JP5401059B2 - Semiconductor device, terminal lead frame, connector frame, and semiconductor device manufacturing method - Google Patents

Description

  The present invention relates to a semiconductor device having a structure in which a semiconductor element is sealed with a mold resin portion, a terminal lead frame and a connector frame used in the manufacture thereof, and a method of manufacturing the semiconductor device.

In a conventional semiconductor device, for example, as shown in FIGS. 18 and 19, each electrode on the upper and lower surfaces of a semiconductor element 101 formed in a plate shape is electrically connected to a plate-like first lead terminal 102 and second lead terminal 103, respectively. There is one in which these semiconductor elements 101 and two lead terminals 102 and 103 are sealed with a mold resin portion 104 (see Patent Document 1). In this semiconductor device, the two lead terminals 102 and 103 are exposed on the lower surface of the mold resin portion 104 so that the semiconductor device can be surface-mounted on the circuit board.
In this semiconductor device, the semiconductor element 101 is fixed to the first lead terminal 102 so that the semiconductor element 101 is electrically connected to the first lead terminal 102, and the upper surface of the semiconductor element 101 and the upper surface of the second lead terminal 103 are The semiconductor element 101 is electrically connected to the second lead terminal 103 by arranging the plate-like connector 105 over the second lead terminal 103.

Further, in this semiconductor device, the two lead terminals 102 and 103 are drawn out so as to be exposed on the first side face 104a of the mold resin portion 104 facing the arrangement direction. Further, the first lead terminal 102 and the connector 105 are integrally formed with leading portions 106 and 107 extending in a direction orthogonal to the arrangement direction, respectively, and the second of the mold resin portion 104 facing the orthogonal direction. The side surface 104b is exposed.
When manufacturing the semiconductor device having this configuration, the first lead terminal 102 and the second lead terminal 103 are configured by a terminal plate integrally formed in the arrangement direction, and the terminal plate is formed by the first lead-out portion 106. A lead frame for terminals connected in a number in the direction orthogonal to the arrangement direction is used. Also, a connector frame in which a number of connectors 105 are connected in the orthogonal direction by the second lead-out portion 107 is used.

When manufacturing a semiconductor device using the terminal lead frame and the connector frame, after arranging the connector frame in a state where the semiconductor element 101 is fixed to each terminal plate of the terminal lead frame, A large number of terminal boards, semiconductor elements 101 and connectors 105 are collectively sealed by the mold resin portion 104. Then, the terminal plate is cut together with the mold resin portion 104 so that the first side surface 104a is formed, and further, the first lead portion 106 and the second lead portion are formed together with the mold resin portion 104 so that the second side surface 104b is formed. By cutting 107, an individual semiconductor device can be obtained.
Japanese Patent Laying-Open No. 2005-277231

By the way, there are cases where a plurality of semiconductor devices of this type are mounted on the same circuit board. However, in order to mount a plurality of semiconductor devices individually, it is necessary to arrange them at intervals on the circuit board. For this reason, there is a problem in that the mounting area of the plurality of semiconductor devices on the circuit board is increased, and downsizing of an electronic apparatus including the plurality of semiconductor devices is hindered.
On the other hand, in order to reduce the mounting area described above, it is conceivable to mount a plurality of semiconductor elements 101 on a circuit board in a state where they are sealed with the same mold resin portion 104, that is, in a state where a plurality of semiconductor devices are connected. . However, if a plurality of semiconductor devices are connected in the conventional method for manufacturing a semiconductor device, there is a problem that semiconductor devices adjacent to each other are electrically connected.

  The present invention has been made in view of the above-described circumstances, and a semiconductor device capable of reducing the mounting area of a plurality of semiconductor devices on a circuit board and reducing the size of an electronic apparatus including the plurality of semiconductor devices, and its manufacture It is an object of the present invention to provide a lead frame for a terminal, a connector frame, and a method for manufacturing a semiconductor device.

In order to solve this problem, a lead frame for a terminal according to the present invention includes a semiconductor element formed in a plate shape and having electrodes on the upper surface and the lower surface, and a first semiconductor element formed in a plate shape and disposed on the upper surface. A lead terminal; a second lead terminal formed in a plate shape and spaced apart in a plane direction of the first lead terminal; and a plate-shaped and the semiconductor element and the second lead terminal A lead frame for a terminal for use in manufacturing a plurality of semiconductor devices comprising a connector for electrically connecting the semiconductor element and the second lead terminal to each other by being disposed over an upper surface, wherein the first lead terminal And a plurality of terminal plates formed integrally with the second lead terminals, and a terminal connection structure for connecting the plurality of terminal plates to each other, and the plurality of terminal plates are directly aligned along the surface direction. The first lead terminals of one terminal board are arranged in the extending direction of a terminal cutting planned line extending in a shape and dividing each terminal board into the first lead terminal and the second lead terminal. And the second lead terminals of the other terminal plates are also arranged in a direction orthogonal to the extending direction of the terminal cutting planned line so as to face each other with a space therebetween, and the terminal connection structure is the terminal cutting structure A first connecting plate portion that connects two terminal plates adjacent to each other in the direction in which the planned line extends, a frame frame disposed around the surface direction of the plurality of terminal plates, and the extended terminal cutting line A second connecting plate portion that extends in a direction and connects the terminal plate adjacent to the frame frame to the frame frame, the first connecting plate portion, the first connecting plate portion having both ends in the longitudinal direction thereof It is arranged outside the terminal cutting planned line in the width direction and each end On connected to the first lead terminal or the second lead terminal plate, and characterized in that it intersects the terminal cutting line.

  The semiconductor device manufacturing method of the present invention is a method of manufacturing a semiconductor device using the terminal lead frame, wherein the semiconductor element is fixed on the first lead terminal of each terminal plate. An arrangement step; an upper surface of the semiconductor element arranged on one terminal plate; and a second lead terminal of another terminal plate arranged at an interval from the first lead terminal of the one terminal plate. A connector mounting step for fixing the connector over the upper surface, a molding step for collectively sealing the plurality of terminal plates, the semiconductor elements and the connectors with the mold resin portion, and the second connecting plate portion. And cutting the frame frame to cut the mold resin portion along the terminal cutting planned line.

According to the lead frame for terminals of the present invention and the method for manufacturing a semiconductor device of the present invention, since the terminal plate and the first connecting plate portion are simultaneously cut in the cutting step, all the first lead terminals and the second leads are cut. The terminals are electrically isolated from each other. That is, all the semiconductor elements are electrically insulated from each other.
And, in this cutting step, when the mold resin part is cut in the orthogonal cutting planned line that extends linearly in the direction orthogonal to the terminal cutting planned line and passes between adjacent terminal plates in the extending direction of the terminal cutting planned line A semiconductor device in which one semiconductor element is sealed with a mold resin portion (hereinafter referred to as a single semiconductor device) can be manufactured.
On the other hand, when the mold resin portion is not cut along the orthogonal cutting line, a semiconductor device having an array structure in which a plurality of semiconductor elements are sealed with the same mold resin portion can be manufactured. That is, since a plurality of semiconductor elements sealed by the same mold resin part are electrically insulated from each other, a plurality of single semiconductor devices can be manufactured in a connected state.

  Furthermore, the semiconductor device of the present invention is a semiconductor device manufactured by the manufacturing method, wherein the first lead terminal, the second lead terminal, and the first connecting plate portion are cut at the terminal cutting planned line. It is exposed to the cut surface of a mold resin part.

  The connector frame of the present invention is a connector frame used when manufacturing a plurality of the semiconductor devices together with the terminal lead frame, wherein each connector is on the first lead terminal of one terminal plate. The connector adjacent to each other is connected by a connector connecting plate portion so that the connector connecting plate portion is arranged over the second lead terminals of other terminal plates arranged opposite to each other. Crossing the terminal cutting planned line.

When manufacturing a semiconductor device using this connector frame, a plurality of connectors can be simultaneously attached to the upper surfaces of a plurality of semiconductor elements by simply overlapping the connector frame on the terminal lead frame. Therefore, the manufacturing efficiency of the semiconductor device is improved.
Moreover, in the state before cutting the mold resin portion in the terminal cutting planned line, since the plurality of connectors are connected by the connector connecting plate portion, the time until the plurality of connectors are sealed by the mold resin portion. In addition, it is possible to easily prevent the displacement of each connector with respect to the semiconductor element and the second lead terminal. Furthermore, it is possible to easily prevent the connector from being bonded to the upper surface of the semiconductor element or the second lead terminal in a state where the connector is inclined with respect to the upper surface of the semiconductor element or the second lead terminal. can do. Therefore, electrical reliability in the semiconductor device can be improved.
In addition, since the connector connecting plate portion intersects the terminal cutting planned line, the connectors of the semiconductor devices adjacent to each other are electrically insulated when the mold resin portion is cut along the terminal cutting planned line. Can do. Therefore, even if this connector frame is used, the semiconductor device having the array structure described above can be manufactured.

According to the present invention, it is possible to manufacture not only a single semiconductor device in which one semiconductor element is sealed with a mold resin portion, but also a plurality of single semiconductor devices connected to each other with the same mold resin portion.
In addition, according to the number of single semiconductor devices to be mounted on the circuit board, a plurality of single semiconductor devices can be collectively mounted on the circuit board in a connected state, so that a plurality of single semiconductor devices on the circuit board can be mounted. Thus, it is possible to reduce the mounting area of the electronic apparatus including a plurality of single semiconductor devices.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
The semiconductor devices 1 and 2 according to this embodiment generally include a semiconductor element 3, a first lead terminal 5, a second lead terminal 7, a connector 9, and a mold resin portion 11 as shown in FIGS. It is configured. The semiconductor element 3 is formed in a plate shape, and is configured to have electrodes on the upper surface 3a and the lower surface 3b. The first lead terminal 5, the second lead terminal 7, and the connector 9 function as electrical wiring for drawing out the electrode of the semiconductor element 3 embedded in the mold resin portion 11 to the outside of the mold resin portion 11. , Formed of a conductive material such as a copper material.

The first lead terminal 5 is formed in a plate shape, and the semiconductor element 3 is disposed on the upper surface 5 a of the first lead terminal 5. As a result, the electrode on the lower surface 3 b of the semiconductor element 3 is electrically connected to the first lead terminal 5. The first lead terminal 5 has a recess 5c that is recessed from the lower surface 5b. The recess 5c is formed so that the lower surface 5b of the first lead terminal 5 has a U-shape in plan view.
The second lead terminal 7 is formed in a plate shape like the first lead terminal 5, and is arranged at a distance from the first lead terminal 5 in the surface direction. The second lead terminal 7 has an upper surface 7 a located in the same plane as the upper surface 5 a of the first lead terminal 5, and a lower surface 7 b located in the same plane as the lower surface 5 b of the first lead terminal 5. Are arranged to be. Further, like the first lead terminal 5, the second lead terminal 7 has a concave portion 7c that is recessed from the lower surface 7b, and the lower surface 7b of the second lead terminal 7 is U-shaped in plan view. It is formed to become.

The connector 9 is for electrically connecting the electrode on the upper surface of the semiconductor element 3 and the second lead terminal 7 to each other, and is composed of two metal pieces 13 and 15.
The second metal piece 15 is formed in a thick plate shape having a thickness dimension equivalent to that of the semiconductor element 3, and is disposed on the upper surface 7 a of the second lead terminal 7. The first metal piece 13 is formed in a plate shape, and is arranged over the upper surface 3 a of the semiconductor element 3 and the upper surface 15 a of the second metal piece 15. That is, the first metal piece 13 is disposed so as to extend from the upper surface 3 a of the semiconductor element 3 to the upper surface 7 a of the second lead terminal 7 in plan view.
Since the second metal piece 15 is set to the same thickness as the semiconductor element 3, the second metal piece 15 is formed on the upper surface 3 a of the semiconductor element 3 disposed on the first lead terminal 5 and on the second lead terminal 7. The upper surface 15a of the arranged second metal piece 15 is located in the same plane. Therefore, the plate-like first metal piece 13 can be disposed over the upper surfaces 3a and 15a of the semiconductor element 3 and the second metal piece 15 in a stable state.

The mold resin portion 11 is formed in a rectangular parallelepiped shape. Inside the mold resin portion 11, the semiconductor element 3, the first lead terminal 5, the second lead terminal 7, the first metal piece 13, and the second metal piece 15 are described. Is buried. The lower surfaces 11 b of the first lead terminal 5 and the second lead terminal 7 are exposed on the lower surface 11 b of the mold resin portion 11. In the present embodiment, the lower surface 11b of the mold resin portion 11 and the lower surfaces 5b and 7b of the first lead terminal 5 and the second lead terminal 7 are located in the same plane, and the first lead terminal 5 and A mold resin portion 11 is also formed in the recesses 5 c and 7 c of the second lead terminal 7.
The lower surfaces 5b and 7b of the first lead terminal 5 and the second lead terminal 7 form external terminal surfaces for electrically connecting the semiconductor element 3 to a circuit board (not shown) on which the semiconductor devices 1 and 2 are mounted. Yes.

The semiconductor devices 1 and 2 generally configured as described above include a terminal lead frame 21 shown in FIGS. 1 to 3, a first metal piece frame 31 shown in FIGS. 4 to 6, and a first lead shown in FIGS. A plurality of two metal piece frames 41 can be used to manufacture a plurality of frames at the same time.
The terminal lead frame 21, the first metal piece frame 31, and the second metal piece frame 41 are all conductive plate materials such as metal plate materials (hereinafter referred to as conductive plate materials). It can be manufactured by subjecting this conductive plate material to pressing or etching.

As shown in FIGS. 1 to 3, the terminal lead frame 21 connects a plurality of terminal plates 22 formed by integrally forming the first lead terminals 5 and the second lead terminals 7 and the plurality of terminal plates 22 to each other. And a terminal connection structure 23.
The plurality of terminal boards 22 are arranged at intervals in the vertical and horizontal directions along the surface direction of the conductive plate material. More specifically, the plurality of terminal plates 22 are arranged at intervals in the extending direction (Y direction) of the terminal cutting planned line L1 that is cut into the first lead terminal 5 and the second lead terminal 7. The terminal cutting planned line L1 extends linearly along the surface direction of the conductive plate material. In addition, the plurality of terminal plates 22 have a terminal cutting planned line L1 such that the first lead terminal 5 of one terminal plate 22 and the second lead terminal 7 of the other terminal plate 22 face each other with a space therebetween. It is also arranged in a direction (X direction) orthogonal to the extending direction.

The terminal connection structure 23 includes a plurality of first connection plate portions 24 that connect two terminal plates 22 adjacent to each other in the Y direction, a frame frame 25 disposed around the surface direction of the plurality of terminal plates 22, and A plurality of second connecting plate portions 26 that connect the frame frame 25 and the terminal plate 22 adjacent to each other in the Y direction to the frame frame 25 are provided.
In addition, between the two terminal boards 22 adjacent in the Y direction, it extends linearly in the X direction, cuts the first connecting plate part 24, and divides the two terminal boards 22 adjacent in the Y direction. For this purpose, the first orthogonal cutting planned line L2 passes through. Further, between the terminal plate 22 and the frame frame 25 connected by the second connecting plate portion 26, it extends linearly in the X direction, and the second connecting plate portion 26 is cut to connect the frame frame 25 to the terminal. A second orthogonal cutting planned line L3 that is cut off from the plate 22 passes therethrough.

The first connecting plate portion 24 is formed to be bent so as to intersect the terminal cutting planned line L1. Specifically, the first connecting plate portion 24 is connected to the other terminal plate 22 from the first lead terminal 5 of one terminal plate 22 along the terminal cutting planned line L1 with respect to two terminal plates 22 adjacent in the Y direction. A first projecting portion 24a projecting toward the terminal plate, a second projecting portion 24b projecting from the second lead terminal 7 of the other terminal plate 22 toward the one terminal plate 22 along the terminal cutting planned line L1, and two And a crossing portion 24c that connects the tip portions of the protruding portions.
Here, the 1st protrusion part 24a and the 2nd protrusion part 24b are arrange | positioned in the width direction outer side of the terminal cutting plan line L1, and the front-end | tip part is arrange | positioned inside the 1st orthogonal cutting plan line L2. . The intersecting portion 24c extends in the X direction and is orthogonal to the terminal cutting planned line L1.
The second connecting plate portion 26 is formed to extend in the Y direction, and is connected to the first lead terminal 5 of the terminal plate 22 adjacent to the frame frame 25. This 2nd connection board part 26 is arrange | positioned on the outer side of the terminal cutting planned line L1, and is orthogonally crossed to the 2nd orthogonal cutting planned line L3.

Further, the terminal connection structure 23 of the terminal lead frame 21 has the above-described configuration, and reinforcing connection plate portions 27A and 27B for suppressing torsional deformation and the like of the first connection plate portion 24 and the second connection plate portion 26. It also has.
The reinforcing connecting plate portions 27A and 27B are formed to extend in the Y direction. Similarly to the first connecting plate portion 24 and the second connecting plate portion 26 described above, two terminal plates 22 adjacent in the Y direction, or The frame frame 25 and the terminal plate 22 adjacent to each other in the Y direction are connected to each other. The reinforcing connecting plate portions 27A and 27B are arranged at positions overlapping the terminal cutting planned line L1, and the width dimension thereof is set smaller than the width dimension of the terminal cutting planned line L1. That is, the reinforcing connecting plate portions 27A and 27B are scraped off when the terminal lead frame 21 is cut along the terminal cutting planned line L1.
Note that the reinforcing connecting plate portion 27 </ b> A that connects the two terminal plates 22 adjacent in the Y direction is orthogonal to the intersecting portion 24 c of the first connecting plate portion 24.

Among the terminal lead frames 21 configured as described above, a part of the terminal plate 22, the first connecting plate portion 24, the second connecting plate portion 26, and the reinforcing connecting plate portions 27A and 27B (hatched portions in FIG. 2). Is formed so as to be recessed from the lower surface of the conductive plate by, for example, etching, and is formed thinner than the thickness of the conductive plate.
In addition, about the terminal board 22, the other part of the terminal board 22 is dented so that the lower surface 22b of the terminal board 22 which consists of a lower surface of an electroconductive board | plate material may become a rectangular frame shape by planar view. Here, since the rectangular frame-shaped lower surface 22b is formed across the first lead terminal 5 and the second lead terminal 7 of the terminal plate 22, when the terminal plate 22 is cut along the terminal cutting planned line L1, the semiconductor The lower surfaces 5b and 7b of the first lead terminal 5 and the second lead terminal 7 described in the configuration of the devices 1 and 2 in a U shape in plan view appear. That is, the portion of the terminal plate 22 formed so as to be recessed from the lower surface of the conductive plate material is the recesses 5c and 7c in the first lead terminal 5 and the second lead terminal 7 of the semiconductor devices 1 and 2 (see FIGS. 13 to 17). Will be formed.

As shown in FIGS. 4 to 6, the first metal piece frame 31 includes a plurality of first metal pieces 13 and a plurality of third connection plate portions (connector connection) that connect the first metal pieces 13 adjacent to each other. Plate portion) 32.
In the state where the first metal piece frame 31 is stacked on the terminal lead frame 21, the plurality of first metal pieces 13 are arranged on the first lead terminal 5 of the one terminal plate 22. Are arranged so as to be spaced apart from each other so as to be arranged over the second lead terminals 7 of the other terminal boards 22 arranged opposite to each other (see FIG. 11). That is, the plurality of first metal pieces 13 are arranged at intervals in the vertical and horizontal directions along the surface direction of the conductive plate material, similarly to the plurality of terminal plates 22. More specifically, the plurality of first metal pieces 13 are arranged at intervals in the extending direction (Y direction) of the terminal cutting planned line L1 and are orthogonal to the extending direction of the terminal cutting planned line L1. They are also arranged at intervals in the direction (X direction).

Each third connecting plate portion 32 connects two first metal pieces 13 adjacent to each other in the Y direction, like the first connecting plate portion 24 of the lead frame 21 for terminals, and the terminal cutting planned line L1. Crossed. More specifically, each of the third connecting plate portions 32 connects one end portions of the first metal piece 13 disposed on the second lead terminal 7 and is plural times with respect to the terminal cutting planned line L1. It is formed to be bent so as to intersect (twice in the illustrated example).
Similarly to the terminal lead frame 21, the first metal piece frame 31 is adjacent to the frame frame 33 arranged around the surface direction of the plurality of first metal pieces and the frame frame 33 in the Y direction. A plurality of fourth connecting plate portions 34 for connecting the first metal pieces 13 to the frame frame 33 are provided.
The fourth connecting plate portion 34 is formed to be bent so as to individually intersect with the terminal cutting planned line L1 and the second orthogonal cutting planned line L3, and like the third connecting plate portion 32, the first metal is formed. It is connected to one end of the piece 13.

Further, the first metal piece frame 31 also includes reinforcing connection plate portions 35A and 35B for suppressing torsional deformation and the like of the third connection plate portion 32 and the fourth connection plate portion 34.
The reinforcing connecting plate portions 35A and 35B are, like the third connecting plate portion 32 and the fourth connecting plate portion 34, two first metal pieces 13 adjacent in the Y direction, or the frame frame 33 adjacent in the Y direction and The first metal pieces 13 are connected to each other and are formed to extend in the Y direction. Each of the reinforcing connecting plate portions 35A and 35B is arranged at a position overlapping the terminal cutting planned line L1, and the width dimension thereof is set smaller than the width dimension of the terminal cutting planned line L1. That is, the reinforcing connecting plate portions 35A and 35B are scraped off when the first metal piece frame 31 is cut along the terminal cutting planned line L1.
Note that the reinforcing connecting plate portion 35 </ b> A that connects the two first metal pieces 13 adjacent to each other in the Y direction is formed so as to intersect with a part of the third connecting plate portion 32.

Of the first metal piece frame 31 configured as described above, a part of the first metal piece 13, the third connecting plate portion 32, the fourth connecting plate portion 34, and the reinforcing connecting plate portions 35A and 35B (FIG. 5). Is formed so as to be recessed from the lower surface of the conductive plate by etching, for example, and is formed thinner than the thickness of the conductive plate.
In addition, about the 1st metal piece 13, the 1st metal piece 13 is formed so that the lower surface 13b of the 1st metal piece 13 which consists of the lower surface of an electroconductive board | plate material may be formed in the both ends of the longitudinal direction (X direction). The other part is formed to be depressed. The two lower surfaces 13b positioned at both ends of the first metal piece 13 form contact surfaces that contact the upper surfaces 3a and 15a of the semiconductor element 3 and the second metal piece 15, respectively.

The second metal piece frame 41 is formed in a thicker plate shape than the terminal lead frame 21 and the first metal piece frame 31, as shown in FIGS. And a plurality of fifth connecting plate portions (connector connecting plate portions) 42 for connecting the second metal pieces 15 adjacent to each other.
The plurality of second metal pieces 15 are arranged on the second lead terminals 7 of the terminal plates 22 in a state where the second metal piece frame 41 is overlaid on the terminal lead frame 21. As shown in FIG. 11, they are arranged with mutual intervals set. That is, the plurality of second metal pieces 15 are arranged at intervals in the vertical and horizontal directions along the surface direction of the conductive plate material, similarly to the plurality of terminal plates 22. More specifically, the plurality of second metal pieces 15 are arranged at intervals in the extending direction (Y direction) of the terminal cutting planned line L1 and are orthogonal to the extending direction of the terminal cutting planned line L1. They are also arranged at intervals in the direction (X direction).

Each fifth connection plate portion 42 connects two second metal pieces 15 adjacent to each other in the Y direction, similarly to the first connection plate portion 24 of the lead frame 21 for terminals, and the terminal cutting planned line L1. Crossed. More specifically, each fifth connecting plate portion 42 is formed to be bent so as to intersect the terminal cutting planned line L1 a plurality of times (twice in the illustrated example).
Similarly to the terminal lead frame 21, the second metal piece frame 41 is adjacent to the frame frame 43 disposed around the surface direction of the plurality of second metal pieces 15 and the frame frame 43 in the Y direction. A plurality of sixth connecting plate portions 44 for connecting the matching second metal pieces 15 to the frame frame 43 are provided.
The sixth connecting plate portion 44 is formed to be bent so as to individually intersect the terminal cutting planned line L1 and the second orthogonal cutting planned line L3.

Further, the first metal piece frame 31 includes reinforcing connection plate portions 45A and 45B for suppressing torsional deformation and the like of the fifth connection plate portion 42 and the sixth connection plate portion 44 in addition to the above-described configuration. Yes.
The reinforcing connecting plate portions 45A and 45B are the two second metal pieces 15 adjacent to each other in the Y direction, or the frames adjacent to each other in the Y direction, like the fifth connecting plate portion 42 and the sixth connecting plate portion 44 described above. The frame 43 and the second metal piece 15 are connected to each other, and are formed to extend in the extending direction of the terminal cutting planned line L1. Each reinforcement connection board part 45A, 45B is distribute | arranged to the position which overlaps with the terminal cutting planned line L1, The width dimension is set smaller than the width dimension of the terminal cutting planned line L1. That is, the reinforcing connecting plate portions 45A and 45B are scraped off when the second metal piece frame 41 is cut along the terminal cutting planned line L1.
Note that the reinforcing connection plate portion 45 </ b> A that connects the two second metal pieces 15 adjacent in the Y direction to each other is formed to intersect the fifth connection plate portion 42.

  Of the second metal piece frame 41 configured as described above, the fifth connecting plate portion 42, the sixth connecting plate portion 44, and the reinforcing connecting plate portions 45A and 45B (hatched portions in FIG. 8) are etched, for example. Is formed so as to be recessed from the lower surface of the conductive plate, and is formed thinner than the thickness of the conductive plate.

  In the state where the first metal piece frame 31 is stacked on the second metal piece frame 41 so that the lower surface 13b of one end of the first metal piece 13 contacts the upper surface 15a of the second metal piece 15. The connector 9 is constituted by the first metal piece 13 and the second metal piece 15. The plurality of connectors 9 are connected to each other by the third connecting plate portion 32 of the first metal piece frame 31 and the fifth connecting plate portion 42 of the second metal piece frame 41. That is, in this embodiment, the first metal piece frame 31 and the second metal piece frame 41 constitute a connector frame in which a plurality of connectors 9 are connected.

  When manufacturing the semiconductor devices 1 and 2 using the terminal lead frame 21, the first metal piece frame 31, and the second metal piece frame 41 configured as described above, first, The semiconductor elements 3 are respectively fixed to the upper surfaces of the first lead terminals 5 (element arranging step).

Next, the upper surface 3 a of the semiconductor element 3 disposed on the one terminal plate 22 and the second lead terminals 7 of the other terminal plates 22 disposed at a distance from the first lead terminal 5 of the one terminal plate 22. The connector 9 is fixed over the upper surface 7a (connector mounting step). In this step, as shown in FIGS. 9 to 11, the connector frame may be stacked on the terminal lead frame 21, specifically, the second metal piece frame 41 and the first metal piece frame. 31 may be stacked on the terminal lead frame 21 in order. In this step, the terminal lead frame 21, the first metal piece frame 31, and the second metal piece frame 41 are aligned with each other, so that the plurality of connectors 9 are connected to the upper surfaces of the individual semiconductor elements 3. 3a can be attached at the same time.
In this step, the second lead terminal 7 and the second metal piece 15 are joined, the first metal piece 13 and the second metal piece 15 are joined, and the semiconductor element 3 and the first metal piece 13 are joined. Perform the bonding.

After the connector attaching step, a part of the fifth connection plate portion 42 of the second metal piece frame 41 is arranged on the terminal plate 22 or the first connection plate portion 24 of the terminal lead frame 21. ing. However, since the fifth connecting plate portion 42 is thinly formed so as to be recessed from the lower surface of the conductive plate member, a gap is formed between the fifth connecting plate portion 42 and the terminal plate 22 or the first connecting plate portion 24. Has been.
Further, a part of the sixth connection plate portion 44 of the second metal piece frame 41 is arranged so as to overlap the terminal plate 22 of the terminal lead frame 21 and the second connection plate portion 26. However, since the sixth connecting plate portion 44 is also formed thinly so as to be recessed from the lower surface of the conductive plate material, similarly to the fifth connecting plate portion 42, the sixth connecting plate portion 44, the terminal plate 22, and the second connecting plate portion. A gap is formed between the two.
Further, the reinforcing connecting plate portions 45A and 45B of the second metal piece frame 41 are arranged on the reinforcing connecting plate portions 27A and 27B of the terminal lead frame 21 so as to overlap each other. However, since the reinforcing connection plate portions 45A and 45B of the second metal piece frame 41 are also formed so as to be recessed from the lower surface of the conductive plate material, the reinforcement connection of the second metal piece frame 41 and the terminal lead frame 21 is provided. Gaps are formed between the plate portions 45A, 45B, 27A, and 27B.

In addition, after the connector mounting step, a part of the third connection plate portion 32 of the first metal piece frame 31 is arranged on the fifth connection plate portion 42 of the second metal piece frame 41. . However, since the third connecting plate portion 32 is formed so as to be recessed from the lower surface of the conductive plate member, a gap is formed between the third connecting plate portion 32 and the fifth connecting plate portion 42.
Further, a part of the fourth connection plate portion 34 of the first metal piece frame 31 is disposed so as to overlap the sixth connection plate portion 44 of the second metal piece frame 41. However, since the fourth connecting plate portion 34 is also formed thinly so as to be recessed from the lower surface of the conductive plate member, similarly to the third connecting plate portion 32, the fourth connecting plate portion 34 and the sixth connecting plate portion 44 are not provided. A gap is formed in.
Further, the reinforcing connection plate portions 35A and 35B of the first metal piece frame 31 are arranged on the reinforcement connection plate portions 45A and 45B of the second metal piece frame 41 so as to overlap each other. However, since the reinforcing connecting plate portions 35A and 35B of the first metal piece frame 31 are also thinly formed so as to be recessed from the lower surface of the conductive plate material, the first metal piece frame 31 and the second metal piece frame 41 are not formed. Gaps are formed between the reinforcing connecting plate portions 35A, 35B, 45A, 45B.

After the connector attaching step, the plurality of terminal plates 22, the semiconductor element 3, the first metal piece 13, and the second metal piece 15 are collectively sealed by the mold resin portion 11 (molding step). In this molding step, a molten resin may be poured from above the first metal piece frame 31 so that the lower surface of the terminal plate 22 is exposed from the lower surface 11 b of the mold resin portion 11.
Finally, the mold resin part 11 is cut at the second orthogonal cutting planned line L3 to cut off the frame frames 25, 33, 43, and the mold resin part 11 is cut at the terminal cutting planned line L1, and if necessary. The manufacturing of the semiconductor device is completed by cutting the mold resin part 11 at the first orthogonal cutting planned line L2 (cutting process).

  In this cutting step, when the mold resin portion 11 is cut along the terminal cutting planned line L1, the terminal plate 22 and the first connecting plate portion 24 of the terminal lead frame 21 are simultaneously cut. 5 and the second lead terminal 7 are electrically insulated from each other. Moreover, since the 3rd connection board part 32 and the 4th connection board part 34 of the flame | frame 31 for 1st metal pieces are also cut | disconnected simultaneously in this cutting | disconnection, all the 1st metal pieces 13 mutually electrically. It will be insulated. Further, at the time of this cutting, since the fifth connecting plate portion 42 and the sixth connecting plate portion 43 of the second metal piece frame 41 are also cut at the same time, all the second metal pieces 15 are electrically connected to each other. It will be insulated. Further, at the time of this cutting, all the reinforcing connecting plate portions 27A, 27B, 35A, 35B, 45A, 45B arranged inside the terminal cutting planned line L1 are scraped off.

And in this cutting process, when the mold resin part 11 is cut at all the first orthogonal cutting lines L2, one semiconductor element 3 is sealed with the mold resin part 11 as shown in FIGS. Thus, the manufactured semiconductor device 1 (hereinafter referred to as a single semiconductor device 1) is manufactured.
In the single semiconductor device 1, in addition to the first lead terminal 5 and the second lead terminal 7, the third connection remaining in the mold resin portion 11 on the cut surface of the mold resin portion 11 cut along the terminal cutting planned line L <b> 1. The plate part 32 and the fifth connecting plate part 42 are exposed. This is because the terminal resin 22 is cut at the terminal cutting planned line L1 so that the terminal plate 22 and the first connecting plate portion 24 of the terminal lead frame 21 and the third connecting plate portion 32 of the first metal piece frame 31 are cut. In addition, the fifth connecting plate portion 42 of the second metal piece frame 41 is cut.
If the single semiconductor device 1 is constituted by the first lead terminal 5, the second lead terminal 7, the first metal piece 13, and the second metal piece 15 adjacent to the frame frames 25, 33, 43, the terminal The fourth connecting plate portion 34 and the sixth connecting plate portion 44 remaining in the mold resin portion 11 are also exposed at the cut surface of the mold resin portion 11 cut along the planned cutting line L1.

In the single semiconductor device 1, the third connecting plate portion 32 and the fifth connecting plate portion 42 remaining in the mold resin portion 11 on the cut surface of the mold resin portion 11 cut along the first orthogonal cutting planned line L <b> 2. In addition, the first connecting plate portion 24 remaining in the mold resin portion 11 is exposed. This is because the mold resin portion 11 is cut at the first orthogonal cutting planned line L2, the first connecting plate portion 24 of the terminal lead frame 21, the third connecting plate portion 32 of the first metal piece frame 31, and This is because the fifth connecting plate portion 42 of the second metal piece frame 41 is cut.
When the single semiconductor device 1 is constituted by the first lead terminal 5, the second lead terminal 7, the first metal piece 13, and the second metal piece 15 adjacent to the frame frames 25, 33, 43, The second connecting plate portion 26 remaining in the mold resin portion 11 and the fourth connecting plate portion 34 remaining in the mold resin portion 11 on the cut surface of the mold resin portion 11 cut along the two orthogonal cutting planned lines L3. And the 6th connection board part 44 will be exposed. This is because the mold resin portion 11 is cut at the second orthogonal cutting planned line L3, the second connecting plate portion 26 of the terminal lead frame 21, the fourth connecting plate portion 34 of the first metal piece frame 31, and This is because the sixth connecting plate portion 44 of the second metal piece frame 41 is cut.
The reinforcing connecting plate portions 27A, 27B, 35A, 35B, 45A, and 45B of the terminal lead frame 21, the first metal piece frame 31, and the second metal piece frame 41 are molded resin portions at the terminal cutting planned line L1. Since all are scraped off when cutting 11, it does not remain in the mold resin portion 11 and is not exposed to the aforementioned cut surface.

  On the other hand, in the above-described cutting process, when the mold resin portion 11 is not cut at some of the first orthogonal cutting planned lines L2, as shown in FIGS. The semiconductor device 2 having an array structure in which the semiconductor elements 3) are sealed by the same mold resin portion 11 can be manufactured. That is, it is possible to manufacture a single semiconductor device 1 in a state where a plurality of single semiconductor devices 1 are connected. The semiconductor device 2 having the array structure shown in FIGS. 16 and 17 is obtained by cutting the mold resin portion 11 at every other first orthogonal cutting planned line L2. 16 showing the semiconductor device 2 having the array structure has the same shape as the cross section of the single semiconductor device 1 shown in FIG.

  As described above, in the semiconductor device 2 having an array structure including a plurality of semiconductor elements 3, the first lead terminal 5 or the like is formed on the cut surface of the mold resin portion 11 cut along the terminal cutting planned line L 1 as in the case of the single semiconductor device 1. In addition to the second lead terminal 7, the third connecting plate portion 32 and the fifth connecting plate portion 42 are exposed. Further, in the semiconductor device 2 having the array structure, similarly to the single semiconductor device 1, the first connecting plate portion 24 and the third connecting plate are formed on the cut surface of the mold resin portion 11 cut along the first orthogonal cutting planned line L2. The part 32 and the fifth connecting plate part 42 are exposed.

Further, even when the semiconductor device 2 having the array structure includes the first lead terminal 5, the second lead terminal 7, the first metal piece 13, and the second metal piece 15 adjacent to the frame frames 25, 33, and 43, a single semiconductor is provided. Similarly to the device 1, the second connecting plate portion 26, the fourth connecting plate portion 34, and the sixth connecting plate portion 44 are exposed on the cut surface of the mold resin portion 11 cut along the second orthogonal cutting planned line L3. become.
In the semiconductor device 2 having the array structure, unlike the single semiconductor device 1, the first connecting plate remaining in the mold resin portion 11 also on the cut surface of the mold resin portion 11 cut along the terminal cutting planned line L <b> 1. The part 24 will be exposed. This is because the intersecting portion 24c of the first connecting plate portion 24 included in the first orthogonal cutting planned line L2 is not cut off by not cutting the mold resin portion 11 at some of the first orthogonal cutting planned lines L2. It is.

As described above, according to the terminal lead frame 21 and the method for manufacturing a semiconductor device according to the above embodiment, not only the single semiconductor device 1 in which one semiconductor element 3 is sealed with the mold resin portion 11, A semiconductor device 2 having an array structure in which a plurality of single semiconductor devices 1 are connected by the same mold resin portion 11 can also be manufactured.
Moreover, since a plurality of single semiconductor devices 1 can be collectively mounted on the circuit board in accordance with the number of single semiconductor devices 1 to be mounted on the circuit board, a plurality of single semiconductor devices 1 on the circuit board can be mounted. The mounting area of the semiconductor device 1 can be reduced to reduce the size of an electronic apparatus including a plurality of single semiconductor devices 1.

Further, when the semiconductor devices 1 and 2 are manufactured using the first metal piece frame 31 and the second metal piece frame 41 as in the above embodiment, the second metal piece is formed on the terminal lead frame 21. The plurality of connectors 9 made up of the first metal piece 13 and the second metal piece 15 can be connected to the plurality of semiconductor elements 3 and the second lead terminals 7 only by sequentially stacking the frame 41 for use and the frame 31 for the first metal piece, respectively. Since it can attach to an upper surface simultaneously, the manufacturing efficiency of the semiconductor devices 1 and 2 improves.
Moreover, in the state before cutting the mold resin part 11 at the terminal cutting planned line L1, the plurality of first metal pieces 13 and second metal pieces 15 are connected to the third connecting plate part 32, the fifth connecting plate part 42, and the frame. Since the plurality of metal pieces 13 and 15 are sealed with the mold resin portion 11, the metal pieces 13 with respect to the semiconductor element 3 and the second lead terminal 7 are connected to each other by the frames 33 and 43. , 15 can be easily prevented from occurring. Further, the first metal piece 13 may be joined to the upper surfaces 3 a and 15 a of the semiconductor element 3 and the second metal piece 15 in a state where the first metal piece 13 is inclined with respect to the upper surfaces 3 a and 15 a of the semiconductor element 3 and the second metal piece 15. Since it can prevent easily, this junction area can fully be ensured. Therefore, the electrical reliability in the semiconductor devices 1 and 2 can be improved.
Further, the third connection plate portion 32 of the first metal piece frame 31 and the fifth connection plate portion 42 of the second metal piece frame 41 intersect the terminal cutting planned line L1, so that the terminal cutting planned line L1. When the mold resin portion 11 is cut, the first metal pieces 13 or the second metal pieces 15 adjacent to each other can also be electrically insulated. Therefore, even when the first metal piece frame 31 and the second metal piece frame 41 are used, the semiconductor device 2 having the above-described array structure can be manufactured.

As mentioned above, although one Embodiment of this invention was described, the technical scope of this invention is not limited to this, It can change suitably in the range which does not deviate from the technical idea of this invention.
For example, the terminal lead frame 21, the first metal piece frame 31, and the second metal piece frame 41 are provided with the reinforcing connecting plate portions 27A, 27B, 35A, 35B, 45A, and 45B. The degree of torsional deformation or the like generated in the first connecting plate 24, the second connecting plate 26, the third connecting plate 32, the fourth connecting plate 34, the fifth connecting plate 42, or the sixth connecting plate 44 is allowable. As long as it is within the range, the reinforcing connecting plate portions 27A, 27B, 35A, 35B, 45A, and 45B may not be formed.

In addition, although the first metal piece frame 31 and the second metal piece frame 41 are both configured to include the frame frames 33 and 43, the frame frames 33 and 43 may not be particularly provided. In this case, in the first metal piece frame 31 and the second metal piece frame 41, the plurality of first metal pieces 13 and the second metal pieces 15 are arranged in a row by the third connecting plate portion 32 and the fifth connecting plate portion 42. Although it is configured to be connected, since the plurality of first metal pieces 13 and the second metal pieces 15 can be simultaneously arranged on the plurality of terminal plates 22 as in the configuration of the above embodiment, Efficiency can be improved.
Furthermore, when manufacturing the semiconductor devices 1 and 2, at least the terminal lead frame 21 may be used, and the plurality of first metal pieces 13 and second metal pieces 15 may be connected to the semiconductor element 3 and the second metal piece 15 in the connector attaching step. The two lead terminals 7 may be individually arranged. Even in this case, it is possible to manufacture a single semiconductor device 1 or a semiconductor device 2 having an array structure.

  The connector 9 is composed of the two metal pieces 13 and 15. However, the connector 9 is disposed over at least the upper surfaces 3a and 15a of the semiconductor element 3 and the second lead terminal 7, so The two-lead terminals 7 may be configured to be electrically connected to each other. That is, the connector 9 may be configured by only the plate-shaped first metal piece 13, for example. In this case, for example, the first metal piece 13 and the first metal piece 13 can be arranged on both the upper surface 3a of the semiconductor element 3 and the upper surface 7a of the second lead terminal 7 having different height positions. A stepped shape may be formed on the first metal piece 13 by bending the first metal piece frame 31 formed by connecting a plurality of the first metal piece frames.

Further, the first connecting plate portion 24 of the terminal lead frame 21 is configured to include the first projecting portion 24a, the second projecting portion 24b, and the intersecting portion 24c. What is necessary is just to be comprised so that a part of 1 connection board part 24 may cross | intersect the terminal cutting planned line L1.
Therefore, the 1st connection board part 24 may be formed so that the intersection part 24c which comprises the 1st connection board part 24 may skew with respect to the terminal cutting plan line L1, for example. Further, for example, the entire first connecting plate portion 24 is formed by linearly extending from the first lead terminal 5 of the one terminal plate 22 to the second lead terminal 7 of the other terminal plate 22, and the terminal cutting planned line L1. May be skewed. Further, the first connecting plate portion 24 is connected to the terminal cutting planned line L1 a plurality of times so as to connect, for example, the first lead terminals 5 of the two adjacent terminal plates 22 or the second lead terminals 7 to each other. It may be bent so as to intersect.

In addition, the second connecting plate portion 26 of the terminal lead frame 21 is connected to the first lead terminal 5 of the terminal plate 22 adjacent to the frame frame 25. For example, the second connecting plate portion 26 is connected to the second lead terminal 7. Also good.
Furthermore, although the 2nd connection board part 26 was formed so that it might be parallel to the extension direction of the terminal cutting planned line L1, it cross | intersects the terminal cutting planned line L1 similarly to the 1st connection board part 24, for example. It may be formed as follows. In this case, the lead terminals 5 and 7 connected to the second connecting plate portion 26 and the frame frame 25 can be electrically insulated simply by cutting the terminal lead frame 21 at the terminal cutting planned line L1. it can. That is, in the case of this configuration, the lead terminals 5 and 7 connected to the second connecting plate portion 26 and the frame 25 can be connected without cutting the terminal lead frame 21 along the second orthogonal cutting line L3. It can be electrically isolated.

It is a top view of the lead frame for terminals which is one embodiment of the present invention. It is a bottom view of the lead frame for terminals of FIG. It is AA arrow sectional drawing of FIG. It is a top view of the 1st metal piece frame used for manufacture of a semiconductor device with the lead frame for terminals of FIG. It is a bottom view of the 1st metal piece frame of FIG. It is a BB arrow sectional view of Drawing 4. It is a top view of the 2nd metal piece frame used for manufacture of a semiconductor device with the lead frame for terminals of FIG. It is a bottom view of the 2nd metal piece frame of FIG. It is CC sectional view taken on the line of FIG. It is a top view which shows the state which laminated | stacked the 2nd metal piece frame and the 1st metal piece frame on the terminal lead frame one by one. It is DD sectional view taken on the line of FIG. FIG. 6 is a bottom view showing a state in which a second metal piece frame and a first metal piece frame are sequentially stacked on a terminal lead frame. It is a top view which shows an example of the semiconductor device manufactured by the manufacturing method of one Embodiment of this invention. FIG. 14 is a bottom view of the semiconductor device of FIG. 13. It is EE arrow sectional drawing of FIG. It is a top view which shows the other example of the semiconductor device manufactured by the manufacturing method of one Embodiment of this invention. FIG. 17 is a bottom view of the semiconductor device of FIG. 16. It is a perspective view which shows an example of the conventional semiconductor device. FIG. 19 is a top view showing the semiconductor device of FIG. 18.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Semiconductor device 3 Semiconductor element 3a Upper surface 3b Lower surface 5 First lead terminal 5a Upper surface 7 Second lead terminal 7a Upper surface 9 Connector 13 First metal piece 15 Second metal piece 21 Lead frame 22 for terminal Terminal plate 23 Terminal Connecting structure 24 First connecting plate portion 25 Frame frame 26 Second connecting plate portion 31 First metal piece frame 32 Third connecting plate portion (connector connecting plate portion)
41 Frame for second metal piece 42 Fifth connecting plate (connector connecting plate)
L1 terminal cutting planned line L2 first orthogonal cutting planned line L3 second orthogonal cutting planned line

Claims (4)

A semiconductor element formed in a plate shape and having electrodes on the upper surface and the lower surface, a first lead terminal formed in a plate shape and disposing the semiconductor element on the upper surface, and a plate-shaped and the first lead terminal of the first lead terminal A second lead terminal disposed at a distance in a plane direction; and the semiconductor element and the second lead terminal formed in a plate shape and disposed over the upper surfaces of the semiconductor element and the second lead terminal. A lead frame for a terminal used when manufacturing a plurality of semiconductor devices including connectors that are electrically connected to each other,
A plurality of terminal plates formed integrally with the first lead terminal and the second lead terminal, and a terminal connection structure for connecting the plurality of terminal plates to each other;
The plurality of terminal plates extend in a straight line along the surface direction and are arranged at intervals in the extending direction of the terminal cutting planned line that divides each terminal plate into the first lead terminal and the second lead terminal. And a direction perpendicular to the extending direction of the terminal cutting planned line so that the first lead terminal of one terminal plate and the second lead terminal of the other terminal plate face each other with a space therebetween Is also arranged
The terminal connection structure includes a first connection plate part that connects two terminal plates adjacent to each other in the extending direction of the terminal cutting planned line, and a frame that is arranged around the surface direction of the plurality of terminal plates. A second connecting plate portion extending in the extending direction of the terminal cutting planned line and connecting the terminal plate adjacent to the frame frame to the frame frame;
The first connecting plate portion is disposed at both ends in the longitudinal direction outside the terminal cutting planned line in the width direction and connected to the first lead terminal or the second lead terminal of each terminal plate. in, the lead frame terminals, characterized in that intersects the terminal cutting line.
A connector frame used when manufacturing a plurality of the semiconductor devices together with the terminal lead frame according to claim 1,
The connectors adjacent to each other are connected so that each connector is arranged from the first lead terminal of one terminal plate to the second lead terminal of the other terminal plate arranged opposite to the connector. Connected by the connecting plate,
The connector frame, wherein the connector connecting plate portion intersects the terminal cutting planned line. A method of manufacturing a semiconductor device using the lead frame for terminals according to claim 1,
An element placement step of fixing the semiconductor element on the first lead terminal of each terminal plate;
The connection over the upper surface of the semiconductor element arranged on one terminal plate and the upper surface of the second lead terminal of another terminal plate arranged at a distance from the first lead terminal of the one terminal plate A connector mounting step for fixing the child;
A molding step of collectively sealing the plurality of terminal plates, the semiconductor element and the connector with the mold resin portion;
A method of manufacturing a semiconductor device, comprising: cutting the second connecting plate portion to cut the frame frame, and cutting the mold resin portion along the terminal cutting planned line. A semiconductor device manufactured by the manufacturing method according to claim 3,
The semiconductor device, wherein the first lead terminal, the second lead terminal, and the first connecting plate part are exposed on a cut surface of the mold resin part cut along the terminal cutting planned line.

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