JP5488874B2 - Inspection equipment for integrated circuit boards - Google Patents

Description

  The present invention relates to an inspection apparatus for an integrated circuit board for inspecting in advance an integrated circuit board on which a MEMS (Micro Electro Mechanical Systems) element is to be mounted.

  By mounting a passive element (generally referred to as a “MEMS element”) on a substrate on which an integrated circuit is formed (hereinafter referred to as an “integrated circuit board”), a circuit is formed by the integrated circuit and the passive element. To form various functional devices. Here, the “MEMS element” refers to a functional device that is three-dimensionally formed using a technique for manufacturing MEMS. “Mounting” means that an integrated circuit board and a MEMS element produced separately are joined and integrated, or a MEMS element is formed directly on the integrated circuit board.

  FIG. 23 schematically shows a conventional functional device 100. The functional device 100 includes a substrate on which an integrated circuit is formed, that is, an integrated circuit substrate 110, and another substrate having circuit elements, that is, a MEMS device 120. It is installed. Specifically, a plurality of electronic elements are formed on the integrated circuit substrate 110 through repetition of various processes such as thin film formation and microfabrication, and the plurality of elements are connected by a wiring pattern. Electrode pads 111A and 111B are formed on the surface. Similarly, the MEMS element 120 is formed with one or a plurality of elements through repetition of various processes such as thin film formation and microfabrication, and the MEMS element 120 has connection electrodes 121A and 121B on the lower surface. The MEMS element 120 is mounted on the integrated circuit substrate 110 and fixed so that the connection electrodes 121A and 121B are electrically connected to the electrode pads 111A and 111B. In the functional device 100 having such a structure, the circuit elements in the MEMS element 120 are connected to the integrated circuit through the connection electrodes 121A and 121B and the electrode pads 111A and 111B, respectively, and exhibit a predetermined function.

  As described above, the integrated circuit in the integrated circuit substrate 110 does not function as such, but the integrated circuit and the MEMS element 120 function for the first time when connected to the MEMS element 120. However, when the inspection is performed after mounting the MEMS element 120 on the integrated circuit board 110 and it is found that the predetermined function is not exhibited, the causes are the integrated circuit board 110 itself, the MEMS element 120 itself, and the MEMS element. It cannot be determined whether there is any damage to the integrated circuit that occurred during the mounting process.

  By the way, it is already known to inspect a substrate on which an integrated circuit is formed. (For example, Patent Documents 1 and 2).

  Patent Document 1 discloses a probe holding structure that is provided on a probe card and holds a conductive spring-type probe having a spring portion and a needle portion that is smaller in diameter than the spring portion and extends linearly from one end of the spring portion. ing. Specifically, the interposer has an interposer disposed on the probe card side and a probe support substrate disposed on the measurement object side with the main surface facing the interposer, and the interposer includes a spring-type probe and a probe card. A conductive path for electrical connection is provided, and a through hole perpendicular to the main surface is formed in the probe support substrate. The probe support substrate and the interposer have a needle portion that penetrates the through hole and a spring portion. The rear end is in contact with the wiring means and is held in a state where the spring portion is contracted between the two substrates.

  U.S. Pat. No. 6,089,077 discloses a test assembly for testing a product circuit on at least one product die. Specifically, a plurality of first level test dies each having a test circuit for testing at least part of the product circuit of the product die, and electrically connecting the first level test die to the at least one product die First interconnect means for coupling to each other, one shared test die, second interconnect means for electrically coupling the shared test die to each of the first level test dies, and communicating with the shared test die And a third interconnect means for electrically coupling the shared test die to the host controller that performs the above. The first interconnection means comprises a plurality of contact elements, the plurality of contact elements comprising spring contact elements.

JP 2007-171139 A (front page) Japanese Patent No. 3754616 (Claim 1, Claim 5, Claim 7)

  As shown in FIG. 23, when the MEMS element 120 is mounted on the integrated circuit board 110, in particular, a plurality of elements in the integrated circuit board 110 and circuit elements in the MEMS element are integrally formed with a high frequency circuit. When considering the inspection of the integrated circuit board 110 in such a case, if an inspection device is used to inspect with the probe having the spring property, the electrical connection path between the probe and the spring connecting element and the integrated circuit board The shape changes by pressing the probe. When the integrated circuit board on which the MEMS element is mounted forms a high frequency circuit of GHz or higher, unlike the low frequency circuit, the inspection needs to be performed carefully. This is because, in particular, when the inspection target is the integrated circuit board 110 as a component of a high-frequency circuit exceeding the GHz order, the frequency characteristics depend on the surrounding environment.

  For example, when a high frequency is passed through the wiring, an electromagnetic wave that changes at the same frequency is generated. Therefore, if there is a substance that reacts to electromagnetic waves around an electrical conduction region such as a wiring, an electromagnetic loss occurs. Specifically, if there is a high-resistance material that is not an insulator between the integrated circuit board and the inspection apparatus, eddy current loss occurs due to generation of eddy current. If there is a dielectric around the integrated circuit board and the inspection apparatus, dielectric loss occurs. Due to these losses, the Q value decreases and the designed characteristics are not exhibited.

  As another example, if there is an electrical material around the wiring, it adds a passive property to the material and changes from the design specifications. Specifically, if a magnetic material is present between the integrated circuit board and the inspection apparatus, the magnetic material tends to accumulate a magnetic field, resulting in an increase in inductance. If there is another region of electrical conduction between the integrated circuit board and the inspection device, stray capacitance is generated. These increase in inductance and generation of stray capacitance become passive properties that deviate from the design.

  As described above, when a high-frequency circuit is configured by mounting a MEMS element on an integrated circuit substrate, when inspecting only the integrated circuit substrate, if inspection is not performed in the same state as the state in which the actual MEMS element is mounted, The correct inspection cannot be performed. As shown in Patent Documents 1 and 2, when the inspection apparatus includes a spring-like probe, and the integrated circuit board is inspected with the probe, the shape change of the probe between the integrated circuit board and the inspection apparatus Due to the difference in dimensions with the actual MEMS element, the generation of inductance, stray capacitance, electromagnetic loss, etc., which are different from the actual MEMS mounted, occur, and the frequency characteristics of the test element are predicted to change from the design specifications Inviting an impossible result. In particular, when a MEMS element is mounted on an integrated circuit substrate to constitute a high-frequency circuit such as an oscillation circuit, oscillation may not occur due to a change in resonance frequency or a decrease in Q value due to electromagnetic loss. Further, the contact resistance between the probe and the integrated circuit board increases, and oscillation may not occur.

  In view of the above, the present invention provides an inspection apparatus for an integrated circuit board that can correctly inspect whether the integrated circuit board has performance as specified before mounting the MEMS element on the integrated circuit board. Purpose.

In order to achieve the above object, an inspection apparatus for an integrated circuit board according to the present invention is used for inspection of an integrated circuit board on which a MEMS element having a package is to be mounted, and has a plurality of inspection connection parts. An evaluation device for an integrated circuit board, comprising: a pressing unit that presses the connection part for inspection against the electrode pad of the integrated circuit board,
The inspection element is configured so that the circuit formed by connecting the inspection element and the integrated circuit board and the circuit formed by mounting the MEMS element on the integrated circuit board are the same as an equivalent circuit,
The inspection element has a package having the same structure as that of the MEMS element package and formed with electric wiring, and a pointed portion protrudes from a contact surface of the package with the integrated circuit substrate. When the test element and the integrated circuit board are connected, the electrode pad formed on the integrated circuit board is configured to come into contact with an electrode pad different from the electrode pad with which the test connection part comes into contact,
Further, when the inspection connecting portion is pressed against the electrode pad by the pressing means, the inspection connecting portion has rigidity and the pressing means has elasticity so that the inspection connecting portion is not deformed.

The inspection apparatus for an integrated circuit board of the present invention is used for inspection of an integrated circuit board on which a MEMS element is to be mounted, and inspects an inspection element having a plurality of inspection connection portions and an electrode pad of the integrated circuit board. A pressing means for pressing the connecting portion, and an evaluation apparatus for an integrated circuit board comprising:
The inspection element is configured so that the circuit formed by connecting the inspection element and the integrated circuit board and the circuit formed by mounting the MEMS element on the integrated circuit board are the same as an equivalent circuit,
When the inspection connecting portion is pressed against the electrode pad by the pressing means, the inspection connecting portion has rigidity and the pressing means has elasticity so that the inspection connecting portion is not deformed.
Further, the test element is provided with an insulator that holds the same element as the circuit element of the MEMS element, and protrudes from the surface of the insulator facing the integrated circuit substrate to project the pseudo test connection portion and the plurality of test elements. A connecting portion is provided, and when the pressing means presses the inspection connecting portion against the electrode pad, the inspection connecting portion is in contact with the electrode pad while keeping the inspection element horizontal by the pseudo inspection connecting portion. To do.

  According to the present invention, the inspection element including the rigid inspection connection portion is brought into contact with the electrode pad of the integrated circuit substrate on which the MEMS element is to be mounted, so that it is electrically the same as the state in which the MEMS element is mounted. The state can be reproduced. Therefore, the integrated circuit board can be correctly inspected. Since the integrated circuit board itself is inspected in advance and the MEMS element is mounted on the integrated circuit board that has passed the inspection, the yield is improved. In particular, it is particularly effective in the inspection of an integrated circuit substrate in which a MEMS element is mounted to constitute a high-frequency circuit.

1 is a diagram schematically showing an integrated circuit board inspection apparatus according to a first embodiment of the present invention. FIG. 2 shows the size relationship between the inspection element, the MEMS element, and the integrated circuit substrate shown in FIG. 1, where (A) shows a case where the MEMS element is mounted on the integrated circuit substrate, and (B) and (C) show FIG. 5 is a schematic diagram showing a case where an inspection element is connected to the integrated circuit board, where (B) is OK and (C) is NG. It is a figure which shows typically the test | inspection apparatus for integrated circuit boards which concerns on 2nd Embodiment of this invention. It is a figure which shows typically the inspection method by the integrated circuit board inspection apparatus shown in FIG. It is a figure which shows typically the integrated circuit board inspection apparatus which concerns on 4th Embodiment of this invention. It is a figure which shows typically the test | inspection apparatus for integrated circuit boards which concerns on 5th Embodiment of this invention. It is a figure which shows typically a mode that the MEMS element is mounted in the integrated circuit board shown in FIG. It is a figure which shows typically the inspection apparatus for integrated circuit boards which concerns on 6th Embodiment of this invention. When a MEMS element is a square coil, it is explanatory drawing for demonstrating how the distance of a test | inspection element, a 1st elastic member, and a 2nd supporting member should be determined, (A) The figure which shows the state of a model setting, (B) is a figure which shows the change of the magnetic field intensity with respect to the distance of a Z-axis direction, (C) is a figure which shows the change of the magnetic field intensity with respect to the distance from the one side of a coil in XY plane. The integrated circuit board inspection apparatus which concerns on 7th Embodiment of this invention is shown, (A) is typical sectional drawing, (B) is a bottom view. FIGS. 10A and 10B show a unit related to the integrated circuit board inspection apparatus according to the seventh embodiment shown in FIG. 10. FIG. 10A is a bottom view, and FIG. FIG. 10 shows an inspection apparatus for an integrated circuit board according to the seventh embodiment shown in FIG. 10, wherein (A) is a cross-sectional view taken along line AA, (B) is a cross-sectional view taken along line BB, and (C) is C It is sectional drawing which follows the -C line. It is a figure which shows typically the manufacturing process of the test | inspection apparatus for integrated circuit boards which concerns on 7th Embodiment. FIG. 14 is a diagram showing a continuation of the manufacturing process shown in FIG. 13. It is a figure which shows the continuation of the preparation process shown in FIG. FIG. 16 is a diagram showing a continuation of the manufacturing process shown in FIG. 15. It is a figure which shows the specific 1st structure of the test | inspection element shown in FIG. 1, (A) is the perspective view seen from the downward diagonal direction, (B) is a bottom view. It is a figure which shows the concrete 2nd structure of the test | inspection element shown in FIG. 1, (A) is the perspective view seen from the downward diagonal direction, (B) is a bottom view. FIG. 18 shows an integrated circuit board device having an inspection connecting portion as shown in FIG. 18, wherein (A) is a plan view, (B) is a side view, and (C) and (D) are front views. (A) thru | or (F) is a bottom view which shows typically the various modifications of the element for a test | inspection. It is a schematic diagram for demonstrating the relationship between the element for a test | inspection and an integrated circuit board in each embodiment of this invention, (A) is a top view of a MEMS element, (B) is a side view of a MEMS element, (C) FIG. 4A shows the relationship between the testing element and the integrated circuit board in the specific first example, and FIG. 4D shows the relationship between the testing element and the integrated circuit board in the specific second example. In each embodiment of the present invention, the relation between an inspection element and pressing means is typically shown, (A) is a side view, and (B) is a bottom view. It is a figure which shows the conventional functional device typically.

Embodiments of the present invention will be described below with reference to the drawings. The integrated circuit board inspection apparatus in each embodiment of the present invention is for inspecting the integrated circuit board 110 described above with reference to FIG. 23 before the MEMS element 120 is mounted, for example. The integrated circuit substrate 110 and the MEMS element 120 are the same as those described above.
(First embodiment)
FIG. 1 schematically shows an inspection apparatus for an integrated circuit board according to a first embodiment of the present invention. The integrated circuit board inspection apparatus 10 inspects the integrated circuit board 110. The integrated circuit board 110 has a plurality of electrode pads 111A and 111B in the illustrated case on the surface. A plurality of circuit elements 112 are connected to the integrated circuit substrate 110 by a wiring pattern through thin film formation on a substrate such as Si and fine processing such as etching. In the illustrated case, an amplifying element is schematically shown as the circuit element 112. An integrated circuit in which the connection electrodes in the MEMS element 120 are connected to the electrode pads 111A and 111B, the circuit element 112 in the integrated circuit substrate 110 and the MEMS element 120 are connected to form an integrated circuit, and the MEMS element 120 is mounted. The substrate 110 exhibits a predetermined function (see FIG. 23). The MEMS element 120 includes electrode portions (also referred to as connection electrodes) 121 </ b> A and 121 </ b> B that protrude from the surface facing the integrated circuit substrate 110 when mounted on the integrated circuit substrate 110. In the present embodiment, the MEMS element 120 has a passive element including any of a resistor, a coil, and a capacitor, but may include other circuit elements.

  The integrated circuit board inspection apparatus 10 inspects the inspection element 12 including a plurality of inspection connection portions 12A and 12B having rigidity as external terminals and the electrode pads 111A and 111B provided on the surface of the integrated circuit board 110. And pressing means 16 for pressing the connecting portions 12A and 12B. Here, the inspection element 12 includes a circuit formed by the inspection element 12 and the integrated circuit on the integrated circuit substrate 110 in a state where the pressing unit 16 presses the inspection element 12 against the electrode pads 111A and 111B. When the MEMS element 120 is mounted on the integrated circuit substrate 110, the circuit formed by the integrated circuit and the MEMS element 120 is configured to be the same as an equivalent circuit. That is, when the testing element 12 is pressed on the integrated circuit board 110 by the pressing means 16, the circuit formed by the integrated circuit on the integrated circuit board 110 and the elements in the testing element 12 has a stray capacitance and loss. Including the occurrence, the circuit formed when the MEMS element 120 is mounted on the integrated circuit substrate 110 is the same as an equivalent circuit.

  For example, the case where the test element 12 includes a two-terminal circuit that is electrically equivalent to the MEMS element 120 is applicable. Here, “electrically equivalent” means that when the MEMS element 120 is mounted on the integrated circuit board 110 and the test element 12 is not supported, the electrode pads 111A and 111B of the integrated circuit and the test connection portion 12A, It is said that it has an electrically equivalent characteristic when it contacts 12B. In other words, when the inspection element 12 and the MEMS element 120 are the same in terms of structure, dimensions, and material, they have ideal equivalent characteristics.

  More specifically, as schematically shown in FIG. 1, a stage 11 on which an integrated circuit board 110 is placed, an inspection element 12 including inspection connection portions 12A and 12B, and an integrated element among the inspection elements 12 are integrated. A support member 13 as a support means provided on the side not facing the circuit board 110, an elastic member 14 as an elastic means for pressing the test connection portions 12A and 12B against the electrode pads 111A and 111B of the integrated circuit board 110, and an elastic member And a movable support portion 15 that movably supports the member 14.

  Here, the pressing means 16 is configured by a combination of the support member 13 and the elastic member 14. The inspection element 12 only needs to have the same configuration and size as the MEMS element 120. The MEMS element 120 includes a coil element as an electrical conduction path and test connection portions 12A and 12B attached to both sides of the coil element, and an insulator around the electrical conduction path has substantially the same dielectric constant as that of the MEMS element 120. In the case of having the magnetic permeability, the size of the insulator in the test element 12 may be in a range in which the external electrical and magnetic influence on the electrical conduction path can be ignored. The shape and size of the insulator need not be the same as the shape and size of the insulator in the MEMS element 120.

  Hereinafter, each component will be described in detail.

  The stage 11 is preferably one that can be mounted so that the integrated circuit board 110 does not move. For example, the stage 11 has a depression as shown in the figure, and the lower part of the integrated circuit board 110 is accommodated in the depression. Is preferred. The stage 11 is preferably movable so that the stage 11 itself can be slid in parallel to a horizontal plane or moved up and down while the integrated circuit board 110 is placed thereon.

  The inspection element 12 has a two-terminal circuit that is electrically equivalent to the MEMS element 120 to be mounted after inspecting the integrated circuit board 110, and the inspection connection portions 12A and 12B are rigid. In other words, it is hard to bend and is solid. As described above, the inspection connecting portions 12A and 12B have rigidity. Rigidity means, for example, that it does not deform for a force of several μN.

  The pressing means 16 has elasticity by being composed of the support member 13 and the elastic member 14. The support member 13 is provided on the surface side of the inspection element 12, that is, on the side opposite to the inspection connection portions 12A and 12B, and is made of an insulator such as an epoxy resin.

  The elastic member 14 is made of a spring material such as a leaf spring, for example. As schematically shown in FIG. 1, one end of the elastic member 14 is attached to the inspection element 12 with the support member 13 interposed, and the other end of the elastic member 14 is attached to the movable support portion 15 as a support portion. ing. The elastic member 14 may be made of an insulating material or a conductive material. This is because the elastic member 14 is attached to the inspection element 12 via a support member 13 made of an insulator.

  The movable support portion 15 as the support portion is not particularly limited as long as it can move at least the inspection element 12 in the direction of the stage 11 and the opposite side, and preferably movable in the two-dimensional direction and the three-dimensional direction.

  Next, a method for inspecting the integrated circuit board 110 by the integrated circuit board inspection apparatus 10 will be described. First, as step 1, the integrated circuit board 110 to be inspected is placed on the stage 11 and fixed.

  In step 2, the stage 11 is moved in the X and Y directions to move the inspection element 12 above the integrated circuit board 110, and the inspection connection portions 12A and 12B in the inspection element 12 are respectively connected to the electrode pads 111A in the integrated circuit board 110. , 111B.

  As Step 3, the movable support portion 15 is lowered to the stage 11 side in the −Z direction, and the inspection connection portions 12A and 12B of the inspection element 12 are brought into contact with the electrode pads 111A and 111B of the integrated circuit substrate 110, respectively. Further, the movable support portion 15 is lowered. Then, while the elastic member 14 is elastically deformed, the inspection connecting portions 12A and 12B are pressed against the electrode pads 111A and 111B on the integrated circuit board 110, respectively. At that time, the inspection connection portions 12A and 12B of the inspection element 12 break through the oxide film on the surface of the electrode pads 111A and 111B by the restoring force of the elastic member 14, and the inspection element 12 is electrically connected to the electrode pads 111A and 111B. Connecting. In this state, a circuit network equivalent to the circuit network formed in a state where the MEMS element 120 is mounted on the integrated circuit substrate 110 is formed without deforming the inspection connection portions 12A and 12B.

  Further, in order to ensure the reliability of the electrical connection between the test element 12 and the integrated circuit board 110, as step 4, the test connection portions 12A and 12B in the test element 12 bite into the electrode pads 111A and 111B. In this state, the movable support 15 is moved in a direction parallel to the XY plane, for example, in the X direction. Then, the inspection element 12 moves in the X direction. As a result, the inspection connecting portions 12A and 12B of the inspection element 12 slide along the surfaces of the electrode pads 111A and 111B. As a result, streaks are formed in the surface oxide films of the electrode pads 111A and 111B, and the electrical connection between the testing element 12 and the integrated circuit substrate 110 is ensured. Step 4 may be performed in accordance with the state of the surface oxide film of the electrode pads 111A and 111B and the probability of electrical disconnection in Step 3.

  In the first embodiment, since the testing element 12 is electrically equivalent to, for example, the same configuration and size as the MEMS element 120 mounted on the integrated circuit board 110, the stray capacitance of the testing element 12 with respect to the integrated circuit board 110. Since C, the induction loss Loss, and the eddy current loss Loss are the same as when the MEMS element 120 is mounted, the integrated circuit board 110 can be inspected in the same state as when the MEMS element 120 is mounted. .

  In particular, when the MEMS element 120 and the integrated circuit substrate 110 form a high-frequency circuit such as an oscillation circuit, the testing element 12 is supported by the elastic member 14 with a support member 13 made of an insulator interposed. Since the high frequency circuit is supported, the influence from the elastic member 14 and the support member 13 can be ignored. That is, the high frequency characteristics, particularly the resonance frequency, is not different from the design value.

  In particular, since the inspection connection portions 12A and 12B in the inspection element 12 are rigid and difficult to deform, even if the inspection connection portions 12A and 12B receive a restoring force by the elastic member 14, the inspection connection portions 12A and 12B The shape does not change. That is, since the shape of the current path between the testing element 12 and the integrated circuit board 110 does not change, the test of the integrated circuit board 110 can be performed in a state similar to a state in which the integrated circuit board 110 is manufactured monolithically.

  For these reasons, the circuit element of the inspection element 12, for example, a circuit composed of a passive element such as a coil and an integrated circuit in the integrated circuit substrate 110 is a high frequency circuit in the GHz band that exceeds, for example, about 1 GHz. Even in this case, the integrated circuit board 110 can be accurately inspected.

  The integrated circuit board inspection apparatus 10 shown in FIG. 1 is formed by the inspection element 12 and the integrated circuit on the integrated circuit board 110 in a state where the pressing means 16 presses the inspection element 12 against the electrode pads 111A and 111B. The inspection element 12 is configured so that the circuit to be the same as the circuit formed by the integrated circuit and the MEMS element when the MEMS element 120 is mounted on the integrated circuit substrate 110 is equivalent to the circuit formed by the integrated circuit board 110. The connecting portions 12A and 12B have rigidity, and the pressing means 16 has elasticity. For example, the inspection element 12 includes a two-terminal circuit that is electrically equivalent to the MEMS element 120 to be actually mounted on the integrated circuit board 110 after the inspection. Therefore, it is possible to create a state in which the MEMS element 120 is mounted on the integrated circuit board 110 and the electrode portions of the MEMS element 120 are connected to the electrode pads 111A and 111B of the integrated circuit board 110.

  This point will be described in detail. FIG. 2 shows the relationship between the test element 12, the MEMS element 120, and the integrated circuit board 110 shown in FIG. 1. FIG. 2A shows a case where the MEMS element 120 is mounted on the integrated circuit board 110. ) Is a schematic diagram showing a case where the testing element 12 is connected to the integrated circuit board 110. An integrated circuit board 110 shown in FIGS. 2A to 2C corresponds to the integrated circuit board 110 in FIG. 1, and an electrode pad 111 </ b> A connected to the MEMS element 120 is provided on the surface side of the integrated circuit board 110. 111B, wiring and LSI elements (hereinafter referred to as “wiring / element 111C”) are arranged. The outermost surface layer 113 of the integrated circuit substrate 110 is an insulating layer.

  As shown in FIG. 2A, when the MEMS element 120 is mounted on the integrated circuit substrate 110, stray capacitance C, induction loss L1, and eddy current loss L2 are generated between the MEMS element 120 and the circuit element. Therefore, the integrated circuit in the integrated circuit substrate 110 and the circuit element in the MEMS element 120 are designed in consideration of the stray capacitance C, the induction loss L1, and the eddy current loss L2, and have desired high frequency characteristics.

  When the inspection element 12 has the same configuration and dimensions as the MEMS element 120 as shown in FIG. 2B and the inspection element 12 is connected to the integrated circuit substrate 110, the inspection element As in the case shown in FIG. 2A, stray capacitance C, induction loss L1, and eddy current loss L2 occur between 12 and the integrated circuit substrate 110. Therefore, the integrated circuit board 110 can be inspected under the same situation as when the MEMS element 120 is mounted.

  Unlike the case shown in FIG. 2 (B), as shown in FIG. 2 (C), even if the testing element 17 has the same circuit as the MEMS element 120, the dimensions are different and it is large as shown. When the inspection element 17 is connected to the integrated circuit board 110, a stray capacitance C ′ and an induction loss L1 ′ different from those shown in FIG. 2A are provided between the inspection element 17 and the integrated circuit board 110. And eddy current loss L2 ′ occurs. That is, the integrated circuit board 110 cannot be inspected under the same situation as when the MEMS element 120 is mounted.

  Here, as shown in FIG. 2B, a support member 13, which is an insulator, is elongated on the opposite side of the integrated circuit board 110 of the test elements 12 and 17 and extends in the vertical direction. One end is connected to the movable support 15 by a spring member as the elastic member 14. Since the support member 13 is elongated, the current flowing through the inspection element 12 is not changed by the elastic member 14 and the support member 13.

  As described above, according to the first embodiment of the present invention, the testing element 12 includes a configuration that is electrically and structurally equivalent to the MEMS element 120 to be actually mounted on the integrated circuit board 110 after the testing. Therefore, the MEMS element 120 can be mounted on the integrated circuit board 110 and the electrode portion of the MEMS element 120 can be connected to the electrode pads 111A and 111B of the integrated circuit board 110.

  In addition, since the rigid inspection connection portions 12A and 12B protrude from the inspection element 12 on the side of the integrated circuit board 110, the inspection element 12 is pressed against the integrated circuit board 110, and the inspection connection portions 12A and 12B are connected. Even when pressed against the electrode pads 111A and 111B on the integrated circuit substrate 110, the inspection connecting portions 12A and 12B do not buckle or bend. That is, a circuit network formed by connecting circuit elements in the inspection element 12 and circuit elements in the integrated circuit board 110 by a wiring pattern by pressing the inspection element 12 against the integrated circuit board 110, and a MEMS element A circuit network formed by mounting 120 on the integrated circuit board 110 is the same as an equivalent circuit.

  In addition, the integrated circuit board 110 includes an amplifying element and a capacitor as the circuit element 112 as shown in FIG. 1, and the MEMS element 120 includes a coil, and the integrated circuit board 110 and the MEMS element 120 form an oscillation circuit or the like. Assuming the case where a high-frequency circuit is configured, since the testing element 12 includes a two-terminal circuit including a coil like the MEMS element 120, the testing element 12 is formed by pressing against the integrated circuit substrate 110. The circuit is the same as a high-frequency circuit formed by mounting the MEMS element 120 on the integrated circuit substrate 110. That is, since the inspection connecting portions 12A and 12B are not deformed, the design value and the inspection value can be compared without being influenced by the frequency characteristics.

(Second Embodiment)
FIG. 3 schematically shows an integrated circuit board inspection apparatus 20 according to the second embodiment of the present invention. The second embodiment shown in FIG. 3 is different from the first embodiment shown in FIG. 1 in that the tips of the test connection portions 12A and 12B in the test element 12 are not sharp. The electrode pads 111A and 111B of the integrated circuit substrate 110 are laminated with different types of metal layers, and the outermost surface layer 111D of the metal layers is made of a metal that is difficult to oxidize, such as Au. In this case, even if the inspection connection portions 12A and 12B do not bite into the electrode pads 111A and 111B in the integrated circuit substrate 110, the inspection connection portions 12A and 12B are merely brought into contact with the outermost surface layer 111D of the electrode pads 111A and 111B. This is because they can be electrically connected.

  According to the second embodiment of the present invention, the integrated circuit board 110 can be correctly inspected as in the first embodiment shown in FIG. In addition, unlike the first embodiment, the inspection connection portions 12A and 12B of the inspection element 12 need only be brought into contact with the electrode pads 111A and 111B of the integrated circuit substrate 110, and the outermost surface layer 111D of the electrode pads 111A and 111B. Therefore, it is not necessary to sharpen the tips of the inspection connection portions 12A and 12B like, for example, a pyramid or a cone, and the inspection element 12 is integrated circuit board. There is also no need to move along the surface of 110. Therefore, the structure of the testing element 12 can be simplified, and the time required for testing the integrated circuit board 110 can be shortened because it is not necessary to rub the electrode pads 111A and 111B with a probe. The integrated circuit board inspection apparatus 20 according to the second embodiment includes an integrated circuit board on which the MEMS element 120 is mounted such that the electrode portion of the MEMS element 120 does not protrude from the surface of the MEMS element 120 facing the integrated circuit board 110. This is particularly effective when 110 is an inspection target.

(Third embodiment)
FIG. 4 is a diagram schematically showing an inspection method by the integrated circuit board inspection apparatus 10 shown in FIG. As shown in FIG. 4, the integrated circuit board 110 is different from the case shown in FIG. 1 in that a depression 111E is provided on the surface of the electrode pads 111A and 111B. The recesses 111E of the electrode pads 111A and 111B are formed by etching or the like so that the tips of the inspection connection portions 12A and 12B of the inspection element 12 in the integrated circuit board inspection apparatus 10 bite. Since the recesses 111E are provided in the electrode pads 111A and 111B, when the distance between the inspection element 12 and the integrated circuit substrate 110 is reduced, the inspection connection portions 12A and 12B themselves enter the recesses 111E of the electrode pads 111A and 111B. . This self-alignment facilitates the alignment between the inspection connecting portions 12A and 12B and the electrode pads 111A and 111B. Furthermore, since the contact area between the inspection connecting portions 12A and 12B and the electrode pads 111A and 111B is increased, the contact resistance can be reduced. Further, by making the shape and size of the tip end portions of the inspection connecting portions 12A and 12B the same as the shape and size of the recess 111E, when the MEMS element 120 is mounted on the integrated circuit substrate 110, and the inspection element The exact same situation can be reproduced when 12 is in contact with the integrated circuit.

(Fourth embodiment)
FIG. 5 schematically shows an integrated circuit board inspection apparatus 30 according to the fourth embodiment. The integrated circuit board 110 to be inspected by the integrated circuit board inspection apparatus 30 is provided with an electrode pad 111F that becomes a GND wiring in the integrated circuit. The test element 33 shown in FIG. 5 is different from the case shown in FIG. 1 in that the test element 33 is composed of a test element main body 32 and a package 34 that form an integrated circuit and a circuit network in the integrated circuit board 110. This is because the MEMS element mounted on the integrated circuit board 110 to be inspected is composed of a MEM element body and a package, so that the inspection element 33 has the same structure and dimensions corresponding to this configuration. I have to. That is, the inspection element 33 has a package 34 having the same structure as the MEMS element package, and one end of the pressing means 16, specifically, the elastic member 14 is attached to the package 34 in the inspection element 33. The element main body 32 is supported by the elastic member 14 with the package 34 interposed therebetween. The package 34 includes an upper portion 34B to which the inspection element main body 32 is attached by a support portion 34A, and an annular side wall portion 34C that covers the inspection element main body 32 while being spaced apart. That is, the package 34 is provided with a recessed portion 34D between the upper portion 34B and the side wall portion 34C, and the GND connection terminal 34E is provided so as to protrude from the side wall portion 34C. The GND connection terminal 34E is connected to an electrical conduction portion (not shown) in the package 34. In either case of the inspection element 33 or the MEMS element, the package 34 may itself be made of a conductive material such as silicon, or a metal is deposited on an insulator such as plastic. May be configured. The shape of the electrical conduction portion of the package 34 may be disposed so as to surround the entire MEMS element main body portion 32, or may be disposed so as to cover a part thereof. In other words, the test element 33 including the package 34 may be configured to have the same equivalent circuit as when the MEMS element including the package is mounted on the integrated circuit board 110 when connected to the integrated circuit board 110. The GND connection terminal 34E has a pointed shape and protrudes from the surface facing the integrated circuit substrate 110 to the same height as the tips of the inspection connection portions 32A and 32B in the inspection element 33. A support member 13 is disposed on the upper portion 34B of the package 34, and the support member 13 is attached to the elastic member 14. The upper part 34B of the package 34 protrudes toward the recessed part 34D opposite to the support member 13, and is provided with a support part 34A. The inspection element main body part 32 is attached to the support part 34A.

  According to the integrated circuit board inspection apparatus 30, the inspection connection portions 32A and 32B of the inspection element main body 32 are connected to the electrode pads 111A and 111B of the integrated circuit board 110, and the package 33 is the inspection element main body. 32, the state where the GND connection terminal 34E is connected to the electrode pad 111F of the integrated circuit board 110 is the same as the state in which the MEMS element is mounted on the integrated circuit board 110 after the inspection. The substrate 110 can be inspected.

(Fifth embodiment)
FIG. 6 schematically shows an integrated circuit board inspection apparatus 40 according to the fifth embodiment. As shown in FIG. 6, the integrated circuit board inspection apparatus 40 is different from the other embodiments in that a support member 43 is integrally formed on the upper layer portion of the inspection element 42. That is, the inspection element 42 includes an insulating support member 43 and an inspection element body 44. As shown in FIG. 7, the integrated circuit board 110 to be inspected by the integrated circuit board inspection apparatus 40 is provided with an insulator 131 having the same properties as the support member 43 on the surface side of the MEMS element 130. It is configured. According to the integrated circuit board inspection apparatus 40 according to the fifth embodiment, since the inspection element 42 is integrally configured by incorporating the support member 43 in advance, the number of components is reduced, and the integrated circuit board inspection apparatus is provided. Forty assembly operations are facilitated.

(Sixth embodiment)
Next, a sixth embodiment based on the first embodiment will be described, but the same applies to the second to fifth embodiments. FIG. 8 is a diagram schematically showing an integrated circuit board inspection apparatus 50 according to the sixth embodiment. The integrated circuit board inspection apparatus 50 is attached to the first elastic member 54 as the first elastic means attached to the movable support portion 55 as the support portion, and to the tip of the first elastic member 54. A first support member 53 as a first support means, an inspection element 52 provided on the first support member 53, a stage 51 on which the integrated circuit board 110 is placed and fixed, and a movable support A second elastic member 58 as a second elastic means attached to the portion 55, a second support member 57 as a second support means attached to the tip of the second elastic member 58, and a second The plurality of probes 56 attached to the support member 57 so as to protrude toward the stage 51, and the driving power is supplied to the integrated circuit board 110 via the plurality of probes 56 to output from the integrated circuit board 110. It has a testing circuit 59 for measuring the signal.

  The integrated circuit board inspection apparatus 50 has the same movable support portion 55 as the inspection element 52 held by the first support member 53 with the first elastic member 54 interposed between the movable support portion 55 and the movable support portion 55. And a plurality of probes 56 held by the second support member 57 with the second elastic member 58 interposed therebetween. The second support member 57 may be called probe support means. That is, the means for supporting the inspection element 52, that is, the pressing means, and the probe support means for supporting the plurality of probes 56 are separately arranged.

  The first elastic member 54 and the second elastic member 58 are both cantilevered, and are specifically formed on the movable support portion 55 in a cantilever shape. In the form shown in FIG. 8, each of the first elastic member 54 and the second elastic member 58 has a bar shape or an elongated flat plate shape, and is provided extending along the surface of the stage 51. End portions of the first elastic member 54 and the second elastic member 58 are fixed to the movable support portion 55. A first support member 53 is attached to the distal end portion of the first elastic member 54, and a second support member 57 is attached to the distal end portion of the second elastic member 58. Each of the first support member 53 and the second support member 57 has a bar shape, a triangular plate shape, a rectangular plate shape, a polygonal plate shape, and the like, and is movable along the surface of the stage 51. The portion 55 is provided so as to extend in the opposite direction. As shown in FIG. 8, the first elastic member 54 and the first support member 53 are arranged on the stage 51 side as compared with the second elastic member 58 and the second support member 57. The second elastic member 58 and the second support member 57 may be arranged on the stage 51 side as compared with the first elastic member 54 and the first support member 53, or substantially the same height as the stage 51. It may be arranged. The first elastic member 54 and the first support member 53 may be arranged so as to overlap the second elastic member 58 and the second support member 57 in a plan view, and conversely, the second elastic member 58 and the second support member 57 in a plan view. The elastic member 58 and the second support member 57 may be arranged so as not to overlap.

  The inspection element 52 is a circuit formed by the inspection element 52 and the integrated circuit in the integrated circuit substrate 110 while being pressed by the electrode pads 111A and 111B, and the MEMS element 120 is mounted on the integrated circuit substrate 110. The circuit is sometimes configured to be the same as the circuit formed by the integrated circuit and the MEMS element 120 as an equivalent circuit. For example, it has the same structure and the same dimensions as the MEMS element 120 electrically connected to the electrode pads 111A and 111B in the integrated circuit substrate 110 to be inspected, and the passive element and the inspection connection parts 52A and 52B have the same structure. It has a two-terminal circuit. The first support member 53 is made of an insulating material. This is because when the test element 52 is electrically connected to the electrode pads 111A and 111B of the integrated circuit board 110 to form an integrated circuit network, the signal flowing through the integrated circuit network is not affected.

  On the other hand, the second support member 57 is not necessarily made of an insulating material. A plurality of probe mounting holes are formed in the second support member 57, provided that the probes 56 are protruded downward in the respective probe mounting holes, and the side surfaces of the probes 56 and the probe mounting holes are insulated. Good. Unlike the inspection connection portions 52A and 52B in the inspection element 52, each probe 56 does not have to be rigid and may partially have a spring shape. That is, if each of the plurality of probes 56 attached to the second support member 57 has a spring structure in part or in whole, the second support member 57 does not include an elastic member, and the movable support portion 55. May be provided directly. The probe 56 is composed of, for example, first to third probes 56A, 56B, and 56C.

  When the circuit network is configured by the MEMS element 120 and the integrated circuit of the integrated circuit board 110, the inspection circuit 59 is output from the power supply unit 59A that supplies electrical energy to the circuit network and the circuit network. And a measurement unit 59B for measuring a signal. The first probe 56A and the power supply unit 59A are electrically connected by a wiring 59C, and the second probe 56B and the power supply unit 59A are electrically connected by a wiring 59D, and the third probe 56C is connected to the third probe 56C. The measurement unit 59B is electrically connected by a wiring 59E.

  As in the other embodiments described above, the integrated circuit board 110 forms a circuit network by connecting to the MEMS element 120 to constitute a functional device. On the surface of the integrated circuit substrate 110, the first and second electrode pads 111A and 111B connected to the MEMS element 120, and the first and the second for supplying electric energy for driving to the circuit network. Two drive electrode pads 111G and 111H and an inspection electrode pad 111I for taking out a signal output from the functional device are provided. The first and second drive electrode pads 111G and 111H are in contact with the first and second probes 56A and 56B, and the inspection electrode pad 111I is in contact with the third probe 56C.

  Here, if the distance between the movable support portion 55 and the stage 51 is reduced by moving the movable support portion 55 or raising the stage, the inspection element 52 supported by the first support member 53 is reduced. The inspection connecting portions 52A and 52B are brought into contact with the electrode pads 111A and 111B of the integrated circuit board 110 with an appropriate pressing force by the first elastic member 54, and at the same time, the probes 56A, 56B and 56C are in contact with the second elastic member 58. Thus, the electrode pads 111G, 111H, and 111I of the integrated circuit substrate 110 are brought into contact with each other with an appropriate pressing force.

  Also in the integrated circuit board inspection apparatus 50, the inspection element 52 is held by the insulating first support member 53, and the first support member 53 is attached to the movable support portion 55 by the first elastic member 54. ing. At this time, since the first support member 53 is insulative and the inspection element 52 is separated from the first elastic member 54 by a predetermined distance d1, the inspection element 52 is present in the presence of the first elastic member 54. Not affected. Further, since the inspection element 52 is separated from the probe 56A near the inspection element 52 by a predetermined distance d1 ', the inspection element 52 is not affected by the presence of the probe 56A. In addition, when the second support member 57 is an electric conductor, the second support member 57 is from the upper end of the passive element (indicated by a dotted line in FIG. 8) in the inspection element 52. The inspection element 52 is not affected by the second support member 57 because the inspection element 52 exists by a predetermined distance d2. As described above, in a state where the MEMS element 120 is mounted on the integrated circuit board 110, the circuit network formed by the integrated circuit of the integrated circuit board 110 and the MEMS element 120, and the state in which the testing element 52 is pressed against the integrated circuit board 110. The circuit network formed by the integrated circuit of the integrated circuit substrate 110 and the test element 52 is the same as an equivalent circuit.

  The inspection element 52 is provided so as to be separated from a member (hereinafter referred to as a “loss member”) that generates a loss around the inspection element 52, for example, the first elastic member 54 and the second support member 57. Whether it should be determined depends on the type and shape of the element provided in the inspection element 52. Since the element has the same structure and dimensions as a MEMS element to be mounted later on the integrated circuit substrate 110, the result is determined by the type and shape of the MEMS element. Therefore, a case where the MEMS element is a coil will be described.

  FIG. 9 illustrates how distances d1 and d2 between the inspection element 52, the first elastic member 54, and the second support member 57 should be determined when the MEMS element is a square coil. (A) is a diagram showing a model setting state, (B) is a diagram showing a change in magnetic field strength with respect to a distance in the Z-axis direction, and (C) is a diagram with respect to a distance from one side of the coil on the XY plane. It is a figure which shows the change of a magnetic field intensity.

  As shown in FIG. 9A, the inspection element 52 is a square coil. The coordinate axis is set so that the center of the coil is the origin O, the axial direction of the coil is the Z axis, and each side of the coil is parallel to the X axis and the Y axis. Here, the square coil may be a single turn or a plurality of turns. Under such settings, a graph showing the magnetic field strength in the Z-axis direction is FIG. 9B, and a graph showing the magnetic field strength according to the distance from one side of the coil in the XY plane is FIG. 9C. It is. 9B and 9C, the horizontal axis represents the ratio of one side of the coil to the distance, that is, (distance from one side of the coil) / (length of one side of the coil), and the vertical axis represents the origin O. The magnetic field strength at each point normalized by the magnetic field strength at is shown. 9B and 9C are calculated from Bio-Savart's law.

  As can be seen from FIG. 9B, the magnetic field strength sharply decreases with increasing distance from the coil center in the Z-axis direction. The magnetic field strength at a position away from the coil center in the axial direction (± Z-axis direction) by about 1.8 times the length of one side of the coil is 1/10 of the magnetic field strength at the coil center.

  As can be seen from FIG. 9C, the magnetic field strength is abrupt at a position away from the coil on the surface where the coil is installed and having the axis in the normal direction (hereinafter referred to as “coil installation surface”). To decrease. The magnetic field strength at a position where the distance from one side of the coil is about 0.8 times the length of one side of the coil on the coil installation surface is 1/10 of the magnetic field strength at the center of the coil.

  Therefore, in consideration of the accuracy of the detecting element 52, that is, the element included in the integrated circuit board inspection apparatus including the coil, the loss member is separated by about 1.8 times or more of the length of one side of the coil in the axial direction of the coil. Or the loss member is formed by the detection element 52 and the integrated circuit board 110 if the loss member is spaced outward from the coil side by about 0.8 times the length of the coil side on the coil installation surface. The influence of the loss member on the generated network can be ignored.

  Here is another example. When the MEMS element is a circular coil, the following results can be obtained by calculating in the same manner as described with reference to FIG. As in the case shown in FIG. 9A, the coordinate system of the circular coil is set so that the axis of the circular coil is the Z axis and the center of the circular coil is the origin. As the distance from the center of the coil increases in the Z-axis direction, the magnetic field strength decreases rapidly. The magnetic field strength at a position away from the coil center in the axial direction (± Z-axis direction) by about 1 times the coil diameter is 1/10 of the magnetic field strength at the coil center. On the surface where the coil is installed and which has the axis in the normal direction (hereinafter referred to as “coil installation surface”), the magnetic field strength sharply decreases at a position away from the coil. The magnetic field strength at a position where the distance from the outer periphery of the coil is about 0.5 times the coil diameter on the coil installation surface is 1/10 of the magnetic field strength at the coil center.

  Therefore, in consideration of the accuracy of various elements of the detection element 52, that is, the integrated circuit board inspection apparatus including the coil, if the loss member is separated by about 1 time or more of the coil diameter in the axial direction of the coil, or If the loss member is separated from the outer periphery of the coil by about 0.5 times or more of the coil diameter on the coil installation surface, the loss member is transferred to the circuit network formed by the detection element 52 and the integrated circuit board 110. The influence can be ignored.

  From the above, in the integrated circuit board inspection apparatus 50, when the inspection element 52 has a circular coil with the X axis as an axis, the distance L1 from the first elastic member 54 serving as a loss member. The distance L2 from the second support member 57 serving as a loss member may be 0.5 times or more of the coil diameter in the Z-axis direction distance. When the inspection element 52 has a square coil with the X axis as the axis, the distance L1 from the first elastic member 54 as the loss member is 1.8 times or more the coil diameter in the X axis direction distance. The distance L2 from the second support member 57 serving as the loss member may be 0.8 times or more the coil diameter in the Z-axis direction distance.

  When the axial direction of the coil included in the inspection element 52 is not the X-axis direction but the Z-axis direction as shown by a dotted line in FIG. 8, it can be obtained as follows. That is, in the integrated circuit board inspection apparatus 50, when the inspection element 52 has a circular coil with the Z axis as the axis, the second electrically conductive second member that becomes a loss member from the upper end of the circular coil. The distance L2 between the support member 57 and the first elastic member 54 serving as a loss member may be one or more times the coil diameter in the Z-axis direction. It may be more than double. On the other hand, when the inspection element 52 has a square coil with the Z axis as an axis, the distance L2 between the upper end of the circular coil and the electrically conductive second support member 57 that becomes a loss member is Z. The axial distance may be 1.8 times or more of the coil diameter, and the distance L1 from the first elastic member 54 serving as the loss member may be 0.8 times or more of the coil diameter in the X-axis direction.

  In the above description, since the inspection element 52 is a coil element, the first elastic means 14 is provided in a region that attenuates to 1/10 or less of the maximum intensity of the magnetic field generated in the coil element. Even when the inspection element includes an electric element other than the coil, the inspection element 52 is a member that causes a loss around the inspection element 52, for example, the first elastic member 54 and the second support member 57. You can determine how far away you should be.

  In addition, the integrated circuit board inspection device 40 may, for example, raise the stage 51 or lower the movable support part 55 toward the stage 51 to connect the inspection connection parts 52A and 52B and the electrode pads of the integrated circuit board 110. Even if the distances from 111A, 111B, 111G, 111H, and 111I are relatively moved so as to be less than or equal to zero, the first elastic member 54 is bent, and the test element 52 is integrated with the first support member 53. Pressed against the substrate 110. At this time, since the inspection connection portions 52A and 52B of the inspection element 52 have a rigid structure, even if the inspection connection portions 52A and 52B are pressed against the electrode pads 111A and 111B of the integrated circuit substrate 110, Since the connecting portions 52A and 52B are not bent and are not bent and kept rigid, an integrated circuit network is formed by the test element 52 and the integrated circuit substrate 110, and the MEMS element 120 is formed on the integrated circuit substrate 110. The inspection can be performed in the same state as in the mounted state, that is, the state in which the MEMS element 120 is integrated on the integrated circuit substrate 110. In this case, unlike the first to fifth embodiments, the first to third probes 56A and 56B are provided with the second elastic member 58 and the second support member 57 interposed in the same movable support portion 55. , 56C are provided, the first probe 56A and the second probe 56B are electrically connected to the electrode pads 111G, 111H, and the third probe 56C is electrically connected to the electrode pad 111I.

  Note that the first and second probes 56A and 56B do not necessarily have a rigid structure, unlike the inspection connection portions 52A and 52B. This is because the current flowing through the first and second probes 56A and 56B is not high frequency. In that respect, since the high-frequency signal from the high-frequency circuit composed of the passive element in the inspection element 52 and the integrated circuit in the integrated circuit substrate 110 flows through the third probe 56C, it is rigid for the accuracy of measurement and inspection. A structure is preferable, but a structure that can be ignored with little influence on the high-frequency circuit is sufficient.

  An inspection method for the integrated circuit board 110 by the integrated circuit board inspection apparatus 50 according to the sixth embodiment will be described.

  As step 1, first, the integrated circuit board 110 to be inspected is placed on the stage 51 and fixed.

  In step 2, the movable support portion 55 is driven in the X and Y directions, the inspection element 52 and the first to third probes 56A, 56B, and 56C are moved above the integrated circuit board 110, and the inspection element 52 is inspected. The connecting portions 52A and 52B and the first to third probes 56A, 56B, and 56C are aligned on the electrode pads 111A, 111B, 111G, 111H, and 111I of the integrated circuit substrate 110, respectively.

  As Step 3, the inspection connection portions 52A and 52B and the first to third probes 56A, 56B and 56C of the inspection element 52 are integrated by moving the movable support portion 55 down or raising the stage 51, respectively. The test connection portions 52A and 52B of the test element 52 are brought into contact with the electrode pads 111A, 111B, 111G, 111H, and 111I of the circuit board 110, and the first elastic member 54 and the second elastic member 58 are elastically deformed. The first to third probes 56A, 56B, and 56C are pressed against the electrode pads 111A, 111B, 111G, 111H, and 111I, respectively. Then, the inspection connection portions 52A and 52B of the inspection element 52 and the first to third probes 56A, 56B, and 56C are electrode pads based on the restoring forces of the first elastic member 54 and the second elastic member 58, respectively. The surface oxide films of 111A, 111B, 111G, 111H, and 111I are pierced and electrically contacted with the electrode pads 111A, 111B, 111G, 111H, and 111I.

  As Step 4, the movable support part 55 or the stage 51 is moved horizontally as necessary. Then, the inspection connection portions 52A and 52B of the inspection element 52 and the first to third probes 56A, 56B, and 56C slide along the surfaces of the electrode pads 111A, 111B, 111G, 111H, and 111I. The contact with the electrode pads 111A, 111B, 111G, 111H, and 111I is ensured and electrically connected. That is, the contact resistance between the testing element 52 and the electrode pads 111A and 111B is reduced, and the testing element 52 and the integrated circuit in the integrated circuit substrate 110 are connected to form a high-frequency circuit.

  In step 5, the high-frequency circuit is driven by applying a voltage or passing a current between the first and second probes 56A and 56B by the inspection circuit, and the output signal of the high-frequency circuit is taken out from the third probe 56C. This is input to the inspection circuit 59. Thereby, the integrated circuit in the integrated circuit board 110 can be inspected.

(Seventh embodiment)
10A and 10B show an integrated circuit board inspection apparatus 70 according to a seventh embodiment of the present invention, in which FIG. 10A is a schematic cross-sectional view and FIG. 10B is a bottom view. The integrated circuit board inspection apparatus 70 according to the seventh embodiment targets an integrated circuit board on which a plurality of identical integrated circuits are arranged in a plane. Therefore, the integrated circuit board inspection device 70 is arranged corresponding to each integrated circuit configured on the integrated circuit board, and as shown in FIG. 10, the inspection elements 72 are arranged in a single row in a plurality of rows. Has been placed. A means 76A for supporting a plurality of probes 76 is disposed between the test elements 72.

  11A and 11B show one unit relating to the integrated circuit board inspection apparatus according to the seventh embodiment shown in FIG. 9, wherein FIG. 11A is a bottom view and FIG. 11B is a cross-sectional view taken along the line DD. 12A is a cross-sectional view taken along line AA, FIG. 12B is a cross-sectional view taken along line BB, and FIG. 12C is a cross-sectional view taken along line CC. The integrated circuit board inspection device 70 has a flat plate shape with a predetermined interval and a depression 75a formed on the lower surface, and a plurality of first pressing means 73, each of which has a first shape. A plurality of inspection elements 72 attached to the lower surface at the front end of the pressing means 73 and a plurality of second pressing means 77 are provided so as to protrude downward at the front end of the second pressing means 77. Each of the first pressing means 73 is attached to one end portion of the outer peripheral portion of the recess 75a on the lower surface 75b of the support portion 75 and is cantilevered. Similarly, each second pressing means 77 is attached to the other end portion of the outer peripheral portion of the recess 75a on the lower surface 75c of the support portion 75, and is a cantilever type. Here, the first pressing means 73 is disposed within a predetermined range with respect to the circuit element in the inspection element 72, for example, the distance from the upper end of the coil element. That is, since an insulator exists between the first pressing means 73 and the circuit element in the inspection element 72, the first pressing means 73 gives the circuit element by adjusting the height of the insulator. The influence can be ignored. In the illustrated example, the presence of the adhesive layer 77b for attaching the inspection element 72 to the first pressing means 73 reduces or eliminates the influence of the first pressing means 73 on the circuit elements. Details will be described later.

  Here, by adjusting the ratio between the dimension of the first pressing means 73 and the dimension of the second pressing means 77, the inspection element 72 attached to the first pressing means 73, particularly the inspection of the tip thereof. The shape change of the connecting portions 72A and 72B can be suppressed. In FIG. 10A, inspection connection portions 72A and 72B are provided along the left-right direction of the page, that is, along the direction in which the first pressing means 73 and the second pressing means 77 extend. These are for schematically showing that the two inspection connection portions 72A and 72B are provided so as to protrude from the inspection element 72, as shown in FIG. 10B, FIG. 11, and FIG. It is preferable that the first pressing means 73 and the second pressing means 77 are provided so as to intersect, in particular, to be orthogonal to the extending direction. This is for avoiding that only one tip of the two inspection connection portions 72A and 72B comes into contact with the electrode pad on the integrated circuit substrate to be inspected. Details will be described later. The inspection procedure by the integrated circuit board inspection apparatus 70 according to the seventh embodiment is the same as that of the other embodiments described above.

  A method for manufacturing the integrated circuit board inspection apparatus 70 according to the seventh embodiment shown in FIG. 10 will be described. FIG. 13 to FIG. 16 are diagrams schematically showing a manufacturing process of the integrated circuit board inspection apparatus 70 according to the seventh embodiment schematically shown in FIG.

  In the first step, as shown in FIG. 13A, alkali anisotropic etching is performed on the surface of a semiconductor substrate 81 such as a silicon substrate having a crystal direction (100) using an alkali solution such as KOH. . Thereby, a pyramid type etch pit 81a is produced.

  In the second step, as shown in FIG. 13B, for example, a 20 nm Cr (chromium) layer, a 500 nm W (tungsten) layer, and an 80 nm Au (gold) layer are sequentially deposited and etched to form etch pits 81a. The metal layer 81b is provided on the surface of the etch pit 81a by patterning with chemicals or plasma so as to leave those metals in place. The patterning may use a lift-off process. W is known as a hard material having wear resistance, and other hard material such as Ni (nickel) may be used instead of W. Alternatively, the conductive diamond may be deposited directly by CVD (Chemical Vapor Deposition) as a material for the tip without depositing Cr or W, followed by patterning, and then the following fabrication may be performed. Au has a role as a mask for etching W with chemicals, and the metal layer 81b may be only a laminate of a Cr layer and a W layer if it is etched by a lift-off process or plasma. The thickness of W is desirably 500 nm or more in order to ensure strength.

  In the third step, as shown in FIG. 13C, a resist 82 such as an epoxy resin is applied to the semiconductor substrate 81, and the through wiring is connected to the etch pit 81a through the resist 82 and patterned with the metal layer 81b. And a contour 82a of a coil as a passive element is formed.

  In the fourth step, as shown in FIG. 13D, after depositing a metal such as Ta as a plating shield layer on the resist 82 including the contour 82a, the mold 82b is filled with copper plating and the surface is polished. repeat. Thereby, as shown in FIG. 13E, the passive element and the through wiring embedded substrate 84 are formed. That is, the passive element and through wiring embedded substrate 84 includes a semiconductor substrate 81, a resist 82 formed on the semiconductor substrate 81, and a passive element 83a such as a coil embedded in the resist 82 and the through wiring 83b. Become.

  In the fifth step, as shown in FIG. 14A, a through hole is formed by a mold in an insulating substrate 85a made of plastic or glass fiber, plating is performed, the through hole is filled with metal, and a through wiring is formed on the insulating substrate 85a. A metal wiring 85b is formed. A part of the through wiring 85b protrudes below the insulating substrate 85a. The front end portion 85c of the through wiring 85b is formed in a convex shape in a tapered shape by selective deposition using plating or FIB. Through this fourth step, the through-hole buried insulator 85 is obtained. Needless to say, the fifth step and the first to fourth steps may be performed independently.

  In the sixth step, as shown in FIGS. 14A and 14B, on the passive element and through wiring embedded substrate 84, the area where the passive element 83a is embedded and the area where the through wiring 83b is embedded. An adhesive is applied to each of the layers to form an adhesive layer 86a, and a through wiring embedded insulator 85 is attached. Through this step, the through wiring 85b and the through wiring 83b are electrically connected.

  In the seventh step, as shown in FIG. 14C, the insulating substrate 85a is polished and thinned to obtain an insulating substrate 85d having a predetermined thickness.

  In the eighth step, as shown in FIG. 15A, metal wiring 85e is formed on the surface of the insulating substrate 85d polished in the seventh step. The metal wiring 85e is configured by a laminated structure of an adhesion layer and an electrode layer. The adhesion layer is made of Cr, for example, and the electrode layer is made of Pt, for example. Here, in FIG. 15A, the two wirings do not overlap each other and are spaced apart from each other in the depth direction on the paper surface, and the two wirings are insulated from each other.

  In the ninth step, as shown in FIG. 15B, an insulating substrate 86 having a plurality of depressions 86a on the lower side and having metal wiring 86b penetrated in the thickness direction between the depressions 86a is prepared. The insulating substrate 86 is made of glass or ceramic. The insulating substrate 86 can be manufactured by inserting a metal rod into a ceramic material or a glass material, forming a recess to be a depression 86a with a mold, and firing it. A part of the metal wiring 86b protrudes below the insulating substrate 86, and the tip 86c of the metal wiring 86b has a convex shape by plating or selective deposition using FIB (Focused Ion Beam).

  In the tenth step, as shown in FIG. 15B, an adhesive is applied to one end and the other end of the outer periphery of the recess 86a so as not to touch the metal wiring 85e, thereby forming adhesive layers 87a and 87b. Thereafter, the insulating substrate 85d and the insulating substrate 86 prepared in the eighth step are bonded. For example, photosensitive polyimide may be used as the adhesive.

  In the eleventh step, the semiconductor substrate 81 is first removed by etching or the like to the state shown in FIG. 16A, and then Cr at the tips of the passive element 83a and the through wiring 83b is removed with a Cr etchant and W appears on the tip surface. Like that. Further, the region indicated by the arrow A in the resist 82 is cut with a laser cutter. Then, as shown in FIG. 16B, the portions other than the resist portion holding the inspection element 82 and the through wiring 83b serving as the probe are not fixed to the insulating substrate 85d serving as the pressing means by the adhesive, and thus come off.

  In the twelfth step, a region indicated by an arrow B in FIG. 16B in the resist 82 is cut with a laser cutter. Then, as shown in FIG. 16B, the flat insulating substrate 85d is cut to form a cantilever as the pressing means 73, and the cantilever as the first pressing means 73 is bonded to the base end portion of the cantilever. The distal end portion, which is fixed by the layer 77a and is opposite to the base end portion, is in a free state, and an inspection element is attached to the lower surface of the distal end portion by an adhesive layer 77b. Further, the cantilever as the second pressing means 77 has the base end portion of the cantilever fixed by the adhesive layer 77c, the tip portion opposite to the base end portion is in a free state, and the adhesive layer 77d is provided on the lower surface of the tip portion. A probe holding means 76A made of resist is attached.

  Through the above steps, the integrated circuit board inspection apparatus 70 according to the seventh embodiment shown in FIG. 10 is completed. The manufacturing method described above is an example, and may be changed as appropriate.

  Next, the inspection element 12 in the first embodiment will be described in detail. The same applies to other embodiments. FIGS. 17A and 17B are diagrams showing a specific first configuration of the inspection element 12, in which FIG. 17A is a perspective view seen from a lower oblique direction, and FIG. 17B is a bottom view.

  The inspection element 12 includes a base body 12C having a metal embedded portion, first and second inspection connection portions 12A and 12B provided on the metal embedded portion and protruding from the back side of the base body 12C, and the metal embedded portion. The coil is formed as a passive element 12D that is embedded and connected between the first inspection connection portion 12A and the second inspection connection portion 12B. As shown in FIG. 17, the first and second inspection connecting portions 12A and 12B are erected on the back surface of the base body 12C, and most of them are embedded, but the first and second connection portions are embedded. The inspection connecting portions 12A and 12B have their tip portions 12E protruding from the bottom surface of the base 12C.

  The distal end portions 12E of the first and second inspection connection portions 12A and 12B become smaller as the sectional dimension becomes the distal end, for example, are sharp. The tip portion 12E is formed in a quadrangular pyramid shape or other pyramid shape or conical shape as shown in the figure. The distal end portion 12E is made of a rigid conductive material such as tungsten, nickel, or dyanmond. Therefore, even if the front end portions 12E of the first and second inspection connection portions 12A and 12B are pressed in contact with the electrode pads 111A and 111B of the integrated circuit substrate 110, the surface oxidation of the electrode pads 111A and 111B does not occur. The film is pierced and the tip portions 12E of the first and second inspection connection portions 12A and 12B are electrically connected to the electrode pads 111A and 111B. Since the first and second inspection connection portions 12A and 12B have a rigid structure, the first and second inspection connection portions 12A and 12B are not affected by pressing and sliding on the electrode pads 111A and 111B. The tip portion 12E is not deformed. Therefore, the inspection element 12 can be used repeatedly.

  18A and 18B are diagrams showing a specific second configuration of the inspection element 12, in which FIG. 18A is a perspective view seen from a lower oblique direction, and FIG. 18B is a bottom view. The second configuration shown in FIG. 18 is different from FIG. 17 in the shape of the tip end portion 12F in the first and second inspection connection portions 12A and 12B in the inspection element 12. That is, the tip end portions 12F of the first and second inspection connection portions 12A and 12B have ridge lines along the base body 12C as shown in the figure, and each point of the ridge lines has the same height from the base body 12C. It is in.

  17 and 18, tip portions 12E and 12F of inspection connection portions 12A and 12B in the inspection element 12 deposit tungsten or the like on a base portion standing on a base 12C, and deposit the deposited layer on a FIB (focused ion beam). ) Or by performing anisotropic etching in advance on the substrate on which the coil is to be formed.

  When the inspection element 12 includes the inspection connection portions 12A and 12B shown in FIG. 18, that is, when the inspection element 12 includes a ridge line parallel to the integrated circuit substrate 110, the first inspection connection portion 12A and the first connection portion It is necessary to arrange the two ridge lines so as to be in contact with the electrode pads 111A and 111B without being in point contact with the second inspection connection portion 12B.

  FIG. 19 shows an integrated circuit board device 60 having an inspection connection section as shown in FIG. 18, wherein (A) is a plan view, (B) is a side view, and (C) and (D) are front views. . FIG. 19C shows a state where the first elastic member 64 is operating, and FIG. 19D shows a state where the first elastic member 64 is operating. In each drawing of FIG. 19, a cantilever-shaped first elastic member 64 is connected to the movable support portion 65, and a first support member 63 is connected to the distal end portion of the first elastic member 64. The second elastic member and the second support member are not shown.

  Since the tips of the first and second inspection connecting portions 62A and 62B shown in FIGS. 19A to 19D are not dot-like but linear, they are different from the electrode pads 111A and 111B of the integrated circuit substrate 110. It can be a line contact rather than a contact. Since the first elastic member 64 is a cantilever-shaped leaf spring, an imaginary line L that connects the ridge lines at the tips of the first inspection connecting portion 62A and the second inspection connecting portion 62B is the first It is preferable that the first and second inspection connection portions 62A and 62B are arranged so as to be inclined with respect to the longitudinal direction of the elastic member 64. The virtual line L may be orthogonal to the longitudinal direction of the first elastic member 64, or may be inclined by 45 degrees, for example. The movable support portion 65 has a reduced vertical distance from the integrated circuit board 110, and only a part of the tip of the first inspection connection portion 62A and the second inspection connection portion 62B is the electrode pad 111A on the integrated circuit substrate 110. , 111B can be avoided, and the entire ridgeline at the tip of the first inspection connecting portion 62A and the second inspection connecting portion 62B comes into contact with the electrode pads 111A, 111B, respectively. Therefore, the contact resistance between the first and second inspection connection portions 62A and 62B and the electrode pads 111A and 111B can be reduced.

  In order to reduce the contact resistance between the first and second inspection connection portions 62A and 62B and the electrode pads 111A and 111B, the first and second inspection connection portions 62A and 62B are connected to the electrode pads 111A and 111B. It is sufficient to contact without tilting. 20A to 20F are bottom views schematically showing various modifications of the inspection element 62. FIG. 20A to 20F, the direction of the arrow is the direction from the first elastic member 64 to the first support member 63, and indicates the front end direction of the first support member 53.

  As shown in FIG. 20A, when the ridgelines of the first inspection connecting portion 62A and the second inspection connecting portion 62B do not intersect, the first inspection connecting portion 62A and the first inspection connecting portion 62A A dummy pseudo-inspection connection portion 62D is provided between the second inspection connection portion 62B and a little closer to either one of the bases 62C from the arrangement center line thereof. The pseudo-inspection connection portion 62D has the same dimensions as the first and second inspection connection portions 62A and 62B, in particular, the same height from the base 62C, and the ridge line is the first and second inspection connection portions. The pseudo-inspection connecting portion 62D is attached to the base 62C so as to be in the same direction as the ridgelines of 62A and 62B. The pseudo-inspection connection portion 62D is preferably made of an insulating material. However, even a conductive material has a predetermined distance from the first inspection connection portion 62A and the second inspection connection portion 62B and is electrically insulated. It only has to be done. The first and second inspection connection portions 62A and 62B are in contact with the electrode pads 111A and 111B of the integrated circuit board 110 while maintaining the horizontal state due to the presence of the pseudo inspection connection portion 62D.

  As shown in FIG. 20B, when the ridge lines of the first inspection connection portion 62A and the second inspection connection portion 62B do not intersect, the first inspection connection portion 62A and the first inspection connection portion 62A A dummy pseudo-inspection connection portion 62D is provided between the second inspection connection portion 62B and a little closer to either one of the bases 62C from the arrangement center line thereof. The pseudo-inspection connection portion 62D has the same height from the base 62C as the first and second inspection connection portions 62A and 62B, and the ridgeline thereof is the ridgeline of the first and second inspection connection portions 62A and 62B. Is connected to the base 62C so as to be orthogonal to the base 62C. The first and second inspection connection portions 62A and 62B are in contact with the electrode pads 111A and 111B of the integrated circuit board 110 while maintaining the horizontal state due to the presence of the pseudo inspection connection portion 62D.

  As shown in FIG. 20C, when the ridge lines of the first inspection connection portion 62A and the second inspection connection portion 62B are arranged on the same line L, the first inspection connection portion Between the connecting portion 62A and the second inspection connecting portion 62B, a dummy pseudo-inspecting connecting portion 62D is located slightly closer to any one of the bases 62C from an arrangement center line thereof, that is, an extended line connecting the two ridge lines. Is provided. The pseudo-inspection connecting portion 62D has a predetermined height from the base body 62C. In particular, it may be the same height as the first and second inspection connecting portions 62A and 62B. This is because the same state as when the MEMS element is mounted on the integrated circuit substrate is obtained. The pseudo-inspection connection portion 62D protrudes from the base 62C so that the ridge line of the pseudo-inspection element 62D is orthogonal to the ridge lines of the first and second inspection connection portions 62A and 62B. The pseudo-inspection connection portion 62D is preferably made of an insulating material. However, even a conductive material has a predetermined distance from the first inspection connection portion 62A and the second inspection connection portion 62B and is electrically insulated. It only has to be done. The first and second inspection connection portions 62A and 62B are in contact with the electrode pads 111A and 111B of the integrated circuit board 110 while maintaining the horizontal state due to the presence of the pseudo inspection connection portion 62D.

  As shown in FIG. 20D, when the ridge lines of the first inspection connection portion 62A and the second inspection connection portion 62B are arranged on the same line L, the first inspection connection portion 62A is used. A dummy pseudo-inspection connection portion 62D is disposed between the connection portion 62A and the second inspection connection portion 62B by slightly approaching either one of the bases 62C from the center line of their arrangement, that is, an extension line connecting the two ridge lines. Provide. The pseudo-inspection connection portion 62D has the same dimensions as the first and second inspection connection portions 62A and 62B, and its ridgeline is parallel to the ridgelines of the first and second inspection connection portions 62A and 62B. The pseudo-inspection connecting portion 62D is attached to the base 62C. The pseudo-inspection connection portion 62D is preferably made of an insulating material. However, even a conductive material has a predetermined distance from the first inspection connection portion 62A and the second inspection connection portion 62B and is electrically insulated. It only has to be done. The first and second inspection connection portions 62A and 62B are in contact with the electrode pads 111A and 111B of the integrated circuit board 110 while maintaining the horizontal state due to the presence of the pseudo inspection connection portion 62D.

  Here, in all of the modifications shown in FIGS. 20A to 20D, it is assumed that the test element 12 has two terminals, but the test element 12 has a multi-terminal such as three terminals. May be. In this case, for example, as shown in FIG. 20E, a third inspection connecting portion 62E may be provided at the same position as in FIG. A third inspection connection portion may be provided at the position of the pseudo inspection connection portion 62D shown in FIGS.

  Even if the inspection element 12 has two terminals, the number of pseudo-inspection connection portions 62D may not be one, but two or more may be provided as in the modification shown in FIGS. . For example, as shown in FIG. 20F, when the ridgelines of the first inspection connecting portion 62A and the second inspection connecting portion 62B are arranged on the same line L, the first inspection is performed. A dummy first pseudo-inspection connection part 62D between the connection part 62A for the inspection and the connection part 62B for the inspection, which is slightly closer to either one of the bases 62C from the center line of the arrangement, that is, the extended line of the ridgeline Between the first inspection connecting portion 62A and the second inspection connecting portion 62B, and a dummy second one slightly closer to either one of the bases 62C from the center line of the arrangement, that is, the extended line of the ridgeline. The pseudo-inspection connection portion 62F may be provided. The first pseudo-inspection connecting portion 62D has the same dimensions as the first and second inspecting connecting portions 62A and 62B, but the second pseudo-inspecting connecting portion 62F is the first and second inspecting connecting portions. The height from the base 62C is made lower than 62A and 62B. As a result, the first and second inspection connection portions 62A and 62B are in contact with the electrode pads 111A and 111B of the integrated circuit board 110 while maintaining the level only by the presence of the first pseudo inspection connection portion 62D. The first and second pseudo inspection connection portions 62D and 62F are attached to the base 62C so that the ridge lines thereof are parallel to the ridge lines of the first and second inspection connection portions 62A and 62B. The first and second pseudo-inspection connection parts 62D and 62F are preferably made of an insulator, but may be electrically insulated even with a conductive material.

  FIG. 21 is a schematic diagram for explaining the relationship between the testing element and the integrated circuit substrate, where (A) is a plan view of the MEMS element, (B) is a front view, and (C) is a specific first view. The relationship between the testing element and the integrated circuit board in the example of FIG. 7 is shown, and (D) is a diagram showing the relationship between the testing element and the integrated circuit board in the specific second example. As shown in FIGS. 21A and 21B, the MEMS element 91 includes an insulator 91D such as a resin, a first electrode portion 91A and a second electrode portion 91B extending in the height direction of the insulator 91D, Suppose that it is comprised with the coil as the passive element 91C provided between the 1st electrode part 91A and the 2nd electrode part 91B. Here, the coil 91C is provided with an axis parallel to the height direction of the insulator 91D, and the distance between the portion near the bottom surface of the insulator 91D and the insulator 91D in the coil as the passive element 91C is h1. .

  There are two possible cases for the inspection element. As shown in FIG. 21C, the inspection element 92 includes an insulator 92D, a first electrode part 92A, a second electrode part 92B, and a passive element 92C, like the MEMS element 91. Even so, the distal end portion 92E of the first electrode portion 92A and the distal end portion 92F of the second electrode portion 92B protrude from the bottom surface of the insulator 92D, that is, the surface facing the integrated circuit substrate 110, as shown in the figure. The tip portions 92E and 92F are in contact with the electrode pads 111A and 111B, respectively. In this case, the heights of the tip portions 92E and 91F and the passive element 92C are made equal to the height h1 shown in FIG. Since the distance between the coil as the passive element 92C and the integrated circuit board 110 does not change, the stray capacitance between the testing element 92 and the integrated circuit board 110 does not differ due to the height h1. However, since the tip portions 92E and 92F of the first electrode portion 92A and the second electrode portion 92B protrude from the facing surface of the integrated circuit substrate 110 in the insulator 92D, the dielectric around the tip portions 92E and 92F The rate changes. Therefore, as shown in FIG. 21C, the bottom surface of the insulator 92D in a state where the tip portions 92E and 92F of the first electrode portion 92A and the second electrode portion 92B are in contact with the electrode pads 111A and 111B. The dimension of the insulator 92 is set so that the distance Δhs on the surface of the integrated circuit substrate 110 is 1/10 or less of the distance h1. Thereby, the MEMS element 91 and the testing element 92 can be regarded as being electrically equivalent.

  As the second inspection element, as shown in FIG. 21D, the inspection element 93 includes an insulator 93D, a first electrode part 93A, a second electrode part 93B, and a passive element 93C. Even if configured, the distal end portion 93E of the first electrode portion 93A and the distal end portion 93F of the second electrode portion 93B are, as illustrated, the bottom surface of the insulator 93D, that is, the opposing surface of the integrated circuit substrate 110. The tip portions 93E and 93F are in contact with the electrode pads 111A and 111B, respectively. In this case, the height from the bottom surface of the insulator 93D and the lower end portion of the coil of the passive element 93C, that is, the surface of the insulator 93D facing the integrated circuit board 110 to the portion near the facing surface of the passive element 93C is shown in FIG. It is made equal to the height h1 shown in (A). Then, when the test element 93 is mounted on the integrated circuit board 110, the position of the coil as the passive element 93C is higher than the protruding height of the tip portions 93E and 93F when compared with the case where the MEMS element 91 is mounted on the integrated circuit board 110. It gets higher by the minute. Therefore, the stray capacitance generated between the test element 93 and the integrated circuit board 110 when the test element 93 is mounted on the integrated circuit board 110 is different from that when the MEMS element 91 is mounted on the integrated circuit board 110. ,Change. Therefore, as shown in FIG. 21D, the length ΔhL in which each of the first electrode portion 93A and the second electrode portion 93B protrudes from the bottom surface of the insulator 93D is 1/10 or less of the distance h1. The dimensions of the tip portions 93E and 93F are set so that Thereby, the MEMS element 91 and the testing element 92 can be regarded as being electrically equivalent.

  FIG. 22 is a schematic diagram for explaining the relationship between the testing element 97 and the pressing means 95. In FIG. 22, the pressing means 95 is shown assuming the pressing means 73 shown in FIG. As described with reference to FIG. 21, the inspection element 97 is configured by providing a coil as a passive element 97C between the first inspection connection portion 97A and the second inspection connection portion 97B. The entire passive element 97C and the first and second inspection connection portions 97A and 97B excluding the tip portions are covered with an insulator 97D such as a resin. Here, the coil as the passive element 97 has a central axis so as to be orthogonal to the flat plate of the pressing means 95. When such an inspection element 97 is attached to the cantilever-type pressing means 95 with an insulating adhesive layer 96, the distance d2 between the portion near the pressing means 95 in the passive element 97C and the pressing means 95 is set to be passive. The region is set so as not to be affected by the magnetic field by the coil as the element 97C.

  As described with reference to FIGS. 21 and 22, the heights Δhs of the first and second inspection tips 92E and 92F in the inspection element 92, and the first and second inspection points in the inspection element 93. By setting the heights ΔhL of the tips 93E and 93F and the distance d2 between the passive element 97C in the test element 97 and the pressing means 95 within a predetermined range, the test element is an integrated circuit of the integrated circuit board. The circuit network to be configured and the circuit network in which the MEMS element is configured by an integrated circuit of an integrated circuit board can be made equivalent in terms of an equivalent circuit. Therefore, according to the device for an integrated circuit board designed in this way, it is possible to accurately check whether the integrated circuit board has a performance according to a predetermined specification.

  As described above, according to the present invention, the integrated circuit board can be correctly inspected with a simple configuration before the MEMS element is mounted on the integrated circuit board on which the integrated circuit is provided.

10, 20, 30, 40, 50, 60, 70: Integrated circuit board inspection apparatus 11, 51: Stages 12, 17, 33, 42, 52, 62, 72, 82: Inspection elements 12A, 12B, 32A, 32B, 52A, 52B, 62A, 62B, 62E, 72A, 72B: Inspection connection portion 12C, 62C: Base 12D, 83a: Passive element 12E, 12F: Tip portion 13, 43, 53, 57, 63: Support member 14 , 54, 58, 64: elastic members 73, 77: pressing means 15, 65, 75: support part (movable support part)
16: Pressing means 32, 44: Inspection element body 34: Package 34A: Support 34B: Upper part 34C: Side wall 34D: Recess 34E: Connection terminal 56: 56A, 56B, 56C, 76: Probe 59: Inspection Circuit 59A: Power supply section 59B: Measurement sections 59C, 59D, 59E: Wiring 62D, 62F: Simulated inspection connection section 75a: Depression 75b, 75c: Lower surface 76A of support section: Means 77a, 77b, 77c for supporting probe 76 , 77d, 86a, 87a, 87b: adhesive layer 81: semiconductor substrate 81a: etch pit 82: resist 82: inspection element 82a: contour 82b: mold 83a: passive elements 83b, 85b: through wiring 84: passive element and through wiring Embedded substrate 85: insulators 85a, 85d, 86: insulating substrate 85c: leading end portions 85c, 85e, 86 of the through wiring : Metal wiring 86c: wiring tip 91: MEMS elements 91A, 92A, 93A, 97A: first electrode parts 91B, 92B, 93B, 97B: second electrode parts 91C, 92C, 93C, 97C: passive elements 91D, 92D, 93D: insulators 92E, 93E: tips 92F, 93F of the first electrode part: tips 92, 93, 97 of the second electrode part 95: testing element 95: pressing means 96: adhesive layer 100: function Device 110: Integrated circuit boards 111A, 111B, 111F: Electrode pad 111C: Wiring / element 111D: Outermost surface layer 111G, 111H: Drive electrode pad (electrode pad)
111I: Inspection electrode pad (electrode pad)
113: Outermost surface layer

Claims (15)

A test element used for inspecting an integrated circuit board on which a MEMS element having a package is to be mounted, and a test element having a plurality of test connection parts, and a pressure for pressing the test connection parts to the electrode pads of the integrated circuit board An integrated circuit board evaluation apparatus comprising:
The inspection element so that the circuit formed by connecting the inspection element and the integrated circuit board and the circuit formed by mounting the MEMS element on the integrated circuit board are the same as an equivalent circuit. Configure
The inspection element has a package having the same structure as that of the MEMS element package and an electrical wiring formed, and a pointed portion protrudes from a contact surface of the package with the integrated circuit substrate. The pointed portion is an electrode different from the electrode pad with which the inspection connecting portion abuts among the electrode pads formed on the integrated circuit substrate when the inspection element and the integrated circuit substrate are connected to each other. Configured to abut the pad,
Further, when pressing the test connection to the electrode pad by the pressing means, so that the test connection is not deformed, characterized in that said pressing means having elastic with the test connection is rigid An integrated circuit board inspection apparatus. An inspection element that is used for inspection of an integrated circuit board on which a MEMS element is to be mounted and has a plurality of inspection connection parts, and a pressing means that presses the inspection connection part against an electrode pad of the integrated circuit board, An integrated circuit board evaluation device comprising:
The inspection element so that the circuit formed by connecting the inspection element and the integrated circuit board and the circuit formed by mounting the MEMS element on the integrated circuit board are the same as an equivalent circuit. The inspection connecting portion has rigidity and the pressing means has elasticity so that the inspection connecting portion is not deformed when the inspection connecting portion is pressed against the electrode pad by the pressing means. ,
Further, the inspection element is provided with an insulator that holds the same element as the circuit element of the MEMS element, and protrudes from a surface of the insulator facing the integrated circuit substrate, and a pseudo inspection connection portion and The plurality of inspection connection portions are provided, and when the pressing means presses the inspection connection portion against the electrode pad, the inspection connection is held horizontally by the pseudo inspection connection portion. An inspection apparatus for an integrated circuit board, wherein the part is brought into contact with the electrode pad. The inspection connecting portion protrudes from the surface of the insulator facing the integrated circuit substrate so as to have a ridge line parallel to the integrated circuit substrate at the tip,
The inspection connecting portion is arranged so that the ridge line of the inspection connecting portion is perpendicular to the longitudinal direction of the pressing means, and the pressing means presses the inspection connecting portion against the electrode pad, The integrated circuit board inspection apparatus according to claim 2, wherein a ridge line of the inspection connection portion is in line contact with the electrode pad. In the inspection element, the inspection connection portions are arranged in a straight line, and the pseudo inspection connection portion is insulated at a position not aligned with the inspection connection portion. The integrated circuit board inspection apparatus according to claim 2. 2. The inspection element includes the inspection connection portion having the same cross-sectional dimension as an electrode portion of the MEMS element , and an element having the same structure as a circuit element of the MEMS element. Or the inspection apparatus for an integrated circuit board according to 2 above. The inspection element includes an element of the passive element and the same structure as the circuit elements of the MEMS device,
The integrated circuit board inspection apparatus according to claim 1, wherein the inspection element is connected to the integrated circuit board to form an integrated circuit and a high-frequency circuit in the integrated circuit board. The pressing means includes an insulating support means and a non-insulating elastic means, and the inspection element is attached to the support means,
The support means is capable of ignoring an influence on characteristics of a circuit network formed by the inspection element and the integrated circuit on the integrated circuit substrate in a state where the inspection element is pressed against the integrated circuit substrate. , wherein the spaced apart a conductive portion in said test device from the resilient means, the integrated circuit board inspection apparatus according to claim 1 or 2. The inspection element includes a coil element as the passive element,
8. The integrated circuit board inspection apparatus according to claim 7 , wherein the elastic means is provided in a region that attenuates to 1/10 or less of the maximum intensity of the magnetic field generated by the coil element. The integrated circuit board inspection apparatus according to claim 2 , wherein the inspection element has a package having the same structure as a package of the MEMS element. Wherein the package of the inspection device and the electrical wiring is formed, pointed portions at the surface in contact with the integrated circuit substrate of the package is formed to project, 該尖Ri section, said testing device The electrode pad formed on the integrated circuit board, when connected to the integrated circuit board, abuts on an electrode pad different from the electrode pad on which the connection portion for inspection abuts. 9. The inspection apparatus for an integrated circuit board according to 9 . The inspection connection portion can ignore the influence on the characteristics of the circuit network formed by the inspection element and the integrated circuit of the integrated circuit substrate in a state where the inspection connection portion is pressed against the electrode pad. extent, characterized in that said protruding from the surface facing the said integrated circuit an insulating substrate, an integrated circuit board inspection apparatus according to claim 2. The passive element in the inspection element is a coil element,
In a state in which the inspection device is pressed against the electrode pad, a height where the integrated circuit and the test connection from the surface facing the substrate of the insulator is protruded it is of the coil element of the insulating body 1/10 or less of the distance from the part closest to the integrated circuit board side to the integrated circuit board,
Said distance, characterized in that equal from the surface facing the said integrated circuit substrate of the insulator in the MEMS device to the dimensions of the site of most the opposing surface side of the circuit elements in the MEMS device, according to claim 11 Inspection equipment for integrated circuit boards. The passive element of the inspection element is a coil element,
In a state in which the inspection device is pressed against the electrode pad, a height where the integrated circuit and the test connection from the surface facing the substrate of the insulator is protruded it is of the coil element of the insulating body And 1/10 or less of the distance between the portion closest to the integrated circuit substrate side and the opposing surface of the insulator,
Said distance, characterized in that equal from the surface facing the said integrated circuit substrate of the insulator in the MEMS device to the dimensions of the site of most the opposing surface side of the circuit elements in the MEMS device, according to claim 11 Inspection equipment for integrated circuit boards. And further comprising a plurality of probes connected to the integrated circuit electrode pad for power supply electrode pads and the output signal on the substrate, and a probe supporting means for supporting a plurality of probes, according to claim 1 or 2. The inspection apparatus for an integrated circuit board according to 2 . 15. The inspection apparatus for an integrated circuit board according to claim 14 , wherein the probe support means and the pressing means are configured separately.

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