JP5386014B2 - Mask apparatus and mask method for shot blasting - Google Patents

Description

  The present invention relates to a mask apparatus and a mask method for shot blasting that can reduce the occurrence of chipping, cracks, and the like that occur at the end of a part to be processed during shot blasting and can manufacture a high-quality processed part.

  In recent years, silicon carbide (SiC) parts used for semiconductor manufacturing equipment have a tendency to reduce the contact surface of a semiconductor wafer in order to reduce heat capacity, reduce weight, and improve performance during high-temperature heat treatment.

  In addition, in order to suppress sticking of the semiconductor wafer during film formation of the semiconductor wafer, a method is adopted in which the surface roughness of the contact surface with the semiconductor wafer is increased to prevent adhesion between the semiconductor wafer and the surface of the silicon carbide component. Yes. As a processing method for roughening the surface roughness of the contact surface with the semiconductor wafer, a so-called shot blasting method in which diamond particles are blown to roughen the surface is often used.

  Note that the shot blasting method includes forming a groove in a mechanical part (for example, “manufacturing method and blasting device for grooved member” disclosed in Japanese Patent Application Laid-Open No. 2001-246564), and forming a recess in a semiconductor substrate (Japanese Patent Application Laid-Open No. 2002-120152). (“Semiconductor chip, semiconductor wafer, semiconductor device and manufacturing method thereof”) disclosed in the Japanese Patent Publication No. Gazette.

JP 2001-246564 A JP 2002-120152 A

  However, when the shot blasting method is simply applied to the process of increasing the surface roughness of the contact surface of the silicon carbide component with the semiconductor wafer, the contact surface of the semiconductor wafer tends to be thinned, so There has been a situation in which product defects occur, such as chipping (chips) or minute cracks at the ends of silicon carbide parts.

  That is, as shown in FIG. 5A, when shot blasting is performed by spraying the blast material 22 from the spray nozzle 20 of the shot blasting apparatus onto the surface of the silicon carbide component 10, an end portion where chipping is likely to occur. This is probably because the shot blasting material easily hits strongly from the top and side surfaces of the film, and the strength is low due to the thinning of the film, so that chipping is likely to occur as shown in FIG.

  The present invention has been made in view of the above-described conventional circumstances, and reduces the occurrence of chipping, cracks and the like that occur at the end of the workpiece during shot blasting, and manufactures a high-quality workpiece. An object of the present invention is to provide a mask apparatus and a mask method for shot blasting.

  In order to achieve the above object, a mask device for shot blasting according to claim 1, when shot blasting is performed by spraying a blast material onto the surface of a member from an injection nozzle of the shot blasting device. A mask apparatus for shot blasting comprising a masking member for covering an outer peripheral end face or an inner peripheral end face, wherein the masking member is thicker by a predetermined value than the thickness of the member in the vicinity of the covering face, The covering end surface of the masking member is installed in close contact with the outer peripheral end surface or the inner peripheral end surface of the member during blasting.

  The shot blasting mask device according to claim 2 is characterized in that an outer peripheral end surface or an inner peripheral end surface of the member is applied when shot blasting is performed by spraying a blast material onto the surface of the member from an injection nozzle of the shot blasting device. A mask apparatus for shot blasting comprising a masking member for coating the masking member, wherein the covering end surface of the masking member has an inclined cross section of a predetermined angle, and the masking member is an upper end of the covering end surface of the masking member during shot blasting The portion is installed so as to cover the upper end portion of the outer peripheral end surface or the inner peripheral end surface of the member.

  The mask device for shot blasting according to claim 3, wherein the masking member has an outer peripheral end surface of the member or an upper end portion of the inner peripheral end surface that is in close contact with a part of the covering end surface of the masking member during shot blasting. It is characterized by being installed.

  According to a mask method for shot blasting according to claim 4, when the blast material is sprayed from the spray nozzle of the shot blast processing apparatus onto the surface of the member to perform shot blast processing, A mask method for shot blasting for covering an inner peripheral end surface, wherein the thickness of the masking member is thicker by a predetermined value than the thickness of the member in the vicinity of the coating surface, and the masking member is coated with the masking member during shot blasting. The end face is installed in close contact with the outer peripheral end face or the inner peripheral end face of the member.

  The mask method for shot blasting according to claim 5 is characterized in that when the blast material is sprayed from the spray nozzle of the shot blast processing apparatus onto the surface of the member to perform shot blast processing, A mask method for shot blasting for covering an inner peripheral end surface, wherein the covering end surface of the masking member has an inclined cross section having a predetermined angle, and the masking member has an upper end portion of the covering end surface of the masking member at the time of shot blasting. It is installed so that the upper end part of the outer peripheral end surface or inner peripheral end surface of the said member may be covered.

  Further, in the masking method for shot blasting according to claim 6, the masking member has an outer peripheral end surface of the member or an upper end portion of the inner peripheral end surface thereof being in close contact with a part of the covering end surface of the masking member at the time of blasting. It is installed.

  According to the mask device and mask method for shot blasting of the present invention having the above characteristics, the thickness of the masking member is made thicker than the thickness of the member by a predetermined value, and the covering end surface of the masking member is in close contact with the outer peripheral end surface or inner peripheral end surface of the member The blasting material is sprayed from the spray nozzle of the shot blasting device onto the surface of the member to perform shot blasting, so that the blasting material does not directly hit from the side of the end of the member, and appropriate masking For shot blasting, it is possible to manufacture high-quality processed parts by reducing the occurrence of chipping and cracking during shot blasting, as a result of which there is no part that is not subjected to shot blasting due to the level difference between members. A mask device and a mask method can be realized.

  Further, according to the mask device and the mask method for shot blasting of the present invention having the above characteristics, the covering end surface of the masking member has an inclined cross section of a predetermined angle, and the upper end portion of the covering end surface of the masking member is the outer peripheral end surface of the member Alternatively, the upper end portion of the inner peripheral end surface is covered, and the outer peripheral end surface of the member or the upper end portion of the inner peripheral end surface is installed in close contact with a part of the covering end surface of the masking member. Shot blasting is performed by spraying the blast material onto the surface of the member, so that the blasting material is not directly applied from the side surface of the end of the member, and the portion that is not shot blasted due to an appropriate step between the masking member and the member As a result, the occurrence of chipping and cracks during shot blasting is reduced, resulting in high-quality processed parts. Shot blasting mask device and the mask process can produce it can be realized. Further, since the upper corner portion of the outer peripheral end surface or the inner peripheral end surface of the processing member 10 can be installed in close contact with any portion of the covering end surface of the masking member 13, the processing tolerance of the member with a single size masking member It can cope with dimensional changes due to the above.

It is explanatory drawing explaining the shot blasting using the mask apparatus for shot blasting which concerns on Example 1 of this invention. It is explanatory drawing of (a), (b) shot blasting when a process member is made into a ring-shaped member, and (c) it is an external view of a process member. It is explanatory drawing of (a) shot blasting when a process member is made into a plate-shaped member, and (b) it is an external view of a process member. It is explanatory drawing explaining the shot blasting using the mask apparatus for shot blasting which concerns on Example 2 of this invention. It is explanatory drawing of the conventional shot blast process.

  Hereinafter, embodiments of a mask apparatus and a mask method for shot blasting according to the present invention will be described in detail in the order of [Embodiment 1] and [Embodiment 2] with reference to the drawings.

  When shot blasting is performed by spraying a blasting material from the spray nozzle of a shot blasting device to the surface of the processing member, in order to prevent chipping from occurring at the end of the processing member, However, the original purpose of shot blasting cannot be achieved, and the surface roughness of the contact surface of the semiconductor wafer does not become rough, so that the semiconductor wafer may stick to the surface of the processing member. There is sex. The shot blasting mask apparatus and mask method of the present invention are configured so that an appropriate amount of blasting material is applied to the end surface of the processed member while preventing the blasting material from directly contacting the end surface of the processed member. It is intended to manufacture high-quality processed parts by reducing the occurrence of chipping and cracks during processing.

[Example 1]
FIG. 1 is an explanatory diagram for explaining shot blasting using a shot blast mask apparatus according to Embodiment 1 of the present invention. In FIG. 1, the mask apparatus and method for shot blasting of the present embodiment cover the outer peripheral end surface or inner peripheral end surface of the processed member 10 with the masking member 12, and the thickness h2 of the masking member 12 is in the vicinity of the coated surface. In this case, the coating end surface of the masking member 12 is thicker than the thickness h1 of the processing member 10 by a predetermined value, and the covering end surface of the masking member 12 is placed in close contact with the outer peripheral end surface or the inner peripheral end surface of the member 10. Shot blasting is performed by spraying on the surface of the processed member 10.

  Here, the processing member 10 is, for example, a silicon carbide component used for a semiconductor manufacturing apparatus, and the surface roughness of the contact surface with the semiconductor wafer is reduced in order to suppress the sticking of the semiconductor wafer during film formation of the semiconductor wafer. Shot blasting is performed on the surface of the silicon carbide component for the purpose of roughening and preventing adhesion between the semiconductor wafer and the surface of the silicon carbide component. The masking member 12 is made of a relatively soft material such as rubber or resin, as is generally used as a masking member. As the blast material 22, for example, diamond particles are used.

  As described above, in the shot blast mask apparatus and mask method of the present embodiment, the shot blasting process is performed using the masking member 12 in which the thickness h2 of the masking member 12 is equal to or greater than the thickness h1 of the processed member 10 in the vicinity of the coating surface. The masking member 12 is sometimes characterized in that the covering end surface of the masking member 12 is placed in close contact with the outer peripheral end surface or the inner peripheral end surface of the processing member 10, but the intent is that the blast material 22 is injected from the injection nozzle 20 of the shot blasting apparatus. In order to prevent the blasting material 22 from directly hitting from the side surface of the end of the processed member 10 when spraying the surface of the processed member 10 to perform shot blasting.

  That is, when the covering end surface of the masking member 12 is placed in close contact with the outer peripheral end surface or the inner peripheral end surface of the processing member 10 so that the blast material 22 does not directly contact the corner side surface of the end portion of the processing member 10. In addition, a step is formed by the shot blasting surface of the processing member 10 and the surface of the masking member 12. Further, if the difference in thickness between the masking member 12 and the processed member 10 is too large, a portion where the blast material 22 is not hit by a shadow formed by the step, that is, a portion where the shot blasting is not performed is generated. It is important to set the thickness h2 of the masking member 12 in accordance with the thickness h1 of the processed member 10 so that there is a step between the masking member 12 and the processed member 10.

  Therefore, the thickness h2 of the masking member 12 is desirably “the thickness h1 + 0 to 5 [mm] of the processed member 10” with respect to the processed member 10 having the thickness h1 of several millimeters. That is, it is desirable that the height of the step between the masking member 12 and the processed member 10 is 0 to 5 [mm].

  Next, an application example of the shot blast mask apparatus and mask method of the present embodiment will be described with reference to FIGS.

  First, the case where the processed member 10 is a ring-shaped member will be described. 2A and 2B are explanatory views of shot blasting when the processed member 10 is a ring-shaped member, and FIG. 2C is an external view of the processed member.

  As shown in FIG. 2 (c), the ring-shaped member also has various shapes such as a circular outer shape 10c and a polygonal shape 10d, but in this case, the place to be blasted is the upper surface, The masking member has the shape of the hollow part of each of the ring-shaped processed members 10c and 10d as its external shape. At the time of shot blasting, the outer peripheral end surface that is the covering end surface of the masking member and the inner peripheral end surface of the ring-shaped processed members 10c and 10d Are installed by fitting the masking members into the hollow portions of the ring-shaped processed members 10c and 10d.

  Next, a case where the processed member 10 is a plate-like member will be described. FIG. 3 is an explanatory diagram of (a) shot blasting and (b) an external view of the processed member when the processed member 10 is a disk-shaped member.

  As shown in FIG. 3 (b), the disk-shaped member also has various shapes such as a circular outer periphery 10f and a polygonal shape 10g, but in this case, the place to be blasted is the upper surface, The masking member has the shape of each of the plate-like processed members 10f and 10g as the external shape of the hollow portion, and at the time of shot blasting, the inner peripheral end surface which is the covering end surface of the masking member and the outer peripheral end surface of the plate-like processed members 10f and 10g Are installed by fitting the plate-like processed members 10f and 10g into the hollow portion of the masking member. As for the thickness of the masking member, as shown in FIG. 3A, a masking member 12e is used in which the thickness of the masking member 12e is equal to or greater than the thickness of the plate-like processed member 10e in the vicinity of the coating surface.

  As described above, in the shot blast mask device and mask method of the present embodiment, when the blast material 22 is sprayed from the spray nozzle 20 of the shot blast processing device onto the surface of the processing member 10 to perform shot blast processing, A mask device for shot blasting comprising a masking member 12 that covers the outer peripheral end surface or inner peripheral end surface of the processing member 10, wherein the masking member 12 is thicker by a predetermined value than the processing member 10 in the vicinity of the coating surface, The masking member 12 is installed such that the covering end surface of the masking member 12 is in close contact with the outer peripheral end surface or the inner peripheral end surface of the processing member 10 during shot blasting.

  In this way, the thickness of the masking member 12 is made thicker than the thickness of the processed member 10 by a predetermined value, and the covering end surface of the masking member 12 is placed in close contact with the outer peripheral end surface or the inner peripheral end surface of the processed member 10 to perform shot blasting Since the blasting material is sprayed from the spray nozzle of the apparatus onto the surface of the processing member 10 to perform shot blasting, the blasting material is not directly applied from the side surface of the end of the processing member 10, and the upper side of the end of the processing member 10 Chipping hardly occurs at the corners. In addition, since there is no need to create a portion that is not subjected to blasting due to an appropriate level difference between the masking member 12 and the member 10, as a result, the occurrence of chipping or cracks during shot blasting is reduced, resulting in a high-quality processed part. It is possible to realize a shot blast mask apparatus and a mask method capable of manufacturing the above.

  Conventionally, in shot blasting, there has been a concern that chipping may occur at the upper corner of the end of the processed member 10, so that only short shot blasting can be performed for a short time. Since the risk of chipping is reduced in the mask apparatus and mask method for use, the surface can be further roughened by shot blasting, and the processed member 10 is a silicon carbide component used for a semiconductor manufacturing apparatus. In addition, it is possible to more reliably take measures against defects such as sticking of a semiconductor wafer.

[Example 2]
FIG. 4 is an explanatory diagram for explaining shot blasting using a shot blasting mask device according to Embodiment 2 of the present invention. In FIG. 4, the shot blast mask apparatus and mask method of the present embodiment cover the outer peripheral end surface or inner peripheral end surface of the processing member 10 with the masking member 13, and the covering end surface of the masking member 13 has a predetermined angle. An inclined cross section is provided, and the upper end portion of the covering end surface of the masking member 13 is installed so as to cover the outer peripheral end surface or the upper end portion of the inner peripheral end surface of the processing member 10. Is sprayed onto the surface of the processed member 10 to perform shot blasting.

  At this time, it is desirable that the masking member 13 is installed such that the outer peripheral end surface or the upper end portion of the inner peripheral end surface of the processed member 10 is in close contact with a part of the covering end surface of the masking member 13. The application of the processed member 10 and the material of the masking member 12 and the blast material 22 are the same as in the first embodiment. For example, diamond particles are used.

  In the shot blast mask apparatus and mask method of the first embodiment, in order to further enhance the above effect, the upper corner portion of the end portion of the processing member 10 and the coated end surface of the masking member 12 are in close contact, and the blast material 22 is the processing member. It is necessary not to get into the side surface of the end portion of 10. However, when the processed member 10 has a ring-like shape, the diameter of the processed member 10 changes slightly due to processing tolerances and the like, and the one-size masking member 12 cannot cope with it. There is a situation that the member 12 must be manufactured.

  Therefore, in this embodiment, even if the covering end surface of the masking member 13 has an inclined cross section having a predetermined angle and the diameter of the processing member 10 is slightly changed, the outer peripheral end surface of the processing member 10 or the upper corner portion of the inner peripheral end surface Therefore, a masking member 13 that can be installed in close contact with a part of the coated end face of the masking member 13 and can cope with a dimensional change due to a processing tolerance of the processing member 10 with the one-size masking member 13 is proposed.

  The inclination angle d of the masking member 13 on the coated end surface is preferably about 90 to 120 [degrees]. If the inclination angle d is too large, the shadow by the upper end of the covering end surface of the masking member 13 becomes wide, and the end surface of the processing member 10 cannot be sufficiently roughened. In the case of a silicon carbide component used for an apparatus, problems such as sticking of a semiconductor wafer will occur.

  In addition, as a method for installing the processing member 10 so that the outer peripheral end surface or the upper end portion of the inner peripheral end surface is in close contact with a part of the covering end surface of the masking member 13, as shown in FIG. Various methods are conceivable, such as a method of adjusting the pedestal on which the masking member 13 is installed with a step, or a method of making the pedestal of the processing member 10 and the masking member 13 a pedestal structure capable of independently adjusting the height position. .

  In this way, by adjusting the installation height of the processing member 10 and / or the masking member 13, the upper corner of the outer peripheral end surface or the inner peripheral end surface of the processing member 10 is in any part of the covering end surface of the masking member 13. It is always possible to install it closely.

  As described above, in the shot blast mask device and mask method of the present embodiment, when the blast material 22 is sprayed from the spray nozzle 20 of the shot blast processing device onto the surface of the processing member 10 to perform shot blast processing, A shot blasting mask device having a masking member 13 for covering an outer peripheral end surface or an inner peripheral end surface of a processing member 10, wherein the covering end surface of the masking member 13 has an inclined cross section of a predetermined angle. The upper end portion of the covering end surface of the masking member 13 is installed so as to cover the upper end portion of the outer peripheral end surface or the inner peripheral end surface of the processing member 10 during processing. Further, it is desirable that the masking member 13 is installed such that the outer peripheral end surface or the upper end portion of the inner peripheral end surface of the processed member 10 is in close contact with a part of the covering end surface of the masking member 13.

  As a result, as in the first embodiment, it is possible to realize a shot blast mask apparatus and a mask method capable of reducing the occurrence of chipping and cracks during shot blasting and manufacturing high-quality processed parts. The one-size masking member 13 can cope with a dimensional change due to a processing tolerance or the like of the processing member 10.

10, 10a-10g Processing member (member)
12, 10a to 10e Masking member 13 Masking member 20 Injection nozzle of shot blasting apparatus 22 Blasting material

Claims (4)

A shot blasting mask device provided with a masking member that covers the outer peripheral end surface or inner peripheral end surface of the member when the blast material is sprayed from the injection nozzle of the shot blasting device onto the surface of the member to perform shot blasting. And
The covering end surface of the masking member has an inclined cross section of a predetermined angle,
The masking member is installed so that the upper end of the covering end surface of the masking member covers the outer peripheral end surface or the upper end of the inner peripheral end surface of the masking member during shot blasting. .   2. The masking member according to claim 1, wherein an upper end portion of the outer peripheral end surface or the inner peripheral end surface of the member is placed in close contact with a part of a covering end surface of the masking member during shot blasting. Mask device for shot blasting. A shot blasting masking method for covering the outer peripheral end surface or the inner peripheral end surface of the member with a masking member when performing shot blasting by injecting a blasting material onto the surface of the member from an injection nozzle of a shot blasting device,
The covering end surface of the masking member has an inclined cross section of a predetermined angle,
A mask method for shot blasting, wherein the masking member is installed so that an upper end portion of a covering end surface of the masking member covers an outer peripheral end surface or an upper end portion of an inner peripheral end surface of the masking member during shot blasting .   4. The masking member according to claim 3, wherein the upper end portion of the outer peripheral end surface or the inner peripheral end surface of the member is placed in close contact with a part of the covering end surface of the masking member during shot blasting. Shot blasting mask method.

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