JP5540465B2 - Package body - Google Patents

Description

  The present invention relates to a package main body for configuring a package for housing a solid-state imaging device (image sensor) together with a lid, a method for manufacturing a solid-state imaging device using the same, and a method for manufacturing a camera.

  Generally, a semiconductor device that is diced and divided into individual chips from a wafer is accommodated in a package and sealed.

  When packaging a solid-state imaging device (image sensor) in this way, the packaging is performed so that incident light is guided to the solid-state imaging device. That is, the solid-state imaging device is attached to a concave package body having an opening with the light incident side as the opening side. Then, processing such as wire bonding is performed. Next, a plate-shaped lid having translucency is overlaid on the opening of the package body, the periphery of the lid is bonded to the periphery of the opening in the package body with an adhesive, and the opening is sealed by the lid Thus, the solid-state imaging device is completed. In this way, since the accommodation space of the solid-state imaging device is hermetically sealed while the incident light is guided to the solid-state imaging device, the solid-state imaging device is not exposed to the outside air. Therefore, since the solid-state image sensor is not affected by moisture, oxygen, or the like, the durability of the solid-state image sensor is improved.

  By the way, when a solid-state image pickup device in which a solid-state image pickup device is packaged is incorporated in the body of the camera, the tilt of the image pickup surface (light receiving surface) of the solid-state image pickup device with respect to the optical axis of the camera body occurs. It is necessary to incorporate the solid-state imaging device so as not to be aligned.

  Therefore, in Patent Document 1 described below, a solid-state imaging device in which a solid-state imaging element is packaged is attached to a camera body via a holder (attachment member), and the following measures are taken. That is, in Patent Document 1, the mounting surface of the camera body in which the solid-state imaging device is to be incorporated is preliminarily defined with reference to the imaging surface of the photographing lens or the mounting surface of the photographing lens (therefore, corresponding to the optical axis of the camera body or the same). (Based on the surface to be used). In addition, the solid-state imaging device is fixed to the holder in advance and the two are integrated. In the state where the solid-state imaging device is fixed to the holder and integrated with the holder, a signal from the solid-state imaging device or a microscope is used. Then, using the imaging surface (light receiving surface) of the solid-state imaging device in the package of the solid-state imaging device as a reference, the attachment surface that comes into contact with the attachment surface of the camera body is processed into a holder. Then, the integrated product of the holder and the solid-state imaging device, which has been processed on the mounting surface, is mounted in the body of the camera in a state where the mounting surface of the holder is in contact with the mounted surface of the camera body. .

According to the method for attaching a solid-state imaging device to a camera disclosed in Patent Document 1, as described above, the solid-state imaging device in which the solid-state imaging device is packaged is fixed to the holder, and both are integrated. Since the mounting surface is processed into a holder with the imaging surface of the solid-state imaging device in the package of the solid-state imaging device as a reference, the holder with the integrated solid-state imaging device is mounted in the camera body. By simply bringing the mounting surface into contact with the mounted surface, it is possible to accurately suppress the tilt of the solid-state imaging device without performing a special angle adjustment or the like for preventing tilt.
JP 11-265026 A

  The mounting method disclosed in Patent Document 1 is very excellent as described above, but the mounting surface must be processed on the holder in accordance with the individual solid-state imaging device, so that the processing takes time and effort. In addition, in order to prevent the powder generated during the processing from remaining attached to the lid for introducing the incident light of the solid-state imaging device and affecting the imaging characteristics, the removal of the powder or the like is necessary. There was room for improvement in that it had to be done reliably.

  In the present invention, similar to the prior art disclosed in Patent Document 1 described above, when the solid-state imaging device is incorporated into the camera body, the mounting surface on the solid-state imaging device side abuts on the mounted surface on the camera body side. It is possible to suppress the tilt of the solid-state image pickup device with high accuracy without performing a special angle adjustment for preventing tilt, and different from the conventional technique disclosed in Patent Document 1 described above, It is an object of the present invention to provide a method for manufacturing a camera that does not require processing of the mounting surface on the solid-state imaging device side in accordance with the solid-state imaging element mounting state. Another object of the present invention is to provide a package body and a method for manufacturing a solid-state imaging device, which can be used in such a method for manufacturing a camera.

  In order to solve the above problems, a package main body according to the first aspect of the present invention is a package main body for configuring a package containing a solid-state image sensor together with a lid, and the solid-state image sensor is not accommodated. In the package body in a state where the lid is not attached, the attachment is brought into contact with the attachment surface of the body of the camera in which the solid-state imaging device including the package and the solid-state imaging device housed in the package is incorporated. It is integrated with a mounting portion having a surface.

  According to a second aspect of the present invention, in the package main body according to the first aspect, the attachment portion is formed of a member different from a member that forms a part of the package main body that defines a housing space for the solid-state imaging device. The member constituting the defining part and the another member are joined or screwed together.

  The package main body according to a third aspect of the present invention is the package main body according to the first aspect, wherein the attachment portion is integrally formed with at least a part of a member that defines a housing space for the solid-state imaging device in the package main body. It is comprised by extending continuously.

  The package main body according to a fourth aspect of the present invention is the package main body according to the first aspect, wherein the portion of the package main body immediately below the portion forming the mounting surface of the solid-state imaging device and the mounting portion are the package main body. Are made of a material having a thermal conductivity higher than that of the material constituting the portion defining the housing space of the solid-state imaging device, and are thermally coupled to each other.

  The package body according to a fifth aspect of the present invention is the package body according to the first aspect, wherein a part of the package body forming a mounting surface of the solid-state imaging device and the mounting portion are the solid-state imaging device in the package body. It is made of a material having a higher thermal conductivity than that of other parts constituting the housing space and is thermally coupled to each other.

  According to a sixth aspect of the present invention, there is provided a manufacturing method of a solid-state imaging device, the step of preparing a package body according to any one of the first to fifth aspects, and the imaging surface of the solid-state imaging device being an attachment surface of the attachment portion Attaching the solid-state image sensor to the package body while aligning their orientations so as to be in a predetermined orientation, and attaching the lid to the package body after the solid-state image sensor is attached to the package body. And a stage of attaching to.

  In the method for manufacturing a solid-state imaging device according to a seventh aspect of the present invention, in the sixth aspect, the predetermined orientation is an orientation in which an imaging surface of the solid-state imaging element and an attachment surface of the attachment portion are parallel to each other. There is something.

  According to an eighth aspect of the present invention, there is provided a camera manufacturing method comprising: preparing the solid-state imaging device manufactured by the manufacturing method according to the sixth or seventh aspect; and mounting the mounting portion of the solid-state imaging device. Incorporating the solid-state imaging device into the body by bringing a surface into contact with the attached surface of the body of the camera.

  According to the present invention, when the solid-state imaging device is incorporated into the camera body, a special angle adjustment for preventing tilting is performed simply by bringing the mounting surface on the solid-state imaging device side into contact with the mounted surface on the camera body side. Manufacturing of a camera that can accurately control the tilt of the solid-state image sensor without performing a process, etc., and eliminates the need to process the mounting surface on the solid-state imaging device side according to the mounting state of each solid-state image sensor. A method can be provided. In addition, according to the present invention, it is possible to provide a package body and a method for manufacturing a solid-state imaging device that can be used in such a method for manufacturing a camera.

  Hereinafter, a package body according to the present invention, a method for manufacturing a solid-state imaging device using the same, and a method for manufacturing a camera will be described with reference to the drawings.

  [First Embodiment]

  FIG. 1 is a schematic plan view showing a package body 1 according to the first embodiment of the present invention. FIG. 2 is a schematic sectional view taken along line X1-X1 'in FIG. FIG. 3 is a schematic cross-sectional view taken along line Y1-Y1 'in FIG. 4 is a schematic plan view showing a solid-state imaging device 10 configured using the package main body 1 shown in FIGS. 1 to 3, and corresponds to FIG. FIG. 5 is a schematic cross-sectional view taken along line X2-X2 ′ in FIG. 4 and corresponds to FIG. 6 is a schematic cross-sectional view taken along the line Y2-Y2 'in FIG. 4, and corresponds to FIG. FIG. 7 is a schematic cross-sectional view showing a camera 100 configured using the solid-state imaging device 10 shown in FIGS. 4 to 6.

  The package body 1 according to the present embodiment is for constructing a package containing the solid-state imaging device 11 together with a lid 13 as shown in FIGS. 4 to 6, and as shown in FIGS. This is a state in which the solid-state imaging device 11 is not mounted and the lid 13 is not attached.

  The package body 1 according to the present embodiment includes a bottom plate 2 having a rectangular shape in plan view, a frame plate 3, an embedded member 4 embedded in the bottom plate 2, a mounting plate 5, and a lead frame 6 made of a conductive material. I have.

  The bottom plate 2, the frame plate 3, and the lead frame 6 are joined together by an adhesive (not shown). The bottom plate 2 and the frame plate 3 are members that form a part that defines a recess 1 a that is a housing space for the solid-state imaging device 11. An upper surface 2 a of the bottom plate 2 is an attachment surface for attaching the solid-state imaging element 11. The lead frame 6 is led out from the inside of the recess 1a to the outside of the side. As the material of the bottom plate 2 and the frame plate 3, for example, ceramic or resin is used, respectively. When ceramic is used, the bottom plate 2 and the frame plate 3 can be formed of a ceramic plate. Moreover, when using resin, the baseplate 2 and the frame board 3 can be comprised as an integral molding member by resin. In the present embodiment, the embedding member 4 is embedded in the bottom plate 2 from the lower side in the vicinity immediately below the attachment surface 2a, and is joined to the bottom plate 2 with an adhesive, for example. A material having higher thermal conductivity than the material of the bottom plate 2 is used as the material of the embedded member 4. As the material of the embedded member 4, it is preferable to use a material having high thermal conductivity such as copper, aluminum, CuW, and stainless steel.

  The mounting plate 5 is bonded to the bottom surface of the bottom plate 2 and the embedding member 4 with an adhesive and protrudes on both sides of the bottom plate 2 and the frame plate 3 in a plan view as shown in FIG. Thus, the mounting plate 5 is integrated with the package body 1 according to the present embodiment. In the present embodiment, the attachment plate 5 constitutes an attachment portion having an attachment surface 5 a that comes into contact with the attached surface 102 (see FIG. 7) of the body 101 of the camera 100. The attached surface 102 is an attached surface of the body 101 of the camera 100 shown in FIG. 7 into which the solid-state imaging device 10 shown in FIGS. 4 to 6 configured using the package body 1 according to the present embodiment is to be incorporated. In the present embodiment, the mounting plate 5 is formed with three notches 5b through which the screw 103 is inserted when the mounting plate 5 is screwed to the body 101 of the camera 100 with the screw 103. In the present embodiment, the surface in the vicinity of the periphery of the notch 5b in the mounting plate 5 (the surface on the front side in FIG. 1) is the mounting surface 5a.

  In the present embodiment, as the material of the mounting plate 5, a material having a higher thermal conductivity than the material of the bottom plate 2 is used similarly to the material of the embedded member 4. As the material of the embedded member 4, for example, it is preferable to use a material having high thermal conductivity such as copper, aluminum, CuW, and stainless steel. As described above, the attachment plate 5 is joined to the lower surface of the embedded member 4, whereby the attachment plate 5 and the embedded member 4 are thermally coupled.

  A solid-state imaging device 10 shown in FIGS. 4 to 6 includes a package main body 1 according to the present embodiment shown in FIGS. 1 to 3, a solid-state imaging device 11 accommodated in a concave portion 1a of the package main body 1, and a concave portion 1a. And a lid 13 attached to the package body 1 so as to be closed.

  The lid 13 is composed of a plate-like member having a predetermined light transmission characteristic (for example, a glass plate, an optical low-pass filter made of a single crystal plate such as crystal or lithium niobate). The solid-state imaging device 11 is accommodated in the recess 1a with the light incident side as the opening side of the recess 1a, and is bonded to the mounting surface 2a of the bottom plate 2 with an adhesive (not shown). The solid-state imaging device 11 and the lead frame 6 are electrically connected by a wire 12, and the solid-state imaging device 11 is electrically connected to the outside via the wire 12 and the lead frame 6. The lid body 13 is attached to the package body 1 by bonding the peripheral portion of the lid body 13 to the upper surface of the frame plate 3 with an adhesive (not shown), and the concave portion 1a (the housing space for the solid-state imaging device 11) is formed. It is sealed. An inert gas is sealed in the sealed recess 1a.

  Here, as a solid-state imaging device manufacturing method according to an embodiment of the present invention, an example of a manufacturing method of the solid-state imaging device 10 shown in FIGS. 4 to 6 will be described. First, the package body 1 shown in FIGS. 1 to 3 is prepared.

  Next, the imaging surface (light-receiving surface) 11a of the solid-state imaging device 11 is in a predetermined direction with respect to the mounting surface 5a of the mounting plate 5 (in this embodiment, it is a parallel direction, but is not necessarily limited to that direction). The solid-state imaging device 11 is attached to the package body 1 while adjusting their orientations so that In the present embodiment, not only the orientation of the imaging surface 11a is adjusted, but at the same time, the position of the two-dimensional solid-state imaging device 11 in the in-plane direction of the imaging surface 11a with respect to the mounting plate 5 and the method of the imaging surface 11a. The solid-state image sensor 11 is attached to the package body 1 while adjusting the position of the solid-state image sensor 11 in the linear direction and the rotational position of the solid-state image sensor 11 around the normal line. The position and orientation of the mounting plate 5 of the package main body 1 and the solid-state imaging device 11 can be aligned using various known methods (for example, a method using a position and orientation detection unit and a positioning mechanism using a microscope or a laser length measuring device). Etc.). In addition, when the solid-state imaging device 11 is attached to the mounting surface 2a of the bottom plate 2 of the package body 1 with an adhesive, if the adhesive is applied to a certain extent, the solid-state imaging device 11 can be formed before the adhesive is solidified. By adjusting the orientation and position and solidifying the adhesive in the state after the adjustment, the solid-state imaging device 11 can be fixed to the package body 1 in a desired orientation and position.

  Next, wire bonding processing is performed, and the solid-state imaging device 11 and the lead frame 6 are connected by the wire 12. Thereafter, the lid 13 is attached to the package body 1 by adhering the peripheral portion of the lid 13 to the upper surface of the frame plate 3 with an adhesive (not shown), and the inert gas is sealed in the recess 1a. Thereby, the solid-state imaging device 10 shown in FIGS. 4 to 6 is completed.

  The solid-state imaging device 10 shown in FIGS. 4 to 6 is incorporated in the body 101 of the camera 100 shown in FIG. The camera 100 shown in FIG. 7 is configured as a single-lens reflex type electronic still camera, but the solid-state imaging device 10 shown in FIGS. 4 to 6 has various electronic cameras such as other electronic still cameras and video cameras. It may be incorporated into.

  In the camera 100 shown in FIG. 7, a body 101 is provided with a lens mount 112, and an interchangeable photographing lens 113 is attached to the lens mount 112. The subject light that has passed through the photographing lens 113 is reflected upward by the quick return mirror 114 and forms an image on the screen 115. The subject image formed on the screen 115 is observed from the finder observation window 118 through the eyepiece lens 117 from the penta roof prism 116. When the release button (not shown) is fully pressed, the quick return mirror 114 jumps upward, and the subject image from the photographing lens 113 enters the solid-state imaging device 10 described above.

  As shown in FIG. 7, in the solid-state imaging device 10, the mounting surface 5 a of the mounting plate 5 of the package body 1 is brought into contact with the mounted surface 102 of the body 101 of the camera 100, so that the notch 5 b of the mounting plate 5 is formed. It is attached to the body 101 of the camera 100 by being screwed with a screw 103 inserted and screwed into a screw hole (not shown) of the body 101.

  The mounted surface 102 of the body 101 of the camera 100 is a solid-state imaging device of the solid-state imaging device 10 in which the mounting surface 5a is in contact with the mounted surface 102 with respect to the optical axis of the photographing lens 113 mounted on the lens mount 112. 11 is processed in advance so that the imaging surface 11a has a predetermined tilt or less and the position of the solid-state imaging device 11 in the normal direction of the imaging surface 11a becomes a predetermined position. In the example shown in FIG. 7, the attachment surface 102 is formed to be orthogonal to the optical axis of the photographing lens 113 attached to the lens mount 112 with a predetermined accuracy.

  In this example, the body 101 of the camera 100 is formed with three protrusions (not shown) that come into contact with the three locations A, B, and C of the mounting plate 5 of the package body 1 of the solid-state imaging device 10. Yes. These protrusions are in contact with the three positions A, B, and C of the mounting plate 5 with the mounting surface 5a of the solid-state imaging device 10 in contact with the mounted surface 102 of the body 101 of the camera 100. Then, the position of the two-dimensional solid-state imaging device 11 in the in-plane direction of the imaging surface 11a of the solid-state imaging device 11 and the rotational position of the solid-state imaging device 11 around the normal line of the imaging surface 11a are determined by the body of the camera 100. 101.

  Here, as a camera manufacturing method according to an embodiment of the present invention, an example of a manufacturing method of the camera 100 shown in FIG. 7 will be described. This manufacturing method includes the steps of preparing the solid-state imaging device 10 shown in FIGS. 4 to 6 manufactured by the above-described solid-state imaging device manufacturing method, and the mounting surface 5a of the mounting plate 5 of the package body 1 of the solid-state imaging device 10 on the camera. The mounting plate is brought into contact with the mounting surface 102 of the body 101 of the 100 and the three locations A, B, and C of the mounting plate 5 are in contact with the three protrusions of the body 101 of the camera 100, respectively. The solid-state imaging device 10 is incorporated into the body 101 of the camera 100 by screwing 5 to the body 101 of the camera 100 with a screw 103.

  If the package main body 1 shown in FIGS. 1 to 3 is used, the solid-state imaging device 10 shown in FIGS. 4 to 6 can be manufactured by the above-described solid-state imaging device manufacturing method. 7 can be manufactured.

  In the solid-state imaging device manufacturing method described above, the imaging surface (light-receiving surface) 11a of the solid-state imaging device 11 is oriented in a predetermined direction (in this case, parallel) with respect to the mounting surface 5a of the mounting plate 5. Since the solid-state imaging device 11 is attached to the package body 1 while adjusting the orientation, the orientation of the imaging surface (light receiving surface) 11a and the orientation of the attachment surface 5a are directly matched. Therefore, in this case as well, as in the conventional technique disclosed in Patent Document 1 described above, when the solid-state imaging device 10 is incorporated into the body 101, the mounting surface 5a on the solid-state imaging device 10 side is attached to the camera 100. By simply abutting on the mounting surface 102 on the body 101 side, the tilt of the solid-state imaging device 11 can be suppressed with high accuracy without performing a special angle adjustment or the like for preventing tilt.

  In the above-described solid-state imaging device manufacturing method, the imaging surface (light-receiving surface) 11a of the solid-state imaging device 11 is in a predetermined direction (here, parallel) with respect to the mounting surface 5a of the mounting plate 5. Since the solid-state imaging device 11 is attached to the package body 1 while adjusting the orientation of the solid-state imaging device 10, the mounting surface on the solid-state imaging device 10 side that matches the individual solid-state imaging device mounting state is different from the conventional technique disclosed in Patent Document 1 described above. It is not necessary to perform the processing of 5a. Therefore, it is possible to save time and labor for such processing, and it is not necessary to remove the powder without generating powder or the like generated during such processing. Therefore, according to the present embodiment, the manufacturing cost of the camera 100 can be reduced, and the cost of the camera 100 itself can also be reduced.

  Further, in the package body 1 shown in FIGS. 1 to 3, the embedded member 4 made of a material having a relatively high thermal conductivity is embedded in the bottom plate 2 in the vicinity immediately below the mounting surface 2a of the solid-state imaging device 11, and the mounting plate 5 is also provided. It is made of a material having a relatively high thermal conductivity, and the embedded member 4 and the mounting plate 5 are thermally coupled. Therefore, in the solid-state imaging device 10 shown in FIGS. 4 to 6 using the package body 1, heat from the solid-state imaging element 11 is easily transmitted to the mounting plate 5 through the embedded member 4. For this reason, according to this solid-state imaging device 10, since the mounting plate 5 has a function of radiating heat from the solid-state imaging element 11, the heat radiation effect of the solid-state imaging element 11 is enhanced, and the characteristics of the solid-state imaging element 11 are deteriorated due to heat generation. Can be suppressed.

  In the present invention, the package body 1 shown in FIGS. 1 to 3 may be modified as shown in FIG. FIG. 8 is a schematic cross-sectional view showing a package body according to a modification of the package body 1 shown in FIGS. 1 to 3, and corresponds to FIG. In FIG. 8, the same or corresponding elements as those in FIG. 2 are denoted by the same reference numerals, and redundant description thereof is omitted. The package main body according to this modification is different from the package main body 1 shown in FIGS. 1 to 3 in that the embedded member 4 penetrates the bottom plate 2 and the upper surface 4a of the embedded member 4 is the mounting surface of the solid-state imaging device 11. Only. The solid-state image sensor 11 is directly attached on the embedded member 4. In this case, the embedded member 4 is a part that forms a mounting surface of the solid-state imaging device 11 in the package body. Also by this modification, the same heat radiation effect as that of the package body 1 shown in FIGS. 1 to 3 can be obtained.

  [Second Embodiment]

  FIG. 9 is a schematic plan view showing the package main body 21 according to the second embodiment of the present invention. FIG. 10 is a schematic cross-sectional view along the line X3-X3 'in FIG. FIG. 11 is a schematic cross-sectional view along the line Y3-Y3 'in FIG. FIG. 12 is a schematic plan view showing a solid-state imaging device 30 configured using the package main body 21 shown in FIGS. 9 to 11, and corresponds to FIG. 13 is a schematic cross-sectional view taken along line X4-X4 'in FIG. 12, and corresponds to FIG. FIG. 14 is a schematic cross-sectional view taken along line Y4-Y4 'in FIG. 12, and corresponds to FIG.

  The package main body 21 according to the present embodiment is for configuring a package containing the solid-state imaging device 31 together with the lid 33 as shown in FIGS. 12 to 14, and as shown in FIGS. The solid-state image sensor 31 is not mounted and the lid 33 is not attached.

  The package main body 21 according to the present embodiment is configured as a PGA (Pin Grid Array) type, and is sandwiched between a rectangular bottom plate 22, an upper frame plate 23, and the bottom plate 22 and the upper frame plate 23 in plan view. A lower frame plate 24, internal terminals 25, and external terminal pins 26 are provided. The bottom plate 22, the lower frame plate 24, and the upper frame plate 23 are joined by an adhesive (not shown). The internal terminal 25 is provided on the upper surface of the lower frame plate 24. The external terminal pin 26 protrudes below the bottom plate 22. The lower frame plate 24 and the bottom plate 22 are composed of a plurality of layers of ceramic plates, and the internal terminals 25 and the external terminal pins 26 are electrically connected by contact holes and wiring patterns (not shown) formed therein. Yes. The upper frame plate 23 is also made of a ceramic plate.

  The bottom plate 22, the lower frame plate 24, and the upper frame plate 23 are members that form a part that defines a recess 21 a that is a housing space for the solid-state imaging device 31. A portion surrounded by the lower frame plate 24 on the upper surface 22 a of the bottom plate 22 is an attachment surface for attaching the solid-state imaging device 11.

  In the present embodiment, as shown in FIG. 9, the bottom plate 22 protrudes from the upper frame plate 23 and the lower frame plate 24 in plan view, and the protruding portion of the bottom plate 22 corresponds to the camera 100 in FIG. Attached with the attached surface 102 of the body 101 (however, in the present embodiment, the position of the attached surface 102 is changed from the position shown in FIG. 7 in accordance with the position of the attaching surface 22a described later). The attachment part which has the attachment surface 22a is comprised. In other words, the attachment portion is formed by a part of the member (in the present embodiment, the bottom plate 22) that forms a concave portion 21a serving as a storage space for the solid-state imaging device 31 and continuously extending integrally. It is configured. Thus, the mounting portion is integrated with the package body 31 according to the present embodiment. In the present embodiment, the protruding portion (attachment portion) of the bottom plate 22 is formed with three notches 22b through which screws are inserted when screwed to the body 101 of the camera 100 with screws. Yes. In the present embodiment, a surface in the vicinity of the notch 22b in the protruding portion of the bottom plate 22 (surface on the front side in FIG. 9) is the mounting surface 22a.

  The solid-state imaging device 30 shown in FIGS. 12 to 14 includes a package main body 21 according to the present embodiment shown in FIGS. 9 to 11, a solid-state imaging device 31 accommodated in the concave portion 21a of the package main body 21, and a concave portion 21a. And a lid 33 attached to the package body 21 so as to be closed.

  The lid 33 is composed of a plate-like member having a predetermined light-transmitting characteristic (for example, a glass plate, an optical low-pass filter made of a single crystal plate such as crystal or lithium niobate). The solid-state imaging device 31 is accommodated in the recess 21a with the light incident side as the opening side of the recess 21a, and is bonded to the mounting surface 22a of the bottom plate 22 with an adhesive (not shown). The solid-state imaging device 31 and the internal terminal 25 are electrically connected by a wire 32, and the solid-state imaging device 31 is electrically connected to the outside world via the wire 32, the internal terminal 25 and the external terminal pin 26. It has become. The lid 33 is attached to the package body 21 by the peripheral portion of the lid 33 being bonded to the upper surface of the upper frame plate 23 with an adhesive (not shown), and the recess 21a (the storage space for the solid-state imaging device 11). Is sealed. An inert gas is sealed in the sealed recess 21a.

  Here, as a solid-state imaging device manufacturing method according to an embodiment of the present invention, an example of a manufacturing method of the solid-state imaging device 30 shown in FIGS. 12 to 14 will be described. First, the package body 21 shown in FIGS. 9 to 11 is prepared.

  Next, the imaging surface (light receiving surface) 31a of the solid-state imaging device 31 is in a predetermined direction (in this embodiment, parallel to the mounting surface 22a of the protruding portion (mounting portion) of the bottom plate 22, but not necessarily The solid-state image pickup device 31 is attached to the package body 21 while aligning the orientations thereof. In the present embodiment, not only the orientation of the imaging surface 31a is aligned, but at the same time, the position of the two-dimensional solid-state imaging device 31 in the in-plane direction of the imaging surface 31a with reference to the protruding portion (attachment portion) of the bottom plate 22 The solid-state image sensor 31 is attached to the package body 21 while adjusting the position of the solid-state image sensor 31 in the normal direction of the image pickup surface 31a and the rotational position of the solid-state image sensor 31 around the normal line. The position and orientation of the protruding portion (attachment portion) of the bottom plate 22 of the package main body 21 and the solid-state imaging element 31 can be adjusted using various known techniques.

  Next, a wire bonding process is performed, and the solid-state imaging device 31 and the internal terminal 25 are connected by the wire 32. Thereafter, the lid 13 is attached to the package body 21 by adhering the peripheral portion of the lid 33 to the upper surface of the upper frame plate 23 with an adhesive (not shown), and the inert gas is sealed in the recess 1a. Thereby, the solid-state imaging device 30 shown in FIGS. 12 to 14 is completed.

  The solid-state imaging device 30 shown in FIGS. 12 to 14 is incorporated in the body 101 instead of the solid-state imaging device 10 in the camera 100 shown in FIG. In this case, as described above, the position of the mounted surface 102 is changed from the position shown in FIG. 7 in accordance with the position of the mounting surface 22a. In this case, in the camera, three protrusions corresponding to the three protrusions described in relation to the first embodiment are formed on the body 101 of the camera 100 according to the solid-state imaging device 30.

  Here, as a camera manufacturing method according to an embodiment of the present invention, an example of a camera manufacturing method in which the solid-state imaging device 30 is incorporated in the camera 100 shown in FIG. 7 in place of the solid-state imaging device 10 will be described. This manufacturing method includes a step of preparing the solid-state imaging device 30 shown in FIGS. 12 to 14 manufactured by the above-described solid-state imaging device manufacturing method, and a mounting surface 22a of the protruding portion of the bottom plate 22 of the package body 31 of the solid-state imaging device 30. In contact with the mounting surface 102 of the body 101 of the camera 100 and with the three portions of the bottom plate 22 in contact with the three protrusions of the body 101 of the camera 100, the protruding portion of the bottom plate 22 is Incorporating the solid-state imaging device 30 into the body 101 of the camera 100 by screwing it onto the body 101 of the 100.

  Except for the heat dissipation of the solid-state imaging device 31, the present embodiment can provide the same advantages as those of the first embodiment.

  [Third Embodiment]

  FIG. 15 is a schematic plan view showing a package body 41 according to the third embodiment of the present invention. 16 is a schematic cross-sectional view along the line X5-X5 'in FIG. FIG. 17 is a schematic cross-sectional view along the line Y5-Y3 'in FIG. 18 is a schematic plan view showing a solid-state imaging device 50 configured using the package main body 41 shown in FIGS. 15 to 17, and corresponds to FIG. FIG. 19 is a schematic cross-sectional view taken along line X6-X6 ′ in FIG. 18 and corresponds to FIG. 20 is a schematic cross-sectional view taken along the line Y6-Y6 'in FIG. 18, and corresponds to FIG. 15 to 20, the same or corresponding elements as those in FIGS. 1 to 6 are denoted by the same reference numerals, and redundant description thereof is omitted.

  The package body 41 according to the present embodiment is different from the package body 1 according to the first embodiment in that the mounting plate 5 is divided into two pieces, and a part of each mounting plate 5 is a bottom plate in the same manner as the lead frame 6. 2 and the frame plate 3 are bonded by an adhesive and only the point where the embedded member 4 is not embedded. In the present embodiment, the mounting plate 5 is formed by die cutting simultaneously with the lead frame 6 from a metal plate used for forming the lead frame 6 by die cutting. In addition, the thickness of this metal plate is set to a thickness that can secure the strength required for the mounting plate 5.

  The method for manufacturing the solid-state imaging device 50 shown in FIGS. 18 to 20 as the method for manufacturing the solid-state imaging device according to one embodiment of the present invention is shown in FIGS. 4 to 6 described in relation to the first embodiment. In the method for manufacturing the solid-state imaging device 10, the package body 1 is replaced with the package body 41.

  Further, as a camera manufacturing method according to an embodiment of the present invention, a camera manufacturing method in which the solid-state imaging device 10 is replaced with a solid-state imaging device 50 in the camera 100 shown in FIG. 7 will be described with respect to the first embodiment. In the manufacturing method of the camera 100 shown in FIG. 7, the solid-state imaging device 10 is replaced with the solid-state imaging device 50.

  Except for the heat dissipation of the solid-state imaging device 11, the present embodiment can provide the same advantages as those of the first embodiment. In addition, according to the present embodiment, the mounting plate 5 can also be formed by die cutting simultaneously with the lead frame 6, so that the accuracy of die cutting for forming the lead frame 6 is very high. Since the processing accuracy is high (for example, the processing accuracy is within ± 0.04 mm), the processing accuracy of the mounting plate 5 can be increased. As a result, according to the present embodiment, the tilt of the solid-state imaging device 11 can be suppressed with higher accuracy. Further, if the mounting plate 5 is formed by die cutting simultaneously with the lead frame 6 as in the present embodiment, the conventional package structure can be used, so that the package cost reduction effect can be obtained.

  [Fourth Embodiment]

  FIG. 21 is a schematic plan view showing a package body 61 according to the fourth embodiment of the present invention. FIG. 22 is a schematic sectional view taken along line X7-X7 'in FIG. FIG. 23 is a schematic sectional view taken along line Y7-Y7 'in FIG. 24 is a schematic plan view showing a solid-state imaging device 70 configured using the package main body 61 shown in FIGS. 21 to 23, and corresponds to FIG. FIG. 25 is a schematic cross-sectional view taken along line X8-X8 'in FIG. 24, and corresponds to FIG. 26 is a schematic cross-sectional view taken along line Y8-Y8 'in FIG. 24, and corresponds to FIG. 21 to 26, the same or corresponding elements as those in FIGS. 1 to 6 are denoted by the same reference numerals, and redundant description thereof is omitted.

  The difference between the package main body 61 according to the present embodiment and the package main body 1 according to the first embodiment is that the bottom plate 2 slightly protrudes on both sides of the frame plate 3 in plan view, and the bottom plate 2 and the mounting plate at the protruding portion. 5 is screwed by a screw 62, and the bottom plate 2 and the mounting plate 5 are not joined by an adhesive, and the embedded member 4 is not embedded. That is, in the present embodiment, the mounting plate 5 is integrated with the package main body 61 by adopting screwing with screws 62 instead of joining with an adhesive. In the present embodiment, a notch through which the screw 62 is inserted is formed in the bottom plate 2, while a screw hole into which the screw 62 is screwed is formed in the mounting plate 5. An insertion hole through which the screw 62 is inserted may be formed in the mounting plate 5, while a screw hole into which the screw 62 is screwed may be formed in the bottom plate 2.

  The method for manufacturing the solid-state imaging device 70 shown in FIGS. 24 to 26 as the method for manufacturing the solid-state imaging device according to the embodiment of the present invention is shown in FIGS. 4 to 6 described in relation to the first embodiment. In the method for manufacturing the solid-state imaging device 10, the package body 1 is replaced with the package body 61.

  Further, as a camera manufacturing method according to an embodiment of the present invention, a camera manufacturing method in which the solid-state imaging device 10 is replaced with a solid-state imaging device 70 in the camera 100 shown in FIG. 7 will be described with reference to the first embodiment. In the manufacturing method of the camera 100 shown in FIG. 7, the solid-state imaging device 10 is replaced with the solid-state imaging device 70.

  Except for the heat dissipation of the solid-state imaging device 11, the present embodiment can provide the same advantages as those of the first embodiment.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments.

  For example, the present invention can also be applied to those using various types of packages such as DIP (Dual Inline Package) and BGA (Ball grid array).

It is a schematic plan view which shows the package main body by the 1st Embodiment of this invention. It is a schematic sectional drawing along the X1-X1 'line | wire in FIG. It is a schematic sectional drawing in alignment with the Y1-Y1 'line | wire in FIG. FIG. 4 is a schematic plan view showing a solid-state imaging device configured using the package body shown in FIGS. 1 to 3. FIG. 5 is a schematic cross-sectional view taken along line X2-X2 ′ in FIG. 4. FIG. 5 is a schematic cross-sectional view taken along line Y2-Y2 ′ in FIG. 4. It is a schematic sectional drawing which shows the camera comprised using the solid-state imaging device shown in FIG. 4 thru | or FIG. It is a schematic sectional drawing which shows the package main body which concerns on the modification of the package main body shown to FIG. It is a schematic plan view which shows the package main body by the 2nd Embodiment of this invention. FIG. 10 is a schematic cross-sectional view taken along line X3-X3 ′ in FIG. 9. FIG. 10 is a schematic cross-sectional view taken along line Y3-Y3 ′ in FIG. 9. FIG. 12 is a schematic plan view illustrating a solid-state imaging device configured using the package main body illustrated in FIGS. 9 to 11. It is a schematic sectional drawing along the X4-X4 'line | wire in FIG. It is a schematic sectional drawing in alignment with the Y4-Y4 'line | wire in FIG. It is a schematic plan view which shows the package main body by the 3rd Embodiment of this invention. FIG. 16 is a schematic cross-sectional view taken along line X5-X5 ′ in FIG. 15. FIG. 16 is a schematic cross-sectional view taken along line Y5-Y3 ′ in FIG. 15. It is a schematic plan view which shows the solid-state imaging device comprised using the package main body shown in FIG. 15 thru | or FIG. It is a schematic sectional drawing along the X6-X6 'line | wire in FIG. It is a schematic sectional drawing in alignment with the Y6-Y6 'line | wire in FIG. It is a schematic plan view which shows the package main body by the 4th Embodiment of this invention. FIG. 22 is a schematic cross-sectional view taken along line X7-X7 ′ in FIG. 21. FIG. 22 is a schematic sectional view taken along line Y7-Y7 'in FIG. FIG. 24 is a schematic plan view showing a solid-state imaging device configured using the package body shown in FIGS. 21 to 23. FIG. 25 is a schematic cross-sectional view along the line X8-X8 ′ in FIG. 24. FIG. 25 is a schematic sectional view taken along line Y8-Y8 'in FIG.

Explanation of symbols

1, 21, 41, 61 Package body 10, 30, 50, 70 Solid-state imaging device 11, 31 Solid-state imaging device 5 Mounting plate 5a, 22a Mounting surface 13, 33 Lid 100 Camera 101 Body 102 Mounting surface

Claims (2)

A package main body for configuring a package containing a solid-state image sensor together with a lid, wherein the solid-state image sensor is not accommodated and the lid is not attached.
And the package and the mounting surface and chromatic vital the mounting surface a mounting surface that contacts said object mounting surface of the camera body incorporating configured solid-state imaging device and a stowed the solid element to the package In contact with the three protrusions of the body in contact with each other, the solid-state imaging device has three locations on the side surface where the rotational position of the solid-state imaging device with respect to the body is determined, and the mounting surface contacts the surface to be mounted And is integrated with an attachment portion screwed to the body in a state where the three portions of the side surface are in contact with the three protrusions, respectively .
The attachment portion is configured by a member different from a member that forms a portion that defines the accommodation space of the solid-state imaging device in the package body, and the member that forms the portion and the other member are: Joined or screwed,
Comprising a lead frame made of a conductive material led out from the housing space,
The material and thickness of the mounting portion are the same as the material and thickness of the lead frame, respectively.
A package body characterized by that.   The package body according to claim 1, wherein the attachment portion and the lead frame are formed from a metal plate by die cutting simultaneously.

Images