JP5370143B2 - Electronic component package base, electronic component package - Google Patents

Description

  The present invention relates to a base for an electronic component package used in an electronic device or the like, and an electronic component package.

  Examples of electronic components that require hermetic sealing include piezoelectric vibration devices such as crystal resonators, crystal filters, and crystal oscillators. In each of these products, a metal thin film electrode is formed on the surface of the crystal diaphragm, and the crystal diaphragm (specifically, the metal thin film electrode is hermetically sealed to protect the metal thin film electrode from the outside air.

  Due to the demand for surface mounting of components, these piezoelectric vibration devices are increasingly being housed in a package made of a ceramic material. For example, Patent Document 1 discloses a ceramic material in which a cross-section having a mounting portion for an electronic component element such as a quartz crystal diaphragm is formed of a concave base (mounting substrate) and a lid (cover), and these are hermetically sealed. A package configuration is disclosed. In this piezoelectric vibration device, a positioning pattern is formed on the inner bottom surface of the base, and the mounting accuracy of electronic component elements by image recognition is improved.

JP 11-251839 A

  In recent years, with the miniaturization of electronic components, an improvement in accuracy for mounting electronic component elements on a base has been further demanded. The positioning pattern for mounting the electronic component element by image recognition as described above is set as a reference point for image recognition, so that there is a positional shift not only by the configuration of the positioning pattern but also by its formation state. was there. Therefore, it is an important issue to improve the mounting accuracy based on the electronic component element by image recognition that it is easy to set the positioning pattern as a reference point and does not affect the quality of the formation state.

  In the above-mentioned Patent Document 1, since the center point of the positioning pattern is determined, the width dimension and position in at least two directions of the pattern are recognized, the center width from the pattern end in each direction is calculated, and the center point is calculated. It is necessary to set the position. This method is more susceptible to the adverse effects of the positioning pattern formation state such as dimensional errors and formation deviations, and the positioning reference points cannot be recognized more accurately along with downsizing. For example, when the base size is 2.0 mm x 1.6 mm or less, a part of the positioning pattern may sink into (intersect) the inner wall surface of the base wall (bank) or extend to the base wall due to misalignment. In some cases, pattern deviation and dimensional error are likely to occur. In addition, since the positioning pattern is printed by metallization on the base of ceramic material, the pattern edge part may be blurred or defective in shape due to formation defects during printing (excessive application or insufficient application of printed matter). was there. As a result, there is a problem that a dimensional error or a positional deviation occurs as a positioning reference point, the positioning reference point cannot be accurately recognized, and the accuracy when mounting an electronic component element on the base by image recognition is reduced. .

  The present invention has been made to solve the above-described problems, and can improve the mounting accuracy of electronic component elements in a miniaturized electronic component, and can provide an inexpensive and highly reliable electronic component package base and electronic component The purpose is to provide a package.

In order to achieve the above object, in a base for an electronic component package for holding a rectangular electronic component element, the base has a rectangular shape in plan view and includes a wall portion, an opening portion, and an internal storage portion. A pair of electrode pads on which the electronic component element is mounted and connected to the upper surface of one end portion of the storage portion, and an outer side parallel to one side of the base wall portion from the electrode pad toward the other end portion of the base internal storage portion. A pair of routing patterns extending at a predetermined width in a state of being exposed on the surface is formed, and the position of the wall portion of the base at the position from the other end of the internal storage portion of the base is formed in the routing pattern. one side and away and the pair of the widening section of the routing pattern as positioning reference point overhanging in a direction turned away with respect to one side of the wall part is provided, the width dimension of the lead-out pattern a, of the wider section When the large overhang dimension is b, the maximum overhang dimension b of the widened portion is formed to be 1/2 or more of the width dimension a of the routing pattern, and the dimension fits in the internal storage portion of the base. it has been Ri Na, with respect to the spacing of the pair of electrode pads, characterized in that widening the spacing of the pair of the widening section.

  With this configuration, the vicinity of the electrode pad on which the electronic component element is mounted and the vicinity of the widened portion of the routing pattern are used for positioning as a reference point for positioning, thereby enabling more accurate image recognition along the wall portion of the base. It is possible to increase the mounting accuracy of electronic component elements (position accuracy in the X direction, position accuracy in the Y direction, position accuracy of θ, etc.). The positioning reference point does not sneak (intersect) or extend the lead pattern and its widened part against the wall of the base due to the effect of pattern formation deviation or lamination deviation when the base is ceramic. It will not interfere with the functions of Even if the formation area of the lead pattern is reduced due to downsizing and high-density mounting of electronic components, the maximum overhang dimension b of the widened portion is 1/2 or more of the width dimension a of the lead pattern. And since it is formed in the dimension which can be accommodated in the internal storage part of the said base, the said wide part can be formed in the stable state, and the position shift and blurring do not arise. The widened portion can be stable and accurate as a positioning reference point that does not affect the quality of the formation state due to manufacturing variations or the like. As a result, even when electronic components are miniaturized or mounted with high density, the accuracy when mounting electronic component elements on the base is improved by recognizing the area around the widened portion as a positioning reference point. Can do.

  In the invention according to claim 2, in addition to the above configuration, an angle at which a part of the end portion of the routing pattern and a part of the end portion of the widened portion intersect is 45 ° or more and 135 ° or less. Thus, the intersecting portion may be set as a positioning reference point.

  In such a configuration, in addition to the above-described effects, the end of the routing pattern is not calculated from the image data of a specific pattern as in the prior art and the center point of the specific pattern is used as a positioning reference point. Since a part where the part of the widened part and a part of the end part of the widened part intersect each other can be directly set as a reference point for positioning, a dimensional error or It is difficult to be adversely affected by the formation state of the positioning pattern such as formation deviation. In addition, since the angle at which a part of the end portion of the routing pattern and a part of the end portion of the widened portion intersect is set to 45 ° or more and 135 ° or less, it is difficult to be adversely affected by the pattern formation blur at the intersecting portion. . As described above, accurate reference point recognition can be performed even if the size is reduced.

  According to a third aspect of the present invention, in addition to the above configuration, a corner portion is formed in the widened portion, and the corner portion is formed at an angle of 45 ° to 135 °, and the corner portion is positioned. It may be set as a reference point for use.

  In such a configuration, in addition to the above-described operation and effect, it is calculated from the image data of a specific pattern as in the prior art, and the center point of the specific pattern is not used as a reference point for positioning, but the widened portion has a corner portion. Can be directly set as a positioning reference point, and the width dimension and position of the pattern from a plurality of directions can be recognized without being adversely affected by the positioning pattern formation state such as a dimensional error or formation deviation. In addition, since the angle of the corner is set to 45 ° or more and 135 ° or less, it is difficult to be adversely affected by the pattern formation blur at the corner. As described above, accurate reference point recognition can be performed even if the size is reduced.

  In addition, the electronic component element is bonded and mounted on the electrode pad using the base of the electronic component package described above, and the opening of the base on which the electronic component element is mounted is hermetically sealed with a lid. It may be a package for electronic parts characterized by the following. With this configuration, an electronic component package that is hermetically sealed using a base that can obtain the above-described operational effects can be obtained. Therefore, the mounting accuracy of the electronic component element in the miniaturized electronic component can be increased, and it is inexpensive and reliable. It is possible to provide a package for electronic components having a high height.

  ADVANTAGE OF THE INVENTION According to this invention, the mounting precision of the electronic component element in a miniaturized electronic component can be improved, and the base of the electronic component package which is cheap and highly reliable, and the electronic component package can be provided.

FIG. 3 is a plan view of a surface-mount type crystal resonator base according to the first embodiment. The partially expanded view of FIG. 1 is a cross-sectional view of a surface-mounted crystal resonator showing a first embodiment. The top view of the base for surface mount-type crystal units which shows a 2nd Example. FIG. 6 is a plan view of a surface-mount type crystal resonator base according to a third embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each of the following embodiments, the case where the present invention is applied to a surface-mount type crystal resonator as an electronic component is shown.

  As shown in FIGS. 1, 2, and 3, the surface-mount type crystal resonator according to Example 1 includes a crystal diaphragm 3 that is an electronic component element, and a crystal diaphragm 3 that has a recess that is open at the top. And a lid 2 that hermetically seals the crystal diaphragm 3 held on the base 1 by being joined to the opening of the base 1.

  The base 1 is a rectangular parallelepiped as a whole, and has a configuration in which a ceramic such as alumina and a conductive material such as tungsten or molybdenum are appropriately laminated. As shown in FIG. 3, the base 1 includes a storage section 10 (internal storage section) having a concave shape in cross section, and a bank portion 11 (wall section) provided around the storage section 10 so as to surround the storage section 10. Specifically, the base 1 is a rectangular (planar view rectangular) flat plate-shaped ceramic base base 1a, and a ceramic having a large central portion and an outer size (planar view outer size) substantially equal to the base base 1a. The base body 1a, the frame body 1b, and the sealing member 11a are integrally fired. The top surface of the bank portion 11 (frame body 1b) is flat, and a sealing member 11a (a sealing material, a metal layer, or the like) is formed on the bank portion 11. For example, the sealing member 11a may have a structure in which a nickel plating layer or a gold plating layer is formed on the upper surface of glass or a metallized layer made of tungsten, molybdenum, or the like, or a metal ring is formed on the upper part of each layer. Good.

  Also, castellations are formed vertically on the side surface of the base 1 from the bottom surface to the top surface (upper surface) of the four corners of the outer periphery (outer peripheral edge in plan view) of the base 1. Further, side terminal electrodes (not shown) are formed below these castellations, and the side terminal electrodes are electrically connected (connected) to terminal electrodes 18 and 19 formed on the bottom surface of the base.

  The base 1 has a rectangular shape in plan view, and a pair of quartz diaphragms 3 to be described later is mounted and connected to the upper surface of one end (on the side 113 of the bank 11) of the inner bottom surface of the storage portion 10 of the base 1. Electrode pads 12, 13, and the electrode pads 12, 13 toward the other end of the inner bottom surface of the base (on the side 114 of the bank 11) and parallel to the sides 111, 112 of the base bank 11 A pair of routing patterns 14 and 15 extending with a certain width in a state of being exposed on the surface are formed. Also, a pillow member M that regulates the inclination when a later-described crystal diaphragm 3 is mounted on the upper surface of the inner bottom surface of the storage portion 10 of the base 1 near the center of the other end side (one side 114 side of the bank portion 11). Is formed. In the first embodiment, each of the electrode pads 12 and 13 has a rectangular shape, and an angle (a portion 121 or 131) at which a part of the end of each of the routing patterns 14 and 15 and a part of the end of each of the electrode pads 12 and 13 intersect. (Intersection angle) is formed at about 90 °.

  Of the pair of routing patterns 14, 15, the base 1 protrudes in a direction facing away from the one side 111, 112 of the bank 11 of the base 1 at a position from the other end of the inner bottom surface of the base 1. A pair of widened portions 16 and 17 of the routing pattern are provided as positioning reference points. In the first embodiment, the pair of widened portions 16 and 17 have a rectangular shape, and portions 161 and 162 where a part of the end portions of the routing patterns 14 and 15 and a part of the end portions of the widened portions 16 and 17 intersect. The angle 171 (crossing angle) is formed at about 90 °, and the angles 163, 164, 173, and 174 of the widened portions 16 and 17 are also formed at about 90 °.

  Further, in Example 1, as shown in FIG. 2, the width dimension of the portion adjacent to the widened portions 16 and 17 in each of the routing patterns 14 and 15 is a, the maximum projecting dimension of each widened portion 16 and 17 is b, When the maximum projecting width dimension of the widened parts 16 and 17 is c, the maximum projecting dimension b of the widened parts 16 and 17 and the maximum projecting width dimension of the widened parts 16 and 17 are formed so as to fit within the inner bottom surface of the base 1. Both c are formed with a dimension equal to or larger than the width dimension a of the routing patterns 14 and 15. In the first embodiment, the distance between the widened portion 16 and the widened portion 17 is designed to be wider than the distance between the electrode pad 12 and the electrode pad 13, and the center line of the one side 111 and one side 112 of the bank 11 of the base 1 is used. On the other hand, the widened portion 16 and the widened portion 17 are formed in line symmetry. The electrode pads 12 and 13, the routing patterns 14 and 15, and the widened portions 16 and 17 are formed by printing a paste of a metallized material such as tungsten or molybdenum, and are integrated with the base 1. The metallization is formed by firing, nickel plating is formed on the upper part, and gold plating is formed on the upper part. In particular, the width dimension “a” of the routing patterns 14 and 15 as the basis for forming the widened portions 16 and 17 is 0.05 mm or more. In the first embodiment, the metallization is configured to have a thickness of, for example, about 0.1 mm in consideration of stability when formed by printing. For this reason, the formation state of the widened portion is further stabilized, and the accuracy as a positioning reference is increased.

  Between the electrode pads 12 and 13, a quartz crystal plate 3 (an electronic component element in the present invention) is mounted. A pair of excitation electrodes and extraction electrodes (not shown) are formed on the front and back surfaces of the crystal diaphragm 3. The pair of excitation electrodes and extraction electrodes are in contact with, for example, the quartz diaphragm 3 (from the top of the quartz diaphragm 3) in the order of chromium, gold, chromium, gold, chromium, chromium, silver, chromium, or chromium, It is formed by laminating in the order of silver. Each of these electrodes (a pair of excitation electrode and extraction electrode) can be formed by a thin film forming means such as a vacuum evaporation method or a sputtering method. The extraction electrode of the crystal diaphragm 3 is conductively bonded to the electrode pads 122 and 132 by a conductive bonding material (not shown), and the crystal diaphragm 3 is held on one side of the base 1. For example, a conductive bonding material such as a conductive resin adhesive, a metal bump, a metal plating bump, or a brazing material is used for conductive bonding between the excitation electrode of the crystal diaphragm 3 and the electrode pads 122 and 123 of the base 1. Can do.

  The lid 2 for hermetically sealing the base 1 has a plate-like ceramic material such as alumina formed with a sealing member 11a such as a glass sealing material, or a metal base material such as a metal brazing material. A metal member formed with 11a is used. The plan view outline of the lid 2 is substantially the same as or slightly smaller than the outline of the base 1.

  By storing the quartz crystal plate 3 in the storage portion 10 of the base 1 and covering it with the lid 2 and performing hermetic sealing by a technique such as fusion bonding by a heating furnace, seam welding or beam irradiation welding. The surface-mounted crystal unit (electronic component package) is completed.

  Hereinafter, a mounting procedure of the crystal diaphragm using the crystal resonator according to the first embodiment of the present invention will be described. As described above, the pair of electrode pads 12 and 13 on the upper surface on one end side of the inner bottom surface, and one side 111 of the base bank portion 11 from the electrode pads 12 and 13 toward the other end side of the inner bottom surface of the base. , 112 and a pair of routing patterns 14, 15 extending at a constant width in a state of being exposed on the outer surface in parallel to the outer surface, and the other end portions of the pair of routing patterns 14, 15, and the bank portion 11 of the base 1. A base 1 is prepared in which widened portions 16 and 17 projecting in a direction (separating direction) from the sides 111 and 112 are formed.

  And as shown in the arrow part of FIG. 1, the part 121,131 where a part of the end part of each routing pattern 14,15 of the base 1 and a part of the end part of each electrode pad 12,13 intersect in advance, A portion 161, 171 where a part of the end of each routing pattern 14, 15 of the base 1 and a part of the end of each widened portion 16, 17 intersect is set as a positioning reference point for image recognition. For example, relative position information and distance information from the intersecting portions 121, 131, 161, 171 to the vicinity of the centers of the electrode pads 12, 13 are stored in the image recognition apparatus. Similarly, relative position information, distance information, and the like from the outer peripheral end of the crystal diaphragm 3 to the vicinity of the center of an extraction electrode (not shown) are stored in the image recognition system of the crystal diaphragm mounting device (electronic component mounting device). In addition, as shown in FIG. 2, as a setting place of the positioning reference point related to the widened portion 16, it may be set not only at the intersecting portion 161 but also at other intersecting portions 162 or corner portions 163 and 164. . As shown in FIG. 1, not only the intersecting portion 171 but also the corner portions 173 and 174 may be set as the setting location of the positioning reference point related to the widened portion 17.

  Next, based on the information stored in the image recognition system, the base 1 is arranged in a predetermined position and orientation with respect to the work area of the crystal diaphragm mounting device. Specifically, the position of the base 1 (the position in the X direction and the position in the Y direction) and the direction of the base (the positions of the electrode pads 12 and 13) are recognized from the intersecting portions 121 and 131, and the intersecting portions 121 are detected. 161, or the angle (θ) at which the base is arranged is recognized from the intersecting portions 131 and 171.

  Next, based on the information stored in the image recognition system, a conductive bonding material is arranged and formed at predetermined positions of the electrode pads 12 and 13 of the base 1 arranged at predetermined positions in the work area. Specifically, a position near the center of the electrode pads 12 and 13 (position in the X direction, position in the Y direction) is recognized from the intersecting portions 121 and 131.

  Next, based on the information stored in the image recognition system, a quartz crystal is formed on the base 1 arranged at a predetermined position in the work area and having a conductive bonding material arranged at a predetermined position on the electrode pads 12 and 13. The diaphragm 3 is mounted and joined. Specifically, from the four corners or four sides of the crystal diaphragm 3, the position of the outer peripheral edge of the crystal diaphragm (end position in the X direction, end position in the Y direction) and the angle at which the crystal diaphragm is disposed ( θ) and the relative position from the four corners of the crystal diaphragm 3 and the position of the extraction electrode to the orientation of the crystal diaphragm and the outer peripheral end of the crystal diaphragm to the vicinity of the center of the extraction electrode. Further, a position near the center of the electrode pads 12 and 13 (a position in the X direction and a position in the Y direction) is recognized from the intersecting portions 121 and 131. Further, the relative position and angle of the base housing portion 10 and the outer peripheral end of the quartz crystal plate 3, and the relative position between the base electrode pads 12 and 13 and the lead electrode of the quartz plate are recognized.

  A second embodiment of the present invention will be described below with reference to FIG. In addition, the same number is attached | subjected about the part similar to the said Example 1, and a part of description is abbreviate | omitted and demonstrated.

  The base 1 has a rectangular shape in plan view, and a pair of quartz diaphragms 3 to be described later is mounted and connected to the upper surface of one end (on the side 113 of the bank 11) of the inner bottom surface of the storage portion 10 of the base 1. Electrode pads 12, 13, and the electrode pads 12, 13 toward the other end of the inner bottom surface of the base (on the side 114 of the bank 11) and parallel to the sides 111, 112 of the base bank 11 A pair of routing patterns 141 and 15 extending at a constant width in a state of being exposed on the surface, and the other end side of the inner bottom surface of the base in a state of being different from the routing pattern 141 (one side 114 side of the bank portion 11) ) And a routing pattern 142 extending at a constant width in a state of being exposed on the outer surface in parallel with the side 111 of the base bank portion 11. Also, a pillow member M that regulates the inclination when a later-described crystal diaphragm 3 is mounted on the upper surface of the inner bottom surface of the storage portion 10 of the base 1 near the center of the other end side (one side 114 side of the bank portion 11). Is formed. In the second embodiment, the electrode pads 12 and 13 have a rectangular shape, and portions 121, 122, and 131 where a part of the end portions of the routing patterns 14 and 15 and a part of the end portions of the electrode pads 12 and 13 intersect each other. The angle (crossing angle) is formed at about 90 °.

  The connection portion between the routing patterns 141 and 142 is provided with a widening portion 16 of the routing pattern as a positioning reference point protruding in a direction facing away from the one side 111 of the bank portion 11 of the base 1 (a direction away from the side). Yes. Further, in the routing pattern 15, as a positioning reference point that protrudes in a direction facing away from the one side 112 of the bank portion 11 of the base 1 (a direction away from the other end portion of the inner bottom surface of the base 1). The widened portion 17 of the routing pattern is provided. In Example 2, the widened portion 16 has a triangular shape, and the widened portion 17 has a pentagonal shape. Angles (intersection angles) of portions 161 and 162 where a part of the end portions of the routing patterns 141 and 142 and a part of the end portion of the widened portion 16 intersect are formed at about 135 ° and about 90 °, respectively. The angle of the corner portion 163 of the widened portion 16 is about 45 °. The angle (intersection angle) of the portion 171 where a part of the end portion of the routing pattern 15 and a part of the end portion of the widened portion 17 intersect is formed at about 90 °, and the corner portion 173 of the widened portion 17 is formed. Are formed at about 112.5 °, about 112.5 °, and about 135 °.

  In the second embodiment, as shown in FIG. 4, the width dimension of the portions of the routing patterns 141 and 15 adjacent to the widened portions 16 and 17 is a, and the maximum projecting dimension of the widened portions 16 and 17 is b1 and b2. When the maximum projecting width dimensions of the widened portions 16 and 17 are c1 and c2, they are formed so as to fit on the inner bottom surface of the base 1, and both the maximum projecting dimension b1 and the maximum projecting width dimension c1 of the widened section 16 are The lead pattern 14 is formed with a dimension that is greater than or equal to the width dimension a, and only the maximum projecting dimension b2 of the widened portion 17 is formed with a dimension that is greater than or equal to the width dimension a of the lead pattern 15. The electrode pads 12 and 13, the routing patterns 14 and 15, and the widened portions 16 and 17 are formed by printing a paste of a metallized material such as tungsten or molybdenum, and are integrated with the base 1. The metallization is formed by firing, nickel plating is formed on the upper part, and gold plating is formed on the upper part.

  In the crystal resonator according to the second embodiment of the present invention, for example, portions 121 and 131 where a part of the end portions of the routing patterns 141 and 15 and a part of the end portions of the electrode pads 12 and 13 intersect, and the base 1 A portion 161 where a part of the end of the lead pattern 141 and a part of the end of the widened portion 16 intersect, a corner 163 of the widened portion 16, and a corner 175 of the widened portion 17 are used for positioning for image recognition. It is set as a reference point. In addition, as shown in FIG. 4, not only the intersection portion 161 and the corner portion 163 but also other intersection portions 162 are set as the setting location of the positioning reference point related to the widened portion 16, and any one of them is included. You may select and set suitably as mentioned above. As shown in FIG. 4, not only the corner portion 175 but also the intersection portion 171, the corner portion 173, the corner portion 174, and the like are set as locations for setting the reference points for positioning related to the widened portion 17. Two or more may be selected and set as appropriate.

  Embodiment 3 of the present invention will be described below with reference to FIG. The same parts as those in the first and second embodiments are denoted by the same reference numerals and a part of the description is omitted.

  The base 1 has a rectangular shape in plan view, and one end on one end side of the inner bottom surface of the storage portion 10 of this base 1 (one end side close to one side 111 on the side 113 of the bank 11) The electrode pad 12 to which one end side of the crystal diaphragm 3 described later is mounted and connected, and one end on the other end side of the inner bottom surface of the base from the electrode pad 12 (on the side 114 side of the bank portion 11) A routing pattern 14 extending in a certain width is formed in a state of being exposed to the outer surface in parallel with the side 111 of the base bank 11 toward one end side close to the side 111. Also, a quartz crystal plate, which will be described later, is formed on the upper surface of the other bottom side of the inner bottom surface of the storage portion 10 of the base 1 (the other end side close to the one side 112 on the side 114 of the bank 11). Electrode pad 13 to which one end side of 3 is mounted and connected, and the other end on one end side of the inner bottom surface of the base from the electrode pad 13 (the other side close to one side 112 of the bank 11 on one side 113 side) A routing pattern 15 extending in a certain width is formed in a state of being exposed to the outer surface in parallel with the one side 112 of the base bank portion 11 toward the end side. In the third embodiment, the electrode pads 12 and 13 are formed in a square shape, and the angles of the portions 121 and 131 where a part of the end portions of the routing patterns 14 and 15 and a part of the end portions of the electrode pads 12 and 13 intersect ( (Intersection angle) is formed at about 90 °.

  In the routing pattern 14, for positioning, at least a part projects from the other end portion of the inner bottom surface of the base 1 in a direction facing away from the one side 111 of the bank 11 of the base 1 (a direction away from it). A widened portion 16 of a routing pattern as a reference point is provided. Further, in the routing pattern 15, for positioning, at least a part projects from the one end portion of the inner bottom surface of the base 1 in a direction facing away from the one side 112 of the bank portion 11 of the base 1 (a direction away from it). A widened portion 17 of a routing pattern as a reference point is provided. In Example 3, the widened portion 16 has a circular shape, and the widened portion 17 has a hexagonal shape. An angle (intersection angle) of a portion 161 where a part of the end portion of the routing pattern 14 and a part of the circumference of the widened portion 16 intersect is formed at about 120 °. The angle (intersection angle) of a portion 171 where a part of the end portion of the routing pattern 15 and a part of the end portion of each widened portion 17 intersect is formed at about 45 °, and the corner portion of the widened portion 17 The angles 173, 174, and 175 are formed at about 90 °, about 135 °, and about 90 °. The widened portion of the routing pattern in the present invention may be used as a via formation region for routing the electrode to the upper and lower surfaces of the base. For example, in the third embodiment, the via V is formed in the widened portion 17, and the electrode pad 13 can be drawn out to a part of the terminal electrode on the back surface of the base 1 without enlarging the formation area of the drawing pattern. it can.

  Further, in Example 3, as shown in FIG. 5, the width dimension of the portions adjacent to the widened portions 16 and 17 in the respective drawing patterns 14 and 15 is a, and the maximum projecting dimension of each widened portion 16 and 17 is b1 and b2. When the maximum projecting width dimension of each of the widened portions 16 and 17 is set to c1 and c2, it is formed with a dimension that fits on the inner bottom surface of the base 1, and the maximum projecting dimension b1 of the widened section 16 is the width dimension a of the routing pattern 14. Only the maximum projecting width dimension c1 of the widened portion 16 is formed with a dimension equal to or larger than the width dimension a of the routing pattern 14. Further, both the maximum overhanging dimension b2 and the maximum overhanging width dimension c2 of the widened portion 17 are formed to be larger than the width dimension a of the routing pattern 14. The electrode pads 12 and 13, the routing patterns 14 and 15, and the widened portions 16 and 17 are formed by printing a paste of a metallized material such as tungsten or molybdenum, and are integrated with the base 1. The metallization is formed by firing, nickel plating is formed on the upper part, and gold plating is formed on the upper part.

  In the crystal resonator according to the third embodiment of the present invention, for example, portions 121 and 131 where a part of the end portions of the routing patterns 14 and 15 and a part of the end portions of the electrode pads 12 and 13 intersect, and the base 1 A portion 161 where a part of the end portion of the routing pattern 14 and a part of the end portion of the widened portion 16 intersect, and a portion 171 where a part of the end portion of the routing pattern 15 and a part of the end portion of the widened portion 17 intersect. Are set as positioning reference points for image recognition. In addition, as shown in FIG. 5, the setting location of the reference point for positioning related to the widened portion 17 includes not only the intersection portion 171 but also the corner portion 173, the corner portion 174, the corner portion 175, etc. One or more may be selected and set as appropriate.

  According to the configuration of the embodiment of the present invention, the base around the electrode pads 12 and 13 on which the crystal diaphragm 3 is mounted and the wide portions 16 and 17 of the routing pattern are used as positioning reference points for image recognition. Image recognition can be performed more accurately along the sides 11 and 112 of the bank portion, and the mounting accuracy of the crystal diaphragm 3 (position accuracy in the X direction, position accuracy in the Y direction, position accuracy of θ, etc.) can be improved. . Further, the widened portions 16 and 17 of the routing pattern are formed so as to protrude in the direction facing away from the one side of the bank portion 11 of the base 1 (in the direction away from each other). In this case, the routing patterns 14 and 15 and the widened portions 16 and 17 do not sink (intersect) or extend with respect to the base bank portion 11 due to the effect of misalignment of the base, so that the function of the positioning reference point can be achieved. There is no hindrance. Further, even if the formation area of the routing patterns 14 and 15 is reduced due to downsizing and high-density mounting of the surface-mount type crystal resonator, the maximum projecting dimensions b, b1 and b2 of the widened portions 16 and 17 are reduced. However, since it is formed with a dimension that is 1/2 or more of the width dimension a of the routing patterns 14 and 15 and can be accommodated in the storage part 10 of the base, the widened parts 16 and 17 are prevented from being displaced or blurred. In addition, if the maximum projecting width dimensions c, c1, c2 of the widened portions 16, 17 are not less than 1/2 of the width dimension a of the routing patterns 14, 15, and are formed so as to fit in the storage portion 10 of the base. The widened portions 16 and 17 can be formed in a more stable state, which is a more preferable form. That is, the widened portions 16 and 17 can be made stable and accurate as positioning reference points that do not affect the quality of the formation state due to manufacturing variations or the like. As a result, even when the electronic component is miniaturized or mounted with high density, the vicinity of the widened portions 16 and 17 is image-recognized as a positioning reference point to mount the crystal diaphragm on the base 1. Accuracy can be increased.

  Further, in each of the above embodiments, the portions 121, 122, 131, 161, 162, where a part of the end portions of the routing patterns 14, 15, 141, 142 and a part of the end portions of the widened portions 16, 17 intersect. 171 is formed at an angle of 45 ° or more and 135 ° or less, and the intersecting portion is set as a reference point for positioning. Therefore, the dimensions can be measured without recognizing the width and position of the pattern from a plurality of directions. It can be made difficult to be adversely affected by the formation state of the positioning pattern, such as errors and misalignment. In addition, it is difficult to be adversely affected by pattern formation blur at the intersection. In each of the above embodiments, the corners 163, 164, 173, 174, and 175 are formed in the widened portions 16 and 17, and the corners are formed at an angle of 45 ° to 135 °. Since it is set as a reference point for positioning, it is difficult to be adversely affected by the formation state of the positioning pattern such as dimensional errors and formation deviations without recognizing the width dimension and position of the pattern from a plurality of directions. In addition, it is difficult to be adversely affected by blurred pattern formation at the corners. As described above, accurate reference point recognition can be performed even if the size is reduced.

  In the above-described embodiment, a surface-mount type crystal resonator is taken as an example, but the present invention can also be applied to other surface-mount type electronic component packages used in electronic devices such as crystal filters and crystal oscillators. For example, the crystal oscillator is not limited to a crystal diaphragm as an electronic component element, but may be applied to mounting an integrated circuit element or other electronic components. Further, although a ceramic material is disclosed as an insulating package (base), another insulating material such as a glass material may be used. Although metallization is disclosed as the metal film of the terminal electrode, other configurations such as a plating material may be used.

  The present invention can be implemented in various other forms without departing from the spirit or main features thereof, and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not limited by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  The present invention can be applied to an electronic component package such as a crystal resonator and a base of an electronic component package.

1 Base 2 Lid 3 Crystal Diaphragm (Electronic Component Element)

Claims (4)

In the base of the electronic component package holding the rectangular electronic component element,
The base has a rectangular shape in plan view and includes a wall portion, an opening portion, and an internal storage portion. A pair of electrode pads for mounting and connecting the electronic component element on an upper surface of one end portion of the internal storage portion, A pair of routing patterns are formed extending from the electrode pad toward the other end of the internal storage portion of the base in a predetermined width in a state of being exposed to the outer surface in parallel with one side of the wall portion of the base,
A positioning reference point that protrudes in a direction away from one side of the wall portion of the base and facing away from one side of the wall portion at a position from the other end of the internal storage portion of the base in the routing pattern. A pair of widened portions of the routing pattern as provided,
When the width dimension of the routing pattern is a and the maximum projecting dimension of the widened portion is b,
Maximum overhang dimension b of the wider section, wherein it is formed in 1/2 or more of the width a of the lead-out pattern, and Ri Na is formed dimensioned to fit inside housing portion of the base, the pair of electrode pads A base for an electronic component package, characterized in that the interval between the pair of widened portions is increased with respect to the interval . An angle at which a part of the end portion of the routing pattern and a part of the end portion of the widened portion intersect is formed at 45 ° to 135 °, and the intersected portion is set as a reference point for positioning. The base of the package for electronic components according to claim 1 or claim 2, wherein A corner portion is formed in the widened portion, the corner portion is formed at an angle of 45 ° to 135 °, and the corner portion is set as a reference point for positioning. Item 1. A base for an electronic component package according to item 1 or 2. An electronic component element is bonded and mounted on an electrode pad using the base of the electronic component package according to any one of claims 1 to 3, and the base on which the electronic component element is mounted is mounted. A package for electronic parts, wherein the opening is hermetically sealed with a lid.

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