JP5483673B2 - Data center cooling system - Google Patents

Description

This invention relates to a cold that is cold storage cooling device for use as a cold source, those about the configured cooling apparatus to cool the data center in particular by the cold storage has been cold.

  Patent Document 1 describes an example in which cold energy in winter is stored and the stored cold energy is used as a cold heat source in summer. In the invention described in Patent Document 1, the cover soil is frozen by introducing outside air (cold heat) in the winter into a blower pipe embedded in the cover soil covering the arch-shaped metal structure. The water stored in the ice-making water tank arranged under the floor of the metal structure is frozen and stored. Patent Document 2 discloses that one end of a heat pipe is buried in the ground, the other end is extended on the ground surface, and heat in the ground is dissipated into the atmosphere to freeze the water in the ground. And an invention configured to store cold.

JP 2003-274749 A Japanese Utility Model Publication No. 6-65764

  According to the invention described in Patent Document 1 described above, the water stored in the ice-making water tank is frozen by using the cold energy in the winter and stored, and the portion to be cooled can be cooled by the latent heat of melting of the ice. Has been. However, in the configuration described in Patent Document 1, since it is configured such that cold heat in winter is naturally transferred to the water stored in the ice making water tank and freezes, there is a possibility that heat cannot be stored efficiently.

According to the invention described in Patent Document 2 is configured so as to cool storage by permafrost the soil of ambient cooled part, also the cold storage heat by heating heat the walls forming the cooled parts to be Since the cooling unit is configured to be cooled, there is a possibility that the cold storage heat is dispersed and transmitted to the surroundings. As a result, there is a possibility that the portion to be cooled is not efficiently transmitted and the portion to be cooled cannot be sufficiently cooled.

  The present invention has been made paying attention to the above technical problem, and is a data center configured to efficiently store cold in winter and cool the cooled part efficiently using the stored cold as a cold source. An object of the present invention is to provide a cooling device.

In order to achieve the above object, the invention of claim 1 is characterized in that the soil or water has heat transferred by a thermosiphon heat pipe having a unidirectional heat transport direction and dissipated into the atmosphere. Of a data center that cools a portion to be cooled in a data center in which electronic components that generate heat are contained in the building by using the frozen water as a frozen heat source or by freezing the water and storing the cold. In the cooling device, soil having a moisture content of 5 to 40% is stored and disposed on the outer periphery of the building, and a cold storage heat storage portion that is frozen by the heat radiation through the thermosiphon heat pipe, and waterproof and has a heat insulating property, and a waterproof insulation layer is pre SL cold storage heat reservoir covers the cold storage heat reservoir to hardly affected by a temperature change of flooding or the external environment, before Symbol A heat conducting member for cooling the cooled part with cold heat of cold 蓄the cold reservoir, and is characterized in that it comprises a air conditioner or chiller unit for cooling the interior of the building.

According to a second aspect of the invention, in the invention of claim 1, wherein the cooled portion comprises an electronic component that generates heat, before Kinetsu conductive member, a second thermally transporting cold said is cold storage in the object to be cooled The cooling of the data center includes any one of a heat pipe and a heat exchange pipe for heat transport by circulating a heat transport medium between the cold storage heat storage section and the cooled section Device.

  The invention of claim 3 is the invention of claim 2, wherein the heat exchange pipe includes a fan coil unit that performs heat exchange between the heat exchange pipe and the cooled portion. This is a data center cooling device.

The invention of claim 4 is the invention of claim 1, before the thickness of the Kibo water insulation on the side in contact with the cooled part of the layer the layer is, the thickness of the side not in contact with the object to be cooled layer Ru cooler der data center, characterized in that it is formed thinner than.

  According to the first aspect of the present invention, cold heat in the winter season is transported by heat pipes to the soil or water stored in the cold storage heat storage section. Therefore, compared with the case where the cold in winter is naturally transferred to the soil or water, the cold is quickly transferred and stored. Moreover, since the cool storage heat storage part is covered with the waterproof heat insulation layer, it is hard to receive the influence of an external environment, and can suppress the loss of cool storage heat. Furthermore, since the cold-stored cold heat is taken out by the heat conducting member and is transported to the cooled portion for cooling, the heat transport efficiency of the cold-storage heat can be improved.

  According to the invention of claim 2, in addition to the effect similar to the effect of the invention of claim 1, since the cooled part includes the electronic component that generates heat, it is possible to cool the electronic component that generates heat by the cold storage heat. it can. Moreover, since the to-be-cooled part is provided inside the cold storage heat storage part or the waterproof heat insulating layer, it is not easily affected by changes in the external environment. Then, since the stored cold heat is taken out by the second heat pipe or the heat transport medium and transported to the cooled part, the heat transport efficiency of the cool heat can be improved. In addition, since no power is required to store cold heat, a quiet device can be configured.

  According to the invention of claim 3, in addition to the effect similar to the effect of the invention of claim 2, the fan coil unit that performs heat exchange between the heat exchange pipe for heat transporting the cold and the portion to be cooled is provided. Therefore, the part to be cooled can be cooled by the fan coil unit.

  According to invention of Claim 4, in addition to the effect similar to the effect by invention of Claim 1, a to-be-cooled part is provided adjacent to a cool storage heat storage part, and also covers a cool storage heat storage part, and a to-be-cooled part Since the thickness of the waterproof heat insulating layer on the side in contact with the surface is formed relatively thin, cold storage heat can be transmitted to the cooled part via the waterproof heat insulating layer.

It is a figure which shows typically an example of the cooling device of the data center which concerns on this invention. It is a figure which shows typically the other example of the cooling device of the data center which concerns on this invention. It is a figure which shows typically the further another example of the cooling device of the data center which concerns on this invention. Other examples of addition to further data center cooling system of the invention is a diagram schematically showing. It is a figure which shows an example of the conventional data center typically.

Next, the present invention will be specifically described with reference to the drawings. FIG. 5 is a diagram schematically showing an example of a conventional data center 1. In the data center 1, a plurality of server racks 2 are installed in the room, and more electronic components such as a central processing unit (CPU) are accommodated in the server rack 2. These electronic components that generate heat, such as a CPU, are configured to cool the entire interior of the building 4 in which the server rack 2 is accommodated by the cold generated by the air conditioner 3 or the chiller unit 3, and to be cooled thereby. Yes. Therefore, in such a conventional data center 1, as the data processing capacity increases, the amount of cooling heat for cooling electronic components such as the CPU increases, and the air conditioner 3 or chiller unit 3 or the like increases. Power consumption for operating the cooling device tends to increase. A similar tendency can be seen in large computer systems such as supercomputers. Therefore, if the cold energy in winter can be stored and used for cooling large computer systems such as data center 1 or supercomputers, the consumption of cooling The amount of power can be reduced.

FIG. 1 is a diagram schematically showing an example of the cooling device 5 of the data center 1 according to the present invention. FIG. 1 shows that at least the accumulated coldness is 300 ° C. This is an example in which a facility having a large computer system such as a data center 1 or a supercomputer is constructed in a cold region of day or more, and cold energy in the winter is stored and used as a cold heat source in the summer. More specifically, the building 4 of the data center 1 is constructed underground with a material such as concrete having excellent durability, and on the outer periphery thereof, soil 6a or water 6b for storing cold in winter is stored in the cold storage heat storage section 6. It is stored and arranged. The cold storage heat reservoir 6 is covered by the waterproof insulation layer 7 having a waterproof and cross heat is configured to hardly affected by external environment. The cold storage heat storage unit 6 is provided with one end of a heat pipe 8 for heat transport of cold in winter to the soil 6a or water 6b so as to be able to transfer heat. The other end of the heat pipe 8 extends to the ground surface, and a plurality of radiating fins 8a are provided so that heat can be transferred. That is, when the outside air temperature is lower than that of the soil 6a or water 6b stored in the cold storage heat storage unit 6 in winter, the heat of the soil 6a or water 6b is transported to the ground surface by the heat pipe 8 to be radiated fin 8a. It is configured to radiate heat from the atmosphere to the atmosphere. For this reason, the soil 6a stored in the cold storage heat storage section 6 is frozen by the cold in winter, or the water 6b is frozen and stored cold. Incidentally, the heat pipes 8 which heat transport outside air cold heat to the cold storage heat reservoir 6, thermo siphon Hitopai flop not work with the top heat conditions such as summer is used. Further, the water content of the soil 6a that is stored in the cold storage heat reservoir 6, Ru 5-40% der. The soil 6a having such a moisture content can obtain strength comparable to that of concrete by frosting.

The cold storage heat storage unit 6 can transfer heat from one end of the second heat pipe 9 that transports the stored cold heat into the room 4 of the data center 1 in which the server rack 2 is disposed. Is provided. The other end of the second heat pipe 9 is extended to the interior of the data center 1, so that it can heat exchange with the other side of the de Tasenta 1 to the end chamber of the heat and the heat transported cold A plurality of radiating fins 9a are provided so as to be able to transfer heat. In the data center 1, an air conditioner 3 or an indoor unit 3a of the chiller unit 3 is arranged in the room so that the room temperature can be adjusted. The air conditioner 3 or the outdoor unit 3b of the chiller unit 3 is installed on the ground surface.

Therefore, according to the cooling device 5 configured as described above, when the outside air temperature is lower than the soil 6a or water 6b stored in the cold storage heat storage unit 6 in winter, the heat of the soil 6a or water 6b is obtained. Is heat transported to the ground surface by the heat pipe 8. The heat transported heat, soil 6a that is stored in cold storage heat reservoir 6 is released to the atmosphere is permafrost reduction, even Shikuwamizu 6b is ice formation to cool蓄from the radiating fins 8a. Then, cold heat is cold storage is being heat transport in the room in the data center 1 by the second heat pipe 9, i.e. the soil 6a Moshiku been turned into frozen ground is a heat of fusion heat transport icy water 6b, the room It is configured to cool. Therefore, it is possible to cool an electronic component that generates heat, such as a CPU, by cold storage heat. Moreover, since the cool storage heat storage part 6 is covered with the waterproof heat insulation layer 7, and it is hard to receive the influence of the change of external environment, the loss of cool storage heat can be suppressed. Furthermore, since cold energy in winter can be stored and used for cooling the data center 1, the power consumption required for the operation of the air conditioner 3 or chiller unit 3 that cools the data center 1 can be reduced.

FIG. 2 is a diagram schematically showing another example of the cooling device 5 of the data center 1 according to the present invention. About the structure similar to FIG. 1, the same code | symbol is attached | subjected to FIG. 2, and the description is abbreviate | omitted. In FIG. 2, the building 4 of the data center 1 has at least an accumulated coldness of 300 ° C. A cold storage area 6 is installed adjacent to the data center 1 for storing cold heat in the winter. The cold storage heat storage unit 6 is provided with a heat pipe 8 for transporting the cold heat in winter to the soil 6a or water 6b stored therein. Further, the cold storage heat storage unit 6 is covered with a waterproof heat insulating layer 7. The thickness of the waterproof heat insulating layer 7 is smaller than the thickness of the waterproof heat insulating layer 7 on the side in contact with the outside air, on the side in contact with the building 4 of the data center 1. It is configured as follows. Incidentally, the heat pipes 8 which heat transport outside air cold heat to the cold storage heat reservoir 6, thermo siphon Hitopai flop not work with the top heat conditions such as summer is used. Further, the water content of the soil 6a that is stored in the cold storage heat reservoir 6, Ru 5-40% der. The soil 6a having such a moisture content can obtain strength comparable to that of concrete by frosting. Furthermore, the air conditioner 3 or the indoor unit 3a of the chiller unit 3 is arranged in the room so that the room temperature can be adjusted. The outdoor unit 3b of the air conditioner 3 or the chiller unit 3 is installed on the ground surface.

Therefore, according to the cooling device 5 configured as described above, when the outside air temperature is lower than the soil 6a or water 6b stored in the cold storage heat storage unit 6 in winter, the heat of the soil 6a or water 6b is obtained. There is radiated from the heat transported by the heat radiation fins 8a by a heat pipe 8 to the atmosphere, soil 6a that is stored in cold storage heat reservoir 6 is permafrost reduction, even Shikuwamizu 6b are cold storage by ice formation. Then, cold accumulating heat stored in the cold storage heat reservoir 6 waterproofing heat insulating layer 7 having a thickness of the layer is constituted thin conducts the heat, i.e. the heat of fusion of soil 6a Moshiku been turned into frozen ground icy water 6b is Den It is configured to heat and cool the data center 1. As a result, it is possible to cool electronic components that generate heat, such as a CPU, by cold storage heat. Moreover, since the cool storage heat storage part 6 is covered with the waterproof heat insulation layer 7, and it is hard to receive the influence of the change of external environment, the loss of cool storage heat can be suppressed. Furthermore, since the cold energy in the winter is stored and this stored heat is transmitted to the data center 1 to cool the data center 1, when the data center 1 is cooled by the air conditioner 3 or the chiller unit 3, etc. The power consumption required for the operation of the cooling device can be reduced.

FIG. 3 is a diagram schematically showing still another example of the cooling device 5 of the data center 1 according to the present invention. The same configurations as those in FIG. 2 described above are denoted by the same reference numerals in FIG. 3 and description thereof is omitted. In FIG. 3, the building 4 of the data center 1 has at least an accumulated cold temperature of 300 ° C. A cold storage area 6 is installed adjacent to the data center 1 for storing cold heat in the winter. The cold storage heat storage unit 6 is provided with a heat pipe 8 for transporting the cold heat in winter to the soil 6a or water 6b stored therein. Further, the cold storage heat storage unit 6 is covered with a waterproof heat insulating layer 7. The thickness of the waterproof heat insulating layer 7 is similar to that of the waterproof heat insulating layer 7 on the side in contact with the outside air as in FIG. 2, and the layer on the side in contact with the building 4 of the data center 1. It is comprised so that thickness may become thin. The heat pipes 8 which heat transport outside air cold heat to the cold storage heat reservoir 6, thermo siphon Hitopai flop not work with the top heat conditions such as summer is used. Further, the water content of the soil 6a that is stored in the cold storage heat reservoir 6, Ru 5-40% der. The soil 6a having such a moisture content can obtain strength comparable to that of concrete by frosting.

The cold storage heat storage unit 6 can transfer heat from one end of the second heat pipe 9 that transports the stored cold heat into the room 4 of the data center 1 in which the server rack 2 is disposed. Is provided. The other end of the second heat pipe 9 extends to the server rack 2 arranged in the room of the data center 1. The plurality of heat radiation fins 9a to allow direct heat exchange between the heat and the heat transported cold generated by the service Barakku 2 to its other end is provided so as to be heat transfer. Here, the other end of the second heat pipe 9 is provided so as to be able to transfer heat to a heat generating part such as a CPU housed in the server rack 2 so as to directly take heat from the heat generating part. May be. Further, the air conditioner 3 or the indoor unit 3a of the chiller unit 3 is disposed in the room, and the room temperature can be adjusted. The outdoor unit 3b of the air conditioner 3 or the chiller unit 3 is installed on the ground surface.

Therefore, according to the cooling device 5 configured as described above, when the outside air temperature is lower than the soil 6a or water 6b stored in the cold storage heat storage unit 6 in winter, the heat of the soil 6a or water 6b is obtained. There is radiated from the heat transported by the heat radiation fins 8a by a heat pipe 8 to the atmosphere, soil 6a that is stored in cold storage heat reservoir 6 is permafrost reduction, even Shikuwamizu 6b are cold storage by ice formation. And the regenerative heat stored in the regenerative heat storage section 6 not only transfers the waterproof heat insulating layer 7 to cool the data center 1 but is also thermally transported into the data center 1 by the second heat pipe 9. that soil 6a Moshiku been turned into frozen ground is a heat of fusion heat transport icy water 6b, because they are configured to cool the room, to cool the electronic components that generate heat, such as CPU by cold storage heat it can. Moreover, since the cool storage heat storage part 6 is covered with the waterproof heat insulation layer 7, and it is hard to receive the influence of the change of external environment, the loss of cool storage heat can be suppressed. Furthermore, since the cold energy in the winter is stored and the stored heat is transported to the data center 1 to cool the data center 1, when the data center 1 is cooled by the air conditioner 3 or the chiller unit 3, etc. The power consumption required for the operation of the cooling equipment can be reduced.

FIG. 4 is a diagram schematically showing still another example of the cooling device 5 of the data center 1 according to the present invention. The components similar to those in FIG. 3 described above are denoted by the same reference numerals in FIG. 4 and description thereof is omitted. In FIG. 4, the building 4 of the data center 1 has at least an accumulated coldness of 300 ° C. A cold storage area 6 is installed adjacent to the data center 1 for storing cold heat in the winter. The cold storage heat storage unit 6 is provided with a heat pipe 8 for transporting the cold heat in winter to the soil 6a or water 6b stored therein. Further, the cold storage heat storage unit 6 is covered with a waterproof heat insulating layer 7. The thickness of the waterproof heat insulating layer 7 is similar to that of the waterproof heat insulating layer 7 on the side in contact with the outside air as in FIG. 2, and the layer on the side in contact with the building 4 of the data center 1. It is comprised so that thickness may become thin. The heat pipes 8 which heat transport outside air cold heat to the cold storage heat reservoir 6, thermo siphon Hitopai flop not work with the top heat conditions such as summer is used. Further, the water content of the soil 6a that is stored in the cold storage heat reservoir 6, Ru 5-40% der. The soil 6a having such a moisture content can obtain strength comparable to that of concrete by frosting.

  Further, a heat exchange pipe 10 through which the heat transport medium 10 a flows is laid between the cold storage heat storage unit 6 and the inside of the building 4 of the data center 1, and the cold storage heat is transferred to the building 4 of the data center 1. It is configured so that heat can be transported indoors. A part of the heat exchange pipe 10 is exposed inside the building 4 of the data center 1, and a fan coil unit that exchanges heat between the heat in the room of the data center 1 and the heat transport medium 10a that has been heat transported. 11 is provided. Further, the air conditioner 3 or the indoor unit 3a of the chiller unit 3 is disposed in the room, and the room temperature can be adjusted. The outdoor unit 3b of the air conditioner 3 or the chiller unit 3 is installed on the ground surface.

Therefore, according to the cooling device 5 configured as described above, when the outside air temperature is lower than the soil 6a or water 6b stored in the cold storage heat storage unit 6 in winter, the heat of the soil 6a or water 6b is obtained. There is radiated from the heat transported by the heat radiation fins 8a by a heat pipe 8 to the atmosphere, soil 6a that is stored in cold storage heat reservoir 6 is permafrost reduction, even Shikuwamizu 6b are cold storage by ice formation. Cold storage heat stored in the cold storage heat reservoir 6 is transferred to the waterproof heat insulating layer 7, i.e. the data center 1 soil 6a Moshiku been turned into frozen ground via a heat of fusion waterproof heat insulating layer 7 of icy water 6b Cooling. The cold storage heat is also transported into the data center 1 by the heat transport medium 10 a flowing through the heat exchange pipe 10. The cold storage heat transported into the room of the data center 1 is exchanged with the indoor heat by the fan coil unit 11 to cool the room, so that the heat generated by the CPU or the like is generated by the cold storage heat. The electronic parts can be cooled. Moreover, since the cool storage heat storage part 6 is covered with the waterproof heat insulation layer 7, and it is hard to receive the influence of the change of external environment, the loss of cool storage heat can be suppressed. Furthermore, since the cold energy in the winter is stored and the stored heat is transported to the data center 1 to cool the data center 1, when the data center 1 is cooled by the air conditioner 3 or the chiller unit 3, etc. The power consumption required for the operation of the cooling equipment can be reduced.

  According to the data center cooling apparatus of the present invention, a facility having a large computer system such as a data center or a supercomputer is installed at an integrated cold temperature of 300 ° C. By constructing in a cold area of day or more and storing cold in winter, a cold source of a large computer system such as a data center or a supercomputer in summer can be secured. In addition, since a cold heat source can be secured, it is possible to reduce power consumption related to cooling a large computer system such as a data center or a supercomputer.

  DESCRIPTION OF SYMBOLS 1 ... Data center, 5 ... Cooling device, 6 ... Cold storage heat storage part, 6a ... Soil, 6b ... Water, 7 ... Waterproof heat insulation layer, 8 ... Heat pipe, 9 ... Second heat pipe, 10 ... Heat exchange piping 10a ... heat transport medium, 11 ... fan coil unit.

Claims (4)

The heat of the soil or water is transported by a thermosyphon heat pipe whose heat transport direction is one direction and is dissipated to the atmosphere, so that the soil is frozen, or the water is frozen to store cold, and the cold storage In the data center cooling device that cools the cooled part in the data center in which the electronic components that generate heat are stored inside the building using the cold heat as a cold heat source ,
A regenerative heat storage section in which soil having a moisture content of 5 to 40% is stored and disposed on the outer periphery of the building, and is frozen by the heat radiation through the thermosiphon heat pipe ,
A waterproof and has a heat insulating property, and a waterproof insulation layer is pre SL cold storage heat reservoir covers the cold storage heat reservoir as less susceptible to the impact temperature change of flooding or the external environment,
A heat conducting member for cooling the cooled part with cold heat of cold 蓄before Symbol cold storage heat reservoir,
An air conditioner or chiller unit that cools the interior of the building;
Cooling system of the data center, characterized in that it comprises a. The cooled part includes an electronic component that generates heat ,
Before Kinetsu conductive member includes a second heat pipe heat transport cold heat said is cold storage in the object to be cooled, by circulating a heat transport medium between the object to be cooled and the cold storage heat reservoir The data center cooling device according to claim 1, comprising any one of heat exchange pipes for heat transport. 3. The data center cooling apparatus according to claim 2, wherein the heat exchange pipe includes a fan coil unit that performs heat exchange between the heat exchange pipe and the portion to be cooled. Claims before the at Kibo water heat insulating layer thickness of the layer of the side in contact with the cooled part, characterized in that the formed thinner than the thickness of the side not in contact with the object to be cooled layer Item 4. The data center cooling device according to Item 1.

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