JP5409059B2 - Flux supply device - Google Patents

Description

  The present invention relates to a flux supply device, and more particularly to a flux supply device that is suitable for application when supplying flux applied to a bump electrode to a cavity when mounting an electronic component.

  As a flux supply device (flux application device) that supplies a flux applied to a bump electrode to mount an electronic component on a substrate to a cavity portion, for example, Patent Document 1 discloses that a base 1 as shown in FIG. A viscous flux 5 is injected into a cylindrical container (squeegee) 4 placed thereon, and the container 4 is reciprocated above the cavity portion 2 formed of a concave portion while being pressed by the block 6. 2 is filled with a flux 5.

JP 2002-172460 A

  However, in the conventional flux supply device disclosed in Patent Document 1, viscosity is required for the flux to be held in the container 4, so that when a low-viscosity flux is injected into the container, it is at the lower end. There was a problem that it was difficult to use to leak out.

  The present invention has been made to solve the above-mentioned conventional problems, and it is an object of the present invention to provide a flux supply device that does not cause leakage even with a low-viscosity flux and can be reliably supplied to the cavity portion. And

The present invention includes an inclined surface having a predetermined width, a weir portion that closes the downstream end portion of the inclined surface and stores injected flux, and a cavity portion in which a horizontal bottom portion lower than the inclined surface is formed in the middle of the inclined surface. A flux plate having a sliding surface at the lower end, extending in the width direction of the inclined surface, contacting the sliding surface of the arm portion with the inclined surface, and the arm portion as the downstream end portion And a moving means for reciprocating a range upstream of the cavity.

  According to the present invention, the arm portion having the sliding surface formed at the lower end in the state in which the flux is accumulated in the reservoir portion at the downstream end portion of the inclined surface blocked by the weir is provided on the downstream side. After moving forward to the end, the flux is stirred by the arm that slides on the inclined surface during forward movement and moved back to the cavity during backward movement by moving backward to the upstream side beyond the cavity. it can.

  Therefore, even if it is a low-viscosity flux, it does not cause the conventional leakage from the downstream end portion and can be reliably supplied to the cavity portion.

The schematic plan view which shows the flux supply apparatus of one Embodiment which concerns on this invention. Longitudinal sectional view of the flux supply device of this embodiment A longitudinal sectional view corresponding to FIG. 2 showing the operation of the present embodiment Other important part expanded sectional view explaining the effect | action and effect of this embodiment Plan view and sectional view showing the outline of a conventional flux supply device

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view of a flux supply device according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view thereof.

  The flux supply device of this embodiment includes a flux plate 10 placed on a base 8 of a device main body (not shown). The flux plate 10 includes an inclined surface 12 having a predetermined width, a downstream end portion 12A of the inclined surface 12, and a weir portion 14 that forms a reservoir portion 12B for storing the injected flux F, and the inclined surface in the middle of the inclined surface. And a cavity portion 16 having a horizontal bottom portion lower than the surface.

  Further, the flux supply device of this embodiment includes an arm portion 20 extending in the width direction of the inclined surface having a sliding surface 20A formed at the lower end, and the arm portion 20 from the downstream end portion 12A and the cavity portion 16. And a moving member (moving means) 22 for reciprocating the upstream range.

When this embodiment is explained in full detail, the said cavity part 16 becomes the shape formed in the middle of the inclined surface 12 as a recessed part of predetermined width and predetermined length, The downstream side edge part also respond | corresponds to the film thickness of a flux. They are formed slightly lower than the inclined slopes 12 Te.

  The arm portion 20 has a long shape along the width direction of the inclined surface 12, and a sliding surface 20 </ b> A that substantially contacts the inclined surface 12 is formed at the lower end thereof. The arm portion 20 is connected to the moving member 22 that is moved along the inclined surface 12 by a driving mechanism (not shown), and the sliding surface 20A is inclined as the moving member 22 reciprocates. 12 is slidable back and forth in the range from the illustrated standby position to the downstream end 12A.

  In the flux supply apparatus of the present embodiment having the above configuration, the moving member 22 is formed on the deep side near the downstream end 12A shown on the right side of FIG. 2 by a drive mechanism (not shown) connected and fixed to the upper part thereof. When moving forward to the flux reservoir portion 12 </ b> B, the flux F is stirred by the arm portion 20.

  Next, as shown in FIG. 3, when the moving member 22 moves backward to return to the left, the flux F can be carried to the cavity portion 16 from the arm portion 20 having a stirring function.

  By repeating this reciprocating motion, the flux F having a constant film thickness can always be held in the cavity portion 16.

  Accordingly, as shown in FIG. 4 in an enlarged manner, the state in which the arm portion 20 is returned to the original standby position by the backward movement is applied to the flux F held in the cavity portion 16 with a constant film thickness by the suction nozzle 30. By immersing the bump electrode located at the lower end of the adsorbed electronic component P, a certain amount of low-viscosity flux F can be applied to the bump electrode.

  According to the embodiment described above in detail, the following effects can be obtained.

(1) It is possible to use a flux F having a low viscosity.

(2) Since the flux F is accumulated in the reservoir portion 12B in which the downstream end portion of the inclined surface is closed by the weir portion 14, it is possible to prevent the flux F having a low viscosity from leaking, and waste of the flux as in the conventional case It can be prevented from occurring.

  In addition, although the said embodiment demonstrated the case where it applied to the low-viscosity flux called what is called an underfill, it can also apply not only to this but what is called a silver paste.

DESCRIPTION OF SYMBOLS 10 ... Flux plate 12 ... Inclined surface 12A ... Downstream end part 12B ... Reservoir part 14 ... Weir part 16 ... Cavity part 20 ... Arm part 20A ... Sliding surface 22 ... Moving member (moving means)

Claims (1)

A flux plate having an inclined surface of a predetermined width, a weir portion for closing the downstream end portion of the inclined surface and storing injected flux, and a cavity portion in which a horizontal bottom portion lower than the inclined surface is formed in the middle of the inclined surface; ,
A sliding surface is formed at the lower end, and an arm portion extending in the width direction of the inclined surface;
Flux supply comprising: a moving means for bringing a sliding surface of the arm portion into contact with the inclined surface and reciprocating the arm portion in a range upstream of the downstream end portion and the cavity portion. apparatus.

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