JP5541208B2 - Mechanical quantity sensor - Google Patents

Description

  The present invention relates to a mechanical quantity sensor having a sensor chip formed with a sensing unit that outputs a sensor signal corresponding to a physical quantity, and a support member that cantilever-supports the sensor chip so that the sensing unit is exposed.

  2. Description of the Related Art Conventionally, a mechanical quantity sensor having a sensor chip formed with a sensing unit that outputs a sensor signal corresponding to a physical quantity and a support member that cantilever-supports the sensor chip so that the sensing unit is exposed is known. For example, Patent Document 1 discloses the following mechanical quantity sensor. That is, the sensor chip has a rectangular planar shape, and a sensing unit that outputs a sensor signal corresponding to the pressure of the measurement medium is formed on one end in the longitudinal direction. And the other end part side opposite to the one end part side is sealed by the support member so that the sensing part is exposed.

  In such a mechanical quantity sensor, for example, as compared with a mechanical quantity sensor in which the entire back surface of the sensor chip is fixed to a mounted member such as a substrate, the length of the sensor chip in the longitudinal direction is appropriately increased, and the sensing unit is By moving away from the support member as the mounted member, the force applied from the support member can be reduced in the region located between the sensing part and the support member in the sensor chip, and the detection accuracy is prevented from being lowered. can do.

Special table 2009-505088

  However, in recent years, there has been a demand for a mechanical quantity sensor that can suppress further reduction in detection accuracy by reducing the force applied to the sensor chip from the support member.

  An object of this invention is to provide the mechanical quantity sensor which can suppress that detection accuracy falls in view of the said point.

  In order to achieve the above object, according to the first aspect of the present invention, the sensor chip (20) having the sensing unit (21) for outputting the sensor signal corresponding to the physical quantity and the sensing unit (21) are exposed. A support member (40) that cantilever-supports the sensor chip (20), and the sensor chip (20) has a corner portion formed by removing two corners adjacent to each other in a rectangular shape ( 23a), and the end on the corner (23a) side is sealed by the support member (40).

  In such a mechanical quantity sensor, the sensor chip (20) has a shape having a corner (23a) formed by removing two adjacent corners in a rectangular shape, and the corner (23a). The end on the side is supported by the support member (40). For this reason, when the thickness of the sensor chip (20) is the same as that of the conventional mechanical quantity sensor in which the planar shape of the sensor chip is rectangular, the area in contact with the support member (40) is reduced. can do. Therefore, the force applied from the support member (40) to the sensor chip (20) can be reduced, and the reduction in detection accuracy can be suppressed.

  For example, as in the invention described in claim 2, the sensor chip (20) has a planar shape that connects the first to third sides (22a to 22c) and the first and second sides (22a and 22b). A first corner (23a) as a portion, a second corner (23b) connecting the first and third sides (22a, 22c), and a third corner connecting the second and third sides (22b, 22c). It is a triangle having a portion (23c), and the end on the first corner (23a) side is sealed by the support member (40) while the second and third corners (23b, 23c) are exposed. It can be.

  In this case, as in the invention described in claim 3, the planar shape of the sensor chip (20) can be an isosceles triangle in which the angles of the second and third corners (23b, 23c) are equal. According to this, when the sensor chip (20) has a perpendicular shape extending from the first corner (23a) to the third side (22c) as compared with the case where the planar shape of the sensor chip (20) is not an isosceles triangle, the axis It is possible to prevent the force applied from the support member (40) from varying between one region and the other region of the sensor chip (20) with the boundary as a boundary. For this reason, it can suppress that detection accuracy falls further.

  And, as in the invention according to claim 4, when the sensor chip (20) drops a perpendicular from the first corner (23a) to the third side (22c), the length of the perpendicular is the third side ( 22c) can be longer.

  Further, as in the invention described in claim 5, the planar shape of the sensor chip (20) can be a right triangle whose second corner (23b) is 90 °.

  And like invention of Claim 6, in the state which the sensing part (21) protrudes, the mounting member (10, 30) which mounts the edge part by the side of the 1st corner | angular part (23a) in a sensor chip (20). The support member (40) can seal the mounting members (10, 30) together with the end portion on the first corner (23a) side of the sensor chip (20).

  In this case, as in the invention described in claim 7, the support member (40) includes a first support member (40a) that seals the mounting member (10, 30) while exposing the sensor chip (20), The first support member (40a) is softer than the first support member (40a), and has a second support member (40b) that seals the end of the sensor chip (20) on the first corner (23a) side.

  According to this, since the 2nd support member (40b) is softer than the 1st support member (40a) compared with the case where a support member (40) is comprised only with a 1st support member (40a), a support member ( The force applied from 40) to the sensor chip (20) can be reduced.

  Further, as in the invention described in claim 8, in the sensor chip (20), a pressure detection element that outputs a sensor signal corresponding to the pressure of the measurement medium is formed as the sensing unit (21). Can do.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

(A) is a figure which shows the cross-sectional structure of the mechanical quantity sensor in 1st Embodiment of this invention, (b) is a top view of the mechanical quantity sensor shown to (a). It is a top view of a semiconductor wafer. (A) is a figure which shows the cross-sectional structure of the mechanical quantity sensor in 2nd Embodiment of this invention, (b) is a top view of the mechanical quantity sensor shown to (a). (A) is a figure which shows the cross-sectional structure of the mechanical quantity sensor in 3rd Embodiment of this invention, (b) is a top view of the mechanical quantity sensor shown to (a). It is a figure which shows the cross-sectional structure of the sensor chip in other embodiment of this invention.

(First embodiment)
A first embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a diagram showing a cross-sectional configuration of a mechanical quantity sensor in the present embodiment, and FIG. 1B is a plan view of the mechanical quantity sensor shown in FIG.

  As shown in FIG. 1, the mechanical quantity sensor includes a substrate 10, a sensor chip 20 that is mounted on the substrate 10 and has a sensing unit 21 that outputs a sensor signal according to a physical quantity, the sensor chip 20, and an external circuit. And a support member 40 that seals the sensor chip 20, the substrate 10, and the like while exposing the sensing unit 21.

  The substrate 10 is composed of islands of lead frames having islands formed by etching or pressing a plate material such as Cu or Fe, and connecting leads, and has a rectangular plate shape. The sensor chip 20 is mounted on the substrate 10 via a die bond material or the like (not shown) with the sensing unit 21 exposed. In the present embodiment, the substrate 10 corresponds to the sealing member of the present invention.

  The sensor chip 20 has a planar shape having a corner portion 23a formed by removing two adjacent corners in a rectangular shape. Specifically, in this embodiment, the first corners 23a that connect the first to third sides 22a to 22c and the first side 22a and the second side 22b, and the first side 22a and the third side 22c are provided. The triangle has a second corner portion 23b to be connected and a third corner portion 23c to connect the second side 22b and the third side 22c. More specifically, it is an isosceles triangle in which the angles of the second corner portion 23b and the third corner portion 23c are equal. In other words, it is an isosceles triangle in which the lengths of the first side 22a and the second side 22b are equal. Further, the length (height) of the perpendicular line dropped from the first corner 23a to the third side 22c is longer than the length of the third side 22c. In addition, the 1st corner | angular part 23a in this embodiment is corresponded to the corner | angular part comprised by removal of two adjacent corner | angular parts in the rectangular shape of this invention.

  The sensor chip 20 having such a planar shape is configured by joining a semiconductor substrate 24 such as a silicon substrate and a base 25 made of a glass substrate or the like. That is, each of the semiconductor substrate 24 and the pedestal 25 has a planar shape of an isosceles triangle.

  The semiconductor substrate 24 is formed with a sensing unit 21 that outputs a sensor signal corresponding to the pressure of the measurement medium. Specifically, the semiconductor substrate 24 is formed with a concave portion 24a having a rectangular cross section formed by anisotropic etching from the back surface, and the thinned portion along with the concave portion 24a. A diaphragm 24b is configured. The diaphragm 24b is formed such that a gauge resistor (not shown) whose resistance value varies depending on the pressure applied to the diaphragm 24b constitutes a Wheatstone bridge circuit.

  That is, the sensing unit 21 of the present embodiment is configured to include the diaphragm 24b and the gauge resistance. In addition, four pads (not shown) are provided on the surface of the semiconductor substrate 24 in the vicinity of the first corner 23a, and each pad is electrically connected to a connection point of each gauge resistor.

  Specifically, one of the pads applies a driving voltage to the bridge circuit, one of the pads maintains the ground potential of the bridge circuit, and two of the pads indicate the respective midpoints of the bridge circuit. To output a voltage when pressure is applied to the diaphragm 24b.

  In addition, although the sensing part 21 is formed in the part exposed from the supporting member 40 among the semiconductor substrates 24, it is preferable to be formed in the edge part by the side of the 3rd side 22c. As the sensing unit 21 is formed at a location farther from the support member 40, the force applied from the support member 40 to the sensing unit 21 is reduced in the region of the semiconductor substrate 24 located between the sensing unit 21 and the support member 40. Because it can.

  A pedestal 25 is bonded to the back surface of the semiconductor substrate 24 by anodic bonding or the like, and a pressure reference chamber 26 is formed by the recess 24 a and the pedestal 25. In the present embodiment, the pressure reference chamber 26 is set to a vacuum pressure, but may be set to an atmospheric pressure, for example.

  The sensor chip 20 having the above-described shape is formed by applying a die bond material (not shown) to the substrate 10 in a state where the sensing unit 21 protrudes from the substrate 10 and the pedestal 25 faces the substrate 10. Is mounted via. That is, the sensor chip 20 is in a state in which the second and third corner portions 23 b and 23 c protrude from the substrate 10.

  The connection terminal 30 is constituted by a connection lead of a lead frame, and electrically connects the sensor chip 20 and an external circuit or the like. In the present embodiment, the connection terminals 30 are formed in a strip plate shape, and four connection terminals 30 are arranged outside the end portion of the substrate 10 so as to be separated from the substrate 10. The pads are electrically connected to the pads formed on the semiconductor substrate 24 through bonding wires 50 made of gold, aluminum, or the like. That is, one of the connection terminals 30 is electrically connected to a pad that applies a driving voltage, and one of the connection terminals 30 is electrically connected to a pad that maintains a ground potential. The two are electrically connected to pads connected to the midpoint of the bridge circuit. In FIG. 1B, the bonding wire 50 is omitted.

  The support member 40 is a general mold resin such as an epoxy resin, and seals the sensor chip 20 while exposing the sensing unit 21. Specifically, only the end portion on the first corner portion 23a side is sealed while the second and third corner portions 23b and 23c are exposed, and the sensor chip is cantilevered. In addition, the substrate 10, the inner lead portion of the connection terminal 30, and the bonding wire 50 are sealed while exposing the outer lead portion of the connection terminal 30.

  Next, a method for manufacturing the mechanical quantity sensor will be described.

  First, a semiconductor wafer constituting a plurality of semiconductor substrates 24 is prepared by dicing, and a base 25 is bonded to the back surface of the semiconductor wafer by anodic bonding or the like. And the sensor chip 20 is formed by dividing | segmenting the thing of this state into a chip unit along a dicing line.

  FIG. 2 is a plan view of the semiconductor wafer. As shown in FIG. 2, by providing first to third dicing lines 61 to 63 extending in three directions on a semiconductor wafer, the sensor chip 20 whose planar shape is triangular when divided into chips is formed. Can do. When the sensor chip 20 having a planar shape of an isosceles triangle is formed as in the present embodiment, the inner angle formed by the first dicing line 61 and the second dicing line 62, the first dicing line 61 and the first dicing line 61 The inner angle formed by the three dicing lines 63 may be made equal. The interior angle is an angle that is an acute angle in other words.

  Thus, by providing the semiconductor wafer with the first to third dicing lines 61 to 63 extending in three directions, for example, by forming the sensor chip 20 having a rectangular planar shape, the planar portion is removed by removing the corners. As compared with the case where the sensor chip 20 having an isosceles triangle shape is formed, it is possible to suppress the formation of a useless region on the semiconductor wafer.

  Thereafter, a lead frame in which the substrate 10 and the connection terminal 30 are coupled to the frame portion and integrated is prepared. In addition, the board | substrate 10 and the connection terminal 30 are isolate | separated by cutting a frame part after resin sealing.

  Then, the sensor chip 20 is mounted on the substrate 10. Specifically, in a state where the second and third corner portions 23b and 23c are projected from the substrate 10 so that the sensing portion 21 protrudes, the end portion on the first corner portion 23a side of the substrate 10 through the die bond material. Is installed. Subsequently, wire bonding is performed between the connection terminal 30 and the sensor chip 20 to electrically connect the connection terminal 30 and the sensor chip 20.

  Next, the substrate 10, the sensor chip 20, the connection terminal 30, and the bonding wire 50 are resin-sealed by the support member 40 while exposing the sensing portion 21 and the outer lead portions of the connection terminal 30. Then, the said mechanical quantity sensor is manufactured by cutting the flame | frame part which connects the board | substrate 10 and the connection terminal 30. FIG.

  As described above, the sensor chip 20 has a planar shape having the first corner portion 23a configured by removing two adjacent corners in the rectangular shape, and the end portion on the first corner portion 23a side is It is sealed with a support member 40. For this reason, compared with the mechanical quantity sensor whose sensor chip planar shape is a rectangular shape, when the thickness of the sensor chip 20 is the same, the area which contacts the support member 40 can be made small. Further, the area (mounting area) mounted on the substrate 10 can be reduced as compared with the mechanical quantity sensor in which the planar shape of the sensor chip is rectangular. Therefore, the force applied to the sensor chip 20 from the support member 40 and the substrate 10 can be reduced, and a reduction in detection accuracy can be suppressed. The force applied to the sensor chip 20 from the support member 40 is a stress or the like generated due to a difference in thermal expansion coefficient between the sensor chip 20 and the support member 40, and the force applied to the sensor chip 20 from the substrate 10. The term “stress” refers to the stress generated by the difference in thermal expansion coefficient between the sensor chip 20 and the substrate 10.

  Furthermore, since the area of the sensor chip 20 is reduced as compared with the conventional mechanical quantity sensor, the cost can be reduced.

  In the present embodiment, the planar shape of the sensor chip 20 is an isosceles triangle. Therefore, in the sensor chip 20, when a perpendicular line extending from the first corner portion 23a to the third side 22c is defined as an axis (hereinafter simply referred to as an axis), one region (FIG. 1B) with the axis as a boundary. The force applied to the sensor chip 20 from the support member 40 and the substrate 10 varies between the upper area of the middle sensor chip 20 and the other area (the lower area of the middle sensor chip 20 in FIG. 1B). This can be suppressed, and the decrease in detection accuracy can be further suppressed.

(Second Embodiment)
A second embodiment of the present invention will be described. In the present embodiment, the sensor chip 20 is mounted on the connection terminal 30 with respect to the first embodiment, and the other parts are the same as those in the first embodiment, and thus the description thereof is omitted here. FIG. 3A is a diagram showing a cross-sectional configuration of the mechanical quantity sensor in the present embodiment, and FIG. 3B is a plan view of the mechanical quantity sensor shown in FIG. FIG. 3A corresponds to the BB cross section in FIG.

  As shown in FIG. 3, in this embodiment, the substrate 10 is eliminated from the first embodiment, and the sensor chip 20 is mounted on the connection terminal 30. Specifically, each connection terminal 30 has one connection terminal 30 extending to the lower end of the first corner portion 23a side, and one connection terminal 30 from the first side 22a side to the first corner portion. It extends to the lower part of the end part on the 23a side, and one connection terminal 30 extends from the second side 22b side to the lower part of the end part on the first corner part 23a side.

  Although not shown, the semiconductor substrate 24 is formed with a signal processing unit that differentially amplifies and outputs a potential difference between two middle points of the bridge circuit, and has three pads. That is, in the present embodiment, one of the pads applies a driving voltage to the bridge circuit, one of the pads maintains the ground potential of the bridge circuit, and one of the pads serves as a signal processing unit. A voltage is output when pressure is applied to the diaphragm 24b by being connected.

  The sensor chip 20 is mounted on the connection terminal 30 with the semiconductor substrate 24 side facing the connection terminal 30. Specifically, pads formed on the semiconductor substrate 24 are electrically and mechanically connected to the connection terminals 30 via bumps 70. That is, the connection terminal 30 of the present embodiment also functions as a mounting member of the present invention.

  As described above, in this embodiment, the sensor chip 20 is electrically and mechanically connected via the connection terminals 30 and the bumps 70. For this reason, compared with the said 1st Embodiment, the force applied to the sensor chip 20 can be reduced. That is, as described above, the substrate 10 is configured by using a metal member, but due to the difference in thermal expansion coefficient between the sensor chip 20 and the support member 40 generally configured by resin or the like, The difference in coefficient of thermal expansion from the substrate 10 made of a metal member becomes larger. For this reason, as described above, by connecting the sensor chip 20 electrically and mechanically via the connection terminals 30 and the bumps 70, the entire region below the end portion of the sensor chip 20 on the first corner portion 23a side. Compared with the first embodiment in which the substrate 10 made of a metal member is arranged, the force applied to the sensor chip 20 can be reduced, and the detection accuracy can be prevented from being lowered.

  In the present embodiment, a signal processing unit is formed in the sensor chip 20, and the potential difference at the midpoint of the bridge circuit is differentially amplified and output, thereby providing three pads. For this reason, as shown in FIG. 3B, the connection terminals 30 can be arranged in a well-balanced manner, and the force applied from the connection terminals 30 to the sensor chip 20 is limited to one region (FIG. 3). It is possible to suppress variation between (b) the upper area of the middle sensor chip 20 and the other area (lower area of the middle sensor chip 20 in FIG. 3B). That is, when the sensor chip 20 is provided with four pads without forming the signal processing unit, for example, in addition to the connection terminal 30 shown in FIG. The connection terminal 30 extending to the lower side of the end portion on the corner 23a side is provided, and the force applied to the sensor chip 20 from the connection terminal 30 is one region with the axis as a boundary (in FIG. 3B). There is a variation between the upper area of the sensor chip 20 in the drawing and the other area (the lower area of the sensor chip 20 in FIG. 3B). On the other hand, in this embodiment, since the signal processing unit is formed on the sensor chip 20 to form three pads, the force applied to the sensor chip 20 from the connection terminal 30 can be prevented from varying. .

(Third embodiment)
A third embodiment of the present invention will be described. In this embodiment, the support member 40 is configured to have a first support member and a second support member with respect to the second embodiment, and the other parts are the same as those in the first embodiment. Description is omitted. FIG. 4A is a diagram showing a cross-sectional configuration of the mechanical quantity sensor in the present embodiment, and FIG. 4B is a plan view of the mechanical quantity sensor shown in FIG. 4A corresponds to the CC cross section in FIG. 4B.

  As shown in FIG. 4, the support member 40 seals the inner lead portion of the connection terminal 30 while exposing the sensor chip mounting region and the outer lead portion of the connection terminal 30 on which the sensor chip 20 is mounted. The first support member 40 a and the second support member 40 b that seals the end of the sensor chip 20 on the first corner 23 a side and the sensor chip mounting region of the connection terminal 30 are included. The first support member 40a is made of mold resin or the like, and the second support member 40b is sealed with a potting agent such as gel softer than the first support member 40a.

  Such a mechanical quantity sensor is manufactured as follows, for example. That is, first, the connection terminal 30 is sealed with the first support member 40a while exposing the sensor chip mounting region on which the sensor chip 20 is mounted and the outer lead portion of the connection terminal 30. Next, the sensor chip 20 is mounted on the sensor chip mounting region in the connection terminal 30 via the bumps 70, and the connection terminal 30 and the sensor chip 20 are electrically and mechanically connected. Thereafter, a potting material is arranged at the end of the sensor chip 20 on the first corner 23a side, and the end of the sensor chip 20 on the first corner 23a side and the sensor chip mounting region of the connection terminal 30 are defined as the second support member 40b. The mechanical quantity sensor shown in FIG. 4 is manufactured by sealing with.

  According to this, since the sensor chip 20 is sealed with the second support member 40b softer than the first support member 40a as compared with the second embodiment, the sensor chip 20 is applied from the support member 40. The force can be reduced, and the reduction in detection accuracy can be further suppressed.

(Other embodiments)
In each of the above embodiments, the example in which the planar shape of the sensor chip 20 is an isosceles triangle has been described. However, the present invention is not limited to this, and the sensor chip 20 has two rectangular corners adjacent to each other in a rectangular shape. What is necessary is just to have the 1st corner | angular part 23a comprised by removal of this, and the edge part by the side of the said 1st corner | angular part 23a being sealed by the support member 40. For example, the sensor chip 20 may be a right triangle in which the angle of the second corner portion 23b is 90 °.

  In each of the above embodiments, the method of forming the sensor chip 20 by dividing the semiconductor wafer bonded to the base 25 into chips is described. For example, the sensor chip 20 is formed as follows. You can also. That is, for example, the sensor chip 20 can also be formed by joining the pedestal 25 to the semiconductor substrate 24 after forming the semiconductor substrate 24 by dividing the semiconductor wafer into chips.

  Furthermore, although each said embodiment demonstrated the example in which the pressure detection element which detects a pressure as the sensing part 21 was formed, even if the flow rate detection element which detects a flow volume is formed as the sensing part 21, for example, Alternatively, a temperature detection element that detects temperature may be formed, or a detection element that detects acceleration, angular velocity, or the like may be formed.

  Further, in each of the above embodiments, a mechanical quantity sensor in which the sensor chip 20 is mounted on the substrate 10 or the connection terminal 30 as a mounting member, and the end on the first corner portion 23a side is sealed with the support member 40 will be described. However, for example, the end of the sensor chip 20 on the first corner 23a side may be sealed with the support member 40 without including the substrate 10 or the connection terminal 30 as the mounting member.

  In each of the above embodiments, the sensor chip 20 has been described by taking as an example one having the semiconductor substrate 24 having the recess 24a formed on the back surface and the base 25 bonded to the back surface of the semiconductor substrate 24. For example, the sensor chip 20 may be configured as follows. FIG. 5 is a diagram illustrating a cross-sectional configuration of the sensor chip 20 according to another embodiment.

  As shown in FIG. 5A, the recess 23 may have a trapezoidal cross-sectional shape. Further, as shown in FIG. 5B, the semiconductor substrate 24 is thinned and a recess 25a is formed in the pedestal 25, and the diaphragm 24b is formed in a region of the semiconductor substrate 24 facing the recess 25a. May be. Then, as shown in FIG. 5 (c), a recess 24a having a trapezoidal cross section is formed from the surface of the semiconductor substrate 24, and a recess 25a is formed in a region of the pedestal 25 that faces the bottom surface of the recess 24a. The diaphragm 24b may be configured. Furthermore, as shown in FIG. 5D, as a modification of FIG. 5C, the cross-sectional shape of the recess 24a may be rectangular. Further, as shown in FIG. 5E, the sensor chip 20 may be constituted by only the semiconductor substrate 24, and the cavity 27 constituting the pressure reference chamber 26 may be formed inside the semiconductor substrate 24. Such a semiconductor substrate 24 is formed, for example, by forming a recess on the surface of a substrate made of silicon and then forming an epitaxial layer on the substrate so as to close the recess by LPCVD or the like, thereby forming a cavity by the recess. 27 is constructed and manufactured.

  In the second and third embodiments, the example in which the sensor chip 20 is electrically and mechanically connected to the connection terminal 30 via the bump 70 has been described. For example, the base 25 faces the connection terminal 30. In this state, the sensor chip 20 may be mechanically connected to the connection terminal 30 via a die bond material, and the sensor chip 20 may be electrically connected to the connection terminal 30 via a bonding wire 50.

DESCRIPTION OF SYMBOLS 10 Board | substrate 20 Sensor chip 21 Sensing part 30 Connection terminal 40 Support member 50 Bonding wire

Claims (8)

A sensor chip (20) having a sensing unit (21) for outputting a sensor signal corresponding to a physical quantity;
A support member (40) that cantilever-supports the sensor chip (20) while exposing the sensing unit (21),
The sensor chip (20) has a planar shape having a corner (23a) formed by removing two adjacent corners in a rectangular shape, and the end on the corner (23a) side is the end A mechanical quantity sensor sealed by a support member (40).   The sensor chip (20) has a first corner portion (23a) as the corner portion in which the planar shape connects the first to third sides (22a to 22c) and the first and second sides (22a, 22b). A triangle having a second corner (23b) connecting the first and third sides (22a, 22c), and a third corner (23c) connecting the second and third sides (22b, 22c); The second and third corners (23b, 23c) are exposed, and the end on the first corner (23a) side is sealed by the support member (40). The mechanical quantity sensor according to claim 1.   The mechanical quantity sensor according to claim 2, wherein the sensor chip (20) is an isosceles triangle in which the planar shape has the same angle of the second and third corners (23b, 23c). .   In the sensor chip (20), when a perpendicular is dropped from the first corner (23a) to the third side (22c), the length of the perpendicular is longer than the third side (22c). The mechanical quantity sensor according to claim 3.   The mechanical quantity sensor according to claim 2, wherein the sensor chip (20) is a right triangle whose planar shape is 90 ° in the second corner (23b). A mounting member (10, 30) for mounting an end of the sensor chip (20) on the first corner (23a) side in a state where the sensing unit (21) protrudes,
The said supporting member (40) seals the said mounting member (10, 30) with the edge part by the side of the said 1st corner | angular part (23a) in the said sensor chip (20). 5. The mechanical quantity sensor according to any one of 5 above.   The support member (40) is softer than the first support member (40a) for sealing the mounting member (10, 30) while exposing the sensor chip (20), and the first support member (40a), The mechanical quantity sensor according to claim 6, further comprising a second support member (40b) that seals an end of the sensor chip (20) on the first corner (23a) side.   8. The sensor chip according to claim 1, wherein a pressure detection element that outputs a sensor signal corresponding to a pressure of a measurement medium is formed as the sensing unit. The mechanical quantity sensor described in 1.

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