JP5379982B2 - Imaging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of effectively radiating heat of an imaging device with simple control without using a cooling element such as a Peltier element which requires battery drive. <P>SOLUTION: When temperature of the imaging device rises to be equal to or above predetermined temperature, a drive mechanism for image blur correction is used to position an imaging device holder at a predetermined position, and a part of a heat radiation plate fixed on the back of the imaging device held by the imaging device holder is thermally coupled to a clip conduction member on a fixing member side (step S146), whereby the heat of the imaging device is thermally conducted to the clip conduction member, and transferred to an outside part or a heat diffusion plate so as to be radiated. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to an imaging apparatus such as a compact digital camera that forms an image of a subject by a photographic lens on an imaging device and a single-lens reflex digital camera with interchangeable lenses.

  In general, in an image pickup apparatus that picks up an image using an image pickup device such as a CCD or CMOS sensor, noise components included in pixel signals increase due to heat generated by the image pickup device itself, leading to image degradation. It is said that. In addition, this type of imaging apparatus includes an image blur correction drive mechanism that moves the image sensor in a two-dimensional direction orthogonal to the optical axis, and corrects image blur so that image blur is corrected when image blur is detected. Some have a camera shake correction function in which the image pickup device is displaced by a driving mechanism.

  Therefore, as a heat dissipation measure for the image sensor, a Peltier element and a copper pillar (heat storage unit) configured to be movable integrally with the image sensor using a camera shake correction function, and a radiator fixed at a predetermined position are provided. When the imaging device is started, the cooling operation starts simultaneously with the start of the operation of the image sensor. When the temperature of the image sensor decreases to a predetermined temperature, the image sensor moves. There is something to start. At this time, since the Peltier element consumes a large amount of power, it consumes a large amount of power when it is always energized (full drive that maximizes the cooling function), so the Peltier element is driven by switching between full drive and intermittent drive. (For example, refer to Patent Document 1).

JP 2006-345052 A

  However, if a drive control circuit that drives the Peltier element in all or intermittently is used, the control becomes complicated, and the Peltier element originally has poor cooling efficiency. Even if the drive mode includes intermittent drive, the Peltier element uses a battery as a power source. It is not preferable to drive.

  The present invention has been made in view of the above, and provides an imaging apparatus capable of effectively radiating heat from an imaging element with simple control without using a cooling element such as a Peltier element that requires battery driving. The purpose is to do.

  In order to solve the above-described problems and achieve the object, an imaging apparatus according to the present invention is disposed on an optical axis of a photographing lens so as to be orthogonal to the optical axis, and a subject image is formed by the photographing lens. An image sensor to be operated, a heat sink fixed to the back surface of the image sensor, an image sensor holder that holds the image sensor, and the image sensor holder that is movable in a two-dimensional direction orthogonal to the optical axis. A fixing member having a support portion, an image blur correction drive mechanism that moves the image sensor holder in a two-dimensional direction orthogonal to the optical axis, a blur detection unit that detects a blur of the imaging device, and the blur detection Image blur control means for operating the image blur correction drive mechanism to correct image blur according to the blur detection result by the means, temperature detection means for detecting the temperature of the image sensor, and an exterior portion of the imaging device or Thermal expansion A clip conducting member that is thermally coupled to a plate and provided on the fixing member, and in which the image sensor holder is in a predetermined position, and a part of the heat radiating plate is detachably thermally coupled, and the temperature detection means And heat dissipation control means for operating the image blur correction drive mechanism so that the image sensor holder is positioned at a predetermined position when the detected temperature is equal to or higher than a predetermined temperature.

  The imaging apparatus according to the present invention is characterized in that, in the above invention, the predetermined position is an initial position of the imaging element holder during a power-on operation.

  In the image pickup apparatus according to the present invention, the low-pass filter disposed on the optical axis between the photographing lens and the image pickup device, and the sealing member that seals the image pickup device and the low-pass filter in the above invention. It is characterized by providing.

  In the image pickup apparatus according to the present invention as set forth in the invention described above, the image blur correction drive mechanism uses any one of an electromagnetic drive motor, a piezoelectric element drive motor, and a flexural vibration motor as a drive source. .

  The imaging device according to the present invention includes the optical filter and the piezoelectric element that are stacked between the photographing lens and the low-pass filter in the above invention, and the imaging element holder includes the imaging element and the piezoelectric element. A low-pass filter, the optical filter, and the piezoelectric element are held.

  In the image pickup apparatus according to the present invention, in the above invention, the clip conducting member and the heat radiating plate include a lock mechanism that removably locks the image pickup element holder in a state where the image pickup element holder is located at a predetermined displacement position. And

  An image pickup apparatus according to the present invention uses an image blur correction drive mechanism to position an image pickup element holder at a predetermined position when the temperature of the image pickup element rises above a predetermined temperature, and performs image pickup held by the image pickup element holder. A part of the heat sink fixed to the back of the element is thermally coupled to the clip conducting member on the fixed member side, so that the heat of the image sensor is conducted to the clip conducting member and transferred to the exterior part or the heat diffusing plate. Thus, the heat radiation of the image sensor can be effectively performed with simple control without using a cooling element such as a Peltier element that requires battery driving.

  The best mode for carrying out an imaging apparatus according to the present invention will be described below with reference to the drawings.

  FIG. 1 is a central longitudinal side view showing an example of the internal configuration of the imaging apparatus according to the present embodiment. A camera body 1 of the present embodiment is a single-lens reflex digital camera to which a photographic lens 2 can be attached and detached, and is fixedly supported by a camera exterior 3 that houses the following constituent members, and an optical axis. A camera structure 4 having a central opening 4a along O and a body side mount 5 to which a lens barrel of the photographing lens 2 is attached and detached are provided. In addition, a pellicle mirror 6, a focal plane shutter 7, and an imaging unit 8 are arranged as components arranged along the optical axis O behind the central opening 4 a of the camera structure (for example, mirror box) 4. Is provided. Furthermore, a focus mat 9, a pentaprism 10, and an eyepiece 11 are provided as members that are fixedly supported above the camera structure 4 and constitute an optical finder device. Further, a liquid crystal monitor 13 is provided inside a monitor display window 12 on the back side of the camera exterior 3.

  The photographing lens 2 includes, for example, a zoom lens 2a, and one or a plurality of diffractive liquid crystal lenses 2b having a known autofocus function, low-pass filter function, image plane aberration correction function, and the like, and a lens group 2c. The camera structure 4 is a frame that supports the imaging unit 8 and the like, and can be reduced in weight and cost, and can be made of polycarbonate resin or PPS mixed with filler such as carbon fiber as a material having high thermal conductivity. It is made of (polyphenylene sulfide) resin. The body side mount 5 is fixed in a state of being applied to the front surface of the camera structure 4. The shutter 7 is disposed on the optical axis O and at a rear position of the pellicle mirror 6.

  FIG. 2 is a schematic longitudinal sectional side view showing a configuration example around the imaging unit 8. The imaging unit 8 includes an imaging element 81, a low-pass filter 82, a dust filter 83 that is an optical filter (for example, an infrared cut filter), and a piezoelectric element 84. The image sensor 81 is disposed on the optical axis O of the photographing lens 2 so as to be orthogonal to the optical axis O, and obtains an image signal corresponding to the light transmitted through the photographing lens 2 and irradiated on its own photoelectric conversion surface. In this embodiment, for example, a CCD is used, but a CMOS sensor or the like may be used. The low-pass filter 82 is disposed on a light beam passing through the optical axis O between the photographing lens 2 and the image sensor 81 and removes a high-frequency component from a subject light beam that is irradiated through the photographing lens 2. is there. The dust-proof filter 83 is opposed to the light beam passing through the optical axis O between the photographic lens 2 and the low-pass filter 82 on the front side of the low-pass filter 82 with a predetermined interval. The piezoelectric element 84 is disposed on the periphery of the dust filter 83 and applies predetermined vibrations to the dust filter 83.

  Here, the imaging element 81 has a heat radiating plate 85 fixed on the back side, and the connection terminals 81a are mounted on the printed circuit board 86 and the flexible circuit board 87 by soldering. The heat radiating plate 85 having the connecting portion 85b is made of, for example, an aluminum material having good thermal conductivity, and integrally includes a heat radiating sheet (for example, a sheet coated with a paint having low thermal emissivity) 85a on the back side. An annular (for example, rectangular shape) sealing member 88 a is interposed between the transparent protective plate 81 b made of glass or the like provided on the front surface side of the image sensor 81 and the low-pass filter 82. The sealing member 88a is formed of black elastic rubber (for example, silicon rubber or urethane rubber filled with carbon). By fixing the imaging unit 8 to the imaging element holder 15 with the mounting member 16 and the screw 17, The sealing member 88a is crushed to seal the protective plate 81b and the low-pass filter 82 in an airtight state to prevent intrusion of dust and the like. Similarly, an annular (for example, circular) sealing member 88b formed of black elastic rubber is interposed between the dustproof filter 83 or the piezoelectric element 84 and the imaging element holder 15, and the imaging unit holder 15 has an imaging unit. By fixing 8, the sealing member 88 b is crushed and the dustproof filter 83 and the image sensor holder 15 are sealed in an airtight state to prevent entry of dust and the like. The heat radiating plate 85 is positioned by positioning pins 89 and fixed to the image sensor holder 15.

  Here, a fixing member 19 having a support portion 18 that supports the image sensor holder 15 so as to be movable in a two-dimensional direction formed of an XY plane orthogonal to the optical axis O is attached to the camera structure 4. The support 18 is a flat plate that is positioned with respect to the fixing member 19 by a plurality of positioning pins 20 and is fixed by a fixing screw 21, and an opening that transmits a subject image to the image sensor 81 around the optical axis O. 18a is formed. The image pickup device holder 15 is positioned between the guide plate 22 having a high surface hardness provided on the image pickup device holder 15 side and the guide plate 23 having a high surface hardness provided on the support portion 18 side, for example, and is positioned by the retainer 24. A guide bearing 25 made of a steel ball is provided so as to be movable on the XY plane without rattling while maintaining a state parallel to the support portion 18. Permanent magnets 32 and 35 disposed on the support member 26 moving in the XY plane, or another permanent magnet and magnetic material (not shown) disposed at other positions are disposed on the support portion 18, and the guide plate 22 and 23 and the guide bearing 25 located between the guide plate 23 and the guide bearing 25 are magnetically attracted and pressed.

  Furthermore, the single-lens reflex digital camera of the present embodiment has an imaging unit displacement mechanism 30 that is an image blur correction drive mechanism that moves the imaging element holder 15 in a two-dimensional direction composed of an XY plane orthogonal to the optical axis O. Is provided. The imaging unit displacement mechanism 30 has a quadrangular shape disposed on the back side of the support portion 18, and an X-axis drive print coil 34 and a Y-axis drive print coil 31 in which magnetic materials 34 a and 31 a are joined to the back side. And a permanent magnet mounted on a support member 26 provided integrally with the image sensor holder 15 so as to oppose the X-axis and Y-axis drive print coils 34 and 31 and having magnetic members 35a and 32a bonded to the back side. 35 and 32 are of an electromagnetic drive type provided with a direct current linear motor as a drive source.

  Here, the permanent magnet 35 having the magnetic material 35a bonded to the back side is magnetized in the thickness direction (optical axis direction) and is opposed to the X-axis driving print coil 34 formed in a horizontally long rectangular shape. The permanent magnet 35 is joined to the back by polarization magnetization so that the N pole and the S pole are aligned in the X-axis direction. Further, the permanent magnet 32 facing the Y-axis driving print coil 31 formed in a vertically long rectangular shape is joined by polarization magnetization so that the N pole and the S pole are aligned in the Y axis direction. Further, an X-axis driving print coil 34 having a Hall element 33 joined inside is provided on the back side of the support portion 18, and a permanent magnet 35 is disposed on the support member 26 so as to face the X-axis driving print coil 34. Is installed. The hall element 33 is for detecting the position on the X axis in the XY plane of the image sensor holder 15 that is displaceable with respect to the fixing member 19 (support portion 18). The position of the image sensor holder 15 on the Y axis in the XY plane is detected by a hall element (not shown) joined to the inside of the Y axis driving print coil 31.

  The initial position of the image sensor holder 15 is a position where the optical axis O of the photographing lens 2 coincides with the center position in the plane of the image sensor 81 when the power is turned on. The initial position of the image sensor holder 15 is on the support 18, in the magnetic flux circuit of the permanent magnets 32 and 35, on the support 18 (in the vicinity of the X and Y axis drive print coils 31 and 34). It is also a position where the image sensor holder 15 is stationary by the materials 31a and 34a in a magnetic balance (a state where the energization of the X and Y axis driving print coils 31 and 34 is cut off).

  Thereby, when a camera shake of the single-lens reflex digital camera is detected by an angular velocity sensor which is a shake detection means described later, the image sensor holder 15 is displaced and moved to a desired position based on the detected angular velocity. Then, the imaging unit displacement mechanism 30 is driven. For example, when the Y-axis drive print coil 31 in the vertical direction is energized in the magnetic flux of the permanent magnet 32 disposed on the support member 26 and is oppositely poled, the image sensor holder 15 moves in the Y-axis direction (not shown). Position detection is performed by the Hall element. When the energization of the Y-axis drive print coil 31 is interrupted, the image sensor holder 15 returns to the initial position due to the magnetic balance between the permanent magnet 32 and the magnetic material 31 a disposed on the support portion 18. Similarly, when the horizontal X-axis driving print coil 34 is energized in the magnetic flux of the permanent magnet 35 disposed on the support member 26 and bonded to a different polarity, the image sensor holder 15 moves in the X-axis direction. Position detection is performed by the element 33. When the energization of the X-axis drive print coil 34 is interrupted, the image sensor holder 15 returns to the initial position due to the magnetic balance between the permanent magnet 35 and the magnetic material 34 a disposed on the support portion 18.

  Thus, when camera shake occurs in the single-lens reflex digital camera during shooting, the image pickup unit displacement mechanism 30 is driven to move the image pickup device holder 15 in a two-dimensional direction within the XY plane. The image blur on the light receiving surface of the image sensor 81 can be corrected. The imaging unit displacement mechanism 30 is not limited to an electromagnetic drive system using an electromagnetic drive motor as a drive source, and may be a system driven using a piezoelectric element drive motor or a flexural vibration motor as a drive source.

  In the camera body 1, an imaging drive circuit board 27 is disposed on the back side of the imaging unit 15. The imaging drive circuit board 27 is mounted with a CPU, which will be described later, a TG (timing generator) IC chip or an AFE (analog front end) IC chip that drives the imaging element 81 at high speed, and the printed circuit board 86 side. Are connected via a flexible substrate 87. Further, a temperature sensor (Timg) 28 for detecting the temperature on the back side of the image sensor 81 is provided.

  Further, in the present embodiment, the lower end in the Y-axis direction of the heat radiating plate 85 fixed to the back surface of the image sensor 81 extends downward as a connecting portion 85b. Further, on the fixing member 19 side, when the image sensor holder 15 is located at a predetermined position in the Y-axis direction, the connecting portion 85b is thermally coupled, and the image sensor holder 15 is thermally coupled by moving away from the predetermined position in the Y-axis direction. The clip conducting member 40 that engages and disengages in accordance with the displacement of the image pickup element holder 15 is fixed by a screw 41 so that is released. FIG. 3 is a schematic configuration diagram showing the vicinity of the clip conducting member 40. As shown in FIG. 3, the clip conducting member 40 is a clip-shaped member that sandwiches and thermally couples the heat conducting member 85c exposed at the connecting portion 85b, which is the end of the heat radiating plate 85 that is displaced, and is made of metal foil or copper. Alternatively, an elastic member having thermal conductivity, for example, elastic rubber 43, which is thermally coupled to the heat conduction wire 42 made of a metal-plated metallic material and absorbs the impact of the connecting / disconnecting portion 85b is incorporated. Yes.

  Further, a notch 40a is formed on one side of the clip conducting member 40, and a deformable leaf spring 44 is fixed by a screw 45 through the notch 40a so as to advance into the clip. The leaf spring 44 has a surface plated with gold or silver. A hemispherical projection 44a is provided at the center of the leaf spring 44, and a hemispherical recess 85d in which the projection 44a is engaged and disengaged is formed in the connecting portion 85b that engages and disengages from the clip conducting member 40. A lock mechanism 46 is constituted by the protrusion 44 a and the recess 85 d of the leaf spring 44. In the state where the Y-axis drive print coil 31 is energized and the imaging element holder 15 is positioned at a predetermined position in the Y-axis direction and the connecting portion 85b is engaged in the clip conducting member 40, the concave portion 85d is engaged with the protrusion 44a. By being combined, the lock state is ensured. In this state, heat generated in the image sensor 81 is conducted from the connecting portion 85 b of the heat radiating plate 85 to the clip conducting member 40, and is conducted from the clip conducting member 40 to the heat conducting wire 42.

  Note that the initial position when the energization of the Y-axis driving print coil 31 is cut off can be set to a predetermined position without using the magnetic material disposed on the support portion 18 for positioning to the initial position on the Y-axis. In this case, the low-temperature processing operation can be handled quickly, and the convenience for the user is enhanced.

  FIG. 4 is an explanatory diagram schematically showing a heat coupling destination of the heat conducting wire 42 thermally coupled to the clip conducting member 40. The heat conducting wire 42 is branched into a plurality of pieces in the clip conducting member 40. The heat conduction wire 42a of the one system is thermally coupled to an exterior front cover 3a that is a part of the camera exterior 3 of the single-lens reflex digital camera via an appropriate wiring path. Alternatively, when the exterior cover is made of synthetic resin, it is thermally coupled to a heat diffusion plate such as a copper plate joined or fixed to the inside of the exterior with screws. Further, the other heat conduction wire 42b of one system is thermally coupled with a shield plate 51 made of a metal plate covering the liquid crystal monitor 13 which is one of the operation units as a heating member through an appropriate wiring path. Furthermore, the heat conduction wire 42c of another system is thermally coupled with a battery housing chamber 53 made of a heat conducting member for housing the battery 52, which is one of the operation units, as a heating member through an appropriate wiring path. Yes. Furthermore, the heat conduction wire 42d of another system is thermally coupled to the liquid crystal lens 2b side which is one of the operation units through an appropriate wiring path.

  In FIG. 4, a heat conductive sheet 55 and an endothermic heat pipe 56 are provided for a heat source such as the CPU 54 mounted on the image pickup drive circuit board 27, and a heat pipe 57, a bellows pipe 58, and the like are illustrated. It is thermally coupled to the exterior rear cover 3b of the camera exterior 3 via a metal wire, a metal foil or the like that is not present.

  FIG. 5 is a schematic side view showing a configuration example of the liquid crystal lens 2b with a part cut away. The liquid crystal lens 2b is a liquid crystal element sandwiched between parallel plane glasses 61a and 61b in a photographic lens 2 for a phase low-pass filter with variable low-pass action, for auto-focusing and for correction of field aberration. 62a and 62b, and an intermediate lens layer 63 made of a nematic liquid crystal material on which alignment films having symmetrical shapes with respect to the subject side and the imaging surface side are formed. In order to apply a voltage to the intermediate lens layer 63, transparent electrodes are formed on the alignment film on the parallel plane glass 61a side and the alignment film on the parallel plane glass 61b side. The parallel flat glasses 61a and 61b are joined by using, as a liquid crystal holder 64, heat conductive members 64a and 64b made of a highly heat conductive material such as a stainless steel or aluminum alloy metal, PPS synthetic resin filled with graphite or carbon fiber. Has been. The outer peripheral surface of the heat conductive member 64a of the liquid crystal holder 64 has an uneven shape in which a spiral groove 65 is formed. The heat conductive wire 42d is wound around the spiral groove 65 and is fixed by, for example, an infrared curable adhesive. ing. As a result, in the liquid crystal lens 2a, the heat conductive wire 42d is thermally coupled with the heat conductive member 64a as a heating portion.

  The liquid crystal lens 2b is provided in a part of the interchangeable photographing lens 2, and is attached to and detached from the camera body 1. For this reason, the heat conducting wire 42d is provided by exposing a plurality of heat conducting wires covered with a heat insulating member on the lens mount, and when the interchangeable photographic lens 2 is coupled to the camera body 1, both heat conductions are performed. The wire is configured to be thermally coupled as the heat conducting wire 42d.

  Further, in the liquid crystal lens 2b, a fixed diaphragm 66 formed of chrome coating is provided on the incident surface of the birefringent liquid crystal material 62a on the subject side. Further, when the heat conductive members 64a and 64b and the lens barrel of the photographic lens 2 are heated, the heat flowing through the heat conductive wire 42 is transferred to the heat conductive members 64a and 64b to warm the liquid crystal lens 2a. In order to prevent heat transfer to the lens barrel side of the photographic lens 2, annular heat insulating members 67a and 67b are joined. In addition, a flexible substrate 68 electrically connected to the transparent electrode is connected to the parallel flat glass 61b.

  Here, the assembly of the liquid crystal lens 2a of the present embodiment will be described. In the present embodiment, as shown in FIG. 5, a liquid crystal element composed of parallel plane glasses 61a and 61b and an intermediate lens layer 63 is inserted and bonded to the heat conductive member 64a from the right side in the figure. And the parallel plane glass 61b is pressed along the positioning pin 69 with the heat conductive member 64b. Thereafter, the heat insulating members 67a and 67b are put on the heat conductive members 64a and 64b from both sides. And the electrode of the parallel plane glass 61b and the flexible substrate 68 are soldered. The parallel flat glass 61b is pressed against the right end surface of the heat conductive member 64a, and a cutout is formed on the right end surface of the heat conductive member 64a so that the parallel flat glass 61b protrudes to the outside.

  Here, for example, the operation of the liquid crystal lens 2b disposed in the zoom lens optical system shown in FIG. 4 of JP-A-2005-208675 will be briefly described. In a state where no charge is applied to the electrodes, the liquid crystal is in a homogeneous alignment, and the major axis direction of the liquid crystal molecules is in an alignment orthogonal to the optical axis O. By making the arrangement directions of the birefringent liquid crystal materials 62a and 62b orthogonal, the light in the polarization direction that undergoes ordinary light refraction at the birefringent liquid crystal material 62a undergoes extraordinary light refraction at the birefringent liquid crystal material 62b, and at the birefringent liquid crystal material 62a. The light in the polarization direction that receives extraordinary light refraction undergoes extraordinary light refraction by the birefringent liquid crystal material 62a, and as a result, all the luminous fluxes are subjected to the same action. On the other hand, in a state where the electrode is charged, the liquid crystal has a homeotropic alignment, and the liquid crystal molecules have an alignment in which the major axis direction of the liquid crystal molecules is parallel to the optical axis O. Therefore, the total luminous flux is subjected to ordinary light refraction by the birefringent liquid crystal materials 62a and 62b, and is subjected to a low-pass effect different from that when no charge is applied.

  In FIG. 5, the single-wire heat conduction wire 42d is formed as a spiral groove 65 of a size to be wound. However, as shown in FIG. 6, the heat conduction wire 42d is formed as a wider spiral groove 65, for example. You may make it heat-couple by winding in two states.

  Here, returning to FIG. 4, the thermal coupling with the clip conducting member 40 is performed in the middle of the wiring paths of the respective heat conducting wires 42b, 42c, and 42d for the liquid crystal monitor 13, the battery 52, and the liquid crystal lens 2b. (SWdisp) 70b, (SWbat) 70c, and (SWlens) 70d are interposed. The switches 70b and 70c are mounted on the imaging drive circuit board 27, and the switch 70d is mounted on a circuit board 71 provided on the lens barrel. These switches 70b, 70c, and 70d have the same structure, but here, for example, an example of the switch 70d will be described.

  FIG. 7 is a schematic longitudinal sectional side view showing the structure of the switch 70d and how it is intermittently connected. This switch 70d is generally composed of at least a plurality of electromagnetically driven temperature sensitive switches (thermostats) using a shape memory alloy and a bimorph bending disposed on the circuit board 71. That is, the switch 70d is based on a thermostat 74 that opens and closes the movable contact 72 with respect to the fixed contact 73 according to temperature, and is fixed adjacent to the permanent magnet 75 and the permanent magnet 75. It consists of an electromagnetic drive type temperature sensitive switch provided with the drive coil 76 which is arrange | positioned at the contact 73 side and displaces the permanent magnet 75 by electricity supply.

  FIG. 7A shows the liquid crystal lens 2b from the clip conducting member 40 side when the imaging element holder 15 is in a predetermined position under the condition that the lens barrel incorporating the liquid crystal lens 2b is at a predetermined temperature or lower (for example, 10 ° C. or lower). It shows a state where heat conduction is performed by the heat conductive member 64a. The first fixed conductor 77 has a first terminal 77a to which the heat conducting wire 42d on the clip conducting member 40 side is connected. The first fixed conductor 77 is formed in a substantially inverted U shape when viewed from the side, and a fixed contact 73 is joined to the upper step portion 77b. Similarly, the second fixed conductor 78 has a second terminal 78a to which the heat conductive wire 42d wound on the heat conductive member 64a side of the liquid crystal lens 2b is connected. The second fixed conductor 78 is formed in a substantially U-shape when viewed from the side, and one end of the elastic conductor plate 74a is fixed to the upper step 78b. A movable contact 72 is joined to the other end of the elastic conductor plate 74 a at a position where it can come into contact with the fixed contact 73. Between the claw portions 74b formed on the elastic conductor plate 74a, a bimetal material 74c that changes the curvature code of the shape when a predetermined temperature is exceeded is held, and constitutes a thermostat 74 together with the elastic conductor plate 74a. Due to the temperature change of the bimetal material 74c, the fixed contact 73 and the movable contact 72 are basically in contact with or separated from each other, and the thermal coupling is interrupted. The first and second fixed conductors 77 and 78 are incorporated in a base 79 using a synthetic resin material that is electrically insulated, and are fixed in an insulated state.

  Here, a concave portion 79a is formed in the base 79 so as to face the intermediate portion of the elastic conductor plate 74a. In this concave portion 79a, a flat drive coil 76 laminated in a square shape when viewed from above. Are joined. The drive coil 76 includes a magnetic material 76a and a fixed coil 76b wound around the magnetic material 76a. In the recess 79a of the base 79, a permanent magnet 75 is fixed to the elastic conductor plate 74a by a coupling member 75a and an adhesive 75b at a position adjacent to the drive coil 76 in the longitudinal direction of the elastic conductor plate 74a. It is provided in a suspended state. The permanent magnet 75 is magnetized so that the north and south poles are positioned in the longitudinal direction of the elastic conductor plate 74a.

  FIG. 7B shows a state in which the movable contact 72 is moved by electromagnetic driving in a state where the heat is already conducted from the clip conducting member 40 side and the temperature on the liquid crystal lens 2b side is a predetermined temperature or higher (for example, 25 to 30 ° C.). A state in which heat is not conducted by being forcibly separated from the fixed contact 73 is shown. That is, in FIG. 7B, when a current is passed through the fixed coil 76b from the left side to the right side in the drawing, the permanent magnet 75 is displaced upward by the action of electromagnetic drive of the drive coil 76. Therefore, the elastic conductor plate 74a to which the permanent magnet 75 is integrally fixed is also forced upward. Here, when the bimetal material 74c is cooled, it tries to return to the original position shown in FIG. 7 (a), but remains held at the position shown in FIG. 7 (b) by electromagnetic driving (switch-off state). ). Therefore, after the temperature of the liquid crystal lens 2b rises to about room temperature, even if the temperature on the clip conducting member 40 side rises, the thermal coupling to the liquid crystal lens 2b side is forcibly cut off. The performance of the lens 2b is not deteriorated.

  Such an operation is the same for the switch 70b for the liquid crystal monitor 13 and the switch 70c for the battery 52.

  Next, the configuration of the electrical control system of the single-lens reflex digital camera according to the present embodiment including such components will be described. FIG. 8 is a block diagram illustrating a configuration example of the electrical control system of the single-lens reflex digital camera according to the present embodiment. First, a system controller 100 that controls the entire camera is provided. The system controller 100 includes a CPU 54, a plurality of circuit blocks, for example, an image processing circuit 101, a compression / decompression circuit 102, an image recognition circuit 103, an external memory IF circuit 104, a general purpose I / O circuit 105, an interrupt control circuit 106, and a timer counter 107. A / D converter 108 and the like. The CPU 54 and the circuit blocks 101 to 108 are connected by a control line or a bus line.

  The image processing circuit 101 performs predetermined image processing such as γ correction, color conversion, pixel conversion, and white balance processing on image data captured by the image sensor 81 and captured from the image sensor IF circuit 110. The compression / decompression circuit 102 performs compression processing on the image data processed by the image processing circuit 101 and expansion processing on the compressed image data read from the memory card 111. The image recognition circuit 103 executes an image processing algorithm necessary for detecting feature points of a person's face as a subject from image data captured by the image sensor 81 using a predetermined image recognition algorithm.

  The external memory IF circuit 104 performs a bridge function between the memory card 111, the SDRAM 112, the FlashRom 113, and the data bus inside the system controller 100. In the FlashRom 113, a control program for controlling the entire operation, a control parameter, and the like are recorded. In the system controller 100, the CPU 54 reads out and executes a control program stored in the FlashRom 113, thereby controlling the operation of the camera and realizing functions such as image blur control means, heat radiation control means, and heating control means. The SDRAM 112 is used for temporary storage of image data obtained via the image sensor IF circuit 110 and as a work area for the system controller 100. The memory card 111 is a detachable recording medium such as a semiconductor nonvolatile memory or a small HDD.

  The general-purpose I / O circuit 105 is used as a reading terminal of the camera operation switch 114 connected to the system controller 100 and an output terminal of a control signal for controlling peripheral circuits. The interrupt control circuit 106 generates an interrupt signal from the camera operation switch 114, an interrupt signal from the timer counter 107, and the like. The timer counter 107 counts clocks and generates timing signals necessary for system control. The A / D converter 108 performs A / D conversion on detection outputs of various sensors such as a temperature sensor (Timg) 26, (Tdisp) 115, (Tbat) 116, and (Tlens) 117 included in the camera.

  An image sensor 81 such as a CCD provided in the image pickup unit 8 photoelectrically converts the subject image formed by the photographing lens 2 into an analog electric signal. The image sensor IF circuit 110 generates a timing pulse for driving the image sensor 81, reads an analog electric signal photoelectrically converted by the image sensor 81, performs A / D conversion, and transfers it to the system controller 100 as image data.

  The temperature sensors (Timg) 26, (Tdisp) 115, (Tbat) 116, and (Tlens) 117 together with the temperature detection circuit 118 constitute a temperature detection means. As the temperature sensor, an element whose resistance value changes according to temperature or a semiconductor temperature sensor may be used. As described above, the temperature sensor (Timg) 26 is disposed on the back surface in the vicinity of the image sensor 81 and detects the temperature of the image sensor 81. The temperature sensor (Tdisp) 115 is for detecting the temperature of the liquid crystal monitor 13 provided on the back side of the camera. The temperature sensor (Tbat) 116 is for detecting the temperature of the battery 52 built in the camera. The temperature sensor (Tlens) 117 is for detecting the temperature of the liquid crystal lens 2 b included in the photographing lens 2.

  The dustproof filter drive circuit 119 outputs a drive signal to the piezoelectric element 84 in order to remove dust attached to the dustproof filter 83 included in the imaging unit 8 by vibration. The imaging unit displacement mechanism 30 is for two-dimensionally displacing the imaging element holder 15 holding the imaging unit 8 in an XY plane perpendicular to the optical axis O of the imaging lens 2, and serves as an electromagnetic drive motor as a drive source. The actuator which becomes. The actuator drive circuit 120 outputs a drive signal to this actuator. The system controller 100 can execute a so-called camera shake correction operation that prevents the image from deteriorating by displacing the image pickup unit 8 (image pickup device holder 15) in accordance with the shake generated in the camera. Blur generated in the camera is detected by an angular velocity sensor 121a using a gyroscope and an angular velocity detection circuit 121 that amplifies the output of the angular velocity sensor 121a. The system controller 100 outputs a control signal for the shake correction operation to the actuator drive circuit 120 based on the output of the angular velocity detection circuit 121.

  The shutter 7 provided on the front surface (subject side) of the image pickup unit 8 and controlling the exposure time of the image pickup device 81 is controlled to open and close in accordance with a control signal output from the shutter control circuit 122. The system controller 100 controls the shutter control circuit 122 according to the exposure time. The pellicle mirror 6 is a beam splitter for guiding the light flux of the photographing lens 2 to the image sensor 81 and the observation optical system (the pentaprism 10 and the eyepiece lens 11), and is a semi-transmission mirror made of a thin glass or nitrocellulose film. It is. The pellicle mirror 6 is set to a thickness that does not cause aberration. A sub mirror 6 a is disposed in the space between the shutter 7 and the pellicle mirror 6. The sub mirror 6 a can selectively take positions in the optical path of the photographing lens 2 and outside the optical path by the sub mirror displacement mechanism 123. The sub mirror drive circuit 124 sends a drive signal to the actuator in the sub mirror displacement mechanism 123. When the sub mirror 6a is in the optical path, the light flux of the photographing lens 2 is guided to the AF sensor 125. Therefore, the system controller 100 sets the sub mirror 6a in the optical path when obtaining the defocus amount (focus shift amount) from the output of the AF sensor 125. When performing a photographing operation, the sub mirror 6a is retracted out of the optical path. As the AF sensor 125, for example, a known phase difference AF sensor is used.

  The power supply circuit (DC / DC converter) 126 converts the voltage of the battery 52 into a drive voltage necessary for the system controller 100 and its peripheral circuits and supplies the converted drive voltage. The power distribution is controlled based on a command from the system controller 100. The liquid crystal monitor drive circuit 127 drives the liquid crystal monitor 13. The liquid crystal monitor 13 displays image data at the time of live view operation or various menus according to the drive signal from the liquid crystal monitor drive circuit 127. The camera operation switch 114 is a switch for operating the camera, and includes a release SW, a mode setting SW, a finder mode selection SW, a power SW, and the like.

  The taking lens 2 is controlled by the lens controller 130. The lens controller 130 is connected to the system controller 100 via a communication line, and executes a predetermined control operation in response to a command from the system controller 100. The zoom mechanism 131 is a mechanism for performing a zoom operation for changing the focal length of the zoom lens 2a in the photographing lens 2. The focus adjustment mechanism 132 is a mechanism for changing the imaging position of the focus lens 2 c in the photographic lens 2. Driving signals for the motors provided in the mechanisms 131 and 132 are supplied from the lens motor driving circuit 133. The lens controller 130 performs a zoom operation and a focus adjustment operation of the photographing lens 2 by controlling the lens motor drive circuit 133. The liquid crystal driving circuit 134 is a circuit for driving the liquid crystal lens 2 b in the photographing lens 2.

  As described above, the clip conducting member 40 is fixedly disposed in the vicinity of the imaging unit 8 in order to efficiently dissipate the heat generated from the imaging element 81 or to effectively use the heat. When the image pickup unit 8 (image pickup element holder 15) is located at a predetermined position in the Y-axis direction, the clip conducting member 40 is thermally coupled to the image pickup element 81 via the heat radiating plate 85 in the image pickup unit 8, and image pickup is performed. The heat generated in the element 81 is transmitted.

  As described above, the heat transferred from the image pickup element 81 to the clip conducting member 40 includes the shield plate 51 for the liquid crystal monitor 13 and the battery 52 for the battery 52 through the heat conducting wires 42a to 42d. The storage chamber 53 and the heat conductive member 64a for the liquid crystal lens 2b can be transmitted. Here, switches (SWdisp) 70b, (SWbat) 70c, and (SWlens) 70d for intermittently transferring heat are interposed on the wiring paths of the heat conducting wires 42b to 42d. These switches 70 b to 70 d can be electrically turned on / off by the heat transfer cutoff SW circuit 128. The system controller 100 drives the imaging unit displacement mechanism 30 in accordance with the outputs of the temperature sensors 26 and 115 to 117 to move the imaging unit 8 (imaging element holder 15) to a predetermined position, and the heat transfer cutoff SW circuit 128 The heat of the image sensor 81 is transmitted to a member that needs to be heated by controlling on / off of the switches 70b to 70d.

  Subsequently, an example of operation control of the camera of the present embodiment executed by the CPU 54 of the system controller 100 will be described. FIG. 9 is an explanatory diagram showing switching of operation control according to the detected temperature, FIGS. 10 to 12 are flowcharts showing the main routine, and FIGS. 13 to 14 are countermeasures for low temperature included in the main routine. It is a flowchart which shows the subroutine of operation | movement.

  First, when the camera power SW is operated to start the operation of the camera system, the system initialization operation is executed (step S120). Note that the system initialization operation is also performed when the camera set to the standby mode is released from the standby mode by operating some SW.

  After the initialization operation is executed, the low-temperature countermeasure operation is periodically executed during the operation of the camera (step S122). In this low-temperature countermeasure operation, the temperature of the operation unit (in the present embodiment, the liquid crystal monitor 13, the battery 52, and the liquid crystal lens 2b) that deteriorates or cannot operate when the temperature is low is detected. (For example, in the case of 10 ° C. or lower), the operation unit is heated by using heat generated from the image sensor 81 to be operable. This low temperature countermeasure operation will be described later.

  Subsequently, in a state where the camera can operate, the state of the live view SW which is one of the camera operation SWs 114 is checked (step S124). If the live view SW is operated (step S124; Yes), the process proceeds to step S126. If the live view SW is not operated (step S124; No), the process proceeds to step S140. When the live view mode is set, the system controller 100 controls the image sensor IF circuit 110 to acquire subject image data at a predetermined frame rate, and causes the liquid crystal monitor 13 to display the acquired image data. Thus, the subject image is provided to the user by live view. In this process, first, it is determined whether or not the live view mode is currently set (step S126). If it is set (step S126; Yes), the process proceeds to step S132 to cancel the mode. If not set (step S126; No), the process proceeds to step S128 for mode setting.

  In step S128 for setting the live view mode, the sub mirror 6a is retracted out of the optical path, and the shutter 7 is set to the open state. Thereby, the light flux of the photographic lens 2 is imaged on the light receiving surface of the image sensor 81. Then, the image sensor IF circuit 110 is set so that the image data of the subject image can be acquired at a predetermined frame rate (30 fps), and the acquired image data is read out and output to the liquid crystal monitor drive circuit 127, thereby performing a live view operation. Is started (step S130). In this state, the process periodically returns to step S122.

  On the other hand, in step S132 for canceling the live view mode, the sub mirror 6a is moved into the optical path and the shutter 7 is set to the closed state. Then, the live view operation is stopped by stopping the operations of the image sensor IF circuit 110 and the liquid crystal monitor drive circuit 127 (step S134). As a result, the live view display on the liquid crystal monitor 13 disappears. In this state, the process periodically returns to step S122.

  On the other hand, when the live view SW is not operated (step S124; No), during the operation of the camera, the temperature of the image sensor 81 is periodically detected through the temperature sensor (Timg) 26 and the temperature detection circuit 118 to detect the detected temperature. The necessary cooling operation is determined according to (step S140). That is, the temperature of the image sensor 81 is increased by a live view operation or a continuous shooting operation, and a cooling operation (heat radiation countermeasure) is required. In the present embodiment, as shown in FIG. 9, control is performed so that a cooling operation according to the detected temperature is executed.

  First, when the detected temperature Timg is equal to or lower than the first predetermined temperature Timg1 (Timg1 ≧ Timg), the camera can operate normally, and the process proceeds from step S140 to step S160. Further, when the live view operation is performed when the second predetermined temperature Timg2 is equal to or lower than the first predetermined temperature Timg1 (Timg2 ≧ Timg> Timg1), step S140 is performed so that the frame rate (15 fps) is lower than normal when the live view operation is performed. To step S152. Further, when the temperature is higher than the second predetermined temperature Timg2 (Timg> Timg2), the live view operation is prohibited, and the heat of the image sensor 81 is used before the exterior of the camera exterior 3 using the clip conducting member 40 and the heat conduction wire 42. In order to execute the heat radiation operation to escape to the cover 3a, the process proceeds from step S140 to step S141. Here, the predetermined temperatures Timg1, Timg2 are preset temperature determination values, and have a relationship of Timg2> Timg1. Specifically, Timg2 = 80 ° C. and Timg1 = 70 ° C. are set and stored as control parameters in the FlashRom 113. The values of these temperatures Timg1, Timg2 are appropriately changed and set as necessary.

  First, in step S141, a warning indicating the cooling operation is displayed on the liquid crystal monitor 13. This is to notify the user that shooting cannot be performed during the cooling operation. Next, it is determined whether or not the live action is being executed (step S142). If it is not being executed (step S142; No), the process proceeds to step S146, and if it is being executed (step S142; Yes), The live view mode is canceled (step S144). That is, the sub mirror 6a is returned to the optical path, the shutter 7 is set to the closed state, the operation of the imaging element IF circuit 110 is stopped, and the live view display is stopped. Then, the image pickup unit displacement mechanism 30 is driven and controlled via the actuator drive circuit 120 to displace the image pickup unit 8 (image pickup element holder 15) to a predetermined position (step S146). Due to the displacement driving of the image pickup unit 8 (image pickup element holder 15) to a predetermined position, the connection portion 85b of the heat radiating plate 85 is locked to the clip conductive member 40 in a state of being thermally coupled to the image pickup element 81. The heat is conducted through the heat radiating plate 85, the clip conducting member 40, and the heat conducting wire 42a to be transmitted to the exterior front cover 3a and escapes into the air. Thereby, heat radiation of the image sensor 81 is performed.

  Such a cooling operation detects the temperature of the image sensor 81 through the temperature sensor 26 and the temperature detection circuit 118, and continues until the detected temperature Timg becomes equal to or lower than the first predetermined temperature Timg1 (step S148). When the temperature Timg of the image sensor 81 is lowered to the first predetermined temperature Timg1 or less, normal operation is possible. At this time, it is also possible to set the second predetermined temperature Timg2 as a temperature determination value for stopping the cooling operation. It is also possible to execute the live view operation at a lower frame rate. However, in reality, if the cooling operation is stopped when the detected temperature is equal to or lower than Timg2, the detected temperature rises immediately after the cooling operation is stopped, and there is a possibility of shifting to the cooling operation. Therefore, as in the present embodiment, it is preferable to continue the cooling operation until the temperature drops to a temperature at which the camera operation can be completely executed.

  When the temperature of the image sensor 81 is lowered and the cooling operation is finished, the centering operation of the image pickup unit 8 (image sensor holder 15) is performed by controlling the drive of the image pickup unit displacement mechanism 30 via the actuator drive circuit 120 (Step 1). S150). That is, the imaging unit 8 (imaging element holder 15) is moved to the center position of the movable range of the imaging unit 8 (imaging element holder 15). Such a centering operation is an operation necessary for executing the camera shake correction operation. Next, the warning display displayed on the liquid crystal monitor 13 is turned off (step S151). During the cooling operation, the detected temperature of the image sensor 81 may be displayed in real time together with a warning display. Further, the end time of the cooling operation may be predicted and displayed from the detected temperature drop curve. Also in this case, when the cooling operation ends, the process proceeds to step S122.

  On the other hand, if it is determined in step S140 that Timg2 ≧ Timg> Timg1, it is determined whether or not the live view operation is being performed at a high frame rate of 30 fps (step S152). If not 30 fps (step S152; No) If it is 30 fps (step S152; Yes), the frame rate of the live view operation is changed from 30 fps to a low speed of 15 fps (step S154). As a result of the process of lowering the frame rate in this way, the drive frequency (or readout frequency) of the image sensor 81 is lowered, and the heat generation of the image sensor 81 is suppressed. As a result, the frequency of occurrence of the cooling operation is reduced, which is a heat dissipation measure. Thereafter, the process proceeds to step S164.

  In the determination of step S140, if Timg1 ≧ Timg, it is determined whether or not the live view operation is being performed at a low frame rate of 15 fps (step S160). If it is not 15 fps (step S160; No), it remains as it is. If the frame rate is 15 fps (step S160; Yes), the frame rate of the live view operation is changed from 15 fps to a high speed of 30 fps (step S162). Thereafter, the process proceeds to step S164.

  In step S164, it is determined whether a release SW that is one of the camera operation SWs 114 has been operated. When the release SW is operated (step S164; Yes), a shooting preparation operation is performed (step S166). That is, the exposure conditions (shutter time and aperture value) are determined according to the subject brightness, and the focus adjustment operation (AF) is also performed. Then, it is determined whether or not the live view mode is set (step S168). If it is not set (step S168; No), the process proceeds to step S172 as it is, but if it is set (step S168). ; Yes), the live view operation is stopped (step S170), and the process proceeds to step S172.

  In step S172, the centering operation of the image pickup unit 8 (image pickup element holder 15) is executed by driving the image pickup unit displacement mechanism 30 to enable the camera shake correction operation. Then, the blur correction operation is started by driving and controlling the imaging unit displacement mechanism 30 based on the detection output of the angular velocity sensor 121a (step S174). Further, the photographing operation is performed in accordance with the exposure condition determined in the process of step S166 (step S176). The image data acquired by the shooting operation is subjected to predetermined image processing and then compressed and stored in the memory card 111.

  When the shooting operation is finished, the blur correction operation is stopped (step S178), and it is determined again whether the live view mode is set (step S180). If the live view mode is not set (step S180; No), the process directly proceeds to step S122. If the live view mode is set (step S180; Yes), the live view operation is resumed. (Step S182), the process proceeds to Step S122. In step S182, the image sensor IF circuit 110 and the liquid crystal monitor drive circuit 127 are set to restart the live view operation.

  In step S164, if the release SW is not operated, it is determined whether or not the release SW has not been operated for a predetermined time (for example, 30 seconds) (step S190). When the time when the release SW is not operated reaches a predetermined time (step S190; Yes), the image pickup unit displacement mechanism 30 is driven and controlled via the actuator drive circuit 120, whereby the image pickup unit 8 (image pickup element holder 15). Is displaced to a predetermined position (step S191). By such displacement driving of the image pickup unit 8 (image pickup element holder 15) to a predetermined position, the connection portion 85b of the heat radiating plate 85 is locked to the clip conductive member 40 in a thermally coupled state. Then, when it is detected that any one of the camera operation SWs 114 is operated, the interrupt control circuit 106 is set so that the standby mode is canceled, and the standby mode is entered (step S192). During the standby mode, the power consumption is reduced by stopping the operation of most circuits. If any one of the camera operation SWs 114 is operated during the standby mode, the standby mode is canceled and the process proceeds to step S120.

  On the other hand, if the time during which the release SW has not been operated has not reached the predetermined time in step S190, it is determined whether or not the power SW that is one of the camera operations SW 114 has been operated (step S194). When the power SW is operated (step S194; Yes), the image pickup unit 8 (image pickup element holder 15) is displaced to a predetermined position by driving and controlling the image pickup unit displacement mechanism 30 via the actuator drive circuit 120. (Step S196). By such displacement driving of the image pickup unit 8 (image pickup element holder 15) to a predetermined position, the connection portion 85b of the heat radiating plate 85 is locked to the clip conductive member 40 in a thermally coupled state. Then, a process for stopping the system is executed to stop the operation of the camera (step S196). When the power SW is not operated (step S194; No), the process proceeds to step S122.

  Subsequently, the low-temperature countermeasure operation in step S122 will be described. The purpose of this process is to measure the temperature of the liquid crystal monitor 13, the battery 52, and the liquid crystal lens 2 b, and in a low temperature environment, if heating is necessary, the image sensor 81 is dummy-driven and used as a heat source. The heat of 81 is transferred to the liquid crystal monitor 13, the battery 52, and the liquid crystal lens 2 b to warm them.

  First, the temperature of the liquid crystal monitor 13 is acquired from the temperature sensor 115, and it is determined whether or not the detected temperature Tdisp has reached a predetermined temperature determination value Tdisp_low (step S52). When the detected temperature has reached the temperature determination value Tdisp_low (step S52; Yes), the corresponding control flag F_disp is cleared (step S54). When the detected temperature does not reach the temperature determination value Tdisp_low (step S52; No), the corresponding switch (SWdisp) 70b is set to the on state and the corresponding control flag F_disp is set (step S56). Regarding the liquid crystal monitor 13, when the detected temperature Tdisp is lower than a predetermined temperature determination value Tdisp_low, it is not suitable for operating the liquid crystal monitor 13. In general, the response speed of the liquid crystal decreases as the temperature decreases, and is not suitable for live view display. Therefore, heating is necessary. The temperature determination value Tdisp_low is stored in advance in the FlashRom 113 as a control parameter, but can be changed and set according to the temperature characteristics of the liquid crystal monitor 13 and the like. When the liquid crystal monitor 13 needs to be heated, the control flag F_disp is set to 1, and when not necessary, the control flag F_disp is cleared to 0. Further, by setting the switch (SWdisp) 70b to the on state, the heat conduction by the heat conducting wire 42b is made effective.

  Similarly, the temperature of the liquid crystal lens 2b is acquired from the temperature sensor 117, and it is determined whether or not the detected temperature Tlens has reached a predetermined temperature determination value Tlens_low (step S58). If the detected temperature has reached the temperature determination value Tlens_low (step S58; Yes), the corresponding control flag F_lens is cleared (step S60). If the detected temperature does not reach the temperature determination value Tlens_low (step S58; No), the corresponding switch (SWlens) 70d is set to the on state, and the corresponding control flag F_lens is set (step S62). If the detected temperature Tlens of the liquid crystal lens 2b is lower than a predetermined temperature determination value Tlens_low, the liquid crystal lens 2b is not suitable for operating. Therefore, heating is necessary. The temperature determination value Tlens_low is stored in advance in the FlashRom 113 as a control parameter, but can be changed and set according to the temperature characteristic of the liquid crystal lens 2b. When the liquid crystal lens 2b needs to be heated, the control flag F_lens is set to 1, and when not necessary, the control flag F_lens is cleared to 0. Further, by setting the switch (SWlens) 70d to the on state, the heat conduction by the heat conducting wire 42d is made effective.

  Furthermore, the temperature of the battery 52 is acquired from the temperature sensor 116, and it is determined whether or not the detected temperature Tbat has reached a predetermined temperature determination value Tbat_low (step S64). When the detected temperature has reached the temperature determination value Tbat_low (step S64; Yes), the corresponding control flag F_bat is cleared (step S66). When the detected temperature does not reach the temperature determination value Tbat_low (step S64; No), the corresponding switch (SWbat) 70c is set to the on state and the corresponding control flag F_bat is set (step S68). Regarding the battery 52, when the detected temperature Tbat is lower than a predetermined temperature determination value Tbat_low, the output voltage of the battery 52 is lowered, which is not suitable for operation. Therefore, heating is necessary. The temperature determination value Tbat_low is stored in advance in the FlashRom 113 as a control parameter, but can be changed and set according to the temperature characteristics of the battery 52 and the like. When the battery 52 needs to be heated, the control flag F_bat is set to 1, and when not necessary, the control flag F_bat is cleared to 0. Also, by setting the switch (SWbat) 70c to the on state, the heat conduction by the heat conducting wire 42c is made effective.

  After such processing, the state of the control flag is determined (step S70). In this determination process, even if one of the control flags is set to 1 and the switch is set to the on state (step S70; Yes), the process proceeds to step S79, but all the control flags are cleared to 0. If YES in step S70, the process returns to the main routine.

  In step S79, a warning indicating that the heating operation is being performed is displayed on the liquid crystal monitor 13. This is to notify the user that photographing cannot be performed during the heating operation. Next, the image pickup unit displacement mechanism 30 is driven and controlled via the actuator drive circuit 120, whereby the image pickup unit 8 (image pickup element holder 15) is displaced to a predetermined position (step S80). By such displacement driving of the image pickup unit 8 (image pickup element holder 15) to a predetermined position, the connection portion 85b of the heat radiating plate 85 is locked to the clip conductive member 40 in a thermally coupled state. Then, the heating operation is started by causing the image sensor 81 to perform dummy driving to generate heat (step S81). In this operation, the image sensor IF circuit 110 is set to drive the image sensor 81 in a dummy manner. For example, the frame rate is set to 30 fps and the image data is read from the image sensor 81. The read image data is not used, but dummy driving for using the image sensor 81 as a heat source, and the frame rate may be set higher in a range where the operation of the image sensor 81 is allowed.

  Here, for example, it is determined whether or not the liquid crystal monitor 13 is being heated (F_disp = 1) (step S82). If the liquid crystal monitor 13 is being heated (step S82; Yes), the heat generated in the dummy-driven image pickup device 81 is shielded via the heat radiating plate 85, the clip conducting member 40, the heat conducting wire 42b, and the switch 70b. 51, and the liquid crystal monitor 13 is heated. Therefore, the temperature of the liquid crystal monitor 13 is monitored by the temperature sensor 115 (step S84), and the heating operation is continued until the detected temperature Tdisp exceeds the temperature determination value Tdisp_low (step S84; No). When the detected temperature Tdisp of the liquid crystal monitor 13 exceeds the temperature judgment value Tdisp_low (step S84; Yes), the heat conduction by the heat conducting wire 42b is forcibly set by turning off the switch (SWdisp) 70b. At the same time, the control flag F_disp is cleared to 0 to indicate that the heating operation of the liquid crystal monitor 13 has been completed (step S86).

  Similarly, it is determined whether or not the liquid crystal lens 2b is being heated (F_lens = 1) (step S88). If the liquid crystal lens 2b is being heated (step S88; Yes), the heat generated in the dummy-driven image sensor 81 is conducted through the heat radiating plate 85, the clip conducting member 40, the heat conducting wire 42d, and the switch 70d. Then, the liquid crystal lens 2b is heated. Therefore, the temperature of the liquid crystal lens 2b is monitored by the temperature sensor 117 (step S90), and the heating operation is continued until the detected temperature Tlens exceeds the temperature determination value Tlens_low (step S90; No). When the detection temperature Tlens of the liquid crystal lens 2b exceeds the temperature determination value Tlens_low (step S90; Yes), the heat conduction by the heat conduction wire 42d is forcibly set by turning off the switch (SWlens) 70d. At the same time, the control flag F_lens is cleared to 0 to indicate that the heating operation of the liquid crystal lens 2b has been completed (step S92).

  Further, it is determined whether or not the battery 52 is being heated (F_bat = 1) (step S94). If the battery 52 is being heated (step S94; Yes), the heat generated in the dummy-driven image sensor 81 is supplied to the battery storage chamber via the heat radiating plate 85, the clip conducting member 40, the heat conducting wire 42c, and the switch 70c. 53, and the battery 52 is heated. Therefore, the temperature of the battery 52 is monitored by the temperature sensor 116 (step S96), and the heating operation is continued until the detected temperature Tbat exceeds the temperature determination value Tbat_low (step S96; No). When the detected temperature Tbat of the battery 52 exceeds the temperature determination value Tbat_low (step S96; Yes), the heat conduction by the heat conduction wire 42c is forcibly cut off by setting the switch (SWbat) 70c to an off state. In addition, the control flag F_bat is cleared to 0 to indicate that the heating operation of the battery 52 has been completed (step S98).

  After such processing, all the operation units (the liquid crystal monitor 13, the liquid crystal lens 2b, and the battery 52) determine whether or not the operable temperature has been reached in the state of the control flag (step S100). If all the control flags are cleared to 0 (step S100; Yes), the heating operation is stopped (step S102). That is, the image sensor IF circuit 110 is set so as to stop the dummy drive of the image sensor 81. Further, the warning display displayed on the liquid crystal monitor 13 is erased (step S104). During the heating operation, the detected temperature of the heating target may be displayed in real time together with a warning display. Further, the end time of the heating operation may be predicted from the rising curve of the detected temperature and displayed. When the heating operation is completed in this manner, the centering operation of the image pickup unit 8 (image pickup element holder 15) is performed by controlling the drive of the image pickup unit displacement mechanism 30 via the actuator drive circuit 120 (step S106). That is, the imaging unit 8 (imaging element holder 15) is moved to the center position of the movable range of the imaging unit 8 (imaging element holder 15). Such a centering operation is an operation necessary for executing the camera shake correction operation. After the process of step S106, the process returns to the main routine.

  As described above, according to the present embodiment, when the temperature of the image sensor 81 rises to a predetermined temperature or more, the image sensor holder 15 is positioned at a predetermined position using the image unit displacement mechanism 30, and the image sensor holder 15 is thermally coupled to the clip conducting member 40 on the fixing member 19 side, so that the heat of the imaging element 81 is increased. Since heat is transferred to the exterior front cover 3a via the clip conducting member 40 and the heat conducting wire 42a to dissipate the heat, the image pickup device 81 can be easily controlled without using a cooling element such as a Peltier element that requires battery driving. Can be effectively dissipated.

  Further, when the temperature is equal to or lower than a predetermined temperature, such as the liquid crystal monitor 13, the battery 52, and the liquid crystal lens 2b, the image pickup device holder 15 is positioned at a predetermined position using the image pickup unit displacement mechanism 30, and the image pickup device holder 15, the connecting portion 85 b of the heat radiating plate 85 fixed to the back surface of the image pickup device 81 in the image pickup unit 8 is thermally bonded to the clip conducting member 40 on the fixing member 19 side, and the image pickup device 81 is driven in a dummy manner. Thus, the image sensor 81 is used as a heat source, and this heat is transferred to the liquid crystal monitor 13, the battery 52, and the liquid crystal lens 2 b through the clip conducting member 40 and the heat conducting wires 42 b to 42 d to be heated. Without using a special heating element such as a battery-driven heater or the like, the liquid crystal monitor 13 whose operation is restricted in a low temperature environment with simple control, Teri 52, an effect that it is possible to heat the liquid crystal lens 2b effectively.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the present embodiment, the connecting direction of the connecting portion 84b and the clip conducting member 40 is set in the Y-axis direction so that the connecting portion 85b engages with the clip conducting member 40 using gravity at a predetermined position of the imaging unit 8. However, the engagement direction may be set so as to engage / disengage in the X-axis direction (left / right direction).

  In addition, the imaging device is not limited to a single-lens reflex digital camera with interchangeable lenses. For example, in a compact digital camera, a mobile phone having a photographing function, a portable information terminal, a notebook personal computer, an electronic medical device, etc. Even if it exists, it is applicable similarly.

  Furthermore, regarding the heat conduction wire portion, a heat transfer member such as a heat pipe having a wick formed on the inner wall may be used.

It is a center longitudinal section side view showing an example of an internal configuration of an imaging device of an embodiment of the invention. It is a schematic vertical side view which shows the structural example around an imaging unit. It is a schematic block diagram which shows the clip conduction member vicinity. It is explanatory drawing which shows typically the heat coupling | bond destination of the heat conducting wire thermally coupled with the clip conducting member. FIG. 3 is a schematic side view showing a configuration example of a liquid crystal lens with a part cut away. It is sectional drawing which shows the modification of the example of winding of the heat conductive wire with respect to the heat conductive member of a liquid crystal lens. It is a schematic longitudinal cross-sectional side view which shows the structure of a switch and the state of an interruption. It is a block diagram which shows the structural example of the electrical equipment control system of the single-lens reflex digital camera of embodiment. It is explanatory drawing which shows switching of the operation control according to detected temperature. It is a flowchart which shows a part of main routine. It is a flowchart which shows the other part of a main routine. It is a flowchart which shows the other part of the main routine. It is a flowchart which shows a part of low temperature countermeasure operation | movement subroutine contained in a main routine. It is a flowchart which shows the other part of a subroutine.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 Shooting lens 3a Exterior front cover 15 Imaging element holder 18 Support part 19 Fixing member 30 Imaging unit displacement mechanism 40 Clip conduction member 46 Lock mechanism 81 Imaging element 85 Heat sink 85b Connecting part 100 System controller 121a Angular velocity sensor O Optical axis

Claims (3)

An image sensor that is disposed on the optical axis of the photographic lens so as to be orthogonal to the optical axis and forms a subject image by the photographic lens;
A heat sink fixed to the back surface of the image sensor;
An image sensor holder for holding the image sensor;
A fixing member having a support portion that supports the imaging element holder so as to be movable in a two-dimensional direction orthogonal to the optical axis;
An image blur correction drive mechanism for displacing the image sensor holder in a two-dimensional direction orthogonal to the optical axis;
Blur detection means for detecting blur of the imaging device;
Image blur control means for operating the image blur correction drive mechanism to correct image blur according to the blur detection result by the blur detection means;
Temperature detecting means for detecting the temperature of the image sensor;
Is provided on the fixing member exterior or thermal diffusion plate and then thermally coupling the imaging device, heat bonding the imaging device holder sandwich part engaging detachably said heat radiating plate in a state located at the predetermined position A clip conducting member,
Heat dissipation control means for operating the image blur correction drive mechanism so that the image sensor holder is positioned at a predetermined position when the temperature detected by the temperature detection means is equal to or higher than a predetermined temperature;
The clip conducting member and the heat radiating plate, a lock mechanism that removably locks in a state where the imaging element holder is located at a predetermined position;
An imaging apparatus comprising:   The image pickup apparatus according to claim 1, wherein the predetermined position is an initial position of the image sensor holder during a power-on operation. A low-pass filter disposed on the optical axis between the photographing lens and the imaging element;
The imaging apparatus according to claim 1, further comprising a sealing member that seals the imaging element and the low-pass filter.

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