JP5480463B2 - PCB decomposition processing equipment - Google Patents

Description

  The present invention relates to a PCB decomposition treatment apparatus that decomposes PCB (polychlorinated biphenyl) by heating. More specifically, the present invention relates to a decomposition processing apparatus for thermally decomposing PCB contained in a liquid using a heating apparatus such as a blast furnace.

  Liquid PCBs have been widely used as electrical insulators in the past because they have excellent electrical insulation properties. However, PCBs are not decomposed even when discarded after use, pollute the air, water, soil, etc., enter the human body through foods, and accumulate because they are not easily decomposed by humans and are excreted slowly. Therefore, a process for detoxifying existing PCBs is desired.

  An example of a PCB decomposition processing apparatus is disclosed in Japanese Patent Application Laid-Open No. 2002-204836. For example, as shown in FIG. 6, the decomposition processing apparatus includes a supply unit 103 and a retention unit 104 disposed in a heating atmosphere 102 in a blast furnace 101, and a liquid PCB 105 supplied from the supply unit 103 into the heating atmosphere 102 is retained. Sufficient heating time is ensured by decomposing the PCB 105 by temporarily retaining it by 104.

  A plurality of staying means 104 are provided below the supply means 103, and the liquid PCB 105 drops each staying means 104 in order from top to bottom. Guide means 106 is provided between the staying means 104, and when passing through the staying means 104, the liquid PCB 105 offset to the center is dropped while being dispersed.

JP 2002-204836 A

  However, the above-described decomposition processing apparatus is configured assuming that the PCB 105 is in a liquid state, and the staying means 104 is disposed below the supply means 103. An updraft is generated in the blast furnace 101 due to the combustion of the coke 107, and the PCB vaporized by heating rises on the updraft. For this reason, it may be difficult to retain the vaporized PCB in the heating atmosphere 102, and there is a demand for ensuring a sufficient heating time for the vaporized PCB.

  It is an object of the present invention to provide a PCB decomposition processing apparatus that can easily secure the heating time of vaporized PCB.

In order to achieve such an object, the invention according to claims 1 and 3 is a PCB decomposition processing apparatus for thermally decomposing PCB contained in a liquid, a heating means for generating a heating fluid for thermally decomposing PCB, and a heating fluid A supply means for spraying liquid therein, a vaporization means disposed in the heating fluid and vaporizing PCB that is sprayed and liquid, and disposed downstream of the vaporization means in the heating fluid and colliding with the heating fluid And a staying means for temporarily staying while disturbing the flow.

  Therefore, when the liquid containing PCB is sprayed from the supply means into the heating fluid, the liquid is vaporized and flows on the heating fluid. At this time, even if the sprayed liquid is not immediately vaporized but remains liquid, it is completely vaporized by contact with the vaporizing means. A retention means is provided in the direction in which the vaporized gas flows, and the vaporized gas is temporarily retained by the retention means together with the heated fluid. For this reason, the contact time between the vaporized gas and the heating fluid and the contact time with the staying means heated by the vaporized gas and the heating fluid are increased.

In the PCB decomposition processing apparatus according to claims 1 and 3 , a plurality of staying means are provided. Therefore, after the vaporized gas and the heated fluid are temporarily retained by the first-stage retention means, they are temporarily retained again by the next retention means even if they pass through. Thus, the flow of the vaporized gas and the heated fluid is temporarily retained for a plurality of times.

Further, in the PCB decomposition processing apparatus according to claim 1 , the staying means is a plate member having a plurality of holes through which the heated fluid passes, and the positions of the holes are shifted in successive stages, and the turbulent flow is caused by the collision with the heated fluid. it is shall cause. Accordingly, the vaporized gas and the flow of the heated fluid are temporarily retained, and then pass through the retention means through the holes. Since the positions of the holes are shifted in successive stages, the flow passing through the staying means advances straight as it is, hits the next staying means, and does not pass through the staying means as it is. Therefore, the flow is temporarily retained also in the retention means.

Further, decomposition treating apparatus of the PCB according to claim 2, wherein the residence means a stage to continue communicating a shall cause turbulence by collisions with the flow passage area is different Do Ri heating fluid hole. Accordingly, the vaporized gas and the flow of the heated fluid are temporarily retained, and then pass through the retention means through the holes. Since the flow passage areas of the holes are different in successive stages, the flow passing through the staying means does not go straight through the holes of the next staying means as they are, and turbulence is generated. Therefore, the flow is temporarily retained also in the retention means.
In the PCB decomposition processing apparatus according to claim 4, the heating fluid flows from the bottom to the top, the staying means is disposed above the vaporization means, and the vaporization means is above and below the supply means. It is what is arranged. Therefore, when the liquid containing PCB is sprayed into the heating fluid from the supply means, the liquid vaporizes and rides on the heating fluid and rises. At this time, even if the sprayed liquid is not immediately vaporized but remains in a liquid state for a while, it is vaporized by the vaporizing means arranged above or below the supply means. A retention means is provided on the vaporization means, and the vaporized gas is temporarily retained by the retention means together with the heated fluid. Since hot air rises, you can make a flow without resisting this ascending force. Moreover, the heavy metal contained in the sprayed liquid is not vaporized like liquid PCB, but is separated from the vaporized gas. The separated heavy metal is combusted by the vaporizing means.

  In the PCB decomposition processing apparatus according to claim 5, the liquid contains heavy metal, and the vaporization means burns heavy metal contained in the liquid and is provided in a plurality of stages. When heavy metal is contained in the liquid, the heavy metal is not vaporized like liquid PCB and is separated from the vaporized gas. The separated heavy metal is combusted by the vaporizing means. Since the vaporization means is provided in a plurality of stages, even if the heavy metal contained in the supplied liquid passes through without being completely burned by the first vaporization means, it is completely burned by the subsequent vaporization means. The

  Here, the vaporizing means is preferably an integrated formed ceramic porous body. In this case, it is possible to arbitrarily form a vaporization means having a porosity corresponding to the size of the vaporization means and the amount of PCB processed. Here, in the present specification, the integrated formed ceramic porous body is a porous body formed by accumulating ceramic lines extruded from nozzles and having pores generated between the lines.

  Further, the vaporizing means is preferably a ceramic noodle (for example, trade name Actothermic, manufactured by Kobe Steel, Ltd.) obtained by swirling and accumulating thread-like ceramics in a circular shape. The ceramic noodle has a shape such that a large number of coil springs are stacked, and has a high thermal shock property. In addition, the ceramic noodle can enhance the thermal shock performance as compared with the honeycomb formed body made of the same material.

  When the vaporizing means is made of ceramic noodles, vaporizing means having different void ratios can be obtained depending on the yarn diameter, the turning diameter, and the accumulation pattern. For example, the porosity can be adjusted to 40 to 80% by changing the yarn diameter to any one of 1.0, 1.5, 2.0 mm, etc. and changing the accumulation pattern. Therefore, it is possible to arbitrarily shape the vaporization means having a porosity corresponding to the processing amount of the liquid containing PCB.

  The vaporizing means is preferably one in which thread-like ceramics are accumulated in a lattice shape. Also in this case, it is possible to obtain vaporizing means having different void ratios depending on the accumulated pattern such as the yarn diameter, the line interval, and the lattice overlap angle. Therefore, it is possible to select a vaporization means having a porosity corresponding to the amount of liquid processed.

Here, the integrated molded ceramic porous body can be made of mullite or alumina. Since the melting point of mullite and alumina is 1800 ° C. or higher and the softening temperature is higher than 1450 ° C., it can have heat resistance in the heating fluid here. Mullite is represented by a composition formula _{3Al 2 O} 3 · 2SiO 2, the composition ratio _{Al 2 O 3: 76.6wt%,} 2SiO 2: is 23.1wt%.

  Further, the vaporizing means may be a block body made of a porous material, or may be a honeycomb structure made of a porous material. Also in these cases, since the contact area between the liquid containing PCB and the heated air can be increased, the liquid containing PCB can be efficiently heated and vaporized.

Further, in the PCB decomposition processing apparatus according to the sixth aspect, the flow path area of the hole in each stage of the staying means is narrower on the downstream side than on the upstream side.

  Further, in the PCB decomposition processing apparatus according to the seventh aspect, the heating means is the combustion section of the blast furnace, and the supply means, the vaporizing means, and the staying means are installed in the blast furnace. According to this, since the thermal energy of the blast furnace can be directly used for the thermal decomposition of the PCB, the thermal energy to be lost is small and the decomposition efficiency can be increased. Moreover, PCB can be heated to 1000-1450 degreeC preferable as a heating temperature for making the decomposition rate of PCB 99.9999% or more.

  The temperature for heating the liquid is 1000 to 1450 ° C. as in the PCB decomposition processing apparatus according to claim 8, and the time for heating the liquid and the vaporized gas is 1.0 to 3.5 seconds. It is preferable to do so. If it is this range, it becomes possible to make the decomposition rate of PCB 99.9999% or more. In order to set the PCB decomposition rate to 99.9999% or more, if the heating temperature is 1450 ° C., for example, the heating time may be 1.0 seconds, and if the heating time is 3.5 seconds, the heating temperature is It may be 1000 ° C.

  Moreover, as heating temperature for making the decomposition rate of PCB 99.9999% or more, Preferably it is 1000-1450 degreeC, More preferably, it is 1200-1400 degreeC. In order to increase the decomposition rate to 99.9999% or more at a heating temperature of less than 1000 ° C., the heating time must be increased to, for example, more than 3.5 seconds. It is not preferable because the size is increased. Further, heating temperatures exceeding 1450 ° C. are not preferable because the vaporizing means made of ceramic may be deformed.

  Furthermore, the heating time for setting the PCB decomposition rate to 99.9999% or more is preferably 1.0 to 3.5 seconds, more preferably 2.0 to 3.5 seconds. In order to achieve a decomposition rate of 99.9999% or more in a heating time of less than 1.0 seconds, the heating temperature must be increased to a level exceeding 1450 ° C., which is not preferable. In addition, a heating time exceeding 3.5 seconds is not preferable because the PCB path becomes long and the decomposition processing apparatus becomes large.

4. The PCB decomposition processing apparatus according to claim 1 , wherein heating means for generating a heating fluid for thermally decomposing the PCB, supply means for supplying a liquid into the heating fluid, and a sprayed liquid disposed in the heating fluid. Since it comprises vaporizing means for vaporizing the PCB as it is, and staying means that is disposed downstream of the vaporizing means in the heated fluid and that temporarily disturbs the flow by collision with the heated fluid and retains it. The contact time between the vaporized PCB and the heating fluid, and the contact time between the vaporized PCB and the high-temperature staying means can be increased, and the heating time necessary for the decomposition of the PCB can be sufficiently ensured. For this reason, the decomposition rate of PCB can be raised.

In the PCB decomposition processing apparatus according to claims 1 and 3, since a plurality of staying means are provided, the vaporized gas can be temporarily retained a plurality of times, and the time for heating the vaporized PCB is increased. Can be secured even longer. For this reason, the decomposition reaction of PCB can be further promoted, and the decomposition rate of PCB can be further increased.

In the PCB decomposition processing apparatus according to claim 1 , the staying means is a plate member having a plurality of holes through which the heated fluid passes, and the positions of the holes are shifted in successive stages, and the turbulent flow is caused by the collision with the heated fluid. the resulting make things der Runode, without flow of the vaporized gas and the heating fluid will pass through the retention means in a plurality of stages as it is straight, it is possible to surely stay temporarily flow to each stage.

Further, the decomposition apparatus of the PCB according to claim 2, wherein the residence means der what gives rise to turbulence by collisions with the flow passage area of the hole is different Do Ri heating fluid in stages to continue communicating Runode, vaporizing When the flow of the gas and the heated fluid passes through the staying means, a turbulent flow is not generated and does not pass straight as it is, and the flow can be temporarily retained for each stage without fail.
In the PCB decomposition processing apparatus according to claim 4, the heating fluid flows from the bottom to the top, the staying means is disposed above the vaporization means, and the vaporization means is disposed below the supply means. Therefore, the flow of the heating fluid can be made by using the rising force of hot air.

  Further, in the PCB decomposition processing apparatus according to claim 5, the liquid contains heavy metal, and the vaporizing means burns heavy metal contained in the liquid and is provided with a plurality of stages. The heavy metals contained can be burned completely. Further, the vaporization of the liquid supplied from the supply means can be further ensured.

  Here, when the vaporizing means is an integrated molded ceramic porous body, the vaporizing means having a porosity corresponding to the size of the vaporizing means and the processing amount of the liquid containing PCB can be arbitrarily formed.

  Further, when the vaporizing means is made of ceramic noodles, vaporizing means having different void ratios can be obtained depending on the yarn diameter, the turning diameter, and the accumulation pattern. Therefore, it is possible to arbitrarily shape the vaporization means having a porosity corresponding to the processing amount of the liquid containing PCB.

  Further, when the vaporizing means is made by accumulating thread-like ceramics in a lattice shape, it is possible to obtain vaporizing means having different void ratios depending on the accumulation pattern such as the yarn diameter, the line interval, and the lattice overlap angle. Therefore, it is possible to select a vaporization means having a porosity corresponding to the processing amount of the liquid containing PCB.

  Here, the integrated molded ceramic porous body can be made of mullite or alumina. Since the melting point of mullite and alumina is 1800 ° C. or higher and the softening temperature is higher than 1450 ° C., it can have heat resistance in the heating fluid here.

  Further, when the vaporizing means is a block body made of a porous material or a honeycomb structure made of a porous material, the contact area between the liquid containing PCB and the heated air can be increased. The contained liquid can be efficiently heated and vaporized.

In the PCB decomposition processing apparatus according to the sixth aspect of the present invention, the flow path area of the hole in each stage of the staying means is narrower on the downstream side than on the upstream side.

  In the PCB decomposition processing apparatus according to claim 7, since the heating means is the combustion section of the blast furnace and the supply means, vaporization means, and retention means are installed in the blast furnace, the thermal energy of the blast furnace is transferred to the PCB. It can be directly used for thermal decomposition, and less heat energy is lost, so that the decomposition efficiency can be increased. Moreover, PCB can be heated to 1000-1450 degreeC preferable as a heating temperature for making the decomposition rate of PCB 99.9999% or more.

  In the PCB decomposition processing apparatus according to claim 8, the temperature for heating the liquid is 1000 to 1450 ° C., and the time for heating the liquid and the vaporized gas is 1.0 to 3.5 seconds. , It becomes possible to make the decomposition rate of PCB 99.9999% or more.

  Hereinafter, the configuration of the present invention will be described in detail based on the best mode shown in the drawings.

1 and 2 show an example of an embodiment of a PCB decomposition processing apparatus of the present invention. The PCB decomposition processing apparatus (hereinafter simply referred to as a decomposition processing apparatus) thermally decomposes the PCB contained in the liquid 2, and includes a heating means 19 that generates a heating fluid 16 that thermally decomposes the PCB, and a heating fluid 16. The supply means 7 for spraying the liquid 2 therein, the vaporization means 3 disposed in the heating fluid 16 and vaporizing the PCB which is sprayed and liquid, and the vaporization means 3 in the heating fluid 16 are disposed downstream of the vaporization means 3. The staying means 5 is provided with a staying means 5 that disturbs the flow by the collision with the heating fluid 16 and temporarily stays there. In this embodiment, the heating fluid 16 flows at high speed from the bottom to the top, the staying means 5 is disposed above the vaporizing means 3, and the vaporizing means 3 is disposed above and below the supply means 7. ing.

  The supply means 7 is, for example, a high pressure nozzle that sprays the liquid 2. In the present embodiment, for example, a decomposition processing apparatus is configured using a blast furnace 8 that has become a decommissioning furnace, and a high-pressure nozzle (hereinafter referred to as a high-pressure nozzle 7) serving as a supply unit 7 is provided on an inner wall surface 17 of the blast furnace 8, for example. Four places are provided at equal intervals in the circumferential direction. Each high-pressure nozzle 7 is connected to an annular tube 20 attached to the outer wall surface of the blast furnace 8 through the furnace wall. The liquid 2 stored in the tank 21 is pressurized and supplied to the supply port 20 a of the annular pipe 20 by the high-pressure pump 22. A check valve 23 is provided between the high-pressure pump 22 and the supply port 20a to prevent the liquid 2 from flowing back. Each high-pressure nozzle 7 is provided with a plurality of injection ports, and the high-pressure liquid 2 supplied from the high-pressure pump 22 into the annular pipe 20 is sprayed into the blast furnace 8 from each injection port. The mist droplets of the liquid 2 sprayed from the high-pressure nozzle 7 are sized to quickly vaporize after being sprayed. That is, the high-pressure nozzle 7 having an injection port having a diameter capable of being sprayed as a mist having a size that allows the PCB in the liquid 2 to quickly vaporize is used. Since the size of the mist droplets changes according to the viscosity, pressure, flow rate, etc. of the liquid 2, for example, a spray experiment in which the diameter of the injection port is changed is performed, the diameter of the injection port is determined, and an appropriate high-pressure nozzle 7 is selected. To do. In addition, since the possibility of causing clogging increases when the diameter of the injection port is too small, caution is required. In the present embodiment, the diameter of the injection port is, for example, about 0.5 mm in diameter. The liquid 2 is, for example, a liquid PCB such as insulating oil, and includes heavy metal.

  The vaporizing means 3 has a disk shape, for example. The vaporization means 3 is a device in which the liquid 2 that has not been vaporized quickly only by contact with the heating fluid 16 comes into contact with the liquid 2, and the fluid 2 is completely vaporized by the contact, and vaporization of heavy metals and the like contained in the liquid 2. The components not to be burned are converted into oxides, which are temporarily retained in the vaporization means 3 or dropped to the furnace bottom and deposited. For example, the vaporizing means 3 is provided in a plurality of stages. In this embodiment, the vaporization means 3 is provided, for example, in two stages below the supply means 7 and one stage above. However, the number of stages of the vaporizing means 3 is not limited to the lower two stages and the upper one stage. Further, the vaporization means 3 in the upper stage of the supply means 7 may be omitted. By increasing the number of stages of the vaporizing means 3, the liquid 2 can be more reliably vaporized and the combustion of heavy metals or the like can be made more reliable. On the other hand, when the number of stages of the vaporizing means 3 is reduced, the pressure loss of the flow of the heating fluid 16 can be reduced.

  The vaporizing means 3 is formed of, for example, an integrated molded ceramic porous body. This integrated molded ceramic porous body is made of, for example, mullite, and here, so-called ceramic noodles in which thread-like ceramics are swirled and integrated into a circular shape is used. For this reason, it is possible to obtain the vaporizing means 3 having different porosity depending on the yarn diameter, the turning diameter, and the accumulation pattern. Therefore, the vaporization means 3 having a porosity corresponding to the processing amount of the liquid 2 can be arbitrarily formed.

  The staying means 5 is, for example, a plate member having a plurality of holes 5a through which the heated fluid 16 passes. In the present embodiment, the staying means 5 has a disk shape, for example. The staying means 5 is provided in a plurality of stages, for example. In this embodiment, the staying means 5 is provided in five stages, for example. The heated fluid 16 flows from the bottom to the top at a high speed, and the staying means 5 is in the first, second,. However, the number of stages of the staying means 5 is not limited to five, but may be two, three, four, six or more, or one. By increasing the number of staying means 5, the number of times the gas vaporized by the vaporizing means 3 can be temporarily retained can be increased, and the time during which the vaporized gas stays in the furnace, that is, the PCB is thermally decomposed. Heating time can be increased. On the other hand, when the number of staying means 5 is reduced, the pressure loss of the flow of the heating fluid 16 can be reduced. In the staying means 5, the positions of the holes 5a are shifted in successive stages. Therefore, when passing through one staying means 5, it collides with the next staying means 5, the flow is disturbed, and a temporary stay can be generated more reliably. In the present embodiment, the positions of the holes 5a of the staying means 5 are changed every other stage, and the first, third and fifth stage staying means 5, and the second and fourth stage staying means. In FIG. 5, the positions of the holes 5a are aligned.

  The staying means 5 is, for example, a ceramic plate. For example, mullite is used as the ceramic. The staying means 5 is disposed above the supply means 7. By arranging the staying means 5 above the supply means 7, the number of stages of the staying means 5 can be easily increased.

  The thickness of the staying means 5 is thinner on the downstream side than on the upstream side, or the same on the upstream side and on the downstream side. In this embodiment, the thickness of the staying means 5 is, for example, 30 cm for the first stage, 25 cm for the second stage, and 20 cm for the third, fourth, and fifth stages. That is, the second stage is thinner than the first stage, and the third stage is thinner than the second stage. The thickness of the third stage, the fourth stage, the fourth stage, and the fifth stage is Each is the same. By doing in this way, the time for the heating fluid 16 to stay between the staying means 5 of each stage can be earned, and it becomes easy to secure the time necessary for the decomposition of the PCB. However, the position of the step where the downstream one is thinner than the upstream one, and the step where the upstream and downstream ones have the same thickness are not limited to the above-mentioned positions. It may be in another position. Further, the downstream side of all the staying means 5 may be thinner than the upstream side, and the upstream and downstream side staying means 5 of the same stage may have the same thickness. Anyway.

  The flow path area of the hole 5a provided in the staying means 5 is narrower on the downstream side than on the upstream side, or is the same for the upstream side and the downstream side. In the present embodiment, a hole 5a having a circular channel area is provided, and the diameter of the hole 5a is, for example, 2.5 cm for the first stage, 2.0 cm for the second stage, and 3rd stage, 4th stage. Stages 5 and 5 are set to 1.5 cm. That is, the flow path area of the hole 5a is narrower in the second stage than in the first stage, and in the third stage than in the second stage, and the third, fourth, and fourth stages. And the fifth row are the same. By doing in this way, the time for the heating fluid 16 to stay between the staying means 5 of each stage can be earned, and it becomes easy to secure the time necessary for the decomposition of the PCB. However, the position of the step that narrows the downstream one than the upstream one, and the step position where the upstream and downstream ones have the same flow path area are not limited to the above positions. Or another position. Further, the downstream means of all the staying means 5 may be narrower than the upstream one, and the upstream and downstream of the staying means 5 of all stages may be the same flow path. It may be an area.

  The interval between the stages of the staying means 5 is larger on the downstream side than on the upstream side, or is the same between the upstream side and the downstream side. By doing in this way, the time for the heating fluid 16 to stay between the staying means 5 of each stage can be earned, and it becomes easy to secure the time necessary for the decomposition of the PCB. However, the position of the stage where the distance between the upstream side and the downstream side is larger than the upstream side, and the stage position where the upstream side and the downstream side have the same distance are not limited to the above-mentioned positions. Or another position. Further, the interval between the upstream side and the downstream side of the staying means 5 of all the stages may be made larger than that of the upstream side. An interval may be used.

  In the decomposition processing apparatus 1 of the present embodiment, the heating means 19 is a burner provided in the blast furnace 8. The burner is installed in the lower part of the blast furnace 8 and generates combustion gas as a heating fluid 16 using, for example, natural gas as fuel. Further, the supply means 7, the vaporization means 3, and the staying means 5 are installed in the blast furnace 8. This blast furnace 8 is provided with a furnace part 10 having a tubular shape and having a furnace port part on the upper side, and a hearth part 11 formed at the lower part of the furnace part 10. The heating fluid 16 flows upward through the furnace unit 10 and is discharged from an upper furnace port (not shown). The upper part of the furnace part 10 is gradually narrowed to prevent heat from escaping.

  A block 18 is formed on the inner wall surface 17 made of a refractory and heat-resistant material of the furnace section 10 to horizontally support the supply means 7, the vaporization means 3, and the staying means 5 with vertical spacing. The surface of each block 18 has heat resistance equivalent to the inner wall surface 17 of the furnace unit 10. Further, the supply means 7 penetrates the furnace wall of the furnace part 10, and the tip part is supported by the block 18.

  The block 18 that supports the vaporizing means 3 is provided in an annular shape along the circumferential direction of the inner wall surface 17. For this reason, since the heating fluid 16 comes to pass through the inside of the vaporization means 3, the vaporization means 3 can be heated efficiently. In some cases, the block 18 may be divided into a plurality of blocks along the circumferential direction of the inner wall surface 17. In this case, the heating fluid 16 creates a space between the edge of the vaporizing means 3 and the blocks 18. Therefore, it is preferable that the position of the space is shifted in the upper and lower stages so that the heating fluid 16 does not pass straight as it is, so as to increase the residence time.

  The block 18 that supports the staying means 5 is provided in an annular shape along the circumferential direction of the inner wall surface 17. For this reason, since the heating fluid 16 passes through the holes 5a provided in the staying means 5, the flow of the heating fluid 16 can be temporarily retained more reliably and the staying means 5 can be efficiently heated. Can do.

  Although not shown in particular, the tuyere 13 is a means for supplying oxygen or air to the liquid 2 or the vaporized gas of the liquid 2 in order to promote the decomposition of PCB contained in the liquid 2 or the vaporized gas of the liquid 2. It may be provided separately. For example, an opening penetrating the furnace wall near the lower part of the first stage retention means 5 is formed, and oxygen or air is supplied from this opening.

  In order to set the decomposition rate of PCB contained in liquid 2 or the vaporized gas of liquid 2 to 99.9999% or more, if the heating temperature is, for example, 1450 ° C., the heating time may be 1.0 second, and the heating time is For example, the heating temperature may be 1000 ° C. for 3.5 seconds. In this embodiment, since the heat of the blast furnace 8 is used, the PCB can be heated to 1000 to 1450 ° C., which is preferable as a heating temperature for setting the PCB decomposition rate to 99.9999% or more.

  A procedure for decomposing PCB contained in the liquid 2 by the above-described decomposition processing apparatus 1 will be described below.

  First, the burner which is the heating means 19 is burned. The vaporizing means 3 and the staying means 5 are heated by the combustion gas, that is, the heating fluid 16 at this time. And if the vaporization means 3 and the retention means 5 are heated to 1000-1450 degreeC, for example, the liquid 2 to be processed will be sprayed from the supply means 7. FIG. The liquid 2 is continuously sprayed by the high-pressure pump 22. The sprayed liquid 2 is vaporized by the heating fluid 16 or the vaporization means 3, rises together with the heating fluid 16, collides with the first stage retention means 5, and then passes through the holes 5 a to form the first stage retention means 5. Go through. That is, the vaporized gas and the flow of the heating fluid 16 are disturbed by the first-stage staying means 5 and are temporarily retained, and then rise through the first-stage staying means 5.

  The flow of the vaporized gas and the heated fluid 16 that has passed through the first-stage staying means 5 collides with the second-stage staying means 5 and is temporarily retained by the second-stage staying means 5. Thereafter, the second staying means 5 passes through the hole 5a and rises. Similarly, the flow of the vaporized gas and the heated fluid 16 rises while being temporarily retained by the third, fourth, and fifth staying means 5 respectively.

  Thus, the flow of the vaporized gas and the heating fluid 16 is temporarily retained by the retention means 5 at each stage, so that the vaporized PCB is thermally decomposed before flowing out from the furnace port (not shown) to the subsequent equipment. The By being temporarily retained by the retaining means 5 at each stage, the vaporized PCB is retained in the furnace for 1.0 to 3.5 seconds. That is, a heating time of 1.0 to 3.5 seconds required for PCB thermal decomposition can be secured. For this reason, PCB can be decomposed at a high rate of 99.9999% or more.

  The liquid 2 sprayed from the supply means 7 is heated mainly by contact with the heating fluid 16 and quickly vaporized. At this time, even if the sprayed liquid 2 is not immediately vaporized but remains in a liquid state, it is vaporized by contact with the vaporizing means 3. Since the vaporizing means 3 is formed of an integrated molded ceramic porous body, the contact area between the vaporizing means 3, the heating fluid 16 and the liquid 2 can be increased, and the liquid 2 can be efficiently heated.

  On the other hand, among the components contained in the liquid 2 supplied from the supply means 7, components that do not vaporize, such as heavy metals, fall mainly after spraying and are burned by the vaporization means 3 below the supply means 7 to become oxides. It stays temporarily in the vaporizing means 3 or falls to the furnace bottom and accumulates. At this time, even if heavy metal or the like falls without being burned by the first stage vaporization means 3, it is completely burned by the second stage vaporization means 3 below.

  The vaporized gas is heated by contact with the heating fluid 16 and the staying means 5 to decompose the PCB. The staying means 5 disturbs the flow of the vaporized gas and the heating fluid 16 to temporarily stay and pass through the hole 5a, so that the vaporized gas can be efficiently heated.

  In the present embodiment, since the positions of the holes 5a of the staying means 5 are shifted in successive stages, the flow of the vaporized gas and the heated fluid 16 does not pass straight through the staying means 5 of each stage as it is. It is possible to reliably cause the retention.

  The above-described embodiment is an example of a preferred embodiment of the present invention, but is not limited thereto, and various modifications can be made without departing from the scope of the present invention. For example, in this embodiment, the vaporizing means 3 is an integrated molded ceramic porous body, but is not limited thereto, and may be a block body or a honeycomb structure made of a porous material. Also in these cases, the contact area between the liquid 2 and the vaporizing means 3 can be increased, so that the heat of the vaporizing means 3 can be efficiently transmitted to the liquid 2, vaporization of the liquid 2 can be promoted, and heavy metal combustion is performed. Can be promoted.

  Further, in the present embodiment, the five-stage staying means 5 is provided, but the number of stages is not limited to this, and it is sufficient if a heating time that can decompose the PCB at a high rate can be secured. It will change.

  Similarly, in this embodiment, the vaporization means 3 is provided in two stages below the supply means 7 and one stage above, but the number of stages is not limited to this, and the PCB in a liquid state can be vaporized well. In addition, it is sufficient if the heavy metal can be burned completely, and it varies depending on the area of the vaporizing means 3, for example.

  Further, in this embodiment, the vaporizing means 3 is supported by the blocks 18, but the present invention is not limited to this. For example, a plurality of adjacent vaporizing means 3 are integrated as a cartridge and supported by only the lowermost block 18. You may make it do. In this case, it is preferable to form a loading / unloading portion capable of communicating or closing the inside / outside of the furnace portion 10 on the side portion of the furnace portion 10, and to insert / remove the cartridge from the loading / unloading portion.

  Similarly, in this embodiment, the staying means 5 are supported by the blocks 18 respectively. However, the present invention is not limited to this. For example, a plurality of adjacent staying means 5 are integrated as a cartridge, and only the bottom block 18 is used. You may make it support. In this case, it is preferable to form a loading / unloading portion capable of communicating or closing the inside / outside of the furnace portion 10 on the side portion of the furnace portion 10, and to insert / remove the cartridge from the loading / unloading portion.

In the present embodiment, the vaporizing means 3 and the staying means 5 are both made of mullite, but the invention is not limited to this and may be made of alumina or cordierite. Cordierite is represented by the composition formula 2Al ₂ O ₃ · 5SiO ₂ · 2MgO, and the composition ratios are Al ₂ O ₃ : 34.3 wt%, SiO ₂ : 51.0 wt%, and MgO: 13.2 wt%. Further, the vaporizing means 3 and the staying means 5 may be manufactured using materials other than mullite, alumina, and cordierite as long as they can withstand use at temperatures in the furnace. Moreover, although all the vaporization means 3 and the retention means 5 are made of the same material, the vaporization means 3 and the retention means 5 may be made of different materials. For example, the upstream vaporizing means 3 having a high temperature of the heating fluid 16 is a material having a high melting point such as mullite or alumina, and the downstream retaining means 5 having a temperature of the heating fluid 16 lower than that of the upstream is like cordierite. A material having a relatively low melting point may be used. In particular, cordierite has a melting point of 1450 ° C., but the softening temperature is lower than that. Therefore, it is preferably used for the staying means 5 arranged on the downstream side. Further, the materials may be different without making all the vaporizing means 3 the same material, and the materials may be made different without making all the staying means 5 the same material.

  Furthermore, the porosity of the porous body of the vaporizing means 3 may be different between the upstream side and the downstream side. For example, the porosity is increased on the upstream side to facilitate the passage of the heated fluid 16, and the porosity is decreased on the downstream side to increase the heating efficiency of the liquid 2.

  Further, the staying means 5 may be, for example, a ceramic porous plate having a through hole through which the flow of the vaporized gas and the heating fluid 16 passes. In this case, since the through hole is provided in advance, it is not necessary to provide the hole 5a by machining or the like.

  In the above-described embodiment, the vaporizing means 3 and the staying means 5 are disk-shaped flat plates installed horizontally, but are not limited thereto.

  Further, in each of the above-described embodiments, the shape of the vaporizing means 3 and the staying means 5 is a disk shape, but is not limited thereto, and is a rectangular plate shape, a polygonal plate shape, a cylindrical shape or a solid rod shape. There may be. When the shape of the vaporizing means 3 and the staying means 5 is, for example, a rectangular plate shape, the furnace section 10 of the blast furnace 8 is usually a cylindrical shape, so that the periphery of the vaporizing means 3 and the staying means 5 and the inner wall surface 17 An arcuate gap is formed between them. Then, since the heating fluid 16 flows upward through this gap, the heating fluid 16 is sufficiently supplied to the vaporizing means 3 and the staying means 5. Therefore, heat and oxygen are sufficiently applied to the PCB, and the PCB decomposition reaction can be promoted. Further, when the vaporizing means 3 and the staying means 5 have, for example, a bar shape, for example, several are arranged in parallel along the inclination direction. The space through which the heating fluid 16 passes through each vaporizing means 3 and each staying means 5 is shifted in position at the upper and lower stages so that the heating fluid 16 does not pass straight as it is so as to increase the residence time. preferable.

  Furthermore, in each embodiment mentioned above, although the vaporization means 3 and the residence means 5 are installed in the blast furnace 8, it is not restricted to this, It installs in the whole heating apparatuses, such as an incinerator which can be heated at about 1000-1450 degreeC. be able to.

  Moreover, in each embodiment mentioned above, although the heating fluid 16 flowed in the up-down direction, it is not restricted to this. For example, an object that flows diagonally or that flows horizontally may be used.

  In each of the above-described embodiments, the vaporizing means 3 is a ceramic noodle in which thread-shaped ceramics are swirled and accumulated in a circular shape. However, the vaporizing means 3 is not necessarily limited to ceramic noodles. For example, thread-shaped ceramics are arranged in a lattice pattern. It may be an accumulated one.

  In the above description, for example, natural gas is used as the fuel for the burner serving as the heating means 19, but the fuel that can be used is not limited to natural gas. For example, heavy oil, waste oil, recycled oil, or the like should be used. You can also. Moreover, you may use combustible wastes, such as an old tire, as a fuel as a fuel, for example. Further, coke may be used as fuel. An example of this case is shown in FIG. The blast furnace 8 includes a tuyere 13 that is formed on the upper side of the hearth part 11 and feeds combustion air 12, and a supply cylinder 15 that supplies coke 14 to the lower part of the furnace part 10. The heating means 19 is a combustion part of the blast furnace 8. Then, the coke 14 supplied from the supply cylinder 15 is deposited on the hearth of the furnace unit 10 and burned by the air 12 blown from the tuyere 13 to generate combustion gas as the heating fluid 16. In addition, since the structure of the hearth part 11, the tuyere 13, and the supply pipe | tube 15 is the same as that of a known blast furnace, detailed description is abbreviate | omitted.

  In the above description, four high-pressure nozzles are used as the supply means 7, but the number of high-pressure nozzles 7 is not limited to four, and a plurality or one other than four may be used.

  In the above description, a high pressure nozzle of the type attached to the inner wall surface 17 of the blast furnace 8 is used as the supply means 7, but is not necessarily limited to this type of high pressure nozzle.

  Further, in the above description, the liquid 2 is continuously sprayed from the supply means 7, but may be sprayed intermittently. In this case, for example, as shown in FIG. 3, the liquid 2 can be intermittently supplied to the supply means 7 by providing a switching valve 24 instead of the check valve 23 of FIG. Although the check valve 23 is omitted in the example of FIG. 3, the check valve 23 may be provided between the switching valve 24 and the supply port 20a.

  Further, in the above description, the position of the hole 5a of the staying means 5 is shifted by successive steps. For example, when the flow passage area of the hole 5a is different at successive steps, the position of the hole 5a is changed. May be aligned. That is, the flow passage areas of the holes 5a of the staying means 5 may be different in successive stages. In this case, the positions of the holes 5a of the staying means 5 may be aligned or shifted in successive stages. .

  Further, as shown in FIG. 5, auxiliary heating means 25 may be provided. The auxiliary heating means 25 is, for example, a burner, and is provided, for example, between the first stage staying means 5 and the second stage staying means 5. However, the installation position of the auxiliary heating means 25 is not limited to this. For example, you may install between the stay means 5 of another stage. Further, the number of auxiliary heating means 25 installed may be two, for example, three or more, or one. By providing the auxiliary heating means 25, the heating fluid 16 and the vaporized gas can be reheated.

It is sectional drawing which shows an example of embodiment of the decomposition processing apparatus of PCB of this invention. It is sectional drawing which follows the II-II line of FIG. It is a figure which shows the other example of the hydraulic circuit which supplies the liquid to the supply means. It is sectional drawing which shows the other example of embodiment of the decomposition processing apparatus of PCB of this invention. It is sectional drawing which shows the further another example of embodiment of the decomposition processing apparatus of PCB of this invention. It is sectional drawing which shows the decomposition | disassembly processing apparatus of the conventional PCB.

Explanation of symbols

2 Liquid 3 Vaporization means 5 Retention means 5a Hole 7 through which heated fluid passes 7 Supply means 8 Blast furnace 16 Heating fluid 19 Heating means

Claims (8)

In a PCB decomposition processing apparatus for thermally decomposing PCB contained in a liquid, heating means for generating a heating fluid for thermally decomposing the PCB, supply means for spraying the liquid into the heating fluid, and in the heating fluid And a vaporizing means for vaporizing the PCB that is sprayed and in a liquid state, and disposed downstream of the vaporizing means in the heated fluid, and temporarily disturbs the flow by collision with the heated fluid. The staying means is a plate member having a plurality of holes through which the heated fluid passes, and is provided in a plurality of stages, and the positions of the holes are shifted in successive stages and the heating is performed. A PCB decomposition processing apparatus, characterized in that a turbulent flow is generated by collision with a fluid . 2. The PCB decomposition processing apparatus according to claim 1, wherein the staying means has a flow path area of the hole which is different in successive stages and generates a turbulent flow by collision with the heated fluid . In a PCB decomposition processing apparatus for thermally decomposing PCB contained in a liquid, heating means for generating a heating fluid for thermally decomposing the PCB, supply means for spraying the liquid into the heating fluid, and in the heating fluid And a vaporizing means for vaporizing the PCB that is sprayed and in a liquid state, and disposed downstream of the vaporizing means in the heated fluid, and temporarily disturbs the flow by collision with the heated fluid. The staying means is a plate member having a plurality of holes through which the heating fluid passes, and is provided in a plurality of stages, and the flow path area of the holes differs in successive stages, and the heating is performed. A PCB decomposition processing apparatus , characterized in that a turbulent flow is generated by collision with a fluid . The heated fluid flows from bottom to top, the staying means is disposed above the vaporizing means, and the vaporizing means is disposed above and below the supply means. The PCB decomposition processing apparatus according to any one of claims 1 to 3 .   5. The liquid according to claim 1, wherein the liquid contains heavy metal, and the vaporizing means burns heavy metal contained in the liquid and is provided in a plurality of stages. The PCB decomposition processing apparatus according to the description. 4. The PCB decomposition processing apparatus according to claim 2, wherein the flow path area of the holes in each stage of the staying means is narrower on the downstream side than on the upstream side . 5.   The PCB according to any one of claims 1 to 6, wherein the heating means is a combustion section of a blast furnace, and the supply means, the vaporization means, and the staying means are installed in the blast furnace. Decomposition processing equipment.   The temperature for heating the liquid is 1000 to 1450 ° C, and the time for heating the liquid and the vaporized gas is 1.0 to 3.5 seconds. The PCB decomposition processing apparatus according to one.

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