JP5584032B2 - Socket for electrical parts - Google Patents

Description

  The present invention relates to an electrical component socket for measuring electrical components such as a semiconductor device (hereinafter referred to as “IC package”) mounted on a wiring board.

  Conventionally, as this type of “electrical component socket”, there is a semiconductor device socket that detachably holds a semiconductor device that is an “electrical component” (see Patent Document 1).

  As described in claim 1 of Patent Document 1, the socket for the semiconductor device includes “a semiconductor device mounting portion on which the semiconductor device is detachably disposed, and a contact electrically connected to a terminal of the semiconductor device. A socket body having a terminal group; and a lid member disposed so as to be close to or separated from the socket body, and is in contact with or separated from an outer peripheral surface of the semiconductor device disposed on the semiconductor device mounting portion. And a pressing force adjusting mechanism portion that adjusts the pressing force of the terminals of the semiconductor device against the contact terminal group, and a pressing force adjusting mechanism portion that is connected to the screw mechanism and is movable. And a lock / unlock mechanism portion that places the screw mechanism in a locked state or an unlocked state.

  By the way, in recent years, there is a demand for measuring whether data is flowing normally in a state where an IC package is mounted on a wiring board in advance.

  However, in the device described in Patent Document 1, the semiconductor device mounting portion is disposed on the wiring board, the semiconductor device is disposed on the semiconductor device mounting portion, and the contact terminal is provided thereon. Since the socket body having a group is provided and the semiconductor device is pressed by the pressing force adjusting mechanism, the IC package is already arranged on the wiring board. Could not do.

  Therefore, there is a technique described in Patent Document 2 for measuring in a state where an IC package is mounted on a wiring board in advance.

  In this Patent Document 2, “a contact having a sharp tip formed and bent obliquely downward is arranged in a face-to-face relationship so that the sharp tips face each other, and the contact is displaced inward. An electrical signal extraction device is described in which a sharp tip is pierced into a solder portion where a chip component is soldered on a circuit board and an independent electrical signal is extracted from each contact by holding the pierced state. Yes.

JP 2006-252946 A. JP2003-185675A.

  However, in such a device described in Patent Document 2, the tip of the contact of the electrical signal extraction device is bitten into the solder portion of the chip component (electrical component). Since it is necessary to bite the tip into a predetermined position of the solder portion, it is necessary to dispose the electric signal extraction device at a predetermined position with respect to the chip component. How is the electric signal extraction device disposed? However, the configuration is not disclosed, and it is difficult to dispose the electric signal extraction device at a predetermined position with respect to the chip component.

  Accordingly, the present invention provides an electrical component socket that can be measured at a predetermined position with respect to the electrical component even when the electrical component is previously disposed on the wiring board. It is an issue.

In order to achieve such an object, the invention according to claim 1 is arranged on a wiring board and electrically connected to an electric component having a plurality of protruding terminals on the side, and the electric component and the intermediate An electrical component socket for electrical connection with a substrate, the mounting means being mounted on the upper side of the electrical component, and the socket body disposed so as to cover the electrical component by the mounting means , provided in the socket body, have a contact pin that is electrically connected to a terminal of the electrical component, said attachment means includes an adapter attached to the electrical component, and a knob which is removably attached to the adapter And an urging means disposed between the knob and the socket body, and the urging means is inserted into an opening formed in the intermediate substrate so that the socket body is placed on the electric component side. The contact pin is configured to press, and the contact pin includes a lower contact portion that is electrically connected to the terminal of the electrical component, an upper contact portion that is electrically connected to the electrode of the intermediate board, and the lower contact portion. A side contact portion and a spring portion formed between the upper contact portions, the socket body is disposed so as to cover the electrical component, the knob is operated, and the socket body is moved by the biasing means. In a state where the electric contact part is pressed, the spring part of the contact pin is elastically deformed and the lower contact part and the upper contact part are displaced in the vertical direction, so that the lower contact part becomes the electric part. Further, the electrical component socket is configured such that the upper contact portion contacts the electrode of the intermediate substrate at a predetermined contact pressure .

According to a second aspect of the present invention, in addition to the configuration of the first aspect , the adapter includes a mounting plate portion bonded to an upper surface of the electrical component, a protrusion projecting from the mounting plate portion, and the knob being screwed. And a screw portion to be joined.

  According to the first aspect of the present invention, even in the case where electrical components are preliminarily disposed on the wiring board, the attachment means is attached to the electrical components, and the socket body is disposed via the attachment means. Therefore, it can be arranged at a predetermined position with respect to the electrical component and measurement or the like can be performed.

  In addition, since the electrical component socket can be disposed so as to cover the electrical component, the electrical component socket can be used even when the adjacent space is narrow, such as when multiple electrical components are adjacent. Can be easily arranged.

Further , since the attaching means is provided with an urging means for pressing the socket body toward the electric component side, the urging means can press the contact pin against the electric component terminal with a predetermined pressing force.

Furthermore , since the attachment means includes an adapter attached to the electrical component, a knob detachably attached to the adapter, and a biasing means disposed between the knob and the socket body, the knob is attached to the adapter. Thus, the socket body can be pressed toward the electrical component by the urging means.

According to the second aspect of the present invention, in addition to the above effect, the adapter includes a mounting plate portion that is bonded to the upper surface of the electrical component, and a screw portion that protrudes from the mounting plate portion and is screwed with the knob. Therefore, the adapter can be easily attached to the electrical component, and the urging force of the urging means can be adjusted by adjusting the tightening amount of the knob with respect to the screw portion.

It is a top view of the electrical component measuring apparatus which has IC socket concerning Embodiment 1 of this invention. It is the front view which cut the left half of the electrical component measuring device which has IC socket which concerns on the same Embodiment 1. It is a right view of the electrical component measuring device which has an IC socket concerning the first embodiment. It is the front view which fixed the adapter on the IC package which concerns on the same Embodiment 1. FIG. FIG. 5 is a front view showing a state in which a socket body, an intermediate substrate, and the like are arranged on the IC package from the state shown in FIG. 4 according to the first embodiment. It is a front view which shows the state which has arrange | positioned the coil spring from the state shown in FIG. 5 which concerns on the same Embodiment 1. FIG. It is a front view which shows the state which has arrange | positioned the knob from the state shown in FIG. It is a figure which shows the IC package which concerns on the same Embodiment 1, (a) is a top view, (b) is a front view, (c) is a right view. It is a figure which shows the state which latched the latching claw of the adapter which concerns on Embodiment 2 of this invention on the socket main body. It is a figure which shows Embodiment 3 of this invention, (a) is a state before attaching a knob to an adapter, (b) is a figure which shows the state which attached the knob to the adapter.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention

  1 to 8 show an embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in the figure denotes an IC socket as an “electrical component socket”, and this IC socket 11 is used to measure the data flow of the IC package 12 that is an “electrical component”. In addition, the terminal 12b of the IC package 12 is electrically connected to the intermediate substrate 13 and the like.

  As shown in FIG. 8, the IC package 12 has a large number of crank-shaped terminals 12b protruding from the side of a rectangular plate-shaped package body 12a. The IC package 12 is soldered to a predetermined position on the wiring board 14 with each terminal 12b soldered in a state where the lower surface of the package body 12a is in contact with the wiring board 14. Implemented in position. Although not shown in the drawing, a plurality of other IC packages 12 of the same type, other different types of electrical components, and the like are arranged on the wiring board 14 in a state of being adjacent to each other.

  On the other hand, the IC socket 11 includes an adapter 15 mounted on the IC package 12 as shown in FIG. 4, and a socket body disposed on the IC package 12 by the adapter 15 and the like as shown in FIGS. 16, a cover 17 disposed on the socket body 16, a contact pin 18 accommodated between the socket body 16 and the cover 17, and a coil spring disposed on the socket body 16 around the adapter 15. 19 and a knob 20 screwed to the adapter 15. The adapter 15, the coil spring 19, the knob 20, and the like constitute “attachment means”.

  The IC board 11 is provided with an intermediate substrate 13 and the like, and the electrical component measuring apparatus 10 is configured.

  Specifically, as shown in FIG. 4, the adapter 15 has a mounting plate portion 15 a that is bonded and fixed to the upper surface of the IC package 12, and a screw portion 15 b is projected upward from the mounting plate portion 15 a. . The knob 20 is screwed into the screw portion 15b.

  Further, the socket body 16 is formed in a size slightly larger than the IC package 12 so as to cover the IC package 12 in a plan view, and the lower surface is in contact with the upper surface of the IC package 12. As shown in FIG. 2 and the like, an insertion recess 16c into which the mounting plate portion 15a of the adapter 15 is inserted is formed, and further, a through hole 16b into which the screw portion 15b of the adapter 15 is inserted is formed.

  Further, the socket body 16 is formed with recesses 16 a at both edge portions, and contact pins 18 are accommodated in the recesses 16 a and are held by the cover 17.

  Further, as shown in FIG. 2 and the like, the contact pin 18 is formed in a substantially U shape from a conductive metal plate material, and contacts the upper surface side of the terminal 12b of the IC package 12 at the lower end portion to be electrically connected. A lower contact portion 18a is formed, and an upper contact portion 18b that is in contact with and electrically connected to the electrode portion on the lower surface of the intermediate substrate 13 is formed at the upper end portion. Further, a substantially U-shaped (laterally) spring portion 18c that is elastically deformed is formed between the lower contact portion 18a and the upper contact portion 18b, and each contact portion 18a is elastically deformed. , 18b are displaced in the vertical direction.

  The lower contact portion 18a is formed to protrude downward, and protrudes downward from an opening 16d formed in the socket body 16. Further, the upper contact portion 18b is formed to protrude upward, and protrudes upward from an opening 17b formed in the cover 17.

  Further, as shown in FIG. 2 and the like, the cover 17 is made of an insulating resin plate, is disposed so as to cover the socket body 16, and the screw portion 15b of the adapter 15 is inserted into the center portion. The through-hole 17a is formed, and the opening 17b through which the upper contact portion 18b of the contact pin 18 is inserted is formed as described above.

  Further, the coil spring 19 is placed on the upper surface of the cover 17 with the threaded portion 15b of the adapter 15 inserted, and the socket 20 is tightened to press the socket body 16 toward the IC package 12 (downward). Like to do.

  On the cover 17 of the IC socket 11 configured in this way, as shown in FIG. 2 and the like, the intermediate substrate 13 of the electrical component measuring apparatus 10 is placed. Electrodes (not shown) that are electrically connected to the upper contact portions 18 b of the contact pins 18 are formed on the lower surface of the intermediate substrate 13, and connectors 21 are formed on both side edges of the upper surface of the intermediate substrate 13. Are connected horizontally, and an FPC (flexible printed circuit) connection cable 22 is connected to the connector 21 from the side.

  Here, the connector 21 and the FPC connection cable 22 are placed horizontally and arranged along the horizontal direction. However, the present invention is not limited to this, and when the space on the side of the IC socket 11 is narrow, In addition, the connector 21 may be installed vertically so that the FPC connection cable 22 extends upward.

  Further, as shown in FIG. 1, the intermediate board 13 is attached to the socket body 16 by a total of four screws 23.

  Next, a method for arranging the IC socket 11 will be described.

  The IC package 12 is mounted in advance at a predetermined position on the wiring board 14 by soldering a plurality of terminals 12b.

  In this state, an IC socket 11 is disposed on the IC package 12 in order to measure the IC package 12 and the like.

  That is, first, as shown in FIG. 4, the mounting plate portion 15 a of the adapter 15 is bonded and fixed to a predetermined position on the upper surface of the IC package 12. An adhesive may be used, or may be fixed with a double-sided tape. A dedicated gauge or the like can be used for positioning the adapter 15. In addition, after the measurement, there is also a method in which a protective tape is attached to the upper surface of the IC package 12 so that the adapter 15 can be removed, and the adapter 15 is adhered from the top.

  Next, as shown in FIG. 5, the socket body 16 on which the intermediate board 13 is disposed is put on the IC package 12, and the screw portion 15 b of the adapter 15 is inserted into the through holes 16 b and 17 a of the socket body 16 and the cover 17. Insert.

  At this time, ribs (not shown) formed at both ends of the plurality of contact pins 18 of the socket body 16 are positioned with respect to the terminals 12b disposed at both ends of the plurality of terminals 12b of the IC package 12. Thus, each contact pin 18 is brought into contact with an arbitrary terminal 12b of the IC package 12.

  Thereafter, as shown in FIG. 6, a coil spring 19 is put on the threaded portion 15b of the adapter 15, and the coil spring 19 is placed on the socket body 16, and then a knob is placed on the threaded portion 15b as shown in FIG. 20 is screwed and tightened to a predetermined position. As a result, the socket body 16 is pressed downward and lowered to elastically deform the contact pin 18, so that the lower contact portion 18 a is on the upper surface of the terminal 12 b of the IC package 12 and the upper contact portion 18 b is on the intermediate substrate 13. Each of the electrodes on the lower surface comes into contact with a predetermined contact pressure.

  In this state, the IC package 12 is measured.

  In such a case, even if the IC package 12 is disposed on the wiring board 14 in advance, the adapter 15 is attached to the IC package 12, and the adapter 15, the coil spring 19, the knob 20, etc. Since the socket body 16 is disposed via the socket, the socket body 16 can be disposed at a predetermined position with respect to the IC package 12, and measurement or the like can be performed.

  In addition, since the IC socket 11 can be disposed so as to cover the IC package 12, even when the adjacent space is narrow, such as when a plurality of IC packages 12 are adjacent to each other, the IC socket 11 Can be easily arranged.

  In addition, the IC socket 11 can be easily arranged by sequentially arranging the adapter 15, the socket body 16, the coil spring 19, and the knob 20 as shown in FIGS. be able to.

  Further, the IC socket 11 can be made shorter in the vertical dimension than that described in Patent Document 2, and the installation space in the vertical direction of the IC socket 11 can be made compact.

Moreover, by adjusting the tightening amount of the knob 20, the pressing force of the coil spring 19 on the socket body 16, that is, the contact pressure of the contact pin 18 on the terminal 12 b of the IC package 12 can be adjusted.
[Embodiment 2 of the Invention]

  FIG. 9 shows a second embodiment of the present invention.

  The second embodiment is different from the first embodiment in “attachment means”. That is, there is a gap between the package body 12a and the wiring board 14, and the tip of the locking claw 25a of the adapter 25, which is an “attachment means”, is inserted and locked in this gap.

  The socket body 16 is attached to the adapter 25 locked and fixed in this manner.

  If the IC socket 11 is locked to the package body 12a using the locking claws 25a as described above, the IC socket 12 is removed from the package body 12a after the measurement of the IC package 12, thereby the IC socket. 11 can be easily removed from the IC package 12.

Since other configurations and operations are the same as those of the first embodiment, a duplicate description is omitted.
Embodiment 3 of the Invention

  FIG. 10 shows a third embodiment of the present invention.

  The third embodiment is different from the first embodiment in the structure of the adapter 26, the knob 27, and the like.

  In the adapter 26 according to the third embodiment, a shaft portion 26b protrudes upward from the mounting plate portion 26a instead of the screw portion 15b of the adapter 15 according to the first embodiment.

  The shaft portion 26b is formed with an insertion groove portion 26c extending in the vertical direction at the top, and a locking groove portion 26d extending in the circumferential direction at the lower end portion of the insertion groove portion 26c.

  In addition, although not shown, the knob 27 is formed with a locking projection that is inserted into the insertion groove 26c of the shaft portion 26b, and the locking projection is lowered along the insertion groove 26c. Thereafter, by rotating the knob 27, the locking projection is locked to the locking groove 26d.

  When the knob 27 is attached to the shaft portion 26b, the socket main body 16 is pressed by the coil spring 28 provided on the knob 27 as in the first embodiment.

  In such a case, the knob 27 can be easily disposed on the shaft portion 26b simply by rotating the knob 27 after being moved downward. Compared with the screwed type as in the first embodiment. Then, the arrangement of the knob 27 can be easily performed.

  Further, the pushing amount of the knob 27, that is, the urging force of the coil spring 28 can be made constant, and the contact pressure between the contact pin 18 and the terminal 12b of the IC package 12 can be made constant.

  Since other configurations and operations are the same as those of the first embodiment, a duplicate description is omitted.

  In the above embodiments, the present invention is applied to the IC socket 11 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices. In addition, the “attachment means” of the present invention is not limited to that of the above embodiment, but may be of other configurations as long as it is attached to an electrical component and the socket body is disposed on the electrical component. Of course it is good. Furthermore, although the “urging means” of the present invention uses a coil spring in the above embodiment, it may be a spring having another structure or an elastic body such as rubber.

10 Electrical component measuring device
11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12a Package body
12b terminal
13 Intermediate board
14 Wiring board
15,25,26 Adapter (Mounting means)
15a Mounting plate
15b Screw part
16 Socket body
17 Cover
18 Contact pin
18a Lower contact part
18b Upper contact part
18c Spring part
19,28 Coil spring (mounting means)
20,27 Knob (Mounting means)

Claims (2)

An electrical component socket disposed on a wiring board for electrically connecting to an electrical component having a plurality of protruding terminals on the side, and for electrical connection between the electrical component and the intermediate substrate. ,
Mounting means mounted on the upper side of the electrical component;
A socket body disposed so as to cover the electrical component by the attachment means;
Provided on the socket body, it has a contact pin that is electrically connected to a terminal of the electrical component,
The attachment means includes an adapter attached to the electrical component, a knob detachably attached to the adapter, and an urging means disposed between the knob and the socket body,
The urging means is configured to be inserted through an opening formed in the intermediate substrate and press the socket body toward the electrical component side,
The contact pin includes a lower contact portion that is electrically connected to the terminal of the electrical component, an upper contact portion that is electrically connected to an electrode of the intermediate substrate, the lower contact portion, and the upper contact. A spring part formed between the parts,
The socket body is disposed so as to cover the electrical component, and the spring portion of the contact pin is elastic while the knob is operated and the socket body is pressed toward the electrical component by the biasing means. When the lower contact portion and the upper contact portion are displaced in the vertical direction by deformation, the lower contact portion becomes the terminal of the electrical component, and the upper contact portion becomes the electrode of the intermediate substrate. Each of the sockets for electrical parts is configured to contact at a predetermined contact pressure . 2. The adapter according to claim 1, wherein the adapter includes a mounting plate portion that is bonded to an upper surface of the electrical component, and a screw portion that protrudes from the mounting plate portion and is screwed with the knob . Socket for electrical parts.

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