JP5452285B2 - Film processing equipment - Google Patents

Description

  The present invention relates to a film processing apparatus for processing a film to be processed while being adsorbed on an adsorption surface before the treatment is performed, and in particular, a technique for suppressing wrinkles when a film is adsorbed to an adsorption surface About.

  Generally, a film is made of a thin material such as a resin sheet, and depending on the material, it is used for various purposes because it can be bent while maintaining a certain strength.

  In recent years, with the development of an information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. In addition, information is recorded on a label attached to a product or the like, and the product or the like is managed using the label. As one of such cards and labels, a non-contact type IC card or a non-contact type IC label on which an IC capable of writing and reading information in a non-contact state with respect to the card or label is mounted. Although used, films are also used in non-contact type IC cards and non-contact type IC labels.

  A non-contact type IC card or a non-contact type IC label is formed by forming a conductive antenna on a film and sandwiching an inlet on which an IC chip is mounted between a card substrate or a label substrate. In order to manufacture an inlet, first, an antenna is formed on a film with conductive ink, and then an IC chip is mounted on the film so as to be connected to the antenna, and the IC chip is adhered to the film by heat or the like. .

  The inlet as described above is manufactured from a large antenna sheet in which a plurality of inlets are arranged in a matrix. In this case, as described above, an antenna is formed for each of the inlets arranged on the antenna sheet, an IC chip is mounted and bonded, and then the inlet is cut to manufacture the inlet.

  Here, when the IC chip is mounted on the film or when the IC chip is heated and adhered to the film, if the IC chip mounting part is wrinkled, the connection between the IC chip and the antenna is sufficient. Therefore, such a process is performed by adsorbing the film to the table. In order to make a film adsorb | suck to a table, first, a film is mounted on a table, Then, the air between a film and a table is attracted | sucked from the circumference | surroundings of a table. Thereby, while a film is fixed to a table, it is avoiding that a wrinkle arises in a film.

  However, when the film becomes large, wrinkles may occur at the center of the film. In addition, even when printing on the film or when pin holes are opened, since high positional accuracy is required, processing is performed by adsorbing the film to the table. In addition, wrinkles occur in the center of the film.

  Here, Patent Document 1 discloses a technique in which a pressing plate is arranged so as to have a space between the film placed on the substrate and then the pressing plate is brought into contact with the film so that the film is adsorbed to the substrate. Has been. In this technique, after a film is placed on a substrate, a pressing plate is disposed so as to have a space between the film, and then air between the pressing plate and the film is sucked. Then, the pressing plate is curved and sequentially comes into contact with the film from the central portion, and the film is pressed against the substrate. In this state, the film is sucked from the substrate side. After that, the suction of air between the press plate and the film is released and the press plate returns to its original state, but since the film is sucked from the substrate side, the film can be reliably adsorbed to the substrate. become.

JP 2003-107235 A

  However, in the technique disclosed in Patent Document 1 described above, first, the film is pressed against the substrate by bending the pressing plate, and the film is sucked from the substrate side in that state, and then the pressing plate is returned to the original state. Therefore, there is a problem that the control at the time of sucking the film on the suction surface becomes complicated. In addition, it is necessary to select a pressing plate that has an appropriate elastic force so as to bend when the air between the film is sucked and press the film against the substrate and return to its original state when the suction is released. However, there is a problem that it takes time and effort in the design stage.

  In addition, in a film subjected to the processing as described above, a region along the peripheral portion such as the four corners of the film in order to perform accurate alignment by detecting the inclination of the film when the processing is performed. However, when the film is pressed against the substrate by curving the holding plate as described above, it is difficult to eliminate the wrinkles generated at the peripheral edge of the film provided with the alignment mark. In the case where wrinkles exist in the vicinity of the alignment mark, there is a problem that accurate alignment cannot be performed when processing the film.

  The present invention has been made in view of the problems of the conventional techniques as described above, and is complicated in control in a film processing apparatus that processes a film that is processed while being adsorbed on an adsorption surface. It is an object of the present invention to provide a film processing apparatus capable of adsorbing a film to an adsorption surface without causing wrinkles even in the vicinity of an alignment mark provided in a region along the peripheral edge of the film. .

In order to achieve the above object, the present invention provides:
An alignment mark is provided in a region along the peripheral edge, and a film that is gradually adsorbed from the central portion toward the peripheral edge on the suction surface and processed in a state of being sucked on the suction surface, A film processing apparatus for processing before processing is performed,
Recognition means for recognizing the alignment mark;
Hole processing means for forming a long hole whose longitudinal direction is a direction radially extending from the central portion in the vicinity of the alignment mark recognized by the recognition means in the film.

  In the present invention configured as described above, an alignment mark is provided in a region along the peripheral edge, and the suction mark is gradually sucked from the central portion toward the peripheral edge, and is sucked to the suction surface. In the film subjected to the above processing, an alignment mark is recognized, and a long hole having a longitudinal direction extending in a radial direction from the central portion is formed in the vicinity of the alignment mark. When the film processed in this way is gradually adsorbed from the central part to the peripheral part on the adsorption surface, the air remaining between the adsorption surface and the film is guided from the central part of the film to the peripheral part. However, since a long hole is formed in the vicinity of the alignment mark provided in the region along the peripheral edge of the film, the air guided from the central part of the film to the peripheral edge escapes from the long hole to the outside. In addition, since the long hole has a longitudinal direction in which the air is guided, the air can easily escape to the outside.

In addition, an alignment mark is provided in a region along the peripheral edge, and a film that is gradually sucked from the central portion toward the peripheral edge on the suction surface and processed in a state of being sucked on the suction surface. , A film processing apparatus for processing before the treatment is performed,
Recognition means for recognizing the alignment mark;
Hole processing means for forming a combined hole composed of a plurality of holes adjacent to each other in a direction extending radially from the central portion in the vicinity of the alignment mark recognized by the recognition means in the film.

  In the present invention configured as described above, an alignment mark is provided in a region along the peripheral edge, and the suction mark is gradually sucked from the central portion toward the peripheral edge, and is sucked to the suction surface. In the film to be processed in step (b), an alignment mark is recognized, and an assembled hole composed of a plurality of holes adjacent in a direction extending radially from the central portion is formed in the vicinity of the alignment mark. When the film processed in this way is gradually adsorbed from the central part to the peripheral part on the adsorption surface, the air remaining between the adsorption surface and the film is guided from the central part of the film to the peripheral part. However, since an assembly hole composed of a plurality of holes is formed in the vicinity of the alignment mark provided in the region along the peripheral edge of the film, the air guided from the center of the film to the peripheral edge The holes escape to the outside, and the plurality of holes constituting the assembly hole are adjacent to each other in the direction in which the air is guided, so that the air easily escapes to the outside.

  Thus, in the film processed by the film processing apparatus of the present invention, the air remaining between the adsorption surface and the film is simply adsorbed on the adsorption surface gradually from the central portion toward the peripheral portion. Since it escapes to the outside, the film is adsorbed to the adsorption surface without any wrinkles in the vicinity of the alignment mark provided in the area along the peripheral edge of the film without complicating the control, and then the alignment is performed. The film can be accurately aligned using the mark.

  As described above, in the present invention, in the vicinity of the alignment mark provided in the region along the peripheral edge of the film, a long hole whose longitudinal direction is the direction extending radially from the central portion, or radially extending from the central portion. Since the assembly hole is composed of a plurality of holes adjacent to each other in the direction, when this film is gradually adsorbed from the central part to the peripheral part on the adsorption surface, it remains between the adsorption surface and the film. The air is guided from the central part of the film to the peripheral part, and escapes from the long holes and the assembly holes in the region along the peripheral part of the film, thereby preventing the peripheral edge of the film from being complicated. The film can be adsorbed on the adsorption surface without wrinkles even in the vicinity of the alignment mark provided in the region along the part, and then the film using the alignment mark It is possible to align accurately.

It is a figure which shows an example of the inlet manufacturing machine using 1st Embodiment of the film processing apparatus of this invention. It is a figure which shows the antenna sheet | seat in which the punching process was given with the film processing apparatus shown in FIG. It is a figure which shows the film adsorption | suction mechanism in the film processing apparatus shown in FIG. 1, (a) is the figure seen from the top, (b) is a figure which shows the structure of the adsorption | suction table shown in (a), (c) is AA 'sectional drawing shown to (b), (d) is a figure which shows the state at the time of adsorb | sucking a film. It is a figure for demonstrating the adsorption | suction operation | movement of the antenna sheet in the film adsorption | suction mechanism shown in FIG. It is a figure for demonstrating the effect by the long hole of the antenna sheet | seat shown in FIG. It is a figure which shows an example of the inlet manufacturing machine using 2nd Embodiment of the film processing apparatus of this invention. It is a figure which shows the antenna sheet | seat in which the punching process was given with the film processing apparatus shown in FIG. It is a figure for demonstrating the effect by the assembly hole of the antenna sheet | seat shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a view showing an example of an inlet manufacturing machine using the first embodiment of the film processing apparatus of the present invention.

  As shown in FIG. 1, the film processing apparatus in this embodiment is used in an inlet manufacturing machine 1 for manufacturing an inlet used for a non-contact type IC card or a non-contact type IC label using a continuous antenna sheet 10. It is done.

  The inlet manufacturing machine 1 pulls out the antenna sheet 10 taken up by the sheet roll 40a, punches the antenna sheet 10 with the film processing apparatus 20, and then forms the antenna sheet 10 on the antenna sheet 10 with the film processing apparatus 30. An IC chip is mounted, bonded, and wound around a sheet roll 40b. Buffer units 60a and 60b are provided between the film processing apparatus 20 and the film processing apparatus 30, and between the film processing apparatus 30 and the sheet roll 40b. Thereby, the antenna sheet 10 pulled out from the sheet roll 40a is continuously conveyed through the film processing apparatus 20 to a region where the pair of rollers 51a and 51b face each other, and the rollers 51a and 51b face each other. Between the region and the region where the pair of rollers 52a and 52b are opposed to each other via the film processing device 30, the roller 51a and 51b are intermittently conveyed and the roller 51a and 51b are wound around the sheet roll 40b. Are transported continuously.

  The film processing apparatus 20 is recognized by the marker recognizing unit 21 that recognizes the alignment mark 14 (see FIG. 2) provided on the antenna sheet 10 and the marker recognizing unit 21 of the antenna sheet 10. The hole processing portion 22 forms a long hole 11 (see FIG. 2) in a region including the vicinity of the alignment mark 14.

  Below, operation | movement of the inlet manufacturing machine 1 comprised as mentioned above is demonstrated.

  First, the continuous antenna sheet 10 wound around the sheet roll 40a is pulled out by the rotation of the rollers 51a and 51b. The continuous antenna sheet 10 wound around the sheet roll 40a is contactless with a non-contact IC card or a non-contact IC label produced using the antenna sheet 10 on a continuous film substrate. An antenna for performing communication is formed.

  The continuous antenna sheet 10 pulled out from the sheet roll 40a is continuously conveyed to the film processing apparatus 20.

  In the film processing apparatus 20, punching is performed on the continuous antenna sheet 10 drawn from the sheet roll 40a.

  FIG. 2 is a diagram illustrating the antenna sheet 10 that has been punched by the film processing apparatus 20 illustrated in FIG. 1.

  As shown in FIG. 2, the continuous antenna sheet 10 pulled out from the sheet roll 40 a is partitioned as a unit antenna sheet 10 a for each unit that is processed or processed by the film processing apparatus 20 or the film processing apparatus 30. Alignment marks 14 are provided at the four corners of the unit antenna sheet 10a.

  In the film processing apparatus 20, first, the marker recognition unit 21 recognizes the alignment mark 14 for each unit antenna sheet 10a.

  Next, in the hole processing unit 22, a plurality of elliptical lengths are provided in each of the regions along the conveyance direction both sides of the continuous antenna sheet 10 including the vicinity of the alignment mark 14 recognized by the marker recognition unit 21. A hole 11 is formed. Each of the long holes 11 has a longitudinal direction extending radially from the central portion 12 of the unit antenna sheet 10a. That is, the long hole 11 whose longitudinal direction is the direction radially extending from the central portion 12 of the unit antenna sheet 10a is formed in a region including the vicinity of the alignment mark 14 provided on the unit antenna sheet 10a. In addition, in the hole processing part 22, the position of the area | region along the conveyance direction both sides of the continuous antenna sheet 10 is detected based on the position of the alignment mark 14 recognized by the marker recognition part 21, and the detection is performed. A long hole 11 is formed in the region.

  The antenna sheet 10 that has been perforated as shown in FIG. 2 in the film processing apparatus 20 is conveyed to the buffer unit 60a.

  In the buffer unit 60a, the antenna sheet 10 is continuously conveyed by the rotation of the rollers 51a and 51b, but the rollers 52a, 52b, 53a and 53b are intermittently moved downstream by the intermittent rotation of stop / go. Are being discharged. This is because higher processing accuracy is required for processing the antenna sheet 10 in the film processing apparatus 30 than processing in the film processing apparatus 20.

  The antenna sheet 10 discharged from the buffer unit 60a by the rotation of the rollers 52a, 52b, 53a, and 53b is conveyed to the film processing apparatus 30, and an IC chip is mounted on the film processing apparatus 30.

  3A and 3B are diagrams showing a film suction mechanism in the film processing apparatus 30 shown in FIG. 1, wherein FIG. 3A is a top view, and FIG. 3B is a configuration of the suction table 31 shown in FIG. FIG. 4C is a cross-sectional view taken along the line AA ′ shown in FIG. 4B, and FIG. 4D is a diagram illustrating a state when the film is adsorbed. FIG. 4 is a view for explaining the suction operation of the antenna sheet 10 in the film suction mechanism shown in FIG.

  The film processing apparatus 30 shown in FIG. 1 performs a process of mounting and bonding an IC chip on the antenna sheet 10 that has been punched by the film processing apparatus 20, and adsorbs the antenna sheet 10. An IC chip is mounted and bonded in a state. The antenna sheet 10 is formed with an antenna as described above, and an IC chip is mounted so as to be connected to the antenna. Therefore, as described above, the antenna sheet 10 is conveyed using the buffer units 60a and 60b. It is necessary to control the position to be accurate.

  The film processing apparatus 30 includes a film adsorption mechanism for adsorbing the antenna sheet 10 that has been perforated by the film processing apparatus 20, and the film adsorption mechanism has an adsorption surface as shown in FIG. A suction table 31, four regulation sheets 32 a to 32 d arranged on the suction table 31, and a vacuum part 34 arranged below the suction table 31.

  One surface of the suction table 31 is a mounting surface on which a film to be sucked is placed, and a plurality of suction holes 33 penetrating the front and back are provided. When the four restriction sheets 32a to 32d are closed, all the suction holes 33 are covered with the restriction sheets 32a to 32d.

  The four restriction sheets 32a to 32d are arranged so as to abut each other at the center of the suction table 31 in the closed state, and are separated from the center of the suction table 31 as shown in FIG. Retreat in the direction. In the state where the four regulation sheets 32a to 32d are retracted, all the suction holes 33 provided in the suction table 31 are exposed.

  The vacuum unit 34 sucks air above the suction table 31 through a plurality of suction holes 33 provided in the suction table 31.

  In the film adsorbing mechanism configured as described above, the antenna sheet 10 discharged from the buffer unit 60a is conveyed, and the unit antenna is rotated by intermittent rotation of the rollers 52a, 52b, 53a, and 53b. The sheets 10a are sequentially placed on the regulation sheets 32a to 32d.

  When the vacuum unit 34 is driven in a state where the regulation sheets 32 a to 32 d are closed on the suction table 31, the suction force by the vacuum unit 34 is provided on the suction table 31 as shown in FIG. The restriction sheets 32 a to 32 d are transmitted to the restriction sheets 32 a to 32 d through the plurality of suction holes 33, and the restriction sheets 32 a to 32 d are sucked to the suction table 31. At this time, since all the suction holes 33 are covered with the regulation sheets 32 a to 32 d, the suction force by the vacuum part 34 is not transmitted to the antenna sheet 10 through the plurality of suction holes 33.

  When each of the four regulation sheets 32a to 32d is retreated in the direction away from the center of the suction table 31, as shown in FIGS. The suction holes 33 thus formed are exposed from the suction holes 33 at the center of the suction table 31 on the antenna sheet 10 side, whereby the antenna sheet 10 is gradually moved from the central portion toward the peripheral portion. It will be adsorbed.

  After that, each of the four regulation sheets 32a to 32d is completely retracted, and as shown in FIG. 3D, when the plurality of suction holes 33 provided in the suction table 31 are all exposed to the antenna sheet 10 side. As shown in FIG. 4D, the antenna sheet 10 conveyed on the suction table 31 is sucked by the vacuum part 34 through the suction holes 33 and is sucked by the suction table 31.

  Here, the effect by the long hole 11 formed in the antenna sheet | seat 10 with the film processing apparatus 20 is demonstrated.

  FIG. 5 is a view for explaining the effect of the long hole 11 of the antenna sheet 10 shown in FIG.

  As described above, even when the antenna sheet 10 is sucked by the film suction mechanism of the film processing apparatus 30, the suction force by the vacuum part 34 is generated between the plurality of suction holes 33 formed in the suction table 31. It is difficult to reach the sheet 10, and as a result, air 13a and 13b may remain between the antenna sheet 10 and the suction table 31, as shown in FIG.

  In the film processing apparatus 30, as described above, when the antenna sheet 10 is gradually adsorbed to the adsorption table 31 from the central part toward the peripheral part, as shown in FIG. The air 13a, 13b remaining between the sheet 10 and the suction table 31 is guided from the central part of the antenna sheet 10 to the peripheral part.

  When the air 13a, 13b remaining between the antenna sheet 10 and the suction table 31 is guided to the peripheral edge of the antenna sheet 10, the long holes 11 are formed in the regions along both sides of the antenna sheet 10 in the conveying direction. Therefore, as shown in FIG. 5C, the airs 13 a and 13 b led to the peripheral edge of the antenna sheet 10 escape from the long hole 11 to the outside. And since this elongate hole 11 makes the longitudinal direction the direction extended radially from the center part of the unit antenna sheet | seat 10a, when adsorb | sucking the antenna sheet | seat 10 to the adsorption | suction table 31 from the center part as mentioned above The direction in which the air 13a and 13 are guided is the longitudinal direction, and is thereby guided from the central portion of the antenna sheet 10 toward the peripheral portion between the antenna sheet 10 and the suction table 31. Air 13a, 13b becomes easy to escape outside. Thereby, wrinkles are not generated in the antenna sheet 10 sucked by the suction table 31. And since the long hole 11 formed in the area | region along the conveyance direction both sides of the antenna sheet 10 becomes what was formed in the vicinity of the alignment mark 14 provided in the antenna sheet 10, Even in the vicinity, no wrinkles occur, and the antenna sheet 10 is attracted to the suction table 31.

  As described above, the direction extending radially from the central portion of the unit antenna sheet 10a is defined as the longitudinal direction in each of the regions along the both sides in the conveyance direction of the antenna sheet 10 including the vicinity of the alignment mark 14 provided on the antenna sheet 10. When the unit antenna sheet 10a is adsorbed to the adsorption table 31 from its central portion toward the peripheral portion, the alignment mark 14 can be formed without requiring special control. The antenna sheet 10 can be attracted to the suction table 31 without causing wrinkles even in the vicinity.

  In this way, the IC chip is bonded to the antenna sheet 10 by applying heat to the area where the IC chip is mounted on the antenna sheet 10 that is sucked and fixed to the suction table 31. The antenna sheet 10 is fixed on the suction table 31 without wrinkles, and no wrinkles are formed in the vicinity of the alignment mark 14, so that when the heat is applied to the area where the IC chip is mounted, The alignment can be accurately performed using the alignment mark 14.

  The antenna sheet 10 on which the IC chip is mounted and bonded is then conveyed to the sheet roll 40b by the rotation of the rollers 54a and 54b via the buffer unit 60b, and wound around the sheet roll 40b. At this time, since the rollers 54a and 54b are continuously rotated, the conveyance of the antenna sheet 10 from the rollers 54a and 54b to the sheet roll 40b becomes continuous.

  In addition, in this form, although the elliptical long hole 11 is formed in the conveyance direction both sides with respect to the continuous antenna sheet | seat 10, the shape of the long hole 11 is not restricted to an ellipse. However, when the antenna sheet 10 is a continuous one, a tensile tension is applied to the antenna sheet 10 when the antenna sheet 10 is conveyed. There is a possibility that the antenna sheet 10 may tear from the portion. Therefore, it is preferable that the long hole 11 has a shape with no corners such as an ellipse. Even when the long hole 11 is provided so as to cut from the end of the antenna sheet 10, the antenna sheet 10 may be torn from the long hole 11, which is not preferable.

(Second Embodiment)
FIG. 6 is a view showing an example of an inlet manufacturing machine using the second embodiment of the film processing apparatus of the present invention.

  As shown in FIG. 6, the film processing apparatus according to this embodiment is provided in an inlet manufacturing machine 101 for manufacturing an inlet used for a non-contact type IC card or a non-contact type IC label using a single-piece antenna sheet 110. Used.

  The inlet manufacturing machine 101 discharges the single-piece antenna sheet 110 that is stacked and accommodated on the stacker 140a from the stacker 140a, and performs a hole processing on the antenna sheet 110 by the film processing apparatus 120, and then performs film processing. The IC chip is mounted on the antenna sheet 110 by the device 130, bonded, and accommodated in the stacker 140b.

  The film processing apparatus 120 is recognized by the marker recognition unit 121 of the recognition unit 121 that recognizes the alignment mark 114 (see FIG. 7) provided on the antenna sheet 110 and the marker recognition unit 121 of the antenna sheet 110. The hole processing section 122 is formed with an assembly hole 111 (see FIG. 7) including two holes 111a and 111b (see FIG. 7) in a region including the vicinity of the alignment mark 114.

  Below, operation | movement of the inlet manufacturing machine 101 comprised as mentioned above is demonstrated.

  First, the single-piece antenna sheet 110 that is stacked and accommodated on the stacker 140a is discharged from the stacker 140a one by one by a feeding roller (not shown) of the stacker 140a. The antenna sheet 110 accommodated in the stacker 140a performs non-contact communication with a non-contact type IC card or non-contact type IC label manufactured using the antenna sheet 110 on a single piece film base material. The antenna is formed.

  The single-piece antenna sheet 110 discharged from the stacker 140a is supplied to the film processing apparatus 120, and the film processing apparatus 120 performs punching.

  FIG. 7 is a diagram illustrating the antenna sheet 110 that has been punched by the film processing apparatus 120 illustrated in FIG. 6.

  As shown in FIG. 7, the single-piece antenna sheet 110 discharged from the stacker 140a is provided with alignment marks 114 at its four corners.

  In the film processing apparatus 120, first, the marker recognition unit 121 recognizes the alignment mark 114.

  Next, in the hole processing unit 122, two rows of holes are formed in each of the regions along the both sides in the discharge direction from the stacker 140 a of the antenna sheet 110 including the vicinity of the alignment mark 114 recognized by the marker recognition unit 121. 111a and 111b are formed. Each of these holes 111 a and 111 b constitutes a set hole 111 as a set, and the hole 111 a and the hole 111 b forming one set hole 111 radiate from the central portion 112 of the antenna sheet 110. Are formed so as to be adjacent to each other in the extending direction. That is, in the region including the vicinity of the alignment mark 114 provided on the antenna sheet 110, the assembly hole 111 including the two holes 111a and 111b adjacent to each other in a direction extending radially from the central portion of the antenna sheet 110 is formed. Become. In the hole processing unit 122, based on the position of the alignment mark 114 recognized by the marker recognition unit 121, the position of a region along both sides in the discharge direction from the stacker 140a of the antenna sheet 110 is detected, and the detection is performed. The assembled hole 111 including the two holes 111a and 111b is formed in the formed region.

  The antenna sheet 110 that has been perforated as shown in FIG. 7 in the film processing apparatus 120 is discharged from the film processing apparatus 120 and supplied to the film processing apparatus 130, which is shown in the first embodiment. The IC chip is mounted and adhered in the state of being adsorbed on the adsorption surface in the same manner as the above.

  Here, the effect by the assembled hole 111 formed in the antenna sheet 110 by the film processing apparatus 120 will be described.

  FIG. 8 is a view for explaining the effect of the assembly hole 111 of the antenna sheet 110 shown in FIG.

  Similarly to the case shown in the first embodiment, even when the antenna sheet 110 is adsorbed to the adsorption surface of the film adsorption mechanism provided in the film processing apparatus 130, it is shown in FIG. As described above, air 113a and 113b may remain between the antenna sheet 110 and the adsorption surface.

  In the film processing apparatus 130, as described above, when the antenna sheet 110 is gradually adsorbed on the adsorption surface from the central part toward the peripheral part, as shown in FIG. The air 113a, 113b remaining between 110 and the adsorption surface is guided from the central portion of the antenna sheet 110 to the peripheral portion.

  Then, when the air 113a, 113b remaining between the antenna sheet 110 and the adsorption surface is guided to the peripheral portion of the antenna sheet 110, two holes are formed in each of the regions along both sides in the discharge direction from the stacker 140a of the antenna sheet 110. Since the assembled hole 111 composed of 111a and 111b is formed, the air 113a and 113b guided to the peripheral edge of the antenna sheet 110 escapes from the assembled hole 111 to the outside as shown in FIG. Become. And since this assembly hole 111 is comprised from the two holes 111a and 111b adjacent to the direction extended radially from the center part of the antenna sheet 110, the antenna sheet 110 is made from the center part as mentioned above. The two holes 111a and 111b are adjacent to each other in the direction in which the air 113a and 113 are guided when adsorbed on the adsorption surface, whereby the antenna sheet 110 is placed between the antenna sheet 110 and the adsorption surface. The air 113a and 113b guided from the central portion toward the peripheral portion can easily escape to the outside. Thereby, wrinkles are not generated in the antenna sheet 110 adsorbed on the adsorption surface. And the assembly hole 111 which consists of two holes 111a and 111b formed in the area | region along the discharge direction both sides from the stacker 140a of the antenna sheet 110 was formed in the vicinity of the alignment mark 114 provided in the antenna sheet 110. Therefore, the antenna sheet 110 is attracted to the attracting surface without causing wrinkles even in the vicinity of the alignment mark 114.

  As described above, in a direction extending radially from the central portion of the antenna sheet 110 in each of the regions along the both sides in the discharge direction of the antenna sheet 110 from the stacker 140a, including the vicinity of the alignment mark 114 provided on the antenna sheet 110. By forming the assembly hole 111 composed of two adjacent holes 111a and 111b, special control is required when the antenna sheet 110 is adsorbed to the adsorption surface from the central part toward the peripheral part. In addition, the antenna sheet 110 can be attracted to the attracting surface without causing wrinkles even in the vicinity of the alignment mark 114.

  The IC chip is bonded to the antenna sheet 110 by applying heat to the area where the IC chip is mounted on the antenna sheet 110 that is sucked and fixed to the suction surface in this way. The antenna sheet 110 is fixed on the attracting surface without generating wrinkles, and no wrinkles are generated in the vicinity of the alignment mark 114. Therefore, when the heat is applied to the area where the IC chip is mounted, the antenna sheet 110 is aligned. The alignment can be accurately performed using the mark 114.

  The antenna sheet 110 on which the IC chip is mounted and bonded is then discharged from the film processing apparatus 130 and accommodated in the stacker 140b.

  In the present embodiment, the assembled hole 111 is composed of two holes 111a and 111b. However, the number of holes constituting the assembled hole 111 is not limited to two. However, a plurality of holes constituting one assembly hole 111 need to be adjacent to each other in a direction extending from the central portion of the antenna sheet 110 to the peripheral portion.

  In the two embodiments described above, the long holes 11 and the assembled holes 111 are formed in regions along the conveyance direction of the antenna sheet 10 and the discharge direction of the antenna sheet 110 from the stacker 140a. As long as it is formed in the vicinity of the alignment marks 14 and 114 provided on the antenna sheets 10 and 110, it may be formed in a region along the entire circumference of the unit antenna sheet 10a or the antenna sheet 111.

  In addition, as a film adsorption mechanism for adsorbing the processed film in the present invention, as long as the film is gradually adsorbed to the adsorption surface from the central part toward the peripheral part, the structure as described above is used. Not limited to.

  In addition, the processing for the film processed in the present invention is not limited to the mounting and adhesion of the IC chip as described above as long as the processing is performed by adsorbing the film to the adsorption surface. That is, the present invention is also applied to a process in which high positional accuracy is ensured by adsorbing the film to the adsorption surface, for example, a process of performing printing on the film and a process of opening a pin hole. can do.

  In the above-described two embodiments, the processing in the film processing apparatuses 20 and 120 and the processing in the film processing apparatuses 30 and 130 are inline processing in one inlet manufacturing machine 1 and 101. The processing in the processing devices 20 and 120 and the processing in the film processing devices 30 and 130 may be separate line processing.

DESCRIPTION OF SYMBOLS 1,101 Inlet production machine 10,110 Antenna sheet 10a Unit antenna sheet 11 Long hole 12,112 Center part 13a, 13b, 113a, 113b Air 14,114 Alignment mark 20,120 Film processing apparatus 21,121 Marker recognition part 22 , 122 Hole processing unit 30, 130 Film processing device 31 Suction table 32a-32d Restriction sheet 33 Suction hole 34 Vacuum unit 40a, 40b Sheet roll 51a, 51b, 52a, 52b, 53a, 53b, 54a, 54b Roller 60a, 60b Buffer Part 111 Assembly hole 111a, 111b Hole 140a, 140b Stacker

Claims (2)

An alignment mark is provided in a region along the peripheral edge, and a film that is gradually adsorbed from the central portion toward the peripheral edge on the suction surface and processed in a state of being sucked on the suction surface, A film processing apparatus for processing before processing is performed,
Recognition means for recognizing the alignment mark;
The film processing apparatus which has a hole processing means which forms the long hole which makes the direction extended radially from the said center part in the vicinity of the alignment mark recognized by the said recognition means among the said films. An alignment mark is provided in a region along the peripheral edge, and a film that is gradually adsorbed from the central portion toward the peripheral edge on the suction surface and processed in a state of being sucked on the suction surface, A film processing apparatus for processing before processing is performed,
Recognition means for recognizing the alignment mark;
A film processing apparatus comprising: a hole processing unit that forms a plurality of holes adjacent to each other in a direction extending radially from the central portion in the vicinity of the alignment mark recognized by the recognition unit of the film. .

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