JP5510664B2 - Electronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, various electronic components such as a piezoelectric device and an acoustic wave device that include a casing and an electronic component main body supported by the casing are known. For example, the following Patent Document 1 discloses a piezoelectric device 100 shown in FIG.

  The piezoelectric device 100 includes a housing 110 and a crystal resonator 120. The housing 110 includes a housing body 111 and a lid 112. The housing body 111 includes a rectangular bottom wall portion 111a and a frame portion 111b that is provided around the bottom wall portion 111a and protrudes from the bottom wall portion 111a. A support portion 111c is formed on the corner portion of the bottom wall portion 111a. The crystal unit 120 is supported by the support portion 111c.

JP 2010-57087 A

  As a manufacturing method of the housing body 111, for example, a resist mask is formed by applying and curing a resist on a portion excluding a portion where the support portion 111c of the bottom wall portion 111a is to be formed. A method of forming the support portion 111c using the resist mask can be considered. However, in this method, in the lift-off process of peeling the resist mask after the support portion 111c is formed, the resist mask may be damaged, and a part of the resist mask may remain on the housing body 111 side. There is a problem that 111 cannot be easily manufactured.

  This invention is made | formed in view of this point, The objective is to provide an electronic component with easy manufacture.

  The electronic component according to the present invention includes a housing and an electronic component main body. The housing includes a bottom wall portion, a frame portion, and a support portion. The frame portion is provided around the bottom wall portion. The frame part protrudes from the bottom wall part. The support portion is provided so as to protrude above the bottom wall portion. The electronic component main body is supported by the support portion. The bottom wall has at least one corner. The support portion is formed such that the distance from the frame portion monotonously decreases toward the tip end side of the corner portion at the corner portion.

  On the specific situation with the electronic component which concerns on this invention, a support part is extended toward the corner | angular part of a bottom wall part, and has a corner | angular part whose angle is smaller than the corner | angular part of a bottom wall part.

  The method for manufacturing an electronic component according to the present invention relates to a method for manufacturing the electronic component according to the present invention. The method of manufacturing an electronic component according to the present invention includes a step of forming a resist mask that covers a portion of the surface of the substrate by applying and curing a resist on the substrate, and using the resist mask on the substrate, A forming step of forming the frame portion and the support portion, and a step of peeling the resist mask after the forming step are provided.

  In the electronic component according to the present invention, the support portion is formed so that the distance from the frame portion decreases monotonously toward the tip side of the corner portion at the corner portion. For this reason, the electronic component according to the present invention can be easily manufactured using a resist mask.

1 is a schematic plan view of an electronic component according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. 1. FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG. 2. It is a schematic sectional drawing for demonstrating the manufacturing process of the housing body in one Embodiment which implemented this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the housing body in one Embodiment which implemented this invention. It is a schematic sectional drawing for demonstrating the manufacturing process of the housing body in one Embodiment which implemented this invention. 1 is a schematic cross-sectional view of a piezoelectric device described in Patent Document 1. FIG.

  Hereinafter, a preferred embodiment of the present invention will be described by taking the electronic component 1 shown in FIG. 1 as an example. However, the electronic component 1 and the manufacturing method thereof are merely examples. The present invention is not limited to the following electronic component 1 and manufacturing method thereof.

  FIG. 1 is a schematic plan view of an electronic component according to this embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG.

  As shown in FIGS. 1 to 3, the electronic component 1 includes an electronic component main body 10 and a housing 20. The electronic component main body 10 is supported by the housing 20 in the internal space 20 a of the housing 20. The electronic component body 10 constitutes a function expression unit that expresses the function of the electronic component 1. For example, when the electronic component 1 is a piezoelectric device, the electronic component body 10 has a piezoelectric function. In this case, for example, the electronic component main body 10 can include, for example, a piezoelectric body and a pair of electrodes for applying a voltage to the piezoelectric body. For example, the electronic component main body 10 is configured by a piezoelectric vibrator including a piezoelectric body having a rectangular shape in plan view having a pair of main surfaces facing each other, and drive electrodes formed on the main surfaces of the piezoelectric body. can do.

  The housing 20 includes a housing body 21 and a lid 22. The lid 22 seals the recess formed in the housing main body 21 and defines the internal space 20a. The material of the lid 22 is not particularly limited. The lid 22 can be formed of, for example, metal, alloy, ceramics, resin, or the like.

  The housing body 21 includes a flat bottom wall portion 21a, a frame portion 21b, and a support portion 21c. The bottom wall portion 21a has at least one corner portion. In the present embodiment, the bottom wall portion 21a is formed in a rectangular shape having four corner portions 21a1 to 21a4 as shown in FIGS. Each of the four corners 21a1 to 21a4 is formed in an R chamfer shape.

  The frame portion 21b is provided around the bottom wall portion 21a so as to surround the bottom wall portion 21a. The frame portion 21b protrudes from the bottom wall portion 21a in the normal direction of the bottom wall portion 21a. An opening is formed at the center of the frame portion 21b in plan view. The opening is formed in a rectangular shape having corners corresponding to the four corners of the bottom wall 21a. In the present embodiment, each corner of the opening is formed in an R chamfer shape. A lid 22 is joined to the tip of the frame portion 21b. In addition, joining of the frame part 21b and the lid | cover 22 may be performed using an adhesive agent, solder, etc., for example, and may be performed by welding by a laser.

  The support portion 21c is provided on the bottom wall portion 21a so as to protrude from the bottom wall portion 21a. Specifically, as the support portion 21c, a first support portion 21c1 provided at the first corner portion 21a1 and a second support portion 21c2 provided at the second corner portion 21a2 are formed. ing. The first support portion 21c1 and the second support portion 21c2 are arranged along the direction in which the short side of the bottom wall portion 21a extends. The electronic component main body 10 is supported by the first and second support portions 21c1 and 21c2. Here, the distance between the first and second support portions 21c1 and 21c2 and the distance between the support portions 21c1 and 21c2 and the frame portion 21 are the corner portions 21a2 and 21a4 formed in an R chamfer shape. This is a distance in a direction perpendicular to a straight line connecting the tip of the corner 21a2 and the tip of the corner 21a4 when the chamfer is not rounded. The support mode of the electronic component main body 10 is not particularly limited. The electronic component main body 10 may be supported by being joined to the first and second support portions 21c1 and 21c2 using, for example, an adhesive or solder.

  In addition, the bottom wall part 21a, the frame part 21b, and the support part 21c may be formed integrally, and may be formed separately. In the present embodiment, an example in which the bottom wall portion 21a, the frame portion 21b, and the support portion 21c are formed separately will be described. Specifically, in the present embodiment, the bottom wall portion 21a is made of a metal plate, and the support portion 21c and the frame portion 21b are made of a plating film. But the material of each of the bottom wall part 21a, the frame part 21b, and the support part 21c is not specifically limited. Each of the bottom wall portion 21a, the frame portion 21b, and the support portion 21c may be formed of a metal or an alloy, or may be formed of ceramics, resin, or the like.

  In the present embodiment, each of the first and second support portions 21c1 and 21c2 is formed such that the distance from the frame portion 21b monotonously decreases toward the distal end side of the first or second corner portions 21a1 and 21a2. Has been. Specifically, each of the first and second support portions 21c1 and 21c2 is formed in a polygonal shape, more specifically, a quadrilateral shape. The corner portions 23a and 23b of the first and second support portions 21c1 and 21c2 extend toward the first or second corner portions 21a1 and 21a2, and the angles of the corner portions 23a and 23b are as follows. It is smaller than the angle of the first or second corner portion 21a1, 21a2. For this reason, the distance between the side wall 24a1 of the first support portion 21c1 and the inner wall 21b1 of the frame portion 21b is narrowed toward the distal end side of the first corner portion 21a1. The distance between the side wall 24a2 of the first support portion 21c1 and the inner wall 21b2 of the frame portion 21b is narrowed toward the distal end side of the first corner portion 21a1. The distance between the side wall 24b1 of the second support portion 21c2 and the inner wall 21b3 of the frame portion 21b is narrowed toward the distal end side of the second corner portion 21a2. The distance between the side wall 24b2 of the second support portion 21c2 and the inner wall 21b2 of the frame portion 21b is narrowed toward the distal end side of the second corner portion 21a2. That is, the distance between the side wall of the support portion and the inner wall of the frame portion monotonously decreases as it approaches the corner portion of the frame portion, and takes the minimum value at the corner portion of the frame portion.

  Next, a method for manufacturing the electronic component 1 according to the present embodiment will be described with reference mainly to FIGS.

  First, a substrate 30 (see FIG. 4) is prepared. This board | substrate 30 is a board | substrate for comprising the bottom wall part 21a. Next, a resist mask 31 (see FIG. 5) that covers a part of the surface of the substrate 30 is formed on the substrate 30. Specifically, first, as shown in FIG. 4, a resist 32 is applied on the substrate 30. Thereafter, the resist 32 is exposed and developed, thereby forming a resist mask 31 that covers a portion of the surface of the substrate 30 excluding a portion where the frame portion 21b and the support portion 21c are to be formed.

  Next, as shown in FIG. 6, a layer 33 for forming the frame portion 21 b and the support portion 21 c is formed on the substrate 30 from the top of the resist mask 31 using the resist mask 31. The formation method of the layer 33 is not specifically limited. When the frame portion 21b and the support portion 21c are made of metal as in this embodiment, the layer 33 can be formed by plating, for example.

  Next, by peeling off the resist mask 31, the housing body 21 composed of the substrate 30 and the layer 33 is produced. Thereafter, the electronic component body 10 is joined to the housing body 21. Finally, the electronic component 1 can be completed by attaching the lid 22.

  By the way, like the piezoelectric device 100 of patent document 1, when the mutually opposing side wall of the support part 111c and the frame part 111b is parallel, after forming the support part 111c using a resist mask, a resist mask is formed. If it is going to peel off, a resist mask will be caught between the frame part 111b and the support part 111c, and the defect that the residue of a resist mask will remain in a housing | casing main body will generate | occur | produce easily.

  On the other hand, in the present embodiment, each of the first and second support portions 21c1 and 21c2 monotonously decreases in distance from the frame portion 21b toward the distal end side of the first or second corner portions 21a1 and 21a2. It is formed as follows. For this reason, when the resist mask 31 is peeled off, the resist mask 31 is hardly caught and remains between the frame portion 21b and the support portion 21c. Specifically, when the resist mask 31 is peeled from the short side between the corners 21a3 and 21a4 to the other short side, the distance between the support part 21c and the frame part 21b monotonously decreases. As the resist mask 31 is peeled off, the stress applied to the resist mask 31 gradually decreases. Further, the width of the resist mask 31 is the narrowest and the most fragile portion is located at a corner of the frame portion 21b which is a terminal portion in the peeling direction. For this reason, it is possible to suppress the resist mask 31 from being broken while the resist mask 31 is being peeled off, and the resist mask 31 from remaining on the frame portion 21b and the bottom wall portion 21a. Therefore, the defect that the residue of the resist mask 31 is hardly generated and the electronic component 1 can be easily manufactured.

  In the above embodiment, an example in which the support portion is formed in a quadrilateral shape has been described. However, the present invention is not limited to this configuration. For example, the support portion may have a polygonal shape or a triangular shape in plan view. When the support portion is formed in a shape having a corner portion, the corner portion of the support portion may be formed in a chamfered shape or an R chamfered shape.

  Moreover, the formation method of a support part is not limited to plating, For example, you may form a support part by thin film formation methods, such as CVD (Chemical Vapor Deposition) method and sputtering method.

DESCRIPTION OF SYMBOLS 1 ... Electronic component 10 ... Electronic component main body 20 ... Housing | casing 20a ... Internal space 21 ... Housing main body 21a ... Bottom wall part 21a1-21a4 ... Corner | angular part 21b ... Frame part 21b1-21b3 ... Inner wall 21c ... Support part 21c1 ... 1st Support portion 21c2 ... second support portion 22 ... lids 23a, 23b ... corner portions 24a1, 24a2, 24b1, 24b2 ... side wall 30 ... substrate 31 ... resist mask 32 ... resist 33 ... layer

Claims (3)

A housing having a bottom wall portion, a frame portion provided around the bottom wall portion, protruding from the bottom wall portion, and a support portion provided protruding above the bottom wall portion;
An electronic component body supported by the support part;
With
The bottom wall has at least one corner;
The said support part is an electronic component formed so that the distance from the said frame part may decrease monotonously toward the front end side of the said corner | angular part in the said corner | angular part.   The electronic component according to claim 1, wherein the support portion has a corner portion extending toward a corner portion of the bottom wall portion and having a smaller angle than the corner portion of the bottom wall portion. A method of manufacturing an electronic component according to claim 1 or 2,
Forming a resist mask that covers a portion of the surface of the substrate by applying and curing a resist on the substrate; and
Forming the frame portion and the support portion on the substrate using the resist mask; and
A step of peeling off the resist mask after the forming step;
An electronic component manufacturing method comprising:

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