JP5477255B2 - Component mounting method - Google Patents

Description

  The present invention relates to a component mounting method for mounting a component on a board positioned on a board conveyance path.

  The component mounting apparatus picks up components supplied from a component supply unit and a component supply unit that are provided on the side of the substrate transfer route, which are provided on the side of the substrate transfer route, and works on the substrate transfer route. A mounting head for mounting the component on the substrate positioned at the position is provided. In addition, an image of the component picked up by the mounting head is imaged between the board conveyance path and the component supply unit to inspect whether there is an abnormality in the component, and to determine the positional displacement (suction displacement) of the component with respect to the mounting head. A component camera is provided, and the mounting head picks up the component supplied from the component supply unit, then moves above the component camera in a direction parallel to the substrate conveyance direction by the substrate conveyance path, and picks up the component Operates so as to be imaged by the component camera (for example, Patent Document 1).

  In the conventional component mounting apparatus having such a configuration, the component supply unit includes an upstream component supply unit located on the upstream side of the board transfer direction by the board transfer path and the board transfer direction by the board transfer path. The downstream component supply unit is located on the downstream side, and the upstream component supply unit supplies components to be mounted on one type (first type) of the board, and the downstream component supply unit is different from that. Parts supply at the time of model switching from the first type board to the second type board (or vice versa) by supplying parts to be mounted on the board of the second type (second type) There has been known one in which the setup work on the part side is omitted and smooth workability is obtained.

  Here, the path that is followed after the mounting head picks up the component from the component supply unit and mounts the component on the board positioned on the board transfer path is the movement of the part camera from the pickup point above the component camera. The first movement path to the movement start point, the second movement path from the movement start point of the movement above the component camera to the movement end point, and the first movement path from the movement end point of the movement above the component camera to the substrate The movement path of the mounting head consisting of the first movement path, the second movement path, and the third movement path is a zigzag shape with a large deflection (the length of each linear portion is large, respectively). If the path length of the moving path is shorter than the zigzag shape, the tact time of component mounting becomes shorter. Therefore, the first movement path and the second movement path are opposite to each other and the first movement path is long, and the second movement path and the third movement path are opposite to each other and the third movement path is long. In such a movement route, the tact time required for component mounting increases.

JP 2009-259886 A

  However, as described above, the component supply unit has an upstream component supply unit located on the upstream side in the substrate conveyance direction by the substrate conveyance path, and a downstream component located on the downstream side in the substrate conveyance direction by the substrate conveyance path. And an upstream component supply unit that supplies components to be mounted on the first type of substrate, and a downstream component supply unit supplies components to be mounted on the second type of substrate. In the component mounting apparatus, the direction in which the mounting head passes above the component camera is constant, for example, the direction in which the mounting head passes above the component camera is constant in the direction from the upstream side to the downstream side in the transport direction by the board transport path. When the component picked up from the downstream component supply unit is mounted on the second type substrate, the movement path of the mounting head is that the component picked up from the upstream component supply unit is the first type. The path length is significantly longer than the movement path of the mounting head when mounted on the substrate, and the tact time is increased because the movement path is often in a zigzag shape with a large deflection, There is a problem that the productivity of the substrate is lowered accordingly.

  Therefore, the present invention prevents an increase in the tact time of component mounting when the component supply unit is composed of an upstream component supply unit and a downstream component supply unit, and can improve the productivity of the board. An object is to provide a component mounting method.

  According to a first aspect of the present invention, there is provided a component mounting method comprising: a substrate conveyance path that conveys a substrate; a component supply unit that is provided on a side of the substrate conveyance path to supply components; and a substrate conveyance path and a component supply unit. The component camera provided between them and the component supplied from the component supply unit are picked up and moved above the component camera in a direction parallel to the substrate conveyance direction by the substrate conveyance path. And a mounting head for mounting a component on a substrate positioned at a work position on the substrate conveyance path, and the component supply unit is located upstream of the substrate conveyance direction along the substrate conveyance path. An upstream component supply unit that supplies components to be mounted on one type of board and a component that is mounted on the second type of board located on the downstream side in the board transfer direction by the board transfer path. Downstream part supply section A component mounting method using the component mounting apparatus, the step of positioning the first type substrate carried in by the substrate transport path at a downstream work position in the substrate transport direction on the substrate transport path, and an upstream component supply unit After picking up the parts to be supplied and moving from the upstream side to the downstream side in the board transfer direction of the board by the board transfer path so that the picked-up parts are imaged by the parts camera, A step of mounting the first type substrate positioned at the downstream work position on the substrate transfer path, and a second type of substrate loaded by the substrate transfer path on the upstream side of the substrate transfer direction on the substrate transfer path The process of positioning to the work position and the parts supplied from the downstream part supply unit are picked up, and the upper part of the parts camera is moved from the downstream side to the upstream side in the board transfer direction by the board transfer path. Only move, after picked-up component is to be imaged by the component camera, and a step of mounting the second type of substrate which is positioned in the working position of the upstream side of the substrate transport path.

  In the present invention, when a component is mounted on the first type substrate on which the component supplied by the upstream component supply unit is mounted, the first type substrate is positioned at a downstream work position on the substrate transport path. At the same time, the mounting head that picks up the component from the upstream component supply unit moves above the component camera from the upstream side to the downstream side in the substrate conveyance direction by the substrate conveyance path so that imaging by the component camera is performed. When the component is mounted on the second type substrate on which the component supplied by the downstream component supply unit is mounted, the second type substrate is positioned at the upstream work position on the substrate transfer path, and the downstream side. The mounting head that picks up the component from the side component supply unit moves above the component camera from the downstream side to the upstream side in the substrate conveyance direction through the substrate conveyance path, and the component camera picks up the image. Since the mounting head picks up components from the upstream component supply unit and mounts them on the first substrate positioned at the downstream work position on the substrate transport path, the mounting head moving path; There are few cases where the moving path of the mounting head is a zigzag shape with a large shake when picking up components from the downstream component supply unit and mounting them on the second substrate positioned at the upstream work position on the substrate transport path. In addition, the average length of the moving path of the mounting head is equal to each other in both component supply units. For this reason, when the component supply unit includes an upstream component supply unit and a downstream component supply unit, it is possible to prevent an increase in tact time of component mounting, and to improve the productivity of the board.

The top view of the component mounting apparatus in one embodiment of this invention The side view of the component mounting apparatus in one embodiment of this invention The perspective view of the board | substrate conveyance path with which the component mounting apparatus in one embodiment of this invention is equipped, and a mounting head The top view of the board | substrate conveyance path with which the component mounting apparatus in one embodiment of this invention is provided (A) (b) Side view of the board | substrate conveyance path and lower receiving unit with which the component mounting apparatus in one embodiment of this invention is provided. The top view of the board | substrate conveyance path with which the component mounting apparatus in one embodiment of this invention is equipped, and a component supply part The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention (A) (b) The top view of the positioning conveyor with which the component mounting apparatus in one embodiment of this invention is provided The flowchart which shows the execution procedure of the component mounting process which the component mounting apparatus in one embodiment of this invention performs (A) (b) The figure which shows the movement path | route until the mounting head of the component mounting apparatus in one embodiment of this invention picks up a component and mounts it on a board | substrate.

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting apparatus 1 shown in FIG. 1 and FIG. 2 is a kind of component mounting apparatus that forms a component mounting line with other component mounting apparatuses (not shown) such as a solder printing machine, an inspection machine, and a reflow furnace. A substrate 2 sent from another component mounting apparatus (for example, a solder printer or another component mounting apparatus) is carried in, and a component (electronic component) 4 is placed on the electrode 3 provided on the surface of the substrate 2. After performing the component mounting work to be mounted, the operation of carrying out the board 2 to another component mounting device (for example, another component mounting device, an inspection machine, a reflow furnace, etc.) on the downstream side not shown is continuously executed. .

  First, for convenience of explanation, a direction based on the component mounting apparatus 1 is defined. In the present embodiment, the conveyance direction of the substrate 2 in the component mounting apparatus 1 (the direction of the flow of the substrate 2 in the component mounting line. The direction in which the arrow A in FIG. 1 faces) is the X axis direction, and the horizontal plane orthogonal to the X axis direction. The inward direction is the Y-axis direction, and the up-down direction is the Z-axis direction. Further, the Y-axis direction is the front-rear direction of the component mounting apparatus 1 and the X-axis direction is the lateral (left-right) direction, and the operator OP (FIG. 1) performs the operation on the component mounting apparatus 1 in the front-rear direction (see FIG. 1). 1 is the front side of the component mounting apparatus 1 and the opposite side (upper side of the paper surface in FIG. 1) is the rear side. When the component mounting apparatus 1 is viewed from the operator OP, the left side in the horizontal direction (left side in FIG. 1) is the upstream side in the transport direction of the substrate 2, and the right side in the horizontal direction (right side in FIG. 1) is the transport direction in the substrate 2. On the downstream side.

  1 and 2, the component mounting apparatus 1 includes a base 11, a board transport path 12 that is provided on the base 11 and transports the board 2 in the X-axis direction, and the board transport path 12 in the Y-axis direction. A component supply unit 13 provided on each of the both sides for supplying the component 4 and two mounting heads 14 as component mounting units for picking up the components 4 supplied from the component supply unit 13 and mounting them on the substrate 2 ( A front side mounting head 14F and a rear side mounting head 14R). The two mounting heads 14 are moved independently of each other by a head moving robot 15 comprising an XY robot provided on the base 11.

  1 and 2, each mounting head 14 is provided with a substrate camera 16 with the imaging field of view facing downward (see also FIG. 3). The substrate transport path 12 on the base 11 and each component supply unit 13 are provided. In each of the two regions between the two, a component camera 17 having an imaging field of view upward is provided.

  3 and 4, in the substrate transport path 12, a carry-in conveyor 12a, a positioning conveyor 12b, and a carry-out conveyor 12c that transport the substrate 2 in the X-axis direction are arranged in this order in the transport direction (X-axis direction) of the substrate 2. Made up.

  3 and 5 (a) and 5 (b), the positioning conveyor 12b provided in the substrate transport path 12 includes a pair of positioning conveyor support members 21 provided on the base 11 so as to face each other in the Y-axis direction, and these It comprises a pair of conveyor frames 22 supported by a pair of positioning conveyor support members 21 and a pair of belt conveyors 23 attached to the pair of conveyor frames 22. The pair of belt conveyors 23 are driven synchronously to carry the substrate 2 while supporting both ends of the substrate 2 from below. Overhanging portions 21 a that project and extend inward in the Y-axis direction (direction toward the middle portion of the pair of belt conveyors 23) are provided at the upper ends of the pair of positioning conveyor support members 21.

  5 (a) and 5 (b), a lower receiving unit 24 having a plurality of receiving pins 24a extending upward from the upper surface is installed on the base 11 below the pair of belt conveyors 23. The cylinder 25 can be moved up and down (see also FIG. 3).

  5 (a) and 5 (b), when the lower receiving unit 24 is raised by the elevating cylinder 25, a plurality of lower receiving pins 24a of the lower receiving unit 24 come into contact with the lower surface of the substrate 2 from below, and further the lower receiving unit 24 When the unit 24 is raised, the upper surfaces of both ends of the substrate 2 pushed up by the plurality of receiving pins 24a come into contact with the overhanging portions 21a of the pair of conveyor support members 21 from below (FIG. 5 (a) → FIG. 5 (b). )). As a result, the substrate 2 is in a holding state in which the center portion of the lower surface is supported by the lower receiving pins 24a and both ends are sandwiched between the protruding portions 21a of the pair of conveyor support members 21 and the lower receiving pins 24a. That is, in the present embodiment, the pair of overhanging portions 21 a extending from the pair of positioning conveyor support members 21, the lower receiving unit 24, and the lifting cylinder 25 constitute a substrate holding mechanism 26 that holds the substrate 2 on the positioning conveyor 12 b. Yes.

  1 and 2, the head moving robot 15 is provided so as to be movable in the Y-axis direction on the Y-axis table 15a provided on the substrate transport path 12 so as to extend across the Y-axis direction. It consists of two front and rear X-axis tables 15b extending in the X-axis direction and two movement stages 15c provided on each X-axis table 15b so as to be movable in the X-axis direction. A mounting head 14F is attached, and a rear mounting head 14R is attached to the moving stage 15c located on the rear side. Each mounting head 14 is provided with a plurality of suction nozzles 14 </ b> N (see also FIG. 3) extending downward so as to be able to rotate up and down and about a vertical axis (Z axis).

  In FIG. 6, each component supply unit 13 includes an upstream component supply unit 13 a located on the upstream side in the conveyance direction (X-axis direction) of the substrate 2 by the substrate conveyance path 12 and the conveyance direction of the substrate 2 by the substrate conveyance path 12. The downstream part supply unit 13b is located on the downstream side. Here, the upstream component supply unit 13a supplies the component 4 to be mounted on the first type substrate 2 on which the component mounting apparatus 1 plans to mount the component 4, and the downstream component supply unit 13b The component mounting apparatus 1 supplies the component 4 to be mounted on the second type substrate 2 different from the first type substrate 2 on which the component 4 is scheduled to be mounted. Each of the upstream-side component supply unit 13a and the downstream-side component supply unit 13b includes a plurality of tape feeders 27 arranged side by side in the X-axis direction.

  As shown in FIGS. 1 and 6, the plurality of tape feeders 27 constituting each component supply unit 13 are arranged on a carriage Cg that can be run on the floor surface by the operator OP operating a pair of handle portions Hd. When the operator connects the carriage Cg to the base 11, the plurality of tape feeders 27 are collectively mounted on the base 11. Each tape feeder 27 pitches a tape member (not shown) in which the component 4 is stored, thereby feeding a component to a component supply port 27p provided at the end of the base 11 on the center side (board conveyance path 12 side). 4 is fed continuously. The pair of handle portions Hd provided on the carriage Cg are folded downward in FIGS. 1 and 2, but can be expanded upward in use.

  The substrate 2 is transported by the carry-in conveyor 12a, the positioning conveyor 12b and the carry-out conveyor 12c constituting the substrate transport path 12, and the positioning operation to the predetermined work position WA (FIG. 4) on the substrate transport path 12 (on the positioning conveyor 12b) is as follows. The operation control unit 40a (FIG. 7) of the control device 40 (FIG. 7) provided in the component mounting apparatus 1 controls the operation of the conveyor drive mechanism 41 (FIG. 7) composed of an actuator (not shown) provided on the board conveyance path 12. Made by doing. The holding and releasing operation of the substrate 2 positioned on the positioning conveyor 12b is performed when the work execution control unit 40a of the control device 40 controls the operation of the lifting cylinder 25 to raise and lower the receiving unit 24.

  The supply operation of the component 4 to the component supply port 27p by each tape feeder 27 constituting the component supply unit 13 is performed by a work drive control unit 40a of the control device 40 of a feeder drive mechanism 42 (FIG. 7) including an actuator (not shown). This is done by performing operation control. Each tape feeder 27 is electrically connected to the control device 40 in a state where the carriage Cg is coupled to the base 11, and the operation of each tape feeder 27 can be controlled by the control device 40 via the feeder drive mechanism 42.

  The movement operation of each mounting head 14 in the horizontal plane by the head moving robot 15 is performed by the work execution control unit 40a of the control device 40 controlling the operation of the head moving robot drive mechanism 43 (FIG. 7) including an actuator (not shown). This is done by combining the movement in the Y-axis direction of each X-axis table 15b with respect to the Y-axis table 15a and the movement in the X-axis direction of each moving stage 15c with respect to each X-axis table 15b.

  The suction operation of each suction nozzle 14N provided in each mounting head 14 with respect to the mounting head 14 and the rotation around the vertical axis is performed by a nozzle drive mechanism 44 (FIG. 7) formed by an actuator or the like that is not illustrated by the work execution control unit 40a of the control device 40. This is done by performing operation control.

  The pickup (suction) and detachment (suction release) operations of the component 4 by each suction nozzle 14N provided in each mounting head 14 are performed by a suction mechanism 45 (FIG. 7) including an actuator (not shown) by the work execution control unit 40a of the controller 40. Is performed by supplying the vacuum pressure into the suction nozzle 14N and releasing the supply of the vacuum pressure.

  The imaging operation by the board camera 16 and the component camera 17 is controlled by the work execution control unit 40a of the control device 40 (FIG. 7). The image data obtained by the imaging operations of the board camera 16 and the component camera 17 is taken into the image data storage unit 40b (FIG. 7) of the control device 40, and receives an instruction from the work execution control unit 40a. In FIG. 7), image recognition processing is performed.

  As will be described later, the two mounting heads 14 (the front mounting head 14F and the rear mounting head 14R) are respectively controlled by the work execution control unit 40a of the control device 40, and the component supply unit 13 (each tape feeder 27). The component 4 to be supplied is picked up and moved above the component camera 17 in a direction parallel to the conveyance direction (X-axis direction) of the substrate 2 by the substrate conveyance path 12 so that the component 4 is imaged by the component camera 17. After that, the operation of mounting the component 4 on the substrate 2 held by the substrate holding mechanism 26 at the work position WA on the substrate conveyance path 12 is repeatedly executed.

  8A and 8B, a tip detection sensor 50a is provided at a position downstream of the positioning conveyor 12b in the substrate transport path 12, and a position upstream of the positioning conveyor 12b in the substrate transport path 12 is provided. Is provided with a rear end detection sensor 50b (see also FIG. 4).

  The front end detection sensor 50a crosses the inspection light La projected in the Y-axis direction by a front end portion (hereinafter simply referred to as a front end portion) 2a in the traveling direction of the substrate 2 that is transported in the X-axis direction by the positioning conveyor 12b. By detecting this state, it is detected that the front end 2a of the substrate 2 has reached a predetermined position (a position where the inspection light La is crossed). Further, the rear end detection sensor 50b is configured such that the inspection light Lb projected in the Y-axis direction is conveyed in the X-axis direction by the positioning conveyor 12b in the advancing direction of the substrate 2 (hereinafter simply referred to as the rear end portion). The state crossed by 2b is detected to detect that the rear end 2b of the substrate 2 has reached a predetermined position (position where the inspection light Lb is crossed). Detection information that the front end 2a of the substrate 2 has reached a predetermined position (position where the inspection light La of the front end detection sensor 50a crosses) is detected by the front end detection sensor 50a, and the detection of the substrate 2 by the rear end detection sensor 50b. Detection information indicating that the rear end 2b has reached a predetermined position (a position where the inspection light Lb of the rear end detection sensor 50b crosses) is input to the control device 40 (FIG. 7).

  Here, the position of the substrate 2 when the front end portion 2a of the substrate 2 is detected by the front end portion detection sensor 50a is the position of the substrate 2 when the rear end portion 2b of the substrate 2 is detected by the rear end portion detection sensor 50b. It is located downstream from the position (FIGS. 8A and 8B). Therefore, the work execution control unit 40a of the control device 40 detects the position of the substrate 2 via the conveyor drive mechanism 41 when the tip 2a of the substrate 2 conveyed in the X-axis direction by the positioning conveyor 12b is detected by the tip detection sensor 50a. If the operation of 12b is stopped, the substrate 2 can be positioned at the downstream work position WA (hereinafter referred to as the downstream position WAa) in the transport direction of the substrate 2 on the substrate transport path 12 (see FIG. a) and FIG. 4), the operation of the positioning conveyor 12b via the conveyor drive mechanism 41 when the rear end 2b of the substrate 2 conveyed in the X-axis direction by the positioning conveyor 12b is detected by the rear end detection sensor 50b. Is stopped, the substrate 2 is moved to the upstream work position WA (hereinafter referred to as the upstream position WAb) in the transport direction of the substrate 2 on the substrate transport path 12. Can be positioned in (FIGS. 8 (b) and 4).

  That is, the conveyor drive mechanism 41 whose operation is controlled by the front end detection sensor 50 a and the rear end detection sensor 50 b provided on the positioning conveyor 12 b and the work execution control unit 40 a of the control device 40 is carried in by the substrate transfer path 12. The downstream work position (downstream position WAa) in the transport direction (X-axis direction) of the substrate 2 on the substrate transport path 12 and the upstream work position in the transport direction of the substrate 2 on the substrate transport path 12 ( It functions as a substrate positioning mechanism 51 (FIG. 7) for positioning to any one of the upstream positions WAb). In the present embodiment, as will be described later, the substrate positioning mechanism 51 positions the first type substrate 2 carried in by the substrate transport path 12 to the downstream position WAa on the substrate transport path 12 to transport the substrate. The second type substrate 2 carried in by the path 12 is positioned at the upstream position WAb on the substrate transport path 12.

  Next, the execution procedure of the component mounting process executed by the control device 40 will be described with reference to the flowchart of FIG. The work execution control unit 40a of the control device 40 confirms that the board 2 has been put into the board conveyance path 12 from another upstream component mounting apparatus (for example, a solder printer or other component mounting apparatus 1 not shown). If detected, the operation of the conveyor drive mechanism 41 is controlled to operate the carry-in conveyor 12a, and the loaded substrate 2 is loaded into the substrate transfer path 12 (substrate loading step of step ST1 shown in FIG. 9). Then, the model data of the substrate 2 that has been loaded is read from a barcode or the like provided on the substrate 2 (the model data reading process at step ST2 shown in FIG. 9). It is determined whether or not it is one type of substrate 2 (model determination step of step ST3 shown in FIG. 9). And when the board | substrate 2 carried in was the 1st type board | substrate 2, the carrying-in conveyor 12a and the positioning conveyor 12b operate | move interlockingly, the board | substrate 2 on the carrying-in conveyor 12a is conveyed to the positioning conveyor 12b, The substrate 2 is positioned at the downstream position WAa by the positioning mechanism 51 (substrate positioning step of step ST4 shown in FIG. 9). Specifically, the work execution control unit 40a of the control device 40 stops the operation of the positioning conveyor 12b when the leading end portion 2a of the substrate 2 conveyed by the positioning conveyor 12b is detected by the leading end detection sensor 50a.

  The work execution control unit 40a of the control device 40 operates the substrate holding mechanism 26 after the first type substrate 2 is positioned at the downstream position WAa so that the substrate 2 is held at the downstream position WAa. (Substrate holding step of step ST5 shown in FIG. 9).

  After holding the substrate in step ST5, the work execution control unit 40a of the control device 40 controls the operation of the head moving robot drive mechanism 43 to move the substrate camera 16 (the mounting head 14) above the substrate 2. Then, a substrate mark (not shown) provided on the substrate 2 is imaged. Then, by causing the image recognition unit 40c to recognize the obtained image, a displacement of the substrate 2 from the normal work position (downstream position WAa) is detected (substrate displacement detection in step ST6 shown in FIG. 9). Process).

  In step ST6, when detecting the position shift of the substrate 2 positioned and held at the downstream side position WAa, the control device 40 controls the operation of the head moving robot drive mechanism 43 and moves the mounting head 14 to the upstream part supply unit 13a. It is moved upward, the operation control of the nozzle drive mechanism 44 is performed, and the suction nozzle 14N of the mounting head 14 is brought into contact with the component 4 supplied to the component supply port 27p of the tape feeder 27 of the upstream component supply unit 13a. The vacuum pressure is supplied to the suction nozzle 14N by controlling the operation of the suction mechanism 45, and the component 4 is picked up (sucked) by the suction nozzle 14N (pickup process in step ST7 shown in FIG. 9).

  When the control device 40 picks up the component 4 by the suction nozzle 14N, it controls the operation of the head moving robot drive mechanism 43, and the picked-up component 4 moves above the component camera 17 in the transport direction of the substrate 2 by the substrate transport path 12 ( The mounting head 14 (both the front mounting head 14F and the rear mounting head 14R) is moved so as to pass from the upstream side toward the downstream side in the X-axis direction (see arrow B shown in FIG. 10A). Then, the component camera 17 is caused to image the component 4. Then, the obtained image is recognized by the image recognition unit 40c, and the presence or absence of abnormality (deformation or defect) of the component 4 is inspected (image recognition process in step ST8 shown in FIG. 9). A positional deviation (adsorption deviation) with respect to the nozzle 14N is obtained (component adsorption deviation detection step in step ST9 shown in FIG. 9).

  When the component suction deviation detection process of step ST9 is completed, the control device 40 controls the operation of the head moving robot drive mechanism 43, and the upper part of the substrate 2 where the component 4 picked up by the suction nozzle 14N is positioned and held at the downstream position WAa. The mounting head 14 is moved so as to move to. Then, the work execution control unit 40a of the control device 40 controls the operation of the nozzle drive mechanism 44, and the target mounting position on the first type substrate 2 (which is positioned and held at the downstream position WAa (this) The electrode 3 at the target mounting position is brought into contact with a solder printing machine disposed on the upstream side of the component mounting apparatus 1), and the suction nozzle 45 is controlled by controlling the operation of the suction mechanism 45. The supply of the vacuum pressure to 14N is canceled, and the component 4 is mounted on the first type substrate 2 (component mounting step of step ST10 shown in FIG. 9).

  Here, when mounting the component 4 on the substrate 2, the work execution control unit 40a of the control device 40 corrects the positional deviation of the substrate 2 obtained in step ST6 and the adsorption deviation of the component 4 obtained in step ST9. As described above, the position correction (including rotation correction) of the suction nozzle 14N with respect to the substrate 2 is performed.

  When the component mounting process of step ST10 is completed, the control device 40 has completed mounting of all components 4 to be mounted on the substrate 2 positioned and held at the downstream position WAa by the front mounting head 14F and the rear mounting head 14R. Is determined (mounting end determination step of step ST11 shown in FIG. 9). As a result, the work execution control unit 40a of the control device 40 finishes mounting the substrate 2 positioned and held at the downstream position WAa of all the components 4 to be mounted by the front mounting head 14F and the rear mounting head 14R. If not, the steps ST7 to ST10 are repeated, and the front side mounting head 14F and the rear side mounting head 14R are mounted on the substrate 2 positioned and held at the downstream position WAa of all the components 4 to be mounted. If all the processing has been completed, the positioning conveyor 12b and the carry-out conveyor 12c are operated in an interlocked manner, and the board 2 is carried out of the component mounting apparatus 1 via the carry-out conveyor 12c (the board carry-out process in step ST12 shown in FIG. 9). ).

  On the other hand, in step ST3, the work execution control unit 40a of the control device 40, when the substrate 2 carried into the carry-in conveyor 12a is not the first type substrate 2, that is, the substrate 2 carried into the carry-in conveyor 12a is the second. In the case of the substrate 2 of this type, the carry-in conveyor 12a and the positioning conveyor 12b are operated in conjunction to transport the substrate 2 on the carry-in conveyor 12a to the positioning conveyor 12b, and the substrate positioning mechanism 51 moves the substrate 2 upstream. Positioning to the side position WAb (substrate positioning step of step ST13 shown in FIG. 9). Specifically, the work execution control unit 40a of the control device 40 stops the operation of the positioning conveyor 12b when the rear end portion 2b of the substrate 2 conveyed by the positioning conveyor 12b is detected by the rear end detection sensor 50b. Let

  After positioning the second type substrate 2 at the upstream position WAb, the work execution control unit 40a of the control device 40 operates the substrate holding mechanism 26 so that the substrate 2 is held at the upstream position WAb. (Substrate holding step of step ST14 shown in FIG. 9).

  When the work execution control unit 40a of the control device 40 holds the substrate in step ST14, the work execution control unit 40a controls the operation of the head moving robot drive mechanism 43 to move the substrate camera 16 above the substrate 2 and is provided on the substrate 2. The board mark is imaged. Then, by causing the image recognition unit 40c to recognize the obtained image, a displacement of the substrate 2 from the normal work position (upstream position WAb) is detected (substrate displacement detection of step ST15 shown in FIG. 9). Process).

  When the control device 40 detects a positional shift of the substrate 2 positioned and held at the upstream position WAb in step ST15, the control device 40 controls the operation of the head moving robot drive mechanism 43 to move the mounting head 14 above the downstream component supply unit 13b. And the operation of the nozzle drive mechanism 44 is controlled so that the suction nozzle 14N of the mounting head 14 is brought into contact with the component 4 supplied to the component supply port 27p of the tape feeder 27 of the downstream component supply unit 13b. By controlling the operation of the mechanism 45, the vacuum pressure is supplied to the suction nozzle 14N, and the component 4 is picked up by the suction nozzle 14N (pickup process of step ST16 shown in FIG. 9).

  When the control device 40 picks up the component 4 by the suction nozzle 14N, the control device 40 controls the operation of the head moving robot drive mechanism 43, and the picked-up component 4 moves above the component camera 17 in the transport direction of the substrate 2 by the substrate transport path 12. The mounting head 14 (both the front-side mounting head 14F and the rear-side mounting head 14R) is moved so as to pass from the downstream side toward the upstream side (see arrow C shown in FIG. 10B). The part 4 is imaged. Then, the obtained image is recognized by the image recognition unit 40c, the presence or absence of abnormality of the component 4 is inspected (image recognition step of step ST17 shown in FIG. 9), and the positional deviation of the component 4 with respect to the suction nozzle 14N ( (Adsorption deviation) is determined (component adsorption deviation detection step of step ST18 shown in FIG. 9).

  When the component suction deviation detection process of step ST18 is completed, the control device 40 controls the operation of the head moving robot drive mechanism 43, and the upper part of the substrate 2 where the component 4 picked up by the suction nozzle 14N is positioned and held at the upstream position WAb. The mounting head 14 is moved so as to move to. Then, the work execution control unit 40a of the control device 40 controls the operation of the nozzle drive mechanism 44 and contacts the target mounting position on the second type substrate 2 in which the picked-up component 4 is positioned and held at the upstream position WAb. At the same time, the vacuum pressure supply to the suction nozzle 14N is canceled by controlling the operation of the suction mechanism 45, and the component 4 is mounted on the second type substrate 2 (component mounting step of step ST19 shown in FIG. 9). ).

  Here, when mounting the component 4 on the substrate 2, the work execution control unit 40a of the control device 40 corrects the positional deviation of the substrate 2 obtained in step ST15 and the adsorption deviation of the component 4 obtained in step ST18. As described above, the position correction (including rotation correction) of the suction nozzle 14N with respect to the substrate 2 is performed.

  Here, as can be seen from FIGS. 10A and 10B, both the front mounting head 14 </ b> F and the rear mounting head 14 </ b> R pick up the component 4 from the upstream component supply unit 13 a and move it on the substrate conveyance path 12. The movement path (FIG. 10A) for mounting on the first type of substrate 2 positioned at the downstream side position WAa and the component 4 from the downstream side component supply unit 13b are picked up on the substrate conveyance path 12. The movement path (FIG. 10 (b)) for mounting on the second type substrate 2 positioned at the upstream position WAb is less likely to be a zigzag shape with large deflection, and the movement path of the mounting head 14 The average lengths of the path lengths of the upstream side component supply unit 13a and the downstream side component supply unit 13b are equal to each other.

  When the component mounting process of step ST19 is completed, the control device 40 has completed mounting of all components 4 to be mounted on the board 2 positioned and held at the upstream position WAb by the front mounting head 14F and the rear mounting head 14R. It is determined whether or not (mounting end determination step of step ST20 shown in FIG. 9). As a result, the work execution control unit 40a of the control device 40 finishes mounting the substrate 2 positioned and held at the upstream position WAb of all the components 4 to be mounted by the front mounting head 14F and the rear mounting head 14R. If not, the steps ST16 to ST19 are repeated, and mounting on the substrate 2 positioned and held at the upstream position WAb of all the components 4 to be mounted by the front mounting head 14F and the rear mounting head 14R is performed. If all the processing has been completed, the positioning conveyor 12b and the carry-out conveyor 12c are operated in an interlocked manner, and the board 2 is carried out of the component mounting apparatus 1 via the carry-out conveyor 12c (the board carry-out process in step ST12 shown in FIG. 9). ).

  The work execution control unit 40a of the control device 40 determines whether or not there is still a board 2 on which the component 4 is mounted after the board unloading process of step ST12 is completed (step ST21 shown in FIG. Process). As a result, when there is a board 2 on which the component 4 is mounted, the work execution control unit 40a of the control device 40 returns to step ST1 to carry in a new board 2 and mount the component 4 on the board 2. If there is no, the series of electronic component mounting work is finished.

  As described above, in the component mounting method according to the present embodiment, the first type of substrate 2 carried by the substrate conveyance path 12 is downstream of the substrate 2 conveyance direction (X-axis direction) on the substrate conveyance path 12. Positioning at the work position WA (downstream position WAa) (step ST4), the component 4 supplied from the upstream component supply unit 13a is picked up (step ST7), and the substrate transport path 12 is positioned above the component camera 17. The substrate 4 moves from the upstream side to the downstream side in the conveyance direction of the substrate 2 so that the picked-up component 4 is imaged by the component camera 17 (step ST8), and then the downstream position WAa on the substrate conveyance path 12 A step (step ST10) of mounting the first type substrate 2 positioned on the substrate 2 and the second type substrate 2 carried by the substrate transfer path 12 to the substrate 2 on the substrate transfer path 12 The step of positioning at the upstream work position WA (upstream position WAb) in the transport direction (step ST13), the component 4 supplied from the downstream component supply unit 13b is picked up (step ST16), and above the component camera 17 Is moved from the downstream side to the upstream side in the substrate 2 conveyance direction by the substrate conveyance path 12 so that the picked-up component 4 is imaged by the component camera 17 (step ST17), and then on the substrate conveyance path 12 This includes a step (step ST19) of mounting on the second type substrate 2 positioned at the upstream position WAb on the upstream side.

  In the component mounting method in the present embodiment, when the component 4 is mounted on the first type substrate 2 on which the component 4 supplied by the upstream component supply unit 13a is mounted, the first type substrate 2 is mounted on the substrate. The mounting head 14 that is positioned at the downstream position WAa on the conveyance path 12 and picks up the component 4 from the upstream component supply unit 13a moves above the component camera 17 in the conveyance direction (X axis) of the substrate 2 by the substrate conveyance path 12. Direction) to move from the upstream side to the downstream side so that imaging by the component camera 17 is performed, and the component 4 is mounted on the second type substrate 2 on which the component 4 supplied by the downstream component supply unit 13b is mounted. Is mounted, the second type substrate 2 is positioned at the upstream position WAb on the substrate transport path 12, and the mounting head picks up the component 4 from the downstream component supply unit 13b. 4 moves above the component camera 17 from the downstream side to the upstream side in the conveyance direction of the substrate 2 by the substrate conveyance path 12 so that imaging by the component camera 17 is performed. The movement path of the mounting head 14 when the component 4 is picked up from the side component supply unit 13a and mounted on the first type substrate 2 positioned at the downstream position WAa on the substrate transport path 12, and the downstream component supply When the component 4 is picked up from the portion 13b and is mounted on the second type substrate 2 positioned at the upstream position WAb on the substrate conveyance path 12, the movement path of the mounting head 14 is a zigzag shape with a large shake. The number of cases is small, and the average length of the moving path of the mounting head 14 is the same in the upstream component supply unit 13a and the downstream component supply unit 13b. To become. For this reason, when the component supply part 13 consists of the upstream component supply part 13a and the downstream part supply part 13b, it can prevent that the tact time of component mounting increases and can improve the productivity of the board | substrate 2. FIG. .

  Although the embodiment of the present invention has been described so far, the present invention is not limited to the above. For example, in the above-described embodiment, the component mounting apparatus 1 has a configuration in which two sets of the component supply unit 13, the mounting head 14, and the component camera 17 are provided. Each set of component cameras 17 may be provided.

  A component mounting method capable of preventing an increase in the tact time of component mounting and improving the productivity of a board when the component supply unit includes an upstream component supply unit and a downstream component supply unit. I will provide a.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 4 Component 12 Board | substrate conveyance path 13 Component supply part 13a Upstream part supply part 13b Downstream part supply part 14 Mounting head 17 Component camera WA Work position WAa Downstream position (downstream work position)
WAb upstream position (upstream working position)

Claims (1)

A substrate conveyance path that conveys the substrate, a component supply unit that is provided on the side of the substrate conveyance path to supply components, a component camera that is provided between the substrate conveyance path and the component supply unit, and a component supply After picking up the parts supplied from the part and moving the parts camera above the parts camera in a direction parallel to the board transfer direction by the board transfer path, the picked up parts are picked up by the parts camera, and then on the board transfer path. A mounting head for mounting the component on the substrate positioned at the work position, and the component supply unit is located upstream of the substrate transfer direction by the substrate transfer path and is mounted on the first type substrate By a component mounting apparatus comprising an upstream component supply unit that supplies and a downstream component supply unit that supplies components to be mounted on the second type of substrate located downstream of the substrate conveyance direction by the substrate conveyance path Component mounting A law,
Positioning the first type substrate carried in by the substrate transport path at a downstream work position in the substrate transport direction on the substrate transport path;
A component supplied from the upstream component supply unit is picked up, moved above the component camera from the upstream side to the downstream side in the substrate conveyance direction by the substrate conveyance path, and the picked-up component is imaged by the component camera. And a step of mounting on the first type of substrate positioned at the downstream work position on the substrate transport path;
Positioning the second type substrate carried in by the substrate transport path at an upstream work position in the substrate transport direction on the substrate transport path;
The component supplied from the downstream component supply unit is picked up, moved above the component camera from the downstream side to the upstream side in the substrate transfer direction by the substrate transfer path, and the picked-up component is imaged by the component camera. And a step of mounting on the second type of board positioned at the upstream work position on the board transport path.

Images