JP5585982B2 - 絶縁性高分子材料組成物 - Google Patents
絶縁性高分子材料組成物 Download PDFInfo
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- JP5585982B2 JP5585982B2 JP2010053968A JP2010053968A JP5585982B2 JP 5585982 B2 JP5585982 B2 JP 5585982B2 JP 2010053968 A JP2010053968 A JP 2010053968A JP 2010053968 A JP2010053968 A JP 2010053968A JP 5585982 B2 JP5585982 B2 JP 5585982B2
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- Prior art keywords
- polymer material
- insulating polymer
- silane coupling
- material composition
- coupling agent
- Prior art date
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- 235000021388 linseed oil Nutrition 0.000 claims description 28
- 239000000944 linseed oil Substances 0.000 claims description 28
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- 229940079877 pyrogallol Drugs 0.000 claims description 20
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 18
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical class OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims description 12
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- ZTHYODDOHIVTJV-UHFFFAOYSA-N Propyl gallate Chemical compound CCCOC(=O)C1=CC(O)=C(O)C(O)=C1 ZTHYODDOHIVTJV-UHFFFAOYSA-N 0.000 claims description 8
- -1 heptadecyl gallate Chemical compound 0.000 claims description 8
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 8
- VFPFQHQNJCMNBZ-UHFFFAOYSA-N ethyl gallate Chemical compound CCOC(=O)C1=CC(O)=C(O)C(O)=C1 VFPFQHQNJCMNBZ-UHFFFAOYSA-N 0.000 claims description 6
- FBSFWRHWHYMIOG-UHFFFAOYSA-N methyl 3,4,5-trihydroxybenzoate Chemical compound COC(=O)C1=CC(O)=C(O)C(O)=C1 FBSFWRHWHYMIOG-UHFFFAOYSA-N 0.000 claims description 6
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- TXGSOSAONMOPDL-UHFFFAOYSA-N propan-2-yl 3,4,5-trihydroxybenzoate Chemical compound CC(C)OC(=O)C1=CC(O)=C(O)C(O)=C1 TXGSOSAONMOPDL-UHFFFAOYSA-N 0.000 claims description 4
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- TYCUSKFOGZNIBO-UHFFFAOYSA-N hexadecyl 3,4,5-trihydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC(O)=C(O)C(O)=C1 TYCUSKFOGZNIBO-UHFFFAOYSA-N 0.000 claims description 3
- IBKQQKPQRYUGBJ-UHFFFAOYSA-N methyl gallate Natural products CC(=O)C1=CC(O)=C(O)C(O)=C1 IBKQQKPQRYUGBJ-UHFFFAOYSA-N 0.000 claims description 3
- BRNPAEUKZMBRLQ-UHFFFAOYSA-N octadecyl 3,4,5-trihydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C1=CC(O)=C(O)C(O)=C1 BRNPAEUKZMBRLQ-UHFFFAOYSA-N 0.000 claims description 3
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- 239000004593 Epoxy Substances 0.000 description 2
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- 235000018553 tannin Nutrition 0.000 description 1
- 239000001648 tannin Substances 0.000 description 1
- 229920001864 tannin Polymers 0.000 description 1
- BQWQGCZOPQEUIQ-UHFFFAOYSA-N tetradecyl 3,4,5-trihydroxybenzoate Chemical compound CCCCCCCCCCCCCCOC(=O)C1=CC(O)=C(O)C(O)=C1 BQWQGCZOPQEUIQ-UHFFFAOYSA-N 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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Description
本発明の実施例1に係る絶縁性高分子材料組成物は、エポキシ化亜麻仁油とピロガロールからなる植物由来の樹脂組成物に、フライアッシュ及びシランカップリング剤を添加したものである。実施例1では、エポキシ基を有するシランカップリング剤を添加した。
本発明の実施例2に係る絶縁性高分子材料組成物は、エポキシ化亜麻仁油とピロガロールからなる植物由来の樹脂組成物に、フライアッシュ及びシランカップリング剤を添加したものである。実施例2では、アミノ基を有するシランカップリング剤を添加した。
本発明の実施例3に係る絶縁性高分子材料組成物は、エポキシ化亜麻仁油とピロガロールからなる植物由来の樹脂組成物に、フライアッシュ及びシランカップリング剤を添加したものである。実施例3では、メルカプト基を有するシランカップリング剤を添加した。
Claims (6)
- エポキシ化亜麻仁油と、没食子酸誘導体またはリグニンと、を相溶させた液状エポキシ樹脂組成物に、
石炭灰と、
シランカップリング剤と、を添加し、加熱処理する
ことを特徴とする絶縁性高分子材料組成物。 - 前記シランカップリング剤はエポキシ基を有する
ことを特徴とする請求項1に記載の絶縁性高分子材料組成物。 - 前記シランカップリング剤はメルカプト基を有する
ことを特徴とする請求項1に記載の絶縁性高分子材料組成物。 - 前記シランカップリング剤は、複数種類のシランカップリング剤を組み合わせたものである
ことを特徴とする請求項1から請求項3のいずれか1項に記載の絶縁性高分子材料組成物。 - 前記没食子酸誘導体は、ピロガロール、没食子酸メチル、没食子酸エチル、没食子酸プロピル、没食子酸イソプロピル、没食子酸ペンチル、没食子酸イソペンチル、没食子酸ヘキサデシル、没食子酸ヘプタデシル、没食子酸オクタデシルのいずれか1種類以上を含有する
ことを特徴とする請求項1から請求項4のいずれか1項に記載の絶縁性高分子材料組成物。 - 請求項1から請求項5のいずれかに記載した絶縁性高分子材料組成物を、少なくとも一部に含んで構成される電力機器。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010053968A JP5585982B2 (ja) | 2010-03-11 | 2010-03-11 | 絶縁性高分子材料組成物 |
| CN201180013320.5A CN102791761B (zh) | 2010-03-11 | 2011-03-09 | 绝缘性高分子材料组合物 |
| US13/583,813 US20130005858A1 (en) | 2010-03-11 | 2011-03-09 | Insulating polymer material composition |
| PCT/JP2011/055461 WO2011111727A1 (ja) | 2010-03-11 | 2011-03-09 | 絶縁性高分子材料組成物 |
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| JP2010053968A JP5585982B2 (ja) | 2010-03-11 | 2010-03-11 | 絶縁性高分子材料組成物 |
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| Publication Number | Publication Date |
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| JP2011184645A JP2011184645A (ja) | 2011-09-22 |
| JP5585982B2 true JP5585982B2 (ja) | 2014-09-10 |
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|---|---|
| US (1) | US20130005858A1 (ja) |
| JP (1) | JP5585982B2 (ja) |
| CN (1) | CN102791761B (ja) |
| WO (1) | WO2011111727A1 (ja) |
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| JP2016536859A (ja) * | 2013-10-07 | 2016-11-24 | エルジー エレクトロニクス インコーポレイティド | メディア信号のエンコード及びデコード方法並びにそれを用いる装置 |
| US9988317B2 (en) | 2016-08-16 | 2018-06-05 | Go Team CCR LLC | Structures constructed using coal combustion materials |
| US9790703B1 (en) | 2016-08-16 | 2017-10-17 | Go Team CCR LLC | Methods of utilizing coal combustion residuals and structures constructed using such coal combustion residuals |
| KR101915897B1 (ko) * | 2017-06-01 | 2018-11-06 | 정태혁 | 발열장치를 구비한 방열기 |
| CN108948768A (zh) * | 2018-07-25 | 2018-12-07 | 河北弘之木环保科技股份有限公司 | 一种高绝缘性能的生物纤维和塑料复合材料的制备方法 |
| CN110105717B (zh) * | 2019-05-31 | 2021-06-01 | 国网河南省电力公司邓州市供电公司 | 一种碳纤维复合芯导线及其制备方法 |
| CN113402848B (zh) * | 2021-06-30 | 2022-05-17 | 四川大学 | 用于强韧化环氧树脂的生物基纳米组装固化剂及制备方法 |
| CN119978316B (zh) * | 2025-04-11 | 2025-08-22 | 华南理工大学 | 一种基于植物衍生材料的绝缘环氧树脂及其制备方法 |
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| JPH059270A (ja) * | 1991-06-24 | 1993-01-19 | Sumitomo Bakelite Co Ltd | 樹脂組成物およびその製造方法 |
| US6384152B2 (en) * | 1999-07-19 | 2002-05-07 | Siemens Westinghouse Power Corporation | Insulating resin of epoxy resin, epoxy diluent, phenolic accelerator and organotin catalyst |
| JP4363077B2 (ja) * | 2002-07-12 | 2009-11-11 | 三菱化学株式会社 | 活性エネルギー線硬化性組成物及びハードコートフィルム |
| JP2005105245A (ja) * | 2003-01-10 | 2005-04-21 | Nec Corp | ケナフ繊維強化樹脂組成物 |
| TWI340763B (en) * | 2003-02-20 | 2011-04-21 | Nippon Kayaku Kk | Seal agent for photoelectric conversion elements and photoelectric conversion elements using such seal agent |
| US20060079645A1 (en) * | 2003-02-24 | 2006-04-13 | Nobuhiro Hasegawa | Curable compositions |
| CN101223207B (zh) * | 2005-07-29 | 2012-02-29 | 住友电木株式会社 | 环氧树脂组合物和半导体装置 |
| JP2008257978A (ja) * | 2007-04-04 | 2008-10-23 | Meidensha Corp | 高電圧機器用絶縁性組成物 |
| JP2007211252A (ja) * | 2007-04-23 | 2007-08-23 | Nitto Denko Corp | フライアッシュ粉体を用いた半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP5229787B2 (ja) * | 2008-01-15 | 2013-07-03 | 株式会社明電舎 | 絶縁性高分子材料組成物 |
| JP2009292884A (ja) * | 2008-06-03 | 2009-12-17 | Hitachi Ltd | リグノフェノール系エポキシ樹脂組成物 |
| JP2010031092A (ja) * | 2008-07-25 | 2010-02-12 | Panasonic Electric Works Co Ltd | 植物由来樹脂成形品 |
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2011
- 2011-03-09 WO PCT/JP2011/055461 patent/WO2011111727A1/ja not_active Ceased
- 2011-03-09 CN CN201180013320.5A patent/CN102791761B/zh not_active Expired - Fee Related
- 2011-03-09 US US13/583,813 patent/US20130005858A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011111727A1 (ja) | 2011-09-15 |
| JP2011184645A (ja) | 2011-09-22 |
| US20130005858A1 (en) | 2013-01-03 |
| CN102791761A (zh) | 2012-11-21 |
| CN102791761B (zh) | 2017-02-08 |
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