JP5511487B2 - Semiconductor device - Google Patents

Description

The present invention, a semiconductor device of a resin sealed semiconductor device sealed with a sealing resin, mainly a semiconductor element mounting surface of the lead frame in a resin-sealed semiconductor equipment of the single-sided sealing type encapsulated with resin Related.

  2. Description of the Related Art Resin-encapsulated semiconductor devices that use a lead frame to electrically connect an electrode of a semiconductor element to an external wiring or the like are widely used. In such a semiconductor device, a lead frame generally includes a support part for mounting a semiconductor element, a suspension lead part for supporting the support part, and a lead terminal part for connecting a thin metal wire. One lead frame includes units corresponding to a plurality of semiconductor devices so that a plurality of semiconductor devices can be formed collectively. In many cases, the semiconductor device forming unit has a substantially rectangular shape, the suspension lead portion extends inward from the rectangular corner portion, and the lead terminal portion extends inward from the side portion.

FIG. 5 is an illustrative plan view showing an enlarged vicinity of a corner of a semiconductor device forming unit of such a conventional lead frame.
A support portion 51 is arranged at the center (in the direction of arrow G) of the semiconductor device forming unit, and a suspension lead portion 52 extends from the support portion 51 toward the corner portion. A substantially rectangular lead terminal portion 53 is disposed on the side portion of the semiconductor device forming unit. The peripheral portion side of the semiconductor device forming unit of the lead terminal portion 53 is connected to the frame portion 50. The longitudinal direction of the suspension lead portion 52 and the longitudinal direction of the lead terminal portion 53 form an angle of approximately 45 °.

  One lead frame has a structure in which a plurality of semiconductor device forming units having such a structure are arranged and coupled to the frame portion 50. In manufacturing a semiconductor device, the lead frame is sealed with a sealing resin so that the bottom surface of the lead terminal portion 53 is exposed. Thereafter, one unit of the lead frame is cut along a cutting line M indicated by a broken line, and its end face is substantially flush with the side face of the sealing resin.

In order to reduce the size of the semiconductor device, the length of the lead terminal portion 53 is preferably as short as possible. However, since the lead terminal portion 53 also serves as a lead for connection with an external wiring board, a certain length (area) is required. For these reasons, the lead terminal portion 53 is formed with a predetermined minimum length L1.
In addition, the distance between the closest portion of the suspension lead portion 52 and the lead terminal portion 53A adjacent to the suspension lead portion 52 needs to be wide in order to ensure the insulation reliability between them. For this purpose, it is preferable to be narrow. For these reasons, the distance between the closest portions is designed to be a predetermined minimum distance L2.

However, in the lead frame having such a conventional structure, when the semiconductor device is formed with the predetermined length L1 and the predetermined distance L2 secured, the size of the semiconductor device in the planar direction increases, and the mounting area increases. There was a problem of becoming.
An object of the present invention has the lead terminal portion length required for external connections (area), and to provide a semiconductor equipment that insulation reliability is ensured between the hanging lead portion and the lead terminal portion That is.

Another object of the present invention is to provide a small semiconductor equipment of small footprint size in the plane direction.

In order to achieve the above object, an invention according to claim 1 is directed to a semiconductor element having electrodes on its surface, a plurality of lead terminal portions for electrical connection, and extending obliquely with respect to the lead terminal portion. A lead frame having a suspension lead portion for supporting a support portion on which the semiconductor element is mounted, a metal thin wire connecting the lead terminal portion and the electrode of the semiconductor element, the semiconductor element, and the lead frame And a sealing resin that seals the thin metal wires so that each part of the plurality of lead terminal portions is exposed, and the plurality of lead terminal portions avoid interference with the suspension lead portions. Including a chamfered lead terminal portion having a chamfered portion substantially along the suspension lead portion at the tip, wherein the support portion is wider than the suspension lead portion, and the lead terminal portion is a wide portion And said The wide terminal portion includes at least a plurality of narrow portions alternately having a width on the upper surface of the card terminal portion narrower than the wide portion, and a width on the bottom surface of the lead terminal portion being the same as the wide portion, from the tip thereof. The semiconductor device is characterized in that the width of the lead terminal portion decreases from the top surface to the bottom surface of the lead terminal portion .

The lead frame has a plurality of lead terminal portions for electrical connection and a suspension lead portion that extends obliquely with respect to the lead terminal portion and supports a support portion on which a semiconductor element is mounted. and may be, the plurality of lead terminals unit includes a chamfer-shaped lead terminal portion having a distal end a chamfered portion formed substantially along the hanging lead portion so as to avoid interference with the hanging lead portion, wherein The support portion may be wider than the suspension lead portion .

According to the first aspect of the present invention, since the lead terminal portion is chamfered along the suspension lead portion so as to avoid interference with the suspension lead portion, the lead terminal portion is packed on the suspension lead portion side accordingly. Even if it arrange | positions, the space | interval more than fixed can be ensured. That is, in a lead frame having a conventional structure, the lead terminal portion has a corner portion that protrudes toward the suspension lead portion, so that interference between the tip of the corner portion and the suspension lead portion is avoided, and the distance between them is increased. In order to ensure a certain level or more, the lead terminal portion has to be disposed substantially on the peripheral edge side. For this reason, the lead frame of the semiconductor device forming unit is large, and the size of the semiconductor device using the lead frame is large.

  On the other hand, in the present invention, the lead terminal portion has a chamfered portion at the tip, and this portion faces the suspension lead portion, so that the suspension lead portion can be disposed substantially inside. . Therefore, the size of the semiconductor device forming unit of the lead frame can be reduced, the size of the semiconductor device using the lead frame can be reduced, and the mounting area can be reduced.

Chamfer, hanging is preferred Rukoto consists of lead portions parallel straight sides on the side of the (C chamfer), as long as being chamfered to avoid interference with hanging lead portion, similar There is an effect. For example, the chamfered portion may be configured with rounded edges (e.g., R-chamfering). Further, the chamfered portion may be a hypotenuse that covers only a part of the lead terminal portion in the width direction, or may be a hypotenuse that covers the entire width as recited in claim 7.
According to a second aspect of the present invention, the outer end surface of the lead terminal portion may be substantially flush with the side surface of the sealing resin.
The lead frame may be symmetrical up and down as in claim 3 and may be symmetrical in right and left as in claim 4.

As claimed in claim 5, wherein said chamfer-shaped lead terminal portion is preferably disposed adjacent to the hanging lead portion.
Further, it is preferable according to claim 6 as described, only the lead terminal portion adjacent to the hanging lead portion is chamfered Rikatachi lead terminal. In this case, there is no lead terminal portion that is extremely shortened by the chamfered portion. In a semiconductor device using such a lead frame, it is possible to suitably perform connection of metal thin wires and connection to an external wiring board for all lead terminal portions.

In this case, when the chamfered portion is a hypotenuse extending over the entire width of the lead terminal portion, the size of the semiconductor device forming unit of the lead frame can be minimized, and the size of the semiconductor device using this can be reduced in the planar direction. Can be the smallest.
According to an eighth aspect of the present invention, the area of the support element side surface of the support portion may be smaller than the area of the support element side surface of the semiconductor element.
As described in claim 9, the support portion may have an X-shape.
According to a tenth aspect of the present invention, the plurality of lead terminal portions may be formed using a lead frame provided with a frame portion having a side. The portion corresponding to the lead terminal portion may extend perpendicularly to the side of the frame portion.
In the planar view, the lead terminal portion has a longitudinal shape, and the suspension lead portion is inclined at an angle of 45 ° with respect to the longitudinal direction of the lead terminal portion. You may be in contact.
As described in claim 12, a stepped portion may be formed in the middle of the suspension lead portion. In this case, as described in claim 13, by the stepped portion, the support portion may be upset at a position higher than the lead terminal portion. The sealing resin may be present on the bottom side of the semiconductor device .

It is a schematic plan view showing a semiconductor device forming units rie de frame. FIG. 2 is an illustrative plan view showing an enlarged vicinity of a corner of a semiconductor device forming unit of the lead frame of FIG. 1. FIG. 3 is a cross-sectional view taken along the line CC of FIG. 2 and a cross-sectional view taken along the line DD. FIG. 2 is a schematic cross-sectional view of a resin-encapsulated semiconductor device formed using the lead frame of FIG. 1. It is an illustrative top view which expands and shows the corner | angular part vicinity of the conventional lead frame.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Figure 1 is a schematic plan view showing a semiconductor device forming units rie de frame 1. One semiconductor device forming unit has a square shape and is symmetrical vertically and horizontally. For this reason, the reference number is given only to the upper left quarter, but the other parts are the same. The semiconductor device forming unit includes a frame portion 2 arranged at the peripheral portion, a support portion 4 arranged at the center portion, a suspension lead portion 3 connecting the support portion 4 and the corner portion of the frame portion 2, and the frame portion 2. A lead terminal portion 5 is provided on the side portion. The frame 2 is usually provided with holes (not shown) used for positioning and fixing the lead frame 1 in the semiconductor device manufacturing process.

The support portion 4 extends diagonally from the corner portion of the frame portion 2 via the suspension lead portion 3. That is, the support part 4 has an X-shape. The support part 4 is wider than the suspension lead part 3. A stepped portion 3 a is formed in the middle of the suspension lead portion 3, and the support portion 4 is arranged upset at a higher position than the frame portion 2.
The lead terminal portion 5 extends perpendicularly to the side from the side portion of the frame portion 2 toward the center. The suspension lead portion 3 is inclined with respect to the longitudinal direction of the lead terminal portion 5 at an angle of about 45 ° in plan view. The lengths of the lead terminal portions 5 are the same.

A plurality of semiconductor device forming units having such a structure are densely arranged to constitute one lead frame.
At the time of manufacturing the semiconductor device, a semiconductor element is die-bonded on the support portion 4, and the electrode of the semiconductor element and the lead terminal portion 5 are connected by a thin metal wire. Thereafter, the semiconductor element, the support part 4, a part of the suspension lead part 3, and a part of the lead terminal part 5 are covered with the sealing resin, and the lead terminal part 5 and the suspension lead part at the position of the cutting line E indicated by a broken line. 3 is cut. The region covered with the sealing resin is a region surrounded by the cutting line E.

FIG. 2 is an illustrative plan view showing an enlarged vicinity of a corner portion of a semiconductor device forming unit of the lead frame of FIG.
The shape of the leading end portion of the lead terminal portion 5 on the center side of the lead frame has a right angle in the lead terminal portion 5B not adjacent to the suspension lead portion 3. On the other hand, the lead terminal portion 5A adjacent to the suspension lead portion 3 is opposed by a straight side substantially parallel to the side of the suspension lead portion 3, and this side extends over the entire width of the lead terminal portion 5A. Is formed. That is, the lead terminal portion 5 </ b> A is a chamfered lead terminal portion having a chamfered portion formed substantially along the suspension lead portion 3 at the tip so as to avoid interference with the suspension lead portion 3 .

A step is provided on the side of the lead terminal portion 5, and the lead terminal portion 5 has a slightly wide portion and a slightly narrow portion. Due to such a shape, the lead terminal portion 5 is difficult to come off to the peripheral edge side.
3 is a cross-sectional view taken along the line CC of FIG. 2 and a cross-sectional view taken along the line DD.
A CC cut line cross section, which is a cross section of the wide portion of the lead terminal portion 5, shows an inverted trapezoidal shape in which the length of the upper base is t1 and the length of the lower base is t2 (t1> t2) ( FIG. 3 (a)). A DD cut line section, which is a section of the narrow portion of the lead terminal portion 5, shows a rectangular shape having a width of t2 (FIG. 3B). In other words, the lead terminal portion 5 has a portion having a width t1 and a portion t2 on the top surface, but the width is constant at t2 on the bottom surface.

  After covering with the sealing resin, the sealing resin is filled up to a position F flush with the bottom surface of the lead terminal portion 5, and the bottom surface of the lead terminal portion 5 is exposed to form an external connection terminal portion (outer lead portion). . In the portion having the shape of the C-C section line (FIG. 3A), the lead terminal portion 5 is wider inside the sealing resin and has a tapered surface facing the bottom surface side of the sealing resin. Therefore, the lead terminal portion 5 is difficult to come down from the sealing resin.

A description will be given with reference to FIG. 2 again.
Since the lead terminal portion 5 also serves as a lead for connection to an external wiring board or the like, the exposed area of the lead terminal portion 5 from the sealing resin needs to be a certain size or larger. For this reason, it is necessary to ensure that the lead terminal portion 5 after cutting has a certain length or more. On the other hand, in order to reduce the size of the semiconductor device, the length of the lead terminal portion 5 is preferably as short as possible. For these reasons, the lead terminal portion 5 is formed with a predetermined minimum length L1.

The distance between the nearest part of the suspension lead part 3 and the lead terminal part 5A adjacent to the suspension lead part 3 needs to be wide in order to ensure the insulation reliability, but is narrow in order to reduce the size of the semiconductor device. It is preferable. For these reasons, the distance between the closest portions is designed to be a predetermined minimum distance L2.
When the lead terminal portion 53 having a conventional shape is used and the lead terminal portion 53 is set to a predetermined length L1 and the distance between the closest portions is set to a predetermined distance L2, the lead terminal portion 53 is compared with the case of the present embodiment. It must be arranged on the more peripheral side. This is because the corner portion 54 of the lead terminal portion 53 having the conventional shape protrudes toward the suspended lead portion 52 at the closest portion, so that when the front end A1 is located at the same position as the front end B1 in the present embodiment, This is because the interval is shorter than the predetermined interval L2. Therefore, the front end B1 in the present embodiment can be disposed on the inner side by the distance L3 as compared with the front end A1 in the prior art. Since the lengths of the lead terminal portions 5 and 53 are all the predetermined length L1, the rear end B2 in the present embodiment is inside the rear end A2 in the conventional technique. That is, such a lead frame 1 can make a semiconductor device formation unit small.

Further, since the sealing resin is formed on substantially the same plane as the rear ends A2 and B2, the semiconductor device using the lead frame of this embodiment can be reduced in size by the distance L3 on one side of one side. It can be reduced by a distance of 2 × L3 per side. Therefore, such a semiconductor device can reduce the mounting area.
FIG. 4 is a schematic cross-sectional view of a semiconductor device formed using such a lead frame 1. Components of the lead frame 1 are denoted by the same reference numerals as those in FIG.

  A rectangular parallelepiped semiconductor element 6 is die-bonded on the support 4. The support portion 4 has an X shape (see FIG. 1), and the area of the upper surface of the support portion 4 is smaller than the bottom area of the semiconductor element 6. The electrode formed on the upper surface of the semiconductor element 6 and the lead terminal portion 5 are electrically connected by a thin metal wire 7. The semiconductor element 6, the fine metal wire 7, and a part of the lead frame 1 are covered with a sealing resin 8. On the bottom surface of the semiconductor device, the lead terminal portion 5 and the sealing resin 8 are formed flush with each other, and the bottom surface of the lead terminal portion 5 is exposed. The sealing resin 8 is present below the support portion 4 with a thickness corresponding to the upset. Further, the outer end face of the lead terminal portion 5 is substantially flush with the side face of the sealing resin 8.

The semiconductor device having such a structure can be surface-mounted on a wiring board or the like using the lead terminal portion 5 exposed on the bottom as an external terminal. Moreover, since only the single side | surface side of the lead terminal part 5 is sealed with the sealing resin 8, the thickness of a semiconductor device can be made thin and it can mount suitably in various thin apparatuses.
Since the sealing resin 8 exists also under the support part 4, the support part 4, the suspension lead part 3, and the sealing resin 8 are firmly bonded. Since the area of the support portion 4 is smaller than the bottom area of the semiconductor element 6, the semiconductor element 6 has a portion in direct contact with the sealing resin 8 on the bottom surface. Thereby, the peeling phenomenon which arises in the interface between the support part 4 and the semiconductor element 6 can be reduced.

  The above is an example of an embodiment of the present invention, and various design changes can be made within the scope of the matters described in the claims.

DESCRIPTION OF SYMBOLS 1 Lead frame 3 Suspended lead part 4 Support part 5 Lead terminal part 6 Semiconductor element 7 Metal fine wire 8 Sealing resin

Claims (13)

A semiconductor element having an electrode on the surface;
A lead frame having a plurality of lead terminal portions for electrical connection and a suspension lead portion extending obliquely with respect to the lead terminal portion and supporting a support portion on which the semiconductor element is mounted;
A fine metal wire connecting the lead terminal portion and the electrode of the semiconductor element;
A sealing resin that seals the semiconductor element, the lead frame, and the fine metal wires so that each part of the plurality of lead terminal portions is exposed;
The plurality of lead terminal portions include a chamfered lead terminal portion having a chamfered portion substantially along the suspension lead portion at the tip so as to avoid interference with the suspension lead portion,
The support part is wider than the suspension lead part ,
The lead terminal portion includes a wide portion and a narrow portion whose width on the top surface of the lead terminal portion is narrower than that of the wide portion and whose width on the bottom surface of the lead terminal portion is the same as that of the wide portion from the tip. A semiconductor device comprising at least a plurality of pairs alternately, wherein the width of the wide portion decreases from the top surface to the bottom surface of the lead terminal portion .   2. The semiconductor device according to claim 1, wherein an end face on the outer side of the lead terminal portion is substantially flush with a side surface of the sealing resin.   3. The semiconductor device according to claim 1, wherein the lead frame is vertically symmetrical.   4. The semiconductor device according to claim 1, wherein the lead frame is symmetrical to the left and right.   The semiconductor device according to claim 1, wherein the chamfered lead terminal portion is disposed adjacent to the suspension lead portion.   6. The semiconductor device according to claim 5, wherein, of the plurality of lead terminal portions, only the lead terminal portion adjacent to the suspension lead portion is the chamfered lead terminal portion.   7. The semiconductor device according to claim 1, wherein the chamfered portion is a hypotenuse extending over the entire width in the width direction of the chamfered lead terminal portion in which the chamfered portion is formed.   8. The semiconductor device according to claim 1, wherein an area of the surface on the semiconductor element side of the support portion is smaller than an area of the surface on the support portion side of the semiconductor element.   The semiconductor device according to claim 1, wherein the support portion has an X-shape.   The plurality of lead terminal portions are formed using a lead frame having a frame portion having a side, and in the lead frame, a portion corresponding to the plurality of lead terminal portions is the portion of the frame portion. The semiconductor device according to claim 1, wherein the semiconductor device extends perpendicularly to the side.   In plan view, the lead terminal portion has a longitudinal shape, and the suspension lead portion is obliquely crossed at an angle of 45 ° with respect to the longitudinal direction of the lead terminal portion. The semiconductor device according to claim 1.   The semiconductor device according to claim 1, wherein a step portion is formed in the middle of the suspension lead portion.   The step portion is configured so that the support portion is set higher than the lead terminal portion, and the sealing resin exists on the bottom surface side of the semiconductor device with respect to the support portion. The semiconductor device according to claim 12, characterized in that:

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