JP5453938B2 - Contact probe manufacturing method and contact probe - Google Patents

Description

  The present invention relates to a contact probe manufacturing method and a contact probe, and more specifically, a contact probe manufacturing method capable of mass production at a lower cost, and a contact formed using the above manufacturing method. It relates to the probe.

  In order to electrically inspect electronic components on which IC and LSI are mounted at high density, a probe card having a large number of contact probes is used. The contact probe is electrically connected to the electronic component by connecting the tip to an electrode of the electronic component. Various data such as electrical characteristics are collected from the contact probe. The tip of the contact probe is sharp, breaks the oxide film formed on the surface of the electrode, and obtains electrical conduction. Moreover, in order to absorb the curvature of the electronic component which is a test object, and the dispersion | variation in the height of an electrode, and to obtain a reliable contact with an electrode, it has a spring structure.

  For example, a probe disclosed in International Publication No. WO2004 / 092748 (Patent Document 1) is processed by the following method. That is, a shape close to the shape of the probe is formed by lithography and electroforming, and then the tip is cut out to make it thinner. For example, the above cutting process is performed by using micro electric discharge machining or dicing.

WO2004 / 092748

  As disclosed in Patent Document 1, it is preferable to use micro electric discharge machining as a method of forming by cutting out a tip portion or a terminal portion from an electroformed probe. The method of cutting out a desired shape from a metal material by using micro electrical discharge machining is particularly excellent in machining accuracy such as the dimensions and surface roughness of the probe to be formed. However, in the micro electric discharge machining, a process of cutting out a desired shape is performed for each place over time. Therefore, there is a problem that the cost of the probe becomes high.

  Further, as a method of forming a probe, there is a method of cutting out from a metal material by using dicing instead of electric discharge machining. In the case of dicing, cutting is performed in a linear direction using, for example, a circular rotary blade. Therefore, for example, when a plurality of probes are cut out together by dicing, before processing, the regions to be cut out to form a plurality of probes are arranged on the same straight line. It is necessary to do an array. If the arrangement before processing is devised in this way, the arrangement density on the substrate may be lowered depending on the probe shape. That is, the number of probes that can be formed on the main surface of one substrate is reduced. In the method of forming a probe by lithography and electroforming, the cost for processing a single substrate is determined, so that the cost of the probe is increased.

  The present invention has been made in view of the above problems, and its object is to improve the processing efficiency of a contact probe formed from a metal structure formed by lithography and electroforming, and to reduce the cost. A contact probe manufacturing method and a contact probe formed using the above method are provided.

The contact probe manufacturing method according to the present invention includes a step of preparing a substrate, a step of forming a first resin mold by lithography on a resist coated on one main surface of the substrate, and a first resin mold. A step of filling a metal material to form a first metal layer so as to embed, and a resist applied on the main surface of the first metal layer opposite to the main surface facing the substrate. On the other hand, after the step of forming the second resin mold by lithography, the step of forming the second resin mold, the step of removing the first metal layer, and forming on one main surface of the substrate And a step of performing electroforming to form the second metal layer so as to embed the first and second resin molds.
The contact probe manufacturing method according to the present invention includes a step of preparing a substrate, a step of forming a first resin mold by lithography on a resist coated on one main surface of the substrate, and a first resin mold. A step of filling a metal material to form a first metal layer so as to embed, and a resist applied on the main surface of the first metal layer opposite to the main surface facing the substrate. On the other hand, after the step of forming the second resin mold by lithography, the step of forming the second resin mold, the step of removing the first metal layer, and forming on one main surface of the substrate And a step of performing electroforming to form the second metal layer so as to embed the first and second resin molds. After the step of filling the metal material, before the step of forming the second resin mold, the step of polishing the main surface of the first resin mold and the step of performing electroforming, the second metal layer A step of polishing the main surface of the first metal layer, and in the step of filling the metal material, the first metal layer is formed by electroforming.

  In the present invention, when forming the contact probe, a resin mold capable of forming a metal material into a desired shape is formed. The resin mold is formed by lithography on the resist applied on one main surface of the substrate. By performing the lithography process a plurality of times, for example, the second resin mold is laminated on the first resin mold. Thus, the resin mold formed by performing the lithography process a plurality of times has, for example, a step structure. For this reason, if a metal material (second metal layer) is formed by electroforming an area surrounded by a resin mold having a step structure, the formed second metal layer follows the resin mold step structure. The shape has a stepped structure. Here, electroforming is a step of performing ultra-thick electroplating (for example, several tens of μm or more) on a mother die.

  The second metal layer (metal material layer) having this step structure becomes a contact probe to be formed. Therefore, if a resin mold formed by a lithography process is used, a contact probe having a desired shape can be easily formed by performing a single electroforming process. Since the contact probe can be easily formed in this way, the processing cost of the contact probe can be reduced.

  As described above, in order to form the second resin mold on the first resin mold with high accuracy, the inside of the first resin mold is filled before the second resin mold is formed. Thus, it is preferable to form (arrange) the first metal layer in advance.

  The contact probe manufacturing method according to the present invention preferably further includes a step of polishing the main surface of the first resin mold formed by the step of forming the first resin mold. The contact probe manufacturing method according to the present invention preferably further includes a step of polishing the main surface of the second metal layer formed by the step of performing electroforming.

  If the first metal layer formed so as to embed the first resin mold is removed by polishing an area of a certain thickness from the main surface which is the uppermost surface, the first resin mold The thickness can be adjusted to a desired thickness. The region of a certain thickness from the main surface, which is the uppermost surface of the second metal layer, is also polished in the same manner, whereby the thickness of the second metal layer constituting the contact probe to be formed is set to a desired thickness. Can be adjusted.

  As described above, if the above polishing step is performed, the dimensional accuracy of the contact probe to be formed, particularly regarding the thickness, can be increased. Further, by polishing, for example, the uppermost surface of the first resin mold and the uppermost surface of the second metal layer can be further flattened.

  In the contact probe manufacturing method according to the present invention, it is preferable that the first metal layer is formed by electroforming in the step of filling the metal material.

  As described above, in order to form the second resin mold on the first resin mold with high accuracy, the inside of the first resin mold is filled before the second resin mold is formed. It is preferable to form (arrange) the first metal layer. Thus, the main surface as the base for forming the second resin mold is not in a state having a hollow portion in the direction along the main surface as in the first resin mold, for example, but is formed by electroforming. If the first metal layer is filled, the second resin mold can be formed with high accuracy using the uppermost surface of the first metal layer or the uppermost surface of the first resin mold as the main surface. it can. That is, since the uppermost surface of the first metal layer can be used as a base for forming the second resin mold, it is possible to improve the dimensional accuracy in which the second resin mold is formed. Since the main surface as a base for forming the second resin mold does not have a hollow portion, the diameter of the opening of the first resin mold is larger than the diameter of the opening of the second resin mold. You can do it or you can make it smaller.

  In the contact probe manufacturing method according to the present invention, in the step of filling the metal material, the first metal layer is formed by disposing a sheet-like structure made of the metal material on one main surface of the substrate. May be formed.

  Even in this case, as in the case of using the first metal layer formed by electroforming, it is possible to use the uppermost main surface of the structure as a base for forming the second resin mold. it can. For this reason, for example, when the second resin mold is formed by the lithography process, the processing accuracy (dimensional accuracy) in the lithography process can be increased as compared with the case where the main surface is in a hollow state.

  The contact probe formed using the contact probe manufacturing method described above is formed by forming a metal material layer having a desired shape using a stepped pattern formed by lithography of a coated resist as a resin mold. The Therefore, for example, machining can be easily performed as compared with the case of performing machining that cuts out the tip portion of the metal material layer using electric discharge machining or dicing machining. For this reason, the processing cost of the contact probe can be reduced.

  According to the present invention, a contact probe used for measuring an electronic component can be formed at a lower cost.

It is a flowchart which shows each process in the manufacturing method of the contact probe which concerns on this invention. FIG. 5 is a cross-sectional view showing a manufacturing mode in the step of preparing a substrate in the first embodiment. FIG. 6 is a cross-sectional view showing a manufacturing mode in a first lithography process in the first embodiment. FIG. 6 is a cross-sectional view showing a manufacturing mode in a first electroforming process as a process for filling a substrate in the first embodiment. 5 is a cross-sectional view showing a manufacturing mode in a first polishing step in Embodiment 1. FIG. 5 is a cross-sectional view showing a manufacturing mode in a second lithography process in the first embodiment. FIG. It is sectional drawing which shows the aspect after removing the 1st metal layer in Embodiment 1. FIG. FIG. 3 is a cross-sectional view showing an aspect in which a second electroforming process in the first embodiment is performed. 5 is a cross-sectional view showing a manufacturing mode in a second polishing process in the first embodiment. FIG. It is sectional drawing which shows the aspect of the structure enclosed by the resin type | mold of FIG. 4 is a top view of a contact probe formed in the first embodiment. FIG. It is a side view of the contact probe of FIG. 11 is a cross-sectional view showing a manufacturing mode in a first lithography process in the second embodiment. FIG. FIG. 10 is a cross-sectional view showing a manufacturing mode in a first electroforming process as a process for filling a substrate in Embodiment 2. FIG. 11 is a cross-sectional view showing a manufacturing mode in a first polishing process in the second embodiment. 11 is a cross-sectional view showing a manufacturing mode in a second lithography process in the second embodiment. FIG. It is sectional drawing which shows the aspect after removing the 1st metal layer in Embodiment 2. FIG. FIG. 6 is a cross-sectional view showing a mode in which a second electroforming process in Embodiment 2 is performed. FIG. 10 is a cross-sectional view showing a manufacturing mode in a second polishing process in the second embodiment. It is sectional drawing which shows the aspect of the structure surrounded by the resin type | mold of FIG. FIG. 11 is a cross-sectional view showing a state where a sheet-like structure is arranged as a step of filling a substrate in Embodiment 3.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each embodiment, elements having the same function are denoted by the same reference numerals, and the description thereof will not be repeated unless particularly necessary.

(Embodiment 1)
The contact probe manufacturing method according to the first embodiment of the present invention will be described below by appropriately comparing and referring to the flowchart of FIG. 1 and cross-sectional views showing manufacturing modes in the respective steps shown in FIGS.

  First, as shown in FIG. 1, a step of preparing a substrate (S10) is performed. Specifically, it is a step of preparing a resin mold for constituting a contact probe and a substrate as a base for constituting a structure of a contact probe using the resin mold.

  More specifically, as shown in FIG. 2, a flat substrate 1 made of, for example, SUS is prepared. However, the material of the substrate 1 is not limited to SUS, and for example, a metallic substrate such as copper or nickel, or a silicon substrate obtained by sputtering a metal material such as titanium or chromium may be used. A conductive substrate prepared by these methods is preferably used as the substrate 1.

  Next, a first lithography step (S20) is performed. Specifically, this is a step of forming a first resin mold used as a mold for forming a first metal layer (metal material layer) constituting the contact probe.

  The first resin mold described above is formed by lithography on the resist applied to one main surface 1a of the substrate 1. For the resist, a resin material mainly composed of polymethacrylate such as polymethyl methacrylate (PMMA), or a chemically amplified resin material sensitive to ultraviolet rays (UV) or X-rays is used. The thickness of the resist can be arbitrarily set according to the thickness of the first metal layer of the contact probe to be formed. For example, the thickness is preferably 10 μm or more and 200 μm or less.

  More specifically, the resist described above is applied to almost the entire surface of one main surface (upper main surface 1a) of the substrate 1 shown in FIG. For example, after supplying a certain amount of resist to a partial region on one main surface of the substrate 1, the resist is applied to almost the entire surface on the main surface of the substrate 1 by rotating it using a spin coater. Next, a mask for lithography is arranged in a region of the substrate 1 facing the main surface supplied with the resist, and UV or X-rays are irradiated through the mask. When a structure having a thickness exceeding 100 μm and a high aspect ratio is required, or when a highly accurate structure having a dimensional accuracy of about ± 2 μm is required, X having a wavelength shorter than UV (for example, wavelength 200 nm) It is preferable to use a line (for example, wavelength 0.4 nm). Further, it is more preferable to use synchrotron radiation X-ray (hereinafter referred to as “SR”) having high directivity among X-rays. The LIGA method using SR is capable of deep lithography, and can manufacture a large number of contact probes having a thickness of 100 μm with high accuracy on the order of microns. On the other hand, when UV is used, a merit can be pursued in terms of cost.

  The mask includes a translucent substrate such as UV or X-ray and an absorption layer patterned according to the shape of the first metal layer to be formed. As the translucent substrate that transmits incident UV, X-rays, etc., silicon nitride, silicon, diamond, titanium, or the like is used for the X-ray mask, and quartz glass or the like is used for the UV mask. In addition, as an absorption layer that absorbs incident UV, X-rays, etc., heavy metals such as gold, tungsten, tantalum, or compounds thereof are used in the case of an X-ray mask, and chromium is used in the case of a UV mask. Is used.

  Such a mask is irradiated with X-rays or UV from the side opposite to the side where the substrate 1 is disposed (upper side in FIG. 3). If it does in this way, energy rays, such as UV or X-rays which passed through the translucent base material will pass through a mask, will arrive at substrate 1, and will expose the resist coated on the main surface of substrate 1. . On the other hand, UV or X-rays irradiated to the absorption layer of the mask do not reach the substrate 1 because it is absorbed by the mask. For this reason, the resist facing the absorption layer is not exposed by the UV or X-ray. For example, when the resist is a positive resist, the resist 1 is exposed through a mask as described above, and then development is performed on the substrate 1 coated with the resist. Only the resist that has been cut) is removed from the substrate 1. On the other hand, the resist that has not been exposed because the energy rays are absorbed by the mask is not removed from the substrate 1 even if the development process is performed. Thus, the resist applied on the main surface of the substrate 1 can be formed as the resin mold 3 shown in FIG. 3 in accordance with the pattern of the absorption layer formed on the mask. Contrary to the positive resist described above, a negative resist in which the exposed resist remains on the main surface of the substrate 1 after the development process and the unexposed resist is removed by the development process, You may perform the process similar to the above.

  After forming the resin mold 3 shown in FIG. 3 by the first lithography step (S20) as described above, the step (S30) of filling the substrate shown in FIG. 1 is performed. Specifically, the substrate 1 shown in FIG. 3 is immersed in a metal ion solution, and an electrochemical reaction process is performed on the substrate 1. In this manner, a desired metal material layer (first metal layer) is formed on the main surface of the substrate 1. The electrochemical reaction treatment here is the same treatment as the plating treatment, but the metal layer to be formed is thicker than the metal thin film formed by the plating treatment, and the metal for constituting the contact probe. This is a process for forming a layer (structure). Alternatively, the electrochemical reaction treatment may be referred to as electroforming.

  The first metal layer 5 is formed by filling a metal material so as to embed the resin mold 3. Further, the metal material is similarly formed on the uppermost surface of the resin mold 3 and the region outside the resin mold 3 by electroforming. Therefore, as a whole, the first metal layer 5 is formed as shown in FIG. As the first metal layer 5, it is preferable to form, for example, copper, nickel simple substance, nickel alloy or the like that can be easily removed by etching. Further, the thickness of the first metal layer 5 formed by electroforming may be thicker than the thickness of the resin mold 3 as shown in FIG. It may be thinner than the thickness.

  A first resin mold (resin mold 3 in FIG. 3) and a second resin mold to be described later are formed by lithography on the resist. The second resin mold is formed so as to be laminated on the uppermost surface of the resin mold 3, but the resin mold 3 can be filled with, for example, the first metal layer 5 in the direction along the main surface. It has a hollow part. Thus, when lithography is newly performed on the main surface having the cavity portion to form the second resin mold, the shape of the second resin mold is affected by the presence of the cavity portion. Specifically, if the hollow portion exists, it is difficult to apply a uniform thickness when applying a resist to form the second resin mold thereon. Therefore, the dimensional accuracy and shape of the second resin mold may cause a problem that an error from a design value becomes large. For this reason, after forming the resin mold 3 by the first lithography and before forming the second resin mold by the second lithography, the first surface for securing a main surface as a base for the second lithography is formed. One metal layer 5 is preferably formed by electroforming as described above. If it does in this way, in the process of forming the 2nd resin mold which continues, the 2nd resin mold with high dimensional accuracy and shape accuracy can be formed.

  As shown in FIG. 4, the second lithography may be performed when the first metal layer 5 as one region constituting the contact probe is formed. However, if the thickness of the first metal layer 5 is not within the desired range, the thickness of the resin mold 3 shown in FIG. It is necessary to perform processing. By this treatment, the thickness of the resin mold 3 can be set to a desired thickness. Since the contact probe to be formed is a mechanical part, when the thickness of the first metal layer 5 formed by the electroforming process cannot be precisely controlled, it is essential to perform the above polishing process.

  In this way, the thickness of the resin mold 3 can be controlled more precisely so as to be a desired thickness. For this reason, it is possible to increase the dimensional accuracy of the contact probe molded from the resin mold 3 particularly with respect to the thickness, and to reduce the surface roughness of the uppermost surface (main surface 3b) of the resin mold 3 (that is, the main surface 3b Flattening). For this reason, the processing accuracy in the next process can be improved. The thickness of the resin mold 3 after polishing is determined by the strength design as a spring of the contact probe to be molded, and can be set to, for example, 20 μm or more and 50 μm or less.

  When the resin mold 3 (first metal layer 5) having a desired thickness as shown in FIG. 5 is formed, a second lithography step (S40) is performed as shown in FIG. Specifically, the main surface 5b (resin) which is the main surface of the first metal layer 5 opposite to the main surface facing the substrate 1 is processed in the same manner as in the first lithography step (S20). This is a step performed again on the resist applied on the main surface 3b) of the mold 3. That is, it is a step of forming a second resin mold used as a mold for forming the second metal layer (metal material layer) constituting the contact probe.

  In the first lithography step (S20) described above, the above-described resist is applied to almost the entire surface of one main surface 1a (upper main surface) of the substrate 1. Similarly, in the second lithography step (S40), the above-described resist is applied to almost the entire surface of the main surface 5b so as to have a desired thickness. Then, the exposure process for making the apply | coated resist into the 2nd resin type | mold which has a desired shape is performed using the mask provided with a translucent base material and an absorption layer. Then, development processing is performed on the resist. As described above, the resin mold 7 shown in FIG. 6 is formed. Note that after the resin mold 7 shown in FIG. 6 is formed, the main surface 5b of the first metal layer 5 may be washed with an acidic solution and pure water before proceeding to the next step.

  Next, a step of dissolving the filler (S50) is performed. Specifically, in the step of removing the first metal layer 5 formed to secure the main surface as a base for performing the second lithography step (S40) with high accuracy to obtain the state shown in FIG. is there.

  For example, the first metal layer 5 such as copper is dissolved by wet etching using an acid or alkali, for example, so that the first metal layer 5 can be removed from the substrate 1 to form a cavity. .

  And an electroforming process (S60) is performed as shown in FIG. Similar to the first metal layer 5 formed in the first electroforming step (S30) described above, the electrochemical reaction treatment is performed on the main surface 1a of the substrate 1 and the like on the main surface of the substrate 1. Then, a desired metal layer (second metal layer 9) is formed. Here, as shown in FIG. 8, it is preferable to form the second metal layer 9 having a thickness equal to or greater than the sum of the thicknesses of the resin mold 3 and the resin mold 7. Specifically, the thickness is determined by the strength design as a spring of the contact probe to be molded, and can be set to 60 μm or more and 100 μm or less, for example.

  In this way, as shown in FIG. 8, a laminate for constituting a contact probe, which is a metal material layer having a two-stage structure with the resin mold 3 and the resin mold 7 as the resin mold, is formed. In addition, about the specific procedure which performs a 2nd electroforming process (S60), it is the same as that of the 1st electroforming process (S30) mentioned above. However, regarding the material, the second metal layer 9 is preferably formed from a material suitable for a contact probe, for example, a nickel alloy such as nickel manganese, nickel cobalt, nickel iron, or a simple nickel.

  Then, the post-process (S70) shown in FIG. 1 is performed. Specifically, the second metal formed in the second electroforming step (S60), similar to the processing performed on the first metal layer 5 after the step of filling the substrate (S30) described above. It is preferable to perform a polishing process for removing a region of a certain thickness from the main surface 9a of the layer 9. In this way, the dimensional accuracy can be increased by setting the second metal layer 9 constituting the contact probe to be formed to a desired thickness (desired dimension). Note that the thickness of the second metal layer 9 after polishing is determined by the strength design as a spring of the contact probe to be molded, and may be, for example, 50 μm or more and 150 μm or less.

  Furthermore, the surface roughness of the uppermost surface (main surface 9b) of the second metal layer 9 can be reduced (that is, the main surface 9b is flattened) by the polishing step described above. Therefore, the quality of the formed contact probe can be improved.

  And the process which removes the 2nd metal layer 9 from the board | substrate 1 is performed. First, the second metal layer 9 is pressed and hardened so as to be covered with an acrylic resin, and then the second metal layer 9 covered with the acrylic resin is removed from the substrate 1. At this point, the second metal layer 9 is embedded in the acrylic resin. Here, the acrylic resin is removed by the thickness of the second metal layer 9 by ashing using fluorine and oxygen. Then, the second metal layer 9 becomes free and can be taken out from the acrylic resin.

  As described above, the second metal layer 9 in the region surrounded by the resin mold 3 and the resin mold 7 in FIG. 9 is formed as the contact probe 10 shown in FIG.

  FIG. 10 is a simplified diagram inheriting the content of the cross-sectional view showing the manufacturing mode of FIGS. The detailed shape of the contact probe 10 shown in FIG. 10 is shown in FIG. 11 and FIG. 12 is a side view of the contact probe 10 shown in FIG. 11 viewed from the lower side in FIG. The upper side in FIG. 10 is the lower side (main surface 10b side) in FIG. 12, and the lower side in FIG. 10 is the upper side in FIG. 12 (main surface 10a side).

  The needle portions 11 at the left and right end portions in FIGS. 11 and 12 are regions that are electrically connected to the electronic component and the electrode by connecting to the electrode and the like of the electronic component. . By making the thickness of the needle part 11 thinner than the thickness of other regions, the pressure applied to the tip part of the needle part 11 can be increased. In this way, the oxide film formed on the electrode surface of the measurement object can be easily removed. If the needle part 11 can remove the oxide film, the electrical characteristics and the like can be measured more precisely.

  In addition, the contact probe 10 shown in FIG. 11 and FIG. 12 has the needle part 11 in both right and left ends. However, it may be a contact probe in which only one of the left and right ends is the needle portion 11.

  In the contact probe 10 of FIGS. 11 and 12, the region near the center in the left-right direction has an arc shape (semicircle) as shown in FIG. 11, for example. The arcuate portion is a region where a large bending stress may be applied, for example, when the needle portions 11 at both ends are connected to the electrodes of the electronic component. The contact probe 10 shown in FIGS. 11 and 12 is formed by forming a metal material layer having a desired shape using the resin molds 3 and 7 formed by resist lithography as described above. Therefore, for example, machining can be easily performed as compared with the case of machining the tip by using electric discharge machining or dicing machining. For this reason, the processing cost of the contact probe can be reduced. The contact probe 10 shown in the top view of FIG. 11 has an arc shape. However, in the contact probe according to the present embodiment, the top view may be linear, for example.

  The contact probe 10 according to the first embodiment has a two-stage structure in which the second metal layer 9 is formed by using the resin mold 3 and the resin mold 7 as a resin mold. However, the contact probe according to Embodiment 1 may have a shape having a three-stage structure or more. Even in this case, it is preferable to form a contact probe having a three-stage structure or more by forming, for example, a third resin mold by the same procedure as that for forming the second resin mold described above.

(Embodiment 2)
Similarly to the first embodiment, the contact probe in the second embodiment is generally formed according to the manufacturing procedure shown in the flowchart of FIG. However, in the first embodiment, as shown in FIGS. 3 to 9 (FIGS. 6 to 9), the diameter of the opening surrounded by the resin mold 3 is the resin mold 7 formed after the resin mold 3. It is smaller than the diameter of the enclosed opening. That is, the area of the main surface 3a (main surface 3b) of the resin mold 3 is larger than the area of the main surface 7a (see FIG. 6) of the resin mold 7, for example. Therefore, as shown in FIGS. 6 to 9, the main surface 7a of the resin mold 7 or the surface along the main surface 7a is completely placed on the main surface 3b of the resin mold 3 shown in FIG. Has been placed.

  However, in the second embodiment, as shown in FIGS. 13 to 19 (FIGS. 16 to 19), the diameter of the opening surrounded by the resin mold 3 is larger than the diameter of the opening surrounded by the resin mold 7. Is also big. That is, the area of the main surface 3a (main surface 3b) of the resin mold 3 is smaller than the area of the main surface 7a (see FIG. 16) of the resin mold 7, for example. Therefore, as shown in FIGS. 16 to 19, the main surface 7a of the resin mold 7 or the surface along the main surface 7a is arranged so that a part thereof protrudes from the main surface 3b of the resin mold 3 shown in FIG. ing.

  As described above, only the points in which the size relationship between the diameters of the openings surrounded by the resin mold 3 and the resin mold 7 are reversed between the first embodiment and the second embodiment are described. Form 2 is different from Embodiment 1. In other words, the second embodiment is the same as the first embodiment in all other respects. Therefore, FIGS. 13, 14, 15, 16, 17, 18, 19, and 20 showing aspects of the steps of the second embodiment are the same as FIGS. 9 and 10.

  After forming the resin mold 3 by the first lithography and before forming the resin mold 7 by the second lithography, the first metal layer 5 for securing the main surface as a base for the second lithography Form. Therefore, the main surface as a base for forming the second resin mold 7 does not have a hollow portion. Therefore, even when the resin mold 7 is formed on the main surface 3b (see FIG. 15) of the resin mold 3 so as to protrude from the main surface 3b (the area of the main surface is larger than that of the main surface 3b), The resin mold 7 can be formed on the main surface 5b (see FIG. 15) of the first metal layer 5 (see FIG. 16) in the region protruding from the main surface 3b of the resin mold 3. Since the resin mold 7 can be formed on the main surface 5b of the first metal layer 5, for example, the resin mold 7 is prevented from being stably formed as in the case where the resin mold 7 is formed in the hollow portion. be able to. That is, the region where the resin mold 7 protrudes from the main surface 3 b of the resin mold 3 can be stably formed on the main surface 5 b of the first metal layer 5. From the above, if the step (S30) of arranging (forming) the first metal layer 5 is performed, the diameter of the opening of the resin mold 7 can be made larger than the diameter of the opening of the resin mold 3. It can also be made smaller.

  The second embodiment of the present invention is different from the first embodiment only in the above points. Therefore, the configuration, conditions, procedures, effects, and the like that have not been described above for the second embodiment are all in accordance with the first embodiment.

(Embodiment 3)
As with the first embodiment, the contact probe in the third embodiment is generally formed according to the manufacturing procedure shown in the flowchart of FIG. However, it differs from the manufacturing procedure in the first embodiment only in the step of filling the substrate shown in FIG. 1 (S30). Specifically, in the step (S30) of filling the substrate in Embodiment 3, as shown in FIG. 21, a sheet-like structure (sheet-like structure 6) made of a metal material on the main surface of the substrate 1 is used. ).

  More specifically, the main surface as a base for performing the second lithography step (S40) in the state where the resin mold 3 is formed after the first lithography step (S20) shown in FIG. The sheet-like structure 6 for ensuring is arrange | positioned. In this way, the resin mold 7 formed by performing the second lithography step (S40) with the main surface 6a of the sheet-like structure 6 as a base is formed with high accuracy (higher dimensional accuracy and shape accuracy). can do. When the height (vertical height) of the main surface 6a of the sheet-like structure 6 shown in FIG. 21 is substantially the same as the height of the main surface 3a of the resin mold 3, the main surface 6a is used as a base as it is. A second lithography step (S40) may be performed. However, for example, when the thickness of the sheet-like structure 6 is larger than the thickness of the resin mold 3, as shown in FIG. It is preferable to remove by polishing. In other words, it is preferable to proceed to the second lithography step after performing processing so that the resin mold 3 and the sheet-like structure 6 have substantially the same thickness.

  The sheet-like structure 6 is preferably made of, for example, copper, nickel simple substance, nickel alloy or the like that can be easily removed by etching, like the first metal layer 5. Also in the third embodiment, the magnitude relationship of the size of the main surface (opening diameter surrounded by each resin mold) between the resin mold 3 and the resin mold 7 may be the aspect of the first embodiment. The aspect of Embodiment 2 may be sufficient.

  The third embodiment of the present invention is different from the first or second embodiment only in the above points. Accordingly, the configuration, conditions, procedures, effects, and the like that have not been described above for the third embodiment are all in accordance with the first or second embodiment.

  As described above, the embodiments of the present invention have been described. However, it should be considered that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention is particularly excellent as a technique for reducing the cost of a contact probe used for measuring an electronic component.

  DESCRIPTION OF SYMBOLS 1 Board | substrate, 1a, 3a, 3b, 5a, 5b, 6a, 7a, 9a, 9b, 10a, 10b Main surface, 3, 7 Resin type | mold, 5 1st metal layer, 6 Sheet-like structure, 9 2nd Metal layer, 10 contact probe, 11 needle part.

Claims (3)

Preparing a substrate;
Forming a first resin mold by lithography on a resist coated on one main surface of the substrate;
Filling a metal material to form a first metal layer so as to embed the first resin mold;
Forming a second resin mold by lithography on a resist coated on the main surface of the first metal layer opposite to the main surface facing the substrate;
Removing the first metal layer after performing the step of forming the second resin mold;
And at least a step of performing electroforming to form a second metal layer so as to embed the first and second resin molds formed on one main surface of the substrate,
Polishing the main surface of the first resin mold after the step of filling the metal material and before the step of forming the second resin mold ;
A step of polishing the main surface of the second metal layer after the electroforming step ;
A method of manufacturing a contact probe, wherein in the step of filling with the metal material, the first metal layer is formed by electroforming.   2. The first metal layer according to claim 1, wherein in the step of filling the metal material, the first metal layer is formed by disposing a sheet-like structure made of the metal material on one main surface of the substrate. Contact probe manufacturing method. A contact probe formed by using the manufacturing method according to claim 1 .

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