JP5388778B2 - Photoelectric conversion device, photoelectric conversion element storage package, and photoelectric conversion module - Google Patents

Description

  The present invention relates to a photoelectric conversion device, a photoelectric conversion element storage package, and a photoelectric conversion module using the photoelectric conversion device.

  In recent years, development of a photoelectric conversion device having a photoelectric conversion element has been advanced. As an exemplary photoelectric conversion device, there is a solar cell device that converts solar energy into electric power. In particular, for the purpose of improving the power generation efficiency, a concentrating solar cell device is being developed. In the case of this solar cell device, the photoelectric conversion element is a solar cell element that converts solar energy into electric power. For example, Patent Document 1 discloses a structure for efficiently irradiating condensed solar light onto a solar cell element.

  The solar cell device proposed in Patent Document 1 includes a receiver substrate on which a solar cell element for photoelectric conversion is mounted, a resin sealing portion for resin-sealing the solar cell element, and a solar cell element on the receiver substrate. An optical member that guides light and an optical holding unit that holds the optical member and is disposed on the receiver substrate are included.

JP 2009-187971 A

  By the way, in the structure of the solar cell device proposed in the above-mentioned Patent Document 1, heat generated in the receiver substrate due to irradiation of sunlight or the like is conducted to the optical member through the optical holding unit, and as a result, the optical member There is a possibility of causing a positional shift or the like due to thermal expansion of the film.

  This invention is made | formed in view of the said subject, and it aims at providing the photoelectric conversion apparatus excellent in heat dissipation, the package for photoelectric conversion element accommodation, and a photoelectric conversion module.

In order to solve the above problems, a photoelectric conversion device according to a first aspect of the present invention includes an element mounting substrate, a photoelectric conversion element provided on one main surface of the element mounting substrate, and a main element of the element mounting substrate. A frame provided on the surface so as to surround the photoelectric conversion element; a light condensing member that is bonded to the frame and provided above the photoelectric conversion element via a space; A thermal conductive substrate provided in contact with the other main surface of the element mounting substrate only in a region surrounded by a body, and a part of a side surface of the thermal conductive substrate is connected to the element mounting substrate. It has an extending portion provided outside the contact portion and projecting in a direction along the other main surface of the element mounting substrate, and provided apart from the other main surface of the element mounting substrate. To do.

The photoelectric conversion element storage package according to the second aspect of the present invention includes an element mounting substrate having a mounting portion on which a photoelectric conversion element is mounted, and surrounds the mounting portion on one main surface of the element mounting substrate. A frame body, and a condensing member that is joined to the frame body and provided at a position higher than a position where the photoelectric conversion element is to be mounted, and in a region surrounded by the frame body when seen in a plan view And a heat conductive substrate provided in contact with the other main surface of the element mounting substrate, and a part of a side surface of the heat conductive substrate is outside a contact portion with the element mounting substrate. And it has the extension part which protrudes in the direction along the other main surface of the said element mounting substrate, and is provided away from the other main surface of the said element mounting substrate, It is characterized by the above-mentioned.

  A photoelectric conversion module according to a third aspect of the present invention includes the photoelectric conversion device and a light receiving member provided on the photoelectric conversion device.

  An object of this invention is to provide the photoelectric conversion apparatus excellent in heat dissipation, the package for photoelectric conversion element accommodation, and a photoelectric conversion module.

It is a disassembled perspective view which shows the external appearance of the photoelectric conversion module which concerns on this embodiment. It is an outline perspective view of a photoelectric conversion device concerning this embodiment. It is a general-view perspective view except the condensing member of the photoelectric conversion apparatus which concerns on this embodiment.

It is sectional drawing when the photoelectric conversion apparatus shown in FIG. 2 is cut | disconnected by the AA line. It is a top view of the photoelectric conversion apparatus shown in FIG. 4, Comprising: (A) is a top view of the photoelectric conversion apparatus which shows the state which mounted the photoelectric conversion element. Moreover, (B) is a top view of the photoelectric conversion apparatus which shows the contact position of a heat conductive board | substrate except a photoelectric conversion element. Further, (C) is a schematic cross-sectional view of the photoelectric conversion device showing a contact state between the thermally conductive substrate and the element mounting substrate. It is sectional drawing of the photoelectric conversion apparatus which concerns on the modification 1 of this embodiment. It is sectional drawing of the photoelectric conversion apparatus which concerns on the modification 2 of this embodiment. It is a top view of the photoelectric conversion apparatus which concerns on the modification 2 shown in FIG. 7, Comprising: (A) is a top view of the photoelectric conversion apparatus which shows the state which mounted the photoelectric conversion element. Moreover, (B) is a top view of the photoelectric conversion apparatus which shows the contact position of a heat conductive board | substrate except a photoelectric conversion element. Further, (C) is a schematic cross-sectional view of the photoelectric conversion device showing a contact state between the thermally conductive substrate and the element mounting substrate. It is a top view of the photoelectric conversion apparatus which concerns on the modification 3 of this embodiment, Comprising: (A) is a top view of the photoelectric conversion apparatus which shows the state which mounted the photoelectric conversion element. Moreover, (B) is a top view of the photoelectric conversion apparatus which shows the contact position of a heat conductive board | substrate except a photoelectric conversion element. Further, (C) is a schematic cross-sectional view of the photoelectric conversion device showing a contact state between the thermally conductive substrate and the element mounting substrate.

  Hereinafter, a photoelectric conversion module, a photoelectric conversion device, and a photoelectric conversion element storage package according to an embodiment of the present invention will be described with reference to the drawings.

<Embodiment>
<Configuration of photoelectric conversion module>
FIG. 1 is an overview perspective view of a photoelectric conversion module 1 according to an embodiment of the present invention, and an exploded perspective view in which a part thereof is enlarged. 2 is a schematic perspective view of the photoelectric conversion device 2 shown in FIG. FIG. 3 is a schematic perspective view of the photoelectric conversion device 2 from which the light collecting member is removed. FIG. 4 is a cross-sectional view of the photoelectric conversion device 2. FIG. 5 is a plan view of the photoelectric conversion device 2 from which the light collecting member is removed, and FIG. 5A is a plan view of the photoelectric conversion device 2 showing a state where the photoelectric conversion elements are mounted. FIG. 5B is a plan view of the photoelectric conversion device 2 showing a state in which the photoelectric conversion element is removed and a heat conductive substrate is arranged.

  The photoelectric conversion module 1 according to the present embodiment is a solar power generation module that converts solar energy into electric power. Moreover, the photoelectric conversion apparatus 2 according to the present embodiment includes a photoelectric conversion element 9 that converts light energy into electric power. For example, the photoelectric conversion element 9 is a solar cell element having a function of converting solar energy into electric power.

  The photoelectric conversion module 1 includes a plurality of photoelectric conversion devices 2, a light receiving member 3 and an external substrate 4 provided above the plurality of photoelectric conversion devices 2. The light receiving member 3 has a function of collecting light received from the outside and collecting the received light on the light collecting member 11. The light receiving member 3 is configured by fixing a plurality of lens members 3b to a rectangular frame member 3a. The lens member 3b of the light receiving member 3 is, for example, a dome-shaped Fresnel lens, and is made of a resin material having excellent optical characteristics such as acrylic resin. The plurality of photoelectric conversion devices 2 are mounted on the external substrate 4. The light receiving member 3 is fixed to the external substrate 4 and covers the plurality of photoelectric conversion devices 2.

  The external substrate 4 has a function of radiating heat generated from the photoelectric conversion device 2. The external substrate 4 is made of a metal material such as aluminum, copper, or a carbon-metal composite material. The thermal conductivity of the external substrate 4 is set to, for example, 100 W / (m · K) or more and 500 W / (m · K) or less.

  The light incident on the light receiving member 3 is collected at the upper end of the light collecting member 11 of the photoelectric conversion device 2. That is, the light collecting member 11 has a function of guiding the light collected by the light receiving member 3 to the photoelectric conversion element 9. The light incident on the light collecting member 11 proceeds from the upper end to the lower end of the light collecting member 11 while being repeatedly reflected by the light collecting member 11, and is incident on the upper surface of the photoelectric conversion element 9 from the lower end of the light collecting member 11. The The photoelectric conversion element 9 converts light energy into electric power.

  As shown in FIG. 4, the photoelectric conversion device 2 includes an element mounting substrate 5, a pedestal 6 provided on one main surface of the element mounting substrate 5, and a photoelectric conversion element 9 provided on one main surface of the element mounting substrate 5. The first output terminal 8a and the second output terminal 8b that are electrically connected to the photoelectric conversion element 9 and take out the output of the photoelectric conversion element 9 to the outside, and photoelectric conversion on one main surface of the element mounting substrate 5 A frame 10 provided so as to surround the element 9, and a condensing member 11 that is bonded to the frame 10 and provided above the photoelectric conversion element 9 via a space, and is seen through the plane, And a thermally conductive substrate 12 provided in contact with the other main surface of the element mounting substrate 5 in an enclosed region. The frame 10 is formed so as to surround one main surface of the element mounting substrate 5 in an annular shape.

  The element mounting substrate 5 and the pedestal 6 provided on one main surface of the element mounting substrate 5 are members formed in a rectangular shape when seen through the plane. The frame body 10 is a member formed in a rectangular shape when seen through on a plane. The shape of the element mounting substrate 5, the pedestal 6, or the frame body 10 when seen through the plane is not limited to a rectangular shape, and may be a circular shape or the like. In addition, it is preferable that the shape of the frame 10 is formed according to the shape of the condensing member 11 to be joined.

  The element mounting substrate 5, the pedestal 6, and the frame 6 are, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or glass. It consists of ceramic materials such as ceramics, metal materials such as copper, iron, tungsten, molybdenum, nickel or cobalt, or alloys containing these metal materials, resin materials such as glass epoxy, acrylic or epoxy. Further, the coefficient of thermal expansion of the element mounting substrate 5 is set to, for example, 7 (ppm / ° C.) or more and 9 (ppm / ° C.) or less.

  A first conductive pattern 7 a is formed on one main surface of the element mounting substrate 5. In addition, a metallized layer is formed on the other main surface of the element mounting substrate 5 in a region where the thermally conductive substrate 12 abuts.

  A second conductive pattern 7 b is formed on the pedestal 6. The first conductive pattern 7a and the second conductive pattern 7b are made of, for example, a metal material such as tungsten, molybdenum, or manganese, and are formed using, for example, a metallization forming technique by a screen printing method.

  The frame 10 has a function of supporting the light collecting member 11. That is, as shown in FIG. 4, the frame body 10 includes a support portion 10 a having an inclined surface that is inclined in a direction in which the inner wall side of the frame body 10 is lowered from the upper surface of the frame body 10 to the entire circumference of the frame body 6. Have. The inclined shape of the support portion 10 a of the frame 10 is formed in accordance with the inclined shape of the light collecting member 11. The difference between the inclined shape of the support portion 10a and the inclined shape of the light collecting member 11, that is, the inclination angle of the inclined surface of the support portion 10a and the inclination angle of the side surface of the light collecting member 11 when viewed in cross section is 20 It is preferable if it is within the range of ° or less.

  Since the side surface of the light collecting member 11 is joined by the inclined surface of the support portion 10a of the frame body 10, both are smoothly joined, the light collecting member 11 is hardly damaged, and both can be joined well. . As a result, a change in the traveling direction of the light guided to the photoelectric conversion element 9 due to scratches or the like can be suppressed, and the light collecting property can be improved. Further, the support portion 10 a of the frame body 10 may be a stepped notch from the upper surface of the frame body 10 to the inner wall surface.

  A metallized layer is formed on the inclined surface of the support portion 10 a of the frame 10 for joining with the light collecting member 11. The metallized layer on the inclined surface of the support portion 10a and the metal film provided on the side surface portion of the light collecting member 11 are bonded via the bonding member 10b. As the metallized layer, for example, a metal material such as tungsten, molybdenum, or manganese is formed by using, for example, a metallization forming technique by a screen printing method. The detailed configuration of the light collecting member 11 will be described later.

  Here, in the case where the element mounting substrate 5, the pedestal 6 and the frame body 10 are formed of ceramics, a manufacturing method of the element mounting substrate 5, the pedestal 6 and the frame body 10 in a state where the three are integrated will be described. The first conductive pattern 7a is formed on one main surface of the uncured element mounting substrate 5 before firing using, for example, a metallization forming technique by screen printing, and the heat conductive substrate 12 is formed on the other main surface. A metallized layer is formed in the contact area. Further, the second conductive pattern 7b is formed on the uncured pedestal 6 before firing using, for example, a metallization forming technique by a screen printing method. Further, a metallized layer for joining with the light collecting member 11 is formed on the inclined surface of the support portion 10a of the uncured frame body 10 before firing using, for example, a metallization forming technique by a screen printing method. Then, an uncured base 6 before firing on which the second conductive pattern 7b is formed on one main surface of the uncured element mounting substrate 5 before firing on which the first conductive pattern 7a is formed, and further firing. The previous uncured frame 10 is pressure-bonded and the three are fired simultaneously. In this way, the element mounting substrate 5, the pedestal 6, and the frame body 10 are integrated after firing.

  The photoelectric conversion element 9 is, for example, a solar cell element that includes a III-V group compound semiconductor. The photoelectric conversion element 9 can immediately convert the received light energy into electric power and output it by the photovoltaic effect. For example, the solar cell element has an InGaP / GaAs / Ge3 junction type cell structure. The indium gallium phosphide (InGaP) top cell converts energy contained in a wavelength region of 660 nm or less. The gallium arsenide (GaAs) middle cell converts energy contained in a wavelength region from 660 nm to 890 nm. The germanium (Ge) bottom cell converts light contained in a wavelength region from 890 nm to 2000 nm. The three cells are connected in series via a tunnel junction. The open circuit voltage is the sum of the electromotive voltages of the three cells.

  A lower surface electrode of the photoelectric conversion element 9 is formed on the lower surface of the photoelectric conversion element 9. The lower electrode is made of, for example, silver or aluminum and is electrically connected to the first conductive pattern 7a via a bonding material such as low melting point solder or conductive epoxy resin.

  Further, the upper surface electrode of the photoelectric conversion element 9 is formed on the upper surface of the photoelectric conversion element 9. The upper surface electrode is formed of, for example, silver, aluminum or the like, and is electrically connected to the second conductive pattern 7b with a conductive wire. In addition, although the connection place of the conductive wire with respect to the 2nd conductive pattern 7b of an upper surface electrode is made into two places, it may not be restricted to this but may be three or more places. Thereby, the current per one conductive wire can be reduced, and the generation of heat can be suppressed.

  Further, the first conductive pattern 7a and the second conductive pattern 7b are electrically connected to the first output terminal 8a and the second output terminal 8b through a bonding material. The first output terminal 8a and the second output terminal 8b are, for example, an iron-nickel-cobalt (Fe—Ni—Co) alloy. The bonding material is, for example, silver-copper solder, low melting point solder, conductive epoxy resin, or the like.

  Here, for example, the first output terminal 8a functions as a positive electrode. The second output terminal 8b functions as a negative electrode. The photoelectric conversion element 9 is electrically connected to the first output terminal 8a and the second output terminal 8b, and electricity is supplied to the outside through the first output terminal 8a and the second output terminal 8b. It can be taken out.

  As for the condensing member 11, a metal film is formed over the perimeter of a side surface. The metal film is formed at a position corresponding to the support portion 10a of the frame 10 by a thin film forming technique such as vapor deposition or sputtering. The metal film is a metal material such as titanium, platinum, gold, chromium, nickel, gold, silver, copper, or an alloy thereof. The metal film on the side surface of the light collecting member 11 is bonded to the inclined surface of the support portion 10a of the frame body 10 over the entire circumference of the frame body 10 via the bonding member 10b. Both are joined by brazing, soldering, resin joining, or the like.

  The joining member 10b is made of, for example, a brazing material, solder, low-melting glass, epoxy resin, or the like. Examples of the brazing material include silver-copper brazing. Examples of solder include gold-tin, gold-germanium, and tin-lead. The low melting point glass means a glass having a glass transition point of 600 ° C. or lower. By joining the frame body 10 and the light collecting member 11 only by the support portion 10 a of the frame body 10, the joint area between the frame body 10 and the light collecting member 11 can be reduced. As a result, the compressive stress from the frame 10 to the light collecting member 11 can be reduced, the positional deviation of the irradiation light to the photoelectric conversion element 9 due to the change in the refractive index of the light collecting member 11 is suppressed, and the light collecting property is improved. be able to.

  The condensing member 11 is joined over the entire circumference of the frame body 10 and is provided above the photoelectric conversion element 9 via the space SP. As a result, the photoelectric conversion element 9 is provided in a space SP surrounded by the element mounting base 5, the pedestal 6, the frame body 10, and the light collecting member 11 and hermetically sealed. Since the photoelectric conversion element 9 can be hermetically sealed by being provided in the internal space SP, moisture resistance is improved, and the photoelectric conversion element 9 can be operated with reliability over a long period of time.

  Further, the light collecting member 11 has translucency and has a function of guiding the light reaching from the light receiving member 3 to the photoelectric conversion element 9. The translucency of the condensing member 11 means that light contained in at least a part of the wavelength region of sunlight can be transmitted when the photoelectric conversion element 9 is a solar cell element. The condensing member 11 is, for example, borosilicate glass.

  The condensing member 11 is a condensing prism, and has a quadrangular frustum shape whose cross-sectional area decreases from the upper end portion to the lower end portion of the condensing member 11 toward the photoelectric conversion element 9. The light that reaches the light collecting member 11 is repeatedly reflected at the interface between the inside and the outside of the light collecting member 11. The condensing member 11 has a function of equalizing the intensity distribution of light energy in the cross-sectional area by reflection in the process toward the photoelectric conversion element 9. Note that a metal thin film may be provided around the light collecting member 11 as a reflective member having a function of reflecting sunlight, for example, by vapor deposition.

  Moreover, the condensing member 11 should just have the function to equalize the intensity distribution of the light energy in a cross-sectional area by reflection of light. The shape of the light collecting member 11 may be a truncated cone shape whose cross-sectional area decreases from the upper end portion to the lower end portion of the light collecting member 11 toward the photoelectric conversion element 9. The shape of the frame 10 is preferably formed in accordance with the shape of the light collecting member 11.

  The thermal conductive substrate 12 is seen through the plane, and the other main surface of the element mounting substrate 5 in the region surrounded by the frame 10, that is, in the region surrounded by the alternate long and short dash line as shown in FIG. Is provided in contact with. The heat conductive substrate 12 is preferably in contact with the other main surface of the element mounting substrate 5 only in a region surrounded by the frame body 10 as seen through the plane. The heat conductive substrate 12 is made of a material having excellent heat conductivity, for example, a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium, or an alloy thereof. The thermally conductive substrate 12 is bonded to the element mounting substrate 5 via a brazing material on a metallized layer formed in a region surrounded by the frame 10 on the other main surface of the element mounting substrate 5. The thermal expansion coefficient of the thermally conductive substrate 12 is set to, for example, 7 (ppm / ° C.) or more and 23 (ppm / ° C.) or less.

  The thermal conductivity of the thermally conductive substrate 12 is set to, for example, 100 W / (m · K) or more and 500 W / (m · K) or less. In addition, as shown in FIG. 5B, the distance L between the heat conductive substrate 12 and the frame body 10 is the suppression of heat conduction to the light collecting member 11 when the heat conductive substrate 12 is seen through a plane. Therefore, L1 is 0.1 mm to 3.0 mm, L2 is 0.1 mm to 3.0 mm, L3 is 0.1 mm to 3.0 mm, and L4 is 0.1 mm to 3.0 mm. Each of the following is preferably set. Further, the thickness T1 of the heat conductive substrate 12 is set to 0.1 mm or more and 1.0 mm or less in terms of relaxation of bonding stress due to a difference in thermal expansion coefficient between the element mounting substrate 5 and the heat conductive substrate 12. It is preferable.

<Configuration of photoelectric conversion element storage package>
Here, the photoelectric conversion element storage package will be described. The photoelectric conversion element storage package is a state in which the photoelectric conversion element 9 is not mounted on one main surface of the element mounting substrate 5. That is, the photoelectric conversion element storage package includes an element mounting board 5 having a mounting portion including a conductive pattern on which the photoelectric conversion element 9 is mounted on one main surface of the element mounting board 5, and one main surface of the element mounting board 5. And a frame 10 provided so as to surround the mounting portion. The frame body 10 has an inclined surface that is inclined in a direction in which the inner wall side of the frame body 10 is lowered in order to join the light collecting member 11 that is to be provided at a position above the planned mounting position of the photoelectric conversion element 9. ing. Further, the support portion 10 a of the frame body 10 may have a stepped portion cut out from the upper surface of the frame body 10 to the inner wall surface.

  For example, a photoelectric conversion element 9 is mounted on one main surface of the element mounting substrate 5 of the photoelectric conversion element storage package via a bonding material such as solder or resin, and the frame 10 is further provided above the photoelectric conversion element 9. A condensing member 11 is provided through a space. Further, the heat conductive substrate 12 is provided in contact with the other main surface of the element mounting substrate 5 in a region surrounded by the frame body 10 as seen in a plan view. By joining the metallized layer of the support portion 10a of the frame 10 and the metal film of the light collecting member 11 via the bonding member 10b, the photoelectric conversion device 2 provided with the light collecting member 11 is obtained.

  According to the present embodiment, the thermal conductive substrate 12 is provided in contact with the other main surface of the element mounting substrate 5 in a region surrounded by the frame body 10 in a plan view. Since the heat generated at is efficiently radiated to the heat conductive substrate 12, the temperature rise of the photoelectric conversion element 9 can be suppressed. As a result, a temperature increase of the photoelectric conversion element 9 is suppressed, and a decrease in conversion efficiency of the photoelectric conversion element 9 can be suppressed.

  Further, since the heat conductive substrate 12 is provided in contact with the other main surface of the element mounting substrate 5 in a region surrounded by the frame body 10 in a plan view, the heat conductivity from the photoelectric conversion element 9. Since the heat conducted to the substrate 12 can be suppressed from being conducted to the frame body 10, the light collecting member 11 joined to the frame body 10 is affected by the heat generated by the photoelectric conversion element 9. It becomes difficult to receive. As a result, the heat conducted from the frame 10 to the light collecting member 11 can be reduced. By making the condensing member 11 less susceptible to heat, a decrease in condensing efficiency due to thermal expansion of the condensing member 11 is suppressed. That is, a decrease in light collection efficiency due to a variation in height between the light collecting member 11 and the photoelectric conversion element 9 and a positional shift of irradiation light to the photoelectric conversion element 9 is suppressed.

  Further, for example, when a large amount of heat is conducted from the frame 10 to the light collecting member 11, the connecting member 10 b that connects the frame 10 and the light collecting member 11 is affected by the heat, and the position shift of the light collecting member 11 is caused. There is a possibility that the light condensing performance is deteriorated due to the positional deviation of the irradiation light from the light collecting member 11 to the photoelectric conversion element 9. According to the present embodiment, the heat conductive substrate 12 is seen through in plan and is provided in contact with the region surrounded by the frame body 10, thereby reducing the heat conducted from the heat conductive substrate 12 to the frame body 10. be able to. As a result, since heat conducted from the frame body 10 to the light collecting member 11 can be reduced, the connection member 10b connecting the frame body 10 and the light collecting member 11 is hardly affected by heat, and the light collecting member 11 The positional deviation of the irradiation light from the condensing member 11 to the photoelectric conversion element 9 can be suppressed, and the light condensing property can be improved.

  In addition, for example, when the sunlight collected by the light collecting member 11 is irradiated in a large amount in a position shifted to a region other than the photoelectric conversion element 9, the temperature of the element mounting substrate 5 rises. According to the present embodiment, in order to efficiently dissipate heat to the heat conductive substrate 12, sunlight condensed by the light collecting member 11 is irradiated to a region other than the photoelectric conversion element 9 in a misaligned state. Moreover, the temperature rise of the element mounting substrate 5 can be suppressed. As a result, it is possible to suppress an increase in the temperature of the element mounting substrate 5 and a decrease in the conversion efficiency of the photoelectric conversion element 9 due to heat generated due to the misalignment of the concentrated sunlight.

<Method for producing photoelectric conversion module>
Here, a method for manufacturing the photoelectric conversion module 1 shown in FIG. 1 and the photoelectric conversion device 2 shown in FIG. 2 will be described.

  First, the element mounting substrate 5, the pedestal 6, and the frame 10 are prepared. When the element mounting substrate 5, the pedestal 6, and the frame 10 are made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to raw powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. Add and mix to obtain a mixture. The mixture of the element mounting substrate 5, the pedestal 6 and the frame 10 is filled with the mixture and dried, and then the element mounting substrate 5, the pedestal 6 and the frame 10 before being sintered are taken out.

  Moreover, a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste.

  Then, a metal paste is applied to one main surface of the taken-out element mounting substrate 5 before sintering using, for example, a screen printing method to form a metallized layer that becomes the first conductive pattern 7a. Further, a metal paste is applied to a region where the heat conductive substrate 12 is brought into contact with the other main surface of the element mounting substrate 5 by using, for example, a screen printing method to form a metallized layer.

  Further, the second conductive pattern 7b is formed on the uncured pedestal 6 before firing by applying a metal paste using, for example, a screen printing method. In addition, a metal paste is applied to the inclined surface of the support portion 10a of the frame 10 before sintering taken out by using, for example, a screen printing method to form a metallized layer for joining with the light collecting member 11. To do.

  Further, the pedestal 6 and the frame body 10 are placed on one main surface of the element mounting substrate 5 and pressed to bring the three members into close contact with each other. Then, by firing the three members at a temperature of about 1600 ° C., an integrated product of the element mounting substrate 5, the pedestal 6, and the frame body 10 can be manufactured. Thereafter, the thermally conductive substrate 12 is bonded to the metal mounting layer formed on the other main surface of the element mounting substrate 5 via the brazing material on the element mounting substrate 5, the pedestal 6, and the frame body 10 that are integrally fired.

  Next, in a region surrounded by the element mounting substrate 5, the pedestal 6, and the frame 10, the photoelectric conversion element 9 is mounted on the first conductive pattern 7a with, for example, a conductive epoxy resin. Then, the first conductive pattern 7a and the lower electrode of the photoelectric conversion element 9 are electrically connected. Further, the second conductive pattern 7b is electrically connected to the upper surface electrode of the photoelectric conversion element 7 through a conductive wire. And the condensing member 11 is joined to the support part 10a of the frame 10 via solder. In this way, the photoelectric conversion device 2 can be manufactured.

  Next, a method for manufacturing the photoelectric conversion module 1 will be described. First, a plurality of photoelectric conversion devices 2 and an external substrate 4 are prepared. Here, a method of connecting the two photoelectric conversion devices 2 will be described. Both are arrange | positioned so that the 1st output terminal 8a of one photoelectric conversion apparatus 2 and the 2nd output terminal 8b of the other photoelectric conversion apparatus 2 may adjoin. Then, the two arranged photoelectric conversion devices 2 are provided on the external substrate 4, and the two arranged photoelectric conversion devices 2 are connected via a connecting member. As a result, the two photoelectric conversion devices 2 can be fixed to the external substrate 4.

  In this way, the photoelectric conversion device 2 can be fixed to the external substrate 4. Similarly, a plurality of photoelectric conversion devices 2 are arranged and fixed on the external substrate 4. And the photoelectric conversion module 1 can be produced by providing the light receiving member 3 on the plurality of photoelectric conversion devices 2 arranged on the external substrate 4.

<Modification>
The present invention is not limited to the above-described embodiments, and various changes and improvements can be made without departing from the scope of the present invention. Hereinafter, modifications of the present embodiment will be described. Note that, in the photoelectric conversion device according to the modification of the present embodiment, the same portions as those of the photoelectric conversion device 2 according to the present embodiment are denoted by the same reference numerals, and description thereof is omitted as appropriate.

<Modification 1>
In the photoelectric conversion device 2 according to the above embodiment, the first conductive pattern 7a is formed on one main surface of the element mounting substrate 5, the second conductive pattern 7b is formed on the pedestal 6, and the frame body 10 is formed thereon. Although it is set as the structure to arrange, it is not restricted to this. As shown in FIG. 6, a structure in which the first conductive pattern 7 a and the second conductive pattern 7 b are formed on one main surface of the element mounting substrate 5, and the frame body 10 is arranged on one main surface of the element mounting substrate 5. It may be. As a result, the photoelectric conversion device 2 has a structure constituted by the element mounting substrate 5 and the frame body 10 and does not use the pedestal 6, so that the manufacturing process can be reduced.

<Modification 2>
In the photoelectric conversion device 2 according to the above-described embodiment, the heat conductive substrate 12 is provided so as to come into contact with a region surrounded by the frame body 10 as seen through a plane, but is not limited thereto. As shown in FIG. 7, the heat conductive substrate 12 is provided so that the heat conductive substrate 12 comes into contact with a region surrounded by the frame body 10 in a plan view. A part of both side surfaces protrudes in a direction along the other main surface of the element mounting substrate 5, and has an extending portion 13 provided to be spaced from the other main surface of the element mounting substrate 5.

  As shown in FIG. 8, the photoelectric conversion device 2 increases the area of the lower surface facing the upper surface of the thermal conductive substrate 12 in contact with the element mounting substrate 5, and the thermal conductive substrate 12 is seen through the plane. In the region surrounded by the frame 10, that is, as shown in FIG. 8B, it is provided in contact with the element mounting substrate 5 in the region surrounded by the alternate long and short dash line. Furthermore, the extending portion 13 of the heat conductive substrate 12 is provided with a gap A1 between the other main surface of the element mounting substrate 5 as shown in FIG. 8C. The heat conductive substrate 12 is preferably in contact with the other main surface of the element mounting substrate 5 only in a region surrounded by the frame body 10 in a plan view. The extending portion 13 is preferably provided with a gap A <b> 1 between the lower surface of the frame body 10 and the other main surface of the element mounting substrate 5 in a plan view.

  The photoelectric conversion device 2 improves the stability of the photoelectric conversion device 2 when it is fixed on the external substrate 4 by increasing the area of the lower surface from the upper surface of the thermally conductive substrate 12 that contacts the element mounting substrate 5. be able to. Further, by providing a screw hole in the heat conductive substrate 12 and fastening the screw to the external substrate 4 directly to fix the heat conductive substrate 12, simpler fixing can be performed.

  Moreover, the heat | fever transmitted from the heat conductive board | substrate 12 to the frame 10 can be suppressed by having space | gap A1 between the other main surfaces of the element mounting board | substrate 5. FIG. As a result, the influence of the heat generated in the photoelectric conversion element 9 is suppressed in the light collecting member 11 bonded to the frame body 10.

  Further, by having the gap A <b> 1 between the other main surface of the element mounting substrate 5, the heat generated from the photoelectric conversion element 9 can be effectively dissipated to the outside through the thermally conductive substrate 12.

  The thermal conductivity of the thermally conductive substrate 12 is set to, for example, 100 W / (m · K) or more and 500 W / (m · K) or less. Further, as shown in FIG. 8B, when the heat conductive substrate 12 is seen through a plane, the distance M between the heat conductive substrate 12 and the frame body 10 is the suppression of heat conduction to the light collecting member 11. Therefore, M1 is 0.1 mm to 3.0 mm, M2 is 0.1 mm to 3.0 mm, M3 is 0.1 mm to 3.0 mm, and M4 is 0.1 mm to 3.0 mm. Each of the following is preferably set.

  Further, as shown in FIG. 8C, the thickness T2 of the heat conductive substrate 12 is 0. 0 in terms of relaxation of bonding stress due to a difference in thermal expansion coefficient between the element mounting substrate 5 and the heat conductive substrate 12. It is preferably set to 1 mm or more and 1.0 mm or less.

  Further, the gap A1 between the other main surface of the element mounting substrate 5 is preferably set to 0.1 mm or more and 3.0 mm or less in terms of suppressing heat conduction to the light collecting member 11.

  In FIG. 8, a part of both side surfaces of the heat conductive substrate 12 protrudes in a direction along the other main surface of the element mounting substrate 5, and is provided to be spaced from the other main surface of the element mounting substrate 5. Although it has the existing part 13, it is not restricted to this. A part of one side surface of the heat conductive substrate 12 protrudes in a direction along the other main surface of the element mounting substrate 5, and an extending portion 13 provided to be spaced from the other main surface of the element mounting substrate 5. And a part of the other side surface of the heat conductive substrate 12 may be provided in a region surrounded by the frame body 10 in a plan view. The heat conductive substrate 12 is preferably brought into contact with the other main surface of the element mounting substrate 5 only in a region surrounded by the frame body 10 as seen in a plan view.

<Modification 3>
In the photoelectric conversion device 2 of Modification 2 described above, the thermally conductive substrate 12 projects part of both side surfaces of the thermally conductive substrate 12 in a direction along the other main surface of the element mounting substrate 5, and the element mounting substrate. Although it has the extension part 13 provided in gap with the other main surface of 5, it is not restricted to this. As shown in FIG. 9, the heat conductive substrate 12 is provided so that the heat conductive substrate 12 abuts within a region surrounded by the frame body 10 as seen through a plane. Further, a part of both side surfaces of the heat conductive substrate 12 protrudes in a direction along the other main surface of the element mounting substrate 5, and an extending portion provided to be spaced from the other main surface of the element mounting substrate 5. 13 and has a cutout portion so that the extending portion 13 of the thermally conductive substrate 12 does not overlap the first output terminal 8a and the second output terminal 8b as seen in a plan view.

  As shown in FIG. 9, the photoelectric conversion device 2 increases the area of the lower surface facing the upper surface of the heat conductive substrate 12 in contact with the element mounting substrate 5, and the heat conductive substrate 12 is seen through the plane. In the region surrounded by the frame 10, that is, as shown in FIG. 9B, it is provided in contact with the element mounting substrate 5 in the region surrounded by the alternate long and short dash line. Further, as shown in FIG. 9C, the extending portion 13 of the thermally conductive substrate 12 is provided with a gap A <b> 2 between the other main surface of the element mounting substrate 5. The heat conductive substrate 12 is preferably in contact with the other main surface of the element mounting substrate 5 only in a region surrounded by the frame body 10 in a plan view. The extending portion 13 is preferably provided with a gap A <b> 1 between the lower surface of the frame body 10 and the other main surface of the element mounting substrate 5 in a plan view.

  The photoelectric conversion device 2 improves the stability of the photoelectric conversion device 2 when it is fixed on the external substrate 4 by increasing the area of the lower surface from the upper surface of the thermally conductive substrate 12 that contacts the element mounting substrate 5. be able to. Further, by providing a screw hole in the heat conductive substrate 12 and fastening the screw to the external substrate 4 directly to fix the heat conductive substrate 12, simpler fixing can be performed.

  Moreover, the heat | fever transmitted from the heat conductive board | substrate 12 to the frame 10 can be suppressed by having space | gap A2 between the other main surfaces of the element mounting board | substrate 5. FIG. As a result, the influence of the heat generated in the photoelectric conversion element 9 is suppressed in the light collecting member 11 bonded to the frame body 10.

  In addition, by having the gap A <b> 2 between the other main surface of the element mounting substrate 5, the heat generated from the photoelectric conversion element 9 can be effectively dissipated to the outside through the thermally conductive substrate 12.

  Further, a part of the heat conductive substrate 12 is cut into a part of the extending portion 13 of the heat conductive substrate 12 so as not to overlap the first output terminal 8a and the second output terminal 8b when seen in a plan view. Since it has a notch, the thermal conductive substrate 12 is prevented from being electrically short-circuited between the thermal conductive substrate 12, the first output terminal 8a, and the second output terminal 8b. Can do.

  The thermal conductivity of the thermally conductive substrate 12 is set to, for example, 100 W / (m · K) or more and 500 W / (m · K) or less. Further, as shown in FIG. 9B, when the heat conductive substrate 12 is seen through a plane, the distance N between the heat conductive substrate 12 and the frame body 10 is the suppression of heat conduction to the light collecting member 11. N1 is 0.1 mm or more and 3.0 mm or less, N2 is 0.1 mm or more and 3.0 mm or less, N3 is 0.1 mm or more and 3.0 mm or less, and N4 is 0.1 mm or more and 3.0 mm or less. Each of the following is preferably set.

  In addition, when viewed through, the gap S between the extended portion 13 of the thermally conductive substrate 12 and the first output terminal 8a and the second output terminal 8b is equal to the extended portion 13 of the thermally conductive substrate 12 and the first output terminal 8b. S1 is 0.1 mm or more and 3.0 mm or less, S2 is 0.1 mm or more and 3.0 mm or less, and S3 is 0. 0 mm or less in terms of electrical insulation between the first output terminal 8a and the second output terminal 8b. 1 mm to 3.0 mm, and S4 is preferably set to 0.1 mm to 3.0 mm.

  Further, as shown in FIG. 9C, the thickness T3 of the heat conductive substrate 12 is 0. 0 in terms of relaxation of bonding stress due to a difference in thermal expansion coefficient between the element mounting substrate 5 and the heat conductive substrate 12. It is preferably set to 1 mm or more and 1.0 mm or less.

  In addition, the gap A2 between the other main surface of the element mounting substrate 5 is preferably set to 0.1 mm or more and 3.0 mm or less in terms of suppressing heat conduction to the light collecting member 11.

  In FIG. 9, a part of both side surfaces of the heat conductive substrate 12 protrudes in a direction along the other main surface of the element mounting substrate 5, and the extension provided to be spaced from the other main surface of the element mounting substrate 5. Although it has the existing part 13, it is not restricted to this. A part of one side surface of the heat conductive substrate 12 protrudes in a direction along the other main surface of the element mounting substrate 5, and an extending portion 13 provided between the other main surface of the element mounting substrate 5 is provided. And a part of the other side surface of the heat conductive substrate 12 may be provided in a region surrounded by the frame body 10 in a plan view. The heat conductive substrate 12 is preferably brought into contact with the other main surface of the element mounting substrate 5 only in a region surrounded by the frame body 10 as seen in a plan view.

DESCRIPTION OF SYMBOLS 1 Photoelectric conversion module 2 Photoelectric conversion apparatus 3 Light reception member 3a Frame member 3b Lens member 4 External substrate 5 Element mounting substrate 6 Base 7a 1st conductive pattern 7b 2nd conductive pattern 8a 1st output terminal 8b 2nd output terminal DESCRIPTION OF SYMBOLS 9 Photoelectric conversion element 10 Frame 10a Support part 10b Joining member 11 Condensing member 12 Thermal conductive substrate 13 Extension part SP Space A1, A2 Space | gap S1-S4 Gap T1-T3 Thermal conductive substrate thickness L1-L4 Frame Distance M1-M4 between frame and heat conductive substrate Distance N1-N4 between frame and heat conductive substrate Distance between frame and heat conductive substrate

Claims (5)

An element mounting substrate;
A photoelectric conversion element provided on one main surface of the element mounting substrate;
A frame provided to surround the photoelectric conversion element on one main surface of the element mounting substrate;
A condensing member that is joined to the frame and provided above the photoelectric conversion element via a space;
A heat conductive substrate provided in contact with the other main surface of the element mounting substrate only in a region surrounded by the frame body in a plan view ,
A part of the side surface of the thermally conductive substrate protrudes in a direction along the other main surface of the element mounting substrate outside the contact portion with the element mounting substrate, and the other main surface of the element mounting substrate. A photoelectric conversion device having an extending portion provided away from a surface . The photoelectric conversion device according to claim 1,
A photoelectric conversion device characterized by having a first output terminal and a second output terminal that are electrically connected to the photoelectric conversion element and take out the output of the photoelectric conversion element to the outside . The photoelectric conversion device according to claim 2,
The photoelectric conversion device, wherein the extension part extends to a region outside the frame body as seen through a plane. An element mounting substrate having a mounting portion on which a photoelectric conversion element is mounted;
A frame provided on one principal surface of the element mounting substrate so as to surround the mounting portion;
A condensing member that is joined to the frame body and provided at a position higher than the planned mounting position of the photoelectric conversion element;
A heat conductive substrate provided in contact with the other main surface of the element mounting substrate only in a region surrounded by the frame body in a plan view ,
A part of the side surface of the thermally conductive substrate protrudes in a direction along the other main surface of the element mounting substrate outside the contact portion with the element mounting substrate, and the other main surface of the element mounting substrate. A package for storing photoelectric conversion elements, characterized in that it has an extending portion provided away from the surface . A photoelectric conversion device according to any one of claims 1 to 3,
A light receiving member provided on the photoelectric conversion device and collecting light on the light collecting member;
A photoelectric conversion module comprising:

Images