JP5488328B2 - Electronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component used in various electronic devices.

  Hereinafter, conventional electronic components will be described with reference to the drawings. Here, a coil component will be described as an example of a conventional electronic component. In a conventional coil component, for example, as shown in FIG. 10, a coil component having a lead terminal portion 1 is formed by sealing a rectangular conductor wire 3 composed of a lead terminal portion 1 and an internal conductor portion 2 with an exterior resin portion 4. 5 was constructed.

  As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.

JP 2005-72022 A

  In the conventional coil component 5, it is necessary to make the lead terminal portion 1 smaller in size than the internal conductor portion 2 as shown in FIG. 11. In particular, with respect to the dimension in the W1 direction, it has been required to accurately define the value by cutting or the like in order to remove the R portion unique to the flat conductor wire 3 of the internal conductor portion 2.

  The reason is that, when forming the exterior resin portion 4 shown in FIG. 10, for example, as shown in FIG. The other part of the rectangular conductor wire 3 is accommodated in a cavity (not shown) of the mold 6 and the portion of the rectangular conductor wire 3 accommodated in the cavity (not shown) is sealed by injection molding. In this case, unless the dimension value of W2 of the terminal lead-out openings 7a and 7b of the mold 6 and the dimension value of W1 shown in FIG. The resin for sealing protrudes from the mold 6 to the lead terminal portion 1 side shown in FIG. 2, and there is a possibility that molding precision such as dimensions may be lowered, such as a resin burr (not shown) occurring in the lead terminal portion 1. It had a problem.

  Then, as described above, the lead terminal portion 1 is cut into W2 having a width dimension smaller than the original dimension of the rectangular conductor wire 3, and further, the rectangular conductor wire is tightened by the clamping pressure of the mold 6. By setting the height dimension H2 to a value smaller than the original dimension 3, the dimension is reduced. That is, the conductor has a problem that there is a risk that the electrical resistance is increased and the mechanical strength is decreased due to the state that the cross-sectional area is smaller than the initial dimension.

  Therefore, the present invention provides an electronic component having a terminal portion with excellent electrical and mechanical characteristics.

  In order to achieve this object, a circuit element portion, a lead terminal portion formed by a rectangular conductor wire, a connection conductor portion connecting the circuit element portion and the lead terminal portion, the circuit element portion and the connection conductor An exterior resin portion that covers the outer surface of the lead terminal portion, and the lead-out terminal portion is formed at the lead-out boundary portion of the lead-out terminal portion with the concave portions facing both wide surfaces of the lead-out terminal portion. This is characterized in that a convex portion is provided at the peripheral edge portion.

  According to the present invention, since the lead terminal portion does not reduce the cross-sectional area and does not increase the electrical resistance, it is possible to suppress power loss in the electronic component and to pull out the lead terminal portion. Since the cross-sectional shape at the boundary portion is substantially H-shaped, the mechanical strength at the lead-out boundary portion of the lead-out terminal portion is improved, and the reliability of the lead-out terminal portion is also improved.

The perspective view of the electronic component in one Embodiment of this invention The top view of the electronic component in one embodiment of the present invention (A) First terminal cross-sectional view of electronic component in one embodiment of the present invention, (b) Second terminal cross-sectional view of electronic component in one embodiment of the present invention, (c) In one embodiment of the present invention Third terminal cross section of electronic component The perspective view of the positional relationship of the metal mold | die and electronic component in one Embodiment of the manufacturing process of this invention 1st sectional drawing of the positional relationship of the metal mold | die and a terminal in one Embodiment of the manufacturing process of this invention. 2nd sectional drawing of the positional relationship of the metal mold | die and a terminal in one Embodiment of the manufacturing process of this invention. 1st sectional drawing of the punch structure part in one Embodiment of the manufacturing process of this invention 2nd sectional drawing of the punch structure part in one Embodiment of the manufacturing process of this invention 3rd sectional drawing of the punch structure part in one Embodiment of the manufacturing process of this invention Perspective view of conventional electronic components A perspective view of a terminal of a conventional electronic component The perspective view of the positional relationship between the metal mold | die and an electronic component in the manufacturing process of the conventional electronic component

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment)
FIG. 1 is a perspective view of an electronic component according to an embodiment of the present invention, in which a circuit element portion 8, a lead terminal portion 9 formed by a rectangular conductor wire, and a connection for connecting the circuit element portion 8 and the lead terminal portion 9 are shown. The conductor part 10 and the exterior resin part 11 which coat | covers the circuit element part 8 and the connection conductor part 10 are provided. Then, on the outside of the extraction boundary portion 12 from the exterior resin portion 11 in the extraction terminal portion 9, the concave portions 13 are formed to face both wide surfaces of the extraction terminal portion 9, and the edge portion 14 of the extraction terminal portion 9 is formed. The first convex portion 15 is provided.

  At this time, in the top view of the electronic component shown in FIG. 2, a straight line A including the lead boundary portion 12, a straight line B connecting the concave portions 13 formed in the lead terminal portion 9, and a straight line C connecting the leading end side of the lead terminal portion 9 are defined. The cross-sectional shapes of the straight line A, the straight line B, and the straight line C are as shown in FIGS. 3A, 3B, and 3C, respectively. Further, in FIG. 2, it is shown that the spiral structure 8 a is housed inside the exterior resin portion 11, but this may be another circuit element 8 as shown in FIG. 1. .

  Here, in the cross-sectional view of FIG. 3 (a), the leading end side of the lead terminal portion 9, that is, a state where the flat conductor wire is not processed at all in the initial shape is indicated by a broken line, and the outer peripheral dimension is larger than that. The drawer boundary portion 12 is formed as a shape enlarged over the entire area, and an area F having a dimension larger than the original shape of the lead terminal portion 9 is formed from the drawer boundary portion 12 as shown in FIG. 11 is located. Further, in the cross-sectional view of FIG. 3B, the cross-sectional shape is substantially H-shaped with a depression near the center as compared with both ends, and the lead terminal portion 9 having the shape shown by the initial broken line of the flat conductor wire. The portion provided with the recess 13 with respect to the tip side is formed so as to be thinner than the shape of the broken line, and at the same time, the side surface sandwiched between the edge portion 14 and the edge portion 14 of the lead terminal portion 9 That is, the 1st convex part 15 is provided in the side surface of the flat conductor wire from which the recessed part 13 is not formed, and it forms in the shape overhanging larger than the shape of the broken line. In the cross-sectional view of FIG. 3 (c), the flat conductor wire is provided in the leading end side as the lead terminal portion 9 with the original shape.

  With the above configuration, when external stress is applied to the lead terminal portion 9 in the top view of FIG. 2, the force tends to be applied to the leading end side of the lead terminal portion 9, but is concentrated on a local area such as on the straight line C. Since this is a difficult state, deterioration due to metal fatigue or the like of the lead terminal portion 9 due to repeated stress can be suppressed, and high reliability regarding mounting and connection can be maintained.

  First of all, since the extraction boundary portion 12 is formed so as to have a large cross-sectional area as shown in FIG. 3A, this portion is formed on the leading end side of the extraction terminal portion 9 shown in FIG. In comparison, the strength is increased, and as a result, it is difficult to concentrate the stress on the extraction boundary portion 12. In addition, secondly, as shown in FIG. 3B, the lead-out terminal portion 9 of the portion formed with the recess 13 located outside the exterior resin portion 11 when viewed from the lead-out boundary portion 12 shown in FIG. By being formed in the H shape, it has a mechanically strong shape against external stress such as bending, and the stress is also difficult to concentrate in this portion. Due to these two factors, stress applied by external impact or vibration is likely to be applied mainly to the leading end side of the lead terminal portion 9 shown in FIG. 2, but this portion is limited like the lead boundary portion 12. Since it is not a narrow part or region, the stress is relatively easy to disperse. As a result, deterioration of the lead-out terminal portion 9 can be suppressed and high reliability can be maintained. Here, in the formation of the cross-sectional shape of the lead-out terminal portion 9, the conductor amount itself is formed because it is formed by punching or pushing in without performing a process of reducing the conductor such as cutting a rectangular conductor wire having a rectangular cross section. There is no change in the cross-sectional area, the amount of decrease in the cross-sectional area becomes very small, and the power loss during operation accompanying the increase in electrical resistance also hardly increases.

  In FIG. 2, the recess 13 is rectangular, but when forming the first protrusion 15 on the edge portion 14 as shown in the cross-sectional view of FIG. 3B, the recess 13 becomes the lead terminal portion 9 of FIG. The dimension of the first convex portion 15 can be easily controlled by forming a groove shape having a length in the pulling-out direction. Therefore, as shown in FIG. 3B, by increasing the region where the cross-sectional shape is formed in an H shape, the region where the mechanical strength is increased can be lengthened.

  Further, as shown in FIG. 1, a connection conductor portion 10 connected to the lead terminal portion 9 and a circuit element portion 8 connected to the connection conductor portion 10 are provided inside the exterior resin portion 11. As for the conductor portion 10, in consideration of electrical resistance, a conductor having a larger cross-sectional area than the lead terminal portion 9 may be applied, or the lead terminal portion 9 is extended to simplify the structure, The portion may be the connecting conductor portion 10. As a result, connection points can be eliminated, and connection reliability can be improved as a matter of course.

  Further, the circuit element portion 8 may be formed as a coil component by forming the lead terminal portion 9 or the connecting conductor portion 10 in a spiral shape after extending. In particular, by forming the lead terminal portion 9, the connecting conductor portion 10 extending from the lead terminal portion 9 and the spiral portion (not shown) with a single flat conductor wire, and providing the concave portion 13, welding or the like. The joint portion is eliminated, and the connection reliability can be further increased.

  Here, the portions including the lead terminal portion 9 and the connecting conductor portion 10 are formed by applying an insulating film to a rectangular conductor wire. Even if the insulation coating is formed in advance, there will be no problems such as damage because flat conductor wires are not processed by complicated bending, twisting or cutting, but to ensure higher insulation An insulating coating or an insulating treatment may be applied to the outside of the exterior resin portion 11 around the recess 13 after the recess 13 is formed.

  From here on, the manufacturing method for the electronic component described so far will be described in order.

  FIG. 4 is a view showing the relationship between the mold and each part of the unsealed electronic component in the manufacturing process of the electronic component. The circuit element portion 8 and the connection conductor portion 10 are connected to the mold of the molding die 16. The portions housed in the tee 17 and positioned on the front end side of the drawing boundary portion 12 of the drawing terminal portion 9a before processing are arranged in the drawing openings 19a and 19b of the molding die 16. Here, both the upper and lower molding dies 16 are provided with punch structure portions 18 for forming the recesses 13 that are not formed at the present time.

  As a first step, FIG. 5 is a cross-sectional view showing the positional relationship between the mold and the terminal in the manufacturing process, and the upper and lower molding dies 16 are used to draw the lead terminal portion 9a before processing into the lead openings 19a and 19b. There is a process that is in a state of being sandwiched and positioned. At this time, the lead openings 19a and 19b have dimensions larger than the outer dimensions of the lead terminal part 9a before processing. It is desirable that the dimension for the relief is such that about 0.1 mm is added to the maximum value of the outer dimension of the lead terminal portion 9a before processing, that is, the maximum tolerance of the outer dimension of the rectangular conductor wire. FIG. 6 is a cross-sectional view similar to the above, but the direction is changed, and a part of the lead terminal portion 9, the connecting conductor portion 10, and the circuit element portion 8 are accommodated in the cavity 17, and the lead terminal before processing. The portion 9a is positioned between the drawer openings 19a and 19b. The molding die 16 is provided with a punch structure 18 above and below the undrawn lead terminal portion 9a, and is not in contact with the drawer boundary portion 12 or the molding boundary portion 12a, but in a close position. 18a is arranged.

  As the next step, as shown in the first sectional view of the punching process of FIG. 7, the punch 18a is simultaneously driven from above and below into the lead terminal portion 9a before processing, and the second sectional view of the punching process of FIG. As shown in FIG. By forming the recess 13, the conductor existing in the portion where the recess 13 will be formed later in the lead terminal portion 9 a before the initial processing is pushed out by the pressing force of the punch 18 a, and The second convex portions 20 are formed above and below the lead terminal portion 9 in the cross-sectional dimension increasing region on the tee 17 side and the lead boundary portion 12 and in the periphery of the concave portion 13.

  At the same time, as shown in the third cross-sectional view of the punching process of FIG. 9 in which the cross-sectional direction is changed by 90 degrees, the recess 13 is formed so that the lead terminal portion (not shown) before the initial processing is later formed. The conductor present in the portion where the concave portion 13 is to be formed is pushed out by the pressing force of the punch 18 a, and the first convex portion 15 is formed on the edge portion 14 of the lead terminal portion 9.

  In the next step, an exterior portion (not shown) is formed by injecting resin into the cavity 17 shown in FIG. At this time, the relief portion that originally existed between the lead terminal portion 9 and the opening 16a, 19b of the molding die 16 was formed continuously around the recess 13 shown in FIG. 9 in the previous step. Since the first convex portion 15 and the second convex portion 20 shown in FIG. 8 are sealed, the resin to be injected does not sufficiently leak the resin to the outside of the cavity 17 even if the injection molding is performed at a high pressure. It is ready to handle. As a result, the resin injected into the cavity 17 leaks to the outside and large burrs are generated even if the lead terminals 9a before dimension processing with respect to the openings 19a and 19b shown in FIG. 6 are not strictly regulated. And a stable state of the exterior of the resin can be secured at a low cost.

  Further, as shown in FIG. 9, the lead terminal portion 9 formed by this method has a very strong structure against bending because the cross-sectional shape is generally H-shaped, as shown in FIG. In addition, since the second convex portion 20 has a structure in which a part of the second convex portion 20 is resin-molded and is present inside the resin and is drawn out as the lead-out terminal portion 9, the mechanical strength of the lead-out boundary portion 12 is also high. As a result, the reliability of the entire lead terminal 9 can be improved.

  The electronic component according to the present invention has an effect of maintaining a stable exterior molded state and maintaining high reliability of the terminal portion, and is useful for application to various electronic devices.

DESCRIPTION OF SYMBOLS 8 Circuit element part 9 Leading terminal part 9a Leading terminal part before processing 10 Connection conductor part 11 Exterior resin part 12 Leading-out boundary part 13 Concave part 14 Edge part 15 1st convex part 16 Molding die 17 Cavity 18 Punch structure part 18a Punch 19a Opening 19b Opening 20 Second convex part

Claims (5)

A circuit element portion, a lead terminal portion formed by a rectangular conductor wire,
A connection conductor portion connecting the circuit element portion and the lead terminal portion;
An exterior resin portion covering the circuit element portion and the connection conductor portion;
In the lead-out boundary part from the exterior resin part in the lead-out terminal part,
Forming the recesses facing both wide surfaces of the lead terminal part,
The electronic component which provided the convex part in the edge part of the said lead-out terminal part. The electronic component according to claim 1, wherein the concave portion has a groove shape extending from the leading boundary portion toward the leading end of the leading terminal portion. The electronic component according to claim 1, wherein the lead terminal portion and the connection conductor portion are formed of a continuous rectangular conductor wire. The electronic component according to claim 3, wherein the flat conductor wire is provided with an insulating film on a surface thereof. A circuit element portion, a lead terminal portion formed by a rectangular conductor wire,
A connection conductor portion connecting the circuit element portion and the lead terminal portion;
In the manufacturing process of the electronic component including the exterior resin portion that covers the circuit element portion, the connection conductor portion, and a part of the lead terminal portion,
A part of the circuit element part, the connection conductor part, and the lead terminal part is provided in an exterior mold having a space for forming the exterior resin part and a terminal relief part larger than the outer dimension of the lead terminal part. A first step of arranging
A second step of forming a recess by punching from both sides in the vicinity of the terminal escape portion in the lead-out terminal portion after the first step;
And a third step of injecting a resin into the space after the second step.

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