JP5567412B2 - Optical transceiver and electronic device - Google Patents

Description

  The present invention relates to optical transceivers and electronic devices.

  An optical transceiver having an optical transmission assembly that converts an electrical signal into an optical signal, an optical reception assembly that converts an optical signal into an electrical signal, and a circuit board to which the optical transmission assembly and the optical reception assembly are electrically connected is known. It has been.

  In optical transceivers, the crosstalk that occurs between the optical transmitter assembly and the optical receiver assembly is a problem. In particular, unwanted electromagnetic waves emitted from the optical transmission assembly tend to adversely affect the reception sensitivity of the optical reception assembly.

  In order to solve such a problem, in Patent Document 1, an electronic component that becomes an electromagnetic noise source is covered with a conductive casing (extra length processing tray that performs extra length processing of an optical fiber), and the casing is covered with a circuit. An optical transceiver module that is electrically connected to a ground pad formed on a substrate has been proposed. In addition, in Patent Document 2, when a part of the shielding wall that separates transmission and reception provided to suppress interference between transmission and reception is missing, a radio wave absorber is attached to the lacked part. An optical transmission module is disclosed.

JP 2006-065017 A JP-A-2005-117772

  However, since the techniques described in Patent Documents 1 and 2 need to secure a space for forming a ground pad on the circuit board, when electronic components are mounted on the circuit board of the optical transceiver at high density, Difficult to apply. In the technique described in Patent Document 2, it is necessary to further secure a space for directly attaching the radio wave absorber on the circuit board.

  This is a problem common not only to optical transceivers but also to all electronic devices in which electronic components serving as a source of unnecessary electromagnetic waves are mounted on a circuit board.

  The present invention has been made in view of the above problems, and provides an optical transceiver and an electronic apparatus that can reduce interference between electronic components mounted on a circuit board without hindering high-density mounting. With the goal.

  In order to solve the above problems, an optical transceiver according to the present invention includes an optical transmission assembly that converts an electrical signal into an optical signal, an optical reception assembly that converts an optical signal into an electrical signal, the optical transmission assembly, and the optical reception. A first holding member having a concave first groove portion that holds an assembly and vertically cuts one side surface of a portion sandwiched between the optical transmission assembly and the optical reception assembly, and holds one or more parts. A second holding member having a concave second groove portion that cuts vertically, the first holding member and the second holding member arranged so that the first groove portion and the second groove portion face each other, and the optical transmission A circuit board electrically connected to each of the assembly and the optical receiving assembly, and one side part adjacent to the lower side part is sandwiched between the first groove parts so that the lower side part contacts the circuit board, A plate-shaped radio wave absorber having an opposite side opposite to one side held by the second groove, the optical transmission assembly, the optical reception assembly, the first holding member, the second holding member, and the circuit board And a case for housing the radio wave absorber.

  In the present invention, a radio wave absorber that is generally used by being directly attached to a casing or an electronic component that is a source of electromagnetic noise is erected on a circuit board so as to partition the optical transmission assembly from the optical reception assembly. Use in the state. For this reason, according to the present invention, there is no need to secure a space for forming a ground pad on the circuit board or a space for directly attaching a radio wave absorber, so that the circuit board is not hindered by high-density mounting. Interference (crosstalk) between the optical transmission assembly and the optical reception assembly mounted thereon can be reduced.

  In one aspect of the present invention, there is further provided an elastic member capable of absorbing radio waves supported from below by a part of the first holding member and a part of the second holding member and pressed from above by the case. The elastic member may cover all or a part of at least one of the optical transmission assembly and the optical reception assembly.

  In this aspect, an elastic member capable of absorbing radio waves, which is generally applied to a part that can be entirely pressed from both sides, is supported from below at at least two locations (first holding member, second holding member), and By using in a state where the case is pressed from above, at least one of the optical transmission assembly and the optical reception assembly is entirely or partially covered with a radio wave absorbing member. Therefore, according to this aspect, compared with the case where the optical transmission assembly and optical reception assembly mounted on a circuit board are partitioned only by a plate-shaped radio wave absorber, interference between the two can be further reduced.

  In the aspect of the invention, the elastic member may be further supported from below by the upper side portion of the radio wave absorber.

  According to this aspect, the elastic member capable of absorbing radio waves is supported from below at at least three locations (first holding member, second holding member, plate-like radio wave absorber). Further, since the plate-like wave absorber and the elastic member capable of absorbing the wave are in close contact with each other, interference between the optical transmission assembly and the optical reception assembly can be further reduced.

  In the aspect of the invention, the elastic member may be formed of a clay-like material.

  In one embodiment of the present invention, the length of the portion of the elastic member that protrudes from the first holding member is less than the height of the first holding member, and the length of the elastic member from the second holding member The length of the portion that protrudes outside may be less than the height of the second holding member.

  According to this aspect, it is possible to prevent a part of the elastic radio wave absorbing member formed of a clay-like material from coming into contact with the circuit board.

  The electronic device according to the present invention includes a first and second electronic component, at least one of which serves as an electromagnetic wave source, a circuit board on which the first and second electronic components are mounted, and the first and second electronic components. A plate-like radio wave absorber disposed on the circuit board so as to partition the electronic components; a holding structure that sandwiches and holds both side portions of the radio wave absorber; and the first and first And a housing that houses the electronic component, the circuit board, the radio wave absorber, and the holding structure.

  According to the present invention, it is not necessary to secure a space for forming a ground pad on the circuit board or a space for directly attaching a radio wave absorber, so that it is mounted on the circuit board without hindering high-density mounting. Interference between electronic components to be performed can be reduced.

1 is an exploded perspective view of an optical transceiver according to an embodiment of the present invention. It is a top view of an optical transceiver. It is a side view of an optical transceiver. It is the III-III sectional view taken on the line of the optical transceiver shown to FIG. 2A. FIG. 4 is a cross-sectional view of the optical transceiver shown in FIG. 2A taken along line IV-IV. FIG. 5 is a cross-sectional view of the optical transceiver shown in FIG. 2B taken along line VV. It is a figure which shows the state which removed the upper case of the optical transceiver. FIG. 7 is a cross-sectional view of the optical transceiver shown in FIG. 6 taken along the line VII-VII. FIG. 7 is a sectional view of the optical transceiver shown in FIG. 6 taken along line VIII-VIII.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is an exploded perspective view of an optical transceiver 100 according to the present embodiment. 2A is a top view of the optical transceiver 100, and FIG. 2B is a side view of the optical transceiver 100. FIG. 3 is a cross-sectional view of the optical transceiver 100 shown in FIG. 2A taken along line III-III. FIG. 4 is a cross-sectional view of the optical transceiver 100 shown in FIG. 2A taken along line IV-IV. FIG. 5 is a cross-sectional view of the optical transceiver 100 shown in FIG. 2B taken along line VV.

  As shown in FIGS. 1 to 5, the optical transceiver 100 includes a case 10, a circuit board 16, an input / output connector 20, a multiplexer 22, a separator 24, an optical transmission assembly 26, an optical reception assembly 28, and an attachment 30 (first 1 holding member), a tray 40 (second holding member), a radio wave absorbing sheet 50, and a radio wave absorbing and radiating sheet 52.

  The case 10 is composed of an upper case 12 and a lower case 14 made of, for example, aluminum, and has an internal space for storing various components (such as an optical transmission assembly 26, an optical reception assembly 28, an attachment 30, a tray 40). Have. The case 10 serves to protect components housed in the internal space and to dissipate heat generated from them to the outside. The upper case 12 and the lower case 14 are fixed with screws, for example.

  The circuit board 16 includes, for example, a board made of glass epoxy resin and a wiring pattern (not shown) formed on the board, and is fixed to the lower case 14 with screws. On the circuit board 16, in addition to the attachment 30 and the tray 40, electronic components (not shown) are mounted. A terminal 18 for electrical connection with the outside is provided at one end of the circuit board 16.

  The input / output connector 20 is a connector for optical connection with an optical fiber inserted from the outside made of, for example, plastic. The input / output connector 20 includes an input connector and an output connector. The input / output connector 20 is fixed by being fitted into a storage portion formed inside the case 10.

  The multiplexer 22 is a multiplexer that multiplexes and outputs a plurality of optical signals into one optical signal. The multiplexer 22 is mainly formed of metal and is fixed to the case 10 with screws.

  The separator 24 is a demultiplexer that separates and outputs one optical signal into a plurality of optical signals. The separator 24 is mainly formed of metal and is fixed to the case 10 with screws.

  The optical transmission assembly 26 is one or a plurality of optical assemblies (here, four) that incorporate light emitting elements for converting electrical signals into optical signals. The optical transmission assembly 26 is bonded and fixed to the attachment 30 and mounted on the circuit board 16 via the attachment 30. In addition, the optical transmission assembly 26 is electrically connected to the circuit board 16, and solder can be used for the electrical connection.

  The optical receiving assembly 28 is one or a plurality of optical assemblies (here, four) that incorporate a light receiving element for converting an optical signal into an electrical signal. Similar to the optical transmitter assembly 26, the optical receiver assembly 28 is bonded and fixed to the attachment 30, and is mounted on the circuit board 16 via the attachment 30. In addition, the optical receiving assembly 28 is electrically connected to the circuit board 16, and solder can be used for the electrical connection.

  The attachment 30 is an insulating holding member having an optical transmission assembly holding part 32 for holding the optical transmission assembly 26 and an optical reception assembly holding part 34 for holding the optical reception assembly 28. The attachment 30 is made of plastic, for example, and is fixed to the circuit board 16 with screws.

  The attachment 30 is formed with an engagement hole 36 that engages with the engagement protrusion 44 of the tray 40 in order to hold the tray 40.

  Further, the attachment 30 is formed with a concave radio wave absorbing sheet fixing groove 38 (first groove portion) that vertically cuts one side surface of a portion sandwiched between the optical transmission assembly 26 and the optical reception assembly 28. The radio wave absorbing sheet fixing groove 38 has a structure provided to sandwich one side of the radio wave absorbing sheet 50. That is, the attachment 30 also has a role of holding the radio wave absorbing sheet 50 in addition to the optical transmission assembly 26, the optical reception assembly 28, and the tray 40.

  The tray 40 is a holding member having an optical fiber winding region 42 for winding and arranging the optical fiber a plurality of times in order to perform the extra length processing of the optical fiber, and is made of, for example, plastic. The tray 40 is formed with an engagement protrusion 44 that engages with the engagement hole 36 of the attachment 30, and the tray 40 is mounted on the circuit board 16 via the attachment 30.

  An opening 46 is formed in the tray 40, and the optical transmission assembly 26, the optical reception assembly 28, and other electronic components (not shown) can be arranged inside the opening 46.

  Further, the tray 40 is further formed with a concave radio wave absorbing sheet fixing groove 48 (second groove) that vertically cuts the inner surface of the opening 46. As shown in FIG. 5, the radio wave absorbing sheet fixing groove 48 is formed to face the radio wave absorbing sheet fixing groove 38 of the attachment 30 when the tray 40 is mounted on the circuit board 16 via the attachment 30. . That is, the attachment 30 and the tray 40 are mounted on the circuit board 16 in a state where the radio wave absorbing sheet fixing groove 38 and the radio wave absorbing sheet fixing groove 48 are arranged to face each other.

  The radio wave absorbing sheet fixing groove 48 has a structure provided to sandwich one side of the radio wave absorbing sheet 50. That is, the tray 40 according to the present embodiment also has a role of holding the radio wave absorbing sheet 50 in addition to the optical fiber.

  The radio wave absorbing sheet 50 is a rectangular plate-shaped radio wave absorber formed of, for example, an ethylene vinyl acetate copolymer and soft magnetic powder. As shown in FIG. 1 and FIG. 3, in the present embodiment, the radio wave absorbing sheet 50 is fixed in a state where it is erected on the circuit board 16 so as to partition the optical transmission assembly 26 and the optical reception assembly 28. Therefore, the radio wave absorption sheet 50 is sandwiched by the radio wave absorption sheet fixing groove 38 at one side adjacent to the lower side so that the lower side (side on the lower case 14 side) is in contact with the circuit board 16. Opposite side portions that face each other are sandwiched between the radio wave absorbing sheet fixing grooves 48. Thereby, interference (crosstalk) between the optical transmission assembly 26 and the optical reception assembly 28 mounted on the circuit board 16 is reduced.

  The radio wave absorbing and radiating sheet 52 is a clay-like elastic member that is made of, for example, silicone rubber and soft magnetic powder and can absorb radio waves. As shown in FIGS. 3 and 4, in the present embodiment, the radio wave absorbing and radiating sheet 52 includes a part of the attachment 30, a part of the tray 40, and the upper side portion of the radio wave absorbing sheet 50 (the side portion on the upper case 12 side). ) And is fixed in a state of being pressed from above by the upper case 12.

  Note that the length of the portion of the radio wave absorbing and radiating sheet 52 that protrudes from the attachment 30 is preferably less than the height of the attachment 30. In addition, the length of the portion of the radio wave absorbing and radiating sheet 52 that protrudes from the tray 40 is preferably less than the height of the tray 40. By doing so, it is possible to prevent a part of the radio wave absorbing and radiating sheet 52 formed of a clay-like material from coming into contact with the circuit board 16.

  FIG. 6 is a diagram illustrating a state where the upper case 12 of the optical transceiver 100 is removed. 7 is a cross-sectional view of the optical transceiver 100 shown in FIG. 6 taken along the line VII-VII. 8 is a cross-sectional view taken along line VIII-VIII of the optical transceiver 100 shown in FIG.

  As shown in FIGS. 6 to 8, the radio wave absorbing and radiating sheet 52 fixed as described above covers substantially the entire light receiving assembly 28 from above. For this reason, compared with the case where the optical transmission assembly 26 and the optical reception assembly 28 mounted on the circuit board 16 are partitioned only by the radio wave absorption sheet 50, the crosstalk between the two is further reduced. Further, the heat generated in the case 10 is more efficiently dissipated to the outside.

  Here, an example is shown in which the radio wave absorbing and radiating sheet 52 supported from below by a part of the attachment 30, a part of the tray 40, and the upper side of the radio wave absorbing sheet 50 covers the light receiving assembly 28 (3 The electromagnetic wave absorbing and radiating sheet 52 may be supported from below by only a part of the attachment 30 and a part of the tray 40 (supported at two points). All or a part of at least one of the optical receiving assemblies 28 may be covered.

  According to the optical transceiver 100 described above, it is not necessary to secure a space for forming a ground pad on the circuit board 16 or a space for directly attaching a radio wave absorber, so that high-density mounting is not hindered. Crosstalk between the optical transmitter assembly 26 and the optical receiver assembly 28 mounted on the circuit board 16 can be reduced.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. In addition, the configuration described in the above embodiment can be replaced with a configuration that is substantially the same, a configuration that exhibits the same operational effects, or a configuration that can achieve the same purpose.

  For example, in the above embodiment, the example in which the tray 40 is used as the configuration for holding the radio wave absorption sheet 50 and the radio wave absorption heat dissipation sheet 52 has been described. However, the radio wave absorption sheet 50 or the radio wave absorption heat dissipation sheet is used as a component other than the tray 40. 52 may be held.

  The present invention is applicable not only to optical transceivers but also to all electronic devices including first and second electronic components, at least one of which serves as an electromagnetic wave source. In this case, the electronic device includes a plate-like wave absorber disposed on the circuit board so as to partition the first and second electronic components, and both side portions of the radio wave absorber. And a holding structure for holding it in between. As an electronic device to which the present invention is applicable, for example, a wireless communication module (first electronic component) for voice communication or packet communication, and a wireless communication module (second electronic component) for realizing a non-contact IC card function Electronic parts) and mobile phones with built-in electronic components.

  10 cases, 12 upper cases, 14 lower cases, 16 circuit boards, 18 terminals, 20 I / O connectors, 22 multiplexers, 24 separators, 26 optical transmitter assemblies, 28 optical receiver assemblies, 30 attachments, 32 optical transmitter assemblies 34, optical receiving assembly holding part, 36 engaging hole, 38, 48 radio wave absorbing sheet fixing groove, 40 tray, 42 optical fiber winding region, 44 engaging protrusion, 46 opening, 50 radio wave absorbing sheet, 52 radio wave absorbing Heat dissipation sheet, 100 optical transceiver.

Claims (6)

An optical transmission assembly for converting electrical signals into optical signals;
An optical receiver assembly for converting an optical signal into an electrical signal;
A first holding member that holds the optical transmission assembly and the optical reception assembly and has a concave first groove that vertically cuts one side surface of a portion sandwiched between the optical transmission assembly and the optical reception assembly;
A second holding member that holds one or more components and has a concave second groove that vertically cuts one side surface;
The first holding member and the second holding member that are disposed so that the first groove portion and the second groove portion face each other are mounted, and are electrically connected to the optical transmission assembly and the optical reception assembly, respectively. A circuit board;
A plate-shaped radio wave absorber in which one side adjacent to the lower side is sandwiched by the first groove and the opposite side facing the one side is sandwiched by the second groove so that the lower side is in contact with the circuit board. Body,
A case for housing the optical transmitter assembly, the optical receiver assembly, the first holding member, the second holding member, the circuit board, and the radio wave absorber;
An optical transceiver comprising: The optical transceiver of claim 1.
And further comprising an elastic member capable of absorbing radio waves that is supported from below by a part of the first holding member and a part of the second holding member and pressed from above by the case,
The elastic member covers all or a part of at least one of the optical transmission assembly and the optical reception assembly;
An optical transceiver characterized by that. The optical transceiver according to claim 2,
The elastic member is further supported from below by the upper side of the radio wave absorber.
An optical transceiver characterized by that. The optical transceiver according to claim 2 or 3,
The elastic member is formed of a clay-like material,
An optical transceiver characterized by that. The optical transceiver according to claim 4,
The length of the portion of the elastic member that protrudes from the first holding member is less than the height of the first holding member,
The length of the portion of the elastic member that protrudes from the second holding member is less than the height of the second holding member.
An optical transceiver characterized by that. First and second electronic components, at least one of which is an electromagnetic wave source,
A first holding member that holds the first and second electronic components and has a concave first groove that vertically cuts one side surface of a portion sandwiched between the first electronic component and the second electronic component; ,
A second holding member that holds one or more components and has a concave second groove that vertically cuts one side surface;
The first holding member and the second holding member arranged so that the first groove portion and the second groove portion are opposed to each other are mounted and electrically connected to each of the first and second electronic components . A circuit board;
A plate-shaped radio wave absorber in which one side adjacent to the lower side is sandwiched by the first groove and the opposite side facing the one side is sandwiched by the second groove so that the lower side is in contact with the circuit board. Body,
A housing that houses the first and second electronic components, the first holding member, the second holding member, the circuit board, and the radio wave absorber;
An electronic device comprising:

Images