JP5570259B2 - Production plan decision method in production line system - Google Patents

Description

  The present invention relates to a production plan determination method in a production line system for producing an electronic component mounting board.

  The production line system is a system for producing an electronic component mounting board by arranging a plurality of electronic component mounting devices side by side and sequentially executing a mounting process by each electronic component mounting device. The production plan in this type of production line system determines that the cycle time for producing the electronic component mounting board is within the set time. In the past, studies have been made on how to shorten the cycle time, and efficiency has been demanded.

  However, in recent years, environmental issues have attracted attention, and environmental efforts such as reduction of carbon dioxide emissions have become important. For example, Patent Documents 1 and 2 describe that power consumption can be reduced by reducing the production speed of an electronic component mounting apparatus (hereinafter also referred to as “module”) that constitutes a production line. .

JP 2006-261647 A JP 2008-28262 A (paragraph [0042])

  The conventional technique is to reduce the power consumption by reducing the mounting speed, that is, the moving speed in each electronic component mounting apparatus. As described above, due to recent environmental problems, there is a demand for means that can further reduce power consumption.

  This invention is made | formed in view of such a situation, and it aims at providing the production plan determination method in the production line system which has a new means which can reduce power consumption.

The invention according to claim 1
In a production line system for producing an electronic component mounting board in which a plurality of electronic components are mounted on a circuit board by arranging a plurality of electronic component mounting apparatuses as modules side by side and sequentially executing a mounting process by each of the electronic component mounting apparatuses In the production plan determination method,
Each of the electronic component mounting apparatuses has a component feeder that accommodates the electronic component, a nozzle that holds the electronic component, one or a plurality of the nozzles, and a relative position between the component feeder and the circuit board. A mounting head that is movably provided,
The production plan determination method is:
An initial production plan determination step for determining an initial production plan for executing mounting processing by all the electronic component mounting apparatuses in the production line system already installed;
When consolidating the mounting processing of the electronic component mounting apparatus of the aggregation source selected from the plurality of electronic component mounting apparatuses into the electronic component mounting apparatus of the aggregation destination, the electronic component mounting apparatus of the aggregation destination a aggregation candidate extracting step of extracting the electronic component mounting apparatus is a candidate as an aggregate candidates, the nozzle of at least a portion of the aggregate origin the electronic component mounting apparatus of the nozzle of the electronic component mounting apparatus of the aggregation candidate same type and is, and the number of the same type of nozzle the electronic component mounting apparatus to be the same number or more of the nozzles of the summarization source of the electronic component mounting apparatus and extracts said aggregation candidate The aggregation candidate extraction step;
A cycle time calculating step of calculating the cycle time of the electronic component mounting apparatus of the aggregation candidate in a case where the mounting process of the aggregated source of the electronic component mounting apparatus was aggregated in the electronic component mounting apparatus of the aggregation candidates,
When the cycle time of the electronic component mounting apparatus of the aggregation candidate calculated in the cycle time calculation step is equal to or less than a threshold set based on the cycle time of the initial production plan , changes the electronic component mounting apparatus and the collection destination of the electronic component mounting apparatus, generates the implementation process changes were aggregated in the electronic component mounting apparatus of the collection destination production plan of the summarization source of the electronic component mounting apparatus Production plan generation process,
With
By executing the mounting process based on the modified production plan, the mounting process of the electronic component mounting apparatus of the aggregation source is stopped to reduce power consumption.

The invention according to claim 2, wherein the modified production plan generating step further conveying operation time of the mounting head in the electronic component mounting apparatus of the aggregation candidates in the case of aggregation, the aggregation source of the electronic component mounting apparatus When the mounting candidate is less than the total time of the transport operation time of the mounting head from the component feeder to the circuit board and the transport operation time of the mounting head in the electronic component mounting apparatus of the consolidation candidate. The electronic component mounting apparatus is the electronic component mounting apparatus at the aggregation destination, and a modified production plan in which the mounting processing of the electronic component mounting apparatus at the aggregation source is aggregated on the electronic component mounting apparatus at the aggregation destination is generated. It is characterized by.

The invention according to claim 3, wherein the modified production plan generation step, said transport operation count from the component feeder to the circuit board of the mounting head in the electronic component mounting apparatus of the aggregation candidate when aggregated, the aggregated from the parts feeder of the mounting head in the original of the electronic component mounting apparatus is reduced from the total number of the transport number of operations of the mounting head in the electronic component mounting apparatus of the aggregation candidate transport operation number to the circuit board The electronic component mounting apparatus of the aggregation candidate is the electronic component mounting apparatus of the aggregation destination, and the mounting process of the electronic component mounting apparatus of the aggregation source is performed on the electronic component mounting apparatus of the aggregation destination An aggregated production plan is generated.

The invention according to claim 4, wherein the aggregation candidate extraction step, wherein all the nozzles of the electronic component mounting apparatus of the aggregation candidate Ru same type Der said nozzle of said aggregate source of the electronic component mounting apparatus wherein the electronic component mounting apparatus, characterized in that said electronic component mounting apparatus of the aggregation candidates.

The invention according to claim 5, wherein the aggregation candidate extraction step, the mounting process of one of the summarization source of the electronic component mounting apparatus, when the aggregate to the electronic component mounting apparatus of one of the collection destination one One first aggregation candidate that is the electronic component mounting apparatus of the two aggregation candidates,
The cycle time calculation step and the modified production plan generation step include the cycle time and the modified production when the mounting processing of the electronic component mounting apparatus of the one aggregation source is consolidated into one first aggregation candidate. It is characterized by generating a plan .

In the invention according to claim 6, when the aggregation candidate extraction step consolidates the mounting processing of the one electronic component mounting apparatus of the aggregation source into a plurality of the electronic component mounting apparatuses of the aggregation destination , wherein extracting the plurality of second aggregation candidate is an electronic component mounting apparatus of the aggregation candidates,
The cycle time calculation process and the modified production plan generation process include the cycle time and the modified production when the mounting process of the electronic component mounting apparatus of the one aggregation source is aggregated into a plurality of the second aggregation candidates. It is characterized by generating a plan .

In the invention according to claim 7, when the aggregation candidate extraction step aggregates the mounting processing of the electronic component mounting apparatus of one aggregation source into the electronic component mounting apparatus of one aggregation destination , One first aggregation candidate that is the electronic component mounting apparatus of the one aggregation candidate as an aggregation candidate is extracted,
The cycle time calculating step and the changing production plan generation step, the aggregation processing to one of the first aggregation candidates, and performing in preference to aggregation processing to a plurality of the second aggregation candidates.

In the invention according to claim 8, the modified production plan generation step generates the aggregated modified production plan while using the mounting head of the electronic component mounting apparatus in the production line system that is already installed as it is. It is characterized by.
The invention according to claim 9 is the change in which the changed production plan generation step is performed by changing the mounting head of the electronic component mounting apparatus in the already installed production line system to another mounting head. A production plan is generated.

In the invention according to claim 10, the changed production plan generation step is changed to the other mounting head that consumes less power than the mounting head of the electronic component mounting apparatus in the already installed production line system. It is characterized by doing.
According to an eleventh aspect of the present invention, in the modified production plan generation step, when there are a plurality of the aggregation candidates for the one electronic component mounting apparatus of the aggregation source, the number of the nozzles is relatively large. The aggregation processing is performed as the aggregation candidate with priority from the electronic component mounting apparatus.

  According to the first aspect of the present invention, it is possible to consolidate the mounting processes in some electronic component mounting apparatuses into other electronic component mounting apparatuses. As a result, the mounting process in the part of the electronic component mounting apparatus can be stopped. Thereby, the power consumption in the electronic component mounting apparatus that stops the mounting process can be reduced. Accordingly, it is possible to determine a production plan that can reduce the power consumption of the entire production line system.

  Here, in addition to the mounting process, each electronic component mounting apparatus performs a circuit board transfer process with the electronic component mounting apparatuses arranged side by side. Therefore, even if the mounting process is stopped, it is necessary to execute the transport process. However, since the power consumption required for the mounting process is much larger than the power consumption required for the transport process, the effect of reducing the power consumption is very large.

  By the way, the power consumption required for the mounting process is mainly the power consumption of the electric motor for operating the mounting head in accordance with the mounting process, and for example the suction device for generating the holding force of the electronic component by the nozzle. There is power consumption. In the former case, the power consumption of the electric motor for operating the mounting head in accordance with the mounting process depends on the time during which the mounting head is operated in accordance with the mounting process. That is, if the time for operating the mounting head can be shortened, the amount of power consumption can be reduced.

  Therefore, according to the second aspect of the present invention, when the mounting process in a part of the electronic component mounting apparatus is integrated into another electronic component mounting apparatus, the transport operation time of the mounting head of the electronic component mounting apparatus after the aggregation is performed. When the total operation time of the mounting heads of the two electronic component mounting apparatuses before aggregation is shorter than the aggregation time, aggregation processing is performed. Therefore, it is possible to determine a production plan that can reliably reduce the power consumption of the production line system.

  The transfer operation time of the mounting head largely depends on the number of transfer operations from the component feeder to the circuit board by the mounting head. Therefore, according to the third aspect of the present invention, the changed production plan is determined in which the number of times that the mounting heads are transported when they are aggregated is less than the number of times of mounting heads transported in the initial production plan. . Therefore, it is possible to determine a production plan that can reliably reduce the power consumption of the production line system.

According to the invention of claim 4, all the nozzles mounted on the mounting head can be reliably aggregated by using the same type of electronic component mounting apparatus as a consolidation candidate, and as a result, reliably Power consumption can be reduced.
According to the invention which concerns on Claim 5, the mounting process of the electronic component mounting apparatus of one aggregation origin can be integrated to one electronic component mounting apparatus. Thereby, the production plan which can reduce power consumption reliably can be determined. In addition, the aggregation destination can be determined reliably and easily.

According to the invention which concerns on Claim 6, the mounting process of the electronic component mounting apparatus of one aggregation origin can be concentrated on several electronic component mounting apparatuses. Thereby, the production plan which can reduce power consumption reliably can be determined.
According to the invention according to claim 7, by performing the aggregation process with the first aggregation candidate prior to the second aggregation candidate, the aggregation destination can be determined reliably and easily, and the power consumption amount is reliably ensured. Can be reduced.

According to the eighth aspect of the invention, since the aggregation process is performed without changing the mounting head, the changed production plan can be easily generated, and the changed production plan can be executed without changing the setup.
According to the invention which concerns on Claim 9, the further power consumption can be reduced reliably.

According to the invention of claim 10, the power consumption can be surely reduced.
According to the eleventh aspect of the invention, the cycle time can be shortened more effectively, and as a result, the power consumption can be reliably reduced.

It is a perspective view which shows the state which arranged two electronic component mounting apparatuses which comprise a part of production line system in parallel. It is a table | surface which shows the number of mounting | wearing of the nozzle in a mounting head, and the power consumption per component. It is a figure which shows the applicable size range of the electronic component in each mounting head, and the applicable size range of the electronic component in each nozzle. It is a flowchart which shows the main process of the production plan determination method. It is a flowchart which shows the aggregation process of FIG.4 S4. It is a flowchart which shows the aggregation process of FIG.4 S4. It is a flowchart which shows the aggregation process of FIG.4 S5. It is a flowchart which shows the aggregation process of FIG.4 S5. It is a table | surface which shows an initial stage production plan. It is a table | surface which shows a change production plan.

  Hereinafter, an embodiment embodying a production plan determination method for a production line system of the present invention will be described with reference to the drawings.

(Outline of this embodiment)
The production plan determination method of the present embodiment is based on the premise that a plurality of electronic component mounting apparatuses 2 and 2 are arranged based on an initial production plan that is planned in advance with an emphasis on efficiency. This is a method for generating a modified production plan. The modified production plan is intended to reduce the amount of power consumption compared to the initial production plan and is planned to be within the target cycle time. This will be described in detail below.

(Machine configuration of production line system 1)
First, the machine configuration of the production line system 1 will be described with reference to FIG. The production line system 1 is a line for producing electronic component mounting boards. The electronic component mounting board is obtained by mounting a plurality of electronic components on the circuit board 30. As shown in FIG. 1, the production line system 1 is configured by arranging a plurality of electronic component mounting apparatuses 2 and 2 side by side. FIG. 1 shows a portion where two electronic component mounting apparatuses 2 and 2 are connected, and an actual production line system 1 is configured by arranging more electronic component mounting apparatuses 2 side by side. .

  Then, the electronic component mounting board is produced by sequentially executing the mounting process by the electronic component mounting apparatuses 2 and 2. Here, since the electronic component mounting apparatus 2 constitutes a module in the production line system 1, the electronic component mounting apparatus 2 is referred to as a module in the following description.

  Each module 2 includes a base 21, a pair of conveyors 22, 22, a component feeder 23, a Y slide 24, an X slide 25, a mounting head 26, a nozzle 27, and a nozzle station (not shown). And is configured.

  The base 21 constitutes the frame of the module 2 and is fixed on the floor. And it is the structure which can be connected with the base | substrate 21 of the module 2 provided adjacently in the X direction. The pair of conveyors 22 and 22 are fixed to the base 21 and convey the circuit board 30 in the X direction placed on the upper surface of the conveyor 22. That is, the conveyor 22 conveys the circuit board 30 from the module 2 arranged on one side in the X direction toward the module 2 arranged on the other side in the X direction. And this conveyor 22 is arrange | positioned along with the Y direction.

  The component feeder 23 is provided at one end portion in the Y direction of the module 2 and accommodates electronic components to be mounted on the circuit board 30. The type of the component feeder 23 includes a tape feeder and a tray feeder. In FIG. 1, a tape feeder is shown.

  The Y slide unit 24 includes a Y direction rail provided on the base 21 so as to extend in the Y direction, a Y moving body that moves along the Y direction rail, and a Y drive unit for moving the Y moving body. Prepare. The Y drive unit is constituted by, for example, an electric motor and a ball screw, a linear motor, or the like. That is, the Y moving body moves along the Y-direction rail with respect to the base body 21 by driving the Y driving unit.

  The X slide portion 25 is configured to extend in the X direction on the Y moving body of the Y slide portion 24, to move along the X direction rail, and to move the X moving body. X drive unit. The X drive unit is configured by, for example, an electric motor and a ball screw, a linear motor, or the like. That is, the X moving body moves relative to the base body 21 along the X direction rail by driving the X driving unit. That is, the X moving body of the X slide unit 25 can move in the X direction and the Y direction with respect to the base body 21.

  The mounting head 26 is provided on the X moving body of the X slide unit 25. That is, the mounting head 26 can move in the X direction and the Y direction with respect to the base 21. Specifically, the mounting head 26 can relatively move between the component feeder 23 and the circuit board 30 conveyed on the conveyor 22. A nozzle 27 is replaceably mounted on the lower end side of the mounting head 26. This mounting head 26 includes a type in which only one nozzle 27 is mounted and a type in which a plurality of nozzles 27 are mounted. This is appropriately selected according to the size of electronic components to be mounted, the total number of electronic components, the number of types, and the like.

  The nozzle 27 is mounted on the lower end side of the mounting head 26. The nozzle 27 can hold the electronic components accommodated in the component feeder 23 by, for example, suction, in order to mount a plurality of electronic components on the circuit board 30 conveyed on the conveyor 22. That is, by moving the mounting head 26 in the X direction and the Y direction with respect to the base body 21, the electronic components housed in the component feeder 23 can be transported to the circuit board 30 by the nozzles 27.

  The nozzle station stores a plurality of types of nozzles 27 that are not mounted on the mounting head 26. When replacing the nozzle 27 to be mounted on the mounting head 26, the mounting head 26 is moved to the nozzle station, the mounted nozzle 27 is removed at the nozzle station, and another nozzle 27 stored in the nozzle station is mounted. To do.

(Type of mounting head 26 and applicable size)
Next, the type of the mounting head 26 and the application size of the electronic component in the mounting head 26 will be described with reference to FIGS. In the present embodiment, as shown in FIG. 2, the mounting head 26 will be described using five types of type A, type B, type C, type D, and type E as examples. The mounting head “type A” has 12 nozzles 27 mounted and has a power consumption of 2.0 W per electronic component. The mounting head “type B” has 12 nozzles 27 mounted and has a power consumption of 2.2 W per electronic component. The mounting head “type C” has eight nozzles 27 mounted and has a power consumption of 3.5 W per electronic component. The mounting head “Type D” has two nozzles 27 mounted and has a power consumption of 7.75 W per electronic component. The mounting head “type E” has one nozzle 27 mounted and has a power consumption of 14.5 W per electronic component. Here, the power consumption per electronic component means that the mounting head 26 is connected to the component feeder 23 and the circuit board 30 on the conveyor 22 in a state in which the number of nozzles 27 that can be mounted on each mounting head 26 is mounted. This is an approximate value obtained by dividing the amount of power consumed by the mounting head 26 itself to reciprocate between the two by the number of nozzles 27. In other words, this power consumption corresponds to the power consumption necessary for attracting an electronic component by the nozzle 27, for example. This power consumption does not include the power consumption for carrying the mounting head 26 by the Y slide portion 24 and the X slide portion 25.

  Further, as described above, the types of nozzles 27 differ depending on the size of the electronic component, and the nozzles 27 on which the respective mounting heads 26 can be mounted differ. In the present embodiment, as shown in FIG. 3, six types of nozzles 27, N1, N2, N3, N4, N5, and N6, are used. And the size of the electronic component which can hold | maintain the nozzle 27 becomes small in order of N1, N2, N3, N4, N5, N6.

  The mounting heads “type A” and “type B” are applied to relatively small electronic components, and the size range of the applied electronic components increases in the order of “type C” and “type D”. However, the application ranges of “type A”, “type B”, and “type C” partially overlap, and the application ranges of “type C” and “type D” partially overlap. The mounting head “type E” can be applied to an electronic component having a size between the minimum range and the middle of the application range of “type A”.

  The relationship between the mounting head 26 and the nozzle 27 is as follows. That is, the mounting heads “type A”, “type B”, “type C”, and “type E” can be applied to the nozzle “N1”. As the nozzle “N2”, mounting heads “type A”, “type B”, “type C”, “type D”, and “type E” are applicable. As the nozzle “N3”, mounting heads “type C”, “type D”, and “type E” are applicable. For the nozzles “N4” and “N5”, the mounting heads “type D” and “type E” are applicable. The mounting head “type E” can be applied to the nozzle “N6”.

(Power consumption by module 2)
Next, power consumption by the module 2 will be described. The power consumption by the module 2 is mainly the power consumption associated with the conveyance process for conveying the circuit board 30 by the conveyors 22 and 22 and the power consumption associated with the mounting process for mounting the electronic components on the circuit board 30.

  The power consumption accompanying the former conveyance process is, for example, 200 to 300 Wh. The power consumption associated with the latter mounting process includes the power consumption of the Y slide portion 24 and the X slide portion 25 in order to move the mounting head 26 between the component feeder 23 and the circuit board 30 on the conveyor 22, and the electronic components. Power consumption for holding the water by adsorption or the like is included. Here, the power consumption for holding the electronic component by suction or the like is as shown in FIG. In order to hold an electronic component by the nozzle 27, it is 20 to 30 Wh per one mounting head 26. Further, the power consumption amount for carrying the mounting head 26 between the component feeder 23 and the circuit board 30 on the conveyor 22 is, for example, about 1000 Wh. In other words, the power consumption associated with the transport operation of the mounting head 26 is very large compared to the power consumption associated with the transport process, and has a greater difference than the power consumption for holding the electronic components by the nozzles 27. .

(Production plan decision method)
Next, a method for determining a production plan in the above-described production line system, in particular, a method for determining a changed production plan that has been changed with respect to the initial production plan will be described with reference to FIGS. Description will be made along the flowcharts shown in FIGS. 4 to 8 with reference to FIGS. 9 and 10 as appropriate.

  As shown in FIG. 4, the main process first determines an initial production plan (S1). The initial production plan is as shown in FIG. This initial production plan is designed with an emphasis on efficiency. That is, the initial production plan is based on the current production line configuration, the head configuration of each module, and the nozzle configuration, and replaces the parts feeder 23 while equalizing the load on all modules and reducing the cycle time as much as possible. This is designed in consideration of the ease of replacement and the replacement timing of the component feeder 23. In the initial production plan, power consumption is not taken into consideration.

  Specifically, as shown in FIG. 9, the initial production plan is composed of twelve modules 2 (indicated by module numbers 1 to 12), and is arranged in order from module numbers 1 to 12. . In FIG. 9, the type of mounting head 26, the type and number of nozzles, the component supply form, the number of electronic components to be mounted according to each nozzle 27, the circuit board 30 on the conveyor 22 from the component feeder 23 in the mounting head 26. Indicates the number of transfer operations up to and the cycle time. The bottleneck module in this initial production plan, that is, the module 2 with the longest cycle time is the module 2 with the module number “2”.

  Subsequently, it is determined whether or not there are mounting heads 26 in which the same number of the same nozzles 27 can be mounted on the mounting heads 26 in the initial production plan and the power consumption is low (S2). For example, in this embodiment, when the mounting head “type B” is mounted in the initial production plan, the mounting head “type A” corresponds to this. As shown in FIG. 2, the power consumption per electronic component of the mounting head “type B” is 2.2 Wh, whereas the power consumption of the mounting head “type A” is 2 Wh. 0.0 Wh.

  Subsequently, in step S2, if there is a corresponding mounting head 26, it is planned to change to the mounting head 26 with low power consumption (S3). That is, in the changed production plan shown in FIG. 10, the “type B” module in the initial production plan shown in FIG. On the other hand, if there is no corresponding mounting head 26 in step S2, S3 is skipped and the process proceeds to the next step.

  Subsequently, a process for consolidating the module 2 mounting process into another module 2 is performed. Specifically, first, an aggregation process is performed when the mounting head 26 of the aggregation destination module 2 is the same type as the mounting head 26 of the aggregation source module 2 (S4). After that, an aggregation process is performed when the mounting head 26 of the aggregation destination module 2 is of a different type from the mounting head 26 of the aggregation source module 2 (S5). Then, the main process ends.

  The aggregation process in the case where the mounting heads 26 are the same type in step S4 of the main process will be described with reference to FIGS. In this aggregation process, first, an aggregation candidate having the same type of mounting head 26 and nozzle 27 (hereinafter, this aggregation candidate is referred to as a “first aggregation candidate”) is extracted for each module 2 (S11).

  Specifically, for the first aggregation candidate, the mounting head 26 of the same type as the mounting head 26 in the aggregation source module 2 is mounted, and the nozzle 27 mounted in the aggregation source module 2 is This corresponds to the case where all types and numbers are the same type. Furthermore, the case where the mounting head 26 of the same type as the mounting head 26 in the module 2 of the aggregation source is mounted and the type of the nozzle 27 mounted in the module 2 of the aggregation source is included in part.

  For example, in the initial production plan of FIG. 9, the former of the first aggregation candidate for the module number “3” corresponds to the module numbers “1”, “2”, “4”, “5”, and the first aggregation candidate In the latter case, the module number “6” corresponds. The module number “7” corresponds to the latter case of the first aggregation candidate for the module number “8”.

  Subsequently, one aggregation source module 2 is selected. Calculate the cycle time in the first aggregation candidate module 2 when the selected aggregation source module 2 implementation process is aggregated into one aggregation destination module 2 among the first aggregation candidates for the aggregation source module 2 (S12). There are the following two methods for calculating the cycle time. As a first method, the cycle times in the respective modules 2 in the initial production plan are summed up. For example, when the module number “3” is collected into “1”, the cycle time is 26.5 seconds when the first method is used. As a second method, the actual cycle time is calculated after redesigning the number of nozzles 27 to be mounted in accordance with the type and number of electronic components. For example, when module numbers “3” are collected into “1”, the cycle time is 25 seconds when the second method is used. More accurate calculation is possible by using the second cycle time calculation method.

  Subsequently, when the mounting processing of the selected one aggregation source module 2 is aggregated into one aggregation destination module 2 among the first aggregation candidates for the aggregation source module 2, the first aggregation candidate module 2 The number of transfer operations of the mounting head 26 between the component feeder 23 and the circuit board 30 on the conveyor 22 is calculated (S13). For example, when the module number “3” is collected into “1”, the number of conveyance operations is seven.

  Subsequently, it is determined whether or not the cycle time calculated in step S12 is equal to or less than a preset threshold value (S14). Here, as the threshold value, the newly set cycle time in the changed production plan may be used, the cycle time of the bottom neck module in the initial production plan may be used, or the cycle time of the bottom neck module may be used. On the other hand, in consideration of the current situation, a time obtained by adding a time during which efficiency can be deteriorated may be used. These can be appropriately selected. For example, in the present embodiment, the bottom time module in the initial production plan, that is, the cycle time of the module number “2” is set as the threshold value.

  Further, the cycle time is equal to or less than the threshold value, and whether the number of conveyance operations of the mounting head 26 calculated in step S13 is smaller than the total value of the number of conveyance operations in the aggregation source and aggregation destination modules 2 in the initial production plan. It is determined whether or not (S14). For example, the total value of the number of transfer operations for both modules “1” and “3” in the initial production plan is 8 times, and the number of transfer operations when the module number “3” is consolidated into “1” is 7 times. The number of times has decreased.

  Subsequently, when the condition of step S14 is satisfied (S14: Y), a process of consolidating the mounting process of the aggregation source module 2 into the aggregation destination module 2 as the first aggregation candidate is executed (S15). For example, module numbers “3” are collected into “1”. Further, the module number “8” is collected into “7” by the same processing. On the other hand, when the condition of step S14 is not satisfied (S14: N), the process proceeds to the next without performing the aggregation process of step S15.

  Subsequently, it is determined whether or not there is another first aggregation candidate for the selected aggregation source module 2 (S16), and if there is, the process is repeated from step S12. On the other hand, if there is no other first aggregation candidate, it is determined whether or not there is another aggregation source module 2 that has not yet performed the processing of steps S12 to S16 (S17). If another aggregation source module 2 exists, the processing is repeated from step S12, and if not, the process proceeds to the next.

  Subsequently, one aggregation source module 2 is selected again. When the selected aggregation source module 2 implementation process is aggregated to a plurality of aggregation destination modules 2 among the first aggregation candidates for the aggregation source module 2, the cycle time in the first aggregation candidate module 2 is calculated. (S21). The cycle time calculation method is as described in the method in step S12 described above. The first aggregation candidate here is referred to as a “second aggregation candidate” in the present invention.

  Subsequently, when the mounting process of the selected one aggregation source module 2 is aggregated into a plurality of aggregation destination modules 2 among the first aggregation candidates for the aggregation source module 2, the first aggregation candidate module 2 The number of transfer operations of the mounting head 26 is calculated between the component feeder 23 and the circuit board 30 on the conveyor 22 (S22). For example, when the module number “5” is distributed and aggregated into two module numbers “4” and “6”, the number of transfer operations of the module numbers “4” and “6” is both seven.

  Subsequently, it is determined whether or not the cycle time calculated in step S21 is equal to or less than a preset threshold value (S23). Here, as the threshold value, the newly set cycle time in the changed production plan may be used, the cycle time of the bottom neck module in the initial production plan may be used, or the cycle time of the bottom neck module may be used. On the other hand, in consideration of the current situation, a time obtained by adding a time during which efficiency can be deteriorated may be used. These can be appropriately selected. For example, in the present embodiment, the bottom time module in the initial production plan, that is, the cycle time of the module number “2” is set as the threshold value.

  Furthermore, the cycle time is equal to or less than the threshold value, and is the number of transfer operations of the mounting head 26 calculated in step S22 less than the total value of the number of transfer operations in the aggregation source and aggregation destination modules 2 in the initial production plan? It is determined whether or not (S23). For example, the total number of transfer operations for both modules “4”, “5”, and “6” in the initial production plan is 15, and the module number “5” is divided into “4” and “6” for aggregation. In this case, the number of times of carrying operations is 14, and the number is reduced.

  Subsequently, when the condition of step S23 is satisfied (S23: Y), the mounting process of the aggregation source module 2 is divided and aggregated into a plurality of aggregation destination modules 2 selected as the first aggregation candidates. The process is executed (S24). For example, the module number “5” is distributed and aggregated into the module numbers “4” and “6”. On the other hand, when the condition of step S23 is not satisfied (S23: N), the process proceeds to the next without performing the aggregation process of step S24.

  Subsequently, it is determined whether or not there is another combination of first aggregation candidates for the selected module 2 of the aggregation source (S25), and if there is, the process is repeated from step S21. On the other hand, if there is no combination of other first aggregation candidates, it is determined whether or not there is another aggregation source module 2 that has not yet performed the processing of steps S21 to S25 (S26). If another aggregation source module 2 exists, the process is repeated from step S21, and if not, the aggregation process in step S4 of the main process ends.

  Next, the aggregation process in the case where the mounting heads 26 are of different types in step S5 of the main process will be described with reference to FIGS. In this aggregation process, first, applicable other-type mounting head candidates are extracted for each module 2 (S31). Referring to FIG. 3, for example, in the case of the module number “12”, the mounting head “type E” is currently mounted and the nozzle “N4” is mounted. “Type D” exists.

  Subsequently, for each module 2, an aggregation candidate having the mounting head 26 that is the other type mounting head candidate extracted in step S31 (hereinafter, this aggregation candidate is referred to as a “third aggregation candidate”) is extracted (S32). ). For example, in the initial production plan of FIG. 9, the module number “9” having the mounting head “type D” corresponds to the third aggregation candidate for the module number “12”. At this time, when there are a plurality of third aggregation candidates for one module 2, the order is determined. Specifically, the module 2 having a large number of mountable nozzles 27 is ranked higher, and the module 2 having a small number of mountable nozzles 27 is ranked lower.

  Subsequently, one aggregation source module 2 is selected. When the mounting process of the selected aggregation source module 2 is aggregated into the module 2 as the third aggregation candidate for the aggregation source module 2, the cycle time in the third aggregation candidate module 2 is calculated (S33). This calculation order is performed based on the order set in step S32. The calculation method of the cycle time is as described above. For example, when module numbers “12” are collected into “9”, the cycle time is 24 seconds.

  Subsequently, when the mounting process of the selected one aggregation source module 2 is aggregated into the module 2 that is the third aggregation candidate for the aggregation source module 2, the component feeder 23 in the third aggregation candidate module 2 And the circuit board 30 on the conveyor 22 calculate the number of transfer operations of the mounting head 26 (S34). This calculation order is performed based on the order set in step S32. For example, when the module number “12” is collected into “9”, the number of transport operations is 11.

  Subsequently, it is determined whether or not the cycle time calculated in step S33 is equal to or less than a preset threshold value (S35). Here, as the threshold value, the newly set cycle time in the changed production plan may be used, the cycle time of the bottom neck module in the initial production plan may be used, or the cycle time of the bottom neck module may be used. On the other hand, in consideration of the current situation, a time obtained by adding a time during which efficiency can be deteriorated may be used. These can be appropriately selected. For example, in the present embodiment, the bottom time module in the initial production plan, that is, the cycle time of the module number “2” is set as the threshold value.

  Further, the cycle time is equal to or less than the threshold value, and whether the number of conveyance operations of the mounting head 26 calculated in step S34 is less than the total value of the number of conveyance operations in the aggregation source and aggregation destination modules 2 in the initial production plan. It is determined whether or not (S35). For example, in the initial production plan, the total number of transfer operations for both modules “9” and “12” is 11 times, and the number of transfer operations when the module number “12” is consolidated into “9” is 11 times. The number of times has not decreased.

  Subsequently, when the condition of step S35 is satisfied (S35: Y), the process of aggregating the mounting process of the aggregation source module 2 into the aggregation destination module 2 as the third aggregation candidate is executed (S36). That is, the aggregation process is performed with priority from the module 2 having many nozzles 27 that can be mounted. As an example described above, considering that the module numbers “12” are aggregated to “9”, this aggregation process is not performed because the number of transport operations is not reduced. On the other hand, when the condition of step S35 is not satisfied (S35: N), the process proceeds to the next without performing the aggregation process of step S36.

  Subsequently, it is determined whether or not there is another third aggregation candidate for the selected aggregation source module 2 (S37), and if it exists, the process is repeated from step S33. On the other hand, if there is no other third aggregation candidate, it is determined whether or not there is another aggregation source module 2 that has not yet performed the processing of steps S33 to S37 (S38). If another aggregation source module 2 exists, the process is repeated from step S33, and if not, the process proceeds to the next.

  Subsequently, for each module 2, a fourth aggregation candidate having the same other type mounting head candidate as the other type mounting head candidate applicable in each module 2 is extracted (S41). Referring to FIG. 3, for example, in the case of the module number “11”, the mounting head “type E” is currently mounted and the nozzles “N4” and “N5” are mounted. There is a mounting head “type D”. In the case of the module number “12”, since the mounting head “type E” is currently mounted and the nozzle “N4” is mounted, the mounting head “type D” exists as another type of mounting head candidate. To do. Therefore, in the initial production plan of FIG. 9, the module number “11” having the same other type of mounting head candidate corresponds to the fourth aggregation candidate for the module number “12”.

  Subsequently, one aggregation source module 2 is selected. When the mounting process of the selected aggregation source module 2 is aggregated into the module 2 as the fourth aggregation candidate for the aggregation source module 2 and is changed to the mounting head “type D”, the fourth aggregation candidate The cycle time in module 2 is calculated (S42). The calculation method of the cycle time is as described above. For example, when the module number “12” is integrated into “11” and the mounting head “type D” is changed, the cycle time is 18 seconds.

  Subsequently, when the mounting process of the selected one aggregation source module 2 is aggregated into the module 2 that is the fourth aggregation candidate for the aggregation source module 2 and is changed to the selected other type mounting head, The number of transfer operations of the mounting head 26 between the component feeder 23 and the circuit board 30 on the conveyor 22 in the fourth aggregation candidate module 2 is calculated (S43). For example, when the module number “12” is integrated into “11” and is changed to the mounting head “type D”, the number of times of carrying operation is six.

  Subsequently, it is determined whether or not the cycle time calculated in step S42 is equal to or less than a preset threshold value (S44). Here, as the threshold value, the newly set cycle time in the changed production plan may be used, the cycle time of the bottom neck module in the initial production plan may be used, or the cycle time of the bottom neck module may be used. On the other hand, in consideration of the current situation, a time obtained by adding a time during which efficiency can be deteriorated may be used. These can be appropriately selected. For example, in the present embodiment, the bottom time module in the initial production plan, that is, the cycle time of the module number “2” is set as the threshold value.

  Furthermore, the cycle time is equal to or less than the threshold value, and whether the number of conveyance operations of the mounting head 26 calculated in step S43 is less than the total number of conveyance operations in the aggregation source and aggregation destination modules 2 in the initial production plan. It is determined whether or not (S44). For example, the total value of the number of transfer operations of both modules “11” and “12” in the initial production plan is 8 times, the module number “12” is consolidated into “11”, and the mounting head “type D” is collected. In the case of the change, the number of conveyance operations is 6, and the number is reduced.

  Subsequently, when the condition of step S44 is satisfied (S44: Y), the mounting process of the aggregation source module 2 is aggregated into the aggregation destination module 2 as the fourth aggregation candidate, and the mounting head is changed. The process is executed (S45). For example, the module numbers “12” are integrated into “11”, and the mounting head 26 is changed from “type E” to “type D”. On the other hand, when the condition of step S44 is not satisfied (S44: N), the process proceeds to the next without performing the aggregation process of step S45.

  Subsequently, it is determined whether or not there is another fourth aggregation candidate for the selected aggregation source module 2 (S46), and if there is, the process is repeated from step S42. On the other hand, if there is no other fourth aggregation candidate, it is determined whether or not there is another aggregation source module 2 that has not yet performed the processing of steps S42 to S46 (S47). If another aggregation source module 2 exists, the process is repeated from step S42, and if not, the aggregation process in step S5 of the main process ends.

(Effect of this embodiment)
By executing the mounting process according to the above-described modified production plan, the following effects can be obtained. First, the module 2 that does not perform the mounting process has module numbers “3”, “5”, “8”, and “12”. In these modules 2, the power consumption required for the mounting process is zero, and only the power consumption required for the transport process is obtained. Therefore, compared with the initial production plan, the changed production plan reduces the power consumption required for the mounting process of the module 2. As described above, the power consumption required for this mounting process is the consumption of the Y slide portion 24 and the X slide portion 25 in order to move the mounting head 26 between the component feeder 23 and the circuit board 30 on the conveyor 22. Power and power consumption for holding electronic components by suction or the like are included. And the former power consumption is as large as around 1000 Wh. Therefore, the reduction effect is very large.

  Furthermore, in the present embodiment, the aggregation process is executed when the number of conveyance operations of the mounting head 26 is reduced when the collection is performed. The number of conveyance operations of the mounting head 26 depends on the operating time of the mounting head 26. That is, if the number of conveyance operations of the mounting head 26 is the same or more before and after the aggregation, the power consumption of the drive unit that operates the mounting head 26 may be the same or more. However, in the present embodiment, since the aggregation is performed when the number of conveyance operations of the mounting head 26 is reduced, the power consumption is reliably reduced when the aggregation is performed.

  Further, the aggregation process is performed when the cycle time is set and equal to or less than the threshold value. Here, the initial production plan is planned with emphasis on efficiency, such as shortening the cycle time, facilitating the replacement of the component feeder 23, the replacement timing of the component feeder 23, and the like. Therefore, if the initial production plan is changed, the efficiency may decrease. For example, the cycle time may be extended. However, since the aggregation process is executed when the cycle time when aggregation is less than or equal to the set threshold, the power consumption is reduced as described above while preventing the cycle time from becoming longer than the threshold. be able to. In particular, by focusing on the bottom neck module, aggregation processing can be performed without extending the cycle time. In addition, even if the cycle time is extended, if it is necessary to obtain an effect of reducing power consumption, the threshold to be set can be set longer than the cycle time of the bottom neck module of the initial production plan. Thus, the effect of reducing the amount of power consumption due to the aggregation can be achieved.

<Others>
In the above embodiment, the aggregation process is performed when the cycle time is equal to or less than the threshold value and the number of conveyance operations of the mounting head 26 is smaller than the total number before aggregation. Regardless of whether or not the number of transport operations of the mounting head 26 is less than the total number before aggregation, the aggregation process may be performed when the cycle time is equal to or less than the threshold value. Further, although the number of times of carrying operation of the mounting head 26 is compared before and after the aggregation, the cycle times of the corresponding modules 2 before and after the aggregation may be compared instead. Here, the comparison of the cycle times of the corresponding modules 2 before and after the aggregation substantially depends on the number of transport operations of the mounting head 26. Therefore, the substantial effect is the same. However, the power consumption can be reduced with higher accuracy by comparing the cycle times.

  In the above embodiment, the initial production plan is a plan that equalizes the load of all modules and shortens the cycle time as much as possible. In addition, an initial production plan may be set according to the ratio of the power consumption of each module. Specifically, the load of the mounting head 26 with a small amount of power consumption is set to be larger than the load of the mounting head 26 with a large amount of power consumption.

For example, assuming that the load of each module is equalized, the load of the mounting head 26 with large power consumption is set to be 0.8 times the reference load, and the load of the mounting head 26 with small power consumption is reduced. It should be 1.2 times the reference load. By doing so, although the production efficiency is lowered, the power consumption can be reliably reduced.
In addition, the process which changes the load of each module according to the ratio of the power consumption of each module can also be performed in a change production plan determination process. That is, the changed production plan determined in the above embodiment is changed according to the ratio of the power consumption of each module.

1: Production line system 2: Electronic component mounting device (module)
21: Substrate 22: Conveyor 23: Parts feeder 24: Y slide part 25: X slide part 26: Mounting head 27: Nozzle 30: Circuit board

Claims (11)

In a production line system for producing an electronic component mounting board in which a plurality of electronic components are mounted on a circuit board by arranging a plurality of electronic component mounting apparatuses as modules side by side and sequentially executing a mounting process by each of the electronic component mounting apparatuses In the production plan determination method,
Each of the electronic component mounting apparatuses has a component feeder that accommodates the electronic component, a nozzle that holds the electronic component, one or a plurality of the nozzles, and a relative position between the component feeder and the circuit board. A mounting head that is movably provided,
The production plan determination method is:
An initial production plan determination step for determining an initial production plan for executing mounting processing by all the electronic component mounting apparatuses in the production line system already installed;
When consolidating the mounting processing of the electronic component mounting apparatus of the aggregation source selected from the plurality of electronic component mounting apparatuses into the electronic component mounting apparatus of the aggregation destination, the electronic component mounting apparatus of the aggregation destination a aggregation candidate extracting step of extracting the electronic component mounting apparatus is a candidate as an aggregate candidates, the nozzle of at least a portion of the aggregate origin the electronic component mounting apparatus of the nozzle of the electronic component mounting apparatus of the aggregation candidate same type and is, and the number of the same type of nozzle the electronic component mounting apparatus to be the same number or more of the nozzles of the summarization source of the electronic component mounting apparatus and extracts said aggregation candidate The aggregation candidate extraction step;
A cycle time calculating step of calculating the cycle time of the electronic component mounting apparatus of the aggregation candidate in a case where the mounting process of the aggregated source of the electronic component mounting apparatus was aggregated in the electronic component mounting apparatus of the aggregation candidates,
When the cycle time of the electronic component mounting apparatus of the aggregation candidate calculated in the cycle time calculation step is equal to or less than a threshold set based on the cycle time of the initial production plan , changes the electronic component mounting apparatus and the collection destination of the electronic component mounting apparatus, generates the implementation process changes were aggregated in the electronic component mounting apparatus of the collection destination production plan of the summarization source of the electronic component mounting apparatus Production plan generation process,
With
A production plan determination method characterized in that by executing the mounting process based on the changed production plan, the mounting process of the electronic component mounting apparatus of the aggregation source is stopped to reduce power consumption. In claim 1,
The changing production plan generating step further, the conveyance operation time of the mounting head in the electronic component mounting apparatus of the aggregation candidates in the case of aggregation, the parts feeder of the mounting head in the intensive source of the electronic component mounting apparatus if the shorter than the total time of the transfer operation time of the mounting head in the electronic component mounting apparatus of the aggregation candidate transport operation time to the circuit board, the aggregate the electronic component mounting apparatus of the aggregation candidate the former of the electronic component mounting apparatus, production planning determination method characterized by generating the mounting process changes were aggregated in the electronic component mounting apparatus of the collection destination production plan of the summarization source of the electronic component mounting apparatus . In claim 2,
The changing production plan generation step, the transport number of operations of the component feeder to the circuit board of the mounting head in the electronic component mounting apparatus of the aggregation candidates in the case of aggregation, in the aggregate source of the electronic component mounting apparatus The aggregation candidate when the number of transfer operations of the mounting head from the component feeder to the circuit board is less than the total number of transfer operations of the mounting head in the electronic component mounting apparatus of the aggregation candidate. the electronic component mounting apparatus and the collection destination of the electronic component mounting apparatus, to generate a modified production plan which integrates the electronic component mounting apparatus of the collection destination of the mounting process of the aggregated source of the electronic component mounting apparatus A production plan determination method characterized by that. In any one of Claims 1-3,
The aggregation candidate extraction step, the electronic component mounting apparatus all Ru same type Der said nozzle of said aggregate source of the electronic component mounting apparatus of the nozzle of the electronic component mounting apparatus of the aggregation candidates, the aggregation candidate A method for determining a production plan, characterized in that the electronic component mounting apparatus is used. In any one of Claims 1-4,
The aggregation candidate extraction step, the mounting process of one of the summarization source of the electronic component mounting apparatus, when the aggregate to the electronic component mounting apparatus of one of the collection destination, one of the electronic component of the aggregation candidate Extract one first aggregation candidate that is a mounting device ,
The cycle time calculation step and the modified production plan generation step include the cycle time and the modified production when the mounting processing of the electronic component mounting apparatus of the one aggregation source is consolidated into one first aggregation candidate. A production plan determination method characterized by generating a plan. In any one of Claims 1-4,
The aggregation candidate extraction step, the mounting process of one of the summarization source of the electronic component mounting apparatus, when the aggregate to a plurality of the electronic component mounting apparatus of the collection destination, the electronic component of the plurality of aggregated candidate Extract multiple second aggregation candidates that are mounting devices ,
The cycle time calculation process and the modified production plan generation process include the cycle time and the modified production when the mounting process of the electronic component mounting apparatus of the one aggregation source is aggregated into a plurality of the second aggregation candidates. A production plan determination method characterized by generating a plan. In claim 6,
The aggregation candidate extraction step, the mounting process of one of the summarization source of the electronic component mounting apparatus, when the aggregate to the electronic component mounting apparatus of one of the collection destination, one of the aggregate as the aggregate candidate Extract one first aggregation candidate that is the candidate electronic component mounting apparatus ,
The cycle time calculation step and the modified production plan generation step perform the aggregation process to one of the first aggregation candidates in preference to the aggregation process to a plurality of the second aggregation candidates . Planning decision method. In any one of Claims 5-7,
The modified production plan generation step generates the aggregated modified production plan while using the mounting head of the electronic component mounting apparatus in the production line system that has already been installed as it is. . In any one of Claims 5-7,
The modified production plan generation step generates the aggregated modified production plan by changing the mounting head of the electronic component mounting apparatus in the production line system already installed to another mounting head. Production plan decision method. In claim 9,
The changed production plan generation step is to change to the other mounting head that consumes less power than the mounting head of the electronic component mounting apparatus in the already installed production line system. Decision method. In any one of Claims 1-10,
The modified production plan generation step is prioritized from the electronic component mounting apparatus having a relatively large number of nozzles when there are a plurality of the aggregation candidates for the electronic component mounting apparatus of one aggregation source. A production plan determination method, wherein an aggregation process is performed as the aggregation candidate.

Images