JP5487739B2 - Substrate bonding apparatus and substrate bonding method - Google Patents

Description

  The present invention relates to an alignment apparatus, a substrate bonding apparatus, and a manufacturing method.

  There is a method for manufacturing a stacked semiconductor device in which semiconductor substrates each formed with a plurality of elements and the like are stacked and bonded together. When the semiconductor substrates each having an element are bonded to each other, the pair of semiconductor substrates held in parallel is precisely positioned and overlapped with the line width accuracy of the circuit. For this reason, an alignment apparatus that precisely aligns a pair of semiconductor substrates is used (see Patent Document 1).

JP 2005-251972 A

  Since the alignment device aligns a pair of semiconductor substrates facing each other, at least one of the stages holding each semiconductor substrate is in the direction in which the held semiconductor substrate falls when the holding force of the semiconductor substrate is released Hold the semiconductor substrate. For this reason, when a semiconductor substrate is carried in or out of the stage of the alignment apparatus, an expensive semiconductor substrate on which elements have already been formed may fall.

  In order to solve the above-mentioned problem, as a first aspect of the present invention, there is provided an alignment apparatus for aligning and superposing one semiconductor substrate on another semiconductor substrate, and superimposing the other semiconductor substrate on the one semiconductor substrate. A first stage for holding the mating surface upward, a second stage for holding the surface to be superimposed on one semiconductor substrate in another semiconductor substrate, and at least one of the first stage and the second stage as one semiconductor There is provided an alignment apparatus including a stage rotating unit that rotates in a vertical direction until the overlapping surfaces of a substrate and another semiconductor substrate face each other.

  Moreover, as a second aspect of the present invention, there is provided a substrate bonding apparatus including the alignment apparatus and a pressure apparatus that pressurizes and bonds the semiconductor substrates stacked by the alignment apparatus.

  Furthermore, as a third aspect of the present invention, there is provided a manufacturing method of a semiconductor device including an overlapping step of overlapping one semiconductor substrate with another semiconductor substrate, wherein the first step is performed prior to the overlapping step. A first holding stage for holding the surface of one semiconductor substrate to be superimposed on another semiconductor substrate upward, and a second stage for holding the surface of the other semiconductor substrate to be superimposed on one semiconductor substrate facing upward There is provided a manufacturing method including a second holding stage and a stage moving stage in which at least one of the first stage and the second stage is moved until the overlapping surfaces of one semiconductor substrate and another semiconductor substrate face each other.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a top view which shows the structure of the board | substrate bonding apparatus 100 whole. It is a longitudinal cross-sectional view which shows the structure of the board | substrate bonding apparatus 100 whole. 3 is a longitudinal sectional view schematically showing the structure of a pressurizing device 130. FIG. It is a figure which shows the state of the semiconductor substrate in the substrate bonding apparatus. It is a figure which shows the state of the semiconductor substrate in the substrate bonding apparatus. It is a figure which shows the state of the semiconductor substrate in the substrate bonding apparatus. It is a figure which shows the transition of the state of the semiconductor substrate 102 in the board | substrate bonding apparatus 100. FIG. It is a figure which shows operation | movement of the coarse movement stage 124. FIG. FIG. 6 is a diagram showing the operation of the upper stage 226. 4 is a cross-sectional view showing a support structure for an upper stage 226. FIG. It is a top view which shows the position of the upper stage 226 which moved.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a plan view of the substrate bonding apparatus 100. FIG. 2 is a longitudinal sectional view of the substrate bonding apparatus 100. The overall structure of the substrate bonding apparatus 100 will be described with reference to these drawings.

  The substrate bonding apparatus 100 includes an alignment apparatus 120, a pressure apparatus 130, a holder stocker 140, an environmental loader 150, a load lock 160, a pre-aligner 170, and an atmospheric loader 180 housed in a housing 110. A plurality of FOUPs (Front Opening Unified Pods) 190 are mounted on the outer surface of the housing.

  The FOUP 190 accommodates a plurality of semiconductor substrates 102. By mounting the FOUP 190 on the substrate bonding apparatus 100, a plurality of semiconductor substrates 102 can be loaded into the substrate bonding apparatus 100 at once.

  Inside the housing 110, an atmospheric loader 180 is arranged immediately before the FOUP 190. The atmospheric loader 180 has a fork 184 and a support arm 186. The fork 184 places and holds the semiconductor substrate 102. The fork 184 is supported via the support arm 186 and moves according to the advance / retreat of the support arm 186.

  Furthermore, the atmospheric loader 180 moves along a guide rail 182 disposed along one side of the casing 110 in which the FOUP 190 is disposed in the same atmospheric environment as the outside of the substrate bonding apparatus 100. As a result, the semiconductor substrate 102 is unloaded from one of the FOUPs 190 and moved to the pre-aligner 170.

  The pre-aligner 170 corrects the mounting position of the semiconductor substrate 102 with respect to the atmospheric loader 180 in the process of mounting the semiconductor substrate 102 carried in by the atmospheric loader 180 on the atmospheric loader 180 again. Thereby, after passing through the pre-aligner 170, the semiconductor substrate 102 can be moved with the position control accuracy of the atmospheric loader 180. A pre-aligner control unit 117 that controls the operation of the pre-aligner 170 is disposed adjacent to the pre-aligner 170.

  The semiconductor substrate 102 pre-aligned in the pre-aligner 170 is carried into the load lock 160 by the atmospheric loader 180. The atmospheric loader 180 is also used when the semiconductor substrate 102 carried out from the load lock 160 is collected in any of the FOUPs 190.

  The load lock 160 has shutters 164 and 162 that can be individually opened and closed on the atmospheric loader 180 side and the environment loader 150 side described later. The interior of the load lock 160 is exhausted by being coupled to a vacuum source (not shown).

  A mounting table 166 is arranged inside the load lock 160. First, the substrate holder 104 is placed on the mounting table 166, and then the semiconductor substrate 102 is mounted on the substrate holder 104. The substrate holder 104 has a smooth holding surface, and holds the semiconductor substrate 102 on the holding surface by vacuum suction, electrostatic suction, or the like. This protects the fragile semiconductor substrate 102 and facilitates handling.

  An alignment device 120 is disposed in the housing 110 of the substrate bonding apparatus 100 in the vicinity of the upper end in the drawing. The alignment device 120 includes a guide rail 122, a coarse movement stage 124, a lower stage 126, and a rotation guide unit 222.

  The alignment device 120 is surrounded by a heat resistant wall 129. Thereby, the influence which the heat radiated from the pressurization apparatus 130 etc. which will be described later has on the accuracy of the alignment apparatus 120 is cut off. An inlet 127 is disposed on one surface of the heat-resistant wall 129 (the lower surface in the illustrated example), and the semiconductor substrate 102 and the like are carried into the lower stage 126 and the like through this. Further, when the inside of the alignment device 120 is vacuum, it is not necessary to provide a load lock as shown in the figure, but when the inside of the alignment device 120 is not vacuum, a load lock may be provided at the loading port 127. .

  In the alignment device 120, the pair of guide rails 122 are arranged in parallel to the longitudinal direction of the region surrounded by the heat resistant wall 129. As a result, the coarse movement stage 124 is guided by the guide rail 122 and moves in the X direction. The lower stage 126 moves further in the X direction and the Y direction on the coarse movement stage 124. Therefore, the coarse drive stage 124 is mounted with the X drive unit 123 and the Y drive unit 121 together with the lower stage 126. A substrate holder 104 and a semiconductor substrate 102 described later are mounted on the lower stage 126.

  Further, on the lower stage 126, a pair of reflecting mirrors 128 arranged orthogonal to each other are mounted. Since the reflecting mirror 128 reflects light emitted from an interferometer (not shown), the position and displacement of the lower stage 126 can be accurately measured. Further, a rotation guide part 222 for guiding an upper stage, which will be described later, is disposed on the side of the lower stage 126, which will be described later.

  In the alignment apparatus 120, the lower stage 126 is coupled to a voltage source and a decompression source through a duct 125. Thereby, the substrate holder 104 and the like can be sucked and held on the upper surface of the lower stage 126. Further, the electrostatic chucking of the semiconductor substrate 102 by the substrate holder 104 can be maintained.

  Further, as is apparent from FIG. 2 in particular, the alignment device 120 includes an upper stage 226 suspended from the rotation guide unit 222. The rotation guide unit 222 is supported by a stopper 225 that also serves as a support column. The upper stage 226 holds another semiconductor substrate 102 so as to face the semiconductor substrate 102 held by the lower stage 126.

  As already described, since the lower stage 126 moves in the X-Y direction, the pair of semiconductor substrates 102 are aligned by adjusting the position of the lower stage 126 with respect to the fixed upper stage 226, for example. be able to. The pair of aligned semiconductor substrates 102 are temporarily joined while maintaining the aligned state by moving the lower stage 126 in the Z direction and overlapping each other. In this state, the pair of semiconductor substrates 102 are transferred to a pressurizing device 130 described later.

  In the substrate bonding apparatus 100, an alignment control unit 112 is disposed adjacent to the alignment apparatus 120. The alignment device 120 executes the above-described series of alignment operations under the control of the alignment control unit 112. In addition, the alignment device 120 is supported on the housing 110 of the substrate bonding device 100 via the vibration isolation legs 111. Thereby, the influence which the vibration which arises by operation | movement of the atmospheric loader 180, the environmental loader 150, the pressurization apparatus 130, etc. has on the alignment accuracy of the alignment apparatus 120 is interrupted | blocked.

  In the middle of the substrate bonding apparatus 100, an environmental loader 150 is disposed. The environment loader 150 includes a pair of forks 152 on which a substrate holder 104 described later is mounted, and a folding arm 154 that supports the pair of forks 152 in common.

  The pair of forks 152 can be used properly, for example, when transporting the room temperature substrate holder 104 carried into the alignment device 120 and when transporting the high temperature substrate holder 104 carried out from the pressurizing device 130 described later. it can. Thereby, it can prevent that the alignment precision in the alignment apparatus 120 falls by the heat | fever transmitted to the board | substrate holder 104 from the environment loader 150. FIG.

  The environment loader 150 is surrounded by the load lock 160, the alignment device 120, the plurality of holder stockers 140, and the plurality of pressure devices 130. Thereby, the environmental loader 150 can carry in or carry out the semiconductor substrate 102 with respect to each element which forms the board | substrate bonding apparatus 100. FIG.

  The load lock 160, the alignment device 120, the holder stocker 140, and the plurality of pressure devices 130 are hermetically closed by an airtight wall 159. Thereby, the surroundings of the environmental loader 150 are exhausted, and the alignment device 120, the pressurizing device 130, and the environmental loader 150 can be operated in a vacuum atmosphere.

  The holder stocker 140 accommodates and waits for the substrate holder 104 that is not used at that time before or after use. The pressurizing device 130 will be described later with reference to FIG.

  FIG. 3 is a longitudinal sectional view schematically showing the structure of the pressure device 130 alone. The pressurizing device 130 includes a surface plate 138 and a heating plate 136 that are stacked from the bottom of the housing 132, and an indented portion 134 and a heating plate 136 that are suspended from the ceiling surface of the housing 132. Each of the heating plates 136 includes a heater. An inlet 131 is provided on one of the side surfaces of the housing 132.

  The semiconductor substrate 102 that has already been aligned and overlaid is loaded into the pressure device 130 and placed on the upper surface of the heating plate 136 on the surface plate 138. The pressurizing device 130 raises the temperature of the heating plate 136 and then pushes down the upper heating plate 136 by the indented portion 134. Accordingly, the semiconductor substrate 102 and the substrate holder 104 sandwiched between the heating plates 136 are pressurized, and the semiconductor substrate 102 is permanently bonded.

  Although not shown, a cooling unit that cools the semiconductor substrate 102 after heating and pressurization may be provided in the pressurizer 130. Thereby, even if it does not reach room temperature, the semiconductor substrate 102 cooled to some extent can be carried out and quickly returned to the FOUP 190. The substrate bonding apparatus 100 includes a pressure control unit 113 and controls the operation of the pressure apparatus 130.

  4A, 4B, 4C, and 4D are diagrams showing the transition of the state of the semiconductor substrate 102 in the substrate bonding apparatus 100. FIG. First, as shown in FIG. 4A, the semiconductor substrate 102 loaded with the atmospheric loader 180 into the load lock 160 is mounted on the substrate holder 104 carried out from the holder stocker 140 and loaded into the load lock 160. .

  The substrate holder 104 sucks and holds the semiconductor substrate 102 by electrostatic suction or the like. In the following process, the semiconductor substrate 102 and the substrate holder 104 are integrally handled. In this way, two sets of substrate holders 104 holding the semiconductor substrate 102 are prepared.

  Next, as shown in FIG. 4B, the pair of substrate holders 104 each holding the semiconductor substrate 102 are aligned with each other in a state in which one of the substrate holders 104 is inverted and opposed to each other. The aligned semiconductor substrates 102 are superimposed and temporarily joined.

  In the alignment apparatus 120, since the pair of semiconductor substrates 102 are not yet bonded, the clip 106 is fitted in the groove 105 of the substrate holder 104. Thereby, it can convey, with the position alignment apparatus 120 hold | maintained.

  The semiconductor substrate 102 superimposed after alignment is carried into the pressurizing device 130 by the environmental loader 150. By being heated and pressurized by the pressurizing device 130, the pair of stacked semiconductor substrates 102 are permanently bonded to form the stacked semiconductor substrate 103.

  FIG. 5 is a diagram illustrating an operation of the alignment apparatus 120 when the substrate holder 104 holding the semiconductor substrate 102 is mounted on the upper stage 226 of the alignment apparatus 120. When the substrate holder 104 holding the semiconductor substrate 102 is loaded into the alignment apparatus 120, first, the coarse movement stage 124 is moved in a direction away from the rotation guide unit 222. As a result, the lower stage 126 is retracted from the initial position, and the space occupied by the lower stage 126 is vacated.

  FIG. 6 is a diagram illustrating the operation of the upper stage 226 following the operation of the coarse movement stage 124 described above. As shown in the figure, the upper stage 226 moves along the rotation guide unit 222 and rotates in the vertical direction in the course of movement so that the mounting surface faces upward.

  The upper stage 226 that has moved along the rotation guide unit 222 eventually comes into contact with a stopper 225 that also serves as a support unit for the rotation guide unit 222 and stops. At this time, since the lower power supply terminal 223 contacts the power supply terminal 223 of the upper stage 226, power is supplied to the upper stage 226 again.

  Further, although not shown in the figure, a pressure hose communicating with a reduced pressure source is coupled to the upper stage 226. The pressure hose is twisted with the rotational movement of the upper stage 226, but there is no problem in holding the substrate holder 104.

  In other words, the power and pressure are not supplied to the upper stage 226 while moving while rotating, but the electrostatic chuck can continue to hold the semiconductor substrate 102 for a short time. . Even when the vacuum chuck is disconnected from the reduced pressure source, the substrate holder 104 can be held for a short time.

  However, since it is not preferable that the substrate holder 104 and the semiconductor substrate 102 drop and fall during the movement, it is also preferable to provide a drop prevention portion 236. The drop-off prevention unit 236 is, for example, inserted near the surface of the held semiconductor substrate 102 in conjunction with the retraction operation of the coarse movement stage 124. Thereby, it is possible to prevent the semiconductor substrate 102 or the substrate holder 104 that is no longer held from the upper stage 226 from falling down.

  Further, the upper stage 226 is equipped with a microscope 224 for observing the surface of the semiconductor substrate 102 mounted on the lower stage 126 when the lower stage 126 is opposed. By observing the alignment mark formed on the semiconductor substrate 102 on the lower stage 126 with the microscope 224, for example, the semiconductor substrate 102 held on the upper stage 226 and the lower stage 126 can be aligned with each other.

  FIG. 7 is a cross-sectional view showing a support structure of the upper stage 226 by the rotation guide unit 222. The rotation guide unit 222 includes a drive unit 210 and a static pressure bearing unit 230.

  On the other hand, the upper stage 226 is disposed on the upper surface of the support stay 229 in the vicinity of one end of the support stay 229 (the left end in the drawing). A supported portion 227 having an inverted T-shaped cross-sectional shape and extending downward is integrally provided on the lower surface of the opposite end portion of the support stay 229 with respect to the support stay 229.

  On the other hand, a support surface 232 having a cross-sectional shape complementary to the supported portion 227 is provided inside the rotation guide portion 222. Here, an air gap 233 is formed between the supported surface 231, which is the surface of the supported portion 227, and the supporting surface 232, for example, by pressure-fed air, and the static pressure bearing portion 230 is formed.

  As a result, the supported portion 227 slides in the direction perpendicular to the paper surface inside the rotation guide portion 222. Further, since the supported surface 231 and the support surface 232 are separated by the air gap 233, the supported surface 231 and the support surface 232 do not slide in direct contact with each other. Thereby, generation | occurrence | production of the abrasion powder in the inside of the alignment apparatus 120 can be prevented.

  Further, a linear motor 228 is arranged between the supported portion 227 and the rotation guide portion 222 in the vicinity of the attachment portion to the support stay 229. The linear motor 228 forms a drive unit 210 that generates a drive force when the support stay 229 moves relative to the rotation guide unit 222.

  Further, for example, by providing a gap sensor for measuring the width of the gap between the supported surface 231 and the support surface 232 at the position indicated by the dotted line A in the drawing, the load applied to the upper stage 226 can be measured. By using, for example, an optical sensor as the gap sensor, the load on the upper stage 226 can be measured while maintaining the non-contact between the supported surface 231 and the supporting surface 232.

  FIG. 8 is a diagram illustrating a state in which the state of the upper stage 226 moved downward is looked down from above. As shown in the figure, the support stay 229 moves along the rotation guide portion 222 and stops by contacting the lower stopper 225. Since the support stay 229 pushes the upper stage 226 closer to the lower stage 126, the upper stage 226 stops at the position (the position shown in FIG. 1) where the lower stage 126 originally existed. Similarly to the lower stage 126, the upper stage 226 stops with the holding surface facing upward.

  Thereby, the environment loader 150 is in a state in which the holding surface of the upper stage 226 faces upward as in the case of mounting the substrate holder 104 on the lower stage 126 without inverting the substrate holder 104 holding the semiconductor substrate 102. Then, the substrate holder 104 is mounted on the upper stage 226.

  Due to the structure of the alignment device 120 as described above, the environment loader 150 may not have a function of inverting the substrate holder 104. Further, even when the semiconductor substrate 102 and the substrate holder 104 are individually placed on the lower stage 126 and the upper stage 226, the semiconductor substrate 102 can be placed on the upper stage 226 without being inverted. Thus, when the semiconductor substrate 102 is placed on the upper stage 226, it is not necessary to press the semiconductor substrate 102 against the substrate holder 104 held on the upper stage by a member of the environmental loader 150, for example. Therefore, the member of the environment loader 150 does not come into contact with the surface of the semiconductor substrate 102 to be overlapped.

  Furthermore, even when a time lag occurs between the timing at which the substrate holder 104 is mounted on the upper stage 226 and the timing at which suction to the upper stage 226 is started, the substrate holder 104 falls from the upper stage 226. There is nothing. Further, by moving the upper stage 226 to the lower position and directing the holding surface upward, cleaning and maintenance of the holding surface of the upper stage 226 are facilitated.

  In the state shown in the figure, the upper end of the drop-off prevention unit 236 approaches and overlaps the upper surface of the semiconductor substrate 102. Thereby, even if the holding force of the substrate holder 104 is lost for some reason when the upper stage 226 moves up along the rotation guide unit 222, the drop prevention unit 236 supports the semiconductor substrate 102 and the substrate holder 104. Prevent falling.

  When the upper stage 226 moves to the upper end of the rotation guide unit 222, the rotation driving unit 234 rotates the drop-off prevention unit 236 so that the upper end is opened. As a result, the drop-off prevention unit 236 moves to a position along the outer periphery of the substrate holder 104, so that the overlapping of the semiconductor substrates 102 is not hindered.

  In the alignment apparatus 120 as described above, after the upper stage 226 holds the semiconductor substrate 102 and the substrate holder 104, the upper stage 226 does not fully return to the upper end of the rotation guide unit 222 and the substrate is placed on the lower stage 126. You may start the operation | work which mounts the holder 104. FIG. Thereby, the work time in the alignment apparatus 120 can be shortened and the throughput of the bonding apparatus 100 can be improved.

  Further, as shown in FIG. 8, the substrate holder 104 may be simultaneously mounted by a plurality of environment loaders 150 in a state where the lower stage 126 and the upper stage 226 are arranged. Also in this case, the work time in the alignment apparatus 120 can be shortened and the throughput of the bonding apparatus 100 can be improved.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

DESCRIPTION OF SYMBOLS 100 Bonding apparatus, 102 Semiconductor substrate, 103 Stacked type semiconductor substrate, 104 Substrate holder, 105 Groove, 106 Clip, 110, 132 Case, 111 Anti-vibration leg, 112 Position control unit, 113 Pressure control unit, 117 Pre-aligner Control unit, 120 alignment device, 121 Y drive unit, 122, 182 guide rail, 123 X drive unit, 124 coarse movement stage, 125 duct, 126 lower stage, 127 loading port, 128 reflector, 129 heat resistant wall, 130 heating Pressure device, 131 loading port, 134 pressure lower part, 136 heating plate, 138 surface plate, 140 holder stocker, 150 environmental loader, 152, 184 fork, 154 folding arm, 159 airtight wall, 160 load lock, 162, 164 shutter, 166Loading table, 170 Pre-aligner, 180 Atmospheric loader, 186 Support arm, 190 FOUP, 210 Drive unit, 222 Rotation guide unit, 223 Power supply terminal, 224 Microscope, 225 Stopper, 226 Upper stage, 227 Supported portion, 228 Linear motor, 229 Support stay, 230 hydrostatic bearing part, 231 supported surface, 232 support surface, 233 air gap, 234 rotation drive part, 236 drop-off prevention part

Claims (10)

A substrate bonding apparatus for bonding two semiconductor substrates together,
A stage having an adsorption part for adsorbing one of the semiconductor substrates;
A stage driving unit that moves the stage between a first position where a surface of the one semiconductor substrate is overlaid and a second position where a surface of the one semiconductor substrate is overlaid;
An alignment apparatus for aligning the one semiconductor substrate with the surface to be overlapped by the movement of the stage facing downward and the other semiconductor substrate;
A pressurizing device that pressurizes the two substrates aligned by the alignment device;
A substrate bonding apparatus comprising:   The substrate bonding apparatus according to claim 1, further comprising a drop-off preventing unit that prevents the one semiconductor substrate from falling when the stage moves from the first position to the second position.   The board | substrate bonding apparatus of Claim 1 which has a support part which supports the said stage so that a movement is possible, without sliding.   The board | substrate bonding apparatus of Claim 3 provided with the load detection part which detects the load concerning the said stage based on the change of the gap | interval between the said stage and the said support part. A substrate holder that is transported while holding at least one of the semiconductor substrates;
5. The substrate holder according to claim 1, wherein the substrate holder is held on the stage while holding the one semiconductor substrate, and moves integrally with the one substrate by driving the stage driving unit. Substrate bonding equipment. The adsorption unit adsorbs the substrate holder to the stage ,
The substrate bonding apparatus according to claim 5, wherein the substrate holder is held by sucking the one semiconductor substrate, and the suction force to the one semiconductor substrate is maintained while being held on the stage. The stage is a first stage of the alignment device;
The alignment apparatus has a second stage for holding the other semiconductor substrate of the two semiconductor substrates,
The substrate bonding according to any one of claims 1 to 6, wherein the stage driving unit moves the first stage until the overlapping surfaces of the one semiconductor substrate and the other semiconductor substrate face each other. apparatus.   The substrate bonding apparatus according to claim 7, further comprising a substrate loading unit that loads a semiconductor substrate onto the second stage while the stage driving unit rotates the first stage.   9. The substrate pasting according to claim 7, wherein when the first stage and the second stage are in the same direction, one of the first stage and the second stage is retracted to a position avoiding the other. Alignment device. A substrate bonding method for bonding two semiconductor substrates together,
A holding step of holding the one semiconductor substrate by adsorbing it to the stage by an adsorbing portion so that the surface of the one semiconductor substrate to be superimposed is facing upward;
A stage of moving the stage so that the overlapping surface of the one semiconductor substrate faces downward;
An alignment step of aligning the one semiconductor substrate with the surface to be overlapped downward by the movement of the stage and the other semiconductor substrate;
A pressurizing step of pressurizing the two substrates aligned by the alignment step;
A substrate bonding method including:

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