JP5526181B2 - 窒化物系発光ヘテロ構造 - Google Patents
窒化物系発光ヘテロ構造 Download PDFInfo
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- JP5526181B2 JP5526181B2 JP2012091174A JP2012091174A JP5526181B2 JP 5526181 B2 JP5526181 B2 JP 5526181B2 JP 2012091174 A JP2012091174 A JP 2012091174A JP 2012091174 A JP2012091174 A JP 2012091174A JP 5526181 B2 JP5526181 B2 JP 5526181B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/11—Comprising a photonic bandgap structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
- H01S5/3216—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities quantum well or superlattice cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3407—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers characterised by special barrier layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3415—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers containing details related to carrier capture times into wells or barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34346—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser characterised by the materials of the barrier layers
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Biophysics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
Description
E0=π2h2/(2med2)
(この値は、バンド曲がりが基底状態を押し上げるため実際にはさらに高い)
で近似でき、式中、hはプランク定数であり、meは電子の有効質量である(GaNの場合0.228m0と推定され得、式中、m0は自由電子の静止質量である)。この場合、dの関数としてバンド曲がりとdの関数としてのGaNの基底状態エネルギーとを比較すると、量子井戸32の幅は、電子基底状態エネルギーがバンド曲がりエネルギーより確実に高くなるように、およそ4.5ナノメートルよりも小さくなければならない。
Claims (19)
- 光発生構造を形成する工程を含む窒化物系発光ヘテロ構造の形成方法であって、前記光発生構造を形成する工程は、
バリア層のセットを形成する工程と、
各々が前記バリア層と隣接する量子井戸のセットを形成する工程と、
を含み、
前記バリア層は、当該バリア層を通って当該バリア層に隣接する前記量子井戸に入る電子のエネルギーを失わせるエネルギー空間を形成する傾斜組成を含んでおり、
前記量子井戸のセットを形成する工程は、量子井戸の各々の厚みを非輻射再結合中心の半径に基づいて選択する工程であって、前記選択された厚みは前記非輻射再結合中心の半径より小さい、該工程を含む、
窒化物系発光ヘテロ構造の形成方法。 - 前記量子井戸のセットを形成する工程は、各量子井戸の電子基底状態が、1つ以上の分極効果によって生じるエネルギーのバンド傾斜範囲より高くなるように、量子井戸の各々の厚みを選択する工程を含む、請求項1に記載の方法。
- 基板を獲得する工程と、
前記基板上にわたって電子供給層を形成する工程と、
を更に含む、請求項1に記載の方法。 - 前記電子供給層に隣接する少なくとも1つのバリア層を形成する工程であって、前記少なくとも1つのバリア層は、前記光発生構造に入る電子が、極性光学フォノンのエネルギーとほぼ同じエネルギーを有するようなバンド構造プロファイルを生じる傾斜組成を含む、該工程を更に含む、請求項3に記載の方法。
- 前記光発生構造上にわたって正孔供給層を形成する工程を更に備える、請求項1に記載の方法。
- 前記正孔供給層に隣接する少なくとも1つのバリア層を形成する工程であって、前記少なくとも1つのバリア層は、前記光発生構造に入る正孔が、極性光学フォノンのエネルギーとほぼ同じエネルギーを有するようなバンド構造プロファイルを生じる傾斜組成を含む、該工程を更に含む、請求項5に記載の方法。
- バリア層各々は、アルミニウムの一定な組成を有するバリア層に比べて、量子井戸との境界で正孔のバリアを減少するアルミニウムの変化組成を有する、請求項1に記載の方法。
- 光発生構造を形成する工程を含む窒化物系発光ヘテロ構造の形成方法であって、前記光発生構造を形成する工程は、
バリア層のセットを形成する工程と、
各々が前記バリア層と隣接する量子井戸のセットを形成する工程と、
を含み、
前記バリア層は、当該バリア層を通って当該バリア層に隣接する前記量子井戸に入る電子のエネルギーを失わせるエネルギー空間を形成する傾斜組成を含んでおり、
前記量子井戸のセットを形成する工程は、1つ以上の分極効果によって生じるエネルギーのバンド傾斜範囲に基づいて量子井戸の各々の厚みを選択する工程であって、前記選択された厚みは、各量子井戸の電子基底状態が、前記1つ以上の分極効果によって生じるエネルギーの前記バンド傾斜範囲より高くなるような厚みである、該工程を含む、
窒化物系発光ヘテロ構造の形成方法。 - 基板を獲得する工程と、
前記基板上にわたって電子供給層を形成する工程と、
を更に備える、請求項8に記載の方法。 - 前記電子供給層に隣接する少なくとも1つのバリア層を形成する工程であって、前記少なくとも1つのバリア層は、前記光発生構造に入る電子が、極性光学フォノンのエネルギーとほぼ同じエネルギーを有するようなバンド構造プロファイルを生じる傾斜組成を含む、該工程を更に含む、請求項9に記載の方法。
- 前記光発生構造上にわたって正孔供給層を形成する工程を更に備える、請求項8に記載の方法。
- 前記正孔供給層に隣接する少なくとも1つのバリア層を形成する工程であって、前記少なくとも1つのバリア層は、前記光発生構造に入る正孔が、極性光学フォノンのエネルギーとほぼ同じエネルギーを有するようなバンド構造プロファイルを生じる傾斜組成を含む、該工程を更に含む、請求項11に記載の方法。
- バリア層各々は、アルミニウムの一定な組成を有するバリア層に比べて、正孔のバリアを減少するアルミニウムの変化組成を有する、請求項8に記載の方法。
- 前記量子井戸のセットを形成する工程は、非輻射再結合中心の半径より小さくなるように量子井戸の各々の厚みを選択する工程を含む、請求項13に記載の方法。
- 基板を獲得する工程と、
前記基板上にわたって電子供給層を形成する工程と、
前記電子供給層上にわたって光発生構造を形成する工程と、
前記光発生構造上にわたって正孔供給層を形成する工程と、
を含む窒化物系発光ヘテロ構造の形成方法であって、前記光発生構造を形成する工程は、
バリア層のセットを形成する工程と、
各々が前記バリア層と隣接する量子井戸のセットを形成する工程と、
を含み、
前記バリア層は、当該バリア層を通って当該バリア層に隣接する前記量子井戸に入る電子のエネルギーを失わせるエネルギー空間を形成する傾斜組成を含んでおり、
前記量子井戸のセットを形成する工程は、量子井戸の各々の厚みを非輻射再結合中心の半径に基づいて選択する工程であって、前記選択された厚みは非輻射再結合中心の半径より小さい、該工程を含む、
窒化物系発光ヘテロ構造の形成方法。 - 前記量子井戸のセットを形成する工程は、各量子井戸の電子基底状態が、1つ以上の分極効果によって生じるエネルギーのバンド傾斜範囲より高くなるような量子井戸の各々の厚みを選択する工程を含む、請求項15に記載の方法。
- 前記電子供給層に隣接する少なくとも1つのバリア層を形成する工程であって、前記少なくとも1つのバリア層は、前記光発生構造に入る電子が、極性光学フォノンのエネルギーとほぼ同じエネルギーを有するようなバンド構造プロファイルを生じる傾斜組成を含む、該工程を更に含む、請求項15に記載の方法。
- 前記正孔供給層に隣接する少なくとも1つのバリア層を形成する工程であって、前記少なくとも1つのバリア層は、前記光発生構造に入る正孔が、極性光学フォノンのエネルギーとほぼ同じエネルギーを有するようなバンド構造プロファイルを生じる傾斜組成を含む、該工程を更に含む、請求項15に記載の方法。
- バリア層各々は、アルミニウムの一定な組成を有するバリア層に比べて、正孔のバリアを減少するアルミニウムの変化組成を有する、請求項15に記載の方法。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US63382804P | 2004-12-06 | 2004-12-06 | |
| US60/633,828 | 2004-12-06 | ||
| US11/292,519 US7326963B2 (en) | 2004-12-06 | 2005-12-02 | Nitride-based light emitting heterostructure |
| US11/292,519 | 2005-12-02 |
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| JP2007545543A Division JP5342780B2 (ja) | 2004-12-06 | 2005-12-05 | 窒化物系発光ヘテロ構造 |
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| JP2012165002A JP2012165002A (ja) | 2012-08-30 |
| JP5526181B2 true JP5526181B2 (ja) | 2014-06-18 |
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| JP2012091174A Expired - Lifetime JP5526181B2 (ja) | 2004-12-06 | 2012-04-12 | 窒化物系発光ヘテロ構造 |
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| Country | Link |
|---|---|
| US (2) | US7326963B2 (ja) |
| EP (1) | EP1831933B1 (ja) |
| JP (2) | JP5342780B2 (ja) |
| WO (1) | WO2006062880A2 (ja) |
Families Citing this family (109)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8545629B2 (en) | 2001-12-24 | 2013-10-01 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
| US7326963B2 (en) * | 2004-12-06 | 2008-02-05 | Sensor Electronic Technology, Inc. | Nitride-based light emitting heterostructure |
| US7498182B1 (en) * | 2005-03-18 | 2009-03-03 | The United States Of America As Represented By The Secretary Of The Army | Method of manufacturing an ultraviolet light emitting AlGaN composition and ultraviolet light emitting device containing same |
| US7547925B2 (en) * | 2005-11-14 | 2009-06-16 | Palo Alto Research Center Incorporated | Superlattice strain relief layer for semiconductor devices |
| US7641735B2 (en) | 2005-12-02 | 2010-01-05 | Crystal Is, Inc. | Doped aluminum nitride crystals and methods of making them |
| US9034103B2 (en) | 2006-03-30 | 2015-05-19 | Crystal Is, Inc. | Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them |
| US8513643B2 (en) * | 2006-09-06 | 2013-08-20 | Palo Alto Research Center Incorporated | Mixed alloy defect redirection region and devices including same |
| US20080054248A1 (en) * | 2006-09-06 | 2008-03-06 | Chua Christopher L | Variable period variable composition supperlattice and devices including same |
| US9771666B2 (en) | 2007-01-17 | 2017-09-26 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| WO2008088838A1 (en) | 2007-01-17 | 2008-07-24 | Crystal Is, Inc. | Defect reduction in seeded aluminum nitride crystal growth |
| US8080833B2 (en) * | 2007-01-26 | 2011-12-20 | Crystal Is, Inc. | Thick pseudomorphic nitride epitaxial layers |
| TWI341600B (en) * | 2007-08-31 | 2011-05-01 | Huga Optotech Inc | Light optoelectronic device and forming method thereof |
| EP2037506B1 (en) * | 2007-09-17 | 2019-07-24 | Palo Alto Research Center Incorporated | Semiconductor light emitting device with superlattices |
| KR101438808B1 (ko) | 2007-10-08 | 2014-09-05 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
| US8144743B2 (en) * | 2008-03-05 | 2012-03-27 | Rohm Co., Ltd. | Nitride based semiconductor device and fabrication method for the same |
| US8497527B2 (en) * | 2008-03-12 | 2013-07-30 | Sensor Electronic Technology, Inc. | Device having active region with lower electron concentration |
| WO2009120998A2 (en) * | 2008-03-27 | 2009-10-01 | Nitek, Inc. | Low resistance ultraviolet light emitting device and method of fabricating the same |
| CN102047454B (zh) * | 2008-04-16 | 2013-04-10 | Lg伊诺特有限公司 | 发光器件及其制造方法 |
| TWI464899B (zh) * | 2008-05-09 | 2014-12-11 | 榮創能源科技股份有限公司 | A method for manufacturing a semiconductor element |
| US7907277B2 (en) * | 2008-05-14 | 2011-03-15 | Baker Hughes Incorporated | Method and apparatus for downhole spectroscopy |
| US7902545B2 (en) * | 2008-05-14 | 2011-03-08 | Baker Hughes Incorporated | Semiconductor for use in harsh environments |
| US10036099B2 (en) | 2008-08-07 | 2018-07-31 | Slt Technologies, Inc. | Process for large-scale ammonothermal manufacturing of gallium nitride boules |
| CA2653581A1 (en) | 2009-02-11 | 2010-08-11 | Kenneth Scott Alexander Butcher | Migration and plasma enhanced chemical vapour deposition |
| US8247886B1 (en) | 2009-03-09 | 2012-08-21 | Soraa, Inc. | Polarization direction of optical devices using selected spatial configurations |
| US9000466B1 (en) | 2010-08-23 | 2015-04-07 | Soraa, Inc. | Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening |
| CN107256915A (zh) | 2009-09-18 | 2017-10-17 | 天空公司 | 发光二极管器件 |
| US8933644B2 (en) | 2009-09-18 | 2015-01-13 | Soraa, Inc. | LED lamps with improved quality of light |
| US9293644B2 (en) | 2009-09-18 | 2016-03-22 | Soraa, Inc. | Power light emitting diode and method with uniform current density operation |
| US9583678B2 (en) | 2009-09-18 | 2017-02-28 | Soraa, Inc. | High-performance LED fabrication |
| RU2452061C2 (ru) * | 2009-10-16 | 2012-05-27 | Общество с ограниченной ответственностью "Нитридные кристаллы" | Полупроводниковый элемент, излучающий свет в ультрафиолетовом диапазоне |
| US8905588B2 (en) | 2010-02-03 | 2014-12-09 | Sorra, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| US10147850B1 (en) | 2010-02-03 | 2018-12-04 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| CN101807640A (zh) * | 2010-03-05 | 2010-08-18 | 中国科学院半导体研究所 | 利用三维极化感应空穴气提高led发光效率的方法 |
| JP5604147B2 (ja) * | 2010-03-25 | 2014-10-08 | パナソニック株式会社 | トランジスタ及びその製造方法 |
| TWI557936B (zh) | 2010-04-30 | 2016-11-11 | 美國波士頓大學信託會 | 具能帶結構位變動之高效率紫外光發光二極體 |
| US8927959B2 (en) | 2010-06-18 | 2015-01-06 | Sensor Electronic Technology, Inc. | Deep ultraviolet light emitting diode |
| US9450143B2 (en) | 2010-06-18 | 2016-09-20 | Soraa, Inc. | Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices |
| US9806226B2 (en) | 2010-06-18 | 2017-10-31 | Sensor Electronic Technology, Inc. | Deep ultraviolet light emitting diode |
| US8907322B2 (en) * | 2010-06-18 | 2014-12-09 | Sensor Electronic Technology, Inc. | Deep ultraviolet light emitting diode |
| JP5806734B2 (ja) | 2010-06-30 | 2015-11-10 | クリスタル アイエス, インコーポレーテッドCrystal Is, Inc. | 熱勾配制御による窒化アルミニウム大単結晶成長 |
| RU2456711C1 (ru) * | 2010-11-11 | 2012-07-20 | Общество с ограниченной ответственностью "Галлий-Н" | Полупроводниковый светоизлучающий элемент |
| US8362458B2 (en) | 2010-12-27 | 2013-01-29 | Industrial Technology Research Institute | Nitirde semiconductor light emitting diode |
| KR101761638B1 (ko) | 2011-01-19 | 2017-07-27 | 삼성전자주식회사 | 질화물 반도체 발광소자 |
| US8786053B2 (en) | 2011-01-24 | 2014-07-22 | Soraa, Inc. | Gallium-nitride-on-handle substrate materials and devices and method of manufacture |
| US8143147B1 (en) | 2011-02-10 | 2012-03-27 | Intermolecular, Inc. | Methods and systems for forming thin films |
| US8633468B2 (en) * | 2011-02-11 | 2014-01-21 | Sensor Electronic Technology, Inc. | Light emitting device with dislocation bending structure |
| US10134948B2 (en) * | 2011-02-25 | 2018-11-20 | Sensor Electronic Technology, Inc. | Light emitting diode with polarization control |
| US8962359B2 (en) | 2011-07-19 | 2015-02-24 | Crystal Is, Inc. | Photon extraction from nitride ultraviolet light-emitting devices |
| US8648384B2 (en) * | 2011-07-25 | 2014-02-11 | Lg Innotek Co., Ltd. | Light emitting device |
| US9595634B2 (en) | 2011-08-11 | 2017-03-14 | Sensor Electronic Technology, Inc. | Device with transparent and higher conductive regions in lateral cross section of semiconductor layer |
| US9385271B2 (en) | 2011-08-11 | 2016-07-05 | Sensor Electronic Technology, Inc. | Device with transparent and higher conductive regions in lateral cross section of semiconductor layer |
| US8787418B2 (en) * | 2011-08-11 | 2014-07-22 | Sensor Electronic Technology, Inc. | Emitting device with compositional and doping inhomogeneities in semiconductor layers |
| US8879598B2 (en) | 2011-08-11 | 2014-11-04 | Sensor Electronic Technology, Inc. | Emitting device with compositional and doping inhomogeneities in semiconductor layers |
| US10411156B2 (en) | 2011-08-11 | 2019-09-10 | Sensor Electronic Technology, Inc. | Device with transparent and higher conductive regions in lateral cross section of semiconductor layer |
| US8686431B2 (en) | 2011-08-22 | 2014-04-01 | Soraa, Inc. | Gallium and nitrogen containing trilateral configuration for optical devices |
| US8912025B2 (en) | 2011-11-23 | 2014-12-16 | Soraa, Inc. | Method for manufacture of bright GaN LEDs using a selective removal process |
| US8723189B1 (en) * | 2012-01-06 | 2014-05-13 | Trustees Of Boston University | Ultraviolet light emitting diode structures and methods of manufacturing the same |
| CN102544285B (zh) * | 2012-01-16 | 2015-12-09 | 北京大学 | 利用电子阻挡层提高发光效率的氮化物发光器件 |
| CN102569571B (zh) * | 2012-03-06 | 2015-06-24 | 华灿光电股份有限公司 | 半导体发光二极管及其制造方法 |
| EP2823515A4 (en) * | 2012-03-06 | 2015-08-19 | Soraa Inc | LIGHT-EMITTING DIODES WITH MATERIAL LAYERS WITH LOW BREAKING INDEX TO REDUCE LIGHT PIPE EFFECTS |
| WO2013158645A1 (en) * | 2012-04-16 | 2013-10-24 | Sensor Electronic Technology, Inc. | Non-uniform multiple quantum well structure |
| US10145026B2 (en) | 2012-06-04 | 2018-12-04 | Slt Technologies, Inc. | Process for large-scale ammonothermal manufacturing of semipolar gallium nitride boules |
| KR102005236B1 (ko) * | 2012-07-05 | 2019-07-31 | 삼성전자주식회사 | 반사 전극 형성을 위한 콘택층을 포함하는 반도체 발광 소자 |
| US9978904B2 (en) | 2012-10-16 | 2018-05-22 | Soraa, Inc. | Indium gallium nitride light emitting devices |
| KR101976455B1 (ko) * | 2012-10-19 | 2019-05-09 | 엘지이노텍 주식회사 | 발광 소자 및 발광 소자 패키지 |
| CN102969416A (zh) * | 2012-11-01 | 2013-03-13 | 扬州中科半导体照明有限公司 | 一种氮化物led外延片及其生长方法 |
| TWI524551B (zh) * | 2012-11-19 | 2016-03-01 | 新世紀光電股份有限公司 | 氮化物半導體結構及半導體發光元件 |
| TWI499080B (zh) | 2012-11-19 | 2015-09-01 | Genesis Photonics Inc | 氮化物半導體結構及半導體發光元件 |
| US10153394B2 (en) | 2012-11-19 | 2018-12-11 | Genesis Photonics Inc. | Semiconductor structure |
| TWI535055B (zh) | 2012-11-19 | 2016-05-21 | 新世紀光電股份有限公司 | 氮化物半導體結構及半導體發光元件 |
| TWI556467B (zh) * | 2012-11-19 | 2016-11-01 | 新世紀光電股份有限公司 | 氮化物半導體結構 |
| CN102945902B (zh) * | 2012-12-11 | 2014-12-17 | 东南大学 | 一种光子晶体结构的发光二极管及其应用 |
| CN103022892B (zh) * | 2012-12-14 | 2015-03-25 | 武汉电信器件有限公司 | 波长为808nm的大功率激光器芯片结构及其制作方法 |
| US9761763B2 (en) | 2012-12-21 | 2017-09-12 | Soraa, Inc. | Dense-luminescent-materials-coated violet LEDs |
| US8994033B2 (en) | 2013-07-09 | 2015-03-31 | Soraa, Inc. | Contacts for an n-type gallium and nitrogen substrate for optical devices |
| US9048387B2 (en) * | 2013-08-09 | 2015-06-02 | Qingdao Jason Electric Co., Ltd. | Light-emitting device with improved light extraction efficiency |
| US10903391B2 (en) * | 2013-09-03 | 2021-01-26 | Sensor Electronic Technology, Inc. | Optoelectronic device with modulation doping |
| US10454006B2 (en) | 2013-10-02 | 2019-10-22 | Sensor Electronic Technology, Inc. | Heterostructure including anodic aluminum oxide layer |
| WO2015051051A1 (en) | 2013-10-02 | 2015-04-09 | Sensor Electronic Technology, Inc. | Heterostructure including anodic aluminum oxide layer |
| JP6252092B2 (ja) * | 2013-10-17 | 2017-12-27 | 日亜化学工業株式会社 | 窒化物半導体積層体及びそれを用いた発光素子 |
| CN103560190B (zh) * | 2013-11-15 | 2016-03-02 | 湘能华磊光电股份有限公司 | 阻挡电子泄漏和缺陷延伸的外延生长方法及其结构 |
| CN103682981A (zh) * | 2013-12-13 | 2014-03-26 | 广东高聚激光有限公司 | 具有极化补偿机制的氮化物量子阱、激光器及发光二极管 |
| US9412902B2 (en) | 2014-02-22 | 2016-08-09 | Sensor Electronic Technology, Inc. | Semiconductor structure with stress-reducing buffer structure |
| US10199535B2 (en) | 2014-02-22 | 2019-02-05 | Sensor Electronic Technology, Inc. | Semiconductor structure with stress-reducing buffer structure |
| JP2015188048A (ja) * | 2014-03-10 | 2015-10-29 | 株式会社東芝 | 窒化物半導体積層体および半導体発光素子 |
| US9799793B2 (en) | 2014-04-15 | 2017-10-24 | Sensor Electronics Technology, Inc. | Semiconductor heterostructure with stress management |
| CN105006505B (zh) | 2014-04-15 | 2019-03-15 | 传感器电子技术股份有限公司 | 具有应力管理的半导体异质结构 |
| CN104157763B (zh) * | 2014-07-09 | 2018-01-09 | 华灿光电(苏州)有限公司 | 一种发光二极管外延片及其制造方法 |
| CN104134732B (zh) * | 2014-07-24 | 2017-09-19 | 映瑞光电科技(上海)有限公司 | 一种改善GaN基LED效率下降的外延结构 |
| WO2016051935A1 (ja) * | 2014-10-03 | 2016-04-07 | 日本碍子株式会社 | 半導体素子用のエピタキシャル基板およびその製造方法 |
| TWI568016B (zh) * | 2014-12-23 | 2017-01-21 | 錼創科技股份有限公司 | 半導體發光元件 |
| KR102392779B1 (ko) * | 2015-09-02 | 2022-04-29 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 및 이를 구비한 발광 소자 패키지 |
| CN108028300B (zh) * | 2015-09-28 | 2020-09-04 | 日亚化学工业株式会社 | 氮化物半导体发光元件 |
| CN105742429A (zh) * | 2016-03-01 | 2016-07-06 | 聚灿光电科技股份有限公司 | 紫外GaN基LED外延结构及其制造方法 |
| TWI738640B (zh) | 2016-03-08 | 2021-09-11 | 新世紀光電股份有限公司 | 半導體結構 |
| US11588096B2 (en) | 2016-04-11 | 2023-02-21 | The Regents Of The University Of California | Method to achieve active p-type layer/layers in III-nitrtde epitaxial or device structures having buried p-type layers |
| CN105789392A (zh) * | 2016-04-28 | 2016-07-20 | 聚灿光电科技股份有限公司 | GaN基LED外延结构及其制造方法 |
| CN109075530B (zh) * | 2016-05-13 | 2021-01-12 | 松下半导体解决方案株式会社 | 氮化物类发光元件 |
| CN105932124B (zh) * | 2016-07-15 | 2018-11-09 | 映瑞光电科技(上海)有限公司 | 一种led外延结构及其制备方法 |
| TWI717386B (zh) | 2016-09-19 | 2021-02-01 | 新世紀光電股份有限公司 | 含氮半導體元件 |
| CN106784188B (zh) * | 2016-12-23 | 2018-09-25 | 东莞市中镓半导体科技有限公司 | 一种具有复合电子阻挡层的近紫外led的制备方法 |
| CN107180898B (zh) * | 2017-05-09 | 2019-05-17 | 天津三安光电有限公司 | 发光二极管 |
| US10516076B2 (en) | 2018-02-01 | 2019-12-24 | Silanna UV Technologies Pte Ltd | Dislocation filter for semiconductor devices |
| US11245249B2 (en) | 2018-03-01 | 2022-02-08 | Ricoh Company, Ltd. | Reflector, surface emitting laser, method for manufacturing reflector, and method for manufacturing surface emitting laser |
| US10297714B1 (en) * | 2018-04-05 | 2019-05-21 | Wisconsin Alumni Research Foundation | Heterogeneous tunneling junctions for hole injection in nitride based light-emitting devices |
| JP2020167321A (ja) * | 2019-03-29 | 2020-10-08 | 旭化成株式会社 | 窒化物半導体発光素子 |
| JP2022533187A (ja) | 2019-05-16 | 2022-07-21 | ザ ボード オブ トラスティーズ オブ ザ レランド スタンフォード ジュニア ユニバーシティー | イオン注入及びイオン注入後の焼鈍を用いた埋込ドーパントの活性化を備える装置及び方法 |
| CN110197861B (zh) * | 2019-06-17 | 2024-04-02 | 南昌大学 | 一种AlInGaN基发光二极管 |
| JP7405554B2 (ja) * | 2019-10-01 | 2023-12-26 | 旭化成株式会社 | 紫外線発光素子 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0827328A (ja) * | 1994-07-11 | 1996-01-30 | Tonen Chem Corp | ポリプロピレン樹脂組成物 |
| US5670798A (en) * | 1995-03-29 | 1997-09-23 | North Carolina State University | Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same |
| JPH08288586A (ja) * | 1995-04-17 | 1996-11-01 | Nec Corp | 2μm帯半導体レーザ |
| JP3678399B2 (ja) * | 1999-01-29 | 2005-08-03 | 株式会社東芝 | 窒化物系半導体レーザ装置 |
| JP3866540B2 (ja) * | 2001-07-06 | 2007-01-10 | 株式会社東芝 | 窒化物半導体素子およびその製造方法 |
| US6955933B2 (en) * | 2001-07-24 | 2005-10-18 | Lumileds Lighting U.S., Llc | Light emitting diodes with graded composition active regions |
| US6618413B2 (en) * | 2001-12-21 | 2003-09-09 | Xerox Corporation | Graded semiconductor layers for reducing threshold voltage for a nitride-based laser diode structure |
| JP4119158B2 (ja) * | 2002-04-23 | 2008-07-16 | 三菱電機株式会社 | 傾斜状多重量子バリアを用いた半導体発光素子 |
| US6943377B2 (en) * | 2002-11-21 | 2005-09-13 | Sensor Electronic Technology, Inc. | Light emitting heterostructure |
| US6878970B2 (en) * | 2003-04-17 | 2005-04-12 | Agilent Technologies, Inc. | Light-emitting device having element(s) for increasing the effective carrier capture cross-section of quantum wells |
| US8253166B2 (en) * | 2004-09-14 | 2012-08-28 | Finisar Corporation | Band offset in AlInGaP based light emitters to improve temperature performance |
| US7326963B2 (en) * | 2004-12-06 | 2008-02-05 | Sensor Electronic Technology, Inc. | Nitride-based light emitting heterostructure |
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| US7537950B2 (en) | 2009-05-26 |
| US20080081390A1 (en) | 2008-04-03 |
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