JP5489010B2 - Method and apparatus for dividing printed circuit board - Google Patents

Description

The present invention relates to a method and an apparatus for dividing a printed circuit board in which a plurality of mounting boards on which electronic components or the like are mounted are connected at a binding portion arranged at a predetermined interval into individual mounting boards. Therefore, the present invention relates to a method for efficiently dividing and acquiring individual mounting boards from a printed board in which a plurality of mounting boards are connected, and an apparatus therefor.

  As a method of dividing a printed circuit board in which a plurality of mounting boards to which electronic components or the like are fixed is divided into individual mounting boards, for example, as disclosed in JP-A-2002-33563 (Patent Document 1), A cutting tool such as a router is disposed above the printed circuit board on which the electronic components are mounted, and the printed circuit board is cut from above (hereinafter referred to as an upper cutting method), and Japanese Patent No. 4487201 (hereinafter, referred to as the above patent application) As shown in Patent Document 3), two methods are known in which a cutting tool is disposed below the printed board and cut from below (hereinafter referred to as a downward cutting method).

  In the upper cutting method described in Patent Document 1, the biggest problem is that when there is a cutting part under an electronic component overhanging from the end face of the printed circuit board, the electronic component cuts off the cutting. This is because it is necessary to turn the printed circuit board upside down for cutting.

At the same time, in any of the above-described cutting methods, dust generated during cutting is collected by using a dust collecting device, so that the influence on the worker's body and the safety of the working environment are achieved.
That is, as shown in FIG. 6, in a general upper cutting type cutting apparatus 1, a printed circuit board 4 is fixed to pins 5 and 5 on a box-shaped support jig 3 placed on a base 2 of the apparatus body. And is cut by the main shaft 6 from above and divided into individual printed circuit boards.

In this cutting apparatus 1, chips generated by cutting the printed circuit board 4 by the main shaft 6 are sucked by a main shaft nozzle 8 provided around the router bit 7 and discharged as indicated by an arrow or shown in the drawing. As described above, the suction is performed by suction from the lower side of the support jig 3 or both discharging methods are used in combination.
In the figure, 9 is an electronic component, and 10 is a slit for cutting.

When the electronic component 9 is overhanging on the printed board 4 described above, the printed board 4 needs to be turned over and cut.
However, cutting the printed circuit board 4 upside down means cutting at the upper part of the electronic component 9 overhanging the cut portion (line), so that the electronic component 9 is contaminated with chips. Cause problems.

Further, in this method, in order to prevent the substrate from being contaminated by chips generated by cutting, a spindle nozzle 8 is provided around the router bit 7 to suck and remove the chips.
In order to suck the chips efficiently by this method, it is required to bring the spindle nozzle 8 as close as possible to the surface of the printed circuit board 4, but on the other hand, if the spindle nozzle 8 is brought as close as possible to the surface of the printed circuit board 4. As the distance is closer, there is a problem that the spindle nozzle 8 comes into contact with the printed circuit board 4 and the electronic component 9 due to warping or suction of the printed circuit board 4 and is likely to be damaged.

  Furthermore, the main shaft 6 may pass through the upper part of the electronic component 9 to continue cutting while moving from the cutting location where the cutting has been completed to the next cutting location. There is also a risk that the chips that have fallen may contaminate the electronic component 9.

In order to prevent this, it is conceivable to increase the suction force of the spindle nozzle 8 from the lower side of the support jig 3.
However, the method of increasing the suction force of the spindle nozzle 8 has the above-mentioned problems and has a limit.
Furthermore, as shown in the figure, since the support jig 3 has a large number of slits 10 for cutting, it is necessary to increase the air volume to increase the suction force.

  Similarly, the invention described in Japanese Patent No. 3770059 (Patent Document 2) aims to improve the method of cutting using a router bit, and eliminates chips generated when cutting using a router bit. For this reason, a flat plate is disposed below the substrate to be cut, and dust-absorbing air is circulated between the substrate and the flat plate.

  This printed circuit board dividing device can be obtained by collecting the chips generated on the substrate surface due to static electricity without leaving any chips generated when cutting the board, which was difficult with the conventional method. In addition, the function of holding the substrate to the receiving jig by sucking in air with a conventional dust collector etc. also causes a force to attract the substrate to the flat plate side due to a decrease in the pressure energy of the air flowing between the substrate and the flat plate at high speed. It is said that the same substrate holding force as that of the prior art can be secured.

  In contrast to the upper cutting method having such problems, a lower cutting method has been proposed as a method for obtaining a printed circuit board on which electronic components are mounted more efficiently and without losing quality.

For example, a substrate cutting method and apparatus described in Japanese Patent No. 4487201 (Patent Document 3) can be given.
The invention described in Patent Document 3 is based on the proposal of the present applicant, and holds a substrate placed on a pair of guide rails by holders attached to a substrate transfer device, and allows the substrate to be viewed from both the upper and lower sides of the substrate. It is fixed by holding down, and the rotary blade is moved along the cutting position of the substrate to cut the substrate.

  This cutting method does not require a complicated and expensive device, is a simple and inexpensive device, has good workability, and has high cutting efficiency. Therefore, a circuit board in the electronic industry, particularly electronic components are mounted. Although it can be widely used in the preparation of printed circuit boards, a plate-like body can be cut regardless of the printed circuit board.

Further, Japanese Utility Model Registration No. 3051899 (Patent Document 4) proposes a mounting board punching device.
This punching device uses an upper die and a lower die each provided with a cutting blade, an upper pressing body provided with a blade hole through which these cutting blades are inserted, and a device provided with a lower pressing housing, and an elastic body. Is used to sandwich the mounting substrate in a sandwich shape, and the substrate is cut by a relative punching operation of cutting blades provided in the upper die and the lower die.

In this method, the worker's work safety can be improved, and the mounting board made of a printed wiring board or a circuit board can be separated into a punched product part and a surplus part and carried out with high accuracy and efficiency. Yes.

JP 2002-33563 A (paragraph 0006, FIG. 1) Japanese Patent No. 3770059 (claims, effects of the invention) Japanese Patent No. 4487201 (claims, effects of the invention) Utility Model Registration No. 3051899 (Claims, Effects of Invention)

The upper cutting method using the router bit described in Patent Document 2 can easily cope with a cut portion on the printed circuit board and can easily cope with complicated cutting, but the printed circuit board itself is fixed. As is apparent from FIG. 1 of FIG. 2, this is performed by a plurality of substrate receiving jigs.
Therefore, the fixing in the vertical direction is not reliable, and there is a possibility that the substrate is distorted when cutting with the router bit.

Furthermore, in this upper cutting method, air is used to remove chips generated at the time of cutting with a router bit, but air is distributed through the entire space between the printed board and the flat board. The force which attracts to the flat plate side is also generated.
In addition, air leakage from the cutting slit is not negligible, and there is a problem that the air flow must be considerably large, and it is possible to completely prevent chips from adhering to the lower surface of the printed circuit board. It cannot be said.

Furthermore, in this upper cutting method, the chips are removed by air, and the surface of the printed board is not contaminated with the chips.
However, there is still a possibility that chips adhering to the router bit fall on the surface of the printed circuit board and contaminate the surface of the printed circuit board when the router bit moves.

  Since the lower cutting method of Patent Document 3 is a method using a rotary blade, it is a simple and inexpensive device, has good workability and high cutting efficiency, so that it cuts a large amount of printed circuit boards. Is suitable, but since the cutting direction is specified, there is a dislike that it cannot be said that it is perfect for the preparation of a small variety of printed circuit boards.

  The lower cutting method of Patent Document 4 is to cut the printed circuit board with the cutting blades provided on the upper and lower sides. Therefore, when cutting, the printed circuit board is easily distorted by shearing stress, and sufficient attention is paid to the operation. Therefore, some distortion is unavoidable.

Furthermore, although it is a problem common to the method of patent document 2 and patent document 4, when the electronic component mounted in the printed circuit board has protruded on the cutting | disconnection location (line | wire), the cutting | disconnection from an upper part is impossible. Therefore, there is a problem that it cannot be used as it is.
To solve this problem, if the printed circuit board is turned upside down and cut, the mounted electronic component will be placed under the cutting point. The problem of end up occurs.

In view of the present situation, the present invention does not require any special means for fixing the printed circuit board to be cut, the mounted electronic component is overhanging on the cutting slit, and the printed circuit board and the electronic component are A printed circuit board that can cut printed circuit boards without damaging electronic components even when they are close to each other, and can collect and discharge chips generated during cutting reliably and effectively. Therefore, it is intended to provide a dividing method and apparatus therefor.

In order to achieve the above object, the invention according to claim 1 of the present invention provides:
When cutting and separating the printed circuit board on which electronic parts are mounted with the router bit placed below it,
The printed circuit board is fixed in close contact with a portion corresponding to the binding portion of the printed circuit board on a support jig in which a slit for cutting from which the tip of the router bit protrudes,
While holding the top surface of the main shaft holding the router bit in a close contact state with the bottom surface of the support jig, the router bit protruding from the slit cuts and separates the printed circuit board,
A method of dividing a printed circuit board , wherein dust generated by cutting is collected at a pinpoint through a slit and a projecting through hole of a router bit formed on a top surface of the main shaft .

The invention according to claim 2 of the present invention is
The method for dividing a printed circuit board according to claim 1,
The cutting division is
The dust generated along with the cutting of the printed board is caused to pass through the inner surface of the spindle nozzle portion using air, and is sucked and removed below the support jig.

Furthermore, the invention according to claim 3 of the present invention is
A supporting jig capable of closely fixing a printed circuit board to be cut and separated, in which a cutting slit from which the leading end of the router bit protrudes is formed at a portion corresponding to the binding part of the printed circuit board on which electronic components are mounted When,
Wherein arranged below the support jig, a main shaft having a router bit, is attached to the main shaft nozzle portion is composed of the dust collecting mechanism for dust collection of the dust generated by cutting with a router bit,
The spindle nozzle has a through hole from which a router bit protrudes,
The printed board dividing apparatus is configured to collect dust at a pinpoint through the slit and the through hole .

The invention according to claim 4 of the present invention is
In the printed circuit board dividing device according to claim 3,
The support jig is
It is composed of a metal plate having a required thickness, its bottom surface is flat, and is flush with the bottom surface of the pedestal that constitutes the apparatus main body, and the portion for tightly fixing the printed circuit board is formed by engraving It is characterized by being.

The invention according to claim 5 of the present invention is
In the printed circuit board dividing device according to claim 3,
The spindle nozzle is
The top surface is flat and has a through-hole through which a router bit protrudes in the center, and a tip-shaped surface is attached with a cylindrical brush that is in sliding contact with the bottom surface of the support jig. It is.

The invention according to claim 6 of the present invention is
In the dividing device of the printed circuit board according to claim 5,
The through hole of the spindle nozzle is
The diameter is smaller than the length of the slit formed in the support jig, and is configured to collect dust at a pinpoint from the slit and the through hole.

  The printed circuit board dividing method and apparatus according to the present invention include a supporting jig in which a cutting slit in which a tip end portion of a router bit protrudes is formed at a portion corresponding to a binding portion of the printed circuit board. The printed circuit board is cut and separated by the router bit that protrudes from the slit while the top surface of the spindle holding the router bit is held in close contact with the bottom surface of the support jig. In addition, since the dust generated by cutting is collected at a pinpoint from the slit, various excellent effects are exhibited.

That is,
1) Even when an electronic component mounted on a printed circuit board is overhanging a cut portion (line), it can be cut and divided without any trouble, and the overhanging electronic component is not contaminated with chips.
2) Since the printed circuit board is cut from the lower surface, not only the surface of the printed circuit board but also the back surface of the printed circuit board is used as a support jig when cutting and moving the router bit. Since it is covered, it does not adhere.
3) Since the printed circuit board is tightly fixed to the plate-like support jig, the substrate is not distorted during cutting by the router bit, and high-precision cutting is possible.

Uses a configuration that cuts and splits the printed circuit board while suctioning and removing the chips generated by cutting through the slit and the top hole of the spindle nozzle using air. By,
1) The cut portion becomes a pin-point dust collection port, the vacuum pressure rises, a large air volume vacuum source is not required, the suction flow rate at the dust collection port is increased, and the dust collection efficiency is also improved.
2) Since only the cutting part is used as a dust collection port, a normally used large dust collection nozzle is not required, and there is no restriction due to the arrangement of electronic parts. Since dust is collected through the through hole of the nozzle, the electronic component mounted by the nozzle is not damaged.
3) Due to the dust collection of the pin point soot, the dust soot only reattaches around the cutting slit, and the total amount of dust attached can be greatly reduced.

The fixing of the printed circuit board onto the plate-like support jig can be easily achieved by engraving a portion for fixing the target printed circuit board in close contact.
Furthermore, pressing against the printed circuit board from above can be achieved by extremely simple means.

  The dust generated during the cutting and separation is arranged so that the bottom surface of the support jig is a flat surface and the top surface of the spindle nozzle is in close contact with the bottom surface, so that the dust generated by the cutting and separation is separated from the slit of the support jig. It can collect dust at a pinpoint.

Moreover, by making the bottom surface of the support jig flat, the router can be moved smoothly, and the tip end surface of the brush attached to the spindle nozzle can be reliably brought into sliding contact with the bottom surface. The bottom surface of the support jig can always be kept clean.

It is sectional drawing which shows the main structures of the dividing apparatus of the printed circuit board concerning this invention. It is a top view of an example of the support jig used for this invention. It is an expanded sectional view of the principal part of the support jig. It is a perspective view of an example of the printed circuit board cut | disconnected by this invention. It is a schematic explanatory drawing of the state where the electronic component overhangs in the slit for cutting. It is sectional drawing of the principal part of the conventional dividing device of a printed circuit board.

Hereinafter, an example of a method and apparatus for dividing a printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings.
The present invention is not limited to the embodiments described below, and various changes can be made without departing from the scope of the invention.

The printed circuit board dividing device 11 of the present invention is characterized in that it has a structure capable of tightly fixing the printed circuit board 12 having the electronic component 12 a mounted on the surface thereof in a plate-like support jig 13.
The support jig 13 is provided with a slit 14 for cutting opposite to the cut portion (binding portion J) of the printed circuit board 12, and cutting and cutting is performed below the support jig 13 using the slit 14. A main shaft 16 is installed.

  A printed circuit board 12 shown in FIG. 4 includes two substrates B and C each having the same type and / or different types of electronic components (not shown) mounted on a frame-shaped base member A, and the outer peripheral edges of the substrates B and C. Are formed by integrating a plurality of spelling portions J (cutting points) formed at a necessary interval, and a slit S having a constant width is formed between the connecting portions J. Yes.

As shown in FIG. 1, the supporting jig 13 has a flange 13c integrally formed in a horizontal direction via a rising portion 13b at opposite side edges of a metal plate 13a having a flat bottom surface. The protruding portion 13b has the same height as the thickness of the pedestal 15 constituting the apparatus main body.
Furthermore, a positioning through-hole 13g is formed in a required portion of the flange 13c, and a positioning pin 15b disposed on the base 15 is engaged with the through-hole 13g to support the bottom surface 15a of the base 15. While the bottom surface of the jig 13 is flush, there is no movement of the support jig 13 in the left-right direction due to vibration, and stable cutting is possible.

On the upper surface of the support jig 13, as shown in FIG. 3, a recess 13d having a required depth that is substantially the same shape as the size of the printed circuit board 12 to be cut is formed by engraving. Pins 13e for positioning the printed circuit board 12 are formed at the required positions.
In the figure, reference numeral 13f denotes a positioning protrusion used when the printed bank divided into pieces is pressed or divided and cut.

  As is apparent from FIG. 1, the spindle 16 has a support portion for the router bit 17 held at the center of a cylindrical spindle holder 16a, and the outer periphery of the holder and the inner periphery of the spindle holder 16a An air discharge hole 16b is formed therebetween, and a spindle nozzle 16c that encloses the tip of the router bit 17 is integrally attached to the top of the air discharge hole 16b.

The spindle nozzle 16c is integrally formed with a protruding portion 16d at the upper center portion thereof, and a through hole is formed at the center portion of the top surface 16e for allowing the router bit 17 to pass therethrough. A cylindrical rotating brush 16f of a required height is attached to the outer periphery of the upper part of the spindle nozzle 16c so that the tip surface is in sliding contact with the bottom surface of the support jig 13 during operation.
Note that the top surface 16e of the spindle nozzle 16c is also held in a state of being in close contact with the bottom surface of the support jig 13 during operation.
In the figure, reference numeral 19 denotes a support member for the main shaft 16.

  In the dividing device 11 having such a configuration, in order to manufacture individual substrates by cutting and separating the printed circuit board 12 at predetermined locations, the dividing device 11 is formed on a support jig 13 that is installed in advance on a pedestal 15 that constitutes the apparatus main body. The printed circuit board 12 is mounted in the support jig 13 using the positioning pins 13e.

As described above, the support jig 13 is formed by engraving a recess 13d having a required depth that is substantially the same shape as the size of the printed circuit board 12 to be cut.
Accordingly, the printed circuit board 12 is held by the bank of the concave portion 13d, the pin 13e, and the protrusion 13f, and movement in the front / rear and left / right directions is restricted.
In FIG. 2, 13 h is a handle for carrying the support jig 13.

  Further, when the printed circuit board 12 is cut from below, the printed circuit board 12 is stable due to its own weight, so that special fixing is not necessary, but the printed circuit board 12 can be cut and separated in a more stable state. As shown in FIG. 1, it is preferable to suppress a required portion on the surface of the printed circuit board 12 with a suppressing member 18 formed by hanging a plurality of columnar bodies 18 a attached to the apparatus main body above the support jig 13.

When the mounting of the printed circuit board 12 to the support jig 13 is completed, the main shaft 16 which is arranged below the support jig 13 and is controlled by the computer is operated.
Simultaneously with the operation, the main shaft 16 moves to the slit 14 corresponding to the portion to be cut first, and the top surface 16e rises to a position where it substantially contacts the bottom surface of the support jig 13, and at the same time, the tip surface of the brush 16f. Also adheres to the bottom.

  Next, when the main shaft 16 is raised, the router bit 17 protrudes from the slit 14, and the binding portion J is sequentially cut and divided in a certain direction to separate the printed circuit boards B and C from the base member A.

When the printed circuit board 12 is cut and divided by the router bit 17, the dividing apparatus 11 of the present invention maintains a state in which the bottom surface of the support jig 13 that holds the printed circuit board 12 and the top surface 16 e of the main shaft 16 are very close to each other. However, the printed circuit board 12 is cut and separated.
Accordingly, the closeness between the bottom surface of the support jig 13 and the top surface 16e of the main shaft 16 is extremely high, and dust generated by the operation of the router bit 17 is attached to the through hole of the top portion 16e of the main shaft nozzle 16c and the main shaft nozzle 16c. The air is efficiently collected by a dust collection mechanism including an air discharge port 16b and a dust collector (not shown) attached to the main shaft 16 such as a brush 16f, and discharged to the outside through the air exhaust hole 16b.

That is, in the present invention, as apparent from FIG. 1, the router bit 17 formed on the top surface 16e of the main shaft 16 is held in close contact with the bottom surface of the support jig 13 during operation. The through-hole is configured to collect dust such as chips generated by cutting at a pinpoint by forming the diameter smaller than the length of the slit 14 formed in the support jig 13.
Therefore, the generated dust can be reliably discharged outside through the slit 14, the through hole of the top surface 16 e of the main shaft 16, and the air discharge port 16 b in the main shaft 16.

  In operation, the dividing apparatus 1 maintains a state in which the bottom surface of the support jig 13 and the top surface 16e of the main shaft 16 are very close to each other, and the slit 14 of the support jig 13 and the main shaft 16 are in a cut portion. By forming a pinpoint dust collection port consisting of a through-hole formed in the top surface 16e of the steel, the vacuum pressure rises, the suction flow velocity from the slit 14 increases, and the amount of leakage is small, so No vacuum source is required.

Furthermore, the brush 16f disposed on the upper part of the main shaft 16 also moves while the tip end surface of the brush 16 is in sliding contact with the bottom surface of the support jig 13, so that dust such as chips adheres to the bottom surface of the support member 13, for example. However, dust can be reliably collected.
At the same time, the bottom surface of the support jig 13 can be kept flush with the bottom surface 15a of the pedestal 15 of the apparatus body, so that the entire bottom surface of the support jig 13 can be kept clean, and the brush 16f The wear of itself can be suppressed as much as possible.

  In addition, as is apparent from FIG. 5, the printed circuit board separating apparatus 1 according to the present invention is capable of cutting chips generated by cutting even when an electronic component 12a such as a connector overhangs the slit S of the printed circuit board 12. Dust is surely collected through the through hole of the main shaft 16, the slit S of the printed circuit board 12 and the slit 14 of the support jig 13, and there is a possibility that the dust adheres to the surface of the electronic component 12 a or the printed circuit board 12. Mostly eliminated.

Furthermore, by engraving and forming the printed circuit board receiving portion of the support jig 13, the printed circuit board 12 to be cut and separated can be securely fixed to the support jig 13, and a small printed circuit board can be used. However, cutting and separation are possible.

Since the printed circuit board dividing method and the dividing apparatus according to the present invention cut and divide the printed circuit board on which the electronic component is mounted from below by the router bit, the electronic component can be surely cut even when overhanging on the slit, Even with a small dust collection capacity, dust generated by cutting or the like can be collected at a pinpoint, so it can be widely used in the preparation of circuit boards in the electronics industry, especially circuit boards mounted with electronic components. is there.

DESCRIPTION OF SYMBOLS 11 Dividing apparatus 12 Printed circuit board 13 Support jig 13a Plate 13b Rising part 13c Flange 13d Plate recessed part 13e Printed circuit board pin 13f Positioning protrusion 13g Positioning through hole 14 Cutting slit 15 Stand 15a base Bottom surface 15b Positioning pin 16 Spindle 16a Spindle holder 16b Air outlet 16c Spindle nozzle 16d Projection 16e Projection top 16f Brush 17 Router bit B, C Printed circuit board J Spell

Claims (6)

When cutting and separating the printed circuit board on which electronic parts are mounted with the router bit placed below it,
The printed circuit board is fixed in close contact with a portion corresponding to the binding portion of the printed circuit board on a support jig in which a slit for cutting from which the tip of the router bit protrudes,
While holding the top surface of the main shaft holding the router bit in a close contact state with the bottom surface of the support jig, the router bit protruding from the slit cuts and separates the printed circuit board,
A method for dividing a printed circuit board , wherein dust generated by cutting is collected at a pinpoint through a slit and a through-hole for protruding a router bit formed on a top surface of the main shaft . The cutting division is
The dust generated by cutting the printed circuit board is caused to pass through the inner surface of the spindle nozzle portion by using air and sucked and removed below the support jig. A method for dividing a printed circuit board. A supporting jig capable of closely fixing a printed circuit board to be cut and separated, in which a cutting slit from which the leading end of the router bit protrudes is formed at a portion corresponding to the binding part of the printed circuit board on which electronic components are mounted When,
Wherein arranged below the support jig, a main shaft having a router bit, is attached to the main shaft nozzle portion is composed of the dust collecting mechanism for dust collection of the dust generated by cutting with a router bit,
The spindle nozzle has a through hole from which a router bit protrudes,
A printed circuit board dividing apparatus , wherein dust is collected at a pinpoint through the slit and the through hole . The support jig is
It is composed of a metal plate having a required thickness, its bottom surface is flat, and is flush with the bottom surface of the pedestal that constitutes the apparatus main body, and the portion for tightly fixing the printed circuit board is formed by engraving The printed circuit board dividing apparatus according to claim 3, wherein: The spindle nozzle is
The top surface is flat, and has a through-hole from which a router bit protrudes at the center, and a cylindrical brush that is in sliding contact with the bottom surface of the support jig is attached. Item 4. The printed circuit board dividing apparatus according to Item 3. The through hole of the spindle nozzle is
The diameter of the slit is formed smaller than the length of the slit formed in the support jig, and dust is collected at a pinpoint from the slit and the through hole. Printed circuit board dividing device.

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