JP5516536B2 - Manufacturing method of electronic component module - Google Patents

Description

  The present invention relates to a method of manufacturing an electronic component module in which an electronic component is mounted on a laminate formed by laminating a plurality of ceramic green sheets.

  2. Description of the Related Art Conventionally, in an electronic component module in which an electronic component is mounted on a multilayer substrate, a structure using a side surface of a metal-plated through hole as an electrode is known (see, for example, Patent Document 1).

  In the structure shown in Patent Document 1, in the final process, a mother sheet on which electronic components are mounted is divided into a plurality of chips to form electronic component modules. At this time, the mother sheet is obtained by laminating a plurality of ceramic green sheets and then firing, and not by cutting with a dicer, but by cutting a groove when in a green sheet state before firing, and after firing It is easy to divide around the groove. The through hole is provided at the boundary position of each chip and is exposed to the side surface of the chip after division.

JP 2005-93846 A

  Since the electronic component module is mounted on the upper surface, when the module size is small, the electronic component module cannot be handled by suction when the electronic component module is handled in the manufacturing process of the electronic device manufacturer. Therefore, in order to enable handling by suction, the top surface of the electronic component module may be covered with an insulator such as resin and the top surface may be flattened.

  However, when a through hole is provided at the boundary position as described above, an insulator such as a resin is filled in the through hole. Since insulators such as resin are hard, if the through-holes are filled with insulators and the like in this way, when the mother sheet is divided into chips, even if the insulator is cut with a dicer or the like, the through-holes Since the groove is not cut up to the insulator filled in, it cannot be cut cleanly. For example, the insulating material adheres only to the side wall of one of the chips after the division, and the insulating material does not adhere to the side wall of the other chip, and the uniformity of each chip is lost.

  Accordingly, the present invention provides an electronic component module that can divide a mother sheet into chips even when an insulator such as a resin is filled when a through hole is provided on a side surface of the chip, and a method of manufacturing the same. With the goal.

The electronic component module of the present invention is manufactured by the following steps.
(1) Step of forming a conductive member so as to be electrically conductive in the thickness direction of the ceramic green sheet (2) Step of forming a laminate by laminating a plurality of ceramic green sheets (3) The conductivity of the laminate A step of forming a through hole in the thickness direction at a position including the portion where the conductive member is formed. (4) a step of forming a first dividing groove on the lower surface of the laminate. (5) a step of firing the laminate. 6) Step of filling the through hole with a solid material (7) Step of mounting an electronic component on the upper surface of the laminate (8) The property of curing on the surface of the laminate at a temperature higher than the melting point of the solid material (9) The step of thermally curing the insulating resin and eluting or volatilizing the solid material In this way, the heat is applied before forming the thermosetting resin on the surface of the laminate. Curability The solid material having a melting point lower than the curing temperature of the fat is filled in the through-hole (through-hole). Examples of such a solid material include a low melting point material such as wax and wax material. Since the through hole is filled with a solid material, the resin does not flow into the through hole. When the thermosetting resin is cured, the solid material is eluted or volatilized, and the through hole becomes a cavity. Therefore, when the mother stacked body is broken for each chip, the end face electrode is not exposed at the side wall of the through hole, and the insulator is not attached to the side wall of one of the divided chips. However, the solid material does not need to be completely lost, and even if it remains to some extent, the uniformity from chip to chip is maintained.

  Moreover, the aspect which makes melting | fusing point of a solid material higher than the curing temperature of a thermosetting resin is also possible. In particular, if the melting point of the solid material is lower than the melting point of the lead-free solder used for mounting, the solid material is eluted or volatilized at the time of reflow, so that the through hole becomes a cavity. Therefore, also in this case, when the mother laminated body is broken for each chip, the end face electrode is not exposed to the side wall of the through hole, and the insulator is not attached to the side wall of one of the divided chips. . Also in this case, the solid material does not need to be completely lost, and even if it remains to some extent, the uniformity from chip to chip is maintained.

  Even if the melting point of the solid material is higher than the melting point of the lead-free solder used for mounting, for example, the remaining solid material is cut with a laser to break the mother laminate uniformly for each chip. It is also possible.

  Further, before the step of firing the laminated body, a third dividing groove different from the second dividing groove is formed on a line connecting the centers of the through holes on the ceramic green sheet on the upper surface side of the laminated body. It is desirable to perform the forming step. In this case, since a break groove is formed on the ceramic green sheet of the laminate in addition to the resin, breakage is further facilitated.

  In addition, you may form a through-hole for every sheet | seat before laminating | stacking a ceramic green sheet.

  According to the present invention, when the through hole is provided on the side surface of the chip, the mother sheet can be divided for each chip even if an insulator such as a resin is filled.

It is a top view of an electronic component module. FIG. 2A is an AA cross-sectional view of the electronic component module, and FIG. 2B is a BB cross-sectional view. It is a figure which shows the manufacturing process of an electronic component module. 4A is a top view of the electronic component module after the break, and FIG. 4B is a cross-sectional view taken along the line AA. It is sectional drawing of the electronic component module which concerns on a 3rd example.

  FIG. 1 is a top view of an electronic component module according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the electronic component module (FIG. 2A is a cross-sectional view along AA, FIG. 2B). (BB sectional view). 2A and 2B, the upper side of the paper is the upper surface side of the electronic component module, and the lower side of the paper is the lower surface side of the electronic component module.

  The electronic component module is obtained by mounting an electronic component such as an IC or a capacitor on the uppermost surface of a laminate formed by laminating a plurality of ceramic green sheets. The laminated body includes a magnetic body (ferrite) layer. For example, a DC-DC converter using the inductor as a choke coil is configured by providing a coil between laminated sheets and connecting the inductor in the laminating direction. Can be realized.

  The electronic component module shown in FIG. 1 and FIG. 2 shows a mother laminated body before breaking. The upper surface of the mother laminated body is covered with an insulator 31. The mother laminated body is broken into chips having a predetermined size indicated by broken lines in the figure. On the upper surface of the mother laminate, a rectangular break groove 51 (second dividing groove in the present invention) is formed by dicing along the broken line shown in FIG. 1 (a line connecting the centers of through-holes described later). Is formed. Break groove 51 is formed by cutting only insulator 31.

  Further, on the lower surface of the mother laminated body, as shown in FIG. 2A, along the broken line shown in FIG. Groove) is formed. Further, as shown in FIG. 2B, on the upper surface (on the ceramic green sheet) of the mother laminated body, along the broken line shown in FIG. (Dividing groove) is formed. The V-shaped break groove 55 and break groove 57 are provided in advance before firing the mother laminate. The mother laminated body is broken to each chip by bending the V-shaped break groove 55 outward and the rectangular break groove 51 and V-shaped break groove 57 inside.

  In FIGS. 1 and 2, for the sake of explanation, the mother stacked body before breaking is shown for two adjacent chips, but in reality, a larger number of chips are arranged.

  A circuit electrode 22 is formed on a part of the ceramic green sheets constituting the laminate, and an electronic component 23 is mounted on the circuit electrode 22.

  Moreover, as shown in a cross-sectional view (AA cross-sectional view) in FIG. 2A, terminal electrodes 21 (input electrodes, output electrodes, and ground electrodes) are formed on the bottom surface of the multilayer body. This terminal electrode 21 becomes a mounting electrode for connecting to a land electrode or the like on the mounting board side on which the electronic component module is mounted in the product manufacturing process of the electronic device after the electronic component module is shipped.

  The terminal electrode 21 and the circuit electrode 22 are electrically connected through the end face electrode 41. The end surface electrode 41 is exposed from the side wall of the through hole by cutting the side surface of the via hole provided at the position serving as the boundary between the chips. Although omitted in the present embodiment, an internal wiring may be formed on the ceramic green sheet disposed in the inner layer and electrically connected via the internal wiring and the end face electrode 41.

  The upper surface of the mother laminated body is covered with an insulator 31. The insulator 31 has a function of protecting the electronic component module and flattening the upper surface of the electronic component module by being applied after the mother laminate is fired. The insulator 31 is a thermosetting resin such as a phenol resin and has fluidity during the coating process, but is cured at a predetermined temperature (for example, about 100 ° C.).

  Here, if the insulator 31 is filled in the through hole, the insulator 31 is attached only to the through hole of one of the chips after the break, and the insulator 31 is attached to the through hole of the other chip. There is a possibility that it will not adhere. In this case, the uniformity from chip to chip is lost.

  Therefore, in the electronic component module according to the present embodiment, the solid material 52 is filled in the through hole before the insulator 31 is applied, so that the insulator 31 does not flow into the through hole. The solid material 52 is a low-melting-point material such as wax or wax material (having a melting point of less than 100 ° C. lower than the curing temperature of the insulator 31).

  When the insulator 31 is thermally cured, the solid material 52 is eluted or volatilized, and the through hole becomes a cavity. Therefore, when the mother laminated body is broken on each chip by bending the V-shaped break groove 55 outward and the rectangular break groove 51 and V-shaped break groove 57 inside, FIG. As shown in the top view of FIG. 4A and the cross-sectional view of FIG. 4B, the end surface electrode is exposed on the side wall of the through hole, and the insulator is attached to the side wall of one of the chips after the division. That is no longer true. Note that the solid material 52 does not need to be completely lost, and even if it remains to some extent, the uniformity from chip to chip is maintained. Moreover, since the reflow furnace at the time of mounting is still higher temperature (for example, about 250 ° C.), even if the solid material 52 remains, it is eluted or volatilized at the time of reflow.

  Next, the manufacturing process of the electronic component module will be described. FIG. 3 is a diagram illustrating a manufacturing process of the electronic component module. The electronic component module is formed as follows.

  First, as shown in FIG. 3A, through holes are formed in each ceramic green sheet of the electronic component module with a punch or the like.

  Next, as shown in FIG. 3 (B), an alloy (conductive paste) containing Ag or the like is filled in the opened through hole. This filled conductive paste later becomes the end face electrode 41. Note that the terminal electrode 21, the circuit electrode 22, and the internal wiring are formed after the step shown in FIG. 3B or before the lamination of the ceramic green sheets. However, the electrodes exposed on the uppermost surface and the lowermost surface can also be formed after lamination.

  Next, after each ceramic green sheet is laminated and temporarily press-bonded, as shown in FIG. 3 (C), the ceramic green sheets are further punched in a direction (orthogonal direction) different from the rectangular punch hole previously opened. Open a rectangular hole. This rectangular hole becomes a through hole.

  Then, as shown in FIG. 3D, a V-shaped break groove 57 is formed along a line connecting the centers of the through holes. The step of forming the V-shaped break groove 57 is not essential, but the V-shaped break groove 57 is formed on the ceramic green sheet of the laminate in addition to the insulator 31. Since a break groove is formed, it becomes easier to break. The break groove 57 is not limited to the V-shape, and may be other shapes such as a rectangular shape. Further, the formation of the through holes in FIG. 3A, the filling of the conductive paste in FIG. 3B, and the formation of the through holes in FIG. 3C may be performed for each sheet before the ceramic green sheets are laminated. Good.

  Then, as shown in FIG. 3E, the mother laminate is fired. Thereby, the fired mother laminated body before a break is obtained.

  The electrode surface of the fired mother laminate is plated. The plating process is performed by immersing the mother laminate in a plating solution and swinging.

  Then, as shown in FIG. 3 (F), after electronic parts such as ICs and capacitors are mounted, as shown in FIG. 3 (G), the through-hole is filled with a solid material 52, and thereafter FIG. The resin (insulator 31) is applied as shown in FIG.

  Further, as shown in FIG. 3 (I), the insulator 31 is broken by a dicing process along a line connecting the centers of the through holes (the same line as the V-shaped break groove 57 described above). A groove 51 is formed.

  Finally, as shown in FIG. 3J, the insulator 31 is thermally cured, and at this time, the solid material 52 is eluted or volatilized. However, the break groove 51 may be formed after the insulator 31 is thermally cured.

  The electronic component module thus manufactured is broken for each chip at the shipping destination or the like, and the end face electrode 41 is exposed at a part of the side wall of the through hole.

  The thermal curing does not need to be performed before the break. For example, the insulator 31 may be temporarily cured at a relatively low temperature after being applied, and may be finally cured at a relatively high temperature after the break. In this case, the solid material 52 may be a material having a melting point lower than the pre-curing temperature, or may be a material having a melting point equal to or higher than the pre-curing temperature and lower than the main curing temperature. When a material having a melting point not lower than the temperature of the pre-curing and lower than the temperature of the main curing is used, the solid material 52 remains filled in the through hole at the time of the break, and the solid material only in the through hole of one of the chips after the break There is also a possibility that the solid material 52 does not adhere to the through hole of the other chip due to adhesion of the other chip 52. However, since elution or volatilization occurs during the main curing, the end face electrode is finally exposed on the side wall of the through hole. The solid material 52 does not adhere to the side wall of one of the divided chips.

  In the above description, an example in which the melting point of the solid material 52 is lower than the curing temperature of the insulator 31 is shown. However, the solid material 52 is higher than the curing temperature of the insulator 31 and is mounted when an electronic component module is mounted. It is also possible to use a material having a melting point (for example, about 100 to 240 ° C.) lower than the melting point of solder (reflow furnace temperature).

  In this case, the solid material 52 does not disappear when the insulator 31 is thermally cured, and the solid material 52 remains filled in the through hole during the break. Therefore, there is a possibility that the solid material 52 adheres only to the through hole of one of the chips after the break and the solid material 52 does not adhere to the through hole of the other chip. However, elution or volatilization occurs during reflow. Therefore, the end face electrode is finally exposed on the side wall of the through hole, and the solid material 52 does not adhere to the side wall of one of the divided chips.

  Furthermore, it is possible to use a material having a melting point of the solid material 52 higher than that of the mounting solder (reflow furnace temperature) (for example, 250 ° C. or higher). In this case, for example, as shown in FIG. 5, by adding a process such as cutting the solid material 52 remaining in the through hole with a laser to form a cut 5352, the mother laminated body is made uniform for each chip. It is possible to break. The cuts 53 can also be formed from the upper surface side of the laminate (overlapping with the break grooves 51).

  In the present embodiment, the rectangular end face electrode 41 and the through hole are exemplified, but other shapes such as a semicircular shape may be used.

DESCRIPTION OF SYMBOLS 21 ... Terminal electrode 22 ... Circuit electrode 23 ... Electronic component 31 ... Insulator 41 ... End surface electrode 51, 52, 57 ... Breaking groove 52 ... Solid material

Claims (4)

Forming a conductive member so as to be electrically conductive in the thickness direction of the ceramic green sheet;
Laminating a plurality of ceramic green sheets to form a laminate;
Forming a through hole in the thickness direction at a position including the portion where the conductive member of the laminate is formed;
Forming a first dividing groove on the lower surface of the laminate so as to straddle the through hole ;
Firing the laminate;
Filling the through hole with a solid material;
Mounting electronic components on the top surface of the laminate;
Forming an insulating resin having a property of curing at a temperature higher than the melting point of the solid material on the surface of the laminate;
Elution or volatilization of the solid material while thermosetting the insulating resin;
Dividing the laminate on the basis of the first dividing groove;
An electronic component module manufacturing method comprising: Forming a conductive member so as to be electrically conductive in the thickness direction of the ceramic green sheet;
Forming a through hole in the thickness direction at a position including a portion where the conductive member of the ceramic green sheet is formed;
A step of laminating a plurality of ceramic green sheets so that the through hole matches the thickness direction, and forming a laminate;
Forming a first dividing groove on the lower surface of the laminate so as to straddle the through hole ;
Firing the laminate;
Filling the through hole with a solid material;
Mounting electronic components on the top surface of the laminate;
Forming an insulating resin having a property of curing at a temperature higher than the melting point of the solid material on the surface of the laminate;
Elution or volatilization of the solid material while thermosetting the insulating resin;
Dividing the laminate on the basis of the first dividing groove;
An electronic component module manufacturing method comprising: Cutting only the insulating resin on the line connecting the centers of the through holes to form a second dividing groove;
Dividing the laminate on the basis of the first and second dividing grooves;
The manufacturing method of the electronic component module of Claim 1 or Claim 2 characterized by the above-mentioned. Before the step of firing the laminate, a step of forming a third dividing groove on a line connecting the centers of the through holes on the ceramic green sheet on the upper surface side of the laminate is performed. The manufacturing method of the electronic component module in any one of Claim 1 thru | or 3 .

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