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JP5568887B2 - Liquid level detector - Google Patents
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JP5568887B2 - Liquid level detector - Google Patents

Liquid level detector Download PDF

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JP5568887B2
JP5568887B2 JP2009121537A JP2009121537A JP5568887B2 JP 5568887 B2 JP5568887 B2 JP 5568887B2 JP 2009121537 A JP2009121537 A JP 2009121537A JP 2009121537 A JP2009121537 A JP 2009121537A JP 5568887 B2 JP5568887 B2 JP 5568887B2
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sliding contact
liquid level
polishing
sliding
conductor
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JP2010271096A (en
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和彦 新川
秀夫 林
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Nippon Seiki Co Ltd
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Description

本発明は、液面検出装置に関するもので、特に、摺動接点が、液面の変動によって回路基板に設けた固定電極上を摺動する液面検出装置に関するものである。   The present invention relates to a liquid level detection device, and more particularly to a liquid level detection device in which a sliding contact slides on a fixed electrode provided on a circuit board due to a change in the liquid level.

従来の液面検出装置は、回路基板上に抵抗材料からなる抵抗体が設けられ、この抵抗体に沿って銀、パラジウムなどの導電性材料とガラスとからなる導体路を有し、この導体路上を摺動する摺動接点を備えていた(例えば、特許文献1参照)。   A conventional liquid level detection device is provided with a resistor made of a resistive material on a circuit board, and has a conductor path made of a conductive material such as silver or palladium and glass along the resistor, (See, for example, Patent Document 1).

このような液面検出装置においては、前記摺動接点が、硬質な前記導体路上を摺動するために、前記摺動接点の摩耗が問題となっていた。   In such a liquid level detecting device, since the sliding contact slides on the hard conductor path, wear of the sliding contact has been a problem.

そこで、前記摺動接点の摩耗の原因は、前記導体路の表面の微小な凹凸による粗さであり、前記導体路の表面の微小な凹凸を除去するために、前記導体路の表面の研磨による艶出し仕上げを施し耐久性の向上をはかった液面検出装置があった(例えば、特許文献2参照)。   Therefore, the cause of wear of the sliding contact is roughness due to minute irregularities on the surface of the conductor path, and polishing of the surface of the conductor path in order to remove the minute irregularities on the surface of the conductor path. There has been a liquid level detection device that has been polished to improve durability (for example, see Patent Document 2).

実開昭62−40528号公報Japanese Utility Model Publication No. 62-40528 特開平11−211540号公報JP 11-2111540 A

このような液面検出装置においては、研磨によって、前記導体路の表面の微小な凹凸も小さくなり、前記摺動接点の摩耗が大幅に減少して耐久性が向上したが、さらなる耐久性の向上が望まれていた。   In such a liquid level detection device, the fine irregularities on the surface of the conductor path are reduced by polishing, and the wear of the sliding contact is greatly reduced and the durability is improved. However, the durability is further improved. Was desired.

そこで、前記導体路の表面の微小な凹凸をさらに除去するために、前記導体路の表面を研磨することが考えられるが、前記導電路の表面を平滑にする研磨作業を行うことは、作業工数の増加を招き、コストが上昇するという問題があった。   Therefore, in order to further remove minute irregularities on the surface of the conductor path, it is conceivable to polish the surface of the conductor path. However, performing the polishing operation to smooth the surface of the conductive path is a work man-hour. There was a problem that the cost increased.

そこで、本発明は、コストの上昇を抑制し、耐久性の向上をはかった液面検出装置を提供するものである。   Therefore, the present invention provides a liquid level detection device that suppresses an increase in cost and improves durability.

本発明は、前記目的を達成するため、導電体を備えた回路基板と、液面の変動に伴い前記導電体を摺動する摺動接点と、この摺動接点が固定される摺動子とを備えた液面検出装置において、前記摺動子は支点を中心に回動し、前記導電体は、前記摺動子の回動に基づく前記摺動接点の円弧状の軌跡上に断続的に複数配置され、前記摺動接点の摺動方向に対して、45°〜90°の傾きを持つように共通方向の研磨痕を前記複数の導電体に設けたものである。 In order to achieve the above object, the present invention provides a circuit board provided with a conductor, a sliding contact that slides on the conductor in accordance with a change in liquid level, and a slider on which the sliding contact is fixed. In the liquid level detecting device, the slider rotates about a fulcrum, and the conductor intermittently on an arc-shaped locus of the sliding contact based on the rotation of the slider. a plurality of arranged, with respect to the sliding direction of the sliding contact, is the polishing marks of the common direction as one lifting the inclination of 45 ° to 90 ° as provided in the plurality of conductors.

また、前記研磨痕は、0.5〜1.0μmの凹凸からなるものである。   Moreover, the said grinding | polishing trace consists of an unevenness | corrugation of 0.5-1.0 micrometer.

以上、本発明により、所期の目的を達成することができ、コストの上昇を抑制し、耐久性が向上した液面検出装置を提供することができる。   As described above, according to the present invention, it is possible to provide a liquid level detection device that can achieve an intended purpose, suppress an increase in cost, and have improved durability.

本発明の第1実施形態の正面図。The front view of 1st Embodiment of this invention. 同実施形態の要部拡大正面図。The principal part enlarged front view of the embodiment. 図2中A−A線の固定電極の研磨前の断面図。Sectional drawing before grinding | polishing of the fixed electrode of the AA line in FIG. 図2中A−A線の固定電極の研磨後の断面図。Sectional drawing after grinding | polishing of the fixed electrode of the AA line in FIG.

図1から図4は、本発明の第1実施形態の正面図であり、本発明を自動車などの車両の燃料タンク内に設けられる液面検出装置を例にとって説明する。   1 to 4 are front views of a first embodiment of the present invention, and the present invention will be described taking a liquid level detection device provided in a fuel tank of a vehicle such as an automobile as an example.

この液面検出装置1は、セラミックなどの回路基板2と、この回路基板2上に形成された導電体からなる固定電極3a、3bと、固定電極3aに接続する抵抗体4と、図示しない支点を中心に回動する摺動子5と、この摺動子5に設けられた第1の摺動接点6と第2の摺動接点7とを備えている。   The liquid level detection device 1 includes a circuit board 2 such as ceramic, fixed electrodes 3a and 3b made of a conductor formed on the circuit board 2, a resistor 4 connected to the fixed electrode 3a, and a fulcrum not shown. , And a first sliding contact 6 and a second sliding contact 7 provided on the slider 5.

9、10は、接続ランド9a,10aと固定電極3a、3bとを電気的に接続する配線パターンであり、配線パターン9、10と接続ランド9a、10aとは、固定電極3a、3bと同一の導電体で形成されている。接続ランド9a,10aには、それぞれリード線12が半田13により接続され、図示しない計器の駆動手段に接続されている。なお、11は、調整用抵抗体11である。   9 and 10 are wiring patterns for electrically connecting the connection lands 9a and 10a and the fixed electrodes 3a and 3b. The wiring patterns 9 and 10 and the connection lands 9a and 10a are the same as the fixed electrodes 3a and 3b. It is made of a conductor. Lead wires 12 are connected to the connecting lands 9a and 10a by solder 13, respectively, and are connected to a driving means of a meter (not shown). Reference numeral 11 denotes an adjustment resistor 11.

固定電極3aは、導電体からなり、その形状は、線状であり、複数設けられている。そして、この固定電極3aは、それぞれ抵抗体4と接続している。固定電極3aを構成する導電体は、銀、パラジウムの金属と、ガラスなどで構成され、回路基板2上に焼付形成される。   The fixed electrode 3a is made of a conductor and has a linear shape, and a plurality of the fixed electrodes 3a are provided. The fixed electrodes 3a are connected to the resistors 4 respectively. The conductor constituting the fixed electrode 3a is made of a metal such as silver or palladium and glass, and is baked on the circuit board 2.

固定電極3bは、固定電極3aと同一の導電体からなり、その主要部の形状は、扇形をしている。なお、この固定電極3bは、その扇形の内部に、回路基板2が露出する溝部14を備えている。   The fixed electrode 3b is made of the same conductor as the fixed electrode 3a, and its main part has a fan shape. The fixed electrode 3b includes a groove portion 14 in which the circuit board 2 is exposed inside the sector.

抵抗体4は、複数の固定電極3を跨ぐように設けられている。なお、本実施形態では、抵抗体4は、調整用抵抗体11と同一材料で、かつ同一工程で形成されている。   The resistor 4 is provided so as to straddle the plurality of fixed electrodes 3. In the present embodiment, the resistor 4 is made of the same material as that of the adjustment resistor 11 and is formed in the same process.

摺動子5は、洋白などの金属からなる板形状であり、パラジウムとルテニウムの合金からなる第1の摺動接点6と第2の摺動接点7とを備えている。   The slider 5 has a plate shape made of a metal such as white and white, and includes a first sliding contact 6 and a second sliding contact 7 made of an alloy of palladium and ruthenium.

第1の摺動接点6と第2の摺動接点7とは、それぞれ弾性を有する第1の腕片51と第2の腕片52とに溶接などの手段によって固定されている。また、本実施形態では、各摺動接点6、7は、2つずつ設けられている。   The first sliding contact 6 and the second sliding contact 7 are fixed to the first arm piece 51 and the second arm piece 52 having elasticity, respectively, by means such as welding. In the present embodiment, two sliding contacts 6 and 7 are provided.

本実施形態では、第1の摺動接点6と第2の摺動接点7との摺動方向Sの軌跡は、円弧である。これは、摺動子5が、図示しない支点を中心に回動するためである。   In the present embodiment, the locus of the sliding direction S between the first sliding contact 6 and the second sliding contact 7 is an arc. This is because the slider 5 rotates around a fulcrum (not shown).

図3で示すように、研磨前の各固定電極3a、3bは、5〜7μmの凹凸を備えている。そこで、各固定電極3a、3bの上方を2〜3μm研磨すると、図2、4で示すように、各固定電極3a、3bに研磨痕15が形成される。この研磨痕15は、凹凸から構成されており、この凹凸の山15aや溝15bは、図1中の回路基板2の縦方向に延びるように形成されており、各固定電極3a、3bの中央部では、各摺動接点6、7の摺動方向Sに対して、直角であり、各固定電極3a、3bの両端部では、各摺動接点6、7の摺動方向Sに対して、約63°の傾きを持っている。研磨痕15の凹凸は、0.5〜1.0μmであり、これは、凹凸の山15aと溝15bとの差である。   As shown in FIG. 3, each fixed electrode 3a, 3b before polishing is provided with unevenness of 5 to 7 μm. Therefore, when 2 to 3 μm is polished above the fixed electrodes 3a and 3b, polishing marks 15 are formed on the fixed electrodes 3a and 3b as shown in FIGS. The polishing mark 15 is composed of irregularities, and the crests 15a and grooves 15b of the irregularities are formed so as to extend in the vertical direction of the circuit board 2 in FIG. 1, and the center of each fixed electrode 3a, 3b. Are perpendicular to the sliding direction S of each sliding contact 6, 7, and at both ends of each fixed electrode 3 a, 3 b, to the sliding direction S of each sliding contact 6, 7, It has an inclination of about 63 °. The unevenness of the polishing mark 15 is 0.5 to 1.0 μm, which is the difference between the uneven peak 15a and the groove 15b.

なお、各摺動接点6、7は、各固定電極3a、3bに対して大きいために研磨前に形成された凹み16部分に接することはなく、各摺動接点6、7は、研磨痕15部分にのみ接することとなる。   Since each sliding contact 6, 7 is larger than each fixed electrode 3 a, 3 b, the sliding contact 6, 7 does not contact the recessed portion 16 formed before polishing, and each sliding contact 6, 7 has a polishing mark 15. It will touch only the part.

本実施形態と比較例と比較する。比較例は、研磨痕15を図1の回路基板2の横方向に延びるように形成したもの、すなわち、各摺動接点6、7の摺動方向Sに対して、0°〜27°の傾きを持ったものである。   This embodiment is compared with a comparative example. In the comparative example, the polishing marks 15 are formed so as to extend in the lateral direction of the circuit board 2 in FIG. 1, that is, with an inclination of 0 ° to 27 ° with respect to the sliding direction S of the sliding contacts 6, 7. It has something.

Figure 0005568887
Figure 0005568887

本実施形態と比較例ともに、サンプル数は、5であり、表は、その平均値を表している。なお、各摺動接点6、7の厚みは、およそ1.0mmである。摺動接点6の摩耗量を比較したところ、摺動回数が100万回の場合、比較例は、0.421mmの摩耗に対して、本実施形態は、0.116mmであり、摩耗量がおよそ4分の1に減少している。また、摺動回数が200万回の場合、本実施形態は、0.189mmであり、比較例の摺動回数100万回の摩耗量より少ない。   In both the present embodiment and the comparative example, the number of samples is 5, and the table shows the average value. In addition, the thickness of each sliding contact 6 and 7 is about 1.0 mm. When the amount of wear of the sliding contact 6 is compared, when the number of sliding times is 1 million, the comparative example is 0.121 mm for the wear of 0.421 mm, and the amount of wear is approximately It has decreased to a quarter. Moreover, when the frequency | count of sliding is 2 million times, this embodiment is 0.189 mm, and is less than the abrasion amount of 1 million times of sliding times of a comparative example.

以上のように、各摺動接点6、7の摺動方向Sが、研磨痕15に対して、45°〜90°の傾きを持つために、各摺動接点6、7が、研磨痕15の凹凸に対して、点接触となり、各摺動接点6、7の摩耗が、減少して耐久性が向上する。   As described above, since the sliding direction S of each sliding contact 6, 7 has an inclination of 45 ° to 90 ° with respect to the polishing mark 15, each sliding contact 6, 7 has the polishing mark 15. As a result, point contact is made with respect to the unevenness, and wear of the sliding contacts 6 and 7 is reduced to improve durability.

また、研磨痕15の凹凸を、0.5〜1.0μmとしたことによって、研磨痕15の凹凸をより少なくする研磨作業を抑制することで、コストの上昇を抑制することができる。   Further, by setting the unevenness of the polishing mark 15 to 0.5 to 1.0 μm, it is possible to suppress an increase in cost by suppressing the polishing work for reducing the unevenness of the polishing mark 15.

なお、研磨痕15の摺動接点6、7の摺動方向Sに対する傾きは、本実施形態に限定されるものではなく、摺動接点6、7の摺動方向Sに対して、45°〜90°の傾きであればよい。   In addition, the inclination with respect to the sliding direction S of the sliding contact 6 and 7 of the grinding | polishing trace 15 is not limited to this embodiment, 45 degrees-with respect to the sliding direction S of the sliding contact 6 and 7 A 90 ° inclination may be used.

また、すべての固定電極3a、3bの研磨痕15が、摺動接点6、7の摺動方向Sに対して、直角となるように、研磨痕15が摺動子5の図示しない回転中心に向かうように、固定電極3a、3bを研磨しても良い。   Further, the polishing mark 15 is at the rotation center (not shown) of the slider 5 so that the polishing mark 15 of all the fixed electrodes 3a and 3b is perpendicular to the sliding direction S of the sliding contacts 6 and 7. The fixed electrodes 3a and 3b may be polished so as to go.

本発明は、摺動接点が回路基板上の固定電極上を摺動する液面検出装置に利用可能である。   The present invention is applicable to a liquid level detection device in which a sliding contact slides on a fixed electrode on a circuit board.

1 液面検出装置
2 回路基板
3a、3b 固定電極
5 摺動子
6 第1の摺動接点
7 第2の摺動接点
15 研磨痕
15a 山
15b 溝
S 摺動方向
DESCRIPTION OF SYMBOLS 1 Liquid level detection apparatus 2 Circuit board 3a, 3b Fixed electrode 5 Slider 6 1st sliding contact 7 2nd sliding contact 15 Polishing trace 15a Mountain 15b Groove S Sliding direction

Claims (2)

導電体を備えた回路基板と、液面の変動に伴い前記導電体を摺動する摺動接点と、この摺動接点が固定される摺動子とを備えた液面検出装置において、前記摺動子は支点を中心に回動し、前記導電体は、前記摺動子の回動に基づく前記摺動接点の円弧状の軌跡上に断続的に複数配置され、前記摺動接点の摺動方向に対して、45°〜90°の傾きを持つように共通方向の研磨痕を前記複数の導電体に設けたことを特徴とする液面検出装置。 In a liquid level detection apparatus comprising: a circuit board provided with a conductor; a sliding contact that slides the conductor according to a change in the liquid level; and a slider to which the sliding contact is fixed. The mover rotates around a fulcrum, and a plurality of the conductors are intermittently arranged on an arcuate locus of the sliding contact based on the rotation of the slider. to the direction, the liquid level detecting apparatus according to claim polishing scars common direction as one lifting the inclination of 45 ° to 90 ° to the provision of the plurality of conductors. 前記研磨痕は、0.5〜1.0μmの凹凸からなることを特徴とする請求項1に記載の液面検出装置。
The liquid level detection device according to claim 1, wherein the polishing mark is made of irregularities of 0.5 to 1.0 μm.
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JPH07253348A (en) * 1994-03-14 1995-10-03 Kansei Corp Liquid level detection sensor
JP2970537B2 (en) * 1996-05-31 1999-11-02 日立エーアイシー株式会社 Printed wiring board for sliding contacts
JP2000046632A (en) * 1998-07-31 2000-02-18 Nippon Seiki Co Ltd Liquid level detecting device
JP3901968B2 (en) * 2001-08-27 2007-04-04 矢崎総業株式会社 Liquid level detector
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