JP5500998B2 - Grinding method for plate - Google Patents

Description

  The present invention relates to a method for grinding a plate-like object by grinding the plate-like object using a grinding wheel.

  For example, an optical device wafer in which a plurality of light emitting elements are formed on a sapphire substrate or SiC substrate is thinned to a predetermined grinding finish thickness by grinding the back surface with a grinding device, and then a cutting device or a dividing device is used. An optical device is formed by dividing into individual chips.

  Further, for example, a silicon wafer in which an electrode made of Cu is embedded is ground on the back surface by a grinding device and thinned to a predetermined grinding finish thickness, so that the embedded electrode is exposed on the back surface of the wafer. Can do.

  Grinding wheels used for grinding plate-like objects such as optical device wafers and silicon wafers are grinding wheels in which superabrasive grains such as diamond and CBN (Cubic Boron Nitride) are hardened with glass, resin, metal, etc. 2. Description of the Related Art A grinding device called a grinder, for example, disclosed in Japanese Patent Application Laid-Open No. 2007-222986 is widely used.

  In grinding with a grinder, the grinding wheel is brought into contact with the back surface (surface to be ground) of the plate-like object held by the chuck table, and the chuck table and the grinding wheel are rotated in the direction approaching each other. Grinding is performed by feeding.

  In grinding, a protective tape and a protective member are disposed on the surface of the plate-like object. This is for protecting the device formed on the surface and for facilitating the handling of the plate-like material thinned by grinding.

JP 2007-222986 A

  When grinding a plate-shaped object, especially when the plate-shaped object is a wafer containing a difficult-to-grind material such as sapphire, SiC, or metal, there is a problem that the grinding wheel is likely to be clogged during grinding. If grinding is continued with a grinding wheel in which crushing has occurred, there is a problem in that a grinding failure such as burning occurs on the surface to be ground and the plate-like object is damaged.

  The present invention has been made in view of these points, and an object of the present invention is to provide a method for grinding a plate-like object without causing grinding failure and without damaging the plate-like object. It is.

According to the present invention, there is provided a grinding method for a plate-like material, in which a plate-like material is disposed on a support, and a resin containing a dressing material having a function of curing by an external stimulus is disposed on the outer periphery of the plate-like material. A disposing step for setting, a curing step for curing the resin containing the dressing material by external stimulation, and a grinding step for grinding the plate-like object fixed on the support using a grinding wheel together with the resin containing the dressing material And after the grinding step, a peeling step for peeling the plate-like material from the support, and the resin containing the dressing material is cured by irradiation with ultraviolet rays to exhibit adhesiveness and peeled off by warm water In the disposing step, a plate-shaped object is disposed on the support through the resin containing the dressing material, and the resin containing the dressing material is disposed on the outer periphery of the plate-shaped object. in the curing step, the And then cured by irradiation with ultraviolet rays to make material containing resin, in the peeling step, a plate shape and then exfoliating the plate-like material from said support by immersing the said support and the plate-like material in hot water An object grinding method is provided.

  Preferably, the plate is made of sapphire.

  According to the present invention, since the dressing resin is disposed on the outer periphery of the plate-like material to perform grinding, the grinding wheel grinds the plate-like material and simultaneously grinds the dressing resin. Therefore, the grinding wheel is sharpened by the resin containing the sharpening material when grinding the plate-like material, so that the grinding wheel is prevented from being crushed, and the occurrence of grinding failure and damage to the plate-like material can be prevented.

It is sectional drawing which shows the arrangement | positioning step of 1st Embodiment. It is sectional drawing which shows the arrangement | positioning step of 2nd Embodiment. FIG. 3A is a cross-sectional view with the annular jig removed, and FIG. 3B is a cross-sectional view showing an ultraviolet curing step. It is sectional drawing which shows a grinding step. It is sectional drawing which shows a peeling step.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, as shown in FIG. 1A, an annular jig 4 is disposed on the support 2, and a dressing material-containing resin 8 is placed on the support 2 surrounded by the annular jig 4 by the resin supply device 6. Supply.

  Here, as the support 2, a transparent resin film such as a transparent PET film (polyethylene terephthalate film), a polycarbonate film, and an acrylic resin film can be employed. When the plate-like object to be ground is transparent, a non-transparent material such as a ceramic plate or a silicon wafer can be employed as the support 2.

  As a resin containing a dressing material, ultraviolet curable hot water swelling type resin (manufactured by Three Bond Co., Ltd., trade name “30Y-632D-3”, Toyo Adtec Co., Ltd., trade name “TEMPLOC series”) and silica (SiC) It is possible to employ a resin mixed with a dressing material such as.

  Next, as shown in FIG. 1 (B), the sapphire substrate 10 to be ground is pressed against the dressing-resin 8 supplied on the support 2, and as shown in FIG. 1 (C), the dressing-resin 8 Is raised between the outer periphery of the disk-shaped sapphire substrate 10 and the annular jig 4.

  In the embodiment described above, the sapphire substrate 10 is intended to be fixed to the support 2 with the resin 8 containing the dressing material. In this case, the dressing material is sandwiched between the sapphire substrate 10 and the support 2, so that the sapphire In order to fix the substrate 10 to the support 2 uniformly, the dressing material may become an obstacle to some extent.

  In order to solve this problem, first, as shown in FIG. 2 (A), an ultraviolet curable hot water swelling type resin is supplied onto the support 2, and then the sapphire substrate 10 is mounted on the resin, and then FIG. B) After the annular jig 4 is disposed on the support 2, the ultraviolet curable warm water swelling type resin is set between the outer periphery of the disc-shaped sapphire substrate 10 and the annular jig 4. What is necessary is just to supply the resin 8 containing the dressing material which mixed.

  Next, the annular jig 4 is removed from the support 2 as shown in FIG. 3A, and then ultraviolet rays are irradiated from below the support 2 by the ultraviolet lamp 12 as shown in FIG. 3B. Then, the ultraviolet curable resin 8 is cured.

  In addition, when the fluidity of the ultraviolet curable warm water swelling type resin 8 is high, the annular jig 4 is removed from the support 2 after the resin 8 is semi-cured by slightly irradiating ultraviolet rays. That's fine. By performing this curing step, an integrated product of the sapphire substrate 10 and the cured resin 8 to which the annular resin 8 cured on the outer periphery of the disc-shaped sapphire substrate 10 is fixed can be obtained.

  Next, as shown in FIG. 4, the support 2 to which the sapphire substrate 10 is fixed is sucked and held by the chuck table 16 of the grinding apparatus, and the back surface of the sapphire substrate 10 is ground by the grinding unit (grinding means) 14. During this grinding, the support 2 acts as a protective member that protects the light emitting element formed on the surface (lower surface) of the sapphire substrate 10.

  The grinding unit 14 is configured by mounting a grinding wheel 22 constituted by fixing a plurality of grinding wheels 26 to the tip of a wheel base 24 on a wheel mount 20 fixed to the tip of a spindle 18.

  In the grinding step, while rotating the chuck table 16 in the arrow A direction at 300 rpm, for example, with respect to the sapphire substrate 10 sucked and held by the chuck table 16, the grinding wheel 22 is rotated in the arrow B direction at 6000 rpm, for example. The grinding feed mechanism of the grinding unit 14 is operated to bring the grinding wheel 26 into contact with the back surface of the sapphire substrate 10.

  Then, the grinding wheel 22 is ground by a predetermined amount at a predetermined grinding feed speed, and the dressing material-containing resin 8 is ground together with the sapphire substrate 10. When the sapphire substrate 10 is ground, since the sapphire substrate 10 is a hard-to-grind material, crushing occurs in the grinding wheel 26 during grinding. Since grinding is performed at the same time, the grinding wheel 26 is sharpened by the sharpening material, and the grinding wheel is prevented from being crushed. In FIG. 4, t is the grinding finish thickness.

  After the grinding, as shown in FIG. 5A, when the support 2, the cured resin 8 and the sapphire substrate 10 are immersed in warm water filled in the container 28, the sapphire substrate 10 is fixed to the support 2. Since the resin 8 being swelled and its adhesive strength disappears, the sapphire substrate 10 can be peeled from the support 2 as shown in FIG.

  In the embodiment described above, a transparent resin is employed as the support 2, but when the plate to be ground is a sapphire substrate 10 or a transparent material such as glass, ultraviolet irradiation is performed from above the plate. Therefore, the support 2 need not be transparent, and a ceramic plate, a silicon wafer, or the like can be used as the support 2.

  Further, the resin containing the dressing material is not limited to the ultraviolet curable resin, and a resin that is cured by an external stimulus such as heating can also be used.

2 Support 4 Circular jig 8 Dressing resin 10 Sapphire substrate 12 Ultraviolet lamp 22 Grinding wheel 26 Grinding wheel 30 Hot water

Claims (2)

A method for grinding a plate-like object,
An arrangement step of disposing a plate-like material on the support and disposing a resin containing a dressing material having a function of curing by an external stimulus on the outer periphery of the plate-like material;
A curing step of curing the resin containing the dressing material by external stimulation;
A grinding step of grinding a plate-like object fixed on the support with a grinding material-containing resin using a grinding wheel;
After performing the grinding step, and a peeling step of peeling the plate-like material from said support member,
The resin containing the dressing material is cured by irradiation with ultraviolet rays to express adhesiveness, and is composed of a resin that can be peeled off by warm water,
In the disposing step, a plate-shaped object is disposed on the support via the dressing-material-containing resin, and the dressing-material-containing resin is disposed on an outer periphery of the plate-shaped object ,
In the curing step, the dressing resin is irradiated with ultraviolet rays to be cured,
In the peeling step, the plate-like material is peeled from the support by immersing the support and the plate-like material in warm water .   The plate-like material grinding method according to claim 1, wherein the plate-like material is made of sapphire.

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