JP5533671B2 - Laminated body with polarizer, display device panel with support, display device panel, display device, and methods for producing the same - Google Patents

Description

  The present invention relates to a laminate including a device substrate with a polarizer used in a display device, a display device-equipped panel including the same, a display device panel formed using the same, a display device including the same, and these It relates to a manufacturing method.

In the field of image display devices such as liquid crystal display devices (LCD), rear projection televisions, and front projectors, especially portable display devices such as digital cameras and mobile phones, weight reduction and thinning of display devices are important issues. Yes.
In order to cope with this problem, it is desired to further reduce the thickness of the device substrate itself used in the display device. In the case of a glass substrate, as a general method for reducing the plate thickness, the glass substrate is etched using hydrofluoric acid or the like before or after the display device member is formed on the surface of the glass substrate. Then, a method of further thinning by physical polishing is performed.

However, if the thickness of the glass substrate is reduced by performing an etching process or the like before forming the display device member on the surface of the glass substrate, the strength of the glass substrate is lowered and the amount of deflection is increased. Therefore, there arises a problem that it becomes difficult to perform processing in the existing display device panel production line.
In addition, when the display device member is formed on the surface of the glass substrate, the thickness of the glass substrate is reduced by etching or the like, and in the process of forming the display device member on the surface of the glass substrate, There arises a problem that the formed fine flaws become apparent, that is, a problem of generation of etch pits.

  Therefore, for the purpose of solving such problems, a thin glass substrate (hereinafter also referred to as “thin glass substrate”) is bonded to another supporting glass substrate to form a glass laminate, and in that state, A method of performing a predetermined process for manufacturing a display device and then peeling the supporting glass substrate from the thin glass substrate has been proposed.

For example, in Patent Document 1, a product glass substrate and a reinforcing glass substrate are bonded and integrated using electrostatic adsorption force or vacuum adsorption force between glass substrates, and a display using the product glass substrate is used. A method of manufacturing the device is described.
For example, Patent Document 2 describes a method for manufacturing a liquid crystal display device in which the ends of a substrate and a support of a liquid crystal display device are bonded using a glass frit adhesive, and then an electrode pattern or the like is formed. ing.
For example, Patent Document 3 describes a method for manufacturing a substrate for a display device, which includes a step of irradiating laser light to at least the vicinity of the edge surface of two glass substrates to fuse the two glass substrates. Yes.

For example, in Patent Document 4, substrate transfer is performed by attaching a substrate to a substrate transfer jig in which an adhesive layer is provided on a support, and transferring the substrate transfer jig through a manufacturing process of a liquid crystal display element. A manufacturing method of a liquid crystal display device is described in which liquid crystal display element formation processing is sequentially performed on a substrate attached to a jig for use, and the substrate is peeled off from the substrate carrying jig after completing a predetermined process.
For example, Patent Document 5 discloses that an electrode substrate for a liquid crystal display element is subjected to a predetermined process on the electrode substrate for a liquid crystal display element using a jig in which an ultraviolet curable pressure-sensitive adhesive is provided on a support, and then cured with an ultraviolet ray. A method for producing a liquid crystal display element, comprising: irradiating a mold adhesive with ultraviolet rays to reduce the adhesive strength of the ultraviolet curable adhesive and peeling the liquid crystal display element electrode substrate from the jig. Have been described.
For example, Patent Document 6 describes a transport method in which a thin plate is temporarily fixed to a support plate with an adhesive material, a peripheral portion of the adhesive material is sealed with a seal material, and the support plate on which the thin plate is temporarily fixed is transported. .

  For example, Patent Document 7 discloses a thin glass laminate obtained by laminating a thin glass substrate and a supporting glass substrate, and the thin glass and the supporting glass substrate have easy peelability and non-adhesiveness. The thin glass laminated body characterized by laminating | stacking through the silicone resin layer which has is described. Then, in order to peel the supporting glass substrate from the thin glass substrate, it is only necessary to apply a force to separate the thin glass substrate from the supporting glass substrate in the vertical direction. It is described that it can be more easily separated by injecting air.

  In addition to the attempt to further reduce the thickness of the glass substrate itself used in the display device as described above, there is naturally a method of reducing the thickness of the constituent members other than the glass substrate constituting the liquid crystal display device. As one of the methods, there is a method of thinning a polarizer (also referred to as a polarization separation element) that exhibits polarization separation ability in the visible light region, which is indispensable for a liquid crystal display device. Usually, this polarizer is bonded in the form formed on a film-like substrate after the liquid crystal cell is completed. For this reason, the thickness of the base film is added. On the other hand, Patent Document 8 proposes a method of forming a polarizer on a glass substrate.

Japanese Unexamined Patent Publication No. 2000-241804 Japanese Unexamined Patent Publication No. 58-54316 Japanese Laid-Open Patent Publication No. 2003-216068 Japanese Patent Laid-Open No. 8-86993 Japanese Patent Laid-Open No. 9-105896 Japanese Unexamined Patent Publication No. 2000-252342 International Publication No. 2007/018028 Pamphlet Japanese Unexamined Patent Publication No. 2005-242080

  However, a method of fixing the glass substrates described in Patent Document 1 using electrostatic adsorption force or vacuum adsorption force, a method of fixing both ends of the glass substrate described in Patent Document 2 using glass frit, or In the method of merging two glass substrates by irradiating the vicinity of the edge surface of the peripheral portion described in Patent Document 3, the glass substrates are laminated and adhered without any intermediate layer, and thus mixed between the glass substrates. Distortion defects occur in the glass substrate due to foreign matters such as bubbles and dust. Therefore, it is difficult to obtain a glass substrate laminate having a smooth surface.

  Moreover, in the method of disposing an adhesive layer or the like between the glass substrates described in Patent Documents 4 to 6, both glass substrates can be avoided although the occurrence of distortion defects due to mixing of bubbles or the like between the glass substrates as described above can be avoided. Is difficult to separate, and the thin glass substrate may be damaged during the separation. Further, the remaining adhesive on the thin glass substrate after separation also becomes a problem.

  On the other hand, according to the thin glass laminate described in Patent Document 7, a distortion defect due to mixing of bubbles or the like between the glass substrates as described above hardly occurs. It is also possible to peel the thin glass substrate and the supporting glass substrate. Furthermore, the problem of remaining adhesive on the thin glass substrate after separation is solved. For this reason, this method is effective as a method for further reducing the thickness of the glass substrate itself used in the display device.

  Next, a substrate on which a polarizer is formed on a glass substrate described in Patent Document 8 is a thing mainly made as a polarization separation element of a liquid crystal projector device, and is a thing installed alone in the middle of an optical path. It is impossible to flow the color filter forming process and the TFT array forming process using this as a substrate. This is because when the substrate is transported in both of the above-described steps, the surface on which the polarizer is formed is transported so that the transport roller and the metal tray are in contact with each other. There is a problem that the child gets hurt. Further, when the polarizing element is directly formed on the glass substrate after assembling the liquid crystal cell, there is a possibility that the organic matter of the color filter and the liquid crystal itself may be deteriorated by the processing in the polarizer forming step.

  The present inventor has intensively studied in order to solve the above problems, and has completed the present invention.

The present invention relates to the following (1) to (14).
(1) A device substrate having a first main surface and a second main surface, a support substrate having a first main surface and a second main surface, and a first main surface of the device substrate and a first main surface of the support substrate A laminate with a polarizer having a resin layer in between, wherein the reflective polarizer is present on the first main surface of the device substrate, and the resin is in contact with the surface of the device substrate on which the reflective polarizer is present The laminated body with a polarizer in which the surface of a layer has peelability.
(2) The laminated body with a polarizer according to (1), wherein the reflective polarizer is a wire grid polarizer.
(3) The pitch (Pm) of the fine metal wires of the wire grid polarizer is 50 to 200 nm, and the ratio of the fine metal wire width (Dm) to the pitch (Pm) (Dm / Pm) is 0.1 to 0. 6. The laminate with a polarizer according to (2), which is 6.
(4) The polarizer according to any one of (1) to (3), wherein the resin forming the resin layer is at least one selected from a fluororesin, an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin. Laminated body.
(5) The laminated body with a polarizer in any one of (1)-(4) whose thickness of the said resin layer is 5-50 micrometers.
(6) The device substrate and the support substrate are made of the same material, and the difference in linear expansion coefficient between the device substrate and the support substrate is 150 × 10 ⁻⁷ / ° C. or less (1) to (5) The laminated body with a polarizer in any one of.
(7) The device substrate and the support substrate are made of different materials, and the difference in linear expansion coefficient between the device substrate and the support substrate is 700 × 10 ⁻⁷ / ° C. or less (1) to (5) The laminated body with a polarizer in any one of.
(8) A panel for a display device with a support, having a display device member on a second main surface of the device substrate in the laminate with a polarizer according to any one of (1) to (7).
(9) A display device panel formed using the support-equipped display device panel according to (8).
(10) A display device having the display device panel according to (9).
(11) A method for producing a laminate with a polarizer according to any one of (1) to (7), wherein a polarizer is formed on a first main surface of the device substrate, and a reflective polarizer is formed. The device layer is formed by laminating a resin layer forming step of forming a resin layer having a peelable surface on the first main surface of the support substrate, the device substrate with a reflective polarizer, and the support substrate with a resin layer. A method for producing a laminate with a polarizer, comprising: an adhesion step of bringing a peelable surface of the resin layer into close contact with a surface of a substrate on which a reflective polarizer is present.
(12) The support-equipped display comprising the production method according to (11) and a step of forming a display device member on the second main surface of the device substrate in the obtained laminate with a polarizer. Manufacturing method of panel for apparatus.
(13) The manufacturing method according to (12) above, and the surface of the device substrate on which the reflective polarizer is present and the peelable surface of the resin layer in the obtained display panel with a support are peeled off. A method for producing a panel for a display device, comprising a peeling step.
(14) A manufacturing method of a display device comprising the manufacturing method according to (13) and a step of obtaining a display device using the obtained display device panel.

The laminated body obtained by the present invention can provide a laminated body with a polarizer that can produce a display device thinner than a conventional display device.
In addition, it is possible to provide a method by which the laminate with a polarizer as described above can be easily and economically manufactured without the presence of foreign matters such as bubbles and dust between the device substrate and the support substrate.
Moreover, it aims at providing the panel for display apparatuses with a support containing such a laminated body with a polarizer.
In addition, it is possible to provide a display device panel and a display device that are formed using such a support-equipped display device panel.
Furthermore, a display device panel with a support, a display device panel, and a method for manufacturing the display device can be provided.

FIG. 1: is a schematic sectional drawing which shows embodiment of the laminated body with a polarizer of this invention. FIG. 2 is a schematic front view showing the embodiment of FIG. FIG. 3 is a schematic perspective view showing an embodiment of a device substrate with a polarizer. FIG. 4 is a schematic perspective view showing another embodiment of a device substrate with a polarizer. FIG. 5 is a schematic cross-sectional view for explaining a process of forming ridges on a roll-shaped device substrate. 6 is a schematic front view for explaining an embodiment of a device substrate with ridges of Example 2. FIG. FIG. 7 is a schematic cross-sectional view for explaining the vapor deposition conditions of Example 2.

  An embodiment of a laminate with a polarizer of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic cross-sectional view showing an embodiment of a laminate with a polarizer of the present invention (hereinafter also simply referred to as “laminate”).
FIG. 2 is a schematic front view seen from the second main surface side of the device substrate of the present embodiment. However, FIG. 2 shows only the first main surface of the device substrate, the first main surface of the support substrate, and the reflective polarizer for easy understanding.
The laminate 10 of the present embodiment includes a device substrate 12, a support substrate 13, and a resin layer 14, and the resin layer 14 is between the first main surface 12a of the device substrate 12 and the first main surface 13a of the support substrate 13. Exists. Further, the reflective polarizer 11 is present on the first main surface 12 a of the device substrate 12.
The resin layer 14 is fixed to the first main surface 13a of the support substrate 13 and is in close contact with the surface of the device substrate 12 on which the reflective polarizer 11 is present. Further, the resin layer 14 has releasability from the surface of the device substrate 12 on which the reflective polarizer 11 is present. Here, the main surface on the support substrate 13 side (resin layer 14 side) of the two main surfaces of the device substrate 12 is the first main surface 12a, and the opposite main surface is the second main surface 12b. It is. Of the two main surfaces of the support substrate 13, the main surface of the device substrate 12 (the side where the resin layer 14 exists) is the first main surface 13 a, and the opposite main surface is the second main surface. 13b.
Next, each of the device substrate, the support substrate, the resin layer, and the reflective polarizer present on the first main surface of the device substrate included in the laminate of the present invention will be described.

The device substrate in the present invention will be described.
The thickness, shape, size, physical properties (thermal shrinkage, surface shape, chemical resistance, etc.), composition, etc. of the device substrate are not particularly limited, and may be the same as, for example, a conventional glass substrate for a display device. Further, it may be a resin substrate.

  The thickness of the device substrate is not particularly limited, but is preferably less than 0.7 mm, more preferably 0.5 mm or less, and further preferably 0.4 mm or less. Further, it is preferably 0.05 mm or more, more preferably 0.07 mm or more, and further preferably 0.1 mm or more.

  The shape of the device substrate is not particularly limited, but is preferably rectangular. Here, the rectangle is substantially a rectangle and includes a shape in which the corners of the peripheral part are cut off (corner cut).

  Although the magnitude | size of a device substrate is not restrict | limited, For example, in the case of a rectangle, it may be 100-2000 mm x 100-2000 mm, and it is preferable that it is 500-1000 mm x 500-1000 mm.

  Even with such a preferable thickness and preferable size, the laminate of the present invention can easily peel the device substrate with a polarizer and the support substrate.

The characteristics of the device substrate, such as the thermal shrinkage rate, surface shape, and chemical resistance, are not particularly limited, and vary depending on the type of display device to be manufactured.
However, the thermal contraction rate of the device substrate is preferably small. Specifically, when the device substrate is glass, the linear expansion coefficient, which is an index of the heat shrinkage rate, is preferably 150 × 10 ⁻⁷ / ° C. or less, preferably 100 × 10 ⁻⁷ / ° C. or less. More preferably, it is more preferably 45 × 10 ⁻⁷ / ° C. or less. If the device substrate is a synthetic resin, it is preferable to use one that is 700 × 10 ⁻⁷ / ° C. or less, more preferably 650 × 10 ⁻⁷ / ° C. or less, and 500 × 10 ⁻⁷ / ° C. or less. More preferably it is. The reason is that it is difficult to make a high-definition display device when the thermal contraction rate is large. In addition, the linear expansion coefficient of the device substrate is preferably 5 × 10 ⁻⁷ / ° C. or more in both cases where the device substrate is glass and synthetic resin.

  In addition, in this invention, a linear expansion coefficient means a thing prescribed | regulated to JISR3102 (1995).

When the device substrate is made of glass, the composition thereof may be similar to, for example, a conventionally known glass containing an alkali metal oxide or an alkali-free glass. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.
On the other hand, the resin substrate is not particularly limited as long as it is a resin having transparency. However, an application to which the laminate of the present invention is preferably applied is a liquid crystal display device. Therefore, it is a thermoplastic resin such as polyester, polycarbonate, polyarylate, polyethersulfone, poly (cyclo) olefin, or a thermosetting resin such as epoxy, transparent polyimide, or acrylic, and has optical isotropy. It is preferable to use a resin having

Next, the support substrate in the present invention will be described.
The support substrate supports the device substrate via the resin layer and reinforces the strength of the device substrate.

The thickness, shape, size, physical properties (heat shrinkage rate, surface shape, chemical resistance, etc.), composition, etc. of the support substrate are not particularly limited.
The thickness of the support substrate is not particularly limited, but it is necessary that the thickness of the laminate of the present invention be such that it can be processed on the current display panel production line.
For example, the thickness is preferably 0.1 to 1.1 mm, more preferably 0.3 to 0.8 mm, and still more preferably 0.4 to 0.7 mm.
For example, when the current production line is designed to process a substrate having a thickness of 0.5 mm, and the device substrate has a thickness of 0.1 mm, the thickness of the support substrate and the thickness of the resin layer Is 0.4 mm. The current production line is most commonly designed to process a glass substrate having a thickness of 0.7 mm. For example, if the thickness of the device substrate is 0.4 mm, The sum of the thickness and the thickness of the resin layer is 0.3 mm.

  The thickness of the support substrate is preferably thicker than the thickness of the device substrate.

  The shape of the support substrate is not particularly limited, but is preferably rectangular. Here, the rectangle is substantially a rectangle and includes a shape in which the corners of the peripheral part are cut off (corner cut).

The size of the support substrate is not limited, but is preferably about the same as the size of the device substrate, and is preferably slightly larger than the device substrate (each about 0.05 to 10 mm larger in the vertical direction or the horizontal direction). . The reason is that it is easy to protect the end portion of the device substrate from the contact of the alignment device such as the positioning pin during the manufacture of the display device panel, and the device substrate and the support substrate can be more easily separated. .
Here, the vertical is the direction of the short side of the device substrate in FIG. 2 and the direction of the arrow Xa, and the horizontal is the direction of the long side of the device substrate and the direction of the arrow Xb in FIG. Means.

The linear expansion coefficient of the support substrate may be substantially the same as or different from the linear expansion coefficient of the device substrate. Substantially the same is preferable in that the device substrate or the support substrate is less likely to be warped when the laminate of this embodiment is heat-treated.
The device substrate and the support substrate are made of the same material, and the difference in coefficient of linear expansion between the device substrate and the support substrate is preferably 150 × 10 ⁻⁷ / ° C. or less, and 100 × 10 ⁻⁷ / ° C. or less. More preferably, it is 50 × 10 ⁻⁷ / ° C. or less.
The device substrate and the support substrate are made of different materials, and the difference in coefficient of linear expansion between the device substrate and the support substrate is preferably 700 × 10 ⁻⁷ / ° C. or less, and 650 × 10 ⁻⁷ / ° C. or less. More preferably, it is 500 × 10 ⁻⁷ / ° C. or less.

The material of the support substrate is not particularly limited, and the material is not particularly limited as long as the material has rigidity capable of supporting the device substrate such as glass, synthetic resin, or metal.
When glass is employed as the material for the support substrate, the composition thereof may be the same as that of glass containing an alkali metal oxide or non-alkali glass, for example. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.
When plastic (synthetic resin) is used as the material for the support substrate, the type is not particularly limited. For example, polyethylene terephthalate resin, poly (cyclo) olefin resin polycarbonate resin, polyimide resin, fluororesin, polyamide resin, polyaramid resin, Examples include polyethersulfone resins, polyetherketone resins, polyetheretherketone resins, polyethylene naphthalate resins, polyepoxy resins, polyacrylic resins, various liquid crystal polymer resins, and silicone resins.
When a metal is employed as the material for the support substrate, the type is not particularly limited, and examples thereof include stainless steel and copper.

Next, the resin layer in the present invention will be described.
In the laminate of the present invention, the resin layer is fixed to the first main surface of the support substrate. And although the resin layer is closely_contact | adhered to the surface in which the reflection type polarizer of the said device substrate exists, it can peel easily. In other words, the resin layer is bonded to the surface on which the reflective polarizer is present with a certain degree of bonding force, but at the time of peeling, the bonding force is such that it can be easily peeled without adversely affecting the reflective polarizer. Are combined. For example, at the time of peeling, the structure can be peeled without damaging the structure of the reflective polarizer and without causing a resin residue on the surface of the reflective polarizer. In this invention, the property which can peel easily on the surface of a resin layer is called peelability.
In the laminate of the present invention, the surface of the device substrate where the reflective polarizer is present and the resin layer are not attached by the adhesive force that the adhesive has, and the force caused by van der Waals force between solid molecules. That is, it is preferable that it is attached by adhesion.
On the other hand, the binding force of the resin layer to the first main surface of the support substrate is relatively higher than the binding force to the surface on which the reflective polarizer exists. In the present invention, the coupling of the device substrate to the surface where the reflective polarizer exists is referred to as adhesion, and the coupling to the first main surface of the support substrate is referred to as fixing. Hereinafter, the surface of the device substrate on which the reflective polarizer is present is also simply referred to as the device substrate surface or the first main surface of the device substrate.

  The thickness of the resin layer is not particularly limited. It is preferably 5 to 50 μm, more preferably 5 to 30 μm, and even more preferably 7 to 20 μm. This is because when the thickness of the resin layer is in such a range, the surface of the device substrate and the resin layer are sufficiently adhered. Moreover, even if bubbles or foreign substances are present, it is possible to suppress the occurrence of distortion defects in the device substrate. On the other hand, if the resin layer is too thick, it takes time and materials to form the resin layer, which is not economical.

In addition, the resin layer may consist of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the layers.
Moreover, when a resin layer consists of two or more layers, the kind of resin which forms each layer may differ.

The surface tension of the peelable surface of the resin layer is preferably 30 mN / m or less, more preferably 25 mN / m or less, and further preferably 22 mN / m or less. Moreover, it is preferable that the surface tension of the peelable surface of the resin layer is 15 mN / m or more. This is because such surface tension can be more easily peeled off from the device substrate surface, and at the same time, adhesion to the device substrate surface is sufficient.
The resin layer is preferably made of a material having a glass transition point lower than room temperature (about 25 ° C.) or having no glass transition point. This is because it becomes a non-adhesive resin layer, has higher releasability, can be more easily peeled off from the device substrate surface, and at the same time, adhesion to the device substrate surface becomes sufficient.
Moreover, it is preferable that the resin layer has heat resistance. For example, when the display device member is formed on the second main surface of the device substrate, the laminate of the present invention can be subjected to heat treatment.
Also, if the elastic modulus of the resin layer is too high, the adhesion with the device substrate surface tends to be low, which is not preferable. If the elastic modulus is too low, the peelability is lowered.

  The kind of resin that forms the resin layer is not particularly limited. For example, a fluororesin, an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin can be used. Several types of resins can be mixed and used. Of these, silicone resins are preferred. This is because the silicone resin is excellent in heat resistance and excellent in peelability from the device substrate. In addition, when the curable silicone resin is cured on the surface of the support substrate to form the silicone resin layer, the resin layer is easily fixed to the support substrate by a condensation reaction with the silanol group on the surface of the support substrate. It is also preferable that the silicone resin layer is not substantially deteriorated in peelability even when treated at about 300 to 400 ° C. for about 1 hour.

  The resin layer is preferably a cured product of a curable silicone for release paper among silicone resins. The silicone for release paper is mainly composed of silicone containing linear dimethylpolysiloxane in the molecule. Since the resin layer formed by curing the composition containing the main agent and the crosslinking agent on the surface (first main surface) of the support substrate using a catalyst, a photopolymerization initiator, etc. has excellent peelability. preferable. In addition, since the flexibility is high, even when foreign matter such as bubbles or dust is mixed between the device substrate and the resin layer, the occurrence of the distortion defect of the device substrate can be suppressed.

  Such release paper silicones are classified into condensation reaction type silicones, addition reaction type silicones, ultraviolet ray curable type silicones and electron beam curable type silicones depending on their curing mechanism, and any of them can be used. Among these, addition reaction type silicone is preferable. This is because the curing reaction is easy, the degree of peelability is good when the resin layer is formed, and the heat resistance is also high.

  The release paper silicone is classified into a solvent type, an emulsion type, and a solventless type, and any type can be used. Among these, a solventless type is preferable. This is because productivity, safety, and environmental characteristics are excellent. Further, since a solvent that causes foaming is not included at the time of curing when forming the resin layer, that is, at the time of heat curing, ultraviolet curing, or electron beam curing, bubbles are unlikely to remain in the resin layer.

Moreover, as the silicone for release paper, specifically, as the trade name or model number commercially available, KNS-320A, KS-847 (both manufactured by Shin-Etsu Silicone), TPR6700 (manufactured by GE Toshiba Silicone), vinyl silicone “8500” "(Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane" 12031 "(Arakawa Chemical Industries, Ltd.), vinyl silicone" 11364 "(Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane" 12031 "(made by Arakawa Chemical Co., Ltd.), vinyl silicone" 11365 "(made by Arakawa Chemical Co., Ltd.) and methylhydrogenpolysiloxane" 12031 "(made by Arakawa Chemical Co., Ltd.), etc. It is done.
KNS-320A, KS-847, and TPR6700 are silicones that contain a main agent and a crosslinking agent in advance.

  Moreover, it is preferable that the silicone resin which forms a resin layer has the property that the component in a silicone resin layer does not transfer easily to a device substrate, ie, low silicone transferability.

Next, the reflective polarizer in the present invention will be described.
A polarizer is an element that is used in an image display device such as a liquid crystal display device, a rear projection television, and a front projector, and that exhibits polarization separation in the visible light region. Examples of polarizers (also referred to as polarization separation elements) include absorption polarizers and reflection polarizers.

An absorptive polarizer is, for example, a polarizer in which a dichroic dye such as iodine is oriented in a resin film, and has low heat resistance.
On the other hand, the reflective polarizer has a feature that the light utilization efficiency can be increased by allowing the light reflected without entering the polarizer to re-enter the polarizer. Therefore, the need for a reflective polarizer is increasing for the purpose of increasing the brightness of LCDs and the like.

  Examples of the reflective polarizer include a linear polarizer made of a birefringent resin laminate, a circular polarizer made of cholesteric liquid crystal, and a wire grid polarizer. Among these, a wire grid polarizer is particularly preferable for the purpose of the present invention, which is to reduce the thickness of the display device.

  The wire grid type polarizer has a structure in which a plurality of fine metal wires are arranged in parallel and at a constant pitch on a light-transmitting substrate. When the pitch of the fine metal wire is sufficiently shorter than the wavelength of the incident light, the component having an electric field vector orthogonal to the length direction of the fine metal wire (that is, p-polarized light) is transmitted in the incident light, and the length direction of the fine metal wire The component having an electric field vector parallel to (ie, s-polarized light) is reflected.

3 and 4 are schematic perspective views of a device substrate with a polarizer, which is a part of the laminate of the present invention in which a wire grid polarizer is formed on the first main surface of the device substrate.
As a wire grid type polarizer exhibiting polarization separation in the visible light region, a thin metal wire 35 having a predetermined width, pitch and length is formed on the first main surface 32a of the device substrate 32 as shown in FIG. As shown in FIG. 4, the upper part of the plurality of ridges 46 formed on the first main surface 42a of the device substrate 42 with a predetermined width, pitch, height, and length as shown in FIG. A wire grid type polarizer coated with a film 47 made of a material to form a fine metal wire, and a fine metal wire and a low reflectivity member (with a predetermined width, pitch and height) on the first main surface of the device substrate ( For example, a wire grid type polarizer formed with SiO ₂ or the like.

  Next, the shape of the thin metal wire of the wire grid type polarizer will be described. The height Hm of the fine metal wire is preferably 30 nm to 200 nm, and more preferably 40 to 150 nm. With this height, s-polarized light transmission is suppressed particularly in the short wavelength region, and the wire grid polarizer can exhibit sufficiently high polarization separation ability. In addition, since the occurrence of the diffraction phenomenon due to the fine metal wire is suppressed, it is possible to suppress a decrease in light transmittance of the polarizer.

  The basic function of the wire grid polarizer is determined by the width Dm and the pitch Pm of the fine metal wires. As shown in FIGS. 3 and 4, the width Dm of the fine metal wire is a distance in a direction perpendicular to the length Lm direction of the fine metal wire, and the pitch Pm of the fine metal wire is a repetition distance in the width direction of the fine metal wire. The ratio (Dm / Pm) between the width Dm of the fine metal wires and the pitch Pm of the fine metal wires is preferably 0.1 to 0.6, and more preferably 0.2 to 0.5. By setting Dm / Pm to 0.1 or more, the wire grid polarizer exhibits a higher degree of polarization with respect to light incident from the surface (surface on which the fine metal wires are formed). By setting Dm / Pm to 0.6 or less, the p-polarized light transmittance becomes higher.

The pitch Pm of the fine metal wires is preferably 300 nm or less, and more preferably 50 to 200 nm. By setting the pitch Pm of the fine metal wires to 300 nm or less, the wire grid polarizer exhibits a sufficiently high reflectance and a sufficiently high polarization separation ability even in a short wavelength region near 400 nm. Moreover, the coloring phenomenon by diffraction is suppressed.
The width Dm of the fine metal wire is more preferably 10 to 120 nm, and 30 to 100 nm is particularly preferable in consideration of the ease of forming a metal layer by vapor deposition on the top of the ridge.

The material of the metal thin wire may be a metal material having sufficient conductivity, but is preferably a material that takes into consideration characteristics such as corrosion resistance in addition to conductivity. Examples of the metal material include a simple metal, an alloy, a dopant, and a metal containing a predetermined amount or less of impurities. For example, aluminum, silver, chromium, magnesium, an aluminum alloy, a silver alloy, and the like can be given. Moreover, the metal which contains nonmetallic elements, such as carbon, as a dopant etc. can also be used. Aluminum, aluminum-based alloy, silver, chromium, and magnesium are preferable, and aluminum and aluminum-based alloy are particularly preferable because they have high visible light reflectivity, low visible light absorption, and high conductivity.
The fine metal wire may be formed directly on the first main surface of the device substrate, or may be through a base layer such as a metal oxide. Further, as described above, the protrusion may be formed on the surface of the protrusions of the protrusion forming layer made of a material such as resin formed on the first main surface of the device substrate.

A panel for a display device with a support can be obtained by forming a display device member on the second main surface of the device substrate with a polarizer in the laminate of the present invention.
The display device member is a protective layer, a TFT array (hereinafter simply referred to as “array”), a color filter, a liquid crystal, indium tin oxide (ITO), or the like, on a surface of a conventional device substrate for a liquid crystal display device. It means a transparent electrode made of zinc oxide or the like, various circuit patterns, and the like.
The display device panel with a support of the present invention includes, for example, an array forming surface of the display device panel with a support according to the present invention in which an array is formed on the second main surface of the device substrate, and a color filter of the device substrate. The form which bonded together the color filter formation surface of the panel for display apparatuses with a support body of the other this invention formed in the 2nd main surface through the sealing material etc. is also contained.

  Further, a display device panel can be obtained from such a support-equipped display device panel. The display device panel and the display device can be obtained by peeling the device substrate of the support-equipped display device panel from the resin layer fixed to the support substrate. An example of the display device is a liquid crystal display device. Examples of the liquid crystal display device include TN type, STN type, FE type, TFT type, and MIM type.

Next, the manufacturing method of the laminated body of this invention is demonstrated.
Although the manufacturing method of the laminated body of this invention is not restrict | limited in particular, It has a peelable surface in the 1st main surface of the said support substrate, and the polarizer formation process which forms a reflection type polarizer in the 1st main surface of the said device substrate. A resin layer forming step for forming a resin layer, the device substrate with a reflective polarizer and the support substrate with a resin layer are laminated, and the resin layer is peeled off on the surface of the device substrate on which the reflective polarizer exists. It is preferable that it is a manufacturing method of the laminated body which comprises the contact | adherence process which adheres a conductive surface. Hereinafter, such a production method is also referred to as a “production method of the present invention”.

  The manufacturing method of the device substrate and the support substrate itself in the manufacturing method of the present invention is not particularly limited. Each can be produced by a conventionally known method. For example, when the substrate is made of glass, it can be obtained by, for example, melting a conventionally known glass raw material into a molten glass, and then forming it into a plate shape by a float method, a fusion method, a down draw method, a slot down method, a redraw method, or the like. it can.

The polarizer formation process in the manufacturing method of this invention is demonstrated.
A method for forming the wire grid polarizer on the device substrate is not particularly limited. For example, the following two methods can be employed. One is a method in which a metal thin film is formed on a device substrate, and then a fine metal wire is formed using a photolithography method. The other is a method in which a resin layer having ridges is formed on a device substrate, a metal layer is formed on the ridges by a method such as vapor deposition or CVD, and a fine metal wire is formed.

  Examples of a method for forming a resin layer having ridges on a device substrate include an imprint method (an optical imprint method and a thermal imprint method). The optical imprint method is particularly preferable because the groove can be accurately transferred.

  In the optical imprint method, for example, a mold in which a plurality of grooves are formed in parallel with each other at a predetermined pitch by a combination of electron beam drawing and etching, and the grooves of the mold are formed on the surface of an arbitrary substrate. This is a method of forming a resin layer having ridges by transferring to a photocurable composition applied to the film and simultaneously photocuring the photocurable composition.

The production of the ridges by the optical imprint method is specifically performed through the following steps (A) to (D).
(A) The process of apply | coating a photocurable composition to the 1st main surface of a device substrate.
(B) A step of pressing a mold in which a plurality of grooves are formed in parallel with each other at a predetermined pitch against the photocurable composition so that the grooves are in contact with the photocurable composition.
(C) A resin having a plurality of ridges corresponding to the grooves of the mold by irradiating radiation (ultraviolet rays, electron beams, etc.) with the mold pressed against the photocurable composition to cure the photocurable composition. Creating a layer.
(D) The process of peeling a mold from the resin layer which has a some protruding item | line.

The production of the ridges by the thermal imprint method is specifically performed through the following steps (E) to (G).
(E) A step of forming a thermoplastic resin transfer film on the first main surface of the device substrate, or a process of producing a thermoplastic resin transfer film.
(F) A glass having a glass transition temperature (Tg) or a melting point (Tm) of a thermoplastic resin so that the groove is in contact with the film to be transferred or the film to be transferred, in a mold in which a plurality of grooves are formed in parallel with each other at a constant pitch. A step of producing a resin layer having a plurality of ridges corresponding to the grooves of the mold by being pressed against the heated film or film to be heated.
(G) A step of cooling the resin layer having a plurality of ridges to a temperature lower than Tg or Tm and peeling the substrate from the mold.

  After forming the ridges by the imprint method, a metal thin wire is formed by vapor-depositing a metal material obliquely from above the plurality of ridges. Examples of the vapor deposition method include physical vapor deposition methods such as vacuum vapor deposition, sputtering, and ion plating.

When the thickness of the device substrate is very thin, for example, 0.1 mm or less, the device substrate itself can be rolled up. Therefore, the device substrate once wound up in a roll shape is set on a delivery roll, the device substrate is continuously delivered, and a polarizer resin layer is formed on the first main surface of the device substrate using a polarizer resin coating means. To do. Then, the said resin layer for polarizers is stuck to the cylindrical roll which has a groove on a curved surface, a protrusion is transferred to the resin layer for a polarizer, and the resin layer for polarizer which has a protrusion is formed. At this time, if an active energy ray-curable resin or the like is used for the polarizer resin layer having the ridges, the opposite side of the device substrate (the resin for the polarizer of the ridges) is brought into close contact with the curved surface of the cylindrical roll. By irradiating ultraviolet rays or the like from the side opposite to the layer forming surface, the shape of the applied ridges can be more reliably fixed, which is preferable. After providing the said protruding item | line, the device board | substrate provided with the resin layer for polarizers which has a protruding item | line is wound up on a winding roll.
And next, the said winding roll is set to the sending-out part of a continuous vapor deposition apparatus, the said device substrate is sent out continuously, and a metal material is vapor-deposited on the upper part of a protruding item | line. Through the above process, the wire grid polarizer is continuously formed on the first main surface of the device substrate. Lastly, a device substrate with a wire grid polarizer can be manufactured with very high productivity by appropriately cutting a device substrate on which a wire grid polarizer is continuously formed and forming a single substrate.

  As a method for forming a wire grid type polarizer on a roll-shaped device substrate, the optical imprint method is particularly preferable because of its high productivity. FIG. 5 is a conceptual diagram showing a method of forming a resin layer for a polarizer having ridges on a roll-shaped device substrate by an optical imprint method. In this manufacturing method, a device substrate supply means 51, a polarizer resin (referred to as the photocurable composition, hereinafter the same) application means 52, a nip roll 53, and a flat plate mold having concave stripes are attached to a roll curved surface. A gravure roll 54, a polarizer resin curing means 55, a peeling roll 56, and a device substrate winding means 57 are configured.

  The device substrate supply means 51 sends out a roll-shaped device substrate toward the polarizer resin coating means 52. The device substrate supply roll 51a, the peeling roll 51b for peeling off the protective film of the device substrate, and the peeled protective film Winding roll 51c.

  The polarizer resin application means 52 is an apparatus for forming a polarizer resin layer by applying a polarizer resin to the first main surface of the device substrate, and supplies the polarizer resin. A supply source 52a, a coating head 52b, a coating roller 52c that wraps and supports a device substrate during coating, and a pipe 52d for supplying the polarizer resin from the polarizer resin supply source 52a to the coating head 52b And a pump 52e.

The gravure roll 54 is an apparatus for forming ridges on the polarizer resin layer applied to the first main surface of the device substrate. The gravure roll 54 has a cylindrical shape, and the curved surface has a shape for the polarizer. A regular fine concavo-convex pattern having a shape obtained by inverting the ridges formed on the resin layer is formed. The fine concavo-convex pattern is required to have shape accuracy, mechanical strength, flatness, and the like. As the shape of the fine uneven pattern, a rectangular shape is desirable.
The gravure roll 54 is preferably made of metal or resin.

As a method for forming a regular fine concavo-convex pattern on the curved surface of the gravure roll 54, a method of forming by cutting with a diamond tool, a method of forming by photo etching, electron beam drawing, laser processing, or the like can be employed. Further, a fine uneven pattern is formed on the surface of a thin metal plate by photo etching, electron beam drawing, laser processing, stereolithography, etc., and the plate is formed by a gravure roll 54 base material. It is also possible to adopt a method in which a gravure roll 54 is formed by being wound around a curved surface of a certain cylindrical roll. In addition, the surface of a plate-shaped body that is easier to process than metal is formed by inverting a fine uneven pattern by photoetching, electron beam drawing, laser processing, stereolithography, etc., and the plate thickness is thin using electroforming. It is also possible to adopt a method in which a fine uneven pattern is formed on the surface of a metal plate, and the plate is wound around and fixed to the curved surface of the base material of the gravure roll 54 to form the gravure roll 54.
It is preferable to perform a mold release process on the curved surface of the gravure roll 54. Thus, the shape of the fine concavo-convex pattern can be satisfactorily maintained by performing the mold release process on the curved surface of the gravure roll 54. As the mold release treatment, various known methods such as coating treatment with a fluororesin can be employed. The gravure roll 54 is preferably provided with driving means.

  The nip roll 53 is an apparatus that forms a roll while pressing the device substrate in a pair with the gravure roll 54, and is required to have predetermined mechanical strength, roundness, and the like. The longitudinal elastic modulus (Young's modulus) of the surface of the nip roll 53 is set to an appropriate value because roll molding is insufficient if it is too small, and if it is too large, it reacts sensitively to entrainment of foreign matters such as dust and tends to cause defects. Preferably, for example, 4 MPa to 100 MPa is preferable. The nip roll 53 is preferably provided with driving means. The nip roll 53 rotates in the opposite direction to the gravure roll 54. The gravure roll 54 and the nip roll 53 are preferably synchronized in rotational speed.

  In order to apply a predetermined pressing force between the gravure roll 54 and the nip roll 53, it is preferable to provide a pressing means on either the gravure roll 54 or the nip roll 53. It is preferable to provide fine adjustment means on either the gravure roll 54 or the nip roll 53 so that the gap (clearance) between the gravure roll 54 and the nip roll 53 can be accurately controlled.

The resin curing means 55 for the polarizer is a light irradiation means provided to face the gravure roll 54 on the downstream side of the nip roll 53. The polarizer resin curing means 54 cures the polarizer resin layer formed on the first main surface of the device substrate by light irradiation. It is preferable that light having a wavelength corresponding to the curing characteristics of the resin layer for the polarizer can be irradiated and light having a light amount corresponding to the transport speed of the device substrate can be irradiated. As the polarizer resin curing means 55, a cylindrical lamp having a length substantially the same as the width of the device substrate can be adopted. Further, a plurality of the cylindrical lamps can be provided in parallel, and a reflector can be provided on the back surface of the cylindrical lamp.
In the case where the temperature of the polarizer resin layer is increased by the polarizer resin curing means 55, a configuration in which a cooling means is provided on the gravure roll 54 can also be adopted.

  The peeling roll 56 is a pair with the gravure roll 54 and peels off the device substrate to which the resin layer having the ridges is applied from the gravure roll 54, and may have predetermined mechanical strength, roundness, and the like. Desired. At the peeling location, the device substrate wound on the curved surface of the gravure roll 54 is sandwiched between the rotating gravure roll 54 and the peeling roll 56, and the device substrate is peeled off from the gravure roll 54 and wound around the peeling roll 56. Multiply. In order to ensure this operation, the peeling roll 56 is preferably provided with a driving means. The peeling roll 56 rotates in the opposite direction to the gravure roll 54.

  The device substrate winding means 57 winds the peeled device substrate and stores it in a roll shape, and is composed of a device substrate winding roll or the like. In the device substrate winding means 57, a configuration is also adopted in which the protective film is supplied to the first main surface side of the device substrate and is stored in the device substrate winding means 57 in a state where the device substrate and the protective film overlap each other. it can.

In the above-described polarizer manufacturing method, a guide roller or the like that forms a conveyance path for a device substrate between the resin application means 52 for the polarizer and the gravure roll 54, between the peeling roll 56 and the winding means 57 for the device substrate, etc. In addition, a tension roller or the like can be provided as needed to absorb slack during the transfer of the device substrate.
In addition, the method of forming a fine uneven pattern is not only a method using a gravure roll in which a fine uneven pattern is formed on the curved surface of a cylindrical roll, but also a method in which a fine uneven pattern is formed on the surface of a belt-like body such as an endless belt. The method using is also included. Even in the formation method using such a belt-like body, the same operation and effect as the formation method using the cylindrical gravure roll can be obtained.

  After forming the ridge by the optical imprint method, a metal layer is formed by vapor deposition on the top of the ridge to form a thin metal wire, and a reflective polarizer is manufactured.

Next, the resin layer formation process in the manufacturing method of this invention is demonstrated.
The method for forming the resin layer on the surface (first main surface) of the support substrate is not particularly limited. For example, a method of adhering a film-like resin to the surface of the support substrate can be mentioned. Specifically, in order to give a high adhesive force to the surface of the film, a method of performing surface modification treatment (priming treatment) on the surface of the support substrate and adhering to the first main surface of the support substrate can be mentioned. For example, chemical methods such as silane coupling agents to improve adhesion (primer treatment), physical methods to increase surface active groups such as flame (flame) treatment, and surfaces such as sandblast treatment Examples of such a mechanical processing method increase the catch by increasing the roughness of the material.

Further, for example, a method of coating the first main surface of the support substrate with a resin composition that becomes a resin layer by a known method may be mentioned. Known methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. From such a method, it can select suitably according to a kind to a resin composition.
For example, when a solventless release paper silicone is used as the resin composition, a die coating method, a spin coating method or a screen printing method is preferred.

In the case of coating a resin composition on the first main surface of the supporting substrate, it is preferable that the coating amount is 1 to 100 g / ^{m 2,} and more preferably 5 to 20 g / ^{m 2.}

For example, when forming a resin layer from an addition reaction type silicone, a resin composition containing a silicone (main agent) containing a linear dimethylpolysiloxane in the molecule, a crosslinking agent and a catalyst is used for the known spray coating method or the like. The coating is applied to the first main surface of the support substrate by the method, and then heat-cured. The heat curing conditions vary depending on the blending amount of the catalyst. For example, when 2 parts by weight of the platinum-based catalyst is blended with respect to 100 parts by weight of the total amount of the main agent and the crosslinking agent, 50 to 250 ° C. in the atmosphere, The reaction is preferably performed at 100 ° C to 200 ° C. In this case, the reaction time is 5 to 60 minutes, preferably 10 to 30 minutes. In order to obtain a silicone resin layer having a low silicone migration property, it is preferable to advance the curing reaction as much as possible so that an unreacted silicone component does not remain in the silicone resin layer.
It is preferable that the reaction temperature and the reaction time are as described above because no unreacted silicone component remains in the silicone resin layer. If the reaction time is too long or the reaction temperature is too high, the oxidative decomposition of the silicone resin occurs at the same time, and a low molecular weight silicone component is produced, which may increase the silicone transferability. It is preferable to allow the curing reaction to proceed as much as possible so that an unreacted silicone component does not remain in the silicone resin layer in order to improve the peelability after the heat treatment.

  For example, when the resin layer is manufactured using release paper silicone, the release paper silicone coated on the first main surface of the support substrate is heat-cured to form a silicone resin layer, and then supported in the adhesion step. A device substrate is laminated on the silicone resin-formed surface of the substrate. By curing the silicone for release paper by heating, the cured silicone resin is chemically bonded to the support substrate. Further, the silicone resin layer is bonded to the support substrate by the anchor effect. By these actions, the silicone resin layer is firmly fixed to the support substrate.

The adhesion process in the production method of the present invention will be described.
The adhesion step is a step of laminating the device substrate with a reflective polarizer and the support substrate with a resin layer, and bringing the peelable surface of the resin layer into close contact with the surface of the device substrate where the reflective polarizer is present. is there. The surface of the device substrate where the reflective polarizer exists and the peelable surface of the resin layer can be bonded by the force caused by the van der Waals force between adjacent solid molecules, that is, the adhesion force. preferable. In this case, the support substrate and the device substrate can be held in a state of being laminated via the resin layer. In addition, since the height of the ridge of the polarizer is less than 100 nm, and the thickness of the resin layer is 5 μm or more, it is possible to follow the ridge shape by deformation of the resin layer.

  The method for laminating the device substrate with a reflective polarizer and the support substrate with a resin layer is not particularly limited. For example, it can implement using a well-known method. For example, after laminating the device substrate on the surface of the resin layer under a normal pressure environment, a method of pressure bonding the resin layer and the device substrate using a roll or a press can be mentioned. It is preferable because the resin layer and the device substrate are more closely adhered by pressure bonding with a roll or a press. In addition, bubbles mixed between the resin layer and the device substrate can be relatively easily removed by pressure bonding using a roll or a press. When pressure bonding is performed by a vacuum laminating method or a vacuum pressing method, it is more preferable because suppression of bubble mixing and securing of good adhesion are more preferably performed. By pressure bonding under vacuum, there is an advantage that even if a minute bubble remains, the bubble does not grow by heating, and it is difficult to cause a distortion defect of the device substrate.

  In the adhesion step, when laminating the device substrate with a reflective polarizer and the support substrate with a resin layer, it is preferable that the surface of the device substrate is sufficiently washed and laminated in a clean environment. Even if a foreign substance is mixed between the resin layer and the device substrate, the resin layer is deformed so that the flatness of the surface of the device substrate is not affected. However, the higher the cleanness, the better the flatness. Therefore, it is preferable.

  The laminate of the present invention can be produced by such a production method of the present invention.

A panel for a display device with a support by the manufacturing method further comprising the step of forming a member for a display device on the second main surface of the device substrate in the obtained laminate of the present invention. Can be manufactured.
Here, the display device member is not particularly limited. For example, an array or a color filter included in the liquid crystal display device can be given.

A method for forming such a display device member is not particularly limited, and may be the same as a conventionally known method.
For example, when manufacturing a TFT-LCD as a display device, a step of forming an array on a conventionally known glass substrate, a step of forming a color filter, a glass substrate on which the array is formed, and a glass substrate on which the color filter is formed It may be the same as various steps such as a step of bonding through a sealing material or the like (array / color filter bonding step). More specifically, examples of the processing performed in these steps include pure water cleaning, drying, film formation, resist coating, exposure, development, etching, and resist removal. Furthermore, as a process performed after implementing an array color filter bonding process, there exists a liquid-crystal injection | pouring process and the sealing process of the injection port performed after implementation of this process, The process implemented by these processes is mentioned.

  In this way, a panel for a display device with a support can be produced.

  Moreover, after obtaining such a panel for a display device with a support, in the obtained panel for a display device with a support, the surface of the device substrate on which the reflective polarizer is present and the peelability of the resin layer A display device panel can be obtained by a manufacturing method including a peeling step for peeling the surface. The method for peeling is not particularly limited. Specifically, for example, a sharp blade-like object can be inserted into the boundary between the device substrate and the resin layer, or a mixed fluid of water and compressed air can be sprayed to peel off. Preferably, the display panel with a support is installed on a surface plate so that the support substrate side is on the upper side and the panel side is on the lower side, and the panel side substrate is vacuum-adsorbed on the surface plate (the support substrate is laminated on both sides). In this state, the liquid is mixed with water and compressed air at the boundary between the device substrate and the resin layer of the display panel with support, and the end of the support substrate is pulled vertically upward. increase. Then, an air layer is sequentially formed at the boundary, the air layer spreads over the entire boundary, and the support substrate can be easily peeled off (the support substrate is formed on both main surfaces of the display device panel with a support). In the case of lamination, the peeling step is repeated one side at a time).

  Furthermore, a display apparatus can be manufactured by the manufacturing method which comprises the process of obtaining a display apparatus using the obtained panel for display apparatuses. Here, the manufacturing method of the display device is not particularly limited, and for example, the display device can be manufactured by a conventionally known manufacturing method.

Example 1
First, prepare a glass device substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass substrate) having a length of 170 mm, a width of 100 mm, a plate thickness of 0.3 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C., washed with pure water, The surface was cleaned by UV cleaning.
Thereafter, aluminum (Al) was vapor-deposited on the first main surface of the device substrate at 0.9 × 10 ⁻⁵ torr and 10 Å / sec to form an Al layer having a thickness of 200 nm. Next, a 100 nm-thick resist (manufactured by Zeon Corporation, ZEP520A) was applied on the Al layer by spin coating. EB exposure and development were performed using an electron beam drawing apparatus (manufactured by Hitachi High-Technology Corporation, HL800D (50 keV)), and a plurality of grooves (width: 100 nm) were formed in parallel with each other at a predetermined pitch (200 nm). A resist film was formed.
Next, using a plasma etching apparatus (SAMCO Co., Ltd., RIE-140iPC), etching is performed with SF ₆ to remove excess Al, and the size (pitch Pm: 200 nm, width Dm: 100 nm, height Hm: 200 nm). A wire grid polarizer of Al metal fine wire (1) was formed on the first main surface of the device substrate to obtain a device substrate with a wire grid polarizer.

Next, a glass support substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass substrate) having a length of 180 mm, a width of 110 mm, a plate thickness of 0.4 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is prepared. The surface was cleaned by UV cleaning.
Thereafter, on the first main surface of the support substrate, a screen printing machine having a mixture of 100 parts by weight of silicone for solvent-free addition reaction type release paper and 2 parts by weight of platinum catalyst in a size of 178 mm in length and 108 mm in width. (Coating amount 30 g / m ² ). And it heat-hardened in air | atmosphere for 30 minutes at 180 degreeC, and obtained the 20-micrometer-thick silicone resin layer.

  Next, the polarizer-forming surface of the device substrate with the wire grid polarizer and the surface of the silicone resin layer fixed to the first main surface of the support substrate are centroided by vacuum press at room temperature. Were laminated so as to overlap each other to obtain a laminate A (laminate of the present invention).

  In the laminate A according to Example 1, the device substrate with the wire grid polarizer and the support substrate are in close contact with the silicone resin layer without generating bubbles, and there is no convex defect and the smoothness is good. Met.

(Example 2)
In a 1000 mL four-necked flask equipped with a stirrer and a condenser, 60 g of monomer 1 (manufactured by Shin-Nakamura Chemical Co., Ltd., NK ester A-DPH, dipentaerythritol hexaacrylate), monomer 2 (Shin-Nakamura) Chemical Industry Co., Ltd., NK Ester A-NPG, Neopentyl Glycol Diacrylate) 40g, Photopolymerization Initiator (Ciba Specialty Chemicals, IRGACURE907), Fluorine-containing Surfactant (Asahi Glass Co., Fluoro) 0.1 g of a co-oligomer of acrylate (CH ₂ = CHCOO (CH ₂ ) ₂ (CF ₂ ) ₈ F) and butyl acrylate, fluorine content: about 30% by mass, mass average molecular weight: about 3000), polymerization inhibitor 1.0 g of Wako Pure Chemical Industries, Ltd., Q1301 and 65.0 g of cyclohexanone were added.
The flask was stirred and homogenized for 1 hour at room temperature and in a light-shielded state. Next, while stirring the inside of the flask, 100 g (solid content: 30 g) of colloidal silica was slowly added, and the mixture was stirred and homogenized for 1 hour while keeping the inside of the flask at room temperature and light shielding. Next, 340 g of cyclohexanone was added, and the mixture was stirred for 1 hour with the inside of the flask kept at room temperature and light-shielded to obtain a solution of a photocurable composition.
Subsequently, on the first main surface of a glass device substrate (Asahi Glass Co., Ltd., AN100, alkali-free glass substrate) having a length of 500 mm, a width of 400 mm, a plate thickness of 0.3 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. The photocurable composition was applied by spin coating to form a polarizer resin layer made of a 1 μm thick photocurable composition.

A quartz mold in which a plurality of grooves that are fine concavo-convex patterns are formed in parallel with each other at a predetermined pitch (mold area: 150 mm long × 130 mm wide, fine concavo-convex pattern area: 140 mm long × 120 mm wide, groove pitch: 150 nm, Groove width: 50 nm, groove depth: 100 nm, groove length: 140 mm, groove cross-sectional shape: rectangular) at 25 ° C. and 0.5 MPa (gauge pressure) on the first main surface of the device substrate It pressed against the formed resin layer for polarizers.
While maintaining this state, irradiation energy at a high-pressure mercury lamp (frequency: 1.5 kHz to 2.0 kHz, main wavelength light: 255 nm, 315 nm, and 365 nm) from the back side of the quartz mold (opposite side of the fine uneven pattern forming surface): 1000 mJ / cm ² ) for 15 seconds, the polarizer resin layer is cured, and a polarizer resin layer having a plurality of ridges corresponding to the grooves of the quartz mold (ridge pitch: 150 nm, The width of the ridges: 50 nm and the height of the ridges: 100 nm). Then, the quartz mold was slowly peeled off from the device substrate.

  A series of steps including pressing of the quartz mold, light irradiation, and peeling of the quartz mold was repeatedly performed on one device substrate. FIG. 6 is a schematic front view of a device substrate with ridges in which a plurality of ridges are formed on the first main surface of one device substrate. Convex ridges 61 were formed at a total of nine locations, three in the vertical direction and three in the horizontal direction, on the first main surface 62a of the device substrate. In addition, the clearance gap Wp in which the protruding item | line 61 is not formed is 10 mm.

  After that, using a vacuum vapor deposition apparatus (manufactured by Showa Vacuum Co., SEC-16CM) that can change the inclination angle of the device substrate facing the vapor deposition source, Al is applied to the upper part of the ridge formed on the first main surface of the device substrate. It vapor-deposited, the metal fine wire was formed in the 1st main surface of a device substrate, and the device substrate with a wire grid type polarizer was obtained. FIG. 7 shows a schematic diagram of the vapor deposition method. Deposition from the direction V1 that is substantially orthogonal to the length direction of the ridges 76 and forms an angle of 30 degrees on the first side surface 76a side of the ridges with respect to the height direction of the ridges; The vapor deposition from the direction V2 which is substantially perpendicular to the length direction of the projection and the angle of 30 degrees to the second side surface 76b side of the projection with respect to the height direction of the projection, and 25 nm for each deposition Was formed on the top of the ridge, and an Al layer having a width of 50 nm and a thickness of 50 nm was formed on the top of the ridge.

Next, it has vinyl groups at both ends on the first main surface of a support substrate (Asahi Glass Co., Ltd., AN100) having a length of 500 mm, a width of 400 mm, a thickness of 0.4 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. A linear polyorganosiloxane and a methylhydrogen polysiloxane having a hydrosilyl group in the molecule are mixed, and this is mixed with a platinum-based catalyst to prepare a mixture, with an area of 498 mm in length and 398 mm in width. Coating was performed with a die coater (coating amount 20 g / m ² ), and heat curing was performed in the air at 180 ° C. for 30 minutes to form a 20 μm thick silicone resin layer. Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogen polysiloxane was adjusted so that the molar ratio of hydrosilyl group to vinyl group was 1/1. The platinum-based catalyst was added in an amount of 5 parts by mass with respect to a total of 100 parts by mass of the linear polyorganosiloxane and methyl hydrogen polysiloxane.

  Next, the polarizer-formed surface of the device substrate with the wire grid type polarizer and the surface of the silicone resin layer on the first main surface of the support substrate are bonded to each other by a vacuum press at room temperature. A laminate of the present invention was obtained.

  In the laminate B according to Example 2, the device substrate with the polarizer and the support substrate were in close contact with the silicone resin layer without generating bubbles, and had no convex defects and good smoothness. .

(Example 3)
A glass device substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass substrate) having a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C., a thickness of 0.1 mm, and a width of 400 mm was continuously formed by the fusion method. A polyethylene film having a thickness of 30 μm was thermally fused to both main surfaces of the device substrate. Thereafter, the device substrate having a length of 50 m was wound around a bobbin having a core diameter of 200 mm to form a roll. Next, the roll-shaped device substrate is set in the device substrate delivery portion of the continuous WEB coater manufactured by Toshiba Machine Co., Ltd., and the polyethylene film on the side that becomes the first main surface later is heated again with a heat roll. The main surface and the polyethylene film surface are continuously peeled off, and then the polarizer resin comprising the photocurable composition is applied to the first main surface of the device substrate (the polyethylene film It was applied to the non-existing surface).
A nickel mold (mold area: 150 mm × 400 mm) having a thickness of 0.2 mm, in which a plurality of grooves are formed in parallel with each other at a predetermined pitch on a chrome-plated metal roll (width 450 mm, diameter 250 mm). Pattern area: 120 mm × 170 mm, number of patterns: 2, pattern area interval: 20 mm, groove pitch: 150 nm, groove width: 50 nm, groove depth: 100 nm, groove length: 120 mm, groove cross-sectional shape: Three (rectangles) were pasted on the curved surface of the metal roll at intervals of 61 mm to prepare a gravure roll. The device substrate was pressed in the gravure roll direction using a nip roll so that the groove on the curved surface of the gravure roll was in contact with the polarizer resin layer formed on the first main surface of the device substrate. The atmospheric temperature at the time of pressing was 25 ° C.

While maintaining the pressed state, from the polyethylene film side (second main surface side of the device substrate) to the high-pressure mercury lamp (frequency: 1.5 kHz to 2.0 kHz, main wavelength light: irradiation energy at 255 nm, 315 nm and 365 nm: 1000 mJ) / Cm ² ) light is continuously irradiated to cure the polarizer resin layer, and the polarizer resin layer (projection strip pitch: 150 nm, projection strip) having projections corresponding to the grooves of the nickel mold. (Width: 50 nm, height of ridge: 100 nm). After peeling off the nickel mold from the device substrate using the peeling roll, the device substrate was wound up on a winding roll. On the first main surface of the wound roll-shaped device substrate, ridges are formed at intervals of 30 mm at two locations in the width direction of the device substrate, and ridges are continuously formed at intervals of 30 mm in the length direction. It was.

  The wound roll-shaped device substrate is set on a delivery part of a continuous vapor deposition apparatus, Al is continuously vapor deposited at a vapor deposition angle of 25 to 35 degrees, and an Al layer having a width of 50 nm and a thickness of 50 nm is formed on the top of the ridge. Formed. Through the above steps, the wire grid polarizer was continuously formed on the first main surface of the thin glass substrate.

  The device substrate on which the wire grid type polarizer is continuously formed is cut at intervals of 750 mm to obtain a device substrate with a wire grid type polarizer having a length of 750 mm, a width of 400 mm, and a thickness of 0.1 mm. It was.

Next, on the first main surface of a glass support substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass substrate) having a length of 760 mm, a width of 405 mm, a plate thickness of 0.6 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. A linear polyorganosiloxane having vinyl groups at both ends and a methylhydrogen polysiloxane having a hydrosilyl group in the molecule are mixed, and this is mixed with a platinum-based catalyst to prepare a mixture. It was coated with a die coater with an area of 757 mm and a width of 402 mm (coating amount 20 g / m ² ), and heat cured at 180 ° C. for 30 minutes to form a 20 μm thick silicone resin layer. Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogen polysiloxane was adjusted so that the molar ratio of hydrosilyl group to vinyl group was 1/1. The platinum-based catalyst was added in an amount of 5 parts by mass with respect to a total of 100 parts by mass of the linear polyorganosiloxane and methyl hydrogen polysiloxane.

  Next, the laminated body C (of the present invention) is bonded to the polarizer-forming surface of the device substrate with the polarizer and the surface of the silicone resin layer on the first main surface of the support substrate by a vacuum press at room temperature. A laminate was obtained.

  In the laminate C according to Example 3, the device substrate with a polarizer and the support substrate were in close contact with the silicone resin layer without generating bubbles, and had no convex defects and good smoothness. .

Example 4
Except for changing the photocurable composition to a heat-resistant silicone resin (FX-V550 manufactured by Adeka), in the same manner as in Example 2, with a gap of 10 mm where no protrusions are formed on the first main surface of the device substrate. The ridges were formed in 9 places, 3 places in the vertical direction and 3 places in the horizontal direction.
Further, in the same manner as in Example 2, the device substrate and the support substrate were bonded together to obtain a laminate D (laminate of the present invention).
In the laminate D according to Example 4, the device substrate with the polarizer and the support substrate were in close contact with the silicone resin layer without generating bubbles, and had no convex defects and good smoothness. .

(Example 5)
In this example, a liquid crystal display device is manufactured using the laminates B and D obtained in Examples 2 and 4.
The laminated body D is prepared and used for an array forming process to form an array on the second main surface of the device substrate. On the other hand, the laminate B is subjected to a color filter forming step to form a color filter on the second main surface of the device substrate. The laminated body D in which the array is formed and the laminated body B in which the color filter is formed are bonded to each other through a sealing material to obtain a display device panel with a support. Note that the polarization axes of the polarizers of the stacked body D and the stacked body B are designed in advance so as to have an appropriate combination. And the support body (support board | substrate) currently fixed to both the main surfaces of the display apparatus panel with a support body is peeled. In the peeling method, the supporting substrate was peeled off after spraying a mixed fluid of compressed air and water on the boundary between the resin layer and the thin plate laminate, one side of each of the main surfaces. The surface of the device substrate after peeling does not show scratches that lead to a decrease in strength. Further, the scratches that lead to the deterioration in display performance are not observed in the polarizer.
Subsequently, the device substrate from which the support substrate has been peeled is divided into 54 cells measuring 51 mm in length and 38 mm in width, and then a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. Subsequently, a module forming step is performed to obtain a liquid crystal display device. There is no problem in characteristics of the liquid crystal display device thus obtained.

(Example 6)
In this example, an extremely thin liquid crystal display device is manufactured using the laminate C obtained in Example 3.
Two stacked bodies C are prepared, and one is subjected to an array forming process to form an array on the second main surface of the device substrate. The remaining one sheet is subjected to a color filter forming step to form a color filter on the second main surface of the device substrate. The laminated body in which the array is formed and the laminated body in which the color filter is formed are bonded together through a sealing material after aligning the directions of the polarization axes of the polarizers, thereby obtaining a display device panel with a support. Thereafter, the support (support substrate) attached to both main surfaces of the display panel with support is peeled off. In the peeling method, the support substrate is peeled off after spraying a mixed fluid of compressed air and water on the boundary between the resin layer and the thin plate laminate, one side of each of the main surfaces. The surface of the device substrate after peeling does not show scratches that lead to a decrease in strength. Further, the scratches that lead to the deterioration in display performance are not observed in the polarizer.
Thereafter, the device substrate from which the support substrate has been peeled is cut and divided into 64 cells of 51 mm in length and 38 mm in width, and then a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. Subsequently, a module forming step is performed to obtain an extremely thin liquid crystal display device. The ultrathin liquid crystal display device thus obtained does not have a problem in characteristics.

(Example 7)
In this example, a liquid crystal display device is manufactured using the laminate A obtained in Example 1.
Two stacked bodies A are prepared, and one is subjected to an array forming process to form an array on the second main surface of the device substrate. On the other hand, the other laminate A is subjected to a color filter forming step to form a color filter on the second main surface of the device substrate. The laminated body in which the array is formed and the laminated body in which the color filter is formed are bonded together through a sealing material after aligning the directions of the polarization axes of the polarizers, thereby obtaining a display device panel with a support. Thereafter, the support (support substrate) attached to both main surfaces of the display panel with support is peeled off. In the peeling method, the support substrate is peeled off after spraying a mixed fluid of compressed air and water on the boundary between the resin layer and the thin plate laminate, one side of each of the main surfaces. The surface of the device substrate after peeling does not show scratches that lead to a decrease in strength. Further, the scratches that lead to the deterioration in display performance are not observed in the polarizer.

  Thereafter, the device substrate from which the support substrate has been peeled is cut and divided into six cells of 51 mm in length and 38 mm in width, and then a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. Subsequently, a module forming step is performed to obtain a liquid crystal display device. There is no problem in characteristics of the liquid crystal display device thus obtained.

(Example 8)
Using a film base of a cycloolefin polymer (ZEONOR Film ZF14 manufactured by Nippon Zeon Co., Ltd.) having a linear expansion coefficient of 700 × 10 ⁻⁷ / ° C., a thickness of 0.1 mm, and a width of 400 mm as a device substrate, A roll is set on the device substrate feed portion of a continuous WEB coater manufactured by Toshiba Machine Co., Ltd., and the polarizer resin coating means is applied to the first main surface of the thin glass substrate with the photocurable composition. did.

  A nickel mold (mold area: 150 mm × 400 mm) having a thickness of 0.2 mm, in which a plurality of grooves are formed in parallel with each other at a predetermined pitch on a chrome-plated metal roll (width 450 mm, diameter 250 mm). Pattern area: 120 mm × 170 mm, number of patterns: 2, pattern area interval: 20 mm, groove pitch: 150 nm, groove width: 50 nm, groove depth: 100 nm, groove length: 120 mm, groove cross-sectional shape: Three (rectangles) were pasted on the curved surface of the metal roll at intervals of 61 mm to prepare a gravure roll. The film substrate was pressed in the gravure roll direction using a nip roll so that the groove on the curved surface of the gravure roll was in contact with the polarizer resin layer formed on the first main surface of the film substrate. The atmospheric temperature at the time of pressing was 25 ° C.

While maintaining the pressed state, a high pressure mercury lamp (frequency: 1.5 kHz to 2.0 kHz, main wavelength light: irradiation energy at 255 nm, 315 nm and 365 nm: 1000 mJ / cm ² ) from the second main surface side of the film substrate. By continuously irradiating light, the polarizer resin layer is cured, and a polarizer resin layer having a ridge corresponding to the groove of the nickel mold (ridge pitch: 150 nm, ridge width: 50 nm, The height of the ridges: 100 nm) was produced. After peeling the nickel mold from the film base material using a peeling roll, the film base material was wound up on a winding roll. On the first main surface of the wound roll-shaped film substrate, ridges are formed at intervals of 30 mm at two locations in the width direction of the film substrate, and continuously protruding at intervals of 30 mm in the length direction. Was formed.

  The wound roll-shaped film base material is set on a delivery portion of a continuous vapor deposition apparatus, Al is continuously vapor deposited at a vapor deposition angle of 25 to 35 degrees, and an Al layer having a width of 50 nm and a thickness of 50 nm is formed on the top of the ridge. Formed. Through the above steps, a wire grid polarizer was continuously formed on the first main surface of the film substrate.

  The film base material on which the wire grid type polarizer is continuously formed is cut at intervals of 750 mm in length, and a device substrate with a wire grid type polarizer having a length of 750 mm, a width of 400 mm, and a thickness of 0.1 mm. Got.

Next, vinyl on both ends on the first main surface of a support substrate (ZEONOR sheet 1020R manufactured by Nippon Zeon Co., Ltd.) having a length of 760 mm, a width of 405 mm, a plate thickness of 0.6 mm, and a linear expansion coefficient of 700 × 10 ⁻⁷ / ° C. A linear polyorganosiloxane having a group and a methyl hydrogen polysiloxane having a hydrosilyl group in the molecule are mixed, and this is mixed with a platinum-based catalyst to prepare a mixture having a length of 757 mm and a width of 402 mm. Was coated with a die coater (coating amount: 20 g / m ² ) and heated and cured in air at 120 ° C. for 60 minutes to form a 20 μm thick silicone resin layer. Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogen polysiloxane was adjusted so that the molar ratio of hydrosilyl group to vinyl group was 1/1. The platinum-based catalyst was added in an amount of 5 parts by mass with respect to a total of 100 parts by mass of the linear polyorganosiloxane and methyl hydrogen polysiloxane.

  Next, the polarizer-formed surface of the device substrate with the polarizer and the surface of the silicone resin layer on the first main surface of the support substrate are bonded to each other by a vacuum press at room temperature using a laminate E (of the present invention). A laminate was obtained.

  In the laminate E according to Example 8, the device substrate with the polarizer and the support substrate were in close contact with the silicone resin layer without generating bubbles, and had no convex defects and good smoothness. .

Example 9
In this example, an extremely thin liquid crystal display device is manufactured by using the laminate E obtained in Example 8.
Two stacked bodies E are prepared, and one is subjected to an array forming process to form an array on the second main surface of the device substrate. The remaining one sheet is subjected to a color filter forming step to form a color filter on the second main surface of the device substrate. The laminated body in which the array is formed and the laminated body in which the color filter is formed are bonded together through a sealing material after aligning the directions of the polarization axes of the polarizers, thereby obtaining a display device panel with a support. Thereafter, the support (support substrate) attached to both main surfaces of the display panel with support is peeled off. In the peeling method, the support substrate is peeled off after spraying a mixed fluid of compressed air and water on the boundary between the resin layer and the thin plate laminate, one side of each of the main surfaces. The surface of the device substrate after peeling does not show scratches that lead to a decrease in strength. Further, the scratches that lead to the deterioration in display performance are not observed in the polarizer.
Thereafter, the device substrate from which the support substrate has been peeled is cut and divided into 64 cells of 51 mm in length and 38 mm in width, and then a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. Subsequently, a module forming step is performed to obtain an extremely thin liquid crystal display device. The ultrathin liquid crystal display device thus obtained does not have a problem in characteristics.

(Comparative example)
Using a glass device substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass substrate) having a length of 170 mm, a width of 100 mm, a plate thickness of 0.7 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C., the same as in Example 1 A device substrate on which a wire grid polarizer of Al metal fine wires having a size (pitch Pm: 200 nm, width Dm: 100 nm, height Hm: 200 nm) was formed by the method was obtained.
Using two device substrates with a thickness of 0.7 mm on which the wire grid polarizer is formed, one is subjected to an array forming process, and an array is formed on the main surface of the device substrate on which no wire grid is formed. did. The remaining one sheet was also subjected to a color filter forming step, and a color filter was formed on the main surface of the device substrate on which no wire grid was formed. The device substrate on which the array was formed and the device substrate on which the color filter was formed were aligned with the polarization axis of the polarizer and then bonded through a sealing material to obtain a display device panel with a support. . On the surface of the panel, in the array forming process and the color filter forming process, there were some places where the haze value (cloudiness value) increased due to contact with the conveyance rollers and the metal tray. This is a phenomenon that occurs because the wire grid polarizer is scratched, and when used in a display device, it is a drawback that leads to obvious display defects.

Although the invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on Japanese Patent Application No. 2009-025025 filed on Feb. 5, 2009, the contents of which are incorporated herein by reference.

  The laminated body obtained by the present invention can provide a laminated body with a polarizer that can produce a display device thinner than a conventional display device.

10 Laminated body with polarizer (laminated body of the present invention)
11 reflective polarizer 12, 32, 42, 72 device substrate 12a, 32a, 42a, 62a device substrate first main surface 12b device substrate second main surface 13 support substrate 13a support substrate first main surface 13b support substrate second main Surface 14 Resin layer 35 Thin metal wires 46, 61, 76 Projection 47 Film made of metal material 51 Device substrate supply means 51a Device substrate feed roll 51b Protective film peeling roll 51c Protective film take-up roll 52 Polarizer resin application means 52a Polarized light Resin supply source 52b Coating head 52c Coating roller 52d Pipe 52e Pump 53 Nip roll 54 Gravure roll 55 Polarizer resin curing means 56 Peeling roll 57 Winding means 76a First side surface 76b of the ridge Second side surface of the ridge Dm Metal wire width Pm Metal wire pitch Hm Gold Metal wire height Lm Metal wire length V1, V2 Deposition direction Wp Gap Xa Vertical arrow Xb Horizontal arrow

Claims (14)

A device substrate having a first main surface and a second main surface;
A support substrate having a first main surface and a second main surface; and a resin layer present between the first main surface of the device substrate and the first main surface of the support substrate;
A laminated body with a polarizer,
A reflective polarizer is present on the first main surface of the device substrate, and the surface of the device substrate on which the reflective polarizer is present and the resin layer are attached by an adhesion force caused by van der Waals force between solid molecules. and has a surface of the resin layer have a peeling property,
A laminated body with a polarizer , wherein a bonding force between the first main surface of the support substrate and the resin layer is relatively higher than the adhesion force .   The laminated body with a polarizer according to claim 1, wherein the reflective polarizer is a wire grid polarizer.   The pitch (Pm) of the fine metal wires of the wire grid polarizer is 50 to 200 nm, and the ratio (Dm / Pm) of the width (Dm) to the pitch (Pm) of the fine metal wires is 0.1 to 0.6. The laminated body with a polarizer of Claim 2 which exists.   The laminate with a polarizer according to any one of claims 1 to 3, wherein the resin forming the resin layer is at least one selected from a fluororesin, an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin. .   The laminated body with a polarizer as described in any one of Claims 1-4 whose thickness of the said resin layer is 5-50 micrometers. The device substrate and the support substrate are made of the same material, and the difference in coefficient of linear expansion between the device substrate and the support substrate is 150 × 10 ⁻⁷ / ° C. or less. A laminate with a polarizer according to 1. The device substrate and the support substrate are made of different materials, and the difference in coefficient of linear expansion between the device substrate and the support substrate is 700 × 10 ⁻⁷ / ° C. or less. A laminate with a polarizer according to 1.   The panel for display apparatuses with a support which has the member for display apparatuses in the 2nd main surface of the said device substrate in the laminated body with a polarizer as described in any one of Claims 1-7.   A display device panel formed using the support-equipped display device panel according to claim 8.   A display device formed using the display device panel according to claim 9. It is a manufacturing method of the laminated body with a polarizer as described in any one of Claims 1-7, Comprising: The polarizer formation process which forms a reflection type polarizer in the 1st main surface of the said device substrate, The said support substrate of the resin layer forming step of forming a resin layer having a release surface on the first main surface, the reflective polarizer with the device substrate is crimped by laminating a supporting substrate with the resin layer, of the device substrate A method for producing a laminate with a polarizer, comprising: an adhesion step of bringing a peelable surface of the resin layer into close contact with a surface on which a reflective polarizer is present.   A manufacturing method according to claim 11 and a panel for a display device with a support, comprising a step of forming a member for display device on a second main surface of the device substrate in the obtained laminate with a polarizer. Production method.   The manufacturing method of Claim 12, and the peeling process which peels the surface in which the reflective polarizer of the said device substrate exists in the obtained display panel with a support body, and the peelable surface of the said resin layer. A method for manufacturing a panel for a display device. The manufacturing method of a display apparatus which comprises the manufacturing method of Claim 13, and the process of obtaining a display apparatus using the obtained panel for display apparatuses.

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