JP5430873B2 - Substrate cleaning apparatus and substrate processing apparatus having the same - Google Patents

Description

  The present invention relates to a substrate cleaning apparatus for cleaning a back surface of a substrate and a substrate processing apparatus including the same.

  In order to perform various processes on various substrates such as a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate, It is used.

  In such a substrate processing apparatus, generally, a plurality of different processes are continuously performed on a single substrate. The substrate processing apparatus described in Patent Document 1 includes an indexer block, an antireflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure apparatus that is an external apparatus separate from the substrate processing apparatus is disposed adjacent to the interface block.

In the substrate processing apparatus described above, the substrate carried in from the indexer block is configured such that after the formation of the antireflection film and the coating process of the resist film are performed in the antireflection film processing block and the resist film processing block, the interface block is To the exposure apparatus. After the exposure process is performed on the resist film on the substrate in the exposure apparatus, the substrate is transported to the development processing block via the interface block. After a resist pattern is formed by performing development processing on the resist film on the substrate in the development processing block, the substrate is transported to the indexer block.
JP 2003-324139 A

  In the course of various film forming processes before the exposure process, the back surface of the substrate may be contaminated. In that case, unevenness occurs on the back surface of the substrate due to the contaminant, and the substrate becomes unstable. For this reason, defocusing in which the focus of the exposure lens deviates from the surface of the resist film on the substrate may occur during the exposure process. As a result, there is a risk that a dimensional defect and a shape defect of the exposure pattern may occur.

  Therefore, it has been proposed to clean the back surface of the substrate after various film forming processes. However, when a liquid such as a cleaning liquid adheres to the resist film formed on the substrate, the resist film and the liquid react to change the state of the resist film. As a result, subsequent resist film processing cannot be performed normally.

  An object of the present invention is to provide a substrate cleaning apparatus capable of sufficiently cleaning the back surface of a substrate while preventing liquid from adhering to the surface of the substrate, and a substrate processing apparatus including the same.

A substrate cleaning apparatus according to a first aspect of the present invention is a substrate cleaning apparatus that cleans the lower surface of a substrate, a substrate rotation holding device that rotates while holding the substrate substantially horizontally, and a substrate held by the substrate rotation holding device. Gas supply means for supplying gas to the upper surface, a cleaning tool for cleaning the lower surface of the substrate held by the substrate rotation holding device, and a cleaning liquid supply means for supplying cleaning liquid to the lower surface of the substrate held by the substrate rotation holding device The substrate rotation holding device includes a rotation member that is provided to be rotatable around a rotation axis substantially along the vertical direction, a rotation drive mechanism that is provided above the rotation member and rotates the rotation member, and a rotation member. And a holding member that holds the substrate by contacting the outer peripheral end of the substrate that is disposed on the lower side of the rotating member, and is held by the holding member. A gas shielding means that covers the upper surface of the substrate and is provided on the lower side of the rotating member so as to rotate integrally with the rotating member. A gas is supplied between the shielding plate and the substrate through a through hole formed in a substantially central portion of the shielding plate so that an air flow toward the outside is formed.
In this substrate cleaning apparatus, the outer peripheral end portion of the substrate disposed on the lower side of the rotating member is held by the holding member provided on the lower side of the rotating member. Then, the rotating member is rotated around the rotation axis along the substantially vertical direction by the rotation driving mechanism provided on the upper side of the rotating member. As a result, the substrate rotates while being held substantially horizontally.
Gas is supplied to the upper surface of the rotating substrate by the substrate supply means. Further, the cleaning liquid is supplied by the cleaning liquid supply means to the lower surface of the rotating substrate and the cleaning tool comes into contact therewith. In this case, the lower surface of the substrate can be cleaned while preventing the cleaning liquid from adhering to the upper surface of the substrate.
Thereby, even if the photosensitive film is formed on the upper surface of the substrate, the contact between the photosensitive film and the cleaning liquid is prevented, and the state of the photosensitive film can be maintained normally. In addition, by removing contaminants attached to the lower surface of the substrate, it is possible to reliably prevent defocusing caused by unevenness on the back surface of the substrate during the exposure process. By these, generation | occurrence | production of the process defect of a board | substrate can be prevented reliably.
Further, in this substrate cleaning apparatus, since the rotational drive mechanism is above the substrate, a sufficient space is formed below the rotating substrate. Since the cleaning tool and the cleaning liquid supply means can clean the lower surface of the substrate in the space, the entire lower surface of the substrate can be efficiently and reliably cleaned.
The space above the substrate blocked by the blocking plate is filled with the gas supplied from the gas supply means. This reliably prevents the cleaning liquid supplied to the lower surface of the substrate from entering the upper surface of the substrate, and reliably prevents the cleaning liquid from adhering to the upper surface of the substrate.
The rotary drive mechanism has a hollow rotary shaft extending in the vertical direction, the rotary member has an opening at the center and is attached to the rotary shaft so as to rotate integrally with the rotary shaft, and the gas supply means rotates. A metal outer tube that is inserted into the rotation shaft of the drive mechanism and the opening of the rotation member, and supported by the rotation drive mechanism so as to form a certain gap with the inner peripheral surface of the rotation shaft, and in the outer tube It may include a resin inner tube that is inserted and has a discharge port at an end facing the top surface of the substrate and supplies gas from the discharge port to the substrate.
The substrate cleaning apparatus may further include a support member that supports the rotation drive mechanism so that the rotation axis extends in the vertical direction, the outer tube includes a flange portion, and the flange portion may be fixed to the support member.
A substrate processing apparatus according to a second aspect of the present invention is a substrate processing apparatus that is disposed adjacent to an exposure apparatus and performs processing on a substrate having a front surface and a back surface, a processing unit for performing processing on the substrate, and a processing A processing unit including a photosensitive film forming unit for forming a photosensitive film made of a photosensitive material on the surface of the substrate, and a processing unit. At least one of the transfer units includes a substrate cleaning device that cleans the back surface of the substrate before exposure processing by the exposure device, and the substrate cleaning device rotates the substrate while rotating the substrate substantially horizontally with the front surface facing upward. A holding device, a gas supply means for supplying gas to the surface of the substrate held by the substrate rotation holding device, a cleaning tool for cleaning the back surface of the substrate held by the substrate rotation holding device, and a substrate rotation holding device A cleaning liquid supply means for supplying a cleaning liquid to the back surface of the substrate held by the substrate, and the substrate rotation holding device includes a rotating member provided rotatably around a rotation axis substantially along the vertical direction, and an upper side of the rotating member. A rotation drive mechanism that rotates and rotates the rotating member, and is provided on the lower side of the rotating member so as to rotate integrally with the rotating member, and is in contact with the outer peripheral edge of the substrate disposed on the lower side of the rotating member A holding member that holds the substrate by the above, and a shielding plate that covers the upper surface of the substrate held by the holding member and is provided on the lower side of the rotating member so as to rotate integrally with the rotating member, the gas supply means The gas is supplied between the shielding plate and the substrate through a through hole formed in the substantially central portion of the shielding plate so that an airflow is formed between the shielding plate and the substrate toward the outside from the central portion of the substrate. Is.
The substrate cleaning apparatus according to the reference embodiment is a substrate cleaning apparatus that cleans the lower surface of the substrate. The substrate rotation holding device rotates the substrate while holding the substrate substantially horizontally, and the upper surface of the substrate held by the substrate rotation holding device. A gas supply means for supplying a gas; a cleaning tool for cleaning the lower surface of the substrate held by the substrate rotation holding device; and a cleaning liquid supply means for supplying a cleaning liquid to the lower surface of the substrate held by the substrate rotation holding device. The substrate rotation holding device includes a rotation member provided to be rotatable around a rotation axis substantially along the vertical direction, a rotation drive mechanism provided on the upper side of the rotation member and configured to rotate the rotation member, and a lower part of the rotation member. provided on the side, those comprising a holding member for holding the substrate by abutting the outer edge of the substrate disposed on the lower side of the rotary member.

  In this substrate cleaning apparatus, the outer peripheral end portion of the substrate disposed on the lower side of the rotating member is held by the holding member provided on the lower side of the rotating member. Then, the rotating member is rotated around the rotation axis along the substantially vertical direction by the rotation driving mechanism provided on the upper side of the rotating member. As a result, the substrate rotates while being held substantially horizontally.

  Gas is supplied to the upper surface of the rotating substrate by the substrate supply means. Further, the cleaning liquid is supplied by the cleaning liquid supply means to the lower surface of the rotating substrate and the cleaning tool comes into contact therewith. In this case, the lower surface of the substrate can be cleaned while preventing the cleaning liquid from adhering to the upper surface of the substrate.

  Thereby, even if the photosensitive film is formed on the upper surface of the substrate, the contact between the photosensitive film and the cleaning liquid is prevented, and the state of the photosensitive film can be maintained normally. In addition, by removing contaminants attached to the lower surface of the substrate, it is possible to reliably prevent defocusing caused by unevenness on the back surface of the substrate during the exposure process. By these, generation | occurrence | production of the process defect of a board | substrate can be prevented reliably.

  Further, in this substrate cleaning apparatus, since the rotational drive mechanism is above the substrate, a sufficient space is formed below the rotating substrate. Since the cleaning tool and the cleaning liquid supply means can clean the lower surface of the substrate in the space, the entire lower surface of the substrate can be efficiently and reliably cleaned.

  The substrate rotation holding device further includes a blocking plate provided on the lower side of the rotating member so as to face the upper surface of the substrate held by the holding member, and the gas supply means supplies gas between the blocking plate and the substrate. You may supply.

In this case , the space above the substrate blocked by the blocking plate is filled with the gas supplied from the gas supply means. This reliably prevents the cleaning liquid supplied to the lower surface of the substrate from entering the upper surface of the substrate, and reliably prevents the cleaning liquid from adhering to the upper surface of the substrate.

Rotation drive mechanism includes a hollow rotary shaft extending in the vertical direction, the rotating member is mounted to the rotary shaft so as to rotate integrally with the rotary shaft and having an opening in the center, the gas supply means, A metal outer tube that is inserted into the rotation shaft of the rotation drive mechanism and the opening of the rotation member and supported by the rotation drive mechanism so as to form a certain gap with the inner peripheral surface of the rotation shaft; And a resin inner tube that has a discharge port at an end facing the upper surface of the substrate and supplies gas from the discharge port to the substrate.

  In this case, since the metal outer tube is supported by the rotation drive mechanism so that a certain gap is formed between the inner peripheral surface of the rotating shaft, the outer tube can be used even when the rotating shaft rotates. And the gap between the inner peripheral surface of the rotary shaft is kept constant. Therefore, wear of the outer tube and the rotating shaft is prevented.

  Further, since the outer tube is supported by the rotation drive mechanism, the positional relationship between the rotation shaft and the outer tube is maintained even when the rotation drive mechanism vibrates. This reliably prevents the outer tube from coming into contact with the rotating shaft.

  Further, since the resin inner tube has flexibility, it can be easily inserted into the outer tube. Furthermore, the gas supply means is made compact by inserting the inner tube into the outer tube.

Board cleaning apparatus further comprises a support member rotating shaft for supporting the rotary drive mechanism so as to extend in the vertical direction, the outer tube has a flange portion, the flange portion may be fixed to the support member.

  In this case, the rotation drive mechanism is supported by the support member, and the flange portion of the outer tube is fixed to the support member. Thereby, the outer tube is reliably fixed to the rotation drive mechanism via the flange portion and the support member. Further, by attaching the flange portion of the outer tube to the support member, the outer tube and the inner tube can be easily fixed to the rotation drive mechanism. Accordingly, it becomes easier to manufacture the substrate processing apparatus.

A substrate processing apparatus according to a reference embodiment is a substrate processing apparatus that is disposed so as to be adjacent to an exposure apparatus and performs processing on a substrate having a front surface and a back surface, a processing unit for performing processing on the substrate, a processing unit, A transfer unit for transferring the substrate to and from the exposure apparatus, and the processing unit includes a photosensitive film forming unit that forms a photosensitive film made of a photosensitive material on the surface of the substrate. At least one of the units includes a substrate cleaning device that cleans the back surface of the substrate before exposure processing by the exposure device, and the substrate cleaning device rotates the substrate while rotating the substrate substantially horizontally with the front surface facing upward. Gas supply means for supplying gas to the surface of the substrate held by the substrate rotation holding device, a cleaning tool for cleaning the back surface of the substrate held by the substrate rotation holding device, and the substrate rotation holding device And a cleaning liquid supply means for supplying a cleaning liquid to the back surface of the substrate held by the substrate, and the substrate rotation holding device includes a rotating member provided rotatably around a rotation axis along a substantially vertical direction, and an upper side of the rotating member. A rotation driving mechanism that rotates the rotating member; and a holding member that is provided on the lower side of the rotating member and holds the substrate by contacting an outer peripheral end of the substrate disposed on the lower side of the rotating member. Is.

  In this substrate processing apparatus, a photosensitive film is formed on the surface of the substrate by the photosensitive film forming unit in the processing section, and the substrate is transferred from the processing section to the exposure apparatus by the transfer section. After the exposure process is performed on the substrate by the exposure apparatus, the substrate is transferred from the exposure apparatus to the processing unit by the transfer unit. Before the exposure process by the exposure apparatus, the back surface of the substrate is cleaned by the substrate cleaning apparatus.

  In the substrate cleaning apparatus, the outer peripheral end portion of the substrate disposed on the lower side of the rotating member is held by the holding member provided on the lower side of the rotating member with the surface facing upward. Then, the rotating member is rotated around the rotation axis along the substantially vertical direction by the rotation driving mechanism provided on the upper side of the rotating member. As a result, the substrate rotates while being held substantially horizontally.

  Gas is supplied to the surface of the rotating substrate by the substrate supply means. Further, the cleaning liquid is supplied from the cleaning liquid supply means to the back surface of the rotating substrate, and the cleaning tool comes into contact therewith. In this case, the back surface of the substrate can be cleaned while preventing the cleaning liquid from adhering to the surface of the substrate.

  As a result, the cleaning liquid is prevented from coming into contact with the photosensitive film formed on the surface of the substrate, and the state of the photosensitive film can be maintained normally. In addition, by removing contaminants attached to the back surface of the substrate, it is possible to reliably prevent defocusing caused by unevenness on the back surface of the substrate during the exposure process. By these, generation | occurrence | production of the process defect of a board | substrate can be prevented reliably.

  Further, in this substrate cleaning apparatus, since the rotational drive mechanism is above the substrate, a sufficient space is formed below the rotating substrate. Since the back surface of the substrate can be cleaned by the cleaning tool and the cleaning liquid supply means in the space, the entire back surface of the substrate can be efficiently and reliably cleaned.

In addition, since the back surface of the substrate can be cleaned while the back surface of the substrate is directed downward, the cleaning liquid supplied to the back surface of the substrate is moved to the front surface side of the substrate by gravity, unlike when the back surface of the substrate is directed upward. There is no inflow. As a result, it is possible to more reliably prevent the cleaning liquid from adhering to the surface of the substrate. In addition, since it is not necessary to provide a reversing mechanism for reversing the substrate, it is possible to suppress an increase in size and cost of the substrate processing apparatus .

  According to the present invention, contact between the photosensitive film and the cleaning liquid is prevented, and the state of the photosensitive film can be maintained normally. Further, by removing the contaminants adhering to the lower surface of the substrate, it is possible to reliably prevent the occurrence of defocus due to the unevenness of the back surface of the substrate during the exposure process. In addition, since a sufficient space is formed below the rotating substrate, the entire lower surface of the substrate can be efficiently and reliably cleaned.

  Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, a photomask glass substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, and the like. Say.

(1) Configuration of Substrate Processing Apparatus FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. In addition, in FIG. 1 and FIGS. 2 to 4 to be described later, in order to clarify the positional relationship, arrows indicating the X direction, the Y direction, and the Z direction orthogonal to each other are attached. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction. In each direction, the direction in which the arrow points is the + direction, and the opposite direction is the-direction. Further, the rotation direction around the Z direction is defined as the θ direction.

  As shown in FIG. 1, the substrate processing apparatus 500 includes an indexer block 9, an antireflection film processing block 10, a resist film processing block 11, a development processing block 12, and an interface block 15. An exposure device 16 is arranged adjacent to the interface block 15. In the exposure apparatus 16, the substrate W is subjected to an exposure process by a liquid immersion method.

  Hereinafter, each of the indexer block 9, the antireflection film processing block 10, the resist film processing block 11, the development processing block 12, and the interface block 15 is referred to as a processing block.

  The indexer block 9 includes a main controller (control unit) 30 that controls the operation of each processing block, a plurality of carrier platforms 40, and an indexer robot IR. The indexer robot IR is provided with a hand IRH for delivering the substrate W.

  The antireflection film processing block 10 includes antireflection film heat treatment units 100 and 101, an antireflection film application processing unit 50, and a first central robot CR1. The antireflection film coating processing unit 50 is provided opposite to the antireflection film heat treatment units 100 and 101 with the first central robot CR1 interposed therebetween. The first center robot CR1 is provided with hands CRH1 and CRH2 for transferring the substrate W up and down.

  A partition wall 17 is provided between the indexer block 9 and the antireflection film processing block 10 for shielding the atmosphere. In the partition wall 17, substrate platforms PASS 1 and PASS 2 for transferring the substrate W between the indexer block 9 and the anti-reflection film processing block 10 are provided close to each other in the vertical direction. The upper substrate platform PASS1 is used when transporting the substrate W from the indexer block 9 to the antireflection film processing block 10, and the lower substrate platform PASS2 is used to transport the substrate W to the antireflection film processing block. It is used when transporting from 10 to the indexer block 9.

  The substrate platforms PASS1, PASS2 are provided with optical sensors (not shown) that detect the presence or absence of the substrate W. Thereby, it is possible to determine whether or not the substrate W is placed on the substrate platforms PASS1 and PASS2. The substrate platforms PASS1, PASS2 are provided with a plurality of support pins fixedly installed. The optical sensor and the support pin are also provided in the same manner on the substrate platforms PASS3 to PASS9 described later.

  The resist film processing block 11 includes resist film heat treatment units 110 and 111, a resist film coating processing unit 60, and a second central robot CR2. The resist film application processing unit 60 is provided to face the resist film heat treatment units 110 and 111 with the second central robot CR2 interposed therebetween. The second center robot CR2 is provided with hands CRH3 and CRH4 for transferring the substrate W up and down.

  A partition wall 18 is provided between the antireflection film processing block 10 and the resist film processing block 11 for shielding the atmosphere. The partition wall 18 is provided with substrate platforms PASS3 and PASS4 that are close to each other in the vertical direction for transferring the substrate W between the anti-reflection film processing block 10 and the resist film processing block 11. The upper substrate platform PASS3 is used when the substrate W is transported from the antireflection film processing block 10 to the resist film processing block 11, and the lower substrate platform PASS4 is used to transfer the substrate W to the resist film. It is used when transporting from the processing block 11 to the processing block 10 for antireflection film.

  The development processing block 12 includes a development heat treatment section 120, a post-exposure bake heat treatment section 121, a development processing section 70, and a third central robot CR3. The post-exposure bake heat treatment unit 121 is adjacent to the interface block 15 and includes substrate platforms PASS7 and PASS8 as described later. The development processing unit 70 is provided opposite to the development heat treatment unit 120 and the post-exposure bake heat treatment unit 121 with the third central robot CR3 interposed therebetween. The third center robot CR3 is provided with hands CRH5 and CRH6 for transferring the substrate W up and down.

  A partition wall 19 is provided between the resist film processing block 11 and the development processing block 12 for shielding the atmosphere. In the partition wall 19, substrate platforms PASS 5 and PASS 6 for transferring the substrate W between the resist film processing block 11 and the development processing block 12 are provided close to each other in the vertical direction. The upper substrate platform PASS5 is used when the substrate W is transported from the resist film processing block 11 to the development processing block 12, and the lower substrate platform PASS6 is used to transfer the substrate W from the development processing block 12 to the resist processing block 12. Used when transported to the film processing block 11.

  The interface block 15 includes a feed buffer unit SBF, a back surface cleaning unit BC, a fourth central robot CR4, an edge exposure unit EEW, a return buffer unit RBF, a placement / cooling unit PASS-CP (hereinafter abbreviated as P-CP). ), A substrate platform PASS9, and an interface transport mechanism IFR. The back surface cleaning unit BC performs a back surface cleaning process (hereinafter referred to as a back surface cleaning process) of the substrate W before the exposure process. Here, the upper surface of the substrate W refers to the surface of the substrate W directed upward, and the lower surface of the substrate W refers to the surface of the substrate W directed downward. The surface of the substrate W refers to the surface on which various films are formed in each processing block, and the back surface of the substrate W refers to the opposite surface. Details of the back surface cleaning unit BC will be described later.

  The fourth central robot CR4 is provided with hands CRH7 and CRH8 (see FIG. 4) for delivering the substrate W up and down, and a hand H1 for delivering the substrate W to the interface transport mechanism IFR. , H2 (see FIG. 4) are provided above and below. Details of the interface block 15 will be described later.

  In the substrate processing apparatus 500 according to the present embodiment, an indexer block 9, an antireflection film processing block 10, a resist film processing block 11, a development processing block 12, and an interface block 15 are arranged side by side along the Y direction. ing.

  2 is a schematic side view of the substrate processing apparatus 500 of FIG. 1 viewed from the + X direction, and FIG. 3 is a schematic side view of the substrate processing apparatus 500 of FIG. 1 viewed from the −X direction. 2 mainly shows what is provided on the + X side of the substrate processing apparatus 500, and FIG. 3 mainly shows what is provided on the −X side of the substrate processing apparatus 500.

  First, the configuration on the + X side of the substrate processing apparatus 500 will be described with reference to FIG. As shown in FIG. 2, in the antireflection film coating processing unit 50 (see FIG. 1) of the antireflection film processing block 10, three coating units BARC are vertically stacked. Each coating unit BARC includes a spin chuck 51 that rotates while adsorbing and holding the substrate W in a horizontal posture, and a supply nozzle 52 that supplies a coating liquid for an antireflection film to the substrate W held on the spin chuck 51.

  In the resist film coating processing section 60 (see FIG. 1) of the resist film processing block 11, three coating units RES are stacked in a vertical direction. Each coating unit RES includes a spin chuck 61 that rotates while adsorbing and holding the substrate W in a horizontal posture, and a supply nozzle 62 that supplies a coating liquid for a resist film to the substrate W held on the spin chuck 61.

  In the development processing unit 70 (see FIG. 1) of the development processing block 12, five development processing units DEV are stacked one above the other. Each development processing unit DEV includes a spin chuck 71 that rotates by sucking and holding the substrate W in a horizontal posture, and a supply nozzle 72 that supplies the developer to the substrate W held on the spin chuck 71.

  An edge exposure unit EEW is disposed on the + X side in the interface block 15. The edge exposure unit EEW includes a spin chuck 98 that rotates by attracting and holding the substrate W in a horizontal posture, and a light irradiator 99 that exposes the periphery of the substrate W held on the spin chuck 98.

  Next, the configuration on the −X side of the substrate processing apparatus 500 will be described with reference to FIG. 3. As shown in FIG. 3, two heating units (hot plates) HP and two cooling units (cooling plates) CP are provided in the antireflection film heat treatment units 100 and 101 of the antireflection film processing block 10, respectively. Laminated. In addition, in the antireflection film heat treatment units 100 and 101, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are respectively arranged at the top.

  Two heating units HP and two cooling units CP are stacked in the resist film heat treatment sections 110 and 111 of the resist film processing block 11, respectively. In addition, in the resist film heat treatment units 110 and 111, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are respectively arranged at the top.

  The development heat treatment section 120 of the development processing block 12 includes two heating units HP and two cooling units CP stacked, and the post-exposure baking heat treatment section 121 includes two heating units HP, The cooling unit CP and the substrate platforms PASS7 and PASS8 are stacked one above the other. In addition, in the development heat treatment section 120 and the post-exposure bake heat treatment section 121, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are arranged at the top.

  Next, the interface block 15 will be described in detail with reference to FIG.

  FIG. 4 is a schematic side view of the interface block 15 as viewed from the + Y side. As shown in FIG. 4, in the interface block 15, the sending buffer unit SBF and the three back surface cleaning processing units BC are stacked on the −X side. In the interface block 15, an edge exposure unit EEW is disposed at the upper part on the + X side.

  Below the edge exposure unit EEW, a return buffer unit RBF, two placement / cooling units P-CP, and a substrate platform PASS9 are stacked in a vertical direction at a substantially central portion in the interface block 15.

  In the lower part of the interface block 15, a fourth center robot CR4 and an interface transport mechanism IFR are provided. The fourth central robot CR4 can move up and down between the feed buffer unit SBF, the back surface cleaning unit BC, the edge exposure unit EEW, the return buffer unit RBF, the placement / cooling unit P-CP, and the substrate platform PASS9. It is provided so that rotation is possible. The interface transport mechanism IFR is provided between the return buffer unit RBF, the placement / cooling unit P-CP, and the substrate platform PASS9 so as to be vertically movable and rotatable.

(1-2) Operation of Substrate Processing Apparatus Next, the operation of the substrate processing apparatus 500 according to the present embodiment will be described with reference to FIGS.

(1-2-1) Operation from the Indexer Block to the Development Processing Block First, the operation from the indexer block 9 to the development processing block 12 will be briefly described.

  On the carrier mounting table 40 of the indexer block 9, a carrier C that stores a plurality of substrates W in multiple stages is loaded. The indexer robot IR takes out the unprocessed substrate W stored in the carrier C using the hand IRH. Thereafter, the indexer robot IR rotates in the ± θ direction while moving in the ± X direction, and places the unprocessed substrate W on the substrate platform PASS1.

  In the present embodiment, a front opening unified pod (FOUP) is adopted as the carrier C. However, the present invention is not limited to this, and an OC (open cassette) that exposes the standard mechanical interface (SMIF) pod and the storage substrate W to the outside air. ) Etc. may be used.

  Further, the indexer robot IR, the first to fourth center robots CR1 to CR4, and the interface transport mechanism IFR are each provided with a direct-acting transport robot that slides linearly with respect to the substrate W and moves the hand back and forth. Although it is used, the present invention is not limited to this, and an articulated transfer robot that linearly moves the hand forward and backward by moving the joint may be used.

  The unprocessed substrate W placed on the substrate platform PASS1 is received by the first central robot CR1 of the antireflection film processing block 10. The first center robot CR1 carries the substrate W into the antireflection film heat treatment units 100 and 101.

  Thereafter, the first central robot CR1 takes out the heat-treated substrate W from the antireflection film heat treatment units 100 and 101, and carries the substrate W into the antireflection film application processing unit 50. In the antireflection film coating processing unit 50, an antireflection film is applied and formed on the substrate W by the coating unit BARC in order to reduce standing waves and halation generated during exposure.

  Next, the first central robot CR1 takes out the coated substrate W from the antireflection film coating processing unit 50, and carries the substrate W into the antireflection film heat treatment units 100 and 101. Thereafter, the first central robot CR1 takes out the heat-treated substrate W from the antireflection film heat treatment units 100 and 101, and places the substrate W on the substrate platform PASS3.

  The substrate W placed on the substrate platform PASS3 is received by the second central robot CR2 of the resist film processing block 11. The second central robot CR2 carries the substrate W into the resist film heat treatment units 110 and 111.

  Thereafter, the second central robot CR2 takes out the heat-treated substrate W from the resist film heat treatment units 110 and 111, and carries the substrate W into the resist film coating treatment unit 60. In the resist film application processing unit 60, a resist film is applied and formed on the substrate W on which the antireflection film is applied and formed by the application unit RES.

  Next, the second central robot CR2 takes out the coated substrate W from the resist film coating processing unit 60, and carries the substrate W into the resist film heat treatment units 110 and 111. Thereafter, the second central robot CR2 takes out the heat-treated substrate W from the resist film heat treatment units 110 and 111, and places the substrate W on the substrate platform PASS5.

  The substrate W placed on the substrate platform PASS5 is received by the third central robot CR3 of the development processing block 12. The third central robot CR3 places the substrate W on the substrate platform PASS7.

  The substrate W placed on the substrate platform PASS7 is received by the fourth central robot CR4 of the interface block 15, and predetermined processing is performed in the interface block 15 and the exposure device 16, as will be described later. After predetermined processing is performed on the substrate W in the interface block 15 and the exposure apparatus 16, the substrate W is carried into the post-exposure bake heat treatment part 121 of the development processing block 12 by the fourth central robot CR4.

  In the post-exposure baking heat treatment part 121, post-exposure baking (PEB) is performed on the substrate W. Thereafter, the fourth central robot CR4 takes out the substrate W from the post-exposure bake heat treatment unit 121 and places the substrate W on the substrate platform PASS8.

  The substrate W placed on the substrate platform PASS8 is received by the third central robot CR3 of the development processing block 12. The third central robot CR3 carries the substrate W into the development processing unit 70. In the development processing unit 70, development processing is performed on the exposed substrate W.

  Next, the third central robot CR3 takes out the development-processed substrate W from the development processing unit 70, and carries the substrate W into the development heat treatment unit 120. Thereafter, the third central robot CR3 takes out the substrate W after the heat treatment from the development heat treatment unit 120 and places the substrate W on the substrate platform PASS6.

  The substrate W placed on the substrate platform PASS6 is placed on the substrate platform PASS4 by the second central robot CR2 of the resist film processing block 11. The substrate W placed on the substrate platform PASS4 is placed on the substrate platform PASS2 by the first central robot CR1 of the anti-reflection film processing block 10.

  The substrate W placed on the substrate platform PASS 2 is stored in the carrier C by the indexer robot IR of the indexer block 9. Thereby, each process of the board | substrate W in the substrate processing apparatus 500 is complete | finished.

(1-2-2) Operation of Interface Block Next, the operation of the interface block 15 will be described in detail.

  As described above, the substrate W carried into the indexer block 9 is subjected to a predetermined process and then placed on the substrate platform PASS7 of the development processing block 12 (FIG. 1).

  The substrate W placed on the substrate platform PASS7 is received by the fourth central robot CR4 of the interface block 15. The fourth central robot CR4 carries the substrate W into the edge exposure unit EEW (FIG. 4). In the edge exposure unit EEW, the peripheral portion of the substrate W is subjected to exposure processing.

  Next, the fourth central robot CR4 takes out the edge-exposed substrate W from the edge exposure unit EEW and carries the substrate W into one of the back surface cleaning processing units BC. In the back surface cleaning processing unit BC, as described above, the back surface cleaning processing is performed on the substrate W before the exposure processing.

  Here, the time of the exposure process by the exposure apparatus 16 is usually longer than the other process steps and the transport step. As a result, the exposure apparatus 16 often cannot accept a subsequent substrate W. In this case, the substrate W is temporarily stored in the sending buffer unit SBF (FIG. 4). In the present embodiment, the fourth central robot CR4 takes out the substrate W that has been subjected to the back surface cleaning processing from the back surface cleaning processing unit BC, and transports the substrate W to the sending buffer unit SBF.

  Next, the fourth central robot CR4 takes out the substrate W stored and stored in the sending buffer unit SBF, and carries the substrate W into the placement / cooling unit P-CP. The substrate W carried into the placement / cooling unit P-CP is maintained at the same temperature (for example, 23 ° C.) as that in the exposure apparatus 16.

  If the exposure apparatus 16 has a sufficient processing speed, the substrate W is transferred from the back surface cleaning processing unit BC to the placement / cooling unit P-CP without storing and storing the substrate W in the sending buffer unit SBF. May be.

  Subsequently, the substrate W maintained at the predetermined temperature by the placement / cooling unit P-CP is received by the upper hand H1 (FIG. 4) of the interface transport mechanism IFR, and the substrate carry-in section 16a in the exposure apparatus 16 is received. (FIG. 1).

  The substrate W that has been subjected to the exposure processing in the exposure device 16 is unloaded from the substrate unloading portion 16b (FIG. 1) by the interface transport mechanism IFR. The interface transport mechanism IFR places the substrate W on the substrate platform PASS9.

  The substrate W placed on the substrate platform PASS9 is received by the fourth central robot CR4. The fourth central robot CR4 transports the substrate W to the post-exposure bake heat treatment part 121 of the development processing block 12 (FIG. 1).

  If the development processing block 12 cannot temporarily accept the substrate W due to a failure of the development processing unit DEV (FIG. 2) or the like, the substrate W after the exposure processing is temporarily stored and stored in the return buffer unit RBF. be able to.

( 2 ) Back surface cleaning processing unit Next, the back surface cleaning processing unit BC will be described in detail with reference to the drawings. 5 and 6 are a side view and a schematic plan view showing the configuration of the back surface cleaning processing unit BC. FIG. 6 schematically shows some components of the back surface cleaning unit BC.

  In the present embodiment, the back surface cleaning processing unit BC includes a housing (not shown), and the following components are provided inside the housing.

  As shown in FIGS. 5 and 6, the back surface cleaning processing unit BC includes a spin chuck 600 that holds and rotates the substrate W horizontally. The spin chuck 600 includes a spin motor 200, a rotating shaft 210, a disk-shaped spin plate 520, a plate support member 510, a disk-shaped blocking plate 525, magnet plates 614a and 614b, and a plurality of chuck pins 615.

  A spin motor 200 is provided above the back surface cleaning processing unit BC. The spin motor 200 is supported by a motor support member 200s. The motor support member 200 s has a through hole 200 h extending in the vertical direction, and is attached to the motor fixing portion 290. The motor fixing part 290 is attached to the housing of the back surface cleaning processing unit BC (not shown).

  A rotating shaft 210 having a cylindrical shape is provided so as to extend downward from the inside of the spin motor 200. The rotating shaft 210 functions as an output shaft of the spin motor 200.

  A plate support member 510 is attached to the lower end of the rotating shaft 210. As will be described later, the plate support member 510 has a cylindrical shape. The spin plate 520 is supported horizontally by the plate support member 510. A blocking plate 525 is horizontally fixed to the lower surfaces of the plate support member 510 and the spin plate 520 by fixing members 525a and 525b. A through hole 525 h is formed at the center of the blocking plate 525. As the rotation shaft 210 is rotated by the spin motor 200, the plate support member 510, the spin plate 520, and the blocking plate 525 rotate integrally around the vertical axis.

  A fluid supply pipe 400 is inserted through the through hole 200h of the motor support member 200s, the rotation shaft 210 of the spin motor 200, and the plate support member 510. A gas can be supplied through the fluid supply pipe 400 onto the substrate W held by the spin chuck 600. Details of the structure of the fluid supply pipe 400 and its peripheral members will be described later.

  A plurality (five in FIG. 6) of chuck pins 615 are provided at equiangular intervals with respect to the rotating shaft 210 at the peripheral edge of the spin plate 520. The number of chuck pins 615 is desirably five or more. The reason will be described later.

  Each chuck pin 615 includes a shaft portion 615a, a pin support portion 615b, a holding portion 615c, and a magnet 616. A shaft portion 615a is provided so as to penetrate the spin plate 520, and a pin support portion 615b extending in the horizontal direction is connected to a lower end portion of the shaft portion 615a. A holding portion 615c is provided so as to protrude downward from the tip portion of the pin support portion 615b. Further, a magnet 616 is attached to the upper end portion of the shaft portion 615a on the upper surface side of the spin plate 520.

  Each chuck pin 615 can rotate around the vertical axis about the shaft portion 615a, the closed state where the holding portion 615c abuts on the outer peripheral end portion of the substrate W, and the holding portion 615c from the outer peripheral end portion of the substrate W. It can be switched to an open state in which they are separated. In this example, each chuck pin 615 is closed when the N pole of the magnet 616 is inside, and each chuck pin 615 is opened when the S pole of the magnet 616 is inside.

  Magnet plates 614 a and 614 b are arranged above the spin plate 520 along the circumferential direction around the rotation shaft 210. The magnet plates 614a and 614b have an S pole on the outside and an N pole on the inside. The magnet plates 614a and 614b are lifted and lowered independently by the magnet lifting mechanisms 617a and 617b, respectively, and between the upper position higher than the magnet 616 of the chuck pin 615 and the lower position substantially equal to the magnet 616 of the chuck pin 615. Moving.

  Each chuck pin 615 is switched between an open state and a closed state by raising and lowering the magnet plates 614a and 614b. Details of operations of the magnet plates 614a and 614b and the chuck pin 615 will be described later.

  A guard 618 is provided outside the spin chuck 600 to receive the cleaning liquid scattered from the substrate W. The guard 618 has a rotationally symmetric shape with respect to the rotation axis 210 of the spin chuck 600. Further, the guard 618 is moved up and down by a guard lifting mechanism 618a. The cleaning liquid received by the guard 618 is drained or collected by a draining device or a collecting device (not shown).

  Outside the guard 618, three or more (three in this example) substrate transfer mechanisms 620 are arranged at equiangular intervals around the rotation shaft 210 of the spin chuck 600. Each substrate transfer mechanism 620 includes a lifting / lowering rotation drive unit 621, a rotation shaft 622, an arm 623, and a holding pin 624. A rotation shaft 622 is provided so as to extend upward from the ascending / descending rotation driving unit 621, and an arm 623 is connected so as to extend in the horizontal direction from the upper end of the rotation shaft 622. A holding pin 624 for holding the outer peripheral end of the substrate W is provided at the tip of the arm 623.

  The rotating shaft 622 performs a lifting / lowering operation and a rotating operation by the lifting / lowering driving unit 621. Thereby, the holding pin 624 moves in the horizontal direction and the vertical direction.

  Further, a substantially cylindrical back surface cleaning brush 630 is disposed below the back surface cleaning processing unit BC. The back surface cleaning brush 630 is attached to the rotating shaft of the motor 635 and is driven to rotate about the vertical axis. The motor 635 is held by a brush holding member 631. The brush holding member 631 is driven by the brush moving mechanism 632. Accordingly, the cleaning brush 630 moves in the horizontal direction and the vertical direction.

  A cleaning nozzle 633 is attached to a portion of the brush holding member 631 in the vicinity of the cleaning brush 630. A liquid supply pipe (not shown) to which a cleaning liquid is supplied is connected to the cleaning nozzle 633. The discharge port of the cleaning nozzle 633 is directed to the periphery of the cleaning brush 630, and the cleaning liquid is discharged from the discharge port toward the periphery of the cleaning brush 630. In this example, pure water is used as the cleaning water.

( 3 ) Details of Fluid Supply Pipe Details of the structure of the fluid supply pipe 400 and its peripheral members in FIG. 5 will be described with reference to FIGS. FIG. 7 is a longitudinal sectional view mainly showing the structure of the fluid supply pipe 400 of FIG. FIG. 8A is an enlarged longitudinal sectional view showing the structure near the tip of the fluid supply pipe 400 of FIG. 5, and FIG. 8B is a view of the fluid supply pipe 400 viewed from the arrow YA of FIG. It is a top view of a front-end | tip part.

  As described above, the fluid supply pipe 400 is inserted through the motor support member 200s, the spin motor 200, the rotating shaft 210, and the plate support member 510.

  As shown in FIG. 7, the fluid supply pipe 400 is curved above the motor support member 200s and extends in the horizontal direction. In the following description, the end portion of the straight pipe portion extending in the vertical direction is referred to as a front end portion, and the end portion of the straight pipe portion extending in the horizontal direction is referred to as a rear end portion.

  In the fluid supply pipe 400, a first flange FR1 is integrally formed in the vicinity of the curved portion of the straight pipe portion extending in the vertical direction. A second flange FR2 is integrally formed at the rear end.

  The first flange FR1 is fixed to the motor support member 200s, and the second flange FR2 is fixed to the pipe fixing portion 280. The tube fixing part 280 is attached to the housing of the back surface cleaning unit BC (not shown).

  Thereby, the fluid supply pipe 400 is fixed to the housing of the back surface cleaning processing unit BC by the pipe fixing portion 280, the motor support member 200s, and the motor fixing portion 290.

  As described above, the spin motor 200 is supported by the motor support member 200s. Thus, the fluid supply pipe 400 is attached to the motor support member 200s, so that the positional relationship between the fluid supply pipe 400 and the spin motor 200 is maintained even when the spin motor 200 operates. Therefore, it is possible to prevent the displacement of the fluid supply pipe 400 from occurring.

As shown in FIGS. 8A and 8B, the fluid supply pipe 400 has a structure in which the gas supply pipe 420 is accommodated in the guide pipe 410. The gas supply pipe 420 is used to supply gas (N ₂ gas in this example) to the substrate W.

  In the present embodiment, guide tube 410 is made of stainless steel. The gas supply pipe 420 is made of a fluororesin such as PTFE (tetrafluoroethylene resin) and PFA (tetrafluoroethylene / perfluoroalkoxyethylene copolymer).

As shown in FIG. 8A, the gas supply pipe 420 is provided so that the tip portion slightly protrudes downward from the through hole 525 h of the blocking plate 525. Thereby, N ₂ gas can be reliably supplied between the blocking plate 525 and the substrate W. Note that the distal end of the gas supply pipe 420 may be fixed to the blocking plate 525.

  The peripheral members at the tip of the fluid supply pipe 400 will be described. In this example, the rotating shaft 210 has an inner diameter of about 20 mm, and the guide tube 410 has an outer diameter of about 18 mm. Thus, a gap GA of about 1 mm is formed between the rotating shaft 210 and the guide tube 410 in a state where the fluid supply tube 400 is attached to the motor support member 200s and the tube fixing portion 280 of FIG.

  A plate support member 510 having a substantially cylindrical shape is attached to the rotating shaft 210 in the vicinity of the distal end portion of the fluid supply pipe 400. An inner peripheral surface 510h of the plate support member 510 is formed in a step shape along the axis.

  When the plate support member 510 is attached to the rotating shaft 210, the cylindrical pad fixing piece 512 is fitted into the gap between the inner peripheral surface 510 h of the plate supporting member 510 and the outer peripheral surface of the rotating shaft 210. Is screwed to the screw receiving portion 511 of the plate support member 510. As a result, the plate support member 510 is securely fixed to the tip of the rotating shaft 210.

  A flange 510F is formed near the lower end of the plate support member 510. The spin plate 520 is fixed to the rotating shaft 210 by screwing the flange 510F and the spin plate 520.

  Returning to FIG. 7, the second flange FR <b> 2 is formed at the rear end of the fluid supply pipe 400 as described above. The second flange FR2 is fixed to the tube fixing portion 280. A supply pipe fixing part 490 is provided in the vicinity of the rear end of the fluid supply pipe 400. In the supply pipe fixing part 490, the gas supply pipe 420 is fixed to the guide pipe 410.

The gas supply pipe 420 extends from the rear end of the guide pipe 410 to the outside. The rear end portion of the gas supply pipe 420 extending from the rear end portion of the guide tube 410 is connected to a gas supply device (not shown). By N ₂ gas is supplied to the gas supply pipe 420 from the gas supply apparatus, N ₂ gas is supplied to the substrate W.

( 4 ) Substrate Holding Operation The substrate W holding operation by the spin chuck 600 will be described. 9 and 10 are diagrams for explaining the holding operation of the substrate W by the spin chuck 600. FIG.

  First, as shown in FIG. 9A, the guard 618 moves to a position lower than the chuck pin 615. Then, the holding pins 624 of the plurality of substrate transfer mechanisms 620 (FIG. 5) move below the spin plate 520 through the guard 618. The substrate W is placed on the plurality of holding pins 624 by the fourth central robot CR4 (FIG. 1).

  At this time, the magnet plates 614a and 614b are in the upper position. In this case, the magnetic force lines B of the magnet plates 614a and 614b are directed from the inside to the outside at the height of the magnet 616 of the chuck pin 615. Thereby, the south pole of the magnet 616 of each chuck pin 615 is attracted inward. Therefore, each chuck pin 615 is opened.

  Subsequently, as shown in FIG. 9B, the plurality of holding pins 624 rise while holding the substrate W. As a result, the substrate W moves between the holding portions 615c of the plurality of chuck pins 615.

  Subsequently, as shown in FIG. 10C, the magnet plates 614a and 614b move to the lower position. In this case, the N pole of the magnet 616 of each chuck pin 615 is attracted inward. Thereby, each chuck pin 615 is closed, and the outer peripheral end portion of the substrate W is held by the holding portion 615c of each chuck pin 615. Each chuck pin 615 holds the outer peripheral end of the substrate W between adjacent holding pins 624. Therefore, the chuck pin 615 and the holding pin 624 do not interfere with each other. Thereafter, the plurality of holding pins 624 move outward from the guard 618.

  Subsequently, as shown in FIG. 10D, the guard 618 moves to a height surrounding the substrate W held by the chuck pins 615. And the back surface washing process of the board | substrate W is performed.

( 5 ) Backside Cleaning Processing FIGS. 11 and 12 are side views for explaining the backside cleaning processing of the substrate W. FIG.

As shown in FIG. 11, during the back surface cleaning process of the substrate W, the substrate W is rotated by the spin chuck 600 and N ₂ gas is supplied between the blocking plate 525 and the substrate W through the gas supply pipe 420. As a result, an N ₂ gas stream is formed between the blocking plate 525 and the substrate W from the center of the substrate W toward the outside.

  In this state, the cleaning brush 630 contacts the back surface of the substrate W while being rotated by the motor 635. Then, the cleaning brush 630 moves between the lower part of the center of the substrate W and the lower part of the peripheral edge, and contacts the entire back surface of the substrate W. Pure water is supplied from the cleaning nozzle 633 to the contact portion between the substrate W and the cleaning brush 630. As a result, the entire back surface of the substrate W is cleaned by the cleaning brush 630 and contaminants attached to the back surface of the substrate W are removed.

  Subsequently, as shown in FIG. 12A, the magnet plate 614a is disposed at the lower position, and the magnet plate 614b is disposed at the upper position. In this case, as shown in FIGS. 12A and 12B, in the outer region R1 of the magnet plate 614a (see FIG. 12B), each chuck pin 615 is closed, and the magnet plate 614b In the outer region R2 (see FIG. 12B), each chuck pin 615 is in an open state. That is, the holding portion 615c of each chuck pin 615 is maintained in contact with the outer peripheral end of the substrate W when passing through the outer region R1 of the magnet plate 614a, and passes through the outer region R2 of the magnet plate 614b. At this time, the substrate W is separated from the outer peripheral end portion.

  Therefore, in the outer region R2 of the magnet plate 614b, the lower surface side portion of the outer peripheral end portion of the substrate W can be cleaned by the cleaning brush 630.

  In this example, at least four of the five chuck pins 615 are located in the outer region R1 of the magnet plate 614a. In this case, even if the holding portion 615c of each chuck pin 615 passes through the outer region R2 of the magnet plate 614b, the substrate W is held by at least four chuck pins 615 even if separated from the outer peripheral end portion of the substrate W. . Thereby, the stability of the substrate W is ensured.

After the back surface cleaning process is completed, the magnet plates 614a and 614b are arranged at the lower position, and the substrate W is held by all the chuck pins 615. In this state, the substrate W is rotated at a high speed by the spin chuck 600. Thereby, the pure water adhering to the substrate W is shaken off, and the substrate W is dried.

( 6 ) Effect of Embodiment In this embodiment, the back surface cleaning process is performed on the substrate W before the exposure process in the back surface cleaning processing unit BC. In this case, the back surface of the substrate W is cleaned by the cleaning brush 630 while N ₂ gas is continuously supplied to the surface of the substrate W. Accordingly, it is possible to reliably remove contaminants attached to the back surface of the substrate W while preventing the liquid from attaching to the surface of the substrate W.

  Therefore, it is possible to reliably prevent the occurrence of defocus due to unevenness on the back surface of the substrate W during the exposure process. Further, the liquid is prevented from adhering to the resist film formed on the surface of the substrate W, and the state of the resist film can be maintained normally. As a result, the occurrence of processing defects on the substrate W can be reliably prevented.

  Further, in the back surface cleaning processing unit BC, the spin chuck 600 that holds the substrate W is positioned above the substrate W. Therefore, the entire back surface of the substrate W can be cleaned by the cleaning brush 630 with the back surface of the substrate W facing downward. Therefore, unlike the case where the back surface of the substrate W is directed upward, the liquid supplied to the back surface of the substrate W does not flow into the front surface side of the substrate W due to gravity. As a result, it is possible to more reliably prevent the liquid from adhering to the surface of the substrate W. In addition, since it is not necessary to provide a reversing mechanism for reversing the substrate W, it is possible to suppress an increase in size and cost of the substrate processing apparatus 500.

  Further, in the back surface cleaning processing unit BC, a stainless steel guide tube 410 of the fluid supply tube 400 is inserted into the rotating shaft 210 of the spin motor 200 and the inside of the plate support member 510. The guide tube 410 is supported by a motor support member 200s that supports the spin motor 200 so that a gap GA is formed between the guide tube 410 and the inner peripheral surface of the rotation shaft 210. Since the stainless steel guide tube 410 has high rigidity, the gap GA between the guide tube 410 and the inner peripheral surface of the rotation shaft 210 is kept constant even when the rotation shaft 210 rotates. This reliably prevents the guide tube 410 from coming into contact with the rotating shaft 210.

  Further, since the guide tube 410 is supported by the spin motor 200, the positional relationship between the rotating shaft 210 and the guide tube 410 is maintained even when the spin motor 200 vibrates. This more reliably prevents the guide tube 410 from coming into contact with the rotating shaft 210.

  Further, since the resin gas supply tube 420 has flexibility, it can be easily inserted into the guide tube 410.

  Further, by attaching the guide tube 410 into which the gas supply tube 420 is inserted to the spin motor 200, the fluid supply tube 400 can be easily assembled to the back surface cleaning processing unit BC.

  Specifically, the spin motor 200 is supported by the motor support member 200s, and the first flange FR1 of the guide tube 410 is fixed to the motor support member 200s. Accordingly, the guide tube 410 is securely fixed to the spin motor 200 via the first flange FR1 and the motor support member 200s. In addition, the fluid supply pipe 400 can be easily fixed to the spin motor 200 by attaching the first flange FR1 of the guide pipe 410 to the motor support member 200s. Therefore, it becomes easier to manufacture the back surface cleaning unit BC.

(7) Modification (7-1)
In the above embodiment, it has been described that the guide pipe 410 of the fluid supply pipe 400 is formed of stainless steel. However, as a material for forming the guide pipe 410, in addition to stainless steel, iron, copper, bronze, brass, A tough metal material such as aluminum, silver, or gold can be used.

  In addition, the gas supply pipe 420 has been described as being formed of a fluororesin. However, as a material for forming the gas supply pipe 420, PVC (polyvinyl chloride), PPS (polyphenylene sulfide), PTFE (polyethylene) in addition to the fluororesin. A resin material having flexibility such as tetrafluoroethylene) or PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer) can also be used.

(7-2)
As a reference example, in the back surface cleaning processing units BC, without providing the shielding plate 525 may be supplied with N ₂ gas into the space between them is brought close to the spin plate 520 and the substrate W.

(7-3)
The number of backside cleaning processing unit BC, coating unit BARC, RES, development processing unit DEV, heating unit HP, cooling unit CP, and mounting / cooling unit P-CP is appropriately changed according to the processing speed of each processing block. Also good.

(7-4)
In the above-described embodiment, the back surface cleaning processing unit BC is disposed in the interface block 15, but the back surface cleaning processing unit BC may be disposed in the development processing block 12 shown in FIG. Alternatively, a back surface cleaning processing block including the back surface cleaning processing unit BC may be provided between the development processing block 12 and the interface block 15 shown in FIG.

(8) Correspondence between each constituent element of claim and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the back surface cleaning processing unit BC is an example of a substrate cleaning device, the spin chuck 600 is an example of a substrate rotation holding device, the fluid supply pipe 400 is an example of a gas supply means, and the back surface cleaning brush 630. Is an example of the cleaning tool, the cleaning nozzle 633 is an example of the cleaning liquid supply means, the spin plate 520 is an example of the rotating member, the spin motor 200 and the rotating shaft 210 are examples of the rotation driving mechanism, and the holding portion 615c. Is an example of the holding member, the guide tube 410 is an example of the outer tube, the gas supply tube 420 is an example of the inner tube, the motor support member 200s is an example of the support member, and the first flange FR1 is the flange portion. It is an example.

  The indexer block 9, the antireflection film processing block 10, the resist film processing block 11 and the development processing block 12 are examples of processing units, the interface block 15 is an example of a delivery unit, and the coating unit RES is photosensitive. It is an example of a film formation unit.

  As each constituent element in the claims, various other elements having configurations or functions described in the claims can be used.

  The present invention can be effectively used for processing various substrates.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. It is one side view of the substrate processing apparatus of FIG. It is the other side view of the substrate processing apparatus of FIG. It is the schematic side view which looked at the interface block from the exposure apparatus side. It is a side view which shows the structure of a back surface cleaning process unit. It is a schematic plan view which shows the structure of a back surface cleaning process unit. FIG. 6 is a longitudinal sectional view mainly showing the structure of the fluid supply pipe of FIG. 5. (A) is an enlarged longitudinal sectional view showing the structure in the vicinity of the tip of the fluid supply pipe in FIG. 5, and (b) is a plan view of the tip of the fluid supply pipe as seen from the arrow YA in FIG. 8 (a). is there. It is a figure for demonstrating holding | maintenance operation | movement of the board | substrate by a spin chuck. It is a figure for demonstrating holding | maintenance operation | movement of the board | substrate by a spin chuck. It is a side view for demonstrating the back surface cleaning process of a board | substrate. It is the side view and top view for demonstrating the back surface cleaning process of a board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 9 Indexer block 10 Anti-reflective film processing block 11 Resist film processing block 12 Development processing block 15 Interface block 16 Exposure apparatus 200 Spin motor 210 Rotating shaft 400 Fluid supply pipe 410 Guide pipe 420 Gas supply pipe 500 Substrate processing apparatus 520 Spin plate 600 Spin chuck 615 Chuck pin 615c Holding part 630 Back surface cleaning brush 633 Cleaning nozzle BARC, RES Coating unit BC Back surface cleaning processing unit CR1 to CR4 First to fourth central robots DEV Development processing unit IFR interface transport mechanism W substrate

Claims (4)

A substrate cleaning apparatus for cleaning the lower surface of a substrate,
A substrate rotation holding device that rotates while holding the substrate substantially horizontal;
Gas supply means for supplying gas to the upper surface of the substrate held by the substrate rotation holding device;
A cleaning tool for cleaning the lower surface of the substrate held by the substrate rotation holding device;
Cleaning liquid supply means for supplying a cleaning liquid to the lower surface of the substrate held by the substrate rotation holding device;
The substrate rotation holding device is
A rotating member provided to be rotatable around a rotation axis along a substantially vertical direction;
A rotation drive mechanism that is provided on the upper side of the rotating member and rotates the rotating member;
A holding member that is provided on the lower side of the rotating member so as to rotate integrally with the rotating member and holds the substrate by contacting an outer peripheral end of the substrate disposed on the lower side of the rotating member;
And a shielding plate provided on the lower side of the rotary member to rotate the upper surface of Ikatsu to the rotating member integrally covering the substrate held by the holding member,
The gas supply means includes the shielding plate and the substrate through a through-hole formed in a substantially central portion of the shielding plate so that an airflow is formed between the shielding plate and the substrate from the central portion of the substrate toward the outside. A substrate cleaning apparatus, wherein gas is supplied between the two. The rotation drive mechanism has a hollow rotation shaft extending in the vertical direction,
The rotating member has an opening at a central portion and is attached to the rotating shaft so as to rotate integrally with the rotating shaft,
The gas supply means includes
A metal made of metal that is inserted into the rotary shaft of the rotary drive mechanism and through the opening of the rotary member and supported by the rotary drive mechanism so as to form a certain gap with the inner peripheral surface of the rotary shaft. An outer tube,
2. A resin-made inner tube that is inserted into the outer tube and has a discharge port at an end facing the upper surface of the substrate, and supplies gas from the discharge port to the substrate. The substrate cleaning apparatus as described. A support member that supports the rotation drive mechanism so that the rotation shaft extends in a vertical direction;
The substrate cleaning apparatus according to claim 2, wherein the outer tube has a flange portion, and the flange portion is fixed to the support member. A substrate processing apparatus that is disposed adjacent to an exposure apparatus and performs processing on a substrate having a front surface and a back surface,
A processing unit for processing the substrate;
A delivery unit for delivering a substrate between the processing unit and the exposure apparatus;
The processing unit includes a photosensitive film forming unit that forms a photosensitive film made of a photosensitive material on the surface of the substrate,
At least one of the processing unit and the delivery unit is
Including a substrate cleaning device for cleaning the back surface of the substrate before the exposure processing by the exposure device;
The substrate cleaning apparatus includes:
A substrate rotation holding device for rotating the substrate with the surface facing upward while holding the substrate substantially horizontally;
Gas supply means for supplying gas to the surface of the substrate held by the substrate rotation holding device;
A cleaning tool for cleaning the back surface of the substrate held by the substrate rotation holding device;
Cleaning liquid supply means for supplying a cleaning liquid to the back surface of the substrate held by the substrate rotation holding device;
The substrate rotation holding device is
A rotating member provided to be rotatable around a rotation axis along a substantially vertical direction;
A rotation drive mechanism that is provided on the upper side of the rotating member and rotates the rotating member;
A holding member that is provided on the lower side of the rotating member so as to rotate integrally with the rotating member and holds the substrate by contacting an outer peripheral end of the substrate disposed on the lower side of the rotating member;
And a shielding plate provided on the lower side of the rotary member to rotate the upper surface of Ikatsu to the rotating member integrally covering the substrate held by the holding member,
The gas supply means includes the shielding plate and the substrate through a through-hole formed in a substantially central portion of the shielding plate so that an airflow is formed between the shielding plate and the substrate from the central portion of the substrate toward the outside. A substrate processing apparatus, wherein a gas is supplied between the two.

Images