JP5386832B2 - Transfer substrate manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a transfer substrate having a functional shape (for example, a pregroove of an optical disc).

  For example, when producing a surface-recording flexible optical disk applicable to a high NA (Numerical Aperture) pickup, first, a flexible transfer substrate is produced using a stamper (mold) having an uneven fine pattern by photolithography.

  This transfer substrate is produced by forming a transfer layer for transferring a fine pattern of a stamper on a film-like substrate using an ultraviolet curable resin or the like. In some cases, a protective film (hard coat film) is formed on a substrate on which a transfer layer is formed. Further, there are some which are produced by forming a protective film on a film-like substrate to which a fine pattern of a stamper is transferred. This transfer layer or protective film is made of UV curable resin or the like placed on a stamper placed on a turntable such as a spinner in order to ensure that the UV curable resin has cure shrinkage and to ensure the uniformity of the resin film thickness. It is formed by coating and rotating in an annular shape, irradiating the resin spread by centrifugal force with ultraviolet rays, and curing the resin.

  However, since the substrate of this transfer substrate is film-like and has no strength, the transfer substrate is peeled off when the film substrate on which the transfer layer is formed is peeled off from the stamper or when the release substrate is peeled off from the protective film formed on the transfer substrate. Becomes easier to deform.

In addition, as a conventional peeling method from the stamper, when the transfer release substrate is peeled off from the combined disk substrate in which the base material layer disk substrate and the transfer release disk substrate are bonded together, transfer is performed so that the air escape path is not biased in one direction. There is a method of cracking and peeling the release disk substrate. Further, there is means for forming a notch by a circle cutter or a laser in the vicinity of the outer peripheral end of the stamper and peeling the stamper so as to lift upward (see, for example, Patent Documents 1 and 2). In addition, a peeling layer is formed in advance on a transfer substrate having a larger outer diameter than the disk substrate, and the outer periphery of the transfer substrate is warped and peeled with the release layer attached, or a notch is formed in the stamper. In addition, there is a method in which gas is supplied from a gap provided in the center hole for peeling (see, for example, Patent Documents 3 and 4).
JP 2005-259208 A JP 2005-78723 A JP 2004-14046 A Japanese Patent Laid-Open No. 2003-331481

  However, any of the above-described peeling methods is a method of mechanically peeling a disk having mechanical rigidity. Therefore, it cannot be applied to a transfer substrate manufactured using the film-like substrate.

  The present invention has been made in view of the above points, and in a method of manufacturing a transfer substrate having a functional shape, it is possible to prevent the transfer substrate from being deformed, to produce a high-quality transfer substrate with good smoothness and few defects. An object of the present invention is to provide a transfer substrate manufacturing method.

  In order to solve the above problems, the present invention employs means for solving the problems having the following characteristics.

The invention described in claim 1 includes a step of placing a mold having a center hole and a functional shape on a surface thereof on a rotating plate, and an annular liquid curable resin on the mold placed on the rotating plate. Coating the curable resin, placing a liquid substrate having a larger outer diameter than the mold on the coated curable resin, and placing the film substrate on the curable resin. After the liquid contact step, the step of rotating the rotating plate to spread the liquid curable resin over the entire upper surface of the mold and the entire lower surface of the film substrate, and the curable resin spread by the rotation to the film Peeling from the mold, including a step of curing by supplying chemical energy through the substrate and a step of peeling the transfer layer and the film substrate obtained by the step of curing the curable resin from the mold in a step of, in the spread process Of the curable resin that spreads beyond the edge of the mold, extends to the outer peripheral edge of the film substrate, and is cured by the curing step, the protruding part that protrudes beyond the edge of the mold, and The film substrate corresponding to the projecting portion is combined and pulled so as to be pulled from the mold, and after the peeling step, the projecting portion and the film substrate corresponding to the projecting portion are cut. .

  According to the first aspect of the present invention, in the transfer substrate manufacturing method having a functional shape, it is possible to prevent the transfer substrate from being deformed, to manufacture a high-quality transfer substrate with good smoothness and few defects. Further, since the outer diameter of the film substrate is larger than that of the mold, the transfer substrate can be easily peeled from the mold.

  In the invention described in claim 2, the outer diameter of the film substrate is larger by 1 to 20 mm than the mold.

  According to the second aspect of the invention, since the outer diameter of the film substrate is larger by 1 to 20 mm than the mold, the transfer substrate can be easily peeled from the mold, and the rotating plate is rotated and the curability is increased. When the resin is spread, the outer peripheral edge of the film substrate is maintained in a horizontal direction without being inclined with respect to the surface of the rotating plate, so that a transfer substrate with good smoothness can be produced.

  According to a third aspect of the present invention, the energy supply cures the curable resin in a low oxygen concentration atmosphere.

  According to a third aspect of the present invention, when the energy is supplied to cure the curable resin, the film substrate extends beyond the edge of the mold by supplying energy in a low oxygen concentration atmosphere. It becomes possible to fully harden the said curable resin extended by.

  According to a fourth aspect of the present invention, there is provided a process of forming a transfer layer and a film substrate having a larger outer diameter than the mold on a mold having a central hole placed on a rotating plate and having a functional shape on the surface. A step of coating a liquid curable resin on the film substrate; a step of placing and contacting a release substrate having a larger outer diameter than the film substrate on the coated curable resin; After the step of placing and contacting the release substrate on the film substrate, the step of rotating the rotating plate to spread the liquid curable resin over the entire upper surface of the film substrate and the lower surface of the release substrate; A step of curing the curable resin spread by the rotation by supplying chemical energy through the release substrate, and a step of curing the curable resin and the release substrate that are extended and cured from the film substrate. Obtained by And a step of peeling the protective film, and a step of peeling the transfer layer, the film substrate and the protective layer from the mold.

  According to the fourth aspect of the present invention, in the method for producing a transfer substrate having a functional shape, it is possible to produce a high-quality transfer substrate having good smoothness and few defects. Moreover, since the outer diameter of the peeling substrate is larger than that of the film substrate, the peeling substrate is easily peeled off.

  The invention described in claim 5 includes a step of forming a transfer film substrate having a larger outer diameter than the mold on a mold having a central hole placed on a rotating plate and having a functional shape on the surface; A step of applying a liquid curable resin on the transfer film substrate, a step of placing and contacting a release substrate having a larger outer diameter than the transfer film substrate on the coated curable resin; After the step of placing and contacting the release substrate on the transfer film substrate, the rotating plate is rotated to spread the liquid curable resin over the upper surface of the transfer film substrate and the entire lower surface of the release substrate. A step of curing the curable resin spread by the rotation by supplying chemical energy through the release substrate, and the curing and extending the curable resin and the release substrate from the film substrate. In the process A step of peeling the protective film obtained Ri, the protective film and the transfer film substrate and a step of peeling from the mold.

  According to the invention described in claim 5, in the method for producing a transfer substrate having a functional shape, it is possible to produce a high-quality transfer substrate having good smoothness and few defects. Moreover, since the outer diameter of the peeling substrate is larger than that of the transfer film substrate, the peeling substrate can be easily peeled off.

  In the invention described in claim 6, the outer diameter of the release substrate is 1 to 20 mm larger than the film substrate or the transfer film substrate.

  According to invention of Claim 6, since the outer diameter of the said peeling substrate is larger than the said film substrate or the said transfer film substrate, peeling of the said peeling substrate becomes easy, and also the said rotating plate is rotated and the said curable resin is made to rotate. When the film substrate is spread, the outer peripheral edge of the film substrate is maintained in the horizontal direction without being inclined with respect to the surface of the rotating plate, so that a transfer substrate with good smoothness can be produced.

  In the invention described in claim 7, the supply of the energy cures the curable resin in a low oxygen concentration atmosphere.

  According to the invention of claim 7, when the energy is supplied to cure the curable resin, the edge of the film substrate or the transfer film substrate is formed by supplying energy in a low oxygen concentration atmosphere. It becomes possible to sufficiently cure the curable resin spread over and spread on the release substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the transfer substrate manufacturing method which prevents the deformation | transformation of a transfer substrate, can manufacture a high quality transfer substrate with good smoothness and few defects can be provided.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings. 1, 3, and 4 for explaining each embodiment shown below, the right side of each layer (including a substrate, a stamper, etc.) shown in the figure is a shaft side on which a rotating body (turn table) described later rotates, The left side is the rotation end.

(First embodiment)
FIG. 1 is a view for explaining a method for producing a surface recording type or optical substrate transmission type optical disc in the first embodiment.

  First, as shown in FIG. 1A, a disk-shaped mold having a pregroove shape 30 formed by, for example, photolithography on a magnet 20 of a turntable 10 that is a rotating plate, and having a center hole. A stamper 40 (for example, an outer diameter of 130 mm) is placed.

  Next, about 0.5 cc of the photocurable resin 50-1 is applied in the vicinity of the center hole of the stamper 40. In application, for example, the photocurable resin 50-1 is applied in an annular shape using a plunger pump or the like. Moreover, in this embodiment, a thermosetting resin etc. can also be used instead of a photocurable resin.

Next, a PC (Polycarbonate) film substrate 60 having a center hole is placed on and wetted with the coated photocurable resin 50-1. The PC film substrate 60 preferably has an outer diameter that is 1 to 20 mm larger than the outer diameter of the stamper 40. Thereby, at the time of rotation of the turntable 10 which will be described later, the outer peripheral end 62 of the PC film substrate 60 is kept in the horizontal direction without being inclined with respect to the surface of the turntable 10, and the photocuring resin 50-1. Adhesion is improved.

  Here, for example, an acrylate monomer material or the like is used as the photocurable resin 50-1, and a high bar pump CV or the like manufactured by Unicontrols can be used as the plunger pump. For the PC film substrate 60, for example, Teijin Pure Ace can be used.

  Next, the turntable 10 is rotated at a predetermined speed for a predetermined time. The turntable 10 is rotated at approximately 3000 rpm for 20 seconds when the photocurable resin 50-1 spreads inward from the recording area of the stamper 40 due to, for example, capillary action. The rotation speed and rotation time in the present embodiment are not limited to this in the present invention, and are arbitrarily set depending on, for example, the radius of the stamper 40 and the PC film substrate 60, the material of the photocurable resin 50-1, and the like. .

  By the rotation, as shown in FIG. 1B, the photocurable resin 50-1 spreads over the upper surface of the stamper 40 and the entire lower surface of the PC film substrate 60. Further, since the rotation is swung away at high speed using centrifugal force, the photocurable resin 50-1 spreads between the stamper 40 and the PC film substrate 60, and a transfer formed by the photocurable resin 50-1 described later. The layer 52 is a layer having a uniform thickness. Furthermore, since the outer diameter of the PC film substrate 60 is larger than the outer diameter of the stamper 40 as described above, the photocurable resin 50-1 extends beyond the edge 42 of the stamper 40, and the outer peripheral end of the PC film substrate 60. Can be extended to 62. Therefore, as shown in FIG. 1B, the photocurable resin 50-1 swells to some extent due to the surface tension between the edge portion 42 of the stamper 40 and the outer peripheral end portion 62 of the PC film substrate 60. It becomes the state which spreads in the shape of a slope.

  Next, as shown in FIG. 1C, chemical energy such as light energy is supplied onto the photocurable resin 50-1 spread as described above via the PC film substrate 60. . Note that the energy and the like are supplied in a low oxygen concentration atmosphere by purging nitrogen. As a result, the photocurable resin 50-1 is cured, and the photocurable resin 50-1 that extends beyond the edge 42 of the stamper 40 to the outer peripheral end 62 of the PC film substrate 60 is also sufficiently cured. It becomes possible to make it.

  In addition, as application of light energy etc., it is preferable to irradiate for 20 seconds using, for example, an ultra high pressure mercury lamp (USH-500BY1) manufactured by USHIO. Moreover, when a thermosetting resin is used instead of the photocurable resin 50-1, thermal energy or the like can be applied.

  As the photocurable resin 50-1 is cured, a transfer layer 52 is formed on the stamper 40, and the transfer layer 52 and the PC film substrate 60 are bonded.

  Next, as shown in FIG. 1 (D), from the stamper 40 to the protruding portion 53 of the transfer layer 52 and the outer peripheral end portion 62 of the PC film substrate 60 that protrude in a slope shape having a certain degree of swelling, For example, an adhesive sheet member such as cellophane tape is attached, and lightly pulled upward so as to be removed from the stamper 40. Thereby, the transfer layer 52 and the PC film substrate 60 formed on the stamper can be easily peeled from the stamper 40. In addition, it can peel easily even if it uses tweezers etc., without using a cellophane tape.

  Next, as shown in FIG. 1E, the protruding portion 53 of the transfer layer 52 and the outer peripheral end portion 62 of the PC film substrate 60 are cut.

  Thereby, as shown in FIG. 1F, a transfer substrate 70 composed of the transfer layer 52 and the PC film substrate 60 is produced.

  The transfer substrate 70 manufactured by the above manufacturing method is maintained in the horizontal direction without the outer peripheral end 62 of the PC film substrate 60 being inclined with respect to the surface of the turntable 10 when the turntable 10 is rotated. For this reason, the adhesiveness of the photocurable resin 50-1 and the PC film substrate 60 which spread beyond the edge 42 of the stamper 40 is improved.

  Moreover, since the supply of the energy or the like is performed in the low oxygen concentration atmosphere, the photo-curable resin 50-1 spreading beyond the edge 42 of the stamper 40 can be sufficiently cured. As a result, the protruding portion 53 of the transfer layer 52 which is in close contact with the PC film substrate 60 and hardened is formed, so that the cellophane tape or the like is attached to this portion and can be easily peeled off from the stamper 40 simply by pulling lightly. it can.

  Therefore, the transfer substrate 70 manufactured by the above manufacturing method is a high-quality transfer substrate that is prevented from being deformed, smooth, and has few defects.

Here, FIG. 2 is a diagram showing reproduction signal characteristics and RF signal characteristics of the disc manufactured in the first embodiment of the present invention. Incidentally, FIG. 2, the rotation angle (Rotation angle / deg) face of the shake acceleration ^{(Axial runout acceleration (m / s} 2)) and residual focus error after focus servo operation (Residual focus error signal after focus servo drive (μm) ).

  According to the first embodiment of the present invention, the disc on which the recording film is formed has good focus and tracking, and as shown in FIG. 2, the disc has a flat reproduction signal characteristic and good reflectivity (RF signal). I was able to get it.

(Second Embodiment)
FIG. 3 is a diagram for explaining a method for producing a surface recording type or optical substrate transmission type optical disc in the second embodiment.

  Here, the second embodiment of the present invention described below is a manufacturing method in which a protective film (hard coat film) is further formed on the transfer layer 52 and the PC film substrate 60 manufactured on the stamper 40 in the first embodiment. Will be explained.

  First, as shown in FIG. 3A, the stamper 40 (for example, outer diameter 130 mm) on the magnet 20 of the turntable 10 has the transfer layer 52 and the PC film substrate 60 produced in the first embodiment described above. It stays in close contact.

  First, about 0.5 cc of the photocurable resin 50-2 is applied in the vicinity of the center hole of the PC film substrate 60. In the application, for example, the photocurable resin 50-2 is applied in an annular shape using a plunger pump or the like. Moreover, in this embodiment, a thermosetting resin etc. can be used instead of a photocurable resin, for example.

  Next, the peeling substrate 80-1 is placed and wetted on the coated photocurable resin 50-2. The release substrate 80-1 preferably has an outer diameter that is 1 to 20 mm larger than the outer diameter of the PC film substrate 60. Accordingly, when the turntable 10 to be described later is rotated, the outer peripheral end portion 82-1 of the peeling substrate 80-1 is maintained in the horizontal direction without being inclined with respect to the surface of the turntable 10, so that the photocurable resin Adhesion with 50-2 is improved.

  Here, for example, an acrylate monomer material or the like is used for the photocurable resin 50-2, and a high bar pump CV or the like manufactured by Unicontrols can be used for the plunger pump, for example. Further, as the release substrate 80-1, for example, a polyethylene terephthalate (PET) substrate (Toyobo Cosmo Shine A4100) or the like having releasability even after the photocurable resin 50-2 is cured can be used.

  Next, the turntable 10 is rotated at a predetermined speed for a predetermined time. The turntable 10 is rotated at about 3000 rpm for 20 seconds when the photocurable resin 50-2 spreads inward from the recording area of the stamper 40 due to, for example, capillary action. Note that the rotation speed and rotation time in the present embodiment are not limited to this in the present invention. For example, the radius of the stamper 40, the PC film substrate 60, and the release substrate 80-1, and the material of the photo-curable resin 50-2. It is arbitrarily set by, for example.

  3B, the photocurable resin 50-2 spreads over the upper surface of the PC film substrate 60 and the entire lower surface of the release substrate 80-1. Further, since the rotation is swung away at high speed using centrifugal force, the photocurable resin 50-2 spreads between the PC film substrate 60 and the release substrate 80-1, and the photocurable resin 50-2 described later The film thickness uniformity of the protective film 56-1 to be formed can be ensured. Furthermore, as described above, since the outer diameter of the release substrate 80-1 is larger than the outer diameter of the PC film substrate 60, the photocurable resin 50-2 spreads beyond the edge 64 of the PC film substrate 60, and the release substrate It can be extended to the outer peripheral end 82-1 of 80-1. Therefore, as shown in FIG. 3B, between the edge 64 of the PC film substrate 60 and the outer peripheral end 82-1 of the release substrate 80-1, the photocurable resin 50-2 is caused by surface tension. It becomes a state of spreading in a slope shape having a certain degree of swelling.

  Next, as shown in FIG. 3C, chemical energy such as light energy is supplied onto the photocurable resin 50-2 via the release substrate 80-1. The supply of energy and the like is performed in a low oxygen concentration atmosphere by purging nitrogen. As a result, the photocurable resin 50-2 is cured, and the photocurable resin 50- extends beyond the edge 64 of the PC film substrate 60 to the outer peripheral end 82-1 of the release substrate 80-1. 2 can be sufficiently cured.

  In addition, as application of light energy etc., it is preferable to irradiate for 20 seconds using, for example, an ultra high pressure mercury lamp (USH-500BY1) manufactured by USHIO. Moreover, when a thermosetting resin is used instead of the photocurable resin 50-2, thermal energy or the like can be applied.

  By the curing of the photocurable resin 50-2, a protective film (hard coat film) 56-1 is formed on the PC film substrate 60.

  Next, as shown in FIG. 3D, the protruding portion 57-1 of the protective film 56-1 and the peeling substrate 80-1 that protrude from the PC film substrate 60 in a state of spreading in a slope having a certain degree of swelling. For example, an adhesive sheet member such as cellophane tape is attached to the outer peripheral end portion 82-1, and is gently pulled upward. As a result, the protrusion 57-1 of the protective film 56-1 is peeled off from the protective film 56-1 while adhering to the cellophane tape or the like, and at the same time, peelable with respect to the cured photocurable resin 50-2. A good release substrate 80-1 can also be easily released from the protective film 56-1. In addition, it can peel easily even if it uses tweezers etc., without using a cellophane tape.

  Next, as shown in FIG. 3E, the protruding portion 53 of the transfer layer 52 protruding from the stamper 40, the outer peripheral end portion 62 of the PC film substrate 60, and the protruding remaining portion 58 (the protruding portion 57) of the protective film 56-1. A sticky sheet member such as cellophane tape is attached to the projecting remaining portion of the protective film 56-1 remaining after the peeling of −1, and lightly pulled upward so as to be removed from the stamper 40. Thereby, the transfer layer 52, the PC film substrate 60, and the protective film 56-1 can be easily peeled from the stamper 40. In addition, it can peel easily even if it uses a tweezers etc. instead of a cellophane tape, for example.

  Next, as shown in FIG. 3F, the protruding portion 53 of the transfer layer, the outer peripheral end portion 62 of the PC film substrate 60, and the protruding remaining portion 58 of the protective film 56-1 are cut.

  Thereby, as shown in FIG. 3G, a transfer substrate 72 composed of the transfer layer 52, the PC film substrate 60, and the protective film 56-1 is produced.

  When the turntable 10 is rotated, the transfer substrate 72 manufactured by the above manufacturing method is kept in the horizontal direction without the outer peripheral end portion 82-1 of the release substrate 80-1 being inclined with respect to the surface of the turntable 10. It is. For this reason, the adhesiveness of the photocurable resin 50-2 spreading beyond the edge 64 of the PC film substrate 60 and the release substrate 80-1 is improved.

  In addition, since the energy is supplied in the low oxygen concentration atmosphere, the photocurable resin 50-2 spreading beyond the edge 64 of the PC film substrate 60 can be sufficiently cured. Thereby, the protrusion part 57-1 of the protective film 56-1 which is the part which the photocurable resin 50-2 hardened beyond the edge part 64 of the PC film board | substrate 60, and the outer peripheral edge part 82- of the peeling board | substrate 80-1. 1 can be easily peeled off from the protective film 56-1 simply by applying the cellophane tape or the like and pulling lightly upward.

  Further, the peeling from the stamper 40 is because the protruding portion 57-1 after peeling is formed on the protective film 56-1, and the protruding portion 53 is formed on the transfer layer 52. Therefore, the transfer layer 52, the PC film The substrate 60 and the protective film 56-1 can be easily peeled from the stamper 40.

  Therefore, the transfer substrate 72 manufactured by the above manufacturing method is a high-quality transfer substrate that is prevented from being deformed, smooth, and has few defects.

  According to the second embodiment of the present invention, the disk on which the recording film is formed has good focus and tracking, and has the same reflectance (RF signal) as that shown in FIG. I got a good disc.

(Third embodiment)
FIG. 4 is a diagram for explaining a method for producing a surface recording type or optical substrate transmission type optical disc in the third embodiment.

  Here, the third embodiment of the present invention described below describes a manufacturing method for forming a protective film on a transfer film substrate to which the pre-groove shape 30 of the stamper 40 is transferred.

First, as shown in FIG. 4A, on a stamper 40 (for example, an outer diameter size of 130 mm), which is a disk-shaped mold having a pre-groove shape 30 formed by, for example, photolithography, and further having a center hole. A PC (Polycarbonate ) film substrate 60 having a central hole is placed. For the PC film substrate 60, for example, Teijin Pure Ace can be used.

  Next, the entire surface of the stamper 40 and the PC film substrate 60 is uniformly heated and pressurized using, for example, upper and lower heaters 100 and 120.

  Specifically, from the state shown in FIG. 4 (A), as shown in FIG. 4 (B), for example, the stamper 40 heated to 150 ° C. is imprinted on the PC film substrate 60 at 14 MPa for 20 minutes. Note that the PC film substrate 60 can be prevented from being bent by uniformly heating the entire surface from above and below using the upper and lower heaters 100 and 120.

  As a result, the pre-groove shape 30 of the stamper 40 is transferred to the PC film substrate 60, and the transfer film substrate 66 is formed on the stamper 40.

  Next, as shown in FIG. 4C, the upper and lower heaters 100 and 120 are released, and the stamper 40 and the transfer film substrate 66 are cooled. In cooling, for example, cooling may be performed at normal temperature, or cooling may be performed by temperature control using a cooling unit that circulates cooling water or the like through the heater to lower the temperature.

  Next, as shown in FIG. 4D, the stamper 40 and the transfer film substrate 66 are placed on the magnet 20 of the turntable 10 which is a rotating plate in a state where the stamper 40 and the transfer film substrate 66 are in close contact with each other.

  Next, about 0.5 cc of the photocurable resin 50-3 is applied in the vicinity of the center hole of the transfer film substrate 66. In the application, the photocurable resin 50-3 is applied in an annular shape using, for example, a plunger pump. Moreover, in this embodiment, a thermosetting resin etc. can be used instead of a photocurable resin, for example.

  Next, the peeling substrate 80-2 is placed and wetted on the coated photocurable resin 50-3. The release substrate 80-2 preferably has an outer diameter that is 1 to 20 mm larger than the outer diameter of the transfer film substrate 66. Thereby, when the turntable 10 to be described later is rotated, the outer peripheral end portion 82-2 of the release substrate 80-2 is kept in the horizontal direction without being inclined with respect to the surface of the turntable 10, so that the photo-curing property. Adhesion with resin 50-3 is improved.

  Here, for example, an acrylate monomer material or the like is used for the photo-curable resin 50-3, and a high bar pump CV or the like manufactured by Unicontrols can be used for the plunger pump, for example. Further, as the release substrate 80-2, for example, a polyethylene terephthalate (PET) substrate (Toyobo Cosmo Shine A4100) or the like having release properties even after the photocurable resin 50-3 is cured can be used.

  Next, the turntable 10 is rotated at a predetermined speed for a predetermined time. The turntable 10 is rotated at about 3000 rpm for 20 seconds when the photocurable resin 50-3 spreads inward from the recording area of the stamper 40 due to, for example, capillary action. The rotation speed and rotation time in the present embodiment are not limited to this in the present invention. For example, the radius of the stamper 40, the transfer film substrate 66, the release substrate 80-2, the material of the photocurable resin 50-3, and the like. Is set arbitrarily.

  By the rotation, as shown in FIG. 4E, the photocurable resin 50-3 spreads over the upper surface of the transfer film substrate 66 and the entire lower surface of the release substrate 80-2. Further, since the rotation is swung away at high speed using centrifugal force, the photocurable resin 50-3 spreads between the transfer film substrate 66 and the release substrate 80-2, and the photocurable resin 50-3 described later is The protective film 56-2 to be formed can ensure film thickness uniformity. Furthermore, since the outer diameter of the release substrate 80-2 is larger than that of the transfer film substrate 66 as described above, the photocurable resin 50-3 extends beyond the edge 68 of the transfer film substrate 66, and the release substrate 80-2 It can be extended to the outer peripheral end 82-2. Therefore, as shown in FIG. 4E, between the edge 68 of the transfer film substrate 66 and the outer peripheral end 82-2 of the release substrate 80-2, the photocurable resin 50-3 is caused by surface tension. It becomes a state of spreading in a slope shape having a certain degree of swelling.

  Next, as shown in FIG. 4F, chemical energy such as light energy is supplied onto the photocurable resin 50-3 through the release substrate 80-2. The supply of energy and the like is performed in a low oxygen concentration atmosphere by purging nitrogen. Thereby, the photocurable resin 50-3 is cured, and extends beyond the edge 68 of the transfer film substrate 66 to the outer peripheral end portion 82-2 of the release substrate 80-2. Can be sufficiently cured.

  In addition, as application of light energy etc., it is preferable to irradiate for 20 seconds using, for example, an ultra high pressure mercury lamp (USH-500BY1) manufactured by USHIO. Moreover, when a thermosetting resin is used instead of the photocurable resin 50-3, thermal energy or the like can be applied.

  A protective film 56-2 is formed on the transfer film substrate 66 by the curing of the photocurable resin 50-3.

  Next, as shown in FIG. 4G, the protruding portion 57-2 of the protective film 56-2 and the peeling substrate 80-2 that protrude in a state of spreading from the transfer film substrate 66 in a slope shape having a certain degree of swelling are formed. For example, an adhesive sheet member such as cellophane tape is attached to the outer peripheral end portion 82-2, and lightly pulled upward. As a result, the protruding portion 57-2 of the protective film is peeled off from the protective film 56-2 while adhering to the cellophane tape or the like, and at the same time, a release substrate having good peelability with respect to the cured photocurable resin 50-3 80-2 can also be easily peeled off from the protective film 56-2. In addition, it can peel easily even if it uses tweezers etc., without using a cellophane tape. Moreover, in order to make the cut surface of the protrusion 57-2 of the protective film 56-2 and the protective film 56-2 more smooth, a cut may be made in advance by a cutting means such as a laser or a cutter.

  Next, as shown in FIG. 4H, the transfer film substrate 66 and the protective film 56-2 are peeled from the stamper 40.

  Thereby, as shown in FIG. 4I, a transfer substrate 74 composed of the transfer film substrate 66 and the protective film 56-2 is produced.

  When the turntable 10 is rotated, the transfer substrate 74 manufactured by the above manufacturing method is maintained in the horizontal direction without the outer peripheral end portion 82-2 of the release substrate 80-2 being inclined with respect to the surface of the turntable 10. Be drunk. For this reason, the adhesiveness of the photocurable resin 50-3 spreading beyond the edge 68 of the transfer film substrate 66 and the release substrate 80-2 is improved.

  In addition, since the energy is supplied in the low oxygen concentration atmosphere, the photocurable resin 50-3 spreading beyond the edge 68 of the transfer film substrate 66 can be sufficiently cured. As a result, the protruding portion 57-2 of the protective film 56-2 and the outer peripheral end portion 82- of the release substrate 80-2, which are portions where the photocurable resin 50-3 is cured beyond the edge 68 of the transfer film substrate 66, are obtained. 2 can be easily peeled off from the protective film 56-2 simply by applying the cellophane tape or the like and pulling lightly upward.

  Therefore, the transfer substrate 74 manufactured by the above manufacturing method is a high-quality transfer substrate that is prevented from being deformed, smooth, and has few defects.

  According to the third embodiment of the present invention, the disk on which the recording film is formed has good focus and tracking, and the reproduction signal characteristic equivalent to that shown in FIG. 2 has a flat reflectance (RF signal). I was able to get a disc.

<Comparison with the present invention>
In this embodiment described above, the outer diameter of the film substrate is protruded by about 1 to 20 mm larger than that of the stamper. Moreover, the dimension of the outer diameter of the peeling substrate is also made to protrude about 1 to 20 mm larger than the film substrate. Then, the comparative example with the case where the outer diameter of a film substrate and a peeling substrate is made into another dimension is demonstrated below.

(Comparative Example 1)
Comparative Example 1 is an example in which a transfer substrate was obtained by increasing the outer diameter of the PC film substrate by 0.5 mm from the stamper in the same process as in the first embodiment. In this example, the protruding portion for attaching the cellophane tape or the like is not formed at the interface between the photocurable resin and the stamper, making it difficult to peel off. As a result, the disk was warped greatly, and the mechanical properties were poor. FIG. 5 is a diagram showing reproduction signal characteristics and RF signal characteristics of the disc manufactured in Comparative Example 1 of the present invention. As shown in this figure, the signal characteristics of the disk produced in Comparative Example 1 were poor. Incidentally, FIG. 5, the rotation angle (Rotation angle / deg) face of the shake acceleration ^{(Axial runout acceleration (m / s} 2)) and residual focus error after focus servo operation (Residual focus error signal after focus servo drive (μm) ).

(Comparative Example 2)
Comparative Example 2 is an example in which a transfer substrate was obtained by increasing the outer diameter of the PC film substrate by 25 mm from the stamper in the same process as in the first embodiment. In this example, when the turntable 10 is rotated, the outer peripheral end portion of the PC film substrate is not tilted and kept in the horizontal direction with respect to the turntable, so that the PC film substrate is in close contact with the photocurable resin. The part which is not closely attached has occurred. For this reason, unless the PC film substrate is greatly curved at the interface between the photocurable resin and the stamper, the protruding portion after the cellophane tape or the like is attached cannot be peeled off. As a result, the transfer substrate after peeling had a large warp shape, and the mechanical properties were poor. In addition, the disk manufactured in Comparative Example 2 exhibited characteristics equivalent to the reproduction signal characteristics and RF signal characteristics of the disk manufactured in Comparative Example 1 in FIG. 5, and the signal characteristics were also poor.

(Comparative Example 3)
Comparative Example 3 is an example in which a transfer substrate was obtained by increasing the outer diameter of the release substrate by 25 mm from the PC film substrate in the same process as in the second embodiment. In this example, when the turntable 10 is rotated, the outer peripheral end portion of the peeling substrate is not tilted and kept in the horizontal direction with respect to the turntable, so that the peeling substrate is in close contact with the photocurable resin. The part which is not done has arisen. For this reason, unless the peeling substrate is greatly curved at the interface between the photocurable resin and the peeling substrate, the protruding portion after the cellophane tape or the like is attached cannot be peeled off. As a result, the transfer substrate after peeling had a large warp shape, and the mechanical properties were poor. Further, the disk manufactured in Comparative Example 3 exhibited characteristics equivalent to the reproduction signal characteristics and RF signal characteristics of the disk manufactured in Comparative Example 1 of FIG. 5, and the signal characteristics were also poor.

  As described above, according to the transfer substrate manufacturing method having a functional shape, according to the present invention, a transfer substrate manufacturing method that can prevent the deformation of the transfer substrate, and can manufacture a high-quality transfer substrate with good smoothness and few defects. Can be provided.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Can be changed.

It is a figure explaining the manufacturing method of the surface recording type | mold or optical substrate transmission type optical disk in 1st Embodiment. It is a figure which shows the reproduction signal characteristic and RF signal characteristic of the disc produced in 1st Embodiment of this invention. It is a figure explaining the manufacturing method of the surface recording type | mold or optical substrate transmissive optical disc in 2nd Embodiment. It is a figure explaining the manufacturing method of the surface recording type | mold or optical substrate transmission type optical disk in 3rd Embodiment. It is a figure which shows the reproduction signal characteristic of the disk produced by the comparative example 1, and RF signal characteristic.

Explanation of symbols

10 Turntable (Rotating plate)
20 Magnet 30 Pre-groove shape 40 Stamper (type)
50 Photocurable resin 52 Transfer layer 53, 57 Protruding portion 56 Protective film 60 PC film substrate 66 Transfer film substrate 70, 72, 74 Transfer substrate 80 Release substrate 100, 120 Upper and lower heaters

Claims (7)

Placing a mold having a central hole and a functional shape on the surface on a rotating plate;
Coating the liquid curable resin in an annular shape on the mold placed on the rotating plate;
On the coated curable resin, a step of placing and wetting a film substrate having a larger outer diameter than the mold; and
After the step of placing and contacting the film substrate on the curable resin, the step of rotating the rotating plate to spread the liquid curable resin over the entire upper surface of the mold and the lower surface of the film substrate; ,
Supplying the chemical energy through the film substrate and curing the curable resin spread by the rotation; and
A transfer layer obtained by the step of curing the curable resin and a step of peeling the film substrate from the mold,
In the step of peeling from the mold, the mold is spread out beyond the edge of the mold by the spreading step, spreads to the outer peripheral edge of the film substrate, and of the mold among the curable resin cured by the curing step. The projecting part projecting beyond the edge part and the film substrate corresponding to the projecting part are combined and peeled off as if pulled from the mold,
A method for manufacturing a transfer substrate , comprising a step of cutting the protruding portion and the film substrate corresponding to the protruding portion after the peeling step.   The transfer substrate manufacturing method according to claim 1, wherein an outer diameter of the film substrate is 1 to 20 mm larger than the mold.   The transfer substrate manufacturing method according to claim 1, wherein the energy is supplied by curing the curable resin in a low oxygen concentration atmosphere. Forming a transfer layer and a film substrate having a larger outer diameter than the mold on a mold having a central hole placed on a rotating plate and having a functional shape on the surface;
Applying a liquid curable resin on the film substrate;
On the coated curable resin, a step of placing and contacting the release substrate having a larger outer diameter than the film substrate;
After the step of placing and contacting the release substrate on the film substrate, the step of rotating the rotating plate to spread the liquid curable resin over the entire upper surface of the film substrate and the lower surface of the release substrate; ,
Supplying the chemical energy through the release substrate and curing the curable resin spread by the rotation; and
Peeling the curable resin that has been extended and cured from the film substrate and the release substrate from the protective film obtained by the curing step; and
And a step of peeling the transfer layer, the film substrate and the protective film from the mold. Forming a transfer film substrate having a larger outer diameter than the mold on a mold having a central hole placed on a rotating plate and having a functional shape on the surface;
Applying a liquid curable resin on the transfer film substrate;
On the coated curable resin, a step of placing and contacting the release substrate having a larger outer diameter than the transfer film substrate; and
After the step of placing and contacting the release substrate on the film substrate, the step of rotating the rotating plate to spread the liquid curable resin over the entire upper surface of the transfer film substrate and the lower surface of the release substrate When,
Supplying the chemical energy through the release substrate and curing the curable resin spread by the rotation; and
Peeling the curable resin and the release substrate that are extended and cured from the transfer film substrate from the protective film obtained by the curing step;
And a step of peeling the protective film and the transfer film substrate from the mold.   6. The transfer substrate manufacturing method according to claim 4, wherein an outer diameter of the release substrate is 1 to 20 mm larger than the film substrate or the transfer film substrate.   6. The transfer substrate manufacturing method according to claim 4, wherein the energy is supplied by curing the curable resin in a low oxygen concentration atmosphere.

Images