simple and easy to spread without causing an increase in manufacturing cost of the manufacturing apparatus, and thereby a manufacturing apparatus for printed wiring boards and the like. Can easily grasp the state of the processing equipment as well as prevent the decline in the operating rate of production equipment by performing equipment maintenance at an appropriate timing, and solve quality problems such as copper residue due to insufficient processing, The purpose is to produce a high-density, high-precision printed wiring board or the like with a high yield.

  In order to achieve this object, the present invention comprises means for transporting a substrate at a predetermined speed, a spray pipe having a plurality of spray nozzles attached thereto, and a pump for supplying a treatment liquid to the spray pipe. It is to use a substrate processing apparatus provided with a pressure gauge at an arbitrary position of a flow path with the spray tube and at an end point of the spray tube.

  With this configuration, it is possible to easily grasp the state of a processing apparatus used for manufacturing a substrate such as a printed wiring board, and it is possible to prevent a reduction in the operating rate of the production facility by performing facility maintenance at an appropriate timing.

  In addition to preventing the cost of manufacturing equipment from increasing, it is possible to maintain the quality of substrate processing with spray pressure as an important manufacturing condition by grasping and managing the pressure across the entire spray tube, including the start and end points. It is possible to solve the problem of the quality of the substrate such as a printed wiring board and to produce a high density and high accuracy substrate with a high yield.

Schematic of a substrate processing apparatus in an embodiment of the present invention Schematic diagram of conventional substrate processing equipment

(Embodiment)
First, an etching apparatus as a substrate processing apparatus in an embodiment of the present invention will be described.

  The structure of the etching apparatus according to the embodiment of the present invention is such that both surfaces from the upper surface and the lower surface can be etched simultaneously, and the structures of the upper surface and the lower surface are basically the same.

  Also, spray nozzles, spray pipes that are installed with a plurality of spray nozzles, pumps that supply processing liquid to the spray pipes, feed rollers as means for transporting the substrate at a predetermined speed, etching booths as processing booths, etc. The configuration of is the same as the conventional one. Therefore, in the present embodiment, only features of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic diagram of a substrate processing apparatus in the present embodiment.

  As shown in FIG. 1, the structure of the substrate processing apparatus in the present embodiment includes a spray pipe 2 for an upper surface provided with a plurality of spray nozzles 1 and a pipe, and a pump for supplying a processing liquid to the spray pipe 2. 4, pressure gauges 3 a and 3 b provided at arbitrary positions in the flow path between the pump 4 and the spray pipe 2, and a pressure gauge 3 c provided at the end point position of the spray pipe.

  In the present embodiment, pressure gauges 3b and 3c are provided as arbitrary positions of individual flow paths of the plurality of spray tubes 2.

  The pressure gauge 3b is the position of the treatment liquid supply start point on the spray tube, and the pressure gauge 3d is a position between the position of the treatment liquid supply start point on the spray tube and the end point of the spray tube. It is.

  The above-mentioned pressure gauge 3d can be installed alone on each spray pipe, but includes a plurality of pressure gauge attachment points at a plurality of positions between the supply start point and the end point of the spray pipe, It can also be set as the structure provided with the pressure gauge 3d in each position. This is convenient for managing the state of the long spray pipe.

  Further, the pressure gauge 3c provided at the position of the end point of the spray tube 2 transmits a signal to a control device (not shown) or an alarm device (not shown) of the substrate processing apparatus when a certain pressure is reached. It is desirable to provide means.

  In addition, in order to confirm only the state of the spray nozzle of the spray pipe, which will be described later, the flow path between the pump 4 and the spray pipe 2 in parallel with the filter 5 provided between the flow path between the pump 4 and the spray pipe 2. It is desirable to provide the flow path of the bypass 6 and the valve 7b without the filter 5 therebetween.

  Examples of the substrate processing apparatus configured as described above will be described below.

  (1) First, when the filter 5 and the spray nozzle 1 are both replaced with new ones, or when the filter 5 is replaced with a new one and the clogging of the spray nozzles 1 is removed and cleaning is finished, the pressure of the spray pipe 2 is confirmed. To do. Specifically, the display of the supply start point, the pressure gauge 3b of the spray pipe, and the pressure gauge 3c of the end point when the pump 4 for supplying the processing liquid to the spray pipe 2 is operated is confirmed.

  At this stage, since the filter 5 and the spray nozzle 1 are not clogged with foreign matters, the following is obtained.

“Display pressure of start point pressure gauge 3b”> “Display pressure of end point pressure gauge 3c”
In particular, “display pressure of start point pressure gauge 3b” − “display pressure of end point pressure gauge 3c” = P0
Check the value of.

(2) Next, a spray nozzle that is extremely clogged with foreign matter or a spray nozzle having a hole diameter of about 80% of the hole diameter of the spray nozzle to be used is once prepared and attached to the spray tube 2. At this time, “the display pressure of the pressure gauge 3b at the start point” − “the display pressure of the pressure gauge 3c at the end point” = P1
Check the value of.

  Normally, when the spray nozzle is clogged with foreign matter, the difference between the “display pressure of the start point pressure gauge 3b” and the “display pressure of the end point pressure gauge 3c” is reduced, and the relationship of P0> P1 is established.

  That is, assuming that the filter 5 is new, the “display pressure of the pressure gauge 3c at the end point” is higher than the initial value (immediately after cleaning the spray nozzle).

  (3) As a simple method when it is assumed that the filter 5 is new, there is a method of checking the pressure of the spray pipe 2 by providing a bypass 6.

  In this case, the state of the spray tube 2 can be confirmed regardless of the degree of clogging of the filter 5.

  In particular, when both the filter 5 and the spray nozzle 1 are clogged, the increasing tendency of the pressure due to the clogging of the spray nozzle 1 and the decreasing tendency of the pressure due to the filling of the foreign substance in the filter 5 are balanced. The pressure gauge display may show the same value as the original exact setting.

  Even in such a case, the influence of the filter 5 can be eliminated by confirming only the state of the spray tube 2 by closing the valve 7c and fully opening the valve 7b to allow the processing liquid to pass through the bypass 6.

  (4) When confirming actual printed wiring boards or the like at the production site, it is desirable to confirm at a certain production period or every certain number of treatments of the substrate.

In confirming the state of the spray pipe 2, the values of the pressure gauge 3b on the start point side and the pressure gauge 3c on the end point side when passing through the bypass 6 are confirmed,
“Display pressure of start point pressure gauge 3b” − “Display pressure of end point pressure gauge 3c” = P2
Check the value of.

  In the comparison between P0 in the case of a new article described above, P1 in the case of 80% clogging as an extreme case, and P2 in the production site, usually P0> P2> P1.

  In the limit range of P2, it is necessary to set in consideration of product yield and productivity.

  In the present embodiment, the middle point of P0 and P1 is set as a control limit value, and the spray nozzle 1 is replaced or cleaned when that value is reached.

  (5) In the management of the filter 5 as well, it is desirable to check for every certain production period or every certain number of substrates processed. In daily management, the value of the pressure gauge 3a (closest to the pump side) is used as a guide, and when the valve 7a is fully opened and the pressure is reduced by 3 to 5% from the time of replacement (new time), the replacement time is set.

  Immediately after replacement of the filter 5, the value of the pressure gauge 3a is adjusted within a predetermined range depending on how the valve 7a is opened and closed. Immediately after replacement of the filter 5, there is no clogging of foreign matter or the like, so the valve 7 a is adjusted in a slightly closing direction. When the number of substrates processed increases and the value of the pressure gauge 3 a decreases, the valve 7 a is adjusted in the opening direction.

  From the above, it is possible to easily grasp the state of the substrate processing equipment as a manufacturing equipment for printed wiring boards and the like, and it is possible to prevent a reduction in the operating rate of the production equipment by performing equipment maintenance at an appropriate timing. Because the state of the processing equipment can be kept stable, quality problems such as copper residue due to insufficient processing on the substrate can be solved, and high-density, high-precision printed wiring boards can be produced with high yield. .

  In order to solve the conventional problems, it may be possible to control the flow rate by installing a flow meter in the spray tube, but the processing liquid is sprayed onto the substrate under the manufacturing conditions in the etching process and development process of printed wiring boards and the like. Pressure is an important condition, and a pressure gauge is an indispensable component of the processing equipment for grasping the pressure. Although the flow meter alone can grasp the flow rate of the processing liquid passing through one point of the spray tube, it cannot grasp the pressure in the entire spray tube.

  The present invention not only prevents an increase in the cost of the manufacturing apparatus due to the addition of a flow meter, but also grasps and manages the pressure of the entire spray tube including the start point and the end point, thereby making the spray pressure an important manufacturing condition. It is possible to maintain the quality of the substrate processing.

  In the present embodiment, the example in which the piping direction of the spray pipe 2 is piped parallel or at an angle to the traveling direction of the substrate is shown in the drawings, but the piping direction of the spray tube 2 is the traveling direction of the substrate. It may be perpendicular to.

  Further, the feed roller as means for transporting the substrate at a predetermined speed is shown as a horizontal transport method, but may be a vertical processing apparatus that transports the substrate vertically.

  Further, although the etching apparatus is described as an example of the substrate processing apparatus in the present embodiment, it is a photosensitive dry film developing apparatus, a photographic developing type solder resist developing apparatus, or a dry film film peeling apparatus. In addition, the effects of the present invention can also be obtained in these processing apparatuses.

  Furthermore, the processing apparatus of the present invention is effective not only in the printed wiring board but also in the manufacture of other substrates that perform processing such as development and etching using a method of spraying a processing liquid onto the substrate.

  By using the substrate processing apparatus of the present invention, it is possible to easily grasp the state of the processing apparatus used for the production of printed wiring boards, etc., and to reduce the operating rate of production facilities by performing equipment maintenance at an appropriate timing. In addition, it is possible to solve the problem of the quality of the substrate such as the printed wiring board and to produce a high-density and high-precision printed wiring board with a high yield. Thereby, it can be said that the industrial applicability of the present invention is great.

DESCRIPTION OF SYMBOLS 1 Spray nozzle 2 Spray pipe 3a-3d Pressure gauge 4 Pump 5 Filter 6 Bypass 7a-7c Valve

Claims (7)

Means for transporting the substrate at a predetermined speed, a spray tube having a plurality of spray nozzles attached thereto, and a pump for supplying a treatment liquid to the spray tube, any position in the flow path between the pump and the spray tube And a substrate processing apparatus having a pressure gauge at the end point of the spray tube. 2. The substrate processing apparatus according to claim 1, wherein an arbitrary position of a flow path between the pump and the spray pipe is a position of a supply start point of the processing liquid on the spray pipe. The arbitrary position of the flow path between the pump and the spray pipe is a position of a treatment liquid supply start point on the spray pipe and a position between the supply start point and the spray pipe end point. Item 2. The substrate processing apparatus according to Item 1. The substrate processing apparatus according to claim 3, wherein a plurality of attachment points of pressure gauges are provided at a plurality of positions between the supply start point and an end point of the spray pipe, and a pressure gauge is provided at each position. 2. The substrate processing apparatus according to claim 1, wherein the pressure gauge provided at the position of the end point of the spray tube includes means for transmitting a signal to a control device or an alarm device of the substrate processing apparatus when a certain pressure is reached. . 2. The substrate processing apparatus according to claim 1, wherein a plurality of spray pipes are provided, and an arbitrary position of a flow path between the pump and the spray pipe is an arbitrary position of a flow path of each spray pipe. The flow path between the pump and the spray pipe is connected via a filter, and the flow path between the pump and the spray pipe includes a bypass flow path and a valve not passing through the filter. The substrate processing apparatus according to claim 1, wherein the apparatus is a substrate processing apparatus.

Images