JP5380243B2 - Manufacturing method of electronic component mounting substrate and electronic component mounting substrate - Google Patents

Description

  The present invention relates to an electronic component mounting substrate manufacturing method and an electronic component mounting substrate in which conductor layers provided on both surfaces of an insulating substrate are connected to each other by a conductive member.

  Electronic component mounting in which a conductor layer made of copper foil is provided on both sides of an insulating substrate, and a heat-dissipating member is press-fitted into a through-hole provided in the insulating substrate, thereby connecting the conductor layers on both sides to improve heat dissipation characteristics. A substrate is known (Patent Document 1 below).

Japanese Patent No. 3174393

  However, in the above-described conventional electronic component mounting board, a single pin-shaped heat radiating member is only press-fitted into the through hole of the insulating substrate provided with the conductor layer on both sides. A gap is easily generated between them, and the adhesion between them is not sufficient, and improvement is desired.

  Then, this invention aims at improving the reliability by improving the adhesiveness between the electroconductive member which serves as a heat radiating member, and a through-hole.

In the present invention, conductor layers are arranged on both surfaces of an insulating substrate having a substrate through hole, and the surface of one of the conductor layers having a through hole smaller than the substrate through hole corresponding to the substrate through hole is filled. The conductive layer is disposed, and the surface of the filling conductor layer at a position corresponding to the through hole of the one conductor layer is heated to a diameter larger than the inner diameter of the through hole and smaller than the inner diameter of the substrate through hole. by pressing the member, the through-hole by melting the one conductor layer and filling the conductive layer near, it causes to flow down a melt of the melted the filling conductive layer from the through-hole of said one conductor layer, said passed down a melt of molten said one conductive layer, filled with the same flow down thereof on the substrate through hole, the site and its surroundings corresponding to the through hole of said one conductor layer, heating of the heating member It was melted by Serial filled with the melt of the one conductor layer which is melted by heating the molten Mono及 beauty the heating member filling the conductive layer, after solidifying the melt was them filled, the filling conductive layer of the one It is made to detach | leave from a conductor layer.

  According to the present invention, one of the conductor layers and the filling conductor layer disposed thereon are melted by using a heating member to fill the substrate through-hole of the insulating substrate with the melt, and this is filled and solidified. Since the conductive layers are connected to each other by the conductive portions, the adhesion of the conductive portions to the substrate through-holes is enhanced, and the conductive portions that are melts are integrated into the conductive layers to conduct the electric conduction between the conductive layers. And heat dissipation are improved, and the reliability of the electronic component mounting board can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is a manufacturing-process figure of the electronic component mounting board | substrate which shows one Embodiment of this invention, (a) is the arrangement | positioning state of four members mutually, (b) is the state which overlapped while positioning the four members of (a) (C) is the state which has made the super hard drill heated in the piled-up state of (b) approach the uppermost copper plate for filling. FIG. 2 is a manufacturing process diagram of an electronic component mounting substrate subsequent to FIG. 1, wherein (a) is a state in which a heated carbide drill is brought into contact with a filling copper plate to melt the filling copper plate and one copper plate; Is a state where the melt of (a) is solidified and the filling copper plate is detached and the copper plates are connected to each other by the conductive portion in the substrate through-hole, and (c) becomes a through hole after the step (b). This is a state in which a punching process is performed to form a metal plating layer on the copper plate surface, and electronic components are mounted on a printed wiring board completed through a predetermined post-process. It is sectional drawing corresponding to FIG.1 (c) in the case of using a copper piece for filling instead of the copper plate for filling of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, as shown in FIG. 1A, an insulating substrate 1 serving as an insulating layer, copper plates 3 and 5 serving as conductor layers located on both upper and lower sides thereof, and a filling conductor located further above the upper copper plate 3 A filling copper plate 7 to be a layer is prepared. The insulating substrate 1 is a semi-cured prepreg in which, for example, an epoxy resin, which is a thermosetting resin corresponding to an adhesive, is impregnated on the upper and lower surfaces of a base material made of glass fiber. That is, the insulating substrate 1 is provided with an adhesive in advance.

  A substrate through hole 1a is formed in the insulating substrate 1 described above, and a copper plate through hole 3a is formed in the upper copper plate 3 as a through hole that is concentric with the substrate through hole 1a and has a smaller diameter than the substrate through hole 1a. It is.

  Next, as shown in FIG. 1 (b), the above four members are arranged in the arrangement state of FIG. 1 (a), that is, in order from the bottom, copper plate 5, insulating substrate 1, copper plate 3, filling copper plate 7 These are superposed in a horizontal state so that At this time, the center of the substrate through hole 1a and the copper plate through hole 3a are substantially coincident, and in this state, the substrate through hole 1a is positioned and fixed to a processing facility (not shown) using a positioning pin or the like.

  And in this state, as shown in FIG.1 (c), the state which matched the center axis line with the center of the board | substrate through-hole 1a and the copper plate through-hole 3a of the carbide drill 9 as a heating member which made the front-end | tip flat. Then, it is pressed against the uppermost filling copper plate 7 while rotating. At this time, the tip (blade edge) of the cemented carbide drill 9 is heated to about 1500 ° C., and the rotation speed is set to about 20 to 80 rpm, for example, so that molten copper is not scattered.

  2A, first, the filling copper plate 7 around the copper plate through hole 3a is melted while being drilled, and a part of the melt flows down from the copper plate through hole 3a of the copper plate 3. Thus, the substrate through-hole 1a of the insulating substrate 1 is filled to become a filler 7b. At this time, a part of the copper plate 3 is also melted and flows down from its own copper plate through hole 3a and filled into the substrate through hole 1a. At this time, since the insulating substrate 1 is also heated, the substrate through-hole 1a is deformed by protruding inward with respect to the original shape (circular shape).

  Thereafter, the carbide drill 9 is lowered to a position where the tip end surface thereof almost reaches the lower surface of the copper plate 3 or to a position immediately before it, so that the copper plate 3 and the filling copper plate around the portion corresponding to the substrate through hole 1a of the insulating substrate 1 7 melts, and the copper plate 3 and the filling copper plate 7 around the cemented carbide drill 9 enter a molten state.

  In this state, when the carbide drill 9 is retracted (raised), as shown in FIG. 2B, the substrate through-hole 1a is filled with the melt of the filling copper plate 7 and the copper plate 3. At the same time, the portion of the copper plate 3 corresponding to the substrate through hole 1a around the copper plate through hole 3a is filled with the melt of the copper plate 3 and the melt of the filling copper plate 7 on the upper portion thereof. Thereafter, with the lapse of time, these melts solidify into conductive portions 11 and copper plate solidified portions 13, and the conductive portions 11 are integrated with the lower copper plate 5, and are integrated with the upper copper plate solidified portion 13, This copper plate solidification part 13 is also integrated with the surrounding copper plate 3.

  In addition, the carbide drill 9 used by heating uses the thing coated with a release agent, thereby preventing adhesion of the melt of the copper plate 3 and the filling copper plate 7. Further, the surface of the copper plate solidified portion 13 in FIG. 2B is polished and smoothed.

  Thereafter, the three members of the insulating substrate 1 and the copper plates 3 and 5 on both sides of the insulating substrate 1 are pressurized while being heated by a pressure press (not shown), so that the adhesive provided in advance in the insulating substrate 1 which is a prepreg is applied. The insulating substrate 1 and the copper plates 3 and 5 are joined by being melted and bonded to form a laminate.

  Subsequently, the laminated body is subjected to a predetermined drilling process to be a through hole (not shown), and then, as shown in FIG. 2 (c), the copper plates on both sides of the insulating substrate 1 in FIG. 2 (a). Metal plating layers 15 and 17 made of copper or the like are formed on the surfaces 3 and 5, respectively, and metal plating layers are similarly formed on the inner surfaces of the through holes. And after forming a required circuit pattern by the etching process with respect to the said metal plating layers 15 and 17, the required electronic component 19 is mounted.

  The conductive part 11 formed by solidifying the melt as described above is directed from the metal plating layer 15 and the copper plate 3 on which the electronic component 19 is mounted to the copper plate 5 and the metal plating layer 17 according to the required circuit pattern. It also functions as a heat radiating member that transmits heat from the metal plating layer 15 and the copper plate 3 to the copper plate 5 and the metal plating layer 17 and dissipates heat.

  As described above, according to the present embodiment, the copper plate 3 and the filling copper plate 7 corresponding to the substrate through hole 1a of the insulating substrate 1 are melted, and the melt is filled in the substrate through hole 1a to conduct electricity. Since the portion 11 is formed, the adhesion to the substrate through-hole 1a is enhanced by the conductive portion 11, the vibration resistance is improved, and the deterioration with time is effective. At the same time, since the upper and lower copper plates 3 and 5 are integrated by the conductive portion 11 and the copper plate solidified portion 13 that solidify the melt of the copper plate 3 and the filling copper plate 7, Conductivity and heat dissipation are improved.

  As described above, the reliability of the electronic component mounting board according to the present embodiment can be improved.

  In the present embodiment, the carbide drill 9 is used as the heating member, but a cylindrical pin-shaped member may be used. Since the drilling action is also generated by using the carbide drill 9, the copper plate 3 and the filling copper plate 7 can be melted more easily in a short time, and workability is improved. On the other hand, by using a pin-shaped member as the heating member, an inexpensive tool can be used, and the manufacturing cost can be reduced. In the case of a pin-shaped member, it may be rotated or simply pressed without rotating.

Moreover, although the board | substrate through-hole 1a and the copper plate through-hole 3a which were mentioned above are circular, not only circular but a square and a polygon may be sufficient.

  Further, as shown in FIG. 3, a filling copper piece 7 </ b> A in place of the filling copper plate 7 shown in FIG. 1 may be disposed on the surface of the copper plate 3 corresponding to the copper plate through hole 3 a.

1 Insulating substrate 1a Substrate through hole 3,5 Copper plate (conductor layer)
3a Copper plate through hole 7 Filling copper plate (filling conductor layer)
9 Carbide drill (heating member)

Claims (3)

Conductor layers are disposed on both surfaces of an insulating substrate having a substrate through hole, and a filling conductor layer is provided on the surface of one of the conductor layers having a through hole smaller than the substrate through hole corresponding to the substrate through hole. A heating member having a diameter larger than the inner diameter of the through hole and smaller than the inner diameter of the substrate through hole is pressed against the surface of the filling conductor layer at a position corresponding to the through hole of the one conductor layer. it is, the through hole to melt the one conductor layer and filling the conductive layer near, causes to flow down a melt of the melted the filling conductive layer from the through-hole of said one conductor layer, wherein that said molten The molten material of one conductor layer was caused to flow down, the flowing material was filled into the substrate through holes, and the portion corresponding to the through hole of the one conductor layer and the periphery thereof were melted by heating of the heating member. For filling Filled with the melt of the one conductor layer which is melted by heating the molten Mono及 beauty the heating member of the body layer, after solidifying the melt was them filled, the filling conductive layer from the conductive layer of the one A method of manufacturing an electronic component mounting board, wherein the electronic component mounting board is separated.   The heating member is a drill having a flat tip, and is pressed against the surface of the filling conductor layer at a position corresponding to the through hole of the one conductor layer while rotating the drill. The manufacturing method of the electronic component mounting board | substrate of description. A substrate for mounting electronic parts in which conductor layers are provided on both surfaces of an insulating substrate, and the conductor layers are electrically connected to each other by a conductive portion provided in a substrate through-hole of the insulating substrate. molten Mono及 beauty was melted by heating of the heating member for filling conductive layer disposed above the conductive layer, melt was melted by heating of the heating member with respect to the one conductive layer disposed on said insulating substrate object is filled, the one conductor layer corresponding to the filled portion is melted Mono及 beauty is melted by heating of the heating member with respect to one of the conductive layers said, of the heating member with respect to the filler conductor layer An electronic component mounting board characterized in that a melted material melted by heating is filled, and the filled melted material is solidified.

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