JP5482241B2 - Image sensor positioning mechanism - Google Patents

Description

  The present invention relates to an image sensor positioning mechanism in an optical apparatus such as a digital camera.

  Conventionally, an image sensor block mounted on a digital camera has been positioned with respect to a reference member fixed to the camera body via a metal plate mounted on the back surface of the image sensor (Patent Document 1).

  In this conventional example, the two adjacent side surfaces of the CCD are pressed by the leaf spring members arranged on the side surfaces facing the two adjacent side surfaces in the fixed frame for fixing the CCD (imaging device), so In this configuration, the CCD is bonded to a fixed frame by pressing and positioning the two adjacent sides.

JP 2006-67147 A

  However, in such a conventional technology configuration, the mounting position of the image sensor is determined by the side surface of the fixed frame. Therefore, if there is a step of adjusting the position with the optical viewfinder field, the image sensor relative to the fixed frame is rotated around the optical axis. It is also difficult to move it in a direction perpendicular to the optical axis. In addition, even if the position of the image sensor is adjusted in the manufacturing process in the prior art, there is a deviation (parallax, tilt) between the optical viewfinder image and the captured image in the situation that the user has been distributed to the market and used by the user. However, it is difficult to cope with readjustment of the position on the image sensor side, and the optical viewfinder field frame has to be adjusted.

  The present invention has been made in view of the problems of such a conventional digital single-lens reflex camera, and provides an image sensor positioning mechanism that can easily adjust the position and position of the image sensor even during and after the manufacturing stage. Objective.

In order to solve this problem, the present invention includes an imaging device , a housing member that holds the imaging device and is attached to an optical device, and a position adjustment member that positions the imaging device with respect to the housing member. and a positioning mechanism, the housing member, a cylindrical portion surrounding the image pickup device is provided, on the surface of the tubular portion, at least one consisting of a normal direction parallel to the plane of the light receiving surface of the imaging device Forming a reference surface ; supporting the position adjustment member movably in a direction parallel to the light receiving surface along the reference surface of the housing member ; and connecting the image sensor to the position adjustment member; And positioning the image pickup device by a position along the reference plane of the position adjusting member .

  The reference plane is perpendicular to the first reference plane set in parallel with a first reference plane set in parallel with one side of the light receiving surface of the image sensor and in parallel with another side adjacent to the one side and forming a right angle. It is practical to have a second reference plane that forms

The position adjusting member is connected to the first positioning portion facing the first reference surface, the first positioning portion, the second positioning portion facing the second reference surface, and the second positioning portion. It is practical to include a connecting portion that is connected to the image sensor.
Furthermore, in a preferred embodiment of the present invention, a pair of the second reference surfaces are formed on the opposing surfaces of the cylindrical portion, the position adjusting members are a pair, and the pair of position adjusting members are It is preferable to include a first positioning portion that faces a different area of the first reference plane, a second positioning portion that faces each of the second reference planes, and a connecting portion that is connected to a different position of the imaging element. Furthermore, it is preferable that each said connection part is each connected to the opposing edge part approximate center of the said image sensor.

The cylindrical portion, said be formed an image sensor to enclose a rectangular cross section of the square tube-shaped, the pair of first reference plane and a pair of second reference plane, the rectangular cross section of the prismatic tubular It can be formed in the vicinity of opposite corners of the part .

  It is preferable that two sets of the first reference surface and the second reference surface are formed at diagonal positions of the cylindrical portion, and the position adjusting member is provided on each pair.

In a preferred embodiment of the present invention includes a gap adjusting member is inserted into and removed from and between the second reference surface and the second positioning portion of the first positioning portion and the first reference surface of the positioning member The position adjusting member moves in a direction perpendicular to the first and second reference planes and parallel to the light receiving surface to a position set by the inserted interval adjusting member. Since the element is positioned , the image pickup element is unlikely to be displaced thereafter.

Preferably, the position adjusting member is screwed and fixed to the cylindrical portion at a position adjusted by the interval adjusting member . By using the screw, it becomes easy to loosen the screw, and the readjustment work becomes easy.

According to another aspect of the present invention, there is provided a positioning mechanism including an imaging device, a housing member that holds the imaging device and is attached to an optical device, and a position adjustment member that positions the imaging device with respect to the housing member. a is, in the housing member, a cylindrical portion surrounding the image pickup device is provided, on the surface of the cylindrical portion, to be and the image pickup element from the normal direction parallel to the plane of the light receiving surface of the imaging device Forming two reference planes parallel to each other at symmetrical positions ; a pair of the position adjustment members are provided, and the pair of position adjustment members are arranged along each of the two reference planes of the housing member. A pair of position adjusting members connected to different positions of the image sensor, and the housing member is connected to the housing member. A pair of position adjustment members connected to different positions of the image sensor, and along the reference surface of the pair of position adjustment members; position by positioning the image pickup element; characterized.

According to the present invention, the position of the image sensor block with respect to the housing member is determined by the position adjusting member that moves along the reference plane formed on the surface of the housing member, so that the position adjustment of the image sensor is easy. Moreover, since the positioning is performed along the reference plane, it is easy to obtain accuracy.
If the present invention is installed in a digital single lens reflex camera equipped with an optical viewfinder, parallax and tilt adjustment between the captured image and the optical image of the viewfinder device can be easily performed without readjustment of the optical viewfinder.

It is sectional drawing which cut | disconnected longitudinally the embodiment which concerns on the camera body of the digital medium format single-lens reflex camera to which this invention is applied with the optical axis. It is sectional drawing which crossed embodiment of the camera body by the optical axis. It is the perspective view which exploded and showed the main members from the mount of the camera body to an image sensor housing, and an image sensor block. It is a rear view of the image sensor housing. It is the rear view which showed the mode of positioning of the image pick-up element block with respect to the image pick-up element image pick-up element housing in the Y-axis direction (up-down direction) in a different aspect to (A), (B), (C). It is the rear view which showed the mode of the positioning of the Y-axis direction (up-down direction) and the X-axis direction (left-right direction) of the image pick-up element block in a different aspect to (A), (B), (C).

  Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 and FIG. 2 are cross-sectional views showing main members of an embodiment of a camera body of a medium-format digital single-lens reflex camera to which the present invention is applied. This medium-format single-lens reflex camera corresponds to the Brownie plate 645 type in a silver salt film camera.

  The camera body 10 includes a lens mount 13 that detachably supports a photographic lens (not shown) on the front surface of the exterior plate 11 that forms the exterior. In the camera body 10 behind the lens mount 13, a main mirror 20, a shutter device 30, and an image sensor block 40 are disposed in order along the designed optical axis O. Above the main mirror 20, a viewfinder device for observing a subject image formed by the subject light flux that has passed through the photographing lens is disposed. The viewfinder device includes a focusing screen 21 on which a subject image reflected by the main mirror 20 is formed, a condenser lens 22, a trapezoid prism 23, and a photographer for observing the subject image formed on the focusing screen 21 as an erect image. An eyepiece optical system 24 is provided. Note that the lens group of the eyepiece optical system 24 is omitted.

  The main mirror 20 is pivotally supported in the mirror box 50, the focusing screen 21 is disposed in the upper opening of the mirror box 50, and the shutter device 30 is disposed in the rear opening of the mirror box 50. The mirror box 50 has a substantially rectangular frame as a basic structure, and is attached to the basic structure (frame) of the camera body 10, and an exterior plate (exterior member) 11 and the like are attached. The shutter device 30 is a longitudinally running focal plane shutter that normally blocks the optical path to the image sensor block 40 by the front curtain. The main mirror 20 swings between an observation position where the subject light flux that has passed through the photographing lens is reflected toward the focusing screen 21 and a photographing position where the subject mirror rises to a position facing the focusing screen 21 and allows the subject light flux to pass. Up and down).

  The image sensor block 40 includes an image sensor 41 in which a chip such as a CCD or CMOS image sensor is packaged, an optical filter 42 such as a low-pass filter and an infrared cut filter, which is mounted on the front surface of the image sensor 41, and an image sensor 41. And a circuit board 44 mounted on the back surface of the mounting plate 43. In the image pickup device 41, an image pickup device chip is usually enclosed in a package such as ceramic. A mounting plate 43 is adhered to the back surface of the image sensor 41. Further, a circuit board 44 is mounted on the back surface of the mounting plate 43 via a spacer. On the light receiving surface 41b side of the image sensor 41, a large number of photodiodes are arranged in a matrix to form a rectangular imaging region. Here, the direction parallel to the long side of the light receiving surface 41b is the X axis, the X axis direction (left and right direction), the direction parallel to the short side is the Y axis, the Y axis direction (vertical direction), and the normal line of the light receiving surface 41b. A parallel direction (optical axis direction) is defined as a Z-axis direction and a Z-axis direction, and the X, Y, and Z axes are defined to be orthogonal to each other. The optical axis direction means a direction parallel to the optical axis O, the front means the front in the optical axis direction (subject side), and the rear means the rear in the optical axis direction (image plane side). The direction means the vertical direction along the Y-axis direction when the camera is placed at the normal position, and the left-right direction means the X-axis when looking forward with the camera placed at the normal position. It means the left-right direction along the direction. The signal pin group 41a protrudes from the back surface of the image pickup device 41 (FIG. 3), and the signal pin group 41a passes through the notch region of the mounting plate 43 and is formed in the signal pin hole formed in the circuit board 44. Fit in the group.

  The image pickup element block 40 has a rear view in which the outer shape of the mounting plate 43 is formed larger than the outer shape of the image pickup element 41 and extends outward from both sides of the image pickup element 41 in parallel with the light receiving surface 41b. Constitutes the mounting portion 43a (FIGS. 2 and 3). The image sensor block 40 is fixed to the image sensor housing 60 via the mounting portion 43a. The mounting plate 43 is usually made of a metal such as an aluminum alloy that is a good thermal conductor.

  The image sensor housing 60 is formed in a box shape (cylindrical shape) that surrounds the image sensor block 40 and has two open surfaces in the front-rear direction along the optical axis O. That is, the imaging element housing 60 is formed with a cylindrical part 61 surrounding the imaging element block 40 and a flange part 62 to which the imaging element block 40 is fixed on the inner peripheral surface of the cylindrical part 61. The cylindrical portion 61 is formed in a substantially rectangular shape when viewed from the back, and the flange portion 62 protrudes along the inner peripheral surface of the cylindrical portion 61, and the rear surface is the image sensor housing 60. When attached to the rear end of the mirror box 50, the mirror box 50 is formed so as to be included in one plane orthogonal to the optical axis O.

  A plurality of L-shaped heat transfer members 63 are mounted on the back surfaces of both sides of the flange portion 62 (FIG. 2). The image pickup device block 40 is fixed to the image pickup device housing 60 with the heat transfer member 63 sandwiched between the attachment portion 43a and the flange portion 62.

  Three sets of bosses 62a and boss holes 43b for positioning and fixing the image pickup device housing 60 and the image pickup device block 40 are formed in the flange portion 62 and the attachment portion 43a of the attachment plate 43. The imaging element block 40 is a state in which each boss hole 43b is fitted into the corresponding boss 62a, a screw 65 is screwed into the end surface of the boss 62a from each boss hole 43b, and the heat transfer member 63 is clamped by the flange portion 62. Thus, the image sensor housing 60 is fixed.

  Further, the bottom and left and right side surfaces of the image sensor housing 60 are connected to the exterior plate 11 located on the bottom surface and both side surfaces of the camera body 10 via the heat transfer member 64. The heat transfer member 64 is mounted over the bottom surface and both side surfaces of the image sensor housing 60. The heat transfer member 64 does not have to be a continuous unitary object, and may be distributed at positions where the image sensor housing 60 and the exterior plate 11 are in surface contact.

  The positioning mechanism of the image sensor block 40 with respect to the image sensor housing 60 will be further described with reference to FIGS. On both shoulders of the outer surface of the cylindrical portion 61 of the image pickup device housing 60, along an outer upper surface (horizontal plane) 61X and both outer surfaces adjacent to the outer upper surface (both vertical surfaces orthogonal to the outer upper surface 61X) 61Y, A pair of substantially L-shaped position adjusting plates 71 and 72 are mounted as position adjusting members. Each position adjusting plate 71, 72 is bent at a right angle from the first positioning portions 71a, 72a extending along the outer upper surface 61X of the cylindrical portion 61 and the first positioning portions 71a, 72a, and the outer surface of the cylindrical portion 61. The second positioning portions 71b, 72b extending along 61X and the front edge side of the lower end portions of the second positioning portions 71b, 72b are bent at holes 61e, 61f formed in both outer side surfaces 61Y of the cylindrical portion 61. In addition, it has connecting portions 71 c and 72 c that enter the inside of the cylindrical portion 61 and extend in parallel along the flange portion 62. Pins 71d and 72d protrude from the back surfaces of the connecting portions 71c and 72c, and pin holes 43c and 43d formed in the mounting portion 43a of the mounting plate 43 are fitted into the pins 71d and 72d. Each position adjustment plate 71, 72 is a cylindrical portion from a pair of long holes 71f, 72f formed in each of the first positioning portions 71a, 72a and a pair of long holes 71f, 72f formed in each of the second positioning portions 71b, 72b. It is fixed to the cylindrical portion 61 by screws 73 and 74 screwed into 61 (FIGS. 3 and 4). The position adjustment plates 71 and 72 can be formed of any material such as metal or synthetic resin.

  The long holes 71e, 72e of the first positioning portions 71a, 72a extend in the X-axis direction (left-right direction), and the long holes 71f, 72f of the second positioning portions 71b, 72b extend in the Y-axis direction (vertical direction). . That is, the position adjustment plates 71 and 72 can be adjusted in the X-axis direction (left and right direction) along the long holes 71e and 72e in the plane orthogonal to the optical axis O, and along the long holes 71f and 72f. The position can be adjusted in the Y-axis direction (vertical direction) in a plane orthogonal to the optical axis O. Further, one (left side) pin hole 43c of the pin holes 43c and 43d is a long hole slightly extending in the X-axis direction with respect to the pin hole 43d. That is, the image sensor block 40 is configured to be rotatable about the pin hole 43d. In addition, the holes 61e and 61f of the cylindrical part 61 are also formed in such a length that the connecting parts 71c and 72c do not interfere with each other in the position adjustment in the Y-axis direction (vertical direction).

  A gap adjusting plate (spacer) is provided between the first positioning portions 71a, 72a of the position adjusting plates 71, 72 and the outer upper surface 61X of the cylindrical portion 61, and between the second positioning portions 71b, 72b and the outer surface 61Y of the cylindrical portion 61. , Shims) 81 and 82 are inserted and removed to adjust the X-axis direction position, the Y-axis direction position of the image sensor block 40 with respect to the image sensor housing 60, and the inclination in the plane orthogonal to the optical axis O (Z axis). can do.

  The cylindrical portion 61 is formed with a first reference surface 61a having a flat surface and extending in the X-axis (left and right) direction in the vicinity of both shoulders of the outer upper surface 61X, and a flat surface on both outer surfaces 61Y and a Y-axis. A second reference surface 61b extending in the (vertical direction) is formed in parallel with the optical axis O (Z axis). Both first reference surfaces 61a are formed in parallel or on the same plane, and both second reference surfaces 61b are parallel to each other and formed in a direction perpendicular to the first reference surface 61a. The two second reference planes 61b are parallel to the optical axis O. Further, the first reference surface 61 a and the second reference surface 61 b are formed in a direction orthogonal to each other and parallel to a normal line standing on the light receiving surface 41 b of the image sensor block 40. Note that this normal line is parallel to the optical axis O (Z-axis) when mounted on the camera body. Further, these first reference surfaces 61a and 61b are formed slightly higher than the outer upper surface 61X and the outer surface 61Y of the cylindrical portion 61.

  Each first reference surface 61a is formed with a screw hole 61c, and each second reference surface 61b is formed with two screw holes 61d at positions separated in the Y-axis direction (vertical direction). Screws 73a and 74a are screwed into the respective screw holes 61c, and screws 73b, 73b, 74b and 74b are screwed into the respective screw holes 61d.

  A spacer 81 is provided between the first reference surface 61a and the first positioning portions 71a and 72a of the position adjustment plates 71 and 72, and the second positioning of the first and second reference surfaces 61a and 61b and the position adjustment plates 71 and 72 is performed. A spacer 82 can be interposed between the portions 71b and 72b. A plurality of spacers 81 and 82 having different thicknesses are prepared, and various thicknesses can be set by singly or in combination. The first and second reference surfaces 61a and 61b and the first positioning portions 71a and 72a of the position adjusting plates 71 and 72 and the second positioning by inserting or not including the spacers 81 and 82 alone or in combination as described above. It is possible to adjust the distance between the portions 71b and 72b. With respect to the image sensor housing 60 (cylindrical part 61) of the image sensor block 40 connected by fitting the position adjusting plates 71 and 72 moved by this interval adjustment and the pins 71d and 72d and the pin holes 43c and 43d. The Y-axis (vertical) direction position, the X-axis (left-right) direction position, and the inclination (angle around the optical axis O) can be adjusted. The adjustment will be further described with reference to FIGS. During adjustment, the screws 65, 73a, 73b, 74a, and 74b are loosened, and the screws 65, 73a, 73b, 74a, and 74b are tightened after the adjustment is completed.

  FIG. 5 shows how the image sensor block 40 is adjusted by adjusting the Y-axis direction spacing of the position adjustment plates 71 and 72 relative to the first reference surface 61a, and FIG. 6 shows the position adjustment plates 71 and 72 relative to the first reference surface 61a. The state of the position adjustment of the image sensor block 40 by the distance adjustment (the Y-axis direction distance adjustment) and the X-axis direction distance adjustment of the position adjustment plates 71 and 72 with respect to the second reference surface 61b is shown. In each figure, the reference cross line 91 centered on the optical axis O and the light receiving surface 41b of the image sensor block 40 are equally divided in the X-axis and Y-axis directions and intersected at the center of the light receiving surface 41b. 93 is drawn. The horizontal line of the reference cross line 91 is parallel to the X axis, and the vertical line is parallel to the Y axis. Further, the pin holes 43c and 43d are formed so that the horizontal direction (X-axis direction) line of the imaging element cross wire 93 passes through the center.

  5A is a standard position of the image sensor block 40, FIG. 5B is an adjustment state in which the image sensor block 40 is lowered from the standard position to the left and raised to the right, and FIG. The adjustment state is shown with the same length raised from the standard position.

In the standard position of FIG. 5A, spacers 81 having a thickness t = 1 are interposed one by one between the first positioning portions 71a and 72a of the position adjusting plates 71 and 72 and the first reference surface 61a. is there. At this standard position, the reference crosshair 91 and the image sensor crosshair 93 are exactly overlapped. By setting the spacer 81 between the first positioning portions 71a and 72a and the first reference surface 61a as the standard position, the distance between the first positioning portions 71a and 72a and the first reference surface 61a is reduced. And it is possible to adjust both directions to spread. Since the second positioning portions 71b and 72b move in the Y-axis direction (direction parallel to the light receiving surface 41a) along the second reference surfaces 61b and 62b, the second positioning portions 71b and 72b move to the second reference surfaces 61b and 62b of the position adjustment plates 71 and 72. The image sensor 41 can be positioned by the position along.

  In FIG. 5B, the spacer 81 on the upper left surface is removed from the standard position state, and the spacer 81 on the upper right surface is changed to a thickness t = 2. By this spacer adjustment, the left position adjustment plate 71 is lowered from the standard position by a thickness t = 1, and the right position adjustment plate 72 is raised from the standard position by a thickness t = 1. Therefore, the image pickup device block 40 is rotated counterclockwise from the standard position by decreasing the left side by a thickness t = 1 and increasing the right side by a thickness t = 1. This can also be seen by the fact that the image sensor crosshair 93 rotates counterclockwise with respect to the reference crosshair 91. In this case, the rotation center of the image pickup device block 40 is substantially coincident with the optical axis O because the pin 71d and the pin hole 43c, and the pin 72d and the pin hole 43d are moved in the Y-axis direction having the same length.

In FIG. 5C, the spacers 81 on the left and right sides of the upper surface are changed to the thickness t = 2 from the standard position state. By this adjustment, the left and right position adjustment plates 71 and 72 (first positioning portions 71a and 72a) are raised from the standard position by a thickness t = 1 ( separated from the first reference surfaces 61a and 62a) . That is, the image sensor block 40 is translated ( moved along the second reference surfaces 61b and 62b) in the Y-axis upward direction by a thickness t = 1 from the standard position. This can also be seen by the fact that the image sensor crosshair 93 is displaced upwardly and parallel to the reference crosshair 91.

  In each state of FIGS. 5A to 5C, the left and right second positioning portions 71b and 72b are in contact with the second reference surface 60b, respectively, and have not moved in the X-axis left-right direction.

  FIG. 6 shows an embodiment in which the position adjustment plates 71 and 72 are adjusted not only in the Y axis vertical direction but also in the X axis horizontal direction. FIG. 6A shows the standard position, FIG. 6B shows the state rotated left from the standard position, and FIG. 6C shows the state translated from the standard position in the right direction of the X axis.

  In the standard position of FIG. 6A, the spacers 81 and 82 having a thickness t = 1 are provided between the left and right first positioning portions 71a and 72a and the first reference surface 61a, and the left and right second positioning portions 71b and 72b. And the second reference surfaces 61b and 61b. At this standard position, the reference crosshair 91 and the image sensor crosshair 93 are exactly aligned.

  In FIG. 6B, the spacers 81 and 82 on the left upper surface and the left side surface are removed from the standard position state, and the spacers 81 and 82 on the right upper surface and the right side surface are changed from thickness t = 1 to t = 2. . Accordingly, the left position adjustment plate 71 moves from the standard position by the thickness t = 1 downward in the Y-axis direction and rightward in the X-axis direction, and the right position adjustment plate 72 moves from the standard position by the thickness t = 1 by the Y-axis. It moves upward and to the right of the X axis. By adjusting the spacers 81 and 82, the image sensor block 40 is moved by a thickness t = 1 in the right direction of the X axis, and is rotated counterclockwise about the intersection of the image sensor crosshairs 93. This can also be seen by the fact that the intersection of the reference cross line 91 moves to the right of the X axis with respect to the intersection of the image sensor cross line 93 and rotates counterclockwise.

  In FIG. 6C, the spacer 82 on the left side is removed from the standard position state, and the spacer 82 on the right side is changed to a thickness t = 2. Accordingly, the left and right position adjusting plates 71 and 72 have moved to the right in the X axis by a thickness t = 1 from the standard position. By this spacer adjustment, the imaging element block 40 is translated by a thickness t = 1 in the right direction of the X axis. This can also be seen by the fact that the image sensor crosshair 93 is translated in the right direction of the X axis with respect to the reference crosshair 91.

  When the above spacer adjustment is completed, the first positioning portions 71a and 72a are screwed in contact with the first reference surface 61a when there is no spacer 81, and when the spacer 81 is present, the spacer 81 is moved to the first reference surface. Screwed in a state sandwiched between 61a. Similarly, the second positioning portions 71b and 72b are fixed to the image sensor housing 60 by screws 73a, 73b, 74a, and 74b in a state where they are in contact with the second reference surface 61b when the spacer 82 is not provided, and when the spacer 82 is provided. The spacer 82 is fixed to the image sensor housing 60 by screws 73a, 73b, 74a, 74b in a state where the spacer 82 is sandwiched between the second reference surface 61b.

  As described above, according to the present embodiment, the position adjustment direction of the image sensor block 40 is adjusted using the first reference surface 61a and the second reference surface 61b orthogonal to each other and parallel to the optical axis O of the image sensor housing 60. The position of the image sensor block 40 is adjusted using the thickness of the spacers 81 and 83 with two directions perpendicular to the optical axis O and perpendicular to each other with high accuracy. Position misalignment is unlikely to occur. In addition, since the image sensor block 40 and the position adjustment plates 71 and 72 are fixed to the image sensor housing 60 by screws, the position can be easily readjusted even after manufacturing.

  In this embodiment, the image sensor block 40 is positioned by first adjusting the tilt by adjusting the upper left and right spacers 81, and then performing the vertical and horizontal position adjustments in parallel, that is, the upper left and right spacers 81. The Y-axis direction (vertical) position (vertical position) is adjusted by adjusting the same amount of the thickness, and the X-axis direction (left and right) position (lateral position) is adjusted by adjusting the thickness of the spacers 82 on both side surfaces. This is preferable.

  Although the disk-shaped spacers 81 and 82 are shown in the illustrated embodiment, they may be U-shaped or C-shaped so that the screws 73a, 73b, 74a, and 74b can be inserted and removed without being removed.

The first and second reference surfaces 61a and 61b are formed on the outer surface of the cylindrical portion 61 of the image sensor housing 60, and the position adjustment plates 71 and 72 are disposed. However, the reference surface is formed on the inner surface and the position adjustment plate is disposed. The structure to do may be sufficient.
The position adjustment plates 71 and 72 are formed in an L shape and arranged on the left and right shoulders of the image pickup device housing 60. However, the position adjustment plates 71 and 72 may be arranged on the left and right lower ends of the image pickup device housing 60 or at diagonal positions. May be.
If the tilt adjustment of the image sensor block 40 is not required, only one of the position adjustment plates 71 and 72 may be used. In this case, the connecting portion of the position adjustment plates 71 and 72 is fixed to the image sensor block 40. Thus, they are formed so as to move together.
The reference plane is, for example, two reference planes formed at positions parallel to the normal line standing on the light receiving surface 41 b of the image sensor block 40, parallel to each other, and symmetrical to the image sensor block 40 ( Only the second reference plane 61b) may be provided. These two reference planes may be provided at the upper and lower positions of the image sensor block 40.
The connecting portions 71c and 72c are configured to enter the cylindrical portion 61 through the holes of the cylindrical portion 61. However, the connecting portions 71c and 72c are formed in the cylindrical portion 61 by forming a notch, or the edge of the cylindrical portion 61 is formed. It is good also as a structure which penetrates in the cylindrical part 61 straddling from the outer side.

  Each position adjusting plate 71, 72 is fixed with three screws 73a, 73b, 73b and screws 74a, 74b, 74b, but only one screw may be provided for each. In that case, instead of the other two screws, a guide mechanism is formed by a guide pin and a guide groove that can linearly guide the position adjusting plates 71 and 72 in a direction perpendicular to the first and second reference surfaces 61a and 61b. The spacer is formed so as to fit on the guide pin.

  As mentioned above, although embodiment which applied this invention to the image pick-up element housing of a medium format digital single-lens reflex camera was shown, it can apply to general optical equipment, such as a 35mm version digital single-lens reflex camera.

DESCRIPTION OF SYMBOLS 10 Camera body 11 Exterior plate 13 Lens mount 20 Main mirror 30 Shutter device 40 Imaging device block 41 Imaging device 43 Mounting plate 43a Mounting portion 43b Boss hole 43c 43d Pin hole 50 Mirror box 60 Imaging device housing 61 Cylindrical portion 61a First reference Surface 61b Second reference surface 61c 61d Screw hole 61X Outer upper surface 61Y Both outer surfaces 62 Flange portion 62a Boss 65 Screw 71 72 Position adjustment plate 71a 72a First positioning portion 71b 72b Second positioning portion 71c 72c Connection portion 71d 72d Pin 71e 72e Long hole 71f 72f Long hole 81 82 Spacer (Spacing adjustment member)
91 Reference crosshair 93 Image sensor crosshair

Claims (10)

A positioning mechanism comprising: an imaging element ; a housing member that holds the imaging element and is mounted on an optical device; and a position adjustment member that positions the imaging element with respect to the housing member ,
A cylindrical portion surrounding the imaging element is provided on the housing member , and at least one reference plane made of a plane parallel to the normal direction of the light receiving surface of the imaging element is formed on the surface of the cylindrical portion ;
Supporting the position adjusting member movably along the reference surface of the housing member in a direction parallel to the light receiving surface; and
An image sensor positioning mechanism comprising: coupling the image sensor to the position adjustment member ; and positioning the image sensor according to a position along the reference plane of the position adjustment member . The positioning mechanism of the imaging device according to claim 1, wherein the reference surface comprises a first reference surface which is set parallel to the side of the light receiving surface of the imaging element, parallel to the other side forming the side and straight corners An imaging device positioning mechanism having a set second reference plane perpendicular to the first reference plane.   3. The positioning mechanism for an image pickup device according to claim 2, wherein the position adjusting member includes a first positioning portion that faces the first reference surface, a second positioning portion that is continuous with the first positioning portion and faces the second reference surface. An imaging device positioning mechanism comprising a positioning portion and a connecting portion connected to the second positioning portion and connected to the imaging device. 4. The positioning mechanism for an image pickup device according to claim 3, wherein a pair of the second reference surfaces are formed on opposing surfaces of the cylindrical portion, the position adjusting members are a pair, and the pair of position adjusting members are An imaging device comprising: a first positioning portion facing a different region of the first reference surface; a second positioning portion facing each of the second reference surfaces; and a connecting portion connected to a different position of the imaging device. Positioning mechanism.   5. The positioning mechanism for an image pickup device according to claim 4, wherein each of the connecting portions is connected to substantially the center of the opposite edge of the image pickup device. The positioning mechanism of the imaging device according to claim 4, wherein the tubular portion, the image pickup element have been formed to enclose a rectangular cross section of the square tube-shaped, the pair of first reference plane and a pair of second reference plane Is a positioning mechanism for an image sensor formed in the vicinity of opposite corners of the rectangular tubular section having a rectangular cross section . 7. The image sensor positioning mechanism according to claim 6 , wherein two sets of the first reference surface and the second reference surface are formed at diagonal positions of the cylindrical portion, and the position adjusting member is disposed on each of the first reference surface and the second reference surface. Image sensor positioning mechanism. The positioning mechanism of the image pickup device of any one of claims 3 to 7, and between the second reference surface and the second positioning portion of the first positioning portion and the first reference surface of the positioning member comprising a gap adjusting member is inserted and removed during the position adjustment member, the first to the position set by the inserted said spacing adjusting member, the light receiving a direction perpendicular to the second reference plane An image sensor positioning mechanism for positioning the image sensor by moving in a direction parallel to the surface . 9. The imaging element positioning mechanism according to claim 8, wherein the position adjusting member is screwed and fixed to the cylindrical portion at a position adjusted by the interval adjusting member . A positioning mechanism comprising: an image sensor; a housing member that holds the image sensor and is mounted on an optical device; and a position adjustment member that positions the image sensor relative to the housing member ,
It said housing member, a cylindrical portion surrounding the image pickup device is provided, on the surface of the cylindrical portion, symmetrical with respect to it and the image sensor in the normal direction parallel to the plane of the light receiving surface of the imaging device Forming two reference planes that are positioned and parallel to each other;
A pair of the position adjusting members are provided, and the pair of position adjusting members are movably supported in a direction parallel to the light receiving surface along each of the two reference surfaces of the housing member; and
The pair of position adjusting members have connecting portions connected to different positions of the image sensor, and are supported to be movable in a direction parallel to the light receiving surface along the reference surface with respect to the housing member. ;as well as
Connecting the pair of position adjustment members to different positions of the image pickup device, and positioning the image pickup device by a position along the reference plane of the pair of position adjustment members ;
An image sensor positioning mechanism characterized by the above.

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