JP5581084B2 - Transparent conductor, method for manufacturing the same, and input device - Google Patents
Transparent conductor, method for manufacturing the same, and input device Download PDFInfo
- Publication number
- JP5581084B2 JP5581084B2 JP2010066519A JP2010066519A JP5581084B2 JP 5581084 B2 JP5581084 B2 JP 5581084B2 JP 2010066519 A JP2010066519 A JP 2010066519A JP 2010066519 A JP2010066519 A JP 2010066519A JP 5581084 B2 JP5581084 B2 JP 5581084B2
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- Prior art keywords
- compound
- acid
- conductive
- fluorine
- epoxy compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004020 conductor Substances 0.000 title claims description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000000034 method Methods 0.000 title description 19
- -1 oxetane compound Chemical class 0.000 claims description 124
- 150000001875 compounds Chemical class 0.000 claims description 117
- 239000004593 Epoxy Substances 0.000 claims description 76
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Chemical group CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 57
- 239000011248 coating agent Substances 0.000 claims description 54
- 238000000576 coating method Methods 0.000 claims description 54
- 229920001940 conductive polymer Polymers 0.000 claims description 49
- 239000003973 paint Substances 0.000 claims description 48
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 47
- 239000011737 fluorine Substances 0.000 claims description 47
- 229910052731 fluorine Inorganic materials 0.000 claims description 47
- 229920000447 polyanionic polymer Polymers 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 33
- 239000002904 solvent Substances 0.000 claims description 17
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 11
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000001153 fluoro group Chemical group F* 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 85
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 41
- 238000011156 evaluation Methods 0.000 description 26
- 239000000047 product Substances 0.000 description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 21
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 19
- 229920006395 saturated elastomer Polymers 0.000 description 18
- 239000000243 solution Substances 0.000 description 18
- 239000011521 glass Substances 0.000 description 17
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 16
- 238000001723 curing Methods 0.000 description 16
- 238000002834 transmittance Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 13
- 125000000524 functional group Chemical group 0.000 description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 12
- 150000001768 cations Chemical class 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 150000003839 salts Chemical class 0.000 description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 11
- 239000002253 acid Substances 0.000 description 11
- 125000000217 alkyl group Chemical group 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 11
- 238000000108 ultra-filtration Methods 0.000 description 11
- 150000001450 anions Chemical group 0.000 description 10
- 229940105990 diglycerin Drugs 0.000 description 10
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 10
- 239000007864 aqueous solution Substances 0.000 description 9
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 239000006096 absorbing agent Substances 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 8
- 239000003999 initiator Substances 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 239000007784 solid electrolyte Substances 0.000 description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 7
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 7
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 6
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 6
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 6
- 150000008065 acid anhydrides Chemical class 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 235000010356 sorbitol Nutrition 0.000 description 6
- 229960002920 sorbitol Drugs 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 125000003368 amide group Chemical group 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 229920000123 polythiophene Polymers 0.000 description 5
- 238000010526 radical polymerization reaction Methods 0.000 description 5
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 5
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 5
- 239000004846 water-soluble epoxy resin Substances 0.000 description 5
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- KXDAEFPNCMNJSK-UHFFFAOYSA-N Benzamide Chemical compound NC(=O)C1=CC=CC=C1 KXDAEFPNCMNJSK-UHFFFAOYSA-N 0.000 description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 4
- 239000002841 Lewis acid Substances 0.000 description 4
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 4
- 229960000250 adipic acid Drugs 0.000 description 4
- 235000011037 adipic acid Nutrition 0.000 description 4
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 238000010538 cationic polymerization reaction Methods 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- 150000002460 imidazoles Chemical class 0.000 description 4
- 125000005462 imide group Chemical group 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 150000007517 lewis acids Chemical class 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 4
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000600 sorbitol Substances 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- DSLZVSRJTYRBFB-LLEIAEIESA-N D-glucaric acid Chemical compound OC(=O)[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O DSLZVSRJTYRBFB-LLEIAEIESA-N 0.000 description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 235000019437 butane-1,3-diol Nutrition 0.000 description 3
- 239000004202 carbamide Substances 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 150000001983 dialkylethers Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229960001031 glucose Drugs 0.000 description 3
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229960003742 phenol Drugs 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920002859 polyalkenylene Polymers 0.000 description 3
- 229920001281 polyalkylene Polymers 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000767 polyaniline Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000128 polypyrrole Polymers 0.000 description 3
- 150000003222 pyridines Chemical class 0.000 description 3
- 150000003230 pyrimidines Chemical class 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000011975 tartaric acid Substances 0.000 description 3
- 235000002906 tartaric acid Nutrition 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- 229940058015 1,3-butylene glycol Drugs 0.000 description 2
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 2
- SULYEHHGGXARJS-UHFFFAOYSA-N 2',4'-dihydroxyacetophenone Chemical compound CC(=O)C1=CC=C(O)C=C1O SULYEHHGGXARJS-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 description 2
- OXQOBQJCDNLAPO-UHFFFAOYSA-N 2,3-Dimethylpyrazine Chemical compound CC1=NC=CN=C1C OXQOBQJCDNLAPO-UHFFFAOYSA-N 0.000 description 2
- GLDQAMYCGOIJDV-UHFFFAOYSA-N 2,3-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1O GLDQAMYCGOIJDV-UHFFFAOYSA-N 0.000 description 2
- JYYNAJVZFGKDEQ-UHFFFAOYSA-N 2,4-Dimethylpyridine Chemical compound CC1=CC=NC(C)=C1 JYYNAJVZFGKDEQ-UHFFFAOYSA-N 0.000 description 2
- UIAFKZKHHVMJGS-UHFFFAOYSA-N 2,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1O UIAFKZKHHVMJGS-UHFFFAOYSA-N 0.000 description 2
- LCZUOKDVTBMCMX-UHFFFAOYSA-N 2,5-Dimethylpyrazine Chemical compound CC1=CN=C(C)C=N1 LCZUOKDVTBMCMX-UHFFFAOYSA-N 0.000 description 2
- WXTMDXOMEHJXQO-UHFFFAOYSA-N 2,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC=C1O WXTMDXOMEHJXQO-UHFFFAOYSA-N 0.000 description 2
- AKEUNCKRJATALU-UHFFFAOYSA-N 2,6-dihydroxybenzoic acid Chemical compound OC(=O)C1=C(O)C=CC=C1O AKEUNCKRJATALU-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- PXBFMLJZNCDSMP-UHFFFAOYSA-N 2-Aminobenzamide Chemical compound NC(=O)C1=CC=CC=C1N PXBFMLJZNCDSMP-UHFFFAOYSA-N 0.000 description 2
- LNIMMWYNSBZESE-UHFFFAOYSA-N 2-Ethyl-3-methylpyrazine, 9CI Chemical compound CCC1=NC=CN=C1C LNIMMWYNSBZESE-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 2
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 2
- QENGPZGAWFQWCZ-UHFFFAOYSA-N 3-Methylthiophene Chemical compound CC=1C=CSC=1 QENGPZGAWFQWCZ-UHFFFAOYSA-N 0.000 description 2
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 2
- XPFCZYUVICHKDS-UHFFFAOYSA-N 3-methylbutane-1,3-diol Chemical compound CC(C)(O)CCO XPFCZYUVICHKDS-UHFFFAOYSA-N 0.000 description 2
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 2
- DTBDAFLSBDGPEA-UHFFFAOYSA-N 3-methylquinoline Chemical compound C1=CC=CC2=CC(C)=CN=C21 DTBDAFLSBDGPEA-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
- QNVNLUSHGRBCLO-UHFFFAOYSA-N 5-hydroxybenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC(O)=CC(C(O)=O)=C1 QNVNLUSHGRBCLO-UHFFFAOYSA-N 0.000 description 2
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- KRNSYSYRLQDHDK-UHFFFAOYSA-N 6,7-dihydro-5h-cyclopenta[b]pyridine Chemical compound C1=CN=C2CCCC2=C1 KRNSYSYRLQDHDK-UHFFFAOYSA-N 0.000 description 2
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 240000002234 Allium sativum Species 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229940126062 Compound A Drugs 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- RHYBFKMFHLPQPH-UHFFFAOYSA-N N-methylhydantoin Chemical compound CN1CC(=O)NC1=O RHYBFKMFHLPQPH-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 2
- SIOXPEMLGUPBBT-UHFFFAOYSA-N Picolinic acid Natural products OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- POJWUDADGALRAB-UHFFFAOYSA-N allantoin Chemical compound NC(=O)NC1NC(=O)NC1=O POJWUDADGALRAB-UHFFFAOYSA-N 0.000 description 2
- HIMXGTXNXJYFGB-UHFFFAOYSA-N alloxan Chemical compound O=C1NC(=O)C(=O)C(=O)N1 HIMXGTXNXJYFGB-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- GGNQRNBDZQJCCN-UHFFFAOYSA-N benzene-1,2,4-triol Chemical compound OC1=CC=C(O)C(O)=C1 GGNQRNBDZQJCCN-UHFFFAOYSA-N 0.000 description 2
- XJHABGPPCLHLLV-UHFFFAOYSA-N benzo[de]isoquinoline-1,3-dione Chemical compound C1=CC(C(=O)NC2=O)=C3C2=CC=CC3=C1 XJHABGPPCLHLLV-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical class OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- HLVXFWDLRHCZEI-UHFFFAOYSA-N chromotropic acid Chemical compound OS(=O)(=O)C1=CC(O)=C2C(O)=CC(S(O)(=O)=O)=CC2=C1 HLVXFWDLRHCZEI-UHFFFAOYSA-N 0.000 description 2
- APEJMQOBVMLION-UHFFFAOYSA-N cinnamamide Chemical compound NC(=O)C=CC1=CC=CC=C1 APEJMQOBVMLION-UHFFFAOYSA-N 0.000 description 2
- 239000006258 conductive agent Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 229940113088 dimethylacetamide Drugs 0.000 description 2
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical class C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- VFPFQHQNJCMNBZ-UHFFFAOYSA-N ethyl gallate Chemical compound CCOC(=O)C1=CC(O)=C(O)C(O)=C1 VFPFQHQNJCMNBZ-UHFFFAOYSA-N 0.000 description 2
- YVIVRJLWYJGJTJ-UHFFFAOYSA-N gamma-Valerolactam Chemical compound CC1CCC(=O)N1 YVIVRJLWYJGJTJ-UHFFFAOYSA-N 0.000 description 2
- 235000004611 garlic Nutrition 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 2
- 229940091173 hydantoin Drugs 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- FBSFWRHWHYMIOG-UHFFFAOYSA-N methyl 3,4,5-trihydroxybenzoate Chemical compound COC(=O)C1=CC(O)=C(O)C(O)=C1 FBSFWRHWHYMIOG-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- CAWHJQAVHZEVTJ-UHFFFAOYSA-N methylpyrazine Chemical compound CC1=CN=CC=N1 CAWHJQAVHZEVTJ-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229940117969 neopentyl glycol Drugs 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- RNVCVTLRINQCPJ-UHFFFAOYSA-N o-toluidine Chemical compound CC1=CC=CC=C1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 2
- 125000003566 oxetanyl group Chemical group 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 150000003216 pyrazines Chemical class 0.000 description 2
- PTMBWNZJOQBTBK-UHFFFAOYSA-N pyridin-4-ylmethanol Chemical compound OCC1=CC=NC=C1 PTMBWNZJOQBTBK-UHFFFAOYSA-N 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- GJAWHXHKYYXBSV-UHFFFAOYSA-N quinolinic acid Chemical compound OC(=O)C1=CC=CN=C1C(O)=O GJAWHXHKYYXBSV-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- MNCGMVDMOKPCSQ-UHFFFAOYSA-M sodium;2-phenylethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=CC1=CC=CC=C1 MNCGMVDMOKPCSQ-UHFFFAOYSA-M 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229960002317 succinimide Drugs 0.000 description 2
- 150000005846 sugar alcohols Chemical class 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- VXKWYPOMXBVZSJ-UHFFFAOYSA-N tetramethyltin Chemical compound C[Sn](C)(C)C VXKWYPOMXBVZSJ-UHFFFAOYSA-N 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 150000003918 triazines Chemical class 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- XUDGDVPXDYGCTG-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 2-[2-(2,5-dioxopyrrolidin-1-yl)oxycarbonyloxyethylsulfonyl]ethyl carbonate Chemical compound O=C1CCC(=O)N1OC(=O)OCCS(=O)(=O)CCOC(=O)ON1C(=O)CCC1=O XUDGDVPXDYGCTG-UHFFFAOYSA-N 0.000 description 1
- HQEPZWYPQQKFLU-UHFFFAOYSA-N (2,6-dihydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC(O)=C1C(=O)C1=CC=CC=C1 HQEPZWYPQQKFLU-UHFFFAOYSA-N 0.000 description 1
- HOSJNFCDDCLEBM-UHFFFAOYSA-N (2-phenyloxetan-3-yl)methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1COC1C1=CC=CC=C1 HOSJNFCDDCLEBM-UHFFFAOYSA-N 0.000 description 1
- ARWCZKJISXFBGI-UHFFFAOYSA-N (3,4-dihydroxyphenyl)-phenylmethanone Chemical compound C1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 ARWCZKJISXFBGI-UHFFFAOYSA-N 0.000 description 1
- VABRJGOVVLYNCR-UHFFFAOYSA-N (3,5-dihydroxyphenyl)-phenylmethanone Chemical compound OC1=CC(O)=CC(C(=O)C=2C=CC=CC=2)=C1 VABRJGOVVLYNCR-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- BSSNZUFKXJJCBG-OWOJBTEDSA-N (e)-but-2-enediamide Chemical compound NC(=O)\C=C\C(N)=O BSSNZUFKXJJCBG-OWOJBTEDSA-N 0.000 description 1
- BSSNZUFKXJJCBG-UPHRSURJSA-N (z)-but-2-enediamide Chemical compound NC(=O)\C=C/C(N)=O BSSNZUFKXJJCBG-UPHRSURJSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- STROKFBTTJPGBP-UHFFFAOYSA-N 1,2,3,4-tetrahydroxyanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=C(O)C(O)=C3C(=O)C2=C1 STROKFBTTJPGBP-UHFFFAOYSA-N 0.000 description 1
- MJIWQHRXSLOUJN-UHFFFAOYSA-N 1,2,4-triazin-3-amine Chemical compound NC1=NC=CN=N1 MJIWQHRXSLOUJN-UHFFFAOYSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- KCZIUKYAJJEIQG-UHFFFAOYSA-N 1,3,5-triazin-2-amine Chemical compound NC1=NC=NC=N1 KCZIUKYAJJEIQG-UHFFFAOYSA-N 0.000 description 1
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- FQXOOGHQVPKHPG-UHFFFAOYSA-N 1,3-diazinane-2,4,5-trione Chemical compound O=C1NCC(=O)C(=O)N1 FQXOOGHQVPKHPG-UHFFFAOYSA-N 0.000 description 1
- AQSQFWLMFCKKMG-UHFFFAOYSA-N 1,3-dibutylurea Chemical compound CCCCNC(=O)NCCCC AQSQFWLMFCKKMG-UHFFFAOYSA-N 0.000 description 1
- ZWAVGZYKJNOTPX-UHFFFAOYSA-N 1,3-diethylurea Chemical compound CCNC(=O)NCC ZWAVGZYKJNOTPX-UHFFFAOYSA-N 0.000 description 1
- SILNNFMWIMZVEQ-UHFFFAOYSA-N 1,3-dihydrobenzimidazol-2-one Chemical compound C1=CC=C2NC(O)=NC2=C1 SILNNFMWIMZVEQ-UHFFFAOYSA-N 0.000 description 1
- 229940057054 1,3-dimethylurea Drugs 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-dioxonaphthalene Natural products C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- ZNYIPTYJBRGSSL-UHFFFAOYSA-N 1,5,5-trimethylimidazolidine-2,4-dione Chemical compound CN1C(=O)NC(=O)C1(C)C ZNYIPTYJBRGSSL-UHFFFAOYSA-N 0.000 description 1
- ZZQIHZSTMNWGDE-UHFFFAOYSA-N 1,5-dihydroxy-2h-naphthalene-1-carboxylic acid Chemical compound C1=CC=C2C(C(=O)O)(O)CC=CC2=C1O ZZQIHZSTMNWGDE-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
- FZUDMFCCNVDITF-UHFFFAOYSA-N 1,5-dihydroxynaphthalene-2,6-dicarboxylic acid Chemical compound OC1=C(C(O)=O)C=CC2=C(O)C(C(=O)O)=CC=C21 FZUDMFCCNVDITF-UHFFFAOYSA-N 0.000 description 1
- OXHNLMTVIGZXSG-UHFFFAOYSA-N 1-Methylpyrrole Chemical compound CN1C=CC=C1 OXHNLMTVIGZXSG-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- OZFIGURLAJSLIR-UHFFFAOYSA-N 1-ethenyl-2h-pyridine Chemical compound C=CN1CC=CC=C1 OZFIGURLAJSLIR-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- BUXKULRFRATXSI-UHFFFAOYSA-N 1-hydroxypyrrole-2,5-dione Chemical compound ON1C(=O)C=CC1=O BUXKULRFRATXSI-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- XDFZKQJLNGNJAN-UHFFFAOYSA-N 1-methylbenzimidazol-2-amine Chemical compound C1=CC=C2N(C)C(N)=NC2=C1 XDFZKQJLNGNJAN-UHFFFAOYSA-N 0.000 description 1
- LAADXMBTEALRFH-UHFFFAOYSA-N 1-phenylsulfanylpyridin-1-ium Chemical class C=1C=CC=C[N+]=1SC1=CC=CC=C1 LAADXMBTEALRFH-UHFFFAOYSA-N 0.000 description 1
- XLXCHZCQTCBUOX-UHFFFAOYSA-N 1-prop-2-enylimidazole Chemical compound C=CCN1C=CN=C1 XLXCHZCQTCBUOX-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- ZPOROQKDAPEMOL-UHFFFAOYSA-N 1h-pyrrol-3-ol Chemical compound OC=1C=CNC=1 ZPOROQKDAPEMOL-UHFFFAOYSA-N 0.000 description 1
- WLDWSGZHNBANIO-UHFFFAOYSA-N 2',5'-Dihydroxyacetophenone Chemical compound CC(=O)C1=CC(O)=CC=C1O WLDWSGZHNBANIO-UHFFFAOYSA-N 0.000 description 1
- OAMHTTBNEJBIKA-UHFFFAOYSA-N 2,2,2-trichloro-1-phenylethanone Chemical compound ClC(Cl)(Cl)C(=O)C1=CC=CC=C1 OAMHTTBNEJBIKA-UHFFFAOYSA-N 0.000 description 1
- WRRQHEMZOCFTQP-UHFFFAOYSA-N 2,2,2-trihydroxy-1-phenylethanone Chemical compound OC(O)(O)C(=O)C1=CC=CC=C1 WRRQHEMZOCFTQP-UHFFFAOYSA-N 0.000 description 1
- NSKCTPBWPZPFHW-UHFFFAOYSA-N 2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-hexadecafluorodecane-1,10-diol Chemical compound OCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CO NSKCTPBWPZPFHW-UHFFFAOYSA-N 0.000 description 1
- XZJPYETUABEQFI-UHFFFAOYSA-N 2,2,3,3,4,4,5,5,6,6,7,7-dodecafluorooctane-1,8-diol Chemical compound OCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CO XZJPYETUABEQFI-UHFFFAOYSA-N 0.000 description 1
- NHEKBXPLFJSSBZ-UHFFFAOYSA-N 2,2,3,3,4,4,5,5-octafluorohexane-1,6-diol Chemical compound OCC(F)(F)C(F)(F)C(F)(F)C(F)(F)CO NHEKBXPLFJSSBZ-UHFFFAOYSA-N 0.000 description 1
- IELVMUPSWDZWSD-UHFFFAOYSA-N 2,2,3,3,4,4-hexafluoropentane-1,5-diol Chemical compound OCC(F)(F)C(F)(F)C(F)(F)CO IELVMUPSWDZWSD-UHFFFAOYSA-N 0.000 description 1
- CDZXJJOGDCLNKX-UHFFFAOYSA-N 2,2,3,3-tetrafluorobutane-1,4-diol Chemical compound OCC(F)(F)C(F)(F)CO CDZXJJOGDCLNKX-UHFFFAOYSA-N 0.000 description 1
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BRRSNXCXLSVPFC-UHFFFAOYSA-N 2,3,4-Trihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(O)=C1O BRRSNXCXLSVPFC-UHFFFAOYSA-N 0.000 description 1
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 1
- CRPNQSVBEWWHIJ-UHFFFAOYSA-N 2,3,4-trihydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C(O)=C1O CRPNQSVBEWWHIJ-UHFFFAOYSA-N 0.000 description 1
- GZXXANJCCWGCSV-UHFFFAOYSA-N 2,3-Diethylpyrazine Chemical compound CCC1=NC=CN=C1CC GZXXANJCCWGCSV-UHFFFAOYSA-N 0.000 description 1
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- 229940082044 2,3-dihydroxybenzoic acid Drugs 0.000 description 1
- GRMNJXQBRPJVQV-UHFFFAOYSA-N 2,3-dihydroxybutanediamide Chemical compound NC(=O)C(O)C(O)C(N)=O GRMNJXQBRPJVQV-UHFFFAOYSA-N 0.000 description 1
- XLGVHAQDCFITCH-UHFFFAOYSA-N 2,3-dihydroxypropanamide Chemical compound NC(=O)C(O)CO XLGVHAQDCFITCH-UHFFFAOYSA-N 0.000 description 1
- JTTIOYHBNXDJOD-UHFFFAOYSA-N 2,4,6-triaminopyrimidine Chemical compound NC1=CC(N)=NC(N)=N1 JTTIOYHBNXDJOD-UHFFFAOYSA-N 0.000 description 1
- LSGBKABSSSIRJF-UHFFFAOYSA-N 2,4,6-tris(trifluoromethyl)-1,3,5-triazine Chemical compound FC(F)(F)C1=NC(C(F)(F)F)=NC(C(F)(F)F)=N1 LSGBKABSSSIRJF-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- KEVRHVMWBKFGLO-UHFFFAOYSA-N 2,4-dimethoxypyrimidine Chemical compound COC1=CC=NC(OC)=N1 KEVRHVMWBKFGLO-UHFFFAOYSA-N 0.000 description 1
- STQCUBPDRIONGM-UHFFFAOYSA-N 2,5-dihydroxynaphthalene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=C(O)C=CC2=C(O)C(C(=O)O)=CC=C21 STQCUBPDRIONGM-UHFFFAOYSA-N 0.000 description 1
- 239000001934 2,5-dimethylpyrazine Substances 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- YKUDHBLDJYZZQS-UHFFFAOYSA-N 2,6-dichloro-1h-1,3,5-triazin-4-one Chemical compound OC1=NC(Cl)=NC(Cl)=N1 YKUDHBLDJYZZQS-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- DQQLZADYSWBCOX-UHFFFAOYSA-N 2-(2,5-dioxoimidazolidin-4-yl)acetic acid Chemical compound OC(=O)CC1NC(=O)NC1=O DQQLZADYSWBCOX-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LROZSPADHSXFJA-UHFFFAOYSA-N 2-(4-hydroxyphenyl)sulfonylphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=CC=C1O LROZSPADHSXFJA-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 description 1
- AUFJTVGCSJNQIF-UHFFFAOYSA-N 2-Amino-4,6-dihydroxypyrimidine Chemical compound NC1=NC(O)=CC(=O)N1 AUFJTVGCSJNQIF-UHFFFAOYSA-N 0.000 description 1
- IDQNBVFPZMCDDN-UHFFFAOYSA-N 2-Amino-4,6-dimethylpyrimidine Chemical compound CC1=CC(C)=NC(N)=N1 IDQNBVFPZMCDDN-UHFFFAOYSA-N 0.000 description 1
- GHCFWKFREBNSPC-UHFFFAOYSA-N 2-Amino-4-methylpyrimidine Chemical compound CC1=CC=NC(N)=N1 GHCFWKFREBNSPC-UHFFFAOYSA-N 0.000 description 1
- IZXIZTKNFFYFOF-UHFFFAOYSA-N 2-Oxazolidone Chemical compound O=C1NCCO1 IZXIZTKNFFYFOF-UHFFFAOYSA-N 0.000 description 1
- SFJRUJUEMVAZLM-UHFFFAOYSA-N 2-[(2-methylpropan-2-yl)oxymethyl]oxirane Chemical compound CC(C)(C)OCC1CO1 SFJRUJUEMVAZLM-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- FVCHRIQAIOHAIC-UHFFFAOYSA-N 2-[1-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COC(C)COCC1CO1 FVCHRIQAIOHAIC-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- CWIAFBQLWOMNFY-UHFFFAOYSA-N 2-[2-(1,1-difluoro-2-hydroxyethoxy)-1,1,2,2-tetrafluoroethoxy]-2,2-difluoroethanol Chemical compound OCC(F)(F)OC(F)(F)C(F)(F)OC(F)(F)CO CWIAFBQLWOMNFY-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- BFMDZOWJRVLYPB-UHFFFAOYSA-N 2-[2-[2-(1,1-difluoro-2-hydroxyethoxy)-1,1,2,2-tetrafluoroethoxy]-1,1,2,2-tetrafluoroethoxy]-2,2-difluoroethanol Chemical compound OCC(F)(F)OC(F)(F)C(F)(F)OC(F)(F)C(F)(F)OC(F)(F)CO BFMDZOWJRVLYPB-UHFFFAOYSA-N 0.000 description 1
- SEFYJVFBMNOLBK-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCC1CO1 SEFYJVFBMNOLBK-UHFFFAOYSA-N 0.000 description 1
- CABMTIJINOIHOD-UHFFFAOYSA-N 2-[4-methyl-5-oxo-4-(propan-2-yl)-4,5-dihydro-1H-imidazol-2-yl]quinoline-3-carboxylic acid Chemical compound N1C(=O)C(C(C)C)(C)N=C1C1=NC2=CC=CC=C2C=C1C(O)=O CABMTIJINOIHOD-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- NPTGVVKPLWFPPX-UHFFFAOYSA-N 2-amino-4-chloro-6-methylpyrimidine Chemical compound CC1=CC(Cl)=NC(N)=N1 NPTGVVKPLWFPPX-UHFFFAOYSA-N 0.000 description 1
- ZMCHBSMFKQYNKA-UHFFFAOYSA-N 2-aminobenzenesulfonic acid Chemical compound NC1=CC=CC=C1S(O)(=O)=O ZMCHBSMFKQYNKA-UHFFFAOYSA-N 0.000 description 1
- JWYUFVNJZUSCSM-UHFFFAOYSA-N 2-aminobenzimidazole Chemical compound C1=CC=C2NC(N)=NC2=C1 JWYUFVNJZUSCSM-UHFFFAOYSA-N 0.000 description 1
- UBBCCLKVCWXZTO-UHFFFAOYSA-N 2-aminobenzimidazole-2-sulfonic acid Chemical compound C1=CC=CC2=NC(N)(S(O)(=O)=O)N=C21 UBBCCLKVCWXZTO-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- FFNVQNRYTPFDDP-UHFFFAOYSA-N 2-cyanopyridine Chemical compound N#CC1=CC=CC=N1 FFNVQNRYTPFDDP-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- RIMKIAWGGXTMHJ-UHFFFAOYSA-N 2-ethyloctadecanedioic acid Chemical compound CCC(C(O)=O)CCCCCCCCCCCCCCCC(O)=O RIMKIAWGGXTMHJ-UHFFFAOYSA-N 0.000 description 1
- CSDSSGBPEUDDEE-UHFFFAOYSA-N 2-formylpyridine Chemical compound O=CC1=CC=CC=N1 CSDSSGBPEUDDEE-UHFFFAOYSA-N 0.000 description 1
- GPLIMIJPIZGPIF-UHFFFAOYSA-N 2-hydroxy-1,4-benzoquinone Chemical compound OC1=CC(=O)C=CC1=O GPLIMIJPIZGPIF-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- TZGPACAKMCUCKX-UHFFFAOYSA-N 2-hydroxyacetamide Chemical compound NC(=O)CO TZGPACAKMCUCKX-UHFFFAOYSA-N 0.000 description 1
- JTYZNCLZDNYUPC-UHFFFAOYSA-N 2-imidazol-1-ylethanol Chemical compound OCCn1ccnc1.OCCn1ccnc1 JTYZNCLZDNYUPC-UHFFFAOYSA-N 0.000 description 1
- WRBRCYPPGUCRHW-UHFFFAOYSA-N 2-iminobutanoic acid zwitterion Chemical compound CCC(=N)C(O)=O WRBRCYPPGUCRHW-UHFFFAOYSA-N 0.000 description 1
- LCANECIWPMDASZ-UHFFFAOYSA-N 2-isocyanatoethanol Chemical compound OCCN=C=O LCANECIWPMDASZ-UHFFFAOYSA-N 0.000 description 1
- QKPVEISEHYYHRH-UHFFFAOYSA-N 2-methoxyacetonitrile Chemical compound COCC#N QKPVEISEHYYHRH-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- MKBBSFGKFMQPPC-UHFFFAOYSA-N 2-propyl-1h-imidazole Chemical compound CCCC1=NC=CN1 MKBBSFGKFMQPPC-UHFFFAOYSA-N 0.000 description 1
- YNFBMDWHEHETJW-UHFFFAOYSA-N 2-pyridin-2-yl-1h-benzimidazole Chemical compound N1=CC=CC=C1C1=NC2=CC=CC=C2N1 YNFBMDWHEHETJW-UHFFFAOYSA-N 0.000 description 1
- DWPYQDGDWBKJQL-UHFFFAOYSA-N 2-pyridin-4-ylethanol Chemical compound OCCC1=CC=NC=C1 DWPYQDGDWBKJQL-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- LGPVKMIWERPYIJ-UHFFFAOYSA-N 3,4-dibutyl-1h-pyrrole Chemical compound CCCCC1=CNC=C1CCCC LGPVKMIWERPYIJ-UHFFFAOYSA-N 0.000 description 1
- FKXCQUBXKMXXBG-UHFFFAOYSA-N 3,4-dibutylthiophene Chemical compound CCCCC1=CSC=C1CCCC FKXCQUBXKMXXBG-UHFFFAOYSA-N 0.000 description 1
- OJFOWGWQOFZNNJ-UHFFFAOYSA-N 3,4-dimethyl-1h-pyrrole Chemical compound CC1=CNC=C1C OJFOWGWQOFZNNJ-UHFFFAOYSA-N 0.000 description 1
- GPSFYJDZKSRMKZ-UHFFFAOYSA-N 3,4-dimethylthiophene Chemical compound CC1=CSC=C1C GPSFYJDZKSRMKZ-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- FYMPIGRRSUORAR-UHFFFAOYSA-N 3-(4-methyl-1h-pyrrol-3-yl)propanoic acid Chemical compound CC1=CNC=C1CCC(O)=O FYMPIGRRSUORAR-UHFFFAOYSA-N 0.000 description 1
- JCOLSHCVCITSFG-UHFFFAOYSA-N 3-(4-methylthiophen-3-yl)propanoic acid Chemical compound CC1=CSC=C1CCC(O)=O JCOLSHCVCITSFG-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- ZAJAQTYSTDTMCU-UHFFFAOYSA-N 3-aminobenzenesulfonic acid Chemical compound NC1=CC=CC(S(O)(=O)=O)=C1 ZAJAQTYSTDTMCU-UHFFFAOYSA-N 0.000 description 1
- ZAGZIOYVEIDDJA-UHFFFAOYSA-N 3-aminopyrazine-2-carboxylic acid Chemical compound NC1=NC=CN=C1C(O)=O ZAGZIOYVEIDDJA-UHFFFAOYSA-N 0.000 description 1
- XCMISAPCWHTVNG-UHFFFAOYSA-N 3-bromothiophene Chemical compound BrC=1C=CSC=1 XCMISAPCWHTVNG-UHFFFAOYSA-N 0.000 description 1
- FCVHZARBOWEONP-UHFFFAOYSA-N 3-butoxy-1h-pyrrole Chemical compound CCCCOC=1C=CNC=1 FCVHZARBOWEONP-UHFFFAOYSA-N 0.000 description 1
- NZSSXTMHSXMZBL-UHFFFAOYSA-N 3-butoxythiophene Chemical compound CCCCOC=1C=CSC=1 NZSSXTMHSXMZBL-UHFFFAOYSA-N 0.000 description 1
- ATWNFFKGYPYZPJ-UHFFFAOYSA-N 3-butyl-1h-pyrrole Chemical compound CCCCC=1C=CNC=1 ATWNFFKGYPYZPJ-UHFFFAOYSA-N 0.000 description 1
- KPOCSQCZXMATFR-UHFFFAOYSA-N 3-butylthiophene Chemical compound CCCCC=1C=CSC=1 KPOCSQCZXMATFR-UHFFFAOYSA-N 0.000 description 1
- QUBJDMPBDURTJT-UHFFFAOYSA-N 3-chlorothiophene Chemical compound ClC=1C=CSC=1 QUBJDMPBDURTJT-UHFFFAOYSA-N 0.000 description 1
- YTIXUMPBYXTWQA-UHFFFAOYSA-N 3-decoxythiophene Chemical compound CCCCCCCCCCOC=1C=CSC=1 YTIXUMPBYXTWQA-UHFFFAOYSA-N 0.000 description 1
- FFRZVVFLHHGORC-UHFFFAOYSA-N 3-decyl-1h-pyrrole Chemical compound CCCCCCCCCCC=1C=CNC=1 FFRZVVFLHHGORC-UHFFFAOYSA-N 0.000 description 1
- JAYBIBLZTQMCAY-UHFFFAOYSA-N 3-decylthiophene Chemical compound CCCCCCCCCCC=1C=CSC=1 JAYBIBLZTQMCAY-UHFFFAOYSA-N 0.000 description 1
- HQKVUWMATDWFJI-UHFFFAOYSA-N 3-dodecoxythiophene Chemical compound CCCCCCCCCCCCOC=1C=CSC=1 HQKVUWMATDWFJI-UHFFFAOYSA-N 0.000 description 1
- HGICMYITGGLHHY-UHFFFAOYSA-N 3-dodecyl-1h-pyrrole Chemical compound CCCCCCCCCCCCC=1C=CNC=1 HGICMYITGGLHHY-UHFFFAOYSA-N 0.000 description 1
- RFKWIEFTBMACPZ-UHFFFAOYSA-N 3-dodecylthiophene Chemical compound CCCCCCCCCCCCC=1C=CSC=1 RFKWIEFTBMACPZ-UHFFFAOYSA-N 0.000 description 1
- KEAYXGHOGPUYPB-UHFFFAOYSA-N 3-ethoxy-1h-pyrrole Chemical compound CCOC=1C=CNC=1 KEAYXGHOGPUYPB-UHFFFAOYSA-N 0.000 description 1
- ZFQVXRBCYGOGAA-UHFFFAOYSA-N 3-ethoxy-4-methylthiophene Chemical compound CCOC1=CSC=C1C ZFQVXRBCYGOGAA-UHFFFAOYSA-N 0.000 description 1
- RLLBWIDEGAIFPI-UHFFFAOYSA-N 3-ethyl-1h-pyrrole Chemical compound CCC=1C=CNC=1 RLLBWIDEGAIFPI-UHFFFAOYSA-N 0.000 description 1
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 1
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 1
- GBDPVIKGIRHANI-UHFFFAOYSA-N 3-ethyl-3-[6-[(3-ethyloxetan-3-yl)methoxy]hexoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCCCOCC1(CC)COC1 GBDPVIKGIRHANI-UHFFFAOYSA-N 0.000 description 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 1
- WLWBKLRAHBGNIU-UHFFFAOYSA-N 3-ethylquinoline Chemical compound C1=CC=CC2=CC(CC)=CN=C21 WLWBKLRAHBGNIU-UHFFFAOYSA-N 0.000 description 1
- SLDBAXYJAIRQMX-UHFFFAOYSA-N 3-ethylthiophene Chemical compound CCC=1C=CSC=1 SLDBAXYJAIRQMX-UHFFFAOYSA-N 0.000 description 1
- JFRPBGLJDHIQGT-UHFFFAOYSA-N 3-heptoxythiophene Chemical compound CCCCCCCOC=1C=CSC=1 JFRPBGLJDHIQGT-UHFFFAOYSA-N 0.000 description 1
- IUUMHORDQCAXQU-UHFFFAOYSA-N 3-heptylthiophene Chemical compound CCCCCCCC=1C=CSC=1 IUUMHORDQCAXQU-UHFFFAOYSA-N 0.000 description 1
- INZDUCBKJIQWBX-UHFFFAOYSA-N 3-hexoxy-4-methyl-1h-pyrrole Chemical compound CCCCCCOC1=CNC=C1C INZDUCBKJIQWBX-UHFFFAOYSA-N 0.000 description 1
- GFJHLDVJFOQWLT-UHFFFAOYSA-N 3-hexoxythiophene Chemical compound CCCCCCOC=1C=CSC=1 GFJHLDVJFOQWLT-UHFFFAOYSA-N 0.000 description 1
- WGKRMQIQXMJVFZ-UHFFFAOYSA-N 3-iodothiophene Chemical compound IC=1C=CSC=1 WGKRMQIQXMJVFZ-UHFFFAOYSA-N 0.000 description 1
- OTODBDQJLMYYKQ-UHFFFAOYSA-N 3-methoxy-1h-pyrrole Chemical compound COC=1C=CNC=1 OTODBDQJLMYYKQ-UHFFFAOYSA-N 0.000 description 1
- HGDGACBSGVRCSM-UHFFFAOYSA-N 3-methoxy-4-methylthiophene Chemical compound COC1=CSC=C1C HGDGACBSGVRCSM-UHFFFAOYSA-N 0.000 description 1
- FEKWWZCCJDUWLY-UHFFFAOYSA-N 3-methyl-1h-pyrrole Chemical compound CC=1C=CNC=1 FEKWWZCCJDUWLY-UHFFFAOYSA-N 0.000 description 1
- VXXGMHKGORIRTK-UHFFFAOYSA-N 3-methyl-3-propylpyrrolidine-2,5-dione Chemical compound CCCC1(C)CC(=O)NC1=O VXXGMHKGORIRTK-UHFFFAOYSA-N 0.000 description 1
- OIXVNYHVHGWVEN-UHFFFAOYSA-N 3-methyl-5-(1h-pyrrol-2-yl)pentanoic acid Chemical compound OC(=O)CC(C)CCC1=CC=CN1 OIXVNYHVHGWVEN-UHFFFAOYSA-N 0.000 description 1
- GRTWOPGOPPTXOA-UHFFFAOYSA-N 3-methyl-5-thiophen-2-ylpentanoic acid Chemical compound OC(=O)CC(C)CCC1=CC=CS1 GRTWOPGOPPTXOA-UHFFFAOYSA-N 0.000 description 1
- KPORMHZYIJPHAV-UHFFFAOYSA-N 3-octadecoxythiophene Chemical compound CCCCCCCCCCCCCCCCCCOC=1C=CSC=1 KPORMHZYIJPHAV-UHFFFAOYSA-N 0.000 description 1
- ARFJPHXJBIEWSZ-UHFFFAOYSA-N 3-octadecylthiophene Chemical compound CCCCCCCCCCCCCCCCCCC=1C=CSC=1 ARFJPHXJBIEWSZ-UHFFFAOYSA-N 0.000 description 1
- AUVZKIJQGLYISA-UHFFFAOYSA-N 3-octoxythiophene Chemical compound CCCCCCCCOC=1C=CSC=1 AUVZKIJQGLYISA-UHFFFAOYSA-N 0.000 description 1
- WFHVTZRAIPYMMO-UHFFFAOYSA-N 3-octyl-1h-pyrrole Chemical compound CCCCCCCCC=1C=CNC=1 WFHVTZRAIPYMMO-UHFFFAOYSA-N 0.000 description 1
- DQTMTQZSOJMZSF-UHFFFAOYSA-N 3-pentadecylcatechol Chemical compound CCCCCCCCCCCCCCCC1=CC=CC(O)=C1O DQTMTQZSOJMZSF-UHFFFAOYSA-N 0.000 description 1
- ZDQZVKVIYAPRON-UHFFFAOYSA-N 3-phenylthiophene Chemical compound S1C=CC(C=2C=CC=CC=2)=C1 ZDQZVKVIYAPRON-UHFFFAOYSA-N 0.000 description 1
- FAOPZUAEZGKQNC-UHFFFAOYSA-N 3-propyl-1h-pyrrole Chemical compound CCCC=1C=CNC=1 FAOPZUAEZGKQNC-UHFFFAOYSA-N 0.000 description 1
- QZNFRMXKQCIPQY-UHFFFAOYSA-N 3-propylthiophene Chemical compound CCCC=1C=CSC=1 QZNFRMXKQCIPQY-UHFFFAOYSA-N 0.000 description 1
- WLDMPODMCFGWAA-UHFFFAOYSA-N 3a,4,5,6,7,7a-hexahydroisoindole-1,3-dione Chemical compound C1CCCC2C(=O)NC(=O)C21 WLDMPODMCFGWAA-UHFFFAOYSA-N 0.000 description 1
- JPZOAVGMSDSWSW-UHFFFAOYSA-N 4,6-dichloropyrimidin-2-amine Chemical compound NC1=NC(Cl)=CC(Cl)=N1 JPZOAVGMSDSWSW-UHFFFAOYSA-N 0.000 description 1
- DUFGYCAXVIUXIP-UHFFFAOYSA-N 4,6-dihydroxypyrimidine Chemical compound OC1=CC(O)=NC=N1 DUFGYCAXVIUXIP-UHFFFAOYSA-N 0.000 description 1
- LVFRCHIUUKWBLR-UHFFFAOYSA-N 4,6-dimethoxypyrimidin-2-amine Chemical compound COC1=CC(OC)=NC(N)=N1 LVFRCHIUUKWBLR-UHFFFAOYSA-N 0.000 description 1
- JOXLBOLGVYVKBU-UHFFFAOYSA-N 4-(1-pyridin-4-ylpropan-2-yl)pyridine Chemical compound C=1C=NC=CC=1C(C)CC1=CC=NC=C1 JOXLBOLGVYVKBU-UHFFFAOYSA-N 0.000 description 1
- IEEGFBHLLWBJJH-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butane-1-sulfonic acid Chemical compound CC(=C)C(=O)OCCCCS(O)(=O)=O IEEGFBHLLWBJJH-UHFFFAOYSA-N 0.000 description 1
- DQRKTVIJNCVZAX-UHFFFAOYSA-N 4-(2-pyridin-4-ylethyl)pyridine Chemical compound C=1C=NC=CC=1CCC1=CC=NC=C1 DQRKTVIJNCVZAX-UHFFFAOYSA-N 0.000 description 1
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 1
- NUKYPUAOHBNCPY-UHFFFAOYSA-N 4-aminopyridine Chemical compound NC1=CC=NC=C1 NUKYPUAOHBNCPY-UHFFFAOYSA-N 0.000 description 1
- VFEYBTFCBZMBAU-UHFFFAOYSA-N 4-chloro-6-methoxypyrimidin-2-amine Chemical compound COC1=CC(Cl)=NC(N)=N1 VFEYBTFCBZMBAU-UHFFFAOYSA-N 0.000 description 1
- VJXRKZJMGVSXPX-UHFFFAOYSA-N 4-ethylpyridine Chemical compound CCC1=CC=NC=C1 VJXRKZJMGVSXPX-UHFFFAOYSA-N 0.000 description 1
- KGYYLUNYOCBBME-UHFFFAOYSA-M 4-fluoro-2-phenyl-4-(4-propylcyclohexyl)cyclohexa-1,5-diene-1-carboxylate Chemical compound C1CC(CCC)CCC1C1(F)C=CC(C([O-])=O)=C(C=2C=CC=CC=2)C1 KGYYLUNYOCBBME-UHFFFAOYSA-M 0.000 description 1
- SBVKVAIECGDBTC-UHFFFAOYSA-N 4-hydroxy-2-methylidenebutanamide Chemical compound NC(=O)C(=C)CCO SBVKVAIECGDBTC-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- GCNTZFIIOFTKIY-UHFFFAOYSA-N 4-hydroxypyridine Chemical compound OC1=CC=NC=C1 GCNTZFIIOFTKIY-UHFFFAOYSA-N 0.000 description 1
- FXPOCCDGHHTZAO-UHFFFAOYSA-N 4-methyl-1h-pyrrole-3-carboxylic acid Chemical compound CC1=CNC=C1C(O)=O FXPOCCDGHHTZAO-UHFFFAOYSA-N 0.000 description 1
- HUQGLWLBOCSVMD-UHFFFAOYSA-N 4-methylpyridine-2,6-diamine Chemical compound CC1=CC(N)=NC(N)=C1 HUQGLWLBOCSVMD-UHFFFAOYSA-N 0.000 description 1
- LRFIHWGUGBXFEC-UHFFFAOYSA-N 4-methylthiophene-3-carboxylic acid Chemical compound CC1=CSC=C1C(O)=O LRFIHWGUGBXFEC-UHFFFAOYSA-N 0.000 description 1
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 1
- JLPOBAADYFDVAV-UHFFFAOYSA-N 5-(hydroxymethyl)-1h-pyridin-2-one Chemical compound OCC1=CC=C(O)N=C1 JLPOBAADYFDVAV-UHFFFAOYSA-N 0.000 description 1
- CARJPEPCULYFFP-UHFFFAOYSA-N 5-Sulfo-1,3-benzenedicarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(S(O)(=O)=O)=C1 CARJPEPCULYFFP-UHFFFAOYSA-N 0.000 description 1
- DSWXMZCXENJPNA-UHFFFAOYSA-N 5-ethylbenzene-1,2,3-triol Chemical compound CCC1=CC(O)=C(O)C(O)=C1 DSWXMZCXENJPNA-UHFFFAOYSA-N 0.000 description 1
- IQAGXMNEUYBTLG-UHFFFAOYSA-N 5-hydroxy-2-methylpent-2-enamide Chemical compound NC(=O)C(C)=CCCO IQAGXMNEUYBTLG-UHFFFAOYSA-N 0.000 description 1
- LNEBYRZFMNCBGR-UHFFFAOYSA-N 5-hydroxybenzene-1,3-disulfonic acid Chemical compound OC1=CC(S(O)(=O)=O)=CC(S(O)(=O)=O)=C1 LNEBYRZFMNCBGR-UHFFFAOYSA-N 0.000 description 1
- NYUABOGYMWADSF-UHFFFAOYSA-N 5-methylbenzene-1,2,3-triol Chemical compound CC1=CC(O)=C(O)C(O)=C1 NYUABOGYMWADSF-UHFFFAOYSA-N 0.000 description 1
- RBYJWCRKFLGNDB-UHFFFAOYSA-N 5-methylpyrazine-2-carboxylic acid Chemical compound CC1=CN=C(C(O)=O)C=N1 RBYJWCRKFLGNDB-UHFFFAOYSA-N 0.000 description 1
- VDWQWOXVBXURMT-UHFFFAOYSA-N 5-methylpyridine-3-carbonitrile Chemical compound CC1=CN=CC(C#N)=C1 VDWQWOXVBXURMT-UHFFFAOYSA-N 0.000 description 1
- NPOQWQKUDROJNP-UHFFFAOYSA-N 5-methylpyrrolidin-2-one Chemical compound CC1CCC(N1)=O.C1(CCC(C)N1)=O NPOQWQKUDROJNP-UHFFFAOYSA-N 0.000 description 1
- VDAIVYPWYSEYDS-UHFFFAOYSA-N 5-propylbenzene-1,2,3-triol Chemical compound CCCC1=CC(O)=C(O)C(O)=C1 VDAIVYPWYSEYDS-UHFFFAOYSA-N 0.000 description 1
- DKJVSIITPZVTRO-UHFFFAOYSA-N 6,7-dihydroxynaphthalene-2-sulfonic acid Chemical compound C1=C(S(O)(=O)=O)C=C2C=C(O)C(O)=CC2=C1 DKJVSIITPZVTRO-UHFFFAOYSA-N 0.000 description 1
- LTUUGSGSUZRPRV-UHFFFAOYSA-N 6-methylpyridine-2-carboxylic acid Chemical compound CC1=CC=CC(C(O)=O)=N1 LTUUGSGSUZRPRV-UHFFFAOYSA-N 0.000 description 1
- QQBCAPJSHSNYLE-UHFFFAOYSA-N 8-(2,5-dioxopyrrol-1-yl)octanoic acid Chemical compound OC(=O)CCCCCCCN1C(=O)C=CC1=O QQBCAPJSHSNYLE-UHFFFAOYSA-N 0.000 description 1
- 229920003026 Acene Polymers 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- POJWUDADGALRAB-PVQJCKRUSA-N Allantoin Natural products NC(=O)N[C@@H]1NC(=O)NC1=O POJWUDADGALRAB-PVQJCKRUSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- DXEYRGUREJDKKM-UHFFFAOYSA-N C1(=CC=CC=C1)[I+]C1=CC=CC=C1.FC1=C(C(=C(C(=C1F)F)F)F)[B+2] Chemical compound C1(=CC=CC=C1)[I+]C1=CC=CC=C1.FC1=C(C(=C(C(=C1F)F)F)F)[B+2] DXEYRGUREJDKKM-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- WJJMNDUMQPNECX-UHFFFAOYSA-N Dipicolinic acid Natural products OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 description 1
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical compound [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004262 Ethyl gallate Substances 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- ZSBDPRIWBYHIAF-UHFFFAOYSA-N N-acetyl-acetamide Natural products CC(=O)NC(C)=O ZSBDPRIWBYHIAF-UHFFFAOYSA-N 0.000 description 1
- VIHYIVKEECZGOU-UHFFFAOYSA-N N-acetylimidazole Chemical compound CC(=O)N1C=CN=C1 VIHYIVKEECZGOU-UHFFFAOYSA-N 0.000 description 1
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical compound CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- RTSNVAJPNOPZED-UHFFFAOYSA-N OC(=O)C1=C(O)C(=O)C=CC1=O Chemical compound OC(=O)C1=C(O)C(=O)C=CC1=O RTSNVAJPNOPZED-UHFFFAOYSA-N 0.000 description 1
- YIKSCQDJHCMVMK-UHFFFAOYSA-N Oxamide Chemical compound NC(=O)C(N)=O YIKSCQDJHCMVMK-UHFFFAOYSA-N 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920000280 Poly(3-octylthiophene) Polymers 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920003006 Polybutadiene acrylonitrile Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002556 Polyethylene Glycol 300 Polymers 0.000 description 1
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 description 1
- 229920002582 Polyethylene Glycol 600 Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- GVCGDKFSWFCOCR-UHFFFAOYSA-N S(CC(=O)O)CC(=O)O.S(CC(=O)O)CC(=O)O.O(CCCC(=O)O)CCCC(=O)O Chemical compound S(CC(=O)O)CC(=O)O.S(CC(=O)O)CC(=O)O.O(CCCC(=O)O)CCCC(=O)O GVCGDKFSWFCOCR-UHFFFAOYSA-N 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- ISAKRJDGNUQOIC-UHFFFAOYSA-N Uracil Chemical compound O=C1C=CNC(=O)N1 ISAKRJDGNUQOIC-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- DFPAKSUCGFBDDF-ZQBYOMGUSA-N [14c]-nicotinamide Chemical compound N[14C](=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-ZQBYOMGUSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- RUDUCNPHDIMQCY-UHFFFAOYSA-N [3-(2-sulfanylacetyl)oxy-2,2-bis[(2-sulfanylacetyl)oxymethyl]propyl] 2-sulfanylacetate Chemical compound SCC(=O)OCC(COC(=O)CS)(COC(=O)CS)COC(=O)CS RUDUCNPHDIMQCY-UHFFFAOYSA-N 0.000 description 1
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- WWFMINHWJYHXHF-UHFFFAOYSA-N [6-(hydroxymethyl)pyridin-2-yl]methanol Chemical compound OCC1=CC=CC(CO)=N1 WWFMINHWJYHXHF-UHFFFAOYSA-N 0.000 description 1
- GCPWJFKTWGFEHH-UHFFFAOYSA-N acetoacetamide Chemical compound CC(=O)CC(N)=O GCPWJFKTWGFEHH-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229960000458 allantoin Drugs 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- AHKDJQYHVWSRLT-UHFFFAOYSA-N anthragallol Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=C(O)C(O)=C2O AHKDJQYHVWSRLT-UHFFFAOYSA-N 0.000 description 1
- 229940053198 antiepileptics succinimide derivative Drugs 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- HNYOPLTXPVRDBG-UHFFFAOYSA-N barbituric acid Chemical compound O=C1CC(=O)NC(=O)N1 HNYOPLTXPVRDBG-UHFFFAOYSA-N 0.000 description 1
- JPYQFYIEOUVJDU-UHFFFAOYSA-N beclamide Chemical compound ClCCC(=O)NCC1=CC=CC=C1 JPYQFYIEOUVJDU-UHFFFAOYSA-N 0.000 description 1
- CIZVQWNPBGYCGK-UHFFFAOYSA-N benzenediazonium Chemical class N#[N+]C1=CC=CC=C1 CIZVQWNPBGYCGK-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229940114055 beta-resorcylic acid Drugs 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- DNSISZSEWVHGLH-UHFFFAOYSA-N butanamide Chemical compound CCCC(N)=O DNSISZSEWVHGLH-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- SNCZNSNPXMPCGN-UHFFFAOYSA-N butanediamide Chemical compound NC(=O)CCC(N)=O SNCZNSNPXMPCGN-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- YFNONBGXNFCTMM-UHFFFAOYSA-N butoxybenzene Chemical group CCCCOC1=CC=CC=C1 YFNONBGXNFCTMM-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CNWSQCLBDWYLAN-UHFFFAOYSA-N butylurea Chemical compound CCCCNC(N)=O CNWSQCLBDWYLAN-UHFFFAOYSA-N 0.000 description 1
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical compound NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- PMSVVUSIPKHUMT-UHFFFAOYSA-N cyanopyrazine Chemical compound N#CC1=CN=CC=N1 PMSVVUSIPKHUMT-UHFFFAOYSA-N 0.000 description 1
- 150000003950 cyclic amides Chemical class 0.000 description 1
- 150000001923 cyclic compounds Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-O diazynium Chemical compound [NH+]#N IJGRMHOSHXDMSA-UHFFFAOYSA-O 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- CUIWFAXEALIQJS-UHFFFAOYSA-N dimethyl 1h-imidazole-4,5-dicarboxylate Chemical compound COC(=O)C=1N=CNC=1C(=O)OC CUIWFAXEALIQJS-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000012990 dithiocarbamate Substances 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012799 electrically-conductive coating Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000005678 ethenylene group Chemical class [H]C([*:1])=C([H])[*:2] 0.000 description 1
- SYGAXBISYRORDR-UHFFFAOYSA-N ethyl 2-(hydroxymethyl)prop-2-enoate Chemical compound CCOC(=O)C(=C)CO SYGAXBISYRORDR-UHFFFAOYSA-N 0.000 description 1
- YYNSXKLGLKOLQZ-UHFFFAOYSA-N ethyl 6-oxo-1h-pyridine-3-carboxylate Chemical compound CCOC(=O)C1=CC=C(O)N=C1 YYNSXKLGLKOLQZ-UHFFFAOYSA-N 0.000 description 1
- 235000019277 ethyl gallate Nutrition 0.000 description 1
- 229960004979 fampridine Drugs 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- ZTOMUSMDRMJOTH-UHFFFAOYSA-N glutaronitrile Chemical compound N#CCCCC#N ZTOMUSMDRMJOTH-UHFFFAOYSA-N 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 229960005150 glycerol Drugs 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- AMANDCZTVNQSNB-UHFFFAOYSA-N glyoxamide Chemical compound NC(=O)C=O AMANDCZTVNQSNB-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 description 1
- 229910000360 iron(III) sulfate Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- WFKAJVHLWXSISD-UHFFFAOYSA-N isobutyramide Chemical compound CC(C)C(N)=O WFKAJVHLWXSISD-UHFFFAOYSA-N 0.000 description 1
- LVPMIMZXDYBCDF-UHFFFAOYSA-N isocinchomeronic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)N=C1 LVPMIMZXDYBCDF-UHFFFAOYSA-N 0.000 description 1
- VFQXVTODMYMSMJ-UHFFFAOYSA-N isonicotinamide Chemical compound NC(=O)C1=CC=NC=C1 VFQXVTODMYMSMJ-UHFFFAOYSA-N 0.000 description 1
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical compound NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- SXQFCVDSOLSHOQ-UHFFFAOYSA-N lactamide Chemical compound CC(O)C(N)=O SXQFCVDSOLSHOQ-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- MJIVRKPEXXHNJT-UHFFFAOYSA-N lutidinic acid Chemical compound OC(=O)C1=CC=NC(C(O)=O)=C1 MJIVRKPEXXHNJT-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WRIRWRKPLXCTFD-UHFFFAOYSA-N malonamide Chemical compound NC(=O)CC(N)=O WRIRWRKPLXCTFD-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- JTVVPKLHKMKWNN-UHFFFAOYSA-N methyl 6-oxo-1h-pyridine-3-carboxylate Chemical compound COC(=O)C=1C=CC(=O)NC=1 JTVVPKLHKMKWNN-UHFFFAOYSA-N 0.000 description 1
- IBKQQKPQRYUGBJ-UHFFFAOYSA-N methyl gallate Natural products CC(=O)C1=CC(O)=C(O)C(O)=C1 IBKQQKPQRYUGBJ-UHFFFAOYSA-N 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- WFKDPJRCBCBQNT-UHFFFAOYSA-N n,2-dimethylprop-2-enamide Chemical compound CNC(=O)C(C)=C WFKDPJRCBCBQNT-UHFFFAOYSA-N 0.000 description 1
- FTWUXYZHDFCGSV-UHFFFAOYSA-N n,n'-diphenyloxamide Chemical compound C=1C=CC=CC=1NC(=O)C(=O)NC1=CC=CC=C1 FTWUXYZHDFCGSV-UHFFFAOYSA-N 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- QRWZCJXEAOZAAW-UHFFFAOYSA-N n,n,2-trimethylprop-2-enamide Chemical compound CN(C)C(=O)C(C)=C QRWZCJXEAOZAAW-UHFFFAOYSA-N 0.000 description 1
- FQTCUKQMGGJRCU-UHFFFAOYSA-N n,n-diacetylacetamide Chemical compound CC(=O)N(C(C)=O)C(C)=O FQTCUKQMGGJRCU-UHFFFAOYSA-N 0.000 description 1
- UVUKMPQRNIREDM-UHFFFAOYSA-N n,n-dibenzoylbenzamide Chemical compound C=1C=CC=CC=1C(=O)N(C(=O)C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 UVUKMPQRNIREDM-UHFFFAOYSA-N 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- UUORTJUPDJJXST-UHFFFAOYSA-N n-(2-hydroxyethyl)prop-2-enamide Chemical compound OCCNC(=O)C=C UUORTJUPDJJXST-UHFFFAOYSA-N 0.000 description 1
- WHHNLMUJCMLDKT-UHFFFAOYSA-N n-(cyclohexylmethyl)-1,3-thiazol-2-amine Chemical compound C1CCCCC1CNC1=NC=CS1 WHHNLMUJCMLDKT-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- ZHDORMMHAKXTPT-UHFFFAOYSA-N n-benzoylbenzamide Chemical compound C=1C=CC=CC=1C(=O)NC(=O)C1=CC=CC=C1 ZHDORMMHAKXTPT-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- RQAKESSLMFZVMC-UHFFFAOYSA-N n-ethenylacetamide Chemical compound CC(=O)NC=C RQAKESSLMFZVMC-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- ZIWDVJPPVMGJGR-UHFFFAOYSA-N n-ethyl-2-methylprop-2-enamide Chemical compound CCNC(=O)C(C)=C ZIWDVJPPVMGJGR-UHFFFAOYSA-N 0.000 description 1
- SWPMNMYLORDLJE-UHFFFAOYSA-N n-ethylprop-2-enamide Chemical compound CCNC(=O)C=C SWPMNMYLORDLJE-UHFFFAOYSA-N 0.000 description 1
- ZUSSTQCWRDLYJA-UHFFFAOYSA-N n-hydroxy-5-norbornene-2,3-dicarboximide Chemical compound C1=CC2CC1C1C2C(=O)N(O)C1=O ZUSSTQCWRDLYJA-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- RMHJJUOPOWPRBP-UHFFFAOYSA-N naphthalene-1-carboxamide Chemical compound C1=CC=C2C(C(=O)N)=CC=CC2=C1 RMHJJUOPOWPRBP-UHFFFAOYSA-N 0.000 description 1
- JRNGUTKWMSBIBF-UHFFFAOYSA-N naphthalene-2,3-diol Chemical compound C1=CC=C2C=C(O)C(O)=CC2=C1 JRNGUTKWMSBIBF-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- SBOJXQVPLKSXOG-UHFFFAOYSA-N o-amino-hydroxylamine Chemical compound NON SBOJXQVPLKSXOG-UHFFFAOYSA-N 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- ZDTGPTLEGLEQAT-UHFFFAOYSA-N octane pyrrole-2,5-dione Chemical compound CCCCCCCC.C1(C=CC(N1)=O)=O ZDTGPTLEGLEQAT-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- FATBGEAMYMYZAF-UHFFFAOYSA-N oleicacidamide-heptaglycolether Natural products CCCCCCCCC=CCCCCCCCC(N)=O FATBGEAMYMYZAF-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- KLAKIAVEMQMVBT-UHFFFAOYSA-N p-hydroxy-phenacyl alcohol Natural products OCC(=O)C1=CC=C(O)C=C1 KLAKIAVEMQMVBT-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- RCCYSVYHULFYHE-UHFFFAOYSA-N pentanediamide Chemical compound NC(=O)CCCC(N)=O RCCYSVYHULFYHE-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- XDUXGEPGVNWEBQ-UHFFFAOYSA-N phenyl 1,4-dihydroxynaphthalene-2-carboxylate Chemical compound OC=1C2=CC=CC=C2C(O)=CC=1C(=O)OC1=CC=CC=C1 XDUXGEPGVNWEBQ-UHFFFAOYSA-N 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- CCDXIADKBDSBJU-UHFFFAOYSA-N phenylmethanetriol Chemical compound OC(O)(O)C1=CC=CC=C1 CCDXIADKBDSBJU-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- NAYYNDKKHOIIOD-UHFFFAOYSA-N phthalamide Chemical compound NC(=O)C1=CC=CC=C1C(N)=O NAYYNDKKHOIIOD-UHFFFAOYSA-N 0.000 description 1
- KNCYXPMJDCCGSJ-UHFFFAOYSA-N piperidine-2,6-dione Chemical compound O=C1CCCC(=O)N1 KNCYXPMJDCCGSJ-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002849 poly(3-ethoxythiophene) polymer Polymers 0.000 description 1
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 1
- 229920002850 poly(3-methoxythiophene) polymer Polymers 0.000 description 1
- 229920005586 poly(adipic acid) Polymers 0.000 description 1
- 229920000962 poly(amidoamine) Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- VKDSBABHIXQFKH-UHFFFAOYSA-M potassium;4-hydroxy-3-sulfophenolate Chemical compound [K+].OC1=CC=C(O)C(S([O-])(=O)=O)=C1 VKDSBABHIXQFKH-UHFFFAOYSA-M 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 1
- 229940080818 propionamide Drugs 0.000 description 1
- FVSKHRXBFJPNKK-UHFFFAOYSA-N propionitrile Chemical compound CCC#N FVSKHRXBFJPNKK-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- XFTQRUTUGRCSGO-UHFFFAOYSA-N pyrazin-2-amine Chemical compound NC1=CN=CC=N1 XFTQRUTUGRCSGO-UHFFFAOYSA-N 0.000 description 1
- ZUCRGHABDDWQPY-UHFFFAOYSA-N pyrazine-2,3-dicarboxylic acid Chemical compound OC(=O)C1=NC=CN=C1C(O)=O ZUCRGHABDDWQPY-UHFFFAOYSA-N 0.000 description 1
- NIPZZXUFJPQHNH-UHFFFAOYSA-N pyrazine-2-carboxylic acid Chemical compound OC(=O)C1=CN=CC=N1 NIPZZXUFJPQHNH-UHFFFAOYSA-N 0.000 description 1
- IPEHBUMCGVEMRF-UHFFFAOYSA-N pyrazinecarboxamide Chemical compound NC(=O)C1=CN=CC=N1 IPEHBUMCGVEMRF-UHFFFAOYSA-N 0.000 description 1
- ZZYXNRREDYWPLN-UHFFFAOYSA-N pyridine-2,3-diamine Chemical compound NC1=CC=CN=C1N ZZYXNRREDYWPLN-UHFFFAOYSA-N 0.000 description 1
- VHNQIURBCCNWDN-UHFFFAOYSA-N pyridine-2,6-diamine Chemical compound NC1=CC=CC(N)=N1 VHNQIURBCCNWDN-UHFFFAOYSA-N 0.000 description 1
- WLFXSECCHULRRO-UHFFFAOYSA-N pyridine-2,6-diol Chemical compound OC1=CC=CC(O)=N1 WLFXSECCHULRRO-UHFFFAOYSA-N 0.000 description 1
- DVECLMOWYVDJRM-UHFFFAOYSA-N pyridine-3-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CN=C1 DVECLMOWYVDJRM-UHFFFAOYSA-N 0.000 description 1
- BGUWFUQJCDRPTL-UHFFFAOYSA-N pyridine-4-carbaldehyde Chemical compound O=CC1=CC=NC=C1 BGUWFUQJCDRPTL-UHFFFAOYSA-N 0.000 description 1
- LJXQPZWIHJMPQQ-UHFFFAOYSA-N pyrimidin-2-amine Chemical compound NC1=NC=CC=N1 LJXQPZWIHJMPQQ-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- DOYOPBSXEIZLRE-UHFFFAOYSA-N pyrrole-3-carboxylic acid Chemical compound OC(=O)C=1C=CNC=1 DOYOPBSXEIZLRE-UHFFFAOYSA-N 0.000 description 1
- FPOLWERNILTNDK-UHFFFAOYSA-N pyruvamide Chemical compound CC(=O)C(N)=O FPOLWERNILTNDK-UHFFFAOYSA-N 0.000 description 1
- LISFMEBWQUVKPJ-UHFFFAOYSA-N quinolin-2-ol Chemical compound C1=CC=C2NC(=O)C=CC2=C1 LISFMEBWQUVKPJ-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- KIWUVOGUEXMXSV-UHFFFAOYSA-N rhodanine Chemical compound O=C1CSC(=S)N1 KIWUVOGUEXMXSV-UHFFFAOYSA-N 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- DUIOPKIIICUYRZ-UHFFFAOYSA-N semicarbazide Chemical compound NNC(N)=O DUIOPKIIICUYRZ-UHFFFAOYSA-N 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- ADXGNEYLLLSOAR-UHFFFAOYSA-N tasosartan Chemical compound C12=NC(C)=NC(C)=C2CCC(=O)N1CC(C=C1)=CC=C1C1=CC=CC=C1C=1N=NNN=1 ADXGNEYLLLSOAR-UHFFFAOYSA-N 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- IDYFACFOJYNFAX-UHFFFAOYSA-J tetrafluoroantimony Chemical compound F[Sb](F)(F)F IDYFACFOJYNFAX-UHFFFAOYSA-J 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
- HERSKCAGZCXYMC-UHFFFAOYSA-N thiophen-3-ol Chemical compound OC=1C=CSC=1 HERSKCAGZCXYMC-UHFFFAOYSA-N 0.000 description 1
- GSXCEVHRIVLFJV-UHFFFAOYSA-N thiophene-3-carbonitrile Chemical compound N#CC=1C=CSC=1 GSXCEVHRIVLFJV-UHFFFAOYSA-N 0.000 description 1
- YNVOMSDITJMNET-UHFFFAOYSA-N thiophene-3-carboxylic acid Chemical compound OC(=O)C=1C=CSC=1 YNVOMSDITJMNET-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 150000008648 triflates Chemical class 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical class C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- ZXYAAVBXHKCJJB-UHFFFAOYSA-N uracil-5-carboxylic acid Chemical compound OC(=O)C1=CNC(=O)NC1=O ZXYAAVBXHKCJJB-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000011782 vitamin Substances 0.000 description 1
- 229940088594 vitamin Drugs 0.000 description 1
- 229930003231 vitamin Natural products 0.000 description 1
- 235000013343 vitamin Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
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- Manufacturing Of Electric Cables (AREA)
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Description
本発明は、透明電極等に用いることができる透明導電体及びその製造方法、透明導電体を備える入力デバイスに関する。 The present invention relates to a transparent conductor that can be used for a transparent electrode and the like, a manufacturing method thereof, and an input device including the transparent conductor.
デジタルカメラ、携帯電話機、カムコーダ、PDA(Personal Digital Assistants)、電子ペーパー等の電子機器には、入力装置が備え付けられ、入力装置としては、例えば、キーボード、JOGダイヤル等の入力手段、タッチパネルなどが使用されている。
タッチパネルとしては、静電容量方式や抵抗膜方式が一般に広く使用されている。
静電容量方式のタッチパネルでは、入力操作面下に静電容量シートが設けられ、入力操作面において、指を触れた入力位置を検出して、指を触れた状態と、指で触れていない状態(非接触)とを判別するようになっている。
抵抗膜方式のタッチパネルでは、入力操作面下に抵抗調整膜が設けられ、入力操作面において、指を触れた入力位置を検出して、指を触れた状態と、指で触れていない状態(非接触)とを判別するようになっている。
通常、静電容量シートおよび抵抗調整膜には導電膜が用いられている。導電膜としては、インジウムスズ酸化物(ITO)、アンチモンスズ酸化物(ATO)、亜鉛酸化物(ZnO)等の透明導電性酸化物(TCO)の膜が多く使用されていた。
Electronic devices such as digital cameras, mobile phones, camcorders, PDAs (Personal Digital Assistants), and electronic papers are equipped with input devices, such as keyboards, input means such as JOG dials, and touch panels. Has been.
As a touch panel, a capacitance method and a resistance film method are generally widely used.
In the capacitive touch panel, a capacitance sheet is provided under the input operation surface, and the input position where the finger is touched is detected on the input operation surface, and the finger is touched and the finger is not touched. (Non-contact) is discriminated.
In the resistive touch panel, a resistance adjustment film is provided under the input operation surface. The input position on the input operation surface is detected by touching the finger, and the finger is touched and the finger is not touched (not touched). Contact).
Usually, a conductive film is used for the capacitance sheet and the resistance adjustment film. As the conductive film, transparent conductive oxide (TCO) films such as indium tin oxide (ITO), antimony tin oxide (ATO), and zinc oxide (ZnO) have been used in many cases.
ところで、静電容量方式のタッチパネルに使用される静電容量シートにおいては、表1に示すように、他の用途に比べて高い表面抵抗を必要とする。 By the way, in the electrostatic capacitance sheet used for the capacitive touch panel, as shown in Table 1, a higher surface resistance is required than in other applications.
そのため、TCO膜を静電容量シートに使用する場合には、表面抵抗を増加させるために、TCOの膜を薄くしていた。ITO膜において表面抵抗を20Ωにする場合にも、厚さを約500nmにしなければならず、350〜400Ωにするためには、約35〜30nmの厚さにする必要がある。したがって、1000Ω以上の表面抵抗を得るためには、さらに薄くしなければならないが、一般に、膜を薄くすると、均一性、耐久性(耐水性、耐エタノール性、耐傷付き性)および物理的連続性が低下する傾向にある。
ATOは、ITOよりも厚い膜厚で高い表面抵抗値を得ることができる。例えば25〜30nmの厚さのATO膜の表面抵抗は約2000Ωである。しかしながら、ATO膜はITO膜に比べて透明性が低いという問題を有していた。
このようなことから、耐久性(耐水性、耐エタノール性、耐傷付き性)、導電性、透明性に優れた導電膜が求められていた。さらに、導電膜は、ガラスやプラスチックス等の透明基体に対する密着性にも優れることが要求されていた。
それら要求に対し、特許文献1では、π共役系導電性高分子と水溶性エポキシモノマーを含む導電性塗料を用いて導電膜を形成することが提案されている。
Therefore, when the TCO film is used for the capacitance sheet, the TCO film is made thin in order to increase the surface resistance. Even when the surface resistance of the ITO film is 20Ω, the thickness must be about 500 nm, and in order to be 350-400Ω, the thickness needs to be about 35-30 nm. Therefore, in order to obtain a surface resistance of 1000Ω or more, it must be further reduced, but in general, when the film is made thinner, uniformity, durability (water resistance, ethanol resistance, scratch resistance) and physical continuity are obtained. Tend to decrease.
ATO can obtain a higher surface resistance value with a film thickness thicker than that of ITO. For example, the surface resistance of an ATO film having a thickness of 25 to 30 nm is about 2000Ω. However, the ATO film has a problem that it is less transparent than the ITO film.
For these reasons, a conductive film excellent in durability (water resistance, ethanol resistance, scratch resistance), conductivity, and transparency has been demanded. Furthermore, the conductive film is required to have excellent adhesion to a transparent substrate such as glass or plastics.
In response to these requirements, Patent Document 1 proposes forming a conductive film using a conductive paint containing a π-conjugated conductive polymer and a water-soluble epoxy monomer.
しかしながら、特許文献1に記載の導電膜は耐水性に優れるものの、耐エタノール性が充分ではなかった。また、導電膜の耐傷付き性が低いため、タッチパネル製造工程等で表面に傷が付き、製品率を大幅に低減させる要因となっていた。
本発明は、上記課題を鑑みてなされたものであり、耐久性(耐水性、耐エタノール性、耐傷付き性)、導電性、透明性に優れ、透明基体に対する密着性にも優れた導電膜を有する透明導電体及びその製造方法を提供することを目的とする。また、このような透明導電体を備えた入力デバイスを提供することを目的とする。
However, although the electrically conductive film described in Patent Document 1 is excellent in water resistance, ethanol resistance is not sufficient. Moreover, since the scratch resistance of the conductive film is low, the surface is scratched in the touch panel manufacturing process and the like, which has been a factor of greatly reducing the product rate.
The present invention has been made in view of the above problems, and provides a conductive film that is excellent in durability (water resistance, ethanol resistance, scratch resistance), conductivity, transparency, and adhesion to a transparent substrate. It is an object to provide a transparent conductor having the same and a method for producing the same. Moreover, it aims at providing the input device provided with such a transparent conductor.
本発明は、以下構成を有する。
[1]透明基体と、該透明基体の少なくとも片面に設けられた導電膜とを有し、前記導電膜が、π共役系導電性高分子とポリアニオンとエポキシ化合物の少なくとも一部の水素原子がフッ素原子に置換された下記一般式で表されるフッ素含有エポキシ化合物とを含有する導電性組成物の硬化体からなることを特徴とする透明導電体。
Gu−(OCH 2 ) p −{X}−(CH 2 O) p −Gu
(Guはグリシジル基を表す。Xは(CF 2 ) l 及び(CF 2 −O−CF 2 ) m の少なくとも一方である。pは0〜1、lは1〜8、mは1〜8である。)
[2]フッ素含有エポキシ化合物は、エポキシ基を2つ有すると共にエーテル結合を有する直鎖状化合物であることを特徴とする[1]に記載の透明導電体。
[3]導電性組成物が、オキセタン化合物及び前記フッ素含有エポキシ化合物以外のエポキシ化合物の一方または両方を含有することを特徴とする[1]または[2]に記載の透明導電体。
[4]透明基体の少なくとも片面に、π共役系導電性高分子と、ポリアニオンと、エポキシ化合物の少なくとも一部の水素原子がフッ素原子に置換された下記一般式で表されるフッ素含有エポキシ化合物と、溶剤とを含有する導電性塗料を塗布し、硬化することを特徴とする透明導電体の製造方法。
Gu−(OCH 2 ) p −{X}−(CH 2 O) p −Gu
(Guはグリシジル基を表す。Xは(CF 2 ) l 及び(CF 2 −O−CF 2 ) m の少なくとも一方である。pは0〜1、lは1〜8、mは1〜8である。)
[5]フッ素含有エポキシ化合物として、エポキシ基を2つ有すると共にエーテル結合を有する直鎖状化合物を用いることを特徴とする[4]に記載の透明導電体の製造方法。
[6]導電性塗料が、オキセタン化合物及び前記フッ素含有エポキシ化合物以外のエポキシ化合物の一方または両方を含有することを特徴とする[4]または[5]に記載の透明導電体の製造方法。
[7][1]〜[3]のいずれかに記載の透明導電体を備えることを特徴とする入力デバイス。
The present invention has the following configuration.
[1] A transparent substrate, and a conductive film provided on at least one surface of the transparent substrate, wherein the conductive film is a fluorine-containing conductive polymer, a polyanion, and at least part of hydrogen atoms of the epoxy compound is fluorine. A transparent conductor comprising a cured product of a conductive composition containing a fluorine-containing epoxy compound represented by the following general formula substituted with an atom.
Gu- (OCH 2) p - { X} - (CH 2 O) p -Gu
(Gu represents a glycidyl group. X is at least one of (CF 2 ) l and (CF 2 —O—CF 2 ) m. P is 0 to 1, l is 1 to 8, m is 1 to 8. is there.)
[2] The transparent conductor according to [1], wherein the fluorine-containing epoxy compound is a linear compound having two epoxy groups and an ether bond.
[3] The transparent conductor according to [1] or [2], wherein the conductive composition contains one or both of an oxetane compound and an epoxy compound other than the fluorine-containing epoxy compound .
[4] A fluorine-containing epoxy compound represented by the following general formula in which at least one surface of the transparent substrate is substituted with a π-conjugated conductive polymer, a polyanion, and at least a part of hydrogen atoms of the epoxy compound are substituted with fluorine atoms; A method for producing a transparent conductor, wherein a conductive paint containing a solvent is applied and cured.
Gu- (OCH 2) p - { X} - (CH 2 O) p -Gu
(Gu represents a glycidyl group. X is at least one of (CF 2 ) l and (CF 2 —O—CF 2 ) m. P is 0 to 1, l is 1 to 8, m is 1 to 8. is there.)
[5] The method for producing a transparent conductor according to [4], wherein the fluorine-containing epoxy compound is a linear compound having two epoxy groups and an ether bond.
[6] The method for producing a transparent conductor according to [4] or [5], wherein the conductive paint contains one or both of an oxetane compound and an epoxy compound other than the fluorine-containing epoxy compound .
[7] An input device comprising the transparent conductor according to any one of [1] to [3].
本発明の透明導電体は、耐久性(耐水性、耐エタノール性、耐傷付き性)、導電性、透明性に優れ、透明基体に対する密着性にも優れる導電膜を有する。
本発明の透明導電体の製造方法によれば、耐久性、導電性、透明性に優れ、透明基体に対する密着性にも優れた導電膜を有する透明導電体を製造できる。
本発明の入力デバイスは、耐久性、導電性、透明性に優れ、透明基体に対する密着性にも優れる導電膜を有するものである。
The transparent conductor of the present invention has a conductive film that is excellent in durability (water resistance, ethanol resistance, scratch resistance), conductivity, transparency, and adhesion to a transparent substrate.
According to the method for producing a transparent conductor of the present invention, it is possible to produce a transparent conductor having a conductive film that is excellent in durability, conductivity, and transparency and excellent in adhesion to a transparent substrate.
The input device of the present invention has a conductive film that is excellent in durability, conductivity, and transparency, and also has excellent adhesion to a transparent substrate.
「透明導電体」
本発明の透明導電体は、透明基体と、該透明基体の少なくとも片面に設けられた導電膜とを有する。
"Transparent conductor"
The transparent conductor of the present invention has a transparent substrate and a conductive film provided on at least one surface of the transparent substrate.
<透明基体>
透明基体としては、例えば、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート、ポリエーテルスルホン、ポリエーテルイミド、ポリエーテルエーテルケトン、ポリフェニレンスルフィド、ポリアリレート、ポリイミド、ポリカーボネート、セルローストリアセテート、セルロースアセテートプロピオネートなどのフィルムまたはシートが挙げられる。また、ガラスなども使用できる。
<Transparent substrate>
Examples of the transparent substrate include polyethylene terephthalate (PET), polyethylene naphthalate, polyethersulfone, polyetherimide, polyetheretherketone, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate. A film or sheet may be mentioned. Moreover, glass etc. can also be used.
<導電膜>
導電膜は、π共役系導電性高分子とポリアニオンとフッ素含有エポキシ化合物とを必須成分として含有し、バインダ、導電性向上剤、添加剤等を任意成分として含有する導電性組成物の硬化体からなる。
<Conductive film>
The conductive film contains a π-conjugated conductive polymer, a polyanion, and a fluorine-containing epoxy compound as essential components, and from a cured product of a conductive composition containing a binder, a conductivity improver, an additive, and the like as optional components. Become.
(π共役系導電性高分子)
π共役系導電性高分子としては、主鎖がπ共役系で構成されている有機高分子であれば特に制限されず、例えば、ポリピロール類、ポリチオフェン類、ポリアセチレン類、ポリフェニレン類、ポリフェニレンビニレン類、ポリアニリン類、ポリアセン類、ポリチオフェンビニレン類、及びこれらの共重合体等が挙げられる。空気中での安定性の点からは、ポリピロール類、ポリチオフェン類及びポリアニリン類が好ましい。極性溶剤との相溶性及び透明性の面から、ポリチオフェン系がより好ましい。
(Π-conjugated conductive polymer)
The π-conjugated conductive polymer is not particularly limited as long as the main chain is an organic polymer composed of a π-conjugated system. For example, polypyrroles, polythiophenes, polyacetylenes, polyphenylenes, polyphenylene vinylenes, Examples thereof include polyanilines, polyacenes, polythiophene vinylenes, and copolymers thereof. From the viewpoint of stability in air, polypyrroles, polythiophenes and polyanilines are preferred. From the viewpoint of compatibility with a polar solvent and transparency, a polythiophene system is more preferable.
π共役系導電性高分子の具体例としては、ポリピロール、ポリ(N−メチルピロール)、ポリ(3−メチルピロール)、ポリ(3−エチルピロール)、ポリ(3−n−プロピルピロール)、ポリ(3−ブチルピロール)、ポリ(3−オクチルピロール)、ポリ(3−デシルピロール)、ポリ(3−ドデシルピロール)、ポリ(3,4−ジメチルピロール)、ポリ(3,4−ジブチルピロール)、ポリ(3−カルボキシピロール)、ポリ(3−メチル−4−カルボキシピロール)、ポリ(3−メチル−4−カルボキシエチルピロール)、ポリ(3−メチル−4−カルボキシブチルピロール)、ポリ(3−ヒドロキシピロール)、ポリ(3−メトキシピロール)、ポリ(3−エトキシピロール)、ポリ(3−ブトキシピロール)、ポリ(3−メチル−4−ヘキシルオキシピロール)、ポリ(チオフェン)、ポリ(3−メチルチオフェン)、ポリ(3−エチルチオフェン)、ポリ(3−プロピルチオフェン)、ポリ(3−ブチルチオフェン)、ポリ(3−ヘキシルチオフェン)、ポリ(3−ヘプチルチオフェン)、ポリ(3−オクチルチオフェン)、ポリ(3−デシルチオフェン)、ポリ(3−ドデシルチオフェン)、ポリ(3−オクタデシルチオフェン)、ポリ(3−ブロモチオフェン)、ポリ(3−クロロチオフェン)、ポリ(3−ヨードチオフェン)、ポリ(3−シアノチオフェン)、ポリ(3−フェニルチオフェン)、ポリ(3,4−ジメチルチオフェン)、ポリ(3,4−ジブチルチオフェン)、ポリ(3−ヒドロキシチオフェン)、ポリ(3−メトキシチオフェン)、ポリ(3−エトキシチオフェン)、ポリ(3−ブトキシチオフェン)、ポリ(3−ヘキシルオキシチオフェン)、ポリ(3−ヘプチルオキシチオフェン)、ポリ(3−オクチルオキシチオフェン)、ポリ(3−デシルオキシチオフェン)、ポリ(3−ドデシルオキシチオフェン)、ポリ(3−オクタデシルオキシチオフェン)、ポリ(3−メチル−4−メトキシチオフェン)、ポリ(3,4−エチレンジオキシチオフェン)、ポリ(3−メチル−4−エトキシチオフェン)、ポリ(3−カルボキシチオフェン)、ポリ(3−メチル−4−カルボキシチオフェン)、ポリ(3−メチル−4−カルボキシエチルチオフェン)、ポリ(3−メチル−4−カルボキシブチルチオフェン)、ポリアニリン、ポリ(2−メチルアニリン)、ポリ(3−イソブチルアニリン)、ポリ(2−アニリンスルホン酸)、ポリ(3−アニリンスルホン酸)等が挙げられる。 Specific examples of the π-conjugated conductive polymer include polypyrrole, poly (N-methylpyrrole), poly (3-methylpyrrole), poly (3-ethylpyrrole), poly (3-n-propylpyrrole), poly (3-butylpyrrole), poly (3-octylpyrrole), poly (3-decylpyrrole), poly (3-dodecylpyrrole), poly (3,4-dimethylpyrrole), poly (3,4-dibutylpyrrole) , Poly (3-carboxypyrrole), poly (3-methyl-4-carboxypyrrole), poly (3-methyl-4-carboxyethylpyrrole), poly (3-methyl-4-carboxybutylpyrrole), poly (3 -Hydroxypyrrole), poly (3-methoxypyrrole), poly (3-ethoxypyrrole), poly (3-butoxypyrrole), poly (3-methyl) -4-hexyloxypyrrole), poly (thiophene), poly (3-methylthiophene), poly (3-ethylthiophene), poly (3-propylthiophene), poly (3-butylthiophene), poly (3-hexyl) Thiophene), poly (3-heptylthiophene), poly (3-octylthiophene), poly (3-decylthiophene), poly (3-dodecylthiophene), poly (3-octadecylthiophene), poly (3-bromothiophene) , Poly (3-chlorothiophene), poly (3-iodothiophene), poly (3-cyanothiophene), poly (3-phenylthiophene), poly (3,4-dimethylthiophene), poly (3,4-dibutyl) Thiophene), poly (3-hydroxythiophene), poly (3-methoxythiophene), poly (3 -Ethoxythiophene), poly (3-butoxythiophene), poly (3-hexyloxythiophene), poly (3-heptyloxythiophene), poly (3-octyloxythiophene), poly (3-decyloxythiophene), poly (3-dodecyloxythiophene), poly (3-octadecyloxythiophene), poly (3-methyl-4-methoxythiophene), poly (3,4-ethylenedioxythiophene), poly (3-methyl-4-ethoxy) Thiophene), poly (3-carboxythiophene), poly (3-methyl-4-carboxythiophene), poly (3-methyl-4-carboxyethylthiophene), poly (3-methyl-4-carboxybutylthiophene), polyaniline , Poly (2-methylaniline), poly (3-isobutyla) Phosphorus), poly (2-aniline sulfonic acid), poly (3-aniline sulfonic acid), and the like.
π共役系導電性高分子は無置換のままでも、充分な導電性を得ることができるが、導電性をより高めるためには、アルキル基、カルボキシ基、スルホ基、アルコキシ基、ヒドロキシ基等の官能基をπ共役系導電性高分子に導入してもよい。
上記π共役系導電性高分子の中でも、導電性、透明性、耐熱性の点から、ポリ(3,4−エチレンジオキシチオフェン)が好ましい。
Even if the π-conjugated conductive polymer remains unsubstituted, sufficient conductivity can be obtained. However, in order to further increase the conductivity, an alkyl group, a carboxy group, a sulfo group, an alkoxy group, a hydroxy group, etc. A functional group may be introduced into the π-conjugated conductive polymer.
Among the π-conjugated conductive polymers, poly (3,4-ethylenedioxythiophene) is preferable from the viewpoint of conductivity, transparency, and heat resistance.
(ポリアニオン)
ポリアニオンとしては、例えば、置換若しくは未置換のポリアルキレン、置換若しくは未置換のポリアルケニレン、置換若しくは未置換のポリイミド、置換若しくは未置換のポリアミド、置換若しくは未置換のポリエステルであって、アニオン基を有する構成単位のみからなるポリマー、アニオン基を有する構成単位とアニオン基を有さない構成単位とからなるポリマーが挙げられる。
なお、ポリアニオンはπ共役系導電性高分子に対するドーパントとしても機能する。
(Polyanion)
Examples of the polyanion include a substituted or unsubstituted polyalkylene, a substituted or unsubstituted polyalkenylene, a substituted or unsubstituted polyimide, a substituted or unsubstituted polyamide, and a substituted or unsubstituted polyester having an anionic group. Examples thereof include a polymer composed only of a structural unit, and a polymer composed of a structural unit having an anionic group and a structural unit not having an anionic group.
Note that the polyanion also functions as a dopant for the π-conjugated conductive polymer.
ポリアルキレンとは、主鎖がメチレンの繰り返しで構成されているポリマーである。
ポリアルケニレンとは、主鎖に不飽和二重結合(ビニル基)が1個含まれる構成単位からなる高分子である。
ポリイミドとしては、ピロメリット酸二無水物、ビフェニルテトラカルボン酸二無水物、ベンゾフェノンテトラカルボン酸二無水物、2,2’−[4,4’−ジ(ジカルボキシフェニルオキシ)フェニル]プロパン二無水物等の酸無水物と、オキシジアミン、パラフェニレンジアミン、メタフェニレンジアミン、ベンゾフェノンジアミン等のジアミンとからのポリイミドを例示できる。
ポリアミドとしては、ポリアミド6、ポリアミド6,6、ポリアミド6,10等を例示できる。
ポリエステルとしては、ポリエチレンテレフタレート、ポリブチレンテレフタレート等を例示できる。
A polyalkylene is a polymer whose main chain is composed of repeating methylenes.
Polyalkenylene is a polymer composed of structural units containing one unsaturated double bond (vinyl group) in the main chain.
As polyimide, pyromellitic dianhydride, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, 2,2 ′-[4,4′-di (dicarboxyphenyloxy) phenyl] propane dianhydride And polyimides from acid anhydrides such as oxydiamine, paraphenylenediamine, metaphenylenediamine, benzophenonediamine and the like.
Examples of the polyamide include polyamide 6, polyamide 6,6,
Examples of the polyester include polyethylene terephthalate and polybutylene terephthalate.
上記ポリアニオンが置換基を有する場合、その置換基としては、アルキル基、ヒドロキシ基、アミノ基、カルボキシ基、シアノ基、フェニル基、フェノール基、エステル基、アルコキシ基等が挙げられる。溶剤への溶解性、耐熱性等を考慮すると、アルキル基、ヒドロキシ基、フェノール基、エステル基が好ましい。 When the polyanion has a substituent, examples of the substituent include an alkyl group, a hydroxy group, an amino group, a carboxy group, a cyano group, a phenyl group, a phenol group, an ester group, and an alkoxy group. In view of solubility in a solvent, heat resistance and the like, an alkyl group, a hydroxy group, a phenol group, and an ester group are preferable.
アルキル基としては、例えば、メチル、エチル、プロピル、ブチル、イソブチル、t−ブチル、ペンチル、へキシル、オクチル、デシル、ドデシル等のアルキル基と、シクロプロピル、シクロペンチル及びシクロヘキシル等のシクロアルキル基が挙げられる。
ヒドロキシ基としては、ポリアニオンの主鎖に直接又は他の官能基を介在して結合したヒドロキシ基が挙げられ、他の官能基としては、炭素数1〜7のアルキル基、炭素数2〜7のアルケニル基、アミド基、イミド基などが挙げられる。ヒドロキシ基は、これらの官能基の末端又は中に置換されている。
アミノ基としては、ポリアニオンの主鎖に直接又は他の官能基を介在して結合したアミノ基が挙げられ、他の官能基としては、炭素数1〜7のアルキル基、炭素数2〜7のアルケニル基、アミド基、イミド基などが挙げられる。アミノ基は、これらの官能基の末端又は中に置換されている。
フェノール基としては、ポリアニオンの主鎖に直接又は他の官能基を介在して結合したフェノール基が挙げられ、他の官能基としては、炭素数1〜7のアルキル基、炭素数2〜7のアルケニル基、アミド基、イミド基などが挙げられる。フェノール基は、これらの官能基の末端又は中に置換されている。
Examples of the alkyl group include alkyl groups such as methyl, ethyl, propyl, butyl, isobutyl, t-butyl, pentyl, hexyl, octyl, decyl, and dodecyl, and cycloalkyl groups such as cyclopropyl, cyclopentyl, and cyclohexyl. It is done.
Examples of the hydroxy group include a hydroxy group bonded directly or via another functional group to the main chain of the polyanion. Examples of the other functional group include an alkyl group having 1 to 7 carbon atoms and an alkyl group having 2 to 7 carbon atoms. An alkenyl group, an amide group, an imide group, etc. are mentioned. Hydroxy groups are substituted at the ends or in these functional groups.
Examples of the amino group include an amino group bonded to the main chain of the polyanion directly or via another functional group. Examples of the other functional group include an alkyl group having 1 to 7 carbon atoms and an alkyl group having 2 to 7 carbon atoms. An alkenyl group, an amide group, an imide group, etc. are mentioned. The amino group is substituted at the end or in these functional groups.
Examples of the phenol group include a phenol group bonded directly or via another functional group to the main chain of the polyanion. Examples of the other functional group include an alkyl group having 1 to 7 carbon atoms and an alkyl group having 2 to 7 carbon atoms. An alkenyl group, an amide group, an imide group, etc. are mentioned. The phenol group is substituted at the end or in these functional groups.
置換基を有するポリアルキレンの例としては、ポリエチレン、ポリプロピレン、ポリブテン、ポリペンテン、ポリヘキセン、ポリビニルアルコール、ポリビニルフェノール、ポリアクリロニトリル、ポリアクリレート、ポリスチレン等を例示できる。
ポリアルケニレンの具体例としては、プロペニレン、1−メチルプロペニレン、1−ブチルプロペニレン、1−デシルプロペニレン、1−シアノプロペニレン、1−フェニルプロペニレン、1−ヒドロキシプロペニレン、1−ブテニレン、1−メチル−1−ブテニレン、1−エチル−1−ブテニレン、1−オクチル−1−ブテニレン、1−ペンタデシル−1−ブテニレン、2−メチル−1−ブテニレン、2−エチル−1−ブテニレン、2−ブチル−1−ブテニレン、2−ヘキシル−1−ブテニレン、2−オクチル−1−ブテニレン、2−デシル−1−ブテニレン、2−ドデシル−1−ブテニレン、2−フェニル−1−ブテニレン、2−ブテニレン、1−メチル−2−ブテニレン、1−エチル−2−ブテニレン、1−オクチル−2−ブテニレン、1−ペンタデシル−2−ブテニレン、2−メチル−2−ブテニレン、2−エチル−2−ブテニレン、2−ブチル−2−ブテニレン、2−ヘキシル−2−ブテニレン、2−オクチル−2−ブテニレン、2−デシル−2−ブテニレン、2−ドデシル−2−ブテニレン、2−フェニル−2−ブテニレン、2−プロピレンフェニル−2−ブテニレン、3−メチル−2−ブテニレン、3−エチル−2−ブテニレン、3−ブチル−2−ブテニレン、3−ヘキシル−2−ブテニレン、3−オクチル−2−ブテニレン、3−デシル−2−ブテニレン、3−ドデシル−2−ブテニレン、3−フェニル−2−ブテニレン、3−プロピレンフェニル−2−ブテニレン、2−ペンテニレン、4−プロピル−2−ペンテニレン、4−プロピル−2−ペンテニレン、4−ブチル−2−ペンテニレン、4−ヘキシル−2−ペンテニレン、4−シアノ−2−ペンテニレン、3−メチル−2−ペンテニレン、4−エチル−2−ペンテニレン、3−フェニル−2−ペンテニレン、4−ヒドロキシ−2−ペンテニレン、ヘキセニレン等から選ばれる1種以上の構成単位を含む重合体を例示できる。
Examples of the polyalkylene having a substituent include polyethylene, polypropylene, polybutene, polypentene, polyhexene, polyvinyl alcohol, polyvinylphenol, polyacrylonitrile, polyacrylate, polystyrene and the like.
Specific examples of polyalkenylene include propenylene, 1-methylpropenylene, 1-butylpropenylene, 1-decylpropenylene, 1-cyanopropenylene, 1-phenylpropenylene, 1-hydroxypropenylene, 1-butenylene, 1-methyl-1-butenylene, 1-ethyl-1-butenylene, 1-octyl-1-butenylene, 1-pentadecyl-1-butenylene, 2-methyl-1-butenylene, 2-ethyl-1-butenylene, 2- Butyl-1-butenylene, 2-hexyl-1-butenylene, 2-octyl-1-butenylene, 2-decyl-1-butenylene, 2-dodecyl-1-butenylene, 2-phenyl-1-butenylene, 2-butenylene, 1-methyl-2-butenylene, 1-ethyl-2-butenylene, 1-octyl-2-butenylene 1-pentadecyl-2-butenylene, 2-methyl-2-butenylene, 2-ethyl-2-butenylene, 2-butyl-2-butenylene, 2-hexyl-2-butenylene, 2-octyl-2-butenylene, 2- Decyl-2-butenylene, 2-dodecyl-2-butenylene, 2-phenyl-2-butenylene, 2-propylenephenyl-2-butenylene, 3-methyl-2-butenylene, 3-ethyl-2-butenylene, 3-butyl 2-butenylene, 3-hexyl-2-butenylene, 3-octyl-2-butenylene, 3-decyl-2-butenylene, 3-dodecyl-2-butenylene, 3-phenyl-2-butenylene, 3-propylenephenyl- 2-butenylene, 2-pentenylene, 4-propyl-2-pentenylene, 4-propyl-2-pentenylene, 4- Tyl-2-pentenylene, 4-hexyl-2-pentenylene, 4-cyano-2-pentenylene, 3-methyl-2-pentenylene, 4-ethyl-2-pentenylene, 3-phenyl-2-pentenylene, 4-hydroxy- Examples thereof include polymers containing one or more structural units selected from 2-pentenylene, hexenylene and the like.
ポリアニオンのアニオン基としては、−O−SO3 −X+、−SO3 −X+、−COO−X+(各式においてX+は水素イオン、アルカリ金属イオンを表す。)が挙げられる。
すなわち、ポリアニオンは、スルホ基及び/又はカルボキシ基を含有する高分子酸である。これらの中でも、π共役系導電性高分子へのドーピング効果の点から、−SO3 −X+、−COO−X+が好ましい。
また、このアニオン基は、隣接して又は一定間隔をあけてポリアニオンの主鎖に配置されていることが好ましい。
Examples of the anion group of the polyanion, -O-SO 3 - X + , -SO 3 - X +, -COO - X + (. X + is the hydrogen ion in each of the formulas, represents an alkali metal ion), and the like.
That is, the polyanion is a polymer acid containing a sulfo group and / or a carboxy group. Among these, from the viewpoint of doping effects on the π-conjugated conductive polymer, -SO 3 - X +, -COO - X + are preferable.
Moreover, it is preferable that this anion group is arrange | positioned in the principal chain of a polyanion adjacently or at fixed intervals.
上記ポリアニオンの中でも、溶剤溶解性及び導電性の点から、ポリイソプレンスルホン酸、ポリイソプレンスルホン酸を含む共重合体、ポリスルホエチルメタクリレート、ポリスルホエチルメタクリレートを含む共重合体、ポリ(4−スルホブチルメタクリレート)、ポリ(4−スルホブチルメタクリレート)を含む共重合体、ポリメタリルオキシベンゼンスルホン酸、ポリメタリルオキシベンゼンスルホン酸を含む共重合体、ポリスチレンスルホン酸、ポリスチレンスルホン酸を含む共重合体等が好ましい。 Among the polyanions, polyisoprene sulfonic acid, a copolymer containing polyisoprene sulfonic acid, a polysulfoethyl methacrylate, a copolymer containing polysulfoethyl methacrylate, and poly (4-sulfone) are preferable in view of solvent solubility and conductivity. Butyl methacrylate), copolymers containing poly (4-sulfobutyl methacrylate), polymethallyloxybenzene sulfonic acid, copolymers containing polymethallyloxybenzene sulfonic acid, polystyrene sulfonic acid, copolymer containing polystyrene sulfonic acid A coalescence or the like is preferable.
ポリアニオンの重合度は、モノマー単位が10〜100,000個の範囲であることが好ましく、溶剤溶解性及び導電性の点からは、50〜10,000個の範囲がより好ましい。 The degree of polymerization of the polyanion is preferably in the range of 10 to 100,000 monomer units, and more preferably in the range of 50 to 10,000 from the viewpoint of solvent solubility and conductivity.
ポリアニオンは、π共役系導電性高分子に配位している。そのため、π共役系導電性高分子とポリアニオンとは複合体を形成している。導電性高分子溶液中のπ共役系導電性高分子とポリアニオンの合計の含有量は0.05〜5.0質量%であることが好ましく、0.1〜4.0質量%であることがより好ましい。π共役系導電性高分子とポリアニオンの合計含有量が0.05質量%未満であると、十分な導電性が得られないことがあり、5.0質量%を超えると、均一な導電膜が得られないことがある。 The polyanion is coordinated to the π-conjugated conductive polymer. Therefore, the π-conjugated conductive polymer and the polyanion form a complex. The total content of the π-conjugated conductive polymer and the polyanion in the conductive polymer solution is preferably 0.05 to 5.0% by mass, and preferably 0.1 to 4.0% by mass. More preferred. When the total content of the π-conjugated conductive polymer and the polyanion is less than 0.05% by mass, sufficient conductivity may not be obtained. When the total content exceeds 5.0% by mass, a uniform conductive film is formed. It may not be obtained.
(フッ素含有エポキシ化合物)
フッ素含有エポキシ化合物は、エポキシ化合物の少なくとも一部の水素原子がフッ素原子に置換された化合物である。
フッ素含有エポキシ化合物としては、例えば、下記一般式のものが挙げられる。
Gu−(OCH2)p−{X}−(CH2O)p−Gu
ここで、Guはグリシジル基を表す。また、Xは(CF2)l及び/又は(CF2−O−CF2)mである。また、pは0〜1、lは1〜8、mは1〜8である。
(Fluorine-containing epoxy compound)
The fluorine-containing epoxy compound is a compound in which at least a part of hydrogen atoms of the epoxy compound is substituted with fluorine atoms.
As a fluorine-containing epoxy compound, the thing of the following general formula is mentioned, for example.
Gu- (OCH 2) p - { X} - (CH 2 O) p -Gu
Here, Gu represents a glycidyl group. X is (CF 2 ) 1 and / or (CF 2 —O—CF 2 ) m . P is 0 to 1, l is 1 to 8, and m is 1 to 8.
フッ素含有エポキシ化合物のうち、不飽和結合(炭素−炭素二重結合および三重結合が有り)を含まない飽和エポキシ化合物は、π共役系導電性高分子との相溶性に優れるため好ましい。また、相溶性の面から、直鎖状の飽和エポキシ化合物が好ましい。さらに、相溶性の面から、飽和エポキシ化合物の炭素数が16未満であることが好ましく、炭素数12以下であることがより好ましい。 Of fluorine-containing epoxy compounds, saturated epoxy compounds that do not contain unsaturated bonds (there are carbon-carbon double bonds and triple bonds) are preferable because they are excellent in compatibility with π-conjugated conductive polymers. Moreover, a linear saturated epoxy compound is preferable from the aspect of compatibility. Furthermore, from the viewpoint of compatibility, the saturated epoxy compound preferably has less than 16 carbon atoms, and more preferably has 12 or less carbon atoms.
また、直鎖状のフッ素含有エポキシ化合物としては、塗料の保存安定性がより向上する点から、エポキシ基を2つ有すると共にエーテル結合を有することが好ましい。
エポキシ基を2つ有すると共にエーテル結合を有するエポキシ化合物としては、米国のエクスフロー社より、フッ素化トリエチレングリコールジエポキシド(製品名:C6GDEP)、フッ素化テトラエチレングリコールジエポキシド(製品名:C8GDEP)、1H,1H,4H,4H−パーフルオロ−1,4−ブタンジオールジエポキシド(製品名:C4DEP)、1H,1H,5H,5H−パーフルオロ−1,5−ペンタンジオールジエポキシド(製品名:C5DEP)、1H,1H,6H,6H−パーフルオロ−1,6−ヘキサンジオールジエポキシド(製品名:C6DEP)、1H,1H,8H,8H−パーフルオロ−1,8−オクタンジオールジエポキシド(製品名:C8DEP)、1H,1H,10H,10H−パーフルオロ−1,10−デカンジオールジエポキシド(製品名:C10DEP)が市販されている。
また、エーテル結合を有さないフッ素含有エポキシ化合物としては、ダイキン工業(株)より、1,6−ビス(2’,3’−エポキシプロピル)−パーフルオロ−n−ヘキサン、1,4−ビス(2’,3’−エポキシプロピル)−パーフルオロ−n−ブタン、1,2−ビス(2’,3’−エポキシプロピル)−パーフルオロ−n−エタンが市販されている。
上記フッ素含有エポキシ化合物は、1種を単独で用いてもよいし、2種以上を併用してもよい。さらに、必要に応じて他のエポキシ樹脂、又はアクリル樹脂等の混合物として用いてもよい。
Moreover, as a linear fluorine-containing epoxy compound, it is preferable to have two epoxy groups and an ether bond from the point which the storage stability of a coating material improves more.
Epoxy compounds having two epoxy groups and ether bonds are fluorinated triethylene glycol diepoxide (product name: C6GDEP) and fluorinated tetraethylene glycol diepoxide (product name: C8GDEP) from Exflow Corporation of the United States. 1H, 1H, 4H, 4H-perfluoro-1,4-butanediol diepoxide (product name: C4DEP), 1H, 1H, 5H, 5H-perfluoro-1,5-pentanediol diepoxide (product name: C5DEP), 1H, 1H, 6H, 6H-perfluoro-1,6-hexanediol diepoxide (product name: C6DEP), 1H, 1H, 8H, 8H-perfluoro-1,8-octanediol diepoxide (product) Name: C8DEP), 1H, 1H, 10H, 10H-perfluoro 1,10-decanediol diepoxide (product name: C10DEP) are commercially available.
In addition, as a fluorine-containing epoxy compound having no ether bond, 1,6-bis (2 ′, 3′-epoxypropyl) -perfluoro-n-hexane, 1,4-bis from Daikin Industries, Ltd. (2 ′, 3′-epoxypropyl) -perfluoro-n-butane, 1,2-bis (2 ′, 3′-epoxypropyl) -perfluoro-n-ethane is commercially available.
The said fluorine-containing epoxy compound may be used individually by 1 type, and may use 2 or more types together. Furthermore, you may use as a mixture of another epoxy resin or an acrylic resin as needed.
フッ素含有エポキシ化合物は、π共役系導電性高分子とポリアニオンとの固形分合計100質量%に対して、1〜100質量%であることが好ましく、1〜50質量%であることがより好ましい。フッ素含有エポキシ化合物の含有量が1質量%未満であると、導電性塗膜の耐傷付き性と耐エタノール性が不足することがあり、100質量%を超えると、導電性塗膜中のπ共役系導電性高分子の含有量が少なくなり、充分な導電性が得られないことがある。また、50質量%以下であればより充分な導電性を得ることができる。 The fluorine-containing epoxy compound is preferably 1 to 100% by mass, and more preferably 1 to 50% by mass with respect to 100% by mass of the total solid content of the π-conjugated conductive polymer and the polyanion. If the content of the fluorine-containing epoxy compound is less than 1% by mass, scratch resistance and ethanol resistance of the conductive coating film may be insufficient, and if it exceeds 100% by mass, π-conjugate in the conductive coating film The content of the system conductive polymer is decreased, and sufficient conductivity may not be obtained. Moreover, if it is 50 mass% or less, more sufficient electroconductivity can be obtained.
(バインダ)
バインダは、耐久性および透明性の向上、基体との密着性向上を目的として含まれる。バインダは、熱硬化性樹脂であってもよいし、熱可塑樹脂であってもよい。
例えば、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステル、ポリイミド、ポリアミドイミド、ポリアミド6、ポリアミド6,6、ポリアミド12、ポリアミド11等のポリアミド、ポリビニルアルコール、ポリビニルブチラール、ポリ酢酸ビニル、ポリ塩化ビニル等のビニル樹脂、エポキシ樹脂、オキセタン樹脂、キシレン樹脂、アラミド樹脂、ポリイミドシリコーン、ポリウレタン、ポリウレア、メラミン樹脂、フェノール樹脂、ポリエーテル、アクリル樹脂およびこれらの共重合体等が挙げられる。
バインダの中でも、フッ素含有エポキシ化合物との混合性、基体との密着性が高いことから、オキセタン樹脂、エポキシ樹脂、アクリル樹脂が好ましい。
(Binder)
The binder is included for the purpose of improving durability and transparency and improving adhesion to the substrate. The binder may be a thermosetting resin or a thermoplastic resin.
For example, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyimide, polyamideimide, polyamide 6, polyamide 6,6,
Among the binders, an oxetane resin, an epoxy resin, and an acrylic resin are preferable because they are highly miscible with the fluorine-containing epoxy compound and have high adhesion to the substrate.
[オキセタン化合物]
オキセタン樹脂を構成するオキセタン化合物の具体例としては、例えば、キシリレンビスオキセタン、3−エチル−3{[(3−エチルオキセタン−3−イル)メトキシ]メチル}オキセタン、4,4’−(3−エチルオキセタン−3−イルメチルオキシメチル)ビフェニル、1,4−ビス{[(3−エチル−3−オキセタニル)メトキシ]メチル}ベンゼン、ジ{1−エチル(3−オキセタニル)}メチルエーテル、1,6−ビス{(3−エチル−3−オキセタニル)メトキシ}ヘキサン、9,9−ビス{2−メチル−4−[2−(3−オキセタニル)]ブトキシフェニル}フルオレン、9,9−ビス{4−{2−[2−(3−オキセタニル)]ブトキシ}エトキシフェニル}フルオレンなど2官能のオキセタン環を有する化合物、オキセタン化ノボラック樹脂などの多官能オキセタン化合物、3−エチル−3−(ヒドロキシメチル)オキセタン、3−エチル−3−(2−エチルヘキシロキシメチル)オキセタン、3−エチル−3−フェノキシメチルオキセタン、3−(メタクリロイルオキシメチル)オキセタン、3−(メタクリロイルオキシメチル)−2−フェニルオキセタン等の1官能のオキセタン環を有する化合物が挙げられる。
[Oxetane compounds]
Specific examples of the oxetane compound constituting the oxetane resin include, for example, xylylenebisoxetane, 3-ethyl-3 {[(3-ethyloxetane-3-yl) methoxy] methyl} oxetane, 4,4 ′-(3 -Ethyloxetane-3-ylmethyloxymethyl) biphenyl, 1,4-bis {[(3-ethyl-3-oxetanyl) methoxy] methyl} benzene, di {1-ethyl (3-oxetanyl)} methyl ether, 1 , 6-bis {(3-ethyl-3-oxetanyl) methoxy} hexane, 9,9-bis {2-methyl-4- [2- (3-oxetanyl)] butoxyphenyl} fluorene, 9,9-bis { Compounds having a bifunctional oxetane ring such as 4- {2- [2- (3-oxetanyl)] butoxy} ethoxyphenyl} fluorene, oxeta Polyfunctional oxetane compounds such as conjugated novolak resin, 3-ethyl-3- (hydroxymethyl) oxetane, 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane, 3-ethyl-3-phenoxymethyloxetane, 3 Examples thereof include compounds having a monofunctional oxetane ring such as-(methacryloyloxymethyl) oxetane and 3- (methacryloyloxymethyl) -2-phenyloxetane.
オキセタン化合物の含有量は、π共役系導電性高分子とポリアニオンとの固形分合計100質量%に対して、1〜200質量%であることが好ましく、10〜100質量%であることがより好ましい。オキセタン化合物の含有量が1質量%未満であると、導電性塗膜の耐水性が不足することがあり、200質量%を超えると、導電性塗膜中のπ共役系導電性高分子の含有量が少なくなり、充分な導電性が得られないことがある。 The content of the oxetane compound is preferably 1 to 200% by mass and more preferably 10 to 100% by mass with respect to 100% by mass of the total solid content of the π-conjugated conductive polymer and the polyanion. . When the content of the oxetane compound is less than 1% by mass, the water resistance of the conductive coating film may be insufficient. When it exceeds 200% by mass, the inclusion of the π-conjugated conductive polymer in the conductive coating film The amount is reduced, and sufficient conductivity may not be obtained.
[エポキシ化合物]
エポキシ樹脂を構成するエポキシ化合物としては、水溶性エポキシ樹脂、エポキシエマルジョンが挙げられる。透明性の点から水溶性エポキシ樹脂であることが好ましい。さらにモノマーであることがより好ましい。水溶性エポキシ樹脂は、エポキシ基を有し、25℃の水100gに対して1g以上溶解する樹脂である。
水溶性エポキシ樹脂の具体例としては、例えば、ネオペンチルグリコールジグリシジルエーテル、1,6−ヘキサンジオールジグリシジルエーテル、トリメチロールプロパンポリグリシジルエーテル、ヘキサヒドロフタル酸ジグリシジルエステル、プロピレングリコールジグリシジルエーテル、トリプロピレングリコールジグリシジルエーテル、ポリプロピレングリコールジグリシジルエーテル、脂肪酸変性エポキシ、ジエチレングリコールジグリシジルエーテル、ポリエチレングリコールジグリシジルエーテル、グリセリンポリグリシジルエーテル、ジグリセリンポリグリシジルエーテル、ポリグリセリンポリグリシジルエーテル、ソルビトール系ポリグリシジルエーテル、エチレンオキシドラウリルアルコールグリシジルエーテル、エチレンオキシドフェノールグリシジルエーテル、アジピン酸グリシジルエーテル、トリグリシジルトリス(2−ヒドロキシエチル)イソシアネート等が挙げられる。
水溶性エポキシ樹脂の中でも、2個以上のエポキシ基を有するものが好ましい。
[Epoxy compound]
Examples of the epoxy compound constituting the epoxy resin include water-soluble epoxy resins and epoxy emulsions. A water-soluble epoxy resin is preferable from the viewpoint of transparency. More preferably, it is a monomer. The water-soluble epoxy resin is a resin having an epoxy group and dissolving 1 g or more in 100 g of water at 25 ° C.
Specific examples of the water-soluble epoxy resin include, for example, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane polyglycidyl ether, hexahydrophthalic acid diglycidyl ester, propylene glycol diglycidyl ether, Tripropylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, fatty acid-modified epoxy, diethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, glycerin polyglycidyl ether, diglycerin polyglycidyl ether, polyglycerin polyglycidyl ether, sorbitol polyglycidyl ether , Ethylene oxide lauryl alcohol glycidyl ether, ethyl Emissions oxide phenol glycidyl ether, adipic acid glycidyl ether, triglycidyl tris (2-hydroxyethyl) isocyanate.
Among water-soluble epoxy resins, those having two or more epoxy groups are preferable.
エポキシエマルジョンは、2個以上のエポキシ基を有する油溶性のエポキシ樹脂を含むエマルジョンである。
エポキシ樹脂としては、例えば、ビフェニル型、ナフタレン型、フルオレン型、ポリアルキレングリコール型、アルキレングリコール型等の2官能タイプのグリシジルエーテル型エポキシ樹脂、フェノールノボラック型、オルソクレゾールノボラック型、DPPノボラック型、3官能型、トリス・ヒドロキシフェニルメタン型、テトラフェニロールエタン型等の多官能タイプのグリシジルエーテル型エポキシ樹脂、テトラグリシジルジアミノジフェニルメタン、トリグリシジルイソシアヌレート、ヒダントイン型、TRAD−D型、アミノフェノール型、アニリン型、トルイジン型等のグリシジルアミン型エポキシ樹脂、脂環型エポキシ樹脂、ウレタン結合を有するウレタン変性エポキシ樹脂、ポリブタジエンまたはポリアクリロニトリル−ブタジエンを含有するゴム変性エポキシ樹脂などが挙げられる。
The epoxy emulsion is an emulsion containing an oil-soluble epoxy resin having two or more epoxy groups.
Examples of the epoxy resin include bifunctional glycidyl ether type epoxy resins such as biphenyl type, naphthalene type, fluorene type, polyalkylene glycol type and alkylene glycol type, phenol novolak type, orthocresol novolak type, DPP novolak type, 3 Multifunctional glycidyl ether type epoxy resin such as functional type, tris-hydroxyphenylmethane type, tetraphenylolethane type, tetraglycidyldiaminodiphenylmethane, triglycidyl isocyanurate, hydantoin type, TRAD-D type, aminophenol type, aniline Type, toluidine type glycidylamine type epoxy resin, alicyclic epoxy resin, urethane modified epoxy resin having urethane bond, polybutadiene or polyacrylonitrile Rubber-modified epoxy resin containing Tajien the like.
エポキシ化合物の含有量は、π共役系導電性高分子とポリアニオンとの固形分合計100質量%に対して、1〜200質量%であることが好ましく、10〜100質量%であることがより好ましい。エポキシ化合物の含有量が1質量%未満であると、導電性塗膜の耐水性が不足することがあり、200質量%を超えると、導電性塗膜中のπ共役系導電性高分子の含有量が少なくなり、充分な導電性が得られないことがある。 The content of the epoxy compound is preferably 1 to 200% by mass and more preferably 10 to 100% by mass with respect to 100% by mass of the total solid content of the π-conjugated conductive polymer and the polyanion. . When the content of the epoxy compound is less than 1% by mass, the water resistance of the conductive coating film may be insufficient, and when it exceeds 200% by mass, the inclusion of the π-conjugated conductive polymer in the conductive coating film The amount is reduced, and sufficient conductivity may not be obtained.
[アクリル化合物]
アクリル樹脂を構成するアクリル化合物には単官能アクリル化合物と多官能アクリル化合物がある。
単官能アクリル化合物としては、グリシジル(メタ)アクリレート、2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、4−ヒドロキシブチル(メタ)アクリレート、エチル−α−ヒドロキシメチルアクリレート、2−ヒドロキシエチルアクリルアミドが挙げられる。
(メタ)アクリルアミド化合物の重合体は、π共役系導電性高分子とポリアニオンの複合体との相溶性が良い上に導電性をより向上させることもできる。
[Acrylic compound]
Acrylic compounds constituting the acrylic resin include monofunctional acrylic compounds and polyfunctional acrylic compounds.
Monofunctional acrylic compounds include glycidyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, ethyl-α-hydroxymethyl acrylate, 2- Hydroxyethylacrylamide is mentioned.
The polymer of the (meth) acrylamide compound has good compatibility with the complex of the π-conjugated conductive polymer and the polyanion, and can further improve the conductivity.
多官能アクリル化合物は、不飽和二重結合を2つ以上有するアクリル化合物である。多官能アクリル化合物を含有すれば、塗膜形成時に成膜性が向上する。
多官能アクリル化合物の具体例としては、ジプロピレングリコールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、トリプロピレングリコールジ(メタ)アクリレート、ジメチロールジシクロペンタジ(メタ)アクリレート、ポリエチレングリコール(以下、PEGと表記する。)400ジ(メタ)アクリレート、PEG300ジ(メタ)アクリレート、PEG600ジ(メタ)アクリレート、N,N’−メチレンビスアクリルアミド等の2官能アクリル化合物、トリメチロールプロパントリ(メタ)アクリレート、トリメチロールプロパンエトキシトリ(メタ)アクリレート、グリセリンプロポキシトリ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、エトキシ化グリセリントリアクリレート等の3官能アクリル化合物、ペンタエリスリトールエトキシテトラ(メタ)アクリレート、ジトリメチロールプロパンテトラ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールヘキサ(ペンタ)(メタ)アクリレート、ジペンタエリスリトールモノヒドロキシペンタ(メタ)アクリレート等の4官能以上のアクリル化合物、ソルビトールペンタアクリレート、ジペンタエリスリトールペンタアクリレート等の5官能以上のアクリル化合物、ジペンタエリスリトールヘキサアクリレート、ソルビトールヘキサアクリレート、アルキレンオキサイド変性ヘキサアクリレート、カプロラクトン変性ジペンタエリスリトールヘキサアクリレート等の6官能以上のアクリル化合物、2官能以上のウレタンアクリレートが挙げられる。
The polyfunctional acrylic compound is an acrylic compound having two or more unsaturated double bonds. If a polyfunctional acrylic compound is contained, the film-forming property will improve at the time of coating film formation.
Specific examples of the polyfunctional acrylic compound include dipropylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, tripropylene glycol di (meth) acrylate, and dimethylol dicyclopentadi (meth) acrylate. , Polyethylene glycol (hereinafter referred to as PEG) 400 di (meth) acrylate, PEG300 di (meth) acrylate, PEG600 di (meth) acrylate, bifunctional acrylic compounds such as N, N′-methylenebisacrylamide, and trimethylol Propane tri (meth) acrylate, trimethylolpropane ethoxytri (meth) acrylate, glycerin propoxytri (meth) acrylate, pentaerythritol tri (meth) acrylate, ethoxylated glycerin triac Trifunctional acrylic compounds such as relate, pentaerythritol ethoxytetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (penta) (meth) acrylate, dipentaerythritol mono A tetrafunctional or higher functional acrylic compound such as hydroxypenta (meth) acrylate, a pentafunctional or higher functional acrylic compound such as sorbitol pentaacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, sorbitol hexaacrylate, alkylene oxide modified hexaacrylate, caprolactone 6 or more functional acrylic compounds such as modified dipentaerythritol hexaacrylate, 2 or more functional A urethane acrylate.
多官能アクリル化合物のうち、多官能アクリルモノマーは、分子量が3000以下であることが好ましい。分子量が3000を超える多官能アクリルモノマーでは、溶剤溶解性が低くなる。また、不飽和二重結合当量が少なくなるため、複合体を架橋させにくく、導電膜形成後に充分な強度が得られない傾向にある。
また、多官能アクリル化合物のうち、多官能ウレタンアクリレートは、溶剤溶解性、耐摩耗性、低収縮の点で、分子量1000以下であることが好ましい。分子量が1000を超える多官能ウレタンアクリレートでは、イソシアネート基とポリオール(水酸基)により形成されるウレタン基の導入率が減少して、溶剤に対する溶解性が低くなる傾向にある。
Of the polyfunctional acrylic compounds, the polyfunctional acrylic monomer preferably has a molecular weight of 3000 or less. A polyfunctional acrylic monomer having a molecular weight exceeding 3000 has low solvent solubility. In addition, since the unsaturated double bond equivalent is reduced, it is difficult to crosslink the composite, and sufficient strength cannot be obtained after formation of the conductive film.
Of the polyfunctional acrylic compounds, the polyfunctional urethane acrylate preferably has a molecular weight of 1000 or less in terms of solvent solubility, wear resistance, and low shrinkage. In the polyfunctional urethane acrylate having a molecular weight exceeding 1000, the introduction rate of the urethane group formed by the isocyanate group and the polyol (hydroxyl group) decreases, and the solubility in the solvent tends to be low.
成膜性がより向上する点では、(メタ)アクリルアミド化合物および多官能アクリル化合物の一方または両方をさらに含有することが好ましい。 In terms of further improving film formability, it is preferable to further contain one or both of a (meth) acrylamide compound and a polyfunctional acrylic compound.
アクリル化合物の含有量は、π共役系導電性高分子とポリアニオンの合計100質量%に対して0.05〜50質量%であることが好ましく、0.3〜30質量%であることがより好ましい。アクリル化合物の含有量が0.05質量%以上であれば、導電膜の成膜性が充分に高くなり、50質量%以下であれば、導電膜中にπ共役系導電性高分子が充分量含まれるため、充分な導電性が得られる。 The content of the acrylic compound is preferably 0.05 to 50% by mass and more preferably 0.3 to 30% by mass with respect to 100% by mass in total of the π-conjugated conductive polymer and the polyanion. . If the content of the acrylic compound is 0.05% by mass or more, the film formability of the conductive film is sufficiently high, and if it is 50% by mass or less, a sufficient amount of π-conjugated conductive polymer is contained in the conductive film. Since it is contained, sufficient electrical conductivity is obtained.
上記エポキシ化合物、オキセタン化合物およびアクリル化合物としては、導電性塗料の保存安定性の点から、フッ素を含まない化合物が好ましい。 As said epoxy compound, oxetane compound, and an acrylic compound, the compound which does not contain a fluorine is preferable from the point of the storage stability of an electrically conductive coating material.
(導電性向上剤)
導電性向上剤は、導電性高分子溶液から形成される導電膜の導電性を向上させる成分である。
具体的に、導電性向上剤は、前記アクリル化合物、窒素含有芳香族性環式化合物、2 個以上のヒドロキシル基を有する化合物、2個以上のカルボキシル基を有する化合物、1個以上のヒドロキシル基および1個以上のカルボキシ基を有する化合物、アミド基を有する化合物、イミド基を有する化合物、ラクタム化合物、グリシジル基を有する化合物、水溶性有機溶剤からなる群より選ばれる少なくとも1種の化合物である。
(Conductivity improver)
The conductivity improver is a component that improves the conductivity of the conductive film formed from the conductive polymer solution.
Specifically, the conductivity improver includes the acrylic compound, a nitrogen-containing aromatic cyclic compound, a compound having two or more hydroxyl groups, a compound having two or more carboxyl groups, one or more hydroxyl groups, and It is at least one compound selected from the group consisting of a compound having one or more carboxy groups, a compound having an amide group, a compound having an imide group, a lactam compound, a compound having a glycidyl group, and a water-soluble organic solvent.
・窒素含有芳香族性環式化合物
窒素含有芳香族性環式化合物としては、例えば、一つの窒素原子を含有するピリジン類及びその誘導体、二つの窒素原子を含有するイミダゾール類及びその誘導体、ピリミジン類及びその誘導体、ピラジン類及びその誘導体、三つの窒素原子を含有するトリアジン類及びその誘導体等が挙げられる。溶媒溶解性等の観点からは、ピリジン類及びその誘導体、イミダゾール類及びその誘導体、ピリミジン類及びその誘導体が好ましい。
Nitrogen-containing aromatic cyclic compounds Examples of nitrogen-containing aromatic cyclic compounds include pyridines and derivatives thereof containing one nitrogen atom, imidazoles and derivatives thereof containing two nitrogen atoms, and pyrimidines. And derivatives thereof, pyrazines and derivatives thereof, triazines containing three nitrogen atoms, and derivatives thereof. From the viewpoint of solvent solubility and the like, pyridines and derivatives thereof, imidazoles and derivatives thereof, and pyrimidines and derivatives thereof are preferable.
ピリジン類及びその誘導体の具体的な例としては、ピリジン、2−メチルピリジン、3−メチルピリジン、4−メチルピリジン、4−エチルピリジン、N−ビニルピリジン、2,4−ジメチルピリジン、2,4,6−トリメチルピリジン、3−シアノ−5−メチルピリジン、2−ピリジンカルボン酸、6−メチル−2−ピリジンカルボン酸、4−ピリジンカルボキシアルデヒド、4−アミノピリジン、2,3−ジアミノピリジン、2,6−ジアミノピリジン、2,6−ジアミノ−4−メチルピリジン、4−ヒドロキシピリジン、4−ピリジンメタノール、2,6−ジヒドロキシピリジン、2,6−ピリジンジメタノール、6−ヒドロキシニコチン酸メチル、2−ヒドロキシ−5−ピリジンメタノール、6−ヒドロキシニコチン酸エチル、4−ピリジンメタノール、4−ピリジンエタノール、2−フェニルピリジン、3−メチルキノリン、3−エチルキノリン、キノリノール、2,3−シクロペンテノピリジン、2,3−シクロヘキサノピリジン、1,2−ジ(4−ピリジル)エタン、1,2−ジ(4−ピリジル)プロパン、2−ピリジンカルボキシアルデヒド、2−ピリジンカルボン酸、2−ピリジンカルボニトリル、2,3−ピリジンジカルボン酸、2,4−ピリジンジカルボン酸、2,5−ピリジンジカルボン酸、2,6−ピリジンジカルボン酸、3−ピリジンスルホン酸等が挙げられる。 Specific examples of pyridines and derivatives thereof include pyridine, 2-methylpyridine, 3-methylpyridine, 4-methylpyridine, 4-ethylpyridine, N-vinylpyridine, 2,4-dimethylpyridine, 2,4. , 6-trimethylpyridine, 3-cyano-5-methylpyridine, 2-pyridinecarboxylic acid, 6-methyl-2-pyridinecarboxylic acid, 4-pyridinecarboxaldehyde, 4-aminopyridine, 2,3-diaminopyridine, 2 , 6-diaminopyridine, 2,6-diamino-4-methylpyridine, 4-hydroxypyridine, 4-pyridinemethanol, 2,6-dihydroxypyridine, 2,6-pyridinedimethanol, methyl 6-hydroxynicotinate, 2 -Hydroxy-5-pyridinemethanol, ethyl 6-hydroxynicotinate, 4-pi Lysine methanol, 4-pyridineethanol, 2-phenylpyridine, 3-methylquinoline, 3-ethylquinoline, quinolinol, 2,3-cyclopentenopyridine, 2,3-cyclohexanopyridine, 1,2-di (4- Pyridyl) ethane, 1,2-di (4-pyridyl) propane, 2-pyridinecarboxaldehyde, 2-pyridinecarboxylic acid, 2-pyridinecarbonitrile, 2,3-pyridinedicarboxylic acid, 2,4-pyridinedicarboxylic acid, Examples include 2,5-pyridinedicarboxylic acid, 2,6-pyridinedicarboxylic acid, and 3-pyridinesulfonic acid.
イミダゾール類及びその誘導体の具体的な例としては、イミダゾール、2−メチルイミダゾール、2−プロピルイミダゾール、2−ウンデジルイミダゾール、2−フェニルイミダゾール、N−メチルイミダゾール、N−ビニルイミダゾール、N−アリルイミダゾール、1−(2−ヒドロキシエチル)イミダゾール(N−ヒドロキシエチルイミダゾール)、2−エチル−4−メチルイミダゾール、1,2−ジメチルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−ベンジル−2−フェニルイミダゾール、1−シアノエチル−2−メチルイミダゾール、1−シアノエチル−2−エチル−4−メチルイミダゾール、2−フェニル−4,5−ジヒドロキシメチルイミダゾール、1−アセチルイミダゾール、4,5−イミダゾールジカルボン酸、4,5−イミダゾールジカルボン酸ジメチル、ベンズイミダゾール、2−アミノべンズイミダゾール、2−アミノべンズイミダゾール−2−スルホン酸、2−アミノ−1−メチルべンズイミダゾール、2−ヒドロキシべンズイミダゾール、2−(2−ピリジル)べンズイミダゾール等が挙げられる。 Specific examples of imidazoles and derivatives thereof include imidazole, 2-methylimidazole, 2-propylimidazole, 2-undecylimidazole, 2-phenylimidazole, N-methylimidazole, N-vinylimidazole, and N-allylimidazole. 1- (2-hydroxyethyl) imidazole (N-hydroxyethylimidazole), 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenyl Imidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 1-acetylimidazole, 4,5-imidazoledicarbo Acid, dimethyl 4,5-imidazole dicarboxylate, benzimidazole, 2-aminobenzimidazole, 2-aminobenzimidazole-2-sulfonic acid, 2-amino-1-methylbenzimidazole, 2-hydroxybenzimidazole , 2- (2-pyridyl) benzimidazole and the like.
ピリミジン類及びその誘導体の具体的な例としては、2−アミノ−4−クロロ−6−メチルピリミジン、2−アミノ−6−クロロ−4−メトキシピリミジン、2−アミノ−4,6−ジクロロピリミジン、2−アミノ−4,6−ジヒドロキシピリミジン、2−アミノ−4,6−ジメチルピリミジン、2−アミノ−4,6−ジメトキシピリミジン、2−アミノピリミジン、2−アミノ−4−メチルピリミジン、4,6−ジヒドロキシピリミジン、2,4−ジヒドロキシピリミジン−5−カルボン酸、2,4,6−トリアミノピリミジン、2,4−ジメトキシピリミジン、2,4,5−トリヒドロキシピリミジン、2,4−ピリミジンジオール等が挙げられる。 Specific examples of pyrimidines and derivatives thereof include 2-amino-4-chloro-6-methylpyrimidine, 2-amino-6-chloro-4-methoxypyrimidine, 2-amino-4,6-dichloropyrimidine, 2-amino-4,6-dihydroxypyrimidine, 2-amino-4,6-dimethylpyrimidine, 2-amino-4,6-dimethoxypyrimidine, 2-aminopyrimidine, 2-amino-4-methylpyrimidine, 4,6 -Dihydroxypyrimidine, 2,4-dihydroxypyrimidine-5-carboxylic acid, 2,4,6-triaminopyrimidine, 2,4-dimethoxypyrimidine, 2,4,5-trihydroxypyrimidine, 2,4-pyrimidinediol, etc. Is mentioned.
ピラジン類及びその誘導体の具体的な例としては、ピラジン、2−メチルピラジン、2,5−ジメチルピラジン、ピラジンカルボン酸、2,3−ピラジンジカルボン酸、5−メチルピラジンカルボン酸、ピラジンアミド、5−メチルピラジンアミド、2−シアノピラジン、アミノピラジン、3−アミノピラジン−2−カルボン酸、2−エチル−3−メチルピラジン、2,3−ジメチルピラジン、2,3−ジエチルピラジン等が挙げられる。 Specific examples of the pyrazines and derivatives thereof include pyrazine, 2-methylpyrazine, 2,5-dimethylpyrazine, pyrazinecarboxylic acid, 2,3-pyrazinedicarboxylic acid, 5-methylpyrazinecarboxylic acid, pyrazineamide, 5 -Methylpyrazine amide, 2-cyanopyrazine, aminopyrazine, 3-aminopyrazine-2-carboxylic acid, 2-ethyl-3-methylpyrazine, 2,3-dimethylpyrazine, 2,3-diethylpyrazine and the like.
トリアジン類及びその誘導体の具体的な例としては、1,3,5−トリアジン、2−アミノ−1,3,5−トリアジン、3−アミノ−1,2,4−トリアジン、2,4−ジアミノ−6−フェニル−1,3,5−トリアジン、2,4,6−トリアミノ−1,3,5−トリアジン、2,4,6−トリス(トリフルオロメチル)−1,3,5−トリアジン、2,4,6−トリ−2−ピリジン−1,3,5−トリアジン、3−(2−ピリジン)−5,6−ビス(4−フェニルスルホン酸)−1,2,4―トリアジン二ナトリウム、3−(2−ピリジン)−5,6−ジフェニル−1,2,4−トリアジン、3−(2−ピリジン)−5,6−ジフェニル−1,2,4―トリアジン−ρ,ρ’−ジスルホン酸二ナトリウム、2−ヒドロキシ−4,6−ジクロロ−1,3,5−トリアジン等が挙げられる。 Specific examples of triazines and derivatives thereof include 1,3,5-triazine, 2-amino-1,3,5-triazine, 3-amino-1,2,4-triazine, and 2,4-diamino. -6-phenyl-1,3,5-triazine, 2,4,6-triamino-1,3,5-triazine, 2,4,6-tris (trifluoromethyl) -1,3,5-triazine, 2,4,6-tri-2-pyridine-1,3,5-triazine, 3- (2-pyridine) -5,6-bis (4-phenylsulfonic acid) -1,2,4-triazine disodium 3- (2-pyridine) -5,6-diphenyl-1,2,4-triazine, 3- (2-pyridine) -5,6-diphenyl-1,2,4-triazine-ρ, ρ′- Disodium disulphonate, 2-hydroxy-4,6-dichloro -1,3,5-triazine and the like.
窒素含有芳香族性環式化合物の含有量は、ポリアニオンのアニオン基単位1モルに対して0.1〜100モルの範囲であることが好ましく、0.5〜30モルの範囲であることがより好ましく、固体電解質層14の物性及び導電性の観点からは、1〜10モルの範囲が特に好ましい。窒素含有芳香族性環式化合物の含有率が0.1モルより少なくなると、窒素含有芳香族性環式化合物とポリアニオン及び共役系導電性高分子との相互作用が弱くなる傾向にあり、導電性が不足することがある。また、窒素含有芳香族性環式化合物が100モルを超えて含まれると共役系導電性高分子の含有量が少なくなり、やはり充分な導電性が得られにくく、固体電解質層14の物性が変化することがある。 The content of the nitrogen-containing aromatic cyclic compound is preferably in the range of 0.1 to 100 mol, more preferably in the range of 0.5 to 30 mol, with respect to 1 mol of the anion group unit of the polyanion. A range of 1 to 10 mol is particularly preferable from the viewpoint of physical properties and conductivity of the solid electrolyte layer 14. When the content of the nitrogen-containing aromatic cyclic compound is less than 0.1 mol, the interaction between the nitrogen-containing aromatic cyclic compound, the polyanion and the conjugated conductive polymer tends to be weak, and the conductivity May be insufficient. In addition, when the nitrogen-containing aromatic cyclic compound exceeds 100 moles, the content of the conjugated conductive polymer decreases, and it is difficult to obtain sufficient conductivity, and the physical properties of the solid electrolyte layer 14 change. There are things to do.
・2個以上のヒドロキシ基を有する化合物
2個以上のヒドロキシ基を有する化合物としては、例えば、プロピレングリコール、1,3−ブチレングリコール、1,4−ブチレングリコール、グリセリン、ジグリセリン、D−グルコース、D−グルシトール、イソプレングリコール、ジメチロールプロピオン酸、ブタンジオール、1,5−ペンタンジオール、1,6−ヘキサンジオール、1,9−ノナンジオール、ネオペンチルグリコール、トリメチロールエタン、トリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトール、チオジエタノール、グルコース、酒石酸、D−グルカル酸、グルタコン酸等の多価脂肪族アルコール類;
セルロース、多糖、糖アルコール等の高分子アルコール;
1,4−ジヒドロキシベンゼン、1,3−ジヒドロキシベンゼン、2,3−ジヒドロキシ−1−ペンタデシルベンゼン、2,4−ジヒドロキシアセトフェノン、2,5−ジヒドロキシアセトフェノン、2,4−ジヒドロキシベンゾフェノン、2,6−ジヒドロキシベンゾフェノン、3,4−ジヒドロキシベンゾフェノン、3,5−ジヒドロキシベンゾフェノン、2,4’−ジヒドロキシジフェニルスルフォン、2,2’,5,5’−テトラヒドロキシジフェニルスルフォン、3,3’,5,5’−テトラメチル−4,4’−ジヒドロキシジフェニルスルフォン、ヒドロキシキノンカルボン酸及びその塩類、2,3−ジヒドロキシ安息香酸、2,4−ジヒドロキシ安息香酸、2,5−ジヒドロキシ安息香酸、2,6−ジヒドロキシ安息香酸、3,5−ジヒドロキシ安息香酸、1,4−ヒドロキノンスルホン酸及びその塩類、4,5−ヒドロキシベンゼン−1,3−ジスルホン酸及びその塩類、1,5−ジヒドロキシナフタレン、1,6−ジヒドロキシナフタレン、2,6−ジヒドロキシナフタレン、2,7−ジヒドロキシナフタレン、2,3−ジヒドロキシナフタレン、1,5−ジヒドロキシナフタレン−2,6−ジカルボン酸、1,6−ジヒドロキシナフタレン−2,5−ジカルボン酸、1,5−ジヒドロキシナフトエ酸、1,4−ジヒドロキシ−2−ナフトエ酸フェニルエステル、4,5−ジヒドロキシナフタレン−2,7−ジスルホン酸及びその塩類、1,8−ジヒドロキシ−3,6−ナフタレンジスルホン酸及びその塩類、6,7−ジヒドロキシ−2−ナフタレンスルホン酸及びその塩類、1,2,3−トリヒドロキシベンゼン(ピロガロール)、1,2,4−トリヒドロキシベンゼン、5−メチル−1,2,3−トリヒドロキシベンゼン、5−エチル−1,2,3−トリヒドロキシベンゼン、5−プロピル−1,2,3−トリヒドロキシベンゼン、トリヒドロキシ安息香酸、トリヒドロキシアセトフェノン、トリヒドロキシベンゾフェノン、トリヒドロキシベンゾアルデヒド、トリヒドロキシアントラキノン、2,4,6−トリヒドロキシベンゼン、テトラヒドロキシ−p−ベンゾキノン、テトラヒドロキシアントラキノン、ガーリック酸メチル(没食子酸メチル)、ガーリック酸エチル(没食子酸エチル)等の芳香族化合物、ヒドロキノンスルホン酸カリウム等が挙げられる。
-Compound having two or more hydroxy groups Examples of the compound having two or more hydroxy groups include propylene glycol, 1,3-butylene glycol, 1,4-butylene glycol, glycerin, diglycerin, D-glucose, D-glucitol, isoprene glycol, dimethylolpropionic acid, butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,9-nonanediol, neopentyl glycol, trimethylolethane, trimethylolpropane, pentaerythritol Polyhydric aliphatic alcohols such as dipentaerythritol, thiodiethanol, glucose, tartaric acid, D-glucaric acid, glutaconic acid;
Polymeric alcohols such as cellulose, polysaccharides, sugar alcohols;
1,4-dihydroxybenzene, 1,3-dihydroxybenzene, 2,3-dihydroxy-1-pentadecylbenzene, 2,4-dihydroxyacetophenone, 2,5-dihydroxyacetophenone, 2,4-dihydroxybenzophenone, 2,6 -Dihydroxybenzophenone, 3,4-dihydroxybenzophenone, 3,5-dihydroxybenzophenone, 2,4'-dihydroxydiphenylsulfone, 2,2 ', 5,5'-tetrahydroxydiphenylsulfone, 3,3', 5,5 '-Tetramethyl-4,4'-dihydroxydiphenylsulfone, hydroxyquinonecarboxylic acid and its salts, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, 2,5-dihydroxybenzoic acid, 2,6- Dihydroxybenzoic acid, 3,5-di Droxybenzoic acid, 1,4-hydroquinonesulfonic acid and its salts, 4,5-hydroxybenzene-1,3-disulfonic acid and its salts, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6- Dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 1,5-dihydroxynaphthalene-2,6-dicarboxylic acid, 1,6-dihydroxynaphthalene-2,5-dicarboxylic acid, 1,5-dihydroxy Naphthoic acid, 1,4-dihydroxy-2-naphthoic acid phenyl ester, 4,5-dihydroxynaphthalene-2,7-disulfonic acid and its salts, 1,8-dihydroxy-3,6-naphthalenedisulfonic acid and its salts, 6,7-Dihydroxy-2-naphthalenesulfonic acid and its 1,2,3-trihydroxybenzene (pyrogallol), 1,2,4-trihydroxybenzene, 5-methyl-1,2,3-trihydroxybenzene, 5-ethyl-1,2,3-tri Hydroxybenzene, 5-propyl-1,2,3-trihydroxybenzene, trihydroxybenzoic acid, trihydroxyacetophenone, trihydroxybenzophenone, trihydroxybenzaldehyde, trihydroxyanthraquinone, 2,4,6-trihydroxybenzene, tetra Aromatic compounds such as hydroxy-p-benzoquinone, tetrahydroxyanthraquinone, methyl garlic acid (methyl gallate), ethyl garlic acid (ethyl gallate), potassium hydroquinone sulfonate, and the like.
2個以上のヒドロキシ基を有する化合物の含有量は、ポリアニオンのアニオン基単位1モルに対して0.05〜50モルの範囲であることが好ましく、0.3〜10モルの範囲であることがより好ましい。2個以上のヒドロキシ基を有する化合物の含有量が、ポリアニオンのアニオン基単位1モルに対して0.05モルより少なくなると、導電性及び耐熱性が不足することがある。また、2個以上のヒドロキシ基を有する化合物の含有量が、ポリアニオンのアニオン基単位1モルに対して50モルより多くなると、固体電解質層14中のπ共役系導電性高分子の含有量が少なくなり、やはり充分な導電性が得られにくく、固体電解質層14の物性が変化することがある。 The content of the compound having two or more hydroxy groups is preferably in the range of 0.05 to 50 mol and more preferably in the range of 0.3 to 10 mol with respect to 1 mol of the anion group unit of the polyanion. More preferred. If the content of the compound having two or more hydroxy groups is less than 0.05 mol with respect to 1 mol of the anion group unit of the polyanion, conductivity and heat resistance may be insufficient. In addition, when the content of the compound having two or more hydroxy groups is more than 50 mol with respect to 1 mol of the anion group unit of the polyanion, the content of the π-conjugated conductive polymer in the solid electrolyte layer 14 is small. Thus, it is difficult to obtain sufficient conductivity, and the physical properties of the solid electrolyte layer 14 may change.
・2個以上のカルボキシ基を有する化合物
2個以上のカルボキシ基を有する化合物としては、マレイン酸、フマル酸、イタコン酸、シトラコン酸、マロン酸、1,4−ブタンジカルボン酸、コハク酸、酒石酸、アジピン酸、D−グルカル酸、グルタコン酸、クエン酸等の脂肪族カルボン酸類化合物;
フタル酸、テレフタル酸、イソフタル酸、テトラヒドロ無水フタル酸、5−スルホイソフタル酸、5−ヒドロキシイソフタル酸、メチルテトラヒドロ無水フタル酸、4,4’−オキシジフタル酸、ビフェニルテトラカルボン酸二無水物、ベンゾフェノンテトラカルボン酸二無水物、ナフタレンジカルボン酸、トリメリット酸、ピロメリット酸等の、芳香族性環に少なくとも一つ以上のカルボキシ基が結合している芳香族カルボン酸類化合物;ジグリコール酸、オキシ二酪酸、チオ二酢酸(チオジ酢酸)、チオ二酪酸、イミノ二酢酸、イミノ酪酸等が挙げられる。
-Compound having two or more carboxy groups Examples of the compound having two or more carboxy groups include maleic acid, fumaric acid, itaconic acid, citraconic acid, malonic acid, 1,4-butanedicarboxylic acid, succinic acid, tartaric acid, Aliphatic carboxylic acid compounds such as adipic acid, D-glucaric acid, glutaconic acid and citric acid;
Phthalic acid, terephthalic acid, isophthalic acid, tetrahydrophthalic anhydride, 5-sulfoisophthalic acid, 5-hydroxyisophthalic acid, methyltetrahydrophthalic anhydride, 4,4'-oxydiphthalic acid, biphenyltetracarboxylic dianhydride, benzophenone tetra Aromatic carboxylic acid compounds in which at least one carboxy group is bonded to an aromatic ring, such as carboxylic dianhydride, naphthalene dicarboxylic acid, trimellitic acid, pyromellitic acid; diglycolic acid, oxydibutyric acid Thiodiacetic acid (thiodiacetic acid), thiodibutyric acid, iminodiacetic acid, iminobutyric acid and the like.
2個以上のカルボキシ基を有する化合物は、ポリアニオンのアニオン基単位1モルに対して0.1〜30モルの範囲であることが好ましく、0.3〜10モルの範囲であることがより好ましい。2個以上のカルボキシ基を有する化合物の含有量が、ポリアニオンのアニオン基単位1モルに対して0.1モルより少なくなると、導電性及び耐熱性が不足することがある。また2個以上のカルボキシ基を有する化合物の含有量が、ポリアニオンのアニオン基単位1モルに対して30モルより多くなると、固体電解質層14中のπ共役系導電性高分子の含有量が少なくなり、やはり充分な導電性が得られにくく、固体電解質層14の物性が変化することがある。 The compound having two or more carboxy groups is preferably in the range of 0.1 to 30 mol, more preferably in the range of 0.3 to 10 mol, relative to 1 mol of the anion group unit of the polyanion. When the content of the compound having two or more carboxy groups is less than 0.1 mol relative to 1 mol of the anion group unit of the polyanion, conductivity and heat resistance may be insufficient. In addition, when the content of the compound having two or more carboxy groups is more than 30 mol with respect to 1 mol of the anion group unit of the polyanion, the content of the π-conjugated conductive polymer in the solid electrolyte layer 14 is decreased. However, it is difficult to obtain sufficient conductivity, and the physical properties of the solid electrolyte layer 14 may change.
・1個以上のヒドロキシ基及び1個以上のカルボキシ基を有する化合物
1個以上のヒドロキシ基及び1個以上のカルボキシ基を有する化合物としては、酒石酸、グリセリン酸、ジメチロールブタン酸、ジメチロールプロパン酸、D−グルカル酸、グルタコン酸等が挙げられる。
-A compound having one or more hydroxy groups and one or more carboxy groups As a compound having one or more hydroxy groups and one or more carboxy groups, tartaric acid, glyceric acid, dimethylolbutanoic acid, dimethylolpropanoic acid , D-glucaric acid, glutaconic acid and the like.
1個以上のヒドロキシ基及び1個以上のカルボキシ基を有する化合物の含有量は、ポリアニオンとπ共役系導電性高分子の合計100質量部に対して1〜5,000質量部であることが好ましく、50〜500質量部であることがより好ましい。1個以上のヒドロキシ基及び1個以上のカルボキシ基を有する化合物の含有量が1質量部より少なくなると、導電性及び耐熱性が不足することがある。また、1個以上のヒドロキシ基及び1個以上のカルボキシ基を有する化合物の含有量が5,000質量部より多くなると、固体電解質層14中のπ共役系導電性高分子の含有量が少なくなり、やはり充分な導電性が得ることが難しい。 The content of the compound having one or more hydroxy groups and one or more carboxy groups is preferably 1 to 5,000 parts by mass with respect to 100 parts by mass in total of the polyanion and the π-conjugated conductive polymer. 50 to 500 parts by mass is more preferable. When the content of the compound having one or more hydroxy groups and one or more carboxy groups is less than 1 part by mass, conductivity and heat resistance may be insufficient. In addition, when the content of the compound having one or more hydroxy groups and one or more carboxy groups exceeds 5,000 parts by mass, the content of the π-conjugated conductive polymer in the solid electrolyte layer 14 decreases. Again, it is difficult to obtain sufficient conductivity.
・アミド化合物
アミド基を有する化合物は、−CO−NH−(COの部分は二重結合)で表されるアミド結合を分子中に有する単分子化合物である。すなわち、アミド化合物としては、例えば、上記結合の両末端に官能基を有する化合物、上記結合の一方の末端に環状化合物が結合された化合物、上記両末端の官能基が水素である尿素及び尿素誘導体などが挙げられる。
アミド化合物の具体例としては、アセトアミド、マロンアミド、スクシンアミド、マレアミド、フマルアミド、ベンズアミド、ナフトアミド、フタルアミド、イソフタルアミド、テレフタルアミド、ニコチンアミド、イソニコチンアミド、2−フルアミド、ホルムアミド、N−メチルホルムアミド、プロピオンアミド、プロピオルアミド、ブチルアミド、イソブチルアミド、メタクリルアミド、パルミトアミド、ステアリルアミド、オレアミド、オキサミド、グルタルアミド、アジプアミド、シンナムアミド、グリコールアミド、ラクトアミド、グリセルアミド、タルタルアミド、シトルアミド、グリオキシルアミド、ピルボアミド、アセトアセトアミド、ジメチルアセトアミド、ベンジルアミド、アントラニルアミド、エチレンジアミンテトラアセトアミド、ジアセトアミド、トリアセトアミド、ジベンズアミド、トリベンズアミド、ローダニン、尿素、1−アセチル−2−チオ尿素、ビウレット、ブチル尿素、ジブチル尿素、1,3−ジメチル尿素、1,3−ジエチル尿素及びこれらの誘導体等が挙げられる。
Amide Compound A compound having an amide group is a monomolecular compound having an amide bond represented by —CO—NH— (the CO moiety is a double bond) in the molecule. That is, as the amide compound, for example, a compound having functional groups at both ends of the bond, a compound in which a cyclic compound is bonded to one end of the bond, urea and urea derivatives in which the functional groups at both ends are hydrogen Etc.
Specific examples of amide compounds include acetamide, malonamide, succinamide, maleamide, fumaramide, benzamide, naphthamide, phthalamide, isophthalamide, terephthalamide, nicotinamide, isonicotinamide, 2-fluamide, formamide, N-methylformamide, propionamide , Propioluamide, butyramide, isobutylamide, methacrylamide, palmitoamide, stearylamide, oleamide, oxamide, glutaramide, adipamide, cinnamamide, glycolamide, lactamide, glyceramide, tartaramide, citrulamide, glyoxylamide, pyruvamide, acetoacetamide, dimethyl Acetamide, benzylamide, anthranilamide, ethylenediamine Laacetamide, diacetamide, triacetamide, dibenzamide, tribenzamide, rhodanine, urea, 1-acetyl-2-thiourea, biuret, butylurea, dibutylurea, 1,3-dimethylurea, 1,3-diethylurea and These derivatives are mentioned.
また、アミド化合物として、アクリルアミドを使用することもできる。アクリルアミドとしては、N−メチルアクリルアミド、N−メチルメタクリルアミド、N−エチルアクリルアミド、N−エチルメタクリルアミド、N,N−ジメチルアクリルアミド、N,N−ジメチルメタクリルアミド、N,N−ジエチルアクリルアミド、N,N−ジエチルメタクリルアミド、2−ヒドロキシエチルアクリルアミド、2−ヒドロキシエチルメタクリルアミド、N−メチロールアクリルアミド、N−メチロールメタクリルアミドなどが挙げられる。 Moreover, acrylamide can also be used as an amide compound. As acrylamide, N-methylacrylamide, N-methylmethacrylamide, N-ethylacrylamide, N-ethylmethacrylamide, N, N-dimethylacrylamide, N, N-dimethylmethacrylamide, N, N-diethylacrylamide, N, Examples thereof include N-diethyl methacrylamide, 2-hydroxyethyl acrylamide, 2-hydroxyethyl methacrylamide, N-methylol acrylamide, N-methylol methacrylamide and the like.
アミド化合物の分子量は46〜10,000であることが好ましく、46〜5,000であることがより好ましく、46〜1,000であることが特に好ましい。 The molecular weight of the amide compound is preferably 46 to 10,000, more preferably 46 to 5,000, and particularly preferably 46 to 1,000.
アミド化合物の含有量は、ポリアニオンとπ共役系導電性高分子の合計100質量部に対して1〜5,000質量部であることが好ましく、50〜500質量部であることがより好ましい。アミド化合物の含有量が1質量部より少なくなると、導電性及び耐熱性が不足することがある。また、アミド化合物の含有量が5,000質量部より多くなると、固体電解質層14中のπ共役系導電性高分子の含有量が少なくなり、やはり充分な導電性が得ることが難しい。 The content of the amide compound is preferably 1 to 5,000 parts by mass and more preferably 50 to 500 parts by mass with respect to 100 parts by mass in total of the polyanion and the π-conjugated conductive polymer. When the content of the amide compound is less than 1 part by mass, conductivity and heat resistance may be insufficient. Moreover, when the content of the amide compound is more than 5,000 parts by mass, the content of the π-conjugated conductive polymer in the solid electrolyte layer 14 is decreased, and it is difficult to obtain sufficient conductivity.
・イミド化合物
アミド化合物としては、導電性がより高くなることから、イミド結合を有する単分子化合物(以下、イミド化合物という。)が好ましい。イミド化合物としては、その骨格より、フタルイミド及びフタルイミド誘導体、スクシンイミド及びスクシンイミド誘導体、ベンズイミド及びベンズイミド誘導体、マレイミド及びマレイミド誘導体、ナフタルイミド及びナフタルイミド誘導体などが挙げられる。
-Imide compound As an amide compound, since electroconductivity becomes higher, the monomolecular compound (henceforth an imide compound) which has an imide bond is preferable. Examples of the imide compound include phthalimide and phthalimide derivatives, succinimide and succinimide derivatives, benzimide and benzimide derivatives, maleimide and maleimide derivatives, naphthalimide and naphthalimide derivatives from the skeleton.
また、イミド化合物は両末端の官能基の種類によって、脂肪族イミド、芳香族イミド等に分類されるが、溶解性の観点からは、脂肪族イミドが好ましい。
さらに、脂肪族イミド化合物は、分子内の炭素間に不飽和結合を有する飽和脂肪族イミド化合物と、分子内の炭素間に不飽和結合を有する不飽和脂肪族イミド化合物とに分類される。
飽和脂肪族イミド化合物は、R1−CO−NH−CO−R2で表される化合物であり、R1,R2の両方が飽和炭化水素である化合物である。具体的には、シクロヘキサン−1,2−ジカルボキシイミド、アラントイン、ヒダントイン、バルビツル酸、アロキサン、グルタルイミド、スクシンイミド、5−ブチルヒダントイン酸、5,5−ジメチルヒダントイン、1−メチルヒダントイン、1,5,5−トリメチルヒダントイン、5−ヒダントイン酢酸、N−ヒドロキシ−5−ノルボルネン−2,3−ジカルボキシイミド、セミカルバジド、α,α−ジメチル−6−メチルスクシンイミド、ビス[2−(スクシンイミドオキシカルボニルオキシ)エチル]スルホン、α−メチル−α−プロピルスクシンイミド、シクロヘキシルイミドなどが挙げられる。
不飽和脂肪族イミド化合物は、R1−CO−NH−CO−R2で表される化合物であり、R1,R2の一方又は両方が1つ以上の不飽和結合である化合物である。具体例は、1,3−ジプロピレン尿素、マレイミド、N−メチルマレイミド、N−エチルマレイミド、N−ヒドロキシマレイミド、1,4−ビスマレイミドブタン、1,6−ビスマレイミドヘキサン、1,8−ビスマレイミドオクタン、N−カルボキシヘプチルマレイミドなどが挙げられる。
Moreover, although an imide compound is classified into an aliphatic imide, an aromatic imide, etc. by the kind of functional group of both terminal, an aliphatic imide is preferable from a soluble viewpoint.
Furthermore, the aliphatic imide compound is classified into a saturated aliphatic imide compound having an unsaturated bond between carbons in the molecule and an unsaturated aliphatic imide compound having an unsaturated bond between carbons in the molecule.
The saturated aliphatic imide compound is a compound represented by R 1 —CO—NH—CO—R 2 , and is a compound in which both R 1 and R 2 are saturated hydrocarbons. Specifically, cyclohexane-1,2-dicarboximide, allantoin, hydantoin, barbituric acid, alloxan, glutarimide, succinimide, 5-butylhydantoic acid, 5,5-dimethylhydantoin, 1-methylhydantoin, 1,5 , 5-trimethylhydantoin, 5-hydantoin acetic acid, N-hydroxy-5-norbornene-2,3-dicarboximide, semicarbazide, α, α-dimethyl-6-methylsuccinimide, bis [2- (succinimidooxycarbonyloxy) Ethyl] sulfone, α-methyl-α-propylsuccinimide, cyclohexylimide and the like.
The unsaturated aliphatic imide compound is a compound represented by R 1 —CO—NH—CO—R 2 , and one or both of R 1 and R 2 are one or more unsaturated bonds. Specific examples are 1,3-dipropylene urea, maleimide, N-methylmaleimide, N-ethylmaleimide, N-hydroxymaleimide, 1,4-bismaleimide butane, 1,6-bismaleimide hexane, 1,8-bis. Maleimide octane, N-carboxyheptylmaleimide and the like can be mentioned.
イミド化合物の分子量は60〜5,000であることが好ましく、70〜1,000であることがより好ましく、80〜500であることが特に好ましい。 The molecular weight of the imide compound is preferably 60 to 5,000, more preferably 70 to 1,000, and particularly preferably 80 to 500.
イミド化合物の含有量は、π共役系導電性高分子とポリアニオンの合計100質量部に対して10〜10,000質量部であることが好ましく、50〜5,000質量部であることがより好ましい。アミド化合物及びイミド化合物の添加量が前記下限値未満であると、アミド化合物及びイミド化合物添加による効果が低くなるため好ましくない。また、前記上限値を超えると、π共役系導電性高分子濃度の低下に起因する導電性の低下が起こるため好ましくない。 The content of the imide compound is preferably 10 to 10,000 parts by mass, more preferably 50 to 5,000 parts by mass with respect to 100 parts by mass in total of the π-conjugated conductive polymer and the polyanion. . If the addition amount of the amide compound and the imide compound is less than the lower limit, the effect of the addition of the amide compound and the imide compound is lowered, which is not preferable. Moreover, when the said upper limit is exceeded, since the electroconductive fall resulting from the fall of (pi) conjugated system conductive polymer concentration will occur, it is unpreferable.
・ラクタム化合物
ラクタム化合物とは、アミノカルボン酸の分子内環状アミドであり、環の一部が−CO−NR−(Rは水素又は任意の置換基)である化合物である。ただし、環の一個以上の炭素原子が不飽和やヘテロ原子に置き換わっていてもよい。
ラクタム化合物としては、例えば、ペンタノ−4−ラクタム、4−ペンタンラクタム−5−メチル−2−ピロリドン、5−メチル−2−ピロリジノン、ヘキサノ−6−ラクタム、6−ヘキサンラクタム等が挙げられる。
-Lactam compound A lactam compound is an intramolecular cyclic amide of aminocarboxylic acid, and a part of the ring is -CO-NR- (R is hydrogen or an arbitrary substituent). However, one or more carbon atoms in the ring may be replaced with an unsaturated or heteroatom.
Examples of the lactam compound include pentano-4-lactam, 4-pentanelactam-5-methyl-2-pyrrolidone, 5-methyl-2-pyrrolidinone, hexano-6-lactam, 6-hexane lactam and the like.
ラクタム化合物の含有量は、π共役系導電性高分子とポリアニオンの合計100質量部に対して10〜10000質量部であることが好ましく、50〜5000質量部であることがより好ましい。ラクタム化合物の添加量が前記下限値未満であると、ラクタム化合物添加による効果が低くなるため好ましくない。また、前記上限値を超えると、π共役系導電性高分子濃度の低下に起因する導電性の低下が起こるため好ましくない。 The content of the lactam compound is preferably 10 to 10,000 parts by mass, and more preferably 50 to 5000 parts by mass with respect to 100 parts by mass in total of the π-conjugated conductive polymer and the polyanion. If the amount of the lactam compound added is less than the lower limit, the effect of the addition of the lactam compound is reduced, which is not preferable. Moreover, when the said upper limit is exceeded, since the electroconductive fall resulting from the fall of (pi) conjugated system conductive polymer concentration will occur, it is unpreferable.
・グリシジル基を有する化合物
グリシジル基を有する化合物としては、例えば、エチルグリシジルエーテル、ブチルグリシジルエーテル、t−ブチルグリシジルエーテル、アリルグリシジルエーテル、ベンジルグリシジルエーテル、グリシジルフェニルエーテル、ビスフェノールA、ジグリシジルエーテル、アクリル酸グリシジルエーテル、メタクリル酸グリシジルエーテル等のグリシジル化合物などが挙げられる。
-Compound having glycidyl group Examples of the compound having glycidyl group include ethyl glycidyl ether, butyl glycidyl ether, t-butyl glycidyl ether, allyl glycidyl ether, benzyl glycidyl ether, glycidyl phenyl ether, bisphenol A, diglycidyl ether, acrylic Examples thereof include glycidyl compounds such as acid glycidyl ether and methacrylic acid glycidyl ether.
グリシジル基を有する化合物の含有量は、π共役系導電性高分子とポリアニオンの合計100質量部に対して10〜10000質量部であることが好ましく、50〜5000質量部であることがより好ましい。グリシジル基を有する化合物の添加量が前記下限値未満であると、グリシジル基を有する化合物添加による効果が低くなるため好ましくない。また、前記上限値を超えると、π共役系導電性高分子濃度の低下に起因する導電性の低下が起こるため好ましくない。 The content of the compound having a glycidyl group is preferably 10 to 10,000 parts by mass, and more preferably 50 to 5000 parts by mass with respect to 100 parts by mass in total of the π-conjugated conductive polymer and the polyanion. When the amount of the compound having a glycidyl group is less than the lower limit, the effect of adding the compound having a glycidyl group is undesirably reduced. Moreover, when the said upper limit is exceeded, since the electroconductive fall resulting from the fall of (pi) conjugated system conductive polymer concentration will occur, it is unpreferable.
・水溶性有機溶媒
水溶性有機溶媒としては、例えば、N−メチル−2ピロリドン、N−メチルアセトアミド、N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、ジメチルスルホキシド、ヘキサメチレンホスホルトリアミド、N−ビニルピロリドン、N−ビニルホルムアミド、N−ビニルアセトアミド等の極性溶媒、クレゾール、フェノール、キシレノール等のフェノール類、エチレングリコール、プロピレングリコール、ジプロピレングリコール、1,3−ブチレングリコール、1,4ブチレングリコール、D−グルコース、D−グルシトール、イソプレングリコール、ブタンジオール、1,5−ペンタンジオール、1,6−ヘキサンジオール、1,9−ノナンジオール、ネオペンチルグリコール等の多価脂肪族アルコール類、エチレンカーボネート、プロピレンカーボネート等のカーボネート化合物、ジオキサン、ジエチルエーテル等のエーテル化合物、ジアルキルエーテル、プロピレングリコールジアルキルエーテル、ポリエチレングリコールジアルキルエーテル、ポリプロピレングリコールジアルキルエーテル等の鎖状エーテル類、3−メチル−2−オキサゾリジノン等の複素環化合物、アセトニトリル、グルタロニトリル、メトキシアセトニトリル、プロピオニトリル、ベンゾニトリル等のニトリル化合物等が挙げられる。これらの溶媒は、単独で用いてもよいし、2種類以上の混合物としてもよい。
Water-soluble organic solvent Examples of the water-soluble organic solvent include N-methyl-2pyrrolidone, N-methylacetamide, N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide, hexamethylene phosphortriamide, N -Polar solvents such as vinylpyrrolidone, N-vinylformamide, N-vinylacetamide, phenols such as cresol, phenol, xylenol, ethylene glycol, propylene glycol, dipropylene glycol, 1,3-butylene glycol, 1,4 butylene glycol , D-glucose, D-glucitol, isoprene glycol, butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,9-nonanediol, neopentylglycol, and other polyhydric aliphatic alcohols Carbonate compounds such as ethylene carbonate and propylene carbonate, ether compounds such as dioxane and diethyl ether, chain ethers such as dialkyl ether, propylene glycol dialkyl ether, polyethylene glycol dialkyl ether and polypropylene glycol dialkyl ether, 3-methyl-2- Examples include heterocyclic compounds such as oxazolidinone, and nitrile compounds such as acetonitrile, glutaronitrile, methoxyacetonitrile, propionitrile, and benzonitrile. These solvents may be used alone or as a mixture of two or more.
(添加剤)
導電性組成物には、必要に応じて、添加剤が含まれてもよい。添加剤としてはπ共役系導電性高分子及びポリアニオンと混合しうるものであれば特に制限されず、例えば、無機導電剤、消泡剤、カップリング剤、酸化防止剤、紫外線吸収剤などを使用できる。
無機導電剤としては、金属イオン(金属塩を水に溶解させて形成する)類、導電性カーボン等が挙げられる。
消泡剤としては、シリコーン樹脂、ポリジメチルシロキサン、シリコーンレジン等が挙げられる。
カップリング剤としては、ビニル基、アミノ基、エポキシ基等を有するシランカップリング剤等が挙げられる。
酸化防止剤としては、フェノール系酸化防止剤、アミン系酸化防止剤、リン系酸化防止剤、硫黄系酸化防止剤、糖類、ビタミン類等が挙げられる。
紫外線吸収剤としては、ベンゾトリアゾール系紫外線吸収剤、ベンゾフェノン系紫外線吸収剤、サリシレート系紫外線吸収剤、シアノアクリレート系紫外線吸収剤、オギザニリド系紫外線吸収剤、ヒンダードアミン系紫外線吸収剤、ベンゾエート系紫外線吸収剤等が挙げられる。酸化防止剤と紫外線吸収剤とは併用することが好ましい。
(Additive)
The conductive composition may contain an additive as necessary. The additive is not particularly limited as long as it can be mixed with a π-conjugated conductive polymer and a polyanion. For example, an inorganic conductive agent, an antifoaming agent, a coupling agent, an antioxidant, an ultraviolet absorber, or the like is used. it can.
Examples of the inorganic conductive agent include metal ions (formed by dissolving a metal salt in water), conductive carbon, and the like.
Examples of the antifoaming agent include silicone resin, polydimethylsiloxane, and silicone resin.
Examples of the coupling agent include silane coupling agents having a vinyl group, an amino group, an epoxy group, and the like.
Examples of the antioxidant include phenolic antioxidants, amine antioxidants, phosphorus antioxidants, sulfur antioxidants, saccharides, vitamins and the like.
Examples of UV absorbers include benzotriazole UV absorbers, benzophenone UV absorbers, salicylate UV absorbers, cyanoacrylate UV absorbers, oxanilide UV absorbers, hindered amine UV absorbers, and benzoate UV absorbers. Is mentioned. It is preferable to use an antioxidant and an ultraviolet absorber in combination.
(導電膜の厚さ)
導電膜の厚さは0.001〜10μmであることが好ましく、0.01〜1μmであることがより好ましい。導電膜の厚みが0.001μm以上であれば、充分な導電性を確保でき、10μm以下であれば、充分な可撓性を確保できる。
(Thickness of conductive film)
The thickness of the conductive film is preferably 0.001 to 10 μm, and more preferably 0.01 to 1 μm. If the thickness of the conductive film is 0.001 μm or more, sufficient conductivity can be secured, and if it is 10 μm or less, sufficient flexibility can be secured.
(導電膜の表面抵抗値)
導電膜の表面抵抗値としては、目的に応じて適宜選択することができ、例えば、5,000Ω以下であるが、2,500Ω以下であることが好ましく、500Ω以下であることがより好ましい。
(Surface resistance value of conductive film)
The surface resistance value of the conductive film can be appropriately selected according to the purpose, and is, for example, 5,000Ω or less, preferably 2,500Ω or less, and more preferably 500Ω or less.
<透明導電体の製造方法>
本発明の透明導電体の製造方法は、透明基体の少なくとも片面に導電性塗料を塗布し、硬化する方法である。ここで、導電性塗料とは、π共役系導電性高分子とポリアニオンとフッ素含有エポキシ化合物と溶剤とを必須成分として含有し、バインダと硬化剤と導電性向上剤と添加剤を任意成分として含有する。
<Method for producing transparent conductor>
The method for producing a transparent conductor of the present invention is a method in which a conductive paint is applied to at least one surface of a transparent substrate and cured. Here, the conductive paint contains a π-conjugated conductive polymer, a polyanion, a fluorine-containing epoxy compound, and a solvent as essential components, and a binder, a curing agent, a conductivity improver, and an additive as optional components. To do.
導電性塗料がバインダとしてオキセタン化合物やエポキシ化合物を含む場合には、得られる導電膜の耐水性と強度がより高くなることから、オキセタン/エポキシ用の硬化剤を含有することが好ましい。
硬化剤としては、例えば、アミン系硬化剤、酸または酸無水物系硬化剤、塩基性活性水素化合物、イミダゾール類、ポリメルカプタン系硬化剤、イソシアネート系硬化剤等が挙げられる。
アミン系硬化剤としては、エチレンジアミン、ジエチレントリアミン、トリエチレンテトラミン等の脂肪族ポリアミン、イソホロンジアミン、1,3−ビスアミノメチルシクロヘキサン等の脂肪族ポリアミン、ジアミノジフェニルメタン、ジアミノジフェニルスルフォン等の芳香族ポリアミン、直鎖状ジアミン、テトラメチルグアニジン、トリエタノール、アミン、ピペリジン、ピリジン、ベンジルジメチルアミン等の2級アミン類または、3級アミン類、ダイマー酸とジエチレントリアミン、トリエチレンテトラミン等のポリアミンとを反応させて得たポリアミドアミンなどが挙げられる。
酸または、酸無水物系硬化剤として、例えば、アジピン酸、アゼライン酸、トリメリット酸、ピロメリット酸、デカンジカルボン酸等のポリカルボン酸、無水フタル酸、無水トリメリット酸、無水ピロメリット酸、3,3’,4,4’−ベンゾフェノンテトラカルボン酸無水物等の芳香族無水物、無水マレイン酸、無水コハク酸、テトラヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸等の環状脂肪族酸無水物、ポリアジピン酸無水物、ポリアゼライン酸無水物、ポリセバシン酸無水物、ドデセニル無水コハク酸、ポリ(エチル)オクタデカン二酸)無水物等の脂肪族酸無水物などが挙げられる。
活性水素化合物としては、例えば、有機酸ジヒドラジドなどが挙げられる。
イミダゾールとしては、例えば、2−メチルイミダゾール、2−エチル−4−メチルイミダゾール、2−ヘプタンデシルイミダゾールなどが挙げられる。
ポリメルカプタン系硬化剤としては、例えば、ペンタエリスリトールテトラチオグリコーレート、ジペンタエリスリトールヘキサチオグリコレート等のチオグリコール酸のエステルなどが挙げられる。
イソシアネート系硬化剤としては、例えば、ヘキサメチレンジイソシアネート、キシレンジイソシアネート等のイソシアネート化合物、イソシアネート基をフェノール、アルコール、カプロラクトン等と反応させてブロックイソシアネート化合物などが挙げられる。
When the conductive coating contains an oxetane compound or an epoxy compound as a binder, the water resistance and strength of the obtained conductive film are further increased, and therefore it is preferable to contain a curing agent for oxetane / epoxy.
Examples of the curing agent include amine curing agents, acid or acid anhydride curing agents, basic active hydrogen compounds, imidazoles, polymercaptan curing agents, and isocyanate curing agents.
Examples of amine curing agents include aliphatic polyamines such as ethylenediamine, diethylenetriamine and triethylenetetramine, aliphatic polyamines such as isophoronediamine and 1,3-bisaminomethylcyclohexane, aromatic polyamines such as diaminodiphenylmethane and diaminodiphenylsulfone, It is obtained by reacting secondary amines such as chain diamine, tetramethylguanidine, triethanol, amine, piperidine, pyridine, benzyldimethylamine or tertiary amines, dimer acid and polyamines such as diethylenetriamine and triethylenetetramine. And polyamidoamine.
Examples of acid or acid anhydride curing agents include polycarboxylic acids such as adipic acid, azelaic acid, trimellitic acid, pyromellitic acid, decanedicarboxylic acid, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, Aromatic anhydrides such as 3,3 ′, 4,4′-benzophenonetetracarboxylic anhydride, cyclic aliphatic acid anhydrides such as maleic anhydride, succinic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, Examples thereof include aliphatic acid anhydrides such as polyadipic acid anhydride, polyazeline acid anhydride, polysebacic acid anhydride, dodecenyl succinic anhydride, poly (ethyl) octadecanedioic acid) anhydride, and the like.
Examples of the active hydrogen compound include organic acid dihydrazide.
Examples of imidazole include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-heptanedecylimidazole, and the like.
Examples of the polymercaptan curing agent include esters of thioglycolic acid such as pentaerythritol tetrathioglycolate and dipentaerythritol hexathioglycolate.
Examples of the isocyanate curing agent include isocyanate compounds such as hexamethylene diisocyanate and xylene diisocyanate, and blocked isocyanate compounds obtained by reacting an isocyanate group with phenol, alcohol, caprolactone, and the like.
また、オキセタン化合物やエポキシ化合物を迅速にかつ充分に硬化させることから、導電性塗料は、カチオン発生化合物を含有することが好ましい。
カチオン発生化合物は、ルイス酸を発生させる化合物である。ここで、カチオン発生化合物の具体例としては、光カチオン開始剤、熱カチオン開始剤等が挙げられる。光カチオン開始剤と熱カチオン開始剤は併用しても構わない。
Moreover, since an oxetane compound and an epoxy compound are hardened rapidly and fully, it is preferable that a conductive paint contains a cation generating compound.
The cation generating compound is a compound that generates a Lewis acid. Here, specific examples of the cation generating compound include a photo cation initiator and a thermal cation initiator. The photo cation initiator and the thermal cation initiator may be used in combination.
光カチオン開始剤としては、例えば、ルイス酸のジアゾニウム塩、ルイス酸のヨードニウム塩、ルイス酸のスルホニウム塩等が挙げられる。これらは、カチオン部分が、芳香族ジアゾニウム、芳香族ヨードニウム、芳香族スルホニウム等であり、アニオン部分が、(四フッ化ホウ素(BF4 −)、六フッ化リン(PF6 −)、六フッ化アンチモン(SbF6 −)、[BX4]−(ただし、Xは少なくとも2つ以上のフッ素またはトリフルオロメチル基で置換されたフェニル基である。)等に構成されたオニウム塩である。
具体例としては、例えば、四フッ化ホウ素のフェニルジアゾニウム塩、六フッ化リンのジフェニルヨードニウム塩、六フッ化アンチモンのジフェニルヨードニウム塩、六フッ化ヒ素のトリ−4−メチルフェニルスルホニウム塩、四フッ化アンチモンのトリ−4−メチルフェニルスルホニウム塩、テトラキス(ペンタフルオロフェニル)ホウ素のジフェニルヨードニウム塩、アセチルアセトンアルミニウム塩とオルトニトロベンジルシリルエーテル混合体、フェニルチオピリジニウム塩、六フッ化リンアレン−鉄錯体が挙げられる。
光カチオン開始剤の市販品としては、CD−1012(サートマー社製)。PCI−019、PCI−021(日本化薬社製)、オプトマーSP−150、オプトマーSP−170(ADEKA社製)、UVI−6990(ダウケミカル社製)、CPI−100P、CPI100A(サンアプロ社製)、TEPBI−S(日本触媒社製)、WPI031、WPI−054、WPI−113、WPI−116、WPI−170(和光純薬工業社製)、イルガキュア250(チバ・スペシャルティ・ケミカル社製)等が挙げられる。
Examples of the photocation initiator include diazonium salts of Lewis acids, iodonium salts of Lewis acids, sulfonium salts of Lewis acids, and the like. In these, the cation part is aromatic diazonium, aromatic iodonium, aromatic sulfonium, etc., and the anion part is (boron tetrafluoride (BF 4 − ), phosphorus hexafluoride (PF 6 − ), hexafluoride. An onium salt composed of antimony (SbF 6 − ), [BX 4 ] − (wherein X is a phenyl group substituted with at least two fluorine or trifluoromethyl groups) and the like.
Specific examples include phenyldiazonium salt of boron tetrafluoride, diphenyliodonium salt of phosphorus hexafluoride, diphenyliodonium salt of antimony hexafluoride, tri-4-methylphenylsulfonium salt of arsenic hexafluoride, tetrafluoro Antimony tri-4-methylphenylsulfonium salt, tetrakis (pentafluorophenyl) boron diphenyliodonium salt, acetylacetone aluminum salt and orthonitrobenzylsilyl ether mixture, phenylthiopyridinium salt, phosphorus hexafluoride allene-iron complex It is done.
As a commercial product of a photocationic initiator, CD-1012 (manufactured by Sartomer). PCI-019, PCI-021 (Nippon Kayaku Co., Ltd.), Optomer SP-150, Optomer SP-170 (ADEKA), UVI-6990 (Dow Chemical), CPI-100P, CPI100A (San Apro) , TEPBI-S (manufactured by Nippon Shokubai Co., Ltd.), WPI031, WPI-054, WPI-113, WPI-116, WPI-170 (manufactured by Wako Pure Chemical Industries, Ltd.), Irgacure 250 (manufactured by Ciba Specialty Chemical Company), etc. Can be mentioned.
熱カチオン開始剤としては、芳香族オニウム塩、トリフル酸塩、三フッ化ホウ素エーテル錯体化合物および三フッ化ホウ素等のようなカチオン系またはプロトン酸触媒が挙げられる。そのなかでも、芳香族オニウム塩が好ましい。芳香族オニウム塩は熱によりカチオン種を発生するものがあり、熱カチオン重合開始剤として用いることもできる。例えば、三新化学社から入手できるサンエイドSI−60L、SI−80L、SI−100L、SI−110L、SI−180Lなどの芳香族スルホニウム塩が挙げられる。
三新化学社製以外の熱カチオン開始剤としては、例えば、アデカオプトンCP−66、CP−77(ADEKA社製)、CI−2920、CI2921、CI2946、CI−2639、CI−2624、CI−2064(日本曹達社製)、FC−520(スリーエム社製)等が挙げられる。
上記カチオン発生化合物は1種を単独で使用してもよいし、2種以上を併用してもよい。
Thermal cationic initiators include cationic or protonic acid catalysts such as aromatic onium salts, triflate salts, boron trifluoride ether complex compounds and boron trifluoride. Of these, aromatic onium salts are preferred. Some aromatic onium salts generate cationic species by heat, and can also be used as a thermal cationic polymerization initiator. For example, aromatic sulfonium salts such as Sun-Aid SI-60L, SI-80L, SI-100L, SI-110L, SI-180L available from Sanshin Chemical Co., Ltd. can be mentioned.
Examples of thermal cation initiators other than those manufactured by Sanshin Chemical Co., Ltd. include Adeka Opton CP-66, CP-77 (manufactured by ADEKA), CI-2920, CI2921, CI2946, CI-2638, CI-2624, CI-2064 ( Nippon Soda Co., Ltd.), FC-520 (manufactured by 3M), and the like.
The said cation generating compound may be used individually by 1 type, and may use 2 or more types together.
硬化剤とカチオン発生剤の合計の含有量は、オキセタン化合物やエポキシ化合物を100質量%とした際の0.1〜100質量%であることが好ましく、1〜80質量%であることがより好ましい。硬化剤とカチオン発生剤の合計の含有量が0.1質量%以上であれば、オキセタン化合物やエポキシ化合物を充分に硬化でき、100質量%以下であれば、導電性塗料から形成される導電膜においてバインダの特性を充分に発揮できる。 The total content of the curing agent and the cation generator is preferably 0.1 to 100% by mass, more preferably 1 to 80% by mass when the oxetane compound or the epoxy compound is 100% by mass. . If the total content of the curing agent and the cation generator is 0.1% by mass or more, the oxetane compound or the epoxy compound can be sufficiently cured, and if it is 100% by mass or less, the conductive film formed from the conductive paint. Can sufficiently exhibit the characteristics of the binder.
導電性塗料がバインダとしてアクリル化合物を含有する場合、アクリル化合物の重合では、ラジカル重合法、熱重合法、光ラジカル重合法、カチオン重合法、プラズマ重合法を適用できる。
ラジカル重合法では、重合開始剤として、例えばアゾビスイソブチロニトリル等のアゾ化合物、過酸化ベンゾイル、ジアシルペルオキシド類、ペルオキシエステル類、ヒドロペルオキシド類等の過酸化物などを用いて重合する。
光ラジカル重合法では、重合開始剤として、カルボニル化合物、イオウ化合物、有機過酸化物、アゾ化合物などを用いて重合する。具体的には、ベンゾフェノン、ミヒラーズケトン、キサントン、チオキサントン、2−エチルアントラキノン、アセトフェノン、トリクロロアセトフェノン、2−ヒドロキシ−2−メチル−プロピオフェノン、1−ヒドロキシシクロヘキシルフェニルケトン、ベンゾインエーテル、2,2−ジエトキシアセトフェノン、2,2−ジメトキシ−2−フェニルアセトフェノン、ベンジル、メチルベンゾイルホルメート、1−フェニル−1,2−プロパンジオン−2−(o−ベンゾイル)オキシム、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキシド、テトラメチルチウラム、ジチオカーバメート、過酸化ベンゾイル、N−ラウリルピリジウムアジド、ポリメチルフェニルシランなどが挙げられる。さらに、光ラジカル重合法光増感剤として、n−ブチルアミン、トリエチルアミン、トリ−n−ブチルホスフィン等を混合できる。
また、カチオン重合法では、カチオン重合開始剤として、アリールジアゾニウム塩類、ジアリールハロニウム塩類、トリフェニルスルホニウム塩類、シラノール/アルミニウムキレート、α−スルホニルオキシケトン類等を用いることができる。
プラズマ重合では、プラズマを短時間照射し、プラズマの電子衝撃によるエネルギーを受けて、フラグメンテーションとリアレンジメントをしたのち、ラジカルの再結合により重合体を生成する。
When the conductive paint contains an acrylic compound as a binder, a radical polymerization method, a thermal polymerization method, a photo radical polymerization method, a cationic polymerization method, and a plasma polymerization method can be applied to the polymerization of the acrylic compound.
In the radical polymerization method, polymerization is performed using, for example, an azo compound such as azobisisobutyronitrile, a peroxide such as benzoyl peroxide, diacyl peroxides, peroxyesters, and hydroperoxides as a polymerization initiator.
In the photo radical polymerization method, polymerization is performed using a carbonyl compound, a sulfur compound, an organic peroxide, an azo compound, or the like as a polymerization initiator. Specifically, benzophenone, Michler's ketone, xanthone, thioxanthone, 2-ethylanthraquinone, acetophenone, trichloroacetophenone, 2-hydroxy-2-methyl-propiophenone, 1-hydroxycyclohexyl phenyl ketone, benzoin ether, 2,2-di Ethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, benzyl, methylbenzoylformate, 1-phenyl-1,2-propanedione-2- (o-benzoyl) oxime, 2,4,6-trimethylbenzoyldiphenyl Examples include phosphine oxide, tetramethylthiuram, dithiocarbamate, benzoyl peroxide, N-laurylpyridium azide, and polymethylphenylsilane. Furthermore, n-butylamine, triethylamine, tri-n-butylphosphine, or the like can be mixed as a photosensitizer for photo radical polymerization.
In the cationic polymerization method, aryldiazonium salts, diarylhalonium salts, triphenylsulfonium salts, silanol / aluminum chelates, α-sulfonyloxy ketones, and the like can be used as the cationic polymerization initiator.
In plasma polymerization, plasma is irradiated for a short time, receives energy from electron bombardment of the plasma, performs fragmentation and rearrangement, and then generates a polymer by recombination of radicals.
溶剤としては特に制限されないが、前記のポリアニオンを溶解しやすいことから水系溶剤が好ましい。
水系溶剤としては、溶解度パラメータが10以上の溶剤が挙げられ、例えば、水の他、メタノール、エタノール、イソプロピルアルコールなどのアルコール類、エチレングリコール、ジエチレングリコール、トリエチレングリコール、ポリエチレングリコール、プロピレングリコールなどのグリコール類、グリセリン、ポリグリセリン、1,2-ブタンジオール、1,3−ブタンジオール、1,4-ブタンジオール、2,3−ブタンジオール等の多価アルコール類、N−メチルピロリドン、ジメチルアセトアミド、ジメチルホルムアミドなどのアミド類などが挙げられる。これら溶剤は1種を単独で使用してもよいし、2種以上を併用してもよい。
The solvent is not particularly limited, but an aqueous solvent is preferable because it easily dissolves the polyanion.
Examples of the aqueous solvent include solvents having a solubility parameter of 10 or more, for example, water, alcohols such as methanol, ethanol and isopropyl alcohol, glycols such as ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol and propylene glycol. Glycerin, polyglycerin, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol and other polyhydric alcohols, N-methylpyrrolidone, dimethylacetamide, dimethyl Examples include amides such as formamide. These solvents may be used alone or in combination of two or more.
導電性塗料における溶剤の含有量は、フッ素含有のエポキシ化合物およびバインダを充分に溶解させるために、40〜99質量%が好ましく、50〜98質量%がより好ましい。溶剤の含有量が40質量%未満であると、フッ素含有の飽和エポキシ化合物とバインダの溶解性に支障をきたし、得られる導電性塗料の安定性が不充分になることがあり、99質量%を超えると、π共役系導電性高分子の分散性が不充分になることがある。 The content of the solvent in the conductive paint is preferably 40 to 99% by mass, and more preferably 50 to 98% by mass in order to sufficiently dissolve the fluorine-containing epoxy compound and the binder. When the content of the solvent is less than 40% by mass, the solubility of the fluorine-containing saturated epoxy compound and the binder may be hindered, and the stability of the obtained conductive paint may be insufficient. If it exceeds, the dispersibility of the π-conjugated conductive polymer may be insufficient.
導電性塗料は、例えば、ポリアニオンの水溶液中でπ共役系導電性高分子の前駆体モノマーを化学酸化重合した後、溶剤、フッ素含有エポキシ化合物を添加することで調製できる。化学酸化重合後、水は除去しても構わない。 The conductive paint can be prepared, for example, by chemically oxidatively polymerizing a precursor monomer of a π-conjugated conductive polymer in an aqueous solution of polyanion and then adding a solvent and a fluorine-containing epoxy compound. After chemical oxidative polymerization, water may be removed.
導電性高分子溶液の塗布方法として、例えば、バーコーティング、コンマコーティング、リバースコーティング、リップコーティング、スプレーコーティング、フレキソ印刷、グラビア印刷などが適用される。導電性高分子溶液塗布後には、硬化処理を施すことが好ましい。 硬化方法としては、加熱または光照射が適用される。加熱方法としては、例えば、熱風加熱や赤外線加熱などの通常の方法を採用できる。また、光照射により硬化する場合には、例えば、超高圧水銀灯、高圧水銀灯、低圧水銀灯、カーボンアーク、キセノンアーク、メタルハライドランプなどの光源から紫外線を照射する方法を採用できる。
紫外線照射における照度は100mW/cm2以上が好ましい。還元剤がアクリル化合物の重合を阻害することがあるため、照度が100mW/cm2未満であると、充分に架橋せず、導電性塗膜の耐摺動性(耐久性)が低くなる傾向にある。なお、本発明における照度は、トプコン社製UVR−T1(工業用UVチェッカー、受光器;UD−T36、測定波長範囲;300〜390nm、ピーク感度波長;約355nm)を用いて測定した値である。
以上のような手法で、本発明の透明導電体を得ることができる。
As a method for applying the conductive polymer solution, for example, bar coating, comma coating, reverse coating, lip coating, spray coating, flexographic printing, gravure printing, and the like are applied. It is preferable to perform a curing treatment after the application of the conductive polymer solution. As the curing method, heating or light irradiation is applied. As a heating method, for example, a normal method such as hot air heating or infrared heating can be employed. Moreover, when hardening by light irradiation, the method of irradiating an ultraviolet-ray from light sources, such as an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc, a xenon arc, a metal halide lamp, can be employ | adopted, for example.
The illuminance upon UV irradiation is preferably 100 mW / cm 2 or more. Since the reducing agent may inhibit the polymerization of the acrylic compound, if the illuminance is less than 100 mW / cm 2 , it does not sufficiently crosslink, and the sliding resistance (durability) of the conductive coating tends to decrease. is there. In addition, the illumination intensity in this invention is the value measured using Topcon Co., Ltd. UVR-T1 (Industrial UV checker, light receiver; UD-T36, measurement wavelength range; 300-390 nm, peak sensitivity wavelength; about 355 nm). .
The transparent conductor of this invention can be obtained with the above methods.
本発明における透明導電体の導電膜は、フッ素含有エポキシ化合物の添加により、耐エタノール性が著しく向上した。耐エタノール性が高いと、製造工程中で導電膜の汚れを拭く場合、エタノール洗浄により容易に汚れを除去することができる。また、フッ素含有エポキシ化合物の添加により、表面の滑り性が向上するため、導電膜の耐傷付き性が高くなる。耐傷付き性が高いと、工程中の取り扱いで導電膜の表面に傷を付けて抵抗値の均一性を損なうといった重大欠陥を防止でき、製品率が向上するといった効果を有する。さらに、導電膜がフッ素含有エポキシ化合物を含有しても、耐水性、導電性、透明性、透明基体に対する密着性は損なわれない。
本発明の透明導電体は、表示デバイスの透明電極として用いることができる。表示デバイスとしては、例えば、エレクトロルミネッセンスディスプレイ、液晶ディスプレイ等が挙げられる。
In the transparent conductive film of the present invention, ethanol resistance was remarkably improved by the addition of the fluorine-containing epoxy compound. When the ethanol resistance is high, the dirt can be easily removed by washing with ethanol when the dirt on the conductive film is wiped during the manufacturing process. In addition, the addition of the fluorine-containing epoxy compound improves the surface slipperiness, so that the scratch resistance of the conductive film is increased. When the scratch resistance is high, it is possible to prevent a serious defect that damages the uniformity of the resistance value by scratching the surface of the conductive film by handling in the process, and the product rate is improved. Furthermore, even if the conductive film contains a fluorine-containing epoxy compound, water resistance, conductivity, transparency, and adhesion to a transparent substrate are not impaired.
The transparent conductor of the present invention can be used as a transparent electrode of a display device. Examples of the display device include an electroluminescence display and a liquid crystal display.
「入力デバイス」
本発明の入力デバイスは、上記本発明の透明導電体を透明電極として備えるものである。入力デバイスの中でも、本発明の効果がとりわけ発揮されることから、抵抗膜式タッチパネルが好適である。
以下、上記本発明の透明導電体を透明電極として備えた抵抗膜式タッチパネルの例について説明する。
本例の抵抗膜式タッチパネルは、図1に示すように、透明基体11表面に導電膜12が形成され、入力者側に配置された可動電極シート10と、透明基体21表面に導電膜22が形成され、画像表示装置側に配置された固定電極シート20とが、導電膜12と導電膜22が対向するように設けられたものである。また、可動電極シート10と固定電極シート20との間には、透明なドットスペーサ24が配置されて、隙間が形成されている。
"Input device"
The input device of the present invention comprises the transparent conductor of the present invention as a transparent electrode. Among the input devices, the resistive touch panel is preferable because the effects of the present invention are particularly exhibited.
Hereinafter, an example of a resistive film type touch panel provided with the transparent conductor of the present invention as a transparent electrode will be described.
As shown in FIG. 1, the resistive touch panel of this example has a
可動電極シート10または固定電極シート20の透明基体11,21としては、例えば、単層または2層以上のプラスチックフィルム、ガラス板、フィルムとガラス板との積層体が挙げられる。ただし、可動電極シート10の透明基体11としては、可撓性を有することから、プラスチックフィルムが好ましく、固定電極シート20の透明基体21としては、固定しやすいことから、ガラス板を用いたものが好ましい。
Examples of the
可動電極シート10の透明基体11の厚さは100〜250μmであることが好ましい。透明基体11の厚さが100μm以上であれば、充分な強度を確保でき、250μm以下であれば、充分な可撓性を確保できる。可動電極シート10の導電膜12の厚さは50〜700μmであることが好ましい。透明基体11の厚さが50μm以上であれば、充分な導電性を確保でき、700μm以下であれば、充分な可撓性及び透明性を確保できる。 固定電極シート20の透明基体21の厚さは0.8〜2.5mmであることが好ましい。透明基体11の厚さが0.8mm以上であれば、充分な強度を確保でき、2.5mm以下であれば、薄くすることができ、省スペース化を実現できる。固定電極シート20の同導電膜22の厚さは0.01〜1.0μmであることが好ましい。導電膜22の厚さが0.01μm以上であれば、充分な導電性を確保でき、1.0μm以下であれば、薄くすることができ、省スペース化を実現できる。可動電極シート10と固定電極シート20の非押圧時の間隔は20〜100μmであることが好ましい。可動電極シート10と固定電極シート20の非押圧時の間隔は20μm以上であれば、非押圧時に可動電極シート10と固定電極シート20とを確実に接触させないようにすることができ、100μm以下であれば、押圧時に可動電極シート10と固定電極シート20とを確実に接触させることができる。前記間隔になるようにするためには、ドットスペーサ24の大きさを適宜選択すればよい。
The thickness of the
この抵抗膜式タッチパネルでは、指またはスタイラスにより可動電極シート10を押した際に、可動電極シート10の導電膜12と、固定電極シート20の同導電膜22とを接触させて導通させ、その際の電圧を取り込んで、位置を検出するようになっている。
In this resistive touch panel, when the
また、入力デバイスは静電容量式タッチパネルであってもよい。前記導電膜を用いた静電容量式タッチパネルとしては、例えば、前記導電膜からなる一対の透明電極が透明基体の両面に設けられ、透明電極全体に低圧の電界を形成し、指で触れることで表面電荷の変化を捉え、位置を検出するものが挙げられる。 The input device may be a capacitive touch panel. As a capacitive touch panel using the conductive film, for example, a pair of transparent electrodes made of the conductive film is provided on both surfaces of a transparent substrate, and a low-voltage electric field is formed on the entire transparent electrode and touched with a finger. One that detects changes in surface charge and detects the position can be mentioned.
このような入力デバイスは、例えば、電子手帳、携帯情報端末(PDA)、携帯電話、PHS、現金自動預け払い機(ATM)、自動販売機、販売時点情報管理(POS)用レジスタなどに備え付けられる。 Such an input device is provided in, for example, an electronic notebook, a personal digital assistant (PDA), a mobile phone, a PHS, an automatic teller machine (ATM), a vending machine, a point-of-sale information management (POS) register, and the like. .
以下、本発明の実施例を具体的に示すが、本発明は実施例により限定されるものではない。
(製造例1)ポリスチレンスルホン酸の調製
1000mlのイオン交換水に206gのスチレンスルホン酸ナトリウムを溶解し、80℃で攪拌しながら、予め10mlの水に溶解した1.14gの過硫酸アンモニウム酸化剤溶液を20分間滴下し、この溶液を2時間攪拌した。
これにより得られたスチレンスルホン酸ナトリウム含有溶液に10質量%に希釈した硫酸を1000mlと10000mlのイオン交換水を添加し、限外ろ過法を用いてポリスチレンスルホン酸含有溶液の約10000ml溶液を除去し、残液に10000mlのイオン交換水を加え、限外ろ過法を用いて約10000ml溶液を除去した。上記の限外ろ過操作を3回繰り返した。
さらに、得られたろ液に約10000mlのイオン交換水を添加し、限外ろ過法を用いて約10000ml溶液を除去した。この限外ろ過操作を3回繰り返した。
限外ろ過条件は下記の通りとした(他の例でも同様)。
限外ろ過膜の分画分子量:30K
クロスフロー式
供給液流量:3000ml/分
膜分圧:0.12Pa
得られた溶液中の水を減圧除去して、無色の固形状のポリスチレンスルホン酸を得た。
Examples of the present invention will be specifically described below, but the present invention is not limited to the examples.
(Production Example 1) Preparation of polystyrene sulfonic acid 206 g of sodium styrene sulfonate was dissolved in 1000 ml of ion-exchanged water, and 1.14 g of ammonium persulfate oxidizing agent solution previously dissolved in 10 ml of water was stirred at 80 ° C. The solution was added dropwise for 20 minutes, and the solution was stirred for 2 hours.
1000 ml and 10,000 ml of ion-exchanged water diluted with 10% by mass of sulfuric acid diluted to 10% by mass were added to the sodium styrenesulfonate-containing solution thus obtained, and about 10,000 ml of the polystyrenesulfonic acid-containing solution was removed using an ultrafiltration method. Then, 10,000 ml of ion-exchanged water was added to the remaining liquid, and about 10,000 ml of solution was removed using an ultrafiltration method. The above ultrafiltration operation was repeated three times.
Furthermore, about 10,000 ml of ion-exchanged water was added to the obtained filtrate, and about 10,000 ml of solution was removed using an ultrafiltration method. This ultrafiltration operation was repeated three times.
The ultrafiltration conditions were as follows (the same applies to other examples).
Molecular weight cut off of ultrafiltration membrane: 30K
Cross flow type Supply liquid flow rate: 3000 ml / min Membrane partial pressure: 0.12 Pa
Water in the obtained solution was removed under reduced pressure to obtain colorless solid polystyrene sulfonic acid.
(製造例2)
ポリスチレンスルホン酸ドープポリ(3,4−エチレンジオキシチオフェン)水溶液の調製14.2gの3,4−エチレンジオキシチオフェンと、36.7gの製造例1で得たポリスチレンスルホン酸を2000mlのイオン交換水に溶かした溶液とを20℃で混合した。
これにより得られた混合溶液を20℃に保ち、掻き混ぜながら、200mlのイオン交換水に溶かした29.64gの過硫酸アンモニウムと8.0gの硫酸第二鉄の酸化触媒溶液とをゆっくり添加し、3時間攪拌して反応させた。
得られた反応液に2000mlのイオン交換水を添加し、限外ろ過法を用いて約2000ml溶液を除去した。この操作を3回繰り返した。
そして、上記ろ過処理が行われた処理液に200mlの10質量%に希釈した硫酸と2000mlのイオン交換水を加え、限外ろ過法を用いて約2000mlの処理液を除去し、これに2000mlのイオン交換水を加え、限外ろ過法を用いて約2000mlの液を除去した。この操作を3回繰り返した。
さらに、得られた処理液に2000mlのイオン交換水を加え、限外ろ過法を用いて約2000mlの処理液を除去した。この操作を5回繰り返し、約1.5質量%の青色のポリスチレンスルホン酸ドープポリ(3,4−エチレンジオキシチオフェン)(PEDOT−PSS)水溶液を得た。
(Production Example 2)
Preparation of Polystyrenesulfonic Acid Doped Poly (3,4-ethylenedioxythiophene) Aqueous Solution 14.2 g of 3,4-ethylenedioxythiophene and 36.7 g of polystyrenesulfonic acid obtained in Production Example 1 were added to 2000 ml of ion-exchanged water. The solution dissolved in was mixed at 20 ° C.
While maintaining the mixed solution thus obtained at 20 ° C. and stirring, 29.64 g of ammonium persulfate dissolved in 200 ml of ion exchange water and 8.0 g of ferric sulfate oxidation catalyst solution were slowly added, The reaction was stirred for 3 hours.
2000 ml of ion-exchanged water was added to the resulting reaction solution, and about 2000 ml of solution was removed using an ultrafiltration method. This operation was repeated three times.
Then, 200 ml of sulfuric acid diluted to 10% by mass and 2000 ml of ion-exchanged water are added to the treatment liquid that has been subjected to the filtration treatment, and about 2000 ml of the treatment liquid is removed using an ultrafiltration method. Ion exchange water was added and about 2000 ml of liquid was removed using ultrafiltration. This operation was repeated three times.
Furthermore, 2000 ml of ion-exchanged water was added to the obtained treatment liquid, and about 2000 ml of the treatment liquid was removed using an ultrafiltration method. This operation was repeated 5 times to obtain an about 1.5% by mass blue polystyrenesulfonic acid-doped poly (3,4-ethylenedioxythiophene) (PEDOT-PSS) aqueous solution.
(実施例1)
製造例2で得たPEDOT−PSS水溶液100gに、フッ素含有の、エーテル結合を含む飽和エポキシ化合物(エクスフロー社製、製品名C6GDEP)を0.015g(1質量%)を添加し、超音波振動機(アレックス・コーポレーション社製ハイパワー超音波洗浄機ネオネニック)を用いて撹拌して、エーテル結合を含む飽和エポキシ化合物を含有したPEDOT−PSS水溶液を調製した。
これとは別に、ジグリセリンポリグリシジルエーテル(阪本薬品工業社製SR−DGE)3g、サンエイドSI−110L(三新化学社製)0.03g、ジメチルスルホキシド3.3g、エタノール133gを混合し、撹拌した。これにより得た溶液に、前記エーテル結合を含む飽和エポキシ化合物を含有したPEDOT−PSS水溶液を添加して、超音波振動機にて攪拌し、導電性塗料Aを得た。
導電性塗料Aをポリエチレンテレフタレートフィルム(東洋紡績製A4300、厚さ:188μm)にバーコーターで塗布し、120℃、2分間、赤外線加熱により乾燥し、導電性塗膜を形成して、透明導電体を得た。
得られた透明導電体の塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を以下の方法により測定した。それらの結果を表2に示す。
Example 1
To 100 g of the PEDOT-PSS aqueous solution obtained in Production Example 2, 0.015 g (1% by mass) of a fluorine-containing saturated epoxy compound containing an ether bond (product name: C6GDEP manufactured by Exflow Co., Ltd.) was added, and ultrasonic vibration was added. PEDOT-PSS aqueous solution containing a saturated epoxy compound containing an ether bond was prepared by stirring using a machine (Alex Corporation High Power Ultrasonic Cleaning Machine Neonenik).
Separately, 3 g of diglycerin polyglycidyl ether (SR-DGE manufactured by Sakamoto Yakuhin Kogyo Co., Ltd.), 0.03 g of sun aid SI-110L (manufactured by Sanshin Chemical Co., Ltd.), 3.3 g of dimethyl sulfoxide, and 133 g of ethanol are mixed and stirred did. A PEDOT-PSS aqueous solution containing a saturated epoxy compound containing an ether bond was added to the solution thus obtained, and the mixture was stirred with an ultrasonic vibrator to obtain a conductive paint A.
Conductive paint A is applied to a polyethylene terephthalate film (A4300 manufactured by Toyobo Co., Ltd., thickness: 188 μm) with a bar coater and dried by infrared heating at 120 ° C. for 2 minutes to form a conductive coating film. Got.
The surface resistance, total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion of the coating film of the obtained transparent conductor were measured by the following methods. The results are shown in Table 2.
[表面抵抗]
三菱化学社製ロレスタMCP−T600を用い、JIS K 7194に準じて測定した。測定結果を表1に示す。
[Surface resistance]
Measurement was performed according to JIS K 7194 using a Loresta MCP-T600 manufactured by Mitsubishi Chemical Corporation. The measurement results are shown in Table 1.
[全光線透過率およびヘイズ]
日本電色工業社製ヘイズメータ測定器(NDH5000)を用い、JIS K7136に準じて全光線透過率およびヘイズを測定した。測定結果を表2に示す。
[Total light transmittance and haze]
The total light transmittance and haze were measured according to JIS K7136 using a Nippon Denshoku Industries Co., Ltd. haze meter measuring device (NDH5000). The measurement results are shown in Table 2.
[摺動試験(耐水性、耐エタノール性の評価)]
導電膜の塗膜強度を測定するため、水もしくはエタノールで湿らせたキムワイプ(日本製紙クレシア社製)を、100gf/cm2の荷重をかけて50往復擦った後、導電膜の剥がれを目視により以下の評価基準に基づいて評価した。また、表面抵抗と接触抵抗を測定した。それらの結果を表2に示す。
◎ :剥離なし、○:わずかに剥離、△:一部剥離、×:完全剥離
[Sliding test (Evaluation of water resistance and ethanol resistance)]
In order to measure the coating film strength of the conductive film, Kimwipe (manufactured by Nippon Paper Crecia Co., Ltd.) moistened with water or ethanol was rubbed 50 times with a load of 100 gf / cm 2 , and then the peeling of the conductive film was visually observed. Evaluation was made based on the following evaluation criteria. Moreover, surface resistance and contact resistance were measured. The results are shown in Table 2.
◎: No peeling, ○: Slight peeling, △: Partial peeling, ×: Complete peeling
[耐傷付き性の評価]
導電膜の塗膜強度を測定するため、キムワイプ(日本製紙クレシア社製)に、100gf/cm2の荷重をかけて50往復擦って傷付け試験を行った後、導電膜の傷を目視により以下の評価基準に基づいて評価した。また、表面抵抗と接触抵抗を測定した。それらの結果を表2に示す。これらの結果は導電膜の膜強度の指標になる。
◎ :傷なし、○:数本傷があり、△:数10本の傷があり、×:無数の傷があり
[Evaluation of scratch resistance]
In order to measure the coating film strength of the conductive film, Kim Wipe (manufactured by Nippon Paper Crecia Co., Ltd.) applied a load of 100 gf / cm 2 and rubbed it 50 times to conduct a scratch test. Evaluation was performed based on the evaluation criteria. Moreover, surface resistance and contact resistance were measured. The results are shown in Table 2. These results are indicators of the film strength of the conductive film.
◎: No scratch, ○: Several scratches, △: Several tens of scratches, ×: Numerous scratches
[密着性の評価]
形成した導電膜の表面を、透明基体(ポリエチレンテレフタレート、またはガラス)まで到達するようにして、カッターナイフで格子状の切り込みを入れた。その切り込みを入れた導電膜にセロハンテープを接着した後、剥離した。その際の導電膜の剥離状況を目視により観察し、以下の評価基準に基づいて評価した。それらの結果を表2に示す。
◎ :剥離なし、○:わずかに剥離、△:一部剥離、×:完全剥離
[Evaluation of adhesion]
The surface of the formed conductive film was made to reach a transparent substrate (polyethylene terephthalate or glass), and a grid-like cut was made with a cutter knife. The cellophane tape was adhered to the cut conductive film, and then peeled off. The peeling state of the electrically conductive film in that case was observed visually, and evaluated based on the following evaluation criteria. The results are shown in Table 2.
◎: No peeling, ○: Slight peeling, △: Partial peeling, ×: Complete peeling
(実施例2)
フッ素含有のエーテル結合を含む飽和エポキシ化合物(エクスフロー社製、製品名C6GDEP)の添加量を0.075g(5質量%)に変更し、ジグリセリンポリグリシジルエーテル(阪本薬品工業社製SR−DGE)の添加量を2.625gに変更し、サンエイドSI−110L(三新化学社製)の添加量を0.02625gに変更した以外は、実施例1と同様にして導電性塗料Bを得た。そして、導電性塗料Aの代わりに導電性塗料Bを用いたこと以外は実施例1と同様に導電性塗膜を形成し、透明導電体を評価した。評価結果を表2に示す。
(Example 2)
The addition amount of a saturated epoxy compound containing a fluorine-containing ether bond (manufactured by Exflow, product name C6GDEP) was changed to 0.075 g (5% by mass), and diglycerin polyglycidyl ether (SR-DGE made by Sakamoto Yakuhin Kogyo Co., Ltd.) ) Was changed to 2.625 g, and the conductive paint B was obtained in the same manner as in Example 1 except that the addition amount of Sun-Aid SI-110L (manufactured by Sanshin Chemical Co., Ltd.) was changed to 0.02625 g. . A conductive coating film was formed in the same manner as in Example 1 except that the conductive paint B was used instead of the conductive paint A, and the transparent conductor was evaluated. The evaluation results are shown in Table 2.
(実施例3)
フッ素含有のエーテル結合を含む飽和エポキシ化合物(エクスフロー社製、製品名C6GDEP)の添加量を0.225g(15質量%)に変更し、ジグリセリンポリグリシジルエーテル(阪本薬品工業社製SR−DGE)の添加量を2.25gに変更し、サンエイドSI−110L(三新化学社製)の添加量を0.0225gに変更した以外は、実施例1と同様にして導電性塗料Cを作製した。そして、導電性塗料Aの代わりに導電性塗料Cを用いたこと以外は実施例1と同様に導電性塗膜を形成し、透明導電体を評価した。評価結果を表2に示す。
Example 3
The addition amount of a saturated epoxy compound containing a fluorine-containing ether bond (manufactured by Exflow, product name C6GDEP) was changed to 0.225 g (15% by mass), and diglycerin polyglycidyl ether (SR-DGE manufactured by Sakamoto Yakuhin Kogyo Co., Ltd.) ) Was changed to 2.25 g, and the conductive paint C was produced in the same manner as in Example 1 except that the addition amount of Sun-Aid SI-110L (manufactured by Sanshin Chemical Co., Ltd.) was changed to 0.0225 g. . And the conductive coating film was formed similarly to Example 1 except having used the conductive paint C instead of the conductive paint A, and the transparent conductor was evaluated. The evaluation results are shown in Table 2.
(実施例4)
フッ素含有のエーテル結合を含む飽和エポキシ化合物(エクスフロー社製、製品名C6GDEP)0.015g(1質量%)を、炭化水素がエーテル化していないエポキシ化合物(ダイキン社製、製品名E−7432(1,6−ビス(2’,3’−エポキシプロピル)−パーフルオロ−n−ヘキサン)0.45g(30質量%)に変更し、ジグリセリンポリグリシジルエーテル(阪本薬品工業社製SR−DGE)の添加量を1.875gに変更し、サンエイドSI−110L(三新化学社製)の添加量を0.01875gに変更した以外は、実施例1と同様にして導電性塗料Dを得た。そして、導電性塗料Aの代わりに導電性塗料Dを用いたこと以外は実施例1と同様に導電性塗膜を形成し、透明導電体を評価した。評価結果を表2に示す。
Example 4
0.015 g (1% by mass) of a saturated epoxy compound containing a fluorine-containing ether bond (product name: C6GDEP manufactured by Exflow Co., Ltd.) and an epoxy compound (product name: E-7432 manufactured by Daikin Co., Ltd.) in which hydrocarbons are not etherified 1,6-bis (2 ′, 3′-epoxypropyl) -perfluoro-n-hexane) was changed to 0.45 g (30% by mass), and diglycerin polyglycidyl ether (SR-DGE manufactured by Sakamoto Pharmaceutical Co., Ltd.) Was changed to 1.875 g, and the conductive paint D was obtained in the same manner as in Example 1 except that the amount of Sun-Aid SI-110L (manufactured by Sanshin Chemical Co., Ltd.) was changed to 0.01875 g. And the conductive coating film was formed similarly to Example 1 except having used the conductive coating material D instead of the conductive coating material A, and the transparent conductor was evaluated.
(実施例5)
フッ素含有のエーテル結合を含む飽和エポキシ化合物(エクスフロー社製、製品名C6GDEP)0.015g(1質量%)を、炭化水素がエーテル化していないエポキシ化合物(エクスフロー社製C5DEP、1H,1H,5H,5H−パーフルオロ−1,5−ペンタンジオールジエポキシド)0.675g(45質量部)に変更し、ジグリセリンポリグリシジルエーテル(阪本薬品工業社製SR−DGE)の添加量を1.5gに変更し、サンエイドSI−110L(三新化学社製)の添加量を0.015gに変更した以外は、実施例1と同様にして導電性塗料Eを得た。そして、導電性塗料Aの代わりに導電性塗料Eを用いたこと以外は実施例1と同様に導電性塗膜を形成し、透明導電体を評価した。評価結果を表2に示す。
(Example 5)
0.015 g (1% by mass) of a saturated epoxy compound containing a fluorine-containing ether bond (product name: C6GDEP, manufactured by Exflow), an epoxy compound (C5DEP, 1H, 1H, manufactured by Exflow), which is not etherified with hydrocarbons 5H, 5H-perfluoro-1,5-pentanediol diepoxide) was changed to 0.675 g (45 parts by mass), and 1.5 g of diglycerin polyglycidyl ether (SR-DGE manufactured by Sakamoto Yakuhin Kogyo Co., Ltd.) was added. The conductive paint E was obtained in the same manner as in Example 1 except that the addition amount of Sun-Aid SI-110L (manufactured by Sanshin Chemical Co., Ltd.) was changed to 0.015 g. A conductive coating film was formed in the same manner as in Example 1 except that the conductive paint E was used instead of the conductive paint A, and the transparent conductor was evaluated. The evaluation results are shown in Table 2.
(実施例6)
フッ素含有のエーテル結合を含む飽和エポキシ化合物(エクスフロー社製、製品名C6GDEP)の添加量を0.9g(60質量%)に変更し、ジグリセリンポリグリシジルエーテル(阪本薬品工業社製SR−DGE)3gを、3−エチル−3{[(3−エチルオキセタン−3−イル)メトキシ]メチル}オキセタン(東亞合成社製OXT221)1.125gに変更し、サンエイドSI−110L(三新化学社製)の添加量を0.01125gに変更した以外は、実施例1と同様にして導電性塗料Fを得た。そして、導電性塗料Aの代わりに導電性塗料Fを用いたこと以外は実施例1と同様に導電性塗膜を形成し、透明導電体を評価した。評価結果を表2に示す。
(Example 6)
The addition amount of a saturated epoxy compound containing a fluorine-containing ether bond (Xflow, product name C6GDEP) was changed to 0.9 g (60% by mass), and diglycerin polyglycidyl ether (Sakamoto Yakuhin Kogyo SR-DGE) ) 3 g was changed to 1.125 g of 3-ethyl-3 {[(3-ethyloxetane-3-yl) methoxy] methyl} oxetane (OXT221 manufactured by Toagosei Co., Ltd.) and Sun-Aid SI-110L (manufactured by Sanshin Chemical Co., Ltd.) ) Was changed to 0.01125 g, and a conductive coating material F was obtained in the same manner as in Example 1. And the conductive coating film was formed similarly to Example 1 except having used the conductive coating material F instead of the conductive coating material A, and the transparent conductor was evaluated. The evaluation results are shown in Table 2.
(実施例7)
製造例2で得たPEDOT−PSS水溶液100gに、フッ素含有の、エーテル結合を含む飽和エポキシ化合物(エクスフロー社製、製品名C6GDEP)を1.125g(75質量%)を添加し、超音波振動機(アレックス・コーポレーション社製ハイパワー超音波洗浄機ネオネニック)を用いて撹拌して、エーテル結合を含む飽和エポキシ化合物を含有したPEDOT−PSS水溶液を調製した。
これとは別に、ペンタエリスリトールトリアクリレート0.75g、イルガキュア184(チバ・スペシャルティ・ケミカルズ社製)0.0075g、2−ヒドロキシエチル(メタ)アクリレート3.3g、2,3,3’,4,4’,5’−ヘキサヒドロキシベンゾフェノン0.45g、エタノール133gを混合し、撹拌した。これにより得た溶液に、前記エーテル結合を含む飽和エポキシ化合物を含有したPEDOT−PSS水溶液を添加して、超音波振動機にて攪拌し、導電性塗料Gを得た。
導電性塗料Gをポリエチレンテレフタレートフィルム(東洋紡績製A4300、厚さ;188μm)に、バーコーターで塗布し、100℃、2分間、赤外線照射により乾燥した。その後、紫外線(高圧水銀灯120W、360mJ/cm2、178mW/cm2)照射し、硬化させて、導電性塗膜を形成し、透明導電体を得た。得られた透明導電体は、実施例1と同様にして評価した。評価結果を表2に示す。
(Example 7)
To 100 g of the PEDOT-PSS aqueous solution obtained in Production Example 2, 1.125 g (75% by mass) of a fluorine-containing saturated epoxy compound containing an ether bond (product name: C6GDEP manufactured by Exflow Co., Ltd.) was added, and ultrasonic vibration was added. PEDOT-PSS aqueous solution containing a saturated epoxy compound containing an ether bond was prepared by stirring using a machine (Alex Corporation High Power Ultrasonic Cleaning Machine Neonenik).
Apart from this, 0.75 g of pentaerythritol triacrylate, 0.0075 g of Irgacure 184 (manufactured by Ciba Specialty Chemicals), 3.3 g of 2-hydroxyethyl (meth) acrylate, 2,3,3 ′, 4,4 '5'-Hexahydroxybenzophenone 0.45 g and ethanol 133 g were mixed and stirred. A PEDOT-PSS aqueous solution containing a saturated epoxy compound containing an ether bond was added to the solution thus obtained, and the mixture was stirred with an ultrasonic vibrator to obtain a conductive paint G.
The conductive paint G was applied to a polyethylene terephthalate film (Toyobo A4300, thickness: 188 μm) with a bar coater, and dried by infrared irradiation at 100 ° C. for 2 minutes. Thereafter, ultraviolet rays (high pressure mercury lamp 120W, 360 mJ / cm 2 , 178 mW / cm 2 ) were irradiated and cured to form a conductive coating film, thereby obtaining a transparent conductor. The obtained transparent conductor was evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
(実施例8)
フッ素含有のエーテル結合を含む飽和エポキシ化合物(エクスフロー社製、製品名C6GDEP)の添加量を1.35g(90質量%)に変更し、ジグリセリンポリグリシジルエーテル(阪本薬品工業社製SR−DGE)3gを、ポリグリセリンポリグリシジルエーテル(阪本薬品工業社製SR−4GLS)0.375gに変更し、サンエイドSI−110L(三新化学社製)の添加量を0.00375gに変更した以外は、実施例1と同様にして導電性塗料Hを得た。そして、導電性塗料Aの代わりに導電性塗料Hを用いたこと以外は実施例1と同様に導電性塗膜を形成し、透明導電体を評価した。評価結果を表2に示す。
(Example 8)
The addition amount of a saturated epoxy compound containing a fluorine-containing ether bond (manufactured by Exflow, product name C6GDEP) was changed to 1.35 g (90% by mass), and diglycerin polyglycidyl ether (SR-DGE manufactured by Sakamoto Yakuhin Kogyo Co., Ltd.) ) 3 g was changed to 0.375 g polyglycerin polyglycidyl ether (Sakamoto Yakuhin Kogyo Co., Ltd. SR-4GLS), and the addition amount of Sun-Aid SI-110L (Sanshin Chemical Co., Ltd.) was changed to 0.00375 g. Conductive paint H was obtained in the same manner as Example 1. And the conductive coating film was formed similarly to Example 1 except having used the conductive paint H instead of the conductive paint A, and the transparent conductor was evaluated. The evaluation results are shown in Table 2.
(実施例9)
フッ素含有のエーテル結合を含む飽和エポキシ化合物(エクスフロー社製、製品名C6GDEP)の添加量を1.5g(100質量%)に変更し、ジグリセリンポリグリシジルエーテル(阪本薬品工業社製SR−DGE)3gを、ソルビトール系ポリグリシジルエーテル(阪本薬品工業社製SR−SEP)0.015gに変更し、サンエイドSI−110L(三新化学社製)の添加量を0.00015gに変更した以外は、実施例1と同様にして導電性塗料Iを得た。そして、導電性塗料Aの代わりに導電性塗料Iを用いたこと以外は実施例1と同様に導電性塗膜を形成し、透明導電体を評価した。評価結果を表2に示す。
Example 9
The addition amount of a saturated epoxy compound containing a fluorine-containing ether bond (product name: C6GDEP manufactured by Exflow) was changed to 1.5 g (100% by mass), and diglycerin polyglycidyl ether (SR-DGE manufactured by Sakamoto Yakuhin Kogyo Co., Ltd.) ) 3 g was changed to 0.015 g of sorbitol-based polyglycidyl ether (Sakamoto Yakuhin Kogyo Co., Ltd. SR-SEP), and the addition amount of Sun-Aid SI-110L (Sanshin Chemical Co., Ltd.) was changed to 0.00015 g. Conductive paint I was obtained in the same manner as Example 1. And the conductive coating film was formed similarly to Example 1 except having used the conductive paint I instead of the conductive paint A, and the transparent conductor was evaluated. The evaluation results are shown in Table 2.
(実施例10)
導電性塗料Aを、ガラス(厚さ:0.8mm×210mm×150mm)にバーコーターで塗布し、120℃、30分間、赤外線加熱により乾燥し、導電性塗膜を形成して、透明導電体を得た。そして、実施例1と同様に塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を評価した。評価結果を表2に示す。
(Example 10)
Conductive paint A is applied to glass (thickness: 0.8 mm × 210 mm × 150 mm) with a bar coater, dried by infrared heating at 120 ° C. for 30 minutes to form a conductive coating, and a transparent conductor Got. And the surface resistance of the coating film, the total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
(実施例11)
導電性塗料Bを、ガラス(厚さ:0.8mm×210mm×150mm)にバーコーターで塗布し、120℃、30分間、赤外線加熱により乾燥し、導電性塗膜を形成して、透明導電体を得た。そして、実施例1と同様に塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を評価した。評価結果を表2に示す。
(Example 11)
Conductive paint B is applied to glass (thickness: 0.8 mm × 210 mm × 150 mm) with a bar coater, dried by infrared heating at 120 ° C. for 30 minutes to form a conductive coating, and a transparent conductor Got. And the surface resistance of the coating film, the total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
(実施例12)
導電性塗料Cを、ガラス(厚さ:0.8mm×210mm×150mm)にバーコーターで塗布し、120℃、30分間、赤外線加熱により乾燥し、導電性塗膜を形成して、透明導電体を得た。そして、実施例1と同様に塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を評価した。評価結果を表2に示す。
(Example 12)
Conductive paint C is applied to glass (thickness: 0.8 mm × 210 mm × 150 mm) with a bar coater, dried by infrared heating at 120 ° C. for 30 minutes to form a conductive coating, and a transparent conductor Got. And the surface resistance of the coating film, the total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
(実施例13)
導電性塗料Dを、ガラス(厚さ:0.8mm×210mm×150mm)にバーコーターで塗布し、120℃、30分間、赤外線加熱により乾燥し、導電性塗膜を形成して、透明導電体を得た。そして、実施例1と同様に塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を評価した。評価結果を表2に示す。
(Example 13)
Conductive paint D is applied to glass (thickness: 0.8 mm × 210 mm × 150 mm) with a bar coater, dried by infrared heating at 120 ° C. for 30 minutes to form a conductive coating, and a transparent conductor Got. And the surface resistance of the coating film, the total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
(実施例14)
導電性塗料Eを、ガラス(厚さ:0.8mm×210mm×150mm)にバーコーターで塗布し、120℃、30分間、赤外線加熱により乾燥し、導電性塗膜を形成して、透明導電体を得た。そして、実施例1と同様に塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を評価した。評価結果を表2に示す。
(Example 14)
Conductive paint E is applied to glass (thickness: 0.8 mm x 210 mm x 150 mm) with a bar coater, dried by infrared heating at 120 ° C for 30 minutes to form a conductive coating film, and transparent conductor Got. And the surface resistance of the coating film, the total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
(実施例15)
導電性塗料Fを、ガラス(厚さ:0.8mm×210mm×150mm)にバーコーターで塗布し、120℃、30分間、赤外線加熱により乾燥し、導電性塗膜を形成して、透明導電体を得た。そして、実施例1と同様に塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を評価した。評価結果を表2に示す。
(Example 15)
Conductive paint F is applied to glass (thickness: 0.8 mm × 210 mm × 150 mm) with a bar coater, dried by infrared heating at 120 ° C. for 30 minutes to form a conductive coating, and a transparent conductor Got. And the surface resistance of the coating film, the total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
(実施例16)
導電性塗料Gを、ガラス(厚さ:0.8mm×210mm×150mm)にバーコーターで塗布し、100℃、2分間、赤外線照射により乾燥した後、紫外線(高圧水銀灯120W、360mJ/cm2、178mW/cm2)照射し、硬化させて、導電性塗膜を形成し、透明導電体を得た。そして、実施例1と同様に塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を評価した。評価結果を表2に示す。
(Example 16)
The conductive paint G was applied to glass (thickness: 0.8 mm × 210 mm × 150 mm) with a bar coater, dried at 100 ° C. for 2 minutes by infrared irradiation, and then irradiated with ultraviolet rays (high pressure mercury lamp 120 W, 360 mJ / cm 2 , 178 mW / cm 2 ) irradiation and curing to form a conductive coating film to obtain a transparent conductor. And the surface resistance of the coating film, the total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
(実施例17)
導電性塗料Hを、ガラス(厚さ:0.8mm×210mm×150mm)にバーコーターで塗布し、120℃、30分間、赤外線加熱により乾燥し、導電性塗膜を形成して、透明導電体を得た。そして、実施例1と同様に塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を評価した。評価結果を表2に示す。
(Example 17)
Conductive paint H is applied to glass (thickness: 0.8 mm × 210 mm × 150 mm) with a bar coater, dried by infrared heating at 120 ° C. for 30 minutes to form a conductive coating, and a transparent conductor Got. And the surface resistance of the coating film, the total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
(実施例18)
導電性塗料Iを、ガラス(厚さ:0.8mm×210mm×150mm)にバーコーターで塗布し、120℃、30分間、赤外線加熱により乾燥し、導電性塗膜を形成して、透明導電体を得た。そして、実施例1と同様に塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を評価した。評価結果を表2に示す。
(Example 18)
Conductive paint I is applied to glass (thickness: 0.8 mm x 210 mm x 150 mm) with a bar coater, dried by infrared heating at 120 ° C for 30 minutes to form a conductive coating, and a transparent conductor Got. And the surface resistance of the coating film, the total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
(比較例1)
フッ素を含有の飽和エポキシ化合物(エクスフロー社製、製品名C6GDEP)を添加しない以外は、実施例1と同様にして導電性塗料Jを得た。そして、導電性塗料Aの代わりに導電性塗料Jを用いたこと以外は実施例1と同様に導電性塗膜を形成し、透明導電体を評価した。評価結果を表2に示す。
(Comparative Example 1)
A conductive paint J was obtained in the same manner as in Example 1 except that a saturated epoxy compound containing fluorine (product name: C6GDEP manufactured by Exflow Co., Ltd.) was not added. Then, a conductive coating film was formed in the same manner as in Example 1 except that the conductive paint J was used instead of the conductive paint A, and the transparent conductor was evaluated. The evaluation results are shown in Table 2.
(比較例2)
導電性塗料Jを、ガラス(厚さ:0.8mm×210mm×150mm)にバーコーターで塗布し、120℃、30分間、赤外線加熱により乾燥し、導電性塗膜を形成して、透明導電体を得た。そして、実施例1と同様に塗膜の表面抵抗、全光線透過率およびヘイズ、耐水性、耐エタノール性、耐傷付き性、密着性を評価した。評価結果を表2に示す。
(Comparative Example 2)
Conductive paint J is applied to glass (thickness: 0.8 mm × 210 mm × 150 mm) with a bar coater, dried by infrared heating at 120 ° C. for 30 minutes to form a conductive coating film, and transparent conductor Got. And the surface resistance of the coating film, the total light transmittance and haze, water resistance, ethanol resistance, scratch resistance, and adhesion were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 2.
フッ素含有エポキシ化合物を含有する導電性塗料をポリエチレンテレフタレートフィルムにバーコーターで塗布して得た実施例1〜9の透明導電体は、表面抵抗、透明性(全光線透過率とヘイズ)、耐水性、耐エタノール性、密着性、および耐傷付き性のいずれにも優れていた。
フッ素含有エポキシ化合物を含有する導電性塗料をガラスにバーコーターで塗布して得た実施例10〜18の透明導電体も、表面抵抗、透明性(全光線透過率とヘイズ)、耐水性、耐エタノール性、密着性、および耐傷付き性のいずれにも優れていた。
これに対し、フッ素含有エポキシ化合物を含まない導電性塗料を用いた比較例1,2では、表面抵抗、透明性(全光線透過率、ヘイズ)、耐水性は良好な結果であったものの、耐エタノール性、耐傷付き性および密着性が低かった。
The transparent conductors of Examples 1 to 9 obtained by applying a conductive paint containing a fluorine-containing epoxy compound to a polyethylene terephthalate film with a bar coater have surface resistance, transparency (total light transmittance and haze), and water resistance. It was excellent in all of ethanol resistance, adhesion, and scratch resistance.
The transparent conductors of Examples 10 to 18 obtained by applying a conductive paint containing a fluorine-containing epoxy compound to glass with a bar coater also have surface resistance, transparency (total light transmittance and haze), water resistance, It was excellent in all of ethanol property, adhesion, and scratch resistance.
On the other hand, in Comparative Examples 1 and 2 using a conductive paint not containing a fluorine-containing epoxy compound, the surface resistance, transparency (total light transmittance, haze), and water resistance were good results, Ethanol resistance, scratch resistance and adhesion were low.
10 可動電極シート
11 透明基体
12 導電膜
20 固定電極シート
21 透明基体
22 導電膜
24 ドットスペーサ
10
Claims (7)
Gu−(OCH 2 ) p −{X}−(CH 2 O) p −Gu
(Guはグリシジル基を表す。Xは(CF 2 ) l 及び(CF 2 −O−CF 2 ) m の少なくとも一方である。pは0〜1、lは1〜8、mは1〜8である。) A transparent substrate and a conductive film provided on at least one surface of the transparent substrate, wherein the conductive film is substituted with fluorine atoms at least part of hydrogen atoms of a π-conjugated conductive polymer, a polyanion, and an epoxy compound. A transparent conductor comprising a cured product of a conductive composition containing a fluorine-containing epoxy compound represented by the following general formula:
Gu- (OCH 2) p - { X} - (CH 2 O) p -Gu
(Gu represents a glycidyl group. X is at least one of (CF 2 ) l and (CF 2 —O—CF 2 ) m. P is 0 to 1, l is 1 to 8, m is 1 to 8. is there.)
Gu−(OCH 2 ) p −{X}−(CH 2 O) p −Gu
(Guはグリシジル基を表す。Xは(CF 2 ) l 及び(CF 2 −O−CF 2 ) m の少なくとも一方である。pは0〜1、lは1〜8、mは1〜8である。) On at least one surface of the transparent substrate, a π-conjugated conductive polymer, a polyanion, a fluorine-containing epoxy compound represented by the following general formula in which at least a part of hydrogen atoms of the epoxy compound are substituted with fluorine atoms, a solvent, The manufacturing method of the transparent conductor characterized by apply | coating the conductive coating material containing this, and hardening.
Gu- (OCH 2) p - { X} - (CH 2 O) p -Gu
(Gu represents a glycidyl group. X is at least one of (CF 2 ) l and (CF 2 —O—CF 2 ) m. P is 0 to 1, l is 1 to 8, m is 1 to 8. is there.)
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