JP5488196B2 - Semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device that includes a high-side semiconductor element and a low-side semiconductor element and enables cooling from both sides.

  2. Description of the Related Art Conventionally, for example, a power card on which a semiconductor element is mounted is used as a semiconductor device that controls a power source of a hybrid vehicle. In general, a semiconductor element mounted on a power card is configured by a set of a transistor (for example, IGBT) and a diode. And, for the purpose of downsizing and the like, some power cards include two sets of a high-side semiconductor element connected to the P-pole side and a low-side semiconductor element connected to the N-pole side in one power card. There is what was mounted (for example, patent document 1). In such a power card (so-called 2-in-1 power card), the high-side semiconductor element is connected to the high-side electrode plate and the middle-side electrode plate, and the low-side semiconductor element is connected to the low-side electrode plate and the middle-side electrode plate.

  As a specific laminated structure of the 2-in-1 power card, for example, as described in Patent Document 2, a high-side semiconductor element and a low-side semiconductor element are laminated on a single-plate middle-side electrode plate. A high side electrode plate is laminated on the high side semiconductor element. On the other hand, a low-side electrode plate is laminated on the low-side semiconductor element. According to such a laminated structure, heat generated in each semiconductor element is dissipated to the upper high-side electrode plate and the low-side electrode plate and the lower middle-side electrode plate. Therefore, by disposing the coolers on both the upper surface side and the lower surface side of the power card, the semiconductor element can be cooled from both sides via the upper and lower electrode plates.

  Here, when manufacturing a power card, as described in Patent Document 3, for example, first, the lower surface of the semiconductor element is soldered to the upper surface of the lower electrode plate, and then the upper surface of the semiconductor element is connected to the upper electrode plate. Soldering is performed on the lower surface of the substrate. At this time, the upper electrode plate is provided with an injection port for injecting solder, and solder is injected between the upper electrode plate and the semiconductor element from this injection port, and the solder between the element and the electrode plate is injected. Joining is performed.

JP 2004-208411 A JP 2001-308263 A JP 2004-134445 A

However, when manufacturing a 2-in-1 power card, there are the following problems.
When soldering the middle side electrode plate and the semiconductor element, the joining portion of the middle side electrode plate must be heated to a predetermined temperature using a heating tool such as a soldering iron. However, in the 2-in-1 power card, since both the high-side semiconductor element and the low-side semiconductor element are connected to a single-sheet middle-side electrode plate, it is necessary to use a middle-side electrode plate having a long overall length. Therefore, for example, when soldering the high-side semiconductor element and the middle-side electrode plate, heat applied to the high-side side of the middle-side electrode plate escapes to the low-side side, resulting in poor heating efficiency. Similarly, when soldering the low-side semiconductor element and the middle-side electrode plate, heat applied to the low-side side of the middle-side electrode plate escapes to the high-side, resulting in poor heating efficiency. As a result, there has been a problem that it takes a long time to heat the joining portion of the middle side electrode plate to a necessary temperature. In this case, power consumption due to the heating device or the like also increases.

  Accordingly, the present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide a semiconductor device that can shorten the time required for the soldering process during manufacturing. .

In order to solve the above problems, the semiconductor device of the present invention has the following characteristics.
(1) In a semiconductor device comprising a high-side semiconductor element and a low-side semiconductor element and capable of cooling from both sides, a high-side electrode plate connected to the high-side semiconductor element, and the low-side semiconductor element A low-side electrode plate to be connected; a high-side semiconductor element; and a middle-side electrode plate to be connected to the low-side semiconductor element, wherein the middle-side electrode plate is connected to the high-side semiconductor element. And the low side plate part connecting the low side semiconductor element is connected via a connecting part having a smaller cross-sectional area than the high side plate part and the low side plate part , the connecting part is It is the remaining portion when a slit penetrating in the thickness direction is formed in the middle side electrode plate, the slip It is characterized in that extending from either side of the middle side electrode plates so as to be perpendicular to the coupling direction towards extending towards the center or from the one end, the other end side.
Here, the “connecting portion having a small cross-sectional area” is a cross-sectional area that is sufficiently small to prevent heat applied to the joint portion with one element from escaping to the other element side beyond the connecting portion. The cross-sectional area of the connecting part is 1/5 to 1/2 of the cross-sectional area of the high-side side plate part and the low-side side plate part. It is desirable that the degree.

(2) In the semiconductor device described in (1) , the slit extends in a connecting direction around the connecting portion .

The semiconductor device of the present invention has the following operations and effects.
(1) The amount of heat that moves between two objects is proportional to the heat transfer area between the two objects. Therefore, in the semiconductor device of the present invention, the heat transfer area between the high side plate and the low side plate is obtained by connecting the high side plate and the low side plate via a connecting portion having a small cross-sectional area. Is made smaller. Thereby, when soldering the high-side side plate portion and the high-side side semiconductor element, it is possible to suppress the heat applied to the joining portion of the high-side side plate portion from escaping to the low-side side plate portion beyond the connecting portion. . Similarly, when soldering the low-side side plate portion and the low-side side semiconductor element, it is possible to suppress the heat applied to the joining portion of the low-side side plate portion from escaping to the high-side side plate portion beyond the connecting portion. Thus, since the heating efficiency of the middle side electrode plate can be increased, it is possible to shorten the time required to heat the bonding portion to a necessary temperature, and to shorten the time required for the solder bonding process during manufacturing. In connection with this, the power consumption by a heating appliance etc. can also be reduced.
For example, by reducing the cross-sectional area of the connecting portion to about 1/5 to 1/2 of the cross-sectional area of the high-side side plate portion and the low-side side plate portion, the time required for the solder joining step can be halved in the actual manufacturing process. Can do.

(2) Since a slit penetrating in the thickness direction is formed around the connecting portion, only the connecting portion has a heat transfer path between the high side plate portion and the low side plate portion. It can certainly be improved. As a result, the time required for the soldering process during manufacturing can be further shortened. Moreover, since the formation of the slit is easier to process than the formation of the recess, the manufacturing cost can be kept low.

(3) The amount of heat transferred between two objects is inversely proportional to the length of the heat transfer path between the two objects. At this time, it is possible to extend the slit in the connecting direction as it is and lengthen the connecting part in the connecting direction, but this reduces the contact area between the middle side electrode plate and the cooler and decreases the cooling performance. End up. Therefore, by extending a slit or a recess in the connecting direction around the connecting portion, the connecting portion is made substantially longer in the connecting direction. As a result, it is possible to more reliably suppress heat from escaping to the other element side beyond the connecting portion, and the electrode plate portion excluding the periphery of the connecting portion can be brought into contact with the cooler. The cooling performance of the plate can be ensured.

It is a top view which shows the whole structure of the 2in1 power card which concerns on embodiment of this invention. It is a circuit diagram which shows the circuit structure of a 2-in-1 power card. It is an expanded sectional view in the III-III line of FIG. It is a top view which shows the middle side electrode plate of the power card. (A) is V (a) -V (a) sectional drawing in FIG. 4, (b) is V (b) -V (b) sectional drawing in FIG. 4, (c) is a figure. 4 is a V (c) -V (c) cross-sectional view in FIG. It is sectional drawing which shows the mode of the 1st solder joining process in the manufacturing method of the same power card. It is sectional drawing which shows the mode of the sealing process in the manufacturing method. It is sectional drawing which shows the mode of the grinding process in the manufacturing method. It is sectional drawing which shows the mode of the 2nd solder joining process in the manufacturing method. It is sectional drawing which shows the mode of the 3rd solder joining process in the manufacturing method. It is sectional drawing which shows the mode of the finishing process in the manufacturing method. It is explanatory drawing which shows the mode of the heat transfer in the middle side electrode plate at the time of the 3rd solder joining process in the manufacturing method. (A) is sectional drawing which shows the connection part which concerns on the modification 1 of this embodiment, (b) is sectional drawing which shows the connection part which concerns on the modification 2 of this embodiment, (c) is FIG. 10 is a cross-sectional view showing a connecting portion according to Modification 3 of the present embodiment. It is sectional drawing which shows the 2in1 power card which concerns on the reference example 1. FIG. It is sectional drawing which shows the mode of the 1st solder connection process in the manufacturing method of the same power card. It is sectional drawing which shows the mode of the sealing process in the manufacturing method. It is sectional drawing which shows the mode of the grinding process in the manufacturing method. It is sectional drawing which shows the mode of the 2nd solder joining process in the manufacturing method. It is sectional drawing which shows the mode of the 3rd solder joining process in the manufacturing method. (A) is sectional drawing which shows the joining structure which concerns on the reference modification example 1 of the reference example 1, (b) is sectional drawing which shows the joining structure which concerns on the reference modification example 2 of the reference example 1. FIG. (A) is a top view which shows the connection part which concerns on the reference modification example 3 of the reference example 1, (b) is a top view which shows the connection part which concerns on the reference modification example 4 of the reference example 1. FIG. (A) is a top view which shows the connection part which concerns on the reference modification example 5 of the reference example 1, (b) is a top view which shows the connection part which concerns on the reference modification example 6 of the reference example 1. FIG. It is sectional drawing which shows the 2in1 power card which concerns on the reference example 2. It is sectional drawing which shows the mode of the 1st solder connection process in the manufacturing method of the same power card. It is sectional drawing which shows the mode of the sealing process in the manufacturing method. It is sectional drawing which shows the mode of the grinding process in the manufacturing method. It is sectional drawing which shows the mode of the 2nd solder joining process in the manufacturing method. It is sectional drawing which shows the mode of the finishing process in the manufacturing method. (A) is a top view which shows the connection part which concerns on the reference modification example 1 of the reference example 2, (b) is a top view which shows the connection part which concerns on the reference modification example 2 of the reference example 2. FIG. It is sectional drawing which shows the 2in1 power card which concerns on the reference example 3. It is sectional drawing which shows the mode of the 2nd solder joining process in the manufacturing method of the same power card. It is sectional drawing which shows the mode of the 3rd solder joining process in the manufacturing method. (A) is a top view which shows the connection part which concerns on the reference modification example 1 of the reference example 3, (b) is a top view which shows the connection part which concerns on the reference modification example 2 of the reference example 3. FIG. (A) is a top view which shows the connection part which concerns on the common reference modification example 1 of the reference examples 1-3, (b) is an upper surface which shows the connection part which concerns on the common reference modification example 2 of the reference examples 1-3 FIG.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described in detail with reference to the accompanying drawings. In the present embodiment, the present invention is applied to a 2-in-1 power card that controls a power source of a hybrid vehicle or the like.

[Power card configuration]
The overall configuration of the 2-in-1 power card according to the present embodiment will be described with reference to FIG. FIG. 1 is a top view showing an overall configuration of a 2-in-1 power card according to an embodiment of the present invention.
As shown in FIG. 1, the 2-in-1 power card 1 includes a high-side circuit unit 10 that constitutes a high-side switching circuit and a low-side circuit unit 20 that constitutes a low-side switching circuit. A high side power element 11 connected to the P pole side is mounted on the high side circuit unit 10. A low side power element 21 connected to the N pole side is mounted on the low side circuit unit 20. In FIG. 1, an output bus bar for connecting both power elements 11 and 21 to the motor side is omitted.

The circuit configuration of the 2-in-1 power card 1 will be described with reference to FIG. FIG. 2 is a circuit diagram showing a circuit configuration of the 2-in-1 power card.
The high-side power element 11 is composed of an IGBT (Insulated Gate Bipolar Transistor) 11A and a diode 11B. The gate G of the high-side IGBT 11A is connected to the control terminal 16 for controlling the gate voltage via the control wiring 15. The emitter E of the high side IGBT 11A is connected to the output side. The collector C of the high-side IGBT 11A is connected to the P-pole side via the bus bar 13. The high-side diode 11B is connected in parallel between the emitter E and the collector C of the high-side IGBT 11A.

  The low-side power element 21 includes an IGBT 21A and a diode 21B as a set. The gate G of the low-side IGBT 21A is connected to a control terminal 26 for controlling the gate voltage via a control wiring 25. The emitter E of the low-side IGBT 21A is connected to the N pole side via the bus bar 23. The collector C of the low side IGBT 21A is connected to the output side. The low-side diode 21B is connected in parallel between the emitter E and the collector C of the low-side IGBT 21A.

Next, a stacked structure of the 2-in-1 power card 1 according to the present embodiment will be described with reference to FIG. FIG. 3 is an enlarged cross-sectional view taken along line III-III in FIG.
As shown in FIG. 3, in the high-side circuit unit 10, the high-side electrode plate 12, the high-side power element 11, the high-side block electrode 14, and the high-side plate unit 31 are stacked in this order. The high-side electrode plate 12, the high-side block electrode 14, and the high-side plate portion 31 each have a rectangular flat plate shape, and are obtained by plating nickel on a copper plate, a copper plate, or an aluminum plate. A solder layer 2 is formed between the upper surface 12 a of the high-side electrode plate 12 and the lower surface 11 b of the high-side power element 11. A solder layer 3 is formed between the upper surface 11 a of the high-side power element 11 and the lower surface 14 b of the high-side block electrode 14. Further, a solder layer 4 is formed between the upper surface 14 a of the high-side block electrode 14 and the lower surface 31 b of the high-side plate portion 31. Further, a solder injection port 32 penetrating in the thickness direction for injecting solder is provided at the center of the high side plate portion 31.

  On the other hand, in the low side circuit portion 20, the low side electrode plate 22, the low side block electrode 24, the low side power element 21, and the low side plate portion 35 are laminated in this order. The low side electrode plate 22, the low side block electrode 24, and the low side plate portion 35 each have a rectangular flat plate shape, and are obtained by plating nickel on a copper plate, a copper plate, or an aluminum plate. A solder layer 5 is formed between the upper surface 22 a of the low side electrode plate 22 and the lower surface 24 b of the low side block electrode 24. A solder layer 6 is formed between the upper surface 24 a of the low-side block electrode 24 and the lower surface 21 b of the low-side power element 21. Furthermore, a solder layer 7 is formed between the upper surface 21 a of the low side power element 21 and the lower surface 35 b of the low side plate portion 35. In addition, a solder injection port 29 penetrating in the thickness direction is provided in the center of the low side electrode plate 22 to inject solder.

  In a state where the high-side circuit unit 10 and the low-side circuit unit 20 are laminated as described above, the portions excluding the upper surfaces 31 a and 35 a and the lower surfaces 12 b and 22 b are molded with the sealing resin 8. According to such a laminated structure, heat generated in each of the power elements 11 and 21 is transferred to the lower high-side electrode plate 12 and the low-side electrode plate 22 in the drawing, and to the upper high-side side plate portion 31 and the low-side side plate portion 35 in the drawing. Heat is dissipated. Therefore, by disposing coolers (not shown) on both the upper surface side and the lower surface side of the power card 1, the power elements 11 and 21 can be cooled from both sides via the upper and lower electrode plates.

Next, the middle side electrode plate 30 of the present embodiment will be described in detail with reference to FIGS. 4 and 5. FIG. 4 is a top view showing the middle side electrode plate of the 2 in 1 power card according to the present embodiment. Fig.5 (a) is V (a) -V (a) sectional drawing of FIG. FIG. 5B is a V (b) -V (b) cross-sectional view of FIG. FIG. 5C is a V (c) -V (c) sectional view of FIG.
As shown in FIG. 4, the middle-side electrode plate 30 includes a high-side plate portion 31 that connects the high-side power element 11, a low-side plate portion 35 that connects the low-side power element 21, and a high-side plate portion 31. A connecting portion 36 that connects the low-side side plate portion 35 is integrally formed. The high side plate 31 and the low side plate 35 have substantially the same rectangular flat plate shape. The connection position of the high side plate part 31 and the low side plate part 35 is the center position on the end surface of each of the high side plate part 31 and the low side plate part 35. In the center of the high-side side plate portion 31 as viewed from above, a solder injection port 32 that is formed in the thickness direction so as to inject solder is provided. Note that the position and number of the solder injection holes 32 may be changed according to the connection position and the number of connections of the elements.

  As shown in FIGS. 4 and 5A, the connecting portion 36 has a rectangular flat plate shape, and has the same thickness as the high-side side plate portion 31 and the low-side side plate portion 35. As shown in FIGS. 5A, 5 </ b> B, and 5 </ b> C, the cross-sectional area S <b> 1 of the connecting portion 36 is smaller than the cross-sectional areas S <b> 2 and S <b> 3 of the high-side side plate portion 31 and the low-side side plate portion 35. In particular, in the present embodiment, the cross-sectional area S1 of the connecting portion 36 is about 1/4 of the cross-sectional areas S2 and S3 of the high-side plate portion 31 and the low-side plate portion 35. Note that the cross-sectional area S1 of the connecting portion 36 may be a cross-sectional area that is sufficiently small to suppress heat applied to the joint portion with one element from escaping to the other element side beyond the connecting portion 36. For example, the cross-sectional areas S2 and S3 of the high side plate portion 31 and the low side plate portion 35 may be 1/3 to 1/2 or less. Further, from the necessity of ensuring the energization performance of the middle side electrode plate 30 and the cooling performance by the cooler, the cross-sectional area S1 of the connecting portion 36 is, for example, the cross-sectional areas S2 and S3 of the high-side plate portion 31 and the low-side plate portion 35. It is desirable that it is 1/5 or more.

  As shown in FIG. 4, the connecting portion 36 is a remaining portion when slits 33 and 34 penetrating in the thickness direction are formed in the middle side electrode plate 30. In other words, the connecting portion 36 can be formed by cutting the slits 33 and 34 from the single-sided middle-side electrode plate 30. The slits 33, 34 extend from the both sides toward the center in the direction Y orthogonal to the connection direction X, and toward the high side in the connection direction X around the connection portion 36. The second slits 34 and 34 are extended. That is, the first slits 33 and 33 are surrounded by the upper end surface 33a of the high side plate portion 31 in the drawing, the lower end surface 33b of the low side plate portion 35 in the drawing, and the connecting portion 36 (and a two-dot chain line). It is the part that was. The second slits 34 and 34 are portions surrounded by end surfaces 34 a and 34 b formed by cutting out the periphery of the connecting portion 36 of the high-side side plate portion 31 and the connecting portion 36 (and a two-dot chain line). The second slit 34 substantially extends the length of the connecting portion 36 in the connecting direction X without substantially reducing the area of the middle side electrode plate 30. In FIG. 3, the cooler for cooling the middle side electrode plate 30 is also arranged on the upper side in the figure. Accordingly, not reducing the area of the middle side electrode plate 30 in this way can avoid the influence on the cooling performance. 4 shows the case where the second slits 34, 34 are extended toward the high side in the connecting direction X, but may be extended toward the low side in the connecting direction X. You may extend toward the both sides in the direction X. FIG.

[Power card manufacturing method]
Next, a manufacturing method of the 2-in-1 power card according to the present embodiment will be described with reference to FIGS. In the manufacturing method of the present embodiment, the first solder joint process, the sealing process, the grinding process, the second solder joint process, the third solder joint process, and the finishing process are mainly performed in this order. FIG. 6 is a cross-sectional view showing a state of a first soldering step in the manufacturing method. FIG. 7 is a cross-sectional view showing a state of a sealing step in the manufacturing method. FIG. 8 is a cross-sectional view showing a state of a grinding step in the manufacturing method. FIG. 9 is a cross-sectional view showing the state of the second soldering step in the manufacturing method. FIG. 10 is a cross-sectional view showing the state of the third soldering step in the manufacturing method. FIG. 11 is a cross-sectional view showing a finishing process in the manufacturing method. FIG. 12 is an explanatory diagram showing a state of heat transfer in the middle side electrode plate during the third solder joining step. 6 to 9, each process is performed in a state where the low side is inverted in the vertical direction, and therefore, the upper surface and the lower surface are reversed from the case of FIG. 3.

  In the first solder bonding step, as shown in FIG. 6A, the high side electrode plate 12, the high side power element 11, and the high side block electrode 14 are solder bonded. Here, between the lower surface 11 b of the high-side power element 11 and the upper surface 12 a of the high-side electrode plate 12, and between the upper surface 11 a of the high-side power element 11 and the lower surface 14 b of the high-side block electrode 14. Each of the solder foils is inserted into each of them, and the high side block electrode 14, the high side power element 11 and the high side electrode plate 12 are superposedly heated and melted to melt the solder layers 2, 3 Form. Thereby, the high-side power element 11 and the high-side electrode plate 12 are electrically and thermally connected. In addition, the high-side power element 11 and the high-side block electrode 14 are electrically and thermally connected. What is formed in this way is the high-side bonded body 17. Although the case where the solder layers 2 and 3 are formed by inserting the solder foil is shown, the solder layers 2 and 3 may be formed by injecting molten solder.

  Further, in the first solder joining step, as shown in FIG. 6B, the low side plate portion 35 of the middle side electrode plate 30, the low side power element 21, and the low side block electrode 24 are solder joined. Here, solder is provided between the lower surface 21a of the low-side power element 21 and the upper surface 35b of the low-side plate portion 35, and between the upper surface 21b of the low-side power element 21 and the lower surface 24a of the low-side block electrode 24, respectively. Solder layers 6 and 7 are formed by inserting the foil and heating the whole while the low-side block electrode 24, the low-side power element 21 and the low-side plate portion 35 are overlapped to melt the solder foil. Thereby, the low side power element 21 and the low side plate part 35 are electrically and thermally connected. Further, the low side power element 21 and the low side block electrode 24 are electrically and thermally connected. What is formed in this way is the low-side joined body 27. In addition, although the case where solder foil is inserted and the solder layers 6 and 7 are formed is shown, the solder layers 6 and 7 may be formed by injecting molten solder.

  In the sealing step, as shown in FIGS. 7A and 7B, the periphery of each of the high-side joined body 17 and the low-side joined body 27 is covered with the sealing resin 8 by transfer molding or potting sealing. . For example, an epoxy resin is used as the sealing resin 8. Note that the lower surface 12 b of the high-side bonded body 17 and the lower surface 35 a of the low-side bonded body 27 are not covered with the sealing resin 8. This is because the sealing resin 8 covers the surfaces 12b and 35a when the heat of the power elements 11 and 21 is radiated to the cooler in contact with the outer surfaces 12b and 35a of the electrode plates 12 and 35. This is because the sealing resin 8 becomes a heat insulator and inhibits heat dissipation.

  In the grinding process, as shown in FIGS. 8A and 8B, the sealing resin 8 existing on the upper side is exposed to a height at which the upper surfaces 14a and 24b of the block electrodes 14 and 24 of the joined bodies 17 and 27 are exposed. Remove by grinding.

In the second solder bonding step, as shown in FIG. 9B, the low-side block electrode 24 and the low-side electrode plate 22 are solder-bonded. At this time, bonding is performed in a reducing atmosphere in order to remove the oxide film on the electrode bonding surface. Or you may remove an oxide film using a flux. Before injecting the solder, the low-side side plate portion 35 is preliminarily heated at a temperature equal to or lower than the melting point of the solder layers 6 and 7 and the heat resistance temperature of the sealing resin 8 using the preheating heater 40. The low side electrode plate 22 is also heated in advance in a reducing atmosphere to near the soldering temperature, or is heated using hot air before and after mounting. Then, with the low-side electrode plate 22 heated to a predetermined temperature placed on the low-side block electrode 24, molten solder is injected into the solder injection port 29 of the low-side electrode plate 22 by the solder injector 9. Thus, the solder layer 5 is formed between the lower surface 22 a of the low side electrode plate 22 and the upper surface 24 b of the low side block electrode 24. Thereby, the low side electrode plate 22 and the low side block electrode 24 are electrically and thermally connected. In addition, since the solder overflowing from the solder injection port 29 is removed in a subsequent finishing process, the accuracy of the injection amount by the solder injector 9 may not be strictly controlled.

  In the third solder bonding step, as shown in FIG. 10, the high-side block electrode 14 and the high-side plate portion 31 of the middle-side electrode plate 30 are solder-bonded. At this time, bonding is performed in a reducing atmosphere in order to remove the oxide film on the electrode bonding surface. Or you may remove an oxide film using a flux. Further, before this process, characteristic inspections such as energization inspection and strength inspection are separately performed on the high side and the low side. Then, it is made into 2 in 1 with the defective product removed. This is because if a defect of one element is found after the conversion to 2 in 1, the entire element, including the other normal element, must be discarded.

Furthermore, before injecting the solder, the high-side electrode plate 12 is heated in advance using the preheating heater 40 at a temperature not higher than the melting points of the solder layers 2 and 3 and the heat resistance temperature of the sealing resin 8. Similarly, the high side plate portion 31 of the middle side electrode plate 30 is also heated in advance in a reducing atmosphere to near the soldering temperature, or is heated using hot air before and after mounting.
By the way, in the 2in1 power card 1, both the high-side power element 11 and the low-side power element 21 are connected to the single-sided middle-side electrode plate 30, so that the total length of the middle-side electrode plate 30 is long. Therefore, when the high-side block electrode 14 and the high-side plate portion 31 are soldered together, heat applied to the high-side side of the middle-side electrode plate 30 escapes to the low-side side.

  However, in the 2-in-1 power card 1 of the present embodiment, as shown in FIG. 5A, the high-side side plate portion 31 and the low-side side plate portion 35 are connected via a connecting portion 36 having a small cross-sectional area. Therefore, the heat applied to the joining portion P of the high-side side plate portion 31 mainly spreads in the high-side side plate portion 31 as indicated by a thick arrow in FIG. This is because there is a heat transfer path Z that escapes to the low-side side plate portion 35 beyond the connecting portion 36, but by reducing the cross-sectional area S1 of the connecting portion 36, the high-side side plate portion 31 and the low-side side plate portion 35 This is because the heat transfer area between the two can be reduced, thereby preventing the heat from escaping to the low-side side plate portion 35 beyond the connecting portion 36. In this way, the time required to heat the joining portion P of the high side plate portion 31 to the required temperature can be shortened, so that the time required for the solder joining process during production can be shortened. In particular, by setting the cross-sectional area S1 of the connecting portion 36 to about 1/5 to 1/2 of the cross-sectional areas S2 and S3 of the high-side side plate portion 31 and the low-side side plate portion 35 in the actual manufacturing process, Can be halved. In connection with this, the power consumption by a heating appliance etc. can also be reduced.

  Moreover, since the 1st slit 33 is extended in the direction Y orthogonal to the connection direction X around the connection part 36, only the connection part 36 exists in the heat transfer path to the high side side plate part 35. . In addition, the length of the connecting portion 36 in the connecting direction X is substantially extended by the second slit 34. Here, the amount of heat transferred between the two objects is inversely proportional to the length of the heat transfer path between the two objects. Therefore, it is conceivable to extend the first slit 33 as it is in the connecting direction X. However, in this case, the contact area between the middle side electrode plate 30 and the cooler (not shown) is reduced, and the cooling performance is lowered. . Therefore, by extending the second slits 34 in the connection direction X around the connection part 36, the connection part 36 is substantially elongated in the connection direction X. Thereby, it is possible to more reliably suppress heat from escaping to the low-side side plate portion 35 beyond the connecting portion 36, and the electrode plate portions 37, 37 excluding the periphery of the connecting portion 36 can be brought into contact with the cooler. Therefore, the cooling performance of the middle side electrode plate 30 can be ensured. Further, since the connecting portion 36 is made of copper or aluminum having high electrical conductivity, the slits 33, 33, 34, 34 are formed between the high side plate portion 31 and the low side plate portion 35 even when the slits 33, 33, 34, 34 are formed. The necessary energization performance is sufficiently secured.

  And after heating the junction part P of the high side side board part 31 to predetermined temperature, molten solder is inject | poured into the solder injection port 32, as shown in FIG. Thereby, the solder layer 4 is formed between the lower surface 31 b of the high-side side plate portion 31 and the upper surface 14 a of the high-side block electrode 14. In this way, the high side plate part 31 and the high side block electrode 14 are electrically and thermally connected. In addition, since the solder overflowing from the solder injection port 32 is removed in a subsequent finishing process, the accuracy of the injection amount by the solder injector 9 may not be strictly controlled.

  In the finishing process, as shown in FIG. 11, the solder overflowing from the solder injection holes 29 and 32 is melted and removed at a temperature equal to or higher than the melting point of the solder layers 4 and 5 using a heating tool such as a soldering iron. Alternatively, the solder overflowing from the solder injection ports 29 and 32 may be mechanically cut. Thereafter, molding with the sealing resin 8 is performed as necessary, and the 2-in-1 power card 1 is manufactured.

  As described above in detail, according to the 2-in-1 power card 1 of the present embodiment, the high-side side plate portion 31 and the low-side side plate portion 35 are connected via the connecting portion 36 having a small cross-sectional area. The heat transfer area between the side side plate portion 31 and the low side side plate portion 35 is reduced. As a result, in the third solder joining step in which the high-side side plate portion 31 and the high-side block electrode 14 are soldered together, the heat applied to the joining portion P of the high-side side plate portion 31 exceeds the connecting portion 36 and the low-side side plate portion. Escape to 35 can be suppressed. In this way, since the heating efficiency of the joining site P can be increased, the time required for the joining site P to reach the required temperature can be shortened, and the time required for the solder joining process during production can be shortened. In connection with this, the power consumption by a heating appliance etc. can also be reduced.

  Further, according to the 2-in-1 power card 1 of the present embodiment, since the first slits 33 and 33 penetrating in the thickness direction are formed around the connecting portion 36, the high-side side plate portion 31 and the low-side side plate portion 35 Between them, only the connecting portion 36 has a heat transfer path, and the heating efficiency can be improved more reliably. As a result, the time required for the soldering process during manufacturing can be further shortened. Moreover, since the formation of the slit is easier to process than the formation of the recess, the manufacturing cost can be kept low.

  Furthermore, according to the 2-in-1 power card 1 of the present embodiment, the second slits 34, 34 are extended in the connection direction X around the connection part 36, so that the connection part 36 is substantially elongated in the connection direction X. doing. Thereby, it is possible to more reliably suppress heat from escaping to the low-side side plate portion 35 beyond the connecting portion 36, and the electrode plate portions 37, 37 excluding the periphery of the connecting portion 36 can be brought into contact with the cooler. Therefore, the cooling performance of the middle side electrode plate 30 can be ensured.

  Next, modified examples 1 to 3 of the 2-in-1 power card 1 according to the present embodiment will be described with reference to the drawings. Modifications 1 to 3 shown below are different from those of the above embodiment in the shape of the middle side electrode plate.

[Modification 1]
FIG. 13A is an enlarged cross-sectional view illustrating a connecting portion of the middle side electrode plate according to the first modification of the present embodiment. FIG. 13A shows a cross section of the middle side electrode plate cut along the connecting direction X.
The middle side electrode plate 70 according to the first modification of the present embodiment is connected to the high side plate portion 71 connected to the high side power element 11 and the low side power element 21 as shown in FIG. The low side plate portion 75 is integrally formed. Between the high side plate portion 71 and the low side plate portion 75, concave portions 72 and 73 are formed in which the middle side electrode plate 70 is recessed from both sides in the thickness direction Z. The remaining portion when the concave portions 72 and 73 are formed is a connecting portion 76 that connects the high-side side plate portion 71 and the low-side side plate portion 75. In this example, the thickness T <b> 1 of the connecting portion 76 is about ½ of the thickness T <b> 2 of the high side plate portion 71 and the low side plate portion 75. Note that the thickness T1 of the connecting portion 76 may be a thickness that is small enough to prevent heat applied to the joint portion with one element from escaping over the connecting portion 76 to the other element side. What is necessary is just 1/3 to 1/2 or less of thickness T2 of the high side board part 71 and the low side board part 75. FIG.

  In the first modification of the present embodiment, the connecting portion 76 is a remaining portion when the concave portions 72 and 73 that are recessed in the thickness direction Z are formed in the middle side electrode plate 70, and thus the cross-sectional area of the connecting portion 76 is These are smaller than the high-side side plate portion 71 and the low-side side plate portion 75. Thereby, since the heat transfer area between the high-side side plate portion 71 and the low-side side plate portion 75 can be reduced, in the third solder joining step for solder-joining the high-side side plate portion 71 and the high-side block electrode 14, It is possible to suppress the heat applied to the joining portion P of the high side plate portion 71 from escaping to the low side plate portion 75 beyond the connecting portion 76. In this way, since the heating efficiency of the joining site P can be increased, the time required for the joining site P to reach the required temperature can be shortened, and the time required for the solder joining process during production can be shortened. In connection with this, the power consumption by a heating appliance etc. can also be reduced.

  Even in the first modification of the present embodiment, if the recesses 72 and 73 are extended in the connecting direction X, the connecting portion 76 can be made substantially longer in the connecting direction X. Thereby, it can suppress more reliably that a heat | fever escapes over the connection part 76 to the low side side board part 75. FIG.

[Modification 2]
FIG. 13B is an enlarged cross-sectional view illustrating a connecting portion of the middle side electrode plate according to the second modification of the present embodiment. FIG. 13B shows a cross section of the middle side electrode plate cut along the connecting direction X.
The middle side electrode plate 80 according to the second modification of the present embodiment is connected to the high side plate portion 81 connected to the high side power element 11 and the low side power element 21 as shown in FIG. The low-side side plate portion 85 is integrally formed. Between the high side plate portion 81 and the low side plate portion 85, a concave portion 82 is formed in which the middle side electrode plate 80 is recessed from one end side (upper side in the drawing) in the thickness direction Z. The remaining portion when the concave portion 82 is formed serves as a connecting portion 86 that connects the high side plate portion 81 and the low side plate portion 85.

  In the second modification of the present embodiment, since the connecting portion 86 is a remaining portion when the concave portion 82 that is recessed in the thickness direction Z is formed in the middle side electrode plate 80, the cross-sectional area of the connecting portion 86 is high. It is smaller than the side side plate portion 81 and the low side side plate portion 85. Thereby, since the heat transfer area between the high-side side plate portion 81 and the low-side side plate portion 85 can be reduced, in the third solder joining step for solder-joining the high-side side plate portion 81 and the high-side block electrode 14, It is possible to suppress the heat applied to the joining portion P of the high-side side plate portion 81 from escaping to the low-side side plate portion 85 beyond the connecting portion 86. In this way, since the heating efficiency of the joining site P can be increased, the time required for the joining site P to reach the required temperature can be shortened, and the time required for the solder joining process during production can be shortened. In connection with this, the power consumption by a heating appliance etc. can also be reduced.

  In particular, in the second modification of the present embodiment, since the recess 82 is formed only on the upper side in the thickness direction Z of the middle side electrode plate 80, both sides in the thickness direction Z as in the first modification of the present embodiment. Compared with the case where the recesses 72 and 73 are formed on the substrate, it can be formed easily. Even in the second modification of the present embodiment, if the recess 82 is extended in the connecting direction X, the connecting portion 86 can be made substantially longer in the connecting direction X. Thereby, it can suppress more reliably that a heat | fever escapes over the connection part 86 to the low side side board part 85. FIG.

[Modification 3]
FIG. 13C is an enlarged cross-sectional view showing a connecting portion of the middle side electrode plate according to the third modification of the present embodiment. FIG. 13C shows a cross section of the middle side electrode plate cut along the connecting direction X.
As shown in FIG. 13C, the middle side electrode plate 90 according to the third modification of the present embodiment is connected to the high side plate portion 91 connected to the high side power element 11 and the low side power element 21. The low side plate portion 95 is integrally formed. Between the high side plate portion 91 and the low side plate portion 95, a recess 92 is formed in which the middle side electrode plate 90 is recessed from one end side (the lower side in the figure) in the thickness direction Z. The remaining portion when the recess 92 is formed serves as a connecting portion 96 that connects the high side plate 91 and the low side plate 95.

Also in the third modification of the present embodiment, since the connecting portion 96 is a remaining portion when the concave portion 92 that is recessed in the thickness direction Z is formed on the middle side electrode plate 90, the cross-sectional area of the connecting portion 96 is high. It is smaller than the side side plate portion 91 and the low side side plate portion 95. Thereby, since the heat transfer area between the high-side side plate portion 91 and the low-side side plate portion 95 can be reduced, in the third solder joining step for solder-joining the high-side side plate portion 91 and the high-side block electrode 14, It is possible to suppress the heat applied to the joint portion P of the high-side side plate portion 91 from escaping to the low-side side plate portion 95 beyond the connecting portion 96. In this way, since the heating efficiency of the joining site P can be increased, the time required for the joining site P to reach the required temperature can be shortened, and the time required for the solder joining process during production can be shortened. In connection with this, the power consumption by a heating appliance etc. can also be reduced.
Also, in the third modification of the present embodiment, since the concave portion 92 is formed only on the lower side in the thickness direction Z of the middle side electrode plate 90, as in the first modification of the present embodiment, in the thickness direction Z. Compared with the case where the concave portions 72 and 73 are formed on both sides, it can be easily formed.

By the way, when the laminated structure of the said embodiment (refer FIG. 3) is employ | adopted, the cooler for cooling the middle side electrode plate 90 is also arrange | positioned at the upper side in the figure. Therefore, when the concave portion 82 is formed on the upper side in the thickness direction Z of the middle side electrode plate 80 as in the second modification of the present embodiment, the contact surface with the cooler is correspondingly reduced.
On the other hand, in the third modification of the present embodiment, the concave surface 92 is formed on the lower side in the thickness direction Z of the middle side electrode plate 90, so that the contact surface 90a with the cooler is not reduced. The cooling performance of the middle side electrode plate 90 can be ensured. Even in the third modification of the present embodiment, if the recess 92 is extended in the connecting direction X, the connecting portion 96 can be made substantially longer in the connecting direction X. Thereby, it can suppress more reliably that a heat | fever escapes over the connection part 96 to the low side side board part 95. FIG.
[Reference example]

Here, a reference example of the 2-in-1 power card will be described with reference to the drawings. The following reference example relates to a semiconductor device that includes a high-side semiconductor element and a low-side semiconductor element and that can be cooled from both sides.
Conventionally, in the case of a 2in1 power card, if a defect of one element is found after the conversion to 2in1, there is a problem that the entire element including the normal other element has to be discarded. Reference examples shown below solve these problems.

[Reference Example 1]
The configuration of the 2-in-1 power card according to Reference Example 1 will be described with reference to FIG. FIG. 14 is a cross-sectional view showing a 2-in-1 power card according to Reference Example 1. Since the 2-in-1 power card 100 according to the reference example 1 has basically the same configuration as that of the above-described embodiment, the same components are denoted by the same reference numerals, and the description thereof is omitted as appropriate. The explanation is centered.
As shown in FIG. 14, the 2-in-1 power card 100 includes a high-side electrode plate 12 connected to the high-side semiconductor element 11, a low-side electrode plate 22 connected to the low-side semiconductor element 21, a high-side semiconductor element 11 and A middle side electrode plate 110 connected to the low side semiconductor element 21 is provided.

  The middle side electrode plate 110 includes a high side plate member 111 that connects the high side semiconductor element 11 and a low side plate member 115 that connects the low side semiconductor element 21, and the high side semiconductor element 11 and the high side plate member The high side plate member 111 and the low side side plate member 115 are connected after the connection to the low side side semiconductor element 21 and the low side side plate member 115 after the connection to the low side side semiconductor element 21. In the 2-in-1 power card 100, the high side plate member 111 and the low side plate member 115 are disposed at the same height position.

  The high side plate member 111 and the low side plate member 115 each have a rectangular flat plate shape, and are obtained by plating nickel on a copper plate or a copper plate or an aluminum plate. In the center of the high-side plate member 111, a solder injection port 112 formed through in the thickness direction for injecting solder is provided. A solder layer 101 is formed between one end surface 111 c of the high side plate member 111 and one end surface 115 c of the low side plate member 115.

  Here, a method for manufacturing the 2-in-1 power card 100 according to Reference Example 1 will be described with reference to FIGS. In the manufacturing method according to Reference Example 1, the first solder joint process, the sealing process, the grinding process, the second solder joint process, and the third solder joint process are mainly performed in this order. FIG. 15 is a cross-sectional view showing the state of the first solder connection step in the manufacturing method. FIG. 16 is a cross-sectional view showing the state of the sealing step in the manufacturing method. FIG. 17 is a cross-sectional view showing a state of a grinding step in the manufacturing method. FIG. 18 is a cross-sectional view showing the state of the second soldering step in the manufacturing method. FIG. 19 is a cross-sectional view showing the state of the third soldering step in the manufacturing method. 15 to 18, each process is performed in a state where the low side is inverted in the vertical direction, and therefore, the upper surface and the lower surface are reversed from the case of FIG. 14.

  In the first solder joining step, as shown in FIG. 15A, the high side electrode plate 12, the high side power element 11 and the high side electrode 14 are solder joined. Here, between the lower surface 11 b of the high-side power element 11 and the upper surface 12 a of the high-side electrode plate 12, and between the upper surface 11 a of the high-side power element 11 and the lower surface 14 b of the high-side block electrode 14. A solder foil is inserted between each of them, and the high side block electrode 14, the high side power element 11 and the high side electrode plate 12 are superposedly heated to melt the solder foil. 3 is formed. Thereby, the high-side power element 11 and the high-side electrode plate 12 are electrically and thermally connected. In addition, the high-side power element 11 and the high-side block electrode 14 are electrically and thermally connected. What is formed in this way is the high-side bonded body 113. Although the case where the solder layers 2 and 3 are formed by inserting the solder foil is shown, the solder layers 2 and 3 may be formed by injecting molten solder.

In the first solder joining step, as shown in FIG. 15B, the low-side plate member 115, the low-side power element 21 and the low-side block electrode 24 are solder-joined. Here, solder is provided between the lower surface 21a of the low-side power element 21 and the upper surface 115b of the low-side plate member 115, and between the upper surface 21b of the low-side power element 21 and the lower surface 24a of the low-side block electrode 24, respectively. Solder layers 6 and 7 are formed by inserting the foil and heating the whole while the low-side block electrode 24, the low-side power element 21 and the low-side plate member 115 are stacked to melt the solder foil. Thereby, the low side power element 21 and the low side plate member 115 are electrically and thermally connected. Further, the low side power element 21 and the low side block electrode 24 are electrically and thermally connected. What is formed in this way is a low-side joined body 118. In addition, although the case where solder foil is inserted and the solder layers 6 and 7 are formed is shown, the solder layers 6 and 7 may be formed by injecting molten solder.

  In the sealing step, as shown in FIGS. 16A and 16B, the periphery of the high-side bonded body 113 and the low-side bonded body 118 is covered with the sealing resin 8 by transfer molding or potting sealing. . For example, an epoxy resin is used as the sealing resin 8. Note that the lower surface 12 b of the high-side bonded body 113 and the lower surface 115 a of the low-side bonded body 118 are not covered with the sealing resin 8. This is because the sealing resin 8 covers the surfaces 12b and 115a when the heat of the power elements 11 and 21 is radiated to the cooler in contact with the outer surfaces 12b and 115a of the electrode plates 12 and 115. This is because the sealing resin 8 becomes a heat insulator and inhibits heat dissipation. Further, the one end surface 115 c of the low side plate member 115 is also joined to the one end surface 111 c of the high side plate member 111 later, so that it is not covered with the sealing resin 8.

  In the grinding process, as shown in FIGS. 17A and 17B, the sealing resin 8 existing on the upper side is exposed to a height at which the upper surfaces 14a and 24b of the block electrodes 14 and 24 of the joined bodies 113 and 118 are exposed. Remove by grinding.

  In the second solder joining step, as shown in FIG. 18A, the high-side block electrode 14 and the high-side plate member 111 are solder-joined. At this time, bonding is performed in a reducing atmosphere in order to remove the oxide film on the electrode bonding surface. Or you may remove an oxide film using a flux. Before injecting the solder, the high side plate member 111 or the like is preheated in the reducing atmosphere to near the soldering temperature, or is heated using hot air before and after mounting. Then, with the high-side plate member 111 placed on the high-side block electrode 14, molten solder is injected into the solder injection port 112 of the high-side plate member 111 by the solder injector 9. In this way, the solder layer 4 is formed between the lower surface 111 b of the high side plate member 111 and the upper surface 14 a of the high side block electrode 14. Thereby, the high side plate member 111 and the high side block electrode 14 are electrically and thermally connected.

  In the second solder bonding step, as shown in FIG. 18B, the low-side block electrode 24 and the low-side electrode plate 22 are solder-bonded. At this time, bonding is performed in a reducing atmosphere in order to remove the oxide film on the electrode bonding surface. Or you may remove an oxide film using a flux. Before injecting the solder, the low-side electrode plate 22 or the like is heated in advance in the reducing atmosphere to near the soldering temperature, or heated using hot air before and after mounting. Then, with the low side electrode plate 22 placed on the low side block electrode 24, molten solder is injected into the solder injection port 29 of the low side electrode plate 22 by the solder injector 9. Thus, the solder layer 5 is formed between the lower surface 22 a of the low side electrode plate 22 and the upper surface 24 b of the low side block electrode 24. Thereby, the low side electrode plate 22 and the low side block electrode 24 are electrically and thermally connected.

  In the third solder joining step, as shown in FIG. 19, the high side plate member 111 and the low side plate member 115 are solder joined. By the way, before this process, characteristic inspections such as energization inspection and strength inspection are separately performed on the high side and the low side. Then, the high-side plate member 111 and the low-side plate member 115 are connected to form 2 in 1 with the defective product removed. This is because if a defect of one element is found after the conversion to 2 in 1, the entire element, including the other normal element, must be discarded.

  After this characteristic inspection, molten solder is injected between the one end surface 111 c of the high side plate member 111 and the one end surface 115 c of the low side plate member 115 to form the solder layer 101. Thereby, the high side plate member 111 and the low side plate member 115 are electrically connected. Thereafter, a finishing process or molding with the sealing resin 8 is performed as necessary, and the 2-in-1 power card 100 is manufactured.

  As described above, according to Reference Example 1, the high-side plate member 111 that connects the high-side semiconductor element 11 and the low-side plate member 115 that connects the low-side semiconductor element 21 are separately formed in advance. Before the side-side plate member 111 and the low-side side plate member 115 are connected, characteristic inspections are performed on the high-side side and the low-side side, respectively. be able to. As a result, it is possible to avoid a situation in which the entire element including a normal element is discarded due to a defect of one element after the conversion to 2in1. For example, when a plurality of inverter circuits such as 3 in 1 and 6 in 1 are configured, the defective rate of mounted elements increases and the discard rate of normal elements also increases. Therefore, it is possible to obtain a higher effect by applying the reference example in such a case.

  Here, the reference modification examples 1 and 2 are shown below for the joining structure of the high-side plate member 111 and the low-side plate member 115 in the middle-side electrode plate 110 according to Reference Example 1. FIG. 20A is a cross-sectional view showing a joint structure according to Reference Modification 1 of Reference Example 1. FIG. FIG. 20B is a cross-sectional view showing a joint structure according to Reference Modification 2 of Reference Example 1.

[Reference change example 1]
In the joining structure according to Reference Modification 1 of Reference Example 1, as shown in FIG. 20A, the joining end surface of the high-side plate member 111 and the joining end surface of the low-side plate member 115 are different from each other. Convex portions 171 and 175 are formed. Then, by injecting molten solder into the gap G when the convex portions 171 and 175 are fitted together, the stepped solder layer 101 is formed on the joining end surface of the high side plate member 111 and the low side plate member 115. ing.
According to the reference modification example 1 of the reference example 1, when the molten solder is injected into the joining end surfaces of the high side plate member 111 and the low side plate member 115, the lower convex portion 175 causes the solder to leak down. Since it can prevent, soldering can be performed easily.

[Reference change example 2]
In the joining structure according to Reference Modification 2 of Reference Example 1, as shown in FIG. 20B, the joining end face of the high side plate member 111 and the joining end face of the low side plate member 115 are different from each other in the vertical direction. Convex portions 171 and 175 are formed, and a solder injection port 172 penetrating in the thickness direction is provided in the convex portion 171 of the high-side plate member 111 located on the upper side in order to inject solder. Then, by injecting molten solder from the solder injection port 172 into the gap G when the convex portions 171 and 175 are fitted together, a stepped solder is formed on the joint end surface of the high side plate member 111 and the low side plate member 115. Layer 101 is formed.
According to Reference Modification 2 of Reference Example 1, it is possible to inject molten solder from the solder injection port 172 to the joining end surfaces of the high-side side plate member 111 and the low-side side plate member 115, and at the time of injection, the lower convex portion 175 Since it is possible to prevent the solder from leaking downward, solder joining can be performed more easily.

  Next, reference modification examples 3 to 6 are shown below for the connecting portion of the high-side plate member 111 and the low-side plate member 115 in the middle-side electrode plate 110 according to Reference Example 1. FIG. 21A is a top view showing a connecting portion according to Reference Modification 3 of Reference Example 1. FIG. FIG. 21B is a top view showing a connecting portion according to Reference Modification 4 of Reference Example 1. FIG. 22A is a top view showing a connecting portion according to Reference Modification 5 of Reference Example 1. FIG. FIG. 22B is a top view showing a connecting portion according to Reference Modification 6 of Reference Example 1. FIG.

[Reference modification 3]
The reference modification example 3 of the reference example 1 is an example of a connecting portion when the structure shown in the reference example 1 (see FIG. 14) and the structure shown in the reference modification example 1 of the reference example 1 (see FIG. 20A) are adopted. It is. The middle side electrode plate 110A according to Reference Modification 3 of Reference Example 1 is connected to the high side plate member 111 connected to the high side power element 11 and the low side power element 21 as shown in FIG. The low-side side plate member 115 to be soldered is joined by the solder layer 101. High-side slits 176A and 176A are formed in the high-side plate member 111. The high side slits 176A and 176A are extended in the direction Y from the both ends in the direction Y of the high side plate member 111 toward the center. The remaining portion when the high-side slits 176A and 176A are formed is a high-side connecting portion 177A.
On the other hand, low side slits 178A and 178A are formed in the low side plate member 115. The low-side slits 178A and 178A are extended in the direction Y from the both end sides in the direction Y of the low-side plate member 115 toward the center. The remaining portion when the low-side slits 178A and 178A are formed is a low-side connecting portion 179A.

  In the reference modification example 3 of the reference example 1, since the connecting portions 177A, 179A are the remaining portions of the slits 176A, 176A, 178A, 178A extending in the direction Y, the cross-sectional areas of the connecting portions 177A, 179A are: It is smaller than the high side plate member 111 and the low side plate member 115. As a result, the time required to heat the joining portion of the high-side plate member 111 and the low-side plate member 115 to a necessary temperature can be shortened, and the time required for the solder joining process during manufacturing can be further shortened. In connection with this, the power consumption by a heating appliance etc. can further be reduced.

[Reference change example 4]
The reference modification example 4 of the reference example 1 is an example of a connecting portion when the structure shown in the reference example 1 (see FIG. 14) and the structure shown in the reference modification example 1 of the reference example 1 (see FIG. 20A) are adopted. It is. The middle side electrode plate 110B according to the reference modification example 4 of the reference example 1 is connected to the high side plate member 111 connected to the high side power element 11 and the low side power element 21 as shown in FIG. The low-side side plate member 115 to be soldered is joined by the solder layer 101. The high side plate member 111 is formed with a high side slit 176B. The high side slit 176B is extended in the direction Y from one end side (lower side in the figure) in the direction Y of the high side plate member 111 toward the other end side (upper side in the figure). The remaining portion when the high-side slit 176B is formed is a high-side connecting portion 177B.
On the other hand, the low side plate member 115 is formed with a low side slit 178B. The low side slit 178B extends in the Y direction from one end side (lower side in the figure) of the low side plate member 115 to the other end side (upper side in the figure). The remaining portion when the low-side slit 178B is formed is a low-side connecting portion 179B.

In the reference modification example 4 of the reference example 1, since the connecting portions 177B and 179B are the remaining portions of the slits 176B and 178B extending in the direction Y, the cross-sectional area of the connecting portions 177B and 179B is the high side plate member. 111 and the lower side plate member 115 are smaller. As a result, the time required to heat the joining portion of the high-side plate member 111 and the low-side plate member 115 to a necessary temperature can be shortened, and the time required for the solder joining process during manufacturing can be further shortened. In connection with this, the power consumption by a heating appliance etc. can further be reduced.
In particular, in the reference modification example 4 of the reference example 1, each slit 176B, 178B has a shape cut out only from one end side in the direction Y. Therefore, from the both end sides in the direction Y as in the reference modification example 3 of the reference example 1. Compared with the slits 176A, 176A, 178A, 178A of the cut shape, it can be easily formed.

[Reference modification examples 5 and 6]
Reference modification example 5 and reference modification example 6 of reference example 1 are examples of connecting portions when the joining structure shown in reference modification example 2 (see FIG. 20B) is adopted. In the reference modification example 5 and the reference modification example 6, as shown in FIGS. 22A and 22B, molten solder is injected into the solder injection port 172 formed in the convex portion 171 of the high-side plate member 111. The high side plate member 111 and the low side plate member 115 can be soldered together. Thus, even when the joining structure shown in the reference modification example 2 is adopted, the same effects as those of the reference modification examples 3 and 4 described above can be obtained.

[Reference Example 2]
The configuration of the 2-in-1 power card according to Reference Example 2 will be described with reference to FIG. FIG. 23 is a cross-sectional view showing a 2-in-1 power card according to Reference Example 2. Since the 2-in-1 power card 120 according to Reference Example 2 has basically the same configuration as that of the above-described embodiment and Reference Example 1, the same parts are denoted by the same reference numerals and description thereof is omitted as appropriate. Now, the differences will be mainly described.
As shown in FIG. 23, the 2-in-1 power card 120 includes a high-side electrode plate 12 connected to the high-side semiconductor element 11, a low-side electrode plate 22 connected to the low-side semiconductor element 21, a high-side semiconductor element 11 and A middle side electrode plate 130 connected to the low side semiconductor element 21 is provided.

  The middle side electrode plate 130 connects the high side plate member 131 connecting the high side semiconductor element 11, the low side plate member 135 connecting the low side semiconductor element 21, and the high side plate member 131 and the low side plate member 135. The high-side plate member 131 and the low-side plate member 135 after the connection between the high-side semiconductor element 11 and the high-side plate member 131 and after the low-side semiconductor element 21 and the low-side plate member 135 are connected. Are connected via a relay member 139. In the 2-in-1 power card 120, the high-side plate member 131 and the low-side plate member 135 are arranged so that their vertical positions are reversed via the relay member 139.

  Each of the high side plate member 131, the low side plate member 135, and the relay member 139 has a rectangular flat plate shape, and is formed by plating nickel on a copper plate, a copper plate, or an aluminum plate. At the center and one end of the high side plate member 131, solder injection holes 132, 133 are formed penetrating in the thickness direction in order to inject solder. A solder layer 121 is formed between the lower surface 131 c on one end side of the high-side plate member 131 and the upper surface 139 a of the relay member 139. Further, a solder layer 122 is formed between the upper surface 135 c on one end side of the low side plate member 135 and the lower surface 139 b of the relay member 139.

  Here, a manufacturing method of the 2-in-1 power card 120 according to the reference example 2 will be described with reference to FIGS. In the manufacturing method according to Reference Example 2, the first solder joining process, the sealing process, the grinding process, the second solder joining process, and the finishing process are mainly performed in this order. FIG. 24 is a cross-sectional view showing the state of the first solder connection step in the manufacturing method. FIG. 25 is a cross-sectional view showing a sealing process in the manufacturing method. FIG. 26 is a cross-sectional view showing a state of a grinding step in the manufacturing method. FIG. 27 is a cross-sectional view showing the state of the second soldering step in the manufacturing method. FIG. 28 is a cross-sectional view showing the state of the finishing step in the manufacturing method.

  In the first solder joining step, as shown in FIG. 24A, the high side electrode plate 12, the high side power element 11, and the high side block electrode 14 are soldered. Here, between the lower surface 11 b of the high-side power element 11 and the upper surface 12 a of the high-side electrode plate 12, and between the upper surface 11 a of the high-side power element 11 and the lower surface 14 b of the high-side block electrode 14. Each of the solder foils is inserted into each of them, and the high side block electrode 14, the high side power element 11 and the high side electrode plate 12 are superposedly heated and melted to melt the solder layers 2, 3 Form. Thereby, the high-side power element 11 and the high-side electrode plate 12 are electrically and thermally connected. In addition, the high-side power element 11 and the high-side block electrode 14 are electrically and thermally connected. What is formed in this way is the high-side bonded body 133. Although the case where the solder layers 2 and 3 are formed by inserting the solder foil is shown, the solder layers 2 and 3 may be formed by injecting molten solder.

  In the first solder bonding step, as shown in FIG. 24B, the low side plate member 135, the low side power element 21, and the low side block electrode 24 are soldered. At the same time, the low side plate member 135 and the relay member 139 are soldered together. Here, between the lower surface 21a of the low-side power element 21 and the upper surface 135a of the low-side plate member 135, between the upper surface 21b of the low-side power element 21 and the lower surface 24a of the low-side block electrode 24, and the low-side plate member Solder foil is inserted between the upper surface 135c on one end side of 135 and the lower surface 139b of the relay member 139, and the low-side block electrode 24, the low-side power element 21, the low-side electrode plate 135, and the relay member 139 are stacked. By heating the whole as it is and melting the solder foil, the solder layers 6, 7, 122 are formed. Thereby, the low side power element 21 and the low side plate member 135 are electrically and thermally connected. Further, the low side power element 21 and the low side block electrode 24 are electrically and thermally connected. Further, the low side plate member 135 and the relay member 139 are electrically and thermally connected. What is formed in this way is the low-side bonded body 140. In addition, although the case where solder foil was inserted and the solder layers 6, 7, and 122 were formed was shown, the solder layers 6 and 7 may be formed by injecting molten solder.

  In the sealing step, as shown in FIG. 25, the periphery of the high-side bonded body 133 and the low-side bonded body 140 is integrally covered with the sealing resin 8 by transfer molding or potting sealing. For example, an epoxy resin is used as the sealing resin 8. Note that the lower surface 12 b of the high-side bonded body 133 and the lower surface 135 b of the low-side bonded body 140 are not covered with the sealing resin 8. This is because the sealing resin 8 covers the surfaces 12b and 135b when the heat of the power elements 11 and 21 is radiated to the cooler in contact with the outer surfaces 12b and 135b of the electrode plates 12 and 135. This is because the sealing resin 8 becomes a heat insulator and inhibits heat dissipation.

  In the grinding step, as shown in FIG. 26, the sealing resin 8 existing on the upper side is removed by grinding to a height at which the upper surfaces 14a and 24b of the block electrodes 14 and 24 of the joined bodies 133 and 140 are exposed. The upper surface 139a of the relay member 139 is the same height as the upper surfaces 14a, 24b of the block electrodes 14, 24.

  In the second solder joining step, as shown in FIG. 27, the high-side block electrode 14 and the high-side plate member 131 are solder-joined. At this time, bonding is performed in a reducing atmosphere in order to remove the oxide film on the electrode bonding surface. Or you may remove an oxide film using a flux. Before injecting the solder, the high side plate member 131 or the like is heated in advance in a reducing atmosphere to near the soldering temperature, or heated using hot air before and after mounting. Then, with the high-side plate member 131 placed on the high-side block electrode 14, molten solder is injected into the solder injection port 132 of the high-side plate member 131 by the solder injector 9. In this way, the solder layer 4 is formed between the lower surface 131b of the high side plate member 131 and the upper surface 14a of the high side block electrode 14. Thereby, the high side plate member 131 and the high side block electrode 14 are electrically and thermally connected.

  In the second solder bonding step, the low-side block electrode 24 and the low-side electrode plate 22 are solder-bonded. At this time, bonding is performed in a reducing atmosphere in order to remove the oxide film on the electrode bonding surface. Or you may remove an oxide film using a flux. Before injecting the solder, the low-side electrode plate 22 or the like is heated in advance in the reducing atmosphere to near the soldering temperature, or heated using hot air before and after mounting. Then, with the low side electrode plate 22 placed on the low side block electrode 24, molten solder is injected into the solder injection port 29 of the low side electrode plate 22 by the solder injector 9. Thus, the solder layer 5 is formed between the lower surface 22 a of the low side electrode plate 22 and the upper surface 24 b of the low side block electrode 24. Thereby, the low side electrode plate 22 and the low side block electrode 24 are electrically and thermally connected.

  Further, in the second solder joining step, the high side plate member 131 and the relay member 139 are joined by solder. By the way, before this joining, characteristic inspection such as energization inspection and strength inspection is separately performed on the high side and the low side. Then, the high-side plate member 131 and the relay member 139 are joined in a state in which the defective product is removed, so that 2in1 is achieved. This is because if a defect of one element is found after the conversion to 2 in 1, the entire element, including the other normal element, must be discarded.

  After this characteristic inspection, molten solder is injected into the solder injection port 133 of the high side plate member 131 by the solder injector 9. In this way, the solder layer 121 is formed between the lower surface 131c on one end side of the high-side plate member 131 and the upper surface 139a of the relay member 139. Thereby, the high side plate member 131 and the relay member 139 are electrically connected.

  In the finishing process, as shown in FIG. 28, the solder overflowing from the solder inlets 29, 132, 133 is melted at a temperature equal to or higher than the melting point of the solder layers 4, 5, 121 using a heating tool such as a soldering iron. To remove. Alternatively, the solder overflowing from the solder injection ports 29, 132, 133 may be mechanically cut. Thereafter, molding with the sealing resin 8 is performed as necessary, and the 2-in-1 power card 1 is manufactured.

As described above, according to Reference Example 2, the high-side plate member 131 that connects the high-side semiconductor element 11 and the low-side plate member 135 that connects the low-side semiconductor element 21 are separately formed in advance. Before the side-side plate member 131 and the low-side side plate member 135 are connected, characteristic inspections are performed on the high-side side and the low-side side, respectively. be able to. As a result, it is possible to avoid a situation where the entire normal element is discarded due to a defect of one element after the 2in1 conversion.
Further, in Reference Example 2, the high side plate member 131 and the low side plate member 135 are arranged so that their vertical positions are reversed via the relay member 139, so that the high side plate member 111 is the same as in Reference Example 1. If the low side plate member 115 and the low side plate member 115 are used separately from the case where they are arranged at the same height, it is possible to improve the degree of freedom of arrangement and the assembling property.

  Here, reference modification examples 1 and 2 will be described below with respect to a connecting portion between the high-side plate member 131 and the relay member 139 in the middle-side electrode plate 130 according to the reference example 2. FIG. 29A is a top view showing a connecting portion according to Reference Modification 1 of Reference Example 2. FIG. FIG. 29B is a top view showing a connecting portion according to Reference Modification 2 of Reference Example 2.

[Reference change example 1]
In Reference Modification 1 according to Reference Example 2, as shown in FIG. 29A, slits 145A and 145A are formed around the solder inlet 133 of the high-side plate member 131. The slits 145A and 145A are extended in the direction Y from the both end sides in the direction Y of the high side plate member 131 toward the center. The remaining portion when the slits 145A and 145A are formed is a connecting portion 146A.
According to the reference modification example 1 according to the reference example 2, since the connecting portion 146A is a remaining portion of the slits 145A and 145A extending in the direction Y, the cross-sectional area of the connecting portion 146A is smaller than that of the high side plate member 131. It has become. As a result, the time required to heat the joint portion between the high-side plate member 131 and the relay member 139 to a necessary temperature can be shortened, and the time required for the solder joining process during manufacturing can be further shortened. In connection with this, the power consumption by a heating appliance etc. can further be reduced.

[Reference change example 2]
In Reference Modification 2 according to Reference Example 2, as shown in FIG. 29B, a slit 145 </ b> B is formed around the solder injection port 133 of the high-side plate member 131. The slit 145B extends in the direction Y from one end side (lower side in the figure) in the direction Y of the high side plate member 131 toward the other end side (upper side in the figure). The remaining portion when the slit 145B is formed is a connecting portion 146B.
According to the reference modification example 2 according to the reference example 2, since the connecting portion 146B is a remaining portion of the slit 145B extending in the direction Y, the cross-sectional area of the connecting portion 146B is smaller than that of the high side plate member 131. Yes. As a result, the time required to heat the joint portion between the high-side plate member 131 and the relay member 139 to a necessary temperature can be shortened, and the time required for the solder joining process during manufacturing can be further shortened. In connection with this, the power consumption by a heating appliance etc. can further be reduced.
In particular, in the reference modification example 2 of the reference example 2, since the slit 145B has a shape cut from only one end side in the direction Y, the shape cut from both ends in the direction Y like the reference modification example 1 of the reference example 2 Compared to the slits 145A and 145A, it can be easily formed.

[Reference Example 3]
The configuration of the 2-in-1 power card according to Reference Example 3 will be described with reference to FIG. FIG. 30 is a cross-sectional view showing a 2-in-1 power card according to Reference Example 3. Since the 2-in-1 power card 150 according to Reference Example 3 has basically the same configuration as that of the above embodiment and Reference Examples 1 and 2, the same parts are denoted by the same reference numerals and description thereof is omitted as appropriate. Hereinafter, the difference will be mainly described.
As shown in FIG. 30, the 2-in-1 power card 150 includes a high-side electrode plate 12 connected to the high-side semiconductor element 11, a low-side electrode plate 22 connected to the low-side semiconductor element 21, a high-side semiconductor element 11 and A middle side electrode plate 160 connected to the low side semiconductor element 21 is provided.

  The middle side electrode plate 160 connects the high side plate member 161 connecting the high side semiconductor element 11, the low side plate member 165 connecting the low side semiconductor element 21, and the high side plate member 161 and the low side plate member 165. A high-side plate member 161 and a low-side plate member 165 after the connection between the high-side semiconductor element 11 and the high-side plate member 161 and after the low-side semiconductor element 21 and the low-side plate member 165 are connected. Are connected via a relay member 169. In this 2-in-1 power card 150, the high-side plate member 161 and the low-side plate member 165 are arranged so that the vertical position is reversed via the relay member 169.

  The high side plate member 161, the low side plate member 165, and the relay member 169 each have a rectangular flat plate shape, and are obtained by plating a copper plate, a copper plate, or an aluminum plate with nickel. In the center of the high-side plate member 161, a solder injection port 162 is formed penetrating in the thickness direction in order to inject solder. A solder layer 151 is formed between the end surface 161 c on one end side of the high-side plate member 161 and the upper side surface 169 a of the relay member 169. Further, a solder layer 152 is formed between the end surface 165 c on one end side of the low side plate member 165 and the lower side surface 169 b of the relay member 169.

  Here, a manufacturing method of the 2-in-1 power card 150 according to Reference Example 3 will be described with reference to FIGS. 31 and 32. In the manufacturing method according to Reference Example 3, the first solder joining process, the sealing process, the grinding process, the second solder joining process, the third solder joining process, and the finishing process are mainly performed in this order. FIG. 31 is a cross-sectional view showing the state of the second soldering step in the manufacturing method. FIG. 32 is a cross-sectional view showing the state of the third soldering step in the manufacturing method. In Reference Example 3, the first solder joining step, the sealing step, and the grinding step are performed in the same manner as in Reference Example 1, and therefore drawings and descriptions showing these steps are omitted.

  First, the first solder joining step, the sealing step, and the grinding step are performed in the same procedure as in Reference Example 1 to obtain the high side joined body 163 and the low side joined body 170. Thereafter, a second solder bonding process is performed on each of the bonded bodies 163 and 170.

  In the second solder joining step, as shown in FIG. 31, the high-side block electrode 14 and the high-side plate member 161 are solder-joined. At this time, bonding is performed in a reducing atmosphere in order to remove the oxide film on the electrode bonding surface. Or you may remove an oxide film using a flux. Before injecting the solder, the high side plate member 161 and the like are heated in advance in the reducing atmosphere to near the soldering temperature, or heated using hot air before and after mounting. Then, with the high side plate member 161 placed on the high side block electrode 14, molten solder is injected into the solder injection port 162 of the high side plate member 161 by the solder injector 9. In this way, the solder layer 4 is formed between the lower surface 161b of the high side plate member 161 and the upper surface 14a of the high side block electrode 14. Thereby, the high side plate member 161 and the high side block electrode 14 are electrically and thermally connected.

  In the second solder bonding step, the low-side block electrode 24 and the low-side electrode plate 22 are solder-bonded. At this time, bonding is performed in a reducing atmosphere in order to remove the oxide film on the electrode bonding surface. Or you may remove an oxide film using a flux. Before injecting the solder, the low-side electrode plate 22 or the like is heated in advance in the reducing atmosphere to near the soldering temperature, or heated using hot air before and after mounting. Then, with the low side electrode plate 22 placed on the low side block electrode 24, molten solder is injected into the solder injection port 29 of the low side electrode plate 22 by the solder injector 9. Thus, the solder layer 5 is formed between the lower surface 22 a of the low side electrode plate 22 and the upper surface 24 b of the low side block electrode 24. Thereby, the low side electrode plate 22 and the low side block electrode 24 are electrically and thermally connected.

  In the third solder joining step, as shown in FIG. 32, the high-side plate member 161 and the relay member 169 are solder-joined, and the low-side plate member 165 and the relay member 169 are solder-joined. By the way, before these joining, characteristic inspections such as energization inspection and strength inspection are separately performed on the high side and the low side. Then, it is made into 2 in 1 with the defective product removed. This is because if a defect of one element is found after the conversion to 2 in 1, the entire element, including the other normal element, must be discarded.

  After this characteristic inspection, the solder layer 151 is formed by injecting molten solder between the end surface 161 c on one end side of the high-side plate member 161 and the upper side surface 169 a of the relay member 169 by the solder injector 9. Thereby, the high side plate member 161 and the relay member 169 are electrically and thermally connected. Further, molten solder is injected between the end surface 165 c on one end side of the low side plate member 165 and the lower side surface 169 b of the relay member 169 to form the solder layer 152. Thereby, the low side plate member 165 and the relay member 169 are electrically connected.

  In the finishing process, the solder overflowing from the solder inlets 29, 162 and the solder layers 151, 152 is melted at a temperature equal to or higher than the melting point of the solder layers 4, 5, 151, 152 using a heating tool such as a soldering iron. Remove. Alternatively, the solder overflowing from the solder injection holes 29 and 162 and the solder layers 151 and 152 may be mechanically cut. Thereafter, molding with the sealing resin 8 is performed as necessary, and the 2-in-1 power card 150 is manufactured.

As described above, according to Reference Example 3, the high-side plate member 161 that connects the high-side semiconductor element 11 and the low-side plate member 165 that connects the low-side semiconductor element 21 are separately formed in advance. Before the side-side plate member 161 and the low-side side plate member 165 are connected, characteristic inspections are performed on the high-side side and the low-side side, respectively. be able to. As a result, it is possible to avoid a situation where the entire normal element is discarded due to a defect of one element after the 2in1 conversion.
Also in Reference Example 3, since the high side plate member 161 and the low side plate member 165 are arranged so that their vertical positions are reversed via the relay member 169, the high side plate member 111 is the same as in Reference Example 1. If the low side plate member 115 and the low side plate member 115 are used separately from the case where they are arranged at the same height, it is possible to improve the degree of freedom of arrangement and the assembling property.

  Here, reference modification examples 1 and 2 will be described below with respect to a connecting portion between the high-side plate member 161 and the relay member 169 in the middle-side electrode plate 160 according to the reference example 3. FIG. 33A is a top view showing a connecting portion according to Reference Modification 1 of Reference Example 3. FIG. FIG. 33 (b) is a top view showing a connecting portion according to Reference Modification 2 of Reference Example 3.

[Reference change example 1]
In Reference Modification 1 according to Reference Example 3, slits 155A and 155A are formed around the solder layer 151 in the high-side plate member 161, as shown in FIG. The slits 155A and 155A are extended in the direction Y from the both ends in the direction Y of the high side plate member 161 toward the center. The remaining portion when the slits 155A and 155A are formed is a connecting portion 156A.
According to the reference modification example 1 according to the reference example 3, since the connecting portion 156A is the remaining portion of the slits 155A and 155A extending in the direction Y, the cross-sectional area of the connecting portion 156A is smaller than that of the high side plate member 161. It has become. As a result, the time required to heat the joint portion between the high-side plate member 161 and the relay member 169 to a necessary temperature can be shortened, and the time required for the solder joining process during manufacturing can be further shortened. In connection with this, the power consumption by a heating appliance etc. can further be reduced.

[Reference change example 2]
In the reference modification example 2 according to the reference example 3, as shown in FIG. 33B, a slit 155B is formed around the solder layer 151 in the high-side plate member 161. The slit 155B extends from one end side (lower side in the figure) in the direction Y of the high side plate member 161 toward the other end side (upper side in the figure) in the direction Y. The remaining portion when the slit 155B is formed is a connecting portion 156B.
According to Reference Modification 2 according to Reference Example 3, since the connecting portion 156B is a remaining portion of the slit 155B extending in the direction Y, the cross-sectional area of the connecting portion 156B is smaller than that of the high-side plate member 161. Yes. As a result, the time required to heat the joint portion between the high-side plate member 161 and the relay member 169 to a necessary temperature can be shortened, and the time required for the solder joining process during manufacturing can be further shortened. In connection with this, the power consumption by a heating appliance etc. can further be reduced.
In particular, in the reference modification example 2 of the reference example 3, since the slit 155B has a shape cut from only one end side in the direction Y, the shape cut from both ends in the direction Y as in the reference modification example 1 of the reference example 3 Compared to the slits 155A and 155A, it can be easily formed.

  Finally, common reference modification examples 1 and 2 that can be commonly applied to the reference examples 1 to 3 described above will be described with reference to FIG. FIG. 34A is a top view showing a connecting portion according to the common reference modification example 1 of the reference examples 1 to 3. FIG. FIG. 34B is a top view showing a connecting portion according to common reference modification example 2 of reference examples 1 to 3. In the common reference modification examples 1 and 2, the high side plate members 180A and 180B can be replaced with any of the high side plate members 111, 131, and 161 of the reference examples 1 to 3 described above.

[Common Reference Change Example 1]
As shown in FIG. 34A, first slits 181A and 181A are extended from the both end sides in the direction Y toward the center of the high-side plate member 180A of the common reference modification example 1. The remaining portion when the first slits 181A and 181A are formed is a connecting portion 183A. Further, second slits 182A and 182A extending in the connecting direction X are formed around the connecting portion 183A of the first slits 181A and 181A. Thereby, the length in the connecting direction X of the connecting portion 183A is substantially extended.
According to the common reference modification example 1, the heating efficiency in the joint portion 185 of the high-side plate member 180A is further increased by substantially extending the length of the connecting portion 183A in the connecting direction X by the second slits 182A and 182A. be able to. Thereby, while shortening the time which a solder joining process requires at the time of manufacture, the power consumption by a heating instrument etc. can further be reduced. Further, since the electrode portion excluding the periphery of the connecting portion 183A can be brought into contact with the cooler, the cooling performance of the high side plate member 180A can be ensured.

[Common Reference Change Example 2]
As shown in FIG. 34 (b), the high-side plate member 180B of the common reference modification example 2 has a first direction from one end side (lower side in the figure) to the other end side (upper side in the figure) in the direction Y. A slit 181B is extended. The remaining portion when the first slit 181B is formed is a connecting portion 183B. A second slit 182B extending in the connecting direction X is formed around the connecting portion 183B of the first slit 181B. Thereby, the length in the connection direction X of the connection part 183B is substantially extended.
According to the common reference modification example 1, by substantially extending the length in the connecting direction X of the connecting portion 183B by the second slit 182B, it is possible to further increase the heating efficiency at the joining portion 185 of the high side plate member 180B. it can. Thereby, while shortening the time which a solder joining process requires at the time of manufacture, the power consumption by a heating instrument etc. can further be reduced. Further, since the electrode portion excluding the periphery of the connecting portion 183B can be brought into contact with the cooler, the cooling performance of the high side plate member 180B can be ensured.
In particular, in the common reference modification example 2, since the slits 181B and 182B have a shape cut out only from one end side in the direction Y, the slit 181A having a shape cut out from both end sides in the direction Y as in the common reference modification example 1 Compared with 181A, 182A, and 182A, it can be formed easily.

It should be noted that the above-described embodiments and reference examples are merely illustrative, and do not limit the present invention in any way, and various improvements and modifications can be made without departing from the scope of the invention.
For example, in the above embodiment and the reference example, the case of a 2 in 1 power card in which two power elements 11 and 21 are mounted on one power card is shown. However, for example, when configuring a plurality of inverter circuits such as 3 in 1 and 6 in 1 You may apply.
Moreover, although the said embodiment demonstrated in detail about shortening of the time which a 3rd solder joining process requires, it is not restricted to this, Only one of the high side side board part 31 or the low side board part 35 of the middle side electrode plate 30 is heated. In other processes that need to be performed, the time can be similarly reduced.
Moreover, you may combine freely each modification of the said embodiment, and each reference modification of the said reference example suitably.

DESCRIPTION OF SYMBOLS 1 ... 2in1 power card 10 ... High side circuit part 11 ... High side power element 12 ... High side electrode plate 20 ... Low side circuit part 21 ... Low side side power element 22 ... Low side electrode plate 30 ... Middle side electrode plate 31 ... High-side side plate portion 33 ... first slit 34 ... second slit 35 ... low-side side plate portion 36 ... connecting portion

Claims (3)

In a semiconductor device comprising a high-side semiconductor element and a low-side semiconductor element, and enabling cooling from both sides,
A high-side electrode plate connected to the high-side semiconductor element;
A low-side electrode plate connected to the low-side semiconductor element;
A middle side electrode plate connected to the high side semiconductor element and the low side semiconductor element;
The middle side electrode plate includes a high side plate portion connecting the high side semiconductor element and a low side plate portion connecting the low side semiconductor element, each having a cross-sectional area greater than the high side plate portion and the low side side plate portion. Being connected via a small connecting part ,
The connecting portion is a remaining portion when a slit penetrating in the thickness direction is formed in the middle side electrode plate,
The slit is extended from both sides of the middle side electrode plate toward the center, or extended from one end side to the other end side so as to be orthogonal to the connecting direction. A semiconductor device. The semiconductor device according to claim 1 ,
The semiconductor device according to claim 1, wherein the slit extends in a connecting direction around the connecting portion. 3. The semiconductor device according to claim 1, wherein a cross-sectional area of the remaining portion is 1/5 to 1/2 of a cross-sectional area of the high-side side plate portion and the low-side side plate portion. Semiconductor device.

Images