JP5466579B2 - Switch device, test device, switch method, and manufacturing method - Google Patents

Description

  The present invention relates to a switch device, a test device, a switch method, and a manufacturing method.

Conventional switches that have multiple contacts and are turned on by bringing the contacts into contact with each other are provided with a protective conductive film on the surface of the contacts to suppress false adhesion between the contacts without increasing the contact resistance of the contacts. (For example, refer to Patent Document 1).
Patent Document 1 International Publication No. 2007/083769

  However, when the number of ON / OFF operations of such a switch increases, the protective conductive film layer is worn, and pseudo contact between the contacts occurs.

  In order to solve the above problems, in the first aspect of the present invention, in the first aspect of the present invention, the first contact and the second contact provided with a protective conductive layer on the surface in contact with the first contact. There is provided a switch device comprising: a movable part that contacts or separates a first contact and a second contact; and a metal supply part that supplements a protective metal with respect to the protective conductive layer.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

The structural example of the switch apparatus 100 which concerns on this embodiment is shown. A view of the AA ′ cross section of the heating unit 146 of FIG. The operation | movement flow of the switch apparatus 100 which concerns on this embodiment is shown. The manufacturing flow of the switch apparatus 100 which concerns on this embodiment is shown. A configuration example of a test apparatus 510 according to this embodiment is shown together with a device under test 500.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 shows a configuration example of a switch device 100 according to the present embodiment. The switch device 100 is a switch device that includes a first contact 10 and a second contact 20 having a protective conductive layer 120 provided on a surface in contact with the first contact 10. The metal for protection is supplemented according to the accompanying deterioration of the protective conductive layer 120. The switch device 100 includes a movable unit 110, a protective conductive layer 120, a contact layer 130, a metal supply unit 140, a wiring layer 150, a measurement unit 160, and a determination unit 170.

  The movable part 110 contacts or separates the first contact 10 and the second contact 20. The movable part 110 is a thermally driven movable contact including a bimorph that brings the first contact 10 and the second contact 20 into contact with each other in an unheated state and separates the second contact 20 from the first contact 10 when heated. Good. Instead of this, the movable part 110 may include a unimorph in which one piezoelectric element and a metal plate are bonded together instead of the bimorph structure in which two piezoelectric elements are bonded together.

  In addition, the movable unit 110 may be an actuator that converts input energy into physical momentum. For example, the movable unit 110 is an electrostatic actuator that is moved by electrostatic attraction, a piezoelectric actuator that is moved by applying a voltage to a piezoelectric material, an electromagnetic actuator that is moved using magnetic force, or a thermal actuator that is moved by thermal expansion. .

  In the present embodiment, the first contact 10 is a movable contact that is moved by the movable unit 110, and the second contact 20 is a fixed contact provided on a substrate that holds the movable unit 110. The second contact 20 includes a protective conductive layer 120 and a contact layer 130.

  The protective conductive layer 120 is provided on the surface of the second contact 20 that contacts the first contact 10. When the first contact 10 and the second contact 20 are brought into contact with each other, the protective conductive layer 120 prevents the contacts from being pseudo-attached to lose the switch function. The protective conductive layer 120 may be a metal oxide that electrically connects the first contact 10 and the second contact 20. For example, the protective conductive layer 120 includes nickel (Ni), gold (Au), or gold palladium (Au—Pd) alloy. The protective conductive layer 120 may have a thickness of about several nm to several tens of nm.

  The contact layer 130 is provided between the protective conductive layer 120 and the metal supply unit 140 and includes a contact metal. For example, the contact layer 130 includes Ni, Au, a nickel-chromium (Ni—Cr) alloy, or an Au—Pd alloy. The contact layer 130 may have a thickness of 100 nm or more.

  The metal supply unit 140 is provided between the contact layer 130 and the wiring layer 150 and supplements the protective conductive layer 120 with a protective metal. The metal supply unit 140 deposits a protective metal from the side opposite to the first contact 10 to the first contact 10 side through the contact layer 130. The metal supply unit 140 may supplement the protective metal according to the deterioration of the protective conductive layer 120 accompanying the ON / OFF operation of the switch device 100. The metal supply unit 140 may have a thickness of about several hundred nm to several μm. The metal supply unit 140 includes a metal supply layer 143 and a heating unit 146.

  The metal supply layer 143 includes a protective metal superimposed on the contact layer 130 on the opposite side of the first contact 10. The metal supply layer 143 may include Ni, Au, or an Au—Pd alloy included in the protective conductive layer 120 as a protective metal.

  The heating unit 146 heats the metal supply layer 143 and the contact layer 130, and deposits a protective metal from the metal supply layer 143 to the protective conductive layer 120 through the contact layer 130. The heating unit 146 includes a metal supply layer 143 and a contact layer below the second contact 20 in contact with the first contact 10 in order to compensate for deterioration of the protective conductive layer 120 of the second contact 20 caused by contact with the first contact 10. 130 may be heated.

  The wiring layer 150 transmits a signal that passes through the switch device 100. The wiring layer 150 may be a transmission line including Ni, Au, a nickel-chromium (Ni—Cr) alloy, or an Au—Pd alloy. In the present embodiment, the switch device 100 moves the movable part 110 and contacts / separates the first contact 10 with the second contact 20 to transmit signals from the wiring layer 150a to the wiring layer 150b or from the wiring layer 150b. The signal transmission to the wiring layer 150a is turned ON / OFF.

  The measurement unit 160 measures the resistance between the first contact 10 and the second contact 20 in a state where the first contact 10 and the second contact 20 are in contact with each other. The measurement unit 160 may measure the resistance by measuring a value of a potential drop by applying a predetermined voltage or current between the wiring layer 150a and the wiring layer 150b. Here, the measurement unit 160 may measure the resistance with a high accuracy by a four-terminal method.

  The determination unit 170 determines whether or not to supplement the protective conductive layer 120 with a protective metal based on the measured magnitude of resistance. The determination unit 170 may determine that the protective conductive layer 120 is supplemented with a protective metal when the measured resistance value is smaller than a predetermined reference resistance value. In addition, the determination unit 170 determines that the resistance measurement result after the protective metal layer 120 is supplemented with the protective metal does not change compared to the measurement value before the compensation, or a change in the predetermined resistance value. When it is within the range, it may be determined that there is no effect of supplementing the protective metal.

  FIG. 2 is a view of the AA ′ cross section of the heating unit 146 of FIG. 1 as viewed from above, together with the heater power supply unit 240 and the heater control unit 250. A square surrounded by a dotted line in the drawing shows an example of the arrangement 260 of the metal supply layer provided above the heating unit 146. A square surrounded by an alternate long and short dash line indicates an example of the arrangement 270 of the second contact provided above the heating unit 146 and in contact with the first contact 10. The heating unit 146 includes a heater 210 that heats the metal supply layer 143 from the side opposite to the contact layer 130, and an insulating unit 220.

  The heater 210 is formed on the side of the metal supply layer 143 opposite to the contact layer 130 by drawing a heater wire that generates heat when a current is passed. The heater 210 is provided between the wiring layer 150 and the metal supply layer 143. The heater 210 may be a heating wire having a large electrical resistance including Ni—Cr alloy or the like. When the metal supply layer 143 is heated, the heater 210 causes the second contact 20 to deposit the protective metal at a position where the protective conductive layer 120 is in contact with the first contact 10 and deteriorates. It is arrange | positioned under the position which contacts.

  The insulating unit 220 electrically insulates between the heater 210 and the metal supply layer 143. Further, the insulating part 220 may electrically insulate between the heater 210 and the wiring layer 150. Further, the insulating unit 220 may electrically insulate the wiring connecting the heater 210 and the heater power supply unit 240 from the metal supply layer 143 and / or the wiring layer 150.

  The insulating part 220 includes an opening 230 for conducting the wiring layer 150 and the metal supply layer 143 in at least a partial region of the metal supply layer 143 in the plane direction. A plurality of opening portions 230 may be included depending on the shape of the insulating part 220. Accordingly, the heating unit 146 transmits a signal that causes the wiring layer 150 and the second contact 20 to conduct and pass through the switch device 100, and is insulated from transmission from the wiring layer 150 to the second contact 20. The metal supply layer 143 can be heated using a line and heater 210.

  The heater power supply unit 240 supplies power to the heater 210. The heater control unit 250 controls the power supply of the heater power supply unit 240. For example, the heater control unit 250 starts power supply to the heater power supply unit 240 when the determination unit 170 determines to supplement the protective conductive layer 120 with a protective metal. In addition, the heater control unit 250 may stop the power supply of the heater power supply unit 240 in response to the elapse of a predetermined heating time after starting the power supply of the heater power supply unit 240. Instead of this, the heater control unit 250 may stop the power supply of the heater power supply unit 240 in accordance with an instruction from the determination unit 170.

  FIG. 3 shows an operation flow of the switch device 100 according to the present embodiment. The switch device 100 drives the movable part 110 to bring the first contact 10 and the second contact 20 into contact with each other, and turns on the switch (S300). In this state, the switch device 100 keeps the wiring layer 150a and the wiring layer 150b conductive.

  The measuring unit 160 measures the resistance between the first contact 10 and the second contact 20 to confirm the switch ON state (S310). The determination unit 170 determines whether or not to supplement the protective metal based on the measured magnitude of the resistance (S320). Here, the determination unit 170 may make a determination by comparing the measured resistance value with a predetermined expected value of the resistance. Instead, the determination unit 170 may determine the resistance value with the measured resistance value determined in advance. It may be determined according to whether or not it is within the range.

  Instead, the metal for contact included in the second contact 20 has higher conductivity than the metal for protection, and the determination unit 170 determines that the measured resistance is less than the reference value in the protective conductive layer 120. Decide to supplement the protective metal. When the conductivity of the protective metal is lower than the conductivity of the contact layer 130, the resistance value decreases when the protective conductive layer 120 deteriorates due to the ON / OFF operation of the switch device 100, and the resistance value decreases when the protective metal is deposited. Therefore, the determination unit 170 may determine to deposit a protective metal when the resistance value is low compared to a predetermined reference resistance value.

  Instead, the determination unit 170 stores the resistance value of the switch device 100 that is operating normally or the resistance value measured last time, and compares the resistance value measured this time with a predetermined reference range. If the resistance value fluctuates greatly, it may be determined to deposit a protective metal. Instead, the determination unit 170 may make a determination according to a flowing current or a dropped voltage by passing a predetermined voltage or current between the first contact 10 and the second contact 20.

  Instead, the measurement unit 160 may measure the switching speed of the switch device 100, and the determination unit 170 may determine to supplement the protective metal according to the switching speed being equal to or higher than the reference time. . Here, the measurement unit 160 measures the time until the current flowing between the wiring layer 150a and the wiring layer 150b becomes equal to or higher than the first reference current to become equal to or lower than the second reference current, and the switch device 100 is turned on. The switching speed that changes from the state to the OFF state may be measured. When the contact time between the contacts tends to be gradually delayed until the pseudo contact between the contacts occurs, the determination unit 170 makes a determination based on the switching speed from the ON state to the OFF state. It is possible to prevent imitation.

  When depositing the protective metal, the switch device 100 drives the movable part 110 to separate the first contact 10 and the second contact 20 and turns off the switch (S330). The heater control unit 250 turns on the heater power supply unit 240 to heat the metal supply layer 143, the contact layer 130, and the protective conductive layer 120 (S340). By the heating, the protective metal of the metal supply layer 143 is diffused as a diffusion metal into the contact layer 130 and eventually reaches the protective conductive layer 120 and precipitates. That is, the protective conductive layer 120 is formed by depositing a protective metal from the metal supply layer 143 through the contact layer 130.

  The heater control unit 250 may turn off the heater power supply unit 240 in response to the elapse of a predetermined time. Here, the amount of deposited metal in the protective conductive layer 120 is determined according to the heating area of the heating unit 146, the heating temperature, the heating time, the layer thickness of 130, and the like. In the heater control unit 250, a heating temperature and a heating time corresponding to the heating area of the heating unit 146, the layer thickness of 130, and the like may be set in advance.

  The metal supply unit 140 supplements the protective conductive layer 120 with a protective metal while the first contact 10 and the second contact 20 are separated from each other, and the movable unit 110 supplements the protective conductive layer 120 with a protective metal. In response to this, the first contact 10 and the second contact 20 are aged by contacting and separating at least once or multiple times (S350). As a result, the switch device 100 can be switched with a stable contact resistance.

  Next, the switch device 100 returns to Step S300, and the measurement unit 160 supplements the protective conductive layer 120 with a protective metal, and then the first contact 10 and the second contact 20 are in contact with each other. The resistance between the second contact 20 and the second contact 20 is measured again, and the determination unit 170 determines that the protective conductive layer 120 is supplemented with a protective metal again when the measured resistance is less than the reference. The switch device 100 may repeat the above operation until the determination by the determination unit 170 obtains a result that the metal for protection is not supplemented.

  When the protective conductive layer 120 does not need to supplement the protective metal, the switch device 100 drives the movable part 110 to separate the first contact 10 and the second contact 20 and turn off the switch. In this state, the metal deposition on the protective conductive layer 120 is terminated (S360). As a result, the switch device 100 can repair the wear of the protective conductive layer 120 caused by repeated ON / OFF operations and the like, and can prevent false contact between the contacts. That is, the switch device 100 according to the present embodiment prevents the false contact between the contacts even if the number of ON / OFF operations of the switch is repeated while suppressing the false contact between the contacts without increasing the contact resistance of the contact. be able to.

  The switch device 100 may execute the above operation flow in an operation test stage after the switch device 100 is manufactured, or may be periodically executed as a diagnostic test after the switch device 100 is mounted on the device or the like. Good. Alternatively, it may be executed every predetermined number of switching operations.

  In the above switch device 100 of the present embodiment, the example in which the heating unit 146 is provided between the metal supply layer 143 and the wiring layer 150 has been described, but instead, the heating unit 146 has the second contact point of the wiring layer 150. 20, the metal supply layer 143 may be heated from the back surface side of the wiring layer 150 via the wiring layer 150. As a result, the switch device 100 can omit the opening 230 and can simplify the formation of the insulating portion 220. Moreover, the switch apparatus 100 can also form the heating part 146 by another process, and can simplify the manufacturing process of the switch apparatus 100. FIG.

  The switch device 100 according to the present embodiment has been described with respect to the example in which the switching operation is performed by one first contact 10 and two second contacts 20 corresponding to one first contact 10. Instead, the switch device 100 includes a plurality of first contacts 10 and a plurality of second contacts 20 that operate independently or simultaneously corresponding to the plurality of first contacts 10, and the heating unit 146 includes a plurality of first contacts 10. The metal supply layer 143 and the contact layer 130 corresponding to the two contacts 20 may be heated simultaneously. As a result, the switch device 100 has a plurality of switches, suppresses pseudo-contact between the contacts without increasing the contact resistance of the plurality of switches, and simulates the contacts even if the number of ON / OFF operations of the switches is repeated. Wearing can be prevented.

  The heating unit 146 of this embodiment described above includes the heater 210 and has been described as being provided between the metal supply layer 143 and the wiring layer 150. Instead, the heating unit 146 may heat the contact layer 130 and the metal supply layer 143 by irradiating at least one of the contact layer 130 and the metal supply layer 143 with a laser. Accordingly, the switch device 100 can make the heating unit 146 independent of the switch device 100, and can simplify the manufacturing process of the switch device 100.

  Instead, the heating unit 146 includes a heater 210 and a laser, and may be heated by both the heater 210 and the laser. The heating unit 146 may be a light source such as an LED or a lamp instead of the laser. The heating unit 146 can intensively heat the worn portion of the protective conductive layer 120 by using a light source that can be easily focused in a beam shape or locally with an optical system such as a lens.

  In the switch device 100 of this embodiment described above, the example in which the second contact 20 forming the protective conductive layer 120 is a fixed contact has been described. Alternatively, the second contact 20 may be a movable contact that is moved by the movable unit 110, and the first contact 10 may be a fixed contact provided on a substrate that holds the movable unit 110.

  The heating unit 146 of the present embodiment has been described as an example in which the metal supply layer 143 is heated. Instead, the heating unit 146 may perform heating of the metal supply layer 143 and heating of the movable unit 110 when the movable unit 110 is thermally driven. For example, when the movable part 110 is thermally driven, the movable part 110 has a heater. Therefore, the movable part 110 is provided with a metal supply layer 143, a contact layer 130, and a protective conductive layer 120 in order so that a protective metal is deposited on the first contact 10 of the movable part 110. Form.

  Accordingly, the heater that drives the movable unit 110 can also be used as the heating unit 146 that deposits a protective metal on the first contact. Here, the switch device 100 may be a switch that heats when the first contact 10 and the second contact 20 are separated from each other to be turned off. As a result, the heating unit 146 can heat the first contact 10 and the second contact 20 while keeping the first contact 10 and the second contact 20 apart when heating the first contact 10 to deposit a protective metal.

  Further, the heating unit 146 is movable to a higher temperature than when the first contact 10 and the second contact 20 are separated from each other when the protective conductive layer 120 is supplemented with a protective metal. The part 110, the metal supply layer 143, and the contact layer 130 are heated. As a result, the switch device 100 increases the heating temperature when supplementing the protective metal, and lowers the heating temperature when driving the movable part 110, so that each control is executed by one heating unit 146. can do.

  FIG. 4 shows a manufacturing flow of the switch device 100 according to the present embodiment. First, the wiring layer 150 is formed on the surface of the substrate (S400). The substrate may be an insulator or a dielectric, and as an example may be a glass substrate. The wiring layer 150 may include a through via that is electrically connected to the back surface of the substrate. For example, the wiring layer 150 may be formed by a plating method.

  Next, a heating unit 146 for heating the metal supply layer 143 and the contact layer 130 is formed on the upper surface of the wiring layer 150 (S410). A metal supply layer 143 is formed on the upper surface of the heating unit 146 to supplement the protective conductive layer 120 with a protective metal (S420). For example, the metal supply layer 143 may be formed by a sputtering method.

  The contact layer 130 of the second contact 20 on the opposite side of the first contact 10 is formed on the upper surface of the metal supply layer 143 (S430). For example, the contact layer 130 may be formed by sputtering.

  Next, the protective conductive layer 120 is formed on the surface of the second contact 20 (S440). Here, the protective conductive layer 120 heats the metal supply layer 143 and the contact layer 130 to deposit a protective metal from the metal supply layer 143 through the contact layer 130 to the opposite side of the metal supply layer 143. May be formed. As a result, the second contact 20 in which the protective conductive layer 120 is provided on the surface in contact with the first contact 10 is formed.

  Next, the movable part 110 that contacts or separates the first contact 10 and the second contact 20 is formed. The movable part 110 may be formed on a semiconductor substrate such as silicon by a process different from that of the second contact 20. The switch device 100 may be formed by bonding a substrate on which the second contact 20 is formed and a substrate on which the movable part 110 is formed. In this case, the two substrates may be bonded by anodic bonding. The switch device 100 may be hermetically sealed to prevent dirt or foreign matter from adhering to the contact surface.

  The switch device 100 manufactured by the above flow heats the metal supply layer 143 and the contact layer 130 by the heating unit 146 after manufacture, and protects the protective conductive layer 120 from the metal supply layer 143 through the contact layer 130. Deposit metal for use. As a result, the switch device 100 can prevent false contact between the contacts even if the number of ON / OFF operations of the switch is repeated after manufacturing.

  FIG. 5 shows a configuration example of the test apparatus 510 according to this embodiment together with the device under test 500. The test apparatus 510 tests at least one device under test 500 such as an analog circuit, a digital circuit, an analog / digital mixed circuit, a memory, and a system on chip (SOC). The test apparatus 510 inputs a test signal based on a test pattern for testing the device under test 500 to the device under test 500, and the device under test based on an output signal output from the device under test 500 according to the test signal. The quality of 500 is judged.

  The test apparatus 510 includes a test unit 520 and a signal input / output unit 530. The test unit 520 tests the device under test 500 by exchanging electrical signals with the device under test 500. The test unit 520 includes a test signal generation unit 523 and an expected value comparison unit 526.

  The test signal generator 523 generates a plurality of test signals to be supplied to the device under test 500. The test signal generator 523 may generate an expected value of the response signal output from the device under test 500 according to the test signal. The test signal generator 523 may be connected to the plurality of devices under test 500 via the signal input / output unit 530 to test the plurality of devices under test 500.

  The expected value comparison unit 526 compares the received data value received by the signal input / output unit 530 with the expected value. The expected value comparison unit 526 may receive the expected value from the test signal generation unit 523. The test apparatus 510 may determine pass / fail of the device under test 500 based on the comparison result of the expected value comparison unit 526.

  The signal input / output unit 530 is connected to one or more devices under test 500 and exchanges test signals between the test apparatus 510 and the devices under test 500. The signal input / output unit 530 may be a performance board on which a plurality of devices under test 500 are mounted. The signal input / output unit 530 includes the switch device 100.

  The switch device 100 is provided between the test unit 520 and the device under test 500 and electrically connects or disconnects between the test unit 520 and the device under test 500. The test apparatus 510 may perform electrical connection or disconnection by the switch apparatus 100 according to the present embodiment. As a result, the test apparatus 510 can perform a test using the switch apparatus 100 that is a contact having a low contact resistance and can prevent false contact between the contacts even if the number of ON / OFF operations of the switch is repeated. That is, the test apparatus 510 can perform transmission and switching of electric signals with low loss and long life.

  In this embodiment, the signal input / output unit 530 is connected to one device under test 500, and one switch device 100 is provided for each of the input signal line and the output signal line of one device under test 500. . Instead, the signal input / output unit 530 may be connected to a plurality of devices under test 500, and one switch device 100 may be provided for each of the input signal lines and the output signal lines of the plurality of devices under test 500. When one signal input / output line is connected from the signal input / output unit 530 to one device under test 500, one switch device 100 may be provided for one input / output line.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

10 First contact, 20 Second contact, 100 Switch device, 110 Movable part, 120 Protective conductive layer, 130 Contact layer, 140 Metal supply part, 143 Metal supply layer, 146 Heating part, 150 Wiring layer, 160 Measurement part, 170 Determination unit, 210 heater, 220 insulation unit, 230 opening, 240 heater power supply unit, 250 heater control unit, 260 metal supply layer arrangement, 270 second contact arrangement, 500 device under test, 510 test apparatus, 520 test unit 523 Test signal generator 526 Expected value comparator 530 Signal input / output unit

Claims (20)

A switch device comprising a first contact and a second contact provided with a protective conductive layer on a surface in contact with the first contact,
A movable part for contacting or separating the first contact and the second contact;
A metal supply unit that supplements the protective conductive layer with a protective metal;
Equipped with a,
The metal supply unit is
A metal supply layer containing a protective metal;
A heating unit for heating the metal supply layer and the second contact to deposit a protective metal from the metal supply layer to the protective conductive layer;
Switch devices that have a. The second contact has a contact layer including a contact metal,
The switch device according to claim 1, wherein the metal supply unit deposits a protective metal from the side opposite to the first contact to the first contact side through the contact layer. The metal supply layer overlaps the contact layer on the opposite side of the first contact ;
The heating unit heats the metal supply layer and the contact layer, the switch according to 請 Motomeko 2 to deposit a metal for protection to the protective conductive layer through the contact layer from the metal supply layer apparatus.   The switch device according to claim 3, wherein the heating unit includes a heater that heats the metal supply layer from a side opposite to the contact layer. The heater is formed on the opposite side of the metal supply layer from the contact layer by drawing a heater wire that generates heat when an electric current is passed,
The switch device according to claim 4, wherein the heating unit further includes an insulating unit that electrically insulates between the heater wire and the metal supply layer. The heater is provided between a wiring layer that transmits a signal that passes through the switch device, and the metal supply layer,
6. The switch device according to claim 5, wherein the insulating portion includes an opening portion for conducting the wiring layer and the metal supply layer in at least a partial region of the metal supply layer in the surface direction. The switch device includes a plurality of the first contacts and a plurality of the second contacts corresponding to the plurality of first contacts,
The switch device according to any one of claims 3 to 6, wherein the heating unit simultaneously heats the metal supply layer and the contact layer corresponding to the plurality of second contacts. The switch device according to any one of claims 3 to 7, wherein the heating unit heats the contact layer and the metal supply layer by irradiating at least one of the contact layer and the metal supply layer with a laser. . A measuring unit for measuring a resistance between the first contact and the second contact in a state where the first contact and the second contact are in contact;
A determination unit that determines whether or not the protective conductive layer is supplemented with a protective metal based on the measured resistance value;
The switch device according to any one of claims 3 to 8, further comprising: The contact metal contained in the second contact has higher conductivity than the protective metal,
The switch device according to claim 9, wherein the determination unit determines to supplement the protective conductive layer with a protective metal when the measured resistance is less than a reference. The measurement unit again measures the resistance between the first contact and the second contact in a state where the first contact and the second contact are in contact with each other after supplementing the protective conductive layer with a protective metal. ,
The switch device according to claim 10, wherein the determination unit determines to supplement the protective conductive layer again with a protective metal when the measured resistance is less than a reference. The metal supply unit supplements the protective conductive layer with a protective metal in a state where the first contact and the second contact are separated from each other,
The movable part is aged by contacting and separating the first contact and the second contact at least once according to the fact that a protective metal is supplemented to the protective conductive layer. switching device according to one paragraph or. The first contact is a movable contact moved by the movable part,
The second contact is a fixed contact provided on a substrate that holds the movable part.
The switch device according to any one of claims 3 to 12. The second contact is a movable contact moved by the movable part,
The first contact is a fixed contact provided on a substrate that holds the movable part.
The switch device according to any one of claims 3 to 12. The movable part includes a bimorph that brings the first contact and the second contact into contact with each other in an unheated state and separates the second contact from the first contact when heated.
In the case where the heating unit separates the first contact and the second contact to be in the off state and when the protective conductive layer is supplemented with a protective metal, the movable unit, the metal supply layer, and The switch device according to claim 14, wherein the contact layer is heated.   When the heating unit supplements the protective conductive layer with a protective metal, the movable unit is heated to a higher temperature than when the first contact and the second contact are separated and turned off. The switch device according to claim 15, wherein the metal supply layer and the contact layer are heated. A test apparatus for testing a device under test,
A test unit for exchanging electrical signals with the device under test to test the device under test;
The switch device according to any one of claims 1 to 16, which is provided between the test unit and the device under test, and electrically connects or disconnects between the test unit and the device under test.
A test apparatus comprising: A switch method using the switch device according to any one of claims 1 to 16,
A movable step of contacting or separating the first contact and the second contact;
A metal supply stage for supplementing the protective conductive layer with a protective metal;
A switch method comprising: A method of manufacturing a switch device comprising a first contact and a second contact that contacts the first contact,
Forming a protective conductive layer on the surface of the second contact;
Forming a metal supply part for forming a metal supply part that supplements the protective metal with respect to the protective conductive layer;
A movable part forming step of forming a movable part for contacting or separating the first contact and the second contact;
Equipped with a,
The metal supply part forming step includes:
A metal supply layer forming step of forming a metal supply layer including a protective metal, which is overlapped with a contact layer of the second contact on the opposite side of the first contact;
A heating part forming step of forming a heating part for heating the metal supply layer and the contact layer after manufacture to deposit a protective metal from the metal supply layer to the protective conductive layer via the contact layer; the method that have a. Before Symbol protective conductive layer forming step, the metal supply layer and by heating the contact layer, by depositing a metal for protection from the metal supply layer to the opposite side of the metal supply layer through the contact layer forming said protective conductive layer, the method according to 請 Motomeko 19, wherein the protective conductive layer on the first contact point and the contact surface to form a second contact provided.

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