JP5462379B2 - LED3D curved lead frame for light emitting device - Google Patents

Description

  The present invention separately manufactures a complicated 3D curved surface structure and LED 3D curved lead frame, develops a curved light emitting circuit into a planar circuit, manufactures a single lead frame using a conductive metal sheet, and laminates the multilayer A lead frame is formed into a strip-like structure, an LED chip is mounted on a mounting base to form an LED flat lead frame, and is bent into an LED 3D curved lead frame by utilizing the ductility and plastic deformation characteristics of a conductive metal. For example, in a curved light emitting device such as a decorative lighting or a curved display advertising board, it is integrally packaged with a transparent material such as a cured resin or silica gel. This method provides additional flexibility in structure and aesthetic design and takes full advantage of the high heat dissipation capability of the metal component body.

  In recent years, LED chips are very commonly used. These LED chips include package LEDs, SMD LEDs, die LEDs, and the like, in which the electrode contacts of the package LEDs include two or more contacts. Those with exposed electrode pins are divided into upright and horizontal types. The SMD LED is a surface mount package. A chip LED having an electrode pin on the bottom surface of a chip package, such as PLCC / SMD / SMT, that is not extended and exposed is called a chip LED. The die LED is a die chip, and is further divided into the same surface electrode, the upper and lower surface electrodes, and the flip chip electrode according to the electrode contact position. The die LED must be mounted on a specific substrate and packaged with a transparent material. The number of bare chips packaged inside the package LED and the SMD LED can be one or more chips, includes a protective Zener diode, and the arrangement of the chips includes parallel connection, series connection, and parallel and Can be mixed in series. The emission color of the LED chip includes a single color, a color, and white light, in which white light can be obtained from three or more color LED chips or by adding a phosphor to the LED chip. Color can be obtained primarily from multiple RGB chips, sometimes adding other chips to meet color requirements, or adding an assembly of white light chips directly.

  These LED chips are mounted by many methods such as a ceramic substrate, a hard circuit substrate, a flexible circuit substrate, a plastic substrate, and a flexible lead depending on the application. Package LEDs are often mounted on flexible leads. The SMD LED is applicable to most uses such as a ceramic substrate, a hard circuit substrate, a flexible circuit substrate, and a plastic substrate.

  Commonly used conductive adhesives for mounting LED chips are solder pastes, conductive adhesives, polymer conductive adhesives, and the like. After attaching these conductive adhesives to the electrode contacts at the mounting position, the LED chip can be mounted and solidified by heating to obtain a soldering effect.

  For LED chips applied to color advertising boards, one method is to directly solder LED chips of different colors to a high density multilayer circuit board, and then drive these chips directly using a drive board and a drive computer. High-resolution color images. Another method is to package the multi-color die LED chip and the driving chip together with the necessary circuitry. The driving method is changed to a serial communication method. The resolution of such a method is limited by the size of the chip, but can greatly reduce manufacturing costs, and such chip assemblies also include white light chips.

LED chips are used in a wide range of applications such as lighting, billboards, and color decoration lighting, particularly lighting applications. However, since the LED emission directionality is limited, a method that can achieve uniform scattering of light is conventionally used. It is one important point of technology. The prior art of billboards adds high resolution and clear color. Cylindrical billboards composed of multiple circuit boards are also commonly found in the prior art. Prior art on color decorative lighting, in addition to common color lighting strips, plastic injection molding lighting devices can form a chemical plating or electroplating metal conductive circuit on its curved surface, thereby The latest 3D circuit technology capable of mounting LED chips has been introduced.

The latest 3D circuit technology has been introduced so that it can.

  A related prior art light emitting device proposal is described below.

  Patent document 1 entitled “LED illuminating device and its stand”, which was filed in 2009, relates to the demand for lighting in road lighting, and the pedestal of the illuminating device is an adjacent and continuous multi-plane with different inclination angles. It is composed of a substrate, and at least one package LED is mounted on each plane, and each LED light source is electrically controlled according to its irradiation angle, and the irradiation light of each LED in a specific region overlaps the light of the adjacent LED And thereby provide a continuous and uniform effect and increase the illumination range. Radiation fins are provided on the surface of the lighting case. The curved surface of the multiplanar substrate of this patent document provides detailed implementation for light distribution and light improvement, but the perimeter of the multiplanar substrate is attached to the positioning frame on the inner perimeter of the lighting case. Furthermore, a transparent illumination shade that can surround the multi-plane substrate is provided at the bottom of the illumination case. Therefore, the heat generated by the LED chip on the multi-planar substrate cannot be quickly released from the radiation fins on the surface of the lighting case.

  Patent Document 2 entitled “Flexible Circuit Board with Heat Sink” entitled “Flexible Circuit Board with Heat Sink”, filed in 2008, uses a circuit carrier, a heat conductive carrier, and a flexible circuit board with a radiator at the top. In this flexible circuit board, the first groove of the heat conductive carrier and the second groove of the heat sink provide a buffer space when the flexible circuit board is bent. It has one stand for providing a circuit carrier between the grooves of the thermally conductive carrier. When this patent document is used for a high-power LED light-emitting device, the focal position of light is adjusted by bending the groove width. Embodiments of this patent document show that flexible circuit boards can provide cylindrical light source structures with different focal radii. However, there is no further explanation for 3D curved surfaces or spherical surfaces.

  Patent Document 3 filed in 2011 relates to a “light emitting module of an LED lighting device”. This patent document is characterized in that the light emission axis of each LED light-emitting member is directed toward the reflecting portion, whereby the LED illumination can be illuminated more uniformly. In order to increase the heat dissipation effect of the flow guide surface, a fan is provided at the base of the heat dissipation body. Although the newly increased fan of this patent document improves the convection cooling effect, it is necessary to increase the number of parts such as a cooling fan. Furthermore, the angle of the irradiation light of the LED light emitting member seems to exceed a conicity of 100 °, and a part of the light is directly irradiated to the outside unless the reflecting part is a sufficient length or special design, Part of the light is applied to the reflector, and multiple reflections also cause illuminance attenuation, and the irregular reflective surface required by the reflector makes manufacturing difficult and increases costs.

  Patent Document 4 filed in 2006 relates to “LED ball illumination”. In this patent document, a flexible circuit board of an LED chip is attached to the surface of an engineering plastic sphere or a polygonal sphere, and is covered or packaged with a transparent material on the outer side of the sphere to provide LED spherical illumination. Although this patent document may be used for decorative lighting or lighting, there is no further teaching on the methods of heat dissipation required for high power LED lighting. In another similar application in 2010, “New Type LED Light Source Structure” Taiwan Utility Model No. 385637 attaches a plurality of flexible circuit boards to an LED lighting assembly and equips the outer surface of the sphere at equal intervals. As a result, an illumination effect having a spherical shape is provided.

  Patent document 5 filed in 2011 relates to a “bulb-type LED lamp”. This patent document is characterized in that a protruding multi-face structure is provided at the upper end of the casing of the light bulb, and another multi-face shell structure having a concave shape at the center of the interior can be made compact. Attach the cover to the outer surface of. The LED chip is mounted on each outer surface of the shell structure, and the multi-sided shell structure is formed by bending a metal plate having a circuit, and electrode contacts are prepared for connection to the circuit of the housing unit. Widens the irradiation range of the LED light source and improves the heat dissipation capability. The heat of the LED chip of this patent document is released through the casing, but the number of LED chips to be mounted increases when higher brightness is required. The arrangement of series connection and parallel connection circuits between LED chips needs to be more clearly described. Another similar utility model filed in 2011, Taiwan Utility Model No. 405524, relates to “LED solid light bulb”, which also has a similar convex structure and a plurality of inclined mounting surfaces in different directions on the outer periphery. The LED light source body is mounted on these mounting surfaces.

  Patent document 6 filed in 2008 relates to “an annular combination structure of LED advertising boards”. The present invention relates to a kind of annular combination structure of LED advertising boards, and this LED advertising board is composed of a plurality of substrates and a plurality of light emitting modules, and each of the substrates can be fixed to an annular support. Since the light emitting surface of such a light emitting module is an annular display surface with no gaps, the characters and patterns displayed on the annular display surface can be seen at various angles, and the characters and patterns are continuous. Have sex. The light emitting module of this patent document includes a single color LED, a white light LED, and an RGB full color LED. As can be seen from the large number of signal pins on the light emitting module, a precise multilayer circuit board must be used to mount these large number of LEDs, and the control signal of the board is also dynamically displayed on the annular display surface. Although it should be used to make it possible to produce an effect, it is still limited to the circuit board, so it cannot obtain a 3D curved display function.

  Patent Document 7 filed in 2011 relates to “display board arrangement and system”. This patent document is a kind of modularized LED display board structure and its system. The flexible circuit board includes a plurality of full-color LED units to form one matrix, and signal connection between each modularized LED display board is used to form a large LED display system. . Since this patent document applies a full-color LED chip unit with a built-in drive mechanism, the display function can be obtained only from the flexible board, and it is still limited to the flexible circuit board, so that the 3D curved surface display function cannot be produced. Bring.

  Patent Document 8 filed in 2011 relates to an “LED lighting device”. This patent document is a kind of LED lighting device made of a three-dimensional circuit. The appearance feature is that the lighting socket has a semicircular arc-shaped solid curved surface, the solid curved surface has a solid circuit, LEDs are arranged in the solid circuit in a specific pattern arrangement, and the generated light is also solid. Appears as a linear distribution. The LED illumination device of this patent document uses a three-dimensional molded circuit component (3D-MID), and the method is a laser direct molding method (LDS). The laser draws a 3D circuit diagram directly on the surface of the activated plastic, and the activated plastic can form an electrical circuit by a chemical vapor deposition method. This requires a large amount of chemical solution to obtain an electrical circuit of sufficient thickness, or many different solutions to deposit different conductive metals on the circuit. That is, this manufacturing method faces the problem of environmental protection like the circuit board. WO 2011/041934, filed in 2011, also applies a similar method for “semiconductor carrier structure”, which also cannot utilize the heat dissipation capability of metal parts.

  Patent Document 9 filed in 2011 relates to “umbrella integrated light emitting member and lead frame”. This patent document is a kind of annular lead frame on which an LED chip is mounted, and is used for mounting on the surface of an umbrella component body, and both are packaged together. The feature is that an LED lead frame is first made of a plate-like conductive metal, and then bent to be attached to an umbrella part to form an annular lead frame. This feature is suitable for series and parallel connections of mixing circuits and for mounting on annular surface surfaces. This patent document does not further invent the application of curved-surface light emission.

Taiwan Patent Application Publication No. 200914762 Specification US Pat. No. 7,443,678 Taiwan Patent No. 339252 Specification Chinese Patent Application No. 1719095 JP 2011-096594 A Taiwan Utility Model No. 343884 Specification German utility model application published 20102010008460 Taiwan Design No. 141427 Specification Taiwan Patent Application Publication No. 100142476

  The above solution just describes the requirements for LED chips in lighting devices or billboards, which are implemented and implemented as follows.

Request 1. Heat Dissipation For example, Patent Documents 2, 3, and 5 have solutions for heat dissipation requirements. In Patent Documents 2 and 3, a circuit board is attached to the surface of a metal component. In Patent Document 3, forced cooling is further performed by a fan. The light emitting LED chip of Patent Document 5 is securely fixed to the surface of a metal part. The heat dissipation effect by the metal parts cannot be fully utilized due to the low heat conduction efficiency of the circuit board, and the increase in the fans increases the risk of malfunction of the parts.

Request 2. Illumination light distribution direction For example, Patent Documents 1, 2, 4, 5, 8, and 9 achieve the illumination effect required by the 3D structure. Some patent documents have a solution for heat dissipation requirements, but only the solution of patent document 9 is relatively simple and can meet the requirements for 3D illumination direction.

Request 3. Decoration For example, Patent Documents 4, 5, 8, and 9 have solutions relating to the decoration requirements of LED lighting devices, these solutions all use 3D-structured color LED chips and are required. Although a decorative effect is achieved, no further explanation is given for complex 3D curved light emitting structures.

Request 4. Ease of Manufacture and Attachment For example, Patent Literature 4 attaches a flexible circuit board to a spherical surface. The Japanese patent of Patent Document 5 uses a method of first mounting an LED chip and a circuit on a metal plate and then bending the metal plate. For example, Patent Document 8 uses an LDS directly to provide a circuit on a plastic curved surface and solders an LED chip. For example, in Patent Document 9, an LED lead frame is manufactured using a plate-like conductive metal thin plate, and then bent into an annular lead frame for attachment to an umbrella part. These patent documents separately manufacture the 3D structure and the LED light emitting structure, but there is no further explanation about the solution method of the complicated 3D light emitting curved surface. Further, Patent Document 8 can be applied only to plastics and uses metal parts for heat dissipation. It cannot be used.

Request 5. Color advertising board For example, patent document 6 comprises a cyclic | annular display panel using an LED module structure, and achieves a dynamic display with a control board. Since Patent Document 7 uses a full-color LED chip unit with a built-in drive mechanism, a dynamic display function of an advertising board can be achieved in a flexible printed circuit only by a serial communication method. Only suitable for 3D curved advertising boards.

  The above-mentioned prior art patent documents aim at solving a specific requirement, and there is no more flexible method that can satisfy the requirement of a complicated 3D light emitting curved surface. The present invention researches and develops the above requirements, introduces a concept of separately producing a complicated curved surface structure of a 3D light emission curved surface and an LED 3D curved lead frame, and applies a new 3D curved lead frame to the LED light emitting device. In some cases, it can satisfactorily meet the above five requirements without the environmental protection problems of chemical plating or electroplating of metal leads.

  In order to satisfy the requirement of light emission of a complex curved surface of a light emitting device, the present invention separately manufactures a complex 3D curved surface structure and an LED 3D curved lead frame, thereby manufacturing an LED chip and a circuit on a light emitting curved surface. Can be greatly reduced, and the flexibility of the structure and aesthetic design is enhanced, and the high heat dissipation capability of the metal component body is fully utilized.

  The point of the method is a curved strip circuit made of multilayer leadframes, which can meet the requirements of series connection, parallel connection, and mixed series and parallel connection. That is, the curved strip circuit can be drawn very easily on the light emitting curved surface. A complicated 3D curved circuit can be divided into many circuit units, and the 3D curved circuit pattern of each circuit unit can be developed into one planar circuit pattern.

  A planar circuit, i.e., a developed planar strip circuit, has a multi-layered lead frame on which conductive thin metal plates are laminated, and the constructed planar circuit pattern may be a concentric curve, a repetitive array curve, or various patterns. An LED chip is mounted on the mounting base of the multilayer lead frame to form an LED flat lead frame. The light of the LED chip with these circuit patterns also satisfies the requirements of the original light emitting curved surface.

  Since the conductive metal of the multilayer lead frame has ductility and plastic deformation characteristics, the LED flat lead frame can be bent using a jig to become an LED 3D curved lead frame, and can be attached to the required light emitting curved surface. . For complicated 3D curved surfaces, a curved surface of a required light emitting surface is formed using a plurality of 3D curved lead frames. Then, for example, with a 3D curved light emitting device such as decorative lighting or a curved display advertising board, they are integrally packaged with a transparent material such as curable resin or silica gel.

  The multilayer lead frame is a single electrically insulating flaky conductive metal multilayer circuit structure in which a plurality of lead frame single plates are laminated. The bottom surface and the side surface of the conductive metal of the lead frame single plate have an electrical insulating layer. Its external shape is a curved strip shape, which includes an LED chip mounting base, and is suitable for curved strip-shaped circuit designs with complex light-emitting curved surfaces.

  The lead frame veneer structure must meet the requirements of series connected circuits, parallel connected circuits, and mixed series and parallel connected circuits. That is, a circuit having a multilayer lead frame structure is composed of lead frame single plates having different structures. And according to the request | requirement of a serial and parallel connection mixed circuit, the length of a lead frame single board is divided | segmented into the some circuit part separated by the insulation slit according to the request | requirement. The length and shape of each circuit portion are not necessarily the same or similar. It is referred to below as the circuit part. In order to meet the requirements of mixed circuit in series and parallel connection, each lead frame veneer is composed of at least one or more circuit parts.

  The structure of each circuit part can be combined in different ways depending on the application and circuit requirements, including leads, power contacts, mounts, conductive through holes, insulated through holes, potential connection points, signal contacts Some or all of the above elements can be combined to meet the requirements. Each combined part has at least one or more elements. Its main part is one or more mounts, which are connected by a plurality of leads. Elements such as power contacts and signal contacts are located at one end of the circuit portion and are used to connect to the control and signal circuits. Conductive through holes, insulated through holes and potential connection points are located on the leads or mountings and are used to meet the requirements of series connection, parallel connection, and mixed series and parallel connections of circuits.

  When an insulating slit is provided on the mounting lead of the circuit part, one circuit part is divided into a plurality of conductive metals separated by the insulating slits of the conductive metal thin plate. Further, since the mount leads each include a set of high-potential and low-potential electrode contacts, such a circuit portion is applied to a series-type lead frame having a series connection circuit.

  When the mounting base lead of the circuit part mounting base is changed to an integrated lead like strip, hollow ring, rectangular, solid plate, a set of high or low potential electrode contacts is provided there . Then, such a circuit portion is a continuous lead frame and can be applied to a parallel connection circuit to provide a high potential or a low potential for a series and parallel connection mixed circuit.

  In order for multilayer laminated lead frames to meet the requirements of mixed circuits in series and parallel connection, conductive through holes and insulating through holes are provided in leads, mounting bases, potential connection points or power contacts, and high potential or low Constructs a potential contact for potential.

  The conductive through hole is used for injecting a conductive adhesive so that the conductive metals in the circuit portions of two or more lead frames stacked one above the other can have the same potential. The conductive through hole is provided only in a lead frame that requires the same potential, and the stacked lead frame in the bottom layer does not have any conductive through hole. When the conductive through hole is completely filled with the conductive adhesive, the laminated lead frames have the same potential.

  The conductive metal in the circuit part of two or more lead frames laminated above and below the intermediate layer of the multilayer laminated lead frame must be connected to the same potential by the conductive through hole, and the other layers above must be insulated. If this is the case, other layers of these different potentials are provided with insulating through-holes having a larger hole diameter than the conductive through-holes and provided with an insulating layer on the inner wall. Ensure that the required lead frame conductive metal does not conduct.

  If the circuit part of the multilayer lead frame that requires the same potential is not positioned in the stacked vertical relationship, the conductive metal wire is passed through the conductive through hole to ensure that the required potential is the same. It needs to be affixed with an adhesive. The bottommost lead frame does not have any conductive through-holes, but directly contacts the conductive metal wire and is connected by a conductive adhesive to conduct. Other lead frame single plates of different potentials have insulating through-holes through which conductive metal wires can pass, and the inner wall has an insulating layer and does not conduct. When conductive through holes are provided at potential connection points or power contact points, both are located on the side of the lead or mounting base and extend outward, it is not necessary to provide insulated through holes on other lead frame single plates of different potentials, The conductive metal wire is simply passed through the conductive through hole together with the conductive adhesive.

  When a lead frame having two or more laminates, which is a multilayer laminate lead frame, has a series connection circuit, each lead is secured in order to ensure the structural strength of the laminated mounting base that satisfies the requirements for mounting the LED chip. The insulating slits of the mounting lead of the frame single plate mounting must be offset from each other.

  After the multi-layer lead frame mounting base on which each lead frame single plate is stacked, the electrode contacts of the mounting base lead should be shifted from each other, so that the high and low potential electrode contacts face each other. Each is arranged to form a plurality of sets of high and low potential electrode contacts for connecting the electrode contacts to the LED chip. The electrode contacts are bent to the same horizontal position in order to mount the LED chip.

  Another object of the present invention is to further explain a method for producing an LED flat lead frame by producing a similar reticulated sheet with a thin metal plate, and using examples, the manufacturability of the production method of the present invention. Explain in detail and show the flexibility for small volume production. A method for processing the LED flat lead frame will be described below.

  In the LED curved surface light emitting device of the present invention, the LED circuit is appropriately designed, and then the shape of the circuit pattern on the curved surface is developed into a planar circuit pattern. The curved circuit diagram can be divided into one or more circuit patterns having a planar structure as necessary. Each circuit pattern here is designed into one circuit pattern having a curved strip structure. Each circuit contains a combination of possible arrangements of single-layer leadframe single plate structures, each single-layer leadframe circuit is drawn on a different strip-shaped metal sheet, and a sheet is made from each sheet metal by a machining method Can do. The thickness of the strip-like conductive metal body is 0.05 mm or more and 2 mm or less, and the width is 1 mm or more and 10 mm or less. The conductive metal is a ferrous metal, a non-ferrous metal, a copper foil plate or the like provided with an insulating layer. For manufacturing convenience, in normal practice, the pattern of the lead frame single plate is appropriately arranged on the strip-shaped metal plate so that the circuit conductive metal thin plates of each single lead frame single plate are combined as a net-like sheet structure. A plurality of necessary connecting portions having different shapes are added to the substrate and processed into a net-like sheet having positioning holes for stacking the multilayer sheets and mounting the LED chips. It is referred to below as a sheet. Depending on the different requirements of the LED chip and the requirements of parallel connection, series connection and mixed series and parallel connection, the conductive sheet metal structure of each sheet can be designed in different ways to meet the requirements.

  According to the requirements of the LED chip and the circuit, the multilayer sheets are overlapped, and then the LED chip is mounted. In order to prevent a short circuit, each layer of the sheet has a heat conductive insulating layer such as an insulating paint. The multilayer sheet has excellent structural rigidity after being bonded via a heat conductive insulating agent, and is suitable for mounting and further processing of LED chips.

  After the stacked sheets are attached to the jig, the LED chip can be mounted on the mounting base. Conductive adhesive is injected into each electrode contact of each mounting base, heat-fixed to stably and fix the LED chip, the connecting part on the sheet is cut and the parts are cut into individual parts, and at this point the multilayer laminated LED plane Lead is obtained.

  The proposed solution of the present invention can improve the function of the LED curved surface light emitting device, and can provide the following effects.

Effect 1.
LED3D curved lead frame leads and the bottom of the mounting base are affixed to the surface of the component body, which can provide a large area heat dissipation effect, and the component body structure makes it easy to radiate heat in vertical convection. Is designed.

Effect 2.
The LED 3D curved lead frame can be attached according to the curved surface in the light irradiation direction, and there is no need to consider how each LED chip should be attached to a complicated curved surface. Therefore, a necessary luminance distribution method can be easily designed, and the aesthetic design can be greatly increased.

Effect 3.
The aesthetic design space in the component main body of the LED curved surface light emitting device is greatly improved, and there is no problem that it is difficult to mount the LED chip. The LED 3D curved lead frame can be completely affixed to the complicated curved surface of the component body, and can be easily packaged with a transparent material. Therefore, the multilayer laminated lead frame structure is particularly a light emitting device using a color LED chip. Is more suitable for enabling optical and aesthetic effects.

Effect 4.
The mass productivity of lead frame sheets made of conductive metal sheets can meet the requirements of low volume production, especially the few ornaments can be processed by laser cutting, water jet cutting or CNC mechanical cutting. it can. A large number of products can be manufactured with precision press dies, eliminating problems such as mass production requirements of chemical processes and environmental contamination by chemicals.

Effect 5.
When a full-color LED chip unit incorporating a driving mechanism is used for an LED3D curved lead frame, a dynamic display advertising board is realized with various curved surfaces or spherical surfaces. Although the distance between chips is relatively large and the resolution is slightly reduced, the LED3D curved lead frame can be made into curved surfaces and spherical surfaces of various sizes, and the serial communication method is widely applied in industry. The installation cost can be greatly reduced.

It is a figure which shows the external structure of the white light-emitting device which is 1st embodiment of this invention. It is a figure which shows the cross-section of the white light-emitting device which is 1st embodiment of this invention. It is a figure which shows the layer structure of the white light LED plane lead frame used in 1st embodiment of this invention connected in parallel, after the circuit connects in series. It is a figure which shows the layer structure of the white light LED plane lead frame used in 1st embodiment of this invention connected in series after the circuit is connected in parallel. It is a figure which shows the cross-sectional structure of the conductive through-hole of a white light LED plane lead frame used in 1st embodiment of this invention, and an insulation through-hole. It is a figure which shows the external structure of the color light-emitting device which is 2nd embodiment of this invention. It is a figure which shows the cross-section of the color light-emitting device which is 2nd embodiment of this invention. It is a figure which shows the layer structure of the color LED plane lead frame used by 2nd embodiment of this invention. It is a figure which shows the structure of the conductive through-hole of a color LED plane lead frame used in 2nd embodiment of this invention, and a power supply contact. It is a figure which shows the structure of the color LED curved surface display advertising board module used by 3rd embodiment of this invention. It is a figure which shows the structure of the color LED annular spherical advertisement board used in 3rd embodiment of this invention. It is a figure which shows the LED chip used by 3rd embodiment of this invention. It is a figure which shows the layer structure of the color LED plane lead frame of the display advertising board used in 3rd embodiment of this invention. It is a figure which shows the sheet | seat structure of the white light LED plane lead frame used in 4th embodiment of this invention.

  In order to specifically describe the LED 3D curved lead frame of the light emitting device of the present invention, the following embodiments are used for further disclosure, but the present invention is not limited to the following embodiments. For clarity of explanation, the thickness of the insulating layer in the drawings of the following embodiments is used for illustration only and not the actual thickness. All parts meet the necessary electrical insulation and electrical safety requirements.

  In the first embodiment, the LED 3D curved lead frame of the present invention is applied to a white light emitting device having a function of a light emitting curved surface.

  1 and 2 are views showing an external structure of the white light emitting device according to the first embodiment of the present invention. The light emitting device 1 includes an aluminum alloy main body 10, a light emitting curved surface 11, a radiation fin 12, an LED 3D curved lead frame 2 a, a screw cap 17, a white light LED chip 91, and a transparent package 15. When the light emitting device of the present embodiment is attached to the ceiling, the screw cap 17 is located at the uppermost part and the light emitting curved surface 11 is located at the lowermost part. The light emitting curved surface 11 is spherical and contacts the heat radiating fins 12. The LED 3D curved lead frame 2 a is attached to the light emitting curved surface 11. The surface has a transparent package 15 to protect the LED 3D curved lead frame 2a and the LED chip 91. Twelve white light LED chips 91 are mounted on the mount 24 to form a mixed circuit in series and parallel connection. The power supply hole 111 of the light emitting curved surface 11 is used to connect the power supply wire from the inside of the main body 10 to the power supply contacts 231 and 232 of the LED 3D curved lead frame 2a. The main body 10 has heat radiating fins 12 extending to the outside, and the heat radiating fin side portions 121 first extend downward on the side surfaces. The light emitting curved surface 11 includes a vent hole 112 at the center. The heat generated by the white light LED chip 91 on the LED 3D curved lead frame 2a can be directly transferred to the radiation fins 12 through the light emitting curved surface 11 made of aluminum alloy. That is, heat is directly radiated from the back surface of the light emitting curved surface 11 and the surface of the radiation fin 12. Since the white light LED chip 91 and the light emitting curved surface 11 are positioned below, when heat is transmitted to the heat radiating fins 12, the outer surface of the heat radiating fins 12 heats the air, and the hot air is buoyant and the side of the heat radiating fins It can flow upward along the part 121. That is, cold air continuously flows from the air holes 112 to cool the back surface of the light emitting curved surface 11 and the radiation fins 12. If the mounting direction of the light emitting device 1 is reversed, the cooling air also flows in the opposite direction, and a large amount of hot air flows out from the vent hole 112. These air flows can reduce the thickness of the temperature boundary layer on the heat radiating surface, and can increase the thermal convection coefficient to promote heat release. Since the LED 3D curved lead frame 2 a is attached to the protruding light emitting curved surface 11, the light irradiation direction of the light emitting device 1 can be easily adjusted by the radius of curvature of the light emitting curved surface 11. The larger the radius of curvature, the more uniformly the light is irradiated downward, and the smaller the radius of curvature, the larger the light irradiation angle. When the light emitting curved surface 11 is a concave spherical surface, the larger the radius of curvature, the longer the focal length of light, and the smaller the radius of curvature, the shorter the focal length of light. If it is necessary to further adjust the luminance distribution of the irradiation light, the circuit can be divided into circuits of smaller units to generate more uniform irradiation light. Since the position of the white light LED chip 91 on the light emission curved surface 11 is designed according to the light irradiation requirement, a necessary circuit is designed as the light emission curved surface 11, and the curved surface circuit is developed into a planar circuit so that the LED plane. The lead frame 2 (see FIG. 3A) is produced. As a result, the LED 3D curved lead frame 2a is accurately affixed to the light emitting curved surface 11 with the insulating heat conductive bonding agent 28 (see FIG. 3C), and the distribution of the irradiated light reliably matches the design, It is possible to reliably have the maximum heat radiation area.

  FIG. 2 is a diagram showing a cross-sectional structure of the white light emitting device according to the first embodiment of the present invention. When the light emitting device of the present embodiment is attached to the ceiling, the screw cap 17 is located at the uppermost part and the light emitting curved surface 11 is located at the lowermost part. The light emitting curved surface 11 is spherical and contacts the lower part 122 of the heat radiating fin. The LED 3D curved lead frame 2 a is attached to the light emitting curved surface 11. The surface has a transparent package 15 provided with a vent 151 communicating with the vent 112. The inside of the main body 10 is a cylindrical space 14, and a control circuit 18 for securing a useful life of the white light LED chip 91 by giving a stable voltage and current is attached inside. The high potential electrode contact is connected to the power contact 171 at the tip of the screw cap 17 by a conducting wire 182, and the low potential electrode contact is connected to the side surface of the screw cap 17 by a conducting wire 181. The space between the cylindrical space 14 of the main body 10 and the light emitting curved surface 11 is connected by the lower portion 122 of the heat radiating fin, and can generate convection between cold air and warm air. First, the heat generated by the white light LED chip 91 is released from the lower portion 122 of the radiation fin. Because natural convection cooling air is available, a large amount of heat that affects the control circuit 18 is not transferred to the cylindrical space 14. Since the opening of the cylindrical space 14 is hermetically coupled to the screw cap 17, the heat generated by the control circuit 18 is released through the wall surface of the cylindrical space 14 and the radiating fin side portion 121 (see FIG. 1). Both of them have a large heat dissipation surface.

  2, 3A and 3C are diagrams showing the layer structure of the white light LED flat lead frame of the first embodiment of the present invention. The circuit of this embodiment includes four sets of three white light LED chips 91 connected in parallel after being connected in series, a total of 12 LED chips 91. The LED flat lead frame 2 is a circuit developed in a plane from the light emitting curved surface 11 and is composed of two concentric circular arc curves connected to each other. Four LED chips 91 are mounted on the center arc, and eight LED chips 91 are mounted on the outer arc, and the three-layer lead frame single plate 21 is laminated.

  The high potential lead frame single plate 21 (H) is a continuous lead frame, and is used as a high potential parallel connection contact of a series connection circuit. The series connection circuit lead frame single plate 21 (W) is a series type lead frame, which is divided into four series connection circuit portions by the insulating slit 225 of the lead 22, and three white light LED chips 91 are connected in parallel 4. Used to configure two sets in series connection. The low potential lead frame single plate 21 (C) is a continuous lead frame, and is used as a low potential parallel connection contact of a series connection circuit.

  The structure of the high potential lead frame single plate 21 (H) includes parts such as a lead 22, a mounting base 24 a and a power contact 231. One power contact 231 for connecting to the control circuit 18 is provided at the tip of the lead frame 21. The lead frame 21 (H) includes twelve mounting bases 24 a connected by leads 22. The mount 24 a has a hollow annular mount lead 241. An insulating through-hole 26 is provided in the lead 22, and is used to avoid a high potential and low potential short circuit due to the conductive adhesive 29. The installation position is above the conductive through hole 25 of each circuit portion in the series connection circuit lead frame single plate 21 (W). The lead 22 is also provided with a conductive through hole 25. The installation position is the high potential end of each circuit portion of the series connection circuit lead frame single plate 21 (W), and the conductive adhesive 29 is dropped on the high potential end of each circuit portion of the lead frame single plate 21 (W). Thus, the lead frame single plate 21 (H) is used to make it a high potential parallel connection contact.

  The circuit in the series connection circuit lead frame single plate 21 (W) is divided into four parallel connection circuit portions by the insulating slit 225 under the condition of the three white light LED chips 91 connected in series. The structure of each circuit part includes parts such as a lead 22 and a mounting base 24b. Three mounting bases 24b connected to each circuit portion by leads 22 are provided. The mounting base 24b is separated by an insulating slit 225 and a mounting base lead 241, and constitutes one set of high-potential and low-potential electrode contacts 243. The high potential lead 22 at the tip of each circuit portion is connected by a conductive through hole 25 of the high potential lead frame single plate 21 (H) by dropping a conductive adhesive 29. A conductive through hole 25 is provided in the low potential lead 22 at the end of each circuit portion, and the conductive adhesive 29 is dropped to be connected to the low potential lead frame single plate 21 (C) through the conductive through hole 25.

  The structure of the low potential lead frame single plate 21 (C) includes portions such as the lead 22, the mounting base 24 c, and the low potential power source contact 232. At the end of the lead frame 21, a low potential power contact 232 that is used to connect to the control circuit 18 is provided. The lead frame 21 (C) includes twelve flat plate mounting bases 24 c connected by leads 22. A conductive adhesive 29 is dropped into the conductive through hole 25 of the lead frame single plate 21 (W) and connected to the lead 22 of the low potential lead frame single plate 21 (C) to constitute a low potential parallel connection contact.

  The lead 22 and the mounting base 24 of each lead frame single plate 21 of the LED flat lead frame 2 have the same outer dimensions for superposition. The mounting base 24 includes a mounting base 24a, a mounting base 24b, and a mounting base 24c. After the conductive adhesive 29 is dropped on each of the high-potential and low-potential electrode contacts 243, the LED chip 91 can be mounted in the internal space. The bottom surface of the lead frame single plate 21 (C) is directly attached to the light emitting curved surface 11 with a heat conductive insulating bonding agent 28.

  2 and 3B are views showing the layer structure of the planar lead frame of the white light LED of the first embodiment of the present invention. The circuit of this embodiment includes four sets of three white light LED chips 91 connected in parallel after being connected in series, a total of 12 LED chips 91. The LED planar lead frame 2 has a planar circuit developed in a plane from the light emitting curved surface 11 and is composed of two concentric arc curves connected to each other. Four LED chips 91 are mounted on the central arc, and eight LED chips 91 are mounted on the outer arc, and the two lead frame single plates 31 are stacked.

  The high potential lead frame single plate 31 (H) is a continuous lead frame and is divided into four circuit parts by the insulating slit 325 of the lead 32 and used as a high potential of the parallel connection circuit. Have different potentials. The low potential lead frame single plate 31 (C) is a continuous lead frame, and is divided into four series connection circuit portions by the insulating slit 325 of the lead 32 and used as the low potential of the parallel connection circuit. The parts have different potentials. The high potential circuit portion and the low potential circuit portion constitute four sets of parallel connection circuits, and each parallel connection circuit forms a series connection structure of a high potential and a low potential by three connection points 35. The connection point 35 a of the high potential lead frame single plate 31 (H) and the connection point 35 b of the low potential lead frame single plate 31 (C) are connected by dropping the conductive adhesive 29 through the conductive through holes 25. (Refer to FIG. 3C), which constitutes a series connection circuit.

  The high potential lead frame single plate 31 (H) is divided into four circuit portions by the insulating slit 325 of the lead 22. The structure of each circuit part includes parts such as a lead 32, a mounting base 34a, a connection point 35a, and a power contact 231. The first circuit portion includes a power contact 231 for connecting to the high potential and control circuit 18, a potential connection point 35a is provided at the tip of the other circuit portion, and a conductive through hole 25 is provided thereon. The conductive adhesive 29 is dropped to connect to the potential connection point 35b of each circuit portion of the low potential lead frame single plate 31 (C). Each circuit portion includes three mounting bases 34a connected by leads 32, and one high potential electrode contact 343 is provided on a hollow annular mounting base lead 341 of the mounting base 34a.

  The low potential lead frame single plate 31 (C) is divided into four circuit portions by the insulating slit 325 of the lead 32. The structure of each circuit part includes parts such as a lead 32, a mounting base 34 c, a connection point 35 b, and a power contact 232. In addition, a low potential power contact 232 is provided at the end of the last circuit portion that is used to connect to the control circuit 18. A potential connection point 35b for connecting to the potential connection point 35a of each circuit portion of the high potential lead frame single plate 31 (H) is provided at the end of the other circuit portion. Each circuit portion is provided with three mounting bases 34c connected by leads 32, and one low potential electrode contact 343 is provided on a hollow annular mounting base lead 341 of the mounting base 34c.

  The lead 32 and the mounting base 34 of each lead frame single plate 31 of the LED flat lead frame 3 have the same outer dimensions for superposition. The mounting base 34 is formed by stacking a mounting base 34a and a mounting base 34c. The electrode contacts 343 of the mounting base 34a and the mounting base 34c are arranged at opposing positions to constitute a set of electrode contacts of a high potential and a low potential. The electrode contact 343 is processed and bent so that both electrode contacts 343 are in the same horizontal plane. After the conductive adhesive 29 is dropped on each of the high-potential and low-potential electrode contacts 343, the LED chip 91 can be mounted in the internal space. The bottom surface of the lead frame single plate 31 (C) is directly attached to the light emitting curved surface 11 with the heat conductive insulating bonding agent 28.

(Second embodiment)
In the second embodiment, the LED 3D curved lead frame of the present invention is applied to a color light emitting device having a function of a light emitting curved surface.

  4 and 5 are views showing an external structure of the color light emitting device according to the second embodiment of the present invention. The color light emitting device 5 includes an aluminum alloy body 10, a light emitting curved surface 11, a radiation fin 12, an LED 3D curved lead frame 6 a, a screw cap 17, a color LED chip 92, and a transparent package 15. When the light emitting device of the present embodiment is attached to the ceiling, the screw cap 17 is located at the uppermost part and the light emitting curved surface 11 is located at the lowermost part. The light emitting curved surface 11 is spherical and contacts the heat radiating fins 12. The LED 3D curved lead frame 6 a is attached to the light emitting curved surface 11. The surface has a transparent package 15 to protect the LED 3D curved lead frame 6a and the color LED chip 92. The color LED chip 92 is mounted in the mounting base 64. The power supply hole 111 of the light emitting curved surface 11 is used to connect the power supply wire from the inside of the main body 10 to the power supply contacts 631 and 632 of the LED 3D curved lead frame 6a. The main body 10 has heat radiating fins 12 extending to the outside, and the heat radiating fin side portions 121 first extend downward on the side surfaces. The light emitting curved surface 11 includes a vent hole 112 at the center. The heat generated by the color LED chip 92 on the LED 3D curved lead frame 6a can be directly transferred to the heat radiating fins 12 through the light emitting curved surface 11 made of aluminum alloy. That is, heat is directly radiated from the back surface of the light emitting curved surface 11 and the surface of the radiation fin 12. Since the color LED chip 92 and the light emitting curved surface 11 are located below, when heat is transmitted to the heat radiating fins 12, the outer surface of the heat radiating fins 12 heats the air, and the hot air is buoyant and the side surfaces of the heat radiating fins It can flow up along 121. That is, cold air continuously flows from the air holes 112 to cool the back surface of the light emitting curved surface 11 and the radiation fins 12. If the mounting direction of the light emitting device 1 is reversed, the cooling air also flows in the opposite direction, and a large amount of hot air flows out from the vent hole 112. These air flows can reduce the thickness of the temperature boundary layer on the heat radiating surface, and can increase the thermal convection coefficient to promote heat release. Since the LED 3D curved lead frame 2 a is attached to the protruding light emitting curved surface 11, the light irradiation direction of the light emitting device 5 can be easily adjusted by the radius of curvature of the light emitting curved surface 11. The larger the radius of curvature, the more uniformly the light is irradiated downward, and the smaller the radius of curvature, the larger the light irradiation angle. When the light emitting curved surface 11 is a concave spherical surface, the larger the radius of curvature, the longer the focal length of light, and the smaller the radius of curvature, the shorter the focal length of light. If it is necessary to further adjust the luminance distribution of the irradiation light, the circuit can be divided into circuits of smaller units to generate more uniform irradiation light. Since the position of the color LED chip 92 on the light emitting curved surface 11 is designed according to the light irradiation requirement, a necessary circuit is designed as the light emitting curved surface 11, and the curved circuit is developed into a planar circuit to produce an LED plane lead. Frame 2 (see FIG. 3A) is produced. As a result, the LED 3D curved lead frame 6a is accurately affixed to the light emitting curved surface 11 with the insulating heat conductive bonding agent 28, and the distribution of the irradiated light reliably matches the design, and further has the maximum heat radiation area. be able to.

  FIG. 5 is a diagram showing a cross-sectional structure of the color light emitting device according to the second embodiment of the present invention. When the light emitting device of the present embodiment is attached to the ceiling, the screw cap 17 is located at the uppermost part and the light emitting curved surface 11 is located at the lowermost part. The light emitting curved surface 11 is spherical and contacts the lower part 122 of the heat radiating fin. The LED 3D curved lead frame 6 a is attached to the light emitting curved surface 11. The transparent package 15 on the surface includes a vent hole 151 communicating with the vent hole 112. The inside of the main body 10 is a cylindrical space 14, which provides a stable voltage and current to ensure the service life of the color LED chip 92, and also provides a plurality of stages of color light including color changes from monochromatic light to white light. A control circuit 18 for providing a switching function is mounted inside. The high potential electrode contact is connected to a power supply contact 171 at the tip of the screw cap 17 by a conductive wire 182. The low potential electrode contact is connected to the side surface of the screw cap 17 by a conducting wire 181. The space between the cylindrical space 14 of the main body 10 and the light emitting curved surface 11 is connected by the lower portion 122 of the heat radiating fin, and can generate convection between cold air and warm air. First, the heat generated by the color LED chip 92 is released from the lower portion 122 of the radiation fin. Because natural convection cooling air is available, a large amount of heat that affects the control circuit 18 is not transferred to the cylindrical space 14. Since the opening of the cylindrical space 14 is hermetically coupled to the screw cap 17, the heat generated by the control circuit 18 is released through the wall surface of the cylindrical space 14 and the radiating fin side portion 121, both of which are released. Has a large heat dissipation surface.

  FIG. 5, FIG. 6 (A) and FIG. 6 (B) are diagrams showing the layer structure of the color LED flat lead frame of the second embodiment of the present invention. The circuit of this embodiment includes four groups of three color LED chips 92 connected in parallel after being connected in series, a total of twelve color LED chips 92. The LED flat lead frame 6 is a circuit developed in a plane from the light emitting curved surface 11 and is composed of two concentric circular arc curves connected to each other. Four LED chips 92 are mounted on the central arc, eight LED chips 92 are mounted on the outer arc, and seven lead frame single plates 61 are stacked.

  The high potential lead frame single plate 61 (HR) is a continuous lead frame and is used as a red light high potential parallel connection contact of a series connection circuit. The series connection circuit lead frame single plate 61 (R) is a series type lead frame, which is divided into four series connection circuit portions by the insulating slit 625 of the lead 62, and is red in four groups of three LED chips 92. Used to construct an optical series connection circuit.

  The high potential lead frame single plate 61 (HG) is a continuous lead frame, and is used as a green light high potential parallel connection contact of a series connection circuit. The series connection circuit lead frame single plate 61 (G) is a series type lead frame, and is divided into four series connection circuit portions by the insulating slits 625 of the leads 62, and green in four groups of three LED chips 92. Used to construct an optical series connection circuit.

  The high potential lead frame single plate 61 (HB) is a continuous lead frame and is used as a blue light high potential parallel connection contact of a series connection circuit. The series connection circuit lead frame single plate 61 (B) is a series type lead frame, which is divided into four series connection circuit portions by the insulating slits 625 of the leads 62, and is blue in four groups of three LED chips 92. Used to construct an optical series connection circuit.

  The low potential lead frame single plate 61 (C) is a continuous lead frame and is used as a low potential parallel connection contact of each series connection circuit.

  The structure of the high potential lead frame single plate 61 (HR) includes parts such as a lead 62, a power contact 631, a high potential connection point 621a, and a mounting base 64a. The power contact 631 is provided at the tip of the circuit, and the conductive through hole 65 is provided there. The lead frame 61 (HR) includes twelve mounting bases 64 a connected to each other by leads 62. The mount 64 a has a hollow annular mount lead 641. The high potential connection point 621a is provided to coincide with the high potential connection point 621b of the series connection circuit lead frame single plate 61 (R), and the conductive through hole 65 is provided there. The conductive adhesive 29 can be dropped into the power supply contact 631 and the conductive through hole 65 of the high potential connection point 621a to connect to the power contact 631 and the high potential connection point 621b of the lead frame single plate 61 (R). Can be used to form high-potential parallel connection contacts.

  The series connection circuit lead frame single plate 61 (R) divides the circuit by using the insulating slit 625 and becomes one set of four parallel connection circuit portions to which three color LED chips connected in series are connected. . The structure of the circuit part includes parts such as a lead 62, a power contact 631, a high potential connection point 621b, a low potential connection point 648, and a mounting base 64b. A power contact 631 is provided at the tip of the first circuit portion, and a low potential connection point 648 is provided at the end. A high potential connection point 621b is provided at the tip of the other circuit portion, and a low potential connection point 648 is provided at the end. A conductive through hole 65 is provided at the low potential connection point 648. Each circuit portion has three mounting bases 64b connected by leads 62, and an insulating slit 645 is provided on the mounting base lead 641 of the mounting base 64b to provide a set of high and low potential electrode contacts 643. Configure. The high potential of each circuit portion is connected to the power contact 631 and the high potential connection point 621b by dropping the conductive adhesive 29 into the conductive through hole 65 of the lead frame single plate 61 (HR). The low potential of each circuit is obtained by dropping the conductive adhesive 29 into the conductive through hole 65 at the low potential connection point 648 of the lead frame single plate 61 (R) and passing the conductive metal wire 67 therethrough. 61 (C) low potential connection point 648 is connected.

  The structure of the high potential lead frame single plate 61 (HG) includes parts such as a lead 62, a power contact 631, a high potential connection point 621a, and a mounting base 64a. The power contact 631 is provided at the tip of the circuit, and the conductive through hole 65 is provided there. The lead frame 61 (HG) includes twelve mounting bases 64 a connected to each other by leads 62. The mount 64 a has a hollow annular mount lead 641. The high potential connection point 621a is provided to coincide with the high potential connection point 621b of the series connection circuit lead frame single plate 61 (G), and the conductive through hole 65 is provided there. The conductive adhesive 29 can be dropped into the conductive through hole 65 of the power contact 631 and the high potential connection point 621a to connect with the power contact 631 and the high potential connection point 621b of the lead frame single plate 61 (G). Can be used to form high potential parallel connection contacts.

  The series connection circuit lead frame single plate 61 (G) divides the circuit by using the insulating slit 625 and becomes one set of four parallel connection circuit portions to which three color LED chips connected in series are connected. . The structure of the circuit part includes parts such as a lead 62, a power contact 631, a high potential connection point 621b, a low potential connection point 648, and a mounting base 64b. A power contact 631 is provided at the tip of the first circuit portion, and a low potential connection point 648 is provided at the end. A high potential connection point 621b is provided at the tip of the other circuit portion, and a low potential connection point 648 is provided at the end. A conductive through hole 65 is provided at the low potential connection point 648. Each circuit portion has three mounting bases 64b connected by leads 62, and an insulating slit 645 is provided on the mounting base lead 641 of the mounting base 64b to provide a set of high and low potential electrode contacts 643. Configure. The high potential of each circuit portion is connected to the power contact 631 and the high potential connection point 621b by dropping the conductive adhesive 29 into the conductive through hole 65 of the lead frame single plate 61 (HG). The low potential of each circuit is obtained by dropping the conductive adhesive 29 into the conductive through hole 65 at the low potential connection point 648 of the lead frame single plate 61 (G) and passing the conductive metal wire 67 therethrough. 61 (C) low potential connection point 648 is connected.

  The structure of the high potential lead frame single plate 61 (HB) includes parts such as a lead 62, a power contact 631, a high potential connection point 621a, and a mounting base 64a. The power contact 631 is provided at the tip of the circuit, and the conductive through hole 65 is provided there. The lead frame 61 (HB) includes twelve mounting bases 64 a connected to each other by leads 62. The mount 64 a has a hollow annular mount lead 641. The high potential connection point 621a is provided to coincide with the high potential connection point 621b of the series connection circuit lead frame single plate 61 (B), and the conductive through hole 65 is provided there. The conductive adhesive 29 can be dropped into the power supply contact 631 and the conductive through hole 65 of the high potential connection point 621a to connect with the power contact 631 and the high potential connection point 621b of the lead frame single plate 61 (B). Can be used to form high potential parallel connection contacts.

  The series connection circuit lead frame single plate 61 (B) divides the circuit by using the insulating slit 625 and becomes one set of four parallel connection circuit portions to which three color LED chips connected in series are connected. . The structure of the circuit part includes parts such as a lead 62, a power contact 631, a high potential connection point 621b, a low potential connection point 648, and a mounting base 64b. A power contact 631 is provided at the tip of the first circuit portion, and a low potential connection point 648 is provided at the end. A high potential connection point 621b is provided at the tip of the other circuit portion, and a low potential connection point 648 is provided at the end. A conductive through hole 65 is provided at the low potential connection point 648. Each circuit portion has three mounting bases 64b connected by leads 62, and an insulating slit 645 is provided on the mounting base lead 641 of the mounting base 64b to provide a set of high and low potential electrode contacts 643. Configure. The high potential of each circuit portion is connected to the power contact 631 and the high potential connection point 621b by dropping the conductive adhesive 29 into the conductive through hole 65 of the lead frame single plate 61 (HB). The low potential of each circuit is obtained by dropping the conductive adhesive 29 into the conductive through hole 65 at the low potential connection point 648 of the lead frame single plate 61 (B) and passing the conductive metal wire 67 therethrough. 61 (C) low potential connection point 648 is connected.

  The structure of the low potential lead frame single plate 61 (C) includes parts such as a lead 62, a power contact 632, a low potential connection point 648 and a mounting base 64 </ b> C. A power contact 632 is provided at the end of the circuit. The lead frame 61 (C) includes twelve mounting bases 64 c connected to each other by leads 62. The mounting base 64c has a solid plate shape. The low potential connection point 648 is provided to coincide with the low potential connection point 648 of the series connection circuit lead frame single plate 61, and the conductive metal 67 is attached to the hole through the conductive through hole 65 of the low potential connection point 648 of each layer. At the same time, the conductive adhesive 29 can be dropped to connect the low-potential connection points 648 of each single-connected lead frame single plate.

  The lead 62 and the mounting base 64 of each lead frame single plate 61 of the LED flat lead frame 6 have the same outer dimensions for superposition. The mounting base 64 includes a mounting base 64a, a mounting base 64b, and a mounting base 64c. The electrode contacts 643 of the mounting base 64b are provided at opposing positions and are bent in the same horizontal plane to form a set of high potential and low potential electrode contacts. The space can be used for mounting the LED chip 92 and can be fixed to each electrode contact by dropping the conductive adhesive 29. The bottom surface of the lead frame single plate 61 (C) is directly attached to the light emitting curved surface 11 with the heat conductive insulating bonding agent 28.

(Third embodiment)
In the third embodiment, the LED 3D curved lead frame of the present invention is applied to a curved or spherical color advertising board or light emitting device.

  FIGS. 7A, 7B, 8 and 9 are views showing the structure of the color LED curved advertising board module of the third embodiment of the present invention. The color advertising board module 7 includes a curved surface 71 of an aluminum alloy body and an LED 3D curved lead frame 8a. The circuit of this embodiment is a 16 × 16 series-connected color LED chip 93. The LED 3D curved lead frame 8a has a strip structure and is arranged in a matrix on the curved surface 71 in series connection. A through hole 711 is provided in the curved surface 71 of the aluminum alloy main body, and the power contact 831 (V), the power contact 834 (G), the clock contact 832 (C), and the signal contact 833 of the LED 3D curved lead frame 8a through the through hole 711. (S) can be connected to the controller and image decoder of the display system. The chip 93 is an integrated package chip in which a driving chip, an RGB three-color chip, and necessary circuits are incorporated. The driving chip has a serial communication interface (SD), a clock interface (CLK), a high potential interface (VCC), and a low potential interface (GND), which are indicated by S, C, V, and G, respectively. The LED 3D curved lead frame 8a is developed on the LED flat lead frame 8, on which four lead frame single plates 81 are laminated.

  The lead frame single plate 81 (V) of the high potential interface (VCC) is a continuous lead frame and is used as the parallel connection high potential contact 843 (V) of the LED chip 93. The mounting base lead 841 of the mounting base 84a has a hollow ring shape and is provided with a high potential contact 843 (V), which is used to connect to the high potential contact (VCC) of the LED chip 93.

  The lead frame single plate 81 (S) of the serial communication interface (SD) is a serial lead frame, and is used to connect to the serial communication interface (SD) of the LED chip 93. An insulating slit 845 is provided in the hollow annular mounting lead 841 of the mounting base 84b to constitute a set of signal input and output contacts 843 (S) of the serial communication interface, which are signal input contacts (SDI) of the LED chip 93. ) And signal output contact (SDO).

  The lead frame single plate 81 (C) of the clock interface (CLK) is a serial lead frame, and is used to connect to the clock interface (CLK) of the LED chip 93. An insulating slit 845 is provided in the hollow annular mounting lead 841 of the mounting base 84b to form a set of input and output contacts 843 (C) of the clock interface, which are clock input contacts (CLKI) and LED chip 93 Used to connect to the clock output contact (CLKO).

  The single lead frame 81 (G) of the low potential interface (GND) is a continuous lead frame, and is used as the parallel connection low potential contact 843 (G) of the LED chip 93. The mounting base lead 841 of the mounting base 84a has a hollow annular shape and is provided with a low potential contact 843 (G), which is used to connect to the low potential contact (GND) of the LED chip 93.

  The structure of the lead frame single plate 81 (V) of the high potential interface (VCC) includes parts such as a lead 82, a power contact 831 (V), and a mounting base 84 a. A power contact 831 (V) is provided at the tip of the circuit. The lead frame 81 (V) includes 16 × 16 mounting bases 84 a connected to each other by leads 82. The mounting base 84a has a hollow annular mounting base lead 841 on which a high potential contact 843 (V) is provided.

  The structure of the lead frame single plate 81 (S) of the serial communication interface (SD) includes parts such as a lead 82, a power contact 833 (S), and a mounting base 84b. One power contact 833 (S) is provided at the tip of the lead frame single plate 81 (S). The lead frame 81 (S) includes 16 × 16 mounting bases 84 b connected to each other by leads 82. The mounting base 84b has a hollow annular mounting base lead 841, in which an insulating slit 845 is provided, and a serial communication contact 843 (S) is provided for each.

  The structure of the lead frame single plate 81 (C) of the clock interface (CLK) includes parts such as a lead 82, a power contact 832 (C), and a mounting base 84 b. A power contact 832 (C) is provided at the tip of the lead frame single plate 81 (C). The lead frame 81 (C) includes 16 × 16 mounting bases 84 b connected to each other by leads 82. The mounting base 84b has a hollow annular mounting base lead 841, in which an insulating slit 845 is provided, and a clock contact 843 (C) of a set of clock interfaces is provided for each.

  The structure of the lead frame single plate 81 (G) of the low potential interface (GND) includes parts such as a lead 82, a power contact 834 (G), and a mounting base 84a. A power contact 834 (G) is provided at the tip of the circuit. The lead frame 81 (G) includes 16 × 16 mounting bases 84 a connected to each other by leads 82. The mounting base 84a has a hollow annular mounting base lead 841, and a low potential contact 843 (G) is provided there.

  The lead 82 and the mounting base 84 of each lead frame single plate 81 of the LED flat lead frame 8 have the same outer dimensions for superposition. The mounting base 84 is formed by stacking a mounting base 84a and a mounting base 84b. The contacts 843 of the mounting base 84a and the mounting base 84b are arranged at opposing positions, and are bent to the same horizontal plane to constitute a contact set of the LED chip 93. The space is used for mounting the LED chip 93 and can be fixed to each contact 843 by dropping the conductive adhesive 29. The bottom surface of the lead frame single plate 81 (G) is directly attached to the light emitting curved surface 71 with the heat conductive insulating bonding agent 28.

  FIG. 7B is a diagram showing the structure of an annular spherical advertisement board composed of the color LED curved surface display advertisement board module of the third embodiment of the present invention. This figure shows one annular curved display advertising board 7a formed of four LED3D curved lead frames 8a to explain that the new method of the present invention can satisfy various emission curved surface requirements. The aluminum alloy main body 71 has an annular spherical structure. A plurality of heat dissipating fins 72 are provided on the inner side, and the heat dissipating ability of the LED chip 93 is enhanced. When the white light LED chip 91 is used for illumination purposes, the plurality of heat radiating fins 72 can further exert a heat radiating effect.

(Fourth embodiment)
In the fourth embodiment, a method for manufacturing an LED flat lead frame of the white light LED light-emitting device according to the first embodiment of the present invention will be described.

  10 and 3A are structures of the sheet 4 of the LED flat lead frame 2 of the present invention. The LED flat lead frame 2 is composed of two concentric circular arc curved portions to be connected. Four LED chips 91 are mounted on the central arc, eight LED chips 91 are mounted on the outer arc, and the three-layer lead frame single plate 21 is laminated. The circuit includes a total of 12 LED chips 91 connected by four sets of three white light LED chips 91 connected in series and then connected in parallel. The purpose of this drawing is to explain how the sheet 4 is used to manufacture each lead frame veneer 21. The sheet 4 (H) of this embodiment is used to manufacture the high potential lead frame single plate 21 (H), and the sheet 4 (W) manufactures the series connection circuit lead frame single plate 21 (W). And the sheet 4 (C) is used to manufacture the low potential lead frame veneer 21 (C).

  The necessary patterns of the lead frame single plate 21 are appropriately arranged on three conductive metal thin plates having the same size. The back surface of the thin metal plate has an insulating layer 28 for preventing a circuit short circuit. Each of the conductive thin metal plates is primarily processed to obtain a prototype of the basic size lead frame 21. The description about each sheet | seat 4 is as follows.

  The sheet 4 (H) is connected to the lead 92, the mounting base 24a, and the power contact 231 using a connecting portion 494 having various shapes to form a network structure, and the conductive through hole 65, the insulating through hole 26, and the hollow. The annular mounting lead 241 is processed.

  The sheet 4 (W) is connected to the lead 92 and the mounting base 24 b using the connecting portions 494 having various shapes, and the circuit is divided into a plurality of parts by the insulating slits 225 and 245. These are connected by a connecting portion 494 to form a network structure, and the conductive through holes 65 and the insulating slits 225 and 245 are processed.

  The sheet 4 (W) is connected to the lead 92, the mounting base 24 c, and the low-potential power contact 232 using a connection portion 494 having various shapes to form a network structure.

  At this time, the prototype of the flat lead frame is formed on the sheet 4, and a plurality of prototypes are connected in series to one sheet 4. At this point, the insulating bonding agent 28 must be applied to the processed surface of the insulating through hole 26 of the sheet 4 (H). The connecting portion 494 of the sheet 4 (W) can ensure the stability of the position of the high-potential and low-potential electrode contact 243. The side surface 491 of each sheet 4 includes a plurality of sheet positioning holes 493. These three sheets 4 are attached to a jig and bonded with a heat conductive insulating bonding agent 28. The lead 22 and the mounting base 24 of each lead frame single plate are overlapped by having the same outer dimensions, and the hollow annular mounting base lead 241 of the sheet 4 (H) mounts the mounting base 24a on the white light LED chip 91. It can be a space. A conductive adhesive 29 is dropped on each electrode contact 243 by a dispenser to mount the white light LED chip 91, and further, the conductive adhesive 29 is dropped on each conductive through hole 65 and fixed by heating. It is firmly coupled to form a series connection circuit, and a parallel connection circuit can be further conducted. Subsequently, the connecting portion 494 is cut out, and the LED flat lead frame 2 having the high potential power contact 231 and the low potential power contact 232 at both ends is obtained.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 10 Main body 11 Light emission curved surface 111 Power supply hole 112 Vent hole 12 Heat radiating fin 121 Radiation fin side part 122 Lower part of radiating fin 131 Mounting base 132 Power supply contact 15 Transparent package 151 Vent hole 17 Screw cap 171 Power supply contact 18 Control circuit 181 Conductor 182 Conductor 2 LED flat lead frame 2a LED 3D curved lead frame 21 (H) high potential lead frame single plate 21 (W) series connection circuit lead frame single plate 21 (C) low potential lead frame single plate connected in parallel after being connected in series 22 Lead 225 Insulating slit 231 High potential power contact 232 Low potential power contact 24 Mounting base 24a Hollow annular mounting base 24b Mounting base 24c Flat mounting base 241 Mounting base lead 245 Mounting lead insulating slit 243 High potential and low Electric potential contact 25 Conductive penetration Through-hole 26 Insulating through-hole 28 Thermal conductive insulating bonding agent, insulating paint 29 Conductive adhesive 3 LED flat lead frame 31 (H) connected in series after parallel connection Single plate 31 (C) Low potential lead frame single Plate 32 Lead 325 Lead insulation slit 331 Power contact 332 Power contact 34 Mounting base 34a Hollow annular mounting base 34c Hollow annular mounting base 343 Power contact 35 Connection point 35a Connection point 35b Connection point 5 Color light emitting device 6a LED 3D curved surface Lead frame 6 LED flat lead frame 61 (HR) Red light high potential lead frame single plate 61 (R) Red light series connection circuit lead frame single plate 61 (HG) Green light high potential lead frame single plate 61 (G ) Green light series connection circuit lead frame single plate 61 (HB) Blue light high potential lead frame Single plate 61 (B) Blue light series connection circuit Lead frame 61 (C) Common ground low potential lead frame single plate 62 Lead 621 (R) Red light potential connection point 621 (G) Green light potential Connection point 621 (B) Blue light potential connection point 625 Insulation slit 631 Power supply contact 632 Power supply contact 64 Mounting base 64a Mounting base 64b Mounting base 641 with insulating slit Mounting base lead 643 Electrode contact 645 Insulation slit 65 Conductive through hole 67 Conductive metal wire 7 Color advertisement board module 7a Spherical annular color advertisement board 71 Curved surface 711 of aluminum alloy main body Through hole 8a LED3D curved leadframe 8 LED planar leadframe 81 (C) Clock leadframe single plate 81 (G) Ground Low potential lead frame single plate 81 (S) Serial communication lead frame single plate 8 (V) lead frame veneer of high potential
82 Lead 831 (V) High-potential power contact 832 (S) Serial communication signal contact 833 (C) Clock signal contact 834 (G) Ground low-potential power contact 84 (a) Mounting base 84 (b) Mounting with insulating slit Base 841 Mounting base lead 843 (C) Clock electrode contact 843 (G) Ground low potential electrode contact 843 (S) Serial communication electrode contact 843 (V) High potential electrode contact 845 Insulating slit 91 White light LED chip 92 Color LED chip 93 Color LED chip with serial communication interface and clock interface CLK Clock interface CLKI Input clock interface CLKO Output clock interface GND Low potential interface SD Serial communication interface SDI Input serial communication interface Face SDO Output serial communication interface VCC High potential interface

Claims (34)

  The LED3D curved lead frame of the light emitting device, the basic element of the LED3D curved lead frame is a curved strip-shaped lead frame single plate, and the lead and mounting base of each single lead frame single plate are laminated to form a multilayer lead frame In order to satisfy the requirements of series connection, parallel connection, and mixed circuit of series and parallel connection, the structure of LED3D curved lead frame consists of lead, power contact, mounting base, conductive through hole, insulating through hole, Potential junctions, signal contacts, clock contacts, and insulating slit portions can be included, and some or all of these portions can be combined as required, and the number of combined portions is at least one or more The main structure is composed of one or more mounts connected by a plurality of leads, and includes a control circuit, a signal circuit, and a clock circuit. Power supply contact, signal contact, clock contact and other parts are provided at one or both ends of the circuit part lead to meet the requirements for connection to the circuit, series connection, parallel connection, and series and parallel connection mixed circuit requirements An LED 3D curved lead frame of a light-emitting device, in which a conductive through hole, an insulating through hole, and a potential connection point are provided in a lead or a mounting base as required to satisfy the requirements, and an insulating slit is provided in the lead and mounting base as required.   Due to the requirements of series and parallel connection mixed circuits, the length of the lead frame single plate is divided into a plurality of circuit parts separated by insulating slits as required, and the length and shape of each circuit part is mixed in series and parallel connection Not necessarily the same or similar to meet the requirements of the circuit, each lead frame veneer is composed of at least one or more circuit parts, and the structure of each circuit part consists of leads, power contacts, mounting bases, It can include conductive through holes, insulating through holes, potential connection points, signal contacts, clock contacts and insulating slit parts, and consist of some or all of these parts as required, the number of combined parts is At least one or more, the main structure of which consists of one or more mounting bases and a plurality of connected leads for connecting to control circuits, signal circuits and clock circuits Provide power contact, signal contact, clock contact and other parts at one or both ends of the circuit part lead to meet your requirements, to meet your requirements to fit series connection, parallel connection and mixed series and parallel connection circuit The LED 3D curved lead frame of the light-emitting device according to claim 1, wherein the conductive through hole, the insulating through hole, and the potential connection point are provided on the lead or the mounting base, and the insulating slit is provided on the mounting base lead of the mounting base according to demand.   The mounting lead of the circuit part has an insulating slit, which is divided into a plurality of thin conductive metal plates separated by an insulating slit, and a set of heights on each mounting lead for series connection circuits. The LED 3D curved lead frame of the light-emitting device according to claim 2, wherein electrode contacts having a potential and a low potential are provided.   The shape of the mounting lead of the circuit part is an integrated lead including a strip shape, a hollow ring shape, a hollow rectangular shape, and a solid plate shape, and provides high-potential or low-potential electrode contacts to the parallel connection circuit. Therefore, the LED 3D curved lead frame of the light emitting device according to claim 2, wherein a set of high-potential or low-potential electrode contacts is provided on the mount lead.   A curved strip-shaped lead frame single plate is laminated to form a multi-layered lead frame in accordance with a mixed circuit in series and parallel connection, in order to form a high potential or low potential contact, lead, mounting base, potential connection point Alternatively, the LED 3D curved lead frame of the light emitting device according to claim 1, wherein the power contact is provided with a conductive through hole or an insulating through hole.   The conductive through hole of the multilayer laminated lead frame is used for injecting a conductive adhesive, and the conductive metal in the circuit part of the two lead frame single plates laminated up and down can have the same potential, The conductive through hole is provided only in the lead frame that requires the same potential, and the lead frame laminated on the bottom layer does not have the conductive through hole, and the conductive adhesive is completely filled in the conductive through hole. The LED 3D curved lead frame of the light emitting device according to claim 5, wherein the laminated lead frames have the same potential.   The conductive metal in the circuit part of two or more lead frame single plates laminated above and below the intermediate layer in the multilayer laminated lead frame is connected to the same potential by the conductive through hole, and the hole diameter is electrically conductive in the other layer above it. 6. The light-emitting device according to claim 5, wherein an insulating through-hole larger than the through-hole is provided to ensure that the conductive metal of another lead frame that requires insulation is not conducted when the conductive adhesive is injected. LED3D curved lead frame.   Make sure that the circuit parts of the multilayer lead frame with the same potential are not stacked one above the other, but penetrate the conductive metal wire through the conductive through hole and penetrate the conductive adhesive to achieve the same potential as required. The lead frame on the bottom layer does not have conductive through-holes, is in direct contact with the conductive metal wire and is connected and connected by a conductive adhesive, and other lead frame single plates having different potentials The LED 3D curved lead frame of the light emitting device according to claim 5, wherein an insulating through hole through which the conductive metal wire can pass is provided.   Conductive through holes are provided at potential connection points or power contacts, both of which are located on the side of the lead or mounting base and extend outward, and other lead frame single plates with different potentials must be provided with insulating through holes. 9. The LED 3D curved lead frame of the light emitting device according to claim 8, wherein the conductive metal wire together with the conductive adhesive is only passed through the conductive through hole.   Multi-layer laminated lead frame in which two or more layers are laminated has a series connection circuit, and the lead insulation slit in each single-layer lead frame mounting structure is a structural strength of the stacked mounting base that satisfies the requirements for mounting LED chips The LED 3D curved lead frame of the light emitting device according to claim 3, wherein the LED 3D curved lead frame is shifted from each other to secure   After the multi-layer lead frame mounting base in which each single-layer lead frame is stacked, the electrode contacts of the mounting base lead are shifted from each other, and the high-potential and low-potential electrode contacts are arranged separately at opposing positions. 5. A plurality of high and low potential electrode contact pairs are formed and connected to the electrode contacts of the LED chip, the electrode contacts being bent to the same horizontal position for mounting the LED chip. LED3D curved lead frame of the light emitting device described.   An LED 3D curved lead frame of a light emitting device, wherein the LED 3D curved lead frame draws a circuit of a curved strip-shaped multilayer lead frame on a light emitting curved surface, and a complicated 3D curved circuit may be divided into a plurality of circuit units. Next, the 3D curved circuit pattern of each circuit unit is developed into one planar curved strip-shaped circuit to produce an LED planar lead frame having a multilayer lead frame structure, and each lead frame single plate of the LED planar lead frame is manufactured. The leads and mounts have the same outer dimensions for lamination, the conductive metal of the multilayer lead frame has ductility and plastic deformation characteristics, and the LED flat lead frame is bent by a jig to become an LED 3D curved lead frame. Can be affixed to the required light emitting curved surface, and transparent such as resin or silica gel Characterized in that it is packaged together with charges, LED 3d curved lead frame of the light emitting device.   The LED flat lead frame is a multilayer lead frame in which conductive thin metal plates are laminated, and the LED chip is mounted on the mounting base, and the curved strip-like circuit pattern has a concentric curve, a repetitive array curve or various other types. 13. The LED 3D curved lead frame of the light emitting device according to claim 12, wherein the LED chip irradiation light in these circuit patterns also satisfies the requirements of the original light emitting curved surface.   An LED 3D curved lead frame of a light-emitting device, wherein the LED flat lead frame manufacturing method draws a circuit of a curved strip-like structure of each lead frame single plate of a multilayer laminated lead frame on different strip-like metal thin plates, Therefore, a plurality of necessary different shapes are required for arranging the pattern of the lead frame single plate appropriately on the strip-shaped metal plate and connecting the circuit conductive metal thin plates of each single lead frame single plate to form a net-like sheet structure. In addition, for the lamination of multilayer sheets and mounting of LED chips, it is processed into a net-like sheet with positioning holes, and all laminated sheets are made into jigs for lamination and insulation lamination Mounting, mounting the LED chip on the mounting base, then injecting conductive adhesive into each electrode contact of each mounting base to bond the LED chip, The LED chip stable and fixed by thermal fixing, cut part into individual parts cut the connecting portion of the sheet, LED plane lead frame of the multi-layer laminate is obtained in stage, LED 3d curved lead frame of the light emitting device.   The thickness of the strip-shaped conductive metal body is 0.05 mm or more and 2 mm or less, the width is 1 mm or more and 10 mm or less, and the conductive metal includes ferrous metal, non-ferrous metal, and copper foil provided with an insulating layer. The LED 3D curved lead frame of the light emitting device according to claim 14, comprising a plate. A white light emitting device made of an LED 3D curved lead frame includes an aluminum alloy body, a light emitting curved surface, an LED 3D curved lead frame, a screw cap, a white light LED chip, and a transparent package,
The light emitting curved surface is a spherical thin plate, the heat radiating fin is connected to the aluminum alloy body, the vent hole is provided in the center of the light emitting curved surface, and the heat radiating fin is used on the side of the aluminum alloy main body with the heat radiating fin. A ventilation flow path connected to the vent hole is secured between the light emitting curved surface and the aluminum alloy body, and the light emitting curved surface can be attached with an LED3D curved lead frame and has a transparent package on the outermost layer, The hole is used to connect the power lead to the power contact of the LED 3D curved lead frame through the inside of the aluminum alloy body,
The LED 3D curved lead frame coincides with the light emitting curved surface and has a white light LED chip on the mounting base, and the circuit includes a series and parallel connection mixed circuit of LED chips and a power contact, and the LED 3D curved lead frame The bottom surface is bonded to the light emitting curved surface with an insulating heat conductive bonding agent, and has the maximum heat radiation area,
The aluminum alloy main body has heat radiating fins extending to the outside, and the heat radiating fins first extend downward and then extend to the outer side of the heat radiating fins on the side surface. Having a cylindrical structure that can be used;
The screw cap is used to attach the light emitting device to the cylindrical opening at the other end of the aluminum alloy body of the lighting device socket.
The LED 3D curved lead frame of the light emitting device according to claim 12, wherein the transparent package is used to protect the LED 3D curved lead frame, and is provided with a vent hole communicating with the vent hole of the light emitting curved face.   The light emission curved surface is a spherical thin plate, provided with a plurality of plate-like radiating fins arranged in an annular shape on the bottom surface, a vent hole in the center, and the inner diameter of the radiating fin in contact with the cylindrical aluminum alloy body. The LED 3D curved lead frame of the light emitting device according to claim 16, wherein a ventilation flow path connected to the vent hole is secured between the light emitting curved surface and the aluminum alloy main body using a heat radiating fin.   The light-emitting curved surface is a spherical thin plate, and the radiating fin and the cylindrical aluminum alloy body are integrated, and the ventilation channel that connects the vent hole is secured between the light-emitting curved surface and the aluminum alloy body using the radiating fin. The LED 3D curved lead frame of the light emitting device according to claim 16.   The heat generated from the white light LED chip of the LED 3D curved lead frame is directly transferred to the heat radiating fin through the light emitting curved surface of the aluminum alloy, whereby the heat is directly radiated from the back surface of the light emitting curved surface and the surface of the heat radiating fin. The air hole is provided in the central part of the air, and the air rises and flows by buoyancy to reduce the thickness of the heat boundary layer of the heat radiating surface, and increases the thermal convection coefficient to promote heat release. LED3D curved lead frame of light emitting device.   The LED 3D curved lead frame circuit consists of four sets of three white light LED chips connected in parallel after being connected in series, a total of 12 LED chips connected, and the light emitting curved circuit consists of a single layer of three lead frames. It can be flattened on the stacked LED flat lead frame, and its circuit shape is composed of two concentric arc curves connected, four LED chips are mounted in the central arc, and eight in the outer arc The LED chip is mounted, the leads and mounting bases of each lead frame single plate of the LED flat lead frame have the same outer dimensions for lamination, and the high potential lead frame single plate is a continuous lead frame, Used as high-potential parallel connection contact of series connection circuit, series connection circuit lead frame single plate is series type lead frame, lead insulation slit Divided into four series-connected circuit parts and used to construct a parallel connection circuit in which four sets of three white light LED chips connected in series are connected, and the low potential lead frame single plate is a continuous lead frame The LED 3D curved lead frame of the light emitting device according to claim 16, wherein the LED 3D curved lead frame is used as a low potential parallel connection contact of a series connection circuit. High potential lead frame single plate structure includes lead, mounting base, conductive through hole, insulating through hole, power contact and other parts, and the power contact is provided at the end of the lead frame to connect with the control circuit Used, the lead is provided with one conductive through hole, the lead frame has twelve mounting bases connected by the lead, the mounting base has a hollow annular mounting base lead, Insulation through-holes are provided in the leads to avoid low-potential short-circuits, and the installation positions are above the conductive through-holes of each circuit portion of the series connection circuit lead frame single plate. Dripping and connecting the high potential ends of each circuit part of the series connection circuit lead frame single plate, the high potential lead frame single plate can be used as a high potential parallel connection contact,
Insulating slits on a single plate of a series connection circuit lead frame are divided into a single group consisting of four groups of parallel connection circuits in which three white light LED chips are connected in series. Each of the circuit parts includes three mounting bases connected by leads, the mounting base having an insulating slit, and a set of high-potential and low-potential electrodes. The high potential lead at the tip of each circuit part is connected by dropping a conductive adhesive into the conductive through hole of the single plate of the high potential lead frame, and conductive through the low potential lead at the end of each circuit part. A hole is provided and connected to the low potential lead frame single plate by dropping a conductive adhesive into the conductive through hole,
The low-potential lead frame single plate structure includes a lead, mounting base, low-potential power contact and other parts, and a low-potential power contact is provided at the end of the lead frame and used to connect to the control circuit. The frame has twelve flat mounting bases connected by leads, and the low potential parallel connection contacts are formed by dropping a conductive adhesive into the conductive through holes of the series connection circuit lead frame single plate. 21. The LED 3D curved lead frame of the light emitting device according to claim 20, which is connected to a single plate lead.   The LED 3D curved lead frame circuit includes four sets of three white light LED chips connected in series after being connected in parallel, a total of 12 LED chips, and the light emitting curved circuit is a laminate of two layers of lead frame single plates. The circuit shape is composed of two concentric circular arcs connected to each other, four LED chips are mounted on the central arc, and eight LEDs on the outer arc. The chip is mounted, the leads and mounting bases of each lead frame single plate of the LED flat lead frame have the same external dimensions for lamination, the high potential lead frame single plate is a continuous lead frame, Insulating slits are divided into four circuit parts and used as the high potential of the parallel connection circuit. The low potential lead frame single plate is a continuous lead frame 17. Divided into four circuit portions by insulating slits of leads and used as a low potential of a parallel connection circuit, each parallel connection circuit completes a series connection structure of a high potential and a low potential by a connection point. LED3D curved lead frame of the light emitting device described in 1. The structure of each circuit part of the high potential lead frame single plate includes a lead, a mounting base, a connection point, a power contact and other parts, and the power contact for connecting to the high potential of the control circuit is connected to the first circuit part. The potential connection point and the conductive through hole are provided at the tip of the other circuit portion, and each circuit portion is connected to the potential connection point of each circuit portion of the low potential lead frame single plate by dropping a conductive adhesive. Comprises three mounting bases connected by leads, one high potential electrode contact is provided on the hollow annular mounting lead of the mounting base,
The structure of each circuit part of the low-potential lead frame single plate includes a lead, a mounting base, a connection point, a power contact and other parts, and a low-potential power contact for connecting to the control circuit at the end of the fourth circuit part. The potential connection point is provided at the end of the other circuit part and is used to connect to the potential connection point of each circuit part of the high potential lead frame single plate, and each circuit part is connected by a lead. The mounting base is provided with one low-potential electrode contact on the hollow annular mounting lead of the mounting base, and high-potential and low-potential electrode contacts are provided on the mounting base. A pair of high potential and low potential electrode contacts are arranged, the electrode contacts are processed and bent to the same horizontal plane, and a conductive adhesive is dropped on each high potential and low potential electrode contact to form an LED chip. Is implemented in its internal space Possible, LED 3d curved lead frame of the light emitting device according to claim 22. A color light emitting device made of an LED 3D curved lead frame includes an aluminum alloy body, a light emitting curved surface, a radiation fin, an LED 3D curved lead frame, a screw cap, and a color LED chip.
The light emitting curved surface is spherical and is in contact with the heat radiating fin. The LED 3D curved lead frame is attached to the light emitting curved surface, and the surface has a transparent package. The power hole is used to connect the power lead from the inside of the aluminum alloy body to the power contact of the LED 3D curved lead frame,
Twelve color LED chips of LED3D curved lead frame are mounted on the mounting base to form a series and parallel connection mixed circuit with power contacts, and the power contacts can give different driving voltages to LED chips of different colors ,
The aluminum alloy main body has heat radiating fins extending to the outside. The heat radiating fins first extend downward, and then extend to the outer side of the heat radiating fins on the side surface, and generate heat from the color LED chip of the LED 3D curved lead frame. Is directly transferred to the heat radiating fin through the light emitting curved surface of the aluminum alloy, whereby heat is radiated directly from the back surface of the light emitting curved surface and the surface of the heat radiating fin, and a ventilation hole is provided in the central portion of the light emitting curved surface. To increase the thermal convection coefficient to promote heat release, and the bottom surface of the LED3D curved lead frame is directly attached to the light emitting curved surface with an insulating heat conductive bonding agent. It has the maximum heat dissipation area, the screw cap can attach the light emitting device to the lighting device socket, and the transparent package is LED3D curved lead frame Used to protect the ventilation holes communicating with the ventilation hole of the light emission curved surface is provided, LED 3d curved lead frame of the light emitting device according to claim 12.   The inside of the aluminum alloy main body of the light emitting device is a cylindrical space, and in order to ensure the service life of the white light LED chip or the color LED chip, it is connected to the LED 3D curved lead frame to provide a stable voltage and current. A circuit is attached, and the lower part of the radiation fin is connected to the space between the cylindrical space and the light emitting curved surface to generate convection in the cold air, and the heat generated from the LED chip is first from the lower part of the radiation fin. A large amount of heat released and affecting the control circuit is not transferred to the cylindrical space, the opening of the cylindrical space is hermetically coupled with a screw cap, and the heat generated by the control circuit is 25. The LED of the light emitting device according to claim 16 or 24, which can be emitted through the wall surface and the heat radiating fin side part, both of which have a large heat radiating surface. D curved surface lead frame.   By attaching the LED 3D curved lead frame to the light emitting curved surface, it is possible to ensure that the distribution of the irradiated light matches the original design, and the direction of light irradiation is easily controlled by the radius of curvature of the light emitting curved surface. When the curved surface is a concave spherical surface, the larger the radius of curvature, the longer the focal length of the light and the more uniform the direction of the light, and the smaller the radius of curvature, the shorter the focal length of the light and the light emitting curved surface. When is a convex spherical surface, the larger the radius of curvature is, the more uniform the direction of irradiation of light is, and the smaller the radius of curvature is, the larger the direction of irradiation of light is. LED3D curved lead frame of the light emitting device according to 24.   25. The LED 3D curved surface of the light emitting device according to claim 16 or 24, wherein when the luminance distribution of the irradiation light needs to be further controlled, the circuit is divided into circuits of smaller units to generate more uniform irradiation light. Lead frame. The circuit of the LED 3D curved lead frame includes four groups of three color LED chips connected in parallel after being connected in series, a total of 12 color LED chips, and the circuit is an LED plane on which seven layers of lead frames are stacked. The lead frame can be developed in a plane, and its circuit shape is composed of two concentric arc curves connected to each other. Four color LED chips are mounted on the central arc, and eight color LED chips are mounted on the outer arc. The lead and mounting base of each lead frame single plate of the LED flat lead frame mounted have the same outer dimensions for lamination,
Red light high potential lead frame single plate is a continuous lead frame, used as red light high potential parallel connection contact of series connection circuit, red light series connection circuit lead frame single plate is series type lead frame, It is divided into four series connection circuit parts by insulating slits, and is used to construct a red light series connection circuit with four sets of three color LED chips,
The green light high potential lead frame single plate is a continuous lead frame, used as a green light high potential parallel connection contact of the series connection circuit, the green light series connection circuit lead frame single plate is a series lead frame, It is divided into four series connection circuit parts by insulating slits, and is used to construct a green light series connection circuit with four sets of three LED chips,
The blue light high potential lead frame single plate is a continuous lead frame, used as a blue light high potential parallel connection contact of the series connection circuit, and the blue light series connection circuit lead frame single plate is a series lead frame, It is divided into four series connection circuit parts by an insulating slit, and is used to construct a blue light series connection circuit with four sets of three LED chips,
The LED3D curved lead frame of the light emitting device according to claim 24, wherein the single plate of the low potential lead frame is a continuous lead frame and is used as a low potential parallel connection contact of a series connection circuit. The structure of the high-potential lead frame single plate of LED chips of three colors, red, blue, and green, includes a lead, a power contact, a high-potential connection point, a mounting base, a conductive through hole, and other parts. The lead frame is provided with a conductive through-hole, the lead frame has twelve mounting bases connected to each other by leads, the mounting base has hollow annular mounting base leads, and the high potential connection point is a series connection circuit. Provided corresponding to the high potential connection point of the lead frame single plate and provided with a conductive through hole, the power supply contact point and the conductive through hole of the high potential connection point are dripped with conductive adhesive and the power contact point of the lead frame single plate and Used to connect high potential connection points, can form high potential parallel connection contacts,
Red, blue and green LED chip series connection circuit lead frame single plate is divided into four parallel connection circuit parts connected with three color LED chips connected in series by dividing the circuit with insulating slits The structure includes a lead, a power contact, a high potential connection point, a low potential connection point, an insulating slit, a mounting base, a conductive through hole, and other parts. Power supply contact is provided, one low potential connection point is provided at the end, one high potential connection point is provided at the tip of the other circuit portion, one low potential connection point is provided at the end, and the conductive through hole Is provided at a low potential connection point, each circuit part has three mounting bases connected by leads, and insulating slits are provided on the mounting base leads to form a set of high potential and low potential electrode contacts. The high potential of each circuit part The conductive adhesive is dropped into the conductive through hole of the single plate and connected to the power contact and the high potential contact. The low potential of each circuit is bonded to the conductive through hole at the low potential connection point of the lead frame single plate. By dropping the agent and passing through the conductive metal wire, it is connected to the low potential connection point of the lead frame single plate. The low potential lead frame single plate is the low potential of red, blue and green color LED chip. A common contact, the structure includes a lead, a low potential power contact, a low potential connection point, a mounting base and other parts, the power contact is provided at the end of the circuit, and the lead frame is connected to each other by leads 12 The mounting base is a solid plate, and the low potential connection point is provided corresponding to the low potential connection point of the series connection circuit lead frame single plate, and is made of conductive metal and conductive adhesive. , Low potential ream of each layer Through the conductor through holes of the points is connected to the low potential connection point of the series connection lead frame of each layer, LED 3d curved lead frame of the light emitting device according to claim 28. The color spherical advertising board module made of LED3D curved lead frame includes the curved surface of the aluminum alloy body and the LED3D curved lead frame, and the circuit of the color spherical advertising board has the strip structure of the LED3D curved lead frame on the curved surface of the aluminum alloy body. Are arranged in a matrix, and through holes are provided in the curved surface of the aluminum alloy body, and the power supply contacts and signal contacts of the LED 3D curved lead frame can be connected to the display system controller and image decoder through the through holes. It is an integrated package chip with built-in drive chip, RGB three-color chip and necessary circuit, LED chip has serial communication interface, clock interface, high potential interface and low potential interface, LED3D curved lead frame is ED plane can be deployed to the lead frame, which are stacked lead frame veneer four layers,
The lead frame single plate of the high potential interface is a continuous lead frame and is used as a drive parallel connection high potential electrode contact of the LED chip, and its mounting base lead is a hollow ring shape and is provided with a high electrode contact. , Used to connect with high potential electrode contacts of LED chips,
The lead frame of the serial communication interface is a serial lead frame, which is used to connect to the serial communication interface of the LED chip. The hollow annular mounting lead of the mounting base is provided with an insulating slit, and the serial communication Used to configure a set of input and output contacts of the interface to connect with the input and output contacts of the LED chip,
The lead frame single plate of the clock interface is a series type lead frame, which is used to connect to the clock interface of the LED chip. The hollow annular mounting lead of the mounting base is provided with an insulating slit, and the serial communication interface A set of input and output contacts are used to connect with the input and output contacts of the LED chip;
The lead frame single plate of the low potential interface is a continuous lead frame, used as a parallel connection ground low potential electrode contact of the LED chip, its mounting base lead is a hollow ring, and the low potential electrode contact is provided. The LED 3D curved lead frame of the light emitting device according to claim 12, which is used for connecting to a low potential electrode contact of the LED chip. The structure of the lead frame single plate of the high potential interface includes the lead, the power contact, the mounting base and other parts, the power contact is provided at the tip of the circuit, and the mounting base arranged in a matrix on the lead frame is provided. Are connected to each other with leads in a spherical curved surface, and the mounting base has a hollow annular mounting base lead and is provided with a high potential electrode contact,
The lead frame single plate structure of the serial communication interface includes a lead, a power contact, a mounting base and other parts, one power contact is provided at the tip of the lead frame single plate, and a low potential lead frame is provided at the end. The lead frame is provided with a mounting base arranged in a matrix and connected to each other by leads on a spherical curved surface. The mounting base has a hollow annular mounting base lead and an insulating slit and a set of serial communication electrode contacts. Each provided,
The lead frame structure of the clock interface includes a lead, a power contact, a mounting base and other parts, a power contact is provided at the leading end of the lead frame, and a low potential lead frame is provided at the end. A mounting base arranged in a matrix is provided and connected to each other by leads on a spherical curved surface. The mounting base has a hollow annular mounting base lead and is provided with an insulating slit and a set of serial communication electrode contacts. ,
The structure of a single lead frame for a low potential interface includes a lead, a power contact, a mounting base and other parts, the power contact is provided at the tip of the circuit, and a mounting base arranged in a matrix on the lead frame is provided. 32. The LED 3D curved lead frame of the light emitting device according to claim 30, wherein the spherical curved surface is connected to each other by a lead, and the mount has a hollow annular mount lead and is provided with a low potential electrode contact.   The mounting plane of the LED flat lead frame developed from the spherical surface is formed by stacking hollow annular mounting bases of each lead frame single plate, the electrode contacts of each mounting base of the lead frame single plate are bent to the same horizontal plane, and the space is It is used to mount LED chips, and the electrode contacts can be fixed on each electrode contact by dropping conductive adhesive, and the bottom surface of LED3D curved lead frame is light emitting spherical with heat conductive insulating bonding agent The LED 3D curved lead frame of the light emitting device according to claim 30, which is directly attached to the curved surface.   The LED 3D curved lead frame of the light emitting device according to claim 30, wherein the advertising board module comprising a plurality of LED 3D curved lead frames constitutes a color annular spherical advertising board.   The thickness of the strip-shaped conductive metal body is 0.05 mm or more and 2 mm or less, the width is 1 mm or more and 10 mm or less, and the conductive metal includes ferrous metal, non-ferrous metal, and copper foil provided with an insulating layer. The LED 3D curved lead frame of the light emitting device according to claim 1, comprising a plate.

Images