JP5384966B2 - Surface treatment equipment - Google Patents

Description

  The present invention relates to an apparatus for processing the surface of a processing object.

  Various techniques for treating the surface of the object to be treated are known. For example, in the invention disclosed in Patent Document 1, the processing solution applied to the surface of the processing object is irradiated with an electron beam to activate the processing solution, and the surface of the processing object is processed with the activated processing solution. Is.

JP 2008-053646 A

  In the invention disclosed in Patent Document 1, it is difficult to uniformly apply the treatment solution with a predetermined thickness on the surface of the treatment object. If the processing solution on the surface of the processing object is thin, the electron beam may reach the surface of the processing object and damage the surface. On the other hand, if the processing solution on the surface of the processing object is thick, the electron beam is consumed in the upper layer portion of the processing solution, and the processing solution in the vicinity of the surface of the processing object is not activated by the electron beam. Processing efficiency may be poor.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a surface treatment apparatus that can suppress the damage to the surface of the object to be treated and can improve the efficiency of the surface treatment. To do.

  The surface treatment apparatus according to the present invention is an apparatus for treating the surface of a treatment object, and activates the treatment solution by irradiating an electron beam onto a treatment solution containing an acid or alkali that treats the surface of the treatment object. An electron beam irradiation unit, and a processing solution supply unit that supplies the processing solution irradiated with the electron beam to the surface of the object to be processed are provided. In this surface treatment apparatus, the electron beam irradiation unit irradiates an electron beam onto a treatment solution containing an acid (for example, sulfuric acid or hydrofluoric acid) or an alkali (for example, aqueous ammonia) for treating the surface of the object to be treated. The treatment solution is activated. Then, the processing solution irradiated with the electron beam by the electron beam irradiation unit is supplied to the surface of the processing object by the processing solution supply unit. Thereby, the surface of a process target object is processed.

  In the surface treatment apparatus according to the present invention, the treatment solution supply unit converts the treatment solution into a vapor or spray state before or after the electron beam irradiation by the electron beam irradiation unit, and treats the treatment solution in the vapor or spray state. It is preferable to spray on the surface of the object. It is preferable that the processing solution supply unit supplies the processing solution and causes the inert gas to flow toward the surface of the processing object. It is preferable that the processing solution supply unit sprays an inert gas on the surface of the processing object together with the processing solution in a vapor or spray state.

  In the surface treatment apparatus according to the present invention, it is preferable that the electron beam irradiation unit irradiates the electron beam to a portion where the treatment solution vapor or spray is sprayed on the surface of the object to be treated by the treatment solution supply unit. is there. It is preferable that the processing solution supply unit supplies another processing solution to the surface of the processing object together with the processing solution irradiated with the electron beam by the electron beam irradiation unit. It is preferable that the processing solution supply unit supplies the processing solution to the surface of the processing object with the temperature of the processing solution in the range of 50 ° C to 400 ° C. It is preferable to further include an electron beam output from the electron beam irradiation unit and transmitted through the processing solution, and a shield unit that absorbs X-rays generated when the electron beam interacts with the processing solution.

  Moreover, it is preferable that the surface treatment apparatus according to the present invention further includes an ultrasonic element that applies ultrasonic vibration to the object to be processed. In this case, by applying ultrasonic vibration to the object to be processed by the ultrasonic element, when removing the resist from the surface of the object to be processed or when decomposing the organic substance, the generated resist removal residue and organic residue are quickly removed. In addition, it can be removed from the surface of the object to be treated, and the efficiency of the surface treatment can be improved.

  In the surface treatment apparatus according to the present invention, it is preferable that the object to be treated is a semiconductor coated with a resist, and the resist is peeled off. Further, it is preferable that the object to be treated is a solid catalyst, and the solid catalyst is produced.

  ADVANTAGE OF THE INVENTION According to this invention, the damage of the surface of a process target object can be suppressed, and the highly efficient surface treatment can be achieved.

1 is a configuration diagram of a surface treatment apparatus 1 according to a first embodiment. It is a block diagram of the surface treatment apparatus 2 which concerns on 2nd Embodiment. It is a block diagram of the surface treatment apparatus 3 which concerns on 3rd Embodiment. It is a block diagram of the surface treatment apparatus 4 which concerns on 4th Embodiment. It is a block diagram of the surface treatment apparatus 5 which concerns on 5th Embodiment. It is a block diagram of the surface treatment apparatus 6 which concerns on 6th Embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

  First, the first embodiment will be described. FIG. 1 is a configuration diagram of a surface treatment apparatus 1 according to the first embodiment. The surface treatment apparatus 1 treats the surface of a treatment object 90 with a treatment solution 80 containing an acid or an alkali, and includes an electron beam irradiation unit 10, a pump 21, a solution tank 22, a treatment tank 23, a pipe 24, The piping 25, the piping 26, the thin film 27, and the ultrasonic element 52 are provided. The pump 21, the solution tank 22, the processing tank 23, the pipe 24, the pipe 25, and the pipe 26 are a processing solution supply unit that supplies the processing solution 80 irradiated with the electron beam by the electron beam irradiation unit 10 to the surface of the processing object 90. Configure.

  The electron beam irradiation unit 10 includes a vacuum vessel 11, a cathode 12, a high voltage generation unit 13, and a window 14. In the electron beam irradiation unit 10, a negative high voltage (50 kV to 150 kV) is applied to the cathode 12 placed in the vacuum container 11 by the high voltage generation unit 13, and electrons are emitted from the cathode 12. Of the electrons E emitted from the cathode 12, those that pass through the window 14 and exit to the outside 15 are irradiated as an electron beam onto the treatment solution 80 in the pipe 24. The window 14 is made of a thin foil such as Be, Si, T1, or Al. The exterior 15 is preferably filled with an inert gas at atmospheric pressure.

  The pump 21 and the solution tank 22 are connected by a pipe 25. A pipe 26 is connected between the solution tank 22 and the processing tank 23. The pump 21 and the processing tank 23 are connected by a pipe 24. A part of the pipe 24 is a thin film 27. The thin film 27 is made of a material having corrosion resistance with respect to the processing solution 80.

  In the present embodiment, the processing solution 80 in the solution tank 22 is pumped up by the pump 21 through the pipe 25 and poured into the processing tank 23 through the pipe 24. The processing solution 80 in the processing tank 23 is poured into the solution tank 22 through the pipe 26. The processing object 90 is placed in the processing tank 23 and covered with the processing solution 80. The treatment solution 80 contains an acid or an alkali.

  The electron beam output from the window 14 of the electron beam irradiation unit 10 passes through the thin film 27 and is irradiated to the processing solution 80 in the pipe 24 to activate the processing solution 80. The activated treatment solution 80 is poured into the solution tank 23 and used for the surface treatment of the treatment object 90 placed in the solution tank 23. Further, the portion of the processing solution 80 in the pipe 24 that is irradiated with the electron beam may have a shape that is elongated in a direction perpendicular to the flow of the processing solution 80.

  When the treatment solution 80 contains an acid or an alkali, the activated state of the treatment solution 80 continues for a sufficiently long time even after the treatment solution 80 is irradiated with an electron beam. Therefore, even when the processing solution 80 activated by irradiation with the electron beam is supplied to the surface of the processing object 90 as in the present embodiment, the surface processing of the processing object 90 is made more efficient. be able to. In the present embodiment, since the surface of the processing object 90 is not irradiated with an electron beam, damage to the surface can be avoided.

  In the present embodiment, by applying ultrasonic vibration to the processing object 90 by the ultrasonic element 52, resist peeling that occurs when the resist is peeled from the surface of the processing object 90 or when the organic substance is decomposed. Residues and organic residues can be quickly removed from the surface of the object to be treated, and the efficiency of the surface treatment can be improved.

  Next, a second embodiment will be described. FIG. 2 is a configuration diagram of the surface treatment apparatus 2 according to the second embodiment. This surface treatment apparatus 2 is. The surface of the processing object 90 is processed with a processing solution 80 containing acid or alkali, and the electron beam irradiation unit 10, the pump 21, the solution tank 22, the processing tank 23, the piping 24, the piping 25, the piping 26, and the piping. 28, a pipe 29 and an isolation chamber 30. The pump 21, the solution tank 22, the processing tank 23, the pipe 24, the pipe 25, the pipe 26, the pipe 28, and the pipe 29 are provided on the surface of the processing object 90 with the processing solution 80 irradiated with the electron beam by the electron beam irradiation unit 10. The process solution supply part to supply is comprised.

  The isolation chamber 30 is provided between the portion of the processing solution 80 in the pipe 24 where the electron beam is irradiated by the electron beam irradiation unit 10 and the electron beam irradiation unit 10. In this isolation chamber 30, an inert gas is introduced into the interior 31 through a pipe 32. The pipe 24 between the pump 21 and the processing tank 23 does not have the thin film 27 as in the first embodiment. Therefore, the electron beam output from the window 14 of the electron beam irradiation unit 10 passes through the inside 31 of the isolation chamber 30 and is directly irradiated to the processing solution 80 in the pipe 24. A pipe 24 between the pump 21 and the processing tank 23 is provided with a pipe 28 for introducing an inert gas and a pipe 29 for exhausting the introduced inert gas.

  Also in this embodiment, the processing solution 80 in the solution tank 22 is pumped up by the pump 21 through the pipe 25 and poured into the processing tank 23 through the pipe 24. The processing solution 80 in the processing tank 23 is poured into the solution tank 22 through the pipe 26. The processing object 90 is placed in the processing tank 23 and covered with the processing solution 80. The treatment solution 80 contains an acid or an alkali.

  The electron beam output from the window 14 of the electron beam irradiation unit 10 passes through the inside 31 of the isolation chamber 30 and is directly irradiated to the processing solution 80 in the pipe 24 to activate the processing solution 80. The activated treatment solution 80 is poured into the solution tank 23 and used for the surface treatment of the treatment object 90 placed in the solution tank 23. Further, the portion of the processing solution 80 in the pipe 24 that is irradiated with the electron beam may have a shape that is elongated in a direction perpendicular to the flow of the processing solution 80.

  When the treatment solution 80 contains an acid or an alkali, the activated state of the treatment solution 80 continues for a sufficiently long time even after the treatment solution 80 is irradiated with an electron beam. Therefore, even when the processing solution 80 activated by irradiation with the electron beam is supplied to the surface of the processing object 90 as in the present embodiment, the surface processing of the processing object 90 is made more efficient. be able to. In the present embodiment, since the surface of the processing object 90 is not irradiated with an electron beam, damage to the surface can be avoided.

  In the present embodiment, an inert gas is introduced into the interior 31 of the isolation chamber 30, and the inert gas is introduced into the pipe 24, so that the window 14 of the electron beam irradiation unit 10 is caused by corrosive gas or the like. Corrosion is suppressed.

  Next, a third embodiment will be described. FIG. 3 is a configuration diagram of the surface treatment apparatus 3 according to the third embodiment. The surface treatment apparatus 3 treats the surface of the object to be treated 90 with a treatment solution 80 containing an acid or an alkali, and includes an electron beam irradiation unit 10, a treatment solution tank 41, a pipe 42, an inert gas tank 43, a pipe. 44, a pipe 45, a motor 51, and an ultrasonic element 52. The processing solution tank 41, the pipe 42, the inert gas tank 43, and the pipe 44 constitute a processing solution supply unit that supplies the processing solution 80 irradiated with the electron beam by the electron beam irradiation unit 10 to the surface of the processing object 90.

The processing solution 80 contained in the processing solution tank 41 reaches the pipe 44 through the pipe 42, and is sprayed by the inert gas G ₁ supplied from the inert gas tank 43 connected to the pipe 44 to form the droplet 81. Is done. The droplet 81 of the processing solution 80 exiting from the pipe 44 is irradiated with the electron beam output from the window 14 of the electron beam irradiation unit 10 in the irradiation region A. The droplet 81 of the processing solution 80 activated by the electron beam irradiation is sprayed on the surface of the processing object 90 rotated by the motor 51. Thereby, a layer of the processing solution 80 is formed on the surface of the processing object 90, and the surface of the processing object 90 is processed.

Further, in the present embodiment, a pipe 45 is provided around or on one side of the pipe 44 for spraying the droplet 81 of the processing solution 80, and the inert gas G ₂ is blown from the pipe 45, whereby the processing solution 80. This prevents the droplet 81 from hitting the window 14 of the electron beam irradiation unit 10 and damaging the window 14. The gas G ₂ also has an effect of directing the spray direction of the droplet 81 toward the surface of the processing object 80.

Note that the steam generator is provided in place of the inert gas tank 43, the vapor may be used instead of the inert gas G _1. Further, a plurality of kinds of treatment solutions to be sprayed may be set, and an electron beam may be irradiated to a mixture of these kinds of treatment solutions. In addition, after the plurality of spray solutions are irradiated with the electron beam, droplets of other solutions that do not need to be activated may be mixed.

  In the present embodiment, by applying ultrasonic vibration to the processing object 90 by the ultrasonic element 52, resist peeling that occurs when the resist is peeled from the surface of the processing object 90 or when the organic substance is decomposed. Residues and organic residues can be quickly removed from the surface of the object to be treated, and the efficiency of the surface treatment can be improved.

  Next, a fourth embodiment will be described. FIG. 4 is a configuration diagram of the surface treatment apparatus 4 according to the fourth embodiment. The surface treatment apparatus 4 treats the surface of the object to be treated 90 with a treatment solution 80 containing acid or alkali. The surface treatment apparatus 4 includes an electron beam irradiation unit 10, a treatment solution tank 41, a pipe 44, a pipe 45, and a motor 51. Prepare. The processing solution tank 41 and the pipe 44 constitute a processing solution supply unit that supplies the processing solution 80 irradiated with the electron beam by the electron beam irradiation unit 10 to the surface of the processing object 90.

  In the present embodiment, steam 82 (temperature: 100 ° C. to 200 ° C.) of the processing solution 80 is generated in the processing solution tank 41. The vapor 82 of the processing solution 80 exits through the pipe 44, and the electron beam output from the window 14 of the electron beam irradiation unit 10 is irradiated in the irradiation region A. The vapor 82 of the processing solution 80 activated by the electron beam irradiation is sprayed on the surface of the processing object 90 rotated by the motor 51. Thereby, a layer of the processing solution 80 is formed on the surface of the processing object 90, and the surface of the processing object 90 is processed.

  In the present embodiment, the electron beam is irradiated toward the surface of the processing object 90. If the surface of the processing object 80 is not damaged even when the electron beam is irradiated in this way, such an arrangement may be used. Even when the surface of the processing object 80 is damaged, the amount of the vapor 82 may be adjusted so that the entire electron beam is consumed by the gas in the vapor 82. Further, the portion irradiated with the electron beam may be a configuration immediately after the vapor 82 has exited from the pipe 44, and the surface of the processing object 80 may not be irradiated with the electron beam.

In the present embodiment, a pipe 45 is provided around or on one side of the pipe 44 for spraying the vapor 82 of the processing solution 80, and the inert gas G ₂ is blown from the pipe 45, whereby the processing solution 80. It is prevented that the vapor | steam 82 hits the window 14 of the electron beam irradiation part 10, and the window 14 is damaged. The gas G ₂ also has an effect of directing the spray direction of the steam 82 toward the surface of the processing object 80.

  Next, a fifth embodiment will be described. FIG. 5 is a configuration diagram of the surface treatment apparatus 5 according to the fifth embodiment. The surface treatment apparatus 5 treats the surface of the object to be treated 90 with a treatment solution 80 containing acid or alkali, and includes an electron beam irradiation unit 10, a nozzle 60, and a motor 51. The nozzle 60 constitutes a processing solution supply unit that supplies the processing solution 80 irradiated with the electron beam by the electron beam irradiation unit 10 to the surface of the processing object 90. The electron beam irradiation unit 10 and the nozzle 60 are preferably integrated.

The nozzle 60 has a through-hole through which the electron beam output from the window 14 of the electron beam irradiation unit 10 passes, and has a pipe 61, a pipe 62, and a pipe 63 connected to the through-hole from the side. . The pressure gas G ₃ is supplied to the central through hole of the nozzle 60 through the pipe 61, the vapor G ₄ is supplied through the pipe 62 downstream thereof, and the processing solution 80 is supplied through the pipe 63.

The processing solution 80 supplied through the pipe 63 is sprayed by the pressure gas G ₃ supplied through the pipe 61 to form droplets 82 and mixed with the vapor G ₄ supplied through the pipe 62. The droplet 82 and the vapor G ₄ of the processing solution 80 mixed in this way are irradiated with the electron beam output from the window 14 of the electron beam irradiation unit 10 to generate a large number of ions, radicals, and the like. Since these ions and radicals rarely disappear due to interaction with other molecules, the ions and radicals can efficiently reach the surface of the processing object 90 rotated by the motor 51 and perform various processes. it can.

Here, the acceleration energy of the electron beam in the electron beam irradiation unit 10, by appropriately setting the distance from the window 14 to the processing object 90, an electron beam is consumed in the steam G ₄ or a droplet 82 Thus, the surface of the processing object 90 can be prevented from reaching the surface. Further, if the acceleration energy of the electron beam is increased to 150 kV, for example, and the distance from the window 14 to the processing object 80 is 2 cm to 3 cm, the electron beam interacts with the vapor G ₄ and the droplet 82. It is also possible to survive and reach the surface of the processing object 90.

In addition, it is preferable that the outlet from which the vapor G ₄ and the droplet 82 exit the nozzle 60 and the injection portion of the vapor G ₄ are kept warm by the heater 64. By doing so, will not adhere is drop vapor G ₄ and the droplet 82, it is possible to prevent lowering the temperature of the vapor G ₄ and the solution 82.

In the above example, the use of the vapor G _4, may be changed to spray other processing solution instead of this. That is, the nozzle 60 may have a plurality of treatment solution sprays, vapor ejection ports, or both.

  Next, a sixth embodiment will be described. FIG. 6 is a configuration diagram of the surface treatment apparatus 6 according to the sixth embodiment. The surface treatment apparatus 6 treats the surface of the treatment object 90 with a treatment solution 80 containing an acid or an alkali, and includes an electron beam irradiation unit 10, a nozzle 70, and a motor 51. The nozzle 70 constitutes a processing solution supply unit that supplies the processing solution 80 irradiated with the electron beam by the electron beam irradiation unit 10 to the surface of the processing object 90. The electron beam irradiation unit 10 and the nozzle 70 are preferably integrated.

The nozzle 70 includes a passage through which the electron beam output from the window 14 of the electron beam irradiation unit 10 passes, a pipe 71 and a pipe 72 connected to the passage from the side, and a shield part 74 provided below the passage. And a pipe 73 provided on the side of the shield part 73. An inert gas G ₁ is supplied to the central passage of the nozzle 70 through a pipe 71, and a processing solution 80 is supplied downstream through the pipe 72. Due to the inert gas G ₁ supplied through the pipe 71, the processing solution 80 supplied through the pipe 72 is prevented from going to the window 14, and the electron beam output from the window 14 of the electron beam irradiation unit 10 is irradiated. It is possible to efficiently reach the surface of the processing object 90 that is activated and rotated by the motor 51.

The electron beam output from the window 14 of the electron beam irradiation unit 10 reaches the shield unit 74. The electron beam whose energy has decreased after the interaction between the processing solution 80 and the electron beam emitted from the pipe 72 is absorbed by the shield portion 74. The shield part 74 is made of a metal material that absorbs an electron beam such as SUS. Moreover, the shield part 74 can also shield the X-rays generated from the interaction of the electron beams by increasing its thickness. The impurity gas G ₅ generated by the interaction between the shield part 74 and the electron beam is exhausted through the pipe 73.

  In each of the surface treatment apparatuses 1 to 6 of the present embodiment described above, the electron beam output from the window 14 of the electron beam irradiation unit 10 is the treatment solution 80 (or the droplet 81 or the vapor 82 of the treatment solution 80). To activate the treatment solution 80. The activated processing solution 80 is supplied to the surface of the processing object 90 and used for the surface treatment of the processing object 90. The treatment solution 80 contains an acid or an alkali, and the activated state of the treatment solution 80 lasts for a sufficiently long time even after the treatment solution 80 is irradiated with the electron beam. Accordingly, even when the processing solution 80 activated by irradiation with the electron beam is supplied to the surface of the processing object 90, the surface processing of the processing object 90 can be made more efficient.

  By using any of the surface treatment apparatuses 1 to 6 according to the present embodiment, for example, the following surface treatment can be performed.

For example, by using the surface treatment apparatus according to the present embodiment, the resist is stripped at the time of p-type or n-type high ion implantation (ion implantation amount is 10 ¹⁵ atms / cm ² or more) into a semiconductor (processing object). Processing can be performed. In a situation where the asher device cannot be used due to surface damage of the Si wafer, the resist stripping process is performed using sulfuric acid electrolyzed water or a mixed water of sulfuric acid and hydrogen peroxide. However, when electrolyzed water of sulfuric acid is used, there is a problem that the electrode is a diamond electrode, which is expensive, and when using a mixed water of sulfuric acid and hydrogen peroxide, it is active. There was a problem that the condition was only about 10 minutes. On the other hand, in the surface treatment apparatus according to the present embodiment, high-temperature (100 ° C. to 300 ° C.) sulfuric acid is used as the treatment solution 80, and the electron beam is irradiated onto the sulfuric acid, so that extremely active radicals and ions are used. Will occur. Since these are extremely active, highly ion-implanted semiconductor resists can be easily stripped.

Further, for example, the surface treatment apparatus according to the present embodiment can be applied to a solid catalyst of sulfuric acid. That is, the surface treatment apparatus according to this embodiment is used in order to easily attach the HSO ₃ group to the surface of the powder (processing object) that is the basis of the solid catalyst as disclosed in Japanese Patent No. 4041409. . At this time, the powder that is the source of the solid catalyst may be activated by first irradiating the electron beam with high-temperature sulfuric acid, and the high-temperature sulfuric acid may be converted into high-temperature sulfuric acid. It may be irradiated.

Further, for example, by using the surface treatment apparatus according to the present embodiment, diluted hydrofluoric acid is activated by irradiation with an electron beam, and the SiO ₂ film on the surface of the silicon substrate (processing object) is activated by the activated hydrofluoric acid. Etching and removal of metal impurities can be performed. In this embodiment, the diluted hydrofluoric acid is in a very active state, and the same effect is obtained at a concentration that is a fraction of the conventional hydrofluoric acid concentration, resulting in a treatment with less environmental load.

  The present invention is not limited to the above embodiment, and various modifications can be made. For example, in the surface treatment apparatus according to the present embodiment, a large number of portions sprayed with vapor or solution may be arranged in the longitudinal direction, and the window 14 of the electron beam irradiation unit 10 is rectangular, and the rectangular shape The structure may be such that an electron beam is irradiated to the outside.

DESCRIPTION OF SYMBOLS 1-6 ... Surface treatment apparatus, 10 ... Electron beam irradiation part, 11 ... Vacuum container, 12 ... Cathode, 13 ... High voltage generation part, 14 ... Window, 21 ... Pump, 22 ... Solution tank, 23 ... Treatment tank, 24 , 25, 26 ... piping, 27 ... thin film, 28, 29 ... piping, 30 ... isolation chamber, 31 ... inside, 32 ... piping, 41 ... treatment solution tank, 42 ... piping, 43 ... inert gas tank, 44, 45 ... Piping, 51 ... motor, 52 ... ultrasonic element, 60 ... nozzle, 61, 62, 63 ... piping, 64 ... heater, 70 ... nozzle, 71, 72, 73 ... piping, 74 ... shield part, 80 ... treatment solution, 81 ... droplet, 82 ... steam, 90 ... processing object.

Claims (11)

An apparatus for processing the surface of a processing object,
An electron beam irradiation unit that activates the treatment solution by irradiating the treatment solution containing an acid or alkali to treat the surface of the treatment object with an electron beam;
A processing solution supply unit that supplies the processing solution irradiated with the electron beam by the electron beam irradiation unit to the surface of the object to be processed;
A surface treatment apparatus comprising:   The processing solution supply unit sets the processing solution in a vapor or spray state before or after the electron beam irradiation by the electron beam irradiation unit, and the processing solution in the vapor or spray state is placed on the surface of the processing object. The surface treatment apparatus according to claim 1, wherein the surface treatment apparatus is sprayed on the surface.   The surface treatment apparatus according to claim 1, wherein the treatment solution supply unit supplies the treatment solution and causes an inert gas to flow toward the surface of the object to be treated.   The surface treatment apparatus according to claim 2, wherein the treatment solution supply unit blows an inert gas onto the surface of the object to be treated together with the treatment solution in a vapor or spray state.   The said electron beam irradiation part irradiates an electron beam to the part by which the vapor | steam or spray of the said process solution is sprayed on the surface of the said process target object by the said process solution supply part. Surface treatment equipment.   2. The surface according to claim 1, wherein the processing solution supply unit supplies another processing solution to the surface of the processing object together with the processing solution irradiated with the electron beam by the electron beam irradiation unit. Processing equipment.   2. The surface treatment apparatus according to claim 1, wherein the treatment solution supply unit supplies the treatment solution to a surface of the object to be treated with a temperature of the treatment solution in a range of 50 ° C. to 400 ° C. 3. .   The electron beam output from the electron beam irradiation unit and transmitted through the processing solution, and a shield unit for absorbing X-rays generated by the interaction of the electron beam with the processing solution. 2. The surface treatment apparatus according to 1.   The surface treatment apparatus according to claim 1, further comprising an ultrasonic element that applies ultrasonic vibration to the object to be processed.   The surface treatment apparatus according to claim 1, wherein the object to be treated is a semiconductor coated with a resist, and the resist is peeled off. The surface treatment apparatus according to claim 1, wherein the object to be treated is a solid catalyst, and a solid catalyst is produced.

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