JP5453870B2 - Metal mask for forming adhesive rib and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component protective cover for protecting or sealing an electronic component such as an imaging device, for example, an adhesive rib for bonding an imaging device covering portion (a closed-shaped photocurable resin surrounding the entire periphery of the electronic component) The present invention relates to a metal mask for forming an adhesive rib for forming a partition wall (hereinafter referred to as UV resin) by screen printing and a method for manufacturing the same.

  When manufacturing an electronic component such as an image sensor using an image sensor, the image sensor formed on the semiconductor substrate is protected or sealed from above with a transparent image sensor covering portion such as acrylic or glass. In order to provide a protective space between the sealing for the image sensor covering portion and the semiconductor substrate, an adhesive rib made of a closed-shaped UV resin partition surrounding the entire periphery of the image sensor is formed by screen printing. The configuration is shown in FIGS. As shown in FIG. 7 to FIG. 9, an image sensor 12 is formed on a semiconductor substrate 11, and a closed surrounding the entire periphery of the image sensor 12 is provided to provide a space with a transparent image sensor covering portion 13 such as glass. Adhesive ribs 14 made of a UV resin partition having a shape are formed by screen printing, and the printing height of the adhesive ribs 14 has recently been required to be about 100 μm or more. Reference numeral 16 denotes a light receiving portion of the image sensor 12.

JP-A-6-59226 JP 2008-23716 A

  In the conventional screen printing mask, in order to print so that the printing height of the adhesive ribs becomes high, the printing height is secured by using a material having a large diameter of the ridge. When a material having a large diameter is used, there is a problem in that the contact area of the ridges with the substrate to be printed becomes large, and an unprinted portion is formed at a portion where the opening is applied, and a desired printed shape cannot be obtained. In general, fine lines having a thin wire diameter are used to obtain a good printed shape, but it has been difficult to ensure the printing height. In recent years, the printing height of the adhesive rib has been required, and it has been difficult to secure a desired shape at a printing height of about 100 μm or more.

  The present invention has been made to solve the above-described problems. An adhesive rib for bonding an electronic component protective cover for protecting or sealing the electronic component (a closed shape surrounding the entire periphery of the electronic component). The present invention relates to a metal mask for forming an adhesive rib which has been improved so that a desired printing height required in recent years can be secured by increasing the printing height of a UV resin partition wall) and a method for producing the same.

In the metal mask for forming an adhesive rib according to the present invention, the adhesive rib for forming a protective cover for protecting or sealing the electronic component is formed by screen printing. A first layer in which a first layer mesh or a first layer bridge is formed at a corresponding portion where a printed pattern opening is formed, which is an upper layer portion on the squeegee surface side of the metal mask. It is integrally formed with the metal plating of the eye and the metal plating of the first layer, and constitutes the lower layer portion on the printing surface side of the metal mask, and the first layer mesh is formed at the corresponding portion where the printing pattern opening is formed. Or a second-layer mesh thinned to a number of 1/2 or less of the first-layer bridge or a second-layer metal plating on which a second-layer bridge is formed, and an opening for the first-layer metal plating Skiing The first-layer mesh or first-layer bridge formed on the surface side and the second-layer mesh or second-layer bridge formed by thinning the number on the printed surface side of the opening of the second-layer metal plating When the liquid adhesive passes through the opening, a shear stress is applied to the adhesive to increase the fluidity, whereby an adhesive rib having a desired printing height can be obtained.

In addition, the upper layer portion on the squeegee surface side of the metal mask is configured, the first layer metal plating in which the first layer mesh or the first layer bridge is formed in the corresponding portion where the printed pattern opening is formed, and the first layer It is formed integrally with the first layer of metal plating, constitutes the lower layer portion on the printing surface side of the metal mask, and 1 of the first layer mesh or the first layer bridge is formed at the corresponding portion where the printing pattern opening is formed. / The second layer metal plating formed with the second layer mesh or the second layer bridge thinned to the number of 2 or less and the second layer metal plating are integrally formed to cover the opening. A metal plating of the third layer for forming a belt-like convex portion for preventing contact with a specified portion of the printing surface or improving the separation of the plate only on the peripheral portion on the printing surface side, First layer mesh or one layer formed on the squeegee surface side of the opening Due to the presence of the bridge and the second layer mesh or second layer bridge formed by thinning the number on the printed surface side of the opening of the second layer metal plating, the liquid adhesive passes through the opening. At this time, an adhesive rib having a desired printing height is obtained by applying shear stress to the adhesive to increase fluidity.

  The first layer metal plating has a structure in which diagonal struts are provided only at the intersection of the opening on the squeegee surface side, and the second layer metal plating is on the printing surface side of the opening. This is a structure in which a bracing portion is not provided at the intersection.

  Also, the first layer metal plating in which the first layer bridge is formed on the squeegee surface side of the opening and the first layer metal plating are integrally formed, and one layer is formed on the printing surface side of the opening. 1 which is formed on the squeegee surface side of the opening of the first layer metal plating, and the second layer metal plating on which the second layer bridge is formed staggered and staggered in a staggered manner. When the liquid adhesive passes through the opening due to the presence of the layer bridge and the second layer bridge formed on the printed surface side of the opening of the second layer metal plating in a staggered manner, the adhesive An adhesive rib having a desired printing height is obtained by applying a shear stress to the film to increase fluidity.

  Also, the first layer metal plating in which the first layer bridge is formed on the squeegee surface side of the opening and the first layer metal plating are integrally formed, and one layer is formed on the printing surface side of the opening. Printed surface of the opening formed integrally with the second-layer metal plating and the second-layer metal plating on which the second-layer bridges are staggered and staggered from the eye bridge. 3rd layer metal plating for forming a belt-like convex portion for preventing contact with a specified portion of the printing surface or improving plate separation only in the peripheral portion on the side, and opening portion of the first layer metal plating Liquid adhesive due to the presence of the first layer bridge formed on the squeegee surface side and the second layer bridge formed staggered on the printed surface side of the opening of the second layer metal plating. When passing through the opening, shearing stress is applied to the adhesive to increase fluidity. In which the adhesive rib print height Nozomu was thus obtained.

  Also, on the squeegee surface side of the metal plating of the first layer, for introduction for introducing the liquid adhesive resin into the opening of the first layer as a reception window for the liquid adhesive resin during screen printing It further comprises an uppermost metal plating having an opening.

In the method of manufacturing the metal mask for forming an adhesive rib according to the present invention, a step of preparing a conductive base material, an opening on the squeegee surface side on the conductive base material, and a first layer on the opening. A step of forming a first resist for providing a mesh or a first layer bridge, and an upper layer portion on the squeegee surface side of the metal mask, excluding a region where the first resist is formed on the conductive base material. Forming a first-layer metal plating having a structure in which a first-layer mesh or a first-layer bridge is formed at a corresponding portion where a printed pattern opening is formed ; and a step of removing the first resist On the first layer metal plating, the opening on the printing surface side and the second layer mesh thinned out in the opening to half or less the number of the first layer mesh or the first layer bridge A second resist for providing a second layer bridge A step of forming, on the first layer of metal plating corresponding to, except for the region in which the second resist is formed, constitutes a lower portion of the printing surface of the metal mask, the printing pattern openings are formed forming a second layer of metal plating of the second layer mesh or second layer bridge decimated to the number of half or less of the first layer mesh or first layer bridge sites have been formed structure And removing the second resist, and then integrally peeling the first layer metal plating and the second layer metal plating from the conductive base material, and opening the first layer metal plating The first-layer mesh or first-layer bridge formed on the squeegee surface side and the second-layer mesh or two-layer formed by thinning the number on the printed surface side of the opening of the second-layer metal plating When the liquid adhesive passes through the opening due to the presence of the eye bridge, it adheres Are those that as adhesive ribs of the desired print height is obtained by the increases fluidity depends shear stress on.

  Also, a step of preparing a conductive base material, an opening on the squeegee surface side on the conductive base material, and only an intersection of the first layer mesh or the first layer bridge and the opening on the squeegee surface side on the opening. Forming a first resist for providing an oblique bracing portion on the first squeegee surface side opening, except for a region where the first resist is formed on the conductive base material; Forming a first-layer metal plating having a structure in which a first-layer bridge is formed and an oblique bracing portion is provided only at the intersection of the opening on the squeegee surface side; and a step of removing the first resist Forming a second resist for providing an opening on the printing surface side and a second-layer mesh or a second-layer bridge on the opening on the first-layer metal plating; Printed except for the area where the second resist is formed on the metal plating A second-layer metal plating having a structure in which a second-layer mesh or a second-layer bridge is formed in the opening on the side and a bracing portion is not provided at the intersection on the printed surface side of the opening is formed. A step of removing the second resist, and a third resist for providing a belt-like convex portion only on the printing surface side opening and the peripheral portion of the opening on the second layer metal plating A step of forming, a step of forming a third-layer metal plating on the second-layer metal plating, excluding a region where the third resist is formed, and removing the third resist; And a step of integrally peeling the first-layer metal plating, the second-layer metal plating, and the third-layer metal plating from the base material.

  The step of forming the first resist is to provide an oblique bracing portion only at the intersection of the opening on the squeegee surface side, and the step of forming the first metal plating is the squeegee surface side. The step of forming the second layer of metal plating is performed on the printed surface side of the opening on the metal plating of the first layer. This is a structure in which a bracing portion is not provided at the intersection.

  A step of preparing a conductive base material, a step of forming a first resist on the conductive base material to provide an opening on the squeegee surface side and a first-layer bridge to the opening; Forming a first-layer metal plating having a structure in which a first-layer bridge is formed in an opening on the squeegee surface side excluding an area where the first resist is formed on the base material; , A step of forming a conductive film on the printed surface side of the first layer of metal plating, an opening on the printed surface side and the opening on the first layer of metal plating A step of forming a second resist for providing a second layer bridge that is staggered and staggered from the first layer bridge, and a region where the second resist is formed on the first layer metal plating Except for the opening on the printed surface side, the first-layer bridge is shifted from the first-layer bridge. Forming a second-layer metal plating having a structure in which a second-layer bridge arranged in a shape is formed, removing the second resist, and then removing the first-layer metal plating from the conductive base material; A first layer mesh or a first layer bridge formed on the squeegee surface side of the opening of the first layer metal plating, and a second layer When the liquid adhesive passes through the opening due to the presence of the second layer mesh or the second layer bridge arranged in a staggered manner on the printed surface side of the opening portion of the metal plating, An adhesive rib having a desired printing height can be obtained by applying shearing stress to increase fluidity.

  Also, on the squeegee surface side of the metal plating of the first layer, for introduction for introducing the liquid adhesive resin into the opening of the first layer as a reception window for the liquid adhesive resin during screen printing The method further includes the step of forming the uppermost metal plating having an opening.

  According to the present invention, the printing height of an adhesive rib for adhering an electronic component protective cover for protecting or sealing an electronic component (a closed-shaped UV resin partition wall surrounding the entire periphery of the electronic component) is increased. There is an effect that the desired printing height required can be secured.

It is a perspective view which shows the screen printing plate provided with the metal mask for adhesive rib formation of this invention. It is the expansion perspective view which looked at the metal mask for adhesive rib formation in Example 1 of this invention from the A section squeegee side of FIG. It is the expansion perspective view seen from the arrow B1 (printed surface side) of FIG. It is sectional drawing along CC line of FIG. FIG. 3 is a cross-sectional view taken along line DD in FIG. 2. It is a schematic explanatory drawing which shows the case where screen printing is carried out with the metal mask for adhesive rib formation of this invention. It is a disassembled perspective view which shows an example of the manufacturing method of semiconductor devices, such as a CMOS image sensor, which shows the state in which the adhesive rib for image pick-up element covering part adhesion was formed. It is a perspective view which shows an example of semiconductor devices, such as a CMOS image sensor which shows the state after coating | coated part adhesion | attachment. It is sectional drawing along the EE line | wire of FIG. It is the expansion perspective view which looked at the metal mask for adhesive rib formation in Example 2 of this invention from the A section squeegee side of FIG. It is the expansion perspective view seen from arrow B2 (printed surface side) of FIG. It is sectional drawing along the FF line of FIG. It is sectional drawing along the GG line of FIG. It is sectional drawing along the HH line of FIG. It is sectional drawing along the II line | wire of FIG. It is the expansion perspective view which looked at the metal mask for adhesive rib formation in Example 3 of this invention from the A section squeegee side of FIG. It is the expansion perspective view seen from the arrow B3 (printed surface side) of FIG. It is the expansion perspective view which looked at the metal mask for adhesive rib formation in Example 4 of this invention from the A section squeegee side of FIG. It is sectional drawing along the JJ line of FIG. It is the expansion perspective view which looked at the metal mask for adhesive rib formation in Example 5 of this invention from the A section squeegee side of FIG. It is sectional drawing along the KK line | wire of FIG. It is sectional drawing along the LL line of FIG. It is the expansion perspective view which looked at the metal mask for adhesive rib formation in Example 6 of this invention from the to-be-printed surface side. It is the expansion perspective view which looked at the metal mask for adhesive rib formation in Example 7 of this invention from the to-be-printed surface side.

  FIG. 1 is a perspective view showing a screen printing plate provided with a metal mask for forming an adhesive rib according to the present invention. FIG. 2 shows the metal mask for forming an adhesive rib according to Embodiment 1 of the present invention from the squeegee side A in FIG. FIG. 3 is an enlarged perspective view seen from the arrow B1 (printed surface side) in FIG. 2, FIG. 4 is a cross-sectional view taken along the line CC in FIG. 2, and FIG. FIG. 6 is a schematic explanatory view showing a case where screen printing is performed using the metal mask for forming an adhesive rib of the present invention, and FIG. 7 is an adhesive rib for bonding an image sensor covering portion. FIG. 8 is an exploded perspective view showing an example of a manufacturing method of a semiconductor device such as a CMOS image sensor showing the state, FIG. 8 is a perspective view showing an example of the semiconductor device such as a CMOS image sensor showing a state after bonding of the protective cover, and FIG. It is sectional drawing along the EE line | wire of FIG.

Reference numeral 1 denotes a screen printing plate provided with a metal mask 2 for forming an adhesive rib according to the present invention, and a peripheral portion thereof is held by a metal square frame 3 through a ridge.
An adhesive rib forming metal mask 2 according to the first embodiment of the present invention is provided with an adhesive rib for bonding an imaging element covering portion for protecting or sealing the imaging element (a closed-shaped UV resin surrounding the entire periphery of the imaging element). The openings 4 for forming the partition walls are formed in a grid pattern. The metal rib 2 for forming the adhesive rib has a total thickness of about 230 μm so that when the screen printing is performed, the printing height of the adhesive rib is about 100 μm or more. is there. The metal rib 2 for forming the adhesive rib is disposed on the metal square frame 3 so that the opening 4 is at an angle of 45 ° with respect to the squeegee traveling direction.
The first layer (squeegee side) 21 of the metal mask 2 for forming the adhesive rib has, for example, a plate thickness of 100 μm, openings 4 having a pitch of 250 μm, and the width of the first layer bridge 21 a spanning the openings 4 is 50 μm. The first-layer metal plating 21 is formed so as to have a structure in which an oblique bracing portion 21 b is provided only at the intersection of the opening 4. Here, if there is an oblique bracing portion 21b at the intersection of the opening, the squeegee does not hit the edge of the intersection of the opening, so that the life of the squeegee can be extended and the mask can be prevented from being damaged. Next, the second layer (printed surface side) 22 of the metal mask 2 for forming the adhesive rib is formed on the first layer 21 with a plate thickness of 100 μm, for example, but the openings 4 are 500 μm pitch. The second-layer bridge 22a spanned by the opening 4 has a width of 50 μm and is alternately below the first-layer bridge 21a. A second-layer metal plating 22 is formed so as to have a structure in which a crossing portion is not provided at the intersection of the openings. Further, the third layer (printed surface side) 23 of the metal mask 2 for forming the adhesive rib is formed on the second layer 22 with a plate thickness of 30 μm, for example, but only the peripheral portion of the opening 4. A third-layer metal plating 23 is formed so as to have a strip shape. Here, by forming the belt-like convex portion 23 that is the third layer only in the peripheral portion of the opening 4, a concave portion is formed inside the belt-like convex portion 23, and the liquid drainage of the adhesive is improved. There is an effect of preventing bleeding.

  The manufacturing method of the metal mask 2 for forming an adhesive rib according to the present invention is to prepare a conductive base material (SUS, etc.), and on the conductive base material, an opening 4 and a first layer bridge 21a having a pitch of 250 μm in the opening. Except for the step of forming the first resist for providing the diagonal braces 21b only at the intersection of the opening and the opening, and the region where the first resist is formed on the conductive base material, for example, the plate thickness is 100 μm, the opening The first-layer metal plating 21 having a structure in which the portion 4 has a pitch of 250 μm, the width of the first-layer bridge 21 a spanning the opening 4 is 50 μm, and the diagonal bracing portion 21 b is provided only at the intersection of the opening 4. A step of forming, a step of removing the first resist, an opening 4 on the metal plating 21 of the first layer, and thinning out to a number of 1/2 or less of the first layer at a pitch of 500 μm in the opening. Given the second layer bridge 22a Except for the step of forming the second resist for forming the first resist layer and the region where the second resist is formed on the first-layer metal plating 21, for example, a plate thickness of 100 μm is formed on the first layer 21. However, the openings 4 are thinned out at a pitch of 500 μm to a half or less of the first layer, and the second-layer bridge 22a spanned by the openings 4 has a width of 50 μm to the first-layer bridge 21a. A step of forming a second layer of metal plating 22 which is provided under every other portion and does not have a bracing portion at the intersection of the openings, and a step of removing the second resist, Forming a third resist on the second layer metal plating 22 to provide the opening 4 and a band-shaped convex portion 23 only on the periphery of the opening; and on the second layer metal plating 22 Except for the region where the third resist is formed, for example, when the plate thickness is 30 μm, Although formed on the layer 22, a step of forming a third-layer metal plating 23 having a strip shape only around the periphery of the opening 4, and after removing the third resist, from the conductive base material The method includes a step of integrally peeling the first-layer metal plating 21, the second-layer metal plating 22, and the third-layer metal plating 23 together. In addition, the manufacturing method of these metal masks can be manufactured as a metal mask having a multi-layer structure by substantially the same method as before. The first to third resists may be removed after the metal layers 1 to 3 are integrally peeled off from the base material after the third layer plating is completed. Moreover, you may put the grinding | polishing process of the resist which protruded after each metal plating of the 1st layer and the 2nd layer.

Using the metal mask 2 for forming an adhesive rib of the present invention completed by the above manufacturing method, an adhesive rib for adhering the imaging element covering portion (a closed-shaped UV resin partition wall surrounding the entire periphery of the imaging element) is screen-printed. The case is shown in FIG. 7 to 9 are views showing an example of a semiconductor device such as a CMOS image sensor showing a state in which an adhesive rib for adhering the imaging element covering portion is formed. In the figure, 11 is a semiconductor substrate, 12 is an image sensor formed on the semiconductor substrate 11, 13 is a transparent image sensor covering portion such as glass, and 14 is an image sensor 12 for providing a space with the image sensor covering portion 13. An adhesive rib made of a closed UV resin partition surrounding the entire periphery, 15 is a squeegee for screen printing the adhesive rib 14 made of the UV resin partition on the semiconductor substrate 11, and 16 is a light receiving portion of the image sensor 12. . 14a is a liquid UV resin (adhesive). Here, since the metal rib 2 for forming the adhesive rib is arranged so that the grid-like opening 4 is at an angle of 45 ° with respect to the squeegee traveling direction, the liquid UV resin (adhesive) 14a is formed. Is easy to enter. At the same time, air escape from the opening is improved to prevent unfilling due to air accumulation.
By using the metal mask 2 for forming the adhesive rib of the present invention, when the liquid UV resin (adhesive) 14a passes through the opening 4 and the mesh portion composed of the first layer bridge 21a and the second layer bridge 22a. The shearing stress is applied to the adhesive to increase the fluidity. That is, as the adhesive continues to receive shear stress, the viscosity gradually decreases and the fluidity of the liquid adhesive increases. As a result, after the first printing, the UV resin is photocured, and then the printing is performed twice or more by the same method, so that the printing height of the adhesive rib 14 can be secured to about 200 μm or more. it can. That is, at the time of screen printing, the adhesive 14a can easily pass through the opening 4 and its mesh portion smoothly, and on the other hand, when the metal mask 2 is peeled off from the printing surface, shearing stress is applied to the adhesive. The fluidity of the liquid adhesive is improved, the metal mask 2 is easily removed, and the printing height of the adhesive ribs 14 can be increased as a result of repeating such a printing method two or more times. In addition, desired linearity can be obtained. Further, since the mesh portion including the first layer bridge 21a and the second layer bridge 22a of the opening 4 is subjected to shear stress, it has a high viscosity (viscosity of 10 to 1000 Pa) and a high thixotropy (thixo ratio of 1.5 to 8. Even in the case of the adhesive of 0), there is an effect that the detachability is improved. Further, by controlling the aperture ratio of the opening 4, there is a great effect that the printing height of the adhesive rib 14 can be freely designed.

The average print height results (relationship between line width and print height) are shown below.
In a single vacuum off contact printing with a mask total thickness of 230 μm, the average print height and average line width are as follows.
When the mask opening width is 300 μm, the result line width is 500 μm and the printing height is 100 μm.
When the mask opening width is 450 μm, the result line width is 600 μm and the printing height is 190 μm.
When the mask opening width is 600 μm, the result line width is 800 μm and the printing height is 210 μm.
In the two-time overlapping printing, the average printing height and the average line width are as follows.
When the mask opening width is 300 μm, the result line width is 600 μm and the printing height is 200 μm.
When the mask opening width is 450 μm, the result line width is 700 μm and the printing height is 360 μm.
When the mask opening width is 600 μm, the result line width is 900 μm and the printing height is 370 μm.

  In the first embodiment, the third layer (printed surface side) 23 of the metal mask 2 for forming an adhesive rib is formed, but the metal plating 23 of the third layer may be omitted. In Example 1, since the squeegee does not hit the edge of the intersection of the openings, the first-layer metal plating is formed so that the diagonal bracing portion 21b is provided only at the intersection of the openings 4. 21 is formed, but if there is no such problem, the first-layer metal plating 21 does not have to be provided with the oblique bracing portion 21 b at the intersection of the opening 4.

  FIG. 10 is an enlarged perspective view of the metal mask for forming an adhesive rib according to the second embodiment of the present invention as seen from the A part squeegee side of FIG. 1, and FIG. 11 is seen from the arrow B2 (printed surface side) of FIG. FIG. 12 is a sectional view taken along line FF in FIG. 10, FIG. 13 is a sectional view taken along line GG in FIG. 10, and FIG. 14 is a sectional view taken along line HH in FIG. FIGS. 15A and 15B are cross-sectional views taken along the line II of FIG.

  In the second embodiment, the first layer (squeegee side) 21 of the metal mask 2 for forming the adhesive rib is, for example, a plate thickness of 100 μm, and a large number of first-layer bridges 21 a are spanned in the opening 4. The first-layer metal plating 21 is formed so that the width is 50 μm and the diagonal bracing portion 21 b is provided only at the intersection of the opening 4. Here, if there is an oblique bracing portion 21b at the intersection of the opening, the squeegee does not hit the edge of the intersection of the opening, so that the life of the squeegee can be extended. Next, the second layer (printed surface side) 22 of the metal mask 2 for forming an adhesive rib is formed on the first layer 21 with a plate thickness of 100 μm, for example. A second layer bridge 22a is placed under every other layer bridge 21a, its width is 50 μm, and the second layer so as not to have a bracing portion at the intersection of the openings. Metal plating 22 is formed. Further, the third layer (printed surface side) 23 of the metal mask 2 for forming the adhesive rib is formed on the second layer 22 with a plate thickness of 30 μm, for example, but only the peripheral portion of the opening 4. It is formed as a third-layer metal plating 23 so as to form a strip shape. Here, by forming the belt-like convex portion 23 that is the third layer only in the peripheral portion of the opening 4, a concave portion is formed inside the belt-like convex portion 23, and the liquid drainage of the adhesive is improved. There is an effect of preventing bleeding.

  Since the manufacturing method of the metal mask 2 for forming an adhesive rib according to the second embodiment is substantially the same as that of the first embodiment, the description thereof is omitted. Further, the third layer (printed surface side) 23 of the adhesive rib forming metal mask 2 may be omitted. Further, in the second embodiment, the squeegee does not hit the edge of the intersection of the openings, so that the first layer of metal plating is formed so that the diagonal struts 21b are provided only at the intersection of the openings 4. 21 is formed, but if there is no such problem, the first-layer metal plating 21 does not have to be provided with the oblique bracing portion 21 b at the intersection of the opening 4.

  16 is an enlarged perspective view of the metal mask for forming an adhesive rib according to the third embodiment of the present invention as viewed from the A part squeegee side in FIG. 1, and FIG. 17 is viewed from the arrow B3 (printed surface side) in FIG. It is an expansion perspective view.

  In the second embodiment, the diagonal brace 21b provided only at the intersection of the opening 4 and the bridge 21a provided in the portion closest to the brace 21b are left. In this third embodiment, the opening is provided. By leaving only the diagonal brace 21b provided only at the four intersections and eliminating the bridge 21a provided at the portion closest to the brace 21b, four pentagonal boat-shaped openings 41 with the tip portions abutting each other are formed. This structure is FIG. 16 shows a cross-shaped intersection, but in the case of a T-shaped intersection, the ends of the three boat-shaped openings are butted in a T-shape, and an L-shape. In the case of a crossing portion (corner portion), the tip portions of the two boat-shaped openings may be abutted in an L shape. Thereby, the adhesive rib 14 can be printed almost uniformly. Further, the boat-shaped opening 41 has a pentagonal shape. However, the boat-shaped opening 41 has an elongated boat-shaped shape and does not sharpen the tip, but gradually narrows as it goes forward, and the tip is round (small arc shape). ).

  18 is an enlarged perspective view of the metal mask for forming an adhesive rib according to the fourth embodiment of the present invention as viewed from the A part squeegee side of FIG. 1, and FIG. 19 is a cross-sectional view taken along line JJ of FIG.

  In the first to third embodiments, the first-layer bridge 21a that spans the opening 4 of the first-layer (squeegee side) 21 of the metal mask 2 for forming an adhesive rib and the first mask of the metal mask 2 for forming an adhesive rib. The second-layer bridges 22a spanning the openings 4 of the second-layer (printed surface side) 22 are provided by decimating the number of the second-layer bridges 22a every other one with respect to the first-layer bridge 21a. On the other hand, in the fourth embodiment, as shown in FIG. 19, the first-layer bridge 21a that spans the opening 4 of the first-layer 21 of the metal mask 2 for forming the adhesive rib, and the adhesive rib-forming The second-layer bridges 22a spanning the openings 4 of the second-layer 22 of the metal mask 2 are staggered and shifted alternately. As a result, the liquid UV resin (adhesive) 14a successfully passes through the opening 4 and the bridge portion composed of the first-layer bridge 21a and the second-layer bridge 22a arranged in a staggered manner. The shearing stress is applied to increase the fluidity, and as a result, the printing height of the adhesive rib 14 can be ensured. That is, at the time of screen printing, the adhesive 14a can easily pass through the opening 4 and its bridge portion. On the other hand, when the metal mask 2 is peeled off from the printing surface, the adhesive is subjected to shear stress and is fluid. As a result, the removability of the metal mask 2 is improved, and as a result, the printing height of the adhesive ribs 14 can be increased.

  In the method of manufacturing the metal mask 2 for forming an adhesive rib according to the fourth embodiment, the first-layer bridge 21a that spans the opening 4 of the first layer 21 of the metal mask 2 for forming an adhesive rib, and the formation of the adhesive rib. In order to stagger the second layer bridges 22a spanning the openings 4 of the second layer 22 of the metal mask 2 for the first time, the first layer metal plating 21 is formed, After removing one resist, a step of forming a conductive film on the printing surface side of the first-layer metal plating 21 is added. The conductive film is formed by vapor deposition or electroless plating.

  20 is an enlarged perspective view of the adhesive rib-forming metal mask according to the fifth embodiment of the present invention as viewed from the A part squeegee side of FIG. 1, FIG. 21 is a sectional view taken along the line KK of FIG. FIG. 21 is a cross-sectional view taken along line LL in FIG. 20.

  In the above Examples 1 to 4, the metal mask 2 for forming an adhesive rib having a three-layer structure has been described. In this Example 5, as shown in FIGS. 20 to 22, an adhesive rib having a three-layer structure is formed. The upper side (squeegee side) of the first metal layer 2 of the metal mask 2 serves as a reception window for the liquid UV resin (adhesive) 14a at the time of screen printing, and is liquid to the opening 4 of the first layer 21. This is a metal mask for forming an adhesive rib having a four-layer structure in which the uppermost surface layer 6 of the metal mask 2 having the introduction opening 5 for introducing the UV resin (adhesive) 14a is further provided. Here, the introduction opening 5 formed in the uppermost surface layer 6 is formed at the same position as the opening 4 of the first layer 21. As a result, the liquid UV resin (adhesive) 14a is received in the introduction opening 5 of the surface layer 6 and smoothly introduced into the opening 4 of the first layer 21, so that the adhesive rib A printing height of 14 can be ensured.

  FIG. 23 is an enlarged perspective view of a metal mask for forming an adhesive rib according to Embodiment 6 of the present invention as viewed from the printed surface side.

  In Example 6, the first layer (squeegee side) 21 of the metal mask 2 for forming an adhesive rib has a plate thickness of, for example, 100 μm, and a large number of first-layer bridges 21a are spanned in the opening 4. The first-layer metal plating 21 is formed so that the width is 50 μm and the diagonal bracing portion 21 b is provided only at the intersection of the opening 4. Next, the second layer (printed surface side) 22c of the metal mask 2 for forming an adhesive rib has, for example, a plate thickness of 100 μm and two types of second-layer bridges 22c alternately on the first layer 21. Only half are formed. Here, one type of second layer bridge 22c is a cantilever type second layer bridge 22c extending from one side toward the center and ending at the center, and another type of second layer bridge 22c. Is a cantilevered second-layer bridge 22c that extends from the other side toward the center and ends at the center, and is cantilevered so as to be alternately cantilevered, with a width of 50 μm, A second-layer metal plating 22 is formed at a crossing portion of the opening so as not to have a bracing portion. Here, by forming the belt-like convex portion 23 that is the third layer only in the peripheral portion of the opening 4, a concave portion is formed inside the belt-like convex portion 23, and the liquid drainage of the adhesive is improved. There is an effect of preventing bleeding.

  Since the manufacturing method of the adhesive rib forming metal mask 2 according to the sixth embodiment is substantially the same as that of the first embodiment, the description thereof is omitted. Further, the third layer (printed surface side) 23 of the adhesive rib forming metal mask 2 may be omitted. In the sixth embodiment, the two types of cantilevered second layer bridges 22c extend from one side or the other side toward the center and end at the center. The tip of the second-layer bridge 22c is shaped so as not to wrap, but the tip of the adjacent cantilever-type second-layer bridge 22c is moved beyond the center of the cantilevered tip. It may be possible to wrap each other, and conversely, the cantilevered tip portion may be formed short so as not to exceed the central portion so that the second layer does not exist in the central portion. .

  FIG. 24 is an enlarged perspective view of an adhesive rib-forming metal mask according to Embodiment 7 of the present invention as viewed from the printing surface side.

  In Example 7, the first layer (squeegee side) 21 of the metal mask 2 for forming an adhesive rib has a plate thickness of 100 μm, for example, and a large number of first layer bridges 21a are spanned in the opening 4, The first-layer metal plating 21 is formed so that the width is 50 μm and the diagonal bracing portion 21 b is provided only at the intersection of the opening 4. Next, the second layer (printed surface side) 22 of the metal mask 2 for forming the adhesive rib is, for example, a plate thickness of 100 μm and two different types of second layer bridges 22c and 22d on the first layer 21. Are alternately formed. Here, one type of second layer bridge 22c is a pair of left and right cantilevered second layer bridges 22c that extend from both sides toward the center and end in the middle without a center portion. Another type of second-layer bridge 22d is an island-shaped second-layer bridge 22d that exists only in the center without both sides. These two different types of second-layer bridges 22c and 22d are alternately formed on each first-layer bridge 21a, have a width of 50 μm, and have a structure in which no bracing portion is provided at the intersection of the openings. Thus, the second-layer metal plating 22 is formed. Here, by forming the belt-like convex portion 23 that is the third layer only in the peripheral portion of the opening 4, a concave portion is formed inside the belt-like convex portion 23, and the liquid drainage of the adhesive is improved. There is an effect of preventing bleeding. Further, the two different types of second-layer bridges 22c and 22d may have a round shape, a triangular shape, a honeycomb shape, a rhombus shape, or the like other than a square shape.

  Since the manufacturing method of the metal mask 2 for forming an adhesive rib according to the seventh embodiment is substantially the same as that of the first embodiment, the description thereof is omitted. Further, the third layer (printed surface side) 23 of the adhesive rib forming metal mask 2 may be omitted. Further, in Example 7, two different types of second-layer bridges 22c and 22d extend from both sides toward the center, and a pair of left and right cantilevered second-layer bridges 22c ending in the middle without a center portion. And the island-shaped second-layer bridge 22d that exists only in the center without both sides are not overlapped with each other, but by extending both, one of the adjacent second-layer bridges 22c, 22d You may make it a part wrap mutually.

DESCRIPTION OF SYMBOLS 1 Screen printing plate 2 Metal mask for adhesive rib formation 3 Metal square frame 4 Opening part 5 Opening part 6 Surface layer 11 of the uppermost layer of the metal mask 2 Semiconductor substrate 12 Image sensor 13 Image sensor cover part 14 Adhesion Agent rib (closed-shaped UV resin barrier surrounding the entire periphery of the image sensor)
14a Liquid UV resin (adhesive)
15 Squeegee 16 Light Receiving Part 21 First Layer Metal Plating 22 Second Layer Metal Plating 23 Third Layer Metal Plating 21a First Layer Bridge 21b Bracing Sections 22a-22d Second Layer Bridge

Claims (21)

It has a closed shape that surrounds the entire periphery of the electronic component, and is used for forming a protective cover adhesive rib for protecting or sealing the electronic component by screen printing. In the metal mask for forming an adhesive rib in which an opening penetrating on the printing surface side is formed,
The upper layer portion on the squeegee surface side of the metal mask is configured, and the first layer metal plating in which the first layer mesh or the first layer bridge is formed in the corresponding portion where the printing pattern opening is formed ,
Formed integrally with the first-layer metal plating, constitutes a lower layer portion on the printed surface side of the metal mask, and the first-layer mesh or 1 is formed at a corresponding portion where the print pattern opening is formed. A second-layer mesh thinned to a number of 1/2 or less of the layer bridge or a second-layer metal plating on which a second-layer bridge is formed,
The first layer mesh or the first layer bridge formed on the squeegee surface side of the opening of the first layer metal plating and the printed surface side of the opening of the second layer metal plating are thinned out. Due to the presence of the formed second layer mesh or second layer bridge, when the liquid adhesive passes through the opening, shearing stress is applied to the adhesive to increase the fluidity, thereby adhering at a desired printing height. A metal mask for forming an adhesive rib, wherein an adhesive rib is obtained. It has a closed shape that surrounds the entire periphery of the electronic component, and is used for forming a protective cover adhesive rib for protecting or sealing the electronic component by screen printing. In the metal mask for forming an adhesive rib in which an opening penetrating on the printing surface side is formed,
The upper layer portion on the squeegee surface side of the metal mask is configured, and the first layer metal plating in which the first layer mesh or the first layer bridge is formed in the corresponding portion where the printing pattern opening is formed ,
Formed integrally with the first-layer metal plating, constitutes a lower layer portion on the printed surface side of the metal mask, and the first-layer mesh or 1 is formed at a corresponding portion where the print pattern opening is formed. A second-layer metal plating in which a second-layer mesh or a second-layer bridge thinned out to a number of 1/2 or less of the layer bridge is formed;
Formed integrally with the second layer of metal plating, a band-shaped convex portion is formed only on the periphery of the opening on the printing surface side to prevent contact with a specified portion of the printing surface or improve the separation of the plate. A third-layer metal plating for
The first layer mesh or the first layer bridge formed on the squeegee surface side of the opening of the first layer metal plating and the printed surface side of the opening of the second layer metal plating are thinned out. Due to the presence of the formed second layer mesh or second layer bridge, when the liquid adhesive passes through the opening, shearing stress is applied to the adhesive to increase the fluidity, thereby adhering at a desired printing height. A metal mask for forming an adhesive rib, wherein an adhesive rib is obtained.   The first layer of metal plating has a structure in which diagonal struts are provided only at the intersection of the opening on the squeegee surface side, and the second layer of metal plating intersects the printed surface side of the opening. 3. The metal mask for forming an adhesive rib according to claim 1, wherein the portion is not provided with a bracing portion.   The intersection of the opening on the squeegee surface side in the metal plating of the first layer is a pentagonal shape in which the end portions are butted against each other by eliminating the bridge provided in the portion closest to the bracing portion leaving only the diagonal bracing portion. 4. The metal mask for forming an adhesive rib according to claim 3, wherein four openings are formed. It has a closed shape that surrounds the entire periphery of the electronic component, and is used for forming a protective cover adhesive rib for protecting or sealing the electronic component by screen printing. In the metal mask for forming an adhesive rib in which an opening penetrating on the printing surface side is formed,
A first-layer metal plating in which a first-layer bridge is formed on the squeegee surface side of the opening;
A second layer formed integrally with the first layer of metal plating, and formed with a staggered second layer bridge that is staggered from the first layer bridge on the printing surface side of the opening. With metal plating of the layer,
The first layer bridge formed on the squeegee surface side of the opening portion of the first layer metal plating and the second layer formed in a staggered manner on the printing surface side of the opening portion of the second layer metal plating. Due to the presence of the bridge, when the liquid adhesive passes through the opening, a shear stress is applied to the adhesive to increase the fluidity, whereby an adhesive rib having a desired printing height can be obtained. Metal mask for forming adhesive ribs. It has a closed shape that surrounds the entire periphery of the electronic component, and is used for forming a protective cover adhesive rib for protecting or sealing the electronic component by screen printing. In the metal mask for forming an adhesive rib in which an opening penetrating on the printing surface side is formed,
A first-layer metal plating in which a first-layer bridge is formed on the squeegee surface side of the opening;
A second layer formed integrally with the first layer of metal plating, and formed with a staggered second layer bridge that is staggered from the first layer bridge on the printing surface side of the opening. The metal plating of the layer,
Formed integrally with the second layer of metal plating, a band-shaped convex portion is formed only on the periphery of the opening on the printing surface side to prevent contact with a specified portion of the printing surface or improve the separation of the plate. A third-layer metal plating for
The first layer bridge formed on the squeegee surface side of the opening portion of the first layer metal plating and the second layer formed in a staggered manner on the printing surface side of the opening portion of the second layer metal plating. Due to the presence of the bridge, when the liquid adhesive passes through the opening, a shear stress is applied to the adhesive to increase the fluidity, whereby an adhesive rib having a desired printing height can be obtained. Metal mask for forming adhesive ribs.   The first layer of metal plating has a structure in which diagonal struts are provided only at the intersection of the opening on the squeegee surface side, and the second layer of metal plating intersects the printed surface side of the opening. 7. The metal mask for forming an adhesive rib according to claim 5 or 6, wherein the portion is not provided with a bracing portion.   The intersection of the opening on the squeegee surface side in the metal plating of the first layer is a pentagonal shape in which the end portions are butted against each other by eliminating the bridge provided in the portion closest to the bracing portion leaving only the diagonal bracing portion. 8. The metal mask for forming an adhesive rib according to claim 7, wherein four openings are formed.   An opening for introducing a liquid adhesive resin into the opening of the first layer on the first layer metal plating squeegee surface side as a reception window for the liquid adhesive resin during screen printing The metal mask for forming an adhesive rib according to any one of claims 1 to 8, further comprising a metal plating of an uppermost layer having: It has a closed shape that surrounds the entire periphery of the electronic component, and is used for forming a protective cover adhesive rib for protecting or sealing the electronic component by screen printing. In the metal mask for forming an adhesive rib in which an opening penetrating on the printing surface side is formed,
A first-layer metal plating in which a first-layer bridge is formed on the squeegee surface side of the opening;
A second layer formed integrally with the first layer of metal plating and having half of the cantilevered second layer bridges alternately formed on the first layer bridge on the printing surface side of the opening. With metal plating,
The first layer bridge formed on the squeegee surface side of the opening portion of the first layer metal plating and the first layer bridge formed alternately on the printing surface side of the opening portion of the second layer metal plating. Due to the presence of the cantilevered second-layer bridge, when the liquid adhesive passes through the opening, a shear stress is applied to the adhesive to increase fluidity, thereby obtaining an adhesive rib having a desired printing height. A metal mask for forming an adhesive rib, wherein It has a closed shape that surrounds the entire periphery of the electronic component, and is used for forming a protective cover adhesive rib for protecting or sealing the electronic component by screen printing. In the metal mask for forming an adhesive rib in which an opening penetrating on the printing surface side is formed,
A first-layer metal plating in which a first-layer bridge is formed on the squeegee surface side of the opening;
Second-layer metal plating formed integrally with the first-layer metal plating and having two types of second-layer bridges alternately formed on the first-layer bridge on the printing surface side of the opening. One type of the second-layer bridge is a pair of cantilevered second-layer bridges extending from both sides toward the center and having no central portion, and the remaining one type has no both-side portions It is an island-shaped second-layer bridge that exists only in the center.
The first layer bridge formed on the squeegee surface side of the opening portion of the first layer metal plating, and 2 formed on the first layer bridge on the printing surface side of the opening portion of the second layer metal plating. Due to the presence of the kind of second-layer bridge, when the liquid adhesive passes through the opening, shearing stress is applied to the adhesive to increase the fluidity so that an adhesive rib having a desired printing height can be obtained. A metal mask for forming an adhesive rib. Preparing a conductive base material;
On the conductive base material, forming a first resist for providing an opening on the squeegee surface side and a first layer mesh or a first layer bridge in the opening;
Except for the region where the first resist is formed on the conductive base material, an upper layer portion on the squeegee surface side of the metal mask is formed, and a first layer is formed at a corresponding portion where the print pattern opening is formed. Forming a first-layer metal plating having a structure in which a mesh or a first-layer bridge is formed;
Removing the first resist;
On the metal plating of the first layer, the opening on the printing surface side and the second layer mesh thinned out in the opening to half the number of the first layer mesh or the first layer bridge or Forming a second resist to provide a second layer bridge;
Except for the region where the second resist is formed on the first-layer metal plating , a lower layer portion on the printed surface side of the metal mask is formed, and the corresponding portion where the printing pattern opening is formed Forming a second-layer metal plating having a structure in which a second-layer mesh or a second-layer bridge thinned out to a number equal to or less than 1/2 of the first-layer mesh or the first-layer bridge;
Removing the second resist, and then removing the first-layer metal plating and the second-layer metal plating integrally from the conductive base material,
The first layer mesh or the first layer bridge formed on the squeegee surface side of the opening of the first layer metal plating and the printed surface side of the opening of the second layer metal plating are thinned out. Due to the presence of the formed second layer mesh or second layer bridge, when the liquid adhesive passes through the opening, shearing stress is applied to the adhesive to increase the fluidity, thereby adhering at a desired printing height. A method for producing a metal mask for forming an adhesive rib, wherein an adhesive rib is obtained. Preparing a conductive base material;
On the conductive base material, forming a first resist for providing an opening on the squeegee surface side and a first layer mesh or a first layer bridge in the opening;
Except for the region where the first resist is formed on the conductive base material, an upper layer portion on the squeegee surface side of the metal mask is formed, and a first layer is formed at a corresponding portion where the print pattern opening is formed. Forming a first-layer metal plating having a structure in which a mesh or a first-layer bridge is formed;
Removing the first resist;
On the metal plating of the first layer, the opening on the printing surface side and the second layer mesh thinned out in the opening to half the number of the first layer mesh or the first layer bridge or Forming a second resist to provide a second layer bridge;
Except for the region where the second resist is formed on the first-layer metal plating , a lower layer portion on the printed surface side of the metal mask is formed, and the corresponding portion where the printing pattern opening is formed Forming a second-layer metal plating having a structure in which a second-layer mesh or a second-layer bridge thinned out to a number equal to or less than 1/2 of the first-layer mesh or the first-layer bridge;
Removing the second resist;
Forming a third resist on the second-layer metal plating to provide a belt-like convex portion only on the printing surface side opening and the peripheral portion of the opening;
Forming a third layer of metal plating on the second layer of metal plating, excluding a region where a third resist is formed;
Removing the third resist, and then integrally peeling the first layer metal plating, the second layer metal plating, and the third layer metal plating from the conductive base material,
The first layer mesh or the first layer bridge formed on the squeegee surface side of the opening of the first layer metal plating and the printed surface side of the opening of the second layer metal plating are thinned out. Due to the presence of the formed second layer mesh or second layer bridge, when the liquid adhesive passes through the opening, shearing stress is applied to the adhesive to increase the fluidity, thereby adhering at a desired printing height. A method for producing a metal mask for forming an adhesive rib, wherein an adhesive rib is obtained.   The step of forming the first resist is to provide an oblique bracing portion only at the intersection of the opening on the squeegee surface side, and the step of forming the first metal plating includes the opening on the squeegee surface side. An oblique bracing portion is provided only at the intersection of the portions, and the step of forming the second layer of metal plating is the intersection of the opening on the printed surface side with the first layer of metal plating. The method for producing a metal mask for forming an adhesive rib according to claim 10 or 11, wherein the portion is not provided with a bracing portion. Preparing a conductive base material;
Forming a first resist for providing an opening on the squeegee surface side and a first-layer bridge on the opening on the conductive base material;
Forming a first-layer metal plating having a structure in which a first-layer bridge is formed on the opening on the squeegee surface side, excluding a region where the first resist is formed, on the conductive base material; ,
Removing the first resist;
Forming a conductive film on the printing surface side of the metal plating of the first layer;
A second resist for providing an opening on the printing surface side and a second layer bridge arranged in a staggered manner in the opening alternately with the first layer bridge on the first layer metal plating Forming a step;
Wherein on the first layer of metal plating, except for the region in which the second resist is formed, the second layer bridge disposed said shifted first layer bridge and each other I違 physician to the opening of the printing surface Forming a second-layer metal plating having a structure in which
Removing the second resist, and then removing the first-layer metal plating and the second-layer metal plating integrally from the conductive base material,
A first layer mesh or first layer bridge formed squeegee side of the opening portion of the first layer metal plating, shifted each other I違 physician print surface side of the opening of the second layer metal plating Due to the presence of the second layer mesh or the second layer bridge arranged in a staggered manner, when the liquid adhesive passes through the opening, a shear stress is applied to the adhesive to increase the fluidity, thereby achieving desired printing. A method for producing a metal mask for forming an adhesive rib, characterized in that an adhesive rib having a height is obtained. Preparing a conductive base material;
Forming a first resist for providing an opening on the squeegee surface side and a first-layer bridge on the opening on the conductive base material;
Forming a first-layer metal plating having a structure in which a first-layer bridge is formed on the opening on the squeegee surface side, excluding a region where the first resist is formed, on the conductive base material; ,
Removing the first resist;
Forming a conductive film on the printing surface side of the metal plating of the first layer;
A second resist for providing an opening on the printing surface side and a second layer bridge arranged in a staggered manner in the opening alternately with the first layer bridge on the first layer metal plating Forming a step;
Wherein on the first layer of metal plating, with the exception of the second resist is formed region, the disposed shifted first layer bridge and each other I違 physician to the opening of the printing surface in a zigzag pattern 2 Forming a second layer metal plating having a structure in which a layer bridge is formed;
Removing the second resist;
Forming a third resist on the second-layer metal plating to provide a belt-like convex portion only on the printing surface side opening and the peripheral portion of the opening;
Forming a third layer of metal plating on the second layer of metal plating, excluding a region where a third resist is formed;
Removing the third resist, and then integrally peeling the first layer metal plating, the second layer metal plating, and the third layer metal plating from the conductive base material,
A first layer mesh or first layer bridge formed squeegee side of the opening portion of the first layer metal plating, shifted each other I違 physician print surface side of the opening of the second layer metal plating Due to the presence of the second layer mesh or the second layer bridge arranged in a staggered manner, when the liquid adhesive passes through the opening, a shear stress is applied to the adhesive to increase the fluidity, thereby achieving desired printing. A method for producing a metal mask for forming an adhesive rib, characterized in that an adhesive rib having a height is obtained.   The step of forming the first resist is to provide an oblique bracing portion only at the intersection of the opening on the squeegee surface side, and the step of forming the first metal plating includes the opening on the squeegee surface side. An oblique bracing portion is provided only at the intersection of the portions, and the step of forming the second layer of metal plating is the intersection of the opening on the printed surface side with the first layer of metal plating. The method for producing a metal mask for forming an adhesive rib according to claim 13 or 14, wherein the portion is not provided with a bracing portion.   An opening for introducing a liquid adhesive resin into the opening of the first layer on the first layer metal plating squeegee surface side as a reception window for the liquid adhesive resin during screen printing The method for producing a metal mask for forming an adhesive rib according to any one of claims 10 to 15, further comprising a step of forming a metal plating of an uppermost layer having a surface. A screen printing method which forms a closed shape surrounding the entire periphery of an electronic component, and forms an adhesive rib for bonding a protective cover for protecting or sealing the electronic component by screen printing,
An opening penetrating from the squeegee surface side to the printing surface side is formed to constitute an upper layer portion on the squeegee surface side, and a first layer mesh or a first layer bridge is formed at a corresponding portion where the printing pattern opening portion is formed. Corresponding portion formed integrally with the formed first layer metal plating and the first layer metal plating, forming a lower layer portion on the printing surface side, and forming the printing pattern opening And a second-layer metal plating formed with a second-layer mesh or second-layer bridge thinned out to a number half or less of the first-layer mesh or first-layer bridge. Using a forming metal mask,
The first layer mesh or the first layer bridge formed on the squeegee surface side of the opening of the first layer metal plating and the printed surface side of the opening of the second layer metal plating are thinned out. Due to the presence of the formed second-layer mesh or second-layer bridge, when the liquid adhesive passes through the opening, a shear stress is applied to the adhesive to increase fluidity, thereby enclosing the entire periphery of the electronic component. A screen printing method using a metal mask for forming an adhesive rib, wherein the adhesive rib for bonding a protective cover for protecting or sealing an electronic component is printed at a desired height. A screen printing method which forms a closed shape surrounding the entire periphery of an electronic component, and forms an adhesive rib for bonding a protective cover for protecting or sealing the electronic component by screen printing,
An opening penetrating from the squeegee surface side to the printing surface side is formed to constitute an upper layer portion on the squeegee surface side, and a first layer mesh or a first layer bridge is formed at a corresponding portion where the printing pattern opening portion is formed. Corresponding portion formed integrally with the formed first layer metal plating and the first layer metal plating, forming a lower layer portion on the printing surface side, and forming the printing pattern opening A second-layer metal plating in which a second-layer mesh or second-layer bridge thinned out to a number of 1/2 or less of the first-layer mesh or first-layer bridge, and the second-layer mesh And a third-layer metal plating for forming a strip-shaped convex portion that improves the separation of the plate only in the peripheral portion on the printing surface side of the opening. Using a forming metal mask,
The first layer mesh or the first layer bridge formed on the squeegee surface side of the opening of the first layer metal plating and the printed surface side of the opening of the second layer metal plating are thinned out. Due to the presence of the formed second-layer mesh or second-layer bridge, when the liquid adhesive passes through the opening, a shear stress is applied to the adhesive to increase fluidity, thereby enclosing the entire periphery of the electronic component. A screen printing method using a metal mask for forming an adhesive rib, wherein the adhesive rib for bonding a protective cover for protecting or sealing an electronic component is printed at a desired height. A screen printing method that forms a closed shape that surrounds the entire periphery of an electronic component, and forms an adhesive rib for protective cover adhesion to protect or seal the electronic component by screen printing, and after the first printing, 21. The screen printing method using the metal mask for forming an adhesive rib according to claim 19 or 20 , wherein the liquid adhesive is photocured and then printed twice or more by the same method.

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