JP5375113B2 - Probe contact jig - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an implement for probe contact capable of reducing workloads to workmen and efficiently and stably inspecting the electric characteristics of semiconductor parts. <P>SOLUTION: The implement 1 for probe contact and for bringing an inspecting probe 3 of a semiconductor inspection apparatus into contact with external terminals 2a of a semiconductor part 2 comprises a pair of frame bodies 10 and 10 mounted to a semiconductor part 2 in such a way as to hold the semiconductor part 2 from both sides. The implement 1 for probe contact is provided with a probe holding implement 12 slide-freely mounted to the frame bodies 10 for holding the inspecting probe 3 and bringing the inspecting probe 3 into contact with the external terminals 2a of the semiconductor part 2. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a probe contact jig, and for example, relates to a probe contact jig that can reduce the work burden on an operator and can efficiently and stably inspect the electrical characteristics of semiconductor components.

  When inspecting electrical characteristics such as a conduction state and a voltage value in a semiconductor component such as a QFP (Quad Flat Package), an inspection probe included in a semiconductor inspection device such as an oscilloscope is brought into contact with an external terminal of the semiconductor component. In this type of inspection, an operator often manually performs an operation of bringing an inspection probe into contact with an external terminal of a semiconductor component.

  However, with recent high-density mounting of semiconductor components, the spacing between adjacent external terminals has narrowed, and the work itself of contacting the inspection probe with the external terminals of the semiconductor component has placed an excessive burden on the operator. I am strong. Therefore, recently, in order to reduce the work burden on the operator, a probe contact jig has been used as an auxiliary tool for assisting the probe contact work.

  As an example of such a probe contact jig, a probe contact jig has been proposed in which an inspection probe of a semiconductor inspection apparatus is attached to a guide member slidable with respect to a semiconductor component (see, for example, Patent Document 1).

  When inspecting the electrical characteristics of a semiconductor component using such a probe contact jig, first, the guide member is pressed against one side of the semiconductor component. Then, while the guide member is pressed against one side of the semiconductor component, the test probe attached to the guide member is sequentially brought into contact with the external terminal of the semiconductor component by sliding along the external terminal of the semiconductor component.

Japanese Utility Model Publication No. 5-14949

  However, in the conventional probe contact jig described above, when the guide member is pressed against one side of the semiconductor component and slid along the external terminal of the semiconductor component, the operation is performed while holding the guide member by hand. . For this reason, the holding state of the guide member becomes unstable, causing problems such as poor contact between the inspection probe and the external terminals of the semiconductor component and short circuit between adjacent external terminals, resulting in a decrease in inspection stability. There was a problem that.

  The disclosed technology has been made in order to solve the above-described problems caused by the prior art, and reduces the work burden on the worker, and efficiently and stably carries out the inspection of the electrical characteristics of the semiconductor components. An object of the present invention is to provide a probe contact jig that can be used.

  In order to solve the above-described problems and achieve the object, a probe contact jig disclosed in the present application is, in one aspect, a probe contact jig that makes an inspection probe included in a semiconductor inspection apparatus contact an external terminal of a semiconductor component. A pair of frames attached to the semiconductor component so as to sandwich the semiconductor component, and a slidably attached to the frame, holding the inspection probe, and for the inspection And a probe holder for bringing the probe into contact with an external terminal of the semiconductor component.

  According to this aspect, the work burden on the worker can be reduced, and the inspection of the electrical characteristics of the semiconductor component can be carried out efficiently and stably.

  According to one aspect of the probe contact jig disclosed in the present application, it is possible to reduce the work burden on the operator and to efficiently and stably perform the inspection of the electrical characteristics of the semiconductor component. .

FIG. 1 is a top view of the probe contact jig according to the present embodiment. FIG. 2 is a side view of FIG. FIG. 3 is a top view showing a state in which the probe contact jig according to the present embodiment is mounted on a semiconductor component. FIG. 4 is a side view of FIG. FIG. 5 is a partially enlarged top view of part A in FIG. 6 is an enlarged cross-sectional side view taken along the line BB in FIG.

  Exemplary embodiments of a probe contact jig disclosed in the present application will be described below in detail with reference to the accompanying drawings.

  First, the configuration of the probe contact jig according to the present embodiment will be described. The probe contact jig according to the present embodiment is a jig for bringing an inspection probe included in a semiconductor inspection apparatus such as an oscilloscope into contact with an external terminal of a semiconductor component such as QFP.

  FIG. 1 is a top view of a probe contact jig according to the present embodiment, FIG. 2 is a side view thereof, and FIG. 3 is a top view showing a state in which the probe contact jig according to the present embodiment is mounted on a semiconductor component. 4 is a side view thereof, FIG. 5 is a partially enlarged top view of portion A in FIG. 3, and FIG. 6 is a partially enlarged side sectional view taken along line BB in FIG. The semiconductor component 2 is made of QFP, and a plurality of adjacent external terminals 2a are protruded from the resin box-shaped main body at a predetermined interval. The inspection probe 3 is electrically connected to an oscilloscope (not shown) via a predetermined lead wire.

  As shown in FIGS. 1 to 4, the probe contact jig 1 includes a pair of frames 10, 10, a probe holder 12, an optical sensor 14 as an external terminal detection sensor, a counter device 16, and a display device. 18.

  The pair of frames 10 and 10 are members attached to the semiconductor component 2 so as to sandwich the semiconductor component 2. Specifically, the pair of frame bodies 10 and 10 includes a slide arm 13 that is extended between the pair of frame bodies 10 and 10 and can be expanded and contracted in the longitudinal direction. By being degenerated, the semiconductor component 2 is attached to the semiconductor component 2 so as to sandwich the semiconductor component 2. On the other hand, the pair of frames 10, 10 are removed from the semiconductor component 2 by extending the slide arm 13.

  In addition, a housing space 11 which is an open space for housing the probe holder 12 is formed inside the frame body 10, and the probe holder 12 is attached to the frame body 10 in this housing space 11. On the other hand, a support rod 15 having a rectangular cross section that is slidably supported in the vertical direction of FIG.

  The probe holder 12 is a member that is slidably attached to the frame 10, holds the inspection probe 3, and makes the inspection probe 3 contact the external terminal 2 a of the semiconductor component 2. Specifically, as shown in FIGS. 5 and 6, the probe holder 12 is formed in a substantially rectangular parallelepiped shape in appearance, and the insertion hole 12 a through which the support rod 15 is inserted is provided in the frame of the probe holder 12. It is formed in the sliding direction with respect to the body 10. The probe holder 12 slides with respect to the frame 10 with the insertion hole 12a inserted through the support rod 15, so that the external terminal 2a of the semiconductor component 2 is positioned above the external terminal 2a of the semiconductor component 2. Move along the adjacent direction.

  The probe holder 12 has an insertion hole 12b through which the inspection probe 3 is inserted in an upright state. The probe holder 12 holds the inspection probe 3 by fixing the inspection probe 3 with the fixing screw 17 in a state where the inspection probe 3 is inserted into the insertion hole 12b. Contact the external terminal 2a.

  The optical sensor 14 is attached to the probe holder 12 and detects the external terminal 2 a of the semiconductor component 2 while sliding relative to the frame body 10 together with the probe holder 12. More specifically, the optical sensor 14 is attached to the probe holder 12 so as to be positioned in the vicinity of the tip of the inspection probe 3 inserted through the insertion hole 12b. The external terminal 2a in contact with the inspection probe 3 is detected. The optical sensor 14 is connected to the counter device 16 via a predetermined signal line, and outputs a detection signal detected from the external terminal 2 a to the counter device 16.

  The counter device 16 is a device that counts the number of external terminals 2 a of the semiconductor component 2 based on a detection signal of the external terminal 2 a by the optical sensor 14, and is mounted on the upper surface of the frame body 10. For example, when the optical sensor 14 detects the external terminals 2 a in order from the outermost external terminal 2 a among the external terminals 2 a of the semiconductor component 2, the counter device 16 detects that the external terminal 2 a detected by the optical sensor 14 is a semiconductor. Of the external terminals 2a of the component 2, the number of external terminals counted from the outermost external terminal 2a is counted.

  The display device 18 is a device that displays the number of external terminals 2 a of the semiconductor component 2 counted by the counter device 16. For example, when the counter device 16 counts the external terminal 2a detected by the optical sensor 14 from the outermost external terminal 2a among the external terminals 2a of the semiconductor component 2, the counter device 16 counts. The device 18 displays the count number. Since the optical sensor 14 detects the external terminal 2a that is in contact with the inspection probe 3, the user of the probe contact jig 1 checks the count number displayed on the display device 18 to thereby check the inspection probe. It is possible to immediately know the number of the external terminal 2a in contact with the external terminal 2a counting from the outermost external terminal 2a.

  Further, the display device 18 is preferably installed at a position that makes it easy for the user to visually recognize the display by the display device 18. In this embodiment, the display device 18 is positioned at a position adjacent to the counter device 16 on the upper surface of the frame 10. is set up. The display device 18 may be installed at other positions such as the upper surface of the counter device 16 and the upper surface of the probe holder 12.

  Next, a procedure for inspecting electrical characteristics such as a conduction state and a voltage value of the semiconductor component 2 by using the probe contact jig 1 configured as described above will be described. When the electrical characteristics of the semiconductor component 2 are inspected using the probe contact jig 1, first, the pair of frames 10 and 10 are arranged so as to sandwich the semiconductor component 2 by retracting the slide arm 13. Attach to 2.

  Subsequently, the inspection probe 3 is held by the probe holder 12 by inserting the inspection probe 3 into the insertion hole 12 b of the probe holder 12 and fixing it with the fixing screw 17.

  Subsequently, the probe holder 12 is slid with respect to the frame body 10, and the inspection probe 3 is brought into contact with the outermost external terminal 2 a among the external terminals 2 a of the semiconductor component 2. At this time, the optical sensor 14 detects the outermost external terminal 2 a among the external terminals 2 a of the semiconductor component 2, and the counter device 16 detects that the external terminal 2 a detected by the optical sensor 14 is the external terminal of the semiconductor component 2. 2a is counted as the first external terminal counted from the outermost external terminal 2a. The display device 18 displays the count number of the external terminal 2a by the counter device 16.

  Subsequently, the probe holder 12 is slid with respect to the frame body 10, and the inspection probe 3 is brought into contact with the external terminal 2 a adjacent to the outermost external terminal 2 a among the external terminals 2 a of the semiconductor component 2. At this time, the optical sensor 14 detects the external terminal 2a adjacent to the outermost external terminal 2a among the external terminals 2a of the semiconductor component 2, and the counter device 16 detects that the external terminal 2a detected by the optical sensor 14 is Of the external terminals 2a of the semiconductor component 2, the second external terminal counted from the outermost external terminal 2a is counted. The display device 18 displays the count number of the external terminal 2a by the counter device 16.

  In this manner, the inspection probe 3 is sequentially brought into contact with the adjacent external terminals 2a while sliding the probe holder 12 with respect to the frame body 10. While the inspection probe 3 is sequentially brought into contact with the adjacent external terminals 2a, the optical sensor 14 detects the external terminal 2a in contact with the inspection probe 3, and the counter device 16 detects that the external terminal 2a detected by the optical sensor 14 is The number of external terminals counted from the outermost external terminal 2a among the external terminals 2a of the semiconductor component 2 is counted. The display device 18 displays the count number of the external terminal 2a by the counter device 16, that is, the count number obtained by counting the external terminal 2a in contact with the inspection probe 3 from the outermost external terminal 2a.

  As described above, the probe contact jig 1 according to the present embodiment is a pair of frames 10 and 10 attached to the semiconductor component 2 so as to sandwich the semiconductor component 2, and slides with respect to the frame 10. A probe holder 12 that is freely attached and holds the inspection probe 3 and makes the inspection probe 3 contact the external terminal 2a of the semiconductor component 2 is provided. For this reason, when the inspection probe 3 is brought into contact with the external terminal 2a of the semiconductor component 2, it is not necessary to directly hold the inspection probe 3 by hand, and the instability of work associated with manual work can be avoided as much as possible. . Further, the inspection probe 3 can be sequentially brought into contact with the adjacent external terminals 2a only by a simple operation of sliding the probe holder 12 with respect to the frame 10. Further, since the pair of frames 10 and 10 sandwich the semiconductor component 2 and are firmly fixed to the semiconductor component 2, the rattling of the probe holder 12 during sliding relative to the frame 10 is eliminated. Thus, problems such as poor contact between the inspection probe 3 and the external terminal 2a of the semiconductor component 2 can be avoided. As a result, the work burden on the worker can be reduced, and the inspection of the electrical characteristics of the semiconductor component 2 can be carried out efficiently and stably.

  Further, in this embodiment, the optical sensor 14 is attached to the probe holder 12 and slides with respect to the frame body 10 together with the probe holder 12 as an external terminal detection sensor that detects the external terminal 2a of the semiconductor component 2. And a counter device 16 that counts the number of external terminals 2a of the semiconductor component 2 based on a detection signal from the optical sensor 14, and a display device that displays the number of external terminals 2a of the semiconductor component 2 counted by the counter device 16 18. For this reason, the worker who uses the probe contact jig 1 only checks the count number displayed on the display device 18, for example, and the external terminal 2 a in contact with the inspection probe 3 is connected to the outermost external device. It is possible to immediately know the number of external terminals counted from the terminal. Therefore, when the inspection probes 3 are sequentially brought into contact with the adjacent external terminals 2a, the work of counting the number of external terminals 2a can be omitted at all. As a result, the work burden on the worker can be further reduced, and the inspection of the electrical characteristics of the semiconductor component 2 can be made more efficient.

  Further, in this embodiment, the pair of frame bodies 10 and 10 includes a slide arm 13 which is a stretchable member that is stretched between the pair of frame bodies 10 and 10 and is extendable in the longitudinal direction. By being degenerated, the semiconductor component 2 is attached to the semiconductor component 2 so as to sandwich it. For this reason, the distance between the pair of frames 10 and 10 can be freely adjusted by extending and contracting the slide arm 13 in the longitudinal direction, and the pair of frames 10 and 10 for the semiconductor components 2 of various sizes. Can be attached. Therefore, when inspecting the electrical characteristics of a plurality of semiconductor components 2 having different sizes, it is not necessary to prepare a separate probe contact jig for each semiconductor component 2 having different sizes, and the distance between the pair of frames 10, 10. It is possible to easily replace the probe contact jig with respect to the semiconductor component simply by adjusting. As a result, the work burden on the worker can be reduced, and the inspection of the electrical characteristics of the semiconductor component 2 can be made more efficient.

  Although the embodiments of the present invention have been described so far, the present invention can be implemented in various different embodiments within the scope of the technical idea described in the claims other than the embodiments described above. Is also good.

  For example, in the present embodiment, the optical sensor 14 is used as the external terminal detection sensor, and the optical sensor 14 detects the external terminal 2a of the semiconductor component 2 in a non-contact manner. A contact-type sensor may be used as the sensor, and the contact-type sensor may detect the external terminal 2 a of the semiconductor component 2. In short, the external terminal detection sensor may be any type of sensor as long as it can detect the external terminal 2a of the semiconductor component 2 while sliding with respect to the frame body 10 together with the probe holder 12.

  The following supplementary notes are further disclosed with respect to the embodiments including the above examples.

(Supplementary note 1) A probe contact jig for bringing an inspection probe of a semiconductor inspection apparatus into contact with an external terminal of a semiconductor component,
A pair of frames attached to the semiconductor component so as to sandwich the semiconductor component;
A probe contact comprising: a probe holder that is slidably attached to the frame body and holds the inspection probe and contacts the inspection probe with an external terminal of the semiconductor component. Jigs.

(Supplementary Note 2) An external terminal detection sensor that is attached to the probe holder and detects an external terminal of the semiconductor component while sliding with respect to the frame together with the probe holder;
A counter device that counts the number of external terminals of the semiconductor component based on a detection signal from the external terminal detection sensor;
The probe contact jig according to appendix 1, further comprising: a display device that displays the number of external terminals of the semiconductor component counted by the counter device.

(Supplementary Note 3) The pair of frames are
A stretchable member that is stretched between the pair of frames and that is stretchable in the longitudinal direction is attached to the semiconductor component so as to sandwich the semiconductor component by retracting the stretchable member. The probe contact jig according to appendix 1 or 2.

(Appendix 4) The probe holder is
Any one of Supplementary notes 1 to 3 characterized in that by sliding with respect to the frame body, the upper part of the external terminal of the semiconductor component is moved along the adjacent direction of the external terminal of the semiconductor component. The probe contact jig described in 1.

DESCRIPTION OF SYMBOLS 1 Probe contact jig 2 Semiconductor component 2a External terminal 3 Inspection probe 10 Frame 11 Accommodating space 12 Probe holder 12a Insertion hole 12b Insertion hole 13 Slide arm 14 Optical sensor 15 Support rod 16 Counter device 17 Fixing screw 18 Display device

Claims (3)

A probe contact jig for bringing an inspection probe of a semiconductor inspection apparatus into contact with an external terminal of a semiconductor component,
A pair of frames attached to the semiconductor component so as to sandwich the semiconductor component;
The frame body is slidably attached to the frame body along a direction intersecting the direction of sandwiching the semiconductor component, and holds the inspection probe, and the inspection probe is connected to an external terminal of the semiconductor component. A probe contact jig, comprising: a probe holder that is brought into contact with the probe. An external terminal detection sensor that is attached to the probe holder and detects an external terminal of the semiconductor component while sliding relative to the frame body together with the probe holder;
A counter device that counts the number of external terminals of the semiconductor component based on a detection signal from the external terminal detection sensor;
The probe contact jig according to claim 1, further comprising: a display device that displays the number of external terminals of the semiconductor component counted by the counter device. The pair of frames are
A stretchable member that is stretched between the pair of frames and that is stretchable in the longitudinal direction is attached to the semiconductor component so as to sandwich the semiconductor component by retracting the stretchable member. The jig for probe contact according to claim 1 or 2.

Images