JP5520476B2 - Inverter unit and inverter - Google Patents

Description

  The present invention relates to an inverter unit and an inverter that can be applied as, for example, a high-frequency resonant inverter.

  Conventionally, as a high-frequency resonant inverter for electric power, when a main circuit is constituted by a flat semiconductor element such as a thyristor, there is one constituted by a unit called “semiconductor stack”. For example, as shown in FIG. 10, five water-cooled fins 21 and four flat semiconductor elements 20 are alternately arranged, and end plates 22 are arranged at both ends, respectively. A disc spring 23 is disposed between the water cooling fins 21, one end of each of the two fastening bolts 24 is connected to one end plate 22, and the other end of the fastening bolt 24 is connected to the other end plate 22 and the pressing plate. 29, the male screw portion at the tip of the fastening bolt 24 projecting from the pressing plate 29 by inserting the coil spring 30 between the end plate 22 and the pressing plate 29 and passing through the protruding end portion of each fastening bolt 24. The nut 25 is screwed into the nut.

  In this way, a constant axial pressure is applied to the four semiconductor elements 20 by the disc spring 23. A DC positive bus (P) 26, a DC negative bus (N) 27, and an AC terminal (AC) 28 are connected to desired electrodes of the semiconductor element 20.

  11 prepares the semiconductor stack S of FIG. 10 for the U-phase, V-phase, and W-phase, and these stacks SU, SV, SW are juxtaposed horizontally and vertically in the same space. A DC positive side bus (P) 26 and a DC negative side bus (N) 27 are arranged in the vertical direction on the side of SU, SV, SW, respectively, and the P terminal of each stack SU, SV, SW, N The terminal, the DC positive bus 26 and the DC negative bus 27 are connected by an electric wire.

  In Patent Document 1, a plurality of switching elements, cooling fins arranged on both sides of the switching elements, flywheel diodes paired with the switching elements, and both sides of the flywheel diodes are disclosed. Power conversion of a configuration in which the cooling fins are configured as separate stacks, and the water cooling fins arranged on the same side of the switching element and the flywheel diode paired with the switching element are connected in a series water system An apparatus is described.

Patent Document 2 includes a water-cooled reactor connected in series to a semiconductor element such as a thyristor module cooled by a water-cooled heat sink, and a series circuit of a water-cooled resistor and a capacitor connected in parallel to the semiconductor element. In a water-cooled semiconductor power converter equipped with a voltage divider circuit, it is divided into a cooling system that passes water to a water-cooled heat sink and a water-cooled reactor, and a cooling system that passes water to a water-cooled resistor. A water-cooling type semiconductor power conversion device in which a sensor for measuring the temperature of cooling water is independently provided is described.
JP 2006-158128 A JP-A-5-168238

  In the conventional semiconductor stack described above, the DC positive side bus 26 and the DC negative side bus 27 are physically separated as shown in FIG. 10, and in order to reduce the distance between them, outside the semiconductor stack, that is, the main bus It can be handled only on the primary or secondary side of the circuit.

  In addition, in the configuration as shown in FIG. 11, it is difficult to physically overlap the semiconductor stacks SU, SV, SW with the DC positive bus 26 and the DC negative bus 27. It is difficult to reduce the inductance.

  Further, in a high-frequency inverter device having a switching frequency of an inverter element of several hundred Hz or more, which is a conventional technique, it is indispensable to take measures against the influence of magnetic flux generated by the high-frequency current of the main circuit. In order to avoid overheating, measures such as securing a separation distance between the main circuit and the structure, or using a non-magnetic material such as stainless steel cannot be avoided, and the size and cost of the apparatus cannot be avoided.

  The present invention has been made to solve the above-described problems, and its purpose is to simplify the structure, to reduce the size of the entire apparatus, and to reduce the influence of magnetic flux generated in the inverter main circuit. It is to provide a unit and an inverter.

  In order to achieve the above object, the invention corresponding to claim 1 comprises two inverter units, each inverter unit comprising a water-cooled AC side conductor and at least two module type semiconductor elements, and the water-cooled AC The side conductor is a flat conductor and serves also as a cooling fin having a flow channel through which cooling water can flow on the inner wall surface, and each of the module-type semiconductor elements is one plate of the water-cooled AC side conductor. Each of the AC terminals included in the surface is electrically connected, and an emitter terminal and a collector terminal are provided on the surface of the water-cooled AC-side conductor facing the semiconductor element mounting surface. The inverter units are arranged to face each other in a state where the surfaces of the water-cooled alternating current side conductors on which the semiconductor elements are not placed are close to each other. An inverter unit group, wherein a magnetic flux generated by the AC side conductor has to be canceled.

In order to achieve the object, the invention corresponding to claim 2 comprises two inverter units constituting a main circuit of the inverter, each inverter unit comprising a water-cooled AC side conductor and at least two module type semiconductor elements. The water-cooled AC side conductor is a flat conductor, and serves also as a cooling fin having a flow channel through which cooling water can flow on the inner wall surface thereof.
Each of the module-type semiconductor elements is mounted and fixed on one plate surface of the water-cooled AC side conductor, and an AC terminal included in each module-type semiconductor element is electrically connected. A surface that has an emitter terminal and a collector terminal on the surface facing the mounting surface, each inverter unit is supported by the same support, and the surface on which the semiconductor element of each water-cooled AC side conductor is not mounted The inverter is arranged to face each other in a state of being close to each other, thereby canceling out the magnetic flux generated in the water-cooled AC side conductor.

  ADVANTAGE OF THE INVENTION According to this invention, the structure of an inverter unit can be simplified, the whole apparatus can be reduced in size, and the inverter unit and inverter which can reduce the influence of the magnetic flux which generate | occur | produces in an inverter main circuit can be provided.

  Embodiments of the present invention will be described below with reference to the drawings. First, the inverter unit of the present invention and the main circuit of the inverter will be described with reference to FIG. The AC voltage from the power system 1 is converted into a DC voltage by a converter (forward conversion circuit) 2, the DC voltage converted by the converter 2 is converted into an AC voltage by an inverter (reverse conversion circuit) 3, and the AC voltage is passed through an AC reactor 4. Thus, an AC load (not shown), for example, an AC motor M is applied.

  In the inverter 3, for example, inverter units 3U1 and 3U2 that form one leg with upper and lower arms constitute a U-phase unit inverter, and similarly, a V-phase unit inverter and a W-phase unit inverter.

  The inverter unit 3U1 is formed by connecting two module type semiconductor switching elements 5 made of IGBT, for example, to the upper and lower arms, respectively, and connecting the emitter of the semiconductor switching element 5 in the upper arm of the leg and the collector of the semiconductor switching element 5 in the lower arm. Similarly, the inverter unit 3U2 has two semiconductor switching elements 5 connected to the upper and lower arms, respectively, and the emitter of the semiconductor switching element 5 on the upper arm of the leg and the semiconductor switching of the lower arm on the leg. An AC terminal AC is provided at a connection point between the element 5 and the collector.

  Each semiconductor switching element 5 includes a transistor T and a flywheel diode D connected to the transistor T in antiparallel.

  Next, a first embodiment of the inverter unit of the present invention will be described with reference to FIGS.

  This comprises a water-cooled AC side conductor 6 and the module type semiconductor switching element 5 described above. The water-cooling AC side conductor 6 is a flat conductor, and has a water flow passage 61 through which cooling water can flow on the inner wall surface, and a cooling water base 7 is provided at each of the inlets and outlets of the water flow passage 61. It also serves as a fin. The semiconductor switching element 5 is mounted and fixed on one surface of the water-cooled AC-side conductor 6, the AC terminal A included in each is electrically connected, and the emitter terminal E is mounted on the surface facing the mounting surface of the conductor. In FIG. 1, the inverter unit 3U1 is composed of two elements, but in FIGS. 2 and 3, four elements 5 are shown.

  Thus, since the 1st Embodiment of the inverter unit of this invention is comprised, the following effects are obtained. That is, by attaching the semiconductor element 5 constituting the inverter unit to the water-cooling AC side conductor 6 in which the cooling fin for cooling the semiconductor element 5 and the conductor (water cooling) constituting the main circuit are integrated, the individual element 5 As a result, the risk of overheating can be reduced, the apparatus can be downsized, and the inductance can be reduced accordingly.

  In the embodiment of the present invention described above, the problems of FIGS. 10 and 11 which are the conventional techniques described above can be improved. Conventionally, in a main circuit configuration of a high-frequency inverter using a flat semiconductor element of a thyristor equal pressure contact type, it is usual to separately lay out a semiconductor stack and a main circuit conductor in which the semiconductor element is pressed with a constant pressure.

  On the other hand, in the present invention, when a module type semiconductor element such as an IGBT is used, the semiconductor element does not need to be pressed, so the structures constituting the main circuit are not separate but integrated structures. is there. That is, the semiconductor element 5 etc. which comprises an inverter main circuit are attached to the water cooling AC side conductor 6 which integrated the cooling fin which cools a semiconductor element, and the conductor (water cooling) which comprises a main circuit. As a result, the structural material that supports the individual semiconductor elements constituting the inverter unit can be minimized, so that the risk of overheating can be reduced and the apparatus can be miniaturized. In addition, the magnetic flux is canceled by bringing these units close to each other with the surfaces on which the semiconductor elements are not mounted facing each other, and the risk of overheating can be minimized. Further, the inductance can be reduced by reducing the outer shape of the main circuit unit.

  FIG. 4 shows a configuration in which six inverter units shown in FIGS. 2 and 3 are prepared, and the inverter units are arranged close to each other and supported by the same support frame 9. With this configuration, the entire apparatus can be reduced in size, weight, and cost.

5 and 6 are views showing a second embodiment of the inverter unit of the present invention, which includes a water-cooled AC side conductor 6A and at least two module type semiconductor elements 5, and the upper and lower arms of FIG. Constitutes one leg. That is, the water-cooled AC side conductor 6A is a flat conductor, and two opposing ends are bent in the same direction, and also serves as a cooling fin having a water flow path 6A1 through which cooling water can flow. It is a thing.

  Each module type semiconductor element 5 is mounted and fixed on a plate surface between two bent ends of a water-cooled AC side conductor 6A, and an AC terminal A included in each is electrically connected, and the conductor Each has an emitter terminal E and a collector terminal C on the surface facing the mounting surface.

  In this embodiment, a pair of inverter units are prepared, and the surfaces of the water-cooled AC side conductor 6A on which the semiconductor element 5 is not mounted are arranged close to each other so as to face each other, so that the magnetic flux generated in each of the water-cooled AC side conductors 6A Is negated, the risk of overheating can be minimized, and the inductance can be reduced by downsizing the outer shape of the main circuit unit.

  FIG. 7 shows three inverter units shown in FIG. 6, each inverter unit is arranged close to each other, and is supported by the same support frame 9. With this configuration, the entire apparatus can be reduced in size, weight, and cost, and the risk of overheating can be minimized.

FIG. 8 and FIG. 9 are views showing a second embodiment of the inverter unit of the present invention, which includes an AC side conductor, at least two (here, four) cooling fins 11, and at least two (here) In this example, four module type semiconductor elements 5 are provided.

  The AC side conductor 10 is a flat conductor, and has a frame shape in which two opposing end portions are bent in the same direction. Each cooling fin 11 is joined to the opposing side surface of the AC-side conductor 10 and has a flat plate shape, and has a water flow channel 101 through which cooling water can flow on the inner wall surface. Each module type semiconductor element 5 is mounted and fixed on the plate surface of the cooling fin 11, and the AC terminal A included in each is electrically connected, and the emitter terminal is connected to the surface facing the mounting surface of the semiconductor element 5. E and a collector terminal C are provided. With such a configuration, the inverter unit is configured as one leg with the upper and lower arms of the main circuit of the inverter.

  According to the third embodiment of the inverter unit of the present invention described above, the following operational effects can be obtained in addition to the operational effects of the above-described embodiments. That is, in the above-described embodiment, the AC side conductor and the cooling fin are integrated into a water-cooled AC side conductor. In this case, when the number of semiconductor elements is large, both sides of the AC conductor processed into a frame shape regardless of this. By providing the semiconductor element, it is not necessary to consider the manufacturing limit of the water-cooled AC side conductor, and the number of semiconductor elements can be changed depending on the difference in the main circuit configuration.

  In the third embodiment of the inverter of the present invention, for example, three inverter units of FIGS. 8 and 9 are supported on the same support body 9 as in FIG. Specifically, the inverter unit includes at least two inverter units shown in FIGS. 8 and 9, each inverter unit including an AC side conductor, at least two cooling fins, and at least two module type semiconductor elements. The AC-side conductor is a flat conductor, and has a frame shape in which two opposing end portions are bent in the same direction, and each of the cooling fins is joined to the opposite side surface of the AC-side conductor. Each of the module-type semiconductor elements is mounted and fixed on the plate surface of each cooling fin, and has a flow channel through which cooling water can flow on the inner wall surface. The AC terminal has an emitter terminal and a collector terminal on the surface that is electrically connected and faces the mounting surface of the conductor, and each inverter unit has the same Supporting the lifting member, an inverter for converting DC power to AC power.

The circuit diagram for demonstrating the main circuit of the inverter unit and inverter of this invention. The top view for demonstrating 1st Embodiment of the inverter unit of this invention. The front view for demonstrating 1st Embodiment of the inverter unit of this invention. The front view for demonstrating 1st Embodiment of the inverter of this invention. The top view for demonstrating 2nd Embodiment of the inverter unit of this invention. The front view for demonstrating 2nd Embodiment of the inverter unit of this invention. The front view for demonstrating 2nd Embodiment of the inverter of this invention. The front view for demonstrating 3rd Embodiment of the inverter unit of this invention. The front view for demonstrating 3rd Embodiment of the inverter of this invention. FIG. 5 is a configuration diagram of a semiconductor stack for explaining problems of a conventional technique. The block diagram for demonstrating the problem of the inverter unit made into the three-phase structure using the semiconductor stack of FIG.

Explanation of symbols

  T ... Transistor, D ... Flywheel diode, A ... AC terminal, E ... Emitter terminal, C ... Collector terminal, 1 ... Power system, 2 ... Converter, 3 ... Inverter, 3U1, 3U2 ... Inverter unit, 4 ... AC reactor, DESCRIPTION OF SYMBOLS 5 ... Module type semiconductor switching element, 6 ... Water cooling AC side conductor, 6A ... Water cooling AC side conductor, 6A1 ... Flow channel, 7 ... Cooling water cap, 9 ... Same support frame (same support body), 10 ... AC side conductor , 11 ... cooling fins, 61 ... flowing water channel, 101 ... flowing water channel.

Claims (8)

It consists of two inverter units,
Each inverter unit includes a water-cooled AC side conductor and at least two module type semiconductor elements,
The water-cooled AC side conductor is a flat conductor, and serves also as a cooling fin having a flow channel through which cooling water can flow on the inner wall surface thereof.
Each of the module-type semiconductor elements is mounted and fixed on one plate surface of the water-cooled AC side conductor, and an AC terminal included in each module-type semiconductor element is electrically connected. Each having an emitter terminal and a collector terminal on the surface facing the mounting surface;
The inverter units are arranged opposite to each other in a state where the surfaces of the water-cooled AC side conductors on which the semiconductor elements are not placed are close to each other, thereby canceling the magnetic flux generated in the water-cooled AC side conductors. An inverter unit group characterized by that. It consists of two inverter units that make up the main circuit of the inverter.
Each inverter unit includes a water-cooled AC side conductor and at least two module type semiconductor elements,
The water-cooled AC side conductor is a flat conductor, and serves also as a cooling fin having a flow channel through which cooling water can flow on the inner wall surface thereof.
Each of the module-type semiconductor elements is mounted and fixed on one plate surface of the water-cooled AC side conductor, and an AC terminal included in each module-type semiconductor element is electrically connected. Each having an emitter terminal and a collector terminal on the surface facing the mounting surface;
Each inverter unit is supported by the same support, and is disposed oppositely in a state where the surfaces of the water-cooled AC side conductors on which the semiconductor elements are not placed are close to each other, whereby magnetic flux generated in the water-cooled AC side conductors An inverter characterized by canceling out. It consists of two inverter units,
Each inverter unit includes a water-cooled AC side conductor and at least two module type semiconductor elements,
The water-cooled alternating current side conductor is a flat conductor, and two opposing end portions are bent in the same direction, and serve also as a cooling fin having a flow channel through which cooling water can flow on the inner wall surface. ,
Each of the module-type semiconductor elements is mounted and fixed on a plate surface between the two bent ends of the water-cooled AC side conductor, and an AC terminal included in each is electrically connected, and the water-cooled AC Each having an emitter terminal and a collector terminal on the surface facing the mounting surface of the side conductor,
The inverter units are arranged opposite to each other in a state where the surfaces of the water-cooled AC side conductors on which the semiconductor elements are not placed are close to each other, thereby canceling the magnetic flux generated in the water-cooled AC side conductors. An inverter unit group characterized by that. It consists of two inverter units that make up the main circuit of the inverter.
Each inverter unit includes a water-cooled AC side conductor and at least two module type semiconductor elements,
The water-cooled alternating current side conductor is a flat conductor, and two opposing end portions are bent in the same direction, and serve also as a cooling fin having a flow channel through which cooling water can flow on the inner wall surface. ,
Each of the module-type semiconductor elements is mounted and fixed on a plate surface between the two bent ends of the water-cooled AC-side conductor, and an AC terminal included in each is electrically connected, and Each having an emitter terminal and a collector terminal on the surface facing the mounting surface;
Each inverter unit is supported by the same support, and is disposed oppositely in a state where the surfaces of the water-cooled AC side conductors on which the semiconductor elements are not placed are close to each other, whereby magnetic flux generated in the water-cooled AC side conductors An inverter characterized by canceling out. A frame-like AC-side conductor in which two opposing end portions are bent in the same direction, respectively,
At least two cooling fins that are joined to opposite side surfaces of the AC-side conductor, have a flat plate shape, and have a water flow path through which cooling water can flow.
At least each of the cooling fins is mounted and fixed on the plate surface, and the AC terminals included in each of the cooling fins are electrically connected, and at least the emitter terminal and the collector terminal are provided on the surface facing the mounting surface of the element. Two modular semiconductor elements;
An inverter unit characterized in that one leg is constituted by upper and lower arms of a main circuit of the inverter. It consists of two inverter units,
Each inverter unit includes a water-cooled AC side conductor, at least two cooling fins, and at least two module type semiconductor elements,
The water-cooled alternating current side conductor is a flat conductor, and two opposite ends are each in a frame shape bent in the same direction,
Each of the cooling fins is joined to the opposing side surfaces of the water-cooling alternating current side conductor, has a flat plate shape, and has a flow channel through which cooling water can flow on the inner wall surface thereof,
Each module-type semiconductor element is mounted and fixed on the plate surface of each cooling fin, and an AC terminal included in each module-type semiconductor element is electrically connected, and an emitter terminal and a surface facing the mounting surface of the conductor Each with a collector terminal,
The inverter units are arranged opposite to each other in a state where the surfaces of the water-cooled AC side conductors on which the semiconductor elements are not placed are close to each other, thereby canceling the magnetic flux generated in the water-cooled AC side conductors. An inverter unit group characterized by that. Consisting of at least two inverter units,
Each inverter unit includes an AC side conductor, at least two cooling fins, and at least two module type semiconductor elements,
The alternating current side conductor is a flat conductor, and two opposite ends are each in a frame shape bent in the same direction,
Each of the cooling fins is joined to the opposing side surface of the AC side conductor, has a flat plate shape, and has a flow channel through which cooling water can flow on the inner wall surface thereof,
Each module-type semiconductor element is mounted and fixed on the plate surface of each cooling fin, and an AC terminal included in each module-type semiconductor element is electrically connected, and an emitter terminal and a surface facing the mounting surface of the conductor Each with a collector terminal,
An inverter characterized by supporting each inverter unit on the same support and converting DC power into AC power. It consists of two inverter units,
Each inverter unit includes a water-cooled AC side conductor, at least two cooling fins, and at least two module type semiconductor elements,
The water-cooled alternating current side conductor is a flat conductor, and two opposite ends are each in a frame shape bent in the same direction,
Each of the cooling fins is joined to the opposing side surfaces of the water-cooling alternating current side conductor, has a flat plate shape, and has a flow channel through which cooling water can flow on the inner wall surface thereof,
Each module-type semiconductor element is mounted and fixed on the plate surface of each cooling fin, and an AC terminal included in each module-type semiconductor element is electrically connected, and an emitter terminal and a surface facing the mounting surface of the conductor Each with a collector terminal,
Each inverter unit is supported by the same support, and is disposed oppositely in a state where the surfaces of the water-cooled AC side conductors on which the semiconductor elements are not placed are close to each other, whereby magnetic flux generated in the water-cooled AC side conductors An inverter characterized by canceling out.

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